Resin composition, resin film, metal foil with resin, prepreg, laminate, multilayer printed wiring board, and semiconductor package

Abstract

To obtain the subject composition capable of manifesting excellent dielectric characteristics in a high-frequency band equal to or higher than a 10GHz band, and useful for printed wiring boards, etc.SOLUTION: The resin composition contains an alicyclic hydrocarbon skeleton-containing polymer (A) having a glass transition temperature of 220 °C or lower and a maleimide compound (B). There are also provided a resin film containing the resin composition, a resin-coated metal foil having a layer of the resin composition on a metal foil, a prepreg containing the resin composition and a sheet-like fiber-reinforced base material, and a laminate, a multilayer printed wiring board and a semiconductor package containing any of them.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present disclosure relates to a resin composition, a resin film, a resin-coated metal foil, a prepreg, a laminate, a multilayer printed wiring board, and a semiconductor package. [Background technology]

[0002] Mobile communication devices such as mobile phones, their base station equipment, servers, routers, and other network infrastructure devices, and large-scale computers use increasingly faster and larger-capacity signals. This trend requires the printed wiring boards used in these electronic devices to support higher frequencies, creating a demand for substrate materials with excellent dielectric properties in high-frequency bands that enable reduced transmission loss. In recent years, in addition to the electronic devices mentioned above, new systems using high-frequency wireless signals are being planned and put into practical use in the ITS field (automotive and transportation systems) and in indoor short-range communications. Therefore, it is expected that low-transmission-loss substrate materials will also be required for the printed wiring boards used in these devices in the future.

[0003] BACKGROUND ART Conventionally, resin compositions containing polyphenylene ether and cyanate resin (see, for example, Patent Document 1), fluororesins (see, for example, Patent Document 2), and the like are known as materials having excellent high-frequency characteristics. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Special Publication No. 61-018937 [Patent Document 2] Japanese Patent Application Publication No. 2018-014387 Summary of the Invention [Problem to be solved by the invention]

[0005] In recent years, there has been a strong demand for the development of resin compositions with improved dielectric properties (low dielectric constant and low dielectric dissipation factor; hereinafter, sometimes referred to as "high-frequency properties") in the 10 GHz band or above that can be used for fifth-generation mobile communication system (5G) antennas, which use radio waves in the frequency band above 6 GHz, and millimeter-wave radars, which use radio waves in the frequency band of 30 to 300 GHz. Although the fluororesin described in Patent Document 2 has excellent high-frequency characteristics, it has a problem in that it requires a molding temperature of 300°C, which is a high temperature, and therefore requires equipment that can handle high-temperature molding. Not only the fluororesin described in Patent Document 2, but generally, fluororesins require high-temperature molding at about 300 to 360°C.

[0006] In view of the current situation, the present disclosure aims to provide a resin composition, a resin film, a resin-coated metal foil, a prepreg, a laminate, a multilayer printed wiring board, and a semiconductor package that exhibit excellent dielectric properties in high frequency bands of 10 GHz or higher. [Means for solving the problem]

[0007] As a result of extensive research conducted by the present inventors to achieve the above object, they have completed the resin composition disclosed in this specification.

[0008] The present disclosure includes the following [1] to

[15] . [1] A resin composition containing an alicyclic hydrocarbon skeleton-containing polymer (A) having a glass transition temperature of 220°C or lower, and a maleimide compound (B). [2] The resin composition according to the above [1], wherein the component (A) has an alicyclic hydrocarbon skeleton having 3 to 12 ring carbon atoms. [3] The resin composition according to the above [1] or [2], wherein the alicyclic hydrocarbon skeleton in the component (A) is monocyclic or bicyclic. [4] The resin composition according to any one of the above [1] to [3], wherein the content of the component (A) is 1 to 80 parts by mass per 100 parts by mass of the total of the resin components. [5] The resin composition according to any one of the above [1] to [4], further comprising a flame retardant (C). [6] The resin composition according to the above [5], wherein the component (C) is an organic phosphorus-based flame retardant. [7] The resin composition according to any one of the above [1] to [6], which does not contain a cyanate resin, or if it contains a cyanate resin, the content thereof is 10 mass % or less based on the solid content of the resin composition. [8] The resin composition according to any one of the above [1] to [7], further comprising a curing accelerator (D). [9] The resin composition according to any one of the above [1] to [8], further comprising an inorganic filler (E).

[10] A resin film comprising the resin composition according to any one of the above [1] to [9].

[11] A resin-coated metal foil having a layer of the resin composition according to any one of the above [1] to [9] on the metal foil.

[12] A prepreg comprising the resin composition according to any one of the above [1] to [9] and a sheet-like fiber-reinforced substrate.

[13] A laminate comprising (i) the resin film described in

[10] above, (ii) the resin-coated metal foil described in

[11] above, or (iii) the prepreg and metal foil described in

[12] above.

[14] A multilayer printed wiring board comprising (i) the resin film described in

[10] above, (ii) the resin-coated metal foil described in

[11] above, (iii) the prepreg described in

[12] above, or (iv) the laminate described in

[13] above.

[15] (v) A semiconductor package comprising the multilayer printed wiring board according to

[14] above and (vi) a semiconductor element. [Effects of the Invention]

[0009] The present disclosure makes it possible to provide a resin composition, a resin film, a resin-coated metal foil, a prepreg, a laminate, a multilayer printed wiring board, and a semiconductor package that exhibit excellent dielectric properties in high frequency bands of 10 GHz or higher. DETAILED DESCRIPTION OF THE INVENTION

[0010] In the numerical ranges described in this specification, the upper or lower limit of the numerical range may be replaced with the values ​​shown in the examples. Furthermore, the lower and upper limits of a numerical range can be arbitrarily combined with the lower or upper limit of another numerical range. In the expression "AA to BB," the numerical values ​​AA and BB at the ends are included as the lower and upper limits, respectively, of the numerical range. In this specification, for example, the expression "10 or more" means 10 or a numerical value exceeding 10, and this also applies when the numerical values ​​are different. Furthermore, for example, the expression "10 or less" means 10 or a numerical value less than 10, and this also applies when the numerical values ​​are different. Furthermore, unless otherwise specified, each component and material exemplified in this specification may be used alone or in combination of two or more. In this specification, the content of each component in a composition means the total amount of the multiple substances present in the composition when multiple substances corresponding to each component are present in the composition, unless otherwise specified.

[0011] In this specification, the "number of ring carbon atoms" refers to the number of carbon atoms necessary to form a ring, and does not include the number of carbon atoms of substituents on the ring. For example, both the cyclohexane skeleton and the methylcyclohexane skeleton have 6 ring carbon atoms. In this specification, the term "resin component" is defined as all components among the solid components constituting the resin composition, excluding inorganic compounds such as inorganic fillers, flame retardants, and flame retardant assistants, which will be described later. In this specification, the term "solid content" refers to components in a resin composition other than water and volatile substances such as the solvent described below. In other words, the term "solid content" includes those that are liquid, syrup-like, or waxy at room temperature around 25°C, and does not necessarily mean that they are solid. Any combination of the descriptions in this specification is also included in the present disclosure and the present embodiment.

[0012] [Resin composition] The resin composition of this embodiment is a resin composition containing an alicyclic hydrocarbon skeleton-containing polymer (A) having a glass transition temperature of 220° C. or less [hereinafter sometimes simply referred to as “alicyclic hydrocarbon skeleton-containing polymer (A)” or “component (A)”] and a maleimide compound (B) [hereinafter sometimes referred to as “component (B)”]. The resin composition of this embodiment is preferably a thermosetting resin composition. In the resin composition of this embodiment, the total content of the (A) component and the (B) component is preferably 30 parts by mass or more, more preferably 50 parts by mass or more, even more preferably 80 parts by mass or more, and particularly preferably 90 parts by mass or more, per 100 parts by mass of the total resin components. There is no particular upper limit to the total content of the (A) component and the (B) component, and the total content may be 99 parts by mass or less, per 100 parts by mass of the total resin components.

[0013] However, the resin composition of this embodiment does not contain a cyanate resin, or if it contains a cyanate resin, the content thereof is preferably 10% by mass or less, more preferably 5% by mass or less, and even more preferably 3% by mass or less, based on the solid content of the resin composition. When the resin composition of this embodiment does not contain a cyanate resin, or contains a cyanate resin but the content is within the above range, high-frequency characteristics and insulation reliability tend to be further improved. Hereinafter, each component contained in the resin composition of the present embodiment will be described.

[0014] <Polymer (A) containing an alicyclic hydrocarbon skeleton with a glass transition temperature of 220°C or less> By using an alicyclic hydrocarbon skeleton-containing polymer (A) with a glass transition temperature (Tg) of 220°C or less, a resin composition with excellent heat resistance and high-frequency characteristics can be obtained. From the viewpoint of heat resistance and high-frequency characteristics, the Tg of component (A) is preferably 50 to 220°C, more preferably 70 to 200°C, even more preferably 100 to 200°C, particularly preferably 130 to 180°C, and most preferably 130 to 150°C. For commercially available alicyclic hydrocarbon skeleton-containing polymers, the Tg can be determined by referring to the catalog value. Alternatively, the Tg can be measured using a thermomechanical measurement device in accordance with the IPC (Institute for Interconnecting and Packaging Electronic Circuits) standard. The component (A) may be used alone or in combination of two or more types.

