Camera module and method for manufacturing camera module

Abstract

To provide a camera module capable of performing active alignment and suppressing occurrence of flare failure due to disturbance light, and to provide a method of manufacturing the camera module.SOLUTION: A camera module includes an optical system that forms an image, an imaging element that captures the image, a substrate that has a main surface having an upper step surface and a lower step surface forming a step and a connecting surface connecting the upper step surface and the lower step surface, the lower step surface being outside the upper step surface, and on which the imaging element is mounted, a holding body that includes a cylindrical portion having an end surface closer to the lower step surface than the upper step surface and separated from the connecting surface, and holds the optical system, and a cured product of an ultraviolet curable resin that bonds the end surface to the lower step surface and has translucency.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a camera module and a method for manufacturing the camera module. [Background technology]

[0002] Patent Document 1 discloses a camera module. In the camera module, a lens forms an image of a subject, and a solid-state imaging element converts the formed image of the subject into an electrical signal. A lens barrel and a lens holder are cylindrical members that hold a lens and an IR cut filter. The solid-state imaging element is mounted on a wiring board. The lens holder is fixed to the wiring board with an adhesive. A convex portion is formed on the lens holder. A notch is formed on the wiring board. The convex portion fits into the notch (paragraphs 0036-0039, 0041-0042 and 0046-0047). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-278515 Summary of the Invention [Problem to be solved by the invention]

[0004] In the camera module disclosed in Patent Document 1, a convex portion formed on the lens holder fits into a notch formed in the wiring board. This makes it difficult to move the lens barrel and lens holder that hold the lens and IR cut filter relative to the wiring board on which the solid-state imaging element is mounted. This makes it difficult to perform active alignment to adjust the optical axes of the lens and solid-state imaging element.

[0005] To perform active alignment in the camera module disclosed in Patent Document 1, a gap is formed between the lens holder and the wiring board, and the adhesive is an ultraviolet (UV) curable resin or a UV-curable / thermosetting resin. However, if a gap is formed between the lens holder and the wiring board and the adhesive is a light-transmitting UV-curable resin or a UV-curable / thermosetting resin, ambient light passing through the gap and penetrating the adhesive may be incident on the image sensor. Furthermore, ambient light passing through the gap and penetrating the adhesive may be reflected by a lens or an IR cut filter, generating reflected light, which may then be incident on the image sensor. This may result in flare defects.

[0006] In view of this problem, an aspect of the present disclosure has been made, and an object of the aspect of the present disclosure is to provide a camera module and a method for manufacturing the camera module that are capable of performing active alignment and suppressing the occurrence of flare defects due to ambient light, for example. [Means for solving the problem]

[0007] A camera module according to a first aspect of the present disclosure comprises an optical system that forms an image, an imaging element that captures the image, a substrate having a main surface with upper and lower surface that form a step and a connecting surface that connects the upper and lower surface, the lower surface being located outside the upper surface, on which the imaging element is mounted, a holder that holds the optical system and has a tubular portion that has an end surface that is closer to the lower surface than the upper surface and is spaced from the connecting surface, and a cured product of ultraviolet-curable resin that is translucent and has the end surface bonded to the lower surface.

[0008] A camera module according to a second aspect of the present disclosure comprises an optical system that forms an image, an imaging element that captures the image, a substrate having a main surface with upper and lower surface that form a step and a connecting surface that connects the upper and lower surface, the upper surface being located outside the lower surface, and on which the imaging element is mounted, a holder that holds the optical system, the holder having an adherend surface, a tubular portion that has a lower end that is closer to the lower surface than the upper surface and is located inside the adherend surface and separated from the connecting surface, and a cured product of ultraviolet-curable resin that adheres the adherend surface to the upper surface and is translucent.

