Holding device and holding method

Abstract

To provide a holding device and a holding method capable of suitably holding a workpiece and a frame regardless of their shapes.SOLUTION: A holding apparatus for holding a ring frame 14 as a workpiece to which a plate-shaped wafer is fixed, the ring frame 14 having a first surface 141, a second surface 142 opposite to the first surface, and a third surface 143 interposed between the first surface and the second surface and intersecting the first surface and the second surface, the holding apparatus comprising: The holding member 50 is made of an elastic body and has a hollow portion 52 including an internal space 51 and a powder 53 accommodated in the internal space 51. The suction source 54 communicates with the internal space 51 and a fluid from the internal space 51. The holding member 50 from which the fluid is sucked from the internal space 51 comes into contact with at least the third surface 143 of the ring frame.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a holding device and a holding method. [Background technology]

[0002] In the semiconductor device manufacturing process, the surface of a disk-shaped semiconductor wafer (hereinafter sometimes simply referred to as a "wafer") is divided into a large number of rectangular regions by streets (planned division lines) arranged in a grid pattern, and devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integration) are formed in each rectangular region. Then, the wafer on which a large number of devices have been formed is cut along the streets with a cutting blade of a cutting machine called a dicer, thereby forming multiple semiconductor chips. When cutting with a dicer, the wafer is sometimes fixed to a ring frame via tape while being transported and processed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2020-028924 [Patent Document 2] Patent No. 7450981 [Patent Document 3] Japanese Patent Publication No. 2021-065977 Summary of the Invention [Problem to be solved by the invention]

[0004] When transporting a ring frame with a fixed wafer, it is generally fixed by suction using a suction pad. However, the ring frame may have a surface with irregularities or grooves, and depending on the position of the suction pad, it may not be possible to fix the wafer by suction.

[0005] Furthermore, when cutting a wafer using a cutting blade such as a dicer, in order to prevent the cutting blade from contacting the ring frame, a holding member may be pressed against the ring frame from above, pulling the ring frame down below the wafer to hold it in place. In this case, it is preferable that the holding member, as well as the ring frame, be positioned below the wafer to prevent them from contacting the cutting blade. However, if the ring frame or holding member is too thick, it may not be possible to pull them down sufficiently to hold them in place, which may hinder processing.

[0006] For example, Patent Documents 1 to 3 describe various workpiece holding devices, robot hands, and suction grippers, but there is room for improvement in terms of suitable holding regardless of the shape of the workpiece or frame.

[0007] An object of the present invention is to provide a holding device and a holding method that are capable of holding a workpiece or a frame in an appropriate manner regardless of their shapes. [Means for solving the problem]

[0008] One aspect of the present invention is a holding device for holding a workpiece including a plate-shaped wafer having a first surface, a second surface opposite the first surface, and a third surface interposed between the first surface and the second surface and intersecting the first surface and the second surface, the holding device comprising: a holding member made of an elastic body and having a hollow portion including an internal space and powder contained in the internal space; and a suction source communicating with the internal space and sucking a fluid from the internal space, wherein the holding member, which has sucked the fluid from the internal space, contacts at least the third surface of the workpiece.

[0009] The holding device may include a contact portion that contacts a contacted surface, which is at least one of the first surface and the second surface, to define the position of the contacted surface.

[0010] The workpiece may be a frame unit in which the wafer is fixed to a ring frame via tape, the holding device may further include a chuck table that holds the wafer of the frame unit on a holding surface, and the holding member may contact the ring frame of the frame unit and hold the ring frame so that the holding surface protrudes from the ring frame.

[0011] The workpiece may be a frame unit in which the wafer is fixed to a ring frame via tape, and the holding device may further include a chuck table that holds the wafer of the frame unit on a holding surface, and the holding device may be provided in a processing device that processes the wafer held on the chuck table with a laser beam or a rotating cutting blade.

[0012] A holding method according to one embodiment of the present invention comprises a workpiece holding step of holding a workpiece of a frame unit, the workpiece being fixed to a ring frame via tape, on the holding surface of a chuck table, either directly or via the tape; a ring frame positioning step of positioning the ring frame so that the holding surface protrudes from the ring frame and bringing the ring frame close to a holding member interposed between a first surface and a second surface of the ring frame and arranged to correspond to a third surface intersecting the first surface and the second surface; the holding member is made of an elastic body and has a plurality of holding members, each having a hollow portion with an internal space and powder contained in the internal space, and a ring frame holding step of sucking fluid from the internal space using a suction source connected to the internal space to contract the hollow portion and hold the ring frame positioned in the ring frame positioning step; and a processing step of processing the workpiece of the frame unit held in the ring frame holding step.

