Power storage device module and bind bar

Abstract

To improve durability of a power storage device module.SOLUTION: The power storage device module 200 includes a plurality of power storage devices 100, a cooler 20, a pair of end plates 110, and a pair of bind bars 120. The cooler 20 has a first refrigerant passage 25 in which a refrigerant flows. The pair of bind bars 120 includes an outer plate 121, an inner plate 125, and a second refrigerant flow path 123. The second refrigerant passage 123 is formed between the inner plate 125 and the outer plate 121. The binding bar 120 is provided with a stress distribution portion 129. The stress dispersion portion 129 is provided between a region where the second refrigerant flow path 123 is provided and a portion bridged between the pair of end plates 110. The stress distribution portion 129 is provided on both sides of the region where the second refrigerant flow path 123 is provided.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to an electricity storage device module and a bind bar. [Background technology]

[0002] Chinese Utility Model No. 218005003 discloses a battery module including a battery pack, opposing first and second radiators, and a plurality of spacers. The battery pack is disposed between the opposing first and second radiators. The spacers are attached to the batteries that make up the battery pack. The spacers are filled with cooling water. The spacers are connected to the first and second radiators. The first and second radiators and the spacers form a heat dissipation path through which the cooling water flows.

[0003] Chinese Utility Model No. 219066947 discloses a battery module including a plurality of battery packs and a first temperature adjustment plate. The first temperature adjustment plate includes a first plate body and a first joint assembly. The first plate body is positioned between battery rows of the plurality of battery packs. The first plate body has a first heat exchange flow path therein through which a heat exchange medium flows. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Chinese Utility Model No. 218005003 [Patent Document 2] Chinese Utility Model No. 219066947 Summary of the Invention [Problem to be solved by the invention]

[0005] The present inventors wish to improve the durability of an electricity storage device module in which a refrigerant flow path is formed. [Means for solving the problem]

[0006] The disclosed energy storage device module includes a plurality of energy storage devices, a cooler, a pair of end plates, and a pair of bind bars. The plurality of energy storage devices are stacked in the stacking direction. The cooler is disposed between adjacent energy storage devices. The pair of end plates are disposed on both sides of the plurality of energy storage devices in the stacking direction. The pair of bind bars span the pair of end plates. The cooler has a first refrigerant flow path through which a refrigerant flows. At least one of the pair of bind bars includes an outer plate, an inner plate, and a second refrigerant flow path. The inner plate is bonded to the inner surface of the outer plate. The inner plate faces the plurality of energy storage devices. The second refrigerant flow path is formed between the inner plate and the outer plate at a portion spanned by the pair of end plates. The second refrigerant flow path is a flow path through which a refrigerant flows along the stacking direction. The first refrigerant flow path and the second refrigerant flow path are connected. The bind bar is provided with a stress distribution portion. The stress distribution portion is a portion where the inner plate is raised relative to the outer plate. The stress dispersion portion is provided in the stacking direction between the region where the second refrigerant flow path is provided and the portion that bridges the pair of end plates. The stress dispersion portion is provided on both sides of the region where the second refrigerant flow path is provided. In this electricity storage device module, the durability of the electricity storage device module is improved. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a perspective view of an electricity storage device 100 to which a cooler 20 is attached. [Figure 2] FIG. 2 is a plan view of the electricity storage device 100 to which the cooler 20 is attached. [Figure 3] FIG. 3 is a schematic diagram of the electricity storage device 100. As shown in FIG. [Figure 4] FIG. 4 is a plan view of the power storage device module 200. As shown in FIG. [Figure 5]FIG. 5 is a schematic diagram of the cooler 20A before it is attached to the electricity storage device 100. As shown in FIG. [Figure 6] FIG. 6 is a schematic diagram of the cooler 20B before it is attached to the electricity storage device 100. As shown in FIG. [Figure 7] FIG. 7 is a schematic diagram of the bind bar 120. [Figure 8] FIG. 8 is a schematic diagram of a pair of bind bars 120 with coolers 20 attached thereto. [Figure 9] FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0008] An embodiment of the technology disclosed herein will be described below with reference to the drawings. The embodiments described herein are, of course, not intended to limit the present invention. The drawings are schematic and do not necessarily reflect the actual product. Furthermore, components and parts performing the same function are appropriately designated by the same reference numerals, and redundant descriptions will be omitted where appropriate. In the following description, the reference numerals L, R, F, Rr, U, and D in the drawings represent left, right, front, rear, top, and bottom, and the reference numerals X, Y, and Z in the drawings represent the short side direction, long side direction, and height direction of the energy storage device, respectively. However, these directions are merely used for convenience of explanation and do not in any way limit the installation form of the energy storage device, etc.

[0009] Here, the cooler for an electricity storage device will be described together with the configuration of the electricity storage device and the electricity storage device module. FIG. 1 is a perspective view of an electricity storage device 100 equipped with a cooler 20. FIG. 2 is a plan view of the electricity storage device 100 equipped with the cooler 20. FIG. 2 shows the electricity storage device 100 equipped with the cooler 20, as viewed from above. In FIGS. 1 and 2, illustrations of a gas exhaust valve and the like provided on the lid 54 are omitted. FIG. 3 is a schematic diagram of the electricity storage device 100. FIG. 3 shows a schematic diagram of the internal configuration of the electricity storage device 100. FIG. 4 is a plan view of an electricity storage device module 200. In FIG. 4, the electricity storage device module 200 as viewed from above is shown.

[0010] <Electricity storage device 100> As shown in FIG. 3, the electricity storage device 100 has an electrode assembly 40 and a case 50 that houses an electrolyte (not shown). In this specification, the term "electricity storage device" refers to a device that can be repeatedly charged and discharged. Electricity storage devices include secondary batteries such as lithium ion secondary batteries and nickel-metal hydride batteries. Electricity storage devices include capacitors such as lithium ion capacitors and electric double layer capacitors. The electricity storage device 100 will be described below using a lithium ion secondary battery as an example.

[0011] Case 50 The case 50 is a housing that houses the electrode assembly 40. As shown in FIG. 1, the case 50 is rectangular (square). Any conventionally known material can be used for the case 50 without any particular restrictions. The case 50 may be made of, for example, a metal. Examples of materials for the case 50 include aluminum, aluminum alloy, iron, and iron alloy. The case 50 has a case body 52 and a lid 54.

[0012] The case body 52 has a substantially rectangular bottom wall 50c1 in plan view, a pair of first side walls 50a1 and 50a2 extending upward in the height direction Z from the short sides of the bottom wall 50c1, and a pair of second side walls 50b1 and 50b2 extending upward in the height direction Z from the long sides of the bottom wall 50c1. The first side wall 50a1 forms the left side wall. The first side wall 50a2 forms the right side wall. As shown in FIG. 3, an opening 52h is formed in the upper part of the case body 52.

[0013] The lid 54 is a plate-like member that is substantially rectangular in plan view. The lid 54 is a member that closes the opening 52h of the case body 52. ​​The lid 54 is formed by a sealing plate 50c2. The sealing plate 50c2 is provided with a liquid inlet 55 and a gas exhaust valve 57. The liquid inlet 55 is a hole provided for injecting an electrolyte (not shown) into the inside of the case 50. After the electrolyte is injected, the liquid inlet 55 is sealed with a sealing member 56. The gas exhaust valve 57 is a thin-walled portion that is designed to rupture (open) when a large amount of gas is generated inside the case 50 and to exhaust the gas. Note that the liquid inlet 55, the sealing member 56, and the gas exhaust valve 57 are not shown in FIG. 1.

[0014] As shown in FIG. 1 , the case 50 has a pair of first surfaces 50a1 and 50a2, a pair of second surfaces 50b1 and 50b2, and a pair of third surfaces 50c1 and 50c2. In this embodiment, the pair of first surfaces 50a1 and 50a2 are formed by a pair of first side walls 50a1 and 50a2. The pair of second surfaces 50b1 and 50b2 are formed by a pair of second side walls 50b1 and 50b2. The pair of third surfaces 50c1 and 50c2 are formed by a bottom wall 50c1 and a sealing plate 50c2. The pair of first surfaces 50a1 and 50a2 face each other along the long-side direction Y of the power storage device 100. The pair of second surfaces 50b1 and 50b2 face each other along the short-side direction X of the power storage device 100. The pair of third surfaces 50c1, 50c2 face each other along the height direction Z of the power storage device 100. The pair of second surfaces 50b1, 50b2 connect the pair of first surfaces 50a1, 50a2. The pair of third surfaces 50c1, 50c2 connect the pair of first surfaces 50a1, 50a2 and the pair of second surfaces 50b1, 50b2. The first surfaces 50a1, 50a2 are the surfaces with the smallest areas among the first surfaces 50a1, 50a2, the second surfaces 50b1, 50b2, and the third surfaces 50c1, 50c2. The second surfaces 50b1, 50b2 are the surfaces with the largest areas among the first surfaces 50a1, 50a2, the second surfaces 50b1, 50b2, and the third surfaces 50c1, 50c2. The area of ​​the third surfaces 50c1 and 50c2 is larger than the area of ​​the first surfaces 50a1 and 50a2, and smaller than the area of ​​the second surfaces 50b1 and 50b2.

