Information processing apparatus, lithography apparatus, method of manufacturing article, program, and information processing method

Abstract

To provide an information processor for enabling a user to easily determine an alternative sample shot area for changing the arrangement of a sample shot area.SOLUTION: The information processing apparatus according to the present invention includes a determination step of determining, when a first value of a predetermined component calculated from a measurement result of a predetermined position in each of a plurality of sample shot regions on a substrate surface of a substrate exceeds a predetermined value, at least one sample shot region candidate to be a factor instead of the predetermined sample shot region; And an output step of outputting the second value corresponding to each of the at least one sample shot region candidate to a display unit.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to an information processing apparatus, a lithography apparatus, an article manufacturing method, a program, and an information processing method. [Background technology]

[0002] Conventionally, in exposure apparatuses, in order to transfer a pattern formed on an original to each shot area on the surface of a substrate with high accuracy, global alignment may be performed using the measurement positions of alignment marks formed in each of several sample shot areas. Patent Document 1 discloses an exposure apparatus that changes the arrangement of sample shot areas on a substrate that will be subsequently exposed and optimizes the positions of the sample shot areas, based on position information of the sample shot areas acquired on a predetermined substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-324055 Summary of the Invention [Problem to be solved by the invention]

[0004] In the exposure apparatus disclosed in Patent Document 1, when changing the arrangement of the sample shot areas or optimizing the positions of the sample shot areas, pre-stored position information of the sample shot areas is required. Therefore, if position information of the sample shot areas is not stored, changing the arrangement of the sample shot areas or optimizing the positions of the sample shot areas is not easy, as it requires the user to do this by trial and error. SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an information processing device that allows a user to easily determine an alternative sample shot area in order to change the arrangement of sample shot areas. [Means for solving the problem]

[0005] The information processing device according to the present invention is characterized in that, when a first value of a predetermined component calculated from measurement results at predetermined positions in each of a plurality of sample shot regions on a substrate surface of a substrate exceeds a predetermined value, it performs a determination step of determining at least one sample shot region candidate to replace the causing predetermined sample shot region; a calculation step of calculating a second value of the predetermined component when each of the at least one sample shot region candidate is used in place of the predetermined sample shot region; and an output step of outputting the second value corresponding to each of the at least one sample shot region candidate to a display unit. [Effects of the Invention]

[0006] According to the present invention, it is possible to provide an information processing device that allows a user to easily determine an alternative sample shot area in order to change the arrangement of sample shot areas. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a schematic diagram of an exposure apparatus equipped with an information processing apparatus according to a first embodiment. [Figure 2] 4 is a flowchart showing a wafer exposure process in the exposure apparatus. [Figure 3] 1A and 1B are diagrams showing examples of arrangements of sample shot areas on a wafer and examples of the relationship between the number of sample shot areas on a wafer and correction residuals; [Figure 4] 1A and 1B are diagrams showing a wafer map displayed in the information processing apparatus according to the first embodiment and a diagram showing the difference between actual coordinates and predicted coordinates in each sample shot area; [Figure 5] FIG. 10 is a top view of a wafer showing each coordinate used when calculating a magnification component. [Figure 6] FIG. 10 is a diagram showing a wafer map for illustrating a method for determining sample shot area candidates. [Figure 7]6 is a flowchart showing a process for displaying a wafer map in the information processing apparatus according to the first embodiment. [Figure 8] FIG. 10 is a diagram showing a wafer map illustrating an example of multiple shot areas where multiple shot measurements are performed. [Figure 9] 10 is a flowchart showing a process for displaying a wafer map in an information processing apparatus according to a second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] The information processing device according to the present embodiment will be described in detail below with reference to the accompanying drawings. Note that the drawings may be drawn at a scale different from the actual scale in order to facilitate understanding of the present embodiment. In the following description, the direction parallel to the optical axis of the projection optical system 3 is defined as the Z direction, and two directions perpendicular to each other in a plane perpendicular to the optical axis of the projection optical system 3 are defined as the X direction and the Y direction.

[0009] [First embodiment] In an exposure apparatus, circuit patterns (reticle patterns) may be transferred onto a substrate in such a way that they are superimposed on each other, with ten or more layers being formed. In this case, if the overlay accuracy between the layers is not good, there is a risk that problems will arise in the characteristics of the formed circuit, resulting in a decrease in yield.

[0010] Therefore, in the exposure apparatus, it is necessary to align the shot areas arranged on the surface of the substrate with extreme precision. Specifically, before transferring a pattern, the positions of alignment marks provided in advance in each shot area on the substrate surface are measured using an optical microscope or the like. Then, based on information about the position of the measured alignment mark and information about the position of the circuit pattern formed on the original, it becomes possible to align a predetermined shot area on the substrate surface with respect to the circuit pattern.

[0011] Overlay accuracy can be improved most significantly by aligning the circuit pattern by measuring the positions of the alignment marks in all shot areas on the substrate surface. However, it takes a lot of time to measure the positions of the alignment marks in all shot areas, and this is not realistic from the viewpoint of productivity.

[0012] Therefore, generally, the alignment of each shot area on the substrate surface is performed using a global alignment method as described below. In the global alignment method, the relative position of a predetermined shot area on the substrate surface is expressed as a function of coordinates on the substrate surface.

[0013] Then, the positions of alignment marks provided in each of several shot areas (hereinafter referred to as sample shot areas) on the substrate surface are measured. Next, a regression analysis-like statistical calculation process is performed using a function model assumed for the positions of the alignment marks provided in each of the measured sample shot areas, thereby estimating the parameters of the function model.

