Power conversion device

Abstract

To provide a technique capable of reducing high-frequency radiation noise accompanying a switching operation of a switching circuit.SOLUTION: The power conversion device 1 according to the present embodiment includes a diode bridge circuit 22 in which a plurality of rectifier diodes RD1 and RD2, a plurality of rectifier diodes RD3 and RD4, and a plurality of rectifier diodes RD5 and RD6 of an upper arm and a lower arm connected in series are connected in parallel, and an invertor circuit 42 including semi-conductor switches SW1 to SW6, capacitors 22P and connected in series so as to connect positive-side and negative-side power source lines and in the diode bridge circuit 22, capacitors and connected in series so as to connect positive-side and negative-side power source lines and in the invertor circuit 42 to each other, and a bypass electric path that connects a neutral point of the capacitor and a neutral point of the capacitor to each other, and a neutral point of the capacitor and a neutral point of the to each other. C3pn 22N C4pn C3pn C2pn C4pn 42N C1pn 35L C1pn 42P C2pn.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a power conversion device. [Background technology]

[0002] BACKGROUND ART Conventionally, there is known a technique for reducing high frequency radiation noise that accompanies the switching operation of a switching circuit (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-010308 Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, it is desirable to further reduce high frequency radiation noise that accompanies the switching operation of the switching circuit.

[0005] In view of the above-mentioned problems, an object of the present invention is to provide a technique capable of reducing high-frequency radiation noise that accompanies the switching operation of a switching circuit. [Means for solving the problem]

[0006] In order to achieve the above object, in one embodiment of the present disclosure, a bridge circuit in which a plurality of legs, each including two diodes of an upper arm and a lower arm connected in series, are connected in parallel; a DC line including a positive line and a negative line, one end of which is connected to the bridge circuit; an inverter circuit connected to the other end of the DC line and including a semiconductor switch; a first series-connected body provided to connect the positive line and the negative line, in which two capacitance components are connected in series; a second series-connected body provided to connect the positive line and the negative line on the inverter circuit side of the first series-connected body, the second series-connected body including two capacitance components connected in series; an electric path connecting the neutral points of the two capacitance components of the first series-connected body and the second series-connected body, A power converter is provided. [Effects of the Invention]

[0007] According to the above-described embodiment, it is possible to reduce high-frequency radiation noise caused by the switching operation of the switching circuit. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a diagram illustrating a configuration of a first example of a power conversion device. [Figure 2] FIG. 2 is an equivalent circuit diagram illustrating an example of a diode bridge circuit. [Figure 3] FIG. 10 is a diagram illustrating a configuration of a second example of a power conversion device. [Figure 4] FIG. 2 is a top view showing the structure of a first example of a PIM. [Figure 5] FIG. 10 is a top view showing the structure of a second example of a PIM. [Figure 6] FIG. 10 is a diagram illustrating a configuration of a third example of a power conversion device. [Figure 7] FIG. 10 is a top view showing the structure of a third example of a PIM. [Figure 8] FIG. 10 is a side view showing the structure of a third example of a PIM. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an embodiment will be described with reference to the drawings.

[0010] [First example of a power conversion device] The configuration of a first example of a power conversion device 1 according to this embodiment will be described with reference to FIG.

[0011] FIG. 1 is a diagram showing the configuration of a first example of a power conversion device 1. As shown in FIG.

[0012] The power conversion device 1 includes an input terminal 10, a converter module 20, a DC link unit 30, a bypass circuit 35, an inverter module 40, and an output terminal 50.

[0013] The power conversion device 1 converts three-phase AC (specifically, AC having R, S, and T phases) input from the input terminal 10 into three-phase AC (specifically, AC having U, V, and W phases) of a predetermined voltage and frequency, and outputs it from the output terminal 50. This allows the power conversion device 1 to drive a load device connected to the output terminal 50. The load device is, for example, a synchronous motor or an induction motor.

[0014] Input terminal 10 is connected to an external power supply capable of outputting three-phase AC power and receives the three-phase AC power supplied from the external power supply. The external power supply may be, for example, a commercial power supply. Input terminal 10 includes input terminals 10R, 10S, and 10T and a ground terminal 10E.

[0015] The input terminal 10R is electrically connected to an R-phase terminal of an external power supply outside the power conversion device 1. The input terminal 10S is electrically connected to an S-phase terminal of an external power supply outside the power conversion device 1. The input terminal 10T is electrically connected to a T-phase terminal of an external power supply outside the power conversion device 1.

[0016] The ground terminal 10E is used to ground the ground GND of the power conversion device 1. The ground GND is a conductive part corresponding to the reference potential of the power conversion device 1, and is, for example, the housing of the power conversion device 1 or a dedicated reference potential line. Outside the power conversion device 1, one end of a grounding electric path is connected to the ground terminal 10E, and the other end of the grounding electric path is grounded. Inside the power conversion device 1, one end of the ground GND is connected to the ground terminal 10E.

[0017] The converter module 20 converts three-phase AC (i.e., AC of R phase, S phase, and T phase) input from the input terminal 10 into DC and outputs it to the DC link unit 30. The converter module 20 includes an input terminal 21, a diode bridge circuit 22, and an output terminal 23.

[0018] Three-phase AC is input to input terminal 21 from an external power supply through input terminal 10. Input terminal 21 includes input terminals 21R, 21S, and 21T.

[0019] The input terminal 21R is electrically connected to the input terminal 10R outside the converter module 20, and is electrically connected to one end of the power line 22R inside the converter module 20. The input terminal 21S is electrically connected to the input terminal 10S outside the converter module 20, and is electrically connected to one end of the power line 22S inside the converter module 20. The input terminal 21T is electrically connected to the input terminal 10T outside the converter module 20, and is electrically connected to the power line 22T inside the converter module 20.

[0020] The diode bridge circuit 22 converts the three-phase AC input from the input terminal 21 into DC and outputs it to the DC link unit 30 through the output terminal 23. The diode bridge circuit 22 includes rectifier diodes RD1 to RD6, power supply lines 22R, 22S, 22T, and power supply lines 22P, 22N.

[0021] 1, the rectifier diodes RD1 to RD6 form a bridge-type full-wave rectifier circuit. Hereinafter, when the rectifier diodes RD1 to RD6 are not to be distinguished from one another, they may be referred to individually as "rectifier diode RD" for convenience.

[0022] The rectifier diodes RD1 and RD2 are connected in series to form a pair of upper and lower arm legs. Specifically, the rectifier diode RD1 corresponds to the upper arm, and the rectifier diode RD2 corresponds to the lower arm. The rectifier diode RD1 has a cathode electrically connected to the power supply line 22P and an anode electrically connected to the cathode of the rectifier diode RD2. The rectifier diode RD2 has an anode electrically connected to the power supply line 22N and a cathode electrically connected to the anode of the rectifier diode RD1.

[0023] The rectifier diodes RD3 and RD4 are connected in series to form a pair of upper and lower arm legs. Specifically, the rectifier diode RD3 corresponds to the upper arm, and the rectifier diode RD4 corresponds to the lower arm. The rectifier diode RD3 has a cathode electrically connected to the power supply line 22P and an anode electrically connected to the cathode of the rectifier diode RD4. The rectifier diode RD4 has an anode electrically connected to the power supply line 22N and a cathode electrically connected to the anode of the rectifier diode RD3.

[0024] The rectifier diodes RD5 and RD6 are connected in series to form a pair of upper and lower arm legs. Specifically, the rectifier diode RD5 corresponds to the upper arm, and the rectifier diode RD6 corresponds to the lower arm. The rectifier diode RD5 has a cathode electrically connected to the power supply line 22P and an anode electrically connected to the cathode of the rectifier diode RD6. The rectifier diode RD6 has an anode electrically connected to the power supply line 22N and a cathode electrically connected to the anode of the rectifier diode RD5.

[0025] The power supply lines 22R, 22S, and 22T are input sections of the diode bridge circuit 22, and three-phase AC current of R phase, S phase, and T phase is input to the midpoints of the legs of the bridge-type full-wave rectifier circuit.

[0026] Inside the converter module 20, the power supply line 22R has one end electrically connected to the input terminal 21R and the other end electrically connected to the anode of the rectifier diode RD1 and the cathode of the rectifier diode RD2. Inside the converter module 20, the power supply line 22S has one end electrically connected to the input terminal 21S and the other end electrically connected to the anode of the rectifier diode RD3 and the cathode of the rectifier diode RD4. Inside the converter module 20, the power supply line 22T has one end electrically connected to the input terminal 21T and the other end electrically connected to the anode of the rectifier diode RD5 and the cathode of the rectifier diode RD6.

[0027] The power supply lines 22P and 22N are the output section of the diode bridge circuit 22, and output a direct current output from a bridge-type full-wave rectifier circuit formed by the rectifier diodes RD1 to RD6 toward the output terminal .

