Gas barrier laminate and method for producing the same

Abstract

To provide a gas barrier laminate which can be extended in all directions while maintaining gas barrier properties.SOLUTION: A gas barrier laminate comprising a first gas barrier layer (X1), an interlayer (Y), and a second gas barrier layer (Y2) in this order, wherein the first gas barrier layer (X1) has a first slit extending in a first direction parallel to the first gas barrier layer (X1), and the second gas barrier layer (X2) has a second slit extending in a second direction parallel to the second gas barrier layer (X2) and intersecting the first direction.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a gas barrier laminate and a method for producing the same. [Background technology]

[0002] As gas barrier laminates including a gas barrier layer have become more widespread, they are required to have extensibility so that they can be attached to adherends of various shapes. Known gas barrier layers include those containing polysilazane as a main component. Gas barrier layers containing polysilazane as a main component have high gas barrier properties and good light transmittance, but suffer from the problem of poor extensibility.

[0003] One method for imparting stretchability to a gas barrier laminate is to form slits in the gas barrier layer. For example, Patent Document 1 describes a gas permeability control laminate having a vapor deposition layer and an overcoat layer on a resin substrate, with slit-shaped gaps provided across both the vapor deposition layer and the overcoat layer. Patent Document 2 also describes a package including a laminate film with slits formed therein. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2018-058253 [Patent Document 2] International Publication No. 2021 / 251225 Summary of the Invention [Problem to be solved by the invention]

[0005] However, forming slits in the gas barrier layer reduces the gas barrier properties when the gas barrier laminate is stretched, making it difficult to achieve both stretchability and gas barrier properties. Furthermore, Patent Documents 1 and 2 do not describe or suggest the arrangement of two gas barrier layers with slits formed therein.

[0006] In view of the above problems, an object of the present invention is to provide a gas barrier laminate that can be stretched in all directions while maintaining gas barrier properties. [Means for solving the problem]

[0007] As a result of extensive research into solving the above problems, the inventors discovered that the above problems could be solved by arranging two gas barrier layers having slits with an intermediate layer between them, and thus completed the present invention. That is, the present invention provides the following [1] to [7].

[0008] [1] A film having a first gas barrier layer (X1), an intermediate layer (Y), and a second gas barrier layer (X2) in this order, the first gas barrier layer (X1) has a first slit extending in a first direction parallel to the main surface of the first gas barrier layer (X1); The gas barrier laminate, wherein the second gas barrier layer (X2) has a second slit that is parallel to the main surface of the second gas barrier layer (X2) and extends in a second direction that intersects with the first direction. [2] The gas barrier laminate according to the above [1], wherein the storage modulus of the intermediate layer (Y) when measured by a tensile test on the intermediate layer (Y) alone is 300 GPa or less. [3] The gas barrier laminate according to the above [1] or [2], wherein at least one selected from the group consisting of the first slit and the second slit has a depth reaching the intermediate layer (Y). [4] The gas barrier laminate according to any one of the above [1] to [3], wherein the intermediate layer (Y) comprises at least one layer selected from the group consisting of a base layer and an adhesive layer. [5] When stretched in the first direction and the second direction, the gas barrier laminate has a water vapor transmission rate of 9.0×10 under conditions of a relative humidity of 90% and 40°C when the stretching rate, which is expressed as the ratio of the stretched length of the gas barrier laminate to the length in a direction parallel to the main surface of the gas barrier laminate before stretching, is 10%. -2 g / m 2 / day or less. The gas barrier laminate according to any one of the above [1] to [4]. [6] The gas barrier laminate according to any one of the above [1] to [5], which has a light transmittance of 50% or more in a wavelength region of 400 to 780 nm. [7] forming a first gas barrier layer (X1); a step of forming a second gas barrier layer (X2); a first lamination step for obtaining a laminate in which a first gas barrier layer (X1) and an intermediate layer (Y) are laminated in this order; a second lamination step for obtaining a laminate in which an intermediate layer (Y) and a second gas barrier layer (X2) are laminated in this order; a first slit forming step of forming a first slit in the first gas barrier layer (X1), the first slit extending in a first direction parallel to a main surface of the first gas barrier layer (X1), before, during, or after the first lamination step; and a second slit forming step of forming, before or after the second lamination step, second slits in the second gas barrier layer (X2), the second slits extending in a second direction parallel to the main surface of the second gas barrier layer (X2) and intersecting with the first direction; [Effects of the Invention]

[0009] According to the present invention, there is provided a gas barrier laminate that is stretchable in all directions while maintaining gas barrier properties. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is an exploded perspective view showing a first example of a gas barrier laminate. [Figure 2] 2A to 2C are a top view, a bottom view, and a perspective top view of the gas barrier laminate of the first example. [Figure 3] FIG. 2 is a cross-sectional view of the gas barrier laminate of the first example. [Figure 4] FIG. 10 is a perspective top view showing another example of the slit arrangement pattern. [Figure 5] FIG. 3 is a cross-sectional view showing a second example of the gas barrier laminate. [Figure 6] FIG. 10 is an exploded perspective view showing a third example of the gas barrier laminate. [Figure 7] FIG. 3 is a cross-sectional view of the gas barrier laminate of the third example. [Figure 8] FIG. 10 is a cross-sectional view of a fourth example of the gas barrier laminate. [Figure 9] FIG. 10 is an exploded perspective view showing a fifth example of the gas barrier laminate. [Figure 10] FIG. 10 is a cross-sectional view of the gas barrier laminate of the fifth example. [Figure 11] FIG. 10 is a cross-sectional view showing a sixth example of the gas barrier laminate. [Figure 12] FIG. 10 is a cross-sectional view showing a seventh example of the gas barrier laminate. [Figure 13] FIG. 2 is a process chart showing an example of a method for producing the gas barrier laminate of the first example. [Figure 14] FIG. 3 is a process chart showing an example of a method for producing the gas barrier laminate of the third example. [Figure 15] FIG. 10 is a process chart showing an example of a method for producing the gas barrier laminate of the fifth example. [Figure 16] FIG. 10 is a process chart showing an example of a method for producing the gas barrier laminate of the sixth example. [Figure 17] FIG. 10 is a process chart showing an example of a method for producing the gas barrier laminate of the seventh example. [Figure 18] FIG. 2 is a cross-sectional view showing an example of a method of using the gas barrier laminate. [Figure 19] FIG. 3 is a cross-sectional view showing another example of a method of using the gas barrier laminate. DETAILED DESCRIPTION OF THE INVENTION

[0011] In this specification, preferred definitions can be selected arbitrarily, and combinations of preferred definitions can be considered more preferred. In this specification, the expression "XX to YY" means "XX or more and YY or less." In this specification, for preferred numerical ranges (e.g., ranges of content, etc.), the lower and upper limits described in stages can be independently combined. For example, the description "preferably 10 to 90, more preferably 30 to 60" can be combined with the "preferable lower limit (10)" and the "more preferable upper limit (60)" to form "10 to 60." In this specification, for example, "(meth)acrylic acid" refers to both "acrylic acid" and "methacrylic acid," and the same applies to other similar terms. In this specification, the property of inhibiting the permeation of water vapor or oxygen is referred to as "gas barrier property," and a film having gas barrier property is referred to as "gas barrier film." In this specification, the term "solid content" refers to components other than the solvent in the coating liquid. Although the present invention will be described using drawings in various places to facilitate understanding, the present invention is not limited to those shown in the drawings. Each drawing is a schematic view, and is exaggerated from the actual size to facilitate understanding. Unless otherwise specified, the upper surface of each cross-sectional view will be referred to as the "upper surface," and the lower surface of each cross-sectional view will be referred to as the "lower surface." Furthermore, the gas barrier laminate, the intermediate laminate, which is a laminate used in the process of obtaining the gas barrier laminate, and each layer constituting these have two parallel main surfaces, one of which will be referred to as the "first main surface" and the other as the "second main surface." A gas barrier laminate according to an embodiment of the present invention (hereinafter sometimes referred to as "the present embodiment") and a method for producing the same will be described below.

[0012] 1. Gas barrier laminate A gas barrier laminate according to an embodiment of the present invention is a gas barrier laminate comprising a first gas barrier layer (X1), an intermediate layer (Y), and a second gas barrier layer (X2) in this order, wherein the first gas barrier layer (X1) has first slits extending in a first direction parallel to the main surface of the first gas barrier layer (X1), and the second gas barrier layer (X2) has second slits extending in a second direction parallel to the main surface of the second gas barrier layer (X2) and intersecting the first direction.

[0013] The gas barrier laminate has a first gas barrier layer (X1) and a second gas barrier layer (X2) with an intermediate layer (Y) interposed therebetween, and both gas barrier layers have slits, thereby ensuring the extensibility of the gas barrier laminate. Furthermore, because the extension direction of the slits formed in the first gas barrier layer (X1) intersects with the extension direction of the slits formed in the second gas barrier layer (X2), the area corresponding to the intersection of the two slits when viewed perpendicular to the gas barrier laminate is the shortest path for moisture and other contaminants to migrate from the front to the back of the gas barrier laminate. Therefore, moisture and other contaminants that migrate via routes other than the intersection take longer to migrate. As a result, it is believed that the gas barrier properties of the gas barrier layer are less likely to be reduced even when slits are formed. Additionally, because the slits appear to be formed in a network pattern when viewed perpendicular to the main surface of the gas barrier laminate, the gas barrier laminate is able to maintain its extensibility in all directions. For these reasons, it is believed that the gas barrier properties of the gas barrier laminate are maintained while the extensibility in all directions is enhanced.

[0014] From the viewpoint of the flexibility of the gas barrier laminate and the retention of the first gas barrier layer (X1) and the second gas barrier layer (X2), it is preferable that the storage modulus of the intermediate layer (Y) is 300 GPa or less when the intermediate layer (Y) alone is measured by a tensile test.

[0015] From the viewpoint of improving the extensibility of the gas barrier laminate, it is preferable that at least one selected from the group consisting of the first slit and the second slit has a depth that reaches the intermediate layer (Y). Furthermore, from the viewpoint of facilitating favorable maintenance of the gas barrier layer, it is preferable that the depthwise ends of the first slit and the second slit are located at a depth halfway through the intermediate layer (Y). More specifically, the depthwise ends of the first slit and the second slit are preferably at a depth of 1 to 50%, more preferably 2 to 40%, and even more preferably 3 to 30%, from the surface of the intermediate layer (Y) on which the slit is formed that contacts the gas barrier layer.

