Heat spreading device

Abstract

To provide a heat diffusion device capable of exhibiting high heat dissipation characteristics even when an outer shape has a notch and a heat source is arranged near the notch.SOLUTION: A housing (10) having a first inner surface and a second inner surface opposed to each other in a thickness direction and provided with an internal space (20), a working medium enclosed in the internal space (20) of the housing (10), a wick provided in the internal space (20) of the housing (10), and a heat conduction member (50) disposed outside the housing (10), wherein when viewed from the thickness direction, a first region (21) and a second region (23) protruding from a part of the first region (21) are present in the internal space (20) of the housing (10), and the heat conduction member (50) is disposed so as to extend over both the first region (21) and the second region (23).SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a heat spreading device. [Background technology]

[0002] In recent years, the amount of heat generated has increased due to the high integration and high performance of elements. Furthermore, the miniaturization of products has led to an increase in heat density. This situation is particularly evident in the field of mobile devices such as smartphones and tablets. Given these circumstances, it is becoming increasingly important to take measures to dissipate heat.

[0003] Graphite sheets and the like are often used as heat dissipation materials, but because their heat transport capacity is insufficient, the use of various heat diffusion devices (e.g., vapor chambers) that can diffuse heat is being considered.

[0004] Since the board on which the heat source is mounted also has electronic components other than the heat source mounted thereon, it may be necessary to place the heat spreading device a little distance (float) from the board to prevent physical interference between the other electronic components and the heat spreading device.

[0005] In such cases, a method is known in which a heat conducting member such as a metal plate is provided between the heat source and the heat diffusion device. For example, Patent Document 1 discloses a method in which heat from a heat generating body (heat source) is transferred to a heat pipe via a heat receiving plate, which is a heat conducting member. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-85055 Summary of the Invention [Problem to be solved by the invention]

[0007] However, if the height of the other electronic components is too high to install the heat spreading device, the method described in Patent Document 1 cannot prevent interference, and it may be necessary to change the external shape of the heat spreading device so as to cut out the area where the electronic components are located. When a part of the outer shape of the heat spreading device is cut out, a part where the dimensions of the heat spreading device are reduced (a dimension-reduced part) is generated in the vicinity of the cutout.

[0008] In a heat diffusion device having such an external shape with a cutout, if a heat source is placed near the cutout (i.e., the dimensionally reduced portion), the path from the evaporation portion where the working medium evaporates to the cooling portion where the working medium is cooled within the heat diffusion device may become narrowed, resulting in a decrease in heat transport efficiency.

[0009] The placement of heat sources and electronic components on a board takes into consideration other factors such as product specifications, weight balance, and noise countermeasures, so there was a demand for a heat diffusion device that could exhibit high heat dissipation characteristics even when the external shape has a cutout and the heat source is placed near the cutout.

[0010] The present invention has been made to solve the above problems, and aims to provide a heat diffusion device whose outer shape has a notch and which can exhibit high heat dissipation characteristics even when a heat source is placed near the notch. [Means for solving the problem]

[0011] The heat diffusion device of the present invention comprises a housing having a first inner surface and a second inner surface opposed in a thickness direction and having an internal space, a working medium sealed in the internal space of the housing, a wick provided in the internal space of the housing, and a heat conductive member arranged outside the housing, wherein when viewed from the thickness direction, the internal space of the housing has a first region and a second region protruding from a part of the first region, the heat conductive member is arranged so as to span both the first region and the second region, and has a first heat conductive portion which is a portion arranged in the first region and a second heat conductive portion which is a portion arranged in the second region. [Effects of the Invention]

[0012] According to the present invention, it is possible to provide a heat diffusion device having an outer shape with a notch and capable of exhibiting high heat dissipation characteristics even when a heat source is placed near the notch. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a perspective view schematically illustrating an example of a heat diffusion device. [Figure 2] 2 is a cross-sectional view of the heat spreading device shown in FIG. 1 taken along line II-II. [Figure 3] FIG. 3 is a schematic diagram showing the positional relationship between the internal space and the heat conducting member in the heat diffusion device shown in FIG. [Figure 4] FIG. 4 is a schematic diagram showing an example of the arrangement of the internal space and heat conduction members that constitute the heat diffusion device. [Figure 5] FIG. 5 is a schematic diagram showing another example of the arrangement of the internal space and heat conduction members that constitute the heat diffusion device. [Figure 6] FIG. 6 is a schematic diagram showing yet another example of the arrangement of the internal space and heat conduction members that constitute the heat diffusion device. [Figure 7] FIG. 7 is a schematic diagram showing yet another example of the arrangement of the internal space and heat conduction members that constitute the heat diffusion device. [Figure 8]FIG. 8 is a schematic diagram showing yet another example of the arrangement of the internal space and heat conduction members that constitute the heat diffusion device. [Figure 9] FIG. 9 is a cross-sectional view schematically showing another example of a heat diffusion device. DETAILED DESCRIPTION OF THE INVENTION

[0014] The heat spreading device of the present invention will be described below. Note that the present invention is not limited to the following configurations and may be modified as appropriate without departing from the spirit and scope of the present invention. In addition, a combination of the individual preferred configurations described below also constitutes the present invention.

[0015] The drawings shown below are schematic diagrams, and the dimensions, aspect ratio, and other scales may differ from those of the actual product. In the drawings, the same or equivalent parts will be designated by the same reference numerals. In addition, the same elements will be designated by the same reference numerals in each drawing, and duplicate explanations will be omitted.