[0015] There are no particular restrictions on the alicyclic hydrocarbon skeleton contained in component (A), so long as Tg is 220°C or less. From the viewpoints of heat resistance and high-frequency characteristics, component (A) preferably contains an alicyclic hydrocarbon skeleton having 3 to 12 ring carbon atoms, more preferably an alicyclic hydrocarbon skeleton having 5 to 12 ring carbon atoms, and even more preferably an alicyclic hydrocarbon skeleton having 5 to 7 ring carbon atoms. It may contain an alicyclic hydrocarbon skeleton having 5 ring carbon atoms or an alicyclic hydrocarbon skeleton having 7 ring carbon atoms. The alicyclic hydrocarbon skeleton may be monocyclic or polycyclic. In the case of a polycyclic skeleton, from the viewpoints of Tg, heat resistance, and high-frequency characteristics, it is preferably bicyclic or tricyclic, and more preferably bicyclic. In other words, it can be said that the alicyclic hydrocarbon skeleton is preferably monocyclic or bicyclic. The alicyclic hydrocarbon skeleton may be a saturated alicyclic hydrocarbon skeleton or an unsaturated alicyclic hydrocarbon skeleton, but is preferably a saturated alicyclic hydrocarbon skeleton.

[0016] From the viewpoints of heat resistance and high-frequency characteristics, the component (A) is preferably at least one selected from the group consisting of a polymer containing a monocyclic alicyclic hydrocarbon skeleton and a polymer containing a polycyclic alicyclic hydrocarbon skeleton, and from the viewpoint of Tg, a polymer containing a monocyclic alicyclic hydrocarbon skeleton is more preferable. The monocyclic alicyclic hydrocarbon skeleton-containing polymer may contain a chain hydrocarbon skeleton. The chain hydrocarbon skeleton may be a chain hydrocarbon skeleton derived from ethylene or an α-olefin, and is preferably a chain hydrocarbon skeleton derived from ethylene, and this also applies to the following specific examples. The monocyclic alicyclic hydrocarbon skeleton-containing polymer may not necessarily contain a chain hydrocarbon skeleton. Examples of the monocyclic alicyclic hydrocarbon skeleton-containing polymer include a substituted or unsubstituted cyclobutane skeleton-containing polymer, a substituted or unsubstituted cyclopentane skeleton-containing polymer, a substituted or unsubstituted cyclooctane skeleton-containing polymer, a substituted or unsubstituted cyclododecane skeleton-containing polymer, etc. Among these, from the viewpoints of heat resistance and high-frequency characteristics, the monocyclic alicyclic hydrocarbon skeleton-containing polymer is preferably a substituted or unsubstituted cyclopentane skeleton-containing polymer. Herein, in this specification, "substituted or unsubstituted" indicates that the group may have a substituent or may be unsubstituted. Examples of the substituent include an alkyl group having 1 to 8 carbon atoms. There is no particular limitation on the number of the substituents, but one or more is acceptable within the range of possible substitution. Hereinafter, the term "substituted or unsubstituted" is defined in the same way.

[0017] The polycyclic alicyclic hydrocarbon skeleton-containing polymer may contain a chain hydrocarbon skeleton, and the chain hydrocarbon skeleton may be a chain hydrocarbon skeleton derived from ethylene or an α-olefin, and is preferably a chain hydrocarbon skeleton derived from ethylene, and this also applies to the following specific examples. Note that the polycyclic alicyclic hydrocarbon skeleton-containing polymer does not necessarily have to contain the chain hydrocarbon skeleton. Examples of the polycyclic alicyclic hydrocarbon skeleton-containing polymer include a substituted or unsubstituted bicycloheptane skeleton-containing polymer (i.e., a substituted or unsubstituted norbornane skeleton-containing polymer), etc. From the viewpoints of heat resistance and high-frequency characteristics, the polycyclic alicyclic hydrocarbon skeleton-containing polymer is preferably a substituted or unsubstituted bicycloheptane skeleton-containing polymer.

[0018] The α-olefin may be an α-olefin having 3 to 20 carbon atoms, an α-olefin having 3 to 10 carbon atoms, or an α-olefin having 3 to 6 carbon atoms. Examples of the α-olefin include propylene, 1-butene, 1-hexene, and 4-methylpentene.

[0019] The refractive index of component (A) at 25°C for the D line is preferably 1.290 to 1.640, more preferably 1.350 to 1.577, and even more preferably 1.500 to 1.550. When the refractive index of component (A) is within the above range, the relative dielectric constant of the resin composition tends to be kept low. In this specification, the D line refers to the D line of a sodium atom.

[0020] There are no particular limitations on the method for producing component (A), and it can be produced by any known method. Alternatively, commercially available products can be used as component (A). Commercially available monocyclic alicyclic hydrocarbon skeleton-containing polymers include "ZEONEX (registered trademark) K26R" (Tg = 143°C, refractive index = 1.535), "ZEONEX (registered trademark) K22R" (Tg = 143°C, refractive index = 1.535), "ZEONEX (registered trademark) E48R" (Tg = 139°C, refractive index = 1.531), "ZEONEX (registered trademark) F52R" (Tg = 156°C, refractive index = 1.535), "ZEONEX (registered trademark) T62R" (Tg = 154°C, refractive index = 1.536), "ZEONEX (registered trademark) 480R" (Tg = 138°C, refractive index = 1.525), and "ZEONEX (registered trademark) 330R" (Tg = 123°C, refractive index = 1.509) (all manufactured by Zeon Corporation). Commercially available polycyclic alicyclic hydrocarbon skeleton-containing polymers include "APEL (registered trademark) 5014CL" (Tg = 135°C, refractive index = 1.54), "APEL (registered trademark) 5014DP" (Tg = 135°C, refractive index = 1.54), "APEL (registered trademark) 6015T" (Tg = 145°C, refractive index = 1.54), "APEL (registered trademark) 6013T" (Tg = 125°C, refractive index = 1.54), "APEL (registered trademark) 6011T" (Tg = 105°C, refractive index = 1.54), and "APEL (registered trademark) 6509T" (Tg = 80°C, refractive index = 1.54) (all manufactured by Mitsui Chemicals, Inc.), "TOPAS (registered trademark) 5013L-10" (Tg = 134°C, refractive index = 1.533), and "TOPAS (registered trademark) 8007S-04" (Tg = 78 ° C, refractive index = 1.53), "TOPAS (registered trademark) 6013M-07" (Tg = 142 ° C, refractive index = 1.53), "TOPAS (registered trademark) 6015S-04" (Tg = 158 ° C, refractive index = 1.53), "TOPAS (registered trademark) 6017S-04" (Tg = 178 ° C, refractive index = 1.53), "TOPAS (registered trademark) 8007X10" (Tg = 78 ° C, refractive index = 1.53) (all manufactured by Polyplastics Co., Ltd.), "ARTON (registered trademark) F4520" (Tg = 164 ° C, refractive index = 1.512), "ARTON (registered trademark) F3500" (Tg = 165 ° C, refractive index = 1.513), "ARTON (registered trademark) D4000" (Tg = 151 ° C, refractive index = 1.516) (all manufactured by JSR Corporation). The refractive indexes of the commercially available products listed above are those at D line and 25°C.

[0021] (Content of component (A)) In the resin composition of the present embodiment, the content of component (A) is not particularly limited, but from the viewpoint of heat resistance and high-frequency characteristics, it is preferably 1 to 80 parts by mass, more preferably 5 to 75 parts by mass, even more preferably 10 to 70 parts by mass, and particularly preferably 15 to 70 parts by mass, relative to 100 parts by mass of the total resin components, and may be 15 to 40 parts by mass or 30 to 70 parts by mass.

[0022] <Maleimide compound (B)> The maleimide compound is preferably at least one selected from the group consisting of maleimide compounds (b1) having two or more N-substituted maleimide groups [hereinafter, sometimes simply referred to as "maleimide compound (b1)" or "component (b1)"] and derivatives thereof. The "derivatives thereof" include addition reaction products of maleimide compounds having two or more N-substituted maleimide groups with amine compounds such as diamine compounds described below.

[0023] The maleimide compound (b1) is not particularly limited as long as it is a maleimide compound having two or more N-substituted maleimide groups. Specific examples of the maleimide compound (b1) include aromatic maleimide compounds such as bis(4-maleimidophenyl)methane, polyphenylmethane maleimide, bis(4-maleimidophenyl)ether, bis(4-maleimidophenyl)sulfone, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide, 4-methyl-1,3-phenylene bismaleimide, m-phenylene bismaleimide, and 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane; and aliphatic maleimide compounds such as 1,6-bismaleimido-(2,2,4-trimethyl)hexane and pyrrolidine acid binder-type long-chain alkyl bismaleimide. Among these, from the viewpoints of adhesion to the conductor and mechanical properties, aromatic maleimide compounds are preferred as the maleimide compound (b1), aromatic bismaleimide compounds are more preferred, 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane and 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide are even more preferred, and 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide is particularly preferred.

[0024] The maleimide compound (b1) is more preferably a compound represented by the following general formula (B1-1).

[0025] [ka] (In the formula, X b1 represents a divalent organic group.

[0026] X in the general formula (B1-1) b1 Examples of the divalent organic group represented by the formula include groups represented by the following general formula (B1-2), (B1-3), (B1-4) or (B1-5).

[0027] [ka] (In the formula, R b1 represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. b1 represents an integer of 0 to 4. * represents a bonding position.

[0028] R b1 Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, an n-pentyl group, etc. The aliphatic hydrocarbon group is preferably an aliphatic hydrocarbon group having 1 to 3 carbon atoms, and more preferably a methyl group. n b1 represents an integer of 0 to 4, and from the viewpoint of availability, an integer of 0 to 2 is preferred, and 0 is more preferred. b1 is an integer equal to or greater than 2, multiple R b1 They may be the same or different.