[0028] One end of the positive-side (i.e., high-voltage side) power supply line 22P is electrically connected to the output terminal 23P and the other end is electrically connected to the cathodes of the rectifier diodes RD1, RD3, and RD5 inside the converter module 20. One end of the negative-side (i.e., low-voltage side) power supply line 22N is electrically connected to the output terminal 23N inside the converter module 20 and the other end is electrically connected to the anodes of the rectifier diodes RD2, RD4, and RD6.

[0029] The output terminal 23 outputs the direct current output from the diode bridge circuit 22 to the DC link unit 30. The output terminal 23 includes output terminals 23P and 23N.

[0030] The output terminal 23P is connected to the power supply line 22P inside the converter module 20, and is electrically connected to a positive line 31P on the positive side (high voltage side) of the DC link unit 30 outside the converter module 20. The output terminal 23N is connected to the power supply line 22N inside the converter module 20, and is electrically connected to a negative line 31N on the negative side (low voltage side) of the DC link unit 30 outside the converter module 20.

[0031] The DC link unit 30 includes a DC line 31 and a smoothing circuit 32 .

[0032] The DC line 31 electrically connects the converter module 20 and the inverter module 40. The DC line 31 includes a positive line 31P on the positive side (high voltage side) and a negative line 31N on the negative side (low voltage side).

[0033] The positive line 31P electrically connects the output terminal 23P of the converter module 20 to the input terminal 41P of the inverter module 40. The negative line 31N electrically connects the output terminal 23N of the converter module 20 to the input terminal 41N of the inverter module 40.

[0034] The smoothing circuit 32 smoothes the DC of the DC line 31. For example, as shown in FIG. 1, the smoothing circuit 32 includes a smoothing capacitor C dc Includes:

[0035] Smoothing capacitor C dc are provided between the positive line 31P and the negative line 31N in such a manner that they are electrically connected to each other. dc is, for example, an electrolytic capacitor. dc The converter module 20 and the inverter module 40 suppress and smooth pulsation of the DC current output from the converter module 20 and the DC current regenerated from the inverter module 40 while repeatedly charging and discharging as needed.

[0036] For example, as shown in Figure 1, a smoothing capacitor C dc One smoothing capacitor C dc A plurality of smoothing capacitors C may be provided. dc When multiple smoothing capacitors C are used, dc may be connected in parallel or in series between the positive line 31P and the negative line 31N. dc is a smoothing capacitor C dcAlternatively, a plurality of such series-connected elements may be connected in parallel between the positive line 31P and the negative line 31N.

[0037] The smoothing circuit 32 includes a smoothing capacitor C dc Additionally, a reactor may be included. The reactor is provided, for example, on the positive line 31P and smoothes the DC output from the converter module 20 and the DC regenerated from the inverter module 40 while generating a voltage to prevent changes in the current as needed.

[0038] The bypass circuit 35 has a bypass function of returning a noise current caused by the switching operation of the inverter circuit 42 to the inverter circuit 42, which is the noise source. pn ,C2 pn ,C3 pn ,C4 pn and a bypass electrical circuit 35L.

[0039] Capacitor C1 pn ,C2 pn are connected in series to electrically connect the power supply line 22P and the power supply line 22N of the diode bridge circuit 22. Specifically, the capacitor C1 pn One electrode of the capacitor C2 is electrically connected to the positive line 31P located closer to the converter module 20 than the smoothing circuit 32, and the other electrode of the capacitor C2 is electrically connected to the positive line 31P located closer to the converter module 20 than the smoothing circuit 32. pn Electrically connected to capacitor C2 pn is connected to the capacitor C1 pn The other electrode is electrically connected to the negative line 31N on the converter module 20 side of the smoothing circuit 32. pn ,C2 pn The series connection electrically connects the power supply line 22P and the power supply line 22N of the diode bridge circuit 22 via the positive line 31P and the negative line 31N that are closer to the converter module 20 than the smoothing circuit 32.

[0040] Capacitor C1 pn ,C2pn The capacitances of the capacitors C1 and C2 are, for example, equal to each other. This makes it possible to suppress an unbalanced state between the positive line 31P and the negative line 31N on the converter module 20 side. pn ,C2 pn The capacities may be different.

[0041] Capacitor C3 pn ,C4 pn are connected in series to electrically connect the power supply lines 42P and 42N of the inverter circuit 42. Specifically, the capacitor C3 pn One electrode of the capacitor C4 is electrically connected to the positive line 31P located closer to the inverter module 40 than the smoothing circuit 32, and the other electrode of the capacitor C4 is electrically connected to the positive line 31P located closer to the inverter module 40 than the smoothing circuit 32. pn Electrically connected to capacitor C4 pn One electrode is connected to the capacitor C3 pn The other electrode is electrically connected to the negative line 31N on the inverter module 40 side of the smoothing circuit 32. That is, in this example, the capacitor C3 pn ,C4 pn The series connection electrically connects the power supply line 42P and the power supply line 42N of the inverter circuit 42 via the portions of the positive line 31P and the negative line 31N that are closer to the inverter module 40 than the smoothing circuit 32.

[0042] Capacitor C3 pn ,C4 pn The capacitances of the capacitors C3 and C4 are, for example, equal to each other. This makes it possible to suppress an unbalanced state between the positive line 31P and the negative line 31N on the inverter module 40 side. pn ,C4 pn The capacities may be different.

[0043] The bypass circuit 35L is connected to the capacitor C1 pn ,C2 pn and capacitor C3 pn ,C4 pnSpecifically, the bypass circuit 35L electrically connects the neutral points of the series-connected capacitors C1 and C2. pn ,C2 pn The electrical path that electrically connects the electrodes of the capacitor C3 pn ,C4 pn The electrodes are electrically connected to the electrical path that electrically connects them.

[0044] The inverter module 40 converts the DC of the DC link unit 30 into three-phase AC of a predetermined voltage and frequency and outputs it to the load device via the output terminal 50 to drive the load device, or converts the three-phase AC into DC during regeneration of the load device and outputs it to the DC link unit 30. The inverter module 40 includes an input terminal 41, an inverter circuit 42, and an output terminal 43.

[0045] The input terminal 41 is electrically connected to the DC line 31 of the DC link unit 30. The input terminal 41 includes input terminals 41P and 41N.

[0046] The input terminal 41P is electrically connected to the positive line 31P outside the inverter module 40, and is electrically connected to the power supply line 42P inside the inverter module 40. The input terminal 41N is electrically connected to the negative line 31N outside the inverter module 40, and is electrically connected to the power supply line 42N inside the inverter module 40.

[0047] Inverter circuit 42 converts DC input from input terminals 41P and 41N into three-phase AC and outputs it toward output terminal 43. Inverter circuit 42 also converts three-phase AC of U phase, V phase, and W phase regenerated from output terminals 43U, 43V, and 43W into DC and outputs it toward input terminal 41. Inverter circuit 42 includes semiconductor switches (also referred to as "switching elements") SW1 to SW6, freewheeling diodes FD1 to FD6, power supply lines 42P and 42N, and power supply lines 42U, 42V, and 42W.

[0048] The semiconductor switches SW1 and SW2, the semiconductor switches SW3 and SW4, and the semiconductor switches SW5 and SW6 configure switch legs of upper and lower arms, respectively, and are connected in parallel between the input terminals 41P and 41N. Hereinafter, when the semiconductor switches SW1 to SW6 are described without distinguishing between them, they may be referred to individually as "semiconductor switches SW" for convenience.

[0049] The semiconductor switch SW1 corresponds to the upper arm, and inside the inverter module 40, one of the two electrodes (in this example, the collector and the emitter) excluding the control electrode (in this example, the base) is electrically connected to the power supply line 42P, and the other electrode is electrically connected to the semiconductor switch SW2. The semiconductor switch SW2 corresponds to the lower arm, and inside the inverter module 40, one of the two electrodes excluding the control electrode is electrically connected to the semiconductor switch SW1, and the other electrode is electrically connected to the power supply line 42N.

[0050] Semiconductor switch SW3 corresponds to the upper arm, and inside inverter module 40, one of two electrodes excluding the control electrode is electrically connected to power supply line 42P, and the other electrode is electrically connected to semiconductor switch SW4. Semiconductor switch SW4 corresponds to the lower arm, and inside inverter module 40, one of two electrodes excluding the control electrode is electrically connected to semiconductor switch SW3, and the other electrode is electrically connected to power supply line 42N.

[0051] Semiconductor switch SW5 corresponds to the upper arm, and inside inverter module 40, one of two electrodes excluding the control electrode is electrically connected to power supply line 42P, and the other electrode is electrically connected to semiconductor switch SW6. Semiconductor switch SW6 corresponds to the lower arm, and inside inverter module 40, one of two electrodes excluding the control electrode is electrically connected to semiconductor switch SW6, and the other electrode is electrically connected to power supply line 42N.

[0052] The semiconductor switch SW is mainly made of silicon (Si), for example. Alternatively, the semiconductor switch SW may be mainly made of a wide bandgap semiconductor material. Examples of wide bandgap semiconductor materials include silicon carbide (SiC), gallium nitride (GaN), gallium oxide (Ga2O3), and carbon (diamond (C)). The semiconductor switch SW is, for example, an insulated gate bipolar transistor (IGBT). Alternatively, the semiconductor switch SW may be a high electron mobility transistor (HEMT), for example.

