Light-emitting module

Abstract

To provide a substrate module in which components arranged on a substrate are appropriately protected.SOLUTION: A substrate having an upper surface and a lower surface, the upper surface being provided with a plurality of first wiring regions and a plurality of second wiring regions; one or more power-supplied devices disposed in the plurality of first wiring regions and configured to receive power supply from outside; The substrate module according to claim 1, wherein the protected component is disposed between two straight lines passing through both ends of the first connection component in a first direction and extending in a second direction perpendicular to the first direction, and between two planes including a side surface of the power-supplied device and a side surface of the first connection component facing each other in the second direction, in a top view.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a light emitting module. [Background technology]

[0002] Patent Document 1 discloses a light-emitting module in which a light-emitting device and a connector are mounted for supplying power to the light-emitting device. By providing a connector, electrical connection with the light-emitting device can be easily performed. In addition, the light-emitting device may be provided with a thermistor to measure the temperature during operation. In Patent Document 1, the thermistor is disposed inside the light-emitting device. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2019-153570 Summary of the Invention [Problem to be solved by the invention]

[0004] In a board module (including a light-emitting module) in which a first connection part to which a second connection part is connected and a power-supplied device such as a light-emitting device are arranged on a wiring board, there are cases in which it is desired to check the operation of the power-supplied device without going through the first connection part.

[0005] Furthermore, in Patent Document 1, the thermistor is protected from light from outside the light emitting device, but even when the thermistor is placed outside the light emitting device, there are cases where it is necessary to protect the thermistor from external light. Furthermore, the object of protection is not limited to the thermistor, and the object of protection is not limited to light. It is necessary to design a module so that components that may need to be protected from external factors can be easily protected as needed. [Means for solving the problem]

[0006] The first light-emitting module disclosed in the embodiment comprises a substrate having an upper surface and a lower surface, with a plurality of wiring regions provided on the upper surface; one or more light-emitting devices arranged in a plurality of first wiring regions included in the plurality of wiring regions and receiving power from an external source; and a first connection component electrically connected to the plurality of first wiring regions and arranged in a plurality of second wiring regions included in the plurality of wiring regions, the first connection component having a first connection portion, the plurality of wiring regions including one or more third wiring regions and one or more fourth wiring regions, the one or more third wiring regions and the one or more fourth wiring regions being electrically connected to the plurality of first wiring regions without the need for the first connection component, a second connection component being connected to the first connection portion of the first connection component, and power being supplied to the one or more light-emitting devices via the second connection component.

[0007] In addition, a second light-emitting module disclosed in an embodiment comprises a substrate having an upper surface and a lower surface, with a plurality of wiring regions provided on the upper surface; one or more light-emitting devices arranged in a plurality of first wiring regions included in the plurality of wiring regions and receiving power from an external source; and a first connection component electrically connected to the plurality of first wiring regions and arranged in a plurality of second wiring regions included in the plurality of wiring regions, the first connection component having a first connection portion, the plurality of wiring regions including one or more third wiring regions and one or more fourth wiring regions, the one or more third wiring regions and the one or more fourth wiring regions being electrically connected to the plurality of first wiring regions without the need to go through the first connection component, and the one or more third wiring regions and the one or more fourth wiring regions being electrically connected to the plurality of second wiring regions.

[0008] Furthermore, the third light-emitting module disclosed in the embodiment further includes, in addition to the first light-emitting module or the second light-emitting module, a protected component that is arranged on the upper surface of the substrate and is to be protected from light in the operating environment of the light-emitting device, and the protected component is arranged, in a top view, between two straight lines that pass through both ends of the first connecting component in the first direction and proceed in a second direction perpendicular to the first direction, and between two planes that respectively include the side of the light-emitting device and the side of the first connecting component that face each other in the second direction. [Effects of the Invention]

[0009] According to the present invention relating to the first light emitting module or the second light emitting module, the operation of the power-supplied device can be checked without using the first connecting part.

