Magnetic sensor

Abstract

To prevent breakage of a magnetic collector caused by thermal expansion of a mold resin, in a magnetic sensor having a structure in which a sensor chip and the magnetic collector are embedded by the mold resin.SOLUTION: The magnetic sensor 1 includes a sensor chip 100 having a device forming face 101 and a back face 102 opposite to each other, and side faces 103 to 106, the sensor chip 100 being mounted on a substrate 10 such that the side faces 105, face a front face 11 of the substrate 10, a magnetic collector 110120 mounted on the substrate, and a molded plastic body 20 embedded at least in a gap S1 formed between the back face 102 of the sensor chip 100 and a connecting portion 123 of the magnetic collector 120, and a gap S2 and a side S3 formed between the side faces 103, of the sensor chip 100 and side plate portions 121122, of the magnetic collector 120, respectively. The length of the gap S1 is equal to or less than the lengths of the gaps S2 and S3.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present disclosure relates to a magnetic sensor, and more particularly to a magnetic sensor including a sensor chip having a magnetic sensing element, a magnetic collector that collects magnetic flux in the sensor chip, and a molding resin that embeds the sensor chip and the magnetic collector. [Background technology]

[0002] Patent Document 1 discloses a magnetic sensor having a structure in which a sensor chip having a magnetic sensing element and a magnetic collector that collects magnetic flux to the sensor chip are mounted on a substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2023 / 204135 Summary of the Invention [Problem to be solved by the invention]

[0004] In this type of magnetic sensor, the sensor chip and magnetic collector are sometimes embedded in a molding resin, which can cause damage to the magnetic collector, which is made of sintered ferrite or the like, due to thermal expansion of the molding resin.

[0005] This disclosure describes a technique for preventing damage to the magnetic collector caused by thermal expansion of the molding resin in a magnetic sensor having a structure in which a sensor chip and a magnetic collector are embedded in a molding resin. [Means for solving the problem]

[0006] A magnetic sensor according to one aspect of the present disclosure includes a substrate, an element forming surface on which a magnetic sensing element is formed, a back surface located opposite the element forming surface, first and second side surfaces perpendicular to the element forming surface and located opposite each other, and third and fourth side surfaces perpendicular to the element forming surface and the first side surface and located opposite each other, the sensor chip being mounted on the substrate so that the first side surface faces the front surface of the substrate, a first magnetic collector mounted on the substrate so as to cover part of the element forming surface of the sensor chip, a first side plate portion covering the third side surface of the sensor chip, and a second magnetic collector mounted on the substrate so as to cover the third side surface of the sensor chip. The sensor chip is provided with a second magnetic collector mounted on a substrate, the second magnetic collector having a second side plate portion covering the fourth side surface of the sensor chip, and a connecting portion connected to the first and second side plate portions and covering the back surface of the sensor chip, and molding resin embedded at least in a first gap formed between the back surface of the sensor chip and the connecting portion of the second magnetic collector, a second gap formed between the third side surface of the sensor chip and the first side plate portion of the second magnetic collector, and a third gap formed between the fourth side surface of the sensor chip and the second side plate portion of the second magnetic collector, wherein the distance of the first gap is less than or equal to the distances of the second and third gaps. [Effects of the Invention]

[0007] According to the present disclosure, in a magnetic sensor having a structure in which a sensor chip and a magnetic collector are embedded in a molding resin, a technique is provided for preventing damage to the magnetic collector due to thermal expansion of the molding resin. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic perspective view showing the appearance of a magnetic sensor 1 according to an embodiment of the present disclosure. [Figure 2] FIG. 2 is a schematic perspective view showing the magnetic sensor 1 with the molding resin 20, the magnetic collector 110, and the bobbin 140 removed. [Figure 3] FIG. 3 is a schematic exploded perspective view showing the magnetic sensor 1 with the molding resin 20, the magnetic collector 110, and the bobbin 140 removed. [Figure 4] FIG. 4 is a schematic perspective view of the sensor chip 100 as viewed from the rear surface 102 side. [Figure 5] 5(a) and 5(b) are both schematic perspective views of the magnetic collector 120, showing the magnetic collector 120 as viewed from different directions. [Figure 6] FIG. 6 is a schematic plan view of the sensor chip 100. As shown in FIG. [Figure 7] FIG. 7 is a schematic cross-sectional view taken along line AA in FIG. [Figure 8] FIG. 8 is a schematic plan view of the magnetic sensor 1 as viewed from the Z direction, showing a state in which the molding resin 20 has been removed. [Figure 9] 9(a) is a graph showing the relationship between the thickness of the connecting portion 123 in the Y direction and the stress applied to the magnetic collector 120. Also, FIG. 9(b) is a graph showing the relationship between the thickness of the overhanging portions 124, 125 in the Y direction and the stress applied to the magnetic collector 120. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the technology according to the present disclosure will be described in detail with reference to the accompanying drawings.