[0053] The freewheeling diode FD1 is connected in parallel to the semiconductor switch SW1, with its forward direction pointing from the input terminal 41N to the input terminal 41P. The freewheeling diode FD2 is connected in parallel to the semiconductor switch SW2, with its forward direction pointing from the input terminal 41N to the input terminal 41P. The freewheeling diode FD3 is connected in parallel to the semiconductor switch SW3, with its forward direction pointing from the input terminal 41N to the input terminal 41P. The freewheeling diode FD4 is connected in parallel to the semiconductor switch SW4, with its forward direction pointing from the input terminal 41N to the input terminal 41P. The freewheeling diode FD5 is connected in parallel to the semiconductor switch SW5, with its forward direction pointing from the input terminal 41N to the input terminal 41P. The freewheeling diode FD6 is connected in parallel to the semiconductor switch SW6, with its forward direction pointing from the input terminal 41N to the input terminal 41P.

[0054] The power supply lines 42P and 42N correspond to the DC input section of the inverter circuit 42.

[0055] The power supply line 42P is a DC input section on the positive side (high voltage side) of the inverter circuit 42. Specifically, one end of the power supply line 42P is electrically connected to the input terminal 41P. The other end of the power supply line 42P is electrically connected to the semiconductor switch SW1 and the freewheel diode FD1, the semiconductor switch SW3 and the freewheel diode FD3, and the semiconductor switch SW5 and the freewheel diode FD5.

[0056] The power supply line 42N is a DC input section on the negative side (low voltage side) of the inverter circuit 42. Specifically, one end of the power supply line 42N is electrically connected to the input terminal 41N. The other end of the power supply line 42N is electrically connected to the semiconductor switch SW2 and the freewheel diode FD2, the semiconductor switch SW4 and the freewheel diode FD4, and the semiconductor switch SW6 and the freewheel diode FD6.

[0057] The power supply lines 42U, 42V, and 42W are output sections of the inverter circuit 42 for three-phase AC (AC of U phase, V phase, and W phase).

[0058] The power supply line 42U is an output section for a U-phase AC current in the inverter circuit 42. Specifically, one end of the power supply line 42U is electrically connected to the semiconductor switch SW1 and the freewheel diode FD1, and the semiconductor switch SW2 and the freewheel diode FD2, respectively, and the other end is electrically connected to the output terminal 43U.

[0059] The power supply line 42V is an output section for a V-phase AC in the inverter circuit 42. Specifically, one end of the power supply line 42V is electrically connected to the semiconductor switch SW3 and the freewheel diode FD3, and the semiconductor switch SW4 and the freewheel diode FD4, respectively, and the other end is electrically connected to the output terminal 43V.

[0060] The power supply line 42W is an output section for a W-phase AC in the inverter circuit 42. Specifically, one end of the power supply line 42W is electrically connected to the semiconductor switch SW5 and the freewheel diode FD5, and the semiconductor switch SW6 and the freewheel diode FD6, respectively, and the other end is electrically connected to the output terminal 43W.

[0061] The output terminals 43 output the three-phase AC (AC of U-phase, V-phase, and W-phase) output from the inverter circuit 42 to the outside of the inverter module 40. The output terminals 43 include output terminals 43U, 43V, and 43W.

[0062] The output terminal 43U is electrically connected to the power supply line 42U inside the inverter module 40, and is also electrically connected to the output terminal 50U outside the inverter module 40. The output terminal 43V is electrically connected to the power supply line 42V inside the inverter module 40, and is also electrically connected to the output terminal 50V outside the inverter module 40. The output terminal 43W is electrically connected to the power supply line 42W inside the inverter module 40, and is also electrically connected to the output terminal 50W outside the inverter module 40.

[0063] The output terminals 50 output the three-phase AC (AC of U-phase, V-phase, and W-phase) output from the inverter module 40 to a load device. The output terminals 50 include output terminals 50U, 50V, 50W, and a ground terminal 50E.

[0064] Output terminal 50U is electrically connected to output terminal 43U inside power conversion device 1, and is electrically connected to a U-phase terminal of a load device outside power conversion device 1. Output terminal 50V is electrically connected to output terminal 43V inside power conversion device 1, and is electrically connected to a V-phase terminal of a load device outside power conversion device 1. Output terminal 50W is electrically connected to output terminal 43W inside power conversion device 1, and is electrically connected to a W-phase terminal of a load device outside power conversion device 1.

[0065] The ground terminal 50E is electrically connected to a grounding electric path extending from a conductive part (for example, a housing) corresponding to the reference potential of the load device, whereby the power conversion device 1 can ground a predetermined point of the load device via the ground GND and the grounding electric path connected to the ground terminal 10E.

[0066] [Bypass circuit function] Next, the function of the bypass circuit 35 will be specifically described with reference to Fig. 2 in addition to Fig. 1. Specifically, common mode noise that may occur in the diode bridge circuit 22 of the converter module 20 will be described.

[0067] Fig. 2 is an equivalent circuit diagram showing an example of the diode bridge circuit 22. Specifically, Fig. 2 shows an equivalent circuit of the parasitic components of the diode bridge circuit 22 when a high-frequency noise current flows.

[0068] As shown in Figure 1, there is a stray capacitance C between the power supply line 22P and the ground GND. p Similarly, there is a stray capacitance C between the power supply line 22N and the ground GND. n exists.

[0069] In addition, the power supply lines 22P and 22N have a wiring inductance L p ,L n In addition, the rectifier diode RD of each leg of the diode bridge circuit 22 has a junction capacitance C j exists.

[0070] Here, with the switching operation of the semiconductor switch SW of the inverter circuit 42, a normal mode high frequency noise voltage V n This generates a normal mode high frequency noise voltage V n reaches the output terminals 23P and 23N of the converter module 20 while attenuating.

[0071] Capacitor C1 pn ,C2 pn Since the series connection of these elements allows high-frequency noise current to pass, the high-frequency noise voltage V n When this occurs, it can be considered that the output terminals 23P and 23N are short-circuited. Therefore, as shown in FIG. 2, the parasitic component of the diode bridge circuit 22 can be considered as a bridge circuit 22EC1.

[0072] Regarding the bridge circuit 22EC1, a potential difference (common mode voltage V cin ) occurs, a common mode noise current (hereinafter referred to as "common mode current") I cin In other words, normal mode high-frequency noise is converted into common mode high-frequency noise in the diode bridge circuit 22, and as a result, there is a possibility that a high-frequency common mode current will propagate from the input terminal 10 to the outside, increasing the radiation noise.

[0073] In this way, the diode bridge circuit 22 may act as a noise source that converts normal-mode high-frequency noise accompanying the switching operation of the semiconductor switch SW into common-mode high-frequency noise.

[0074] Common mode voltage V cin is the voltage V in Figure 2 b Using this, it is expressed by the following equation (1).

[0075]

number

[0076] Therefore, when the condition of equation (2) is met, the common mode voltage V cin becomes zero, and the common mode current I cin is not flowing.

[0077]

number

[0078] The condition of the formula (2) corresponds to the balance condition of the bridge circuit 22EC1. Therefore, the wiring inductance L p ,L n , and stray capacitance C p ,C n By setting cinFor example, the mounting structure of the rectifier diode RD is considered so that the left side of equation (2) approaches zero.

[0079] However, when suppressing common-mode current depending on the mounting structure of the rectifier diode RD, it may be necessary to vary the mounting direction of the rectifier diode RD on the substrate depending on the rectifier diode RD. This may require the use of multiple types of rectifier diode RD chips with different structures, which may result in increased variation in performance of the diode bridge circuit 22 or increased effort in managing the rectifier diodes RD to suppress the variation in performance.

[0080] In contrast, the bypass circuit 35 has a stray capacitance C p ,C n The high-frequency common mode current flowing through the bypass circuit 35 can be recovered (i.e., returned) to the inverter circuit 42 through the bypass circuit 35L. Therefore, the power conversion device 1 can suppress radiation noise caused by the switching operation of the semiconductor switch SW in the inverter circuit 42 by the action of the bypass circuit 35.

[0081] For example, the impedance of the bypass circuit 35 is set to be sufficiently smaller than the impedance of each of the stray capacitances Cp and Cn. p ,C n As a result, the common mode current can be effectively recovered to the inverter circuit 42.

[0082] As described above, in this embodiment, by providing the bypass circuit 35, it is possible to suppress common mode noise originating from the diode bridge circuit 22 as a noise source. Therefore, it is possible to configure the diode bridge circuit 22 using one type of rectifier diode RD with the same structure while suppressing common mode noise originating from the diode bridge circuit 22 as a noise source. This makes it possible to avoid an increase in the variation in performance of the diode bridge circuit 22 and an increase in the effort required to manage the rectifier diode RD in order to suppress the variation in performance.

[0083] [Second example of power conversion device] Next, a configuration of a second example of the power conversion device 1 according to this embodiment will be described with reference to FIG.

