Radioisotope production system, target substrate, and target substrate holder

Abstract

To provide a radioisotope manufacturing system capable of automatically loading a target substrate to a target device, the target substrate, and a target substrate holder.SOLUTION: The target substrate loader 110 places a target substrate 10X to be irradiated among the plurality of target substrates 10 on the target device 101. In this case, when the radiation to one target substrate 10 is completed, the radiation to the 10X portion of the next target substrate to be irradiated may be continuously performed. Therefore, it is possible to eliminate the need for an operator to replace the target substrate 10 each time the target substrate 10 is irradiated. In addition, even when a plurality of types of target substrates 10 are present, the target substrate loading device 110 can specify a target substrate 10 of a target type and perform irradiation.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a radioisotope production system, a target substrate, and a target substrate holder. [Background technology]

[0002] Conventionally, target devices for producing radioisotopes using a solid target have been known (see, for example, Patent Document 1). In this type of target device using a solid target, accelerated particles are introduced from an accelerator such as a cyclotron, and a nuclear reaction occurs with elements that make up the solid target, thereby producing radioisotopes within the solid target. The solid target that has undergone the nuclear reaction is then recovered from the target device, and the radioisotope is obtained by processing the solid target, such as by dissolving it using a strong acid or strong base liquid. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 61-246699 Summary of the Invention [Problem to be solved by the invention]

[0004] However, when loading or unloading a target substrate, which is a solid target, into or from a target device, the accelerator must be stopped, radioactivity must be confirmed to have decreased to a predetermined level, and then a worker must enter the shield to perform the work. Therefore, the work of loading a target substrate into the target device involves exposure to radiation. The present invention aims to provide a radioisotope production system that enables automatic loading of a target substrate into a target device, and a target substrate for use in such a radioisotope production system. [Means for solving the problem]

[0005] The radioisotope production system of the present invention comprises a target substrate loading device that holds a plurality of target substrates to be irradiated with a charged particle beam from an accelerator, and a target device that irradiates the target substrates with the charged particle beam from the accelerator, and the target substrate loading device places a target target substrate to be irradiated from among the plurality of target substrates on the target device.

[0006] In a radioisotope production system, a target substrate loading device holds multiple target substrates to be irradiated with a charged particle beam from an accelerator. The target substrate loading device also installs a target substrate to be irradiated from among the multiple target substrates onto the target device. In this case, once irradiation of one target substrate is complete, irradiation of the next target substrate to be irradiated can be performed continuously. This eliminates the need for an operator to replace the target substrate each time a target substrate is irradiated. Furthermore, even when multiple types of target substrates exist, the target substrate loading device can identify the target type and irradiate it. This makes it possible to automatically load target substrates onto the target device.

[0007] The target substrate loading device may include a target substrate holder that holds multiple target substrates, and a transfer unit that removes target substrates from the target substrate holder and places them on the target device. In this case, the transfer unit can place the target substrates from the target substrate holder on the target device without manual intervention by an operator.

[0008] The radioisotope production system may further include a plurality of target devices, and among the plurality of target devices, a target device corresponding to the target substrate may be moved to a position facing the irradiation unit of the charged particle beam, and the target substrate loading device may load the target substrate into the target target device arranged at a position facing the irradiation unit. In this case, if there are multiple types of target substrates, the target devices can be separated by type. As a result, when irradiating multiple types of target substrates, they can be continuously irradiated without performing tasks such as replacing the target substrates.

[0009] The target substrate holder includes a storage unit that stores multiple target substrates arranged in an array direction, a base that supports the storage unit so that it can move in the array direction, and a movement mechanism that moves the storage unit in the array direction. The movement mechanism has a first insertion member and a second insertion member that are inserted by moving forward and backward relative to holes in the storage unit. The first insertion member may be fixed in position relative to the base, and the second insertion member may be movable back and forth relative to the base in the array direction. In this case, the movement mechanism can accurately move multiple target substrates in the array direction with a compact configuration. Furthermore, with this configuration, the movement mechanism can move the target substrates precisely, making it easier to adjust the irradiation order, for example, when setting the irradiation order depending on the type of target substrate.

[0010] The target substrate may have an identification shape indicating identification information, the identification shape having at least one of a groove and a protrusion, and the target substrate holder may have a shape corresponding to the identification shape at the location where the target substrate is to be installed. In this case, if a target substrate with incorrect identification information is installed at a specific location on the target substrate holder, the identification shape on the target substrate will not match the shape on the target substrate holder, and the target substrate will not be installed properly. In this case, the worker can easily notice that the installation location is incorrect.

[0011] The identification information may indicate the nuclide of the target substrate, which allows the nuclide of the target substrate to be easily identified.

[0012] The radioisotope production system of the present invention comprises a target substrate loading device that holds a plurality of target substrates to be irradiated with a charged particle beam from an accelerator, and a target device that irradiates the target substrates with the charged particle beam from the accelerator, and the target substrate loading device places target substrates having an identification shape that identifies the nuclide on the target device.

