Substrate assembly, electronic device, electronic package, and manufacturing method thereof

Abstract

To provide a substrate assembly, an electronic device to which the substrate assembly is applied, and an electronic package.SOLUTION: The substrate assembly 1000c includes a substrate 80, a composite layer structure 400c ' and an adhesive layer 60. The composite layer structure 400c ' defines a bonding surface, and one or more circuit layers and one or more light path layers 200 are disposed above and / or below the bonding surface, wherein the light path layers 200 define a plurality of light paths 300, and the circuit layers define a plurality of wires 81, 82. The adhesive layer 60 is disposed between the substrate 80 and the composite layer structure 400c '.SELECTED DRAWING: Figure 2D

Description

[Technical Field]

[0001] The present invention relates to electronic devices with mixed substrate applications. [Background technology]

[0002] Most conventional substrate packaging technologies only achieve electrical connections, making it difficult to effectively integrate high-efficiency optical communications. Attempts to combine the two result in complex manufacturing processes and increased costs, making it impossible to meet industrial demands for high bandwidth, low loss, and high-density packaging. Some current photonics-electronics hybrid solutions also lack flexibility in their manufacturing processes, resulting in a lack of heterogeneous and multi-material integration capabilities and design flexibility for high-density stacking. Summary of the Invention [Problem to be solved by the invention]

[0003] The present invention breaks through the above limitations and, by adopting the heterogeneous integration design concept, realizes a coplanar or stacked structure of circuit layers and optical path layers on a single or multi-layer substrate, which not only supports high-density electro-optical hybrid communication and highly reliable packaging, but also allows for a variety of manufacturing processes and material options, greatly improving the degree of system integration and application flexibility.

[0004] An object of one or more embodiments of the present invention is to provide a substrate assembly and electronic devices and packages incorporating the substrate assembly, which meets the demand for high computing power, high efficiency, and cost-effective production in the semiconductor industry by combining heterogeneous structures. [Means for solving the problem]

[0005] The present invention provides a substrate assembly, comprising: a substrate; a composite layer structure defining a bonding surface, with one or more circuit layers and one or more optical path layers disposed above and / or below the bonding surface, the optical path layers defining a plurality of optical paths, and the circuit layers defining a plurality of conductors; and an adhesive layer provided between the substrate and the composite layer structure.

[0006] In one embodiment, one or more of the circuit layers and one or more of the optical path layers are intermixed and arranged in a coplanar manner.

[0007] In one embodiment, either the circuit layer or the optical path layer is located above the bonding surface, and the other is located below the bonding surface.

[0008] In one embodiment, a portion of the circuit layer is configured as a redistribution layer (RDL).

[0009] In one embodiment, the conductive lines define a line width, and at least some of the line widths are 10 micrometers or less.

[0010] In one embodiment, the conductive lines define a line width, and at least some of the line widths are 2 micrometers or less.

[0011] In one embodiment, at least a portion of the optical path comprises a guided wave.

[0012] In one embodiment, the waveguide is a planar, strip or ridge waveguide.

[0013] In one embodiment, the substrate assembly further includes a support layer along the bonding surface.

[0014] In one embodiment, the circuit layer is disposed on the support layer, and the optical path layer is disposed on the support layer, or the circuit layer and the optical path layer are mixed in a coplanar manner and disposed on the support layer.

[0015] In one embodiment, the material of the support layer includes an adhesive material or a polyimide, or a combination thereof.

[0016] In one embodiment, the planar dimensions of the substrate are at least 100 millimeters by 100 millimeters.

[0017] In one embodiment, the substrate is a glass substrate, a ceramic substrate, a bismaleimide triazine laminate (BT) substrate, a fiberglass reinforced epoxy resin laminate (FR4) substrate, a build-up film, a Rogers substrate, a polyimide substrate, or a combination comprising any of the above materials.

[0018] In one embodiment, the substrate assembly further defines a plurality of channels formed in one or more of the circuit layers and / or one or more of the optical path layers to provide electrical connection or optical communication in a direction perpendicular to the substrate, the channels penetrating the adhesive layer and further penetrating the substrate.

[0019] In one embodiment, the substrate assembly further defines a plurality of channels formed in one or more of the circuit layers and / or one or more of the optical path layers to provide electrical connection or optical communication in a direction perpendicular to the substrate, the channels passing through the adhesive layer and the support layer, or even through the substrate.

[0020] In one embodiment, the substrate assembly further includes one or more light engines corresponding to one or more optical path layers, where some of the optical paths extend along a first direction of the composite layer structure and some of the optical paths extend along a second direction of the composite layer structure, and the first direction and the second direction are not parallel to each other, and some of the light engines control the optical paths in the first direction and / or the second direction.

[0021] In one embodiment, the substrate assembly includes one or more light engines respectively corresponding to one or more optical path layers, where some of the light paths in the optical path layers extend along a first direction of the composite layer structure and some of the light paths in the other optical path layers extend along a second direction of the composite layer structure, and the first and second directions are not parallel to each other, and some of the light engines control input and / or output in the first and second directions, and the light engines are electrically connected or optically communicated with the corresponding one or more optical path layers.

[0022] In one embodiment, some of the light engines control the light path in a vertical direction perpendicular to the composite layer structure.

[0023] In one embodiment, the light engine includes one or more photoelectric conversion elements and one or more light modulators.

[0024] In one embodiment, the light engine includes one or more light path directing elements.

[0025] In one embodiment, the substrate, the optical path layer, and the circuit layer define coefficients of thermal expansion, and the difference between any two of the coefficients of thermal expansion is 30 ppm / °C or less.

[0026] In one embodiment, the substrate, the optical path layer, the circuit layer and the support layer define coefficients of thermal expansion, and the difference between the coefficients of thermal expansion of any two of them is 30 ppm / °C or less.

[0027] The present invention provides a substrate assembly, comprising: a substrate; a composite layer structure defining a bonding surface, with one or more optical path layers disposed above and / or below the bonding surface, the optical path layers defining a plurality of optical paths; and an adhesive layer disposed between the substrate and the composite layer structure.

[0028] In one embodiment, at least a portion of the optical path comprises a guided wave.

[0029] In one embodiment, the waveguide is a planar, strip or ridge waveguide.

[0030] In one embodiment, the substrate assembly further includes a support layer along the bonding surface.

[0031] In one embodiment, the material of the support layer includes an adhesive material or a polyimide, or a combination thereof.

[0032] In one embodiment, the planar dimensions of the substrate are at least 100 millimeters by 100 millimeters.

[0033] In one embodiment, the substrate is a glass substrate, a ceramic substrate, a bismaleimide triazine laminate (BT) substrate, a fiberglass reinforced epoxy resin laminate (FR4) substrate, a build-up film, a Rogers substrate, a polyimide substrate, or a combination comprising any of the above materials.

[0034] In one embodiment, the substrate assembly further defines a plurality of channels formed in one or more of the optical path layers to provide optical communication in a vertical direction perpendicular to the substrate, the channels extending through the adhesive layer and further through the substrate.

[0035] In one embodiment, the substrate assembly further defines a plurality of channels formed in one or more of the optical path layers to provide electrical connection or optical communication in a vertical direction perpendicular to the substrate, the channels passing through the adhesive layer and the support layer, or even through the substrate.

[0036] In one embodiment, the substrate assembly further includes one or more light engines corresponding to one or more optical path layers, where some of the optical paths extend along a first direction of the composite layer structure and some of the optical paths extend along a second direction of the composite layer structure, and the first direction and the second direction are not parallel to each other, and some of the light engines control the optical paths in the first direction and / or the second direction.

[0037] In one embodiment, the substrate assembly further includes one or more light engines respectively corresponding to one or more light path layers, where some of the light paths in the light path layers extend along a first direction of the composite layer structure, and some of the light paths in the other light path layers extend along a second direction of the composite layer structure, and the first direction and the second direction are not parallel to each other, and some of the light engines control input and / or output in the first direction and the second direction, and the light engines optically communicate with one or more light path layers.

[0038] In one embodiment, some of the light engines control the light path in a vertical direction perpendicular to the composite layer structure.

[0039] In one embodiment, the light engine includes one or more photoelectric conversion elements and one or more light modulators.

[0040] In one embodiment, the light engine includes one or more light path directing elements.

[0041] In one embodiment, the substrate and the optical path layer define coefficients of thermal expansion, and the difference between any two of the coefficients of thermal expansion is 30 ppm / °C or less.

[0042] The present invention provides an electronic device, comprising the substrate assembly described above and a plurality of semiconductor components disposed in the composite layer structure of the substrate assembly, some of the semiconductor components electrically connected to the circuit layer and other of the semiconductor components optically communicating with the optical path layer.

[0043] In one embodiment, the one or more semiconductor components are a system on a chip (SoC) and / or a high bandwidth memory (HBM).

[0044] In one embodiment, at least some of the semiconductor members are stacked on top of each other.

[0045] In one embodiment, each of the semiconductor components includes a plurality of input / output (I / O) terminals, and the number of I / O terminals of one or more computing and memory elements is 300 or more.

[0046] In one embodiment, the number of I / O terminals of one or more of the computation and storage elements is 1024 or more.

[0047] In one embodiment, besides electrical connection, the composite layer structure further includes optical communication between the substrate and the semiconductor member.

[0048] The present invention provides an electronic package, which includes a functional substrate, at least one substrate assembly electrically connected to the functional substrate, and a plurality of semiconductor components disposed in the composite layer structure of the at least one substrate assembly, some of the semiconductor components electrically connected to the circuit layer and other of the semiconductor components in optical communication with the optical path layer.

[0049] In one embodiment, besides electrical connection, optical communication is further included between the composite layer structure, the substrate, the semiconductor member and the functional substrate.

[0050] In one embodiment, the electronic package further includes an adhesive layer disposed between the substrate assembly and the functional substrate to achieve planar bonding.

[0051] In one embodiment, some of the channels extend through the adhesive layer.

[0052] In one embodiment, the functional substrate further comprises a plurality of insertion recesses for the substrate assemblies to insert therein in a one-to-one manner, and the substrate of the substrate assembly comprises at least a hard material.

[0053] In one embodiment, the one or more semiconductor components are a system on a chip (SoC) and / or a high bandwidth memory (HBM).

[0054] In one embodiment, at least some of the semiconductor members are stacked on top of each other.

[0055] In one embodiment, each of the semiconductor components includes a plurality of input / output (I / O) terminals, and the number of I / O terminals of one or more computing and memory elements is 300 or more.

[0056] In one embodiment, the number of I / O terminals of one or more of the computation and storage elements is 1024 or more.

[0057] The present invention provides an electronic package. The electronic package includes a functional substrate, a plurality of composite layer structures, and a plurality of semiconductor components disposed in the composite layer structures. Each of the composite layer structures defines a bonding surface, and one or more circuit layers and one or more optical path layers are disposed above and / or below the bonding surface. The optical path layers define a plurality of optical paths, and the circuit layers define a plurality of conductive lines. Some of the semiconductor components are electrically connected to the circuit layers, and other of the semiconductor components are in optical communication with the optical path layers.

[0058] In one embodiment, one or more of the circuit layers and one or more of the optical path layers are intermixed and arranged in a coplanar manner.

[0059] In one embodiment, either the circuit layer or the optical path layer is located above the bonding surface, and the other is located below the bonding surface.