[0016] In this specification, terms indicating the relationship between elements (e.g., "parallel," "orthogonal," "opposite," etc.) and terms indicating the shapes of elements not only mean the literal and strict aspects, but also mean a range that is substantially equivalent, for example, a range that includes a difference of about a few percent.

[0017] The following embodiments are merely examples, and it goes without saying that partial substitution or combination of the configurations shown in different embodiments is possible. In the description of each embodiment, descriptions of matters common to the previously described embodiments will be omitted, and only differences will be described. In particular, similar effects resulting from similar configurations will not be mentioned in each embodiment.

[0018] [Heat diffusion device] The heat diffusion device of the present invention comprises a housing having a first inner surface and a second inner surface opposed in a thickness direction and having an internal space, a working medium sealed in the internal space of the housing, a wick provided in the internal space of the housing, and a heat conductive member arranged outside the housing, wherein when viewed from the thickness direction, the internal space of the housing has a first region and a second region protruding from a part of the first region, the heat conductive member is arranged so as to span both the first region and the second region, and has a first heat conductive portion which is a portion arranged in the first region and a second heat conductive portion which is a portion arranged in the second region.

[0019] FIG. 1 is a perspective view schematically illustrating an example of a heat diffusion device. As shown in FIG. 1, the heat spreading device 1 includes a housing 10 and a heat conducting member 50 disposed outside the housing 10. The heat spreading device 1 includes a housing 10 and a heat conducting member 50 disposed outside the housing 10.

[0020] In this specification, the length direction, thickness direction, and width direction are defined as directions L, T, and W, respectively, as shown in Fig. 1 etc. The length direction L, thickness direction T, and width direction W are perpendicular to one another. Furthermore, the direction perpendicular to the thickness direction T and including the length direction L and width direction W is defined as the surface direction.

[0021] The housing 10 is preferably planar as a whole.

[0022] In this specification, the term "planar" refers to a shape that includes a plate shape and a sheet shape, and means a shape in which the lengthwise dimension and widthwise dimension are considerably larger than the thicknesswise dimension, for example, a shape in which the lengthwise dimension and widthwise dimension are 10 times or more, preferably 100 times or more, the thicknesswise dimension.

[0023] The size of the housing 10 is not particularly limited.

[0024] The length L and width W of the housing 10 are preferably 5 mm or more and 500 mm or less, more preferably 20 mm or more and 300 mm or less, and even more preferably 50 mm or more and 200 mm or less.

[0025] The lengthwise dimension L and the widthwise dimension W of the housing 10 may be the same or different from each other.

[0026] The dimension of the housing 10 in the thickness direction T is preferably 50 μm or more and 500 μm or less.

[0027] The housing 10 is preferably made up of a first sheet 11 and a second sheet 12 whose outer edges are joined together. In this specification, the term "sheet" also includes forms such as foil and film.

[0028] The materials constituting the first sheet 11 and the second sheet 12 are not particularly limited as long as they have properties suitable for the heat diffusion device 1, such as thermal conductivity, strength, softness, flexibility, and the like.

[0029] The constituent material of the first sheet 11 and the second sheet 12 is preferably a metal, such as copper, nickel, aluminum, magnesium, titanium, iron, or an alloy containing at least one of these metals as a main component, and is particularly preferably copper or its alloy, or aluminum or its alloy.

[0030] The planar shape of the housing 10 when viewed from the thickness direction T may be any shape as long as a first region and a second region protruding from a part of the first region are present in an internal space (detailed by reference numeral 20 in FIG. 3 ) described below. Therefore, the planar shape of the housing 10 may be, for example, a shape combining two or more rectangular shapes of different sizes (widths). The planar shape of the housing 10 may also be an L-shape, a C-shape, a stepped shape, or the like. The housing 10 may also have a through-hole in the thickness direction T. The planar shape of the housing 10 may be a shape according to the application of the heat spreading device 1, a shape according to the location where the heat spreading device 1 is mounted, or a shape according to other components present nearby.

[0031] The size of the housing 10 is not particularly limited.

[0032] The length L and width W of the housing 10 are preferably 5 mm or more and 500 mm or less, more preferably 20 mm or more and 300 mm or less, and even more preferably 50 mm or more and 200 mm or less.

[0033] The lengthwise dimension L and the widthwise dimension W of the housing 10 may be the same or different from each other.

[0034] The dimension of the housing 10 in the thickness direction T is preferably 50 μm or more and 500 μm or less.

[0035] The dimensions of the housing 10 in the length direction L, thickness direction T, and width direction W are defined as the maximum dimensions in the length direction L, thickness direction T, and width direction W, respectively.

[0036] Although Figure 1 illustrates an example in which the housing 10 is made up of two sheets, a first sheet 11 and a second sheet 12, the housing 10 may be made up of one sheet or three or more sheets.

[0037] 2 is a cross-sectional view of the heat spreading device shown in FIG. 1 taken along line II-II. The housing 10 is sealed in an airtight state, and has an internal space 20. The housing 10 has a first inner surface 10a and a second inner surface 10b that face each other in a thickness direction T.

[0038] In the example shown in Figure 2, the housing 10 is composed of a first sheet 11 and a second sheet 12, with the inner surface of the first sheet 11 corresponding to the first inner surface 10a of the housing 10 and the inner surface of the second sheet 12 corresponding to the second inner surface 10b of the housing 10.

[0039] The housing 10 has an internal space 20. Specifically, the housing 10 has the internal space 20 surrounded by a first inner surface 10a and a second inner surface 10b.

[0040] The housing 10 preferably has an evaporation section in the internal space 20 .