[0013] In a radioisotope production system, a target substrate loading device holds multiple target substrates to be irradiated with a charged particle beam from an accelerator. The target substrate loading device also installs target substrates having an identification shape that identifies a nuclide into the target device. In this case, once irradiation of a target substrate of one nuclide is completed, irradiation can be continuously performed on a target substrate of another nuclide identified by the identification shape. This eliminates the need for an operator to replace the target substrate every time the nuclide changes. Furthermore, even when target substrates of multiple nuclide types exist, the target substrate loading device can easily and correctly identify the target substrate of the target nuclide by its identification shape and perform irradiation. As a result, automatic loading of target substrates into the target device is possible.

[0014] The target substrate according to the present invention is a target substrate used in a radioisotope production system, and has identification information indicating a target nuclide.

[0015] The target substrate has identification information indicating the target nuclide. This allows the target nuclide of the target substrate to be easily identified. In this way, by using a target substrate whose target nuclide can be easily identified, automatic loading of the target substrate into the target device becomes possible.

[0016] The identification information may be indicated by a groove cut into the edge of the target substrate. A protrusion corresponding to the groove of the identification information is provided in the installation location of the target substrate on the target substrate holder. If a target substrate with different identification information is installed in such an installation location, the groove on the target substrate and the protrusion on the target substrate holder will not match, and the installation will not be successful. In this case, the worker can easily notice that the installation location is incorrect.

[0017] The target substrate holder of the present invention is a target substrate holder that holds multiple target substrates, and includes a storage section that stores the multiple target substrates lined up in an arrangement direction, a base section that supports the storage section so that it can move in the arrangement direction, and a moving mechanism that moves the storage section in the arrangement direction, wherein the moving mechanism has a first insertion member and a second insertion member that are inserted by moving forward and backward into a hole in the storage section, and the first insertion member is fixed in position relative to the base section, and the second insertion member is capable of moving back and forth in the arrangement direction relative to the base section.

[0018] In the target substrate holder, the moving mechanism is compact and can move multiple target substrates accurately in the arrangement direction. Furthermore, with this configuration, the moving mechanism can move the target substrates precisely, making it easier to adjust the irradiation order, for example, when setting the irradiation order depending on the type of target substrate. As a result, using this target substrate holder enables automatic loading of target substrates into the target device.

[0019] The target substrate holder can hold a target substrate having an identification shape that indicates identification information, including at least one of a groove and a protrusion. In this case, if a target substrate with incorrect identification information is placed in a specific location on the target substrate holder, the target substrate cannot be placed properly by making the identification shape on the target substrate mismatch with the shape on the target substrate holder. In this case, the worker can easily notice that the placement is incorrect. [Effects of the Invention]

[0020] According to the present invention, it is possible to provide a radioisotope production system that enables automatic loading of a target substrate into a target device, as well as a target substrate and a target substrate holder used in such a radioisotope production system. [Brief explanation of the drawings]

[0021] [Figure 1] 1 is a side view schematically showing a radioisotope manufacturing system according to an embodiment. [Figure 2] 1 is a plan view schematically showing a radioisotope manufacturing system according to an embodiment. [Figure 3] 1 is a plan view schematically showing a radioisotope manufacturing system according to an embodiment. [Figure 4] 10 is a conceptual diagram for explaining an operation of a target substrate loading device when loading a target substrate onto a target device. FIG. [Figure 5] 10 is a conceptual diagram for explaining an operation of a target substrate loading device when loading a target substrate onto a target device. FIG. [Figure 6] FIG. 2 is a perspective view of a target substrate holder. [Figure 7] FIG. 2 is a perspective view of a target substrate holder. [Figure 8] FIG. 10 is a cross-sectional perspective view for explaining an identification shape. [Figure 9] FIG. 10 is a conceptual diagram for explaining a movement mechanism. [Figure 10] FIG. 10 is a conceptual diagram for explaining a movement mechanism. DETAILED DESCRIPTION OF THE INVENTION

[0022] A radioisotope production system 100 according to this embodiment will be described with reference to the drawings. FIG. 1 is a side view schematically illustrating the radioisotope production system 100. FIGS. 2 and 3 are side views schematically illustrating the radioisotope production system 100. FIG. 2 is an enlarged plan view of one target device 101. As shown in the figure, the radioisotope production system 100 includes a plurality of target devices 101 (see FIG. 3), a target substrate loading device 110 disposed above the target devices 101, a manifold 201 (irradiation unit) of an accelerator 200, and a control unit 150. The direction in which the charged particle beam B travels is referred to as the forward-backward direction D1. In the forward-backward direction D1, the side toward the accelerator 200 is referred to as the "front" side, and the opposite side is referred to as the "rear" side. A horizontal direction perpendicular to the forward-backward direction D1 is referred to as the lateral direction D2.

[0023] The target device 101 is a device that holds the target substrate 10. The target substrate 10 is, for example, shaped like an oval disk, and a metal layer made of a target material is formed on the surface of the target substrate 10. The target substrate 10 may be compatible with multiple types of nuclides. Examples of the metal layer of the target substrate 10 include Cu, Zr, Ga, and the like. In the radioisotope production process, the target substrate 10 is set in the target device 101, and the target device 101 is moved forward (to the left of the paper) in the forward-backward direction D1 from the state shown in FIGS. 1 and 2. Then, the front end of the target device 101 is inserted into the manifold 201 of the accelerator 200, and the target device 101 is attached to the manifold 201 of the accelerator 200 so that the front end surface of the target device 101 is pressed against the receiving surface of the manifold 201. The target substrate 10 is held in the target device 101 in an orientation tilted about an axis vertical to the irradiation direction of the charged particle beam B. In this state, the accelerator 200 irradiates the target substrate 10 in the target device 101 with a charged particle beam B. At the portion irradiated with the charged particle beam B, a small amount of radioactive isotopes are produced by nuclear reactions in the target material.

