Disk-shaped substrate manufacturing apparatus and disk-shaped substrate manufacturing method

Abstract

To detect that there is no carrier at a predetermined position on the upper side of a lower surface plate.SOLUTION: An apparatus for production of a disk-shaped substrate has a lower platen on the top side of which a carrier holding a disk-shaped substrate is placed, an upper platen which approaches and separates from the lower platen at the top side of the lower platen, a detection device which detects the presence of a carrier at a predetermined position at the top side of the lower platen, and a control device which stops processing of the disk-shaped substrate when the detection device detects that there is no carrier at the predetermined position.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to a disk-shaped substrate manufacturing apparatus and a disk-shaped substrate manufacturing method. [Background technology]

[0002] Patent document 1 describes a wet polishing device having a carrier with a holding hole for loading a workpiece, and a polishing section that sandwiches the workpiece loaded on the carrier between an upper platen and a lower platen arranged opposite each other and polishes it while supplying a polishing liquid. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-283457 Summary of the Invention [Problem to be solved by the invention]

[0004] In Patent Document 1, a holding hole is formed in the carrier. The workpiece is held in this holding hole. As a result, the workpiece is subjected to processing such as polishing while being held by the carrier above the lower surface plate. After processing, the workpiece is carried out from above the lower surface plate by an unloader or the like. The unloader holds the workpiece but not the carrier, so the carrier usually remains above the lower surface plate.

[0005] As disk-shaped substrates as workpieces become thinner, carriers that hold these disk-shaped substrates are also becoming thinner. When a carrier is made thinner, the carrier tends to adhere to the disk-shaped substrate when the disk-shaped substrate is unloaded by an unloader, making it more likely that the carrier will be ejected along with the disk-shaped substrate. In other words, the carrier may not be in a predetermined position above the lower surface plate. However, the technology described in Patent Document 1 does not allow for detection of the carrier being in a predetermined position above the lower surface plate. Therefore, with the technology described in Patent Document 1, processing of the disk-shaped substrate continues even when the carrier is not in a predetermined position above the lower surface plate.

[0006] The present disclosure provides a disk-shaped substrate manufacturing apparatus and manufacturing method that does not process the disk-shaped substrate unless a carrier is present in a predetermined position above a lower surface plate. [Means for solving the problem]

[0007] The present disclosure includes the following aspects. <1> a lower surface plate on which a carrier for holding a disk-shaped substrate is placed; an upper surface plate that is located above the lower surface plate and moves toward and away from the lower surface plate; a detection device that detects the presence or absence of the carrier at a predetermined position above the lower surface plate; a control device that stops processing of the disk-shaped substrate when the detection device detects that the carrier is not present at the predetermined position; A disk-shaped substrate manufacturing apparatus having the above structure. <2> a transfer device that transfers the disk-shaped substrate to the carrier in a state where the upper surface plate is spaced apart from the lower surface plate; The detection device is provided in the transfer device. <1> The disk-shaped substrate manufacturing apparatus according to claim 1. <3> The process stopped by the control device includes the transfer by the transfer device. <1> The disk-shaped substrate manufacturing apparatus according to claim 1. <4> the transfer device includes a loading device that loads the disk-shaped substrate onto the carrier, The detection device is provided at least in the carry-in device. <2> or <3> The disk-shaped substrate manufacturing apparatus according to claim 1. <5> The detection device is a contact body that is provided on the transfer device so as to be vertically movable and that moves upward relative to the transfer device by coming into contact with the carrier from above. <2> ~ <4> 10. The disk-shaped substrate manufacturing apparatus according to claim 9, <6> A method for manufacturing a disk-shaped substrate, comprising: holding a disk-shaped substrate with a carrier placed above a lower surface plate; and polishing the disk-shaped substrate between the lower surface plate and an upper surface plate; detecting the presence or absence of the carrier at a predetermined position above the lower surface plate in a state in which the upper surface plate is spaced apart from the lower surface plate; When it is detected that the carrier is not present at the predetermined position, the processing of the disk-shaped substrate is stopped. Method for manufacturing a disk-shaped substrate [Effects of the Invention]

