Heat dissipation mechanism and method of using the same

Abstract

To radiate heat of a heat radiation object in a limited space.SOLUTION: The heat dissipation mechanism includes a plurality of covering members formed in a plate shape using a heat dissipation member and capable of individually covering target portions of the heat dissipation object, and a heat transfer member that thermally connects the target portions of the heat dissipation object and the plurality of covering members, the plurality of covering members include a first covering member in which a heat insulating member having a thermal conductivity lower than that of the heat dissipation member is disposed so as to cover a surface of the heat dissipation member that is an outer surface side with respect to the heat dissipation object in a covered state in which the target part is covered, and a second covering member in which the heat insulating member is not disposed, and are switchable between a heat insulating state in which all the covering members are overlapped so that the first covering member is disposed on an outermost side and a covered heat dissipation state in which all the covering members are overlapped so that the second covering member is disposed on an outermost side.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] FIELD OF THE DISCLOSURE The present disclosure relates to heat dissipation mechanisms and methods of using heat dissipation mechanisms. [Background technology]

[0002] A lunar rover that travels on the surface of the moon has a travel device such as wheels and a control device that controls the travel device. The control device generates heat when controlling the travel device. The heat generated by the control device is dissipated by a heat dissipation mechanism such as a radiator. Patent Document 1 discloses a deployable radiator that deploys a radiator panel when dissipating heat. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6698874 Summary of the Invention [Problem to be solved by the invention]

[0004] The lunar rover is transported from Earth to the Moon by a transport vehicle such as a rocket. Devices transported by transport vehicles, such as lunar rovers, may operate within the transport vehicle during transport. Heat generated by the operation of the device must be appropriately dissipated. A deployable radiator such as that described in Patent Document 1 requires the radiator panel to be deployed for heat dissipation, making it difficult to use in the limited space within the transport vehicle.

[0005] The present disclosure has been made in view of the above, and aims to provide a heat dissipation mechanism that is capable of dissipating heat from a heat dissipation object in a limited space, and a method of using the heat dissipation mechanism. [Means for solving the problem]

[0006] The heat dissipation mechanism according to the present disclosure comprises a plurality of covering members formed in a plate shape using heat dissipation members and capable of individually covering target portions of a heat dissipation object, and a heat transfer member that thermally connects the target portions of the heat dissipation object to the plurality of covering members, wherein the plurality of covering members include a first covering member in which an insulating member having a lower thermal conductivity than the heat dissipation member is arranged to cover the surface of the heat dissipation member that faces outward from the heat dissipation object when in a covering state in which the target portions are covered, and a second covering member in which the insulating member is not arranged, and is switchable between an insulating state in which all of the covering members are overlapped so that the first covering member is positioned outermost to form the covering state, and a covered heat dissipation state in which all of the covering members are overlapped so that the second covering member is positioned outermost to form the covering state.

[0007] The method of using the heat dissipation mechanism according to this embodiment is a method of using the above-described heat dissipation mechanism, in which when the heat dissipation mechanism is loaded onto a transport vehicle and transported from Earth to the surface of a planet or satellite other than Earth by the transport vehicle, the multiple covering members are placed in the coated heat dissipation state inside the transport vehicle, and after the heat dissipation mechanism has been transported to the surface, the multiple covering members are placed in the insulated state on the surface.

[0008] The method of using the heat dissipation mechanism according to this embodiment is such that, when the heat dissipation mechanism is mounted on a conveying machine, the multiple covering members are placed in the covering heat dissipation state inside the conveying machine, and heat generated in the heat dissipation object is released while the mechanism is mounted on the conveying machine. [Effects of the Invention]

[0009] According to the present disclosure, heat can be dissipated from a heat dissipation object in a limited space. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a perspective view schematically illustrating an example of a heat dissipation mechanism according to this embodiment. [Figure 2] FIG. 2 is a diagram showing an example of a state in which the heat dissipation mechanism is used (insulating state). [Figure 3]FIG. 3 is a diagram showing an example of a state in which the heat dissipation mechanism is used (covered heat dissipation state). [Figure 4] FIG. 4 is a diagram showing an example of a state in which the heat dissipation mechanism is used (deployed heat dissipation state). [Figure 5] FIG. 5 is a diagram showing an example of a state in which the heat dissipation mechanism is mounted on a traveling device. [Figure 6] FIG. 6 is a diagram showing an example of the arrangement of the evaporator of the heat transfer member in the exposed portion of the heat dissipation object. [Figure 7] FIG. 7 is a diagram showing an example of the arrangement of the evaporator of the heat transfer member in the exposed portion of the heat dissipation object. [Figure 8] FIG. 8 is a diagram showing the configuration of a heat dissipation mechanism according to a modified example. [Figure 9] FIG. 9 is a diagram showing the configuration of a heat dissipation mechanism according to a modified example. [Figure 10] FIG. 10 is a diagram showing the configuration of a heat dissipation mechanism according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of a heat dissipation mechanism and a method of using the heat dissipation mechanism according to the present disclosure will be described with reference to the drawings. Note that the present invention is not limited to these embodiments. Furthermore, the components in the following embodiments include those that are easily replaceable by those skilled in the art, or those that are substantially identical.