[0013] The ring frame may be made of resin. [Effects of the Invention]

[0014] According to the above aspects, it is possible to provide a holding device and a holding method that are capable of holding a workpiece or a frame in an appropriate manner regardless of the shape of the workpiece or the frame. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 2 is a top view showing an example of the configuration of the holding device of the first embodiment. [Figure 2] FIG. 2 is a cross-sectional view showing an example of the configuration of the holding device of the first embodiment. [Figure 3] 10A and 10B are diagrams for explaining in more detail the structure for holding a workpiece by a holding member. [Figure 4] 2A and 2B, showing an example of the configuration of a holding device according to a second embodiment. FIG. [Figure 5] FIG. 10 is a top view showing an example of the configuration of a holding device according to a third embodiment. [Figure 6] FIG. 10 is a top view showing an example of the configuration of a holding device according to a third embodiment. [Figure 7] 6A and 6B, showing an example of the configuration of a holding device according to a fourth embodiment. FIG. [Figure 8] FIG. 10 is a cross-sectional view showing an example of the configuration of a holding device according to a fifth embodiment. [Figure 9] 2A and 2B, showing an example of the configuration of a holding device according to a sixth embodiment. FIG. [Figure 10] FIG. 13 is a cross-sectional view showing an example of the configuration of a holding device according to a seventh embodiment. [Figure 11] 1A and 1B are diagrams showing an example of the structure of a workpiece to be held by the holding device and holding method of the present embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0016] <Definitions of terms, etc.> The holding device of this embodiment is used in cooperation with a workpiece transport device, processing device, etc. There is a degree of freedom in the type of workpiece transport device, processing device, etc. that cooperates with it, and various design modifications are possible. The workpiece transport device may, for example, be one that uses a chuck table or a turntable, or one that uses a transport arm. The workpiece processing device may, for example, be one that cuts the workpiece using a cutting blade such as a dicer, one that processes the workpiece with a laser beam, one that polishes the workpiece with a polishing pad, or one that grinds the workpiece with a grinding wheel.

[0017] In this specification, the term "wafer" may refer to, for example, a "semiconductor wafer" that is the base of a semiconductor integrated circuit. A semiconductor wafer may be realized as a disk obtained by slicing a single crystal pillar made by growing silicon (Si), silicon carbide (SiC), or the like to an appropriate thickness. Furthermore, the term "wafer" is not limited to semiconductor components, but may also refer to wafer-shaped workpieces made of various materials such as silicon (Si), silicon carbide (SiC), glass, and resin. In this specification, when the term "wafer" is simply used, it may be used in a broad sense to include not only semiconductor wafers but also wafer-shaped workpieces that are not limited to semiconductor components. Furthermore, the terms "wafer" and "semiconductor wafer" may be used interchangeably (especially when referring to a semiconductor wafer, it may also be interpreted as referring to a wafer-shaped workpiece that is not limited to semiconductor components).

[0018] In this specification, the term "workpiece" may refer to, for example, any object that can be held by the holding device and holding method of the present embodiment. One example of the workpiece may be a frame unit in which a semiconductor wafer is fixed to a ring frame via tape. In this case, the term "workpiece" may refer to a portion of the frame unit that is held (e.g., sucked) by the holding device and holding method of the present embodiment (e.g., at least a portion of the semiconductor wafer and the ring frame).

[0019] In this specification, the term "workpiece" may be used to refer to, for example, a plate-shaped semiconductor wafer having a first surface, a second surface opposite the first surface, and a third surface interposed between the first and second surfaces and intersecting the first and second surfaces. In this case, the "third surface" may refer to, for example, the outer peripheral side surface of the plate-shaped semiconductor wafer (the side surface connecting the outer peripheral edges of the first and second surfaces). Alternatively, when a through hole or a bottomed hole is formed in the plate-shaped semiconductor wafer, the "third surface" may refer to, for example, the inner peripheral side surface of the through hole or the bottomed hole (the side surface extending in a direction connecting the inner peripheral edges of the first and second surfaces).

[0020] Furthermore, when the "workpiece" is a ring frame to which a semiconductor wafer is fixed, this ring frame also has a first surface, a second surface opposite to the first surface, and a third surface interposed between the first and second surfaces and intersecting the first and second surfaces. In this case, the "third surface" may refer to, for example, the outer peripheral side surface of the ring frame (the side surface connecting the outer edges of the first and second surfaces). Alternatively, when a through hole or a blind hole is formed in the ring frame, the "third surface" may refer to, for example, the inner peripheral side surface of the through hole or blind hole.

[0021] In the above meaning, the first to third surfaces of the "workpiece," the first to third surfaces of the "semiconductor wafer," the first to third surfaces of the "ring frame," and the first to third surfaces of the "frame unit" may be read interchangeably.

[0022] <About the structure of the workpiece> The structure of workpieces 110 and 120 to be held by the holding device and holding method of this embodiment will be described with reference to FIGS. 11A and 11B.

[0023] 11A, workpiece 110 has a disk-shaped semiconductor wafer 111 made of, for example, silicon. On the front side of semiconductor wafer 111, chips 112, which are electronic devices, are formed in multiple regions defined by a plurality of grid-like planned division lines (streets). Semiconductor wafer 111 is supported by ring frame 114 via tape 113, which is a support member attached to the back side. Ring frame 114 is made of, for example, a resin material.

[0024] 11B, workpiece 120 has a rectangular semiconductor wafer (which may also be called a package substrate) 121 made of, for example, silicon. On the front side of semiconductor wafer 121, chips 122, which are electronic devices, are formed in multiple regions defined by multiple grid-like planned division lines (streets). Semiconductor wafer 121 is supported by ring frame 124 via tape 123, which is a support member attached to the back side. Ring frame 124 is made of, for example, a resin material.