[0060] In one embodiment, besides electrical connection, optical communication is further included between the composite layer structure, the semiconductor member and the functional substrate.

[0061] In one embodiment, a portion of the circuit layer is configured as a redistribution layer (RDL).

[0062] In one embodiment, the conductive lines define a line width, and at least some of the line widths are 10 micrometers or less.

[0063] In one embodiment, the conductive lines define a line width, and at least some of the line widths are 2 micrometers or less.

[0064] In one embodiment, at least a portion of the optical path comprises a guided wave.

[0065] In one embodiment, the electronic package further comprises a support layer along the bonding surface.

[0066] In one embodiment, the circuit layer is disposed on the support layer; the optical path layer is disposed on the support layer; or the circuit layer and the optical path layer are mixed in a coplanar manner and disposed on the support layer.

[0067] In one embodiment, the material of the support layer includes an adhesive material or a polyimide, or a combination thereof.

[0068] In one embodiment, the functional substrate is a glass substrate, a ceramic substrate, a bismaleimide triazine laminate (BT) substrate, a fiberglass reinforced epoxy resin laminate (FR4) substrate, a build-up layer, a Rogers substrate, a PPO substrate, a polyimide substrate, or a combination comprising any of the above materials.

[0069] In one embodiment, the electronic package further defines a plurality of channels formed in one or more of the circuit layers and / or one or more of the optical path layers for electrical connection or optical communication in a vertical direction perpendicular to the substrate, the channels penetrating the adhesive layer or further penetrating the substrate.

[0070] In one embodiment, the electronic package further defines a plurality of channels formed in one or more of the circuit layers and / or one or more of the optical path layers for electrical connection or optical communication in a vertical direction perpendicular to the substrate, the channels passing through the adhesive layer and the support layer, or further passing through the substrate.

[0071] In one embodiment, the one or more semiconductor components are a system on a chip (SoC) and / or a high bandwidth memory (HBM).

[0072] In one embodiment, at least some of the semiconductor members are stacked on top of each other.

[0073] In one embodiment, each of the semiconductor components includes a plurality of input / output (I / O) terminals, and the number of I / O terminals of one or more computing and memory elements is 300 or more.

[0074] In one embodiment, the number of I / O terminals of one or more of the computation and storage elements is 1024 or more.

[0075] In one embodiment, the electronic package further includes one or more light engines corresponding to one or more light path layers, where some of the light paths extend along a first direction of the composite layer structure and some of the light paths extend along a second direction of the composite layer structure, the first direction and the second direction are not parallel to each other, and some of the light engines control the light paths in the first direction and / or the second direction.

[0076] In one embodiment, the electronic package further includes one or more light engines respectively corresponding to one or more light path layers, where some of the light paths in the light path layers extend along a first direction of the composite layer structure, and some of the light paths in the other light path layers extend along a second direction of the composite layer structure, and the first direction and the second direction are not parallel to each other, and some of the light engines control input and / or output in the first direction and the second direction, and the light engines are electrically connected or optically communicated with one or more corresponding light path layers.

[0077] In one embodiment, some of the light engines control the light path in a vertical direction perpendicular to the composite layer structure.

[0078] In one embodiment, the light engine includes one or more photoelectric conversion elements and one or more light modulators.

[0079] In one embodiment, the light engine includes one or more light path directing elements.

[0080] In one embodiment, the substrate, the optical path layer, and the circuit layer define coefficients of thermal expansion, and the difference between any two of the coefficients of thermal expansion is 30 ppm / °C or less.

[0081] In one embodiment, the substrate, the optical path layer, the circuit layer and the support layer define coefficients of thermal expansion, and the difference between the coefficients of thermal expansion of any two of them is 30 ppm / °C or less.

[0082] The present invention provides a method for manufacturing an electronic package, comprising the following steps: Step 1: forming a composite layer structure on a substrate, the composite layer structure defining a bonding surface, and one or more circuit layers and one or more optical path layers respectively disposed above and / or below the bonding surface; the one or more optical path layers defining a plurality of optical paths, and the one or more circuit layers defining a plurality of conductive lines; Step 2: performing one of the following two steps: placing a plurality of semiconductor components on the composite layer structure, some of the semiconductor structures electrically connected to at least the circuit layer, and other semiconductor components optically communicating with the optical path layer; providing that a functional substrate is stacked below the composite layer structure and electrically connected to at least the composite layer structure; Step 3: performing another step described above after Step 2.

[0083] In one embodiment, when the composite layer structure is formed on the substrate, one of the following two steps is performed: one or more optical path layers are formed on the initial substrate, the one or more optical path layers including a plurality of optical paths, and at least a portion of the initial substrate is removed from the one or more optical path layers; one or more circuit layers are formed on the initial substrate, the one or more circuit layers including a plurality of conductive lines, and at least a portion of the initial substrate is removed from the one or more circuit layers. After this, the following step is performed: when the composite layer structure is formed on the substrate, the circuit layer is laminated on the optical path layer, or the optical path layer is laminated on the circuit layer.

[0084] In one embodiment, when the composite layer structure is formed on the substrate, the circuit layer and the optical path layer are arranged in a coplanar manner.

[0085] In one embodiment, when the composite layer structure is formed on the substrate, the initial substrate includes a rigid plate, a flexible plate laminated to the rigid plate, and after the rigid plate is removed from the flexible plate, a composite layer structure including the flexible plate but not the rigid plate is left.

[0086] In one embodiment, when the composite layer structure is formed on the substrate, the initial substrate is a rigid plate, and removing the composite layer structure from the rigid plate results in the composite layer structure not including the rigid plate.

[0087] In one embodiment, when the composite layer structure is formed on the substrate, an adhesive layer is provided between the circuit layer and the optical path layer.

[0088] In one embodiment, when the composite layer structure is formed on the substrate, a support layer is provided along the bonding surface.

[0089] In one embodiment, the support layer comprises a flexible layer or an adhesive layer, or a combination thereof.

[0090] In one embodiment, the conductive lines define a line width, and at least some of the line widths are 10 micrometers or less.

[0091] In one embodiment, at least a portion of the optical path comprises a guided wave.

[0092] In one embodiment, the substrate is defined as having planar dimensions of at least 100 millimeters by 100 millimeters.

[0093] In one embodiment, the substrate is a glass substrate, a ceramic substrate, a bismaleimide triazine laminate (BT) substrate, a fiberglass reinforced epoxy resin laminate (FR4) substrate, a build-up film, a Rogers substrate, a polyimide substrate, or a combination comprising any of the above materials.

[0094] In one embodiment, in addition to electrical connections, any two of the three elements of the composite layer structure, the semiconductor member, and the functional substrate correspond to each other and provide optical communication.

[0095] In one embodiment, after the composite layer structure is formed on the substrate, an adhesive layer is provided between the composite layer structure and the functional substrate.

[0096] In one embodiment, after the composite layer structure is formed on the substrate, the composite layer structure is connected to the functional substrate via a plurality of insertion channels.

[0097] The present invention provides a method for manufacturing an electronic package, which includes the following steps: forming one or more circuit layers and one or more optical path layers on a functional substrate to form a composite layer structure, wherein the one or more circuit layers define a plurality of conductive lines and the one or more optical path layers define a plurality of optical paths; providing a plurality of semiconductor components on the functional substrate, some of the semiconductor components electrically connecting with the one or more circuit layers and other of the semiconductor components optically communicating with the one or more optical path layers;

[0098] In one embodiment, when the composite layer structure is formed, the circuit layer and the optical path layer are formed in a coplanar manner.

[0099] In one embodiment, when the composite layer structure is formed, the circuit layer and the optical path layer are formed in a stacking manner.

[0100] In one embodiment, when the composite layer structure is formed, after either the circuit layer or the optical path layer is formed on the functional substrate, the other layer is laminated on top of said layer.

[0101] In one embodiment, when the composite layer structure is formed on the substrate, an adhesive layer is provided between the circuit layer and the optical path layer.

[0102] In one embodiment, when the composite layer structure is formed on the substrate, a support layer is provided along the bonding surface.

[0103] In one embodiment, the support layer comprises a flexible layer or an adhesive layer, or a combination thereof.

[0104] In one embodiment, the conductive lines define a line width, and at least some of the line widths are 10 micrometers or less.

[0105] In one embodiment, at least a portion of the optical path comprises a guided wave.

[0106] In one embodiment, the substrate is defined as having planar dimensions of at least 100 millimeters by 100 millimeters.

[0107] In one embodiment, the substrate is a glass substrate, a ceramic substrate, a bismaleimide triazine laminate (BT) substrate, a fiberglass reinforced epoxy resin laminate (FR4) substrate, a build-up film, a Rogers substrate, a polyimide substrate, or a combination comprising any of the above materials.

[0108] In one embodiment, the functional substrate is a glass substrate, a ceramic substrate, a bismaleimide triazine laminate (BT) substrate, a fiberglass reinforced epoxy resin laminate (FR4) substrate, a build-up film, a Rogers substrate, a PPO substrate, a polyimide substrate, or a combination comprising any of the above materials.

[0109] In one embodiment, in addition to electrical connections, any two of the three elements of the composite layer structure, the semiconductor member, and the functional substrate correspond to each other and provide optical communication.

[0110] In one embodiment, after the composite layer structure is formed on the substrate, an adhesive layer is provided between the composite layer structure and the functional substrate.

[0111] In one embodiment, after the composite layer structure is formed on the substrate, the composite layer structure is connected to the functional substrate via a plurality of insertion channels.

[0112] The present invention provides a method for manufacturing an electronic package, which includes the following steps: forming one or more circuit layers and one or more optical path layers on a functional substrate to form a composite layer structure, wherein the one or more circuit layers define a plurality of conductive lines and the one or more optical path layers define a plurality of optical paths; providing a plurality of semiconductor components on the functional substrate, some of the semiconductor components electrically connecting with the one or more circuit layers and other of the semiconductor components optically communicating with the one or more optical path layers;

[0113] In one embodiment, when the composite layer structure is formed, the circuit layer and the optical path layer are formed in a coplanar manner.

[0114] In one embodiment, when the composite layer structure is formed, the circuit layer and the optical path layer are formed in a stacking manner.

[0115] In one embodiment, when the composite layer structure is formed, either the circuit layer or the optical path layer is formed on the functional substrate, and then the other layer is laminated on top of said layer.

[0116] In one embodiment, when the composite layer structure is formed on the substrate, an adhesive layer is provided between the circuit layer and the optical path layer.

[0117] In one embodiment, when the composite layer structure is formed on the substrate, a support layer is provided along the bonding surface.

[0118] In one embodiment, the support layer comprises a flexible layer or an adhesive layer, or a combination thereof.

[0119] In one embodiment, the conductive lines define a line width, and at least some of the line widths are 10 micrometers or less.

[0120] In one embodiment, at least a portion of the optical path comprises a guided wave.

[0121] In one embodiment, the substrate is defined as having planar dimensions of at least 100 millimeters by 100 millimeters.

[0122] In one embodiment, the functional substrate is a glass substrate, a ceramic substrate, a bismaleimide triazine laminate (BT) substrate, a fiberglass reinforced epoxy resin laminate (FR4) substrate, a build-up film, a Rogers substrate, a PPO substrate, a polyimide substrate, or a combination comprising any of the above materials.