[0024] In the radioisotope production system 100 of this embodiment, the target substrate 10 is a meltable metal target, and after irradiation with the charged particle beam B, the target material can be melted in a melting port 202 (see FIG. 3). After the melting operation, the liquid is transferred to a hot cell refinement device (not shown) in the subsequent process.

[0025] As shown in Fig. 2, the target device 101 has a cylindrical shape. The target device 101 includes a main body 2, a front flange 3 provided in front of the main body 2 (upstream of the charged particle beam B), and an intermediate holder 4 provided between the main body 2 and the front flange 3. The main body 2, the intermediate holder 4, and the front flange 3 are divided in the front-rear direction D1. The joint between the main body 2 and the intermediate holder 4 and the joint between the intermediate holder 4 and the front flange 3 exist along a vertical plane that intersects obliquely with the front-rear direction D1.

[0026] The front flange 3 is reciprocatable in the front-rear direction D1 relative to the main body 2, and the intermediate holder 4 is similarly reciprocatable in the front-rear direction D1 relative to the main body 2. To enable such reciprocating movement, the target device 101 is provided with a drive unit (not shown) and a guide bar for guiding the movement. The intermediate holder 4 has a substrate slot 47 (see FIG. 2) for holding the target substrate 10.

[0027] As shown in FIG. 3, the radioisotope producing system 100 has a plurality of target devices 101 arranged in the horizontal direction D2 relative to one manifold 201 of the accelerator 200. In this embodiment, four target devices 101A, 101B, 101C, and 101D are provided. The target devices 101A, 101B, 101C, and 101D can hold target substrates 10 of different nuclides. However, the number of target devices 101 is not particularly limited and may be changed as appropriate depending on the number of nuclides of the target substrates 10. The target devices 101A, 101B, 101C, and 101D are supported by a holder 106. When the holder 106 is moved in the horizontal direction D2 by a drive mechanism (not shown), the target devices 101A, 101B, 101C, and 101D as a whole move in the horizontal direction D2. Among the target devices 101A, 101B, 101C, and 101D, the target device 101 to be irradiated with the charged particle beam B is referred to as the target target device 101X. The target target device 101X is disposed at a position facing the manifold 201 of the accelerator 200 in the front-rear direction D1. The target target device 101X is pressed against the manifold 201 (see the imaginary line in the figure). In the example shown in FIG. 3(a), the target device 101B corresponds to the target target device 101X. In the example shown in FIG. 3(b), the target device 101C corresponds to the target target device 101X. A dissolution port 202 is provided at a position away from the manifold 201 in the lateral direction D2. The dissolution port 202 is a port against which the target target device 101X is pressed after irradiation, and which dissolves the metal layer of the target target substrate 10X with a solution.

[0028] The control unit 150 controls the overall operation of the radioisotope manufacturing system 100. The control unit 150 controls the operation of the target substrate loading device 110 and the operation of the target device 101.

[0029] Next, the target substrate loading device 110 will be described. As shown in Figures 1 and 2, the target substrate loading device 110 is a device that holds a plurality of target substrates 10 (see Figure 1) and loads the target substrates 10 into a target target device 101X. The target substrate loading device 110 places a target target substrate 10X to be irradiated from among the plurality of target substrates 10 into the target target device 101X. The target substrate loading device 110 places the target target substrate 10X on the manifold 201 by loading the target target substrate 10X into the target target device 101X.

[0030] As shown in FIG. 1, the target substrate loading device 110 includes a target substrate holder 103 and a transfer unit 102. Below, a reference axis A is set as shown in FIG. 2 and is used to explain the positional relationship of each unit. In a plan view, the reference axis A extends in a direction perpendicular to the target substrate 10 held by the target device 101. The target substrate holder 103 holds multiple target substrates 10 arranged parallel to each other in the direction in which the reference axis A extends. The detailed configuration of the target substrate holder 103 will be described later. The transfer unit 102 removes a target target substrate 10X from the target substrate holder 103 and places it on the target target device 101X. The transfer unit 102 includes a base unit 102a, an arm unit 102b, and a chuck unit 102c. The base unit 102a is a member that supports the arm unit 102b and the chuck unit 102c. The arm portion 102b is a member that supports the chuck portion 102c. The upper end of the arm portion 102b is supported by the base portion 102a. The arm portion 102b is extendable and retractable in the vertical direction. The chuck portion 102c grips the target substrate 10X. The position where the target target device 101X receives the target target substrate 10X is referred to as a loading position PG1. At this time, the transfer portion 102 is positioned above the loading position PG1. The target substrate holder 103 also moves so that the target target substrate 10X, one of the multiple target substrates 10, is positioned above the loading position PG1.