[0041] The evaporation section is a section that evaporates a liquid-phase working medium (described later) and changes it into a gas-phase working medium. Specifically, the evaporation section is a section of the internal space 20 of the housing 10 where the heat conductive member 50 shown in Fig. 1 is arranged, and corresponds to a section that is heated by a heat source (not shown) via the heat conductive member.

[0042] The working medium is enclosed in an interior space 20 of the housing 10 .

[0043] The working medium is not particularly limited as long as it can undergo a gas-liquid phase change in the environment inside the housing 10. Examples of the working medium include water, alcohols, and alternatives to chlorofluorocarbons. The working medium is preferably an aqueous compound, and among these, water is particularly preferred.

[0044] The wick 30 is provided in the internal space 20 of the housing 10 . The wick 30 extends in the planar direction of the internal space 20 . The wick 30 has a capillary structure that allows the liquid phase working medium to move by capillary force.

[0045] The capillary structure of the wick 30 may be a known structure used in conventional heat diffusion devices (e.g., vapor chambers). Examples of such capillary structures include microstructures having irregularities such as pores, grooves, and protrusions, such as porous structures, fibrous structures, groove structures, and mesh structures.

[0046] The wick 30 functions as a liquid transporting portion that sucks up and transports the liquid-phase working medium by capillary force. The region of the internal space 20 other than the wick 30 functions as a vapor flow path containing mainly the working medium in a gas phase.

[0047] 2, the wick 30 is in contact with the first inner surface 10a, but may be separated from the first inner surface 10a. Alternatively, the wick 30 may be in contact with the second inner surface 10b. When the wick 30 is in contact with the first inner surface 10a of the housing 10, the wick 30 is preferably bonded to the first inner surface 10a of the housing 10. Methods for bonding the wick 30 to the first inner surface 10a of the housing 10 include, for example, diffusion bonding, ultrasonic bonding, spot welding, etc.

[0048] The wick 30 is preferably made of a porous material. Examples of porous bodies include sintered bodies, nonwoven fabrics, meshes, etched porous plates, and fiber bundles.

[0049] The heat spreading device 1 preferably further includes a support 60 provided in the interior space 20 of the housing 10 .

[0050] In the example shown in FIG. 2, the support 60 is provided in the vapor flow path, which is an area other than the wick 30, in the internal space of the housing 10.

[0051] The support pillars 60 may be integrated with the second inner surface 10b of the housing 10. In this case, the support pillars 60 are formed, for example, by etching the second inner surface 10b of the housing 10, in this case the inner surface of the second sheet 12.

[0052] In this specification, two elements being integrated means that there is no interface between the elements, for example, it means that the boundary between the elements cannot be discerned.

[0053] A plurality of support columns 60 may be provided. When viewed from the thickness direction T, the plurality of support columns 60 may be arranged in a lattice (matrix) pattern, a staggered pattern, or any other arrangement.

[0054] Examples of materials that can be used to form the support 60 include resin, metal, ceramics, and mixtures or laminates of two or more of these materials.

[0055] When a plurality of support columns 60 are provided, the cross-sectional shapes of the plurality of support columns 60 may be the same as one another, may be different from one another, or may be partially different from one another.

[0056] FIG. 3 is a schematic diagram showing the positional relationship between the internal space and the heat conducting member in the heat diffusion device shown in FIG. 3, when viewed from the thickness direction T, the internal space 20 of the housing 10 includes a first region 21 and a second region 23 that protrudes from a part of the first region 21. In other words, when viewed from the thickness direction T, the first region 21 and the second region 23 are aligned in the planar direction in the internal space 20 of the housing 10. In FIG. 3, the boundary line B between the first region 21 and the second region 23 is schematically indicated by a dashed line.

[0057] When viewed from the thickness direction T, the second region 23 protrudes from a part of the first region 21 in the internal space 20 of the housing 10. Therefore, in the surface direction perpendicular to the protruding direction of the second region 23 (length direction L in FIG. 3), the width of the second region 23 (length indicated by the double arrow W2 in FIG. 3) can be said to be smaller than the width of the first region 21 (length indicated by the double arrow W1 in FIG. 3).

[0058] As described above, in the internal space 20 of the housing 10, the second region 23 exists as a minute region having a relatively small width, specifically, a minute region having a width smaller than that of the first region 21.

[0059] The planar shape of the housing 10 and the shape of the internal space 20 described above can both be said to be shapes having cutouts, in other words, shapes that produce dimensionally reduced portions.

[0060] The first and second regions existing in the internal space are distinguished by the following procedure. First, the external shape of the internal space when viewed from the thickness direction is divided into the convex polygon with the largest area (any interior angle less than 180°) and other shapes. The resulting convex polygon with the largest area becomes the first region, and the other shapes become the second region. If the external shape of the internal space can be divided into the convex polygon with the largest area and two or more other shapes, the region with the smallest area is designated the second region, the region with the next smallest area is designated the third region, the region with the next smallest area is designated the fourth region, and so on. However, any portion of the first region that is 5% or less in area is treated as part of the adjacent region.

[0061] When viewed in the thickness direction, the area of ​​the first region 21 is preferably larger than the area of ​​the second region 23. The area of ​​the second region 23 is preferably 20% or more and 50% or less of the area of ​​the first region 21. When the area of ​​the second region is less than 20% of the area of ​​the first region or exceeds 50%, the problem of reduced efficiency of thermal diffusion from the second region to the first region may be less likely to occur.