[0009] The manufacturing method for a camera module of the third aspect of the present disclosure is a manufacturing method for a camera module of the first or second aspect of the present disclosure, and includes: (a) assembling an optical system unit including the optical system and the holder, and an image sensor unit including the image sensor and the substrate; (b) applying a pre-hardening fluid of ultraviolet curing resin to the optical system unit or the image sensor unit; (c) temporarily joining the optical system unit and the image sensor unit to each other via the pre-hardening fluid; (d) adjusting the position and angle of the optical system unit relative to the image sensor unit; and (e) hardening the pre-hardening fluid to change the pre-hardening fluid into the hardened product. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a cross-sectional view schematically illustrating a camera module according to a first embodiment. [Figure 2A] 2 is a cross-sectional view schematically illustrating the structure of the camera module of the first embodiment, in the vicinity of a cured UV resin material provided in the camera module. FIG. [Figure 2B] 2 is a cross-sectional view schematically illustrating the structure of the camera module of the first embodiment, in the vicinity of a cured UV resin material provided in the camera module. FIG. [Figure 2C] 2 is a cross-sectional view schematically illustrating the structure of the camera module of the first embodiment, in the vicinity of a cured UV resin material provided in the camera module. FIG. [Figure 3]4 is a flowchart showing a manufacturing flow of the camera module according to the first embodiment. [Figure 4] FIG. 10 is a cross-sectional view schematically illustrating a camera module according to a second embodiment. [Figure 5A] 10 is a cross-sectional view schematically illustrating the structure of a camera module according to a second embodiment, in the vicinity of a cured UV resin material provided in the camera module. FIG. [Figure 5B] 10 is a cross-sectional view schematically illustrating the structure of a camera module according to a second embodiment, in the vicinity of a cured UV resin material provided in the camera module. FIG. [Figure 6A] 10 is a cross-sectional view schematically illustrating the structure of a camera module according to a second embodiment, in the vicinity of a cured UV resin material provided in the camera module. FIG. [Figure 6B] 10 is a cross-sectional view schematically illustrating the structure of a camera module according to a second embodiment, in the vicinity of a cured UV resin material provided in the camera module. FIG. [Figure 6C] 10 is a cross-sectional view schematically illustrating the structure of a camera module according to a second embodiment, in the vicinity of a cured UV resin material provided in the camera module. FIG. [Figure 7] FIG. 10 is a cross-sectional view schematically illustrating a camera module according to a third embodiment. [Figure 8] FIG. 10 is a cross-sectional view schematically illustrating a camera module according to a fourth embodiment. [Figure 9] FIG. 13 is a cross-sectional view schematically illustrating a camera module according to a first modified example of the fourth embodiment. [Figure 10] FIG. 13 is a cross-sectional view schematically illustrating a camera module according to a second modified example of the fourth embodiment. [Figure 11] FIG. 13 is a cross-sectional view schematically illustrating a camera module according to a second modified example of the fifth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the drawings, the same or equivalent elements are designated by the same reference numerals, and redundant description will be omitted.

[0012] 1. First embodiment 1.1 Camera module Fig. 1 is a cross-sectional view schematically illustrating a camera module according to a first embodiment, and also illustrates X, Y, and Z axes that define a three-dimensional Cartesian coordinate system.

[0013] Hereinafter, the directions parallel to the X-axis, Y-axis, and Z-axis will be referred to as the X-direction, Y-direction, and Z-direction, respectively. Also, the directions around the X-axis, Y-axis, and Z-axis will be referred to as θ X direction, θ Y Direction and θ Z are called directions.

[0014] The camera module 1 of the first embodiment shown in Fig. 1 forms an image of an object, captures the image of the formed object, and outputs an image signal corresponding to the image of the object. The camera module 1 is incorporated into a smartphone. The camera module 1 may also be incorporated into a mobile communication terminal other than a smartphone. The camera module 1 may also be incorporated into a device other than a mobile communication terminal.

[0015] As shown in FIG. 1, the camera module 1 includes an optical system unit 11, an imaging element unit 12, and a cured product 13 of ultraviolet (UV) curable resin.

[0016] The optical system unit 11 forms an image of an object.

[0017] The imaging element unit 12 captures an image of a focused object and outputs an image signal corresponding to the image of the object. The imaging element unit 12 is separated from the optical system unit 11. Therefore, a gap 21 is formed between the optical system unit 11 and the imaging element unit 12.

[0018] The cured UV-curable resin 13 bonds the optical system unit 11 to the imaging element unit 12. The cured UV-curable resin 13 is disposed in the gap 21. The UV-curable resin is a UV-curable resin or a combined UV-curable and heat-curable resin. If the UV-curable resin is a UV-curable resin, the cured UV-curable resin 13 is obtained by irradiating a pre-curing fluid of the UV-curable resin with UV to cure the pre-curing fluid of the UV-curable resin. If the UV-curable resin is a combined UV-curable and heat-curable resin, the cured UV-curable resin 13 is obtained by irradiating a pre-curing fluid of the UV-curable resin with UV and heating to cure the pre-curing fluid of the UV-curable resin. The cured UV-curable resin 13 is translucent because it is obtained by irradiating a pre-curing fluid of the UV-curable resin with UV or by irradiating with UV and heating the pre-curing fluid of the UV-curable resin. Therefore, ambient light L coming from outside the camera module 1 passes through the cured UV-curable resin 13.

[0019] 1.2 Optical unit As shown in FIG. 1, the optical system unit 11 includes a lens 31, an infrared cut filter (IRCF) 32, a lens barrel 33, a holder , and a resin layer .

[0020] The lens 31 transmits light coming from an object and focuses the transmitted light. In this way, the lens 31 forms an image of the object. The lens 31 has an optical axis 31a. The optical axis 31a coincides with the Z axis.

[0021] The IRCF 32 transmits the light that has passed through the lens 31. The IRCF 32 cuts out infrared components from the light that is transmitted.

