Coated substrate and method for producing coated substrate

Abstract

To provide a new coated substrate.SOLUTION: The coated base material 1 is formed by coating a conductive base material 5 with a film 3. The thickness of the film 3 is 50nm to 10 μm. The film 3 contains magnesium hydroxide as a main component and is amorphous. When the coating 3 is measured by a fluorescent X-ray analysis method, the content ratio (weight ratio) of Al (aluminum) to Mg (magnesium) is 1 / 500 or more and 1 / 5 or less.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to coated substrates and methods for making coated substrates. [Background technology]

[0002] BACKGROUND ART In metal members used in environments with temperature changes of 100° C. or more, a ceramic film is sometimes formed on the surface to improve the insulating properties (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-033245 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the technology disclosed in this document does not necessarily provide sufficient properties such as adhesion of the coating to the substrate, and a new coated substrate has been desired. The present disclosure has been made in view of the above-mentioned circumstances, and has an object to provide a novel coated substrate. The present disclosure can be realized in the following aspects. [Means for solving the problem]

[0005] [1] A coated substrate in which a conductive substrate is coated with a coating, The thickness of the coating is 50 nm or more and 10 μm or less, the coating is mainly composed of magnesium hydroxide and is amorphous; The coated substrate, wherein when the coating is measured by fluorescent X-ray analysis, the content ratio (weight ratio) of Al (aluminum) to Mg (magnesium) is 1 / 500 or more and 1 / 5 or less. [2] The coated substrate according to [1], wherein the portion of the conductive substrate where the coating is formed has electrical conductivity. [3] The coated substrate according to [1] or [2], wherein the coating contains iodine. [4] The coated substrate according to [1] or [2], wherein the conductive substrate is made of a metal material containing at least one element selected from the group consisting of Fe (iron), Ni (nickel), Co (cobalt), Cu (copper), Pt (platinum), and Pd (palladium) in a total amount of 30 mass% or more. [5] When the coating is measured by X-ray photoelectron spectroscopy, the total element percentage of metal elements and O (oxygen) is 70 atm% or more, The coated substrate according to [1] or [2], wherein the element percentage of C (carbon) is 0.1 atm % or more and less than 20 atm %. [6] A method for producing a coated substrate using a bath solution containing an organic solvent and iodine, the bath liquid has a water content of less than 1% by mass and contains at least one or more metal elements; A voltage is applied to the conductive substrate while the conductive substrate is immersed in the bath liquid, a manufacturing method for forming the coating containing the metal element on the conductive base material of a negative electrode, The metal element in the bath solution is supplied to the bath solution by dissolution of the positive electrode, and an Mg-Al alloy is used as the positive electrode material. [1] A method for producing a coated substrate according to [1]. [Effects of the Invention]

[0006] According to the present disclosure, a novel coated substrate is provided in which the coating has high adhesion to the conductive substrate. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic diagram of a cross section of a coated substrate. [Figure 2] FIG. 1 is a schematic diagram of a film forming apparatus. DETAILED DESCRIPTION OF THE INVENTION

[0008] The present disclosure will be described in detail below. In this specification, when a numerical range is indicated using "-", it is intended to include both the lower limit and the upper limit unless otherwise specified. For example, the expression "10-20" includes both the lower limit "10" and the upper limit "20". In other words, "10-20" has the same meaning as "10 or more and 20 or less". In addition, in this specification, the upper limit and lower limit of each numerical range can be combined in any way.

[0009] 1. Coated substrate 1 The coated substrate 1 is formed by coating a conductive substrate 5 with a coating 3. The thickness of the coating 3 is 50 nm or more and 10 μm or less. The coating 3 is mainly composed of magnesium hydroxide and is amorphous. When the coating 3 is measured by fluorescent X-ray analysis, the content ratio (weight ratio) of Al (aluminum) to Mg (magnesium) is 1 / 500 or more and 1 / 5 or less. The coated substrate 1 of the present disclosure has improved insulation properties due to the amorphous coating 3 containing magnesium hydroxide as a main component.

