Method for manufacturing a magnetic sensor element and magnetic sensor element

Abstract

To provide a method for manufacturing a magnetic sensor element and a magnetic sensor element that can reduce variations in sensor characteristics. [Solution] A method for manufacturing a magnetic sensor element 1 comprising a substrate 2, a magnetic wire 3, a detection coil 4, and an insulator 5. A first conductor wiring 41, which constitutes part of the detection coil 4, is formed on the inner wall surface 211 of a groove 21 in the substrate 2. A concave insulating portion 51 is formed in the groove 21 where the first conductor wiring 41 is provided, which constitutes part of the insulator 5 and has a support surface 511 and a pair of guide surfaces 512. The magnetic wire 3 is placed in the groove-shaped space 510 of the concave insulating portion 51. A covering insulating portion 52 is formed, which constitutes part of the insulator 5 and covers the magnetic wire 3 from the opposite side of the support surface 511. A second conductor wiring 42 is formed on the surface of the insulator 5, which constitutes part of the detection coil 4 and is connected to the first conductor wiring 41.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a magnetic sensor element and a magnetic sensor element.

Background Art

[0002] As a magnetic sensor element, a magnetoimpedance element including a substrate, a magnetic wire disposed on the substrate, and a detection coil formed of a thin film conductor spirally provided on the outer periphery of the magnetic wire is disclosed in Patent Document 1.

[0003] In the magnetic sensor element disclosed in Patent Document 1, the magnetic wire is disposed in a groove provided in the substrate. That is, a groove is provided in the substrate, a thin film conductor pattern is formed on the bottom surface and the side surface of the groove, and a thin film conductor pattern is also formed on the surface of an insulator (hereinafter also referred to as an embedded insulator) filled in the groove and embedding the magnetic wire. By connecting these conductor patterns, a detection coil spirally provided on the outer periphery of the magnetic wire is formed.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, the conventional magnetic sensor element has the following problems. In other words, groove formation in the substrate is generally performed by machining, and the width of the groove must be sufficiently large compared to the diameter of the magnetic wire. Therefore, when manufacturing a magnetic sensor element, it is difficult to position the magnetic wire in the center of the groove in the width direction. That is, there is a problem that the magnetic wire is likely to be biased to one side in the width direction of the groove, or that the magnetic wire is likely to bend within the groove. Such bias and bending of the magnetic wire causes variations in the positional relationship between the detection coil formed around the groove (bottom surface, sides, and surface of the embedded insulator) and the magnetic wire. As a result, it becomes difficult to obtain a magnetic sensor element with the desired sensor characteristics.

[0006] This invention has been made in view of the above problems, and aims to provide a method for manufacturing a magnetic sensor element and a magnetic sensor element that can reduce variations in sensor characteristics. [Means for solving the problem]

[0007] One aspect of the present invention is, A method for manufacturing a magnetic sensor element comprising a substrate having grooves, a magnetic wire disposed within the grooves, a detection coil made of a thin film conductor spirally arranged on the outer circumference of the magnetic wire, and an insulator interposed between the magnetic wire and the detection coil, A first conductor wiring constituting a part of the detection coil is formed on the inner wall surface of the groove in the substrate. Within the groove portion in which the first conductor wiring is provided, a concave insulating portion is formed which constitutes a part of the insulator and has a support surface facing the opening side of the groove portion, and a pair of guide surfaces that are erected from the support surface and face each other. The magnetic wire is placed in the groove-like space between the support surface of the concave insulating portion and the pair of guide surfaces. A covering insulating portion is formed which constitutes a part of the insulator and covers the magnetic wire from the opposite side of the support surface. The present invention relates to a method for manufacturing a magnetic sensor element, comprising forming a second conductor wiring on the surface of the insulator, which constitutes a part of the detection coil and is connected to the first conductor wiring.