[0025] In this way, the workpieces 110, 120 are configured as a "frame unit" in which the semiconductor wafers 111, 121 are fixed to the ring frames 114, 124 via the tapes 113, 123. In this embodiment, the components including the workpieces 110, 120 will be appropriately designated by the representative reference numeral 10, the components including the semiconductor wafers 111, 121 by the representative reference numeral 11, the components including the chips 112, 122 by the representative reference numeral 12, the components including the tapes 113, 123 by the representative reference numeral 13, and the components including the ring frames 114, 124 by the representative reference numeral 14.

[0026] <Structure of conveying equipment and processing equipment equipped with holding devices> In a conveying device or processing device (hereinafter collectively referred to as a holding device 20) equipped with the holding device of this embodiment, processing is performed along the planned dividing lines (streets) between the plurality of chips 12 (112, 122) on the semiconductor wafer 11 (111, 121) (for example, processing is performed using a dicer or laser beam). Each embodiment of the holding device 20 will be described below.

[0027] First Embodiment 1A and 1B are top views showing an example of the configuration of the holding device 20 of the first embodiment. Fig. 1A illustrates a holding device 20 in which sets of contact portions 40 and holding members 50, which will be described later, are formed around the entire circumference of the holding device 20, while Fig. 1B illustrates a holding device 20 in which sets of contact portions 40 and holding members 50, which will be described later, are formed intermittently in the circumferential direction of the holding device 20.

[0028] 2A and 2B are cross-sectional views showing an example of the configuration of the holding device 20 of the first embodiment, taken along line II-II in Fig. 1A and Fig. 1B. Fig. 2A illustrates the holding device 20 in a state where it is positioned directly above the workpiece (frame unit) 10 without holding it, and Fig. 2B illustrates the holding device 20 in a state where it holds the workpiece (frame unit) 10.

[0029] The holding device 20 is composed of a chuck table 30 and elements associated with the chuck table 30. The chuck table 30 includes a frame 31 having a recess on its upper surface and a holding plate 32 attached to the recess of the frame 31. The frame 31 surrounds the periphery of the holding plate 32, with only the top surface of the holding plate 32 exposed. The frame 31 is disk-shaped with a predetermined thickness in the vertical direction in the figure, and the outer peripheral surface 33 of the frame 31 is cylindrical. The thickness of the holding plate 32 in the vertical direction in the figure is approximately the same as the depth of the recess of the frame 31, and the top surfaces of the frame 31 and the holding plate 32 are flush with each other to form the holding surface of the chuck table 30. The holding surface of the chuck table 30 (the top surface of the holding plate 32) is shaped to correspond to the bottom surface of the semiconductor wafer 11 of the workpiece 10.

[0030] The holding plate 32 is formed of a porous member such as a porous ceramic material, and the holding plate 32 communicates with a suction source 34 via a suction path provided inside the chuck table 30. By operating the suction source 34, a suction force can be applied to the holding surface (upper surface of the holding plate 32) of the chuck table 30. In this way, the chuck table 30 has the function of holding the semiconductor wafer 11 of the workpiece (frame unit) 10 on the holding surface (upper surface of the holding plate 32).

[0031] Contact portions 40 and holding members 50 are formed around the periphery of the chuck table 30 in this order from the inner diameter side (inside) to the outer diameter side (outside). FIG. 1A illustrates sets of contact portions 40 and holding members 50 formed around the entire outer circumference of the chuck table 30. FIG. 1B illustrates sets of contact portions 40 and holding members 50 formed intermittently in the circumferential direction of the outer side of the chuck table 30. In FIG. 1B, sets of four contact portions 40 located on the inner diameter side (inside) and four holding members 50 located on the outer diameter side (outside) are provided at approximately 90° intervals in the circumferential direction of the outer side of the chuck table 30 (the circumferential positions of each of the four contact portions 40 and the holding members 50 correspond (match)).

[0032] The contact portions 40 located on the inner diameter side (inside) of the periphery of the chuck table 30 have the function of contacting the lower surface of the inner diameter side of the ring frame 14 and holding it in a position-controlled state. The holding members 50 located on the outer diameter side (outside) of the periphery of the chuck table 30 have the function of holding the upper surface (first surface), lower surface (second surface), and side surface (third surface) of the outer diameter side of the ring frame 14 in a position-controlled state by the contact portions 40.

[0033] The structure of the workpiece 10 (ring frame 14) held by the holding member 50 will be described in more detail with reference to FIGS. 3A, 3B, and 3C.

[0034] 3A and 3C, the ring frame 14 serving as the workpiece 10 held by the holding member 50 has an upper surface (first surface) 141, a lower surface (second surface) 142, and a side surface (third surface) 143. The upper surface (first surface) 141 and the lower surface (second surface) 142 are defined as surfaces located opposite each other, and the first surface and the second surface may be interpreted as interchangeable. The side surface (third surface) 143 is defined as a surface that is interposed between the upper surface (first surface) 141 and the lower surface (second surface) 142 and intersects with the upper surface (first surface) 141 and the lower surface (second surface) 142.

[0035] 3B and 3C, holding member 50 has hollow portion 52 made of an elastic body and including internal space 51, and powder 53 accommodated in internal space 51 of hollow portion 52. More specifically, internal space 51 of hollow portion 52 is sealed airtight except for a portion connected to suction source 54, and is filled with powder 53 and a fluid (e.g., air).

[0036] Furthermore, as shown in Figures 2A, 2B, 3B, and 3C, a suction source 54 is connected to the internal space 51 of the hollow portion 52, and the suction source 54 can be used to suck (e.g., vacuum) a fluid (e.g., air) from the internal space 51 of the hollow portion 52.