[0016] The intermediate layer (Y) preferably includes at least one selected from the group consisting of a base layer and an adhesive layer. When the intermediate layer (Y) includes a base layer, the two gas barrier layers are easily maintained. Furthermore, when the intermediate layer (Y) includes an adhesive layer, the gas barrier laminate can be easily produced.

[0017] 1-1. Configuration examples of gas barrier laminates <Example 1> FIG. 1 is an exploded perspective view showing a schematic configuration of a gas barrier laminate 100, which is a first example of a gas barrier laminate according to an embodiment of the present invention. The gas barrier laminate 100 comprises, in this order, a first gas barrier layer 11, a common base layer 23, and a second gas barrier layer 12. The common base layer 23 is an intermediate layer 60 located between the first gas barrier layer 11 and the second gas barrier layer 12, and supports the first gas barrier layer 11 and the second gas barrier layer 12. In the gas barrier laminate 100, the first gas barrier layer 11 and the second gas barrier layer 12 each have a single-layer structure. A slit 71 is formed in the first gas barrier layer 11, and a slit 72 is formed in the second gas barrier layer 12.

[0018] The gas barrier laminate 100 has a first main surface S1 and a second main surface S2 that are parallel to each other. Either the first main surface S1 or the second main surface S2 of the gas barrier laminate 100 will be attached to an adherend.

[0019] In the gas barrier laminate 100, the slit 71 extends along the thickness direction of the first gas barrier layer 11, from the upper surface to the lower surface of the first gas barrier layer 11, but does not reach the common base material layer 23. Similarly, the slit 72 extends along the thickness direction of the second gas barrier layer 12, from the lower surface to the upper surface of the second gas barrier layer 12, but does not reach the common base material layer 23.

[0020] A plurality of slits 71 are formed at equal intervals in parallel to one another along the y direction in Fig. 1. A plurality of slits 72 are formed at equal intervals in parallel to one another along the x direction in Fig. 1, which is perpendicular to the y direction.

[0021] The groove width of slit 71 (groove width in the x direction in FIG. 1) and the groove width of slit 72 (groove width in the y direction in FIG. 1) are preferably as small as possible to ensure gas barrier properties, for example, 100 nm or less, 50 nm or less, or 30 nm or less. There is no particular lower limit, but from the viewpoint of ease of production, it is, for example, 5 nm or more. The same applies to each gas barrier laminate described below.

[0022] The distance between adjacent pairs of slits 71 (the distance between the slits in the x direction in FIG. 1) and the distance between adjacent pairs of slits 72 (the distance between the slits in the y direction in FIG. 1) are preferably 2 mm or more, more preferably 3 mm or more, and even more preferably 5 mm or more, from the viewpoint of easily ensuring gas barrier properties, and are preferably 20 mm or less, more preferably 15 mm or less, and even more preferably 12 mm or less, from the viewpoint of easily ensuring extensibility. These also apply to each gas barrier laminate described later.

[0023] Figure 2(A) is a top view of the gas barrier laminate 100 (a plan view seen from the direction of arrow A in Figure 1), Figure 2(B) is a bottom view of the gas barrier laminate 100 (a plan view seen from the direction of arrow B in Figure 1), and Figure 2(C) is a perspective top view of the gas barrier laminate 100 (a perspective view seen from the direction of arrow A in Figure 1). As described above, slits 71 are formed along the y direction (see FIG. 2(A)), and slits 72 are formed along the x direction (see FIG. 2(B)). Therefore, as shown in FIG. 2(C), when the gas barrier laminate 100 is viewed from the top side (the direction of arrow A in FIG. 1), the slits appear to be formed in a grid pattern. In FIG. 2(C), slits 71 are indicated by solid lines, and slits 72 are indicated by dashed lines. As shown in Figure 2(C), when the gas barrier laminate 100 is viewed from the top, slits are formed in the two gas barrier layers in a grid pattern, thereby providing high extensibility even in directions parallel to the first main surface S1 or the second main surface S2 of the gas barrier laminate.

[0024] 3A and 3B are cross-sectional views of the gas barrier laminate 100, where FIG. 3A is a cross-sectional view taken along line IIIA-IIIA' in FIGS. 1 and 2A, and FIG. 3B is a cross-sectional view taken along line IIIB-IIIB' in FIGS. 1 and 2B. As shown in FIG. 3(A), the slit 71 is formed from the upper surface side toward the lower surface side of the first gas barrier layer 11. The tip of the slit 71 in the depth direction reaches the lower surface of the first gas barrier layer 11. The slit 72 is formed from the lower surface side toward the upper surface side of the second gas barrier layer 12. The tip of the slit 72 in the depth direction reaches the upper surface of the second gas barrier layer 12. As described above, the slits 71 and 72 do not reach the common base material layer 23. In other words, the depth d1 of the slit 71 is equal to the thickness of the first gas barrier layer 11, and the depth d1' of the slit 72 is equal to the thickness of the second gas barrier layer 12. The common base material layer 23 has a thickness d3, and no slits are formed in the common base material layer 23.

[0025] The gas barrier laminate 100 has a certain degree of stretchability because each of the two gas barrier layers has a slit, and furthermore, because it has a small number of parts and a simple configuration, it is easy to make it thin, lightweight, and easy to make it easy to improve light transmittance. Furthermore, because no slits are formed in the common base material layer 23, it is easy to prevent damage to the common base material layer 23 when the gas barrier laminate 100 is stretched.

[0026] The shape of the gas barrier laminate when viewed from a direction perpendicular to the main surface is not limited to that shown in Fig. 1 and may be any of a variety of shapes. For example, it may be a polygon such as a square, rectangle, or hexagon, or it may be an ellipse. This also applies to each gas barrier laminate described below.

[0027] The arrangement pattern of the slits 71 and 72 is not limited to that shown in Fig. 2, and they may be arranged in various patterns. For example, the angle formed between the extension direction of the slits 71 and the extension direction of the slits 72 may be 90° as shown in Fig. 2, or may be less than that. In other words, the extension direction of the slits 71 and the extension direction of the slits 72 may intersect at an interior angle θ of 90° or less.

[0028] FIG. 4 is a perspective top view showing another example of the slit arrangement pattern. 4(A), the extending direction of the slits 71 and the extending direction of the slits 72 intersect at an interior angle θ of less than 90°. In this case, from the viewpoint of widening the range in which good extensibility can be obtained, the interior angle θ preferably satisfies the relationship 90°>θ≧45°, more preferably satisfies the relationship 90°>θ≧50°, and further preferably satisfies the relationship 90°>θ≧60°.

[0029] Furthermore, the slits 71 and slits 72 may be arranged randomly as in the gas barrier laminate 100B shown in Figure 4(B), or the slits 71 and slits 72 may be formed radially as in the gas barrier laminate 100C shown in Figure 4(C). Similarly, any desired arrangement pattern of the slits 71, 72 can be adopted in the second to seventh examples of the gas barrier laminate shown below.

[0030] <Example 2> FIG. 5 is a cross-sectional view of a gas barrier laminate 101 which is a second example of the gas barrier laminate. The gas barrier laminate 101 is a modified example of the gas barrier laminate 100, and Figures 5(A) and 5(B) are cross-sectional views of the gas barrier laminate 101 cut in the same manner as Figures 3(A) and 3(B), respectively. 5(A) and 5(B), in the gas barrier laminate 101, the first gas barrier layer 11 includes an unmodified layer 11b and a modified layer 11a that exhibits high gas barrier properties. The unmodified layer 11b is in contact with the upper surface of the common base material layer 23, and the modified layer 11a is in contact with the upper surface of the unmodified layer 11b. The second gas barrier layer 12 also includes an unmodified layer 12b and a modified layer 12a that exhibits high gas barrier properties. The unmodified layer 12b is in contact with the lower surface of the common base material layer 23, and the modified layer 12a is in contact with the lower surface of the unmodified layer 12b. The slit 71 is formed so as to penetrate through the modified layer 11a and the unmodified layer 11b and reach the lower surface of the unmodified layer 11b (see FIG. 5(A)). The slit 72 is formed so as to penetrate through the modified layer 12a and the unmodified layer 12b and reach the upper surface of the unmodified layer 12b (see FIG. 5(B)). The other configurations are the same as those of the gas barrier laminate 100 shown in FIG. 3, and therefore detailed explanations will be omitted. By providing the first gas barrier layer 11 and the second gas barrier layer 12 with a modified layer, as in the gas barrier laminate 101, it becomes easier to ensure good gas barrier properties while making the gas barrier layers thinner. Note that one of the first gas barrier layer 11 and the second gas barrier layer 12 may have a modified layer, and the other may not. Due to the presence of two gas barrier layers in the gas barrier laminate 101, the gas barrier properties are unlikely to be impaired even if one of the gas barrier layers does not have a modified layer, and omitting the modification treatment can improve ease of production.

[0031] <Example 3> FIG. 6 is an exploded perspective view showing a schematic configuration of a gas barrier laminate 102 which is a third example of the gas barrier laminate. The gas barrier laminate 102 includes, in this order, a first gas barrier layer 11, a common base layer 23, and a second gas barrier layer 12. The common base layer 23 corresponds to an intermediate layer 60. In the gas barrier laminate 102, a slit 71a is formed in the first gas barrier layer 11, and a slit 72a is formed in the second gas barrier layer 12.

[0032] The gas barrier laminate 102 has a first main surface S1 and a second main surface S2 that are parallel to each other. The first main surface S1 or the second main surface S2 of the gas barrier laminate 102 is the surface that is attached to an adherend.

[0033] In the gas barrier laminate 102, the slit 71a extends along the thickness direction of the first gas barrier layer 11, from the upper surface to the lower surface of the first gas barrier layer 11, and is formed partway through the thickness direction of the common base material layer 23. Therefore, a slit 71b is formed on the upper surface of the common base material layer 23 at a position corresponding to the slit 71a. Similarly, the slit 72a extends along the thickness direction of the second gas barrier layer 12, from the lower surface to the upper surface of the second gas barrier layer 12, and is formed partway through the thickness direction of the common base material layer 23. Therefore, a slit 72b is formed on the lower surface of the common base material layer 23 at a position corresponding to the slit 72a. Hereinafter, the slit formed by the slits 71a and 71b may be referred to as "slit 71," and the slit formed by the slits 72a and 72b may be referred to as "slit 72."

[0034] A plurality of slits 71a are formed parallel to one another at equal intervals along the y direction in Fig. 6. The same is true for slits 71b. Therefore, slits 71 are formed in the same manner. 6, which is perpendicular to the y direction. The slits 72b are also formed in the same manner. Therefore, the slits 72 are also formed in the same manner.