[0031] 4 and 5, the operation of the target substrate loading device 110 when loading a target target substrate 10X into a target target device 101X will be described. As shown in FIG. 4(a), the target substrate holder 103 moves so that the target target substrate 10X is positioned above the loading position PG1. At this time, the arm portion 102b of the transfer unit 102 is positioned so that the chuck portion 102c does not interfere with the target substrate holder 103. As shown in FIG. 4(b), the transfer unit 102 extends the arm portion 102b downward and grips the target target substrate 10X in the target substrate holder 103 with the chuck portion 102c.

[0032] As shown in Figure 5(a), after the transfer unit 102 grasps the target substrate 10X with the chuck unit 102c, it retracts the arm unit 102b and moves the target substrate 10X upward. The target substrate holder 103 moves in the lateral direction D2 and retreats (see also the target substrate holder 103 shown by the imaginary line in Figure 3). As shown in Figure 5(b), after the target substrate holder 103 has retreated, the transfer unit 102 extends the arm unit 102b downward and loads the target substrate 10X into the loading position PG1 of the target device 101X.

[0033] Next, the configuration of the target substrate holder 103 will be described in more detail with reference to Figures 6 and 7. Figures 6 and 7 are perspective views of the target substrate holder 103. As shown in Figure 6, the target substrate holder 103 includes a slide portion 20, a base portion 21, and an accommodation portion 25.

[0034] The slide portion 20 is a member configured to be slidable in the lateral direction D2 relative to a wall portion W (see FIG. 3 ) on which the manifold 201 is provided. The base portion 21 is a member that supports the box portion 22 and the rack portion 23 so that they can move in the arrangement direction D3. The base portion 21 is connected to the slide portion 20 via a connecting portion 24. As a result, when the slide portion 20 moves in the lateral direction D2, the base portion 21, the box portion 22, and the rack portion 23 move in the lateral direction D2 together with the slide portion 20. The base portion 21 extends along an arrangement direction D3 that is inclined with respect to the front-rear direction D1 and the lateral direction D2. The arrangement direction D3 is the direction in which the target substrates 10 are arranged within the rack portion 23. The base portion 21 has an upper wall portion 26 that extends horizontally and a side wall portion 27 that extends downward from the edge of the upper wall portion 26.

[0035] The storage section 25 is a member that stores multiple target substrates 10 lined up in the arrangement direction D3. The storage section 25 includes a box section 22 and a rack section 23. The box section 22 is a member that detachably supports the rack section 23 that holds the target substrates 10. The box section 22 includes a bottom wall section 30 and a pair of side walls 31, 32. The side wall section 31 extends upward from an edge of the bottom wall section 30 and is provided so as to face the side wall section 27 of the base section 21. The side wall section 32 extends upward from an edge of the bottom wall section 30 opposite the side wall section 31. A guide member 33 extending in the arrangement direction D3 is provided on the side wall section 27 of the base section 21 (see FIG. 7). The side wall section 31 has a slide section that is slidable along the guide member 33. This allows the box portion 22 to move together with the rack portion 23 relative to the base portion 21 in the arrangement direction D3.

[0036] The rack portion 23 is a member that stores multiple target substrates 10 lined up in the arrangement direction D3 and is detachable from the box portion 22. The rack portion 23 includes a bottom wall portion 34 and a pair of side walls 36 and 37. The bottom wall portion 34 is supported on the bottom wall portion 30. The side wall portion 36 extends upward from an edge of the bottom wall portion 34 and is supported by the inner circumferential surface of the side wall portion 31. The side wall portion 37 extends upward from an edge of the bottom wall portion 34 opposite the side wall portion 36 and is supported by the inner circumferential surface of the side wall portion 32. A handle portion 38 is provided at one end of the rack portion 23 in the arrangement direction D3. An operator can attach or detach the rack portion 23 to or from the box portion 22 by holding the handle portion 38 and sliding it in the arrangement direction D3.

[0037] As shown in FIG. 7 , a plurality of grooves 40 for holding target substrates 10 are formed on the inner peripheral surface of the rack portion 23. The grooves 40 are spaced apart at a predetermined pitch in the arrangement direction D3. The grooves 40 extend in a direction perpendicular to the arrangement direction D3 on the upper surface of the bottom wall portion 34 and extend in the vertical direction on the inner peripheral surfaces of the side wall portions 36 and 37. The target substrates 10 held in the grooves 40 are arranged so that their long sides extend horizontally and their short sides extend vertically. In this embodiment, the rack portion 23 holds target substrates 10A, 10B, 10C, and 10D of four types of nuclides.

[0038] Next, the identifiability of the target substrate 10 will be described with reference to FIG. 8. FIG. 8 is a cross-sectional perspective view of the rack unit 23. As shown in FIG. 8(a), the target substrate 10 has an identification feature 50 indicating identification information. The identification information may indicate the nuclide of the target substrate 10. Alternatively, other information may be used as the identification information. The identification feature 50 has at least one of a groove and a protrusion. In this embodiment, the identification feature 50 has a groove. The identification feature 50 is formed on a portion of the edge of the target substrate 10. That is, the overall shape (outline) of the target substrate 10 is the same regardless of the type, and the identification feature 50 indicates the identification information by the difference in the shape of a portion of the overall shape. In this embodiment, the identification feature 50 is formed on the edge of the target substrate 10 that is positioned on the bottom wall 34 when the target substrate 10 is held by the rack unit 23. The identification feature 50 is formed by a groove cut into the edge in a U-shape.