[0014] Then, the position coordinates of each shot area in the coordinate system of the substrate stage provided in the exposure apparatus are calculated using a function model having the estimated parameters, thereby aligning each shot area on the substrate surface. In such global alignment methods, polynomial function models with the coordinates of the substrate stage as variables are often used as function models, and in particular, scaling, rotation, uniform offset, etc., which are linear functions of the coordinates of the substrate stage, are mainly used.

[0015] In addition, a method using a regression model that also takes into account the higher-order components of the coordinates of the substrate stage as parameters has also come into use. Furthermore, a method has also been proposed in which parameters are selected based on data acquired by measuring a large number of sample shot areas in advance and a regression model having a regularization term, and the selected parameters are used to calculate the position coordinates of each shot area.

[0016] On the other hand, if the alignment of each shot area fails in the exposure apparatus, the exposure apparatus will abnormally stop. In order to restore an exposure apparatus that has stopped abnormally in this way, it is necessary to remove the cause of the failure.

[0017] For example, it may be possible to restore the exposure apparatus that has abnormally stopped by identifying the sample shot area that caused the failure and changing the identified sample shot area to another sample shot area. However, in conventional exposure apparatuses, information for selecting the other sample shot area so that the alignment of each shot area does not fail is not provided, and the user must search for the other sample shot area by trial and error.

[0018] Therefore, in conventional exposure apparatuses, after an abnormal stop due to a failure to align each shot area, the time it takes to recover, i.e., the abnormal stop time, is long, resulting in a decrease in yield. Therefore, the present embodiment aims to provide an information processing device that allows the user to easily change the sample shot area when an abnormal stop occurs due to a failure to align each shot area, thereby shortening the abnormal stop time.

[0019] FIG. 1(a) is a schematic diagram of an exposure apparatus 1 equipped with an information processing apparatus according to the first embodiment. The exposure apparatus 1 includes a projection optical system 3, a wafer chuck 5, a wafer stage 6, an alignment optical system 7 (measurement unit), a control unit 8, and a display unit 9. The information processing device according to this embodiment includes a control unit 8 and a display unit 9.

[0020] The projection optical system 3 is a reduction projection optical system that projects an image of the circuit pattern drawn on the reticle 2 onto the wafer surface (substrate surface) of the wafer 4 (substrate) while reducing the image. The wafer chuck 5 is configured to hold the wafer 4 by suction.

[0021] The wafer stage 6 is configured to be movable so as to position the wafer 4 at a predetermined position within the XY plane. The alignment optical system 7 is configured to measure the positions (predetermined positions) of the pre-alignment marks 11 and fine alignment marks 12 formed in each of a plurality of shot areas on the wafer surface of the wafer 4. In addition to the pre-alignment marks 11 and the fine alignment marks 12, an underlying pattern may be formed on the wafer surface of the wafer 4 in a previous process.

[0022] FIG. 1( b ) is a schematic diagram of an alignment optical system 7 provided in the exposure apparatus 1 . The alignment optical system 7 includes a light source 71 , a beam splitter 72 , lenses 73 and 74 , and a sensor 75 .

[0023] In the alignment optical system 7, illumination light emitted from a light source 71 is reflected by a beam splitter 72 and then passes through a lens 73, thereby illuminating a pre-alignment mark 11 formed on the wafer surface of the wafer 4. The diffracted light generated by illuminating the pre-alignment mark 11 passes through a lens 73, a beam splitter 72 and a lens 74, and is received by a sensor 75, whereby the position of the pre-alignment mark 11 is measured. The position of the fine alignment mark 12 can also be measured in the same way.

[0024] FIG. 2 is a flowchart showing the exposure process of the wafer 4 in the exposure apparatus 1. Each step in the flowchart is performed by the control unit 8.

[0025] When the exposure process of the wafer 4 starts in the exposure apparatus 1, first, the wafer 4 is loaded into the exposure apparatus 1 (step S1). Next, pre-alignment is performed to roughly calculate the position of the wafer 4 by detecting the pre-alignment marks 11 formed on the wafer surface of the wafer 4 (step S2). Specifically, in step S2, the pre-alignment marks 11 formed in each of the multiple shot areas on the wafer surface of the wafer 4 are detected, and the shift component of the entire wafer surface of the wafer 4 and the first-order linear component including the magnification component and the rotation component are calculated.

[0026] Next, based on the pre-alignment result acquired in step S2, fine alignment is performed to precisely calculate the shift component of the entire wafer surface of the wafer 4 and the first-order linear component including the magnification component and rotation component (step S3). Specifically, in step S3, based on the result of the pre-alignment, the wafer stage 6 is driven so that the fine alignment marks 12 are positioned at positions observable by the alignment optical system 7. Then, the positions of the fine alignment marks 12 formed in each of the multiple shot areas are measured.

[0027] In step S3, the high-order deformation components of the wafer 4 can also be calculated precisely by measuring the positions of the fine alignment marks 12 formed in each of the many shot areas. This makes it possible to calculate the precise position of each of the multiple shot areas on the wafer surface of the wafer 4.

[0028] Next, after the fine alignment in step S3 is completed, the wafer 4 is exposed so that the image of the pattern formed on the reticle 2 is projected onto each of the multiple shot areas on the wafer surface of the wafer 4 by the projection optical system 3 (step S4). Then, the wafer 4 is unloaded from the exposure apparatus 1 (step S5), and the exposure process is completed.