[0012] FIG. 1 is a perspective view that schematically illustrates an example of a heat dissipation mechanism 100 according to this embodiment. FIG. 1 illustrates an example in which a plurality of covering members 20 are each in an unfolded state. As shown in FIG. 1, the heat dissipation mechanism 100 according to this embodiment includes a container 10, a plurality of covering members 20, and a heat transfer member 30. In this embodiment, the heat dissipation mechanism 100 dissipates heat from a heat dissipation object 40. In this embodiment, the heat dissipation object 40 includes, for example, equipment such as a control device mounted on a lunar rover that travels on the lunar surface, equipment used on the lunar surface, etc.

[0013] The container 10 can accommodate a heat dissipation object 40. The container 10 has an external appearance of, for example, a rectangular parallelepiped. In this embodiment, the container 10 has a set up-down direction. The container 10 has an upper surface 10a, a lower surface 10b, and side surfaces 10c. The container 10 has the lower surface 10b on the lower side in the vertical direction and the upper surface 10a on the upper side in the vertical direction. The container 10 has an opening 11. The opening 11 exposes a portion of the heat dissipation object 40 accommodated in the container 10. The opening 11 is provided on the upper surface 10a of the container 10. The opening 11 is provided in the center of the upper surface 10a. The opening 11 is, for example, rectangular in plan view. The upper surface 10a of the container 10 has an edge 10e around the opening 11. The container 10 is formed using, for example, a multi-layer insulation (MLI).

[0014] The plurality of covering members 20 are provided so as to be able to close the opening 11. The plurality of covering members 20 are formed in a plate shape using a heat dissipation member 25 having a higher thermal conductivity than the container 10. The heat dissipation member 25 is made of a metal material such as aluminum.

[0015] The multiple covering members 20 are attached to the edge 10e around the opening 11 on the upper surface 10a of the container 10. The multiple covering members 20 may be attached to the edge 10e via, for example, a flexibly deformable connecting substrate or the like. The multiple covering members 20 are arranged one on each side of the opening 11 in a first direction D1 in a plan view. Note that the direction D2 shown in FIG. 1 is a direction perpendicular to the first direction D1, which is a linear direction, and to the up-down direction, and will hereinafter be referred to as the second direction D2. In this embodiment, the multiple covering members 20 are arranged, for example, on the edge 10e corresponding to each of two opposing sides of the opening 11.

[0016] The multiple covering members 20 are rotatable around rotation axes along two opposing sides of the opening 11. By rotating the multiple covering members 20 around their respective rotation axes, they can be individually switched between a covered state in which they cover the opening 11 and an unfolded state in which they are unfolded to open the opening 11. In the covered state, the covering members 20 are arranged in a position that overlaps the opening 11 in a plan view, along the top surface 10a or exposed portion 41 of the container 10. In the unfolded state, the covering members 20 are folded back to the side opposite the opening 11 and are arranged in a state in which they are supported by the edge 10e of the top surface 10a.

[0017] In this embodiment, the multiple covering members 20 include a first covering member 21 and a second covering member 22. When the first covering member 21 is in a closed state in which it closes the opening 11, a heat insulating member 26 is disposed on a surface 25a of the heat dissipation member 25 that faces outward from the container 10. The heat insulating member 26 has a lower thermal conductivity than the heat dissipation member 25. As with the container 10 described above, the heat insulating member 26 may be, for example, a multilayer insulating material.

[0018] The heat transfer member 30 connects an exposed portion 41 of the heat dissipation object 40 that is exposed at the opening 11 to the multiple covering members 20. More specifically, the heat transfer member 30 thermally connects the exposed portion 41 to the heat dissipation members 25 of the multiple covering members 20. The heat transfer member 30 transfers heat from the exposed portion 41 to the heat dissipation members 25. An example of the heat transfer member 30 is a loop heat pipe (LHP). Hereinafter, the heat transfer member 30 (first heat transfer member) connected to the heat dissipation member 25 of the first covering member 21 may be referred to as the heat transfer member 31. Furthermore, the heat transfer member 30 (second heat transfer member) connected to the heat dissipation member 25 of the second covering member 22 may be referred to as the heat transfer member 32. In the heat transfer member 30, flexible tubes having flexibility are used as the transport pipes 31t, 32t that connect the evaporators 31e, 32e on the exposed portion 41 side and the condensers 31c, 32c on the heat dissipation member 25 side. With this configuration, the heat transfer member 30 can deform in accordance with the opening and closing of the covering member 20.