[0008] Other aspects of the present invention include: A magnetic sensor element comprising a substrate having grooves, a magnetic wire disposed within the grooves, a detection coil made of a thin film conductor spirally arranged on the outer circumference of the magnetic wire, and an insulator interposed between the magnetic wire and the detection coil, The detection coil comprises a first conductor wiring formed on the inner wall surface of the groove in the substrate, and a second conductor wiring formed on the surface of the insulator and connected to the first conductor wiring. The insulator has a concave insulating portion having a groove-shaped space in which the magnetic wire is arranged, and a covering insulating portion that covers the magnetic wire from the opening side of the groove-shaped space. The concave insulating portion is located in a magnetic sensor element, having a support surface facing the opening side of the groove and a pair of guide surfaces that are erected from the support surface and face each other. [Effects of the Invention]

[0009] In the above-described method for manufacturing a magnetic sensor element, a concave insulating portion is formed within the groove, and then a magnetic wire is placed in the groove-shaped space of the concave insulating portion. Therefore, variations in the positional relationship between the detection coil and the magnetic wire can be suppressed. As a result, variations in the sensor characteristics of the resulting magnetic sensor element can be reduced.

[0010] In the above-described magnetic sensor element, the insulator has a concave insulating portion with a groove-shaped space in which the magnetic wire is positioned, and a covering insulating portion that covers the magnetic wire from the opening side of the groove-shaped space. Therefore, variations in the positional relationship between the detection coil and the magnetic wire can be suppressed. As a result, variations in sensor characteristics can be reduced.

[0011] As described above, according to the above aspect, it is possible to provide a method for manufacturing a magnetic sensor element and a magnetic sensor element that can reduce variations in sensor characteristics.

Brief Description of the Drawings

[0012] [Figure 1] Plan view of the magnetic sensor element in Embodiment 1. [Figure 2] Cross-sectional view taken along the arrow II-II in FIG. 1. [Figure 3] Explanatory drawing of the manufacturing method of the magnetic sensor element in Embodiment 1. [Figure 4] Plan explanatory drawing of the state where the first conductor wiring is formed on the substrate having the groove portion in Embodiment 1. [Figure 5] Explanatory drawing of the manufacturing method of the magnetic sensor element following FIG. 3 in Embodiment 1. [Figure 6] Plan explanatory drawing of the state where the concave insulating portion is provided in the groove portion where the first conductor wiring is formed in Embodiment 1. [Figure 7] Explanatory drawing of the manufacturing method of the magnetic sensor element following FIG. 5 in Embodiment 1. [Figure 8] Explanatory drawing explaining the advantages during exposure in Embodiment 1. [Figure 9] Cross-sectional view of the magnetic sensor element in a modification of Embodiment 1. [Figure 10] Cross-sectional view of the magnetic sensor element in Embodiment 2. [Figure 11] Explanatory drawing of the manufacturing method of the magnetic sensor element in Embodiment 3. [Figure 12] Cross-sectional view of the magnetic sensor element in Embodiment 4.

Modes for Carrying Out the Invention

[0013] As the magnetic sensor element, for example, a magneto-impedance element (hereinafter also referred to as a MI element) that utilizes the magneto-impedance effect can be used. However, the magnetic sensor element can also be other than the MI element, such as an electromagnetic induction type fluxgate sensor element that uses a magnetic wire as a core, a magnetic flux response type magnetic flux sensor element, etc.

[0014] The inner wall surface of the groove portion may have a bottom surface and a pair of side surfaces standing upright from the bottom surface, and the side surfaces may be inclined so as to be separated from each other toward the opening side. In this case, it becomes easier to stably form the first conductor wiring and the concave insulating portion. For example, when forming the first conductor wiring and the concave insulating portion using photolithography, it is easy to appropriately perform resist exposure and insulator exposure. Note that the degree of inclination of the side surface of the groove portion is preferably inclined to such an extent that the above-described effects can be obtained, and it is also desirable that the width of the opening portion of the groove portion does not become excessively large. From such a viewpoint, in the present embodiment, for example, the inclination of the side surface with respect to the normal direction of the substrate can be about 20 to 70°, more preferably about 40 to 60°.

[0015] Also, the pair of guide surfaces may have a vertical surface perpendicular to the surface of the substrate, and the magnetic wire can be disposed between the vertical surfaces of the pair of guide surfaces. In this case, it is easy to accurately position the magnetic wire in the width direction with respect to the groove portion. Therefore, variations in the positional relationship between the detection coil and the magnetic wire can be further suppressed. Here, the width direction means a direction orthogonal to both the depth direction of the groove portion and the extending direction of the groove portion. The same shall apply hereinafter unless otherwise specified. Also, "perpendicular to the surface of the substrate" means substantially perpendicular to the surface of the substrate to such an extent that the above-described effects can be obtained, for example, meaning that it is in the range of 80° to 100° with respect to the surface of the substrate.