[0029] [ka] (In the formula, R b2 and R b3 Each of X independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. b2 represents an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, a single bond, or a divalent group represented by the following general formula (B1-3-1): b2and n b3 Each independently represents an integer of 0 to 4. * indicates the bonding position.

[0030] R b2 and R b3 The aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R in the general formula (B1-2) is explained below. b1 This is the same as the explanation for the aliphatic hydrocarbon group having 1 to 5 carbon atoms shown by X b2 Examples of the alkylene group having 1 to 5 carbon atoms include a methylene group, a 1,2-dimethylene group, a 1,3-trimethylene group, a 1,4-tetramethylene group, a 1,5-pentamethylene group, etc. The alkylene group is preferably an alkylene group having 1 to 3 carbon atoms, and more preferably a methylene group. X b2 Examples of the alkylidene group having 2 to 5 carbon atoms represented by the formula (I) include an ethylidene group, a propylidene group, an isopropylidene group, a butylidene group, an isobutylidene group, a pentylidene group, an isopentylidene group, etc. As the alkylidene group, an isopropylidene group is preferred. n b2 and n b3 represents an integer of 0 to 4, and from the viewpoint of availability, an integer of 0 to 2 is preferred, and 0 or 2 is more preferred. b2 is an integer equal to or greater than 2, multiple R b2 The n may be the same or different. b3 is an integer equal to or greater than 2, multiple R b3 They may be the same or different from each other. X b2 The divalent group represented by the general formula (B1-3-1) is as follows:

[0031] [ka] (In the formula, R b4 and R b5 Each of X independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. b3represents an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, or a single bond. b4 and n b5 Each independently represents an integer of 0 to 4. * indicates the bonding position.

[0032] R b4 and R b5 The aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R in the general formula (B1-2) is explained below. b1 This is the same as the explanation for the aliphatic hydrocarbon group having 1 to 5 carbon atoms shown by X b3 The alkylene group having 1 to 5 carbon atoms and the alkylidene group having 2 to 5 carbon atoms represented by the formula (B1-3) are b2 and alkylidene groups having 2 to 5 carbon atoms, as shown in the following formula: Among these, an isopropylidene group is preferred from the viewpoints of high-frequency characteristics, adhesion to a conductor, heat resistance, glass transition temperature, and thermal expansion coefficient. X b3 Among the groups represented by the formula (I), alkylidene groups having 2 to 5 carbon atoms are preferred, and an isopropylidene group is more preferred. n b4 and n b5 represents an integer of 0 to 4, and from the viewpoint of availability, an integer of 0 to 2 is preferred, and 0 is more preferred. b4 is an integer equal to or greater than 2, multiple R b4 The n may be the same or different. b5 is an integer equal to or greater than 2, multiple R b5 They may be the same or different from each other.

[0033] [ka] (In the formula, n b6 represents an integer of 1 to 10. * represents a bonding position.

[0034] n b6From the viewpoint of availability, is preferably an integer of 1 to 5, and more preferably an integer of 1 to 3.

[0035] [ka] (In the formula, R b6 and R b7 Each of n independently represents a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms. b7 represents an integer of 1 to 8. * represents a bonding position.

[0036] R b6 and R b7 The aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R in the general formula (B1-2) is explained below. b1 This is the same as the explanation for the aliphatic hydrocarbon group having 1 to 5 carbon atoms shown by n b7 represents an integer of 1 to 8, preferably an integer of 1 to 3, and more preferably 1. n b7 is an integer equal to or greater than 2, multiple R b6 may be the same or different, and multiple R b7 They may be the same or different from each other.

[0037] X in the general formula (B1-1) b1 From the viewpoint of high frequency characteristics, the following formula (X b1 -1)~(X b1 -3), and is preferably a divalent group represented by the following formula (X b1 -2) or a divalent group represented by the following formula (X b1 It is more preferable that the divalent group represented by the following formula (X −3) is a divalent group represented by the following formula (X b1 It is more preferable that the divalent group is represented by the formula: -2).

[0038] [ka] (In the formula, * indicates the bonding position to the nitrogen atom in the maleimide group.)

[0039] The maleimide compound may be a derivative of the maleimide compound (b1) from the viewpoints of solubility in organic solvents, compatibility, adhesion to conductors, and high-frequency characteristics. The derivative of the maleimide compound (b1) is preferably a modified maleimide compound (Z) [hereinafter, sometimes abbreviated as "modified maleimide compound (Z)" or "component (Z)"] having a structural unit derived from the maleimide compound (b1) and a structural unit derived from an amine compound (b2) having a primary amino group [hereinafter, sometimes abbreviated as "amine compound (b2)" or "component (b2)"]. The structural units derived from the component (b1) and the structural units derived from the component (b2) contained in the modified maleimide compound (Z) may each be of one type or a combination of two or more types.

[0040] The modified maleimide compound (Z) is preferably a compound having a structure represented by the following formula (B-1), which is formed by an addition reaction between a maleimide group in the component (b1) and a primary amino group in the component (b2). [ka] (* indicates the bond position to other structures.)

[0041] Examples of the structural unit derived from the component (b1) include one or more types selected from the group consisting of groups represented by the following general formula (B1-6) and groups represented by the following general formula (B1-7).

[0042] [ka] (In the formula, X b1 represents X in the general formula (B1-1). b1 where * indicates the bond position to other structures.)

[0043] The amine compound (b2) is preferably a compound having two or more amino groups, more preferably a diamine compound having two amino groups. Examples of the amine compound (b2) include 4,4'-diaminodiphenylmethane, 4,4'-diamino-3,3'-dimethyldiphenylmethane, 3,3'-diethyl-4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl ketone, 4,4'-diaminobiphenyl, 3,3'-dimethyl-4,4'-diaminodiphenyl Aminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, 2,2-bis(3-amino-4-hydroxyphenyl)propane, 3,3'-dimethyl-5,5'-diethyl-4,4'-diaminodiphenylmethane, 2,2-bis(4-aminophenyl)propane, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 1,3-bis(3-aminophenoxy)benzene, 1 ,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, 1,3-bis[1-[4-(4-aminophenoxy)phenyl]-1-methylethyl]benzene, 1,4-bis[1-[4-(4-aminophenoxy)phenyl]-1-methylethyl]benzene, 4,4'-[1,3-phenylenebis(1-methylethylidene)]bisaniline, Examples of the aromatic diamine compounds include 4,4'-[1,4-phenylenebis(1-methylethylidene)]bisaniline, 3,3'-[1,3-phenylenebis(1-methylethylidene)]bisaniline, bis[4-(4-aminophenoxy)phenyl]sulfone, bis[4-(3-aminophenoxy)phenyl]sulfone, and 9,9-bis(4-aminophenyl)fluorene; and amine-modified siloxane compounds having a primary amino group.

[0044] The amine compound (b2) is preferably a compound represented by the following general formula (B2-1).

[0045] [ka] (In the formula, X b4 represents a divalent organic group.

[0046] The component (b2) is X in the general formula (B2-1). b4 It is preferable that the composition contains an aromatic diamine compound which is a divalent group represented by the following general formula (B2-2) [hereinafter, sometimes abbreviated as "aromatic diamine compound (B2-2)"].

[0047] [ka] (In the formula, R b11 and R b12 X each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, a hydroxyl group, or a halogen atom. b5 represents an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, a fluorenylene group, a single bond, or a divalent group represented by the following general formula (B2-2-1) or (B2-2-2): b8 and n b9 Each independently represents an integer of 0 to 4. * indicates the bonding position.

[0048] R in the general formula (B2-2) b11 and R b12 Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, and an n-pentyl group. X b5 Examples of the alkylene group having 1 to 5 carbon atoms include a methylene group, a 1,2-dimethylene group, a 1,3-trimethylene group, a 1,4-tetramethylene group, and a 1,5-pentamethylene group. X b5 Examples of the alkylidene group having 2 to 5 carbon atoms represented by the formula include an ethylidene group, a propylidene group, an isopropylidene group, a butylidene group, an isobutylidene group, a pentylidene group, and an isopentylidene group. n b8 and n b9 represents an integer of 0 to 4, and is preferably 0 or 1 from the viewpoint of availability. b8 or n b9 is an integer equal to or greater than 2, multiple R b11 R b12 They may be the same or different from each other. X in the general formula (B2-2) b5 The divalent group represented by the general formula (B2-2-1) is as follows:

[0049] [ka] (In the formula, R b13 and R b14 Each of X independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. b6 represents an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an m-phenylenediisopropylidene group, a p-phenylenediisopropylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, or a single bond. b10 and n b11 Each independently represents an integer of 0 to 4. * indicates the bonding position.

[0050] R in the general formula (B2-2-1) b13 and R b14 The aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R in the general formula (B2-2) is explained below. b11 and R b12 This is the same as the explanation for the aliphatic hydrocarbon group having 1 to 5 carbon atoms shown by X b6 The alkylene group having 1 to 5 carbon atoms and the alkylidene group having 2 to 5 carbon atoms represented by the formula (B2-2) are explained in detail below. b5 This is the same as the explanation for the alkylene group having 1 to 5 carbon atoms and the alkylidene group having 2 to 5 carbon atoms. n b10 and n b11represents an integer of 0 to 4, and from the viewpoint of availability, an integer of 0 to 2 is preferred, and 0 is more preferred. b10 is an integer equal to or greater than 2, multiple R b13 The n may be the same or different. b11 is an integer equal to or greater than 2, multiple R b14 They may be the same or different from each other. X in the general formula (B2-2) b5 The divalent group represented by the general formula (B2-2-2) is as follows:

[0051] [ka] (In the formula, R b15 represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. b7 and X b8 each independently represents an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, or a single bond. b12 represents an integer of 0 to 4. * represents a bonding position.