[0010] According to the third light emitting module of the present invention, it is further possible to realize a module having a structure for protecting the target components. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a perspective view of a light-emitting module according to a first embodiment. [Figure 2] FIG. 2 is a perspective view of the light emitting module according to the first embodiment, seen from a different direction than that in FIG. [Figure 3] FIG. 3 is a top view of the light emitting module according to the first embodiment. [Figure 4] FIG. 4 is a top view of the light emitting module according to the first embodiment in a state in which the protected component is protected. [Figure 5] FIG. 5 is a side view of the light emitting module according to the first embodiment in a state in which the protected component is protected. [Figure 6] FIG. 6 is a perspective view of the light emitting device according to the first embodiment. [Figure 7] FIG. 7 is a perspective view of the light emitting device according to the first embodiment, seen from a different direction than that in FIG. [Figure 8] FIG. 8 is a top view of the light emitting device according to the first embodiment. [Figure 9] FIG. 9 is a top view illustrating the internal structure of the light emitting device according to the first embodiment. [Figure 10] FIG. 10 is a perspective view of the second connecting part according to the first embodiment as viewed from the top side. [Figure 11] FIG. 11 is a perspective view of the second connecting part according to the first embodiment as viewed from the bottom side. [Figure 12]FIG. 12 is a perspective view of the light emitting module according to the second embodiment. [Figure 13] FIG. 13 is a perspective view of the light emitting module according to the second embodiment, seen from a different direction than that of FIG. [Figure 14] FIG. 14 is a top view of the light emitting module according to the second embodiment. [Figure 15] FIG. 15 is a top view of the light emitting module according to the second embodiment in a state where the protected component is protected. [Figure 16] FIG. 16 is a six-view diagram of the light-emitting module according to the first embodiment. [Figure 17] FIG. 17 is a six-view diagram of the light emitting device according to the first embodiment. [Figure 18] FIG. 18 is a six-view diagram of the light-emitting module according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] In this specification and claims, polygons such as triangles and quadrilaterals are referred to as polygons, including shapes in which the corners of the polygons have been rounded, chamfered, corner-cut, rounded, etc. Furthermore, shapes in which processing has been applied not only to the corners (edges of the sides) but also to the middle portions of the sides are also referred to as polygons. In other words, shapes in which partial processing has been applied while retaining the polygonal base are included in the interpretation of "polygon" described in this specification and claims.

[0013] The same applies to words that describe specific shapes, such as trapezoids, circles, and irregularities, not just polygons. The same also applies when dealing with the sides that form the shape. In other words, even if the corners or middle part of a side are processed, the interpretation of "side" includes the processed part. Note that when distinguishing a "polygon" or "side" that has no processing from a processed shape, the word "strict" is added, for example, "strict quadrangle."

[0014] Furthermore, in this specification or the claims, when there are multiple equivalents to a certain element and each is to be expressed separately, the element may be distinguished by adding "first" or "second" to the beginning of the element. Furthermore, when the objects or viewpoints distinguished between this specification and the claims are different, the same notation may not refer to the same object between the specification and the claims.

[0015] For example, if there are objects in this specification that are distinguished by being marked with "first," "second," or "third," and the claims are written with only the "first" and "third" in this specification as the subject matter, the objects marked with "first" and "second" in the claims may refer to the objects marked with "first" and "third" in this specification.

[0016] Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, although the illustrated embodiments embody the technical concept of the present invention, they do not limit the present invention. Furthermore, in the following description, the same names and symbols indicate the same or similar components, and redundant explanations may be omitted as appropriate. Note that the size and positional relationship of components shown in each drawing may be exaggerated for ease of understanding.

[0017] First Embodiment A substrate module according to a first embodiment will be described. FIGS. 1 to 5 are diagrams for explaining an exemplary embodiment of the substrate module. The drawings show a light emitting module 1, which is an exemplary embodiment of the substrate module. FIG. 1 is a perspective view of the light emitting module 1. FIG. 2 is a perspective view of the light emitting module 1 as viewed from a diagonal direction of FIG. 1. FIG. 3 is a top view of the light emitting module 1. FIG. 4 is a top view showing an example of the light emitting module 1 in a state in which a second connecting part is connected. FIG. 5 is a side view of the light emitting module 1 corresponding to FIG. 4.

[0018] 6 to 9 are diagrams for explaining an exemplary embodiment of a power-supplied device mounted on a substrate module. The figures show a light-emitting device 20, which is an exemplary embodiment of a power-supplied device. FIG. 6 is a perspective view of the light-emitting device 20. FIG. 7 is a perspective view of the light-emitting device 20 as viewed from a diagonal direction of FIG. 6. FIG. 8 is a top view of the light-emitting device 20. FIG. 9 is a top view of a region in the light-emitting device 20 where the light-emitting element 24 is arranged.

