Method, system and device for passively holding printing substrates on a printing belt

Abstract

A method, system, and apparatus for passively holding a print substrate on a print transport belt is disclosed.SOLUTION: In some embodiments, the bonding device is disposed above the printing conveyor belt. The device adheres and / or bonds to the printing material on the upper side and adheres and / or bonds to the print carrier belt on the lower side. The device has a plurality of first adhesive elements on the upper side, which are designed to adhere to the printing material. In some embodiments, the lower surface is configured to be adhered and / or coupled to the transport belt by a plurality of second adhesive elements. In some embodiments, the adhesive elements are concave discs and / or convex protrusions configured to apply a force (e.g., suction, friction, electrostatic, van der Waals, etc.) to the substrate and / or the transport belt.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] (Related Applications) This specification relates generally to inkjet and analog printing, and in particular to transporting substrates on continuous belt machines. [Background technology]

[0002] In most inkjet and analog printing processes, the substrate (e.g., fabric, cardboard, paper, tile) is transported through the print area on a conveyor belt, where ink or dye is applied to the substrate. In conventional print conveyor systems, vacuum mechanisms or adhesives are often used to bond the substrate to the conveyor belt. However, vacuum mechanisms consume a lot of energy, occupy a lot of space, generate noise, create significant friction on the conveyor belt, and can cause print defects. Adhesive solutions are generally not food-grade compatible, are not environmentally friendly, are difficult to remove, can damage certain substrates, and typically lose their retention properties over time. Therefore, a solution is needed to overcome some of the deficiencies of conventional conveyor belt systems. [Brief explanation of the drawings]

[0003] [Figure 1] 1 illustrates a perspective view of a printing system according to one or more embodiments. [Figure 2] FIG. 1 illustrates a side view of a printing system including a printer head and a light / heat source, according to one or more embodiments. [Figure 3] FIG. 1 illustrates a top view of a passive support system for continuous belt printing according to one or more embodiments. [Figure 4A] 4A-4H are illustrations of various examples of adhesive devices and adhesive elements, according to one or more embodiments. [Figure 4B] 4A-4H are illustrations of various examples of adhesive devices and adhesive elements, according to one or more embodiments. [Figure 4C]4A-4H are illustrations of various examples of adhesive devices and adhesive elements, according to one or more embodiments. [Figure 4D] 4A-4H are illustrations of various examples of adhesive devices and adhesive elements, according to one or more embodiments. [Figure 4E] 4A-4H are illustrations of various examples of adhesive devices and adhesive elements, according to one or more embodiments. [Figure 4F] 4A-4H are illustrations of various examples of adhesive devices and adhesive elements, according to one or more embodiments. [Figure 4G] 4A-4H are illustrations of various examples of adhesive devices and adhesive elements, according to one or more embodiments. [Figure 4H] 4A-4H are illustrations of various examples of adhesive devices and adhesive elements, according to one or more embodiments. [Figure 5] FIG. 1 is a perspective view of a printing system according to one or more embodiments. [Figure 6] FIG. 1 is a flow diagram illustrating a method of operation of a passive support system according to one or more embodiments. [Figure 7] FIG. 1 is a block diagram illustrating a computer system in accordance with one or more embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0004] Disclosed are methods, systems, and devices for passively holding a substrate on a print transport belt. For example, in some embodiments, an adhesive device (e.g., a layer, film, mat, etc.) is disposed on the print transport belt. The device adheres and / or bonds to the substrate on a first side of the device (e.g., the top surface of the device) and adheres and / or bonds to the print transport belt on a second side of the device (e.g., the bottom surface of the device). The device includes a first plurality of adhesive elements on the first side configured to adhere to the substrate. The second side of the device is configured to adhere and / or bond to the transport belt by a second plurality of adhesive elements. In some embodiments, the second side is adhered and / or bonded to the transport belt by an adhesive coating, such as a glue or other bonding compound. Once the substrate is adhered / bonded to the first side of the device and the device is adhered / bonded to a conveyor, the conveyor transports the substrate to a print zone where the printing process proceeds (e.g., ink can be deposited on the substrate in the print zone). In some embodiments, the substrate is removed after reaching / passing the print zone, and the portion of the apparatus to which the substrate was attached is cleaned and dried, so that the cleaned / dried portion of the apparatus is ready to receive another substrate, and the transport process is repeated.

[0005] In some embodiments, the adhesive element is configured to apply one or more of suction, friction, pressure, electrostatic, van der Waals, or additional forces to the substrate and / or the transport belt. Thus, the adhesive element is configured to couple the substrate and / or the transport belt to the device. In some embodiments, the adhesive element can be a concave disk (e.g., suction cup / microcup) disposed on top of the adhesive device, and / or in some embodiments, a concave shape on the top surface of the adhesive device. In this application, the term "concave disk" refers to a disk that curves inward toward the centerline of the adhesive device, with the tip of the curved shape closest to the centerline of the device. In some embodiments, the adhesive element is a convex protrusion (e.g., bump / microbump). In this application, the term "convex protrusion" refers to a protrusion that curves outward from the centerline of the adhesive device, with the tip of the curved shape closest to the centerline of the device.