[0019] Next, a description will be given of a state in which the heat dissipation mechanism 100 configured as described above is used. Figures 2 to 4 are diagrams showing an example of a state in which the heat dissipation mechanism 100 is used. Figures 2 to 4 show cross sections taken along a plane perpendicular to the second direction D2 in Figure 1. In the heat dissipation mechanism 100, the multiple covering members 20 are deformable between an insulating state ST1 shown in Figure 2, a covered heat dissipation state ST2 shown in Figure 3, and an unfolded heat dissipation state ST3 shown in Figure 4.

[0020] 2 is a state in which all of the covering members 20 are covered so that the first covering member 21 is disposed on the outermost side (on the upper side in this embodiment). In the insulating state ST1, the heat dissipation members 25 of the first covering member and the second covering member 22 are covered by the insulating member 26 and are not exposed to the outside. This prevents heat generated in the heat dissipation object 40 from being released to the outside.

[0021] 3 is a state in which all of the covering members 20 are covered so that the second covering member 22 is disposed on the outermost side (on the upper side in this embodiment). In the covered heat dissipation state ST2, the heat dissipation member 25 of the second covering member 22, which is disposed on the outermost side, is exposed to the outside. Furthermore, the other heat dissipation members 25 (the heat dissipation member 25 of the first covering member 21 in this embodiment) are not exposed to the outside. Therefore, in the covered heat dissipation state ST2, when heat generated in the heat dissipation target 40 is transferred to the heat dissipation members 25 of the first covering member 21 and the second covering member 22 via the heat transfer member 30, the heat transferred to the heat dissipation member 25 of the first covering member 21 is not released to the outside, and the heat transferred to the heat dissipation member 25 of the second covering member 22 is released to the outside from the heat dissipation member 25 of the second covering member 22.

[0022] In the insulating state ST1 and the coated heat-dissipating state ST2 described above, the multiple covering members 20 overlap each other to cover the openings 11. Therefore, the overall dimensions of the heat dissipation mechanism 100 in a plan view are substantially the same in the insulating state ST1 and the coated heat-dissipating state ST2. In the coated heat-dissipating state ST2, the dimensions of the heat dissipation mechanism 100 in a plan view are substantially the same as in the insulating state ST1, while still being able to dissipate heat from the heat dissipation object 40. Therefore, even in a limited space where the multiple covering members 20 cannot be deployed, the heat from the heat dissipation object 40 can be dissipated.

[0023] 4 is a state in which at least one covering member 20 is in an expanded state. In the expanded heat dissipation state ST3, the heat dissipation members 25 of the first covering member 21 and the second covering member 22 are exposed to the outside. Therefore, when heat generated in the heat dissipation target 40 is transferred to the heat dissipation members 25 of the first covering member 21 and the second covering member 22 via the heat transfer member 30, the heat is dissipated to the outside from the heat dissipation members 25 of the first covering member 21 and the second covering member 22, respectively.

[0024] In the deployed heat-dissipating state ST3, the first covering member 21 and the second covering member 22 are deployed, so the dimensions of the heat-dissipating mechanism 100 in a planar view are larger than those in the insulating state ST1 and the covered heat-dissipating state ST2. Also, in the deployed heat-dissipating state ST3, heat is dissipated to the outside from the heat-dissipating members 25 of the first covering member 21 and the second covering member 22, so the amount of heat dissipation is larger than that in the covered heat-dissipating state ST2.

[0025] Next, an example of a method of using the heat dissipation mechanism 100 according to this embodiment will be described. The heat dissipation mechanism 100, with the heat dissipation object 40 housed in the container 10, is mounted on a carrier 60 such as a rocket (schematically shown by the dashed-dotted line in FIG. 3 ), and is transported from the Earth to the surface of the Moon by the carrier 60.

[0026] The heat dissipation mechanism 100 is mounted on the conveyor 60 so that the multiple coated members 20 are in the coated heat dissipation state ST2. The equipment mounted as the heat dissipation object 40 may operate and generate heat when being transported on the conveyor 60. By mounting the multiple coated members 20 on the conveyor 60 in the coated heat dissipation state ST2 in the heat dissipation mechanism 100, the heat generated in the heat dissipation object 40 can be dissipated while maintaining the same dimensions as in the insulating state ST1.

[0027] After the transport vehicle 60 reaches the lunar surface and the heat dissipation mechanism 100 is transported to the lunar surface, the multiple covering members 20 can be placed in the thermal insulating state ST1 during a period when light from the sun does not reach the lunar surface (overnight period). By placing the multiple covering members 20 in the thermal insulating state ST1, heat dissipation from the heat dissipation mechanism 100 is suppressed.