[0035] 7A and 7B are cross-sectional views of the gas barrier laminate 102, with Fig. 7A being a cross-sectional view taken along line VIIA-VIIA' in Fig. 6 and Fig. 7B being a cross-sectional view taken along line VIIB-VIIB' in Fig. 6. However, both Fig. 7A and Fig. 7B are not exploded views. 7(A), the slit 71 is formed so as to penetrate the first gas barrier layer 11 and reach the common base material layer 23. The slit 71 is formed as a so-called half cut. That is, the slit 71 is formed to a depth partway through the common base material layer 23 and does not reach the bottom surface of the common base material layer 23.

[0036] More specifically, the depth d2 of the slit 71 is greater than the thickness d1 of the first gas barrier layer 11. The slit 71 reaches the common base material layer 23, but does not reach the back surface of the common base material layer 23. In other words, the depth d2 of the slit 71 is smaller than the sum (d1 + d3) of the thickness d1 of the first gas barrier layer 11 and the thickness d3 of the common base material layer 23.

[0037] 7(B), the slits 72 are formed so as to penetrate the second gas barrier layer 12 and reach the common base material layer 23. The slits 72 are also formed as half cuts. That is, the slits 72 are formed to a depth partway through the common base material layer 23 and do not reach the top surface of the common base material layer 23.

[0038] More specifically, the depth d2' of the slit 72 is greater than the thickness d1' of the second gas barrier layer 12. The slit 72 reaches the common base material layer 23, but does not reach the upper surface of the common base material layer 23. In other words, the depth d2' of the slit 72 is smaller than the sum (d1' + d3) of the thickness d1' of the second gas barrier layer 12 and the thickness d3 of the common base material layer 23.

[0039] The gas barrier laminate 102 has a simple configuration with a small number of parts, and is thin, lightweight, stretchable, and has good light transmittance, similar to the above-mentioned gas barrier laminate 100. In addition, since the slits 71 and 72 reach the common base layer 23, it is easier to improve flexibility and stretchability and is easier to manufacture than the gas barrier laminate 100.

[0040] <Example 4> Fig. 8 is a cross-sectional view of a fourth example of the gas barrier laminate, a gas barrier laminate 103. The gas barrier laminate 103 is a modified example of the gas barrier laminate 102, and Fig. 8(A) and Fig. 8(B) are cross-sectional views of the gas barrier laminate 103 cut in the same manner as Fig. 7(A) and Fig. 7(B), respectively. In the gas barrier laminate 103, the first gas barrier layer 11 includes an unmodified layer 11b and a modified layer 11a that exhibits high gas barrier properties. The unmodified layer 11b is in contact with the upper surface of the common base material layer 23, and the modified layer 11a is in contact with the upper surface of the unmodified layer 11b. The second gas barrier layer 12 also includes an unmodified layer 12b and a modified layer 12a that exhibits high gas barrier properties. The unmodified layer 12b is in contact with the lower surface of the common base material layer 23, and the modified layer 12a is in contact with the lower surface of the unmodified layer 12b. The slit 71 is formed so as to penetrate through the modified layer 11a and the unmodified layer 11b and reach the lower surface of the unmodified layer 11b, and the slit 72 is formed so as to penetrate through the modified layer 12a and the unmodified layer 12b and reach the upper surface of the unmodified layer 12b. The other configurations are the same as those of the gas barrier laminate 102 shown in FIG. 7, and therefore detailed explanations will be omitted.

[0041] The gas barrier laminate 103 is thin, lightweight, stretchable, light-transmitting, and easily manufacturable, similar to the gas barrier laminate 102. In addition, by providing a modified layer in each of the first gas barrier layer 11 and the second gas barrier layer 12, it becomes easier to ensure good gas barrier properties while making the gas barrier layer thin. Note that one of the first gas barrier layer 11 and the second gas barrier layer 12 may have a modified layer, and the other may not have a modified layer.

[0042] <Example 5> FIG. 9 is an exploded perspective view showing a schematic configuration of a gas barrier laminate 104, which is a fifth example of the gas barrier laminate according to an embodiment of the present invention. The gas barrier laminate 104 comprises a first gas barrier layer 11, a first base layer 21, an adhesive layer 30, a second gas barrier layer 12, and a second base layer 22 in this order. The first base layer 21 and the adhesive layer 30 are located between the first gas barrier layer 11 and the second gas barrier layer 12 and form an intermediate layer 60 . In the gas barrier laminate 104, a slit 71a is formed in the first gas barrier layer 11, and a slit 72a is formed in the second gas barrier layer 12.

[0043] 9, the gas barrier laminate 104 has a first main surface S1 and a second main surface S2 that are parallel to each other. As will be described later, the first main surface S1 of the gas barrier laminate 100 is the surface that will be attached to an adherend.

[0044] In the gas barrier laminate 104, the slit 71a extends along the thickness direction of the first gas barrier layer 11, from the upper surface to the lower surface of the first gas barrier layer 11, and is formed partway along the thickness direction of the first base material layer 21. Therefore, a slit 71b is formed on the upper surface of the first base material layer 21 at a position corresponding to the slit 71a. Similarly, the slit 72a extends along the thickness direction of the second gas barrier layer 12, from the upper surface to the lower surface of the second gas barrier layer 12, and is formed partway along the thickness direction of the second base material layer 22. Therefore, a slit 72b is formed on the upper surface of the second base material layer 22 at a position corresponding to the slit 72a.

[0045] A plurality of slits 71a are formed parallel to one another at equal intervals along the y direction in Fig. 9. The same is true for slits 71b. Therefore, slits 71 are formed in the same manner. 9. The slits 72a are formed parallel to one another at equal intervals along the x direction in FIG. 9, which is perpendicular to the y direction. The same is true for the slits 72b. Therefore, the slits 72 are formed in the same manner.

[0046] Fig. 10 is a cross-sectional view of the gas barrier laminate 104. Fig. 10(A) is a cross-sectional view taken along line XA-XA' in Fig. 9, and Fig. 10(B) is a cross-sectional view taken along line XB-XB' in Fig. 9. However, both Fig. 10(A) and Fig. 10(B) are not exploded. As shown in FIGS. 10(A) and 10(B), the first gas barrier layer 11 includes an unmodified layer 11b and a modified layer 11a that exhibits high gas barrier properties. The unmodified layer 11b is in contact with the upper surface of the first base material layer 21, and the modified layer 11a is in contact with the upper surface of the unmodified layer 11b. The slits 71 are formed so as to penetrate through the modified layer 11a and the unmodified layer 11b and reach the first base material layer 21. The slits 71 are formed as half cuts. That is, the slits 71 are formed to a depth partway through the first base material layer 21 and do not reach the bottom surface of the first base material layer 21.

[0047] More specifically, the depth d2 of the slit 71 is greater than the thickness d1 of the first gas barrier layer 11. The slit 71 reaches the first base material layer 21, but does not reach the rear surface of the first base material layer 21. In other words, the depth d2 of the slit 71 is smaller than the sum (d1 + d3) of the thickness d1 of the first gas barrier layer 11 and the thickness d3 of the first base material layer 21.

[0048] As shown in FIGS. 10(A) and 10(B), the second gas barrier layer 12 also includes an unmodified layer 12b and a modified layer 12a that exhibits high gas barrier properties. The unmodified layer 12b is in contact with the upper surface of the second base material layer 22, and the modified layer 12a is in contact with the upper surface of the unmodified layer 12b. The second gas barrier layer 12, more specifically the upper surface of the modified layer 12a included in the second gas barrier layer 12, is attached to the lower surface of the first base material layer 21 via an adhesive layer 30.

[0049] The slits 72 are formed so as to penetrate through the modified layer 12a and the unmodified layer 12b and reach the second base material layer 22. The slits 72 are also formed as half cuts. That is, the slits 72 are formed partway through the depth of the second base material layer 22 and do not reach the bottom surface of the second base material layer 22.

[0050] More specifically, the depth d2' of the slit 72 is greater than the thickness d1' of the second gas barrier layer 12. The slit 72 reaches the second base layer 22, but does not reach the rear surface of the second base layer 22. In other words, the depth d1' of the slit 72 is smaller than the sum (d2' + d3') of the thickness d2' of the second gas barrier layer 12 and the thickness d3' of the second base layer 22.

[0051] In the gas barrier laminate 104 of the fifth example above, both the first gas barrier layer 11 and the second gas barrier layer 12 have modified layers, but this is not limited thereto, and either the first gas barrier layer 11 or the second gas barrier layer may not have a modified layer, or neither the first gas barrier layer 11 nor the second gas barrier layer may have a modified layer. Even if no modified layer is present, the stacking of two gas barrier layers prevents a decrease in gas barrier properties, and omitting the modification treatment facilitates the production of the gas barrier laminate.

[0052] <Example 6> Fig. 11 is a cross-sectional view of a sixth example of the gas barrier laminate, a gas barrier laminate 105. Fig. 11(A) and Fig. 11(B) are cross-sectional views of the gas barrier laminate 105 cut in the same manner as Fig. 10(A) and Fig. 10(B), respectively. The gas barrier laminate 105 differs from the gas barrier laminate 100 shown in Figure 10 in that the laminate, which is composed of a first gas barrier layer 11 and a first base material layer 21, is positioned so that the surface on which the slits 71 are formed faces the adhesive layer 30, but otherwise has the same configuration as the gas barrier laminate 104. Since the slits 71 and 72 of the gas barrier laminate 105 are not exposed to the outside, the gas barrier properties are less likely to deteriorate, and damage due to contact with external members or the like is easily prevented.

[0053] <Example 7> Fig. 12 is a cross-sectional view of a gas barrier laminate 106, which is a seventh example of the gas barrier laminate. Fig. 12(A) and Fig. 12(B) are cross-sectional views of the gas barrier laminate 106 cut in the same manner as Fig. 10(A) and Fig. 10(B), respectively. The gas barrier laminate 106 has a laminate of the first gas barrier layer 11 and the first base material layer 21, and a laminate of the second gas barrier layer 12 and the second base material layer 22 in the gas barrier laminate 104 of Fig. 10. However, unlike the gas barrier laminate 104, the gas barrier laminate 106 has a configuration in which an adhesive layer 30 is provided on the underside of the former, and the surface of the latter facing the second base material layer 22 is attached via the adhesive layer 30. The gas barrier laminate 106 can be produced by bonding a pair of laminates produced in the same manner with an adhesive layer, and is therefore easy to produce.