[0006] The advantages and benefits of the presently disclosed technology include providing a passive conveyor retention system that can securely and effectively hold a substrate in place during printing without the use of noisy, energy-intensive vacuum mechanisms or environmentally unfriendly, food-incompatible adhesive solutions. Unlike many conventional conveyor technologies, the presently disclosed technology can be used with a wide variety of substrates and inks without the risk of substrate damage or print defects due to the vacuum effect on the ink. Furthermore, the presently disclosed technology can reduce the physical footprint of industrial printing processes by requiring much less physical space (and machines) than many conventional conveyor technologies.

[0007] Additionally, the technology disclosed herein significantly reduces the electrical load requirements of industrial-scale printing processes, reducing the electrical load on power plants compared to traditional vacuum mechanisms and ultimately reducing greenhouse gas emissions from those plants. Additionally, the technology disclosed herein reduces material waste because it does not need to be replaced as frequently as traditional conveyor solutions. In some embodiments, the technology disclosed herein includes a cleaning and drying mechanism for the bonding device, which extends the device's operational life and retention, and further reduces material waste.

[0008] These and other aspects, features, and implementations may be expressed as methods, apparatus, systems, components, program products, means or steps for performing a function, and in other ways. These aspects, features, and implementations will become apparent from the following description, including the claims.

[0009] In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the present embodiments. However, it will be apparent that the present embodiments may be practiced without these specific details.

[0010] FIG. 1 illustrates a perspective view of a printing system 100 according to one or more embodiments. The printing system 100 includes a printer head 106, at least one light and / or heat source 112, and a substrate transport system 102. Embodiments may include various combinations of these and other components (e.g., a dryer). For example, the light source / heat source 112 may be present in some embodiments but not others. As another example, a dryer or fusing unit may be included if the image 110 is not immediately transferred to the substrate. The substrate transport system 102 may include a belt, actuator, pulleys, etc. for moving the substrate. While the printing system 100 of FIG. 1 may include a transfer belt, other means for transporting and / or holding the substrate or transfer material 104, such as a rotating platform or a stationary bed, may also be used.

[0011] The printer head 106 is configured to deposit ink onto a substrate or transfer material 104 in the form of an image 110. The transfer material 104 (also called a former material) is flexible, allowing the image 110 to be transferred to substrates with complex shapes. For example, the transfer material 104 may be a rubber former, a thermoformable material, or the like. In some embodiments, the printer head 106 is an inkjet printer head that jets ink onto the substrate or transfer material 104 using, for example, piezoelectric nozzles. In some embodiments, the ink is a water-based energy-curable ink or a solvent-based energy-curable ink. However, other inks, such as solid energy, e.g., UV-curable inks, may also be used. The ink can be deposited in various forms, such as ink droplets or colored polyester ribbons.

[0012] In some embodiments, one or more light and / or heat sources 112 cure some or all of the ink deposited on the substrate or transfer material 104 by UV radiation, hot air radiation, or contact between the transfer material 104 and a heated surface. The light / heat sources 112 may be, for example, ultraviolet fluorescent lamps, ultraviolet light-emitting diodes (LEDs), low-pressure (e.g., mercury (Hg)) lamps, excimer (excimer) lamps and / or lasers, hot air sources, and / or infrared (IR) lamps. Various combinations of these and other light / heat sources could also be used. For example, the printing system 100 could include a low-pressure Hg lamp and ultraviolet LEDs. As described in more detail with reference to FIG. 2, the light / heat sources 112 may be configured to emit specific subtypes of ultraviolet radiation.

[0013] The printer head 106 and light / heat source 112 are shown directly adjacent to one another, i.e., adjacent with no intervening components. However, additional components may be present to aid in printing, curing, etc. For example, multiple different light / heat sources 112 may be positioned after the printer head 106. Figure 1 illustrates one possible order in which components may be arranged to print an image 110 onto a substrate or transfer material 104. Other embodiments are contemplated in which additional components are positioned before, between, or after the illustrated components.

[0014] In some embodiments, one or more of the aforementioned components are housed within one or more carriages. For example, the print head 106 can be housed within the print carriage 108, and the light / heat source 112 can be housed within the curing carriage / frame / body 114. In addition to protecting the components from damage, the carriage / frame / body 114 provides other benefits. For example, the curing carriage / frame / body 114 can limit the area of ​​the transfer material 104 and image 110 exposed during the curing process. The printing system 100 may include any combination of pulleys, motors, rails, and / or mechanical or electrical technology that allows the carriage / frame / body to move along the substrate transport system (e.g., the transfer belt 102), i.e., relative to the substrate or transfer material 104. The transfer belt 102 is attached to a vacuum table 120 and moves over a vacuum platen 122 that rests on the vacuum table 120. In alternative embodiments, the carriage may be fixedly mounted to a rail or base of the printing system 100. In these embodiments, the transfer material 104 may be moved relative to the printer head 106, light / heat source 112, etc., thereby depositing ink onto the transfer material 104.