[0084] Hereinafter, in this example, the same symbols are used for configurations that are the same as or correspond to the first example (FIG. 2) described above, and the explanation will focus on the parts that are different from the first example described above, and explanations of the parts that are the same as or correspond to the first example described above may be omitted.

[0085] FIG. 3 is a diagram showing the configuration of a second example of the power conversion device 1. In FIG.

[0086] In FIG. 3, the input terminal 10 and the output terminal 50 are omitted.

[0087] As shown in FIG. 3, the power conversion device 1 according to this embodiment differs from the first embodiment described above mainly in that it includes a PIM (Power Integrated Module) 60 instead of the converter module 20 and the inverter module 40.

[0088] The power conversion device 1 includes a DC link unit 30 and a PIM 60.

[0089] The DC link unit 30 includes a DC line 31 and a smoothing circuit 32, similar to the first example (FIG. 1) described above.

[0090] The DC line 31 includes a positive line 31P and a negative line 31N, similar to the first example described above.

[0091] The smoothing circuit 32 includes a smoothing capacitor Cdc mounted on a capacitor substrate 70 .

[0092] The capacitor substrate 70 includes positive terminals Pc0 and Pc1 and a negative terminal Nc.

[0093] The positive terminal Pc0 is electrically connected to the positive electrode of the smoothing capacitor Cdc by a wiring pattern provided on the capacitor substrate , and is also electrically connected to the positive line 31P1 outside the capacitor substrate .

[0094] The positive terminal Pc1 is electrically connected to the positive electrode of the smoothing capacitor Cdc by a wiring pattern provided on the capacitor substrate , and is also electrically connected to the positive line 31P2 outside the capacitor substrate .

[0095] The negative terminal Nc is electrically connected to the negative electrode of the smoothing capacitor Cdc by a wiring pattern provided on the capacitor substrate 70, and is also electrically connected to each of the negative lines 31N1 and 31N2 outside the capacitor substrate 70. This connects the negative terminal of the smoothing capacitor Cdc to each of the negative line 31N1 on the output side of the diode bridge circuit 22 and the negative line 31N2 on the input side of the inverter circuit 42.

[0096] The negative electrode terminal Nc may be replaced with two negative electrode terminals, similar to the case of the positive electrode terminals Pc0 and Pc1.

[0097] The positive line 31P includes a positive line 31P1 that electrically connects the connection terminal Pd of the PIM 60 to the positive terminal Pc0 of the capacitor board 70, and a positive line 31P2 that electrically connects the connection terminal Pi of the PIM 60 to the positive terminal Pc1 of the capacitor board 70.

[0098] The negative line 31N includes a negative line 31N1 connecting the connection terminal Nd of the PIM 60 and the negative terminal Nc of the capacitor board 70, and a negative line 31N2 connecting the connection terminal Ni of the PIM 60 and the negative terminal Nc of the capacitor board 70.

[0099] The PIM 60 includes an input terminal 61, an output terminal 62, a connection terminal 63, a diode bridge circuit 22, a bypass circuit 35, and an inverter circuit 42.

[0100] Three-phase AC (AC of R phase, S phase, and T phase) is input to input terminal 61 from an external power supply via input terminal 10. Input terminal 61 includes input terminals 61R, 61S, and 61T.

[0101] Input terminal 61R is electrically connected to input terminal 10R outside the PIM 60, and is electrically connected to one end of power line 22R inside the PIM 60. Input terminal 61S is electrically connected to input terminal 10S outside the PIM 60, and is electrically connected to one end of power line 22S inside the PIM 60. Input terminal 61T is electrically connected to input terminal 10T outside the PIM 60, and is electrically connected to power line 22T inside the PIM 60.

[0102] The output terminals 62 output the three-phase AC (AC of U-phase, V-phase, and W-phase) output from the inverter circuit 42 to the outside of the PIM 60. The output terminals 62 include output terminals 62U, 62V, and 62W.

[0103] Output terminal 62U is electrically connected to power supply line 42U inside PIM 60, and is also electrically connected to output terminal 50U outside PIM 60. Output terminal 62V is electrically connected to power supply line 42V inside PIM 60, and is also electrically connected to output terminal 50V outside PIM 60. Output terminal 62W is electrically connected to power supply line 42W inside PIM 60, and is also electrically connected to output terminal 50W outside PIM 60.

[0104] The connection terminals 63 are provided to electrically connect the PIM 60 to the DC link unit 30. The connection terminals 63 include connection terminals 63P and 63N.

[0105] The connection terminal 63P is electrically connected to the positive line 31P outside the PIM 60. The connection terminal 63P includes connection terminals Pd and Pi.

[0106] The connection terminal Pd is electrically connected to the power supply line 22P inside the PIM 60, and is electrically connected to the positive line 31P1 outside the PIM 60. The connection terminal Pi is electrically connected to the power supply line 42P inside the PIM 60, and is electrically connected to the positive line 31P2 outside the PIM 60.

[0107] The connection terminal 63N is electrically connected to the negative line 31N outside the PIM 60. The connection terminal 63N includes connection terminals Nd and Ni.

[0108] The connection terminal Nd is electrically connected to the power supply line 22N inside the PIM 60, and is electrically connected to the negative line 31N1 outside the PIM 60. The connection terminal Ni is electrically connected to the power supply line 42N inside the PIM 60, and is electrically connected to the negative line 31N2 outside the PIM 60.

[0109] In this example, the connection terminal 63N connects the connection terminal Nd and the connection terminal Ni to the negative terminal Nc via negative lines 31N1 and N2, respectively, but the connection terminal Nd and the connection terminal Ni may be pattern-connected in close proximity to the PIM 60, and the negative terminal Nc may also be pattern-connected thereto.

[0110] The bypass circuit 35 includes a capacitor C1 pn ,C2 pn ,C3 pn ,C4 pn and a bypass electrical circuit 35L.

[0111] Capacitor C1 pnOne electrode of the capacitor C2 is electrically connected to the power supply line 22P, and the other electrode of the capacitor C2 is electrically connected to the power supply line 22P. pn Electrically connected to capacitor C2 pn is connected to the capacitor C1 pn and the other electrode is electrically connected to the power supply line 22N.

[0112] Capacitor C3 pn One electrode of the capacitor C4 is electrically connected to the power supply line 42P, and the other electrode of the capacitor C4 is electrically connected to the power supply line 42P. pn Electrically connected to capacitor C4 pn One electrode is connected to the capacitor C3 pn and the other electrode is electrically connected to the power supply line 42N.

[0113] The bypass circuit 35L is connected to the capacitor C1 as in the first example. pn ,C2 pn and capacitor C3 pn ,C4 pn The neutral points of the series-connected bodies are electrically connected to each other. As a result, the bypass circuit 35 has a stray capacitance C n ,C p The high-frequency common-mode current flowing through the bypass circuit 35 can be recovered to the inverter circuit 42 through the bypass circuit 35L. Therefore, the power conversion device 1 can suppress radiation noise caused by the switching operation of the semiconductor switch SW in the inverter circuit 42 by the action of the bypass circuit 35.

[0114] In this way, in this example, the power conversion device 1 can suppress radiation noise caused by the switching operation of the semiconductor switch SW in the inverter circuit 42 by using the bypass circuit 35 built into the PIM 60. As a result, the power conversion device 1 and PIM 60 according to this example have the same functions and effects as those of the first example described above.

[0115] [First example of PIM] Next, with reference to FIG. 4 in addition to FIG. 3, a structure of a first example of the PIM 60 according to this embodiment will be described.

[0116] FIG. 4 is a top view showing the structure of a first example of the PIM 60. As shown in FIG.

[0117] 4, the diode bridge circuit 22 and the inverter circuit 42 are mounted on the surface of the insulating substrate 60CB1 facing the positive direction of the Z axis. The insulating substrate 60CB1 is, for example, a DBC (Direct Bonded Copper) substrate. A base member 60BS is attached to the back surface of the insulating substrate 60CB1 facing the negative direction of the Z axis. The base member 60BS is made of, for example, copper, and has a function of dissipating heat from components mounted on the insulating substrate 60CB1 and corresponds to ground GND (i.e., a conductive portion corresponding to a reference potential).

[0118] The insulating substrate 60CB1 has a wiring pattern 22P on the surface in the positive direction of the Z axis. pt1 ,22N pt1 ,22N pt2 ,22R pt ,22S pt ,22T pt Also, on the surface of the insulating substrate 60CB1 in the positive direction of the Z axis, 42P pt1 ,42N pt1 ,42U pt1 ,42U pt2 ,42V pt1 ,42V pt2 ,42W pt1 ,42W pt2 These wiring patterns are formed from a conductive material such as copper. pt1 ,22N pt1 ,22N pt2 ,22R pt ,22S pt ,22T pt ,42P pt1 ,42N pt1 ,42U pt1 ,42U pt2 ,42V pt1 ,42V pt2 ,42W pt1 ,42W pt2are arranged to be spaced apart from each other.

[0119] Wiring pattern 22P pt1 corresponds to the power line 22P. pt1 In the second embodiment, a connection terminal Pd, a rectifier diode RD1, a rectifier diode RD3, and a rectifier diode RD5 are arranged so as to be spaced apart from each other.