[0015] 3, the lid 54 has terminal insertion holes 58, 59 to which the positive electrode terminal 60 and the negative electrode terminal 65 are respectively attached. The terminal insertion holes 58, 59 are each formed at an end of the lid 54 in the long side direction Y.

[0016] The positive electrode terminal 60 and the negative electrode terminal 65 are attached to the ends of the lid 54 in the long side direction Y of the electricity storage device 100. The positive electrode terminal 60 is connected to a plate-shaped positive electrode external conductive member 62 on the outside of the case 50. The negative electrode terminal 65 is connected to a plate-shaped negative electrode external conductive member 67 on the outside of the case 50. The positive electrode external conductive member 62 and the negative electrode external conductive member 67 are connected to other electricity storage devices or external equipment via external connection members (such as bus bars).

[0017] A positive electrode current collector 70 and a negative electrode current collector 75 are attached to the inner surface of the lid 54. The positive electrode current collector 70 and the negative electrode current collector 75 are each a plate-shaped conductive member extending along the inner surface of the lid 54. A lower end 60c of the positive electrode terminal 60 is connected to the positive electrode current collector 70. A lower end 65c of the negative electrode terminal 65 is connected to the negative electrode current collector 75.

[0018] The lid 54 is provided with various insulating members that prevent electrical continuity between the case 50 (case body 52, lid 54) and the electrode terminals (positive terminal 60, negative terminal 65). Gaskets 90 that prevent electrical continuity between the electrodes and the lid 54 are fitted in the terminal insertion holes 58, 59 of the lid 54. An external insulating member 92 is disposed between the positive electrode external conductive member 62 (or the negative electrode external conductive member 67) and the outer surface of the lid 54. An internal insulating member 94 is disposed between the positive electrode current collector 70 (or the negative electrode current collector 75) and the inner surface of the lid 54. The internal insulating member 94 has a plate-shaped base portion 94a attached to the inner surface of the lid 54. The internal insulating member 94 has a protruding portion 94b that protrudes from the base portion 94a toward the electrode assembly 40. The protruding portion 94b restricts vertical movement of the electrode assembly 40 and prevents direct contact between the electrode assembly 40 and the lid 54. The material of the insulating member is not particularly limited as long as it has a predetermined insulating property. Synthetic resin materials such as polyolefin resin and fluorine resin can be used as the insulating member. Note that the insulating member (external insulating member 92) is not shown in Figures 1 and 2.

[0019] The lid 54 is attached to the top of the case body 52 with the electrode body 40 attached via the positive electrode current collector 70 and the negative electrode current collector 75, and seals the opening 52h.

[0020] <Electrode body 40> The electrode assembly 40 may be the same as a conventional one and is not particularly limited. The electrode assembly 40 includes a positive electrode and a negative electrode (not shown). The electrode assembly 40 may be, for example, a flat wound electrode assembly in which a strip-shaped positive electrode and a strip-shaped negative electrode are stacked in an insulated state via a strip-shaped separator and wound around a winding axis. The electrode assembly 40 may also be a laminated electrode assembly in which a square-shaped (typically rectangular) positive electrode and a square-shaped (typically rectangular) negative electrode are stacked in an insulated state.

[0021] The positive electrode includes a positive electrode core, which is a foil-shaped metal member, and a positive electrode active material layer formed on the surface of the positive electrode core. A metal material having a predetermined conductivity, such as aluminum or an aluminum alloy, can be used for the positive electrode core. The positive electrode active material layer is a layer containing a positive electrode active material. The positive electrode active material is a material that can reversibly absorb and release charge carriers in relation to the negative electrode active material described below. For example, a lithium transition metal composite oxide can be used as the positive electrode active material. A positive electrode tab 42 that protrudes outward in the Y direction (to the left in FIG. 3 ) is provided on one side edge of the positive electrode. The positive electrode tab 42 is a region where the positive electrode active material layer is not formed and where the positive electrode core is exposed. The positive electrode tab 42 is connected to a positive electrode current collector 70.

[0022] The negative electrode includes a negative electrode core, which is a foil-shaped metal member, and a negative electrode active material layer formed on the surface of the negative electrode core. A metal material having a predetermined conductivity, such as copper or a copper alloy, can be used for the negative electrode core. The negative electrode active material layer is a layer containing a negative electrode active material. The negative electrode active material is a material that can reversibly absorb and release charge carriers in relation to the positive electrode active material. A carbon material, a silicon-based material, or the like can be used for the negative electrode active material. A negative electrode tab 44 that protrudes outward in the Y direction (to the right in FIG. 3 ) is provided on one side edge of the negative electrode. The negative electrode tab 44 is a region where the negative electrode active material layer is not formed and where the negative electrode core is exposed. The negative electrode tab 44 is connected to a negative electrode current collector 75.

[0023] The separator prevents contact between the positive electrode and the negative electrode and allows charge carriers to pass through. As the separator, a porous resin film having a plurality of fine pores formed therein through which charge carriers can pass can be used.

[0024] The electrolyte housed in the case 50 together with the electrode assembly 40 can be any electrolyte used in conventionally known secondary batteries, without any particular restrictions. The non-aqueous electrolyte can be one in which a supporting salt is dissolved in a non-aqueous solvent.

[0025] 4, the power storage devices 100 are aligned in a predetermined direction to form a power storage device module 200. In this embodiment, the power storage devices 100 are aligned along the short side direction (stacking direction) X with the second surfaces 50b1 and 50b2 of adjacent power storage devices 100 facing each other. A cooler 20 is attached to each of the multiple power storage devices 100.

[0026] <Cooler 20> The cooler 20 is a cooler for the electricity storage device 100. As shown in FIG. 2, the cooler 20 is attached to a case 50 of the electricity storage device 100. A thermally conductive resin, also called a gap filler, may be interposed between the cooler 20 and the case 50. This can improve the cooling efficiency of the case 50. The cooler 20 is made of a metal plate 21.

[0027] <Plate 21> The plate 21 may be made of a metal with excellent thermal conductivity. The plate 21 may be made of, for example, aluminum or an aluminum alloy. The plate 21 is plate-shaped. The height of the plate 21 is approximately the same as the height of the electricity storage device 100. As shown in FIG. 1 , the plate 21 has a first plate portion 22, a second plate portion 23, a bent portion 24, and a refrigerant flow path 25. The plate 21 is provided with an inlet 26 and an outlet 27.

[0028] <First plate portion 22> The first plate portion 22 is a portion that overlaps at least one of the pair of first surfaces 50a1, 50a2. The first plate portion 22 is substantially rectangular. The first plate portion 22 has substantially the same dimensions as the first surfaces 50a1, 50a2 of the case 50. In this embodiment, the first plate portion 22 is provided on both sides in the long side direction Y so as to overlap both of the pair of first surfaces 50a1, 50a2. In other words, the plate 21 has a pair of first plate portions 22 that overlap the pair of first surfaces 50a1, 50a2. The first plate portion 22 is connected to the second plate portion 23.

[0029] <Second plate portion 23> The second plate portion 23 is a portion that is overlaid on one of the pair of second surfaces 50b1, 50b2. In the embodiment shown in FIG. 1, the second plate portion 23 is overlaid on the front second surface 50b1 of the pair of second surfaces 50b1, 50b2. The second plate portion 23 has a substantially rectangular shape. The second plate portion 23 has substantially the same dimensions as the second surfaces 50b1, 50b2 of the case 50. Note that in the embodiment shown in FIG. 4, the second plate portion 23 is arranged such that the power storage devices 100 overlaid on the front second surface 50b1 and the power storage devices 100 overlaid on the rear second surface 50b2 are alternately arranged.

[0030] The first plate portion 22 and the second plate portion 23 cover three of the side surfaces (front, right, and left surfaces) of the substantially rectangular parallelepiped case 50. One of the side surfaces (rear surface) of the substantially rectangular parallelepiped case 50 is not covered by either the first plate portion 22 or the second plate portion 23. Therefore, the plate 21 has a substantially U-shape when viewed from above. A bent portion 24 is formed at the boundary between the first plate portion 22 and the second plate portion 23.

[0031] <Bend 24> The bent portion 24 is a portion provided on the plate 21 that is bent along the boundary between the first plate portion 22 and the second plate portion 23. The bent portion 24 extends along the height direction Z. In this embodiment, two bent portions 24 are provided on the plate 21. The bent portions 24 are provided at the boundary between the second plate portion 23 and the left first plate portion 22, and at the boundary between the second plate portion 23 and the right first plate portion 22.