[0016] Furthermore, the pair of guide surfaces may have chamfered portions at their opening-side ends that are inclined to move further apart from each other as they move toward the opening. In this case, it becomes easier to position the magnetic wire in the groove-like space of the concave insulating portion, thereby improving the productivity of the magnetic sensor element.

[0017] Furthermore, the distance between the vertical surfaces of the pair of guide surfaces can be set to 1 to 1.5 times the diameter of the magnetic wire. In this case, variations in the positional relationship between the detection coil and the magnetic wire can be effectively suppressed. From this viewpoint, more preferably, the distance between the vertical surfaces of the pair of guide surfaces can be set to 1.1 to 1.3 times the diameter of the magnetic wire.

[0018] (Embodiment 1) A method for manufacturing a magnetic sensor element and embodiments relating to the magnetic sensor element will be described with reference to Figures 1 to 8. As shown in Figures 1 and 2, the magnetic sensor element 1 in this embodiment comprises a substrate 2 with grooves 21, a magnetic wire 3, a detection coil 4 made of a thin film conductor, and an insulator 5.

[0019] As shown in Figure 2, the magnetic wire 3 is arranged within the groove 21. The detection coil 4 is spirally arranged around the outer circumference of the magnetic wire 3. The insulator 5 is interposed between the magnetic wire 3 and the detection coil 4.

[0020] The detection coil 4 has a first conductor wiring 41 and a second conductor wiring 42. The first conductor wiring 41 is formed on the inner wall surface 211 of the groove 21 in the substrate 2. The second conductor wiring 42 is formed on the surface of the insulator 5 and is connected to the first conductor wiring 41.

[0021] The insulator 5 has a concave insulating portion 51 and a covering insulating portion 52. The concave insulating portion 51 has a groove-shaped space 510 in which the magnetic wire 3 is positioned. The covering insulating portion 52 covers the magnetic wire 3 from the opening side of the groove-shaped space 510. The concave insulating portion 51 has a support surface 511 facing the opening side of the groove portion 21, and a pair of guide surfaces 512 that are erected from the support surface 511 and face each other.

[0022] In this embodiment, the magnetic sensor element 1 is an MI element. The substrate 2 is made of a non-magnetic material, and for example, a ceramic substrate such as alumina or a semiconductor wafer such as silicon can be used. In this embodiment, a silicon substrate is used as the substrate 2, and an SiO2 film 20 (silicon oxide film) is formed on its surface side. The SiO2 film 20 is also formed on the inner wall surface 211 of the groove portion 21.

[0023] The magnetic wire 3 is an amorphous wire, and can be a wire with a substantially circular cross-sectional shape perpendicular to the longitudinal direction. The diameter φ of this magnetic wire 3 can be, for example, 10 to 150 μm, more preferably 10 to 30 μm.

[0024] The inner wall surface 211 of the groove 21 has a bottom surface 212 and a pair of side surfaces 213 that rise from the bottom surface 212. The side surfaces 213 are inclined so that they move further apart from each other as they move toward the opening side. The pair of guide surfaces 512 have vertical surfaces perpendicular to the surface of the substrate 2. A magnetic wire 3 is positioned between the vertical surfaces of the pair of guide surfaces 512. In this embodiment, substantially the entire surface of the guide surface 512 is a vertical surface.

[0025] The distance between the vertical surfaces of the pair of guide surfaces 512 is 1 to 1.5 times the diameter of the magnetic wire 3. More preferably, the distance between the vertical surfaces of the pair of guide surfaces 512 is 1.1 to 1.3 times the diameter of the magnetic wire 3. For example, if the diameter of the magnetic wire 3 is 25 μm, the distance between the vertical surfaces of the pair of guide surfaces 512 can be approximately 30 μm.

[0026] Next, we will first provide an overview of the manufacturing method for the magnetic sensor element 1 of this embodiment. A first conductor wiring 41, which constitutes part of the detection coil 4, is formed on the inner wall surface 211 of the groove 21 in the substrate 2 (see Figures 3 and 4).

[0027] Subsequently, a concave insulating portion 51, which constitutes part of the insulator 5, is formed within the groove 21 where the first conductor wiring 41 is provided (see Figures 5 and 6). The concave insulating portion 51 has a support surface 511 facing the opening side of the groove 21, and a pair of guide surfaces 512 that are erected from the support surface 511 and face each other.