[0123] In one embodiment, in addition to electrical connections, any two of the three elements of the composite layer structure, the semiconductor member, and the functional substrate correspond to each other and provide optical communication.

[0124] In one embodiment, after the composite layer structure is formed on the substrate, an adhesive layer is provided between the composite layer structure and the functional substrate. [Brief explanation of the drawings]

[0125] [Figure 1A] 1A-1C illustrate different embodiments of the circuit layer in the substrate assembly of the present invention. [Figure 1B] 1A-1C illustrate different embodiments of the circuit layer in the substrate assembly of the present invention. [Figure 1C] 1A-1C illustrate different embodiments of the circuit layer in the substrate assembly of the present invention. [Figure 1D] 1A-1C illustrate different embodiments of the circuit layer in the substrate assembly of the present invention. [Figure 2A] 1A to 1C are diagrams showing different embodiments of the optical path layer in the substrate assembly of the present invention. [Figure 2B] 1A to 1C are diagrams showing different embodiments of the optical path layer in the substrate assembly of the present invention. [Figure 2C] 1A to 1C are diagrams showing different embodiments of the optical path layer in the substrate assembly of the present invention. [Figure 2D] 1A to 1C are diagrams showing different embodiments of the optical path layer in the substrate assembly of the present invention. [Figure 3A] 1A to 1C are diagrams showing different lamination methods for circuit layers and optical path layers on a single substrate in the substrate assembly of the present invention. [Figure 3XA]1A to 1C are diagrams showing different lamination methods for circuit layers and optical path layers on a single substrate in the substrate assembly of the present invention. [Figure 3B] 1A to 1C are diagrams showing different lamination methods for circuit layers and optical path layers on a single substrate in the substrate assembly of the present invention. [Figure 3XB] 1A to 1C are diagrams showing different lamination methods for circuit layers and optical path layers on a single substrate in the substrate assembly of the present invention. [Figure 3C] 1A to 1C are diagrams showing different lamination methods for circuit layers and optical path layers on a single substrate in the substrate assembly of the present invention. [Figure 3XC] 1A to 1C are diagrams showing different lamination methods for circuit layers and optical path layers on a single substrate in the substrate assembly of the present invention. [Figure 3D] 1A to 1C are diagrams showing different lamination methods for circuit layers and optical path layers on a single substrate in the substrate assembly of the present invention. [Figure 3XD] 1A to 1C are diagrams showing different lamination methods for circuit layers and optical path layers on a single substrate in the substrate assembly of the present invention. [Figure 3E] 1A to 1C are diagrams showing different lamination methods for circuit layers and optical path layers on a single substrate in the substrate assembly of the present invention. [Figure 4A] FIG. 1 illustrates that the circuit layer and optical path layer of the present invention are arranged in a coplanar manner on a single substrate. [Figure 4B] FIG. 1 illustrates that the circuit layer and optical path layer of the present invention are arranged in a coplanar manner on a single substrate. [Figure 4C] FIG. 1 illustrates that the circuit layer and optical path layer of the present invention are arranged in a coplanar manner on a single substrate. [Figure 4D] FIG. 1 illustrates that the circuit layer and optical path layer of the present invention are arranged in a coplanar manner on a single substrate. [Figure 5A] 1A-1C illustrate different embodiments of the electronic package of the present invention. [Figure 5XA] 1A-1C illustrate different embodiments of the electronic package of the present invention. [Figure 5B] 1A-1C illustrate different embodiments of the electronic package of the present invention. [Figure 5XB] 1A-1C illustrate different embodiments of the electronic package of the present invention. [Figure 5C] 1A-1C illustrate different embodiments of the electronic package of the present invention. [Figure 5XC] 1A-1C illustrate different embodiments of the electronic package of the present invention. [Figure 5D] 1A-1C illustrate different embodiments of the electronic package of the present invention. [Figure 5XD] 1A-1C illustrate different embodiments of the electronic package of the present invention. [Figure 6A] 1A-1C illustrate different embodiments of the electronic package of the present invention. [Figure 6XA] 1A-1C illustrate different embodiments of the electronic package of the present invention. [Figure 6B] 1A-1C illustrate different embodiments of the electronic package of the present invention. [Figure 6XB] 1A-1C illustrate different embodiments of the electronic package of the present invention. [Figure 6C] 1A-1C illustrate different embodiments of the electronic package of the present invention. [Figure 6XC] 1A-1C illustrate different embodiments of the electronic package of the present invention. [Figure 6D] 1A-1C illustrate different embodiments of the electronic package of the present invention. [Figure 6XD] 1A-1C illustrate different embodiments of the electronic package of the present invention. [Figure 7] FIG. 10 is a diagram showing the multiple composite layer structure in the electronic package of the present invention directly connected to the functional substrate, without including the substrate and the flexible board. [Figure 8A] 1A to 1C are diagrams showing different embodiments in which semiconductor components in an electronic device of the present invention are arranged in a composite layer structure of a substrate assembly. [Figure 8B] 1A to 1C are diagrams showing different embodiments in which semiconductor components in an electronic device of the present invention are arranged in a composite layer structure of a substrate assembly. [Figure 9A] 10 is a diagram showing that an adhesive layer is provided between the substrate assembly and the functional substrate of the present invention to achieve flat bonding. FIG. [Figure 9B]10 is a diagram showing that an adhesive layer is provided between the substrate assembly and the functional substrate of the present invention to achieve flat bonding. FIG. [Figure 9C] 10 is a diagram showing that an adhesive layer is provided between the substrate assembly and the functional substrate of the present invention to achieve flat bonding. FIG. [Figure 10A] 10A and 10B are diagrams showing different embodiments of the optical path layer installed on the functional substrate of the present invention. [Figure 10B] 10A to 10C are diagrams showing different embodiments of the optical path layer installed on the functional substrate of the present invention. [Figure 10C] 10A to 10C are diagrams showing different embodiments of the optical path layer installed on the functional substrate of the present invention. [Figure 10D] 10A to 10C are diagrams showing different embodiments of the optical path layer installed on the functional substrate of the present invention. [Figure 10E] 10A to 10C are diagrams showing different embodiments of the optical path layer installed on the functional substrate of the present invention. [Figure 10ME] 10A to 10C are diagrams showing different embodiments of the optical path layer installed on the functional substrate of the present invention. [Figure 10NE] 10A to 10C are diagrams showing different embodiments of the optical path layer installed on the functional substrate of the present invention. [Figure 10F] 10A to 10C are diagrams showing different embodiments of the optical path layer installed on the functional substrate of the present invention. [Figure 10G] 10A to 10C are diagrams showing different embodiments of the optical path layer installed on the functional substrate of the present invention. [Figure 11A] 1A and 1B are diagrams illustrating the circuit layer of the present invention having different manufacturing process steps. [Figure 11B] 1A and 1B are diagrams illustrating the circuit layer of the present invention having different manufacturing process steps. [Figure 11C] 1A and 1B are diagrams illustrating the circuit layer of the present invention having different manufacturing process steps. [Figure 11D] 1A and 1B are diagrams illustrating the circuit layer of the present invention having different manufacturing process steps. [Figure 12A]1A and 1B are diagrams showing the optical path layer of the present invention having different manufacturing process steps. [Figure 12B] 1A and 1B are diagrams showing the optical path layer of the present invention having different manufacturing process steps. [Figure 12C] 1A and 1B are diagrams showing the optical path layer of the present invention having different manufacturing process steps. [Figure 12D] 1A and 1B are diagrams showing the optical path layer of the present invention having different manufacturing process steps. [Figure 13A] 1A and 1B are diagrams illustrating the circuit layer and optical path layer of the present invention arranged on a single substrate in a coplanar manner and having different manufacturing process steps. [Figure 13B] 1A and 1B are diagrams illustrating the circuit layer and optical path layer of the present invention arranged on a single substrate in a coplanar manner and having different manufacturing process steps. [Figure 13C] 1A and 1B are diagrams illustrating the circuit layer and optical path layer of the present invention arranged on a single substrate in a coplanar manner and having different manufacturing process steps. [Figure 13D] 1A and 1B are diagrams illustrating the circuit layer and optical path layer of the present invention arranged on a single substrate in a coplanar manner and having different manufacturing process steps. [Figure 14] FIG. 1 illustrates that the circuit layer and optical path layer of the present invention are arranged on a functional substrate in a coplanar manner. DETAILED DESCRIPTION OF THE INVENTION

[0126] The present invention will be further explained by the following detailed description and drawings, which are for illustrative purposes only and are not intended to limit the present invention.

[0127] The present invention can be understood from the following detailed description, which is taken in conjunction with the drawings in which like numerals refer to like elements.

[0128] In the present invention, the substrate assembly shown in Figures 1A to 1D is at least a part of the structure or manufacturing method of the electronic device shown in U.S. Provisional Patent Application No. 63 / 585,746 (hereinafter referred to as "Provisional Application '746"; this provisional application corresponds to U.S. Patent Application No. 18 / 899,765).

[0129] The substrate assemblies 100-100c include a substrate 80, a composite layer structure (not shown, disposing redistribution structures 40'-40c' with a circuit layer 20, corresponding to the RDL traces of the '746 Provisional Application, with the redistribution structures 40'-40c' electrically connecting to the conductive gasket 30 and the top conductive conductor 30x), and an adhesive layer 60 (referred to as an adhesion layer in the '746 Provisional Application) for adhering the redistribution structures 40'-40c' to the substrate 80. To enhance electrical performance, multiple channels (referred to as conductors 70 in the '746 Provisional Application) are provided, penetrating at least the adhesive layer and electrically connecting the composite layer structure (the RDL traces of the redistribution structures) to the substrate 80 (substrate conductors 81, 82). The '746 Provisional Application describes the electrical connection types and manufacturing methods of the substrate assemblies, and all information related thereto is relevant and applicable to the present invention. Additionally, it should be noted that in most drawings, the top conductive lead 30x may not be labeled.

[0130] It should be noted that Figures 1A to 1D show an example of a portion of the circuit layer portion of a substrate assembly. The circuit layer of the substrate assembly can be replaced with an optical path layer in Figures 2A to 2D, and all the optical path layers can be realized optically. The substrate assemblies 1000 to 1000c include a substrate 80 (substrate conductors 81 and 82 are provided on opposite surfaces), a composite layer structure 400' to 400c' (these are optical path layers), and an adhesive layer 60 (also an adhesive material structure) for adhering the composite layer structure to the substrate 80. To improve optical performance, a plurality of channels 700 are provided and are used for at least optical communication, and these channels penetrate at least from the adhesive layer 60 through the substrate 80.

[0131] To clarify the structure of the substrate assembly of the present invention, the substrate assembly includes a substrate, a composite layer structure, and an adhesive layer disposed between the substrate and the composite layer structure. The composite layer structure defines a bonding surface, which can be a virtual (conceptual) surface or a physical (substantial) surface. The composite layer structure further includes one or more circuit layers (composite layer structures 40'-40c' shown in FIGS. 1A-1D) and one or more optical path layers (composite layer structures 400'-400c' shown in FIGS. 2A-2D), each of which can be disposed above or below the bonding surface. The optical path layer defines multiple optical paths, and the circuit layer defines multiple conductors. The circuit layer and the optical path layer are disposed above or below the bonding surface in a stacked or coplanar manner. Note that the terms "circuit layer" and "optical path layer" herein refer to a single-layer structure or a composite (multiple-layer) structure. Similarly, "multiple circuit layers" and "multiple optical path layers" may refer to a single structure or a combination of multiple structures. For ease of description, a layer, multiple layers, single structure or multiple structures will be referred to collectively herein as a "layer."