[0032] The cooler 20 is attached to the power storage device 100 so that the first plate portion 22, the second plate portion 23, and the bent portion 24 are aligned along the first surfaces 50a1, 50a2 and the second surface 50b1 or 50b2. When the cooler 20 is attached to the power storage device 100, the bent portion 24 is a portion where the first plate portion 22 and the second plate portion 23 are bent so that they are aligned along the first surfaces 50a1, 50a2 and the second surface 50b1 or 50b2 of the case 50. In other words, when the cooler 20 is attached to the power storage device 100, the bent portion 24 is bent so that the angle between the first plate portion 22 and the second plate portion 23 matches the angle between the first surfaces 50a1, 50a2 and the second surface 50b1 or 50b2 of the case 50. In this embodiment, the case 50 has a substantially rectangular parallelepiped shape. Therefore, when the cooler 20 is attached to the electricity storage device 100, the bent portion 24 is bent at a substantially right angle. Inside the plate 21 attached to the electricity storage device 100, a refrigerant flow path 25 is formed.

[0033] <Refrigerant flow path 25> The refrigerant flow path 25 is a path through which the refrigerant flows. The refrigerant flow path 25 is formed inside the first plate portion 22, the second plate portion 23, and the bent portion 24. The refrigerant flow path 25 connects an inlet 26 and an outlet 27 provided in the plate 21. The refrigerant flow path 25 is formed so that the refrigerant flows from the inlet 26 to the outlet 27 inside the plate 21.

[0034] In this embodiment, the inlet 26 and the outlet 27 are provided in the first plate portion 22. The inlet 26 is connected to one of the pair of first plate portions 22, the first plate portion 22a. The outlet 27 is connected to the other of the pair of first plate portions 22, the first plate portion 22b. The refrigerant flow path 25 is formed so that the refrigerant passes from one of the first plate portions 22a through the second plate portion 23 toward the other first plate portion 22b. Note that the inlet 26 and the outlet 27 do not necessarily have to be provided in different first plate portions 22a, 22b, and may be provided in one of the first plate portions 22a, 22b. The inlet 26 and the outlet 27 may be provided in the second plate portion 23. The locations of the inlet 26 and the outlet 27 can be determined depending on the configuration of the electricity storage device 100, the piping connected to the cooler 20, and the like.

[0035] The outlet 27 is provided above the inlet 26. The inlet 26 is provided in the lower part of the first plate portion 22a. The outlet 27 is provided in the upper part of the second plate portion 23. The positional relationship between the inlet 26 and the outlet 27 is not particularly limited to this form. The inlet 26 and the outlet 27 may be provided at the same height. The outlet 27 may be provided below the inlet 26.

[0036] The inlet 26 and the outlet 27 are configured to allow the refrigerant to be introduced into the refrigerant flow path 25 in the plate 21. In this embodiment, the inlet 26 and the outlet 27 are attached to the plate 21 via a sealing member (not shown). Here, the inlet 26 and the outlet 27 are configured by piping (e.g., a quick spool) attached to the first plate portion 22. This ensures airtightness between the inlet 26 and the outlet 27 and the refrigerant flow path 25. This configuration also makes the inlet 26 and the outlet 27 detachable from the plate 21, improving maintainability, such as pipe replacement. Furthermore, loads on the inlet 26 and the outlet 27 due to vibrations of the power storage device 100, etc., are also likely to be alleviated. For example, an O-ring or the like can be used as the sealing member. It is not necessary for both the inlet 26 and the outlet 27 to be attached via a sealing member; either the inlet 26 or the outlet 27 may be attached via a sealing member. Furthermore, the sealing member is not essential, and the inlet 26 and the outlet 27 may be attached to the plate 21 by welding or the like.

[0037] The inlet 26 and the outlet 27 are provided perpendicular to the plate 21 (first plate portion 22). Here, the inlet 26 and the outlet 27 are pipes attached perpendicular to the plate 21. The refrigerant flows in and out perpendicular to the plate 21. The portions of the plate 21 to which the inlet 26 and the outlet 27 are attached (through holes) are provided on the surface of the plate 21. The diameter of the through holes formed in the plate 21 can be set within the area of ​​the plate 21 (in this embodiment, the area of ​​the first plate portion 22). Therefore, it is easier to increase the diameters of the inlet 26 and the outlet 27 compared to when the inlet 26 and the outlet 27 are connected to the side surface of the plate 21. As a result, it is easier to increase the amount of refrigerant circulating through the cooler 20 per unit time.

[0038] The refrigerant flow path 25 is provided so that the refrigerant flowing in from the inlet 26 flows out from the outlet 27 .

[0039] In this embodiment, the refrigerant flow path 25 is provided in the plate 21 so as to snake from the inlet 26 to the outlet 27. The refrigerant flow path 25 passes through the first plate portion 22, the second plate portion 23, and the bent portion 24, while bending back at the first plate portion 22a and the first plate portion 22b. The refrigerant flow path 25 is configured as follows: The refrigerant flow path 25 extends from the inlet 26 provided at the bottom toward the front of the first plate portion 22a. The refrigerant flow path 25 extends toward the right at the second plate portion 23. At the first plate portion 22b, the refrigerant flow path 25 extends toward the rear, turns upward, and then turns back toward the front. The refrigerant flow path 25 extends toward the left at the second plate portion 23. At the first plate portion 22a, the refrigerant flow path 25 extends toward the rear, turns upward, and then turns back toward the front. The refrigerant flow path 25 again extends to the right at the second plate portion 23. Although a detailed description will be omitted, the refrigerant flow path 25 is folded back again at the first plate portion 22b, and then folded back again at the first plate portion 22a. The refrigerant flow path 25 then extends to the right again at the second plate portion 23 and reaches the outlet 27 of the first plate portion 22b. In this way, the refrigerant flow path 25 makes 2.5 round trips between the first plate portion 22a and the first plate portion 22b, with the flow path facing upward each time it folds back. Here, the refrigerant flow path 25 is a single, continuous flow path with no branches. This prevents the refrigerant from stagnating, resulting in good cooling efficiency.

[0040] There is no particular limitation on the method for forming the plate 21 having the above-described refrigerant flow path 25 therein. In this embodiment, as will be described below, cavities that become the refrigerant flow path 25 are formed in a substantially flat metal plate 21c by extrusion processing, and then the openings are closed with cover members 21a and 21b (see FIG. 2), thereby forming the flow path.

[0041] A rectangular metal plate 21c is prepared. The dimensions and shape of the metal plate 21c can be selected depending on the case 50. Cavities that become the refrigerant flow paths 25 are formed in the metal plate 21c by extrusion along the long side of the metal plate 21c. In this embodiment, five through holes are formed in the metal plate 21c along the long side of the metal plate 21c. Areas corresponding to the outer surfaces of the first plate portions 22a and 22b (surfaces to which the inlet 26 and the outlet 27 are attached) are cut out by cutting. At this time, to form the folded-back portion of the refrigerant flow path 25, the metal plate 21c is cut so that adjacent cavities (through holes) are connected at their ends. Cover members 21a and 21b are prepared to cover the cut surface of the metal plate 21c and the end opened by extrusion. The same type of metal as the metal plate 21c can be used for the cover members 21a and 21b. Through holes to which the inlet 26 and the outlet 27 are attached are formed in the cover members 21a and 21b, respectively. Lid members 21a and 21b are attached to both ends of metal plate 21c so as to close the surfaces cut by the cutting process and the ends opened by the extrusion process. Although not particularly limited, lid members 21a and 21b can be attached to metal plate 21c by, for example, brazing, welding, or the like. Lid members 21a and 21b are attached to metal plate 21c so that the through holes of lid members 21a and 21b are connected to cavities formed in metal plate 21c that serve as refrigerant flow paths 25. In this manner, the above-described refrigerant flow paths 25 can be formed in metal plate 21c.

[0042] The metal plate 21c, in which the refrigerant flow path 25 is formed, is bent by bending to form the plate 21. In this embodiment, both end portions of the metal plate 21c are bent. As a result, both end portions of the metal plate 21c form the first plate portion 22. Each bent portion forms a bent portion 24. The portion between the bent portions 24 forms the second plate portion 23.

[0043] The angle of the bent portion 24 is not particularly limited. The angle of the bent portion 24 can be determined according to the shape of the case 50. The angle of the bent portion 24 may also be determined from the perspective of ease of attachment and detachment to and stability after attachment to the case 50, etc. The angle of the bent portion 24 (the angle between the first plate portion 22 and the second plate portion 23) is not particularly limited, but may be approximately 80 degrees or more and 120 degrees or less before attachment to the case 50. In the cooler 20 before attachment to the case 50, the angle between the first plate portion 22 and the second plate portion 23 may be approximately the same as the angle between the first surfaces 50a1, 50a2 and the second surface 50b1 of the case 50 (90 degrees in this embodiment).

[0044] Fig. 5 is a schematic diagram of a cooler 20A before being attached to the power storage device 100. Fig. 6 is a schematic diagram of a cooler 20B before being attached to the power storage device 100. The coolers 20A and 20B are attached to the power storage device 100, which has a rectangular parallelepiped shape.