[0052] R in the general formula (B2-2-2) b15 The aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R in the general formula (B2-2) is explained below. b11 and R b12 This is the same as the explanation for the aliphatic hydrocarbon group having 1 to 5 carbon atoms shown by X b7 and X b8 The alkylene group having 1 to 5 carbon atoms and the alkylidene group having 2 to 5 carbon atoms represented by the formula (B2-1) are, for example, X b5 Examples of the alkylene group having 1 to 5 carbon atoms and the alkylidene group having 2 to 5 carbon atoms are the same as those shown by the formula (1) and (2). b7 and X b8 is preferably an alkylidene group having 2 to 5 carbon atoms, and more preferably an isopropylidene group. n b12represents an integer of 0 to 4, and from the viewpoint of availability, an integer of 0 to 2 is preferred, and 0 is more preferred. b12 is an integer equal to or greater than 2, multiple R b15 They may be the same or different.

[0053] The component (b2) is X in the general formula (B2-1). b4 may contain an amine-modified siloxane compound which is a divalent group containing a structural unit represented by the following general formula (B2-3), and X in the general formula (B2-1) b4 However, it may contain a terminal amine-modified siloxane compound, which is a divalent group represented by the following general formula (B2-4).

[0054] [ka] (In the formula, R b16 and R b17 each independently represents an alkyl group having 1 to 5 carbon atoms, a phenyl group, or a substituted phenyl group. * indicates the bonding position.)

[0055] [ka] (In the formula, R b16 and R b17 is the same as in the general formula (B2-3), and R b18 and R b19 each independently represents an alkyl group having 1 to 5 carbon atoms, a phenyl group, or a substituted phenyl group. b9 and X b10 each independently represents a divalent organic group, n b13 represents an integer of 2 to 100. * represents a bonding position.

[0056] R in the general formulae (B2-3) and (B2-4) b16 ~R b19Examples of the alkyl group having 1 to 5 carbon atoms represented by include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, an n-pentyl group, etc. As the alkyl group, an alkyl group having 1 to 3 carbon atoms is preferred, and a methyl group is more preferred. R b16 ~R b19 Examples of the substituent on the phenyl group in the substituted phenyl group represented by the formula (I) include an alkyl group having 1 to 5 carbon atoms, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl group having 2 to 5 carbon atoms. Examples of the alkyl group having 1 to 5 carbon atoms include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, and an n-pentyl group. Examples of the alkenyl group having 2 to 5 carbon atoms include a vinyl group and an allyl group. Examples of the alkynyl group having 2 to 5 carbon atoms include an ethynyl group and a propargyl group. X b9 and X b10 Examples of the divalent organic group represented by include an alkylene group, an alkenylene group, an alkynylene group, an arylene group, -O-, or a divalent linking group formed by combining these. Examples of the alkylene group include alkylene groups having 1 to 10 carbon atoms, such as a methylene group, an ethylene group, or a propylene group. Examples of the alkenylene group include alkenylene groups having 2 to 10 carbon atoms. Examples of the alkynylene group include alkynylene groups having 2 to 10 carbon atoms. Examples of the arylene group include arylene groups having 6 to 20 carbon atoms, such as a phenylene group or a naphthylene group. Among these, X b9 and X b10 As the alkylene group, an alkylene group or an arylene group is preferable, and an alkylene group is more preferable. n b13 represents an integer of 2 to 100, preferably an integer of 2 to 50, more preferably an integer of 3 to 40, and even more preferably an integer of 5 to 30. b13 is an integer equal to or greater than 2, multiple R b16 R b17 They may be the same or different from each other.

[0057] Examples of the structural unit derived from the component (b2) include one or more types selected from the group consisting of groups represented by the following general formula (B2-5) and groups represented by the following general formula (B2-6). [ka] (In the formula, X b4 represents X in the general formula (B2-1). b4 where * indicates the bond position to other structures.)

[0058] The weight average molecular weight (Mw) of the modified maleimide compound (Z) is not particularly limited, but may be 400 to 10,000, 1,000 to 5,000, 1,500 to 4,000, or 2,000 to 3,000. The weight average molecular weight in this specification means a value measured by gel permeation chromatography (GPC) in terms of polystyrene.

[0059] ((B) Component Content) In the resin composition of the present embodiment, the content of the maleimide compound (B) is not particularly limited, but from the viewpoints of high-frequency characteristics, heat resistance, and moldability, it is preferably 20 to 99 parts by mass, more preferably 25 to 95 parts by mass, even more preferably 30 to 90 parts by mass, and particularly preferably 30 to 85 parts by mass, and may alternatively be 60 to 85 parts by mass, or alternatively 30 to 70 parts by mass, per 100 parts by mass of the total of the resin components.

[0060] <Flame retardant (C)> The resin composition of the present embodiment preferably further contains a flame retardant (C) [hereinafter, sometimes abbreviated as "component (C)"]. The flame retardant (C) may be used alone or in combination of two or more. Examples of the flame retardant (C) include inorganic phosphorus-based flame retardants; organic phosphorus-based flame retardants; and metal hydrates such as aluminum hydroxide hydrate and magnesium hydroxide hydrate. Metal hydroxides may also be classified as inorganic fillers (E) described below, but metal hydroxides that can impart flame retardancy are classified as flame retardants (C). Among these, organic phosphorus-based flame retardants are preferred as the flame retardant (C). Examples of inorganic phosphorus-based flame retardants include red phosphorus; ammonium phosphates such as monoammonium phosphate, diammonium phosphate, triammonium phosphate, and ammonium polyphosphate; inorganic nitrogen-containing phosphorus compounds such as phosphoric acid amide; phosphoric acid; and phosphine oxide. Examples of organic phosphorus-based flame retardants include aromatic phosphate esters, phosphonic acid diesters, and phosphinic acid esters; metal salts of phosphinic acid; organic nitrogen-containing phosphorus compounds; and cyclic organic phosphorus compounds. Here, examples of "metal salts" include lithium salts, sodium salts, potassium salts, calcium salts, magnesium salts, aluminum salts, titanium salts, and zinc salts. Among these, aromatic phosphate esters are preferred as organic phosphorus-based flame retardants. While the aromatic phosphate ester is not particularly limited, from the viewpoint of achieving flame retardancy and high-frequency characteristics, a phosphate ester having an aromatic hydrocarbon group containing two or more aromatic ring structures [hereinafter, sometimes abbreviated as "aromatic hydrocarbon group (c)"] [hereinafter, sometimes referred to as phosphate ester flame retardant (C1)] is preferred.

[0061] The resin composition of the present embodiment containing the phosphate ester flame retardant (C1) tends to exhibit excellent high-frequency characteristics while maintaining sufficient flame retardancy. The reason for this is unclear, but is presumed to be as follows. The phosphate ester flame retardant (C1) has an aromatic hydrocarbon group containing two or more aromatic ring structures in the molecule, and therefore has a highly crystalline structure in which the molecules are closely packed due to the interaction of the two or more aromatic rings. This is thought to reduce molecular vibration, which is one of the causes of deterioration of dielectric properties, and therefore improve high-frequency properties.

[0062] The aromatic hydrocarbon group (c) contained in the phosphate ester flame retardant (C1) may be a monovalent group or a divalent or higher valent group, but is preferably a divalent group. When the aromatic hydrocarbon group (c) is a divalent group, the divalent aromatic hydrocarbon group (c) is preferably a divalent group connecting two phosphate ester bonds, i.e., a group forming =P(=O)-O-aromatic hydrocarbon group (c)-O-P(=O)=.

[0063] From the viewpoints of high-frequency characteristics and flame retardancy, the divalent aromatic hydrocarbon group (c) is preferably a divalent aromatic hydrocarbon group in which two or more aromatic rings are bonded together by a single bond or a linking group having 5 or less carbon atoms [hereinafter sometimes abbreviated as "aromatic hydrocarbon group (c1)"], or a divalent fused polycyclic aromatic hydrocarbon group containing two or more aromatic ring structures [hereinafter sometimes abbreviated as "aromatic hydrocarbon group (c2)"], and more preferably an aromatic hydrocarbon group (c1).

[0064] (Aromatic hydrocarbon group (c1)) Examples of the two or more aromatic rings contained in the aromatic hydrocarbon group (c1) include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, etc. Among these, a benzene ring is preferred from the viewpoints of high-frequency characteristics, adhesion to conductors, and flame retardancy. The aromatic hydrocarbon group formed from these aromatic rings may or may not be substituted with a substituent, such as an aliphatic hydrocarbon group having 1 to 5 carbon atoms, such as a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, or an n-pentyl group; or a halogen atom, such as a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom. As the aromatic hydrocarbon group (c1), from the viewpoint of high frequency characteristics and flame retardancy, a substituted or unsubstituted phenylene group is preferred, and an unsubstituted phenylene group is more preferred. The two or more aromatic rings contained in the aromatic hydrocarbon group (c1) may be the same or different.

[0065] Examples of the linking group having 5 or less carbon atoms contained in the aromatic hydrocarbon group (c1) include a divalent hydrocarbon group having 1 to 5 carbon atoms, a divalent heteroatom-containing group having 5 or less carbon atoms, and a divalent group having 1 to 5 carbon atoms in which a hydrocarbon group and a heteroatom-containing group are linked. Note that the term "5 or less carbon atoms" as used herein also includes the case where the number of carbon atoms is 0. Examples of divalent hydrocarbon groups having 1 to 5 carbon atoms include alkylene groups having 1 to 5 carbon atoms, such as methylene, 1,2-dimethylene, 1,3-trimethylene, 1,4-tetramethylene, and 1,5-pentamethylene; and alkylidene groups having 2 to 5 carbon atoms, such as ethylidene, propylidene, isopropylidene, butylidene, isobutylidene, pentylidene, and isopentylidene. Examples of divalent heteroatom-containing groups having 5 or less carbon atoms include ether groups, sulfide groups, sulfonyl groups, carbonyloxy groups, and keto groups.