[0132] In some circumstances, the planar dimensions of a substrate suitable for the substrate assembly of the present invention are at least 100 mm by 100 mm, and the substrate has optical / conductive channels on one or both sides, as well as one or more via holes used for optical communication and electrical connection.

[0133] In some lamination situations, the circuit layer and the optical path layer are arranged in a lamination manner, and an adhesive layer is provided between them. The terms "adhesive layer" and "bonding layer" are used here to distinguish between different components (layers), and do not imply any difference in their essential properties.

[0134] In some lamination scenarios, the circuit layer and / or optical path layer does not include any plates when manufactured, and in some lamination scenarios, the circuit layer and / or optical path layer includes flexible plates when manufactured, and at least one flexible plate is disposed thereon after lamination is complete.

[0135] In some stacking scenarios, the embodiment includes two substrates, each of which includes a circuit layer having a substrate and an optical path layer having a substrate, stacked together. Related embodiments are described in detail below.

[0136] In some lamination scenarios, these embodiments may include only a single substrate, and the circuit layer and / or optical path layer may be laminated with the single substrate. For details, see some (but not all) of the arrangements and combinations shown in Figures 3A-3XD. The substrate assembly includes a substrate 80, a composite layer structure defining a bonding plane CP, and an adhesive layer 60 disposed between the substrate 80 and the composite layer structure. The composite layer structure includes one or more optical path layers 200, one or more circuit layers 20 laminated below or above the optical path layer 200, and a bonding plane CP defined between the circuit layer 20 and the optical path layer 200. Differences in the layer stacking order and the presence or absence of a flexible board in each layer can be seen by comparing similar drawings.

[0137] 3A discloses a substrate assembly 3A, which includes a substrate 80 having conductive lines 81 and 82 on one or both sides thereof, a composite layer structure defining a coupling surface CP, and an adhesive layer 60 disposed between the substrate 80 and the composite layer structure. The composite layer structure includes a sub-optical structure, which includes one or more optical path layers 200 on which a flexible plate 14 is disposed as a support, a plurality of optical engines OE used for optical communication and capable of optical-electrical two-way connection and bidirectional conversion, including but not limited to optical path structures such as optical switches, optical-electrical converters, and optical diverters, and a plurality of channels 700 communicating with the optical path layer 200 at least in a direction perpendicular to the substrate 80 and formed continuously penetrating the flexible plate 14 and the adhesive layer 60′. The sub-conductive structure further includes a sub-optical structure laminated below the sub-conductive structure. The sub-conductive structure includes one or more circuit layers 20, on which a flexible plate 14 is similarly disposed as a support, and a plurality of conductors 70 communicating with the circuit layer 20 in a direction perpendicular to at least the substrate 80. An adhesive layer 60' is provided between the sub-optical structure and the sub-conductive structure, thereby bonding the two independent components. A conductive gasket electrically connected to the circuit layer 20 is denoted by 30, and an optical interface optically connected to the optical path layer 200 is denoted by 300, providing optical connection to at least these optical engines OE. These channels 700 may be used for electrical connection, optical communication, or both. When electrically connected, they are used to connect the optical path layer 200 and the circuit layer 20, and the conductors 70 are used to electrically connect at least the circuit layer 20 to the substrate 80. A virtual (conceptual) coupling plane CP is defined between the circuit layer 20 and the optical path layer 200, and a real (actual) coupling plane CP' is defined between the adhesive layer 60' and the circuit layer 20. It should be understood that a plurality of optical engines (not shown) are similarly provided between the sub-optical structure and the sub-conductive structure for bidirectional optical-electrical conversion. These optical engines are provided in the sub-optical structure and / or the sub-conductive structure, and this aspect is applicable to all embodiments disclosed in the present invention.

[0138] FIG. 3XA discloses a substrate assembly 3'A, which has a different lamination method from that of the substrate assembly 3A. In the substrate assembly 3'A, a sub-conductive structure is laminated on top of a sub-optical structure. A virtual (conceptual) coupling plane CP is defined between the circuit layer 20 and the optical path layer 200, and a real (actual) coupling plane CP' is defined between the adhesive layer 60' and the optical path layer 200. Note that in this embodiment, an additional flat layer 60a (which may also contain adhesive) is installed between the optical path layer 200 and the circuit layer 20, so that electrical signals can be transmitted to the optical engine OE. In some embodiments or figures, the flat layer 60a may be omitted. In this case, the flat layer 60a and the adhesive layer 60' may be integrated into the same adhesive layer.

[0139] FIG. 3B discloses a substrate assembly 3B, which has a different bonding method from that of the substrate assembly 3A. In the substrate assembly 3B, a sub-conductive structure without a flexible plate 14 is laminated below a sub-optical structure without a flexible plate 14. A virtual (conceptual) bonding plane CP is defined between the circuit layer 20 and the optical path layer 200, and a real (actual) bonding plane CP' is defined between the adhesive layer 60' and the optical path layer 200. Note that in this embodiment, the conductive gasket 30 is shown and labeled. In this case, by further disposing a flat layer 60a (which may also contain adhesive) between the optical path layer 200 and the circuit layer 20, the conductive gasket 30 can be electrically connected to the conductor 70. In some embodiments or figures, the conductive gasket 30 and the flat layer 60a may be omitted.

[0140] 3XB discloses a substrate assembly 3'B that has a different lamination method from that of the substrate assembly 3B. In the substrate assembly 3'B, a sub-conductive structure without a flexible plate 14 is laminated on a sub-optical structure without a flexible plate 14.

[0141] FIG. 3C illustrates a substrate assembly 3C that differs from the substrate assembly 3A in the coupling scheme. In the substrate assembly 3C, the sub-conductive structure with a flexible plate 14 is stacked below the sub-optical structure without a flexible plate 14, with the flexible plate 14 of the sub-conductive structure facing the sub-optical structure. Furthermore, as can be seen in FIG. 3A, the channel 700 extends continuously through the flexible plate 14 and the adhesive layer 60', and the conductors 70 extend continuously through the flexible plate 14 and the adhesive layer 60'. However, in the substrate assembly 3C, the channel 700c extends only through the adhesive layer 60', and the conductors 70c are divided into two groups: one group of conductors 70c1 extends through the flexible plate 14 to provide optical communication and / or electrical connection to the optical path layer 200; and the other group of conductors 70c2 extends through the adhesive layer 60 to provide electrical connection to the substrate 80. It should be understood that in another embodiment, the stacking method may be reversed, for example, a sub-conductive structure provided with a flexible plate 14 may be stacked on top of a sub-optical structure not provided with a flexible plate 14, with the flexible plate 14 of the sub-conductive structure facing outward.

[0142] 3XC discloses a substrate assembly 3'C, which has a different bonding and lamination method from that of substrate assembly 3A. In substrate assembly 3C, a sub-conductive structure without a flexible plate 14 is laminated on a sub-optical structure with a flexible plate 14, with the flexible plate 14 of the sub-conductive structure facing the substrate 80. In substrate assembly 3'C, a plurality of channels 700'c penetrate the flexible plate 14 and adhesive layer 60, realizing optical communication and / or electrical connection. A plurality of conductors 70'c penetrate the adhesive layer 60', realizing electrical connection with the sub-optical structure.

[0143] It should be understood that in another embodiment, the lamination method may be reversed. For example, a sub-conductive structure without a flexible plate 14 may be laminated below a sub-optical structure with a flexible plate 14, with the flexible plate 14 of the sub-optical structure facing outward. As shown in FIG. 3D, a substrate assembly 3D is disclosed, which has a different bonding and lamination method from that of the substrate assembly 3'C. A flat layer 60a is further provided between the adhesive layer 60 and the optical path layer 200. In one embodiment, the flat layer 60a and the adhesive layer 60' are integrated into the same adhesive layer. In the substrate assembly 3D, the conductors 70 are formed only through the adhesive layer 60, and the multiple channels 700d are divided into two groups. One group of channels 700d1 penetrates the flexible plate 14 to realize optical communication and / or electrical connection with the optical path layer 200. The other group of channels 700d2 penetrates the adhesive layer 60' to realize electrical connection with the circuit layer 20.

[0144] 3XD discloses a substrate assembly 3'D, which uses a different bonding and lamination method from the substrate assembly 3'C. The conductive sub-structure without the flexible plate 14 is laminated on top of the optical sub-structure with the flexible plate 14, with the flexible plate 14 of the optical sub-structure facing the conductive sub-structure. The conductors 70 are formed by penetrating only the adhesive layer 60', and the channels 700d are divided into two groups. One group of channels 700d1 penetrates the flexible plate 14 to realize optical communication and / or electrical connection with the optical path layer 200. The other group of channels 700d2 penetrates the adhesive layer 60 to realize electrical connection with the substrate 80.

[0145] In some coplanar configurations, as shown in Figures 4A-4D, circuit layers and optical path layers are arranged coplanarly on a single substrate. The substrate assembly includes a substrate 80, a composite layer structure, an adhesive layer 60 disposed between the substrate 80 and the composite layer structure, and a bonding surface CP between the composite layer structure and the substrate 80. The composite layer structure includes one or more optical path layers 200 and one or more circuit layers 20 arranged coplanarly. By comparing similar drawings, differences in the stacking order of each layer and the presence or absence of a flexible board in each layer can be seen.

[0146] FIG. 4A shows a substrate assembly 4A, which includes a substrate 80 having conductive lines 81 and 82 on one or both sides, a composite layer structure, an adhesive layer 60 disposed between the substrate 80 and the composite layer structure, and a coupling plane CP defined between the composite layer structure and the substrate 80. The optical path layer 200 of the sub-optical structure and the circuit layer 20 of the sub-conductive structure are arranged by separation, mixing, rearrangement, continuous, or discontinuous methods. The sub-optical structure and the sub-conductive structure can share or be installed separately on a flexible plate 14, which is shared in this embodiment. The adhesive layer 60 is connected to the substrate 80 and the composite layer structure via the flexible plate 14. A virtual (conceptual) coupling plane CP is defined between the circuit layer 20 and the optical path layer 200, and a real (actual) coupling plane CP' is jointly defined by the sub-optical structure and the sub-conductive structure facing the substrate 80. Channels 700 and conductors 70 penetrate the adhesive layer 60 and the flexible plate 14.

[0147] 4B shows a substrate assembly 4B that is different from the substrate assembly 4A in lamination method. In the substrate assembly 4B, the optical sub-structure and the conductive sub-structure are not provided with the flexible plate 14. The channels 700 and the conductors 70 penetrate the adhesive layer 60.

[0148] FIG. 4C discloses a substrate assembly 4C, which differs from the substrate assembly 4A in its lamination method. In the substrate assembly 4C, the sub-optical structures and sub-conductive structures are all mounted on a flexible plate 14, which is separated from the substrate 80. The conductors 70d are divided into two groups: one group of conductors 70d1 penetrates the flexible plate 14 and is used for electrical connection with the circuit layer 20; the other group of conductors 70d2 penetrates the adhesive layer 60 and is used for electrical connection with the substrate 80. The channels 700d are also divided into two groups: one group of channels 700d1 penetrates the flexible plate 14 and is used for optical communication with the optical path layer 200; the other group of channels 700d2 selectively penetrates the adhesive layer 60 and is used for optical communication with the substrate 80. Note that the substrate conductors 81 and 82 of the substrate 80 are divided into two groups, corresponding to the circuit layer 20 and the optical path layer 200, respectively.