[0120] The connection terminals Pd are formed of a conductive material such as copper, and are connected to the wiring pattern 22P by solder, for example. pt1 By attaching it to the wiring pattern 22P pt1 and electrically connected to each other.

[0121] The cathode electrode of the rectifier diode RD1 is the wiring pattern 22P. pt1 The cathode electrode of the rectifier diode RD1 is connected to the wiring pattern 22P by, for example, soldering or the like. pt1 By attaching it to the wiring pattern 22P pt1 The anode electrode of the rectifier diode RD1 is electrically connected to the wire 22R. wr The anode electrode of the rectifier diode RD1 and the wire 22R are connected to each other by soldering or the like. wr and are electrically connected. wr is formed of a conductive material such as copper, for example. The same applies to each wire described below.

[0122] The cathode electrode of the rectifier diode RD3 is the wiring pattern 22P. pt1 The cathode electrode of the rectifier diode RD3 is connected to the wiring pattern 22P by, for example, soldering. pt1 By attaching it to the wiring pattern 22P pt1 The anode electrode of the rectifier diode RD3 is electrically connected to the wire 22S. wrThe anode electrode of the rectifier diode RD3 and the wire 22S are connected to each other by soldering or the like. wr are electrically connected to each other.

[0123] The cathode electrode of the rectifier diode RD5 is the wiring pattern 22P. pt1 The cathode electrode of the rectifier diode RD5 is connected to the wiring pattern 22P by, for example, soldering or the like. pt1 By attaching it to the wiring pattern 22P pt1 The anode electrode of the rectifier diode RD5 is electrically connected to the wire 22T. wr The anode electrode of the rectifier diode RD5 and the wire 22T are connected to each other by soldering or the like. wr are electrically connected to each other.

[0124] Wiring pattern 22N pt1 A connection terminal Nd is disposed on the first terminal Nd.

[0125] The connection terminal Nd is formed of a conductive material such as copper. For example, the wiring pattern 22N is soldered. pt1 By attaching it to the wiring pattern 22N pt1 and electrically connected to each other.

[0126] Also, wiring pattern 22N pt1 Includes wire 22N wr4 One end of the wiring pattern 22N is attached by soldering, for example. pt1 and wire 22N wr4 are electrically connected to each other.

[0127] Wiring pattern 22N pt2 is wiring pattern 22N pt1 The wiring pattern 22N is arranged so as to be spaced apart from the wiring pattern 22N. pt2 The wire 22N is connected to the wr1 By attaching one end of the wiring pattern 22Npt2 and wire 22N wr1 are electrically connected. pt2 The wire 22N is connected to the wr4 The other end of the wiring pattern 22N is attached. pt2 and wire 22N wr4 As a result, the wiring pattern 22N pt1 ,22N pt2 22N wire wr4 are electrically connected through

[0128] Wiring pattern 22R pt The input terminal 61R and the rectifier diode RD2 are arranged to be spaced apart from each other.

[0129] The input terminal 61R is connected to the wiring pattern 22R by, for example, soldering. pt By attaching it to the wiring pattern 22R pt and electrically connected to each other.

[0130] The cathode electrode of the rectifier diode RD2 is connected to the wiring pattern 22R. pt For example, the cathode electrode of the rectifier diode RD2 is connected to the wiring pattern 22R by soldering or the like. pt By attaching it to the wiring pattern 22R pt The anode electrode of the rectifier diode RD2 is electrically connected to a wire 22N by, for example, soldering. wr1 The other end of the rectifier diode RD2 is electrically connected to the anode electrode of the wire 22N. wr1 As a result, the wire 22N wr1 Through the anode electrode of the rectifier diode RD2 and the wiring pattern 22N pt2 The anode electrode of the rectifier diode RD2 is electrically connected to a wire 22N by, for example, soldering. wr2 One end of the rectifier diode RD2 is connected to the anode electrode of the wire 22N. wr2are electrically connected to each other.

[0131] Wiring pattern 22R pt The wire 22R is connected to the wr The other end is attached to the wire 22R wr and wiring pattern 22R pt As a result, the wire 22R is electrically connected to the wr Through the wiring pattern 22R pt and the anode electrode of the rectifier diode RD1 are electrically connected. wr and wiring pattern 22R pt The anode electrode of the rectifier diode RD1, the cathode electrode of the rectifier diode RD2, and the input terminal 61R are electrically connected through the wire 22R. wr and wiring pattern 22R pt corresponds to the power supply line 22R as a whole.

[0132] Wiring pattern 22S pt , an input terminal 61S and a rectifier diode RD4 are arranged to be spaced apart from each other.

[0133] The input terminal 61S is connected to the wiring pattern 22S by, for example, soldering. pt By attaching it to the wiring pattern 22S pt and electrically connected to each other.

[0134] The cathode electrode of the rectifier diode RD4 is the wiring pattern 22S. pt The cathode electrode of the rectifier diode RD4 is connected to the wiring pattern 22S by soldering, for example. pt By attaching it to the wiring pattern 22S pt The anode electrode of the rectifier diode RD4 is electrically connected to a wire 22N by, for example, soldering. wr2 The other end is attached to the anode electrode of the rectifier diode RD4 and the wire 22N wr2 As a result, the wire 22Nwr2 The anode electrode of the rectifier diode RD4 and the anode electrode of the rectifier diode RD2 are electrically connected through the wire 22N. wr1 ,22N wr2 Through the anode electrode of the rectifier diode RD4 and the wiring pattern 22N pt2 The anode electrode of the rectifier diode RD4 is electrically connected to a wire 22N by, for example, soldering. wr3 By connecting one end of the rectifier diode RD4 to the anode electrode of the wire 22N wr3 are electrically connected to each other.

[0135] Wiring pattern 22S pt The wire 22S is connected to the wr The other end of the wiring pattern 22S is attached. pt and wire 22S wr As a result, the wire 22S wr Through the wiring pattern 22S pt and the anode electrode of the rectifier diode RD3 are electrically connected. wr and wiring pattern 22S pt The anode electrode of the rectifier diode RD3 and the cathode electrode of the rectifier diode RD4 are electrically connected to the input terminal 61S through the wire 22S. wr and wiring pattern 22S pt corresponds to the power supply line 22S as a whole.

[0136] Wiring pattern 22T pt The input terminal 61T and the rectifier diode RD6 are arranged to be spaced apart from each other.

[0137] The input terminal 61T is connected to the wiring pattern 22T by, for example, soldering. pt By attaching it to the wiring pattern 22T pt and electrically connected to each other.

[0138] The cathode electrode of the rectifier diode RD6 is the wiring pattern 22T.pt The cathode electrode of the rectifier diode RD6 is connected to the wiring pattern 22T by, for example, soldering or the like. pt By attaching it to the wiring pattern 22T pt The anode electrode of the rectifier diode RD6 is electrically connected to a wire 22N by, for example, soldering. wr3 The other end is attached to the anode electrode of the rectifier diode RD6 and the wire 22N wr3 As a result, the wire 22N wr3 The anode electrode of the rectifier diode RD6 and the anode electrode of the rectifier diode RD4 are electrically connected through the wire 22N. wr1 ,22N wr2 ,22N wr3 Through the anode electrode of the rectifier diode RD6 and the wiring pattern 22N pt2 In other words, the wiring pattern 22N pt1 , wiring pattern 22N pt2 , Wire 22N wr1 , Wire 22N wr2 , Wire 22N wr3 , and wire 22N wr4 corresponds to the power supply line 22N as a whole.

[0139] Wiring pattern 22T pt For example, by soldering, etc., the wire 22T wr The other end of the wiring pattern 22T pt and wire 22T wr As a result, the wire 22T wr Through the wiring pattern 22T pt and the anode electrode of the rectifier diode RD5 are electrically connected. wr and wiring pattern 22T pt The anode electrode of the rectifier diode RD5 and the cathode electrode of the rectifier diode RD6 are electrically connected to the input terminal 61T through the wire 22T. wr and wiring pattern 22Tpt corresponds to the power supply line 22T as a whole.

[0140] Wiring pattern 42P pt1 corresponds to the power supply line 42P. pt1 In the circuit, a connection terminal Pi, semiconductor switches SW1, SW3, SW5, and freewheeling diodes FD1, FD3, FD5 are arranged so as to be spaced apart from one another.

[0141] The connection terminals Pi are formed of a conductive material such as copper. The connection terminals Pi are connected to the wiring pattern 42P by solder or the like. pt1 By attaching it to the wiring pattern 42P pt1 and electrically connected to each other.

[0142] The collector terminal of the semiconductor switch SW1 is a 42P wiring pattern. pt1 The collector terminal of the semiconductor switch SW1 is connected to the wiring pattern 42P by soldering, for example. pt1 By attaching it to the wiring pattern 42P pt1 The emitter terminal of the semiconductor switch SW1 is electrically connected to a wire 42U by, for example, soldering. wr2 ,42U wr3 By attaching one end of each, the emitter terminal of the semiconductor switch SW1 and the wire 42U wr2 ,42U wr3 are electrically connected to each other.