[0062] As shown in FIG. 3, the heat conducting member 50 is disposed so as to extend across both the first region 21 and the second region 23. The portion of the heat conducting member 50 that is disposed in the first region 21 is referred to as a first heat conducting portion 51 . The portion of the heat conducting member 50 that is disposed in the second region 23 is referred to as a second heat conducting portion 53 .

[0063] When the heat conducting member 50 is disposed so as to span both the first region 21 and the second region 23, heat can be transported between the first region 21 and the second region 23 by the heat conducting member 50.

[0064] Therefore, even if the external shape has a notch and a heat source is placed near the notch, which would normally narrow the path from the evaporation section where the working medium evaporates to the cooling section where the working medium is cooled within the heat diffusion device, thereby reducing the heat transport efficiency, the heat conduction member transports heat to the end of the narrowed section, thereby preventing the heat transport efficiency from decreasing. Therefore, even if the outer shape has a notch and a heat source is placed near the notch, high heat dissipation characteristics can be achieved.

[0065] The portion of the internal space of the housing where the heat conducting member is disposed serves as an evaporation portion. The evaporation section is a section that evaporates the liquid working medium and changes it into a gaseous working medium.

[0066] When using a heat diffusion device, the position of the heat source is not particularly limited, and the first region may overlap the heat source, or the second region may overlap the heat source, but it is preferable that the second region overlap the heat source. When the second region overlaps with the heat source, this corresponds to the case where the heat diffusion path from the second region to the first region within the housing is narrowed. However, in the heat diffusion device of the present invention, the heat conductive member is arranged so as to span both the second region and the first region, so that high heat dissipation characteristics can be exhibited even in such a case.

[0067] Examples of heat sources include electronic components, etc. Among electronic components, ICs and photoelectric conversion modules for high-speed communication generate a large amount of heat, so the heat spreading device of the present invention can be preferably used for a substrate where these components are the heat source.

[0068] The thickness of the heat conducting member does not have to be uniform; for example, the first heat conducting portion and the second heat conducting portion may have different thicknesses.

[0069] The material constituting the heat conduction member may be any material having high thermal conductivity, such as metals such as copper, zinc, aluminum, tungsten, silicon, sodium, magnesium, and alloys thereof. Of these, copper, zinc, aluminum, tungsten, silicon, and alloys thereof are preferred, and copper, aluminum, tungsten, and alloys thereof are more preferred.

[0070] A TIM (Thermal Interface Material) such as a conductive sheet may be disposed between the heat conducting member and the housing, and between the heat conducting member and the heat source. The thermally conductive sheet is a sheet-like member that includes, for example, a resin and a filler filled in the resin, such as aluminum nitride, boron nitride, carbon nanotubes, or graphene. Furthermore, the TIM is not limited to a thermally conductive sheet, but may be, for example, a thermally conductive grease whose viscosity is adjusted by mixing the above-mentioned filler with a non-volatile fluid.

[0071] The height (thickness) of the heat conducting member is not particularly limited, but is preferably 0.5 mm or more and 5 mm or less from the viewpoint of suppressing interference between the housing and surrounding electronic components. If the height (thickness) of the heat conducting member exceeds 5 mm, the heat transfer path of the heat conducting member becomes too long, which may reduce the heat dissipation efficiency of the entire heat diffusion device.

[0072] In the heat spreading device of the present invention, the shape of the first heat conducting portion can be appropriately set within a range that does not cause interference with surrounding electronic components. That is, the shape of the heat conducting member is not limited to the form shown in Fig. 3, and various other shapes can be used. Examples of the shape of such heat conducting members will be described with reference to Figs. 4, 5, 6, 7, and 8.

[0073] FIG. 4 is a schematic diagram showing an example of the arrangement of the internal space and heat conduction members that constitute the heat diffusion device. 4, the internal space 20A includes a first region 21A and a second region 23A. The heat conducting member 50A includes a first heat conducting portion 51A located in the first region 21A and a second heat conducting portion 53A located in the second region 23A.

[0074] The shape of the first region 21A is a double-headed arrow LL 2A The long side SL of the length indicated by 2A and double arrow LS 2A The short side of the length indicated by SS 2A It is a roughly rectangular shape. Long side SL of first region 21A 2A is parallel to the longitudinal direction L. Short side SS of first region 21A 2A is parallel to the width direction W.

[0075] The shape of the first heat-conducting portion 51A is indicated by a double-headed arrow LL. 5A The long side SL of the length indicated by 5A and double arrow LS 5A The short side of the length indicated by SS 5A It is a substantially rectangular shape. Long side SL of first thermally conductive portion 51A 5A is parallel to the longitudinal direction L. Short side SS of first thermally conductive portion 51A 5A is parallel to the width direction W.

[0076] That is, the longitudinal direction (long side SL) of the first region 21A 2A the direction in which the first heat conducting portion 51A extends) and the longitudinal direction (long side SL 5A It can be said that the directions of extension are the same. Therefore, the shape of the first heat conducting portion 51A is such that the long side SL is substantially parallel to the longitudinal direction (L direction) of the first region 21A. 5A and the short side SS perpendicular to the longitudinal direction 5A It can be said that the shape is a substantially rectangular shape having the shape shown in FIG.

[0077] When the longitudinal direction of first heat conducting portion 51A and the longitudinal direction of first region 21A are aligned, heat from the heat source first spreads in the longitudinal direction of first region 21A through first heat conducting portion 51A, and then spreads toward the lateral direction of first region 21A due to the action of the working medium in internal space 20. This shortens the heat diffusion path within internal space 20, improving heat transport efficiency.