[0037] Powder 53 is an aggregate of many particles of a certain size, such as sand or powder, and when the density of the particles contained therein is lower than a certain threshold (for example, when the fluid is not being sucked by suction source 54), it behaves like a fluid, but when the density is higher than that threshold (for example, when the fluid is being sucked by suction source 54), it behaves like a solid. This change in state due to density can be called a jamming transition, and various critical properties are observed near the transition point.

[0038] The hollow portion 52 has elasticity that allows it to maintain a constant shape, i.e., an internal space 51 having a generally rectangular (box-like) cross section as shown in FIG. 3B , when the suction source 54 is not sucking the fluid. On the other hand, when the hollow portion 52 approaches the ring frame 14 in the vertical direction and is crushed by the lower surface (second surface) 142, the internal space 51 having a generally rectangular (box-like) cross section as shown in FIG. 3B is easily (flexibly) deformed, and as shown in FIG. 3C , it comes into contact with the upper surface (first surface) 141, the lower surface (second surface) 142, and the side surface (third surface) 143 of the ring frame 14, sandwiching (clamping) and holding them from three directions. When the suction source 54 sucks the fluid in the sandwiched (clamped) state, the density of the powder 53 contained in the internal space 51 of the hollow portion 52 increases, and the ring frame 14 is held by utilizing the jamming transition phenomenon (frictional force).

[0039] 3C, the holding member 50, which has sucked the fluid from the internal space 51 of the hollow portion 52, is in contact with the upper surface (first surface) 141, the lower surface (second surface) 142, and the side surface (third surface) 143 of the ring frame 14, but it is sufficient that the holding member 50 is in contact with at least the side surface (third surface) 143 of the ring frame 14. In other words, it is sufficient that the hollow portion 52, which has been crushed and deformed by the ring frame 14, can wrap around to the side surface (third surface) 143 of the ring frame 14.

[0040] Here, the holding surfaces of the ring frame 14 (for example, the upper surface 141, the lower surface 142, and the side surfaces 143) may have shapes such as unevenness (for example, gate marks) or grooves (for example, grooves for tape cutting). In this regard, according to the present embodiment, which utilizes the jamming transition phenomenon (frictional force), the holding member 50 is easily (flexibly) deformed so as to conform to the holding surfaces of the ring frame 14, and then the holding member 50 is hardened by fluid suction (for example, vacuuming) using the suction source 54, thereby making it possible to hold the ring frame 14 in an appropriate manner.

[0041] Furthermore, even if there are some individual differences or variations in the shape and dimensions of the ring frame 14, these can be absorbed, and the ring frame 14 and therefore the frame unit 10 can be held with high stability and reliability (to put it in extreme terms, all that is required is for the corners of the lower surface 142 and the side surface 143 of the ring frame 14, which are close together in the vertical direction, to be abutted somewhere in the hollow portion 52 of the holding member 50).

[0042] Furthermore, on the inner diameter side (inside) of the holding member 50, the contact portion 40 contacts the contacted surface, which is the lower surface (second surface) 142 of the ring frame 14, and regulates the position of the contacted surface. This, coupled with (cooperating with) the holding of the ring frame 14 by the holding member 50 utilizing the jamming transfer phenomenon (frictional force), enables more suitable holding of the ring frame 14.

[0043] The contact portion 40 may contact at least one of the upper surface (first surface) 141 and the lower surface (second surface) 142 of the ring frame 14 to determine the position of the contacted surface. For example, the contact portion 40 may clamp the upper surface (first surface) 141 and the lower surface (second surface) 142 of the ring frame 14 from above and below, thereby regulating the position of the ring frame 14.

[0044] The holding member 50, working in cooperation with the contact portion 40, comes into contact with the ring frame 14 of the frame unit 10 and holds the ring frame 14 so that the holding surface of the chuck table 30 (the upper surface of the holding plate 32) protrudes beyond the ring frame 14. As a result, for example, when cutting the semiconductor wafer 11 using a cutting blade such as a dicer, the ring frame 14 can be pulled down and held below the semiconductor wafer 11 to prevent the cutting blade from coming into contact with the ring frame 14.

[0045] The holding device 20 is provided in a processing device that processes the semiconductor wafer 11 held on the chuck table 30 with a rotating cutting blade 60 (the holding device can also be read as the processing device). As described above, there are a plurality of device regions on the workpiece 10 (semiconductor wafer 11) that are partitioned by grid-like planned dividing lines (streets), and cutting processing is performed by the cutting blade 60 along these planned dividing lines.

[0046] As shown in FIG. 2B , the cutting blade 60 is supported at the tip of a horizontally extending spindle 61, and the spindle 61 is rotated by a spindle motor (not shown). The cutting blade 60 can be moved horizontally in the axial direction of the spindle 61 by a movement mechanism (not shown), so that the cutting blade 60 is aligned with the planned dividing lines (streets) of the workpiece 10 (semiconductor wafer 11). The cutting blade 60 (spindle 61) can be moved vertically by a lifting mechanism (not shown). In the cutting process, a control unit 62 of the cutting device controls the movement mechanism to position the cutting blade 60 above the planned dividing lines (streets) of the workpiece 10 (semiconductor wafer 11) to be cut. The positions of the planned dividing lines (streets) may be detected by irradiating an observation light onto the back surface (lower surface) of the workpiece 10 (semiconductor wafer 11), on which the planned dividing lines (streets) are not formed, and observing the back surface (lower surface) with a predetermined observation device 63.