[0054] 1-2. Middle class (Y) The intermediate layer (Y) is a layer located between the first gas barrier layer (X1) and the second gas barrier layer (X2). When the intermediate layer (Y) alone is measured by a tensile test, the intermediate layer (Y) preferably has a storage modulus of 300 GPa or less. When the storage modulus of the intermediate layer (Y) is within the above range, the first gas barrier layer (X1) and the second gas barrier layer (X2) are easily maintained while ensuring the flexibility of the gas barrier laminate. The storage modulus of the intermediate layer (Y) is more preferably 200 GPa or less, even more preferably 100 GPa or less, and even more preferably 50 GPa or less, from the viewpoint of easily increasing the extensibility of the gas barrier laminate, and is preferably 0.01 GPa or more, more preferably 0.1 GPa or more, even more preferably 1 GPa or more, and particularly preferably 10 GPa or more, from the viewpoint of easily increasing the retention of the two gas barrier layers. The storage modulus of the intermediate layer (Y) is measured in detail by the method described in the Examples.

[0055] The intermediate layer (Y) is composed of, for example, a base layer and an adhesive layer. The presence of the base layer facilitates improving the retention of the two gas barrier layers, and the presence of the adhesive layer increases the degree of freedom in manufacturing the gas barrier laminate. The intermediate layer (Y) composed of the base layer and adhesive layer is produced, for example, by forming a first gas barrier layer on one side of the base layer and then forming an adhesive layer on the other side of the base layer. The intermediate layer (Y) may be composed of only a base layer, or may be composed of only an adhesive layer.

[0056] In the above-described first, second, third, and fourth examples, the intermediate layer (Y) is formed of the common base material layer 23. In the fifth example described above, the intermediate layer (Y) is composed of the first base material layer 21 and the adhesive layer 30. In the sixth example described above, the intermediate layer (Y) is composed of the adhesive layer 30. In the seventh example described above, the intermediate layer (Y) is composed of the first base material layer 21, the adhesive layer 30, and the second base material layer 22.

[0057] The storage modulus of the intermediate layer (Y) can be adjusted to fall within the above range by, for example, selecting the type and thickness of the base layer and the type and thickness of the adhesive layer.

[0058] From the viewpoint of enhancing the gas barrier property, the water vapor transmission rate of the intermediate layer (Y) under the conditions of a relative humidity of 90% and a temperature of 40°C is preferably 1 g / m 2 / day or less, preferably 1.0×10 -1 g / m 2 / day or less, more preferably 1.0 × 10 -2 g / m 2 / day or less. The water vapor permeability of the intermediate layer (Y) is measured in detail by the method described in the Examples.

[0059] 1-3. Base material layer The base layers used as the first base layer 21, the second base layer 22, and the common base layer 23 can each independently be made of various resin films, preferably polyvinyl chloride (PVC) film, polyvinylidene chloride film, polyurethane film, polymethyl methacrylate film, silicone rubber film, polyethylene terephthalate (PET) film, polybutylene terephthalate (PBT) film, polylactic acid (PLA) film, polycarbonate film, cycloolefin film, cellulose film, etc., and more preferably PVC film, polyvinylidene chloride film, polyurethane film, polymethyl methacrylate film, or silicone rubber film.

[0060] 1-4.Gas barrier layer The first gas barrier layer (X1) and the second gas barrier layer (X2) of the gas barrier laminate (corresponding to the first gas barrier layer 11 and the second gas barrier layer 12 of the gas barrier laminate, respectively) can each independently be a gas barrier layer made of various conventionally known materials. Examples of such gas barrier layers include at least one selected from the group consisting of inorganic oxide films such as alumina, inorganic nitride films, inorganic oxynitride films, and gas barrier layers containing silicon and oxygen. The gas barrier laminate preferably has a gas barrier layer containing silicon and oxygen, from the viewpoint of ensuring high gas barrier properties at low cost. Here, the content of silicon and oxygen in the gas barrier layer is preferably 50 at% or more, more preferably 60 at% or more, and even more preferably 70 at% or more of the atoms constituting the gas barrier layer. There is no particular upper limit, but it is, for example, 95 at%. The gas barrier layer is preferably formed from a coating of a composition containing a polysilazane compound and, optionally, a carbon-containing silicon-based polymer compound, as described below. The gas barrier layer preferably has, in the thickness direction thereof, a first region (high-nitrogen-containing region) that contains silicon, oxygen, and nitrogen, and, optionally, carbon, and has a higher nitrogen content than other regions.

[0061] As will be described later, the first region is formed by a modification process and has a relatively higher nitrogen content than the second region, which is a region other than the first region. Therefore, in the following description, the first region may also be referred to as a "modified region" or a "high-nitrogen-content region." The second region may also be referred to as a "non-modified region" or a "low-nitrogen-content region." The "high-nitrogen-content region" refers to a region that is stable over time and whose thickness does not decrease over time.

[0062] The gas barrier layer preferably has a first region containing silicon, oxygen, carbon, and nitrogen in its thickness direction, and satisfies the following requirements (1) and (2). Requirement (1): The composition of the first region is SiO x C y N z It is expressed as: x:0.20~0.50 y:0~0.30 z: 0.20~0.70 Requirement (2): The thickness d of the first region M is 10 nm or more.

[0063] The above thickness d MFrom the viewpoint of improving the gas barrier property, the thickness is preferably 12 nm or more, more preferably 30 nm or more, and from the viewpoint of increasing the strength of the gas barrier layer, it is even more preferably 50 nm or more, and even more preferably 60 nm or more. There is no particular upper limit, but from the viewpoint of ease of production, it is preferably 300 nm or less, more preferably 150 nm or less, and particularly preferably 90 nm or less. Note that the entire gas barrier layer may be a modified region, and may not include an unmodified region.

[0064] The high nitrogen content region may be located on the outermost surface of the gas barrier layer or inside the gas barrier layer, but is preferably located on the outermost surface of the gas barrier layer from the viewpoints of exhibiting good gas barrier properties and ease of production.

[0065] In the depth direction of the gas barrier layer, the element ratio of nitrogen atoms can be made to gradually and continuously change from the outermost surface by forming a high nitrogen content region through a modification treatment, as will be described later. Typically, in the change in the element ratio of each element in silicon, oxygen, and nitrogen (and optionally, carbon) in the thickness direction of the gas barrier layer, there is a region where the element ratio of nitrogen is higher than in the deeper layer.

[0066] Gas barrier layer thickness d G From the viewpoint of easily ensuring gas barrier properties, light transparency, and flexibility, as well as from the viewpoint of ease of production, the thickness is preferably 30 to 1,500 nm, more preferably 50 to 1,000 nm, and even more preferably 100 to 400 nm. Gas barrier layer thickness d G Even if the nitrogen content is on the order of nanometers, by providing a high nitrogen content region, it is possible to obtain a gas barrier laminate having sufficient gas barrier performance.

[0067] The gas barrier layer is formed from a gas barrier precursor layer, and is preferably formed from a layer obtained by drying a coating film of a coating liquid (hereinafter also referred to as "gas barrier precursor layer coating liquid") containing a polysilazane compound and, if desired, a carbon-containing silicon-based polymer compound. The high nitrogen content region can be formed by a modification treatment described below.

[0043] By providing a high nitrogen content region obtained by subjecting the gas barrier precursor layer, which is a layer obtained by drying a coating of the above-mentioned gas barrier precursor layer coating liquid, to a modification treatment described below, a gas barrier layer with excellent gas barrier properties can be efficiently formed. In particular, when the above-mentioned modification treatment is carried out by plasma irradiation in the presence of helium gas, it becomes easier to form a high nitrogen-containing region with a sufficient thickness.

[0068] Examples of polysilazane compounds include inorganic polysilazanes and organic polysilazanes. Examples of inorganic polysilazanes include perhydropolysilazane, and examples of organic polysilazanes include compounds in which part or all of the hydrogen atoms of perhydropolysilazane have been substituted with organic groups such as alkyl groups. Among these, inorganic polysilazanes are more preferred from the viewpoints of availability and the ability to form a gas barrier layer with excellent gas barrier properties. Furthermore, as the polysilazane compound, commercially available products available as glass coating materials and the like can also be used as they are. The polysilazane compounds can be used singly or in combination of two or more.

[0069] Examples of the carbon-containing silicon-based polymer compound include polycarbosilane-based compounds, polysilane-based compounds, and mixtures thereof.

[0070] Examples of methods for forming a layer obtained by applying and drying a coating liquid for a gas barrier precursor layer include a method in which a coating liquid for a gas barrier precursor layer containing a polysilazane compound, and optionally a carbon-containing silicon-based polymer compound, other components (for example, a curing agent, other polymers, an antioxidant, a light stabilizer, and a flame retardant), and a solvent is applied onto a substrate film by a known method, and the resulting coating film is then appropriately dried to form the layer. Since the coating liquid for the gas barrier precursor layer contains the polysilazane compound described above, a conversion reaction of the polysilazane occurs when the coating liquid is heated after coating, resulting in a coating film (gas barrier precursor layer) with gas barrier properties.

[0071] Examples of the modification treatment include ion implantation and vacuum ultraviolet light irradiation (irradiation with an excimer laser or the like). Among these, ion implantation is preferred because it provides high gas barrier performance. In the ion implantation, the amount of ions implanted into the polymer layer may be appropriately determined depending on the intended use of the gas barrier laminate to be formed (for example, the required gas barrier properties, light transparency, or flexibility).

[0072] Examples of ions to be implanted include ions of rare gases such as argon, helium, neon, krypton, and xenon, and ions of fluorocarbons, hydrogen, nitrogen, oxygen, carbon dioxide, chlorine, fluorine, and sulfur. These ions may be used alone or in combination of two or more.

[0073] The method for injecting ions is not particularly limited, but examples thereof include a method of irradiating ions (ion beam) accelerated by an electric field and a method of injecting ions in plasma. Of these, the latter method of injecting plasma ions is preferred because it allows a gas barrier film to be easily obtained.

[0074] The ion species to be implanted by plasma ion implantation include the same ions as those exemplified above as the ions to be implanted.

[0075] 1-5. Adhesive layer The adhesive layer contained in the intermediate layer (Y) is formed using an adhesive composition described below. Such an adhesive layer preferably contains an isobutylene polymer (A) and is formed by reacting a diene rubber (B) with a crosslinking agent (C). In an adhesive layer having such a structure, the isobutylene polymer (A) is entangled with the crosslinked structure formed by the reaction of the diene rubber (B) and the crosslinking agent (C), forming a complex and dense structure such as an interpenetrating network structure, and therefore the adhesive layer has sufficient cohesive strength, excellent moisture blocking properties, and an excellent balance between adhesive strength and holding power.