[0143] The cathode electrode of the freewheeling diode FD1 is the wiring pattern 42P. pt1 The cathode electrode of the freewheeling diode FD1 is connected to the wiring pattern 42P by soldering, for example. pt1 By attaching it to the wiring pattern 42P pt1 The anode electrode of the freewheeling diode FD1 is electrically connected to a wire 42U by, for example, soldering. wr2The other end of the wire is connected to the anode of the freewheeling diode FD1 and the wire 42U. wr2 This electrically connects the wiring pattern 42P pt1 and wire 42U wr2 The semiconductor switch SW1 and the freewheeling diode FD1 are electrically connected in parallel through the wire 42U. The anode electrode of the freewheeling diode FD1 is connected to the wire 42U by, for example, soldering. wr1 One end of the wire is connected to the anode of the freewheeling diode FD1 and the wire 42U. wr1 are electrically connected to each other.

[0144] The collector terminal of the semiconductor switch SW3 is a 42P wiring pattern. pt1 The collector terminal of the semiconductor switch SW3 is connected to the wiring pattern 42P by, for example, soldering. pt1 By attaching it to the wiring pattern 42P pt1 The emitter terminal of the semiconductor switch SW3 is electrically connected to a wire 42V by, for example, soldering. wr2 ,42V wr3 By attaching one end of each, the emitter terminal of the semiconductor switch SW3 and the 42V wire wr2 ,42V wr3 are electrically connected to each other.

[0145] The cathode electrode of the freewheeling diode FD3 is the wiring pattern 42P. pt1 The cathode electrode of the freewheeling diode FD3 is connected to the wiring pattern 42P by, for example, soldering. pt1 By attaching it to the wiring pattern 42P pt1 The anode electrode of the freewheeling diode FD3 is electrically connected to a wire 42V by, for example, soldering. wr2 The other end is connected to the anode of the freewheeling diode FD3 and the 42V wire. wr2 This electrically connects the wiring pattern 42P pt1and wire 42V wr2 The semiconductor switch SW3 and the freewheeling diode FD3 are electrically connected in parallel through the wire 42V. The anode electrode of the freewheeling diode FD3 is connected to the wire 42V by, for example, soldering. wr1 One end of the freewheeling diode FD3 is connected to the anode electrode of the 42V wire. wr1 are electrically connected to each other.

[0146] The collector terminal of the semiconductor switch SW5 is a 42P wiring pattern. pt1 The collector terminal of the semiconductor switch SW5 is connected to the wiring pattern 42P by, for example, soldering. pt1 By attaching it to the wiring pattern 42P pt1 The emitter terminal of the semiconductor switch SW5 is electrically connected to a wire 42W by, for example, soldering. wr2 ,42W wr3 By attaching one end of each, the emitter terminal of the semiconductor switch SW5 and the wire 42W wr2 ,42W wr3 are electrically connected to each other.

[0147] The cathode electrode of the freewheeling diode FD5 is the wiring pattern 42P. pt1 The cathode electrode of the freewheeling diode FD5 is connected to the wiring pattern 42P by, for example, soldering. pt1 By attaching it to the wiring pattern 42P pt1 The anode electrode of the freewheeling diode FD5 is electrically connected to the wire 42W by, for example, soldering. wr2 The other end is attached to the anode electrode of the freewheeling diode FD5 and the wire 42W wr2 This electrically connects the wiring pattern 42P pt1 and wire 42W wr2The semiconductor switch SW5 and the freewheeling diode FD5 are electrically connected in parallel through the wire 42W. The anode electrode of the freewheeling diode FD5 is connected to the wire 42W by, for example, solder. wr1 One end of the freewheeling diode FD5 is attached to the anode electrode and the 42W wire wr1 are electrically connected to each other.

[0148] Wiring pattern 42N pt1 A connection terminal Ni is arranged on the

[0149] The connection terminals Ni are formed of a conductive material such as copper, etc. The connection terminals Ni are connected to the wiring pattern 42N by solder, etc. pt1 By attaching it to the wiring pattern 42N pt1 and electrically connected to each other.

[0150] Wiring pattern 42N pt1 For example, by soldering, wire 42N wr2 ,42N wr4 ,42N wr6 By attaching one end of each of the wiring patterns 42N pt1 and wire 42N wr2 ,42N wr4 ,42N wr6 are electrically connected to each other.

[0151] Wiring pattern 42U pt1 In the second input terminal, a semiconductor switch SW2 and a freewheeling diode FD2 are arranged so as to be spaced apart from each other.

[0152] The collector terminal of the semiconductor switch SW2 is connected to the wiring pattern 42U. pt1 The collector terminal of the semiconductor switch SW2 is connected to the wiring pattern 42U by, for example, soldering. pt1 By attaching it to the wiring pattern 42U pt1 The emitter terminal of the semiconductor switch SW2 is electrically connected to a wire 42N by, for example, soldering.wr2 The other end of the wire 42N is connected to the emitter terminal of the semiconductor switch SW2. wr2 As a result, the wire 42N is electrically connected to the wr2 Through this, the emitter terminal of the semiconductor switch SW2 and the wiring pattern 42N pt1 The emitter terminal of the semiconductor switch SW2 is electrically connected to a wire 42N. wr1 By attaching one end of the wire 42N to the emitter terminal of the semiconductor switch SW2, wr1 are electrically connected to each other.

[0153] The cathode electrode of the freewheeling diode FD2 is the wiring pattern 42U. pt1 The cathode electrode of the freewheeling diode FD2 is connected to the wiring pattern 42U by, for example, soldering. pt1 By attaching it to the wiring pattern 42U pt1 The anode electrode of the freewheeling diode FD2 is electrically connected to a wire 42N by, for example, soldering. wr1 The other end of the wire is connected to the anode of the freewheeling diode FD2 and the wire 42N. wr1 As a result, the wiring pattern 42U pt1 and wire 42N wr1 The semiconductor switch SW2 and the freewheeling diode FD2 are electrically connected in parallel via the

[0154] In addition, wiring pattern 42U pt1 For example, by soldering, wire 42U wr1 The other end of the wiring pattern 42U is attached. pt1 and Wire 42U wr1 As a result, the wire 42U wr1 The parallel connection of the semiconductor switch SW1 and the freewheel diode FD1 on the upper arm and the parallel connection of the semiconductor switch SW2 and the freewheel diode FD2 on the lower arm are electrically connected in series via the parallel connection.

[0155] Wiring pattern 42V pt1 In the second input terminal, a semiconductor switch SW4 and a freewheeling diode FD6 are arranged so as to be spaced apart from each other.

[0156] The collector terminal of the semiconductor switch SW4 is a 42V wiring pattern. pt1 The collector terminal of the semiconductor switch SW4 is connected to the wiring pattern 42V by, for example, soldering. pt1 By attaching it to the wiring pattern 42V pt1 The emitter terminal of the semiconductor switch SW4 is electrically connected to a wire 42N by, for example, soldering. wr4 The other end of the wire 42N is connected to the emitter terminal of the semiconductor switch SW4. wr4 As a result, the wire 42N is electrically connected to the wr4 Through this, the emitter terminal of the semiconductor switch SW4 and the wiring pattern 42N pt1 The emitter terminal of the semiconductor switch SW4 is electrically connected to a wire 42N. wr3 By attaching one end of the wire 42N to the emitter terminal of the semiconductor switch SW4, wr3 are electrically connected to each other.

[0157] The cathode electrode of the freewheeling diode FD4 is the wiring pattern 42V. pt1 The cathode electrode of the freewheeling diode FD4 is connected to the wiring pattern 42V by, for example, soldering. pt1 By attaching it to the wiring pattern 42V pt1 The anode electrode of the freewheeling diode FD4 is electrically connected to a wire 42N by, for example, soldering. wr3 The other end of the wire is connected to the anode of the freewheeling diode FD4 and the wire 42N. wr3 This electrically connects the wiring pattern 42V pt1 and wire 42N wr3 The semiconductor switch SW4 and the freewheeling diode FD4 are electrically connected in parallel via the

[0158] Also, the wiring pattern 42V pt1 For example, by soldering, etc., wire 42V wr1 The other end of the wiring pattern is attached to pt1 and wire 42V wr1 This electrically connects the wire 42V wr1 The parallel connection of the semiconductor switch SW3 and the freewheel diode FD3 on the upper arm and the parallel connection of the semiconductor switch SW4 and the freewheel diode FD4 on the lower arm are electrically connected in series via the parallel connection.

[0159] Wiring pattern 42W pt1 In the second input terminal, a semiconductor switch SW6 and a freewheeling diode FD4 are arranged so as to be spaced apart from each other.