[0008] According to the present disclosure, an apparatus and method for manufacturing a disk-shaped substrate are obtained that do not process the disk-shaped substrate when there is no carrier in a predetermined position above the lower surface plate. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a front view showing a schematic configuration of a manufacturing system including a disk-shaped substrate manufacturing apparatus according to an embodiment. [Figure 2A] FIG. 2A is a perspective view showing a magnetic disk substrate as an example of a disk-shaped substrate. [Figure 2B] FIG. 2B is a front view showing a magnetic disk substrate as an example of a disk-shaped substrate. [Figure 3] FIG. 3 is a cross-sectional view showing the polishing apparatus according to the embodiment. [Figure 4] FIG. 4 is a perspective view showing a loader section, a polishing section, and an unloader section of the disk-shaped substrate manufacturing apparatus according to the embodiment. [Figure 5] FIG. 5 is a cross-sectional view showing the disk-shaped substrate manufacturing apparatus of the embodiment at the position of a detection device. [Figure 6] FIG. 6 is an enlarged cross-sectional view partially showing the position of a detection device of the disk-shaped substrate manufacturing apparatus according to the embodiment. [Figure 7] FIG. 7 is an enlarged cross-sectional view partially showing the position of a detection device of the disk-shaped substrate manufacturing apparatus according to the embodiment. [Figure 8] FIG. 8 is an enlarged cross-sectional view partially showing the position of a detection device of the disk-shaped substrate manufacturing apparatus according to the embodiment. [Figure 9] FIG. 9 is an enlarged plan view partially showing the position of a detection device of the disk-shaped substrate manufacturing apparatus according to the embodiment. [Figure 10] FIG. 10 is a block diagram showing a control device in the disk-shaped substrate manufacturing apparatus of the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments of the present disclosure will be described. However, the present disclosure is not limited to the following embodiments. When embodiments are described with reference to drawings in the present disclosure, the configuration of the embodiment is not limited to the configuration shown in the drawings. Furthermore, the sizes of components in each drawing are conceptual, and the relative size relationships between components are not limited to these.

[0011] In the following description of the drawings, like parts are designated by like reference numerals. However, the drawings are schematic, and the relationship between thickness and planar dimensions, and the thickness ratio of each device and each component, differ from the actual ones. Therefore, specific thicknesses and dimensions should be determined by taking into consideration the following explanation. Furthermore, there are parts in which the dimensional relationships and ratios differ between the drawings. Furthermore, unless otherwise specified in the specification, the number of each component element of the present disclosure is not limited to one, and there may be multiple elements.

[0012] In the following embodiments, components (including element steps, etc.) are not essential unless otherwise specified. The same applies to numerical values ​​and their ranges, and do not limit the present disclosure.

[0013] In the present disclosure, numerical ranges indicated using "to" include the numerical values ​​before and after "to" as the minimum and maximum values, respectively.

[0014] In the numerical ranges described in stages in this disclosure, the upper or lower limit value described in one numerical range may be replaced with the upper or lower limit value of another numerical range described in stages. Furthermore, in the numerical ranges described in this disclosure, the upper or lower limit value of that numerical range may be replaced with a value shown in the examples.

[0015] In the present disclosure, when components are contained, each component may contain multiple types of corresponding substances. When multiple types of substances corresponding to each component are present in the composition, the content or amount of each component means the total content or amount of the multiple types of substances present in the composition, unless otherwise specified.

[0016] In the present disclosure, the particles corresponding to each component may contain multiple types of particles. When multiple types of particles corresponding to each component are present in the composition, the particle size of each component means the value for a mixture of the multiple types of particles present in the composition, unless otherwise specified.

[0017] In the present disclosure, the terms "layer" and "film" include cases where the layer or film is formed over the entire area when the area in which the layer or film is present is observed, as well as cases where the layer or film is formed over only a portion of the area.

[0018] <Overall configuration of the disc-shaped substrate manufacturing system> The overall configuration of a disk-shaped substrate manufacturing system 12 of this embodiment will be described with reference to FIG.

[0019] The disk-shaped substrate manufacturing system 12 is a system used to manufacture the magnetic disk substrate 102 shown in FIG. 2A. In the present disclosure, the disk-shaped substrate manufacturing system 12 may be configured to include one or more other devices necessary for manufacturing disk-shaped substrates. In this embodiment, the magnetic disk substrate 102 is a substrate for a hard disk, but it may also be a substrate used for other purposes. A through-hole 104 is formed in the center of the magnetic disk substrate 102. However, the central through-hole 104 does not have to be present.