[0028] Subsequently, the magnetic wire 3 is placed in the groove-like space 510 between the support surface 511 of the concave insulating portion 51 and the pair of guide surfaces 512 (see Figure 7). Subsequently, a covering insulation portion 52 is formed, which constitutes part of the insulator 5 and covers the magnetic wire 3 from the opposite side of the support surface 511 (see Figure 7).

[0029] Subsequently, a second conductor wiring 42 is formed on the surface of the insulator 5, which constitutes part of the detection coil 4 and is connected to the first conductor wiring 41 (see Figure 7).

[0030] Next, an example of a manufacturing method for the magnetic sensor element 1 of this embodiment will be described with reference to Figures 3 to 7. First, a silicon substrate is prepared as substrate 2. As shown in step S1 of Figure 3, grooves 21 are formed on the surface of substrate 2. That is, grooves 21 are formed by selectively etching predetermined locations on the surface of substrate 2. Here, anisotropic etching is performed on substrate 2. Specifically, for example, wet etching is performed using an aqueous solution of tetramethylammonium hydroxide (TMAH) as the etching solution. This forms grooves 21 that are inclined so that the side surfaces 213 move further apart from each other as they approach the opening.

[0031] Next, as shown in step S2 of Figure 3, an SiO2 film 20 is formed on the surface of the substrate 2, including the inner wall surface 211 of the groove 21. In this specification, the substrate 2 may also refer to the SiO2 film 20 and the silicon substrate together. The SiO2 film 20 can be formed by sputtering. This SiO2 film 20 ensures electrical insulation between the silicon substrate and the detection coil 4. The SiO2 film 20 is formed uniformly over the entire surface, for example, as a thin film of 1 μm or less.

[0032] Next, as shown in step S3 of Figure 3 and in Figure 4, a first conductor wiring 41 is formed across the inner wall surface 211 of the groove 21 and the surface of the substrate 2. The first conductor wiring 41 can be formed using photolithography. The first conductor wiring 41 can be formed, for example, by plating Cu, Ni-P, and Au in order from the bottom layer.

[0033] Next, as shown in Figures 5 and 6, a concave insulating portion 51 is formed in the groove 21 where the first conductor wiring 41 is provided. Here, the concave insulating portion 51 is formed in two parts in sequence. That is, first, as shown in step S4 of Figure 5, a part of the concave insulating portion 51 (support-side insulating portion 513) is formed along the bottom surface 212 of the groove 21. At least a part of the surface of this support-side insulating portion 513 becomes the support surface 511. Next, as shown in step S5 of Figure 5, the other part of the concave insulating portion 51 (guide-side insulating portion 514) is formed along the side surface 213 of the groove 21. The inner surface of this guide-side insulating portion 514 becomes the guide surface 512. When forming the guide-side insulating portion 514, the guide surface 512 is made perpendicular to the surface of the substrate 2.

[0034] This forms a concave insulating portion 51. The concave insulating portion 51 can be formed using photolithography. The concave insulating portion 51 can be formed using a photosensitive resin material mainly composed of epoxy resin, such as SU-8. When forming the concave insulating portion 51 by photolithography, the photosensitive resin material is deposited on the surface of the substrate 2, including the groove portion 21, before exposure. For example, a spray coating method can be used for film deposition. After deposition of the photosensitive resin material, exposure and development are performed to form the concave insulating portion 51.

[0035] Next, as shown in step S6 of Figure 7, the magnetic wire 3 is inserted into the groove-shaped space 510 of the concave insulating portion 51. At this time, the magnetic wire 3 is guided by the guide surface 512 of the concave insulating portion 51 and positioned at a predetermined position in the width direction. It is also supported by the support surface 511 of the concave insulating portion 51 and positioned at a predetermined position in the opening direction of the groove portion 21.

[0036] Next, as shown in step S7 of Figure 7, a covering insulation portion 52 is formed so as to cover the magnetic wire 3 from the opposite side of the support surface 511. As a result, the magnetic wire 3 is embedded in the insulator 5, which consists of the concave insulation portion 51 and the covering insulation portion 52. In addition, the groove portion 21 is filled with the insulator 5, and the surface of the substrate 2 is flattened. This covering insulation portion 52 can also be formed using the same material and method as the concave insulation portion 51.

[0037] Next, as shown in step S8 of Figure 7, a second conductor wiring 42 is formed on the surface of the insulator 5. The second conductor wiring 42 can also be formed using the same materials and methods as the first conductor wiring 41. The detection coil 4 is formed by connecting the first conductor wiring 41 and the second conductor wiring 42. Based on the above, the magnetic sensor element 1 of this embodiment can be manufactured.