[0019] 11 and 12 are diagrams illustrating an exemplary embodiment of a second connection part 50 in a board module. Fig. 11 is a perspective view of the second connection part 50 seen from above. Fig. 12 is a perspective view of the second connection part 50 seen from below.

[0020] The substrate module includes a substrate 10, one or more powered devices, a protected component, and a connecting component 40. In the illustrated light-emitting module 1, a light-emitting device 20 is used as the powered device, and a thermistor 30 is used as the protected component.

[0021] The board module may further include another connection component 50 that connects to the connection component 40. When describing these two connection components separately, they will be referred to as the first connection component 40 and the second connection component 50. Below, each component will be described first, followed by a description of the board module.

[0022] (Substrate 10) The substrate 10 has an upper surface and a lower surface. The substrate 10 is formed in a plate-like shape and has a rectangular outer shape when viewed from above. Other components are disposed on the upper surface of the substrate 10. A plurality of wiring regions 11 are provided on the upper surface of the substrate 10. The substrate 10 has one or more through holes 15 that penetrate in the vertical direction.

[0023] (powered device) The powered device has a bottom surface. The powered device is a device that operates by receiving a supply of power from an external power source. The powered device also includes an electronic component that operates by receiving a supply of electricity from an external power source. In the illustrated light-emitting module 1, a light-emitting element 24 is used as the electronic component, but it is not limited to the light-emitting element 24. The electronic component may also be a component that does not have a light-emitting function.

[0024] (Protected parts) The protected component has a bottom surface. The protected component is a component in the board module that needs to be protected in an environment in which the powered device is operating. The protected component is a component that needs to be protected from the influence of the powered device or from influences outside the board module in an environment in which the powered device is operating. In the illustrated light-emitting module 1, a thermistor 30 is used as the protected component, but it is not limited to the thermistor 30. For example, a Zener diode could also be used as the protected component.

[0025] (First connecting part 40) The first connecting part 40 has a lower surface. The first connecting part 40 also has a connection portion 41. The second connecting part 50 is connected to the connection portion 41. The connection portion 41 is provided on the upper surface side of the first connecting part 40. Note that the connection portion 41 may also be provided on the side surface side of the first connecting part 40.

[0026] (Second connecting part 50) The second connecting part 50 has a connecting portion 51 that connects to the first connecting part 40. When the connecting portions of the first connecting part 40 and the second connecting part 50 are described separately, they will be referred to as the first connecting portion 41 and the second connecting portion 51, respectively. The first connecting part 40 is connected to the second connecting portion 51. In addition, the second connecting portion 51 is connected to the first connecting portion 41.

[0027] The second connecting part 50 has a protective portion 52. The protective portion 52 is provided above the second connecting portion 51. The protective portion 52 is larger in size than the second connecting portion 51 in a top view. The protective portion 52 covers the second connecting portion 51 in a top view.

[0028] The protective section 52 protects the protected components in the environment in which the powered device is operating. Therefore, the protective section 52 has the property of protecting the protected components. For example, the protective section 52 has a light-blocking property, which protects the protected components from the effects of light. Furthermore, for example, the protective section 52 is made of a material with excellent heat dissipation properties, which protects the protected components from the effects of heat. For example, the protective section 52 can be formed from a plate-shaped metal.

[0029] The second connecting part 50 has a wiring portion 53. The wiring portion 53 is, for example, a flexible printed circuit board. The wiring portion 53 is electrically connected to the second connecting portion 51. The second connecting portion 51 is disposed on the lower surface of the wiring portion 53.

[0030] In addition, a protective portion 52 is disposed on the upper surface of the wiring portion 53. The protective portion 52 is connected to the upper surface of the wiring portion 53. The wiring portion 53 is formed in an elongated shape when viewed from above. The second connection portion 51 connects to the lower surface of the wiring portion 53 at its elongated tip. The protective portion 52 extends beyond the tip where the second connection portion 51 connects. Therefore, in a top view, the protective portion 52 has a region that overlaps with the second connection portion 51 and a region that does not overlap with the second connection portion 51. In addition, in a top view, the second connection portion 51 is not exposed. In addition, in a top view, the protective portion 52 has a region that overlaps with the wiring portion 53 and a region that does not overlap with the wiring portion 53. In addition, in a top view, the wiring portion 53 is not exposed.

[0031] (Board module) In the board module, one or more powered devices, protected components, and a first connecting component 40 are mounted on a board 10. The bottom surface of the powered device is bonded to the top surface of the board 10. The bottom surface of the protected component is bonded to the top surface of the board 10. The bottom surface of the first connecting component 40 is bonded to the top surface of the board 10.