[0149] 4D shows a substrate assembly 4D that is different from the substrate assembly 4C in its lamination method. In the substrate assembly 4D, the optical sub-structure and the conductive sub-structure are not provided with the flexible plate 14. The channels 700 and the conductors 70 penetrate the adhesive layer 60. Note that the substrate conductors 82 of the substrate 80 may be divided into two groups.

[0150] In an embodiment of the coplanar structure without a flexible board, a molding layer may be placed on the entire top of the coplanar structure for easier processing. In one embodiment, the circuit layer and the optical path layer are formed separately and then arranged on the same substrate / carrier board / carrier to assemble into a stacked structure; in another embodiment, the circuit layer and the optical path layer are formed on the same substrate / carrier board / carrier in the same manufacturing process, and at this time, there is no absolute boundary between the circuit layer and the optical path layer, and they exist in a mixed and interacting manner.

[0151] For a detailed description of the substrate assembly, please refer to Figures 3A, 3XA, 4A, and 4D for a clear definition of the bonding surface. The bonding surface itself is a virtual plane. Referring to the drawings, the circuit layer and the optical path layer are defined as the bonding surface by their marked positions. If no flexible plate or adhesive layer is present, the bonding surface is a virtual plane; if a flexible plate, adhesive layer, or similar structure is present, the bonding surface has more substance and is defined by the adhesive layer 60, the flexible plate 14, or a combination thereof. In this embodiment, the fact that the bonding surface has a thickness does not affect the definition. In Figures 3A to 3XD, the bonding surface is provided between the circuit layer and the optical path layer; in Figures 4A to 4D, the bonding surface is provided as a virtual plane on which the circuit layer and the optical path layer are disposed.

[0152] In embodiments of any circuit layer, the conductive lines have defined line widths, at least some of which are 10 micrometers, 5 micrometers, or 2 micrometers or less. In embodiments of any circuit layer, the conductive lines have defined line spacing, at least some of which are 10 micrometers, 5 micrometers, or 2 micrometers or less.

[0153] In any embodiment of the optical layer, at least some of the optical paths are formed by waveguides, which may be planar, strip or ridge waveguides.Furthermore, optical fibers may be selected as the optical paths.

[0154] With respect to embodiments of the flexible plate 14 and / or adhesive layer 60, excluding elements other than the composite layer structure, for example, the flexible plate 14 and / or adhesive layer 60, are defined as support layers. The support layers are disposed along the bonding surface. In one embodiment, the support layer includes an adhesive material, a polyimide, or a combination thereof.

[0155] In any one embodiment of the present invention, the substrate 80 is a glass substrate, a ceramic substrate, a bismaleimide triazine laminate (BT) substrate, a fiberglass reinforced epoxy resin laminate (FR4) substrate, a build-up film (e.g., Ajinomoto build-up film, ABF), a Rogers substrate, a polyimide substrate, or a combination comprising any of the above materials.

[0156] In any one embodiment of the present invention, channels are formed in the circuit layer and / or optical path layer and are used for vertical electrical connections or optical communication and further connect to the substrate. These channels can penetrate any layers and materials before reaching the substrate.

[0157] See the symbol OE in Figures 3A-3XD and 4A-4XD. In any one embodiment of the present invention, the substrate assembly includes one or more optical engines OE, which are disposed corresponding to optical path layers, and the optical path layers are located on top or bottom of the conductive layer. The optical engines OE may be packaged physical units or unpackaged virtual units.

[0158] In one embodiment of the present invention, the optical engine OE includes one or more photoelectric conversion elements and one or more optical modulators for input / output electrical-to-optical conversion. The photoelectric conversion element can cooperate with a semiconductor material or a circuit layer and can be an electrical-to-optical conversion element (e.g., a laser diode) or an optical-to-electrical conversion element (e.g., an optical sensor). The optical signal can be provided from an external source (e.g., an optical fiber) or an internal source (e.g., a laser diode). In one embodiment of the present invention, the optical engine OE includes an optical path guide element for adjusting the direction of the optical path, for example, guiding the optical path from a first waveguide to a second waveguide. In one embodiment of the present invention, the optical engine OE includes a combination of a photoelectric conversion element with one or more optical modulators and an optical path guide element.

[0159] In any one embodiment of the present invention, the materials of the plate, substrate, layer, etc. have respective coefficients of thermal expansion, and the difference between any two coefficients of thermal expansion is less than 30 ppm / °C.

[0160] The electronic device of the present invention refers to any one of the above embodiments and combinations thereof, and further includes semiconductor components. The structure or manufacturing method of some of the electronic devices described in U.S. Provisional Patent Application No. 63 / 631,109 (hereinafter referred to as the "Provisional '109 Draft," which corresponds to U.S. Patent Application No. 19 / 172,793) corresponds to the electronic device of the present invention. As shown in FIG. 8A , electronic device 800A includes a substrate assembly 8A and a plurality of semiconductor components 90 disposed in the composite layer structure (including an optical path layer 200 and a circuit layer 20) of the substrate assembly 8A, with some of the semiconductor components 90 electrically connected to the circuit layer 20 and others optically communicating with the optical path layer 200. In some embodiments, for example, electronic device 800B, as shown in FIG. 8B , some of the semiconductor components 90 are stacked on top of each other in substrate assembly 8B. In some embodiments, one or more semiconductor components are a SoC (System-on-Chip) 91 and / or a HBM (High Bandwidth Memory) 92. In some embodiments, some of the semiconductor components can be stacked on top of each other, for example, a sub-semiconductor component 93 stacked on top of another sub-semiconductor component 94, and selectively electrically connected to the circuit layer 20 or optically communicating with the optical path layer 200.

[0161] In one embodiment, the optical / electronic communication between the circuit layer 20 and the optical path layer 200 can be designed in a many-to-many or many-to-one structure. For example, as shown in FIG. 3E, multiple circuit layers 20 correspond to the same optical path layer 200, and multiple electronic signal channels can be aggregated into one or more optical channels. This design improves signal integration and fully utilizes the high-bandwidth characteristics of optical communication. The many-to-one structure simplifies the layout of the optical distribution layer, reduces the complexity of the manufacturing process, and facilitates the high-density integration of the optical / electronic hybrid substrate, which is particularly suitable for semiconductor components with high performance computing and high bandwidth requirements.

[0162] In one embodiment, when bonding a circuit layer (including multiple conductive lines) and an optical path layer (including multiple optical paths), the required alignment accuracy between the circuit layer and the optical path layer is significantly higher than the alignment accuracy between the circuit layer and the functional substrate. For example, the alignment accuracy between the circuit layer and the optical path layer must be within ±1 μm, and the alignment accuracy between the circuit layer and the functional substrate must be within ±5 μm. Optical communication structures are extremely sensitive to path alignment errors, and even slight deviations can affect the coupling efficiency and transmission quality of optical signals. Therefore, the bonding process of the circuit layer and the optical path layer requires high-precision manufacturing and inspection methods to ensure effective integration of electronic and optical channels and system stability.

[0163] In one embodiment of the present invention, the flexible plate 14 comprises a build-up film (e.g., Ajinomoto build-up film, ABF) substrate, a polyimide substrate, or a combination of any of the above flexible plates. In an embodiment in which the flexible plate 14 is mounted on the optical path layer, the thickness of the flexible plate 14 is 50 micrometers or less.

[0164] The electronic package embodiments shown in Figures 5A-6XD show structures including only a substrate assembly and a functional substrate without semiconductor components. Some structures or manufacturing methods correspond to the electronic devices in the '793 proposal, with the entire structure being mounted on the functional substrate. In the encapsulation layer embodiment in the '793 proposal, the encapsulation layer is removed after the substrate assembly is attached to the functional substrate, and the semiconductor components are attached before or after the substrate assembly is attached to the functional substrate. Figures 5A-5XD further illustrate several electronic packages 5AP-5'DP. Note that these are the substrate assemblies of Figures 3A-3XD further mounted on a functional substrate FB, i.e., substrate 80 is at least electrically connected to functional substrate FB. The functional substrate FB may be a motherboard, i.e., a printed circuit board (PCB), or a type similar to the substrate 80, such as a glass substrate, a ceramic substrate, a bismaleimide triazine laminate (BT) substrate, a fiberglass reinforced epoxy resin laminate (FR4) substrate, a build-up film (e.g., Ajinomoto build-up film, ABF), a Rogers substrate, a polyimide substrate, or a combination including any of the above materials. In Figures 5B and 5XB, an adhesive layer 60'' is further provided between the substrate assembly and the functional substrate FB to achieve planar bonding.

[0165] The plurality of electronic packages 6AP-6DP shown in Figures 6A-6D show the state in which the substrate assembly of Figures 4A-4D is further mounted on a functional substrate FB. The plurality of electronic packages 6'AP-6'DP shown in Figures 6XA-6XD represent the substrate assemblies 4'A-4'D without the substrate 80. In Figures 6XB and 6XD, in a state in which the flexible board 14 is not provided, the substrate assemblies 4'A-4'D add a temporary lamination carrier TB as support in the manufacturing process.

[0166] The present invention includes other electronic package embodiments. For example, multiple composite layer structures 7x (including the circuit layer 20 of the sub-conductive structure and the optical path layer 200 of the sub-optical structure) can be directly connected to the functional substrate FB, without including the substrate 80 and flexible board 14. As shown in FIG. 7, the composite layer structure 7x can be directly attached to the functional substrate FB or attached via a separate adhesive layer. Note that in this embodiment, the adhesive layer or layer is not specifically illustrated; instead, the adhesive layer or layer is formed by directly bonding the composite layer structure and the functional substrate FB under high pressure (or high temperature conditions). These composite layer structure 7x embodiments include the different combinations in the above embodiments. For ease of explanation, the circuit layer and the optical path layer are shown in a coplanar manner in the drawings. These combinations are very similar to those described above, except for the substrate portion. Note that the optical path layer 200 of the sub-optical structure and the circuit layer 20 of the sub-conductive structure can be independent or integrated, for example, arranged by separation, mixing, rearrangement, continuous, or discontinuous methods. It should also be noted that the semiconductor components are not shown in the figures.

[0167] In some embodiments of the present invention, an adhesive layer 60" is provided between the substrate assembly and the functional substrate to achieve planar bonding, see FIG. 9A for details. In this embodiment, the substrate assembly 4D has already been provided with a semiconductor component 90, and the functional substrate FB is further provided with passive components, units or packages (PU) and driving devices, units or packages (DU). Some channels or conductors may penetrate the adhesive layer 60", but this is not limiting. In some embodiments of the present invention, the substrate 80 of the substrate assembly includes at least a hard material, and the functional substrate FB is further provided with a plurality of insertion grooves SK into which the substrate assembly 4D is inserted in a one-to-one manner, see FIG. 9B.