[0038] Furthermore, when manufacturing the magnetic sensor element 1, for example, multiple magnetic sensor elements 1 can be manufactured in parallel on a single large substrate, and then separated into individual magnetic sensor elements 1.

[0039] Next, we will explain the effects and benefits of this embodiment. In the manufacturing method of the magnetic sensor element 1 described above, a concave insulating portion 51 is formed in the groove portion 21, and then the magnetic wire 3 is placed in the groove-shaped space 510 of the concave insulating portion 51. Therefore, variations in the positional relationship between the detection coil 4 and the magnetic wire 3 can be suppressed. As a result, variations in the sensor characteristics of the resulting magnetic sensor element 1 can be reduced.

[0040] Furthermore, the side surfaces 213 on the inner wall surface 211 of the groove 21 are inclined to move further apart from each other as they move toward the opening. This makes it easier to stably form the first conductor wiring 41 and the concave insulating portion 51. In particular, when forming the first conductor wiring 41 and the concave insulating portion 51 using photolithography, it is easier to properly expose the resist and the insulator. That is, as shown in Figure 8, it is easier to reliably irradiate the light L during exposure along the side surfaces 213 of the groove 21, making it easier to suppress the occurrence of unexposed or insufficiently exposed areas.

[0041] Furthermore, the pair of guide surfaces 512 have vertical surfaces perpendicular to the surface of the substrate 2, and the magnetic wire 3 is positioned between the vertical surfaces of the pair of guide surfaces 512. This makes it easier to accurately position the magnetic wire 3 in the width direction relative to the groove 21. Therefore, variations in the positional relationship between the detection coil 4 and the magnetic wire 3 can be further suppressed.

[0042] As described above, this embodiment provides a method for manufacturing a magnetic sensor element and a magnetic sensor element that can reduce variations in sensor characteristics.

[0043] As a modification of the above embodiment 1, as shown in Figure 9, the covering insulating portion 52 can be formed to cover the entire recessed insulating portion 51. That is, in Figure 2 of embodiment 1, an example was shown in which the covering insulating portion 52 is filled into the groove-shaped space 510 in the recessed insulating portion 51, and the covering insulating portion 52 is not placed outside the groove-shaped space 510 in the width direction. However, as shown in Figure 9, the covering insulating portion 52 may be made to cover the entire recessed insulating portion 51.

[0044] (Embodiment 2) As shown in Figure 10, this embodiment has a pair of guide surfaces 512, each having a chamfered portion 515 at the opening end of the groove 21. The chamfered portions 515 are inclined to move further apart from each other as they move towards the opening.

[0045] In this embodiment, a portion of the guide surface 512 becomes a vertical surface, and a chamfered portion 515 is formed on the opening side of the groove 21 relative to the vertical surface. The chamfered portion 515 can be flat or curved. Other aspects are the same as in Embodiment 1.

[0046] In this embodiment, it becomes easier to arrange the magnetic wire 3 in the groove-shaped space 510 of the concave insulating portion 51, thereby improving the productivity of the magnetic sensor element 1. Furthermore, it has the same effects and advantages as Embodiment 1.

[0047] (Embodiment 3) As shown in Figure 11, this embodiment utilizes nanoimprint technology to form the concave insulating portion 51. For example, instead of the method shown in steps S4 and S5 of Figure 5 for manufacturing the magnetic sensor element 1 described in Embodiment 1 above, nanoimprint technology can be used as follows.

[0048] For example, similar to Embodiment 1, as shown in steps S1 to S3 in Figure 3, a first conductor wiring 41 is formed on the substrate 2, including the groove 21. Then, as shown in step S41 in Figure 11, a resin material 51a is provided on the surface of the substrate 2 so as to fill the groove 21. Here, the resin material 51a can be, for example, a thermoplastic resin, a thermosetting resin, or a photocurable resin. In other words, when using thermal nanoimprinting, a thermoplastic resin or a thermosetting resin is used as the resin material 51a. When using optical nanoimprinting, a photocurable resin is used as the resin material 51a.

[0049] Furthermore, nanoimprint technology uses a mold 6 equipped with a mold surface 61 for forming groove-like spaces 510.