[0032] Furthermore, the one or more power-supplied devices and the first connecting component 40 are arranged in a plurality of wiring regions 11 of the substrate 10. This allows the one or more power-supplied devices and the first connecting component 40 to be electrically connected. Furthermore, the protected component and the first connecting component 40 are arranged in a plurality of wiring regions 11 of the substrate 10. This allows the protected component and the first connecting component 40 to be electrically connected.

[0033] Here, among the multiple wiring areas 11, the wiring area 11 in which the powered device is arranged will be called the first wiring area 12, the wiring area 11 in which the first connection component 40 is arranged will be called the second wiring area 13, and the wiring area 11 in which the protected component is arranged will be called the third wiring area 14 to distinguish them.

[0034] The substrate 10 has a plurality of first wiring regions 12, and one or more power-supplied devices are arranged in the plurality of first wiring regions 12. The substrate 10 also has a plurality of second wiring regions 13, and first connection components 40 are arranged in the plurality of second wiring regions 13. The substrate 10 also has a plurality of third wiring regions 14, and protected components are arranged in the plurality of third wiring regions 14. The plurality of first wiring regions 12 and the plurality of second wiring regions 13 are electrically connected. The plurality of second wiring regions 13 and the plurality of third wiring regions 14 are also electrically connected.

[0035] The protected component is disposed between one or more power-supplied devices and the first connecting part 40 in a top view. The protected component is sandwiched between two opposing side surfaces of the power-supplied devices and the first connecting part 40. The protected component is disposed between two planes that respectively include the opposing side surfaces of the power-supplied devices and the first connecting part 40 in a top view.

[0036] Here, in top view, the direction parallel to the side surface of first connecting part 40 facing the power-supplied device is defined as the first direction, and the direction perpendicular to the side surface is defined as the second direction. In this case, the protected component is arranged, in top view, between two straight lines that pass through both ends of first connecting part 40 in the first direction and extend in the second direction.

[0037] In addition, the protected component is disposed between two straight lines that pass through both ends of the one or more power-supplied devices in the first direction and extend in the second direction in top view. In top view, the side surfaces of the one or more power-supplied devices that face the side surfaces of the first connecting part 40 are parallel to the first direction.

[0038] In top view, a virtual line that is parallel to the first direction and passes through the first wiring region 12 does not pass through the second wiring region 13. In addition, in top view, a virtual line that is parallel to the first direction and passes through the first wiring region 12 does not pass through the third wiring region 14. In top view, a virtual line that is parallel to the first direction and passes through the second wiring region 13 does not pass through the third wiring region 14.

[0039] Furthermore, in top view, there exists a virtual line that is parallel to the second direction and passes through the first wiring region 12 and the second wiring region 13. That is, in top view, the first wiring region 12 is provided at a position separated from the second wiring region 13 in a direction perpendicular to the first direction. Also, in top view, there exists a virtual line that is parallel to the second direction and passes through the first wiring region 12, the second wiring region 13, and the third wiring region 14. That is, in top view, the third wiring region 14 is provided at a position separated from the second wiring region 13 in a direction perpendicular to the first direction.

[0040] In a top view, the second wiring regions 13 that are electrically connected to the third wiring region 14 are provided between two second wiring regions 13 that are electrically connected to the first wiring region 12. The second wiring regions that are electrically connected to the third wiring region 14 are provided between the two second wiring regions 13 in the first direction.

[0041] The multiple wiring regions 11 include multiple wiring regions 11 that are provided in positions away from the multiple second wiring regions 13 in the first direction, separate from the first wiring region 12, the second wiring region 13, and the third wiring region 14. The multiple wiring regions 11 include one or more pairs of wiring regions 11 that sandwich the multiple second wiring regions 13 in the first direction.

[0042] Each of the pair of wiring regions 11 is electrically connected to a first wiring region 12. Furthermore, each of the pair of wiring regions 11 is electrically connected to a third wiring region 14. Furthermore, one or more pairs of wiring regions 11 are electrically connected to multiple second wiring regions 13.

[0043] This pair of wiring regions 11 allows electrical connection to the powered device without going through the first connecting part 40. This pair of wiring regions 11 also allows electrical connection to the protected component without going through the first connecting part 40. This pair of wiring regions 11 can be used, for example, when it is desired to check the operation of the powered device or the protected component without going through the first connecting part 40.