[0020] As shown in FIG. 2B , the magnetic disk substrate 102 has a base material 106. The base material 106 is, for example, an aluminum plate or an aluminum alloy plate, but the present disclosure is not limited to this and may be a glass plate or the like. Hereinafter, aluminum plates, aluminum alloy plates, glass plates, etc. will be collectively referred to as the base material 106. Plating layers 108A and 108B are formed on a first surface and a second surface of the base material 106. The plating layers 108A and 108B are, for example, electroless nickel-phosphorus plating. In this case, the surface to be polished may be the plating layers 108A and 108B.

[0021] 1, the disk-shaped substrate manufacturing system 12 includes a supply unit 22, a loader unit 24, a polishing unit 26, an unloader unit 28, a cleaning / drying unit 30, and a discharge unit 32. The loader unit 24 and the unloader unit 28 are examples of transfer devices in the technology of the present disclosure. The loader unit 24 is also an example of a carry-in device. The unloader unit 28 is also an example of an unloading device.

[0022] The magnetic disk substrates 102 are transported to the supply unit 22 while being stored in a case 34. The disk-shaped substrate manufacturing system 12 polishes these magnetic disk substrates 102 in the polishing unit 26, and cleans and dries them in the cleaning and drying unit 30. The disk-shaped substrate manufacturing system 12 then stores the cleaned and dried magnetic disk substrates 102 in the case 34 and discharges them.

[0023] The polishing section 26 can simultaneously polish a predetermined number of magnetic disk substrates 102. The magnetic disk substrates 102 may be transported from the loader section 24 to the polishing section 26 and removed from the polishing section 26 to the unloader section 28 in batches, for example, in units of the number of substrates to be polished.

[0024] The loader section 24 takes out the magnetic disk substrates 102 one by one from the case 34. The loader section 24 holds a predetermined number of magnetic disk substrates 102 all at once. The loader section 24 carries the predetermined number of magnetic disk substrates 102 into the polishing section 26.

[0025] The unloader section 28 collectively carries out the magnetic disk substrates 102 polished in the polishing section 26 from the polishing section 26. The unloader section 28 transports the magnetic disk substrates 102 one by one to the cleaning and drying section 30. The magnetic disk substrates 102 cleaned and dried in the cleaning and drying section 30 are stored in cases 34 in groups of a predetermined number and are discharged from the discharge section 32 to the outside of the apparatus.

[0026] The detailed configuration and operation of each part will be described below.

[0027] <Polishing section> 3, the polishing unit 26 includes a lower surface plate 36, an upper surface plate 38, a sun gear 40, and an internal gear 42. The polishing unit 26 is an example of a polishing device that polishes the magnetic disk substrate 102, and is also an example of a manufacturing device that manufactures the magnetic disk substrate 102.

[0028] The lower surface plate 36 is a disk-shaped member. The lower surface plate 36 has a horizontal, annular upper surface. A polishing cloth 48 is attached to the upper surface of the lower surface plate 36. The lower surface plate 36 is supported so as to be rotatable about a vertical axis VA. The lower surface plate 36 is connected to a rotation drive unit (not shown). The lower surface plate 36 and the lower support member rotate by receiving the rotational force of the rotation drive unit.

[0029] The upper surface plate 38 is a disk-shaped member. The upper surface plate 38 has a horizontal, annular lower surface. A polishing cloth 48 is attached to the lower surface of the upper surface plate 38. The polishing cloth 48 attached to the upper surface plate 38 is positioned opposite the polishing cloth 48 attached to the lower surface plate 36. The upper surface plate 38 is supported so as to be rotatable about a vertical axis VA. The upper surface plate 38 is connected to a surface plate rotation drive unit (not shown). The upper surface plate 38 and the upper support member rotate by receiving the rotational force of the surface plate rotation drive unit.

[0030] The upper surface plate 38 and the upper support member are supported so as to be freely movable up and down along a vertical axis VA. The upper surface plate 38 and the upper support member are raised and lowered by driving an upper surface plate lifting drive unit (not shown). The upper surface plate 38 moves towards and away from the lower surface plate 36 as it is raised and lowered. The upper surface plate 38 and the polishing cloth 48 are provided with a large number of polishing liquid supply holes and stripping fluid supply holes (neither of which are shown). The polishing liquid supply holes and stripping fluid supply holes are used to supply the polishing liquid and stripping fluid.