[0045] In the cooler 20A shown in FIG. 5, the angle between the first plate portion 22 and the second plate portion 23 is greater than 90 degrees before the cooler 20A is attached to the case 50. The angle between the first plate portion 22 and the second plate portion 23 is greater than the angle between the first surfaces 50a1, 50a2 and the second surface 50b1 (see FIG. 1) of the case 50, which makes it easy to attach the cooler 20A to the case 50. The angle between the first plate portion 22 and the second plate portion 23 may be adjusted so that the cooler 20A is less likely to come off the case 50 after the cooler 20 is attached. The cooler 20A may be restrained relative to the case 50 so that the cooler 20A is less likely to come off the case 50 after the cooler 20 is attached.

[0046] 6, the angle formed between the first plate portion 22 and the second plate portion 23 is smaller than 90 degrees before the cooler 20B is attached to the case 50. Because the angle formed between the first plate portion 22 and the second plate portion 23 is smaller than the angle formed between the first surfaces 50a1, 50a2 and the second surface 50b1 (see FIG. 1) of the case 50, the cooler 20B is less likely to come off the case 50 after being attached to the case 50. When attaching the cooler 20B, the angle formed between the first plate portion 22 and the second plate portion 23 can be temporarily widened so that it becomes larger than the angle formed between the first surfaces 50a1, 50a2 and the second surface 50b1 of the case 50.

[0047] As shown in FIG. 1 , a refrigerant supply device 28 is connected to the inlet 26 of the cooler 20. The refrigerant supply device 28 is provided outside the power storage device 100. In this embodiment, a device also called a chiller, which circulates a refrigerant at a preset temperature, is used as the refrigerant supply device 28. The refrigerant supply device 28 is also connected to the outlet 27. The refrigerant supply device 28 circulates the refrigerant through the refrigerant flow path 25 via the inlet 26 and the outlet 27 while adjusting the temperature of the refrigerant. The temperature of the refrigerant may be, for example, room temperature or a temperature lower than room temperature. Although not particularly limited, the refrigerant may include water, antifreeze, insulating liquid, etc. Using water or antifreeze as the refrigerant may reduce the cost required to cool the power storage device 100. Using an insulating liquid as the refrigerant may improve the safety of the power storage device 100. Silicon oil, transformer oil, etc. may be used as the insulating liquid. There are no particular limitations on the configuration of the refrigerant supply device 28 and the method of connecting the refrigerant supply device 28 and the cooler 20. The cooler 20 may be connected to the refrigerant supply device 28 via a bind bar 120 (see FIG. 4) described later.

[0048] In the above-described embodiment, as shown in FIGS. 1 and 2, the electricity storage device cooler 20 is used in an electricity storage device 100 having a case 50 with a pair of first surfaces 50a1, 50a2 and a pair of second surfaces 50b1, 50b2. The second surfaces 50b1, 50b2 connect the pair of first surfaces 50a1, 50a2. The cooler 20 is composed of a metal plate 21. The plate 21 has a first plate portion 22, a second plate portion 23, a bent portion 24, and a refrigerant flow path 25. The first plate portion 22 is overlaid on at least one of the pair of first surfaces 50a1, 50a2. The second plate portion 23 is overlaid on one of the pair of second surfaces 50b1, 50b2. The bent portion 24 is bent along the boundary between the first plate portion 22 and the second plate portion 23. The refrigerant flow path 25 is a flow path through which the refrigerant flows inside the first plate portion 22, the second plate portion 23, and the bent portion 24. The plate 21 is provided with an inlet 26 that communicates with the refrigerant flow path 25 and an outlet 27 that communicates with the refrigerant flow path 25. The cooler 20 cools the first surfaces 50a1, 50a2 and the second surface 50b1 of the case 50 of the electricity storage device 100. The single cooler 20 can cool two adjacent surfaces of the case 50 of the electricity storage device 100. This results in better cooling efficiency for the electricity storage device 100 than, for example, a cooler that cools only one surface of the case of the electricity storage device.

[0049] Although not particularly limited, the first plate portion 22 and the second plate portion 23 may be set to have dimensions that cover the first surfaces 50a1, 50a2 and the second surface 50b1. This increases the contact area between the cooler 20 and the power storage device 100, and can improve the cooling efficiency of the power storage device 100.

[0050] In the above-described embodiment, the plate 21 of the cooler 20 includes a pair of first plate portions 22 that are overlapped on the pair of first surfaces 50a1, 50a2. The pair of first plate portions 22 are overlapped on both sides of the pair of first surfaces 50a1, 50a2, thereby increasing the contact area between the cooler 20 and the electricity storage device 100. This can improve the cooling efficiency of the electricity storage device 100. Furthermore, because the electricity storage device 100 can be sandwiched between the pair of first plate portions 22, the connection between the cooler 20 and the electricity storage device 100 is easily maintained.

[0051] In this embodiment, a positive electrode terminal 60 is provided at one end of the lid 54 in the long side direction Y, and a negative electrode terminal 65 is provided at the other end. When the electricity storage device 100 is being used (during charging and discharging), the temperatures of the positive electrode terminal 60 and the negative electrode terminal 65 tend to rise. For this reason, the temperatures of both ends of the electricity storage device 100 in the long side direction Y tend to rise more easily than other parts. When the positive electrode terminal 60 and the negative electrode terminal 65 are provided at both ends in the long side direction Y, the cooling efficiency of the electricity storage device 100 is likely to be further improved by cooling the first surfaces 50a1, 50a2 that constitute the side surfaces of the electricity storage device 100 in the long side direction Y.

[0052] In the above-described embodiment, the inlet 26 is connected to one of the pair of first plate portions 22, the first plate portion 22a, and the outlet 27 is connected to the other first plate portion 22b. This allows the connection structure, such as piping, provided at the inlet 26 and the connection structure, such as piping, provided at the outlet 27 to be provided on different side surfaces of the electricity storage device 100. As a result, the connection structures, such as piping, connected to the cooler 20 are less likely to be concentrated in one place, and the connection structure can be simplified.

[0053] In the above-described embodiment, the case 50 of the power storage device 100 has a rectangular parallelepiped shape. The case 50 has a pair of first surfaces 50a1 and 50a2 and a pair of second surfaces 50b1 and 50b2, and third surfaces 50c1 and 50c2 connected to them. The first surfaces 50a1 and 50a2 are the surfaces with the smallest areas among the first surfaces 50a1 and 50a2, the second surfaces 50b1 and 50b2, and the third surfaces 50c1 and 50c2. The second surfaces 50b1 and 50b2 are the surfaces with the largest areas among the first surfaces 50a1 and 50a2, the second surfaces 50b1 and 50b2, and the third surfaces 50c1 and 50c2. By cooling the second surfaces 50b1 and 50b2, which are the surfaces with the largest areas, the cooling efficiency of the power storage device 100 can be improved. The cooler 20 is attached so as to sandwich the first surfaces 50a1, 50a2, which are the surfaces with the smallest area, and therefore the space occupied by the cooler 20 can be reduced. In addition, the cooler 20 can be easily attached to and detached from the electricity storage device 100.

[0054] The configuration of the cooler is not limited to the above-described embodiment. In the above-described embodiment, the first surfaces 50a1 and 50a2 are the surfaces with the smallest areas, and the second surfaces 50b1 and 50b2 are the surfaces with the largest areas. However, the configuration is not limited to this. For example, the configuration of the first plate portion may be determined so that the bottom wall 50c1 constitutes the first surface. The configuration of the first plate portion may be determined so that the second side walls 50b1 and 50b2 constitute the first surface. The configuration of the second plate portion may be determined so that the bottom wall 50c1 constitutes the second surface. As described above, which surfaces of the case 50 are the first surface and the second surface can be appropriately determined depending on the configuration of the power storage device 100, the installation form of the power storage device 100, etc.

[0055] Furthermore, the cooler may be configured to be able to cool a plurality of power storage devices 100. For example, the cooler may be configured so that the first plate portion is overlapped with the first side walls 50a1, 50a2 of the plurality of power storage devices 100, and the second plate portion is overlapped with the second side walls 50b1, 50b2 of the plurality of power storage devices 100.

[0056] In the above-described embodiment, the inlet 26 and the outlet 27 are provided perpendicular to the plate 21 (in this embodiment, the first plate portion 22). The opening area where the inlet 26 and the outlet 27 are attached can be set according to the area of ​​the first plate portion 22. Therefore, it is easy to increase the diameters of the inlet 26 and the outlet 27 without increasing the thickness of the plate 21. By increasing the diameters of the inlet 26 and the outlet 27, it is possible to increase the amount of refrigerant circulating in the refrigerant flow path 25 per unit time. As a result, the cooling efficiency of the electricity storage device 100 can be improved.

[0057] In the above-described embodiment, the outlet 27 is provided above the inlet 26. This makes it easier for the refrigerant to fill the refrigerant flow path 25 when the refrigerant is supplied to the cooler 20. The temperature of the cooler 20 is easily reduced by heat exchange with the refrigerant. As a result, the cooling efficiency of the electricity storage device 100 can be improved.

[0058] In the above-described embodiment, the refrigerant flow path 25 is provided in the plate 21 so as to meander from the inlet 26 to the outlet 27. Therefore, the temperature of the cooler 20 is likely to be reduced by the refrigerant, and the cooling efficiency of the electricity storage device 100 is likely to be improved.