[0078] Further, the long side SL of the first heat conducting portion 51A 5A The direction in which the lines extend is perpendicular to the boundary line B between the first region 21A and the second region 23A. Therefore, the shape of heat conducting member 50A can be said to be a linear extension of second heat conducting portion 53A beyond boundary line B to first region 21A.

[0079] When the shape of the heat conduction member 50A is such that the second heat conduction section 53A is extended linearly beyond the boundary line B to the first region 21A, the heat from the second heat conduction section 53A is transferred linearly to the first heat conduction section 51A, thereby improving the efficiency of heat diffusion from the second heat conduction section 53A to the first heat conduction section 51A.

[0080] As shown in FIG. 4, the long side SL of the first heat conductive portion 5A Length LL 5A The length of the boundary line between the first region 21A and the second region 23A (indicated by the double-headed arrow L in FIG. 4) B It is preferable that the length is longer than the length indicated by (length indicated by). The length of the boundary line B between the first region 21A and the second region 23B is also the length through which the boundary line B passes through the internal space 20A. If the length of the long side of the first thermal conductive portion is longer than the length of the boundary line between the first region and the second region, it can be said that a sufficient amount (area) of thermal conductive material is arranged in the first region, and the heat dissipation efficiency can be improved.

[0081] As shown in FIG. 4, the area of ​​the first heat conducting portion 51A is preferably larger than the area of ​​the second heat conducting portion 53A. In the heat diffusion device 1A shown in FIG. 4, the width of the first heat conductive portion 51A and the width of the second heat conductive portion 53A are the same as those indicated by the double arrow LS 5AThe length in the longitudinal direction of the first thermally conductive portion 51A (indicated by the double-headed arrow LL 5A The length in the longitudinal direction of the second thermally conductive portion 53A (the length indicated by the double arrow LL A Therefore, it can be said that the area of ​​first thermally conductive portion 51A is larger than the area of ​​second thermally conductive portion 53A. When the area of ​​first heat conducting portion 51A is larger than the area of ​​second heat conducting portion 53A, the heat diffusion path in first region 21A becomes shorter, and the heat transport efficiency increases.

[0082] The ratio of the area of ​​first thermally conductive portion 51A to the area of ​​first region 21A is preferably 20% or more and 50% or less.

[0083] The ratio of the area of ​​second thermally conductive portion 53A to the area of ​​second region 23A is preferably 30% or more and 100% or less.

[0084] FIG. 5 is a schematic diagram showing another example of the arrangement of the internal space and heat conduction members that constitute the heat diffusion device. 5, a first region 21B and a second region 23B exist in an internal space 20B. A heat conduction member 50B has a first heat conduction portion 51B that is located in the first region 21B and a second heat conduction portion 53B that is located in the second region 23B.

[0085] The shape of the first region 21B is a double-headed arrow LL 2B The long side SL of the length indicated by 2B and double arrow LS 2B The short side of the length indicated by SS 2B It is a substantially rectangular shape. Long side SL of first region 21B 2B is parallel to the width direction W. Short side SS of first region 21B 2B is parallel to the longitudinal direction L.

[0086] The shape of the first heat-conducting portion 51B is indicated by a double-headed arrow LL. 5B The long side SL of the length indicated by 5Band double arrow LS 5B The short side of the length indicated by SS 5B It is a substantially rectangular shape. The length of the first thermally conductive portion 51B in the short-side direction differs between the portion that contacts the boundary line B between the first region 21B and the second region 23B and the portion that does not contact the boundary line B. However, in this case, the length of the portion that does not contact the boundary line B in the long-side direction is longer than the length of the portion that contacts the boundary line B. Therefore, the length of the longest portion in the long-side direction (the portion that does not contact the boundary line B in FIG. 5) is the length of the short-side direction indicated by the double-headed arrow LS 5B The length indicated by is the length of the short side of the first thermally conductive portion 51B. However, the first heat conducting portion 51B itself has a portion that does not contact the boundary line B (the length of the short side is as shown by the double-headed arrow LS 5B Not only the part of the boundary line B (the part of the length indicated by the double arrow LS 5B This also includes the part whose length is not indicated by . Long side SL of first thermally conductive portion 51B 5B is parallel to the width direction W. Short side SS of first thermally conductive portion 51B 5B is parallel to the longitudinal direction L.

[0087] That is, the longitudinal direction (long side SL) of the first region 21B 2B the direction in which the first heat conducting portion 51B extends) and the longitudinal direction (long side SL 5B It can be said that the directions of extension are the same. Therefore, the shape of the first heat conducting portion 51B is such that the long side SL is substantially parallel to the longitudinal direction (W direction) of the first region 21B. 5B and the short side SS perpendicular to the longitudinal direction 5B It can be said that the shape is a substantially rectangular shape having the shape shown in FIG.

[0088] When the longitudinal direction of first heat conducting portion 51B and the longitudinal direction of first region 21B are aligned, heat from the heat source first spreads in the longitudinal direction of first region 21B through first heat conducting portion 51B, and then spreads toward the lateral direction of first region 21B due to the action of the working medium in internal space 20. This shortens the heat diffusion path within internal space 20, improving heat transport efficiency.

[0089] Further, the long side SL of the first heat conducting portion 51B 5B The direction in which the lines extend is parallel to the boundary line B between the first region 21B and the second region 23B. Therefore, the shape of heat conducting member 50B can be said to be a shape obtained by bending second heat conducting portion 53B from a specific point beyond boundary line B so as to be approximately parallel to boundary line B and extending it.