[0031] The sun gear 40 is provided at the center of the grinding section 26. The sun gear 40 rotates about a vertical axis VA by being driven by a sun gear rotation drive section (not shown). The sun gear 40 may be a spur gear, a pin gear, or the like, with a row of teeth integrally formed on the side surface.

[0032] The internal gear 42 is arranged concentrically with the sun gear 40. The internal gear 42 has an annular cylindrical body 50. Internal teeth are formed on the inner peripheral surface of the cylindrical body 50. As shown in FIG. 5 , an annular gap GP is formed between the inner peripheral side of the cylindrical body 50 and the lower surface plate 36. The internal gear 42 in this embodiment is held non-rotatably by a holding member (not shown). Alternatively, a rotation drive unit that rotates the internal gear may be provided to rotate the internal gear about the vertical axis VA. When the internal gear 42 is rotated, the sun gear 40 may be held non-rotatably. Furthermore, a spur gear, a pin gear, or the like may also be used for the internal gear 42.

[0033] The carrier 44 is a thin, disk-shaped member. External teeth are formed on the outer circumferential surface of the carrier 44. As shown in FIG. 4, the carrier 44 has a plurality of holding holes 54 formed therein. The holding holes 54 hold the magnetic disk substrates 102.

[0034] A plurality of carriers 44 are disposed in the polishing section 26. The carriers 44 mesh with the sun gear 40 and the internal gear 42, and rotate around the sun gear 40 while revolving around the sun gear 40 in response to the rotation of at least one of the sun gear 40 and the internal gear 42.

[0035] In the polishing section 26, the upper surface plate 38 is positioned above the magnetic disk substrate 102 held by the carrier 44, and the lower surface plate 36 is positioned below it. In this state, the carrier 44 is caused to revolve and rotate, whereby both the upper and lower surfaces of the magnetic disk substrate 102 are polished by the polishing cloth 48.

[0036] A fluid supply device (not shown) is provided above the upper surface plate 38. The fluid supply device supplies a polishing liquid and a stripping fluid to the polishing section 26.

[0037] <Loader section> As shown in FIG. 4, the loader unit 24 is disposed before the polishing unit 26. The loader unit 24 has a table 56 and a transfer device 58. The table 56 is circular. The table 56 is rotatably mounted on a platform (not shown). The transfer device 58 is disposed above the table 56. The transfer device 58 of the loader unit 24 is an example of a loading device of the disclosed technology.

[0038] A plurality of plates 60 are attached to the table 56. The number of plates 60 is the same as the number of carriers 44 in the polishing unit 26. The arrangement of the plurality of plates 60 is the same as the arrangement of the carriers 44. Each plate 60 is provided with a plurality of trays 62. The positions of the trays 62 correspond to the holding holes 54 of the carriers 44. Magnetic disk substrates 102 can be placed on the trays 62.

[0039] The transfer device 58 has a movable base plate 64. The movable base plate 64 is movable horizontally between the table 56 and the lower surface plate 36 of the polishing unit 26. The movable base plate 64 is also capable of moving up and down relative to the lower surface plate 36. As shown in FIG. 5, the same number of gripping plates 66 as the plates 60 are attached to the underside of the movable base plate 64. A gripping unit 68 is provided on the underside of the gripping plate 66. The gripping unit 68 has a pair of claws 68T that open and close by supplying and exhausting air, etc.

[0040] <Unloader section> The unloader section 28 is disposed after the polishing section 26. The unloader section 28 has a table 70 and a transfer device 72. The table 70 is circular. The table 70 is rotatably mounted on a platform (not shown). The transfer device 72 is disposed above the table 70. The transfer device 72 of the unloader section 28 is an example of a carrying-out device of the disclosed technology.

[0041] The table 70 and transfer device 72 of the unloader section 28 have the same configuration as the table 56 and transfer device 58 of the loader section 24, except that each part is arranged symmetrically. In the unloader section 28, parts with the same names as those in the loader section 24 have the same functions, so they are given the same reference numerals in Figure 4 and detailed explanations will be omitted.

[0042] <Detection device> 5 and 6, in this embodiment, the loader unit 24 has a detection device 46. The detection device 46 includes a holder 74, a contact rod 76, and a sensor 78. The contact rod 76 is an example of a contact body of the disclosed technology.