[0059] An example of the configuration of the cooler 20 attached to the power storage device 100 has been described above. The power storage device 100 to which the cooler 20 is attached constitutes a power storage device unit 101. The power storage device unit 101 may be used alone or in combination with a plurality of power storage device units 101. A power storage device module 200 can be formed by arranging a plurality of power storage device units 101 in a row.

[0060] <Electricity storage device module 200> As shown in Fig. 4, the power storage device module 200 includes a plurality of power storage devices 100, a cooler 20, a pair of end plates 110, and a pair of bind bars 120 (bind bars 120A, 120B). The plurality of power storage devices 100 are stacked along a short-side direction X (stacking direction) of the plurality of power storage devices 100. The short sides of the plurality of power storage devices 100 are aligned along the stacking direction. Spacers (not shown) may be disposed between adjacent power storage devices 100.

[0061] <Multiple Power Storage Devices 100> The plurality of power storage devices 100 are electrically connected by bus bars 80. The bus bars 80 may be metal members having required conductivity. The bus bars 80 may be made of, for example, aluminum or an aluminum alloy. The bus bars 80 connect electrode terminals (positive electrode terminals 60, negative electrode terminals 65) of adjacent power storage devices 100 among the plurality of power storage devices 100. In the plurality of power storage devices 100, a positive electrode terminal 60 is provided at one end of the substantially rectangular lid 54, and a negative electrode terminal 65 is provided at the other end. In the plurality of power storage devices 100, the positive electrode terminals 60 and the negative electrode terminals 65 are arranged alternately in the stacking direction. The bus bars 80 connect the positive electrode terminals 60 and the negative electrode terminals 65 that are arranged in the stacking direction. The configuration of the bus bars 80 is not particularly limited. A connection member (not shown) for extracting power from the power storage device module 200 can be connected to the positive terminal 60a of the power storage device 100 at one end and the negative terminal 65a of the power storage device 100 at the other end of the power storage device module 200.

[0062] A cooler 20 is arranged between at least any adjacent power storage devices among the multiple power storage devices 100. In this embodiment, the cooler 20 is attached to each of the multiple power storage devices 100. Here, the coolers 20 are arranged on the second surfaces 50b1 and 50b2 of the multiple power storage devices 100. Therefore, the cooler 20 is arranged between any adjacent power storage devices 100. The cooler 20 cools the second surface 50b1 of the power storage device 100 to which the cooler 20 is attached. The cooler 20 also contacts the rear second surface 50b1 of the power storage device 100 adjacent to the power storage device 100 across the cooler 20. Therefore, the cooler 20 also cools the adjacent power storage device 100. This improves cooling efficiency for the multiple power storage devices 100. The multiple power storage devices 100 can be cooled from the front and rear, except for the power storage devices 100 provided at both ends in the stacking direction X. However, the present invention is not limited to this configuration, and there may be a portion between adjacent power storage devices where no cooler is disposed. Also, a spacer may be disposed between adjacent power storage device units 101.

[0063] A cooler having a first refrigerant flow path through which a refrigerant flows is used as the cooler arranged between adjacent power storage devices 100. In this embodiment, the above-described cooler 20 having a refrigerant flow path 25 (see FIG. 1) through which a refrigerant flows can be used as such a cooler. The refrigerant flow path 25 of the cooler 20 functions as the first refrigerant flow path of the power storage device module 200. Note that the above-described cooler 20 is an example of a cooler arranged between adjacent power storage devices, and other coolers may also be used.

[0064] In this embodiment, a plurality of power storage device units 101 are arranged along the stacking direction X. The power storage devices 100 and the coolers 20 are arranged alternately along the stacking direction X. In the power storage device module 200, a pair of end plates 110 are provided to sandwich the plurality of power storage device units 101 therebetween.

[0065] <Pair of end plates 110> The pair of end plates 110 are arranged on both sides of the plurality of power storage devices 100 in the stacking direction X. Inner surfaces 111 of the pair of end plates 110 face the plurality of power storage device units 101. The end plates 110 are generally rectangular plates. The end plates 110 may be made of a metal having a required strength. The end plates 110 may be made of, for example, aluminum or an aluminum alloy. The height of the end plates 110 is generally the same as the height of the power storage devices 100 and the cooler 20. The left-right dimension of the end plates 110 is greater than the left-right dimensions of the second surfaces 50b1 and 50b2 of the power storage devices 100 and the second plate portion 23 of the cooler 20. Therefore, when the power storage device module 200 is viewed along the stacking direction X, the power storage devices 100 and the cooler 20 are covered by the end plates 110.

[0066] In this embodiment, the outer surfaces 112 of the pair of end plates 110 are provided with approximately rectangular parallelepiped recesses 113 extending along the height direction Z. The recesses 113 are provided on both ends of the outer surfaces 112 of the end plates 110 in the long side direction Y. Bind bars 120 are attached to the recesses 113. The multiple power storage device units 101 are restrained via the pair of end plates 110. The pair of end plates 110 are bundled together along the stacking direction X by the pair of bind bars 120.

[0067] <Pair of Binding Bars 120> The pair of bind bars 120 are arranged on both sides of the multiple power storage devices 100 in the long side direction Y. The pair of bind bars 120 are bridged across the pair of end plates 110. In this embodiment, the bind bar 120 is provided with a pair of connecting portions 120a. The pair of connecting portions 120a are portions that are connected to the end plates 110. In the stacking direction X, the pair of connecting portions 120a are provided at both end portions of the bind bar 120. The pair of connecting portions 120a are connected to the pair of end plates 110, respectively.

[0068] The shape of the connecting portion 120a is not particularly limited. In this embodiment, the connecting portion 120a has a shape that fits into the recess 113. The connecting portion 120a has a substantially rectangular parallelepiped shape along the height direction Z. The connecting portion 120a is provided on an inner plate 125, which will be described later, and protrudes from the inner plate 125 toward the power storage device 100. The connecting portion 120a may be attached to an inner surface 125a of the inner plate 125. The method of connecting the pair of bind bars 120 and the pair of end plates 110 is not particularly limited. In this embodiment, the connecting portion 120a of the bind bar 120 and the recess 113 of the end plate 110 are provided with connection holes (not shown). The connection holes of the connecting portion 120a of the bind bar 120 penetrate the connecting portion 120a along the long side direction Y. The connection holes of the recesses 113 of the end plates 110 are screw holes along the long side direction Y. The connection holes of the recesses 113 of the end plates 110 are positioned so as to overlap the connection holes of the connection portions 120a when the connection portions 120a are placed in the recesses 113. Screws are inserted into the connection holes to connect the pair of bind bars to the pair of end plates 110.

[0069] Because the connection portions 120a protrude toward the power storage device 100 (inside), the dimension of the power storage device module 200 in the long side direction Y can be reduced. In addition, the connection portions 120a are likely to be caught on the end plates 110. Therefore, even when the power storage devices 100 move in the stacking direction X or expand during charging and discharging, the power storage devices 100 are likely to be restrained along the stacking direction X.

[0070] FIG. 7 is a schematic diagram of the bind bar 120. As shown in FIG. 7, the bind bar 120 includes an outer plate 121, an inner plate 125, and a second refrigerant flow path 123. In this embodiment, the bind bar 120 includes an external connection pipe 128. The outer plate 121 and the inner plate 125 that constitute the bind bar 120 are made of metal. The outer plate 121 and the inner plate 125 may be made of aluminum, an aluminum alloy, copper, a copper alloy, or the like. The second refrigerant flow path 123 is formed between the outer plate 121 and the inner plate 125.

[0071] <Outer Plate 121> The outer plate 121 forms the outer surface of the bind bar 120 in the long side direction Y. The outer plate 121 forms the surface of the bind bar 120 opposite to the surface facing the multiple power storage devices 100 (see FIG. 4). The outer plate 121 is a substantially rectangular flat plate. The height of the outer plate 121 is substantially the same as the height of the power storage devices 100 and the cooler 20. The length of the outer plate 121 (the dimension along the stacking direction X) may be determined according to the distance between the pair of end plates 110. The length of the outer plate 121 can be set to the combined length of the power storage device units 101 arranged along the stacking direction X and the pair of end plates 110. An inner plate 125 is attached to an inner surface 121a of the outer plate 121.

[0072] The method for bonding the outer plate 121 and the inner plate 125 together is not particularly limited. In this embodiment, the outer plate 121 and the inner plate 125 are bonded together by brazing. Therefore, the outer plate 121 and the inner plate 125 are bonded together via a brazing material. Bonding the outer plate 121 and the inner plate 125 together by brazing allows for good mass production at low cost. Furthermore, even when the structure of the bonded parts is complex, stable bonding is possible, and the quality of the bonding can be stable. Note that, from the viewpoint of improving the bonding strength, the outer plate 121 and the inner plate 125 may be bonded together by welding or the like.

[0073] <Inner plate 125> The inner plate 125 faces the plurality of power storage devices 100 (see FIG. 4). Here, the inner plate 125 faces the first surfaces 50a1, 50a2 of the plurality of power storage devices 100. The inner plate 125 has a substantially rectangular plate shape. In this embodiment, the inner plate 125 has substantially the same dimensions as the outer plate 121 in the stacking direction X and the height direction Z.