[0015] In various embodiments, some or all of the components are controlled by a computer system 116, which may be the same as or similar to computer system 700 shown and described in more detail with reference to Figure 7. Computer system 116 allows a user to input printing instructions and information, change print settings, and modify the printing process, for example, by changing curing settings.

[0016] FIG. 2 shows a side view of a printing system 200 including a printer head 202 and a light / heat source 204 according to one or more embodiments. While a single-pass configuration is shown in FIG. 2, other embodiments may employ a multi-pass, or scanning, configuration. Similarly, the embodiments can be adapted for various printers, such as flatbed printers, drum printers, or lane printers. For example, a flatbed printer may include a stable bed, a traversing printer head, a stable printer head and a traversing bed, etc. The substrate transport system is attached to a vacuum table 120 and travels over a vacuum platen 122 that rests on the vacuum table 120.

[0017] The printer head 202 can include separate ink / color drums, such as cyan, magenta, yellow, and black (CMYK), or color polyester ribbons that are applied to the surface of the transfer material 206. Path A represents the media feed direction, i.e., the direction the substrate or transfer material 206 moves during the printing process. Path D represents the distance between the printer head 202 and the surface of the transfer material 206.

[0018] As mentioned above, both direct and indirect printing have traditionally been performed only on flat surfaces. However, the printing systems and methods described herein enable printing images on complex shapes, i.e., non-flat surfaces, by applying ink directly to a substrate or transfer material 206 and then transferring the ink to a subsequent substrate. When printing directly onto a surface, print quality depends on the accuracy of ink drop placement. Therefore, it is necessary to maintain a constant or nearly constant distance between the printer head 202 and the flat surface of the transfer material 206. Air currents, velocity fluctuations, and the like can affect ink drop placement even when the distance changes are small, e.g., by a few millimeters.

[0019] In some embodiments, the light / heat source 204 cures some or all of the ink 208 deposited by the printer head 202 on the substrate or transfer material 206. The light / heat source 204 may be configured to emit UV electromagnetic radiation of wavelengths of subtype V (UVV), subtype A (UVA), subtype B (UVB), subtype C (UVC), or any combination thereof. Generally, UVV wavelengths are measured in the range of 395 nanometers (nm) to 445 nm, UVA wavelengths are measured in the range of 315 nm to 395 nm, UVB wavelengths are measured in the range of 280 nm to 315 nm, and UVC wavelengths are measured in the range of 100 nm to 280 nm. However, one skilled in the art will recognize that these ranges may be somewhat adjustable. For example, in some embodiments, a wavelength of 285 nm may be characterized as UVC.

[0020] The light / heat source 204 may be, for example, a fluorescent lamp, a light-emitting diode (LED), a low-pressure (e.g., mercury (Hg)) bulb, an excimer lamp / laser, a hot air source, and / or an infrared (IR) lamp. In some embodiments, a combination of different light / heat sources could be used. Generally, the light / heat source 204 is selected so that the curing temperature does not exceed the temperature at which the ink 208 begins to sublimate. For example, the light / heat source 204 in FIG. 2 could be a UV LED lamp, which generates little heat and can be used with a wide variety of printers. UV LED lamps offer low power consumption, long life, and predictable output.

[0021] Other curing processes, such as epoxy (resin) chemistry, flash curing, and electron beam techniques, may also be used. Those skilled in the art will appreciate that various curing processes utilizing specific time frames, intensities, speeds, etc., may be employed. The intensity may increase or decrease linearly or nonlinearly (e.g., exponentially, logarithmically). In some embodiments, the intensity may be varied using a variable resistor, or, in the case of an LED light source, by applying a pulse-width modulated (PWM) signal to the diode.

[0022] 3 shows a top view of a passive support system 300 for continuous belt printing, according to one or more embodiments. In some embodiments, the passive support system 300 includes the printing system 100 of FIG. 1, the printing system 200 of FIG. 2, and / or the printing system 500 of FIG. 5.

[0023] The passive retention system 300 includes an adhesive device 302 (e.g., an adhesive layer, film, mat, or sheet) having a plurality of adhesive elements 304 disposed on an upper surface (e.g., a first surface) of the adhesive device 302. A lower surface (e.g., a second surface) of the adhesive device 302 is configured to couple to an upper surface 305 of a print transport belt 306, with the adhesive device 302 disposed on top of the transport belt 306. The transport belt 306 is configured to transport the substrate 308 to the print zone 310 as part of the printing process so that the substrate 308 can receive ink in the print zone 310. In some embodiments, the adhesive device 302 further includes a plurality of adhesive subsections 302a, 302b. Each subsection 302a, 302b includes a plurality of adhesive elements 304. In some embodiments, the adhesive device 302 is integrated with the transport belt 306 such that the upper surface 305 of the transport belt 306 includes the adhesive device 302.