[0029] Overlay accuracy is one of the performance indicators of semiconductor exposure equipment. In semiconductor exposure equipment, ten or more layers of circuit patterns are transferred onto the wafer 4 in an overlapping manner, and if the overlap between the layers is not good, the characteristics of the formed circuit may deteriorate. Therefore, in the semiconductor exposure apparatus, the deterioration of the overlay accuracy is suppressed by performing alignment measurement that measures the positions of alignment marks formed on the wafer surface of the wafer 4.

[0030] In general alignment measurement, some shot areas (hereinafter referred to as sample shot areas) are selected from a plurality of shot areas on the wafer surface of the wafer 4. Then, the positions of the alignment marks formed in each of the selected sample shot areas are measured. FIG. 3(a) shows an example of the arrangement of a plurality of shot areas 20 on the wafer surface of the wafer 4 and a sample shot area 21 selected from the plurality of shot areas 20.

[0031] Moreover, by increasing the number of sample shot areas 21 selected from the plurality of shot areas 20, the overlay accuracy of the wafer 4 can be further improved. On the other hand, if the number of sample shot areas 21 increases, the time required for alignment measurement also increases. That is, there is a trade-off between the number of sample shot areas 21 and the time required for alignment measurement, and as the number of sample shot areas 21 increases, the productivity of the exposure apparatus 1 decreases.

[0032] FIG. 3(b) shows an example of the relationship between the number of sample shot areas 21 on the wafer surface of the wafer 4 in the exposure apparatus 1 and the correction residual. Here, the correction residual corresponds to the difference between predicted coordinates calculated by correcting the design coordinates and actual coordinates (measured coordinates) that are actually measured. As shown in FIG. 3(b), as the number of sample shot areas 21 in the exposure apparatus 1 increases, the correction residual is reduced.

[0033] FIG. 4(a) shows an example of a map of the wafer surface of the wafer 4 as a UI image displayed on the display unit 9 provided in the information processing device according to this embodiment. The information processing device according to this embodiment can display on the display unit 9 the values ​​of predetermined alignment components (predetermined components) such as the magnification component, rotation component, and shift component of the wafer surface of the wafer 4. Note that each alignment component here is a numerical representation of the magnitude and direction of distortion that depends on the position on the wafer surface of the wafer 4.

[0034] FIG. 4(a) shows an example in which the value (first value) of the magnification component of the wafer surface of the wafer 4 exceeds a preset threshold value (predetermined value), causing the exposure apparatus 1 to abnormally stop, and making it necessary to select another sample shot area 21. Specifically, in the example shown in FIG. 4(a), eight sample shot areas 21a, 21b, 21c, 21d, 21e, 21f, 21g, and 21h used in alignment measurement for the wafer 4 are shown.

[0035] The sample shot areas 21a to 21h can be set by selecting them from a plurality of shot areas 20 by performing general statistical calculations in advance. FIG. 4(b) shows the difference between the predicted coordinates in each of the sample shot areas 21a to 21h and the actual coordinates actually measured by the alignment optical system 7.

[0036] The magnification component of the wafer surface of wafer 4 is calculated using two or more sample shot areas, as will be described later, so it is not easy to determine which sample shot area caused the preset threshold to be exceeded. Therefore, as shown in FIG. 4(b), the difference between the average value of the differences (shown by the broken line) and the difference in each of the sample shot areas 21a to 21h (hereinafter referred to as the difference from the average value) is calculated.

[0037] At this time, it can be seen that the difference from the above average value in sample shot area 21g is extremely large (largest) compared to the differences from the above average values ​​in sample shot areas 21a, 21b, 21c, 21d, 21e, 21f, and 21h. Therefore, it can be assumed that the calculated value of the magnification component of the wafer surface of the wafer 4 exceeds a preset threshold value due to the sample shot area 21g.

[0038] Next, a specific method for calculating the value of the magnification component of the wafer surface of the wafer 4 will be described. FIG. 5(a) is a top view of wafer 4 showing the coordinates used when calculating the value of the magnification component of the wafer surface of wafer 4 using two sample shot areas 21p and 21q.

[0039] As shown in FIG. 5(a), the design coordinates of the centers of the sample shot areas 21p and 21q are respectively (d X1 [mm],d Y1 [mm]) and (d X2 [mm],d Y2 [mm]). Moreover, the measurement coordinates of the center of the sample shot area 21p actually measured by the alignment optical system 7 are (d X1 [mm]+l X1 [nm],d Y1 [mm]+l Y1 [nm]).

[0040] Moreover, the measurement coordinates of the center of the sample shot area 21q actually measured by the alignment optical system 7 are (d X2 [mm]+l X2 [nm],d Y2 [mm]+l Y2 [nm]). At this time, the magnification β X [ppm] and magnification β Y [ppm] can be expressed by the following formulas (1) and (2).

number

number

[0041] And the magnification β calculated by Eq. (1) X and the magnification β calculated by Equation (2) Y The value of the magnification component of the wafer surface of the wafer 4 can be calculated from the difference between

[0042] FIG. 5(b) is a top view of wafer 4 showing each coordinate used when calculating the value of the magnification component of the wafer surface of wafer 4 using multiple sample shot areas 21i (i=1, 2, . . . , N).

[0043] Specifically, the design coordinates of the center of the sample shot area 21i are (d Xi [mm],d Yi [mm]). Moreover, the measurement coordinates of the center of the sample shot area 21i actually measured by the alignment optical system 7 are (d Xi [mm]+l Xi [nm],d Yi [mm]+l Yi [nm]).