[0039] The target substrate holder 103 has a shape 51 corresponding to the identification shape 50 in the groove 40 in which the target substrate 10 is placed. In this embodiment, the shape 51 is formed by a protrusion formed in the groove 40 of the bottom wall 34. The shape 51 is set to a position and size such that it fits into the identification shape 50 when the target substrate 10 is placed in the groove 40. This allows the target substrate loading device 110 to place the target substrate 10 having the identification shape 50 for identifying a nuclide on the target device 101X.

[0040] In this embodiment, the identification features 50 distinguish the identification information depending on their positions on the edge of the target substrate 10. In the example shown in FIG. 8, three types of identification information are distinguished depending on the positions of the features 50, 51. As shown in FIG. 8(a), the features 50, 51 for the target substrate 10D containing Zr are positioned closer to the sidewall 37. As shown in FIG. 8(b), the features 50, 51 for the target substrate 10B containing Ga are positioned closer to the sidewall 36. As shown in FIG. 8(c), the features 50, 51 for the target substrate 10C containing Cu are positioned between the features 50, 51 representing Zr and the features 50, 51 representing Ga.

[0041] As described above, each groove 40 can accommodate a target substrate 10 having a corresponding identification shape 50. If a target substrate 10 having a different identification shape 50 is placed in the groove 40, the target substrate 10 will float from the groove 40, making it impossible to fully insert the target substrate 10 into the groove. As shown in FIG. 7 , an arch member 42 is provided at the upper end of one end of the box portion 22 in the arrangement direction D3. When the rack portion 23 is inserted into the box portion 22, it passes through the space below the arch member 42. The height of the lower surface of the arch member 42 is set to a height that allows the upper edge of the target substrate 10 to be inserted without contacting the arch member 42 when the target substrate 10 is placed in the groove 40 without floating. On the other hand, the height of the lower surface of the arch member 42 is set to a height that allows the upper edge of the target substrate 10 to contact the arch member 42 when the target substrate 10 is placed floating from the groove 40. Therefore, if the target substrate 10 is placed in the wrong groove 40, the raised target substrate 10 will interfere with the arch member 42 when the rack portion 23 is inserted into the box portion 22. This allows the worker to notice that the target substrate 10 has been placed in the wrong groove 40.

[0042] The target substrate loading device 110 must place a target substrate 10 of a desired nuclide above the loading position PG1 as the target target substrate 10X and place it at a position for removal by the transfer unit 102. For example, in the state shown in FIG. 2, the target substrate 10D is assumed to be the target target substrate 10X for the next irradiation. At this time, the target substrate loading device 110 must slide the target substrate holder 103 in the arrangement direction D3 to position the target substrate 10D above the loading position PG1. As described above, the nuclide of the target substrate 10 to be placed is determined corresponding to the groove 40. Therefore, the control unit (not shown) can determine which of the multiple grooves 40 should be placed at the loading position PG1 and the position of the desired groove 40, thereby placing the target substrate 10 of the desired nuclide at the loading position PG1. Therefore, with reference to FIG. 7, a mechanism for determining the position of each groove 40 will be described.

[0043] As shown in FIG. 7 , the target substrate loading device 110 includes a position detection unit 60 provided on the base unit 21 side and a marker unit 61 provided on the box unit 22 side. The position detection unit 60 includes a support plate 62 fixed to the upper wall 26 of the base unit 21 and a plurality of position detection sensors 63 provided on the support plate 62 in the arrangement direction D3. The position detection sensors 63 are spaced apart at the same pitch as the pitch of the grooves 40. The position detection sensors 63 have detection units protruding from the lower surface of the support plate 62. The marker unit 61 is configured as a protrusion protruding upward from the upper surface of the side wall 31 of the box unit 22. When the marker unit 61 is positioned below one of the position detection sensors 63, the detection unit of that position detection sensor 63 is pushed up by the marker unit 61. In this case, only one of the multiple position detection sensors 63 emits a detection signal. This allows the control unit to determine the position of the target substrate 10X in the arrangement direction D3, and to determine in which direction and how far the target substrate 10X is from the loading position PG1. Note that the detection method of the position detection unit 60 is not limited to the above, and a non-contact sensor such as a laser may also be used. Other detection methods may also be employed.

[0044] 9 and 10, a description will be given of a movement mechanism 70 for moving the target substrate holder 103 in the arrangement direction D3 so that the target substrate loading device 110 places the target target substrate 10X at the loading position PG1. As shown in FIG. 9(a), the movement mechanism 70 includes a receiving member 71, a first insertion member 72, a second insertion member 73, and a guide portion 74.

[0045] The receiving member 71 has a plurality of holes 71a arranged in the arrangement direction D3. The receiving member 71 is provided in the box portion 22 of the storage portion 25. The plurality of holes 71a are arranged at a constant pitch in the arrangement direction D3 and extend in a direction perpendicular to the arrangement direction D3. The holes 71a receive the insertion members 72 and 73.

[0046] The insertion members 72 and 73 are inserted by moving forward and backward relative to the hole 71a of the receiving member 71. The insertion members 72 and 73 are arranged spaced apart from each other in the arrangement direction D3. The insertion members 72 and 73 have a piston and a cylinder. There is no particular limitation on the method of driving the insertion members 72 and 73, but they may be moved by magnetic action. Of these, the first insertion member 72 is fixed in position relative to the base portion 21. The second insertion member 73 is capable of reciprocating in the arrangement direction D3 relative to the base portion 21. The second insertion member 73 is capable of reciprocating in the arrangement direction D3 by moving along a guide portion 74 extending in the arrangement direction D3.