[0024] The plurality of adhesive elements 304 are configured to couple (e.g., adhere, hold, attach, secure) the substrate 308 to the upper surface of the bonding device 302. As described in more detail in FIGS. 4A-4H , the plurality of adhesive elements 304 are configured to passively adhere the substrate 308 to the bonding device 302 by one or more of suction, friction, pressure, electrostatic, van der Waals forces, and / or other passive bonding mechanisms. In other words, the plurality of adhesive elements 304 are configured to securely hold the substrate 308 in place as the transport belt 306 transports the substrate 308 to the print zone 310 without requiring an external energy source or moving parts to maintain and / or create adhesive forces / mechanisms between the substrate 308 and the adhesive elements 304.

[0025] 4A-4H illustrate various examples of adhesive devices and adhesive elements according to one or more embodiments. FIG. 4A illustrates an adhesive device 402a including a plurality of adhesive elements 408a on one side 404a of the device 402a. For example, in some embodiments, the plurality of adhesive elements 408a include convex protrusions that form at least a portion of and / or are disposed on the top surface 404a of the device 402a. The convex protrusions are configured to bond to the printed substrate by providing one or more of suction, friction, pressure, electrostatic, van der Waals forces, and other bonding mechanisms to the printed substrate.

[0026] The bottom surface 406a is configured to bond to a transport belt. In some embodiments, an adhesive coating 410a (e.g., an adhesive or other bonding compound) is applied to and / or forms the bottom surface 406a. The adhesive coating 410a is configured to hold and / or bond the adhesive device 402a to the transport belt.

[0027] In some embodiments, adhesive device 402a includes an intermediate layer 403a that provides a boundary separating top surface 404a and bottom surface 406a. Intermediate layer 403a also provides physical support for a plurality of adhesive elements 408a and provides a surface onto which adhesive coating 410a is applied. In some embodiments, intermediate layer 403a is omitted from device 402a, and the upper portion of bottom surface 406a directly contacts and / or supports the lower portion of top surface 404a.

[0028] FIG. 4B illustrates an adhesive device 402b including multiple adhesive elements 408b and 410b on two side surfaces 404b and 406b. Similar to the adhesive elements of FIG. 4A, in some embodiments, the multiple adhesive elements 408b and 410b include protruding protrusions. For example, the device 402b includes a first plurality of protruding protrusions 408b formed / disposed on at least a portion of the top surface 40. For example, the adhesive device 402b includes a second plurality of protruding protrusions 410b formed / disposed on at least a portion of the bottom surface 406b opposite the top surface 404b, as shown in FIG. 4b. The first plurality of protruding protrusions 408b are configured to adhere the adhesive device 402b to a printing substrate. The second plurality of protruding protrusions 410b are configured to adhere the adhesive device 402b to a printing transport belt. The first and second pluralities of convex protrusions are configured to adhere the device 402b to the printing substrate and the transport belt by providing one or more of suction, friction, pressure, electrostatic, van der Waals forces, and other bonding mechanisms. In some embodiments, the adhesive device 402b includes an intermediate layer 403b that separates the upper surface 404b from the lower surface 406b and physically supports the first and second pluralities of adhesive elements 408b and 410b. In some embodiments, the intermediate layer 403b is omitted, and the upper surface 404b and the lower surface 406b directly contact each other.

[0029] Figure 4C illustrates an adhesive device 402c having a plurality of adhesive elements 408c formed / disposed on at least a portion of a first surface 404c of the device 402c. Each component illustrated in Figure 4C is identical to or generally similar to the corresponding component described in connection with the adhesive device 402a with reference to Figure 4A, except that the adhesive elements 408c comprise concave disks.

[0030] 4D illustrates an adhesive device 402d that includes a plurality of adhesive elements 408d and 410d formed / disposed on at least a portion of a first surface 404d (e.g., a first plurality of adhesive elements 408d) and at least a portion of a second surface 406d (e.g., a second plurality of adhesive elements 410d) of the device 402d. Each component illustrated in FIG. 4D is identical to or generally similar to the corresponding component described in connection with adhesive device 402b with reference to FIG. 4B, except that the plurality of adhesive elements 408d and 410d comprise concave disks.

[0031] Figure 4E illustrates an adhesive device 402e with a plurality of adhesive elements 408e formed / disposed on at least a portion of a first surface 404e of the device 402e. Each component illustrated in Figure 4E is identical to or generally similar to the corresponding component described in connection with adhesive device 402c with reference to Figure 4C, except that the adhesive elements 408c are recessed into at least a portion of the first side 404e and an intermediate layer is omitted from the device 402e such that the first side 404e and second side 406e contact each other.