[0044] At this time, a plurality of sample shot areas 21i (i=1, 2, . . . , N) are used to calculate the magnification β X [ppm] and magnification β Y [ppm] can be expressed by the following formulas (3) and (4).

number

number

[0045] Note that x, y, X, Y, Z, a, b, c, d, e, f, and D included in formulas (3) and (4) are defined by the following formulas (5), (6), (7), (8), (9), (10), (11), (12), (13), (14), (15), and (16), respectively.

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number

number

number

number

number

number

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[0046] The above method for calculating the value of the magnification component of the wafer surface of the wafer 4 is an example, and the calculation may be performed by a different method.

[0047] FIG. 4(a) shows that the value of the magnification component calculated from the eight sample shot areas 21a to 21h using equations (3) to (16) is 5.5 ppm, which exceeds the preset threshold value of 5.0 ppm.

[0048] Specifically, in the map of the wafer surface of wafer 4 as a UI image displayed on display unit 9 shown in FIG. 4(a), shading is shown indicating that the value of the magnification component in sample shot area 21g is 5.5 ppm. As shown in FIG. 4(a), the maximum value of the shading is set to ±6.0 ppm based on the calculated 5.5 ppm.

[0049] The shading of sample shot area 21g can also be expressed as the difference between the value of the magnification component calculated from sample shot areas 21a to 21h and the value calculated from sample shot areas 21a to 21f and 21h other than sample shot area 21g. The shading of sample shot area 21g can also be expressed as the difference between the value of the magnification component calculated from the eight sample shot areas 21a to 21h and the value of the magnification component calculated from the multiple shot areas 20 where multiple shot measurements, which will be described later, were performed.

[0050] In the above, it is determined that the value of the magnification component of the wafer surface of the wafer 4 has exceeded the threshold value due to the selection of sample shot area 21g. At this time, the information processing apparatus according to this embodiment selects a new sample shot area 21g from eleven sample shot area candidates around the sample shot area 21g included in the area 121 shown in FIG. 4(a).

[0051] FIG. 6(a) is a map of the wafer surface of the wafer 4 to show a method for determining sample shot area candidates around the sample shot area 21g. As shown in FIG. 6(a), in the information processing apparatus according to this embodiment, shot areas 20 within a predetermined distance from the center of a sample shot area 21g are set as sample shot area candidates.

[0052] That is, a shot area 20 at least part of which is included within a circle 122 having a radius a predetermined distance from the center of the sample shot area 21g is set as a sample shot area candidate. The predetermined distance can be set arbitrarily, for example, to 50 mm. Furthermore, in the above, shot areas 20 at least a part of which is included within circle 122 are set as sample shot area candidates, but this is not limiting and shot areas 20 whose center is included within circle 122 may also be set as sample shot area candidates.

[0053] FIG. 6(b) is a map of the wafer surface of the wafer 4 to show another method of determining sample shot area candidates around the sample shot area 21g. In this other method shown in FIG. 6(b), a shot area 20 that contacts a predetermined side or a predetermined corner of the sample shot area 21g is determined as a sample shot area candidate.

[0054] The seven shot areas 20 surrounding the sample shot area 21g included in the area 121 shown in FIG. 6(b) are defined as the shot areas 20 closest to the sample shot area 21g. Furthermore, the shot area 20 that is in contact with a predetermined side or a predetermined corner of each of the seven shot areas 20 that are closest to the sample shot area 21g is defined as the shot area 20 that is second closest to the sample shot area 21g.

[0055] Then, the shot area 20 that is in contact with a predetermined side or a predetermined corner of the shot area 20 that is the (K-1)th closest to the sample shot area 21g is defined as the shot area 20 that is the Kth closest to the sample shot area 21g. In this case, in this other method, when the parameter is set to K, the shot areas 20 that are closest to the sample shot area 21g through the shot area 20 that are Kth closest to the sample shot area 21g are determined as sample shot area candidates. In the alternative method shown in FIG. 6(b), the parameter is set to 1, but is not limited to this and can be set to any value.

[0056] In FIG. 4(a), the values ​​of the magnification components of the wafer surface of wafer 4 calculated from each of the eleven sample shot area candidates determined as described above and seven sample shot areas 21a to 21f and 21h are shown in shades of gray. The shading in each of the eleven sample shot area candidates shown in FIG. 4(a) can also be expressed as the difference from the average value of the twelve magnification component values ​​calculated as described above.

[0057] The shading of each of the eleven sample shot area candidates shown in FIG. 4(a) may be displayed in color to allow for more intuitive judgment. For example, a sample shot area candidate whose difference from the value of the magnification component acquired in a multiple shot measurement, which will be described later, is larger than that of sample shot area 21g, i.e., a poor sample shot area candidate, may be displayed in red. On the other hand, the difference from the value of the magnification component acquired in the multiple shot measurement is smaller than that of sample shot area 21g, that is, a good sample shot area candidate may be displayed in blue.

[0058] FIG. 7 is a flowchart showing the processing for displaying a map of the wafer surface of the wafer 4 in the information processing device according to this embodiment when the exposure apparatus 1 is abnormally stopped due to a failure in the alignment process. This process is performed in parallel with the pre-alignment process in step S2 and the fine alignment process in step S3 in the flowchart shown in FIG. 2, for example.

[0059] When the process starts, first, it is determined whether information has been input indicating that the alignment process has failed and stopped abnormally because the value of a predetermined alignment component calculated in the exposure apparatus 1 exceeds a preset threshold (step S11). If the information has not been input (No in step S11), the process returns to step S11 and continues.