[0047] The operation of the movement mechanism 70 when moving the storage unit 25 from the state shown in FIG. 9(a) to one side in the arrangement direction D3 (the left side of the drawing) will be described. In the state shown in FIG. 9(a), the second insertion member 73 is positioned close to the first insertion member 72, and both insertion members 72 and 73 are inserted into the hole 71a. Next, as shown in FIG. 9(b), the first insertion member 72 contracts, thereby releasing the insertion from the hole 71a. The position of the end of the storage unit at this time is defined as the reference position SL1. Next, as shown in FIG. 10(a), with only the second insertion member 73 inserted into the hole 71a, the second insertion member 73 moves along the guide portion 74 toward the opposite side from the first insertion member 72. As a result, the end of the storage unit 25 moves from the reference position SL1 by the movement amount of the second insertion member 73. The second insertion member 73 may move by a multiple of the pitch of the hole 71a. Here, the second insertion member 73 moves by one pitch of the hole 71a.

[0048] Next, as shown in FIG. 10(b), the first insertion member 72 is inserted into the new hole 71a. Next, as shown in FIG. 10(c), the second insertion member 73 contracts, thereby releasing its insertion into the hole 71a. In this state, the second insertion member 73 moves toward the first insertion member 72. Here, the second insertion member 73 moves by one pitch of the hole 71a. The second insertion member 73 is inserted into the hole 71a again, returning to the state shown in FIG. 9(a). By repeating these operations, the storage section 25 repeatedly moves by a multiple of the pitch of the hole 71a (here, one pitch).

[0049] Next, an example of the operation of the radioisotope production system 100 will be described. First, an operator prepares target substrates 10A, 10B, 10C, and 10D of four types of nuclides in a hot lab. Next, the operator places the target substrates 10A, 10B, 10C, and 10D in the designated grooves 40 of the rack unit 23 in the hot lab. The operator inserts the rack unit 23 into the box unit 22, thereby completing preparation of the target substrate holder 103. Next, the control unit 150 acquires data of a pre-created manufacturing procedure. The manufacturing procedure includes information on the order and time intervals in which the target substrates 10A, 10B, 10C, and 10D of the four types of nuclides are processed. However, the manufacturing procedure may also be determined each time by the operator's operation. The control unit 150 determines the target substrate 10X to be irradiated for the first time, and moves the accommodation unit 25 using the movement mechanism 70 so that the target substrate 10X can be removed by the transfer unit 102 (see FIGS. 9 and 10). The control unit 150 also moves the target device 101X to the position of the manifold 201 (see FIG. 3). After each movement is completed, the control unit 150 moves the target substrate holder 103 to the loading position PG1 and performs the operations shown in FIGS. 4 and 5. After the first irradiation of the target target substrate 10X is completed, the control unit 150 sends the target liquid to the hot lab through the dissolving port 202 (see FIG. 3). The control unit 150 also returns the dissolved target target substrate 10X to the target substrate holder 103. Next, the control unit 150 determines the target substrate 10X to be irradiated for the second time, and repeats the same process. When irradiation of all of the target substrates 10 on the target substrate holder 103 is complete, the worker removes the rack unit 23 and returns the irradiated target substrates to the hot lab. In this embodiment, the target substrate holder 103 can hold 10 target substrates 10, so that continuous irradiation can be performed up to 10 times without returning the target substrate holder 103 to the hot lab midway. Note that the number of target substrates 10 that the target substrate holder 103 can hold is not particularly limited, as long as it is plural.

[0050] The effects of the radioisotope producing system 100 described above will be described.

[0051] In the radioisotope production system 100, the target substrate loading device 110 holds a plurality of target substrates 10 to be irradiated with a charged particle beam B from the accelerator 200. The target substrate loading device 110 also installs a target substrate 10X to be irradiated from among the plurality of target substrates 10 onto the target device 101. In this case, once irradiation of one target substrate 10 is completed, irradiation of the next target substrate 10X to be irradiated can be performed consecutively. This eliminates the need for an operator to replace the target substrate 10 each time the target substrate 10 is irradiated. Furthermore, even when there are multiple types of target substrates 10, the target substrate loading device 110 can identify the target type of target substrate 10 and perform irradiation. As described above, automatic loading of target substrates 10 onto the target device 101 is possible.

[0052] The target substrate loading device 110 may include a target substrate holder 103 that holds a plurality of target substrates 10, and a transfer unit 102 that removes a target substrate 10X from the target substrate holder 103 and places it on the target device 101. In this case, the transfer unit 102 can place the target substrate 10 from the target substrate holder 103 on the target device 101 without manual intervention by an operator.

[0053] The radioisotope manufacturing system 100 further includes a plurality of target devices 101, and among the plurality of target devices 101, a target target device 101X corresponding to a target target substrate 10X may be moved to a position facing a manifold 201, which is an irradiation unit of the charged particle beam B, and the target substrate loading device 110 may load the target target substrate 10X into the target target device 101X arranged at a position facing the manifold 201. In this case, when there are multiple types of target substrates 10, the target devices 101 can be separated by type. As a result, when irradiating multiple types of target substrates 10, irradiation can be performed continuously without performing work such as replacing the target substrates 10.