[0074] The inner plate 125 is provided with a protrusion 126. The protrusion 126 is a portion that protrudes from an inner surface 125a of the inner plate 125 toward the electricity storage device 100. When viewed from an outer surface 125b of the inner plate 125, the protrusion 126 is recessed toward the electricity storage device 100. The protrusion 126 is formed in a part of the inner plate 125. In the embodiment shown in FIG. 7, the protrusion 126 is formed in the lower part of the inner plate 125. The protrusion 126 can be formed by press working or the like.

[0075] The protrusion 126 includes a first portion 126a extending along the stacking direction X and a second portion 126b extending from the first portion 126a in the height direction (upward in this embodiment). The first portion 126a is formed on the lower portion of the inner plate 125. A plurality of second portions 126b (the same number as the number of coolers 20) are provided. The plurality of second portions 126b are provided at approximately equal intervals according to the intervals between the power storage device 100 and the coolers 20. The surface of the protrusion 126 facing the power storage device 100 is approximately flat. A pipe for circulating a refrigerant can be connected to the surface of the protrusion 126 facing the power storage device 100.

[0076] The outer plate 121 and the inner plate 125 are joined together around the protrusion 126. In other words, the outer plate 121 and the inner plate 125 are attached to each other around the protrusion 126. Therefore, a cavity is formed between the inner plate 125 and the outer plate 121 in the area where the protrusion 126 is formed. This cavity functions as the second refrigerant flow path 123.

[0077] <Second refrigerant flow path 123> The second refrigerant flow path 123 is a flow path through which the refrigerant flows along the stacking direction X. The second refrigerant flow path 123 is configured so that the refrigerant flows along the stacking direction X in at least a portion thereof. In the stacking direction X, the second refrigerant flow path 123 is formed between portions (connecting portions 120a in this embodiment) that bridge a pair of end plates 110 (see FIG. 4). The second refrigerant flow path 123 is connected to the first refrigerant flow path 25 of the cooler 20 (see FIG. 1).

[0078] As described above, the second refrigerant flow path 123 is formed in the cavity formed by bonding the outer plate 121 and the inner plate 125 together. The second refrigerant flow path 123 configured in this manner is formed without having to run piping inside the bind bar or form a flow path for supplying the refrigerant inside the bind bar by processing. This reduces the number of parts in the bind bar 120, and can keep manufacturing costs low. Furthermore, the refrigerant flow path can be formed simply by processing the inner plate or the outer plate. This increases the degree of freedom in the shape and dimensions of the refrigerant flow path, making it easier to circulate the refrigerant at the desired flow path and flow rate.

[0079] In this embodiment, cooler connection pipes 127, which are connected to the coolers 20, are connected to the multiple second portions 126b of the inner plate 125. The cooler connection pipes 127 extend along the height direction. In the embodiment shown in FIG. 7, the cooler connection pipes 127 extend upward from the first portions 126a. Therefore, the refrigerant flowing in or out of the multiple cooler connection pipes 127 is collected within the second refrigerant flow path 123.

[0080] In this embodiment, the cooler connection pipe 127 is made of flexible pipe. In other words, the inner plate 125 is provided with flexible pipe 127b. The central portion 127b of the cooler connection pipe 127 is alternately folded back along the direction in which the cooler connection pipe 127 extends. The central portion 127b of the cooler connection pipe 127 has a so-called accordion-folded shape. This makes the cooler connection pipe 127 flexible and capable of stretching, contracting, and bending.

[0081] An opening is formed inward (toward the left in the embodiment shown in FIG. 7) at the end 127a (the upper end in the embodiment shown in FIG. 7) of the cooler connecting pipe 127. The inlet 26 or the outlet 27 (see FIG. 4) of the cooler 20 is connected to the opening of the end 127a. In this embodiment, the end 127a of the cooler connecting pipe 127 of the bind bar 120A is connected to the outlet 27. The end 127a of the cooler connecting pipe 127 of the bind bar 120B is connected to the inlet 26. As a result, the second refrigerant flow path 123 is connected to the first refrigerant flow path 25. Because the first refrigerant flow path 25 and the second refrigerant flow path 123 are connected via the flexible pipe 127b, even when a load due to vibration or the like is applied to the power storage device module 200, even when the power storage device 100 vibrates during use of the power storage device module 200, or even when the power storage device 100 expands and contracts due to charging and discharging, the cooler connecting pipe 127 can easily follow the power storage device unit 101. As a result, the cooler connecting pipe 127 is less likely to be damaged.

[0082] An external connection pipe 128 is connected to the second refrigerant flow path 123. In this embodiment, the external connection pipe 128 is connected to a first portion 126a of the protruding portion 126 of the inner plate 125. The external connection pipe 128 is connected to an end (a front end in this embodiment) of the second portion 126b of the inner plate 125. The external connection pipe 128 can be connected to an external refrigerant supply device 28 (see FIG. 4).

[0083] FIG. 8 is a schematic diagram of a pair of bind bars 120 to which coolers 20 are attached. FIG. 8 shows a pair of bind bars 120 and the rearmost cooler 20. The power storage device 100 and other coolers 20 are omitted from FIG. 8. In FIG. 8, the right-side bind bar 120A has the same configuration and is disposed in the same orientation as the bind bar 120 shown in FIG. 7. The bind bar 120B is attached upside down relative to the bind bar 120A. Therefore, in the bind bar 120B, the second refrigerant flow path 123 extends along the stacking direction X at the top of the inner plate 125. In the bind bar 120B, the cooler connection pipe 127 extends downward from the upper second refrigerant flow path 123. The left-side bind bar 120B has the same configuration as the bind bar 120A, except that the external connection pipe 128 is connected to the upper rear portion.

[0084] As shown in FIG. 8, the refrigerant supply device 28 is connected to the external connection pipe 128 of the bind bar 120A and the external connection pipe 128 of the bind bar 120B. In FIG. 8, the direction of refrigerant flow is indicated by arrows. The refrigerant is supplied from the refrigerant supply device 28 to the external connection pipe 128 of the bind bar 120B. The refrigerant supplied to the external connection pipe 128 is supplied to a second refrigerant flow path 123 (see FIG. 7) provided at the top of the bind bar 120B. The refrigerant supplied to the second refrigerant flow path 123 is supplied to a cooler connection pipe 127 (see FIG. 4) connected to the second refrigerant flow path 123. The refrigerant supplied to the cooler connection pipe 127 passes through the cooler connection pipe 127 and is supplied to the cooler 20 from the inlet 26 (see FIG. 4). The refrigerant supplied to the cooler 20 flows through the first refrigerant flow path 25 from the inlet 26 to the outlet 27. The refrigerant is supplied from the outlet 27 to the cooler connecting pipe 127 of the bind bar 120A. The refrigerant supplied to the cooler connecting pipe 127 is supplied to a second refrigerant flow path 123 provided at the bottom of the bind bar 120A, to which the cooler connecting pipe 127 is connected. The refrigerant passes through the second refrigerant flow path 123 and flows out from an external connection pipe 128 of the bind bar 120A. The refrigerant flowing out from the external connection pipe 128 flows into the refrigerant supply device 28. As described above, the refrigerant circulates through the pair of bind bars 120 and the cooler 20.

[0085] The position of the second refrigerant flow path 123 through which the refrigerant flows is not particularly limited as long as the inner plate 125 and the outer plate 121 are bonded together and the refrigerant does not leak. The position of the second refrigerant flow path 123 can be set appropriately depending on the configuration of the cooler 20 to be connected. The second refrigerant flow path 123 may be provided at the bottom, top, or center of the bind bar 120. The area in the bind bar 120 where the second refrigerant flow path 123 is formed is not particularly limited. The second refrigerant flow path 123 may be formed over a wider area in the bind bar 120 than the area shown in FIG. 7. The position and area of ​​the second refrigerant flow path 123 can be modified in various ways by processing the inner plate 125 and the outer plate 121.

[0086] As described above, in the bind bar 120, the refrigerant flowing through the first refrigerant flow path 25 of the cooler 20 is collected in the second refrigerant flow path 123, or the refrigerant flowing through the second refrigerant flow path 123 is dispersed to the first refrigerant flow path 25. The bind bar 120 holds (restrains) the multiple power storage devices 100 and collects the flow paths of the refrigerant that cools the power storage devices 100. In other words, the bind bar 120 has both the function of holding the multiple power storage devices 100 and the function of collecting the refrigerant flow paths. Note that the pair of bind bars 120 is not limited to the above-described form. For example, only one of the pair of bind bars may be provided with a second refrigerant flow path that connects to the first refrigerant flow path of the cooler. In this case, the one bind bar may be provided with both an external connection pipe through which the refrigerant flows in and an external connection pipe through which the refrigerant flows out.

[0087] 7, the pair of bind bars 120 are provided with stress dispersing portions 129. In this embodiment, the stress dispersing portions 129 are provided on both inner plates 125 of the pair of bind bars 120.