[0044] Each of one or more pairs of wiring regions 11 has one wiring region 11 located at a position away from the second wiring region 13 in a first direction, and the other wiring region 11 located at a position away from the second wiring region 13 in the first direction and opposite to the one wiring region 11.

[0045] A second connecting part 50 is connected to a board module on which one or more powered devices, protected components, and first connecting part 40 are mounted. By connecting second connecting part 51 to first connecting part 41, second connecting part 50 is electrically connected to one or more powered devices. Furthermore, power is supplied to one or more powered devices via second connecting part 50. Furthermore, second connecting part 50 is electrically connected to the protected components, and power is supplied to the protected components via second connecting part 50.

[0046] When the first connecting part 40 and the second connecting part 50 are connected, the protecting part 52 is disposed above the protected part. Furthermore, in the protecting part 52, a region that does not overlap with the second connecting part 51 in a top view is disposed above the protected part. Furthermore, in the protecting part 52, a region that does not overlap with the wiring part 53 in a top view is disposed above the protected part.

[0047] Furthermore, the protection part 52 is disposed at a position where it does not come into contact with one or more power-supplied devices. By disposing the protected component between one or more power-supplied devices and the first connecting part 40, the second connecting part 50 having the protection part 52 can protect the protected component.

[0048] In a top view of the board module with the second connecting part 50 connected, the protected parts are covered by the protecting part 52. Furthermore, the height from the top surface of the board 10 to the protecting part 52 of the second connecting part 50 connected to the first connecting part 40 is greater than the height from the top surface of the board 10 to the top surfaces of the protected parts. This allows the protecting part 52 to protect the protected parts while avoiding contact with them.

[0049] Furthermore, the height from the top surface of the substrate 10 to the protective part 52 of the second connecting part 50 connected to the first connecting part 40 is smaller than the height from the top surface of the substrate 10 to the top surface of the powered device. This allows the protective part 52 to be provided at a position lower than the top surface of the powered device, making it possible to protect the protected component from the effects of the powered device. For example, in the case where the powered device is a light emitting device 20 as in the illustrated light emitting module, if the protective part 52 is higher than the top surface of the powered device, some of the light emitted from the top surface of the light emitting device 20 may be irradiated onto the bottom surface of the protective part 52 and travel to the protected component.

[0050] Here, a description will be given of a light emitting device 20, which is an example of a powered device. The light emitting device 20 has, as components, a package 21, one or more light emitting elements 24, one or more reflecting members 25, multiple wirings 26, an optical member 27, and an adhesive 28.

[0051] The package 21 also has a base 22 and a lid member 23, and the light emitting element 24 and the reflecting member 25 are disposed on the base 22, and the lid member 23 is joined to the base 22 to seal the light emitting element 24. This allows the light emitting element 24 to be disposed in a vacuum or airtight sealed closed space.

[0052] In the illustrated example of the light emitting device 20, four light emitting elements 24 are arranged side by side. Four reflecting members 25 are also arranged side by side. The light emitting elements 24 and the reflecting members 25 are provided in one-to-one correspondence. The light emitting elements 24 are electrically connected to the package 21 by a plurality of wirings 26. This allows the light emitting elements 24 to receive a supply of power from an external source via the package 21.

[0053] Light emitted from the light emitting element 24 is reflected by the reflecting member 25 and travels upward. The light that travels upward passes through the lid member 23 and is emitted to the outside of the package 21. In addition, the light that has been emitted to the outside of the package 21 passes through the optical member 27 and is emitted upward from the lens surface of the optical member 27.

[0054] On the upper surface of the optical member 27, lens surfaces are provided that correspond one-to-one to the light emitting elements 24. By passing through these lens surfaces, the light emitted from the light emitting elements 24 becomes collimated light and is emitted from the optical member 27.

[0055] The optical member 27 is bonded to the lid member 23 by an adhesive 28. Two types of adhesives 28, a first adhesive 281 and a second adhesive 282, are used to bond the optical member 27 and the lid member 23. For example, the first adhesive 281 is an ultraviolet curing resin, and the second adhesive 282 is a thermosetting resin. Note that the combination of the first adhesive 281 and the second adhesive 282 is not limited to this.