[0047] The holding method of this embodiment has the following constituent features. As a prerequisite, it has a plurality of holding members 50, each of which is made of an elastic body and has a hollow portion 52 with an internal space 51, and powder 53 contained in the internal space 51. The holding method of this embodiment has a workpiece holding step, a ring frame positioning step, a ring frame holding step, and a processing step. The processing step may be omitted from the holding method of this embodiment.

[0048] In the workpiece holding process, the semiconductor wafer 11 of the frame unit 10, in which the semiconductor wafer 11 is fixed to the ring frame 14 via the tape 13, is held on the holding surface (upper surface of the holding plate 32) of the chuck table 30 directly or via the tape 13.

[0049] In the ring frame positioning process, the ring frame 14 is positioned so that the holding surface (upper surface of the holding plate 32) of the chuck table 30 protrudes from the ring frame 14, and the ring frame 14 is brought close to a holding member 50 that is interposed between the upper surface (first surface) 141 and the lower surface (second surface) 142 of the ring frame 14 and is arranged to correspond to the side surface (third surface) 143 that intersects with the upper surface (first surface) 141 and the lower surface (second surface) 142.

[0050] In the ring frame holding step, a suction source 54 communicating with the internal space 51 sucks fluid from the internal space 51 to contract the hollow portion 52, thereby holding the ring frame 14 positioned in the ring frame positioning step.

[0051] In the processing step, the semiconductor wafer 11 of the frame unit 10 held in the ring frame holding step is processed (for example, cut by the cutting blade 60).

[0052] Second Embodiment 4A and 4B are cross-sectional views corresponding to FIGS. 2A and 2B, showing an example of the configuration of the holding device 20 of the second embodiment. The same (common) parts as those of the first embodiment are denoted by the same reference numerals, and redundant explanations will be omitted.

[0053] In the first embodiment, the holding member 50 contacts the upper surface (first surface) 141, the lower surface (second surface) 142, and the side surface (third surface) 143 of the ring frame 14, sandwiching (holding) these surfaces from three directions. In contrast, in the second embodiment, the holding member 50 does not contact the upper surface (first surface) 141 of the ring frame 14, but contacts the lower surface (second surface) 142 and the side surface (third surface) 143 of the ring frame 14, thereby holding the ring frame 14. In this way, it is sufficient for the holding member 50 to be in contact with at least the side surface (third surface) 143 of the ring frame 14.

[0054] <Third embodiment> 5A and 5B are top views showing an example of the configuration of the holding device 70 of the third embodiment. Fig. 5A illustrates a holding device 70 in which sets of contact portions 80 and holding members 90, which will be described later, are formed around the entire circumference of the holding device 70, while Fig. 5B illustrates a holding device 70 in which sets of contact portions 80 and holding members 90, which will be described later, are formed intermittently in the circumferential direction of the holding device 70.

[0055] Figures 6A and 6B are cross-sectional views showing an example of the configuration of the holding device 70 of the third embodiment, taken along line VI-VI in Figures 5A and 5B. Figure 6A illustrates the holding device 70 in a state where it is positioned directly below the workpiece (frame unit) 10 without holding it, and Figure 6B illustrates the holding device 70 in a state where it holds the workpiece (frame unit) 10.

[0056] The holding device 70 has a main body 71 on which a set of a contact portion 80 and a holding member 90 (described later) is formed (or which holds the set). In the example of FIG. 5A, the main body 71 has a circular disk shape when viewed from above. In the example of FIG. 5B, the main body 71 has a substantially X-shape with two arms that are perpendicular to each other when viewed from above. The holding device 70 (main body 71) is provided so as to be movable in the horizontal and vertical directions in FIGS. 6A and 6B.

[0057] The holding device 70 has a function of picking up and transporting the work (frame unit) 10 (the holding device may be read as a transport device).

[0058] On the underside of the main body 71, contact portions 80 and retaining members 90 are formed in this order from the inner diameter side (inside) to the outer diameter side (outside). Fig. 6A illustrates sets of contact portions 80 and retaining members 90 formed around the entire outer circumference of the underside of the main body 71. Fig. 6B illustrates sets of contact portions 80 and retaining members 90 formed intermittently in the circumferential direction of the outer side of the underside of the main body 71. In Fig. 6B, sets of four contact portions 80 located on the inner diameter side (inside) and four retaining members 90 located on the outer diameter side (outside) are provided at approximately 90° intervals in the circumferential direction of the outer side of the underside of the main body 71 (the circumferential positions of each of the four contact portions 80 and retaining members 90 correspond (match)).

[0059] The contact portion 80 located on the inner diameter side (inside) of the lower surface of the main body portion 71 has the function of holding the ring frame 14 in a position-restricted state in contact with the upper surface of the inner diameter side. The holding member 90 located on the outer diameter side (outside) of the lower surface of the main body portion 71 has the function of holding the upper surface (first surface) 141, lower surface (second surface) 142, and side surface (third surface) 143 of the outer diameter side of the ring frame 14 in a position-restricted state by the contact portion 80.