[0088] <Stress dispersion part 129> FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. 7. The external connection pipe 128 is not shown in FIG. 9. As shown in FIG. 9, the stress distribution portion 129 is provided in the stacking direction X between the region where the second refrigerant flow path 123 is provided and the portion (connection portion 120a) that bridges the pair of end plates 110 (see FIG. 4). The stress distribution portion 129 is provided on both sides of the region where the second refrigerant flow path 123 is provided (in this embodiment, the convex portion 126 provided on the inner plate 125) in the stacking direction X (see FIG. 7). The stress distribution portion 129 is a portion where one of the inner plate 125 and the outer plate 121 protrudes relative to the other. In the stress distribution portion 129, a cavity 129a is formed between the inner plate 125 and the outer plate 121. Therefore, the cavity inside the stress distribution portion 129 is isolated from the outside. Moreover, the cavity 129 a inside the stress dispersing portion 129 is isolated from the second refrigerant flow path 123 .

[0089] Incidentally, the use (charging and discharging) of the power storage device module may cause the expansion and contraction of the power storage devices included in the power storage device module. Furthermore, depending on the manner in which the power storage device module is used, the power storage device module may be subjected to vibrations, etc. In this case, a load may be applied to the bind bar bundling the multiple power storage devices. When a load is applied to the bind bar due to the expansion and contraction of the power storage devices or the vibration of the power storage device module, stress may be applied to the surface where the inner plate and the outer plate are bonded together. The inventors have found that, for example, when a load that bends the bind bar is applied, the stress applied to the bonded surface may vary depending on the position. The inventors have found that when a load is applied to the bind bar, the stress applied to the bonded surface tends to concentrate at the boundary between the portions where the inner plate and the outer plate are not bonded together. Therefore, if the bind bar has a cavity (refrigerant flow path) between the inner plate and the outer plate, stress tends to concentrate on the bonded surface around the cavity. Stress applied around the periphery of the refrigerant flow path may cause the bonded surface to peel off, potentially resulting in refrigerant leakage between the inner plate and the outer plate.

[0090] When a bind bar is suspended across an end plate, a load may be applied to the bind bar via the end plate. In this case, the stress acting on the bonding surface of the bind bar increases the closer it is to the portion suspended across the end plate. For example, when the end of the bind bar is suspended across the end plate, the closer it is to the end, the more likely stress is to concentrate on the bonding surface of the bind bar. Therefore, when a cavity is provided between the inner plate and the outer plate, the closer it is to the portion of the bonding surface around the cavity that is suspended across the end plate, the more likely stress is to concentrate. For example, when the end of the bind bar is suspended across the end plate, stress is likely to concentrate on both ends in the stacking direction of the bonding surface around the cavity.

[0091] In the above-described embodiment, the power storage device module 200 includes a plurality of power storage devices 100, a cooler 20, a pair of end plates 110, and a pair of bind bars 120. The plurality of power storage devices 100 are stacked along the stacking direction X. The cooler 20 is disposed between adjacent power storage devices 100. The pair of end plates 110 are disposed on both sides of the plurality of power storage devices 100 in the stacking direction X. The pair of bind bars 120 span the pair of end plates 110. The cooler 20 has a first refrigerant flow path 25 through which a refrigerant flows. At least one of the pair of bind bars 120 includes an outer plate 121, an inner plate 125, and a second refrigerant flow path 123. The inner plate 125 is bonded to an inner surface 121a of the outer plate 121. The inner plate 125 faces the plurality of power storage devices 100. The second refrigerant flow path 123 is formed between the inner plate 125 and the outer plate 121, at a portion (connecting portion 120a) that spans the pair of end plates 110. The second refrigerant flow path 123 is a flow path through which a refrigerant flows along the stacking direction X. The first refrigerant flow path 25 and the second refrigerant flow path 123 are connected. The bind bar 120 is provided with a stress distribution portion 129. The stress distribution portion 129 is a portion where the inner plate 125 protrudes relative to the outer plate 121. The stress distribution portion 129 is provided in the stacking direction X, between a region where the second refrigerant flow path 123 is provided and a region that spans the pair of end plates 110. The stress distribution portions 129 are provided on both sides of the region where the second refrigerant flow path 123 is provided.

[0092] The stress acting on the surface where the outer plate 121 and the inner plate 125 are bonded together is not only acting around the second refrigerant flow path 123, but also around the stress distribution portion 129, which is the portion where the inner plate 125 protrudes relative to the outer plate 121. In other words, the stress that may act around the second refrigerant flow path 123 is also distributed around the stress distribution portion 129. This reduces the stress around the second refrigerant flow path 123, making the bonded surface around the second refrigerant flow path 123 less likely to peel off. Furthermore, even when a large load is applied to the bind bar 120 via the end plate 110, the load is likely to concentrate on the stress distribution portion 129 near the connection portion 120a (the end portion of the bind bar 120). As a result, the bonded surface around the stress distribution portion 129 is more likely to peel off than the area around the second refrigerant flow path 123. Therefore, by providing the stress distribution portion 129 on the outside of the second refrigerant flow path 123 in the stacking direction X, the area around the stress distribution portion 129 is more likely to peel due to stress than the area around the second refrigerant flow path 123. In other words, the area where the inner plate 125 and the outer plate 121 may peel off may shift from the area around the second refrigerant flow path 123 to the area around the stress distribution portion 129. As a result, the bonded surfaces around the second refrigerant flow path 123 are less likely to peel off, and the problem of refrigerant leaking from between the inner plate 125 and the outer plate 121 is less likely to occur.

[0093] It is not necessary for both of the pair of bind bars to have the above-described bind bar configuration, and only one of the bind bars may have the above-described configuration. For example, if one of the pair of bind bars is provided with a second refrigerant flow path that connects to the first refrigerant flow path of the cooler, it is preferable that the bind bar provided with the second refrigerant flow path has the above-described configuration.

[0094] The position of the stress distribution portion 129 is not particularly limited as long as it is provided between the connection portion 120a and the second refrigerant flow path 123. From the viewpoint of reducing the stress acting on the second refrigerant flow path 123, the stress distribution portion 129 may be provided on the end side in the stacking direction X (for example, near the connection portion 120a). The farther the stress distribution portion 129 is from the second refrigerant flow path 123, the farther the point at which stress may concentrate may be from the second refrigerant flow path 123. As a result, the stress acting on the second refrigerant flow path 123 is likely to be reduced. However, if the stress distribution portion 129 is too far from the second refrigerant flow path 123, the stress distribution portion 129 will be close to the end in the stacking direction X, and the stress acting on the stress distribution portion 129 may become large. The stress distribution portion 129 may be provided, for example, in an intermediate portion between the end of the second refrigerant flow path 123 and the portion where the end plate 110 contacts.

[0095] There are no particular limitations on the shape of the stress dispersing portion 129. An example of the stress dispersing portion 129 will be described below.

[0096] As shown in FIG. 7 , the stress distribution portion 129 extends in a direction perpendicular to the stacking direction X. In this embodiment, the stress distribution portion 129 is linear. The stress distribution portion 129 extends from the top to the bottom of the bind bar 120. In other words, the stress distribution portion 129 extends in the height direction Z. The stress distribution portion 129 does not reach the top and bottom ends of the bind bar 120. The stress distribution portion 129 protrudes in the height direction beyond the top and bottom ends of the second refrigerant flow path 123. This allows stress to be distributed regardless of where stress is applied to the second refrigerant flow path 123.

[0097] The configuration of the stress distribution portion is not limited to the above-described form. A plurality of stress distribution portions may be provided at one end. The stress distribution portion does not have to be linear, and may have a serpentine shape in the front-to-rear direction. The stress distribution portion may, for example, be inclined with respect to the height direction Z. The stress distribution portion may have a shape such that two straight lines intersect. The stress distribution portion may also be provided at the top and bottom of the second refrigerant flow path. The stress distribution portion may be continuous around the second refrigerant flow path so as to surround the second refrigerant flow path. The stress distribution portion may surround the second refrigerant flow path in a substantially rectangular shape. By surrounding the second refrigerant flow path with the stress distribution portion, stress that may be applied to the entire circumference of the second refrigerant flow path can be distributed.

[0098] As shown in FIG. 9 , a cavity 129a is formed in the stress distribution portion 129 between the outer plate 121 and the inner plate 125. The outer plate 121 and the inner plate 125 are bonded together around the cavity using the method described above. In other words, in the stress distribution portion 129, the outer plate 121 and the inner plate 125 are bonded together around the area where the inner plate 125 protrudes relative to the outer plate 121. The stress distribution portion 129 can be formed by press-forming the flat inner plate 125 and then bonding it to the flat outer plate 121. This makes it easier for the bonded surfaces of the outer plate 121 and the inner plate 125 to peel off in the stress distribution portion 129 when a load is applied to the bind bar 120. In other words, the bonded surfaces peel off more easily around the stress distribution portion 129 than around the second refrigerant flow path 123, making it easier to maintain the second refrigerant flow path 123. As a result, leakage of the refrigerant can be prevented.