[0160] The collector terminal of the semiconductor switch SW6 is a 42W wiring pattern. pt1 The collector terminal of the semiconductor switch SW6 is connected to the wiring pattern 42W by, for example, soldering. pt1 By attaching it to the wiring pattern 42W pt1 The emitter terminal of the semiconductor switch SW6 is electrically connected to a wire 42N by, for example, soldering. wr6 The other end of the wire 42N is connected to the emitter terminal of the semiconductor switch SW6. wr6 As a result, the wire 42N is electrically connected to the wr6 Through this, the emitter terminal of the semiconductor switch SW6 and the wiring pattern 42N pt1 The emitter terminal of the semiconductor switch SW6 is electrically connected to a wire 42N. wr5 By attaching one end of the wire 42N to the emitter terminal of the semiconductor switch SW6, wr5 are electrically connected to each other.

[0161] The cathode electrode of the freewheeling diode FD6 is a 42W wiring pattern. pt1The cathode electrode of the freewheeling diode FD6 is connected to the wiring pattern 42W by, for example, soldering. pt1 By attaching it to the wiring pattern 42W pt1 The anode electrode of the freewheeling diode FD6 is electrically connected to a wire 42N by, for example, soldering. wr5 The other end of the diode is connected to the anode of the freewheeling diode FD6 and the wire 42N. wr5 As a result, the wiring pattern 42W pt1 and wire 42N wr5 The semiconductor switch SW6 and the freewheeling diode FD6 are electrically connected in parallel via the

[0162] In addition, the wiring pattern is 42W. pt1 For example, by soldering, wire 42W wr1 The other end of the wiring pattern 42W pt1 and wire 42W wr1 This electrically connects the wire 42W wr1 The parallel connection of the semiconductor switch SW5 and the freewheel diode FD5 on the upper arm and the parallel connection of the semiconductor switch SW6 and the freewheel diode FD6 on the lower arm are electrically connected in series via the parallel connection.

[0163] Wiring pattern 42N pt1 and wire 42N wr1 ,42N wr2 ,42N wr3 ,42N wr4 ,42N wr5 ,42N wr6 corresponds to the power supply line 42N as a whole.

[0164] Wiring pattern 42U pt2 An output terminal 62U is arranged at the terminal 62U.

[0165] The output terminal 62U is connected to the wiring pattern 42U by, for example, soldering. pt2 By attaching it to the wiring pattern 42U pt2and electrically connected to each other.

[0166] In addition, wiring pattern 42U pt2 For example, by soldering, wire 42U wr3 The other end of the wiring pattern 42U is attached. pt2 and Wire 42U wr3 As a result, the wiring pattern 42U pt1 ,42U pt2 , and wire 42U wr1 ,42U wr2 ,42U wr3 The emitter terminal of the semiconductor switch SW1, the anode electrode of the freewheeling diode FD1, the collector terminal of the semiconductor switch SW2, the cathode electrode of the freewheeling diode FD2, and the output terminal 62U are electrically connected through the wiring pattern 42U. pt1 ,42U pt2 , and wire 42U wr1 ,42U wr2 ,42U wr3 corresponds to the power supply line 42U as a whole.

[0167] Wiring pattern 42V pt2 An output terminal 62V is arranged at

[0168] The output terminal 62V is connected to the wiring pattern 42V by, for example, soldering. pt2 By attaching it to the wiring pattern 42V pt2 and electrically connected to each other.

[0169] Also, the wiring pattern 42V pt2 For example, by soldering, etc., wire 42V wr3 The other end of the wiring pattern is attached to pt2 and wire 42V wr3 This electrically connects the wiring pattern 42V pt1 ,42V pt2 , and wire 42V wr1 ,42V wr2 ,42V wr3The emitter terminal of the semiconductor switch SW3, the anode electrode of the freewheeling diode FD3, the collector terminal of the semiconductor switch SW4, the cathode electrode of the freewheeling diode FD4, and the output terminal 62V are electrically connected through the wiring pattern 42V. pt1 ,42V pt2 , and wire 42V wr1 ,42V wr2 ,42V wr3 Overall, this corresponds to a 42V power line.

[0170] Wiring pattern 42W pt2 An output terminal 62W is disposed at the terminal 62A.

[0171] The output terminal 62W is connected to the wiring pattern 42W by, for example, soldering. pt2 By attaching it to the wiring pattern 42W pt2 and electrically connected to each other.

[0172] In addition, the wiring pattern is 42W. pt2 For example, by soldering, wire 42W wr3 The other end of the wiring pattern 42W pt2 and wire 42W wr3 As a result, the wiring pattern 42W pt1 ,42W pt2 , and wire 42W wr1 ,42W wr2 ,42W wr3 The emitter terminal of the semiconductor switch SW5, the anode electrode of the freewheeling diode FD5, the collector terminal of the semiconductor switch SW6, the cathode electrode of the freewheeling diode FD6, and the output terminal 62W are electrically connected through the wiring pattern 42W. pt1 ,42W pt2 , and wire 42W wr1 ,42W wr2 ,42W wr3 Overall, this corresponds to 42W of power line power.

[0173] Wiring pattern 35L pt1 corresponds to the bypass circuit 35L.pt1 is a part of the wiring pattern 22P pt1 ,22N pt2 ,42P pt1 ,42N pt1 are arranged adjacent to and spaced apart from each other.

[0174] Capacitor C1 pn For example, one electrode is connected to the wiring pattern 22P by soldering or the like. pt1 The other electrode is attached to the wiring pattern 35L pt1 This allows the capacitor C1 pn One electrode is the wiring pattern 22P pt1 and the other electrode is electrically connected to the wiring pattern 35L. pt1 is electrically connected to

[0175] Capacitor C2 pn For example, one electrode is connected to the wiring pattern 35L by soldering or the like. pt1 and the other electrode is attached to the wiring pattern 22N pt2 This allows the capacitor C2 pn One electrode is a wiring pattern 35L pt1 and the other electrode is electrically connected to the wiring pattern 22N pt2 and electrically connected to each other.

[0176] Capacitor C1 pn ,C2 pn is wiring pattern 35L pt1 and the wiring pattern 22P corresponding to the power supply line 22P is connected in series through the pt1 , and the wiring pattern 22N corresponding to the power supply line 22N pt2 Electrically connect between.

[0177] In addition, capacitor C2 pn The other electrode is connected to the wiring pattern 22N by, for example, soldering. pt1 By attaching it to the wiring pattern 22N pt1 In this case, the wiring pattern 22N may be electrically connected to the wiring pattern 22N. pt2 and wire 22Nwr4 is omitted, and the wire 22N is connected by soldering or the like. wr1 One end of the wiring pattern 22N pt1 may be attached to

[0178] Capacitor C3 pn For example, one electrode is connected to the wiring pattern 42P by soldering or the like. pt1 The other electrode is attached to the wiring pattern 35L pt1 This allows the capacitor C3 pn One electrode is the wiring pattern 42P pt1 and the other electrode is electrically connected to the wiring pattern 35L. pt1 and electrically connected to each other.

[0179] Capacitor C4 pn For example, one electrode is connected to the wiring pattern 35L by soldering or the like. pt1 and the other electrode is attached to the wiring pattern 42N pt1 This allows the capacitor C4 pn One electrode is a wiring pattern 35L pt1 and the other electrode is electrically connected to the wiring pattern 42N pt1 and electrically connected to each other.

[0180] Capacitor C3 pn ,C4 pn is wiring pattern 35L pt1 and the wiring pattern 42P corresponding to the power supply line 42P. pt1 , and the wiring pattern 42N corresponding to the power supply line 42N pt1 Electrically connect between.

[0181] Wiring pattern 35L pt1 is the capacitor C1 pn ,C2 pn The neutral point of the series connection and the capacitor C3 pn ,C4 pn The series connection is electrically connected between the neutral point of the series connection.

[0182] In this way, in this example, the wiring pattern 35L provided on the insulating substrate 60CB1 on which the diode bridge circuit 22 and the inverter circuit 42 are mounted is pt1 and capacitor C1 pn ,C2 pn ,C3 pn ,C4 pn The bypass circuit 35 can be realized by this.

[0183] [Second example of PIM] Next, with reference to FIG. 5 in addition to FIG. 3, a structure of a second example of the PIM 60 according to this embodiment will be described.

[0184] Hereinafter, in this example, the same symbols are used for configurations that are the same as or correspond to those in the first example (FIG. 4) described above, and the explanation will focus on the differences from the first example described above, and explanations of the same or corresponding parts as those in the first example described above may be omitted.

[0185] FIG. 5 is a top view showing the structure of a second example of the PIM 60. In FIG.

[0186] As shown in FIG. 5, the PIM 60 according to this embodiment includes an insulating substrate 60PB and a wiring pattern 35L. pt1 and capacitor C1 pn ,C2 pn ,C3 pn ,C4 pn The main difference from the first example described above is that the is mounted on an insulating substrate 60PB.

[0187] In this example, the insulating substrate 60PB is disposed such that its rear surface facing the negative Z-axis direction faces the mounting surface of the diode bridge circuit 22 and the inverter circuit 42 and overlaps, in top view, the mounting surface of the insulating substrate 60CB1 on which the diode bridge circuit 22 and the inverter circuit 42 are mounted. The insulating substrate 60PB is, for example, a printed circuit board.