[0010] (1) Conductive base material 5 There are no particular limitations on the conductive substrate 5. In order to improve the adhesion of the coating 3 to the conductive substrate 5, it is preferable that at least the portion (region) of the conductive substrate 5 that is covered with the coating 3 is made of a material that is conductive and can serve as a negative electrode 7 (cathode). When the portion of the conductive substrate 5 that is covered with the coating 3 has conductivity and serves as a negative electrode 7 (cathode), the coating 3 can be easily formed in this portion by applying a voltage. The surface portion of the conductive substrate 5 may be made of a material that has conductivity and can serve as the negative electrode 7. The entire conductive substrate 5 may be made of a material that can serve as the negative electrode 7. From the viewpoint of application to high-temperature applications, the conductive substrate 5 is preferably made of a metal material containing at least one element selected from the group consisting of Fe (iron), Ni (nickel), Co (cobalt), Cu (copper), Pt (platinum), and Pd (palladium) in a total amount of 30% by mass or more, more preferably 70% by mass or more, and even more preferably 90% by mass or more. The conductive substrate 5 may also contain at least one element selected from the group consisting of Fe (iron), Ni (nickel), Co (cobalt), Cu (copper), Pt (platinum), and Pd (palladium) in a total amount of 100% by mass. For example, an iron-based alloy and carbon are suitable materials for the negative electrode 7. Suitable examples of the iron-based alloy include one or more selected from the group consisting of an Fe-Ni-Cr-based alloy (austenitic stainless steel), an Fe-Cr-based alloy (ferritic stainless steel), an Fe-Ni-based alloy (permalloy), an Fe-Si-based alloy (iron silicon), an Fe-Si-Al-based alloy (sendust), an Fe-Ni-Mo (supermalloy), an Fe-Co-based alloy (permendur), an Fe-Ni-Co-based alloy (kovar), and an Fe-CB-based alloy (amorphous).

[0011] (2) Coating 3 (2.1) Thickness The thickness of the coating 3 is 50 nm or more, preferably 80 nm or more, and more preferably 100 nm or more, from the viewpoint of exhibiting a function according to the material of the coating 3. On the other hand, from the viewpoint of withstanding stress generated in the coating 3 and ensuring adhesion to the conductive substrate 5, the thickness is 10 μm or less, preferably 1000 nm or less, and more preferably 800 nm or less. From these viewpoints, the thickness of the coating 3 is 50 nm or more and 10 μm or less, preferably 80 nm or more and 1000 nm or less, and more preferably 100 nm or more and 800 nm or less. Note that if the thickness of the coating 3 is not constant, the thickness requirement is satisfied as long as the thickness of at least a portion of the coating 3 is within the above-mentioned range. The thickness of the coating 3 can be determined by observation with a FIB-SEM (dual beam scanning electron microscope).

[0012] (2.2) Principal Component The main component of the coating 3 is magnesium hydroxide. Here, the main component refers to a substance whose content (mass %) is 50 mass % or more.

[0013] (2.3) Amorphous The coating 3 is amorphous. The fact that it is amorphous can be confirmed by the fact that no crystal grains are observed in a cross-sectional image obtained by FIB-SEM, and that no peaks originating from the coating 3 are observed in XRD analysis, or that the TEM electron diffraction pattern is unclear. If the coating 3 is amorphous, it can be expected to exhibit unique functions such as smoothing of the outermost surface due to uniform film growth.

[0014] (2.4) Ratio of Al (aluminum) to Mg (magnesium) The coating 3 contains Al. When the coating 3 is measured by fluorescent X-ray analysis, the Al content ratio to Mg is 1 / 500 or more and 1 / 5 or less, preferably 1 / 250 or more and 1 / 10 or less, and more preferably 1 / 100 or more and 1 / 50 or less. The Al content ratio to Mg is a weight ratio. It is presumed that the coating 3 has an amorphous film structure due to a trace amount of Al being combined with Mg.

[0015] (2.5) Iodine It is preferable that the coating 3 contains iodine. When the coating 3 contains a small amount of iodine, the oxide coating present on the surface of the conductive substrate 5 is converted into iodine ions I - This is thought to result in a structure in which the coating 3 and the conductive substrate 5 are in direct contact with each other, thereby ensuring adhesion between the conductive substrate 5 and the coating 3. When the coating 3 is measured by X-ray photoelectron spectroscopy, the elemental percentage of iodine is preferably 0.1 atm% or more, more preferably 0.2 atm% or more, and even more preferably 0.3 atm% or more. The upper limit of the elemental percentage of halogen elements is 3 atm% or less.