[0060] 6A and 6B, holding member 90 has hollow portion 92 made of an elastic body and including internal space 91, and powder 93 accommodated in internal space 91 of hollow portion 92. More specifically, internal space 91 of hollow portion 92 is sealed so as to be airtight except for a portion connected to suction source 94, and is filled with powder 93 and a fluid (e.g., air).

[0061] Furthermore, a suction source 94 is in communication with the internal space 91 of the hollow portion 92, and the suction source 94 can suck (eg, vacuum) a fluid (eg, air) from the internal space 91 of the hollow portion 92.

[0062] The powder 93 is an aggregate of many particles of a certain size, such as sand or powder, and when the density of the particles contained therein is lower than a certain threshold (for example, when the fluid is not being sucked by the suction source 94), the powder behaves like a fluid, but when the density is higher than that threshold (for example, when the fluid is being sucked by the suction source 94), the powder behaves like a solid. This change in state due to density can be called a jamming transition, and various critical properties are observed near the transition point.

[0063] The hollow portion 92 has elasticity that allows it to maintain a constant shape, i.e., an internal space 91 having a generally rectangular (box-shaped) cross section as shown in Fig. 6A, when the suction source 94 is not sucking in the fluid. On the other hand, when the hollow portion 92 approaches the ring frame 14 in the vertical direction and is crushed by the upper surface (first surface) 141, the internal space 91 having a generally rectangular (box-shaped) cross section as shown in Fig. 6A is easily (flexibly) deformed, and as shown in Fig. 6B, it comes into contact with the upper surface (first surface) 141, the lower surface (second surface) 142, and the side surface (third surface) 143 of the ring frame 14, sandwiching (clamping) and holding them from three directions. Then, when the suction source 94 sucks in the fluid in the sandwiched (clamped) state, the density of the powder 93 contained in the internal space 91 of the hollow portion 92 increases, and the ring frame 14 is held by utilizing the jamming transition phenomenon (frictional force).

[0064] 6B, the holding member 90, which has sucked the fluid from the internal space 91 of the hollow portion 92, is in contact with the upper surface (first surface) 141, the lower surface (second surface) 142, and the side surface (third surface) 143 of the ring frame 14, but it is sufficient that the holding member 90 is in contact with at least the side surface (third surface) 143 of the ring frame 14. In other words, it is sufficient that the hollow portion 92, which has been crushed and deformed by the ring frame 14, can wrap around to the side surface (third surface) 143 of the ring frame 14.

[0065] Here, the holding surfaces of the ring frame 14 (for example, the upper surface 141, the lower surface 142, and the side surfaces 143) may have shapes such as unevenness (for example, gate marks) or grooves (for example, grooves for tape cutting). In this regard, according to the present embodiment, which utilizes the jamming transfer phenomenon (frictional force), the holding member 90 is easily (flexibly) deformed so as to follow the holding surfaces of the ring frame 14, and then the holding member 90 is hardened by fluid suction (for example, vacuum pulling) using a suction source 94, thereby making it possible to hold the ring frame 14 in an appropriate manner.

[0066] Furthermore, even if there are some individual differences or variations in the shape and dimensions of the ring frame 14, these can be absorbed, and the ring frame 14 and therefore the frame unit 10 can be held with high stability and reliability (to put it in extreme terms, all that is required is to abut the corners of the top surface 141 and side surface 143 of the ring frame 14, which are brought close together in the vertical direction, against somewhere in the hollow portion 92 of the holding member 90).

[0067] Furthermore, on the inner diameter side (inside) of the holding member 90, the contact portion 80 contacts the contacted surface, which is the upper surface (first surface) 141 of the ring frame 14, and regulates the position of the contacted surface. This, coupled with (cooperating with) the holding of the ring frame 14 by the holding member 50 utilizing the jamming transfer phenomenon (frictional force), enables more suitable holding of the ring frame 14.

[0068] The contact portion 80 may contact at least one of the upper surface (first surface) 141 and the lower surface (second surface) 142 of the ring frame 14 to determine the position of the contact surface. For example, the contact portion 80 may regulate the position of the ring frame 14 by sandwiching the upper surface (first surface) 141 and the lower surface (second surface) 142 of the ring frame 14 from above and below.

[0069] <Fourth embodiment> 7A and 7B are cross-sectional views corresponding to FIGS. 6A and 6B, showing an example of the configuration of a holding device 70 according to a fourth embodiment. The same (common) parts as those in the third embodiment are denoted by the same reference numerals, and redundant explanations will be omitted.

[0070] In the third embodiment, the holding member 90 contacts the upper surface (first surface) 141, the lower surface (second surface) 142, and the side surface (third surface) 143 of the ring frame 14, sandwiching (holding) these surfaces from three directions. In contrast, in the fourth embodiment, the holding member 90 does not contact the lower surface (second surface) 142 of the ring frame 14, but contacts the upper surface (first surface) 141 and the side surface (third surface) 143 of the ring frame 14, thereby holding the ring frame 14. In this way, it is sufficient for the holding member 90 to be in contact with at least the side surface (third surface) 143 of the ring frame 14.

[0071] Fifth Embodiment 8A, 8B, and 8C are cross-sectional views showing an example of the configuration of the holding device 20 of the fifth embodiment. 8A to 8C show variations in the shape of the holding member 50 when the suction source is not sucking the fluid (so-called free state). There is a degree of freedom in the shape and size of the hollow portion 52 of the holding member 50 and the internal space 51 formed in the hollow portion 52, and various design changes are possible (as long as the workpiece can be held using the jamming transition phenomenon (frictional force)).