[0043] In this embodiment, the holder 74 is provided on the outer peripheral surface of the gripping plate 66. The shape of the holder 74 is not particularly limited, but for example, the holder 74 may be a rectangular parallelepiped as a whole, and the surface facing the outer peripheral surface of the gripping plate 66 may be curved to fit the outer peripheral surface of the gripping plate 66. An insertion hole 74H is formed in the holder 74, penetrating the holder 74 in the vertical direction. The cross-sectional shape of the insertion hole 74H in a direction perpendicular to the extension direction is not particularly limited, but in this embodiment, it is circular.

[0044] A contact rod 76 is inserted through the insertion hole 74H. In this embodiment, the cross-sectional shape of the contact rod 76 in a direction perpendicular to the extending direction is circular to correspond to the insertion hole 74H. Therefore, the overall shape of the contact rod 76 is cylindrical.

[0045] The outer diameter of the contact rod 76 is smaller than the inner diameter of the insertion hole 74H. When inserted into the insertion hole 74H, the contact rod 76 is movable up and down relative to the holder 74. In other words, the contact rod 76 is movable up and down relative to the gripping plate 66, which is part of the loader unit 24.

[0046] A stopper 76S is formed at the upper end of the contact rod 76. The stopper 76S also forms part of the contact rod 76. The shape of the stopper 76S is not particularly limited, but in this embodiment it is, for example, cylindrical. The outer diameter of the stopper 76S is larger than the inner diameter of the insertion hole 74H. The downward movement of the contact rod 76 is restricted by the stopper 76S hitting the holder 74.

[0047] For example, as shown in Fig. 6, when the gripping plate 66 is in a position separated from the carrier 44, the lower end of the contact rod 76 is not in contact with the carrier 44. Also, as shown in Fig. 8, even when the carrier 44 is not in the predetermined position above the lower surface plate 36 where it should be, the lower end of the contact rod 76 is not in contact with the carrier 44. In these states, the contact rod 76 is in a lowered position due to its own weight, and the stopper 76S is in contact with the holder 74.

[0048] 7, the length of the contact rod 76 is set so that the lower end of the contact rod 76 comes into contact with the carrier 44 when the gripping plate 66 is lowered to a predetermined position above the lower surface plate 36. When the gripping plate 66 is further lowered with the lower end of the contact rod 76 in contact with the carrier 44, the contact rod 76 slides upward relative to the holder 74 and the gripping plate 66. When the contact rod 76 has slid upward, a portion of the contact rod 76 including the stopper 76S is located above the upper surface of the gripping plate 66.

[0049] A sensor 78 is provided on the upper surface of the gripping plate 66. The sensor 78 can detect the presence or absence of the contact rod 76, including the stopper 76S. As shown in FIG. 6 or FIG. 8, when the contact rod 76 is in a lowered position relative to the gripping plate 66, the contact rod 76, including the stopper 76S, is located below the upper surface of the gripping plate 66, and the sensor 78 does not detect the contact rod 76. In other words, the fact that the sensor 78 does not detect the contact rod 76 indicates that the contact rod 76 is in a lowered position. In contrast, as shown in FIG. 7, when the lower end of the contact rod 76 is in contact with the carrier 44 and the contact rod 76 is located in an elevated position relative to the gripping plate 66, the sensor 78 detects the contact rod 76 located above the upper surface of the gripping plate 66. In other words, it indicates that the contact rod 76 is in an elevated position. Information about the position of the contact rod 76 detected by the sensor 78, ie, whether the contact rod 76 is raised or lowered, is transmitted to a control device 80 shown in FIG.

[0050] The control device 80 executes various processes on the magnetic disk substrate 102 based on information about the vertical positions of the gripping plate 66 and the contact rod 76. If the sensor 78 does not detect the contact rod 76, that is, if the detection device 46 detects that the carrier 44 is not in a predetermined position on the lower surface plate 36, these processes are stopped. In this embodiment, the processes that are stopped in this way include the operation of the loader unit 24.

[0051] Specifically, as shown in Fig. 6, when the gripping plate 66 is separated from the carrier 44, the control device 80 continues the operation of the loader unit 24. As shown in Fig. 7, when the gripping plate 66 approaches the carrier 44 and reaches a predetermined position, and the sensor 78 detects the contact rod 76, it is determined that the carrier 44 is above the lower platen 36. In this case, the control device 80 continues the operation of the loader unit 24.

[0052] On the other hand, when the gripping plate 66 approaches the carrier 44 and reaches a predetermined position, but the sensor 78 does not detect the contact rod 76, it can be determined that the carrier 44 is not above the lower surface plate 36, as shown in Figure 8. In this case, the control device 80 stops the operation of the loader unit 24.