[0054] The target substrate holder 103 includes a storage unit 25 that stores multiple target substrates 10 arranged in the arrangement direction D3, a base unit 21 that supports the storage unit 25 so that it can move in the arrangement direction D3, and a movement mechanism 70 that moves the storage unit 25 in the arrangement direction D3. The movement mechanism 70 has a first insertion member 72 and a second insertion member 73 that are inserted into holes 71a of the storage unit 25 by moving them forward and backward. The first insertion member 72 may be fixed in position relative to the base unit 21, and the second insertion member 73 may be reciprocally movable in the arrangement direction D3 relative to the base unit 21. In this case, the movement mechanism 70 has a compact configuration and can accurately move multiple target substrates 10 in the arrangement direction D3. Furthermore, with this configuration, the movement mechanism 70 can move the target substrates 10 precisely, making it easier to adjust the irradiation order, for example, when setting the irradiation order depending on the type of target substrate 10.

[0055] For example, a comparative example may be a target substrate holder that extends diagonally upward relative to the loading position PG1 of the target device 101. This target substrate holder holds multiple target substrates in the order in which they are loaded, starting from the bottom. In this comparative example, a tall target substrate holder is located above the target device 101. If such a target device and target substrate holder were covered with a shielding member, a large amount of unnecessary space would be created above the target device 101 inside the shielding member, resulting in a problem of increased system size. On the other hand, the radioisotope production system 100 according to the present embodiment allows for a more compact configuration above the target device 101 than the comparative example. This reduces unnecessary space inside the shielding member, enabling a more compact system. Furthermore, in the comparative example, once the order of the target substrates is determined, the order of irradiation cannot be changed midway. On the other hand, the movement mechanism 70 of the radioisotope production system 100 according to the present embodiment allows for a high degree of freedom of movement, allowing for the order of irradiation of the target substrates 10 to be changed midway.

[0056] The target substrate 10 has an identification shape 50 indicating identification information, and the identification shape 50 has at least one of a groove and a protrusion, and the target substrate holder 103 may have a shape 51 corresponding to the identification shape 50 at the location where the target substrate 10 is to be installed. In this case, if a target substrate 10 with incorrect identification information is installed in a specific location (here, the groove 40) on the target substrate holder 103, the identification shape 50 on the target substrate 10 and the shape 51 on the target substrate holder 103 will not match, and installation will not be successful. In this case, the worker can easily notice that the installation location is incorrect.

[0057] The identification information may indicate the nuclide of the target substrate 10. This allows the nuclide of the target substrate 10 to be easily identified.

[0058] The radioisotope manufacturing system 100 of this embodiment includes a target substrate loading device 110 that holds a plurality of target substrates 10 to be irradiated with a charged particle beam B from an accelerator 200, and a target device 101 that irradiates the target substrates 10 with the charged particle beam B from the accelerator 200, and the target substrate loading device 110 places a target substrate 10 having an identification shape 50 that identifies a nuclide on the target device 101.

[0059] In the radioisotope production system 100, the target substrate loading device 110 holds multiple target substrates 10 to be irradiated with a charged particle beam B from the accelerator 200. The target substrate loading device 110 also installs target substrates 10 having an identification shape 50 for identifying a nuclide into the target device 101. In this case, once irradiation of a target substrate 10 of a certain nuclide is completed, irradiation of a target substrate 10 of another nuclide identified by the identification shape 50 can be performed successively. This eliminates the need for an operator to replace the target substrate 10 each time a nuclide changes. Furthermore, even when target substrates 10 of multiple nuclide types are present, the target substrate loading device 110 can easily and correctly identify the target substrate 10 of the target nuclide by its identification shape and perform irradiation. As described above, automatic loading of target substrates 10 into the target device 101 is possible.

[0060] The target substrate 10 according to this embodiment is a target substrate 10 used in a radioisotope production system 100, and has identification information indicating the target nuclide.

[0061] The target substrate 10 has identification information indicating the target nuclide, which makes it possible to easily identify the target nuclide of the target substrate 10. In this way, by using the target substrate 10 whose target nuclide can be easily identified, it becomes possible to automatically load the target substrate into the target device 101.

[0062] The identification information may be indicated by a groove cut out from the edge of the target substrate 10. A protrusion corresponding to the groove of the identification information is provided at the installation location of the target substrate 10 on the target substrate holder 103. If a target substrate 10 with different identification information is installed in such an installation location, the groove on the target substrate 10 and the protrusion on the target substrate holder 103 will not match, and the installation will not be successful. In this case, the worker can easily notice that the installation location is incorrect.

[0063] The target substrate holder 103 of this embodiment comprises a storage section 25 that stores multiple target substrates 10 lined up in an arrangement direction D3, a base section 21 that supports the storage section 25 so that it can move in the arrangement direction D3, and a moving mechanism 70 that moves the storage section 25 in the arrangement direction D3, and the moving mechanism 70 has a first insertion member 72 and a second insertion member 73 that are inserted by moving forward and backward into the hole 71a of the storage section 25, and the first insertion member 72 is fixed in position relative to the base section 21, and the second insertion member 73 is movable back and forth in the arrangement direction D3 relative to the base section 21.