[0022] The lens barrel 33 has a cylindrical shape. Therefore, an intra-cylinder space 33a is formed in the lens barrel 33. The intra-cylinder space 33a accommodates the lens 31. The lens barrel 33 holds the lens 31. The lens barrel 33 has a accommodated portion 41 accommodated in the holder 34. The accommodated portion 41 is on the side where the imaging element unit 12 is arranged.

[0023] The holder 34 has a cylindrical shape. Therefore, an internal space 34a is formed in the holder 34. The internal space 34a accommodates the IRCF 32, the resin layer 35, and the accommodated portion 41. The holder 34 holds the IRCF 32.

[0024] The resin layer 35 bonds the accommodated portion 41 to the holder 34 .

[0025] As a result, an optical system including lens 31 and IRCF 32 is held by a holder including lens barrel 33, holder 34, and resin layer 35. The optical system may be an optical system other than an optical system including lens 31 and IRCF 32. The holder may be a holder other than a holder including lens barrel 33, holder 34, and resin layer 35.

[0026] The optical system unit 11 may include a drive mechanism that drives all or part of the lens 31 in the Z direction. This allows the camera module 1 to have an autofocus function. The optical system unit 11 may include a drive mechanism that drives part of the lens 31 in the X and Y directions. This allows the camera module 1 to have a lens-shift type image stabilization function. The optical system unit 11 may include a drive mechanism that drives part of the lens 31 in the θ X Direction and θ Y In this way, the camera module 1 can be provided with a lens tilt type image stabilization function.

[0027] 1.3 Image sensor unit As shown in FIG. 1, the imaging element unit 12 includes an imaging element 51 and a substrate 52.

[0028] The imaging element 51 has a light receiving surface 51a. The light receiving surface 51a receives light that has passed through the IRCF 32. An image of an object is formed on the light receiving surface 51a. The imaging element 51 captures the formed image and outputs an image signal corresponding to the image of the object. The imaging element 51 is a complementary metal-oxide semiconductor (CMOS) image sensor, a charge-coupled device (CCD) image sensor, or the like.

[0029] The imaging element 51 is mounted on the substrate 52. As a result, the substrate 52 supports the imaging element 51 and is electrically connected to the imaging element 51. By electrically connecting the substrate 52 to the imaging element 51, an image signal output by the imaging element 51 is input to the substrate 52. The substrate 52 outputs the input image signal.

[0030] The imaging element unit 12 may include a drive mechanism that drives the imaging element 51 in the X and Y directions. This allows the camera module 1 to be provided with a sensor-shift type image stabilization function. X Direction and θ Y In this way, the camera module 1 can be provided with a sensor tilt type image stabilization function.

[0031] 1.4 Adhesion of holder to substrate and suppression of flare defects As shown in FIG. 1, the holder 34 includes a cylindrical portion 61 .

[0032] The cylindrical portion 61 has a cylindrical shape. The cylindrical portion 61 is on the side where the imaging element unit 12 is disposed. Therefore, the cylindrical portion 61 has an end face 61a and an inner peripheral surface 61b. The end face 61a has a rectangular annular shape and is located outside the opening 34b of the intra-cylinder space 34a of the holder 34 when viewed from the subject side of the optical axis 31a of the lens 31, and is disposed along the outer periphery of the opening 34b, surrounding the opening 34b. The end face 61a may have an annular shape other than a rectangular annular shape. The end face 61a is generally perpendicular to the optical axis 31a of the lens 31. The central axis of the end face 61a generally coincides with the optical axis 31a. The inner peripheral surface 61b defines the intra-cylinder space 34a.

[0033] The substrate 52 has a first main surface 52a and a second main surface 52b. The first main surface 52a and the second main surface 52b are located on opposite sides to each other. The first main surface 52a is located on the side where the optical system unit 11 is disposed. The second main surface 52b is located on the side opposite to the side where the optical system unit 11 is disposed.

[0034] The first main surface 52a of the substrate 52 has an upper surface 52c, a lower surface 52d, and a connecting surface 52e. The upper surface 52c has a rectangular planar shape. The lower surface 52d has a rectangular frame-like planar shape. When viewed from the subject side of the optical axis 31a of the lens 31, it is located outside the upper surface 52c, is arranged along the outer periphery of the upper surface 52c, and surrounds the upper surface 52c. The upper surface 52c may have a planar shape other than a rectangular planar shape, and the lower surface 52d may have a planar shape other than a rectangular frame-like planar shape. The lower surface 52d is generally parallel to the light-receiving surface 51a of the image sensor 51. The central axis of the lower surface 52d generally coincides with the central axis of the light-receiving surface 51a. However, if peripheral components are mounted on the upper surface 52c, the central axis of the lower surface 52d may not coincide with the central axis of the light-receiving surface 51a. The upper surface 52c and the lower surface 52d are disposed at different positions in a direction perpendicular to the light receiving surface 51a. Therefore, the upper surface 52c and the lower surface 52d form a step 71. The connecting surface 52e connects the upper surface 52c and the lower surface 52d. The imaging element 51 is mounted on the upper surface 52c.