[0032] Figure 4F shows an adhesive device 402f including a plurality of adhesive elements 408f and 410f, each recessed on a respective side of the adhesive device 402f. For example, a first plurality of adhesive elements 408f are recessed on a first side 404f, and a second plurality of adhesive elements 410f are recessed on a second side 406f. Each component shown in Figure 4F is identical to or generally similar to the corresponding component described in connection with adhesive device 402d with reference to Figure 4D, except that the first and second plurality of adhesive elements 408f and 410f are recessed on the first and second sides 404f and 406f, and the device 402f does not include an intermediate layer.

[0033] Figure 4G illustrates an adhesive device 402g having a plurality of adhesive elements 408g formed / disposed on at least a portion of a first side 404g of the adhesive device 402g. Each component illustrated in Figure 4G is identical to or generally similar to the corresponding component described in connection with the adhesive device 402a with reference to Figure 4A, except that the adhesive elements 408g comprise a mixture of convex protrusions and concave disks.

[0034] FIG. 4H illustrates an adhesive device 402h including a plurality of adhesive elements 408h and 410h. The first plurality of adhesive elements 408h are formed / disposed on at least a portion of a first side 404h of the device 402h and include a mixture of concave discs and convex protrusions. The second plurality of adhesive elements 410h are recessed into a second side 406h of the adhesive device 402h and include concave discs. In some embodiments, one or more adhesive elements of the first and second plurality of adhesive elements 408h and 410h are stand-alone components secured to the adhesive device 402h. In some embodiments, the side / surface of the adhesive device 402h is shaped such that the first and second plurality of adhesive elements 408h and 410h are formed on the side / surface of the adhesive device. In the embodiment illustrated in FIG. 4H, the intermediate layer is omitted from the device 402h. Other than the differences noted above, each component shown in FIG. 4H is identical to or generally similar to the corresponding component described in connection with adhesive device 402f with reference to FIG. 4F.

[0035] 5 is a perspective view of a printing system 500 according to one or more embodiments. In some embodiments, printing system 500 is identical to or generally similar to printing system 100 of FIG. 1 and printing system 200 of FIG. 2. In some embodiments, a passive support system, such as passive support system 300 of FIG. 3, comprises printing system 500.

[0036] The printing system 500 includes a bonding device 502 configured with one or more bonding elements. The bonding device 502 is disposed on an upper surface of a print transport belt 506. In some embodiments, the bonding device 502 is the same as or generally similar to the bonding device 302 described in FIG. 3 and / or the bonding devices 402a-h described in FIGS. 4A-4H. In some embodiments, the printing system 500 includes a film removal component 512 configured to remove a packaging film 513 from the bonding device 502. The packaging film 513 is removed before the bonding device 502 is disposed on the transport belt 506. In some embodiments, the printing system 500 includes a pressing component 514 (e.g., a press) configured to assist in bonding a bottom surface of the bonding device 502 to the top surface of the transport belt 506. For example, the pressing component 514 can apply pressure to the bonding device 502 and the transport belt 506 to bond or bond the bottom surface of the bonding device 502 to the transport belt 506.

[0037] The transport belt 506 is configured to transport the substrate 508 to or through the print zone 510 by bonding the substrate 508 to the bonding device 502 and transporting it along the transport belt 506. In some embodiments, a second pressing component (not shown) assists in bonding the substrate 508 to the bonding device 502 by applying pressure between the substrate 508 and the top surface of the bonding device 502. In some embodiments, the same pressing component 514 is used to both attach the bonding device 502 to the transport belt 506 and the substrate 508 to the bonding device 502. In some embodiments, the substrate 508 is removed from the bonding device 502 after reaching and / or passing through the print zone 510, and the transport belt 506 transports the bonding device 502 to a washing stage 516 and a drying stage 518, before returning the bonding device 502 to receive additional substrates 508.

[0038] In some embodiments, the cleaning stage 516 includes a cleaning component configured to clean the bonding device 502. For example, the cleaning component can include a rotating brush that applies a fluid (e.g., water) to the brush and rotates so that the bristles slide across the top surface of the bonding device 502 to remove dirt, dust, ink, etc.

[0039] In some embodiments, the drying stage 518 includes a drying component configured to dry the bonding apparatus 502. For example, the drying component can include a blower / suction mechanism and / or a wiping mechanism configured to remove residual moisture from the bonding apparatus 502 after the bonding apparatus 502 has been cleaned in the cleaning stage 516.