[0028] Furthermore, on the lunar surface, for example, during a period when light from the sun reaches the lunar surface, at least some of the multiple covering members 20 can be in the deployed state, i.e., the multiple covering members 20 can be in the deployed heat-dissipating state ST3. By placing the multiple covering members 20 in the deployed heat-dissipating state ST3, heat can be dissipated from the heat-dissipating members 25 of the deployed covering members 20. Note that, on the lunar surface, for example, during a period when light from the sun reaches the lunar surface, the multiple covering members 20 may be in the covered heat-dissipating state ST2. In this way, on the lunar surface, the amount of heat dissipation of the heat dissipation mechanism 100 can be adjusted by switching the multiple covering members 20 between the insulating state ST1, the covered heat-dissipating state ST2, and the deployed heat-dissipating state ST3.

[0029] FIG. 5 is a diagram showing an example of a state in which the heat dissipation mechanism 100 is mounted on a traveling device. The traveling device 50 shown in FIG. 5 has a terrestrial surface and can travel on the terrestrial surface of a celestial body different from Earth (such as a planet such as Mars, a satellite such as the Moon, or an asteroid). In this embodiment, the traveling device 50 can travel on, for example, the surface of the moon. The traveling device 50 has a main body 51, a drive unit 52, and wheels 53. The main body 51 is mounted with the heat dissipation mechanism 100 described above, which houses the heat dissipation object 40. The heat dissipation mechanism 100 is disposed such that the opening 11 is located on the opposite side from the traveling device 50. That is, the opening 11 is disposed at the top end of the heat dissipation mechanism 100, and the traveling device 50 is disposed below the heat dissipation mechanism 100. The heat dissipation object 40 includes various devices, such as a control device for causing the traveling device 50 to travel. The drive unit 52 drives the wheels 53 under the control of a control device included in the heat dissipation object 40. The wheels 53 rotate when driven by the drive unit 52. Rotation of the wheels 53 enables the traveling device 50 to travel on the lunar surface. Note that, although Fig. 5 shows an example in which the heat dissipation mechanism 100 is mounted in the insulating state ST1, this state is not limiting, and the heat dissipation mechanism 100 may be mounted in the coated heat dissipation state ST2 or the deployed heat dissipation state ST3. Furthermore, when the heat dissipation mechanism 100 is mounted on the traveling device and then mounted on the transport device 60, the multiple covering members 20 may be mounted on the transport device 60 so that they are in the coated heat dissipation state ST2.

[0030] 6 and 7 are diagrams showing examples of the arrangement of the evaporator of the heat transfer member 30 in the exposed portion 41 of the heat dissipation object 40. FIG.

[0031] 6, the evaporator 31e of the heat transfer member 31 connected to the heat dissipation member 25 of the first covering member 21 is provided in a first region AR1, which is a half region of the exposed portion 41 on the first covering member 21 side with respect to a middle position C1 in the first direction D1 where the multiple covering members 20 are arranged. Also, the evaporator 32e of the heat transfer member 30 connected to the heat dissipation member 25 of the second covering member 22 is provided in a second region AR2, which is a half region of the exposed portion 41 on the second covering member 22 side with respect to the middle position C1 in the first direction D1.

[0032] With this configuration, heat in the first region AR1 of the exposed portion 41 is dissipated by the heat dissipation member 25 of the first covering member 21, and heat in the second region AR2 of the exposed portion 41 is dissipated by the heat dissipation member 25 of the second covering member 22. In this way, the region of the exposed portion 41 is partitioned, and heat dissipation can be shared between the heat dissipation members 25 of the first covering member 21 and the second covering member 22 for each partitioned region.

[0033] Furthermore, as shown in FIG. 7, the evaporator 31e of the heat transfer member 31 and the evaporator 32e of the heat transfer member 32 can be configured to be arranged so as to straddle both sides of the first direction D1, i.e., both sides of the first region AR1 and the second region AR2 of the exposed portion 41, with respect to the intermediate position C1 in the first direction D1 of the exposed portion 41.

[0034] 7 shows a configuration in which evaporators 31e and 32e are arranged in a serpentine manner so as not to interfere with each other. With this configuration, evaporators 31e and 32e can be arranged on both sides of intermediate position C1 in the first direction D1, and can also be arranged across both sides of intermediate position C2 in the second direction D2 perpendicular to the first direction D1. In other words, evaporators 31e and 32e can be arranged over the entire exposed portion 41.

[0035] With this configuration, each of the heat transfer members 31, 32 can transfer heat from the entire exposed portion 41 to the heat dissipation member 25 of the first covering member 21 and the second covering member 22. Therefore, even if a malfunction occurs in one of the heat transfer members 31, 32, the other can transfer the entire heat from the exposed portion 41 to the heat dissipation member 25, and the heat can be dissipated from the heat dissipation member 25.