[0060] On the other hand, if the information is input (Yes in step S11), the predetermined alignment component that exceeds the preset threshold is identified (step S12). Next, among the plurality of sample shot areas, the sample shot area that is the cause of the value of the predetermined alignment component identified in step S12 exceeding a preset threshold is determined (step S13).

[0061] Next, sample shot area candidates arranged around the sample shot area determined in step S13 are determined (step S14, determination step). Next, the results of alignment measurement performed in exposure apparatus 1 are obtained for each of the sample shot area candidates determined in step S14 (step S15).

[0062] Next, the value (second value) of the predetermined alignment component identified in step S12 is calculated from the result of the alignment measurement in each of the sample shot area candidates in step S15 (step S16, calculation step). Finally, the value of the predetermined alignment component corresponding to each of the sample shot area candidates calculated in step S16 is output to the display unit 9 (output step). Then, a map of the wafer surface of the wafer 4, in which the values ​​are indicated by shading, is displayed on the display unit 9 (step S17), and the process ends.

[0063] In step S16, the value of the predetermined alignment component is calculated using each of the sample shot area candidates and sample shot areas other than the sample shot area determined in step S13, but this is not limitative. That is, it is also possible to calculate the difference from the value of the predetermined alignment component calculated using a sample shot area other than the sample shot area determined in step S16. Alternatively, in the above process, multiple shot measurements may be performed on multiple shot areas 20, as described below, and the difference from the value of the specified alignment component (third value) calculated using the multiple shot areas 20 for which the multiple shot measurements were performed may be calculated.

[0064] That is, in the information processing apparatus according to this embodiment, instead of performing alignment measurement for each sample shot area candidate in step S15, the following multiple shot measurement may be performed. FIG. 8(a) is a map of the wafer surface of the wafer 4 showing an example of a plurality of shot areas 20 in which the multiple shot measurement is performed in the exposure apparatus 1. In the example of the multiple shot measurement shown in FIG. 8( a ), alignment measurement is performed for all shot areas 20 on the wafer surface of the wafer 4 .

[0065] FIG. 8(b) is a map of the wafer surface of the wafer 4 showing another example of a plurality of shot areas 20 where the multiple shot measurement is performed. In another example of the multiple shot measurement shown in FIG. 8(b), alignment measurement is performed on eleven sample shot area candidates around sample shot area 21g included in area 121 on the wafer surface of wafer 4. That is, in the information processing apparatus according to this embodiment, the multiple shot measurement may be performed on multiple shot areas 20 including the sample shot area candidate determined in step S14.

[0066] Furthermore, in step S17, the value of the predetermined alignment component is displayed in shades of gray, but this is not limiting, and a correction residual indicating the correction accuracy may also be displayed in shades of gray. The correction residual here means the difference between the actual coordinates (measurement coordinates) of the center of the sample shot area or the alignment mark actually measured by the alignment optical system 7 and the predicted coordinates calculated from the design coordinates and correction values.

[0067] Specifically, the actual coordinates are expressed as (M X ,M Y ), and the design coordinates are (D X ,D Y ), and the correction values ​​in the X and Y directions for all alignment components such as the magnification component, rotation component, and shift component are C X and C Y Let's say. The correction value can be calculated by a coordinate correction value calculation such as linear approximation.

[0068] At this time, the correction residuals R X and R Y are expressed as the following equations (17) and (18). R X =M X -(D X ×C X ) ···(17) R Y =M Y -(D Y ×C Y ) ···(18)

[0069] If the correction value is correct, the correction residual between the actual coordinates and the predicted coordinates will be small. On the other hand, if a large correction residual remains, it means that the correction value has not been calculated correctly, and it is expected that the alignment accuracy will decrease. That is, it is possible to determine the validity of the correction value based on the correction residual calculated as described above.

[0070] As described above, in the information processing device according to this embodiment, when the alignment process in exposure apparatus 1 fails and causes an abnormal stop, the value of the predetermined alignment component of the candidate sample shot area that serves as a substitute for the predetermined sample shot area that caused the problem is displayed on display unit 9. This allows the user to easily select a new sample shot area to replace the specified sample shot area, thereby shortening the time required to restore exposure apparatus 1 that has stopped abnormally.

[0071] It should be noted that, in the information processing device according to this embodiment, as described above, calculation and display processing is performed to change the arrangement of the sample shot area when the value of a predetermined alignment component exceeds a preset threshold value and the exposure apparatus 1 abnormally stops, but the present invention is not limited to this. That is, in the information processing device according to this embodiment, when the value of a predetermined alignment component exceeds a predetermined value that is set based on the alignment accuracy required by the user, calculation and display processing may be performed to change the arrangement of the sample shot area.

[0072] In this case, in step S11, instead of inputting information indicating that the exposure apparatus 1 has abnormally stopped, information is input indicating that the value of a specified alignment component exceeds a specified value, which may result in the alignment accuracy required by the user not being met. Furthermore, in the information processing device according to this embodiment, for example, in response to a user request, the value of a predetermined alignment component (fourth value) may be calculated from the measurement results of the positions of alignment marks formed in each of a predetermined combination of multiple sample shot areas in accordance with the above.

[0073] Then, a map of the wafer surface of the wafer 4, in which the calculated values ​​of the predetermined alignment components are indicated by shading, may be displayed on the display unit 9. In this case, the user can refer to the map to increase the number of sample shot areas to improve alignment accuracy, or reduce the number of sample shot areas to improve throughput while maintaining alignment accuracy.