[0076] The method for forming the pressure-sensitive adhesive layer is not particularly limited. For example, the pressure-sensitive adhesive composition described below can be applied to the release-treated surface of a release sheet or a substrate sheet by a known method, and the resulting coating film can be dried to form the pressure-sensitive adhesive layer.

[0077] Examples of methods for applying the pressure-sensitive adhesive composition include spin coating, spray coating, bar coating, knife coating, roll coating, blade coating, die coating, and gravure coating. Drying conditions for drying the coating film include, for example, 80 to 150°C for 30 seconds to 5 minutes. After the drying treatment, the adhesive layer may be left to stand for about a week to cure, which allows the crosslinked structure to be sufficiently formed.

[0078] The thickness of the adhesive layer is not particularly limited and can be determined appropriately depending on the application. The thickness of the adhesive layer is preferably 0.5 to 200 μm, more preferably 1 to 100 μm, and even more preferably 5 to 40 μm. If the thickness of the adhesive layer is 0.5 μm or more, better adhesive properties are likely to be exhibited, and if the thickness of the adhesive layer is 200 μm or less, the adhesive layer can be formed with good productivity.

[0079] The adhesive layer has high cohesive strength, excellent moisture-blocking properties, and an excellent balance between adhesive strength and holding power. Therefore, when this adhesive layer is used as a sealing material, it can sufficiently prevent moisture penetration and is not easily separated at the adhesive interface, so that it can prevent moisture penetration for a long period of time.

[0080] 1-6. Pressure-sensitive adhesive composition The pressure-sensitive adhesive composition used to prepare the pressure-sensitive adhesive layer that constitutes the gas barrier laminate according to an embodiment of the present invention preferably contains an isobutylene polymer (A), a diene rubber having a hydroxyl group (B), and a crosslinking agent (C).

[0081] [Isobutylene polymer (A)] The isobutylene polymer (A) (hereinafter sometimes referred to as "polymer (A)") is a polymer having a polyisobutylene skeleton in the main chain and / or side chain. That is, polymer (A) has a repeating unit represented by the following structural formula (I) in the main chain and / or side chain.

[0082] [ka]

[0083] Specific examples of the polymer (A) include a homopolymer of isobutylene (polyisobutylene), a copolymer of isobutylene and isoprene (butyl rubber), a copolymer of isobutylene and n-butene, a copolymer of isobutylene and butadiene, and halogenated copolymers obtained by brominating or chlorinating these copolymers. These isobutylene polymers can be used alone or in combination of two or more.

[0084] The number average molecular weight (Mn) of the polymer (A) is preferably 100,000 to 2,000,000. The use of a polymer (A) having a number-average molecular weight (Mn) of 100,000 or more provides the pressure-sensitive adhesive composition with appropriate fluidity, facilitating the formation of a pressure-sensitive adhesive layer with sufficient adhesiveness. Furthermore, a polymer (A) having a number-average molecular weight (Mn) of 2,000,000 or less is easily soluble in common organic solvents, allowing the pressure-sensitive adhesive composition to be prepared efficiently. The number average molecular weight (Mn) is a value measured by gel permeation chromatography using tetrahydrofuran as a solvent (GPC analysis) and converted into a value using standard polystyrene.

[0085] The polymer (A) can be obtained by a known method, for example, a method of polymerizing monomers in the presence of a Lewis acid catalyst such as aluminum chloride or boron trifluoride. Alternatively, commercially available products may be used as the polymer (A), such as ExxonButyl (manufactured by Nippon Butyl Co.), Vistanex (manufactured by Exxon Chemical Co.), Hycar (manufactured by Goodrich Chemicals), and Oppanol (manufactured by BASF).

[0086] [Diene rubber (B) having hydroxyl groups] The diene rubber (B) having a hydroxyl group (hereinafter sometimes referred to as "diene rubber (B)") is a diene rubber composed of a polymer having a hydroxyl group at the end of the main chain and / or in the side chain. "Diene rubber" refers to a "rubber-like polymer having a double bond in the polymer main chain."

[0087] The diene rubber (B) is not particularly limited as long as it is a diene rubber having a hydroxyl group, but it is preferable that the diene rubber (B) has a hydroxyl group at the end of the main chain in order to facilitate reaction with the crosslinking agent (C). The diene rubber (B) having a hydroxyl group may have a functional group other than a hydroxyl group. The average number of hydroxyl groups per molecule of the diene rubber (B) is 1.5 or more, preferably 1.5 to 10. By having 1.5 or more hydroxyl groups per molecule, an adhesive layer having sufficient cohesive strength can be efficiently formed, and by having the number of hydroxyl groups per molecule of 10 or less, a decrease in the compatibility between the isobutylene polymer (A) and the diene rubber (B) is suppressed. The hydroxyl group content of the diene rubber (B) is preferably 0.1 to 2 mol / kg. By setting the hydroxyl group content within this range, an adhesive layer having sufficient cohesive strength can be efficiently formed, and a decrease in the compatibility between the isobutylene polymer (A) and the diene rubber (B) can be suppressed.

[0088] Examples of the diene rubber (B) include hydroxyl group-containing polybutadiene rubber, hydroxyl group-containing polyisoprene rubber, hydroxyl group-containing styrene-butadiene copolymer rubber, and hydroxyl group-containing acrylonitrile-butadiene copolymer rubber. These diene rubbers (B) may be those that have not been hydrogenated (hydroxyl group-containing unhydrogenated diene rubber) or those that have been hydrogenated (hydroxyl group-containing hydrogenated diene rubber). Among these, as the diene rubber (B), a hydroxyl group-containing polybutadiene rubber or a hydroxyl group-containing polyisoprene rubber is preferred from the viewpoint that it has high compatibility with the isobutylene polymer (A), has sufficient cohesive strength, and can efficiently form an adhesive layer with high moisture-blocking properties. Furthermore, the diene rubber (B) is preferably a hydrogenated diene rubber having hydroxyl groups, from the viewpoint of being able to form an adhesive layer that is resistant to discoloration even under high temperature and humidity. The hydrogenated diene rubber having hydroxyl groups may be a partially hydrogenated product or a fully hydrogenated product. The diene rubber (B) preferably has a bromine number of 0 to 200 g / 100 g. By setting the bromine number within this range, it is possible to form an adhesive layer that is resistant to discoloration even under high temperature, humidity, and heat. The bromine number can be measured, for example, in accordance with JIS K2605:1996. The diene rubber (B) can be used alone or in combination of two or more.

[0089] The diene rubber (B) is preferably a liquid at room temperature (25°C) that becomes a solid exhibiting rubber elasticity upon crosslinking (liquid rubber). When the diene rubber (B) is a liquid rubber, compatibility with the isobutylene polymer (A) is improved, and an adhesive layer with high moisture-blocking properties can be efficiently formed.

[0090] The number average molecular weight of the diene rubber (B) is preferably 500 to 300,000. When the number average molecular weight of the diene rubber (B) is 500 or more, bleeding out of the diene rubber (B) can be prevented when an adhesive layer is formed. When the number average molecular weight of the diene rubber (B) is 300,000 or less, the crosslinking reaction proceeds quickly and the diene rubber (B) is well mixed with the isobutylene polymer (A) when preparing the adhesive composition, so that the diene rubber (B) has sufficient cohesive strength and can efficiently form a uniform adhesive layer. The number average molecular weight is a value calculated as a standard polystyrene equivalent, obtained by gel permeation chromatography using tetrahydrofuran as a solvent.

[0091] The diene rubber (B) can be produced by a known method. For example, it can be obtained by radically polymerizing a diene monomer with an azo compound having a hydroxyl group, such as hydrogen peroxide or 2,2'-azobis[2-methyl-N-(2-hydroxyethyl)propionamide], in the presence of a polymerization initiator. Alternatively, the diene rubber (B) can be obtained by anionically polymerizing a diene monomer in the presence of a catalyst such as naphthalenedilithium to obtain a living polymer, and then reacting this with a monoepoxy compound or the like. Furthermore, the diene rubber (B) can also be obtained by copolymerizing a diene monomer or the like with a vinyl monomer having a hydroxyl group.

[0092] Commercially available products may be used as the diene rubber (B), such as trade names Poly bd series (liquid polybutadiene having hydroxyl groups, manufactured by Idemitsu Kosan Co., Ltd.), Poly ip series (liquid polyisoprene having hydroxyl groups, manufactured by Idemitsu Kosan Co., Ltd.), trade name Epol series (liquid hydrogenated polyisoprene having hydroxyl groups, manufactured by Idemitsu Kosan Co., Ltd.), trade name GI series (liquid polybutadiene having hydroxyl groups, manufactured by Nippon Soda Co., Ltd.), and trade name Polytail series (hydroxyl-modified hydrogenated polybutadiene, manufactured by Mitsubishi Chemical Corporation).

[0093] The blending amount of the diene rubber (B) is preferably 1 to 60 parts by mass relative to 100 parts by mass of the polymer (A). When the blending amount of the diene rubber (B) is 1 part by mass or more relative to 100 parts by mass of the polymer (A), an adhesive layer having a crosslinked structure can be efficiently formed, and when it is 60 parts by mass or less, an adhesive layer having sufficient adhesive strength can be efficiently formed.

[0094] [Crosslinking agent (C)] The crosslinking agent (C) is a compound that can react with the hydroxyl groups of the diene rubber (B) to form a crosslinked structure. Preferred examples of the crosslinking agent (C) include isocyanate-based crosslinking agents, epoxy-based crosslinking agents, aziridine-based crosslinking agents, and metal chelate-based crosslinking agents, with isocyanate-based crosslinking agents being more preferred.

[0095] For example, an isocyanate-based crosslinking agent is a compound having an isocyanate group as a crosslinkable group. Examples of isocyanate-based crosslinking agents include aromatic polyisocyanates such as tolylene diisocyanate, diphenylmethane diisocyanate, and xylylene diisocyanate; aliphatic polyisocyanates such as hexamethylene diisocyanate; alicyclic polyisocyanates such as isophorone diisocyanate and hydrogenated diphenylmethane diisocyanate; and biuret and isocyanurate forms of these compounds, as well as adducts which are reaction products with low-molecular-weight active hydrogen-containing compounds such as ethylene glycol, propylene glycol, neopentyl glycol, trimethylolpropane, and castor oil.

[0096] The crosslinking agent (C) can be used alone or in combination of two or more.