[0016] (2.6) Total element percentage of metal elements and O (oxygen) The total element percentage of metal elements and O (oxygen) when the coating 3 is measured by X-ray photoelectron spectroscopy (XPS) is 70 atm% or more, preferably 80 atm% or more, and more preferably 90 atm% or more, from the viewpoint of ensuring that the coating 3 functions satisfactorily as an inorganic coating. The upper limit of the total element percentage of metal elements and O (oxygen) is 100 atm% minus the element percentage (atm%) of C (carbon). If the composition of the coating 3 is not constant, the requirement for the total element percentage of metal elements and O (oxygen) is met as long as the composition of at least a portion of the coating 3 is within the above-mentioned range.

[0017] (2.7) Elemental percentage of C (carbon) The element percentage of C (carbon) when measuring the coating 3 by X-ray photoelectron spectroscopy (XPS) is preferably 0.1 atm% or more and less than 20 atm%, more preferably 0.5 atm% or more and less than 15 atm%, and even more preferably 1 atm% or more and less than 10 atm%, from the viewpoints of ensuring flexibility and suppressing cracking due to the inclusion of C (carbon) and suppressing deterioration of characteristics inherent to ceramics or amorphous films due to an excessive C (carbon) content. If the composition of the coating 3 is not constant, the requirement for the element percentage of C (carbon) is met as long as the composition of at least a portion of the coating 3 is within the above-mentioned range. Composition analysis by X-ray photoelectron spectroscopy can be performed using an X-ray photoelectron spectrometer. Measurement conditions include an aluminum metal K-alpha ray source, a beam diameter of 100 μm, and an X-ray incident angle of 45° to the surface to be analyzed, and the cross section is scanned.

[0018] 2. Method for producing coated substrate 1 The method for producing the coated substrate 1 of the present disclosure is not particularly limited. A preferred production method is described below: A preferred production method is a method for producing the coated substrate 1 using a bath liquid 2 containing an organic solvent and iodine. The bath liquid 2 has a water content of less than 1% by mass and contains at least one metal element. By applying a voltage while the conductive substrate 5 is immersed in the bath liquid 2, a coating 3 containing the metal element is formed on the negative electrode 7 side (cathode side) of the conductive substrate 5. The metal element in the bath liquid 2 is supplied to the bath liquid 2 by elution from the positive electrode 6, and an Mg-Al alloy is used as the positive electrode material. In the manufacturing method of the present disclosure, electrodeposition on the negative electrode 7 side can suppress oxidation of the conductive substrate 5 more effectively than electrodeposition on the positive electrode 6 side (anode side).

[0019] (1) Bath liquid 2 The bath liquid 2 preferably contains an organic solvent as a solvent. (1.1) Moisture content To ensure the homogeneity of the coating 3 and to suppress oxidation of the conductive substrate 5, the water content of the bath liquid 2 is set to less than 1% by mass. The water content is preferably less than 0.5% by mass, and more preferably less than 0.1% by mass. The water content may be 0% by mass. The water content of the bath liquid 2 can be determined by GC-MS analysis.

[0020] (1.2) Metallic elements The bath liquid 2 contains at least one metal element. In the present disclosure, an Mg-Al alloy is used as the positive electrode material, and therefore the metal elements include at least Mg (magnesium) and Al (aluminum). The other metal elements are not particularly limited. From the viewpoint of allowing the coating 3 to function as a high-quality protective film for the conductive substrate 5, the other metal elements are preferably at least one selected from the group consisting of Ti (titanium), Zr (zirconium), Mo (molybdenum), W (tungsten), V (vanadium), Fe (iron), Cr (chromium), and Co (cobalt). In the manufacturing method of the present disclosure, a hydroxide film, which is the coating 3, is formed depending on the metal elements in the bath liquid 2. Among the metal elements contained in the bath liquid 2, Mg (magnesium) and Al (aluminum) are supplied to the bath liquid 2 by elution from the positive electrode 6 (anode). When the metal elements are eluted from the positive electrode 6 into the bath liquid 2, it becomes easy to control the film formation rate, and continuous and stable film formation on a plurality of conductive substrates 5 becomes possible.