[0168] In one embodiment of the present invention, the functional substrate FB is a glass substrate, a ceramic substrate, a bismaleimide triazine laminate (BT) substrate, a fiberglass reinforced epoxy resin laminate (FR4) substrate, a build-up film (e.g., Ajinomoto build-up film, ABF), a Rogers substrate, a PPO substrate, a polyimide substrate, or a combination including any of the above materials. Further, the functional substrate has a defined coefficient of thermal expansion, and the difference between any two of the coefficients of thermal expansion is 30 ppm / °C or less.

[0169] Thus, as shown in Figures 9A and 9B, the electronic package of the present invention further incorporates the content of the '793 proposal. In Figure 9A, the electronic package has an adhesive layer between the substrate assembly and the functional substrate, achieving planar bonding. In some embodiments, the adhesive layer has no electrical connection function. Some channels may be electrically connected or optically connected through the adhesive layer, or other electrical connections (e.g., anisotropic conductive film ACF) may be used. In Figure 9B, the functional substrate of the electronic package has multiple insertion slots into which the substrate assembly is inserted in a one-to-one manner, and the substrate of the substrate assembly comprises at least a rigid material. Note that Figure 9B does not specifically illustrate the adhesive layer. The adhesive layer is formed by directly bonding the composite layer structure and the substrate 80 under high pressure (or high temperature conditions). Another embodiment of the electronic package of the present invention is shown in Figure 9C, which includes at least one composite layer structure, but does not include any flexible board 14 or substrate 80, which are directly or indirectly attached to the functional substrate FB. The above composite layer structure embodiments are provided for reference and application. In these embodiments, there are multiple composite layer structures (with or without substrates), and the electronic package further includes some IC packages DU and passive components PU, such as capacitors, resistors, and inductors, used to control signal transmission. Although the adhesive layer or layer is not specifically shown in these embodiments, the adhesive layer or layer is formed by directly bonding the composite layer structure and the functional substrate FB under high pressure (or high temperature conditions).

[0170] It should be noted that in any of the above embodiments, in addition to electrical connection, optical communication is also realized between the composite layer structure (with or without a substrate) and the semiconductor member or between them. Therefore, in any of the embodiments of the present invention, the functional substrate further includes one or more optical engines OEs disposed on corresponding optical path layers, which are located on the top or bottom of the conductive layer. As described above, the optical engine OE may be a packaged physical unit or an unpackaged virtual unit. In any of the embodiments of the present invention, the optical engine OE includes one or more photoelectric conversion elements and one or more optical modulators for electrical-to-optical conversion for input / output. The photoelectric conversion elements can cooperate with the semiconductor member, the circuit layer, or the functional substrate and may be electrical-to-optical conversion elements (e.g., laser diodes) or optical-to-electrical conversion elements (e.g., optical sensors). The optical signal can be provided from an external source (e.g., optical fiber) or an internal source (e.g., laser diodes). In any of the embodiments of the present invention, the optical engine OE includes an optical path guide element for adjusting the direction of the optical path, for example, guiding the optical path from a first waveguide to a second waveguide. In any one embodiment of the present invention, the optical engine OE includes a combination of an optical-electrical conversion element with one or more optical modulators, and an optical path guiding element.

[0171] The optical engine OE and the optical path layer will now be described in more detail. As mentioned above, the optical path layer is provided on the substrate or functional substrate. Taking the electronic package 1A of the present invention as an example, further combining it with the '793 proposal, it includes optical path layers 200, 2000 (with similar reference numerals) provided on the functional substrate FB. The working unit 80U may be located at the location where the composite layer structure is present, or at the location where the composite layer structure and its substrate 80 are simultaneously installed. Some IC packages DU and passive components PU (used to control signal transmission) are installed thereon; see FIG. 10A for details. The optical path layers 200, 2000 are considered to be a single optical path layer, and the optical path layer includes multiple optical paths. Some of the optical paths extend along a first direction D1 and are parallel to the composite layer structure, and some of the optical paths extend along a second direction D2 and are parallel to the composite layer structure. These optical paths are considered to be main optical paths. The first direction D1 and the second direction D2 may be parallel or not parallel to each other. Some optical paths are based on a composite layer structure (with or without a substrate) and may be sub-optical paths (not required). In some embodiments, the sub-optical paths can communicate with at least one semiconductor element 90 of the main optical path. In some embodiments, the sub-optical paths can communicate with any two semiconductor elements 91, 92. The circuit unit 20X is a conductive wire or optical path, and controls the optical path layers 200, 2000 directly or via an electrical-to-optical conversion circuit / unit.

[0172] The following is an example in which some optical engines OE are disposed on the optical path layer. In one embodiment, as shown in FIG. 10B , one or more optical engines OE are disposed on the corresponding optical path layer, and the optical path performs electrical / optical conversion with the semiconductor member 90 or adjusts the optical path direction through the optical engines OE. Some of the optical engines OE can control / adjust optical signals so that the main optical path is perpendicular to the third direction D3 of the composite layer structure, either in the first direction D1 or the second direction D2 or both. Some of the optical engines OE can control / adjust optical signals so that the main optical path is perpendicular to the third direction D3 of the composite layer structure. The control / adjustment of the optical engine OE1 refers to the optical diverter, which divertes the optical signal from one direction to the next. The control / conversion of the optical engine OE2 refers to the opto-electrical converter, which converts between optical and electrical signals. Note that the transmission direction of the electrical signal is not limited. Here, "control" includes at least operations such as steering or converting, and the optical engine OE has at least one of the above functions. In this embodiment, each main optical path is provided with an edge coupler that connects to a respective optical fiber OF.

[0173] It should be noted that the optical signal inlet may be located in the composite layer structure, the functional substrate, or both.

[0174] 10C is an example of an optical path layer provided on a functional substrate. Unlike FIG. 10B, when the optical engine OE1 controls / adjusts the optical signal of the optical path, the optical engine is not provided at the intersection (first direction D1 or second direction D2) of each main optical path. Similarly, when the optical engine OE2 controls / adjusts the optical signal entering the semiconductor member 90, the optical engine is not provided at the entry point (first direction D1 or second direction D2) of each main optical path.

[0175] The optical path layer provided on the functional substrate will be described using Fig. 10D as an example. Unlike Fig. 10C, edge couplers for connecting to optical fibers OF are not provided in all main optical paths.

[0176] The optical path layers provided on the functional substrate are described using FIGS. 10E, 10ME, and 10NE as examples. Unlike FIG. 10D, FIG. 10E shows multiple optical path layers, with some optical paths in one optical path layer extending along a first direction D1 in a composite layer structure. Some optical paths in another optical path layer extending along a second direction D2 in a composite layer structure. Some optical engines OE1 guide the optical signals of the optical paths in the first direction D1, the second direction D2, or redirecting them from the origin to a third (vertical) direction D3. Some optical engines OE2 convert optical signals into electrical signals and electrical signals into optical signals. As shown in FIG. 10ME, optical signals entering through the optical fiber OF are mainly transmitted along the first direction D1 to the corresponding operational unit 80U. As shown in FIG. 10NE, optical signals entering through the optical fiber OF are mainly transmitted along the second direction D2 to the corresponding operational unit 80U.

[0177] It should be noted that the optical engine OE1 is provided at multiple intersections where the optical paths in the first and second directions intersect, and may be provided on the same or different optical path layers. Furthermore, the optical engines OE1 and OE2 are provided on any or all of the optical path layers, and the positions of the optical engines OE on different optical path layers may or may not overlap.

[0178] Using FIG. 10F as an example, the optical path layers provided on the functional substrate will be described. Here, the number of optical path layers may be single or multiple, without affecting the conceptual structure of this embodiment. An optical path circuit 20Y similar to a demultiplexer and an optical engine OE1Y are provided on the main circuit side, and an external single light source (e.g., optical fiber OF) can supply an optical signal, which can be controlled by the IC package. The optical engine OE1Y is used to control the optical signal along the main optical path in the first direction D1.

[0179] It should be noted that in any embodiment of the present invention, an internal light source can be substituted for the external light source described above.

[0180] Taking Fig. 10G as an example, the optical path layer provided on the functional substrate is similar to the embodiment of Fig. 10F. In addition to controlling the optical signals along the first direction D1 of the main optical path, the optical engine OE1Y' also controls the optical signals along the second direction D2 of the main optical path in a demultiplexer manner, forming an optical path circuit 20Y' similar to a demultiplexer.

[0181] As can be seen, there are many manufacturing methods for each embodiment of the electronic package, and the functional substrate includes at least a composite layer structure and a semiconductor material. The manufacturing of the electronic package can be divided into at least four methods, which are further described below, but are not shown in the drawings when focusing only on the manufacturing process of each substrate assembly.

[0182] In one method, the substrate assembly includes a composite layer structure and a substrate, and the substrate assembly is transferred to a functional substrate or semiconductor component is installed. In the first method, the optical path layer and the circuit layer can be formed in separate manufacturing processes and are combined with the substrate, so in one embodiment, this design is easy to understand when compared with other embodiments described below. In another embodiment, the optical path layer and / or the circuit layer are combined with a flexible board.

[0183] In the second method, the substrate assembly includes a composite layer structure and a substrate, and the substrate assembly is transferred to a functional substrate or semiconductor component is installed. The difference from the first method is that either the optical path layer or the circuit layer, or neither of them is bonded to the substrate.

[0184] See Figures 11A-11D and 12A-12D. In these figures, the initial substrate 10 includes a flexible plate 14 mounted on a rigid plate 12, or the initial substrate 10 includes only the rigid plate 12. Note that the flexible plate 14 and the rigid plate 12 may be single or multiple substrates. A multiple layer structure includes at least one or more optical path layers 400' (or similar designations) and further includes one or more circuit layers 40' (or similar designations). The multiple layer structures 100I and 100II in Figure 11A are structures in which the circuit layer 40' is processed independently, with or without a substrate 80. Step 1 involves the initial substrate 10 including a flexible plate 14 mounted on a rigid plate 12. Step 2 involves the circuit layer 20 being mounted on the flexible plate 14, and the conductive gasket 30 being formed on the circuit layer 20. In step 3, the temporary connecting substrate structure 50 includes a temporary connecting substrate 54 (i.e., the aforementioned carrier TB) and a release layer 52 disposed between the temporary connecting substrate 54 and the circuit layer 20, thereby releasing the rigid board 12 from the flexible board 14. In step 4, an adhesive layer 60 is disposed on the flexible board 14, and a plurality of conductors 70 penetrate the adhesive layer 60 and the flexible board 14 to electrically connect to the circuit layer 20. In step 5-1, the temporary connecting substrate 54 is released from the circuit layer 20 by removing the release layer 52 using a laser peeling process, and a substrate 80 is disposed below the adhesive layer 60 and connected to the flexible board 14. In step 5-2, the temporary connecting substrate 54 is similarly released from the circuit layer 20 by removing the release layer 52 using a laser peeling process, but the substrate 80 is not disposed below the adhesive layer 60.