[0066] From the viewpoint of high frequency characteristics and flame retardancy, the aromatic hydrocarbon group (c1) is preferably a divalent group represented by the following general formula (C-2).

[0067] [ka] (In the formula, R c5 and R c6 Each of X independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. c2 represents an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, or a single bond. c6 and n c7 Each of n independently represents an integer of 0 to 4. c8 represents an integer of 1 to 3.)

[0068] X in the general formula (C-2) c2 Examples of the alkylene group having 1 to 5 carbon atoms include a methylene group, a 1,2-dimethylene group, a 1,3-trimethylene group, a 1,4-tetramethylene group, and a 1,5-pentamethylene group. X c2 Examples of the alkylidene group having 2 to 5 carbon atoms represented by the formula include an ethylidene group, a propylidene group, an isopropylidene group, a butylidene group, an isobutylidene group, a pentylidene group, and an isopentylidene group. X c2 Among the groups represented by the formula (I), from the viewpoint of high frequency characteristics and flame retardancy, a methylene group, an isopropylidene group, and a single bond are preferred, and a single bond is more preferred.

[0069] R in the general formula (C-2) c5 and R c6 Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, and an n-pentyl group.

[0070] n in the general formula (C-2) c6 and n c7 From the viewpoint of high frequency characteristics and flame retardancy, n is preferably an integer of 0 to 3, more preferably 0 or 1, and even more preferably 0. c6 is an integer equal to or greater than 2, multiple R c5 may be the same or different. c7 is an integer equal to or greater than 2, multiple R c6 They may be the same or different from each other.

[0071] n in the general formula (C-2) c8 is preferably 1 or 2, more preferably 1. c8 If is an integer greater than or equal to 2, multiple X c2 may be the same or different, and multiple n c7 They may be the same or different from each other.

[0072] From the viewpoint of high-frequency characteristics and flame retardancy, the divalent group represented by the general formula (C-2) is preferably a divalent group represented by the following formula (C-2-1) or a divalent group represented by the following formula (C-2-2), and more preferably a divalent group represented by the following formula (C-2-2).

[0073] [ka]

[0074] (Aromatic hydrocarbon group (c2)) The aromatic hydrocarbon group (c2) is a divalent fused polycyclic aromatic hydrocarbon group containing two or more aromatic ring structures. In this embodiment, the term "fused polycyclic aromatic hydrocarbon" refers to an aromatic hydrocarbon having two or more ring structures, and having a fused ring in which two or more rings share two or more atoms, such as naphthalene, anthracene, and pyrene. Therefore, examples of the aromatic hydrocarbon group (c2) include divalent groups obtained by removing two hydrogen atoms from these fused polycyclic aromatic hydrocarbons. These fused polycyclic aromatic hydrocarbons may or may not be substituted with a substituent. Examples of the substituent include the same substituents that may be present on the aromatic ring contained in the aromatic hydrocarbon group (c1).

[0075] The number of phosphorus atoms contained in one molecule of the phosphate ester flame retardant (C1) is not particularly limited, but from the viewpoint of high-frequency characteristics and flame retardancy, it is preferably 1 to 10, more preferably 2 to 5, even more preferably 2 or 3, and particularly preferably 2. When the phosphate ester flame retardant (C1) has two or more phosphorus atoms, it is preferably a condensed phosphate ester in which a phosphate ester bond formed by one phosphorus atom and a phosphate ester bond formed by another phosphorus atom are linked by the divalent aromatic hydrocarbon group (c).

[0076] The phosphate ester flame retardant (C1) may be a monovalent phosphate ester, a divalent phosphate ester, or a trivalent phosphate ester, but from the viewpoint of high-frequency characteristics and flame retardancy, a trivalent phosphate ester is preferred.

[0077] The phosphate ester group of the phosphate ester flame retardant (C1) may be any of alkyl ester, aryl ester, aralkyl ester, etc., but is preferably an aryl ester from the viewpoint of high-frequency characteristics and flame retardancy. That is, the phosphate ester flame retardant (C1) is preferably an aromatic phosphate ester compound. Examples of the aryl group constituting the aryl ester include a substituted or unsubstituted phenyl group and a substituted or unsubstituted naphthyl group. Examples of the substituent on the aryl group include hydrocarbon groups having 1 to 5 carbon atoms, such as a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, and an n-pentyl group; and halogen atoms. Among these, the aryl group is preferably an unsubstituted phenyl group or a 2,5-dimethylphenyl group.

[0078] From the viewpoint of high frequency characteristics and flame retardancy, the phosphate ester flame retardant (C1) is preferably a compound represented by the following general formula (C-1).

[0079] [ka] (In the formula, R c1 ~R c4 Each of X independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. c1 represents a divalent group represented by the following general formula (C-2) or a divalent fused polycyclic aromatic hydrocarbon group containing two or more aromatic ring structures: c1 ~n c4 each independently represents an integer of 0 to 5, and n c5 represents an integer from 0 to 5.

[0080] [ka] (In the formula, R c5 and R c6 Each of X independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. c2represents an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, or a single bond. c6 and n c7 Each of n independently represents an integer of 0 to 4. c8 represents an integer of 1 to 3.)

[0081] R in the general formula (C-1) c1 ~R c4 Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, an n-pentyl group, etc. The aliphatic hydrocarbon group is preferably an aliphatic hydrocarbon group having 1 to 3 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and even more preferably a methyl group. n c1 ~n c4 represents an integer of 0 to 5, preferably an integer of 0 to 2, more preferably 0 or 2, and even more preferably 2. c1 ~n c4 is an integer equal to or greater than 2, multiple R c1 Comrade, R c2 Comrade, R c3 Comrades or R c4 They may be the same or different from each other. n c5 represents an integer of 0 to 5, preferably an integer of 1 to 3, more preferably 1 or 2, and even more preferably 1. n c5 If is an integer greater than or equal to 2, multiple X c1 n and multiple n c4 They may be the same or different from each other.

[0082] R in the general formula (C-2) c5 and R c6 The aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R in the general formula (C-1) is explained below. c1 ~R c4 This is the same as the explanation for the aliphatic hydrocarbon group having 1 to 5 carbon atoms shown by n c6 and nc7 represents an integer of 0 to 4, preferably an integer of 0 to 2, and more preferably 0. c6 or n c7 is an integer equal to or greater than 2, multiple R c5 R c6 They may be the same or different from each other.

[0083] X c2 Examples of the alkylene group having 1 to 5 carbon atoms include a methylene group, a 1,2-dimethylene group, a 1,3-trimethylene group, a 1,4-tetramethylene group, and a 1,5-pentamethylene group. X c2 Examples of the alkylidene group having 2 to 5 carbon atoms represented by the formula include an ethylidene group, a propylidene group, an isopropylidene group, a butylidene group, an isobutylidene group, a pentylidene group, and an isopentylidene group. X c2 Among the groups represented by the formula (I), from the viewpoint of high frequency characteristics and flame retardancy, a methylene group, an isopropylidene group, and a single bond are preferred, and a single bond is more preferred. X c2 From the viewpoint of high-frequency characteristics and flame retardancy, is preferably a divalent group represented by the following formula (C-2-1) or a divalent group represented by the following formula (C-2-2), and more preferably a divalent group represented by the following formula (C-2-2).

[0084] [ka]

[0085] n in the general formula (C-2) c8 represents an integer of 1 to 3, preferably 1 or 2, and more preferably 1. n c8 If is an integer greater than or equal to 2, multiple X c2 may be the same or different, and multiple n c7 They may be the same or different from each other.

[0086] X in the general formula (C-1) c1Examples of the divalent fused polycyclic aromatic hydrocarbon group having two or more aromatic ring structures represented by the formula (I) include divalent groups obtained by removing two hydrogen atoms from a fused polycyclic aromatic hydrocarbon such as naphthalene, anthracene, or pyrene. These fused polycyclic aromatic hydrocarbon groups may or may not be substituted with a substituent. Examples of the substituent on the fused polycyclic aromatic hydrocarbon group include aliphatic hydrocarbon groups having 1 to 5 carbon atoms, such as a methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group, or n-pentyl group; and halogen atoms, such as a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom.

[0087] Examples of the phosphate ester flame retardant (C1) include 4,4'-biphenol-diphenyl phosphate, bisphenol A-diphenyl phosphate, 4,4'-biphenol-dicresyl phosphate, bisphenol A-dicresyl phosphate, 4,4'-biphenol-di(2,6-xylenyl phosphate), bisphenol A-di(2,6-xylenyl phosphate), 4,4'-biphenol-polyphenyl phosphate, bisphenol A-polyphenyl phosphate, 4,4'-biphenol-polycresyl phosphate, bisphenol A-polycresyl phosphate, 4,4'-biphenol-poly(2,6-xylenyl phosphate), bisphenol A-poly(2,6-xylenyl phosphate), etc. Among these, 4,4'-biphenol-di(2,6-xylenyl phosphate) is preferred from the viewpoints of high-frequency characteristics, adhesion to conductors, and flame retardancy. In the example compounds of the phosphate ester flame retardant (C1), the term "poly" refers to a repeating unit consisting of a structure derived from a divalent phenol compound and a structure derived from phosphoric acid, which constitute the phosphate ester compound (for example, in the general formula (C-1), n c5 The term "compound" refers to a compound having two or more repeating units, and may also refer to a compound containing such a compound in which the average number of repeating units exceeds one.