[0074] Furthermore, in the information processing apparatus according to this embodiment, after calculating the value of a predetermined alignment component for each of the sample shot area candidates in step S16, the arrangement of the sample shot areas may be automatically changed based on a predetermined method. Furthermore, in the information processing device according to this embodiment, a user interface that can be operated by the user may be displayed on the display unit 9 as needed. Furthermore, although the information processing apparatus according to this embodiment is provided in the exposure apparatus 1, it is not limited to this and can also be provided in a lithography apparatus that forms a pattern of an original on a substrate.

[0075] [Second embodiment] In the information processing apparatus according to the first embodiment, when the alignment process in the exposure apparatus 1 fails and the exposure apparatus 1 abnormally stops, a map of the wafer surface of the wafer 4 is displayed in order to select a new sample shot area from the sample shot area candidates. In this case, the exposure apparatus 1 is stopped abnormally until the new sample shot area is selected, and the throughput of the exposure apparatus 1 decreases.

[0076] On the other hand, by acquiring information about the alignment components before performing alignment processing in the exposure apparatus 1, it is possible to prevent such abnormal stops in the exposure apparatus 1. Therefore, in the information processing device according to the second embodiment, when a message is input indicating that an abnormality has occurred because the value of a predetermined alignment component calculated by an external measuring device has exceeded a threshold value, a map of the wafer surface of wafer 4 is displayed in order to select a new sample shot area. That is, the external measuring device can measure the positions of the alignment marks formed in each of the plurality of sample shot areas on the wafer surface of the wafer 4.

[0077] FIG. 9 is a flowchart showing a process for displaying a map of the wafer surface of the wafer 4 in the information processing device according to the second embodiment when an abnormality occurs in the external measuring device. The information processing device according to this embodiment has the same configuration as the information processing device according to the first embodiment, so the same components are given the same reference numerals and descriptions thereof will be omitted.

[0078] When the process starts, first, it is determined whether information has been input indicating that an abnormality has occurred because a predetermined alignment component calculated by an external measuring device exceeds a preset threshold (step S21). If the information has not been input (No in step S21), the process returns to step S21 and continues.

[0079] On the other hand, if the information has been input (Yes in step S21), steps S12 to S14 are performed in the same manner as in the information processing device according to the first embodiment. Next, the results of alignment measurement performed by an external measuring device for each of the sample shot area candidates determined in step S14 are acquired (step S25), and steps S16 and S17 are performed in the same manner as in the information processing apparatus according to the first embodiment. As a result, a map of the wafer surface of wafer 4, in which the values ​​of the predetermined alignment components in each of the sample shot area candidates are indicated by shading, is displayed on display unit 9, and the process ends.

[0080] As described above, in the information processing device according to this embodiment, when the value of a predetermined alignment component in the external measuring device exceeds a threshold value, the value of the predetermined alignment component of a candidate sample shot area that serves as a substitute for the causing predetermined sample shot area is displayed on display unit 9. This makes it possible to check the validity of the arrangement of sample shot areas on the wafer surface of wafer 4 before sending a product lot through exposure apparatus 1, and if the arrangement is not valid, to change the arrangement or add a new sample shot area.

[0081] Therefore, it is possible to prevent an abnormal stop that occurs in the exposure apparatus 1 due to a failure in the alignment process. Furthermore, since the map of the wafer surface of the wafer 4 is displayed on the display unit 9, the changes and additions can be easily made, thereby reducing the work time.

[0082] Although the above describes the information processing device according to this embodiment, the above-described information processing method, a program for causing a computer to execute the method, and a computer-readable recording medium on which the program is recorded are also included within the scope of this embodiment.

[0083] [Production method] Next, a method for manufacturing an article using the exposure apparatus 1 equipped with the information processing apparatus according to the first or second embodiment will be described.

[0084] The products manufactured here include semiconductor devices, display devices, color filters, optical components, and MEMS (Micro Electro Mechanical Systems). For example, a semiconductor device is manufactured through a pre-process for forming a circuit pattern on a wafer 4 and a post-process including a processing step for completing the circuit chip formed in the pre-process as a product.

[0085] The pre-processing includes an exposure process in which a wafer 4 coated with a photosensitive agent (resist) is exposed using an exposure apparatus 1 equipped with an information processing apparatus according to the first or second embodiment, and a development process in which the photosensitive agent exposed by the exposure process is developed. Then, a circuit pattern is formed on the wafer 4 by performing an etching process, an ion implantation process, etc. using the developed photosensitive agent pattern as a mask.

[0086] By repeating these steps of exposure, development, etching, etc., a circuit pattern consisting of multiple layers is formed on the wafer 4. In the post-process, the wafer 4 on which the circuit pattern is formed is diced, and chip mounting, bonding and inspection processes are carried out.

[0087] A display device is manufactured through a process of forming a transparent electrode. The process of forming a transparent electrode includes a step of applying a photosensitive agent onto a glass wafer 4 on which a transparent conductive film has been vapor-deposited, and a step of exposing the wafer 4 coated with the photosensitive agent using an exposure apparatus 1 equipped with an information processing device according to the first or second embodiment. The step of forming the transparent electrode also includes a step of developing the exposed photosensitive agent.

[0088] According to the method for manufacturing an article according to this embodiment, it is possible to manufacture an article with higher quality and higher productivity than conventional methods. Although the preferred embodiments have been described above, the present invention is not limited to these embodiments and various modifications and changes are possible within the scope of the gist thereof.