[0064] In the target substrate holder 103, the moving mechanism 70 has a compact configuration and can accurately move multiple target substrates 10 in the arrangement direction D3. Furthermore, with such a configuration, the moving mechanism 70 can move the target substrates 10 precisely, making it easier to adjust the irradiation order, for example, when setting the irradiation order depending on the type of target substrate 10. As described above, by using this target substrate holder 103, it becomes possible to automatically load target substrates 10 into the target device 101.

[0065] The target substrate holder 103 can hold a target substrate 10 having an identification shape 50 that indicates identification information including at least one of a groove and a protrusion. In this case, if a target substrate 10 with incorrect identification information is placed in a specific location on the target substrate holder 103, the placement can be prevented by making the identification shape on the target substrate 10 different from the shape on the target substrate holder 103. In this case, the worker can easily notice that the placement location is incorrect.

[0066] The present invention can be implemented in various forms, including the above-described embodiment, with various modifications and improvements based on the knowledge of those skilled in the art. Furthermore, it is also possible to configure modified forms by utilizing the technical matters described in the above-described embodiment. The configurations of the respective embodiments may be used in appropriate combination.

[0067] For example, the method for recovering the irradiated target substrate 10 is not particularly limited, and a structure in which the target substrate 10 is dropped from the target device 101 may be adopted.

[0068] The configuration of the moving mechanism 70 that moves the accommodation portion 25 of the target substrate holder 103 is not limited to the above-described embodiment, and any structure may be adopted as long as it is a mechanism that can load the target substrate 10X into the target device 101X. Furthermore, the method of transferring the target substrate 10X from the target substrate holder 103 to the target device 101X is not limited to the transfer portion 102 described above, and a free-fall method, for example, may also be adopted.

[0069] In the above embodiment, a plurality of target devices 101 are provided, but it may be one. [Explanation of symbols]

[0070] 10...target substrate, 21...base portion, 25...accommodation portion, 70...moving mechanism, 72...first insertion member, 73...second insertion member, 100...radioisotope production system, 101...target device, 102...transfer portion, 103...target substrate holder, 110...target substrate loading device, 200...accelerator, 201...manifold (irradiation portion).

Claims

1. a target substrate loading device that holds a plurality of target substrates to be irradiated with a charged particle beam from an accelerator; a target device that irradiates the target substrate with a charged particle beam from an accelerator, The target substrate loading device places a target substrate to be irradiated from among the plurality of target substrates onto the target device.

2. the target substrate loading device, a target substrate holder for holding a plurality of target substrates; 2. The radioisotope manufacturing system according to claim 1, further comprising: a transfer unit that removes the target substrate from the target substrate holder and places it on the target device.

3. Further comprising a plurality of said target devices; Among the plurality of target devices, a target device corresponding to the target substrate is moved to a position facing an irradiation unit of the charged particle beam; 2. The radioisotope manufacturing system according to claim 1, wherein the target substrate loading device loads the target substrate onto the target target device disposed at a position facing the irradiation unit.

4. The target substrate holder comprises: a housing section that houses the plurality of target substrates in a state where the target substrates are arranged in an arrangement direction; a base portion that supports the storage portion so that the storage portion is movable in the arrangement direction; a moving mechanism that moves the storage unit in the arrangement direction, the movement mechanism includes a first insertion member and a second insertion member that are inserted into the hole of the accommodation portion by moving forward and backward relative to the hole, the first insertion member is fixed in position relative to the base portion; The radioisotope manufacturing system according to claim 2 , wherein the second insertion portion is reciprocally movable relative to the base portion in the arrangement direction.

5. the target substrate has an identification shape that indicates identification information; the identification shape has at least one of a groove and a protrusion, The radioisotope manufacturing system according to claim 2 , wherein the target substrate holder has a shape corresponding to the identification shape at a location where the target substrate is to be placed.

6. The radioisotope production system according to claim 5 , wherein the identification information indicates the nuclide of the target substrate.

7. a target substrate loading device that holds a plurality of target substrates to be irradiated with a charged particle beam from an accelerator; a target device that irradiates the target substrate with a charged particle beam from an accelerator, The target substrate loading device places the target substrate, which has an identification shape that identifies a nuclide, on the target device.

8. A target substrate for use in a radioisotope production system, the target substrate having identification information indicating a target nuclide.

9. The target substrate according to claim 8 , wherein the identification information is indicated by a groove cut out from an edge of the target substrate.

10. A target substrate holder for holding a plurality of target substrates, a housing section that houses the plurality of target substrates in a state where the target substrates are arranged in an arrangement direction; a base portion that supports the storage portion so that the storage portion is movable in the arrangement direction; a moving mechanism that moves the storage unit in the arrangement direction, the movement mechanism includes a first insertion member and a second insertion member that are inserted into the hole of the accommodation portion by moving forward and backward relative to the hole, the first insertion member is fixed in position relative to the base portion; The second insertion portion is reciprocally movable relative to the base portion in the arrangement direction.

11. The target substrate holder according to claim 10 , capable of holding the target substrate having an identification shape that indicates identification information, the identification shape including at least one of a groove and a protrusion.

Images