[0035] The cured UV-curable resin 13 bonds the end surface 61a of the cylindrical portion 61 to the lower surface 52d of the substrate 52. The cured UV-curable resin 13 is disposed in a first gap 81 formed between the end surface 61a and the lower surface 52d, is sandwiched between the end surface 61a and the lower surface 52d, and is in contact with the end surface 61a and the lower surface 52d. The cured UV-curable resin 13 may extend to the outside of the first gap 81, or may extend to a second gap 82 formed between the inner circumferential surface 61b of the cylindrical portion 61 and the connecting surface 52e of the substrate 52.

[0036] The end surface 61a of the cylindrical portion 61 is closer to the lower surface 52d of the substrate 52 than to the upper surface 52c of the substrate 52, and is located midway in the Z direction between the position where the upper surface 52c is located and the position where the lower surface 52d is located. Therefore, when the inside of the camera module 1 is viewed from the outside of the camera module 1 through the first gap 81, the connecting surface 52e of the substrate 52, i.e., the step 71, is visible. Therefore, the disturbance light L that passes through the first gap 81 and the cured product 13 of the UV-curable resin is blocked by the step 71. This makes it possible to prevent the disturbance light L from entering the lens 31, the IRCF 32, the image sensor 51, etc. This makes it possible to prevent flare defects caused by the disturbance light L.

[0037] In the first embodiment, the step 71 is a single step formed by two surfaces, namely, the upper surface 52c and the lower surface 52d of the substrate 52. However, the step 71 may be a step of two or more steps formed by three or more surfaces, namely, the upper surface 52c, the lower surface 52d, and the middle surface of the substrate 52.

[0038] 1.5 Active alignment As described above, the end surface 61a of the cylindrical portion 61 is generally perpendicular to the optical axis 31a of the lens 31. The central axis of the end surface 61a is generally located at a position determined by design relative to the optical axis 31a. The lower surface 52d of the substrate 52 is generally parallel to the light receiving surface 51a of the imaging element 51. The central axis of the lower surface 52d is generally aligned with the central axis of the light receiving surface 51a and is located at a position determined by design relative to the central axis of the light receiving surface 51a. However, due to variations in the shapes of the lens 31, lens barrel 33, holder 34, image sensor 51, substrate 52, etc., it is not possible to completely realize the following states: the end face 61a is perpendicular to the optical axis 31a, the central axis of the end face 61a is located at a position determined by design relative to the optical axis 31a, the lower surface 52d is parallel to the light-receiving surface 51a, and the central axis of the lower surface 52d is located at a position determined by design relative to the central axis of the light-receiving surface 51a. For this reason, even when the optical system unit 11 is bonded to the image sensor unit 12 so that the end face 61a and the lower surface 52d are parallel to each other and the central axes of the end face 61a and the lower surface 52d coincide with each other, problems such as optical axis misalignment still occur. For this reason, active alignment is required to adjust the position and angle of the optical system unit 11 relative to the image sensor unit 12.

[0039] The cylindrical portion 61 is separated from the connecting surface 52e of the substrate 52. This allows the optical system unit 11 to be moved in the X and Y directions relative to the image sensor unit 12 before the pre-curing fluid of the UV curable resin, which is the precursor of the cured product 13 of the UV curable resin, is cured. This enables active alignment in six axes.

[0040] 1.6 Height of the end face of the cylindrical part 2A, 2B, and 2C are cross-sectional views that schematically illustrate the structure of the camera module of the first embodiment in the vicinity of a cured UV resin material provided in the camera module.

[0041] 2A, in the Z direction, the end surface 61a of the cylindrical portion 61 is located at a lower limit position close to the position where the lower surface 52d of the substrate 52 is located. In addition, in the Z direction, the cured product 13 of the UV curable resin has a minimum thickness close to zero.

[0042] 2B, the end surface 61a of the cylindrical portion 61 is located at a design position in the Z direction that is midway between an upper limit position close to the position where the upper surface 52c of the substrate 52 is located and a lower limit position close to the position where the lower surface 52d of the substrate 52 is located. In addition, the cured product 13 of the UV-curable resin has a design thickness in the Z direction that is close to half the height of the step 71.

[0043] 2C, in the Z direction, the end surface 61a of the cylindrical portion 61 is located at an upper limit position close to the position where the upper surface 52c of the substrate 52 is located. In addition, in the Z direction, the cured product 13 of the UV curable resin has a maximum thickness close to the height of the step 71.

[0044] 2A, 2B, and 2C, the end surface 61a of the cylindrical portion 61 is positioned lower in the Z direction than the position where the upper step surface 52c is positioned, so that the step 71 hides the lens 31, the IRCF 32, the image sensor 51, etc.