[0089] The disclosure of this embodiment includes the following configurations and methods. (Configuration 1) An information processing device characterized by performing, when a first value of a predetermined component calculated from measurement results at predetermined positions in each of a plurality of sample shot regions on a substrate surface of a substrate exceeds a predetermined value, a determination step of determining at least one sample shot region candidate to replace the causing predetermined sample shot region; a calculation step of calculating a second value of the predetermined component when each of the at least one sample shot region candidate is used in place of the predetermined sample shot region; and an output step of outputting the second value corresponding to each of the at least one sample shot region candidate to a display unit. (Configuration 2) The information processing device according to configuration 1, wherein the determination step includes a step of acquiring information indicating that a first value calculated in alignment of a substrate in a lithography device has exceeded a predetermined value. (Configuration 3) The information processing device according to configuration 1 or 2, wherein the determination step includes a step of acquiring information that a first value calculated from a measurement result of a predetermined position in each of a plurality of sample shot areas on the substrate surface by a measurement device has exceeded a predetermined value. (Configuration 4) The information processing device according to any one of configurations 1 to 3, wherein the predetermined component is a shift component, a magnification component, or a rotation component of the substrate surface. (Configuration 5) An information processing device according to any one of configurations 1 to 4, wherein the determination step includes a step of calculating a difference between predicted coordinates and measurement coordinates of a predetermined position in each of a plurality of sample shot areas, a step of calculating an average value of the differences in each of the plurality of sample shot areas, and a step of determining, as the predetermined sample shot area, a sample shot area among the plurality of sample shot areas having the largest difference between the difference and the average value. (Configuration 6) An information processing device according to any one of configurations 1 to 5, wherein the determination step includes a step of determining, as a sample shot area candidate, a shot area that is at least partially included within a circle having a radius that is a predetermined distance from the center of a predetermined sample shot area. (Configuration 7) An information processing device according to any one of configurations 1 to 5, wherein the determination step includes a step of determining shot areas that are in contact with a predetermined side or a predetermined corner of each of the predetermined sample shot areas as sample shot area candidates. (Configuration 8) The information processing apparatus according to any one of configurations 1 to 7, wherein the calculation step includes a step of acquiring measurement results of a predetermined position in each of at least one sample shot area candidate. (Configuration 9) An information processing device according to any one of configurations 1 to 8, further comprising a display unit that displays a first value corresponding to a predetermined sample shot area and a second value corresponding to at least one sample shot area candidate. (Configuration 10) The information processing device according to Configuration 9, wherein the display unit displays a map of the substrate surface in which corresponding first values ​​are indicated by shading in predetermined sample shot areas, and corresponding second values ​​are indicated by shading in at least one sample shot area candidate. (Configuration 11) The information processing device according to Configuration 9, wherein the calculation step includes a step of acquiring measurement results of a predetermined position in each of a plurality of shot areas including at least one sample shot area candidate, and a step of calculating a third value of a predetermined component from the measurement results of the predetermined position in each of the plurality of shot areas, and wherein the display unit displays a map of the substrate surface in which the difference between corresponding first and third values ​​in the predetermined sample shot area is indicated by shading, and in which the difference between corresponding second and third values ​​in each of the at least one sample shot area candidate is indicated by shading. (Configuration 12) An information processing device described in any one of configurations 1 to 11, characterized by performing a process of calculating a fourth value of a predetermined component from measurement results of a predetermined position in each of a plurality of shot areas of a predetermined combination on a substrate surface, and a process of outputting the fourth value corresponding to the predetermined combination to a display unit. (Configuration 13) The information processing device according to configuration 12, further comprising a display unit that displays a fourth value corresponding to the predetermined combination and a user interface for changing the predetermined combination. (Configuration 14) An information processing device according to any one of configurations 1 to 13, wherein the calculation step includes a step of calculating a correction residual when at least one sample shot area candidate is used in place of a predetermined sample shot area, and the output step includes a step of outputting the correction residual corresponding to at least one sample shot area candidate to a display unit. (Configuration 15) A lithography apparatus for forming a pattern of an original on a substrate, the lithography apparatus comprising the information processing apparatus according to any one of configurations 1 to 14. (Configuration 16) A lithography apparatus according to configuration 15, further comprising a measurement unit that measures the position of an alignment mark formed in a shot area on the surface of the substrate. (Method 1) A method for manufacturing an article, comprising the steps of: exposing a substrate using an exposure apparatus equipped with the information processing apparatus described in any one of configurations 1 to 14; developing the exposed substrate; and manufacturing an article from the developed substrate. (Configuration 17) A program that, when executed by a computer, causes the computer to perform the following steps: a determination step of determining at least one sample shot area candidate to replace a causative predetermined sample shot area when a first value of a predetermined component calculated from measurement results at a predetermined position in each of a plurality of sample shot areas on a substrate surface of a substrate exceeds a predetermined value; a calculation step of calculating a second value of the predetermined component when each of the at least one sample shot area candidate is used instead of the predetermined sample shot area; and an output step of outputting the second value corresponding to each of the at least one sample shot area candidate to a display unit. (Method 2) An information processing method comprising: a determination step of determining at least one sample shot area candidate to replace the causative predetermined sample shot area when a first value of a predetermined component calculated from measurement results at a predetermined position in each of a plurality of sample shot areas on a substrate surface of a substrate exceeds a predetermined value; a calculation step of calculating a second value of the predetermined component when each of the at least one sample shot area candidate is used in place of the predetermined sample shot area; and an output step of outputting the second value corresponding to each of the at least one sample shot area candidate to a display unit. [Explanation of symbols]

[0090] 4. Wafer (substrate) 8. Control unit (information processing device) 9 Display section 21 Sample shot area

Claims

1. a determination step of determining at least one sample shot area candidate to replace the causative predetermined sample shot area when a first value of a predetermined component calculated from measurement results at predetermined positions in each of a plurality of sample shot areas on a substrate surface of the substrate exceeds a predetermined value; a calculation step of calculating a second value of the predetermined component when each of the at least one sample shot area candidate is used in place of the predetermined sample shot area; an output step of outputting the second value corresponding to each of the at least one sample shot area candidate to a display unit; An information processing device characterized by performing the above.