[0088] (Flame retardant (C) content) When the resin composition of this embodiment contains a flame retardant (C), its content is not particularly limited, but is, for example, preferably 0.1 to 40 parts by mass, alternatively 1 to 30 parts by mass, alternatively 5 to 25 parts by mass, or alternatively 10 to 20 parts by mass, per 100 parts by mass of the total of the (A) and (B) components. When the content of the flame retardant (C) is equal to or greater than the lower limit, better flame retardancy tends to be obtained. When the content is equal to or less than the upper limit, better moldability, adhesion to conductors, and heat resistance tend to be obtained. In particular, when the resin composition of this embodiment contains an organic phosphorus-based flame retardant, the content of phosphorus atoms derived from the organic phosphorus-based flame retardant is not particularly limited, but is preferably 0.2 to 5 parts by mass, more preferably 0.3 to 3 parts by mass, even more preferably 0.6 to 2.5 parts by mass, even more preferably 1.0 to 2.5 parts by mass, and particularly preferably 1.5 to 2.5 parts by mass, per 100 parts by mass of the total resin components. When the content of the organic phosphorus-based flame retardant is equal to or greater than the lower limit, better flame retardancy tends to be obtained while suppressing deterioration of high-frequency characteristics. When the content is equal to or less than the upper limit, better moldability, adhesion to conductors, and better heat resistance and high-frequency characteristics tend to be obtained.

[0089] (Flame retardant synergist) The resin composition of the present embodiment may further contain a flame retardant aid. Examples of the flame retardant aid include inorganic flame retardant aids such as antimony trioxide and zinc molybdate. When the resin composition of this embodiment contains a flame retardant aid, its content is not particularly limited, but is preferably 0.1 to 20 parts by mass, and more preferably 0.1 to 10 parts by mass, per 100 parts by mass of the total resin components. When the content of the flame retardant aid is within the above range, better chemical resistance tends to be obtained. Furthermore, the resin composition of this embodiment does not necessarily contain a flame retardant aid.

[0090] <Curing accelerator (D)> The resin composition of the present embodiment may further contain a curing accelerator (D). By including the curing accelerator (D), the resin composition of the present embodiment tends to have improved curability and to have better high-frequency characteristics, heat resistance, adhesion to conductors, elastic modulus, and glass transition temperature. The curing accelerator (D) may be used alone or in combination of two or more kinds.

[0091] Examples of component (D) include amine-based curing accelerators, imidazole-based curing accelerators, phosphorus-based curing accelerators, organometallic salts, acidic catalysts, organic peroxides, etc. In this embodiment, imidazole-based curing accelerators are not classified as amine-based curing accelerators. Examples of the amine-based curing accelerator include amine compounds having primary to tertiary amines such as triethylamine, pyridine, tributylamine, and dicyandiamide; and quaternary ammonium compounds. Examples of the imidazole-based curing accelerator include imidazole compounds such as methylimidazole, phenylimidazole, 2-undecylimidazole, and isocyanate-masked imidazole (for example, an addition reaction product of hexamethylene diisocyanate resin and 2-ethyl-4-methylimidazole). Examples of the phosphorus-based curing accelerator include tertiary phosphines such as triphenylphosphine; and quaternary phosphonium compounds such as an addition product of p-benzoquinone with tri-n-butylphosphine. Examples of organic metal salts include carboxylates of manganese, cobalt, zinc, etc. The acid catalyst includes p-toluenesulfonic acid and the like. Examples of organic peroxides include dicumyl peroxide, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexyne-3,2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, t-butylperoxyisopropyl monocarbonate, α,α'-di(t-butylperoxy)diisopropylbenzene, etc. However, from the viewpoint of the dielectric loss tangent (Df), the resin composition of the present embodiment may be in an embodiment that does not contain an organic peroxide. Among these, from the viewpoint of obtaining better high-frequency characteristics and heat resistance, imidazole-based curing accelerators and phosphorus-based curing accelerators are preferred, imidazole-based curing accelerators and quaternary phosphonium compounds are more preferred, and the combined use of an imidazole-based curing accelerator and a quaternary phosphonium compound is even more preferred.

[0092] ((D) Component Content) When the resin composition of the present embodiment contains the curing accelerator (D), its content is not particularly limited, but is preferably 0.01 to 10 parts by mass, more preferably 0.05 to 5 parts by mass, still more preferably 0.1 to 5 parts by mass, and particularly preferably 0.5 to 4 parts by mass, relative to 100 parts by mass of the maleimide compound (B). When the content of the curing accelerator (D) is within the above range, better high-frequency characteristics, heat resistance, storage stability, and moldability tend to be obtained.

[0093] <Inorganic filler (E)> The resin composition of the present embodiment may further contain an inorganic filler (E). When the resin composition of the present embodiment contains the inorganic filler (E), it tends to have better low thermal expansion, high elastic modulus, heat resistance, and flame retardancy. The inorganic filler (E) may be used alone or in combination of two or more kinds.

[0094] Examples of the inorganic filler (E) include silica, alumina, titanium oxide, mica, beryllia, barium titanate, potassium titanate, strontium titanate, calcium titanate, aluminum carbonate, magnesium hydroxide, aluminum hydroxide, aluminum silicate, calcium carbonate, calcium silicate, magnesium silicate, silicon nitride, boron nitride, clay (e.g., calcined clay), talc, aluminum borate, and silicon carbide. Among these, silica, alumina, mica, and talc are preferred as the inorganic filler (E), with silica and alumina being more preferred, and silica being even more preferred, from the viewpoints of thermal expansion coefficient, elastic modulus, heat resistance, and flame retardancy. Examples of silica include precipitated silica produced by a wet method and having a high water content, and dry-process silica produced by a dry method and containing almost no bound water. Dry-process silica is classified according to the production method, and includes crushed silica, fumed silica, fused silica (fused spherical silica), and the like. Among these, fused spherical silica is preferred as the inorganic filler (E).

[0095] The average particle size of the inorganic filler (E) is not particularly limited, but is preferably 0.01 to 20 μm, more preferably 0.1 to 10 μm, even more preferably 0.2 to 1 μm, and particularly preferably 0.3 to 0.8 μm. In this specification, the average particle size refers to the particle size at a point corresponding to 50% volume when a cumulative frequency distribution curve of particle sizes is calculated, with the total volume of particles being 100%.

[0096] When the inorganic filler (E) is used, a coupling agent such as a titanate coupling agent or a silane coupling agent may be used in combination as needed to improve the dispersibility of the inorganic filler (E) and the adhesion between the inorganic filler (E) and the organic components in the resin composition. The coupling agents may be used alone or in combination of two or more. When a coupling agent is used, the treatment method may be a so-called integral blend treatment method in which the inorganic filler (E) is blended into the resin composition and then the coupling agent is added, but a method in which an inorganic filler that has been previously surface-treated with a coupling agent by a dry or wet method is used is preferred. By adopting this method, the characteristics of the inorganic filler (E) can be more effectively expressed. If necessary, the inorganic filler (E) may be used in the form of a slurry in which it is dispersed in an organic solvent in advance.

[0097] (Content of component (E)) When the resin composition of the present embodiment contains the inorganic filler (E), the content thereof is not particularly limited, but from the viewpoints of the thermal expansion coefficient, elastic modulus, heat resistance, and flame retardancy, it is preferably 1 to 60% by volume, more preferably 5 to 50% by volume, even more preferably 10 to 45% by volume, particularly preferably 15 to 40% by volume, and most preferably 20 to 30% by volume, based on the solid content of the resin composition.

[0098] <Other ingredients> Furthermore, the resin composition of this embodiment may contain, as necessary, one or more components selected from the group consisting of resin materials other than the above-mentioned components, coupling agents, antioxidants, adhesion improvers, heat stabilizers, antistatic agents, UV absorbers, pigments, colorants, and lubricants (hereinafter, sometimes abbreviated as "other components"), within a range that does not impair the effects of this embodiment. These components may be used alone or in combination of two or more. Alternatively, the resin composition of this embodiment may not contain these components. When the resin composition of the present embodiment contains the other components, the content of each of them is not particularly limited, but may be, for example, 0.01 parts by mass or more, 10 parts by mass or less, 5 parts by mass or less, or 1 part by mass or less, per 100 parts by mass of the total of the resin components.

[0099] <Organic solvents> The resin composition of the present embodiment may be a varnish-like resin composition containing an organic solvent, from the viewpoint of facilitating handling and facilitating production of a prepreg, which will be described later. The organic solvent is not particularly limited, but examples thereof include alcohol-based solvents such as ethanol, propanol, butanol, methyl cellosolve, butyl cellosolve, and propylene glycol monomethyl ether; ketone-based solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ether-based solvents such as tetrahydrofuran; aromatic solvents such as toluene, xylene, and mesitylene; nitrogen-containing solvents such as dimethylformamide, dimethylacetamide, and N-methylpyrrolidone; sulfur-containing solvents such as dimethyl sulfoxide; and ester-based solvents such as γ-butyrolactone. From the viewpoint of solubility of component (A), aromatic solvents are preferred, and toluene is particularly preferred. The organic solvents may be used alone or in combination of two or more.

[0100] When the resin composition of this embodiment contains an organic solvent, its content is not particularly limited, but is preferably such that the solids concentration of the resin composition of this embodiment is 30 to 90 mass%, more preferably 40 to 80 mass%, and even more preferably 40 to 60 mass%. When the organic solvent content is within the above range, the resin composition is easy to handle, and the impregnation into the substrate and the appearance of the produced prepreg are good. Furthermore, this makes it easy to adjust the solids concentration of the resin in the prepreg, as described below, and tends to make it easier to produce a prepreg with a desired thickness.