[0045] 1.7 Camera module manufacturing FIG. 3 is a flowchart showing the flow of manufacturing the camera module of the first embodiment.

[0046] When the camera module 1 is assembled, steps S101 to S105 shown in FIG. 3 are performed.

[0047] In step S101, the optical system unit 11 and the image sensor unit 12 are assembled.

[0048] In the following step S102, a pre-curing fluid of UV curable resin is applied to the image sensor unit 12. The optical system unit 11 may also be applied with a pre-curing fluid of UV curable resin.

[0049] In the subsequent step S103, the optical system unit 11 and the image sensor unit 12 are temporarily joined to each other via the pre-curing fluid of the applied UV curable resin. In a state in which the optical system unit 11 and the image sensor unit 12 are temporarily joined to each other with the pre-curing fluid of the UV curable resin sandwiched therebetween, one of the optical system unit 11 and the image sensor unit 12 can be moved relative to the other of the optical system unit 11 and the image sensor unit 12.

[0050] In the next step S104, the position and angle of the optical system unit 11 relative to the image sensor unit 12 are adjusted. This allows focus adjustment and optical axis adjustment of the camera module 1. The position adjustment is performed in the X direction, Y direction, and Z direction. The angle adjustment is performed in θ X direction, θ Y Direction and θ Z It is done in terms of direction.

[0051] In the following step S105, the pre-curing fluid of the UV curable resin is cured, and the pre-curing fluid of the UV curable resin is converted into a cured product of the UV curable resin 13. As a result, the optical system unit 11 and the image sensor unit 12 are joined to each other with the cured product of the UV curable resin 13 sandwiched between them. When the optical system unit 11 and the image sensor unit 12 are joined with the cured product of the UV curable resin 13 sandwiched between them, one of the optical system unit 11 and the image sensor unit 12 cannot be moved relative to the other of the optical system unit 11 and the image sensor unit 12. If the UV curable resin is a UV-curable resin, the pre-curing fluid of the UV curable resin is irradiated with UV when curing the pre-curing fluid of the UV curable resin. If the UV curable resin is a UV-curable and heat-curable resin, the pre-curing fluid of the UV curable resin is irradiated with UV and heated when curing the pre-curing fluid of the UV curable resin. The pre-curing fluid of the UV curable resin is pre-cured by UV irradiation, and a pre-cured product of the UV curable resin is obtained. By heating, the temporarily cured UV curable resin is fully cured, and a cured UV curable resin 13 is obtained.

[0052] By performing steps S101 to S105, the camera module 1 is manufactured in which the optical system unit 11 is actively aligned with the image sensor unit 12 and the focus and optical axis are adjusted.

[0053] 2. Second embodiment The following describes the differences between the second embodiment and the first embodiment. For points that are not described, the second embodiment also employs the same configuration as that employed in the first embodiment.

[0054] FIG. 4 is a cross-sectional view schematically illustrating a camera module according to the second embodiment.

[0055] In the camera module 2 of the second embodiment shown in FIG. 4, a protrusion 91 is formed on the inner circumferential surface 61b of the cylindrical portion 61. The region of the inner circumferential surface 61b where the protrusion 91 is formed protrudes further toward the optical axis 31a of the lens 31 and the central axis of the inner circumferential surface 61b than the region of the inner circumferential surface 61b where the protrusion 91 is not formed. Therefore, the protrusion 91 overlaps with the second gap 82 when viewed from the subject side of the optical axis 31a of the lens 31. The protrusion amount of the protrusion 91 is determined so that the protrusion 91 overlaps with the entire second gap 82 when viewed from the subject side of the optical axis 31a of the lens 31. The protrusion 91 has a surface 91a on the side where the second gap 82 is located. The surface 91a is located closer to the upper surface 52c of the substrate 52 than the light receiving surface 51a of the image sensor 51 in the Z direction. Therefore, the disturbance light L that passes through the first gap 81 and the cured product 13 of the UV curable resin, but is not blocked by the step 71 and passes through the second gap 82, is blocked by the overhang 91. This makes it possible to further prevent the disturbance light L from entering the lens 31, the IRCF 32, the image sensor 51, etc. This makes it possible to further prevent flare defects from occurring due to the disturbance light L.

[0056] In the Z direction, the distance from the upper surface 52c of the substrate 52 to the protrusion 91 is longer than the distance from the lower surface 52d of the substrate 52 to the end surface 61a of the cylindrical portion 61. As a result, the protrusion 91 is spaced apart from the upper surface 52c of the substrate 52 regardless of the position of the optical system unit 11 relative to the image sensor unit 12 in the Z direction.

[0057] 5A and 5B are cross-sectional views that schematically illustrate the structure of the camera module according to the second embodiment, in the vicinity of a cured UV resin material provided in the camera module.