[0036] FIG. 8 illustrates the configuration of a heat dissipation mechanism according to a modified example. In the heat dissipation mechanism 100A illustrated in FIG. 8, the first covering member 21 is bendable in the unfolded state so that a portion of the heat insulating member 26 covers a portion of the heat dissipation member 25. This configuration allows the area of ​​the portion of the heat dissipation member 25 exposed to the outside to be adjusted. This allows the first covering member 21 to adjust the amount of heat dissipation from the heat dissipation member 25. For example, the first covering member 21 may be bent to cover a portion of the heat dissipation member 25 depending on the amount of heat dissipation, or may be fully opened to avoid impeding heat dissipation. Note that the first covering member 21 may be bendable in multiple stages. This configuration allows the first covering member 21 to adjust the amount of heat dissipation from the heat dissipation member 25 in multiple stages. Furthermore, by allowing the first covering member 21 to be bent in multiple stages, the first covering member 21 can easily cover and insulate the side surfaces of the heat dissipation member 25 in the insulating state ST1 illustrated in FIG. 2 or 5, for example, or be folded between the heat dissipation members 25 in the covering and heat dissipation state ST2 illustrated in FIG. 3.

[0037] 9 and 10 are diagrams illustrating the configuration of a heat dissipation mechanism according to a modified example. The heat dissipation mechanism 100B illustrated in FIG. 9 includes a plurality of covering members 20 arranged on both sides of a linear direction (e.g., a first direction D1) relative to the opening 11 of the container 10 in a planar view, and further arranged on both sides of a direction intersecting the linear direction (e.g., a second direction D2). In the configuration illustrated in FIG. 9, the direction intersecting the linear direction is the second direction D2 orthogonal to the first direction D1, but the direction is not limited to the orthogonal direction, and the covering members may be arranged in a direction intersecting the linear direction different from the orthogonal direction. For example, if the shape of the opening 11 is a regular hexagon, the plurality of covering members 20 may be arranged on both sides of the linear direction relative to the opening 11 of the container 10 in a planar view, and further arranged on both sides of directions intersecting the linear direction at 60° angles.

[0038] With this configuration, the heat dissipation members 25 of the four covering members 20 can share and dissipate the heat from the exposed portion 41 of the heat dissipation object 40, so that heat can be dissipated efficiently even if the amount of heat generated in the exposed portion 41 is large.

[0039] Fig. 9 shows a configuration in which one first covering member 21 is arranged. Fig. 10 shows a configuration in which two first covering members 21 are arranged. In the examples shown in Figs. 9 and 10, the total area of ​​the heat dissipation member 25 that is released to the outside can be changed by individually changing the covering state and the deployed state of each covering member 20.

[0040] For example, as shown in Fig. 9, by putting all four covering members 20 into the expanded state (ST4), the total area of ​​the heat dissipation members 25 exposed to the outside is the area of ​​four heat dissipation members 25. Hereinafter, the area of ​​N heat dissipation members 25 will be referred to as area N. The state shown in Fig. 8 is the state of area 4.

[0041] From this state (state of area 4), by changing two second covering members 22 into a covering state (ST5), the total area of ​​the heat dissipation members 25 exposed to the outside becomes area 3. Furthermore, from this state of area 3, by changing three second covering members 22 into a covering state (ST6), the total area of ​​the heat dissipation members 25 exposed to the outside becomes area 2.

[0042] Also, as shown in Figure 10, when all four covering members 20 are in an expanded state with an area of ​​4 (ST7), one first covering member 21 and one second covering member 22 are put into a covering state (ST8), the total area of ​​the heat dissipation member 25 exposed to the outside becomes area 2.

[0043] In this way, when the covering state and the deployed state of the first covering member 21 and the second covering member 22 are changed individually, the total area of ​​the heat dissipation member 25 exposed to the outside can be changed, thereby adjusting the amount of heat dissipation.

[0044] As described above, according to the first aspect of the present disclosure, a heat dissipation mechanism is provided, which includes a plurality of covering members 20 formed in a plate shape using heat dissipation members 25 and capable of individually covering the exposed portions 41, which are the target portions of the heat dissipation object 40, and a heat transfer member 30 that thermally connects the exposed portions 41 of the heat dissipation object 40 and the plurality of covering members 20, and the plurality of covering members 20 includes a first covering member 21 in which an insulating member having a lower thermal conductivity than the heat dissipation member 25 is arranged to cover the surface 25a of the heat dissipation member 25 that is on the outer side facing the heat dissipation object 4 when in a covering state in which the exposed portions 41 are covered, and a second covering member 22 in which no insulating member is arranged, and which is capable of switching between an insulating state ST1 in which all covering members 20 are stacked so that the first covering member 21 is positioned outermost and in a covering state, and a covered heat dissipation state ST2 in which all covering members 20 are stacked so that the second covering member 22 is positioned outermost and in a covering state.