[0101] <Dielectric properties (high frequency properties)> The dielectric constant (Dk) at 10 GHz when the resin composition of this embodiment is prepared into a test piece by the method described in the Examples below is not particularly limited, but is preferably 3.0 or less, more preferably 2.95 or less, and even more preferably 2.85 or less. The smaller the dielectric constant (Dk), the better, and there is no particular limit to the lower limit, but from the viewpoint of the balance with other physical properties, it may be, for example, 2.2 or more, or 2.4 or more. The dielectric loss tangent (Df) at 10 GHz when a test piece is made from the resin composition of this embodiment by the method described in the Examples below is not particularly limited, but is preferably 0.0030 or less, more preferably 0.0025 or less, even more preferably 0.0020 or less, and particularly preferably 0.0018 or less. The smaller the dielectric loss tangent (Df), the better, and there is no particular limit to the lower limit, but from the viewpoint of the balance with other physical properties, it may be, for example, 0.0003 or more, 0.0005 or more, or 0.0010 or more. The dielectric constant (Dk) and dielectric loss tangent (Df) are values ​​measured in accordance with the cavity resonator perturbation method, more specifically, by the method described in the Examples. In this specification, the dielectric constant refers to the relative dielectric constant.

[0102] The resin composition of this embodiment can be produced by mixing component (A), component (B), and optional components to be used in combination as needed using a known method. In this process, each component may be dissolved or dispersed in the organic solvent while stirring. The mixing order, temperature, time, and other conditions are not particularly limited and can be set as desired.

[0103] The resin composition of the present embodiment exhibits excellent dielectric properties in a high frequency band of 10 GHz or higher. Therefore, resin films, resin-coated metal foils, prepregs, laminates, multilayer printed wiring boards, semiconductor packages, and the like obtained using the resin composition are suitable for use in electronic components that handle high-frequency signals.

[0104] [Resin film] The resin film of the present embodiment is a resin film containing the resin composition of the present embodiment. The resin film of the present embodiment can be produced, for example, by applying a resin composition containing an organic solvent, that is, a resin varnish, to a support and drying it by heating. Examples of the support include polyolefin films such as polyethylene, polypropylene, and polyvinyl chloride; polyester films such as polyethylene terephthalate (hereinafter also referred to as "PET") and polyethylene naphthalate; and various plastic films such as polycarbonate and polyimide films. The support may be subjected to a surface treatment such as matte treatment, corona treatment, ozone treatment, or plasma treatment. The support may also be subjected to a release treatment using a silicone resin-based release agent, an alkyd resin-based release agent, a fluororesin-based release agent, or the like. The thickness of the support is not particularly limited, but is preferably 10 to 150 μm, more preferably 25 to 80 μm.

[0105] The method for applying the resin varnish to the support is not particularly limited, and any coating device known to those skilled in the art can be used, such as a comma coater, bar coater, kiss coater, roll coater, gravure coater, die coater, etc. The coating device may be appropriately selected depending on the film thickness to be formed. The drying temperature and drying time may be appropriately determined depending on the amount of organic solvent used, the boiling point of the organic solvent used, etc. For example, in the case of a resin varnish containing about 40 to 60 mass% of organic solvent, a resin film can be suitably formed by drying at 50 to 150°C for about 3 to 10 minutes. The thickness of the resin film of this embodiment is not particularly limited, but is preferably 5 to 80 μm, more preferably 10 to 50 μm, and even more preferably 15 to 35 μm. The thickness of the resin film is the thickness of the dried resin film. One resin film may be used alone, or two or more resin films may be used in a stack.

[0106] [Metal foil with resin] The resin-coated metal foil of this embodiment has a layer of the resin composition of this embodiment on a metal foil. Hereinafter, the "layer of the resin composition" may be referred to as a "resin layer." Specifically, the resin composition of this embodiment is applied to a metal foil and then B-staged in a drying oven to produce a "resin-coated metal foil" having a resin layer on the metal foil. Here, B-staging in this specification refers to achieving the B-stage state defined in JIS K6900 (1994), and is also referred to as semi-curing. The drying conditions are not particularly limited, but the drying temperature is preferably 60 to 180° C., more preferably 80 to 140° C. The coating method is not particularly limited, but examples include coating methods using known coating machines such as a die coater, comma coater, bar coater, kiss coater, and roll coater.

[0107] The types of metal foil for the resin-coated metal foil include copper foil, aluminum foil, tin foil, tin-lead alloy (solder) foil, nickel foil, etc., but other metal foils may also be used. Among these, copper foil is preferred as the metal foil. When the metal foil is copper foil, the grade and thickness of the copper foil may be appropriately selected depending on the circuit design of the semiconductor package to be manufactured, but copper foil with a copper content of 95% by mass or more is preferred. Of the two surfaces of the metal foil, the surface facing the resin layer may be roughened to improve adhesion. The roughening treatment can be performed by forming roughening particles on the surface of the metal foil. The roughening particles are preferably electrodeposited particles made of at least one element selected from the group consisting of copper, nickel, phosphorus, tungsten, arsenic, molybdenum, chromium, cobalt, and zinc, or electrodeposited particles made of an alloy containing at least one of these elements. After the roughening treatment, secondary particles, tertiary particles, an anti-rust layer, a heat-resistant layer, or the like may be formed using at least one element selected from the group consisting of nickel, cobalt, copper, and zinc, or an alloy containing at least one of these elements, and the surface may then be subjected to a surface treatment such as a chromate treatment or a silane coupling treatment. In the resin-coated metal foil of this embodiment, the thickness of the resin layer is not particularly limited, but is preferably 5 to 200 μm, more preferably 10 to 100 μm, and even more preferably 10 to 50 μm. In the resin-coated metal foil of this embodiment, the thickness of the metal foil is not particularly limited, but is preferably 3 to 40 μm, more preferably 5 to 35 μm, and even more preferably 10 to 20 μm.

[0108] Examples of the resin-coated metal foil include (A) a "resin layer / metal foil" configuration and (B) a "resin layer / ultrathin metal foil / release layer / carrier" configuration. The resin-coated metal foil of the above-mentioned embodiment (A) can be used mainly in the subtractive process, and can also be used in the semi-additive (SAP) process and the modified semi-additive (MSAP) process. The resin-coated metal foil of the above-mentioned embodiment (B) can be used mainly in the MSAP process because the ultrathin metal foil remains on the thermosetting resin film and can function as a seed layer as it is, but it may also be used in the SAP process. The resin layer in the above-mentioned embodiment (A) and embodiment (B) is the resin layer described above, and the types of metal foil and ultrathin metal foil are explained in the same manner as the above-mentioned metal foil. The carrier in embodiment (B) may be the above-mentioned metal foil or a resin film such as a polyimide film or a polyethylene terephthalate film. The thickness of the metal foil in the embodiment (A) is as described above for the metal foil. On the other hand, the ultrathin metal foil in the embodiment (B) is thinner than the aforementioned metal foil, and its thickness may be 0.1 to 3 μm, or 0.3 to 2.5 μm. The release layer in the embodiment (B) enables smooth peeling at the interface between the release layer and the ultrathin metal foil when peeling the carrier. If the ultrathin metal foil and the carrier can be easily peeled when peeling the carrier, the release layer need not be formed. The release layer is not particularly limited as long as it enables smooth peeling at the interface between the release layer and the ultrathin metal foil, and known release layers can be used. The release layer may be an inorganic release layer or an organic release layer.

[0109] [Prepreg] The prepreg of this embodiment contains the resin composition of this embodiment and a sheet-like fiber-reinforced substrate. The prepreg can be formed using the resin composition of this embodiment and a sheet-like fiber-reinforced substrate, and can be produced, for example, by impregnating or coating the resin composition of this embodiment into a sheet-like fiber-reinforced substrate, and then heating and drying the substrate in a drying oven at 60 to 180°C for 1 to 30 minutes to B-stage the resin composition. The content of solids derived from the resin composition in the prepreg of this embodiment is not particularly limited, but is preferably 30 to 90 mass%, more preferably 35 to 85 mass%, even more preferably 40 to 80 mass%, and particularly preferably 45 to 80 mass%. When the content of solids derived from the resin composition in the prepreg is within this range, better moldability tends to be obtained when the prepreg is made into a laminate.

[0110] As the sheet-like fiber-reinforced substrate for the prepreg, known materials used in various laminates for electrical insulating materials can be used. Examples of materials for the sheet-like fiber-reinforced substrate include inorganic fibers such as E-glass, D-glass, S-glass, and Q-glass; organic fibers such as polyimide, polyester, and tetrafluoroethylene; and mixtures thereof. These sheet-like fiber-reinforced substrates can be in the form of woven fabric, nonwoven fabric, roving, chopped strand mat, surfacing mat, and the like. The thickness of the sheet-like fiber-reinforced substrate is not particularly limited, and a thickness of 5 to 160 μm can be used, for example. Furthermore, from the viewpoints of impregnation with the resin composition, heat resistance, moisture absorption resistance, and processability when formed into a laminate, those that have been surface-treated with a coupling agent or the like, or those that have been mechanically opened can be used.

[0111] The resin composition can be impregnated or coated on a sheet-like fiber-reinforced substrate by the following hot melt method or solvent method. The hot melt method does not contain an organic solvent in the resin composition, and is either (1) a method in which the resin composition is first coated onto a coated paper that has good peelability from the resin composition and then laminated onto a sheet-like fiber-reinforced substrate, or (2) a method in which the resin composition is directly coated onto a sheet-like fiber-reinforced substrate using a die coater. On the other hand, the solvent method is a method in which an organic solvent is added to a resin composition, a sheet-like fiber-reinforced substrate is immersed in the obtained resin composition to impregnate the resin composition into the sheet-like fiber-reinforced substrate, and then the substrate is dried.