[0056] A semiconductor laser element can be used as the light emitting element 24. Also, for example, a semiconductor laser element that emits blue light can be used. Note that a semiconductor laser element that emits light other than blue light may also be used. Here, blue light refers to light whose emission peak wavelength is in the range of 420 nm to 494 nm. An example of a semiconductor laser element that emits blue light is a semiconductor laser element containing a nitride semiconductor. Examples of nitride semiconductors that can be used include GaN, InGaN, and AlGaN.

[0057] In a light-emitting module 1 in which a light-emitting device 20 and a thermistor 30 are mounted on a substrate 10, light emitted upward from the top surface of the light-emitting device 20 may be reflected and return to the substrate module. In this case, the protective portion 52 of the second connecting part 50 can protect the thermistor 30 from the returning light. Note that the object to be protected does not have to be the thermistor 30. The protected component in the light-emitting module 1 is a component that needs to be protected from light in the operating environment of the light-emitting device.

[0058] Second Embodiment Next, a substrate module according to a second embodiment will be described. Figs. 12 to 15 are drawings for explaining an exemplary embodiment of the substrate module. The drawings show a light emitting module 2, which is an exemplary embodiment of the substrate module. Fig. 12 is a perspective view of the light emitting module 2. Fig. 13 is a perspective view of the light emitting module 2 as viewed from a diagonal direction of Fig. 12. Fig. 14 is a top view of the light emitting module 2. Fig. 15 is a top view showing an example of the light emitting module 2 in a state in which a second connecting part is connected.

[0059] A substrate module differs from a board module in that a plurality of power-supplied devices are arranged side by side in a first direction. In the illustrated example of the light-emitting module 2, two power-supplied devices are arranged side by side in the first direction. Note that the number of power-supplied devices arranged side by side in the board module does not have to be limited to two.

[0060] The side surfaces of the power-supplied devices facing the side surface of the first connecting part 40 are provided on the same plane. In addition, the distance in the second direction between the opposing side surface of the first connecting part 40 and the side surface of the power-supplied device is the same for each of the power-supplied devices.

[0061] Furthermore, the plurality of power-supplied devices are arranged symmetrically with respect to a line parallel to the second direction in a top view. In the illustrated example of the light-emitting module 2, the light-emitting devices 20 are arranged so that the lens surfaces of the optical members 27 are close to each other. Furthermore, in a top view, the optical members 27 are arranged close to one side of the light-emitting devices 20.

[0062] The multiple powered devices include two powered devices that are the same distance to the protected component. The multiple powered devices also include two powered devices that are the same distance to the first connecting part 40. The two powered devices that are the same distance to the protected component and the two powered devices that are the same distance to the first connecting part 40 are the same two powered devices. By arranging the multiple powered devices, the protected components, and the first connecting part 40 in this manner, the protector 52 can similarly protect the protected components for the board module by connecting the second connecting part 50 to the first connecting part 40.

[0063] As explained above, the present invention, which has the technical features disclosed in the specification, is not limited to the structure described in the embodiments of the specification. For example, the present invention can be applied to a substrate module having components not disclosed in the embodiments, and differences from the disclosed structure do not constitute grounds for the inapplicability of the present invention. Furthermore, from the perspective of the minimum components required to complete the invention, the components possessed by the substrate module disclosed in the embodiments may include non-essential components.

[0064] This means that the substrate module disclosed in the embodiments of this specification includes not only the perspective of completing the invention, but also the perspective of disclosing a rational configuration that assumes one use form. While the application of the invention is not limited to the exemplary use form, there are aspects that will work effectively when applied to that use form.

[0065] For this reason, it may not be necessary for the present invention (claims) to include all of the components disclosed in one embodiment. For example, if the claims do not describe some of the components of a substrate module disclosed in an embodiment, the components are not limited to those disclosed in the present embodiment, and the invention described in the claims is claimed to be applicable with the freedom of design by those skilled in the art, such as substitution, omission, modification of shape, and change of material.