[0097] The amount of crosslinking agent (C) to be added is preferably such that the crosslinkable groups of the crosslinking agent (C) (in the case of a metal chelate crosslinking agent, the metal chelate crosslinking agent) are 0.1 to 5 equivalents, more preferably 0.2 to 3 equivalents, relative to the hydroxyl groups of the diene rubber (B). By ensuring that the amount of crosslinkable groups is within the above range, an adhesive layer having a crosslinked structure can be efficiently formed.

[0098] [Other ingredients] The pressure-sensitive adhesive composition may contain other components as long as the effects of the present invention are not impaired. Other components include additives such as tackifiers, silane coupling agents, antistatic agents, light stabilizers, antioxidants, ultraviolet absorbers, resin stabilizers, fillers, pigments, extenders, and softeners. These may be used alone or in combination of two or more. When other components are added, the amount of each added is preferably 0.01 to 5% by mass in the pressure-sensitive adhesive composition.

[0099] [Method for preparing pressure-sensitive adhesive composition] The pressure-sensitive adhesive composition can be prepared by appropriately mixing and stirring the polymer (A), diene rubber (B), crosslinking agent (C), and, if necessary, other components and solvents according to a conventional method. Examples of the solvent include aromatic hydrocarbon solvents such as benzene and toluene; ester solvents such as ethyl acetate and butyl acetate; ketone solvents such as acetone, methyl ethyl ketone and methyl isobutyl ketone; aliphatic hydrocarbon solvents such as n-pentane, n-hexane and n-heptane; and alicyclic hydrocarbon solvents such as cyclopentane and cyclohexane. These solvents can be used alone or in combination of two or more.

[0100] 1-7. Other examples of gas barrier laminates The gas barrier laminate according to the embodiment of the present invention is not limited to those shown in Figures 1 to 12, and may include one or more other layers as long as the object of the present invention is not impaired. Examples of such other layers include a protective layer, a second substrate layer, and an adhesive layer for attachment to an adherend. The gas barrier laminate may be a long product. In this case, the gas barrier laminate may be in the form of a roll wound around a core material.

[0101] 2. Properties of gas barrier laminate The thickness of the gas barrier laminate can be appropriately determined depending on the application of the adherend to which the gas barrier laminate is to be attached, etc. From the viewpoint of handleability, the thickness of the gas barrier laminate is preferably 1 to 1,000 μm, more preferably 50 to 150 μm.

[0102] The water vapor transmission rate of the gas barrier laminate before stretching in an atmosphere of 40°C and a relative humidity of 90% is preferably 1.0 × 10 -2 g / m 2 / day or less, preferably 9.0×10 -3 g / m 2 / day or less, more preferably 6.0 × 10 -3 g / m 2 / day or less, and even more preferably 4.0 × 10 -3 g / m 2 / day or less, particularly preferably 1.0 × 10 -4 g / m 2 / day or less. The water vapor transmission rate of the gas barrier laminate is measured in detail by the method described in the examples. The water vapor permeability of the gas barrier laminate can be set within the above-mentioned range, for example, by providing a gas barrier laminate having a gas barrier layer that satisfies the above-mentioned requirements (1) and (2) according to the manufacturing method of the gas barrier laminate described below.

[0103] In addition, when stretched in the first direction and the second direction, the gas barrier laminate has a water vapor transmission rate of 9.0×10 under conditions of a relative humidity of 90% and 40° C. when the stretching rate, which is expressed as the ratio of the stretched length of the gas barrier laminate to the length in a direction parallel to the main surface of the gas barrier laminate before stretching, is 10%. -2 g / m 2 / day or less, preferably 7.0 × 10 -2 g / m 2 / day or less, more preferably 5.0 × 10 -2 g / m 2 / day or less. The water vapor transmission rate of the gas barrier laminate after stretching is measured in detail by the method described in the examples. The water vapor permeability of the gas barrier laminate after stretching can be set within the above-mentioned range by forming a gas barrier laminate having a gas barrier layer that satisfies the above-mentioned requirements (1) and (2), and then arranging a first gas barrier layer (X1) having a first slit and a second gas barrier layer (X2) having a second slit extending in a direction intersecting the first slit, via an intermediate layer (Y) having a predetermined storage modulus, as described above.

[0104] The gas barrier laminate has a light transmittance in the wavelength region of 400 to 780 nm of preferably 50% or more, more preferably 75% or more, even more preferably 80% or more, and particularly preferably 85% or more, from the viewpoint of obtaining high light transmittance. There is no particular upper limit, and it is 100%. The light transmittance of the gas barrier laminate can be set within the above-mentioned range by providing a gas barrier laminate having a gas barrier layer that satisfies the above-mentioned requirements (1) and (2) and by selecting an appropriate material and thickness for the intermediate layer (Y). Specifically, the light transmittance is measured by the method described in the examples.

[0105] 3. Method for producing gas barrier laminate The method for producing a gas barrier laminate according to an embodiment of the present invention includes the following steps. First gas barrier layer forming step: a step of forming a first gas barrier layer (X1). Second gas barrier layer forming step: a step of forming a second gas barrier layer (X2). First lamination step: a step of obtaining a laminate in which a first gas barrier layer (X1) and an intermediate layer (Y) are laminated in this order. Second lamination step: a step of obtaining a laminate in which the intermediate layer (Y) and the second gas barrier layer (X2) are laminated in this order. First slit forming step: a step of forming a first slit in the first gas barrier layer (X1), the first slit extending in a first direction parallel to the main surface of the first gas barrier layer (X1), before, during, or after the first lamination step. Second slit forming step: a step of forming second slits in the second gas barrier layer (X2), the second slits extending in a second direction parallel to the main surface of the second gas barrier layer (X2) and intersecting the first direction, before the second lamination step, during the first lamination step, or after the second lamination step. The above-mentioned manufacturing method for a gas barrier laminate can provide a gas barrier laminate having two gas barrier layers with an intermediate layer (Y) interposed therebetween, and in which the slits formed in each gas barrier layer intersect with each other. Hereinafter, examples of manufacturing methods for obtaining each of the above-mentioned gas barrier laminates will be specifically described with reference to the drawings.

[0106] <Manufacturing method 1> An example of a method for manufacturing the gas barrier laminate 100 of the first example and the gas barrier laminate 101 of the second example is a manufacturing method in which the first slit forming step is performed after the first lamination step, and the second slit forming step is performed after the second lamination step. According to this manufacturing method, a gas barrier layer having slits can be formed on a base layer without an intervening adhesive layer, and a gas barrier laminate having a simple configuration with a small number of parts can be manufactured.

[0107] Fig. 13 is a process chart showing an example of a method for producing the first example of the gas barrier laminate 100. Fig. 13(a) to Fig. 13(e1) are cross-sectional views corresponding to Fig. 3(A), and Fig. 13(e2) is a cross-sectional view corresponding to Fig. 3(B). 13(a), first, a common base material layer 23 is prepared, which will become the intermediate layer 60. An anchor layer may be provided on at least one of the two main surfaces of the common base material layer 23. This also applies to the manufacturing methods described below. Next, the first gas barrier layer 11 made of a silicon nitride film, a silicon oxide film, or the like is formed on one main surface of the common base layer 23 by vapor deposition, sputtering, or the like (see FIG. 13(b)). Next, the second gas barrier layer 12 made of a silicon nitride film, a silicon oxide film, or the like is formed on the other main surface of the common base layer 23 by vapor deposition, sputtering, or the like (see FIG. 13(c)). When forming a gas barrier layer having a modified layer as in the gas barrier laminate 101 of the second example, for example, a polysilazane composition is applied to one main surface of the common base layer 23 and dried to form a polysilazane layer, and the polysilazane layer is then subjected to a modification treatment such as plasma ion treatment to form the modified layer.

[0108] Next, dicing is performed from the upper surface side of the first gas barrier layer 11 to form slits 71 (see FIG. 13(d)). Also, dicing is performed from the lower surface side of the second gas barrier layer 12 to form slits 72. At this time, the slits 72 are formed so that the extension direction of the slits 72 intersects with the extension direction of the slits 71 (see FIGS. 13(e1) and 13(e2)).

[0109] The dicing method for forming the slits 71 and 72 is not particularly limited, and examples thereof include a method using a dicing blade and laser dicing. Laser dicing is preferred from the viewpoint of facilitating the formation of narrow slits. This also applies to the manufacturing methods described below. When forming the slits, the dicing processing position, processing speed, processing time, etc. are appropriately adjusted to form slits with a depth corresponding to the thickness of the gas barrier layer, so that the slits can be formed so that they do not substantially reach the common base material layer 23.

[0110] <Manufacturing method 2> A manufacturing method for the gas barrier laminate 102 of the third example and the gas barrier laminate 103 of the fourth example may include a manufacturing method in which the first slit formation step is performed after the first lamination step, the second slit formation step is performed after the second lamination step, and in the first slit formation step and the second slit formation step, dicing is performed so that the tip of the slit in the depth direction reaches halfway through the common base material layer 23.

[0111] Fig. 14 is a process chart showing an example of a method for producing the gas barrier laminate 102 of the third example. Fig. 14(a) to Fig. 14(e1) are cross-sectional views corresponding to Fig. 7(A), and Fig. 14(e2) is a cross-sectional view corresponding to Fig. 7(B). 14(a) to 14(c) are the same as the processes shown in Figures 13(a) to 13(c). Then, as shown in Figure 14(d), when forming slits 71 in the first gas barrier layer 11, unlike the process shown in Figure 13(d), dicing is performed so that the tip of the slit 71 in the depth direction reaches a depth halfway through the common base material layer 23. Also, as shown in Figures 14(e1) and 14(e2), when forming slits 72 in the second gas barrier layer 12, dicing is performed so that the extension direction of the slit 72 intersects the extension direction of the slit 71 and the tip of the slit 72 in the depth direction reaches a depth halfway through the common base material layer 23. In this way, the gas barrier laminate 102 is obtained. In this manufacturing method, the tip of the slit in the depth direction reaches partway through the common base material layer 23, so there is a high degree of freedom in processing when forming the slit, and the gas barrier laminate 102 can be manufactured easily. When forming a gas barrier layer having a modified layer as in the gas barrier laminate 103 of the fourth example, for example, a polysilazane composition is applied to each of the two main surfaces of the common base layer 23 and dried to form a polysilazane layer, and the polysilazane layer is then subjected to a modification treatment such as plasma ion treatment to form the modified layer.