[0021] (1.3) Iodine The bath liquid 2 contains iodine. By including iodine in the bath liquid 2, film formation can be carried out at a practical speed, and the film 3 tends to be homogeneous. I (iodine) is selected from the viewpoint of rapidly progressing the organic electrochemical reaction and allowing the film 3 to function as a high-quality protective film for the conductive substrate 5. The iodine concentration in the bath liquid 2 is not particularly limited. From the viewpoints of appropriately suppressing the reaction rate, advantageously controlling the uniformity and thickness of the coating 3, and suppressing peeling of the coating 3, the iodine concentration is preferably 1 ppm or more and 20,000 ppm or less, more preferably 5 ppm or more and 2,000 ppm or less, and even more preferably 50 ppm or more and 500 ppm or less. Note that "ppm" stands for "parts per million" and "mg / L." The iodine concentration in the bath liquid 2 can be determined from the amount of halogen element added when the bath is made, or by ICP-MS analysis of the bath liquid 2, or XRF analysis of the solution.

[0022] (1.4) Organic solvents By using an organic solvent as the solvent for bath liquid 2, gas generation during film formation and oxidation of the conductive substrate 5 itself are suppressed. From the viewpoint of favorable formation of film 3, the solvent preferably contains at least one selected from the group consisting of ketones and nitriles. It is presumed that the inclusion of a ketone or nitrile in the solvent causes a condensation reaction on the electrode surface (cathode surface), making electrodeposition possible. It is also presumed that the inclusion of a ketone in the solvent causes keto-enol tautomerism in the presence of iodine, improving the reactivity of bath liquid 2.

[0023] (1.4.1) Ketones The ketone is not particularly limited as long as it is an organic solvent having a carbonyl group (-C(=O)-) other than an ester bond. Examples of ketones include acetone, methyl ethyl ketone (MEK), 1-hexanone, 2-hexanone, 4-heptanone, 2-heptanone (methyl amyl ketone), 1-octanone, 2-octanone, 1-nonanone, 2-nonanone, diisobutyl ketone, methyl isobutyl ketone, acetylacetone, acetonylacetone, phenylacetone, acetophenone, methyl naphthyl ketone, cyclohexanone (CHN), methylcyclohexanone, etc. Among these, acetone and methyl ethyl ketone are preferred as the ketone from the viewpoint of particularly favorable formation of the coating 3.

[0024] (1.4.2) Nitriles Nitriles are organic solvents containing a nitrile group (-CN) in their structure. Examples of nitriles include acetonitrile, propionitrile, valeronitrile, and butyronitrile. Among these, acetonitrile is preferred as the nitrile from the viewpoint of forming the coating 3 particularly well.

[0025] (2) Conductive base material 5 For the "conductive substrate 5", the explanation in the section "(1) Conductive substrate 5" in "1. Coated substrate 1" above applies as is.

[0026] (3) Forming step of forming the film 3 (voltage application) In the present disclosure, a voltage is applied while the conductive substrate 5 is immersed in the bath liquid, thereby forming a coating 3 containing a metal element on the negative electrode side of the conductive substrate 5. Specifically, a positive electrode 6 and a negative electrode 7 (conductive substrate 5) are immersed in the bath liquid 2, and a potential gradient is generated between the two electrodes. An Mg—Al alloy is used as the positive electrode material for the positive electrode 6. The Mg—Al alloy is not particularly limited as long as it contains Mg and Al. Examples of Mg—Al alloys include alloys with an Al content of 1% by mass or more and 15% by mass or less, with the remainder being magnesium and unavoidable impurities (AZ91, AZ31, AM50, AM60, etc.). There are no particular limitations on the shape, thickness, size, etc. of the positive electrode 6. The positive electrode 6 may be in the form of, for example, a foil, a plate, a foam, a nonwoven fabric, a mesh, a felt, or an expanded material. The positive electrode 6 and the negative electrode 7 are preferably disposed facing each other. The positive electrode 6 and the negative electrode 7 are connected to a DC power supply, and a potential gradient can be generated between the positive electrode 6 and the negative electrode by the DC power supply. To generate a potential gradient between the positive electrode 6 and the negative electrode 7, the positive electrode 6 and the negative electrode 7 are immersed in the bath liquid 2, and a voltage (e.g., a constant voltage) is applied to both electrodes by a power source connected to the positive electrode 6 and the negative electrode 7. From the viewpoint of forming a film at a practical speed, the potential gradient generated between the two electrodes is preferably 10 V or more and 1000 V or less, more preferably 20 V or more and 500 V or less, and even more preferably 40 V or more and 100 V or less, in the case of a constant voltage. The application time of the voltage is not particularly limited and is, for example, preferably from 10 seconds to 300 seconds, more preferably from 20 seconds to 240 seconds, and even more preferably from 30 seconds to 180 seconds. The voltage may not be a constant voltage but may be variable in magnitude.