[0058] 5A, in the Z direction, end surface 61a of cylindrical portion 61 is located at a lower limit position close to the position where lower surface 52d of substrate 52 is located. Also, in the Z direction, cured product 13 of the UV curable resin has a minimum thickness close to zero.

[0059] 5B, the end surface 61a of the cylindrical portion 61 is located at a design position in the Z direction that is midway between an upper limit position close to the position where the upper surface 52c of the substrate 52 is located and a lower limit position close to the position where the lower surface 52d of the substrate 52 is located. In addition, the cured product 13 of the UV-curable resin has a design thickness in the Z direction that is close to half the height of the step 71.

[0060] 5A and 5B, in the Z direction, the lower end of the protrusion 91 is located at a position higher than the position at which the upper surface 52c of the substrate 52 is located. Therefore, the protrusion 91 does not come into contact with the upper surface 52c of the substrate 52 and does not interfere with the step 71.

[0061] 6A, 6B, and 6C are cross-sectional views that schematically illustrate the structure of the camera module according to the second embodiment, in the vicinity of a cured UV resin material provided in the camera module.

[0062] 6A, the end face 61a of the cylindrical portion 61 is disposed at the outermost position in the radial direction of the holder 34, in the X or Y direction, from a design position where the entire end face 61a of the cylindrical portion 61 overlaps with the cured product 13 of the UV-curable resin, as viewed from the subject side of the optical axis 31a of the lens 31. Even in this state, the overhang 91 overlaps with the entire second gap 82, as viewed from the subject side of the optical axis 31a of the lens 31. Therefore, the overhang 91 can block ambient light L that has passed through the second gap 82.

[0063] 6B, the end surface 61a of the cylindrical portion 61 is arranged in a design position in the X or Y direction such that the entire end surface 61a of the cylindrical portion 61 overlaps with the cured product 13 of the UV curable resin when viewed from the subject side of the optical axis 31a of the lens 31. In this state, the overhang 91 overlaps with the entire second gap 82 when viewed from the subject side of the optical axis 31a of the lens 31. Therefore, the overhang 91 can block ambient light L that has passed through the second gap 82.

[0064] 6C, the end face 61a of the cylindrical portion 61 is disposed at the innermost position radially inward of the holder 34 from the design position where the entire end face 61a of the cylindrical portion 61 overlaps with the cured product 13 of the UV-curable resin, as viewed from the subject side of the optical axis 31a of the lens 31. In this state, the cylindrical portion 61 contacts the connecting surface 52e of the substrate 52, and the second gap 82 is not formed. Therefore, the ambient light L does not pass through the second gap 82.

[0065] 3 Third embodiment The following describes the differences between the third embodiment and the second embodiment. For points that are not described, the third embodiment also employs the same configuration as that employed in the second embodiment.

[0066] FIG. 7 is a cross-sectional view schematically illustrating a camera module according to the third embodiment.

[0067] In the camera module 3 of the third embodiment shown in FIG. 7 , the protrusion 91 has a surface 91a on the side where the second gap 82 is disposed. A recess 91b is formed on the surface 91a. The recess 91b may be a groove extending linearly in the circumferential direction of the holder 34, or may be a number of dimples arranged in the circumferential direction of the holder 34. Dimples may be formed on the inner surface of the groove. The recess 91b diffusely reflects and attenuates light that enters the recess 91b. Therefore, ambient light L that passes through the second gap 82 and is blocked by the protrusion 91 enters the recess 91b and is attenuated. This further prevents the ambient light L from entering the lens 31, the IRCF 32, the image sensor 51, etc. This further prevents flare defects caused by the ambient light L.

[0068] 4 Fourth embodiment The following describes the differences between the fourth embodiment and the third embodiment. For points that are not described, the fourth embodiment also employs the same configuration as that employed in the third embodiment.

[0069] FIG. 8 is a cross-sectional view schematically illustrating a camera module according to the fourth embodiment.

[0070] In the camera module 4 of the fourth embodiment shown in Fig. 8, the recess 91b has a first depth at a first position P1 and a second depth that is deeper than the first depth at a second position P2 that is farther from the optical axis 31a of the lens 31 than the first position P1. For example, the inner surface of the recess 91b is a slope represented by a straight line in a cross section including the optical axis 31a of the lens 31, and the depth of the recess 91b continuously deepens with increasing distance from the optical axis 31a. Alternatively, the inner surface of the recess 91b is a slope represented by an arc in a cross section including the optical axis 31a, and the depth of the recess 91b continuously deepens with increasing distance from the optical axis 31a. The inner surface of the recess 91b reflects incident light in a direction away from the optical axis 31a. Therefore, disturbance light L that passes through the second gap 82, is blocked by the protrusion 91, and enters the inside of the recess 91b, is reflected by the inner surface of the recess 91b, and travels in a direction away from the optical axis 31a, and in a direction away from the lens 31, the IRCF 32, the image sensor 51, etc. This makes it possible to further prevent the disturbance light L from entering the lens 31, the IRCF 32, the image sensor 51, etc. This makes it possible to further prevent flare defects caused by the disturbance light L.