[0040] In some embodiments, the adhesive device 502 is removed from the transport belt 506 after the substrate 508 is removed. In some embodiments, the adhesive device 502 is removed from the transport belt 506 after passing through a cleaning stage 516 and / or a drying stage 518. In some embodiments, the adhesive device 502 is removed from the transport belt 506 because the adhesive device 502 has lost its holding / adhesive properties on one or more sides (e.g., an upper side configured to bond to the substrate 508 and / or a lower side configured to bond to the transport belt 506). The adhesive device 502 is removed after being exposed to a heat source 520 (e.g., an infrared lamp). The heat source 520 is configured to weaken the attachment / securing / adhesion between the adhesive device 502 and the transport belt 506. The heat source 520 is secured / attached / adhered to a surface of the bonding device 502 and is positioned near a removal component 522 configured to rotate in a direction opposite to the travel path of the conveyor belt 506 to separate the bonding device 502 from the belt 506. In some embodiments, the removal component 522 includes a gear motor 524 configured to drive an extension bar 526 to rotate in a direction opposite to the travel path of the conveyor belt 506. The bonding device 502 is attached to the extension bar 526, and the rotation of the extension bar 526 causes the bonding device 502 to be separated from the conveyor belt 506. In some embodiments, the extension bar 526 includes a corrugated component 528 removably coupled to the extension bar 526. The corrugated component 528 is attached to the bonding device 502, and the rotation of the extension bar 526 causes the corrugated component 528 to rotate to separate the bonding device 502 from the conveyor belt 506.

[0041] 6 is a flow diagram illustrating a method 600 for operating a passive support system according to one or more embodiments. In some embodiments, the passive support system is the same as or generally similar to the passive support system 300 described with reference to FIG. 3. In some embodiments, the passive support system includes one or more of the printing system 100 of FIG. 1, the printing system 200 of FIG. 2, and the printing system 500 of FIG. 5. In some embodiments, one or more steps may be performed, at least in part, by a computer system, such as computer system 700 of FIG. 7.

[0042] In block 602, a bottom surface of an adhesive layer (e.g., an adhesive device such as those described in FIGS. 3-5) is bonded to the top surface of the print transport belt. The bottom surface of the adhesive layer includes an adhesive component, such as a plurality of adhesive elements (e.g., concave disks and / or convex protrusions), or an adhesive compound (e.g., glue, binder, etc.), that bonds the adhesive layer to the transport belt. In some embodiments, a pressing component applies pressure between the transport belt and the adhesive layer to bond the belt and the adhesive layer.

[0043] At block 604, the substrate is adhered to the top surface of the adhesive layer by a plurality of adhesive elements disposed on and / or formed on the top surface of the layer. The top surface of the adhesive layer is opposite the bottom surface of the adhesive layer. The plurality of adhesive elements on the top surface of the adhesive layer comprise convex protrusions, concave disks, mixtures, and / or additional adhesive structures. The adhesive elements are configured to provide suction, friction, pressure, electrostatic, van der Waals forces, or other bonding mechanisms to the substrate.

[0044] In block 606, the substrate is transported to the print zone by the movement of the transport belt. Because the substrate is bonded to the adhesive layer, and the adhesive layer is bonded to the transport belt, the substrate is held in relative position on the adhesive layer as the conveyor transports the adhesive layer and the substrate. In block 608, the substrate is removed from on top of the adhesive layer. The adhesive layer is then transported to and / or passes through a cleaning stage and a drying stage. In block 610, the adhesive layer is cleaned in the cleaning stage. The cleaning stage includes cleaning components (e.g., a rotating brush with wet bristles configured to remove dirt, debris, ink, etc.) configured to clean the adhesive layer. In block 612, the adhesive layer is dried in the drying stage. The drying stage includes drying components, such as a wiping mechanism and / or a blower / vacuum, configured to remove cleaning fluid residue from the adhesive layer. Once the adhesive layer is cleaned and dried, the adhesive layer is ready to receive additional substrates.

[0045] In block 614, in some embodiments, the adhesive layer is removed from the transport belt following removal of the substrate (e.g., block 608). In some embodiments, the adhesive layer is removed after a cleaning step (e.g., block 610) and / or a drying step (e.g., block 612). Removing the adhesive layer includes exposing the adhesive layer to a heat source (e.g., an infrared lamp). The heat source heats an adhesive element bonding the adhesive layer to the transport belt. In some embodiments, heating the adhesive element weakens the adhesive between the adhesive element and the transport belt. The adhesive layer is attached to a removal component configured to remove the adhesive layer from the transport belt. In some embodiments, the removal component includes a gear motor attached to a bar (e.g., a folding bar) configured to extend from the gear motor. The bar includes a cardboard component (e.g., a cardboard tube or roll attached to the bar) configured to receive the adhesive layer from the transport belt. The gear motor is configured to rotate the bar in a direction opposite to the direction of movement of the transport belt. Once the adhesive layer is bonded to the corrugated board component, a gear motor rotates the bar, which in turn rotates the corrugated board component, thereby separating the adhesive layer from the conveyor belt. In some embodiments, the corrugated board component is removably bonded to the bar so that it can be removed from the bar after the adhesive layer is removed.

[0046] Figure 7 is a block diagram illustrating a computer system 700 according to one or more embodiments. Components of exemplary computer system 700 may be used to implement systems 100, 200, 300, 400, and 500, which are shown and described in more detail with reference to Figures 1, 2, 3, and 5. At least some of the operations described with reference to Figure 6 may be implemented on computer system 700. Similarly, other embodiments may include different and / or additional components, or may be connected in different ways.