[0010] FIG. 1 is a schematic perspective view showing the appearance of a magnetic sensor 1 according to an embodiment of the present disclosure.

[0011] As shown in FIG. 1 , the magnetic sensor 1 according to this embodiment includes a substrate 10, a sensor chip 100 mounted on a surface 11 of the substrate 10, magnetic collectors 110 and 120, a dummy chip 130, and a bobbin 140, and a molded resin 20. The magnetic collectors 110 and 120 are blocks made of a highly permeable material such as sintered ferrite, and serve to collect a magnetic field to a magnetic sensing element provided on the sensor chip 100. The dummy chip 130 is disposed on the back side of the sensor chip 100, and serves to mechanically reinforce the sensor chip 100. The bobbin 140 is provided to cover the magnetic collector 110, and a compensation coil C1 is wound around the bobbin 140. U-shaped terminal fittings 141 and 142 are fixed to the bobbin 140, and one end of the compensation coil C1 is wound around one protrusion of the terminal fitting 141, and the other end of the compensation coil C1 is wound around one protrusion of the terminal fitting 142.

[0012] 2 and 3 are a schematic perspective view and a schematic exploded perspective view, respectively, showing the magnetic sensor 1 with the mold resin 20, the magnetic collector 110, and the bobbin 140 removed.

[0013] 2 and 3, electrode patterns 12 to 19 are provided on the surface 11 of the substrate 10. The electrode patterns 12 and 13 are connected to the other protrusions of the terminal fittings 141 and 142, respectively. The electrode patterns 14 to 19 are connected to the power supply terminal and signal terminal of a bridge circuit including a magnetic sensing element integrated on the sensor chip 100, and to a compensation coil integrated on the sensor chip 100.

[0014] 3, the sensor chip 100 has an element forming surface 101 and a back surface 102 which are located opposite each other and form an XZ plane, side surfaces 103 and 104 which are located opposite each other and form a YZ plane, and side surfaces 105 and 106 which are located opposite each other and form an XY plane, and is mounted on the substrate 10 so that the side surface 105 faces the front surface 11 of the substrate 10. A magnetic sensing element and magnetic layers M1 to M3, which will be described later, are formed on the element forming surface 101 of the sensor chip 100.

[0015] FIG. 4 is a schematic perspective view of the sensor chip 100 as viewed from the rear surface 102 side.

[0016] As shown in FIG. 4 , the back surface 102 of the sensor chip 100 is covered with a dummy chip 130. The size of the dummy chip 130 in the XZ directions may be approximately the same as the size of the sensor chip 100 in the XZ directions. The thickness of the dummy chip 130 in the Y direction may be greater than the thickness of the sensor chip 100 in the Y direction. The dummy chip 130 may be provided with a notch 131 that exposes a part of the back surface 102 of the sensor chip 100. Although providing the dummy chip 130 is not essential in the present invention, covering the back surface 102 of the sensor chip 100 with the dummy chip 130 not only protects the sensor chip 100 but also alleviates stress applied to the magnetic collector 120 due to thermal expansion of the mold resin 20.

[0017] 5(a) and 5(b) are both schematic perspective views of the magnetic collector 120, showing the magnetic collector 120 as viewed from different directions.

[0018] 5(a) and 5(b), the magnetic collector 120 includes side plate portions 121 and 122 extending in the Y direction, a connecting portion 123 connected to an end of the side plate portion 121 in the +Y direction and an end of the side plate portion 122 in the +Y direction, an overhang portion 124 connected to an end of the side plate portion 121 in the -Y direction, and an overhang portion 125 connected to an end of the side plate portion 122 in the -Y direction. The connecting portion 123 may have a notch 126 in a portion facing the front surface 11 of the substrate 10. The connecting portion 123 may also have a notch 127 on the side opposite to the notch 126.