[0045] According to this configuration, in the insulating state ST1 and the covering / heat-dissipating state ST2, the multiple covering members 20 overlap to cover the exposed portions 41, so that the overall dimensions of the heat dissipation mechanism 100 in both states are approximately the same in a plan view. Therefore, in the covering / heat-dissipating state ST2, the dimensions of the heat dissipation mechanism 100 in a plan view are approximately the same as in the insulating state ST1, and heat can be dissipated from the heat dissipation object 40. This makes it possible to dissipate heat from the heat dissipation object 40 even in a limited space where the multiple covering members 20 cannot be deployed.

[0046] According to the second aspect of the present disclosure, in the heat dissipation mechanism of the first aspect, the multiple covering members 20 can be individually changed between a covered state and an expanded state in which they are expanded to open the exposed portions 41, and in the expanded state, the heat dissipation members 25 are in an expanded heat dissipation state ST3 exposed to the outside.

[0047] According to this configuration, in the deployed heat-dissipating state ST3, the first covering member 21 and the second covering member 22 are deployed, and the respective heat-dissipating members 25 are exposed to the outside, and heat is dissipated to the outside from the respective heat-dissipating members 25 of the first covering member 21 and the second covering member 22. This allows for a larger amount of heat dissipation than in the covered heat-dissipating state ST2.

[0048] According to the third aspect of the present disclosure, in the heat dissipation mechanism according to the second aspect, the first covering member 21 is bendable so that a part of the heat insulating member covers a part of the heat dissipation member 25 in the deployed state.

[0049] This configuration makes it possible to adjust the area of ​​the portion of heat dissipation member 25 that is exposed to the outside, thereby making it possible to adjust the amount of heat dissipated from heat dissipation member 25 in first covering member 21.

[0050] According to a fourth aspect of the present disclosure, in the heat dissipation mechanism according to the third aspect, the first covering member 21 can be bent in multiple stages.

[0051] According to this configuration, in the first covering member 21, the amount of heat radiation from the heat radiation member 25 can be adjusted in multiple stages.

[0052] According to the fifth aspect of the present disclosure, in the heat dissipation mechanism of the second aspect, the heat dissipation object 40 is installed so that the exposed portion 41 is positioned vertically upward, and multiple covering members 20 are arranged on the edge (edge ​​10e of container 10) surrounding the exposed portion 41 on the upper surface (upper surface 10a of container 10) of the heat dissipation object 40, and in the covered state, the covering members 20 are arranged in a position overlapping the exposed portion 41 in a planar view, so as to follow the upper surface (upper surface 10a of container 10) or the exposed portion 41 of the heat dissipation object 40, and in the unfolded state, the covering members 20 are folded back to the side opposite the exposed portion 41 and arranged in a state supported by the edge of the upper surface of the heat dissipation object 40.

[0053] According to this configuration, the exposed portion 41 and the multiple covering members 20 are arranged on the upper surface of the heat dissipation object 40, which is on the upper side in the direction of gravity, so that in the covered state and the unfolded state, the action of gravity can stabilize the state in which the covering members 20 are supported on the edge or exposed portion 41 of the upper surface of the heat dissipation object 40.

[0054] According to a sixth aspect of the present disclosure, in a heat dissipation mechanism relating to any of the first to fifth aspects, the container 10 is installed on a running device 50 that has a terrestrial surface and is capable of running on the terrestrial surface of a celestial body other than the Earth, and is arranged so that the exposed portion 41 is located on the opposite side of the running device 50.

[0055] With this configuration, even when the traveling device 50 is installed on the lunar surface, the covering member 20 can be stably supported on the edge or exposed portion 41 of the upper surface of the heat dissipation object 40 by the action of the gravity of the moon.

[0056] According to a seventh aspect of the present disclosure, in the heat dissipation mechanism according to any one of the first to sixth aspects, the plurality of covering members 20 are arranged one on each side of the exposed portion 41 in the linear direction in a plan view.

[0057] This configuration allows the multiple covering members 20 to be arranged in a well-balanced manner relative to the exposed portions 41.

[0058] According to the eighth aspect of the present disclosure, in the heat dissipation mechanism relating to the seventh aspect, the heat transfer member 30 has a heat transfer member 31 connected to the covering member 20 arranged on one linear side of the exposed portion 41, and a heat transfer member 32 connected to the covering member 20 arranged on the other linear side of the exposed portion 41, and the heat transfer member 31 and the heat transfer member 32 are each arranged so as to straddle both sides of the exposed portion 41 at a midpoint in the linear direction.