[0112] The thickness of the prepreg of this embodiment is not particularly limited, and may be 10 to 170 μm, 10 to 120 μm, or 10 to 70 μm.

[0113] [Laminate] The laminate of this embodiment is a laminate containing (i) the resin film of this embodiment, (ii) the resin-coated metal foil of this embodiment, or (iii) the prepreg and metal foil of this embodiment. The laminate of this embodiment can be obtained by hot-press molding one or more resin films of this embodiment or one resin-coated metal foil of this embodiment, or by arranging two resin-coated metal foils with the metal foil as the outer layer and then hot-press molding them. Alternatively, a laminate can be obtained by placing metal foil on one or both sides of a resin film of this embodiment or one or both sides of a prepreg of this embodiment, or by placing metal foil on one or both sides of a stack of two or more resin films of this embodiment or prepregs of this embodiment, and then hot-press molding them. A laminate having metal foil is sometimes called a metal-clad laminate. Another method for producing a laminate includes a method in which the resin-coated metal foil of this embodiment is placed on both sides or one side of the prepreg of this embodiment or another prepreg so that the resin side faces the prepreg, and then heated and pressed. In this case, as long as one or more prepregs of this embodiment are used, one prepreg may be used, or two or more prepregs may be stacked. When two or more prepregs are stacked, different prepregs may be combined and stacked. The metal of the metal foil is not particularly limited as long as it is used in electrical insulating material applications, but from the viewpoint of electrical conductivity, it may be copper, gold, silver, nickel, platinum, molybdenum, ruthenium, aluminum, tungsten, iron, titanium, chromium, or an alloy containing one or more of these metal elements, with copper and aluminum being preferred, and copper being more preferred. From the viewpoint of productivity, the heating temperature during hot and pressure molding is preferably 185° C. or higher, and may be 200 to 300° C., or may be 220 to 250° C. When the heating temperature is within the above range, good productivity tends to be obtained along with excellent dielectric properties and flame retardancy. The pressure and time during hot-press molding are not particularly limited, but can be, for example, a pressure of 0.2 to 10 MPa and a time of 0.1 to 5 hours. Hot-press molding can also be performed using a vacuum press or the like to maintain a vacuum state for 0.5 to 5 hours. Under these conditions, a sufficiently cured laminate can be obtained.

[0114] [Multilayer printed wiring board] The multilayer printed wiring board of this embodiment contains (i) the resin film of this embodiment, (ii) the resin-coated metal foil of this embodiment, (iii) the prepreg of this embodiment, or (iv) the laminate of this embodiment. The multilayer printed wiring board of this embodiment can be manufactured by using the resin film of this embodiment, the resin-coated metal foil of this embodiment, the prepreg, or the laminate of this embodiment and performing circuit formation processing such as drilling, metal plating, and etching of the metal foil, and multilayer adhesive processing, by known methods.

[0115] [Semiconductor Package] The semiconductor package of this embodiment is a semiconductor package that includes (v) the multilayer printed wiring board of this embodiment and (vi) a semiconductor element. The semiconductor package of this embodiment can be manufactured, for example, by mounting semiconductor elements such as semiconductor chips and memories at predetermined positions on the multilayer printed wiring board of this embodiment by a known method, and then sealing the semiconductor elements with sealing resin or the like.

[0116] Although preferred embodiments have been described above, these are merely examples for the purpose of explaining the present disclosure, and the scope of the present disclosure is not intended to be limited to these embodiments. The present disclosure also includes various aspects that differ from the above-described embodiments without departing from the gist of the present disclosure. [Example]

[0117] The present embodiment will be specifically described below with reference to examples, but the present embodiment is not limited to the following examples.

[0118] [Examples 1 to 4, Comparative Examples 1 and 2] (Preparation of Resin Composition) The components shown in Table 1 were mixed and stirred in toluene at room temperature according to the formulation shown in Table 1 to prepare a resin composition with a solid content of 45 to 55 mass %. (Preparation of laminated plates and resin plates) The resin composition obtained in each example was applied to a 50 μm-thick PET film using a coater, and then heated and dried at 110° C. for 3 minutes to produce a resin-coated PET film with a resin layer thickness of 25 μm. Multiple sheets of the resin-coated PET film were produced. A resin film was obtained by peeling the PET film from the resin-coated PET film. The resin films thus obtained were stacked until the thickness reached 325 μm, forming a resin film laminate. The resin film laminate was placed in a 300 μm-thick mold, and an 18 μm-thick low-profile copper foil (BF-ANP18, M-side Rz: 1.5 μm, manufactured by CIRCUIT FOIL) was further laminated with the M-side in contact with the resin surface, thereby obtaining a laminate. A double-sided copper-clad laminate was then produced by hot-press molding at a temperature of 230°C, a pressure of 3.0 MPa, and a time of 90 minutes. The resulting double-sided copper-clad laminate was immersed in a copper etching solution (a 10% by mass solution of ammonium persulfate, manufactured by Mitsubishi Gas Chemical Company, Inc.) to remove the outer copper foil, thereby producing a 300 μm-thick resin plate.

[0119] [Evaluation method] The high frequency characteristics were evaluated according to the following method, and the results are shown in Table 1. (1. Evaluation of high frequency characteristics) The resin plates prepared in each example were cut into test pieces of 60 mm in length and 2 mm in width to prepare test pieces for measurement. The dielectric constant and dielectric loss tangent of the test pieces were measured using the cavity resonator perturbation method. The measuring instrument used was an Agilent Technologies vector network analyzer "N5227A," the cavity resonator was a Kanto Electronics Application Development Co., Ltd.'s "CP129" (10 GHz band resonator), and the measurement program was "CPMA-V2." Measurements were performed at a frequency of 10 GHz and a temperature of 25°C.

[0120] [Table 1]

[0121] The abbreviations for each material in Table 1 are as follows: [Component (A): A polymer containing an alicyclic hydrocarbon skeleton with a Tg of 220°C or less] "ZEONEX (registered trademark) 480R" (manufactured by Zeon Corporation), a polymer containing a cyclopentane skeleton, Tg = 138°C (catalog value), refractive index = 1.525 (catalog value) [Component (B): Maleimide compound] 3,3'-Dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide [Other resin components: Polyphenylene ether] "NORYL (registered trademark) PPO630-111" (SABIC Japan LLC), weight average molecular weight = 47,600 [Component (C): Flame retardant] Phosphate ester flame retardant with the following structural formula [ka] [Component (D): Curing accelerator] Curing accelerator 1: Tri-n-butylphosphine adduct of p-benzoquinone Curing accelerator 2;2-undecylimidazole Curing accelerator 3: 1,3-bis(2-t-butylperoxyisopropyl)benzene [(E) Component: Inorganic filler] Spherical fused silica: average particle size 1.5 μm, toluene 50% by mass slurry

[0122] As is clear from the results shown in Table 1, when the resin compositions prepared in Examples 1 to 4 were used, the resin plates had excellent high-frequency characteristics. Furthermore, the component (A) contained in the resin compositions prepared in Examples 1 to 4 had structural units derived from cycloolefin, and therefore had excellent heat resistance. On the other hand, in Comparative Example 1, in which polyphenylene ether was used instead of components (A) and (B), and Comparative Example 2, in which polyphenylene ether was used instead of component (A), the high-frequency characteristics of the resin plates were poor compared to Example 3, which can be directly compared.

Claims

1. A resin composition comprising: (A) an alicyclic hydrocarbon skeleton-containing polymer having a glass transition temperature of 220°C or lower; and (B) a maleimide compound.

2. 2. The resin composition according to claim 1, wherein the component (A) has an alicyclic hydrocarbon skeleton having 3 to 12 ring carbon atoms.

3. The resin composition according to claim 1 or 2, wherein the alicyclic hydrocarbon skeleton in the component (A) is monocyclic or bicyclic.

4. The resin composition according to any one of claims 1 to 3, wherein the content of the component (A) is 1 to 80 parts by mass per 100 parts by mass of the total of the resin components.

5. The resin composition according to any one of claims 1 to 4, further comprising a flame retardant (C).

6. The resin composition according to claim 5 , wherein the component (C) is an organic phosphorus-based flame retardant.

7. The resin composition according to any one of claims 1 to 6, wherein the resin composition does not contain a cyanate resin, or when the cyanate resin is contained, the content of the cyanate resin is 10 mass% or less based on the solid content of the resin composition.

8. The resin composition according to any one of claims 1 to 7, further comprising a curing accelerator (D).

9. The resin composition according to any one of claims 1 to 8, further comprising an inorganic filler (E).

10. A resin film comprising the resin composition according to any one of claims 1 to 9.

11. A resin-coated metal foil having a layer of the resin composition according to any one of claims 1 to 9 on the metal foil.

12. A prepreg comprising the resin composition according to any one of claims 1 to 9 and a sheet-like fiber-reinforced substrate.

13. A laminate comprising: (i) the resin film according to claim 10; (ii) the resin-coated metal foil according to claim 11; or (iii) the prepreg and metal foil according to claim 12.

14. A multilayer printed wiring board comprising: (i) the resin film according to claim 10; (ii) the resin-coated metal foil according to claim 11; (iii) the prepreg according to claim 12; or (iv) the laminate according to claim 13.

15. (v) a multilayer printed wiring board according to claim 14; and (vi) a semiconductor package comprising a semiconductor element.

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