[0019] 1 to 3, the sensor chip 100 and the dummy chip 130 are arranged in an area surrounded by the side plate portions 121 and 122, the connecting portion 123, and the overhang portions 124 and 125 that constitute the magnetic collector 120. When the sensor chip 100 is arranged in an area surrounded by the magnetic collector 120, the side surface 103 of the sensor chip 100 is covered by the side plate portion 121 of the magnetic collector 120, the side surface 104 of the sensor chip 100 is covered by the side plate portion 122 of the magnetic collector 120, the back surface 102 of the sensor chip 100 is covered by the connecting portion 123 of the magnetic collector 120 via the dummy chip 130, and the element forming surface 101 of the sensor chip 100 is covered by the overhang portions 124 and 125 of the magnetic collector 120.

[0020] FIG. 6 is a schematic plan view of the sensor chip 100, and FIG. 7 is a schematic cross-sectional view taken along line AA in FIG.

[0021] As shown in FIGS. 6 and 7, four magnetically sensitive elements R1 to R4 that form a bridge circuit are formed on the element forming surface 101 of the sensor chip 100. The magnetically sensitive elements R1 to R4 are not particularly limited as long as they are elements whose electrical resistance changes depending on the direction of magnetic flux, and for example, MR elements can be used. The fixed magnetization directions of the magnetically sensitive elements R1 to R4 are aligned in the same direction (for example, the positive side in the X direction). The magnetically sensitive elements R1 to R4 are provided on the surface of an insulating layer 107 that covers the element forming surface 101. The magnetically sensitive elements R1 to R4 are covered with an insulating layer 108, and magnetic layers M1 to M3 made of permalloy or the like are formed on the surface of the insulating layer 108. The magnetic layers M1 to M3 are covered with an insulating layer 109. The magnetic layer M1 is disposed approximately in the center of the element forming surface 101 in the X direction. The magnetic layers M2 and M3 are disposed on both sides of the element forming surface 101 in the X direction so as to sandwich the magnetic layer M1 in the X direction.

[0022] The magnetic layers M1 and M2 form two gaps G1 and G2 that extend in the Z direction and have the X direction as their width direction. The positions of the gaps G1 and G2 in the X direction coincide with each other, and they are aligned in the Z direction. The magnetic layers M1 and M3 form two gaps G3 and G4 that extend in the Z direction and have the X direction as their width direction. The positions of the gaps G3 and G4 in the X direction coincide with each other, and they are aligned in the Z direction. Furthermore, the gaps G1 and G3 are aligned in the X direction, and the gaps G2 and G4 are aligned in the X direction. The magnetic sensing elements R1 to R4 are positioned so as to overlap the gaps G1 to G4, respectively, in a plan view seen from the Y direction. As a result, the magnetic field in the X direction passing through the magnetic gaps G1 to G4 is applied to the magnetic sensing elements R1 to R4, respectively.

[0023] 6 and 7, the area indicated by the symbol 110a indicates the area covered from the Y direction by the XZ plane located at the end of the magnetic collector 110 in the +Y direction, and the areas indicated by the symbols 124a and 125a indicate the areas covered from the Y direction by the overhanging portions 124 and 125 of the magnetic collector 120, respectively.

[0024] The regions 110a, 124a, and 125a overlap the magnetic layers M1 to M3, respectively. As a result, the magnetic layer M1 is covered from the Y direction by the magnetic collector 110, the magnetic layer M2 is covered from the Y direction by the overhanging portion 124 of the magnetic collector 120, and the magnetic layer M3 is covered from the Y direction by the overhanging portion 125 of the magnetic collector 120. The magnetic field in the Y direction, which is the magnetic field to be detected, is collected by the magnetic collector 110 and applied to the magnetic layer M1 via the magnetic collector 110. The magnetic field applied to the magnetic layer M1 is bent in the +X direction and the −X direction in the magnetic layer M1. The magnetic flux component bent in the −X direction in the magnetic layer M1 is supplied to the magnetic layer M2 through the gaps G1 and G2, and then flows to the overhanging portion 124 of the magnetic collector 120, the side plate portion 121, and the connecting portion 123. At this time, part of the magnetic flux passing through gaps G1 and G2 in the -X direction is applied to magnetic sensing elements R1 and R2. Meanwhile, the magnetic flux component bent in the +X direction in magnetic layer M1 is supplied to magnetic layer M3 through gaps G3 and G4, and then flows to overhang portion 125 of magnetic collector 120, side plate portion 122, and connecting portion 123. At this time, part of the magnetic flux passing through gaps G3 and G4 in the +X direction is applied to magnetic sensing elements R3 and R4.