[0027] 3. Effects of the coated substrate 1 of this embodiment According to this embodiment, a novel coated substrate 1 is provided that can be applied to various fields and is expected to have high functionality. For example, it can be used as an insulating material for magnets, coils, heat dissipation substrates, etc. According to this embodiment, a novel coated substrate 1 is provided that can be used in an environment accompanied by a temperature change of 100° C. or more. According to this embodiment, a novel coated substrate 1 having high insulating properties and high adhesion of the coating 3 is provided. The coated substrate 1 of this embodiment can be mass-produced using a simple process. The method for producing the coated substrate 1 of this embodiment is a wet film-forming method, and therefore has the potential to be generally applicable to products of various shapes and sizes. [Example]

[0028] The present disclosure will be explained more specifically with reference to examples.

[0029] In the following description, the measurement conditions for XPS (X-ray photoelectron spectroscopy) are as follows: [XPS (X-ray photoelectron spectroscopy) measurement conditions] X-ray beam diameter: 100 μmΦ Signal capture angle: 45.0° Pass energy: 140 eV Ar etching for 30 seconds (etching rate: 10 nm / min in SiO2 equivalent)

[0030] The measurement conditions for the X-ray fluorescence analysis are as follows: [X-ray fluorescence analysis measurement conditions] Measuring device name: ZSX Primus2 Measuring diameter: 10mm Semi-quantitative analysis method: SQX analysis

[0031] 1. Example (1) Example 1 (solvent: acetone, negative electrode 7: Cu plate, positive electrode 6: magnesium alloy (Mg—Al alloy) A film forming apparatus 11 shown in FIG. 2 was used. A magnesium alloy was used as the positive electrode 6. A Cu plate (copper plate) was used as the negative electrode 7. The negative electrode 7 is a conductive substrate 5 on whose surface a coating 3 is formed. Acetone was used as the solvent for the bath liquid 2. 50 ppm of iodine was dissolved in the bath liquid 2 as a halogen. With the positive electrode 6 and the negative electrode 7 immersed in the bath liquid 2, 80 V was applied between the positive electrode 6 and the negative electrode 7 for 1 minute to form the coating 3 (forming step). Thereafter, the coated substrate 1 was removed from the bath liquid 2 and dried. A 120 nm coating 3 was formed on the surface of the conductive substrate 5. The thickness of the coating 3 was measured by observing the cross section of the negative electrode 7 with a field emission scanning electron microscope (FIB-SEM). FT-IR analysis of the coating surface and analysis by XPS after Ar etching for 30 seconds revealed that the coating 3 was composed mainly of magnesium hydroxide. When the coating 3 was measured by fluorescent X-ray analysis, the content ratio of Al to Mg was found to be 0.016. Coating 3 was measured by X-ray photoelectron spectroscopy and found to have an elemental percentage of iodine of 0.3 atm %. Furthermore, the element percentage of carbon element in Coating 3 was 9.9 atm %, and the total element percentage of Mg element, Al element, and oxygen element was 89.7 atm %. Furthermore, for Coating 3, no crystal grains were observed in the cross-sectional image obtained by FIB-SEM, no peaks attributable to Coating 3 were observed in XRD analysis, and the TEM electron diffraction pattern was unclear, confirming that Coating 3 was amorphous. Furthermore, the film 3 and the conductive substrate 5 were not peeled off and were well bonded to each other.