[0071] FIG. 9 is a cross-sectional view schematically illustrating a camera module according to a first modified example of the fourth embodiment.

[0072] In a camera module 4a according to a first modified example of the fourth embodiment shown in FIG. 9, a hole 52f is formed in the substrate 52. The hole 52f penetrates the substrate 52 in the thickness direction, extending from the first main surface 52a of the substrate 52 to the second main surface 52b of the substrate 52. The hole 52f has a planar shape smaller than the planar shapes of the IRCF 32 and the image sensor 51. The IRCF 32 is mounted on the first main surface 52a of the substrate 52, supported by the outer edge of the hole 52f, and blocks the hole 52f. The image sensor 51 is mounted on the second main surface 52b of the substrate 52, supported by the outer edge of the hole 52f, and blocks the hole 52f. The hole 52f allows light that has passed through the IRCF 32 to pass through. The image sensor 51 receives the light that has passed through the hole 52f. The image sensor 51 is flip-chip bonded to the second main surface 52b. In the Z direction, the surface 91a of the protrusion 91 is disposed closer to the exit surface 32b of the IRCF 32 than to the entrance surface 32a of the IRCF 32. This makes it possible to suppress the incidence of stray light from the entrance surface 32a of the IRCF 32.

[0073] FIG. 10 is a cross-sectional view schematically illustrating a camera module according to a second modified example of the fourth embodiment.

[0074] In a camera module 4b according to a second modification of the fourth embodiment shown in FIG. 10, an upper surface 52c of a substrate 52 has a rectangular frame shape. A first main surface 52a of the substrate 52 has a lower surface 52g that is surrounded by the upper surface 52c when viewed from the subject side of the optical axis 31a of the lens 31. An IRCF 32 is mounted on the first main surface 52a of the substrate 52 and supported by the upper surface 52c. An imaging element 51 is mounted on the lower surface 52g. A surface 91a of the protrusion 91 is positioned closer to an exit surface 32b of the IRCF 32 than to an entrance surface 32a of the IRCF 32 in the Z direction. This configuration suppresses stray light from entering the entrance surface 32a of the IRCF 32.

[0075] Modifications similar to those made in the first or second modified example of the fourth embodiment may be made in the first, second or third embodiment.

[0076] 5 Fifth embodiment The following describes the differences between the fifth embodiment and the first embodiment. For points that are not described, the fifth embodiment also employs the same configuration as that employed in the first embodiment.

[0077] FIG. 11 is a cross-sectional view schematically illustrating a camera module according to the fifth embodiment.

[0078] In the camera module 5 of the fifth embodiment shown in Fig. 11, the holder 34 includes a flange portion 62. The flange portion 62 has a flange-like shape extending radially outward from the cylindrical portion 61. The flange portion 62 has an adhered surface 62a. The adhered surface 62a is included on the lower surface of the flange portion 62 and exists along the outer periphery of the flange portion 62. The adhered surface 62a may also be included on the surface of a structure other than the flange portion 62 having a flange-like shape.

[0079] In the fifth embodiment, the lower surface 52d has a rectangular planar shape. The upper surface 52c has a rectangular frame-like planar shape. When viewed from the subject side of the optical axis 31a of the lens 31, the upper surface 52c is located outside the lower surface 52d, is arranged along the outer periphery of the lower surface 52d, and surrounds the lower surface 52d. The lower surface 52d may have a planar shape other than a rectangular planar shape, and the upper surface 52c may have a planar shape other than a rectangular frame-like planar shape. The upper surface 52c is generally parallel to the light receiving surface 51a of the image sensor 51. The central axis of the upper surface 52c generally coincides with the central axis of the light receiving surface 51a. However, if peripheral components are mounted on the lower surface 52d, the central axis of the upper surface 52c may not coincide with the central axis of the light receiving surface 51a. The upper surface 52c and the lower surface 52d are disposed at different positions in a direction perpendicular to the light receiving surface 51a. Therefore, the upper surface 52c and the lower surface 52d form a step 71. The connecting surface 52e connects the upper surface 52c and the lower surface 52d. The imaging element 51 is mounted on the lower surface 52.

[0080] The cured UV-curable resin 13 bonds the adherend surface 62a of the flange portion 62 to the upper surface 52c of the substrate 52. The cured UV-curable resin 13 is disposed in a first gap 111 formed between the adherend surface 62a and the upper surface 52c, is sandwiched between the adherend surface 62a and the upper surface 52c, and is in contact with the adherend surface 62a and the upper surface 52c. The cured UV-curable resin 13 may extend to the outside of the first gap 111, or may extend to a second gap 112 formed between the outer circumferential surface 61d of the tubular portion 61 and the connecting surface 52e of the substrate 52.