[0025] Although it is not essential to provide the overhanging portions 124, 125 on the magnetic collector 120, by covering the magnetic layers M2, M3 with the overhanging portions 124, 125, respectively, it is possible to significantly reduce the magnetic resistance between the magnetic collector 110 and the magnetic collector 120. Furthermore, even if the magnetic collector 120 does not have the overhanging portions 124, 125, it is possible to reduce the magnetic resistance between the magnetic collector 110 and the magnetic collector 120 by covering the side surfaces 103, 104 of the sensor chip 100 with the side plate portions 121, 122 of the magnetic collector 120. Furthermore, by covering the back surface 102 of the sensor chip 100 with the connecting portion 123 of the magnetic collector 120, it is possible to efficiently apply the magnetic field in the Y direction to be detected to the magnetic sensitive elements R1 to R4.

[0026] As shown in Fig. 7, a compensation coil C2 is provided on the sensor chip 100. The compensation coil C2 is provided, for example, at a position overlapping with the magnetic sensing elements R1 to R4, and when a compensation current flows through the compensation coil C2, a canceling magnetic field is applied to the magnetic sensing elements R1 to R4. In the example shown in Fig. 7, the compensation coil C2 is provided on the element forming surface 101. As described above, the magnetic sensor 1 according to this embodiment has two compensation coils C1 and C2. The canceling magnetic field may be applied to the magnetic sensing elements R1 to R4 using either one of the compensation coils C1 and C2, or both of the compensation coils C1 and C2.

[0027] FIG. 8 is a schematic plan view of the magnetic sensor 1 according to this embodiment as viewed from the Z direction, showing a state in which the molding resin 20 has been removed.

[0028] 8, when the sensor chip 100 and the dummy chip 130 are arranged in an area surrounded by the magnetic collector 120, a gap S1 is formed between the back surface 102 of the sensor chip 100 and the connecting portion 123 of the magnetic collector 120 via the dummy chip 130, a gap S2 is formed between the side surface 103 of the sensor chip 100 and the side plate portion 121 of the magnetic collector 120, and a gap S3 is formed between the side surface 104 of the sensor chip 100 and the side plate portion 122 of the magnetic collector 120. Therefore, when the mold resin 20 is formed on the front surface 11 of the substrate 10, the mold resin 20 fills these gaps S1 to S3.

[0029] Molding resin 20 that has entered gaps S1 to S3 expands at high temperatures, which applies stress to magnetic collector 120. In particular, because gap S1 has a larger area than gaps S2 and S3, if a large amount of molding resin 20 enters gap S1, not only is strong stress applied to connecting portion 123 of magnetic collector 120 itself, but strong stress is also applied via connecting portion 123 to the base portions of overhanging portions 124 and 125.

[0030] Taking this into consideration, in this embodiment, the distance W1 of gap S1 in the Y direction is designed to be less than the distance W2 of gap S2 in the X direction and the distance W3 of gap S3 in the X direction. This makes it less likely that damage to magnetic collector 120 will occur due to thermal expansion of molded resin 20 that has entered gap S1. As an example, the distance W1 of gap S1 in the Y direction is 150 μm, and the distances W2 and W3 of gaps S2 and S3 in the X direction are 180 μm.

[0031] In order to reduce the distance W1 of the gap S1 in the Y direction, the thickness of the connecting portion 123 of the magnetic collector 120 in the Y direction itself may be increased, or a dummy chip 130 may be used. The thickness of the connecting portion 123 of the magnetic collector 120 in the Y direction may be greater than the thickness of the side plate portions 121, 122 of the magnetic collector 120 in the X direction. For example, if the thickness of the side plate portions 121, 122 in the X direction is 0.5 to 0.6 mm, the thickness of the connecting portion 123 in the Y direction may be twice that or more, for example, 1.0 mm or more, or 1.3 mm or more.