[0185] The composite layer structures 100aI and 100aII in FIG. 11B are structures in which the circuit layer 40a' is processed independently, depending on whether or not it includes a substrate 80. In step 1, the initial substrate 10 includes only the rigid board 12. In step 2, the circuit layer 20 is attached to the rigid board 12, and a conductive gasket 30 is formed on the circuit layer 20. In step 3, the temporary connecting board structure 50 includes a temporary connecting board 54 (i.e., the aforementioned carrier TB) and a release layer 52 disposed between the temporary connecting board 54 and the circuit layer 20, and the rigid board 12 is released from the circuit layer 20. In step 4, an adhesive layer 60 is disposed directly on the circuit layer 20, and multiple conductors 70 penetrate the adhesive layer 60 to electrically connect with the circuit layer 20. In step 5-1, the temporary connecting board 54 is released from the circuit layer 20 by removing the release layer 52 using a laser peeling process, and a substrate 80 is disposed below the adhesive layer 60 and connected to the circuit layer 20. In step 5-2, the temporary connecting substrate 54 is similarly released from the circuit layer 20 by removing the release layer 52 through a laser peeling process, but without placing the substrate 80 below the adhesive layer 60.

[0186] The composite layer structures 100bI and 100bII in FIG. 11C are structures in which the circuit layer 40b' is processed independently, with or without the substrate 80. Step 1 includes an initial substrate 10, which is a flexible board 14 attached to a rigid board 12. Step 2 includes a circuit layer 20 attached to the flexible board 14, and a conductive gasket 30 is formed on the circuit layer 20. Step 3 includes an adhesive layer 60 attached to the circuit layer 20, and multiple conductors 70 penetrate the adhesive layer 60 and the flexible board 14 to electrically connect to the circuit layer 20. Step 4 includes a substrate 80 physically connected to the circuit layer 20 through the adhesive layer 60 and electrically connected to the circuit layer 20 through the conductors 70. Step 5 includes a laser peeling process to remove the release layer 52, releasing the temporary connecting substrate 54 from the circuit layer 20. Step 6-1 shows the composite layer structure 100bI completed after step 5. Step 6-2 is the completed composite layer structure 100bII after step 3, after the temporary connecting substrate 54 is released from the circuit layer 20 by removing the release layer 52 through a laser peeling process.

[0187] Composite layer structures 100cI and 100cII in FIG. 11D are structures in which the circuit layer 40c' is processed independently, with or without the substrate 80. In step 1, the initial substrate 10 includes only the rigid board 12. In step 2, the circuit layer 20 is attached to the rigid board 12, and a conductive gasket 30 is formed on the circuit layer 20. In step 3, an adhesive layer 60 is directly attached to the circuit layer 20, and multiple conductors 70 penetrate the adhesive layer 60 to electrically connect to the circuit layer 20. In step 4, the substrate 80 is physically connected to the circuit layer 20 through the adhesive layer 60 and electrically connected to the circuit layer 20 through the conductors 70. In step 5, the temporary connecting substrate 54 is released from the circuit layer 20 by removing the release layer 52 using a laser peeling process. Step 6-1 shows the completed composite layer structure 100cI after step 5. Step 6-2 is the completed composite layer structure 100cII after step 3, after the temporary connecting substrate 54 is released from the circuit layer 20 by removing the release layer 52 through a laser peeling process.

[0188] 12A to 12D, when the optical path layer 400′ has or does not have the substrate 80, the same technique as in FIGS. 11A to 11D can be used, except that the circuit layer 20 is replaced with the optical path layer 200. Optical path layers 1000I and 1000II shown in FIG. 12A, which include only the composite layer structure of the optical path layer 400′, can be manufactured using the same manufacturing process as the composite layer structures 100I and 100II shown in FIG. 11A, except that the optical path layer 200 is replaced with the circuit layer 20.

[0189] Similarly, the composite layer structures 1000aI, 1000aII, 1000bI, 1000bII, 1000cI, and 1000cII shown in FIGS. 12B-12D can be completed by processing in the same manner.

[0190] The results of the manufacturing process of the circuit layer 40' in Figures 11A to 11D are combined with the results of the manufacturing process of the circuit layer 400' in Figures 12A to 12D, thereby realizing the substrate assembly and electronic device in the first and second methods (and applying the functional substrate FB).

[0191] The present invention also provides a third method, in which the substrate assembly is constructed in a composite layer structure with or without a substrate, and then transferred to a functional substrate FB and / or semiconductor components are installed. Unlike the second method, the optical path layer and the circuit layer can be formed on the substrate 80 (or without a substrate) in the same manufacturing process, resulting in a coplanar or laminated method. Figures 13A-13D illustrate a coplanar manufacturing process. A composite layer structure 4000' (or similar) can include one or more circuit layers and optical path layers, and can be formed on the same substrate / plate / carrier in the same manufacturing process. The circuit layer and the optical path layer are usually formed in a mixed manner, and the two layers do not necessarily have clearly separate regions in the top view.

[0192] Composite layer structures 10000I, 10000II, and 10000III in FIG. 13A are structures in which the composite layer structure 2000 is processed independently, with or without a substrate 80. Step 1 shows the initial substrate 10 including a flexible plate 14 attached to a rigid plate 12. Step 2 shows the composite layer structure 2000 (with the circuit layer 20 and optical path layer 200 disposed thereon) attached to the flexible plate 14, and a conductive gasket 3000 is formed on the circuit layer 20. Step 3 shows the temporary connecting substrate structure 50, including a temporary connecting substrate 54 (i.e., the aforementioned carrier TB) and a release layer 52 attached between the temporary connecting substrate 54 and the circuit layer 20, and the rigid plate 12 is released from the flexible plate 14. Step 4 shows the adhesive layer 60 attached to the flexible plate 14, and a plurality of conductors 70 passing through the adhesive layer 60 and the flexible plate 14 to electrically connect with the circuit layer 20. In step 5-1, temporary connecting substrate 54 is released from circuit layer 20 by removing release layer 52 through a laser peeling process, and there is no substrate 80 below adhesive layer 60. At this stage, composite layer structure 10000I can be applied to a functional substrate through a subsequent process. In step 5-2, temporary connecting substrate 54 is similarly released from circuit layer 20 by removing release layer 52 through a laser peeling process, but there is a substrate 80 below adhesive layer 60. At this stage, composite layer structure 10000II can be applied to a functional substrate through a subsequent process. In step 6, temporary connecting substrate 54 is released from circuit layer 20 by removing release layer 52 through a laser peeling process, and then composite layer structure 10000III is completed in step 7.

[0193] Composite layer structures 10000aI, 10000aII, and 10000aIII in FIG. 13B are structures in which the composite layer structure 2000 is processed independently, depending on whether or not the substrate 80 is present. Step 1 shows that the initial substrate 10 includes only the rigid plate 12. Step 2 shows that the composite layer structure 2000 (on which the circuit layer 20 and the optical path layer 200 are disposed) is provided on the rigid plate 12, and a conductive gasket 3000 is formed on the circuit layer 20. Step 3 shows that the temporary connecting substrate structure 50 includes a temporary connecting substrate 54 (i.e., the aforementioned carrier TB) and a release layer 52 provided between the temporary connecting substrate 54 and the circuit layer 20, and the rigid plate 12 is released from the flexible plate 14. Step 4 shows that an adhesive layer 60 is provided on the composite layer structure 2000, and a plurality of conductors 70 penetrate the adhesive layer 60 to electrically connect with the composite layer structure 2000. In step 5-1, temporary connecting substrate 54 is released from circuit layer 20 by removing release layer 52 through a laser peeling process, and there is no substrate 80 below adhesive layer 60. At this stage, composite layer structure 10000aI can be applied to a functional substrate in a subsequent process. In step 5-2, temporary connecting substrate 54 is similarly released from circuit layer 20 by removing release layer 52 through a laser peeling process, but there is a substrate 80 below adhesive layer 60. At this stage, composite layer structure 10000aII can be applied to a functional substrate in a subsequent process. In step 6, temporary connecting substrate 54 is released from circuit layer 20 by removing release layer 52 through a laser peeling process, and then composite layer structure 10000aIII is completed in step 7.

[0194] Composite layer structures 10000bI, 10000bII, and 10000bIII in Figure 13C are structures in which the composite layer structure 2000 is processed independently, with or without a substrate 80. Step 1 shows that the initial substrate 10 includes a flexible plate 14 attached to a rigid plate 12. Step 2 shows that the composite layer structure 2000 (on which the circuit layer 20 and the optical path layer 200 are disposed) is attached to the flexible plate 14, and a conductive gasket 3000 is formed on the circuit layer 20. Step 3-1 shows the temporary connecting substrate structure 50, which includes a temporary connecting substrate 54 (i.e., the aforementioned carrier TB) and a release layer 52 attached between the temporary connecting substrate 54 and the circuit layer 20. At this stage, the composite layer structure 10000bI can be applied to a functional substrate by subsequent techniques. In step 3-2, an adhesive layer 60 is provided on the flexible board 14, and a plurality of conductors 70 penetrate the adhesive layer 60 and the flexible board 14 to electrically connect with the circuit layer 20; at this stage, the composite layer structure 10000bII can be applied to a functional substrate by subsequent techniques. In step 4, a substrate 80 is provided below the adhesive layer 60, and the rigid board 12 is released from the flexible board 14; at this stage, the composite layer structure 10000bII can be applied to a functional substrate by subsequent processes; after being released from the rigid board 12 in step 4, the composite layer structure 10000bIII is completed in step 7.

[0195] Composite layer structures 10000cI, 10000cII, and 10000cIII in FIG. 13D are structures in which the composite layer structure 2000 is processed independently, with or without a substrate 80. Step 1 shows that the initial substrate 10 includes only the rigid plate 12. Step 2 shows that the composite layer structure 2000 (on which the circuit layer 20 and the optical path layer 200 are disposed) is provided on the rigid plate 12, and a conductive gasket 3000 is formed on the circuit layer 20. Step 3-1 shows the structure of Step 2 inverted, at which stage the composite layer structure 10000cI can be applied to a functional substrate in a subsequent process. Step 3-2 shows that an adhesive layer 60 is provided on the composite layer structure 2000, and multiple conductors 70 penetrate the adhesive layer 60 to electrically connect with the composite layer structure 2000. At this stage, the composite layer structure 10000cII can be applied to a functional substrate in a subsequent process. Step 4 shows that a substrate 80 is provided below the adhesive layer 60. In step 5, the rigid plate 12 is released from the composite layer structure 2000 by a laser peeling process, at which point the composite layer structure 10000cIII can be applied to a functional substrate by subsequent processes.

[0196] The results of the manufacturing process for the circuit layer 4000' shown in Figures 13A-13D can be used alone to realize a substrate assembly by a third method, or the results of the manufacturing process for the circuit layer 4000' shown in Figures 13A-13D can be mixed with the results of the circuit layer 40' shown in Figures 11A-11D and / or the results of the optical path layer 400' shown in Figures 12A-12D to realize a substrate assembly by yet another method.

[0197] It should be understood that methods 1 through 3 can be combined in any way.

[0198] The fourth method is to form the composite layer structure directly on the functional substrate, without using a substrate. The semiconductor components are applied to the composite layer structure before or after the manufacturing process. The optical path layer 200 and the circuit layer 20 can be simultaneously formed on the functional substrate FB in a coplanar manner or by lamination. As shown in FIG. 14, the optical path layer and the circuit layer are coplanar. In this embodiment, the adhesive layer and the adhesive layer are not specifically depicted. The adhesive layer or the adhesive layer is formed by directly bonding the composite layer structure and the functional substrate FB under high pressure (or by further combining high temperature conditions).