[0053] A display device 82 is connected to the control device 80. Based on information received from the sensor 78, the control device 80 causes the display device 82 to display, for example, whether or not the carrier 44 is present above the lower surface plate 36. The display device 82 may be, for example, a display that displays images, or a device that can be seen by an operator, such as a lamp that indicates various operating states of the polishing unit 26. Furthermore, instead of or in addition to such a visible device, a speaker, buzzer, or the like may be used that notifies the operator of the operating state of the polishing unit 26 by voice or the like.

[0054] 9, when the gripping plate 66 is in a predetermined position above the lower surface plate 36 and the lower surface plate 36 is viewed from above, the position of the contact rod 76 is in the gap GP between the cylindrical body 50 of the internal gear 42 and the lower surface plate 36. If the plate 60 is lowered with the carrier 44 not above the lower surface plate 36, the lower end of the contact rod 76 is not configured to come into contact with the lower surface plate 36.

[0055] FIG. 10 shows a block diagram of the hardware configuration of the control device 80.

[0056] The control device 80 includes a computer 84. The computer 84 includes a processor 86, a memory 88, a storage 90, an input device 92, an output device 94, a storage medium reader 96, and a communication I / F (Interface) 98. These elements are connected to each other via a bus 100 so that they can communicate with each other.

[0057] The storage 90 stores a substrate manufacturing program 112 for manufacturing the magnetic disk substrate 102. The processor 86 is capable of executing various programs and controlling each element. Specifically, the processor 86 reads the program from the storage 90 and executes the program using the memory 88 as a work area. In other words, the processor 86 controls each element and performs various arithmetic processing in accordance with the program stored in the storage 90.

[0058] The memory 88 can temporarily store programs and various data as a work area.

[0059] The storage 90 is, for example, a read-only memory (ROM), a hard disk drive (HDD), a solid state drive (SSD), etc., and stores various programs and various data. These programs include not only application programs such as the substrate processing program described above, but also an operating system.

[0060] The input device 92 is a device for making various inputs to the computer 84. The input device 92 includes operation switches, operation buttons, etc., and may also include a keyboard used in a personal computer, a mouse, or other pointing device, etc.

[0061] The output device 94 is a device for outputting various types of information from the computer 84, and includes, for example, a display, an indicator lamp, a speaker, etc. A touch panel display can also be used as the output device 94, in which case the touch panel display also functions as the input device 92.

[0062] The storage medium reader 96 is a device that reads data stored in various storage media and writes data to the storage media, such as a CD (Compact Disc)-ROM, a DVD (Digital Versatile Disc)-ROM, a Blu-ray Disc, and a USB (Universal Serial Bus) memory.

[0063] The communication I / F 98 is an interface for communicating with other devices, and is compliant with standards such as Ethernet (registered trademark) and FDDI (Fiber Distributed Data Interface).

[0064] In this embodiment, the communication I / F 98 communicates with each of the determining unit 20, the supplying unit 22, the loader unit 24, and the polishing unit 26, thereby enabling control of these devices and acquisition of various statuses of these devices. This communication may be wireless or wired. The display device 82 shown in FIG. 1 may be included in the output device 94, or may be provided separately from the output device 94.

[0065] Next, the operation of the disk-shaped substrate manufacturing system 12 of this embodiment and the method for manufacturing the disk-shaped substrate will be described.

[0066] When manufacturing disk-shaped substrates using the disk-shaped substrate manufacturing system 12, the magnetic disk substrate 102 is transported, i.e., loaded, from the loader unit 24 to the polishing unit 26 while the upper surface plate 38 is separated from the lower surface plate. Then, the magnetic disk substrate 102 is transferred to the holding hole 54 of the carrier 44.

[0067] With the magnetic disk substrate 102 held in the holding hole 54, the loader unit 24 is retracted from above the lower surface plate 36. Thereafter, the upper surface plate 38 is moved closer to the lower surface plate 36, and the polishing cloths 48 come into contact with the upper and lower surfaces of the magnetic disk substrate 102. Then, due to the revolution and rotation of the carrier 44, both surfaces of the magnetic disk substrate 102 are polished by the polishing cloths 48.