[0072] 8A, holding member 50 has hollow portion 52 having an outer shape obtained by inverting a generally L-shape in the left-right direction, and internal space 51 having a cross-sectional shape obtained by inverting a generally L-shape in the left-right direction is formed inside hollow portion 52, and powder 53 is accommodated in internal space 51. The outer shape of hollow portion 52 and the cross-sectional shape of internal space 51 are generally similar to each other.

[0073] 8B, holding member 50 has hollow portion 52 having an outer shape obtained by inverting a generally L-shape in the vertical and horizontal directions, and internal space 51 having a cross-sectional shape obtained by inverting a generally L-shape in the vertical and horizontal directions is formed inside hollow portion 52, and powder 53 is accommodated in internal space 51. The outer shape of hollow portion 52 and the cross-sectional shape of internal space 51 are generally similar to each other.

[0074] 8C, holding member 50 has hollow portion 52 having an outer shape obtained by inverting a generally L-shape in the vertical and horizontal directions (the outer shape of hollow portion 52 itself is the same as that in FIG. 8B). Inside hollow portion 52, internal space 51 having a generally rectangular cross section is formed, and powder 53 is accommodated in internal space 51.

[0075] Sixth Embodiment 9A and 9B are cross-sectional views corresponding to FIGS. 2A and 2B, showing an example of the configuration of the holding device 20 of the sixth embodiment. The same (common) parts as those of the first embodiment are denoted by the same reference numerals, and redundant explanations will be omitted.

[0076] In the sixth embodiment, a laser irradiation unit 64 is provided as a processing device for the semiconductor wafer 11 of the frame unit 10 held in the ring frame holding process, instead of the cutting blade 60. The holding device 20 is provided in a processing device that processes the semiconductor wafer 11 held on the chuck table 30 with a laser beam from the laser irradiation unit 64 (the holding device can also be read as the processing device).

[0077] Seventh Embodiment 10A and 10B are cross-sectional views showing an example of the configuration of the holding device 20 of the seventh embodiment.

[0078] For example, in the above-described first to sixth embodiments, the "third surface that is interposed between the first and second surfaces and intersects with the first and second surfaces" of the ring frame (work) 14 is set as the outer peripheral side surface (side surface 143 that connects the outer peripheral edges of the upper surface 141 and the lower surface 142) of the ring frame (work) 14. In contrast to this, the seventh embodiment shows another setting example of the "third surface" of the ring frame (work) 14.

[0079] In FIG. 10A, a through hole 144 is formed in the ring frame (workpiece) 14. The inner peripheral side surface of the through hole 144 is defined as the "third surface." In Fig. 10A, the holding member 50, which is simply drawn, enters the through hole 144 of the ring frame (work) 14 and is in contact with the upper surface (first surface) 141, the lower surface (second surface) 142, and the inner peripheral side surface (third surface) of the through hole 144.

[0080] 10B, a bottomed hole 145 is formed in the lower surface 142 of the ring frame (work) 14, and the inner peripheral side surface of this bottomed hole 145 is referred to as the "third surface." In FIG. 10B, a holding member 50, simply depicted, enters the bottomed hole 145 of the ring frame (work) 14 and contacts the lower surface (second surface) 142 and the inner peripheral side surface (third surface) of the bottomed hole 145. Although not depicted in FIG. 10B, the bottomed hole 145 may be formed in the upper surface 141 of the ring frame (work) 14, and the holding member 50 may enter the bottomed hole 145 of the ring frame (work) 14 and contact the upper surface (first surface) 141 and the inner peripheral side surface (third surface) of the bottomed hole 145.

[0081] <Variation 1> In the above embodiment, the holding device has been described as being applied to a workpiece transport device, processing device, or the like. Examples of workpiece transport devices have been described as using a chuck table or a turntable, and examples have been described as using a transport arm. Examples of workpiece processing devices have been described as using a cutting blade such as a dicer to cut a workpiece, and using a laser beam to process a workpiece. However, the application of the holding device of this embodiment is not limited to these, and it can also be applied to a grinder for framed workpieces. For example, in a grinding step in which the back surface of a wafer is ground to a predetermined thickness, the holding device of this embodiment may hold a ring frame and pull the ring frame downward so that the ring frame does not get in the way during the wafer grinding step.

[0082] <Variation 2> A detection device (detection mechanism) such as a proximity sensor or fiber sensor may be provided at any position of the holding device 20, 70, for example, at the contact portion (position control portion) 40, 80 and / or its base portion, so that the detection device can detect (grasp) whether or not the holding device 20, 70 (holding member 50, 90) is performing a holding operation, and whether or not the workpiece (frame unit) 10 is being held by the holding device 20, 70 (holding member 50, 90).

[0083] <Variation 3> 2 to 4 and 6 to 10, the thickness (cross-sectional thickness) of the hollow elastic body is primarily constant. However, the deformation of the hollow elastic body may be controlled by providing portions with larger (thicker) and smaller (thinner) thicknesses (cross-sectional thicknesses) in the hollow elastic body. For example, the outer peripheral portion of the hollow elastic body may be thicker to suppress outward deformation, or the inner peripheral portion may be thicker to enhance the elasticity of the rubber. Furthermore, the thickness (cross-sectional thickness) of the hollow elastic body at the portion that comes into contact with the workpiece and is crushed may be locally reduced (thinned) to promote elastic deformation originating from the contact point of the workpiece.