[0199] The following describes a fourth method for fabricating electronic devices. First, a high-precision (2 μm), large-area, low-cost circuit layer (referred to here as the RDL layer) is fabricated using TFT panel technology on a flexible substrate (e.g., a PI substrate) that is attached to a rigid substrate (e.g., a glass substrate) or directly on the rigid substrate. It is then cut into clusters consisting of multiple units and peeled off from the glass substrate. An optical path layer (optical connection, including at least waveguides and / or optical fibers) can be prefabricated on a functional substrate (packaging substrate level). The clusters are then attached to the functional substrate, completing the electrical connections and forming electronic devices. Multiple CoR (chips formed on the ultra-fine RDL layer, which is the semi-finished CoWoS-R) units can be bonded to electronic devices, realizing a large-scale integrated system with electronic device clusters. This layered structure design is beneficial for stress management and maintaining precision. An appropriate cluster size ensures cluster units (PI clusters), and a redundancy design can be introduced to address low yield issues. [Explanation of symbols]

[0200] 100~100c, 1000~1000c, 3A~3D, 3'A~3'D, 4A~4D, 4'A~4'D, 8A~8D board assembly 10, 80 board 12 Rigid plate 14 Flexible board 20, 40a', 40b', 40c', 4000' circuit layer 20X Circuit Unit 20Y optical path circuit 30X, 81, 82 conductors 30, 3000 Conductive gasket 40'~40c' Composite layer structure (rewiring structure) 50 Temporary connection board structure 52 Dissociation Layer 54 Temporary connection board 60, 60', 60'' adhesive layer 60a flat layer 70, 70c~70d, 70'c, 70c1~70c2, 70d1~70d2 Conductor 100I~100II, 100aI~100aII, 100bI~100bII, 100cI~100cII, 1000I~1000II, 2000, 10000I~10000III, 10000aI~10000aIII, 10000bI~10000bIII, 10000cI~10000cIII Composite layer structure 200, 400', 2000 optical path layer 300 light path 7x, 400'~400c', 4000' Composite layer structure (light path layer or circuit layer) 700, 700c~700d, 700d1~700d2, 700'c channel 800A~800B Electronic equipment 80U Work Unit 81, 82 PCB conductors 90~94 Semiconductor materials 91 System on a Chip (SoC) 92 High Bandwidth Memory (HBM) 1A, 6'AP~6'DP electronic package CP, CP' bond plane D1 1st direction D2 2nd direction D3 Third direction DU IC package FB function board OE, OE1~OE2, OE1Y optical engine OF optical fiber PU passive elements SK Insertion Tank TB carriers

Claims

1. A substrate; a composite layer structure defining a coupling surface, with one or more circuit layers and one or more optical path layers disposed above and / or below the coupling surface, the optical path layers defining a plurality of optical paths, and the circuit layers defining a plurality of conductive lines; and an adhesive layer disposed between the substrate and the composite layer structure.

2. 2. The substrate assembly of claim 1, wherein one or more of the circuit layers and one or more of the optical path layers are arranged in a mixed coplanar manner; one or more of the circuit layers or one or more of the optical path layers are located above the bonding surface, and the other is located below the bonding surface.

3. 10. The substrate assembly of claim 1, further comprising a support layer disposed along the bonding surface, the support layer comprising an adhesive material or polyimide, or a combination thereof.

4. 2. The substrate assembly of claim 1, wherein the planar dimensions of the substrate are at least 100 millimeters by 100 millimeters.

5. 2. The substrate assembly of claim 1, wherein the substrate is a glass substrate, a ceramic substrate, a bismaleimide triazine laminate (BT) substrate, a fiberglass reinforced epoxy resin laminate (FR4) substrate, a build-up film, a Rogers substrate, a polyimide substrate, or a combination comprising any of the above materials.

6. 2. The substrate assembly of claim 1, further comprising: a plurality of channels defined in one or more of the circuit layers and / or one or more of the optical path layers, the channels providing electrical connection or optical communication in a vertical direction perpendicular to the substrate, the channels penetrating the adhesive layer or further penetrating the substrate.

7. 2. The substrate assembly of claim 1, comprising one or more optical engines arranged corresponding to one or more of the optical path layers, wherein some of the optical paths extend along a first direction of the composite layer structure, some of the optical paths extend along a second direction of the composite layer structure, the first direction and the second direction are not parallel to each other, and some of the optical engines control the optical paths to be perpendicular to the vertical direction of the composite layer structure.

8. 2. The substrate assembly of claim 1, wherein the substrate, the optical path layer, and the circuit layer define thermal expansion coefficients, and the difference between the thermal expansion coefficients of any two of them is 30 ppm / °C or less.

9. A substrate; a composite layer structure defining a coupling surface, with one or more optical path layers disposed above and / or below said coupling surface, said optical path layers defining a plurality of optical paths; and a substrate assembly comprising an adhesive layer disposed between the substrate and the composite layer structure.

10. A substrate assembly according to claim 1; a plurality of semiconductor members disposed in the composite layer structure of the substrate assembly; An electronic device, characterized in that a part of the semiconductor members is electrically connected to the circuit layer, and another part of the semiconductor members is in optical communication with the optical path layer.

11. 11. The electronic device of claim 10, wherein the one or more semiconductor components are a System on Chip (SoC) and / or a High Bandwidth Memory (HBM).

12. 11. The electronic device of claim 10, wherein at least some of the semiconductor members are stacked on top of each other.

13. a functional substrate; At least one substrate assembly according to claim 1 electrically connected to the functional substrate; a plurality of semiconductor members disposed in a composite layer structure of at least one of the substrate assemblies; An electronic package, characterized in that some of the semiconductor members are electrically connected to the circuit layer, and other parts of the semiconductor members are in optical communication with the optical path layer.

14. The electronic package of claim 13 , further comprising an adhesive layer disposed between the substrate assembly and the functional substrate.

15. The electronic package of claim 13 , wherein the functional substrate further has a plurality of insertion grooves for the substrate assembly to insert in a one-to-one manner, and the substrate of the substrate assembly includes at least a hard material.

16. 14. The electronic package of claim 13, wherein one or more of the semiconductor components is a system on a chip (SoC) and / or a high bandwidth memory (HBM).

17. a functional substrate; a plurality of composite layer structures defining a coupling surface, with one or more circuit layers and one or more optical path layers disposed above and / or below the coupling surface, the optical path layers defining a plurality of optical paths, and the circuit layers defining a plurality of conductors; a plurality of semiconductor members disposed in the composite layer structure; An electronic package, characterized in that some of the semiconductor members are electrically connected to the circuit layer, and other parts of the semiconductor members are in optical communication with the optical path layer.

18. 18. The electronic package of claim 17, wherein one or more of the circuit layers and one or more of the optical path layers are arranged in a mixed coplanar manner; one or more of the circuit layers or one or more of the optical path layers are located above the bonding surface, and the other is located below the bonding surface.

19. 18. The electronic package of claim 17, wherein the functional substrate is a glass substrate, a ceramic substrate, a bismaleimide triazine laminate (BT) substrate, a fiberglass reinforced epoxy resin laminate (FR4) substrate, a build-up layer, a Rogers substrate, a PPO substrate, a polyimide substrate, or a combination comprising any of the foregoing materials.

20. A plurality of channels are defined, and these channels are formed in one or more of the circuit layers and / or one or more of the optical path layers, and provide electrical connection or optical communication perpendicular to the vertical direction of the substrate. An adhesive layer is installed between these composite reservoir structures and the functional substrate, and the channels penetrate the adhesive layer or further penetrate the functional substrate.

21. 20. The electronic package of claim 17, wherein one or more of the semiconductor components is a system on a chip (SoC) and / or a high bandwidth memory (HBM).

22. 18. The electronic package of claim 17, wherein some of the optical paths extend along a first direction of the composite layer structure, and some of the optical paths extend along a second direction of the composite layer structure, and the first direction and the second direction are not parallel to each other.

23. 18. The electronic package of claim 17, wherein the substrate, the optical path layer, and the circuit layer define coefficients of thermal expansion, and the difference between the coefficients of thermal expansion of any two of them is 30 ppm / [deg.] C. or less.

24. 20. The electronic package of claim 17, further comprising a support layer disposed along the bonding surface, the support layer comprising an adhesive material or a polyimide, or a combination thereof.

25. The method for manufacturing an electronic package comprises: a composite layer structure is formed on a substrate, the composite layer structure defining a bonding surface, and one or more circuit layers and one or more optical path layers are respectively provided above and / or below the bonding surface; the one or more optical path layers defining a plurality of optical paths, and the one or more circuit layers defining a plurality of conductors; Do one of the following two steps: a plurality of semiconductor members are disposed in the composite layer structure, some of the semiconductor members being electrically connected to at least the circuit layer, and other of the semiconductor members being in optical communication with the optical path layer; a functional substrate is provided that is laminated under the composite layer structure and is electrically connected to at least the composite layer structure; A method for manufacturing an electronic package, comprising the steps of:

26. When the composite layer structure is formed on the substrate, one of the following two steps is performed: forming one or more optical path layers on an initial substrate, the one or more optical path layers including a plurality of optical paths, and removing at least a portion of the initial substrate from the one or more optical path layers; forming one or more circuit layers on the initial substrate, the one or more circuit layers including a plurality of conductive lines, and removing at least a portion of the initial substrate from the one or more circuit layers; After this, perform the following steps:

26. The method for manufacturing an electronic package according to claim 25, wherein when the composite layer structure is formed on the substrate, the circuit layer is laminated on top of the optical path layer, or the optical path layer is laminated on top of the circuit layer.

27. When the composite layer structure is formed on the substrate, one of the following two steps is performed: the initial substrate comprises a rigid plate and a flexible plate laminated to the rigid plate; after removing the rigid plate from the flexible plate, a composite layer structure is obtained that includes the flexible plate but does not include the rigid plate; 26. The method of claim 25, wherein the initial substrate is a rigid board, and removing the composite layer structure from the rigid board results in the composite layer structure being free of the rigid board.

28. 26. The method of claim 25, wherein an adhesive layer is provided between the circuit layer and the optical path layer when the composite layer structure is formed on the substrate.

29. The method of claim 25, wherein after the composite layer structure is formed on the substrate, an adhesive layer is provided between the composite layer structure and the functional substrate.

30. A method for manufacturing an electronic package, characterized in that one or more circuit layers and one or more optical path layers are formed on a functional substrate to form a composite layer structure, wherein the one or more circuit layers define a plurality of conductors and the one or more optical path layers define a plurality of optical paths; and a plurality of semiconductor components are provided on the functional substrate, some of the semiconductor components being electrically connected to one or more of the circuit layers, and other of the semiconductor components being in optical communication with one or more of the optical path layers.

31. 31. The method of claim 30, wherein the circuit layer and the optical path layer are formed in a coplanar manner when the composite layer structure is formed.

32. 31. The method for manufacturing an electronic package according to claim 30, wherein when the composite layer structure is formed, after either the circuit layer or the optical path layer is formed on the functional substrate, the other layer is laminated on top of the layer.

33. 31. The method of claim 30, wherein an adhesive layer is provided between the circuit layer and the optical path layer when the composite layer structure is formed on the substrate.

34. The method of claim 30, wherein after the composite layer structure is formed on the substrate, an adhesive layer is provided between the composite layer structure and the functional substrate.

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