[0068] After polishing, the upper surface plate 38 rises and moves away from the lower surface plate 36. Thereafter, the unloader unit 28 carries the magnetic disk substrate 102 out of the holding hole 54 of the carrier 44, i.e., unloads it, and moves it to the cleaning and drying unit 30.

[0069] Here, a detailed description will be given of the case where the loader unit 24 transfers the magnetic disk substrate 102 into the holding hole 54 of the carrier 44. In this case, the carrier 44 is located above the lower surface plate 36. When the plate 60 approaches the carrier 44 to a predetermined position, the tip of the contact rod 76 comes into contact with the carrier 44, and the contact rod 76 rises relative to the gripping plate 66. This causes the sensor 78 to detect the contact rod 76. The control device 80 then controls the loader unit 24 to continue operating.

[0070] However, there are cases where the carrier 44 is not present in the predetermined position above the lower surface plate 36. For example, when the unloader unit 28 unloads the magnetic disk substrate 102 from the holding hole 54 of the carrier 44, the magnetic disk substrate 102 may be unloaded together with the carrier 44 attached thereto.

[0071] In this state, even if the gripping plate 66 approaches the carrier 44 to a predetermined position, the tip of the contact rod 76 does not come into contact with the carrier 44 because the carrier 44 is not present above the lower surface plate 36. In other words, the contact rod 76 is maintained in a lowered position. Because no part of the contact rod 76 protrudes from the upper surface of the gripping plate 66, the sensor 78 does not detect the stopper 76S. In this case, the control device 80 controls the loader unit 24 to stop operating. In other words, the transfer of the magnetic disk substrates 102 onto the carrier 44 is stopped. Furthermore, the control device 80 displays on the display device 82 that the carrier 44 is not present above the lower surface plate 36.

[0072] As described above, in this embodiment, when there is no carrier 44 above the lower surface plate 36, the control device 80 stops the operation of the loader unit 24. If the magnetic disk substrate 102 is transferred to the upper side of the lower surface plate 36 when there is no carrier 44 above the lower surface plate 36, there is a high possibility that a problem will occur when the polishing unit 26 is operated thereafter. However, in this embodiment, when there is no carrier 44 above the lower surface plate 36, the magnetic disk substrate 102 is not transferred to the upper side of the lower surface plate 36, so there is a low possibility that such a problem will occur. Furthermore, by reducing the number of problems, the operating rate of the polishing unit 26 is improved.

[0073] The fact that there is no carrier 44 above the lower surface plate 36 is displayed on the display device 82. This display enables the operator to take necessary measures, such as setting the carrier 44 in a predetermined position above the lower surface plate 36. In addition, the operator can stop the transfer of the magnetic disk substrates 102 onto the carrier 44 by, for example, turning off the power switch of the loader unit 24.

[0074] When the plate 60 is viewed from above, the position of the contact rod 76 is in the gap GP between the cylindrical body 50 of the internal gear 42 and the lower surface plate 36. Therefore, when the plate 60 is lowered with the carrier 44 not above the lower surface plate 36, the lower end of the contact rod 76 does not come into contact with the lower surface plate 36. In other words, because the contact rod 76 does not inadvertently rise relative to the plate 60, it is possible to prevent the situation in which the carrier 44 is mistakenly recognized as being present when it is not.

[0075] The above is an example of a configuration in which information regarding the vertical position of the contact rod 76 detected by the sensor 78 is transmitted to a control device, and the operation of the loader unit 24 is controlled based on this information. In this case, a sensor using visible light or infrared light, for example, can be used as the sensor 78. Alternatively, the vertical position of the contact rod 76 may be detected by capturing an image of the contact rod 76 with an imaging device. Furthermore, a camera that captures an image of the carrier 44 may be used as the detection device, without using a contact rod. In other words, the presence or absence of the carrier 44 is detected from the image captured by the imaging device. In a configuration using the contact rod 76, the contact rod 76 is detected by the sensor 78, so the presence or absence of the carrier 74 can be detected with a simple structure.

[0076] Furthermore, the configuration for controlling the operation of the loader unit 24 depending on the presence or absence of the carrier 44 above the lower surface plate 36 is not limited to the configuration using the control device 80 described above. For example, a mechanical structure may be used in which the electrical conduction state (conductive or insulated) or electrical resistance changes depending on the position of the contact rod 76, and the loader unit 24 may be operated or stopped based on the electrical conduction state or electrical resistance.