[0059] This configuration allows the multiple covering members 20 to be arranged in a balanced manner with respect to the exposed portion 41. This configuration allows each of the heat transfer members 31, 32 to transfer heat from the entire exposed portion 41 to the heat dissipation member 25 of the first covering member 21 and the second covering member 22. Therefore, even if a malfunction occurs in one of the heat transfer members 31, 32, the other can transfer the entire heat from the exposed portion 41 to the heat dissipation member 25, and the heat can be dissipated from the heat dissipation member 25.

[0060] According to a ninth aspect of the present disclosure, in the heat dissipation mechanism according to the seventh aspect, the plurality of covering members 20 are further arranged one on each side of the exposed portion 41 in a direction perpendicular to the linear direction in a plan view.

[0061] This configuration allows the multiple covering members 20 to be arranged in a well-balanced manner relative to the exposed portions 41, while increasing the amount of heat dissipation.

[0062] According to the tenth aspect of the present disclosure, a heat dissipation object 40 is covered by a container 10 which is a covering having an opening 11, the target portion is an exposed portion 41 of the heat dissipation object 40 exposed from the opening 11, and the covering member 20 is formed integrally with the container 10 using a heat dissipation member 25 having a higher thermal conductivity than the container 10.

[0063] According to this configuration, in a configuration in which the covering member 20 is integrally formed with the container 10, heat from the heat dissipation object 40 can be released even in a limited space where multiple covering members 20 cannot be deployed.

[0064] According to an eleventh aspect of the present disclosure, there is provided a method of using a heat dissipation mechanism using a heat dissipation mechanism relating to any of the first to tenth aspects, wherein when the heat dissipation mechanism is mounted on a transport vehicle and transported by the transport vehicle from the Earth to the surface of a celestial body having a surface other than the Earth, the plurality of covering members 20 are set to a coated heat dissipation state ST2 inside the transport vehicle, and after the heat dissipation mechanism is transported to the Earth's surface, the plurality of covering members 20 are set to an insulating state ST1 on the Earth's surface.

[0065] According to this configuration, by placing the plurality of coated members 20 in the coated heat dissipation state ST2 inside the transport device, it is possible to dissipate heat from the heat dissipation object 40 in a limited space.

[0066] According to a twelfth aspect of the present disclosure, in a method of using the heat dissipation mechanism relating to the eleventh aspect, in the heat dissipation mechanism, the multiple covering members 20 can be individually changed between a covered state and a deployed state in which they are deployed to open the opening 11, and in the deployed state, the heat dissipation members 25 are in a deployed heat dissipation state ST3 in which they are exposed to the outside, and after the heat dissipation mechanism is transported to the ground surface, the multiple covering members 20 are switched between the insulating state ST1 and the deployed heat dissipation state ST3 on the ground surface to adjust the amount of heat dissipation.

[0067] According to this configuration, when a heat dissipation mechanism is used on the surface of a celestial body that has a ground surface and is different from the Earth, the heat dissipation amount can be adjusted by switching the multiple covering members 20 between the insulating state ST1 and the deployed heat dissipation state ST3, thereby dissipating heat according to the environment of the ground surface.

[0068] According to a thirteenth aspect of the present disclosure, there is provided a method of using a heat dissipation mechanism that uses a heat dissipation mechanism relating to any of the first to tenth aspects, in which, when the heat dissipation mechanism is mounted on a conveying machine, the multiple coating members 20 are set to a coated heat dissipation state ST2 inside the conveying machine, and heat generated in the heat dissipation object 40 is released while mounted on the conveying machine.

[0069] According to this configuration, when the heat dissipation mechanism is mounted on the transport device, the plurality of covering members 20 are placed in the covered heat dissipation state ST2 inside the transport device, so that heat can be dissipated according to the environment even inside the transport device.

[0070] The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention. For example, in the above-described embodiment, the opening 11 and the multiple covering members 20 of the container 10 are provided on the top surface 10a, but the present invention is not limited to this configuration. The opening 11 and the multiple covering members 20 may be provided on the side surface 10c.

[0071] Furthermore, in the above embodiment, the container 10 has been described as an example of a covering covering the heat dissipation object 40, but the present invention is not limited to this configuration. For example, the heat dissipation object 40 may be configured such that the portions other than the exposed portions 41 are covered with a multilayer insulating material (covering). In this case, the heat dissipation mechanism including the multiple covering members 20 and the heat transfer members 30 is configured to be provided separately from the covering. By attaching the heat dissipation mechanism to the heat dissipation object 40, heat can be appropriately dissipated from the exposed portions 41 of the heat dissipation object 40. [Explanation of symbols]