[0032] (2) Example 2 (Solvent: Acetone, Negative Electrode 7: SUS Plate, Positive Electrode 6: Magnesium Alloy (Mg-Al Alloy) A coated substrate 1 was prepared in the same manner as in Experimental Example 1, except that a SUS plate (stainless steel plate) was used for the negative electrode 7 . A 120 nm coating 3 was formed on the surface of the conductive substrate 5. The thickness of the coating 3 was measured by observing the cross section of the negative electrode 7 with a field emission scanning electron microscope (FIB-SEM). FT-IR analysis of the coating surface and analysis by XPS after Ar etching for 30 seconds revealed that the coating 3 was composed mainly of magnesium hydroxide. When the coating 3 was measured by fluorescent X-ray analysis, the ratio of Al to Mg was found to be 0.015. Coating 3 was measured by X-ray photoelectron spectroscopy and found to have an elemental percentage of iodine of 0.1 atm %. Furthermore, the element percentage of carbon element in Coating 3 was 9.8 atm %, and the total element percentage of Mg element, Al element, Fe element, Cr element, and oxygen element was 89.5 atm %. Furthermore, for Coating 3, no crystal grains were observed in the cross-sectional image obtained by FIB-SEM, no peaks attributable to Coating 3 were observed in XRD analysis, and the TEM electron diffraction pattern was unclear, confirming that Coating 3 was amorphous. Furthermore, the film 3 and the conductive substrate 5 did not peel off and were well bonded together.

[0033] (3) Example 3 (solvent: acetone, negative electrode 7: permalloy plate, positive electrode 6: magnesium alloy (Mg-Al alloy) A coated substrate 1 was prepared in the same manner as in Experimental Example 1, except that a permalloy plate was used as the negative electrode 7 . A 120 nm coating 3 was formed on the surface of the conductive substrate 5. The thickness of the coating 3 was measured by observing the cross section of the negative electrode 7 with a field emission scanning electron microscope (FIB-SEM). FT-IR analysis of the coating surface and analysis by XPS after Ar etching for 30 seconds revealed that the coating 3 was composed mainly of magnesium hydroxide. When the coating 3 was measured by fluorescent X-ray analysis, the ratio of Al to Mg was found to be 0.015. Coating 3 was measured by X-ray photoelectron spectroscopy and found to have an elemental percentage of iodine of 0.2 atm %. Furthermore, the element percentage of carbon element in Coating 3 was 9.8 atm %, and the total element percentage of Mg element, Al element, Fe element, Ni element, and oxygen element was 89.6 atm %. Furthermore, for Coating 3, no crystal grains were observed in the cross-sectional image obtained by FIB-SEM, no peaks attributable to Coating 3 were observed in XRD analysis, and the TEM electron diffraction pattern was unclear, confirming that Coating 3 was amorphous. Furthermore, the film 3 and the conductive substrate 5 did not peel off and were well bonded together.

[0034] (4) Example 4 (Solvent: Acetone, Negative Electrode 7: Carbon Plate, Positive Electrode 6: Magnesium Alloy (Mg-Al Alloy) A coated substrate 1 was prepared in the same manner as in Experimental Example 1, except that a carbon plate was used as the negative electrode 7 . A 120 nm coating 3 was formed on the surface of the conductive substrate 5. The thickness of the coating 3 was measured by observing the cross section of the negative electrode 7 with a field emission scanning electron microscope (FIB-SEM). FT-IR analysis of the coating surface and analysis by XPS after Ar etching for 30 seconds revealed that the coating 3 was composed mainly of magnesium hydroxide. When the coating 3 was measured by fluorescent X-ray analysis, the ratio of Al to Mg was found to be 0.015. Coating 3 was measured by X-ray photoelectron spectroscopy and found to have an elemental percentage of iodine of 0.1 atm %. Furthermore, the element percentage of carbon element in Coating 3 was 9.6 atm %, and the total element percentage of Mg element, Al element, and oxygen element was 89.6 atm %. Furthermore, for Coating 3, no crystal grains were observed in the cross-sectional image obtained by FIB-SEM, no peaks attributable to Coating 3 were observed in XRD analysis, and the TEM electron diffraction pattern was unclear, confirming that Coating 3 was amorphous. Furthermore, the film 3 and the conductive substrate 5 did not peel off and were well bonded together.