[0047] Computer system 700 may include one or more central processing units ("processors") 702, main memory 706, non-volatile memory 710, network adapter 712 (e.g., network interface), video display 718, input / output devices 720, control devices 722 (e.g., keyboard and pointing device), drive unit 724 including storage medium 726, and signal generating device 730, communicatively coupled to a bus 716. Bus 716 is illustrated as an abstraction representing one or more physical buses and / or point-to-point connections connected by appropriate bridges, adapters, or controllers. Thus, bus 716 can include a system bus, a PCI (Peripheral Component Interconnect) bus or PCI-Express bus, a HyperTransport or ISA (industry standard Architecture) bus, a SCSI (smart computer system interface) bus, a USB (universal serial bus), an IIC (I2C) bus, or an IEEE (Institute of Electrical and Electronics Engineers) standard 1394 bus (also known as "Firewire").

[0048] Computer system 700 may share a similar computer processor architecture with a desktop computer, a tablet computer, a personal digital assistant (PDA), a mobile phone, a game console, a music player, a wearable electronic device (e.g., a watch or fitness tracker), a network-connected ("smart") device (e.g., a television or home assistant device), a virtual reality / augmented reality system (e.g., a head-mounted display), or other electronic device capable of executing a series of instructions (sequential or other instructions) that specify operations to be performed by computer system 700.

[0049] Although main memory 706, non-volatile memory 710, and storage medium 726 (also referred to as a "machine-readable medium") are illustrated as a single medium, the terms "machine-readable medium" and "storage medium" should be interpreted to include a single medium or multiple media (e.g., a centralized / distributed database and / or associated cache) that store one or more sets of instructions 728. The terms "machine-readable medium" and "storage medium" should also be interpreted to include any medium that can store, encode, or retain sets of instructions executed by computer system 700.

[0050] Generally, the routines executed to implement embodiments of the present disclosure may be implemented as part of an operating system or as a specific application, component, program, object, module, or sequence of instructions (collectively referred to as a "computer program"). A computer program typically includes one or more instructions (e.g., instructions 704, 708, 728) that are stored at various times in various memory and storage devices within a computing device. The instructions, when read and executed by one or more processors 702, cause the computer system 700 to perform operations to implement elements comprising various aspects of the present disclosure.

[0051] Furthermore, while embodiments have been described in the context of a fully functional computing device, those skilled in the art will appreciate that various embodiments may be distributed as program products in a variety of forms, and the present disclosure is practiced without regard to the particular type of machine or computer-readable medium used to actually accomplish the distribution.

[0052] Further examples of machine-readable storage media, machine-readable media, or computer-readable media include volatile and non-volatile memory devices 710, floppy disks and other removable disks, hard disk drives, optical disks (e.g., compact disk-read-only memories (CD-ROMs), digital versatile disks (DVDs)), and transmission-type media such as digital and analog communications links.

[0053] Network adapter 712 allows computer system 700 to broker data within network 714 with entities external to computer system 700 via any communication protocol supported by computer system 700 and the external entity. Network adapter 712 can include a network adapter card, a wireless network interface card, a router, an access point, a wireless router, a switch, a multi-layer switch, a protocol converter, a gateway, a bridge, a bridge router, a hub, a digital media receiver, and / or a repeater.

[0054] The network adapter 712 may include a firewall that controls and / or manages the authorization to access / proxy data within a computer network and tracks various levels of trust between different machines and / or applications. A firewall may be any number of modules with any combination of hardware and / or software components that can enforce a predetermined set of access rights between a particular set of machines and applications, machines and / or applications (e.g., regulate traffic flow and resource sharing between these entities). A firewall may additionally manage and / or access access control lists that detail the permissions of individuals, machines, and / or applications to access and manipulate objects, including the circumstances under which the permissions apply.

[0055] The techniques presented herein may be implemented using programmable circuitry (e.g., one or more microprocessors), software and / or firmware, dedicated hardwired (i.e., non-programmable) circuitry, or a combination of these forms. The dedicated circuitry may be in the form of one or more application-specific integrated circuits (ASICs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), or the like.

[0056] The description and drawings herein are illustrative and should not be construed as limiting. Numerous specific details are set forth to provide a thorough understanding of the present disclosure. However, in some cases, well-known details are not set forth to avoid obscuring the description. Furthermore, various changes may be made without departing from the scope of the embodiments.

[0057] The terms used in this specification generally have their ordinary meanings in the art, in the context of this disclosure, and in the specific context in which each term is used.Specific terms used to describe this disclosure are explained above or elsewhere in this specification to provide practitioners with further guidance regarding the description of this disclosure.For convenience, certain terms may be highlighted, for example, using italics and / or quotation marks.The use of highlighting does not affect the scope and meaning of the term.The scope and meaning of a term is the same in the same context, regardless of whether it is highlighted or not.It will be understood that the same thing can be expressed in multiple ways.It will be recognized that "memory" is a form of "storage," and these terms may be used interchangeably in some cases.