[0032] 5(a) and 5(b), if a notch 126 is provided in the connecting portion 123 of the magnetic collector 120, even if the molded resin 20 entering the gap S1 thermally expands, the notch 126 forms a space between the connecting portion 123 and the surface 11 of the substrate 10. This space serves as an escape route for the thermally expanded molded resin 20, making the magnetic collector 120 less likely to be damaged. The greater the depth of the notch 126 in the Z direction, the greater the effect of alleviating stress. However, if the depth in the Z direction is too great, the magnetic properties of the magnetic collector 120 and the mechanical strength of the connecting portion 123 decrease. Therefore, for example, if the thickness of the connecting portion 123 in the Y direction is 1.3 mm, setting the depth of the notch 126 in the Z direction to 0.3 to 0.4 mm effectively prevents damage to the magnetic collector 120 due to the thermal expansion of the molded resin 20 while suppressing degradation of the magnetic properties and mechanical strength.

[0033] On the other hand, the notch 127 provided in the connecting portion 123 has only a small effect in alleviating the stress applied to the connecting portion 123. However, if a notch 127 having the same shape as the notch 126 is provided, the magnetic collector 120 will have a rotationally symmetric shape with the Y direction as its axis, and therefore there is no need to check the up-down direction of the magnetic collector 120 during assembly. Moreover, when the magnetic collector 120 is produced by bonding two blocks together, the two blocks will have the same shape, which reduces manufacturing costs. Note that the boundary 128 shown in Figures 5(a) and (b) indicates the position where the two blocks are bonded together.

[0034] 9(a) is a graph showing the relationship between the thickness of the connecting portion 123 in the Y direction and the stress applied to the magnetic collector 120. Also, FIG. 9(b) is a graph showing the relationship between the thickness of the overhanging portions 124, 125 in the Y direction and the stress applied to the magnetic collector 120.

[0035] 9(a) and 9(b), although the stress applied to the magnetic collector 120 increases as the environmental temperature increases, it can be seen that the stress applied to the magnetic collector 120 is alleviated as the thickness of the connecting portion 123 in the Y direction and the thickness of the overhanging portions 124 and 125 in the Y direction increase. Here, if the magnetic collector 120 is made of a sintered ferrite body, damage will occur if the stress applied to the magnetic collector 120 exceeds 110 MPa. Taking this into consideration, if the product's guaranteed temperature is 85°C, damage to the magnetic collector 120 can be prevented by setting the thickness of the connecting portion 123 in the Y direction to approximately 0.9 mm or more and the thickness of the overhanging portions 124 and 125 in the Y direction to approximately 0.39 mm or more. Alternatively, if the product's guaranteed temperature is 125°C, damage to the magnetic collector 120 can be prevented by making the thickness of the connecting portion 123 in the Y direction approximately 1.3 mm or more and the thickness of the overhanging portions 124, 125 in the Y direction approximately 0.54 mm or more.

[0036] The above describes the embodiments of the present disclosure, but the present disclosure is not limited to the above embodiments, and various modifications are possible within the scope of the present disclosure, and it goes without saying that these modifications are also included within the scope of the present disclosure.

[0037] The technology according to the present disclosure includes, but is not limited to, the following configuration examples.

[0038] A magnetic sensor according to one aspect of the present disclosure includes a substrate, an element forming surface on which a magnetic sensing element is formed, a back surface located opposite the element forming surface, first and second side surfaces perpendicular to the element forming surface and located opposite each other, and third and fourth side surfaces perpendicular to the element forming surface and the first side surface and located opposite each other, the sensor chip being mounted on the substrate so that the first side surface faces the front surface of the substrate, a first magnetic collector mounted on the substrate so as to cover part of the element forming surface of the sensor chip, a first side plate portion covering the third side surface of the sensor chip, and a second magnetic collector mounted on the substrate so as to cover the third side surface of the sensor chip. a second magnetic collector mounted on a substrate, the second magnetic collector having a connecting portion connected to the first and second side plates and covering the back surface of the sensor chip, a first gap formed between the back surface of the sensor chip and the connecting portion of the second magnetic collector, a second gap formed between the third side surface of the sensor chip and the first side plate of the second magnetic collector, and a third gap formed between the fourth side surface of the sensor chip and the second side plate of the second magnetic collector, wherein the distance of the first gap is equal to or less than the distances of the second and third gaps, thereby mitigating stress applied to the second magnetic collector due to thermal expansion of the mold resin.