[0050] When using thermal nanoimprinting, the mold 6 and substrate 2 are heated to a temperature above the glass transition temperature of the resin material 51a, which is made of thermoplastic or thermosetting resin. In this state, as shown in step S42 of Figure 11, the mold surface 61 of the mold 6 is pressed against the resin material 51a. After the resin material 51a is cooled, it is demolded as shown in step S43 of Figure 11. This transfers the shape of the mold surface 61 to the resin material 51a filled in the grooves 21, forming groove-like spaces 510.

[0051] When using optical nanoimprinting, the mold surface 61 of the mold 6 is pressed onto the resin material 51a, which is made of a photocurable resin, as shown in step S42 of Figure 11. In this state, ultraviolet light is irradiated onto the resin material 51a. Therefore, the mold 6 used is transparent to the ultraviolet light being irradiated. After the resin material 51a has cured, the substrate 2 is released from the mold 6 as shown in step S43 of Figure 11. This transfers the shape of the mold surface 61 to the resin material 51a, forming groove-like spaces 510. The subsequent steps can be the same as those from step S6 onwards in Figure 7 of Embodiment 1. Other aspects are the same as in Embodiment 1.

[0052] In this embodiment, the concave insulating portion 51 can be formed in a single step. That is, in the method shown in Embodiment 1, as shown in Figure 5, it was necessary to form the support-side insulating portion 513 and the guide-side insulating portion 514 sequentially to form the concave insulating portion 51, whereas in this embodiment, the concave insulating portion 51 can be formed in one step. Therefore, the number of steps can be reduced. Furthermore, it has the same effects and advantages as Embodiment 1.

[0053] (Embodiment 4) In this embodiment, as shown in Figure 12, the side surface 213 of the groove 21 formed on the substrate 2 is substantially perpendicular to the surface of the substrate 2. In other words, the inner wall surface 211 of the groove 21 has a bottom surface 212 parallel to the surface of the substrate 2, and side surfaces 213 that are erected substantially vertically from both ends thereof. Other aspects are the same as in Embodiment 1.

[0054] This embodiment also provides the same effects and advantages as Embodiment 1. Although not shown in the figures, the magnetic sensor element 1 of this embodiment can also be configured such that the opening end of the side surface 213 of the groove 21 is provided with the chamfered portion shown in Embodiment 2 (see reference numeral 515 in Figure 10).

[0055] The features of this disclosure are as follows: [1] A method for manufacturing a magnetic sensor element comprising a substrate having grooves, a magnetic wire disposed in the grooves, a detection coil made of a thin film conductor spirally provided on the outer circumference of the magnetic wire, and an insulator interposed between the magnetic wire and the detection coil, A first conductor wiring constituting a part of the detection coil is formed on the inner wall surface of the groove in the substrate. Within the groove portion in which the first conductor wiring is provided, a concave insulating portion is formed which constitutes a part of the insulator and has a support surface facing the opening side of the groove portion, and a pair of guide surfaces that are erected from the support surface and face each other. The magnetic wire is placed in the groove-like space between the support surface of the concave insulating portion and the pair of guide surfaces. A covering insulating portion is formed which constitutes a part of the insulator and covers the magnetic wire from the opposite side of the support surface. A method for manufacturing a magnetic sensor element, comprising forming a second conductor wiring on the surface of the insulator, which constitutes a part of the detection coil and is connected to the first conductor wiring. [2] The inner wall surface of the groove has a bottom surface and a pair of side surfaces erected from the bottom surface, and the side surfaces are inclined to move further apart from each other toward the opening side, the method for manufacturing a magnetic sensor element according to [1]. [3] A method for manufacturing a magnetic sensor element according to [1] or [2], wherein the pair of guide surfaces have vertical surfaces perpendicular to the surface of the substrate, and the magnetic wire is placed between the vertical surfaces of the pair of guide surfaces. [4] A method for manufacturing a magnetic sensor element according to any one of [1] to [3], wherein the pair of guide surfaces have chamfered portions at their opening ends that are inclined to move further apart from each other toward the opening side. [5] A magnetic sensor element comprising a substrate having grooves, a magnetic wire disposed within the grooves, a detection coil made of a thin film conductor spirally provided on the outer circumference of the magnetic wire, and an insulator interposed between the magnetic wire and the detection coil, The detection coil comprises a first conductor wiring formed on the inner wall surface of the groove in the substrate, and a second conductor wiring formed on the surface of the insulator and connected to the first conductor wiring. The insulator has a concave insulating portion having a groove-shaped space in which the magnetic wire is arranged, and a covering insulating portion that covers the magnetic wire from the opening side of the groove-shaped space. The recessed insulating portion comprises a support surface facing the opening side of the groove and a pair of guide surfaces that are erected from the support surface and face each other, thereby forming a magnetic sensor element. [6] The magnetic sensor element according to [5], wherein the inner wall surface of the groove has a bottom surface and a pair of side surfaces erected from the bottom surface, and the side surfaces are inclined to move further apart from each other toward the opening side. [7] The magnetic sensor element according to [5] or [6], wherein the pair of guide surfaces have vertical surfaces perpendicular to the surface of the substrate, and the magnetic wire is arranged between the vertical surfaces of the pair of guide surfaces. [8] The magnetic sensor element according to any one of [5] to [7], wherein the pair of guide surfaces have chamfered portions at their opening ends that are inclined to move further apart from each other toward the opening side. [Explanation of Symbols]