[0112] <Manufacturing method 3> A manufacturing method for the gas barrier laminate 104 of the fifth example above includes a manufacturing method in which the first slit forming step is performed during the first lamination step, and the second slit forming step is performed before the second lamination step. According to this production method, a gas barrier laminate having two gas barrier layers each having a slit formed therein can be easily produced.

[0113] Fig. 15 is a process chart showing the method for producing the gas barrier laminate 104 of the fifth example. As shown in Fig. 15(a1), first, a first base layer 21 is prepared. Next, for example, a polysilazane composition is applied onto the first base layer 21 and dried to form a polysilazane layer (see FIG. 15(b1)). The polysilazane layer is modified from the upper surface side to form a modified layer 11a. The remaining portion other than the modified layer 11a becomes an unmodified layer 11b (see FIG. 15(c1)). In this way, a gas barrier film is obtained as an intermediate laminate in which the first gas barrier layer 11 and the first base layer 21 constituting a part of the intermediate layer (Y) are laminated.

[0114] Next, dicing is performed from the upper surface side of the modified layer 11a to form slits 71 that reach halfway through the first base material layer 21 (see FIG. 15(d1)). In this manufacturing method, the intermediate layer (Y) is completed by forming the adhesive layer 30 described below, so the first slit formation step is performed during the first lamination step.

[0115] On the other hand, a second base material layer 22 is prepared (see FIG. 15(a2)), and for example, a polysilazane composition is applied onto the second base material layer 22 and dried to form a polysilazane layer (see FIG. 15(b2)). The polysilazane layer is modified from the upper surface side to form a modified layer 12a. The remaining portion other than the modified layer 12a becomes an unmodified layer 12b (see FIG. 15(c2)). In this way, a gas barrier film is obtained as an intermediate laminate in which the second gas barrier layer 12 is laminated on the second base layer 22. Next, dicing is performed from the upper surface side of the modified layer 12a to form slits 72 that reach partway through the second base layer 22 (see FIG. 15(d2)).

[0116] Next, an adhesive layer 30 is formed on the lower surface of the first base material layer 21 (the surface on which the slits 71 of the intermediate laminate composed of the first gas barrier layer 11 and the first base material layer 21 are not formed) (see FIG. 15(e)). As a result, an intermediate laminate with an intermediate layer is formed, in which the intermediate layer 60 composed of the first base material layer 21 and the adhesive layer 30 and the first gas barrier layer 11 are laminated together. Next, the upper surface (the surface on which the slits 72 are formed) of a laminate composed of the second gas barrier layer 12 with the slits 72 formed therein and the second base material layer 22 is attached to the lower surface of the first base material layer 21 via the adhesive layer 30. At this time, the laminate is attached so that the extending direction of the slits 72 intersects with the extending direction of the slits 71. In this way, the intermediate layer 60 and the second gas barrier layer 12 are laminated together, and the gas barrier laminate 100 is completed.

[0117] If the first gas barrier layer 11 and the second gas barrier layer 12 do not have a modified layer, a gas barrier layer made of a silicon nitride film, a silicon oxide film, or the like may be formed by vapor deposition, sputtering, or the like, and the modification treatment may be omitted. This also applies to the manufacturing methods described below.

[0118] Alternatively, after providing the adhesive layer 30 on the back surface of the second base material layer 22, the back surface of the first base material layer 21 on which the slits 71 have been formed may be attached to the back surface of the second base material layer 22 via the adhesive layer 30. Alternatively, the first base material layer 21 on which the first gas barrier layer 11 has been formed and the second base material layer 22 on which the second gas barrier layer 12 has been formed may be attached together with the adhesive layer 30, and then the slits may be formed.

[0119] <Manufacturing method 4> Examples of a manufacturing method for the gas barrier laminate 105 of the sixth example and the gas barrier laminate 106 of the seventh example include a manufacturing method in which the first gas barrier layer forming step and the first slit forming step are performed, and also the second gas barrier layer forming step and the second slit forming step are performed, and then the two laminates are bonded together with the adhesive layer 30 constituting the intermediate layer (Y), thereby carrying out the first lamination step and the second lamination step. According to this production method, a gas barrier laminate having two gas barrier layers each having a slit formed therein can be easily produced.

[0120] FIG. 16 is a process chart showing a method for producing the gas barrier laminate 105 of the sixth example. The steps shown in Figures 16(a1) to 16(d1) are similar to the steps shown in Figures 15(a1) to 15(d1), and the steps shown in Figures 16(a2) to 16(d2) are similar to the steps shown in Figures 15(a2) to 15(d2), so detailed explanations will be omitted. Next, an adhesive layer 30 is formed on the surface of the laminate with the slits 71 formed therein, obtained in FIG. 16(d1) (see FIG. 16(e)). Then, the surface of the adhesive layer 30 with the slits 72 formed therein, obtained in FIG. 16(d2) (see FIG. 16(f)), is attached to the surface opposite the laminate, on which the adhesive layer 30 is attached. In this way, a gas barrier laminate 101 is obtained.

[0121] FIG. 17 is a process chart showing a method for producing the gas barrier laminate 106 of the seventh example. The steps shown in Figures 17(a1) to 17(d1) are similar to the steps shown in Figures 15(a1) to 15(d1), and the steps shown in Figures 17(a2) to 17(d2) are similar to the steps shown in Figures 15(a2) to 15(d2), so detailed explanations will be omitted. Next, an adhesive layer 30 is formed on the surface of the laminate obtained in FIG. 17(d1) with the slits 71 formed thereon (the main surface on the first base material layer 21 side) on which the slits 71 are not formed (see FIG. 17(e)). Then, the surface of the adhesive layer 30 opposite the laminate obtained in FIG. 17(d2) with the slits 72 formed thereon (the main surface on the second base material layer 22 side) is attached to the surface of the adhesive layer 30 opposite the laminate (see FIG. 17(f)). In this way, a gas barrier laminate 106 is obtained.

[0122] 4. Method of using the gas barrier laminate The gas barrier laminate according to the embodiment of the present invention can be attached to an adherend using an adhesive layer to prevent moisture and the like from entering the adherend. Examples of methods for using the gas barrier laminate include the following.

[0123] Fig. 18 is a cross-sectional view showing an example of a method of using a gas barrier laminate. Fig. 18 shows the gas barrier laminate 104 of the fifth example described above attached to an adherend 200. The first main surface S1 of the gas barrier laminate 104 is attached to the upper surface of the adherend 200 via an adhesive layer 40. Fig. 18(A) is a cross-sectional view corresponding to Fig. 10(A), and Fig. 18(B) is a cross-sectional view corresponding to Fig. 10(B).

[0124] As shown in Figure 18(A), the slit 71 is located on the adherend 200 side. Also, as shown in Figure 18(B), the slit 72 is located more inward than the second base material layer 22. Therefore, after the gas barrier laminate 104 is attached to the adherend 200, the slits 71 and 72 are not exposed to the outside, so that the gas barrier properties are less likely to deteriorate and damage due to contact with external members, etc. is easily prevented.

[0125] Fig. 19 is a cross-sectional view showing another example of a method of using a gas barrier laminate. Fig. 19 shows the gas barrier laminate 103 of the fourth example described above attached to the upper surface of an adherend 200 via an adhesive layer 40. Fig. 19(A) is a cross-sectional view corresponding to Fig. 8(A), and Fig. 19(B) is a cross-sectional view corresponding to Fig. 8(B). 19, the first main surface S1 (the surface on which the slits 71 are formed) of the gas barrier laminate 103 is attached to the adherend 200. A protective layer 80 is provided on the second main surface S2 of the gas barrier laminate 103 with an adhesive layer 50 interposed therebetween.

[0126] 19(A), the slit 71 is located on the adherend 200 side, and as shown in Fig. 19(B), the slit 72b is located inside the protective layer 80. Therefore, after the gas barrier laminate 103 is attached to the adherend 200, the slits 71 and 72 are not exposed to the outside, so that the gas barrier properties are less likely to deteriorate and damage due to contact with external members, etc. can be easily prevented. The protective layer 80 can be made of the same material as the above-mentioned base layer.

[0127] The gas barrier laminate 103 may be attached with the second main surface S2 facing the adherend 200. In this case, the protective layer 80 is provided on the first main surface S1 of the gas barrier laminate 103 via the adhesive layer 50. The adhesive layers 40 and 50 may be the same as those described in the section "1-5. Adhesive layer" above. [Example]

[0128] Next, specific examples of the present invention will be described, but the present invention is not limited to these examples in any way. The storage modulus of the substrate layer and the substrate layer with the adhesive layer described below, the elongation percentage, elongation length, water vapor transmission rate, and light transmission rate of the gas barrier laminates produced in the production examples described below, and the water vapor transmission rate of the intermediate laminates were measured, calculated, and evaluated by the following procedures.

[0129] [Elongation ratio and elongation length of gas barrier laminate] For the circular gas barrier laminates obtained in the Examples and Comparative Examples, the edges of the gas barrier laminate were gripped at 12 points at 30° intervals along the plane of the gas barrier laminate, moving away from the center, and the gas barrier laminate was stretched radially around the entire circumference using a RAD9200 testing machine. The stretched length ΔL and the length L0 in the direction parallel to the plane of the gas barrier laminate before stretching were measured for one specific point and another point located on the opposite side of the center of the gas barrier laminate using a digital microscope (Keyence Corporation, VHX-5000), and the elongation percentage was calculated using the following formula (1): Elongation rate (%)=(ΔL / L0)×100...Equation (1)

[0130] [Water Vapor Transmission Rate (WVTR)] The water vapor transmission rate (WVTR) (unit: g / m) of the gas barrier laminates obtained in the examples and comparative examples before stretching and at each stretching rate shown in Table 1 was measured using a water vapor transmission rate measuring device (AQUATRAN-2 (AQUATRAN is a registered trademark) manufactured by MOCON). 2 / day") was measured under conditions of a relative humidity of 90% and 40°C. In addition, the WVTR of the gas barrier film A as the base layer and intermediate laminate was measured in the same manner as above, except that stretching was not performed.

[0131] [Light transmittance] For the gas barrier laminates obtained in the examples and comparative examples before stretching, the light transmittance (%) was measured in the wavelength range of 360 to 780 nm, which was the measurement range including the wavelength range of 400 to 780 nm, using an ultraviolet-visible-near-infrared (UV-Vis-NIR) spectrophotometer (manufactured by Shimadzu Corporation, product name "UV-3600").