[0039] The magnetic sensor may further include a dummy chip disposed between the rear surface of the sensor chip and the connecting portion of the second magnetic collector, and the first gap may be formed between the dummy chip and the connecting portion of the second magnetic collector. This allows the first gap to be narrowed even when the sensor chip is thin.

[0040] In the magnetic sensor, the thickness of the connecting portion of the second magnetic collector may be greater than the thickness of the first and second side plate portions of the second magnetic collector, which makes the second magnetic collector less susceptible to damage.

[0041] In the magnetic sensor described above, the connecting portion of the second magnetic collector may have a notch so as to form a space between the connecting portion of the second magnetic collector and the surface of the substrate. This makes it more difficult for the second magnetic collector to be damaged. In this case, the second magnetic collector may have a rotationally symmetric shape. This makes it easier to manufacture the second magnetic collector.

[0042] In the magnetic sensor described above, the second magnetic collector may further include a first overhang connected to the first side plate and covering another part of the element formation surface of the sensor chip, and a second overhang connected to the second side plate and covering yet another part of the element formation surface of the sensor chip, thereby enabling the magnetic flux to be more concentrated on the element formation surface of the sensor chip.

[0043] In the magnetic sensor, the second magnetic collector may be made of a sintered ferrite, which makes it possible to prevent the second magnetic collector, which is brittle, from being damaged. [Explanation of symbols]

[0044] 1 Magnetic sensor 10 Substrate 11 Surface of the board 12~19 Electrode patterns 20 Molding resin 100 sensor chips 101 Element formation surface 102 Back side 103~106 Side 107~109 Insulating layer 110,120 Magnetic collector 110a,124a,125a area 121,122 Side plate part 123 Connecting part 124,125 Overhang 126,127 Notch 128 Boundary 130 Dummy Chip 131 Notch 140 bobbins 141,142 Terminal fittings C1, C2 compensation coil G1~G4 Gap M1~M3 magnetic layer R1~R4 magnetic sensing element S1~S3 gap W1~W3 distance

Claims

1. A substrate; a sensor chip having an element forming surface on which a magnetic sensing element is formed, a back surface located opposite to the element forming surface, first and second side surfaces perpendicular to the element forming surface and located opposite to each other, and third and fourth side surfaces perpendicular to the element forming surface and the first side surface and located opposite to each other, the sensor chip being mounted on the substrate so that the first side surface faces the surface of the substrate; a first magnetic collector mounted on the substrate so as to cover a part of the element forming surface of the sensor chip; a second magnetic collector mounted on the substrate, the second magnetic collector having a first side plate portion covering the third side surface of the sensor chip, a second side plate portion covering the fourth side surface of the sensor chip, and a connecting portion connected to the first and second side plate portions and covering the back surface of the sensor chip; a molding resin filled in at least a first gap formed between the rear surface of the sensor chip and the connecting portion of the second magnetic collector, a second gap formed between the third side surface of the sensor chip and the first side plate portion of the second magnetic collector, and a third gap formed between the fourth side surface of the sensor chip and the second side plate portion of the second magnetic collector; Equipped with the first gap distance is equal to or less than the second and third gap distances; Magnetic sensor.

2. a dummy chip disposed between the rear surface of the sensor chip and the connecting portion of the second magnetic collector; the first gap is formed between the dummy tip and the connecting portion of the second magnetic collector; The magnetic sensor according to claim 1 .

3. a thickness of the connecting portion of the second magnetic collector is greater than a thickness of the first and second side plate portions of the second magnetic collector; The magnetic sensor according to claim 1 .

4. a notch is provided in the connecting portion of the second magnetic collector so as to form a space between the connecting portion of the second magnetic collector and the surface of the substrate; The magnetic sensor according to claim 1 .

5. the second magnetic collector has a rotationally symmetric shape; The magnetic sensor according to claim 4 .

6. the second magnetic collector further includes a first overhang portion connected to the first side plate portion and covering another part of the element forming surface of the sensor chip, and a second overhang portion connected to the second side plate portion and covering yet another part of the element forming surface of the sensor chip. The magnetic sensor according to claim 1 .

7. the second magnetic collector is made of a ferrite sintered body; The magnetic sensor according to claim 1 .

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