[0099] The stress distribution portion 129 may be provided on the inner plate 125 or on the outer plate 121. In this embodiment, the stress distribution portion 129 is formed by the inner plate 125 protruding from the substantially flat outer plate 121. In other words, the stress distribution portion 129 is provided on the inner plate 125. Therefore, even when the stress distribution portion 129 is attached to the electricity storage device module 200, the stress distribution portion 129 is unlikely to protrude outside the bind bar 120 in the long side direction Y. This can reduce the space occupied by the electricity storage device module 200.

[0100] In the embodiment described above, the power storage device module 200 includes an external connection pipe 128 that is connected to an external refrigerant supply device 28. The external connection pipe 128 is connected to the second refrigerant flow path 123. The external connection pipe 128 is also called a header pipe, and is a pipe in which a plurality of pipes are gathered together. In this embodiment, the external connection pipe 128 gathers a plurality of cooler connection pipes 127 via the second refrigerant flow path 123. Because the plurality of cooler connection pipes 127 are gathered together by the external connection pipe 128, the space occupied by the pipes in the power storage device module 200 can be reduced.

[0101] The technology disclosed herein has been described in various ways. Unless otherwise specified, the embodiments and the like described herein do not limit the present invention. Furthermore, the technology disclosed herein can be modified in various ways, and as long as no particular problems arise, each component and each process described herein can be omitted or combined as appropriate. Furthermore, this specification includes the disclosures described in the following sections.

[0102] Section 1: a plurality of electricity storage devices stacked along a stacking direction; a cooler disposed between at least any adjacent power storage devices among the plurality of power storage devices; a pair of end plates arranged on both sides of the plurality of power storage devices in the stacking direction; a pair of bind bars spanning the pair of end plates; Equipped with the cooler has a first refrigerant flow path through which a refrigerant flows, At least one of the pair of bind bars is An outer plate; an inner plate attached to an inner surface of the outer plate and facing the plurality of electricity storage devices; a second refrigerant flow path formed between the inner plate and the outer plate between the pair of end plates, through which a refrigerant flows along the stacking direction; Equipped with the first refrigerant flow path and the second refrigerant flow path are connected to each other, In the at least one bind bar, stress dispersion portions, in which one of the inner plate and the outer plate is raised relative to the other, are provided on both sides of the region where the second refrigerant flow path is provided, between a region where the second refrigerant flow path is provided and a portion where the bind bar is bridged between the pair of end plates in the stacking direction. Energy storage device module.

[0103] Section 2: Item 2. The electricity storage device module according to item 1, wherein a cavity is formed between the inner plate and the outer plate in the stress dispersion section.

[0104] Section 3: 3. The electricity storage device module according to item 1 or 2, wherein the stress dispersion portion is provided on the inner plate.

[0105] Section 4: 4. The electricity storage device module according to any one of items 1 to 3, wherein the stress distribution portion extends in a direction perpendicular to the stacking direction.

[0106] Section 5: 5. The electricity storage device module according to any one of items 1 to 4, wherein the inner plate and the outer plate are bonded together by brazing.

[0107] Item 6: 6. The electric storage device module according to any one of items 1 to 5, wherein the inner plate is provided with a flexible pipe that extends from the second refrigerant flow path and is connected to the first refrigerant flow path of the cooler.

[0108] Section 7: Further provided is an external connection pipe connected to an external refrigerant supply device, 7. The electricity storage device module according to any one of items 1 to 6, wherein the external connection pipe is connected to the second refrigerant flow path.

[0109] Section 8: 8. The energy storage device module according to any one of items 1 to 7, wherein a pair of connecting portions that protrude from the inner plate toward the energy storage device and are connected to the end plates are provided at both ends of the bind bar in the stacking direction.

[0110] Section 9: a plurality of electricity storage devices stacked along a stacking direction; a cooler disposed between at least any adjacent power storage devices among the plurality of power storage devices, the cooler having a first refrigerant flow path through which a refrigerant flows; a pair of end plates arranged on both sides of the plurality of power storage devices in the stacking direction; and used in an electricity storage device module including A bind bar attached to the pair of end plates, an inner plate facing the plurality of electricity storage devices; an outer plate bonded to the outer surface of the inner plate; a second refrigerant flow path provided between the inner plate and the outer plate at a portion spanning the pair of end plates, through which a refrigerant flows along the stacking direction; Equipped with In the stacking direction, between a region where the second refrigerant flow path is provided and a portion bridging the pair of end plates, stress dispersion portions in which one of the inner plate and the outer plate is raised relative to the other are provided on both sides of the region where the second refrigerant flow path is provided. Binding bar. [Explanation of symbols]

[0111] 20,20A,20B cooler 21 Plate 21a, 21b Cover member 21c metal plate 22, 22a, 22b First plate portion 23 Second plate section 24 Bend 25 refrigerant flow path (first refrigerant flow path) 26 Inlet 27 Outlet 28 Refrigerant supply device 40 Electrode body 42 Positive electrode tab 44 Negative electrode tab 50 cases 50a1,50a2 1st side (1st side wall) 50b1,50b2 2nd side (2nd side wall) 50c1 3rd side (bottom wall) 50c2 3rd side (sealing plate) 52 Case body 52h opening 54 Lid 55 Liquid injection hole 56 Sealing member 57 Gas exhaust valve 58,59 Terminal insertion hole 60,60a positive terminal 62 Positive electrode external conductive member 65,65a Negative terminal 67 Negative electrode external conductive member 70 Positive electrode current collector 71 Positive electrode first current collector 75 Negative electrode current collector 76 Negative electrode first current collector 80 Bus Bar 90 Gasket 92 External insulating member 94 Internal insulating member 94a Base 94b Protrusion 100 Energy storage device 101 Energy storage device unit 110 End Plate 111 Inner surface 112 External surface 113 Depression 120, 120A, 120B Binding Bar 120a connection 121 Outer Plate 121a Inside surface 123 Second refrigerant flow path 125 inner plate 125a Inside surface 125b External surface 126 Convex 126a Part 1 126b Part 2 127 Cooler connection piping 127a End 127b Flexible piping (center) 128 External connection piping 129 Stress distribution section 129a Cavity 200 Energy Storage Device Module

Claims

1. a plurality of electricity storage devices stacked along a stacking direction; a cooler disposed between at least any adjacent power storage devices among the plurality of power storage devices; a pair of end plates arranged on both sides of the plurality of power storage devices in the stacking direction; a pair of bind bars spanning the pair of end plates; Equipped with the cooler has a first refrigerant flow path through which a refrigerant flows, At least one of the pair of bind bars is An outer plate; an inner plate attached to an inner surface of the outer plate and facing the plurality of electricity storage devices; a second refrigerant flow path formed between the inner plate and the outer plate at a portion spanning the pair of end plates, through which a refrigerant flows along the stacking direction; Equipped with the first refrigerant flow path and the second refrigerant flow path are connected to each other, In the at least one bind bar, stress dispersion portions, in which one of the inner plate and the outer plate is raised relative to the other, are provided on both sides of the region where the second refrigerant flow path is provided, between a region where the second refrigerant flow path is provided and a portion where the bind bar is bridged between the pair of end plates in the stacking direction. Energy storage device module.

2. The electricity storage device module according to claim 1 , wherein a cavity is formed between the inner plate and the outer plate in the stress distribution portion.

3. The electricity storage device module according to claim 1 or 2, wherein the stress dispersion portion is provided on the inner plate.

4. The power storage device module according to claim 1 , wherein the stress distribution portion extends in a direction perpendicular to the stacking direction.

5. The electricity storage device module according to claim 1 or 2, wherein the inner plate and the outer plate are bonded together by brazing.

6. 3 . The electric storage device module according to claim 1 , wherein the inner plate is provided with a flexible pipe extending from the second refrigerant flow path and connected to the first refrigerant flow path of the cooler.

7. Further provided is an external connection pipe connected to an external refrigerant supply device, The power storage device module according to claim 1 , wherein the external connection pipe is connected to the second refrigerant flow path.

8. 3. The energy storage device module according to claim 1, wherein a pair of connecting portions protruding from the inner plate toward the energy storage device and connected to the end plates are provided at both ends of the bind bar in the stacking direction.

9. a plurality of electricity storage devices stacked along a stacking direction; a cooler disposed between at least any adjacent power storage devices among the plurality of power storage devices, the cooler having a first refrigerant flow path through which a refrigerant flows; a pair of end plates arranged on both sides of the plurality of power storage devices in the stacking direction; and used in an electricity storage device module including A bind bar attached to the pair of end plates, an inner plate facing the plurality of electricity storage devices; an outer plate bonded to the outer surface of the inner plate; a second refrigerant flow path provided between the inner plate and the outer plate at a portion spanning the pair of end plates, through which a refrigerant flows along the stacking direction; Equipped with a stress dispersion portion, in which one of the inner plate and the outer plate is raised relative to the other, is provided on both sides of the region where the second refrigerant flow path is provided, between a region where the second refrigerant flow path is provided and a portion where the pair of end plates are bridged in the stacking direction; Binding bar.

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