[0035] 2. Effects of the Example According to this embodiment, a novel coated substrate 1 is provided that can be applied to various fields and is expected to have high functionality.

[0036] (Addendum) This specification includes the following inventions: [1] A coated substrate in which a conductive substrate is coated with a coating, The thickness of the coating is 50 nm or more and 10 μm or less, the coating is mainly composed of magnesium hydroxide and is amorphous; The coated substrate, wherein when the coating is measured by fluorescent X-ray analysis, the content ratio (weight ratio) of Al (aluminum) to Mg (magnesium) is 1 / 500 or more and 1 / 5 or less. [2] The coated substrate according to [1], wherein the portion of the conductive substrate where the coating is formed has electrical conductivity. [3] The coated substrate according to [1] or [2], wherein the coating contains iodine. [4] The coated substrate according to any one of [1] to [3], wherein the conductive substrate is made of a metal material containing at least one element selected from the group consisting of Fe (iron), Ni (nickel), Co (cobalt), Cu (copper), Pt (platinum), and Pd (palladium) in a total amount of 30 mass% or more. [5] When the coating is measured by X-ray photoelectron spectroscopy, the total element percentage of metal elements and O (oxygen) is 70 atm% or more, The coated substrate according to any one of [1] to [5], wherein the element percentage of C (carbon) is 0.1 atm % or more and less than 20 atm %. [6] A method for producing a coated substrate using a bath solution containing an organic solvent and iodine, the bath liquid has a water content of less than 1% by mass and contains at least one or more metal elements; A voltage is applied to the conductive substrate while the conductive substrate is immersed in the bath liquid, a manufacturing method for forming the coating containing the metal element on the conductive base material of a negative electrode, The metal element in the bath solution is supplied to the bath solution by dissolution of the positive electrode, and an Mg-Al alloy is used as the positive electrode material. [1] to [5], the method for producing the coated substrate. [Explanation of symbols]

[0037] 1...Coated substrate 2…Bath liquid 3...coating 5...Conductive base material 6...Positive electrode 7...Negative electrode 11...Film deposition equipment

Claims

1. A coated substrate in which a conductive substrate is coated with a coating, The thickness of the coating is 50 nm or more and 10 μm or less, the coating is mainly composed of magnesium hydroxide and is amorphous; A coated substrate, wherein when the coating is measured by fluorescent X-ray analysis, the content ratio (weight ratio) of Al (aluminum) to Mg (magnesium) is 1 / 500 or more and 1 / 5 or less.

2. The coated substrate according to claim 1 , wherein the conductive substrate has a portion where the coating is formed, the portion having electrical conductivity.

3. The coated substrate of claim 1 or claim 2, wherein the coating comprises iodine.

4. 3. The coated substrate according to claim 1, wherein the conductive substrate is made of a metal material containing at least one element selected from the group consisting of Fe (iron), Ni (nickel), Co (cobalt), Cu (copper), Pt (platinum), and Pd (palladium) in a total amount of 30 mass% or more.

5. When the coating is measured by X-ray photoelectron spectroscopy, the total element percentage of metal elements and O (oxygen) is 70 atomic % or more, 3. The coated substrate according to claim 1, wherein the element percentage of C (carbon) is 0.1 atm % or more and less than 20 atm %.

6. A method for producing a coated substrate using a bath solution containing an organic solvent and iodine, the bath liquid has a water content of less than 1% by mass and contains at least one metal element; A voltage is applied to the conductive substrate while the conductive substrate is immersed in the bath liquid, a manufacturing method for forming the coating containing the metal element on the conductive base material of a negative electrode, The metal element in the bath solution is supplied to the bath solution by dissolution of the positive electrode, and an Mg—Al alloy is used as the positive electrode material. A method for producing the coated substrate of claim 1.

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