[0058] Accordingly, alternative language and synonyms may be used for any one or more of the terms discussed herein, without any particular significance to whether the term is specifically described or discussed herein. Synonyms are provided for certain terms. The listing of one or more synonyms does not exclude the use of other synonyms. The use of examples anywhere in this specification, including examples of terms discussed herein, is for illustrative purposes only and is not intended to further limit the scope and meaning of the disclosure or the exemplified terms. Similarly, the present disclosure is not limited to the various embodiments described herein.

[0059] It should be understood that the embodiments and variations shown and described herein are merely illustrative of the principles of the invention and that various modifications may be implemented by those skilled in the art.

Claims

1. a transport belt configured to transport a substrate to the print zone; and a first surface including a first plurality of adhesive elements configured to bond the first surface to the substrate; and a second surface opposite the first surface, the second surface configured to bond the layer to a top surface of the transport belt; and a layer disposed on the top surface of the conveyor belt, A printing transport system comprising: When the printing substrate is bonded to the first surface of the layer, the printing substrate is transported to the printing area by the transport belt. Printing transport system.

2. The system of claim 1 , wherein the first plurality of adhesive elements are concave discs.

3. The system of claim 1 , wherein the first plurality of adhesive elements are convex protrusions.

4. 10. The system of claim 1, wherein the first plurality of adhesive elements are configured to bond the first surface to the substrate by one or more of suction, friction, pressure, electrostatic, and van der Waals forces.

5. The system of claim 1 , wherein the second surface includes the second plurality of adhesive elements, the second plurality of adhesive elements configured to bond the layer to a top surface of the transport belt.

6. The system of claim 1 , wherein the second surface includes an adhesive coating, the adhesive coating configured to bond the layer to the top surface of the transport belt.

7. a pressing component configured to position the layer on an upper surface of the conveyor belt such that the layer is bonded to the upper surface of the conveyor belt; a cleaning component for cleaning said layer; a drying component configured to dry the layer; and a removal component configured to remove the layer from the conveyor belt; The system of claim 1 further comprising:

8. a transport belt configured to transport the substrate; and a first side configured to adhere the substrate to the adhesive device by a first plurality of adhesive elements; a second side configured to adhere the adhesive device to the conveyor belt; and a bonding device disposed on the conveyor belt, A system comprising: When the printing medium is glued to the first side of the gluing device, the printing medium is transported to a printing area by the conveyor belt. system.

9. The system of claim 8 , wherein the first plurality of adhesive elements are concave discs.

10. The system of claim 8 , wherein the first plurality of adhesive elements are convex protrusions.

11. 9. The system of claim 8, wherein the first plurality of adhesive elements are configured to couple the substrate to the adhesive device by one or more of suction, friction, pressure, electrostatic, and van der Waals forces.

12. The system of claim 8 , wherein the second side is configured to adhere the adhesive device to the transport belt with the second plurality of adhesive elements.

13. The system of claim 8 , wherein the second side is configured to adhere the adhesive device to the transport belt with an adhesive coating.

14. a pressing component configured to position the adhesive device on the conveyor belt such that the adhesive device is adhered to the conveyor belt; a cleaning component configured to clean the adhesive device; a drying component configured to dry the bonding device; and a removal component configured to remove the adhesive device from the conveyor belt; The system of claim 8 further comprising:

15. 1. A method for transporting a printing substrate, the method comprising: bonding a layer to a top surface of the transport belt, the layer including a first side and a second side opposite the first side, the second side bonding the layer to the top surface of the transport belt; adhering the substrate to the first surface of the layer with a first plurality of adhesive elements on the first surface; and transporting the printing substrate to a printing area; A method comprising:

16. removing the substrate from the first surface of the layer; transferring the layer to a cleaning component configured to clean the layer; transferring the layer to a drying component configured to dry the layer; heating the layer with a heat source; and removing the layer from the top surface of the conveyor belt with a removal component configured to peel the layer from the conveyor belt; The method of claim 15, comprising:

17. the first plurality of adhesive elements are concave disks, and the step of adhering the substrate to the first surface of the layer further includes the step of applying one or more of an attractive force, a frictional force, a pressure, an electrostatic charge, and a van der Waals force to the substrate by the first plurality of adhesive elements.

16. The method of claim 15.

18. the first plurality of adhesive elements are convex protrusions, and the step of adhering the substrate to the first surface of the layer further includes the step of applying one or more of an attractive force, a frictional force, a pressure, an electrostatic charge, and a van der Waals force to the substrate by the first plurality of adhesive elements.

16. The method of claim 15.

19. the step of bonding the layer to the upper surface of the conveyor belt further includes a second plurality of adhesive elements on the second surface, the layer being bonded to the upper surface of the conveyor belt by the second plurality of adhesive elements.

16. The method of claim 15.

20. the step of bonding the layer to the top surface of the transport belt further includes an adhesive coating on the second surface, the layer being bonded to the top surface of the transport belt by the adhesive coating.

16. The method of claim 15.

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