[0090] If the shape of the heat conduction member 50B is such that the second heat conduction section 53B is bent and extended from a specific point beyond the boundary line B so that it is approximately parallel to the boundary line B, heat can be transported using the heat conduction member beyond the point where the path would become narrowed if heat were transported using a working medium, resulting in good heat diffusion efficiency.

[0091] FIG. 6 is a schematic diagram showing yet another example of the arrangement of the internal space and heat conduction members that constitute the heat diffusion device. 6, a first region 21C and a second region 23C exist in an internal space 20C. A heat conduction member 50C has a first heat conduction portion 51C that is located in the first region 21C and a second heat conduction portion 53C that is located in the second region 23C.

[0092] The shape of the first region 21C is a double-headed arrow LL 2C The long side SL of the length indicated by 2C and double arrow LS 2C The short side of the length indicated by SS 2C It is a substantially rectangular shape. Long side SL of first region 21C 2C is parallel to the width direction W. Short side SS of first area 21C 2C is parallel to the longitudinal direction L.

[0093] The shape of the first heat-conducting portion 51C is indicated by a double-headed arrow LL. 5C The long side SL of the length indicated by 5C and double arrow LS 5C The short side of the length indicated by SS 5C It is a substantially rectangular shape. Long side SL of first thermally conductive portion 51C 5C is parallel to the longitudinal direction L. Short side SS of first thermal conductive portion 51C 5C is parallel to the width direction W.

[0094] That is, the longitudinal direction (long side SL) of the first region 21C 2C the direction in which the first heat conducting portion 51C extends) and the longitudinal direction (long side SL 5C The direction in which the wire extends can be said to be perpendicular to the wire. Therefore, the shape of the first heat conducting portion 51C is such that the short side SS is approximately parallel to the longitudinal direction (W direction) of the first region 21C. 5C and the long side SL perpendicular to the longitudinal direction 5C It can be said that the shape is a substantially rectangular shape having the shape shown in FIG.

[0095] When the longitudinal direction of first heat conducting member 51C and the longitudinal direction of first region 21C are perpendicular to each other, first heat conducting member 51C diffuses heat along the short direction of first region 21C, thereby shortening the path along which heat is diffused by first heat conducting member 51C. In this case, the temperature difference in the longitudinal direction of first heat conducting member 51C is reduced, making it easier for heat to be dissipated uniformly to first region 21C.

[0096] Further, the long side SL of the first heat conducting portion 51C 5C The direction in which the lines extend is perpendicular to the boundary line B between the first region 21C and the second region 23C. Therefore, the shape of heat conducting member 50C can be said to be a linear extension of second heat conducting portion 53C beyond boundary line B to first region 21C.

[0097] When the shape of the heat conduction member 50C is such that the second heat conduction portion 53C is extended linearly beyond the boundary line B to the first region 21C, the heat from the second heat conduction portion 53C is transferred linearly to the first heat conduction portion 51C, thereby improving the efficiency of heat diffusion from the second heat conduction portion 53C to the first heat conduction portion 51C.

[0098] FIG. 7 is a schematic diagram showing yet another example of the arrangement of the internal space and heat conduction members that constitute the heat diffusion device. 7, a first region 21D and a second region 23D exist in an internal space 20D. A heat conduction member 50D has a first heat conduction portion 51D that is located in the first region 21D and a second heat conduction portion 53D that is located in the second region 23D.

[0099] The shape of the first region 21D is a double-headed arrow LL 2D The long side SL of the length indicated by 2D and double arrow LS 2D The short side of the length indicated by SS 2D It is a substantially rectangular shape. Long side SL of first region 21D 2D is parallel to the longitudinal direction L. Short side SS of first region 21D 2D is parallel to the width direction W.

[0100] The shape of the first heat-conducting portion 51D is indicated by a double-headed arrow LL. 5D The long side SL of the length indicated by 5D and double arrow LS 5D The short side of the length indicated by SS 5D It is a substantially rectangular shape. The length of the first thermally conductive portion 51D in the short-side direction differs between the portion that contacts the boundary line B between the first region 21D and the second region 23D and the portion that does not contact the boundary line B. However, in this case, the total length of the portions that do not contact the boundary line B is longer than the length of the portions that contact the boundary line B. Therefore, the length of the longest portion in the long-side direction (the portion that does not contact the boundary line B in FIG. 7) is the length of the short-side direction indicated by the double-headed arrow LS 5D The length indicated by is the length of the short side of the first thermally conductive portion 51D. However, the first heat conducting portion 51D itself has a portion that does not contact the boundary line B (the length of the short side is as shown by the double-headed arrow LS 5D Not only the part of the boundary line B (the part of the length indicated by the double arrow LS 5D This also includes the part whose length is not indicated by . Long side SL of first thermally conductive portion 51D 5D is parallel to the width direction W. Short side SS of first thermal conductive portion 51D 5Dis parallel to the longitudinal direction L.

[0101] That is, the longitudinal direction (long side SL) of the first region 21D 2D the direction in which the first heat conducting portion 51D extends) and the longitudinal direction (long side SL 5D The direction in which the wire extends can be said to be perpendicular to the wire. Therefore, the shape of the first heat conducting portion 51D is such that the short side SS is approximately parallel to the longitudinal direction (L direction) of the first region 21D. 5D and the long side SL perpendicular to the longitudinal direction 5D It can be said that the shape is a substantially rectangular shape having the shape shown in FIG.