[0077] In the above example, the detector 46 is provided in the loader unit 24. However, instead of this, or in addition, the detector 46 may be provided in the unloader unit 28. In a configuration in which the detector 46 is provided in the unloader unit 28, for example, when the magnetic disk substrate 102 polished in the polishing unit 26 is unloaded by the unloader unit 28, the detector 46 may detect whether the carrier 44 is being unloaded together with the magnetic disk substrate 102. In other words, if the detector 46 detects that the carrier 44 is being unloaded together with the magnetic disk substrate 102 when the magnetic disk substrate 102 is unloaded by the unloader unit 28, it is determined that the carrier 44 is no longer present above the lower surface plate 36. Furthermore, the detector 46 may be provided in the lower surface plate 36 or in the internal gear 42.

[0078] Both the loader unit 24 and the unloader unit 28 are examples of the transport device of the disclosed technology. Therefore, a configuration in which the detection device 46 is provided in the loader unit 24 or the unloader unit 28 is also an example of a configuration in which the detection device is provided in the transport device. However, the detection device does not have to be provided in the transport device, and may be provided in the polishing unit 26, for example. The detection device may also be provided separately from the transport device and the polishing unit 26. For example, as described above, in a configuration in which an imaging device is included as a detection device, the imaging device can be provided separately from the transfer device and the polishing unit 26.

[0079] In the configuration in which a detector is provided in the loader section 24 as in the above embodiment, the presence or absence of the carrier 44 above the lower surface plate 36 can be detected in conjunction with the operation of loading the magnetic disk substrate 102 into the carrier 44 .

[0080] In a configuration in which a detector is provided in the unloader section 28, the presence or absence of the carrier 44 at a predetermined position above the lower surface plate 36 can be detected in conjunction with the operation of unloading the magnetic disk substrate 102 from the carrier 44.

[0081] In the above embodiment, stopping the transport device is given as an example of a process that the control device 80 stops when there is no carrier 44 above the lower surface plate 36, but the process that the control device 80 stops is not limited to this. The process that the control device 80 stops may include, for example, stopping the polishing unit 26 in addition to or in conjunction with stopping the transport device. Furthermore, it may include stopping the entire disk-shaped substrate manufacturing system 12 when there is no carrier 44 above the lower surface plate 36. [Explanation of symbols]

[0082] 12 Manufacturing Systems 23 Loader section (an example of a transfer device) 28 Unloader section (an example of a transfer device) 36 Lower surface plate 38 Upper surface plate 44 Career 46 Detection Device 58 Transfer equipment 76 Contact rod (an example of a contact body) 102 Magnetic disk substrate (an example of a disk-shaped substrate)

Claims

1. a lower surface plate on which a carrier for holding a disk-shaped substrate is placed; an upper surface plate that is located above the lower surface plate and moves toward and away from the lower surface plate; a detection device that detects the presence or absence of the carrier at a predetermined position above the lower surface plate; a control device that stops processing of the disk-shaped substrate when the detection device detects that the carrier is not present at the predetermined position; A disk-shaped substrate manufacturing apparatus having the above structure.

2. a transfer device that transfers the disk-shaped substrate to the carrier in a state where the upper surface plate is spaced apart from the lower surface plate; 2. The disk-shaped substrate manufacturing apparatus according to claim 1, wherein the detection device is provided in the transfer device.

3. The disk-shaped substrate manufacturing apparatus according to claim 2 , wherein the process stopped by the control device includes the transfer by the transfer device.

4. the transfer device includes a loading device that loads the disk-shaped substrate onto the carrier, 3. The disk-shaped substrate manufacturing apparatus according to claim 2, wherein the detection device is provided at least in the carry-in device.

5. The detection device is 3. The disk-shaped substrate manufacturing apparatus according to claim 2, further comprising a contact member that is provided on the transfer device so as to be movable up and down, and that moves upward relative to the transfer device by contacting the carrier from above.

6. A method for manufacturing a disk-shaped substrate, comprising: holding a disk-shaped substrate with a carrier placed above a lower surface plate; and polishing the disk-shaped substrate between the lower surface plate and an upper surface plate; detecting the presence or absence of the carrier at a predetermined position above the lower surface plate in a state in which the upper surface plate is spaced apart from the lower surface plate; When it is detected that the carrier is not present at the predetermined position, the processing of the disk-shaped substrate is stopped. A method for manufacturing a disk-shaped substrate.

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