[0132] [Storage modulus] Intermediate layers in the examples and comparative examples (substrate layers with adhesive layers formed thereon in Examples 1 and 2 and Comparative Example 2, and a single substrate layer in Comparative Example 1) were prepared, and the intermediate layers were cut to a width of 4 mm in plan view and a length such that the distance between the chucks of the measuring device was 30 mm, to prepare test pieces. The storage modulus E' of the intermediate layers at 23°C was measured using the test pieces with the following device and under the following measurement conditions. Measurement equipment: A&D Co., Ltd.'s automatic dynamic viscoelasticity measuring instrument "Leovibron DDV-01FP" Frequency: 1Hz Measurement temperature range: -10 to 120°C Heating rate: 3℃ / min

[0133] [Example 1] <Preparation of Gas Barrier Film A> A 50 μm thick vinyl chloride film with one side treated for easy adhesion was used as the substrate layer. Perhydropolysilazane (DHC-10AM manufactured by DNF Corporation) was applied to the upper surface of this substrate layer and cured by heating at 100°C for 2 minutes to form a 200 nm thick polysilazane layer. Next, using a plasma ion implantation device, plasma ions were implanted into the polysilazane layer under the following conditions to modify the surface of the polysilazane layer, thereby forming a gas barrier layer, thereby obtaining a gas barrier film A. The water vapor permeability of the gas barrier film A was 5.0×10 -4 g / m 2 It was / day. The plasma ion implantation apparatus and plasma ion implantation conditions used in the above modification treatment are as follows: (Plasma ion implantation equipment) RF power supply: Model number "RF56000", manufactured by JEOL Ltd. High-voltage pulse power supply: "PV-3-HSHV-0835", manufactured by Kurita Manufacturing Co., Ltd. (Plasma ion implantation conditions) Plasma generating gas: He Gas flow rate: 100sccm ·Duty ratio: 0.5% Repetition rate: 1,000Hz Applied voltage: -10kV ·RF power supply: Frequency 13.56MHz, applied power 1,000W Chamber pressure: 0.2 Pa Pulse width: 5μsec Processing time (ion implantation time): 800 seconds

[0134] <Preparation of adhesive layer> A pressure-sensitive adhesive composition was prepared by dissolving 100 parts by weight of an isobutylene polymer (a copolymer of isobutylene and isoprene, manufactured by Japan Butyl Co., Ltd., "Exxon Butyl 268"), 20 parts by weight of a diene rubber having hydroxyl groups (a liquid hydrogenated polyisoprene rubber having hydroxyl groups at the main chain terminal, manufactured by Idemitsu Kosan Co., Ltd., "Epol"), and 2.0 parts by weight of a crosslinker (a polyisocyanate compound, manufactured by Nippon Polyurethane Co., Ltd., "Coronate HL") in toluene. This pressure-sensitive adhesive composition was applied to a heavy-release release sheet and dried at 110°C for 1 minute to form a 20 μm thick adhesive layer. Next, a light-release release sheet was attached to the exposed surface of the adhesive layer, and the resulting layer was aged at 23°C and 50% RH for 1 week.

[0135] <Preparation of Gas Barrier Laminate> The obtained gas barrier film A was cut into a circle with a diameter of 80 mm to obtain two circular gas barrier films A. The pressure-sensitive adhesive layer was cut into a circle with a diameter of 80 mm on the surface of one of the circular gas barrier films A on the base layer side (the side opposite the gas barrier layer), and the light release sheet was peeled off to bond the exposed surface. The other side of the circular gas barrier film A and the circular gas barrier film A with a circular adhesive layer attached thereto were half-cut from the gas barrier layer side using a dicing device (Tokyo Seimitsu Co., Ltd.; AWD-4000B, dicing blade: Disco Corporation; 27HEDG) to create multiple parallel slits at 8 mm intervals and a cutting depth of 5.0 μm. Next, the heavy-release release sheet on the adhesive layer of the circular gas barrier film A after slit formation and having an adhesive layer was peeled off, and the other circular gas barrier film A was attached to the exposed adhesive layer with the gas barrier layer side in contact, thereby obtaining a gas barrier laminate. At this time, when viewed from the direction perpendicular to the main surface of the gas barrier laminate, the two circular gas barrier films A were attached so that the extension direction of the slits in one circular gas barrier film A and the extension direction of the slits in the other circular gas barrier film A perpendicularly intersected. The water vapor permeability of this gas barrier laminate was 6.2 × 10 -5 g / m 2 It was / day.

[0136] [Example 2] <Preparation of Gas Barrier Film B> Gas barrier film B was produced in the same manner as in Example 1, except that a polyethylene terephthalate sheet (PET sheet) ("PET50 A4360" manufactured by Toyobo Co., Ltd., thickness 50 μm) was used as the base layer and perhydropolysilazane was applied to the non-adhesive side of this sheet. In this case, a modified gas barrier layer was formed on the PET sheet.

[0137] <Preparation of Gas Barrier Laminate> Using the obtained gas barrier film B, a circular gas barrier film B and a circular adhesive layer attached to the base layer side surface (the surface opposite the gas barrier layer) of the circular gas barrier film B were produced using the same procedure as in Example 1. Then, both films were diced using the same procedure as in Example 1 to form slits in each gas barrier layer. Then, a gas barrier laminate was produced by bonding the two together with the adhesive layer in the same manner as in Example 1. The water vapor permeability of the gas barrier laminate was 5.2×10 -5 g / m 2 It was / day.

[0138] [Comparative Example 1] A gas barrier laminate was prepared using only one circular gas barrier film A with a slit formed therein, which was produced in the same manner as in Example 1.

[0139] Comparative Example 2 A gas barrier laminate was produced using the same procedure as in Example 1, except that in Example 1, the heavy release release sheet on the adhesive layer of one circular gas barrier film A having an adhesive layer was peeled off, and the top surface (the surface facing the gas barrier layer) of the other circular gas barrier film A was attached to the exposed adhesive layer so that the extension directions of the slits formed in the two gas barrier layers were the same (i.e., parallel to each other).

[0140] Tables 1-1 and 1-2 show the measurement results of the physical properties of each gas barrier laminate, together with the layer structure of the gas barrier laminate.

[0141] [Table 1-1]

[0142] [Table 1-2]

[0143] As shown in Table 1-1, the gas barrier laminate of Example 1, in which the storage modulus of the base layer is 25 GPa, shows only a small decrease in gas barrier properties even when the elongation rate is increased, and when the elongation rate is 5%, the WVTR value is 9.1 × 10 -3 g / m 2 / day or less, and even at an elongation rate of 10%, the WVTR value is 3.6 × 10 -2 g / m 2 was kept below / day.

[0144] Furthermore, the gas barrier laminate of Example 2 showed a relatively small decrease in gas barrier properties up to an elongation rate of 2.5%, with a WVTR value of 4.3 × 10 -3 g / m 2 / day or less. However, when the elongation rate reached 5%, the gas barrier property significantly decreased. Although the gas barrier property could be ensured up to a predetermined elongation rate, it was found that the storage modulus of the base layer was greater than that of the base layer of Example 1, and therefore the gas barrier property was not maintained as well against elongation as the gas barrier laminate of Example 1.

[0145] On the other hand, the gas barrier laminate of Comparative Example 1, which has only one gas barrier layer, had a WVTR value of 1.7 × 10 at an elongation rate of 1.3%. -1 g / m 2 / day, which shows that even a slight elongation significantly reduces the gas barrier properties.

[0146] In addition, the gas barrier laminate of Comparative Example 2, in which the slits formed in the two gas barrier layers were in the same direction, had a WVTR value of 1.9 × 10 at an elongation rate of 1.3%. -1 g / m 2 / day, which shows that even a slight elongation significantly reduces the gas barrier properties. [Explanation of symbols]

[0147] 11: First gas barrier layer (X1) 11a: Modified layer 11b: Unmodified layer (gas barrier precursor layer) 12: Second gas barrier layer (X2) 12a: Modified layer 12b: Unmodified layer (gas barrier precursor layer) 21: First base material layer 22: Second substrate layer 23: Common base layer 30, 40, 50: Adhesive layer 60: Middle class (Y) 71, 71a, 71b, 72, 72a, 72b: Slits 80:Protective layer 100, 100A, 100B, 100C, 101, 102, 103, 104, 105, 106: Gas barrier laminate 200: Adherent d1, d1': thickness of the gas barrier layer d2, d2': slit depth d3, d3': thickness of the substrate layer S1: First main surface S2: 2nd principal surface

Claims

1. a first gas barrier layer (X1), an intermediate layer (Y), and a second gas barrier layer (X2) in this order; the first gas barrier layer (X1) has first slits extending in a first direction parallel to the main surface of the first gas barrier layer (X1); a gas barrier laminate, wherein the second gas barrier layer (X2) has a second slit that is parallel to the main surface of the second gas barrier layer (X2) and extends in a second direction that intersects with the first direction.

2. 2. The gas barrier laminate according to claim 1, wherein the storage modulus of the intermediate layer (Y) when measured by a tensile test on the intermediate layer (Y) alone is 300 GPa or less.

3. 3. The gas barrier laminate according to claim 1, wherein at least one selected from the group consisting of the first slit and the second slit has a depth reaching the intermediate layer (Y).

4. The gas barrier laminate according to claim 1 or 2, wherein the intermediate layer (Y) comprises at least one layer selected from the group consisting of a base layer and an adhesive layer.

5. When stretched in the first direction and the second direction, the gas barrier laminate has a water vapor transmission rate of 9.0×10 under conditions of a relative humidity of 90% and 40° C. when the stretching rate, which is expressed as the ratio of the stretched length of the gas barrier laminate to the length in a direction parallel to the main surface of the gas barrier laminate before stretching, is 10%. －２ g / m ２ The gas barrier laminate according to claim 1 or 2, wherein the gas barrier layer is 0.15 times / day or less.

6. 3. The gas barrier laminate according to claim 1, which has a light transmittance of 50% or more in the wavelength region of 400 to 780 nm.

7. a step of forming a first gas barrier layer (X1); a step of forming a second gas barrier layer (X2); a first lamination step for obtaining a laminate in which a first gas barrier layer (X1) and an intermediate layer (Y) are laminated in this order; a second lamination step of obtaining a laminate in which the intermediate layer (Y) and the second gas barrier layer (X2) are laminated in this order; a first slit forming step of forming, in the first gas barrier layer (X1), first slits extending in a first direction parallel to a main surface of the first gas barrier layer (X1) before, during, or after the first lamination step; and a second slit forming step of forming, before or after the second lamination step, second slits in the second gas barrier layer (X2), the second slits extending in a second direction parallel to the main surface of the second gas barrier layer (X2) and intersecting with the first direction.

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