[0102] When the longitudinal direction of the first heat conducting member 51D and the longitudinal direction of the first region 21D are perpendicular to each other, the first heat conducting member 51D diffuses heat along the short-side direction of the first region 21D, shortening the path along which the heat is diffused by the first heat conducting member 51D. In this case, the temperature difference in the longitudinal direction of the first heat conducting member 51D is reduced, making it easier to equalize the heat dissipation to the first region 21D. Furthermore, as shown in FIG. 7, when the first heat conducting member 51D is shaped to be disposed along the short-side direction of the first region 21D, the evaporation section is disposed along the width direction of the first region 21D, making it easier to determine the movement direction of the vapor flow path in one direction (direction L in FIG. 7), and making it easier to utilize the space in the first region 21D as a vapor flow path.

[0103] Further, the long side SL of the first heat conducting portion 51D 5D The direction in which the lines extend is parallel to the boundary line B between the first region 21D and the second region 23D. Therefore, the shape of heat conducting member 50D can be said to be a shape obtained by extending second heat conducting portion 53D so that it branches off in two directions substantially parallel to boundary line B from a specific point beyond boundary line B.

[0104] If the shape of the heat conduction member 50D is such that the second heat conduction section 53D is extended so as to branch off in two directions approximately parallel to the boundary line B from a specific point beyond the boundary line B, heat can be transported using the heat conduction member beyond the point where the path becomes narrowed when using a working medium for heat transport, thereby improving the heat diffusion efficiency.

[0105] An example of a heat spreading device having a third region in the internal space will be described with reference to FIG. FIG. 8 is a schematic diagram showing yet another example of the arrangement of the internal space and heat conduction members that constitute the heat diffusion device. In the heat diffusion device 1E shown in FIG. 8, the internal space 20E includes a first region 21E, a second region 23E protruding from a portion of the first region 21E, and a third region 25E protruding from a portion of the first region 21E at a position away from the second region 23E. The first region 21E and the second region 23E are distinguished by a boundary line B. The first region 21E and the third region 25E are distinguished by a boundary line C.

[0106] The heat conducting member 50E has a first heat conducting portion 51E that is a portion disposed in the first region 21E, and a second heat conducting portion 53E that is a portion disposed in the second region 23E.

[0107] As shown in FIG. 8, in addition to the first region 21E and the second region 23E, the internal space 20E of the housing may further include a third region 25E that protrudes from a part of the first region 21E at a position away from the second region 23E. In this case, at least a part of the first heat conducting portion 51E (long side SL in FIG. 8) 5E ) is preferably disposed at a position facing the boundary line C between the first region 21E and the third region 25E.

[0108] If a third region exists in the internal space of the housing, there is a high possibility that the path of heat diffusion from the second region to the third region will be significantly restricted. However, as shown in FIG. 8, the long side SL, which is a part of the first heat conducting portion 51E, 5E is disposed at a position facing the boundary line C between the first region 21E and the third region 25E, the portion of the first heat conducting portion 51E facing the boundary line C (in FIG. 8, the long side SL 5E ) to the third region 25E, high heat transport efficiency can be achieved even when the third region 25E exists in the internal space 20E.

[0109] Furthermore, when the internal space includes a first region, a second region, and a third region, as in the heat diffusion device shown in FIG. 8, the heat conduction member may be arranged to extend from the second region to the third region via the first region.

[0110] The thickness of the heat conducting member may be the same for the first heat conducting portion and the second heat conducting portion, but may also be different. For example, the maximum height of the second thermally conductive portion may be greater than the maximum height of the first thermally conductive portion. An example of a heat diffusion device including a heat conducting member in which the maximum height of the second heat conducting portion is greater than the maximum height of the first heat conducting portion will be described with reference to FIG.

[0111] FIG. 9 is a cross-sectional view schematically showing another example of a heat diffusion device. The heat spreading device 2 shown in FIG. 9 includes a housing 10 and a heat conducting member 55 disposed outside the housing 10. The heat spreading device 2 shown in FIG. The heat conducting member 55 has a first heat conducting portion 56 arranged in the first region 21 of the internal space 20 of the housing 10, and a second heat conducting portion 58 arranged in the second region 23. The maximum height of second thermally conductive portion 58 (height indicated by h2 in FIG. 9) is greater than the maximum height of first thermally conductive portion 56 (height indicated by h1 in FIG. 9). Therefore, in cases where components taller than the heat source are placed around the heat source, adjusting the maximum height of the first heat conduction section, specifically, making the height of the first heat conduction section lower than the height of the second heat conduction section, may make it possible to avoid interference with the taller components without changing the planar shape of the heat conduction member.

[0112] The present specification discloses the following:

[0113] The present disclosure (1) provides a housing having a first inner surface and a second inner surface facing each other in a thickness direction and having an internal space; a working medium sealed in the internal space of the housing; and a wick provided in the internal space of the housing; a heat conduction member disposed outside the housing; When viewed from the thickness direction, the internal space of the housing includes a first region and a second region protruding from a part of the first region, The heat diffusion device is characterized in that the heat conduction member is arranged to span both the first region and the second region, and has a first heat conduction portion that is arranged in the first region, and a second heat conduction portion that is arranged in the second region.

[0114] The present disclosure (2) is a heat diffusion device according to the present disclosure (1), wherein the shape of the first heat conduction portion is substantially rectangular having long sides substantially parallel to the longitudinal direction of the first region and short sides substantially perpendicular to the longitudinal direction.

[0115] The present disclosure (3) is a heat diffusion device according to the present disclosure (1), wherein the shape of the first heat conduction portion is substantially rectangular having a short side substantially parallel to the longitudinal direction of the first region and a long side substantially perpendicular to the longitudinal direction.

[0116] The present disclosure (4) is a heat diffusion device according to the present disclosure (2) or (3), wherein the direction in which the long side of the first heat conduction portion extends is approximately perpendicular to the boundary line between the first region and the second region.