2. 2 . The information processing apparatus according to claim 1 , wherein the determining step includes a step of acquiring information indicating that the first value calculated in alignment of the substrate in a lithography apparatus has exceeded the predetermined value.

3. 2. The information processing apparatus according to claim 1, wherein the determining step includes a step of acquiring information that the first value calculated from a measurement result of the predetermined position in each of the plurality of sample shot areas on the substrate surface by a measurement device has exceeded the predetermined value.

4. 2. The information processing apparatus according to claim 1, wherein the predetermined component is a shift component, a magnification component, or a rotation component of the substrate surface.

5. The determining step calculating a difference between predicted coordinates and measured coordinates of the predetermined position in each of the plurality of sample shot areas; calculating an average value of the differences in each of the plurality of sample shot areas; determining, as the predetermined sample shot area, a sample shot area among the plurality of sample shot areas that has the largest difference between the difference and the average value; 2. The information processing apparatus according to claim 1, further comprising:

6. 2. The information processing apparatus according to claim 1, wherein the determining step includes a step of determining, as the sample shot area candidate, a shot area at least a part of which is included within a circle having a radius a predetermined distance from the center of the predetermined sample shot area.

7. 2. The information processing apparatus according to claim 1, wherein the determining step includes a step of determining, as the sample shot area candidate, a shot area that is in contact with a predetermined side or a predetermined corner of each of the predetermined sample shot areas.

8. 2. The information processing apparatus according to claim 1, wherein the calculation step includes a step of acquiring a measurement result of the predetermined position in each of the at least one sample shot area candidate.

9. 2. The information processing apparatus according to claim 1, further comprising: the display unit that displays the first value corresponding to the predetermined sample shot area and the second value corresponding to each of the at least one sample shot area candidate.

10. 10. The information processing apparatus according to claim 9, wherein the display unit displays a map of the substrate surface in which the corresponding first value in the predetermined sample shot area is indicated by shading, and the corresponding second value in each of the at least one sample shot area candidate is indicated by shading.

11. The calculation step acquiring measurement results of the predetermined position in each of a plurality of shot areas including the at least one sample shot area candidate; calculating a third value of the predetermined component from the measurement results of the predetermined position in each of the plurality of shot regions; Including, 10. The information processing apparatus according to claim 9, wherein the display unit displays a map of the substrate surface in which a difference between the corresponding first value and the corresponding third value in the predetermined sample shot area is indicated by shading, and in which a difference between the corresponding second value and the corresponding third value in each of the at least one sample shot area candidate is indicated by shading.

12. calculating a fourth value of a predetermined component from measurement results at predetermined positions in each of a plurality of shot areas of a predetermined combination on the substrate surface; outputting the fourth value corresponding to the predetermined combination to the display unit; 2. The information processing apparatus according to claim 1, wherein the information processing apparatus performs the following steps.

13. 13. The information processing apparatus according to claim 12, further comprising the display unit that displays the fourth value corresponding to the predetermined combination and a user interface for changing the predetermined combination.

14. the calculation step includes a step of calculating a correction residual when each of the at least one sample shot area candidate is used in place of the predetermined sample shot area, 2. The information processing apparatus according to claim 1, wherein the output step includes a step of outputting the correction residual corresponding to each of the at least one sample shot area candidate to the display unit.

15. 1. A lithography apparatus for forming a pattern of an original on a substrate, comprising: A lithography apparatus comprising the information processing device according to any one of claims 1 to 14.

16. 16. The lithography apparatus according to claim 15, further comprising a measurement unit that measures the position of an alignment mark formed in a shot area on a surface of the substrate.

17. exposing a substrate by an exposure apparatus comprising the information processing apparatus according to any one of claims 1 to 14; developing the exposed substrate; manufacturing an article from the developed substrate; A method for manufacturing an article, comprising:

18. When executed by a computer, the computer a determination step of determining at least one sample shot area candidate to replace the causative predetermined sample shot area when a first value of a predetermined component calculated from measurement results at predetermined positions in each of a plurality of sample shot areas on a substrate surface of the substrate exceeds a predetermined value; a calculation step of calculating a second value of the predetermined component when each of the at least one sample shot area candidate is used in place of the predetermined sample shot area; an output step of outputting the second value corresponding to each of the at least one sample shot area candidate to a display unit; A program characterized by causing a computer to perform the following.

19. a determination step of determining at least one sample shot area candidate to replace the causative predetermined sample shot area when a first value of a predetermined component calculated from measurement results at predetermined positions in each of a plurality of sample shot areas on a substrate surface of the substrate exceeds a predetermined value; a calculation step of calculating a second value of the predetermined component when each of the at least one sample shot area candidate is used in place of the predetermined sample shot area; an output step of outputting the second value corresponding to each of the at least one sample shot area candidate to a display unit; An information processing method comprising:

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