[0081] The lower end 61e of the cylindrical portion 61 is closer to the lower surface 52d of the substrate 52 than to the upper surface 52c of the substrate 52, and is located midway in the Z direction between the position where the upper surface 52c is located and the position where the lower surface 52d is located. Therefore, when the inside of the camera module 5 is viewed from the outside of the camera module 5 through the first gap 111, the outer peripheral surface 61d of the cylindrical portion 61 is visible. Therefore, the disturbance light L that passes through the first gap 111 and the cured product 13 of the UV-curable resin is blocked by the cylindrical portion 61. This makes it possible to prevent the disturbance light L from entering the lens 31, the IRCF 32, the image sensor 51, etc. This makes it possible to prevent flare defects caused by the disturbance light L.

[0082] In the fifth embodiment, the step 71 is a single step formed by two surfaces, namely, the upper surface 52c and the lower surface 52d of the substrate 52. However, the step 71 may be a step of two or more steps formed by three or more surfaces, namely, the upper surface 52c, the lower surface 52d, and the middle surface of the substrate 52.

[0083] The present disclosure is not limited to the above-described embodiments, and may be replaced with a configuration that is substantially the same as the configuration shown in the above-described embodiments, a configuration that has the same effect, or a configuration that can achieve the same purpose. [Explanation of symbols]

[0084] 1,2,3,4,4a,4b,5 Camera module 11 Optical unit 12 Image sensor unit 13 Cured ultraviolet (UV) cured resin 21 Gap 31 Lens 31a Optical axis 32 Infrared Cut Filter (IRCF) 32a Incident surface 32b Exit surface 33 Lens barrel 33a Cylinder space 34 Holder 34a Cylinder space 34b opening 35 Resin layer 41 Detained Part 51 Image sensor 51a Photosensitive surface 52 PCB 52a first principal surface 52b Second main surface 52c Upper surface 52d Lower level 52e Contact surface 52f hole 52g bottom surface 61 Cylindrical part 62 Flange 61a End face 61b Inner surface 61d Outer surface 61e bottom edge 62a Adhesive surface 71 Steps 81 First Gap 82 Second Gap 91 Overhang 91a side 91b Recess 111 First Gap 112 Second Gap P1 First position P2 Second position L Ambient light

Claims

1. an optical system for forming an image; an imaging element that captures the image; a substrate having a main surface with upper and lower step surfaces that form a step and a connecting surface that connects the upper and lower step surfaces, the lower step surface being located outside the upper step surface, and on which the imaging element is mounted; a holder for holding the optical system, the holder having a cylindrical portion having an end surface located closer to the lower surface than the upper surface and spaced from the connecting surface; a cured product of an ultraviolet curable resin that adheres the end surface to the lower surface and has light-transmitting properties; A camera module comprising:

2. the optical system has an optical axis; The cylindrical portion has an inner circumferential surface, A gap is formed between the inner circumferential surface and the connecting surface, A protrusion is formed on the inner circumferential surface, the protrusion overlapping the gap when viewed from the subject side of the optical axis. The camera module of claim 1 .

3. In the optical axis direction, the distance from the upper surface to the protrusion is longer than the distance from the lower surface to the end surface. The camera module according to claim 2 .

4. the overhang has a surface on the side where the gap is located; A recess is formed on the surface.

4. The camera module according to claim 2 or 3.

5. The recess has a first depth at a first position and a second depth that is deeper than the first depth at a second position that is farther from the optical axis than the first position. The camera module according to claim 4 .

6. an optical system for forming an image; an imaging element that captures the image; a substrate having a main surface with upper and lower step surfaces that form a step and a connecting surface that connects the upper and lower step surfaces, the upper step surface being located outside the lower step surface, and on which the imaging element is mounted; a holder having an adherend surface, a cylindrical portion having a lower end located closer to the lower surface than the upper surface, and located inside the adherend surface and separated from the connecting surface, the holder holding the optical system; a cured product of an ultraviolet curable resin that adheres the adherend surface to the upper surface and has translucency; A camera module comprising:

7. A method for manufacturing a camera module according to any one of claims 1 to 3 and 6, comprising the steps of: (a) assembling an optical system unit including the optical system and the holder, and an image pickup element unit including the image pickup element and the substrate; (b) applying a pre-cured fluid of ultraviolet curable resin to the optical system unit or the image pickup element unit; (c) temporarily joining the optical system unit and the image sensor unit to each other via the pre-hardening fluid; and (d) adjusting the position and angle of the optical system unit relative to the image sensor unit; (e) curing the pre-hardening fluid to convert the pre-hardening fluid into the hardened material; A method for manufacturing a camera module comprising:

Images