[0117] The present disclosure (5) is the heat diffusion device according to the present disclosure (2) or (3), wherein the direction in which the long side of the first heat conducting portion extends is approximately parallel to the boundary line between the first region and the second region.

[0118] The present disclosure (6) is a heat diffusion device that is an arbitrary combination with any of the present disclosures (2) to (5), in which the length of the long side of the first heat conduction portion is longer than the length of the boundary line between the first region and the second region.

[0119] The present disclosure (7) is a heat diffusion device in any combination with any of the present disclosures (1) to (6), in which the area of ​​the first heat conducting portion is larger than the area of ​​the second heat conducting portion.

[0120] The present disclosure (8) further provides a third area in the internal space of the housing, the third area being located away from the second area and protruding from a part of the first area, The heat diffusion device is any combination of any of the present disclosures (1) to (7), in which at least a part of the first heat conducting portion is disposed in a position facing the boundary line between the first region and the third region.

[0121] The present disclosure (9) is a heat diffusion device in any combination with any of the present disclosures (1) to (8), in which the maximum height of the second heat conducting portion is greater than the maximum height of the first heat conducting portion.

[0122] The present disclosure (10) is a heat diffusion device in any combination with any of the present disclosures (1) to (9), in which the second region overlaps the heat source.

[0123] The present disclosure (11) is a heat diffusion device in any combination with any of the present disclosures (1) to (10), in which the area of ​​the first region is larger than the area of ​​the second region when viewed in the thickness direction. [Explanation of symbols]

[0124] 1, 1A, 1B, 1C, 1D, 1E, 2 Heat Spreading Device 10. Housing 10a First inner surface 10b Second inner surface 11 Sheet 1 12 Second Sheet 20, 20A, 20B, 20C, 20D, 20E interior space 21, 21A, 21B, 21C, 21D, 21E 1st area 23, 23A, 23B, 23C, 23D, 23E 2nd area 25E Third area 30 Wick 50, 50A, 50B, 50C, 50D, 50E, 55 Thermal conductive material 51, 51A, 51B, 51C, 51D, 51E, 56 First heat conduction section 53, 53A, 53B, 53C, 53D, 53E, 58 Second heat conduction section 60 pillars B. Boundary line between the first and second areas C. Boundary line between the first and third areas SL 2A , S.L. 2B , S.L. 2C , S.L. 2D Long side of the first area SS 2A , S.S. 2B , S.S. 2C , S.S. 2D Short side of the first area SL 5A , S.L. 5B , S.L. 5C , S.L. 5D , S.L. 5E Long side of the first heat conduction part SS 5A , S.S. 5B , S.S. 5C , S.S. 5D , S.S. 5E Short side of the first heat conduction part L B Boundary line length LL 2A , L.L. 2B , L.L. 2C , L.L. 2D Length of the long side of the first area LS 2A , L.S. 2B , L.S. 2C , L.S. 2D Length of the short side of the first area LL 5A , L.L. 5B , L.L. 5C , L.L. 5D Length of the long side of the first heat conduction part LS 5A , L.S. 5B , L.S. 5C , L.S. 5D Length of the short side of the first heat conduction part LL A Length of the long side of the second area h1 Height of the first heat conduction part h2 Height of the second heat conduction section W1 Width of the first area W2 Width of the second area

Claims

1. a housing having a first inner surface and a second inner surface facing each other in a thickness direction and having an internal space; a working medium sealed in the internal space of the housing; and a wick provided in the internal space of the housing; a heat conduction member disposed outside the housing; When viewed from the thickness direction, the internal space of the housing includes a first region and a second region protruding from a part of the first region, The heat diffusion device is characterized in that the heat conduction member is arranged to span both the first region and the second region, and has a first heat conduction portion that is arranged in the first region, and a second heat conduction portion that is arranged in the second region.

2. The heat spreading device according to claim 1 , wherein the first heat conducting portion has a substantially rectangular shape having long sides substantially parallel to a longitudinal direction of the first region and short sides substantially perpendicular to the longitudinal direction.

3. The heat spreading device according to claim 1 , wherein the first heat conducting portion has a substantially rectangular shape having short sides substantially parallel to a longitudinal direction of the first region and long sides substantially perpendicular to the longitudinal direction.

4. 4. The heat spreading device according to claim 2, wherein the direction in which the long side of the first heat conducting portion extends is substantially perpendicular to a boundary line between the first region and the second region.

5. 4. The heat spreading device according to claim 2, wherein the direction in which the long side of the first heat conducting portion extends is substantially parallel to a boundary line between the first region and the second region.

6. The heat spreading device according to claim 2 , wherein the length of the long side of the first heat conducting portion is longer than the length of a boundary line between the first region and the second region.

7. 4. The heat spreading device according to claim 1, wherein the area of ​​said first heat conducting portion is larger than the area of ​​said second heat conducting portion.

8. a third region protruding from a part of the first region at a position separated from the second region is further present in the internal space of the housing; 4. The heat spreading device according to claim 1, wherein at least a portion of said first heat conducting portion is disposed at a position opposite to a boundary line between said first region and said third region.

9. 4. The heat spreading device according to claim 1, wherein the second heat conducting portion has a maximum height greater than the maximum height of the first heat conducting portion.

10. The heat spreading device of any one of claims 1 to 3, wherein the second region overlaps the heat source.

11. 4. The heat spreading device according to claim 1, wherein the area of ​​said first region is larger than the area of ​​said second region when viewed in said thickness direction.

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