[0056] 1. Magnetic sensor element 2 circuit boards 21 Groove 3 Magnetic wires 4 detection coil 41 First Conductor Wiring 42 Second conductor wiring 5. Insulator 51 Concave insulating part 511 Bearing surface 512 Guide surface 52 Covered insulating part

Claims

1. A method for manufacturing a magnetic sensor element comprising a substrate having grooves, a magnetic wire disposed within the grooves, a detection coil made of a thin film conductor spirally arranged on the outer circumference of the magnetic wire, and an insulator interposed between the magnetic wire and the detection coil, A first conductor wiring constituting a part of the detection coil is formed on the inner wall surface of the groove in the substrate. Within the groove portion in which the first conductor wiring is provided, a concave insulating portion is formed which constitutes a part of the insulator and has a support surface facing the opening side of the groove portion, and a pair of guide surfaces that are erected from the support surface and face each other. The magnetic wire is placed in the groove-like space between the support surface of the concave insulating portion and the pair of guide surfaces. A covering insulating portion is formed which constitutes a part of the insulator and covers the magnetic wire from the opposite side of the support surface. A method for manufacturing a magnetic sensor element, comprising forming a second conductor wiring on the surface of the insulator, which constitutes a part of the detection coil and is connected to the first conductor wiring.

2. The method for manufacturing a magnetic sensor element according to claim 1, wherein the inner wall surface of the groove portion has a bottom surface and a pair of side surfaces erected from the bottom surface, and the side surfaces are inclined to move further apart from each other as they move toward the opening side.

3. A method for manufacturing a magnetic sensor element according to claim 1 or 2, wherein the pair of guide surfaces have vertical surfaces perpendicular to the surface of the substrate, and the magnetic wire is arranged between the vertical surfaces of the pair of guide surfaces.

4. The method for manufacturing a magnetic sensor element according to claim 1 or 2, wherein the pair of guide surfaces have chamfered portions at their opening-side ends that are inclined to move further apart from each other as they move toward the opening side.

5. A magnetic sensor element comprising a substrate having grooves, a magnetic wire disposed within the grooves, a detection coil made of a thin film conductor spirally arranged on the outer circumference of the magnetic wire, and an insulator interposed between the magnetic wire and the detection coil, The detection coil comprises a first conductor wiring formed on the inner wall surface of the groove in the substrate, and a second conductor wiring formed on the surface of the insulator and connected to the first conductor wiring. The insulator has a concave insulating portion having a groove-shaped space in which the magnetic wire is arranged on the inside, and a covering insulating portion that covers the magnetic wire from the opening side of the groove-shaped space. The recessed insulating portion comprises a support surface facing the opening side of the groove and a pair of guide surfaces that are erected from the support surface and face each other, thereby forming a magnetic sensor element.

6. The magnetic sensor element according to claim 5, wherein the inner wall surface of the groove portion has a bottom surface and a pair of side surfaces erected from the bottom surface, and the side surfaces are inclined to move further apart from each other as they move toward the opening side.

7. The magnetic sensor element according to claim 5 or 6, wherein the pair of guide surfaces have vertical surfaces perpendicular to the surface of the substrate, and the magnetic wire is arranged between the vertical surfaces of the pair of guide surfaces.

8. The magnetic sensor element according to claim 5 or 6, wherein the pair of guide surfaces have chamfered portions at their opening-side ends that are inclined to move further apart from each other as they move toward the opening side.

Images