[0066] 16 to 18 show six-sided views of the light emitting module 1, the light emitting device 20, and the light emitting module 2, respectively, in order to specify in more detail the structure of a specific embodiment of each light emitting module and light emitting device. The light emitting device 20, in which the light emitting element 24 is a semiconductor laser element, may be called a laser package. The light emitting module 1 and the light emitting module 2, which include the light emitting device 20, in which the light emitting element 24 is a semiconductor laser element, may be called a laser package module. [Industrial Applicability]

[0067] The light-emitting module described in the embodiment can be used in a projector. In other words, a projector can be said to be one application form to which the present invention can be applied. However, the present invention is not limited to this, and can be used in vehicle headlights, head-mounted displays, lighting, displays, etc. Furthermore, the substrate module can also be used in information processing devices such as computers, for example, as a substrate module for electronic circuits. [Explanation of symbols]

[0068] 1, 2 Light-emitting module 10 Substrate 11 Wiring area 12 1st wiring area 13 2nd wiring area 14 Third wiring area 15 through holes 20 Light-emitting device 21 packages 22 Base 23 Cover member 24 Light-emitting element 25 Reflective material 26 Wiring 27 Optical Components 28 Adhesive 281 First Adhesive 282 Second Adhesive 30 Thermistor 40 First connecting part 41 First connection part 50 Second connecting part 51 Second connection part 52 Protection Department 53 Wiring section

Claims

1. a substrate having an upper surface and a lower surface, the upper surface being provided with a plurality of wiring regions; one or more light emitting devices that are arranged in a plurality of first wiring regions included in the plurality of wiring regions and receive power from an external source; a first connection component electrically connected to the plurality of first wiring regions and disposed in a plurality of second wiring regions included in the plurality of wiring regions, the first connection component having a first connection portion; Equipped with the plurality of wiring regions include one or more third wiring regions and one or more fourth wiring regions; the one or more third wiring regions and the one or more fourth wiring regions are electrically connected to the plurality of first wiring regions without needing to be connected via the first connection component; A light-emitting module, wherein a second connection component is connected to the first connection portion of the first connection component, and power is supplied to the one or more light-emitting devices via the second connection component.

2. a substrate having an upper surface and a lower surface, the upper surface being provided with a plurality of wiring regions; one or more light emitting devices that are arranged in a plurality of first wiring regions included in the plurality of wiring regions and receive power from an external source; a first connection component electrically connected to the plurality of first wiring regions and disposed in a plurality of second wiring regions included in the plurality of wiring regions, the first connection component having a first connection portion; Equipped with the plurality of wiring regions include one or more third wiring regions and one or more fourth wiring regions; the one or more third wiring regions and the one or more fourth wiring regions are electrically connected to the plurality of first wiring regions without needing to be connected via the first connection component; The one or more third wiring regions and the one or more fourth wiring regions are electrically connected to the plurality of second wiring regions.

3. the one or more third wiring regions are provided at positions spaced apart from the second wiring region in a first direction; 3. The light-emitting module according to claim 1, wherein the one or more fourth wiring regions are provided at positions away from the second wiring region in the first direction and opposite to the one or more third wiring regions.

4. The light emitting module according to claim 3 , wherein the first wiring region is provided at a position spaced apart from the second wiring region in a direction perpendicular to the first direction in a top view.

5. the one or more light emitting devices include a first light emitting device and a second light emitting device; The light-emitting module according to claim 3 , wherein the first light-emitting device and the second light-emitting device are arranged side by side in the first direction.

6. the first light emitting device includes a plurality of first semiconductor laser elements arranged in a direction perpendicular to the one direction in a top view, and a first package in which the plurality of first semiconductor laser elements are arranged; 6. The light emitting module according to claim 5, wherein the second light emitting device has a plurality of second semiconductor laser elements arranged in a direction perpendicular to the one direction when viewed from above, and a second package in which the plurality of second semiconductor laser elements are arranged.

7. the first light emitting device further includes a first optical member having a lens surface, the first optical member being disposed closer to one side surface of the first light emitting device in a top view; the second light emitting device further includes a second optical member having a lens surface, the second optical member being disposed closer to one side surface of the second light emitting device in a top view; The light emitting module according to claim 6 , wherein the first light emitting device and the second light emitting device are arranged so that the first optical member and the second optical member are close to each other.

8. 8. The light-emitting module according to claim 3, wherein the plurality of first wiring regions are arranged, when viewed from above, at a position farther away in a direction perpendicular to the first direction than any of the plurality of second wiring regions, the one or more third wiring regions, and the one or more fourth wiring regions.

9. a protected component disposed on the upper surface of the substrate and to be protected from light in an operating environment of the light emitting device; 9. The light-emitting module according to claim 1, wherein, when viewed from above, the protected component is positioned between two straight lines that pass through both ends of the first connecting component in the first direction and extend in a second direction perpendicular to the first direction, and between two planes that respectively include a side surface of the light-emitting device and a side surface of the first connecting component that face each other in the second direction.

Images