[0084] <Variation 4> 1B (first embodiment) described above exemplifies a case where four sets of contact portions 40 and holding members 50 are provided in the circumferential direction of the holding device 20 (four holding portions). Also, FIG. 5B (third embodiment) described above exemplifies a case where four sets of contact portions 80 and holding members 90 are provided in the circumferential direction of the holding device 70 (four holding portions). However, it is sufficient that at least two sets of contact portions and holding members are provided in the circumferential direction of the holding device (two or more holding portions).

[0085] The holding device and holding method of this embodiment relate to, for example, a work frame holding technology (fixing technology) using jamming transfer (friction force). The holding device of this embodiment is a holding device for holding a workpiece including a plate-shaped semiconductor wafer having a first surface, a second surface opposite to the first surface, and a third surface interposed between the first surface and the second surface and intersecting the first surface and the second surface, and includes a holding member made of an elastic body and having a hollow portion including an internal space and powder contained in the internal space, and a suction source communicating with the internal space and sucking a fluid from the internal space, and the holding member, which has sucked the fluid from the internal space, comes into contact with at least the third surface of the workpiece.

[0086] This makes it possible to achieve suitable holding regardless of the shapes of the workpiece or frame. For example, assuming that the workpiece is a frame unit in which a semiconductor wafer is fixed to a ring frame via tape, even if the surface of the ring frame has irregularities, grooves, or other shapes, the ring frame and therefore the frame unit can be held with high stability and reliability. Furthermore, even if there are some individual differences and variations in the shape and dimensions of the ring frame, these can be absorbed, and the ring frame and therefore the frame unit can be held with high stability and reliability.

[0087] The embodiments of the present invention are not limited to the above-described embodiments and modifications, and may be variously changed, substituted, or modified without departing from the spirit of the technical idea of ​​the present invention. Furthermore, if the technical idea of ​​the present invention can be realized in a different way due to technological advances or other derived technologies, it may be implemented using that method. Therefore, the claims cover all embodiments that may fall within the scope of the technical idea of ​​the present invention. [Industrial Applicability]

[0088] As described above, the present invention can be applied to, for example, a holding device and a holding method for holding a frame unit in which a semiconductor wafer is fixed to a ring frame via tape. [Explanation of symbols]

[0089] 10 110 120: Work (frame unit) 11 111 121: Semiconductor wafer (work) 13 113 123: Tape 14 114 124: Ring frame (work) 141:Top surface (first surface) 142: Bottom surface (second surface) 143: Side (3rd side) 144: Through hole (3rd surface) 145: Bottomed hole (3rd side) 20: Holding device 30: Chuck table 32: Holding plate (holding surface) 40: Contact part (position control part) 50: Holding member 51: Interior space 52:Hollow part 53: Powder 54: Suction source 60: Cutting blade 64: Laser irradiation section 70: Holding device 80: Contact part (position control part) 90: Holding member 91: Interior space 92:Hollow part 93: Powder 94 :Suction source

Claims

1. A holding device for holding a workpiece including a plate-shaped wafer having a first surface, a second surface opposite to the first surface, and a third surface interposed between the first surface and the second surface and intersecting the first surface and the second surface, a holding member made of an elastic body and having a hollow portion including an internal space and powder contained in the internal space; a suction source communicating with the internal space and configured to suck fluid from the internal space; Equipped with The holding member, from which the fluid has been sucked out of the internal space, comes into contact with at least the third surface of the workpiece. A holding device characterized by:

2. the holding device includes a contact portion that contacts a contact surface, which is at least one of the first surface and the second surface, to define a position of the contact surface; 2. The holding device according to claim 1.

3. the workpiece is a frame unit in which the wafer is fixed to a ring frame via a tape, the holding device further includes a chuck table that holds the wafer on a holding surface of the frame unit, the holding member contacts the ring frame of the frame unit and holds the ring frame so that the holding surface protrudes from the ring frame.

3. The holding device according to claim 1 or 2.

4. the workpiece is a frame unit in which the wafer is fixed to a ring frame via a tape, the holding device further includes a chuck table that holds the wafer on a holding surface of the frame unit, The holding device is provided in a processing device that processes the wafer held on the chuck table with a laser beam or a rotating cutting blade.

3. The holding device according to claim 1 or 2.

5. a workpiece holding step of holding the workpiece of the frame unit, in which the workpiece is fixed to the ring frame via a tape, on a holding surface of a chuck table directly or via the tape; a ring frame positioning step of positioning the ring frame so that the holding surface protrudes from the ring frame, and bringing the ring frame close to a holding member that is interposed between the first surface and the second surface of the ring frame and is provided so as to correspond to a third surface that intersects with the first surface and the second surface; Equipped with The holding member is made of an elastic body, and includes a plurality of holding members each having a hollow portion with an internal space and powder contained in the internal space; a ring frame holding step of sucking fluid from the internal space by a suction source communicating with the internal space to shrink the hollow portion and hold the ring frame positioned in the ring frame positioning step; a processing step of processing the workpiece of the frame unit held in the ring frame holding step; The holding method further comprises:

6. The ring frame is made of resin.

6. The holding method according to claim 5.

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