[0072] 10 containers 10a top surface 10b Bottom side 10c side 10e Edge 11 Opening 20 Covering material 21 First covering member 22 Second covering member 25 Heat dissipation material 25a side 26 Heat insulating materials 30, 31, 32 Heat transfer member 31c, 32c capacitors 31e, 32e Evaporator 31t,32t transport pipe 40 Heat dissipation object 41 Exposed part 50 Running gear 51 Main body 52 Drive unit 53 Wheels 60 Conveyor 100,100A,100B heat dissipation mechanism C1,C2 intermediate position D1 1st direction D2 2nd direction AR1 1st area AR2 2nd area ST1 Insulated state ST2: Heat dissipation state ST3 Expanded heat dissipation state

Claims

1. a plurality of covering members formed into a plate shape using a heat dissipation member and capable of individually covering target portions of the heat dissipation object; a heat transfer member that thermally connects the target portion of the heat dissipation object and the plurality of covering members; Equipped with The plurality of covering members include: a first covering member in which a heat insulating member having a lower thermal conductivity than the heat dissipation member is disposed so as to cover a surface of the heat dissipation member that is on the outer surface side of the heat dissipation object when the heat dissipation member is in a covered state in which the target portion is covered, and a second covering member in which the heat insulating member is not disposed, The insulating state in which all the covering members are overlapped so that the first covering member is disposed on the outermost side and the covering state is established is switchable between, and the covering heat dissipation state in which all the covering members are overlapped so that the second covering member is disposed on the outermost side and the covering state is established. Heat dissipation mechanism.

2. The plurality of covering members can be individually changed between the covering state and a deployed state in which they are deployed to open the target portion, and in the deployed state, the heat dissipation member is in a deployed heat dissipation state in which it is exposed to the outside. The heat dissipation mechanism according to claim 1 .

3. The first covering member is bendable so that a portion of the heat insulating member covers a portion of the heat dissipating member in the deployed state. The heat dissipation mechanism according to claim 2 .

4. The first covering member can be bent in multiple stages. The heat dissipation mechanism according to claim 3 .

5. the heat dissipation object is arranged so that the target portion is located on an upper surface in a vertical direction, The plurality of covering members are arranged on the edge of the upper surface of the heat dissipation object around the target portion, and in the covered state, are arranged at positions overlapping the target portion in a plan view along the upper surface or the exposed portion of the heat dissipation object, and in the unfolded state, are folded back to the side opposite the target portion and arranged in a state supported by the edge of the upper surface. The heat dissipation mechanism according to claim 2 .

6. The heat dissipation object is installed on a traveling device that can travel on the surface of a celestial body that has a ground surface and is different from the Earth, and the target portion is positioned on the opposite side of the traveling device. The heat dissipation mechanism according to claim 5 .

7. The plurality of covering members are arranged one on each side of the target portion in a linear direction in a plan view. The heat dissipation mechanism according to claim 1 .

8. the heat transfer member includes a first heat transfer member connected to the covering member disposed on one side of the target portion in the linear direction, and a second heat transfer member connected to the covering member disposed on the other side of the target portion in the linear direction, The first heat transfer member and the second heat transfer member are disposed so as to straddle both sides of a middle position of the target portion in the linear direction. The heat dissipation mechanism according to claim 7.

9. The plurality of covering members are further disposed one on each side of the target portion in a direction perpendicular to the linear direction in a plan view. The heat dissipation mechanism according to claim 7.

10. the heat dissipation object is covered with a covering having an opening, the target portion is a portion of the heat dissipation object that is exposed through the opening, The covering member is provided integrally with the covering using the heat dissipation member having a higher thermal conductivity than the covering. The heat dissipation mechanism according to claim 1 .

11. A method for using the heat dissipation mechanism according to claim 1, comprising: When the heat dissipation mechanism is mounted on a transport vehicle and transported from the Earth to the surface of a celestial body having a surface different from the Earth by the transport vehicle, the plurality of covering members are placed in the covered heat dissipation state inside the transport vehicle; After the heat dissipation mechanism is transported to the ground surface, the plurality of covering members are brought into the thermally insulated state on the ground surface. How to use the heat dissipation mechanism.

12. In the heat dissipation mechanism, the plurality of covering members can be individually changed between the covering state and a deployed state in which the covering members are deployed to open the target portion, and in the deployed state, the heat dissipation members are in a deployed heat dissipation state in which they are exposed to the outside, After the heat dissipation mechanism is transported to the ground surface, the covering members are switched between the heat insulating state and the deployed heat dissipation state on the ground surface to adjust the amount of heat dissipation. A method for using the heat dissipation mechanism according to claim 11.

13. A method for using the heat dissipation mechanism according to claim 1, comprising: When the heat dissipation mechanism is mounted on a transporting device, the plurality of covering members are set in the covering heat dissipation state inside the transporting device, and heat generated in the heat dissipation object is dissipated while the heat dissipation mechanism is mounted on the transporting device. How to use the heat dissipation mechanism.

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