[0188] In FIG. 5, for convenience, insulating substrate 60PB is drawn at a position where it has been moved so that the mounting surface of insulating substrate 60CB1 is exposed, and the actual position of insulating substrate 60PB is drawn with a dashed line.

[0189] The insulating substrate 60PB has a wiring pattern 22P on the surface in the positive direction of the Z axis. pt2 ,22N pt2 ,35L pt1 ,42P pt2 ,42N pt2 The wiring pattern 22P is formed. pt2 ,22N pt2 ,35L pt ,42P pt2 ,42N pt2 are arranged to be spaced apart from each other.

[0190] Wiring pattern 22P pt2 is a top view of the wiring pattern 22P pt1 The connecting terminals Pd are arranged on the mounting surface on the front side (positive direction of the Z axis) of the insulating substrate 60PB so as to overlap with the locations where the connecting terminals Pd are arranged.

[0191] The connection terminal Pd is connected to the wiring pattern 22P of the insulating substrate 60CB1. pt1 22P pt2 For example, the tip of the connection terminal Pd in ​​the positive Z-axis direction is attached to the wiring pattern 22P on the insulating substrate 60PB. pt2 and solder the wiring pattern 22P pt2 As a result, the wiring pattern 22P pt1 ,22P pt2 In other words, the wiring pattern 22P pt1 ,22P pt2 , and the connection terminal Pd as a whole correspond to the power supply line 22P.

[0192] Wiring pattern 22N pt2 is a wiring pattern 22N when viewed from above. pt1 The insulating substrate 60PB is disposed on the mounting surface on the front side (positive direction of the Z axis) of the insulating substrate 60PB so as to overlap a part of the insulating substrate 60PB.

[0193] Wiring pattern 22N pt1In the top view, the wiring pattern 22N pt2 At the overlapping portion, a connecting member 22N cr will be established.

[0194] Connection member 22N cr The connecting member 22N is made of a conductive material such as copper. cr is connected to the wiring pattern 22N by, for example, soldering or the like. pt1 By attaching it to the wiring pattern 22N pt1 Also, the connecting member 22N is electrically connected to cr is the wiring pattern 22N of the insulating substrate 60CB1. pt1 22N to the insulating substrate 60PB in the positive direction of the Z axis, and the tip of the wiring pattern 22N pt2 For example, the connecting member 22N cr The tip of the wiring pattern 22N on the insulating substrate 60PB in the positive direction of the Z axis is pt2 and solder the wiring pattern 22N pt2 As a result, the connecting member 22N cr Through the wiring pattern 22N pt1 ,22N pt2 In other words, the wiring pattern 22N pt1 ,22N pt2 , and the connecting member 22N cr corresponds to the power supply line 22N as a whole.

[0195] Wiring pattern 42P pt2 is a wiring pattern of 42P when viewed from above. pt1 The insulating substrate 60PB is disposed on the mounting surface on the front side (positive direction of the Z axis) of the insulating substrate 60PB so as to overlap a part of the insulating substrate 60PB.

[0196] Wiring pattern 42P pt1 In the top view, the wiring pattern is 42P pt2 Where it overlaps with the connecting part 42P cr will be established.

[0197] Connection part 42P crThe connecting member 42P is made of a conductive material such as copper. cr For example, by soldering, etc., the wiring pattern 42P pt1 By attaching it to the wiring pattern 42P pt1 Also, the connecting member 42P is electrically connected to the cr is the wiring pattern 42P of the insulating substrate 60CB1. pt1 42P to the insulating substrate 60PB in the positive direction of the Z axis. pt2 For example, the connecting member 42P cr The positive Z-axis direction of the wiring pattern 42P on the insulating substrate 60PB is pt2 and solder the wiring pattern 42P pt2 As a result, the connecting member 42P cr Through the wiring pattern 42P pt1 ,42P pt2 In other words, the wiring pattern 42P pt1 ,42P pt2 , and connecting member 42P cr corresponds to the power supply line 42P as a whole.

[0198] Wiring pattern 42N pt2 is the wiring pattern 42N when viewed from above. pt2 The insulating substrate 60PB is disposed on the mounting surface on the front side (positive direction of the Z axis) of the insulating substrate 60PB so as to overlap a part of the insulating substrate 60PB.

[0199] Wiring pattern 42N pt1 In the top view, the wiring pattern 42N pt2 At the overlapping portion, a connecting member 42N cr will be established.

[0200] Connection member 42N cr The connecting member 42N is made of a conductive material such as copper. cr is connected to the wiring pattern 42N by, for example, soldering or the like. pt1 By attaching it to the wiring pattern 42N pt1 Also, the connecting member 42N is electrically connected to thecr is the wiring pattern 42P of the insulating substrate 60CB1. pt1 42N to the insulating substrate 60PB in the positive direction of the Z axis, and pt2 For example, the connecting member 42N cr The tip of the positive Z-axis direction is the wiring pattern 42N on the insulating substrate 60PB. pt2 and solder the wiring pattern 42N pt2 As a result, the connecting member 42N cr Through the wiring pattern 42N pt1 ,42N pt2 In other words, the wiring pattern 42N pt1 ,42N pt2 , and the connecting member 42N cr corresponds to the power supply line 42N as a whole.

[0201] Wiring pattern 35L pt1 is a part of the wiring pattern 22P pt2 ,22N pt2 ,42P pt2 ,42N pt2 They are arranged on the front mounting surface of the insulating substrate 60PB so as to be adjacent to and spaced apart from each other.

[0202] Capacitor C1 pn For example, one electrode is connected to the wiring pattern 22P by soldering or the like. pt2 The other electrode is attached to the wiring pattern 35L pt1 This allows the capacitor C1 pn One electrode is the wiring pattern 22P pt2 and the other electrode is electrically connected to the wiring pattern 35L. pt1 and electrically connected to each other.

[0203] Capacitor C2 pn For example, one electrode is connected to the wiring pattern 35L by soldering or the like. pt1 and the other electrode is attached to the wiring pattern 22N pt2 This allows the capacitor C2pn One electrode is a wiring pattern 35L pt1 and the other electrode is electrically connected to the wiring pattern 22N pt2 and electrically connected to each other.

[0204] Capacitor C1 pn ,C2 pn is wiring pattern 35L pt1 and the wiring pattern 22P corresponding to the power supply line 22P is connected in series through the pt2 , and the wiring pattern 22N corresponding to the power supply line 22N pt2 Electrically connect between.

[0205] Capacitor C3 pn For example, one electrode is connected to the wiring pattern 42P by soldering or the like. pt2 The other electrode is attached to the wiring pattern 35L pt1 This allows the capacitor C3 pn One electrode is the wiring pattern 42P pt2 and the other electrode is electrically connected to the wiring pattern 35L. pt1 and electrically connected to each other.

[0206] Capacitor C4 pn For example, one electrode is connected to the wiring pattern 35L by soldering or the like. pt1 and the other electrode is attached to the wiring pattern 42N pt2 This allows the capacitor C4 pn One electrode is a wiring pattern 35L pt1 and the other electrode is electrically connected to the wiring pattern 42N pt2 and electrically connected to each other.

[0207] Capacitor C3 pn ,C4 pn is wiring pattern 35L pt1 and the wiring pattern 42P corresponding to the power supply line 42P. pt2 , and the wiring pattern 42N corresponding to the power supply line 42N pt2 Electrically connect between.

[0208] Wiring pattern 35L pt1 is the capacitor C1 pn ,C2 pn The neutral point of the series connection and the capacitor C3 pn ,C4 pn The series connection is electrically connected between the neutral point of the series connection.

[0209] In this way, in this example, the wiring pattern 35L provided on the insulating substrate 60PB, which is different from the insulating substrate 60CB1 on which the diode bridge circuit 22 and the inverter circuit 42 are mounted, pt1 and capacitor C1 pn ,C2 pn ,C3 pn ,C4 pn The bypass circuit 35 can be realized by this.

[0210] [Third example of power conversion device] Next, a third example of the power conversion device 1 according to this embodiment will be described with reference to FIG.

[0211] Hereinafter, in this example, the same symbols are used for configurations that are the same as or correspond to the first example (FIG. 1) and second example (FIG. 3) described above, and the explanation will focus on the parts that are different from the first and second examples described above, and explanations of the parts that are the same as or correspond to the first and second examples described above may be omitted.

[0212] FIG. 6 is a diagram illustrating a configuration of a third example of the power conversion device 1. In FIG.

[0213] In FIG. 6, the input terminal 10 and the output terminal 50 are omitted.

[0214] As shown in FIG. 6, the power conversion device 1 according to this example includes a capacitor C1 pn ,C2 pn The main difference from the second example described above is that the bypass electric circuit 35L is disposed so that at least a part of the bypass electric circuit 35L is interposed between each of the power supply lines 22P, 22N and the ground GND.

[0215] The power conversion device 1 includes a DC link unit 30 and a PIM 60, similar to the second example described above.

[0216] Similar to the second example described above, the PIM 60 includes an input terminal 61, an output terminal 62, a connection terminal 63, a diode bridge circuit 22, a bypass circuit 35, and an inverter circuit 42.

[0217] The bypass circuit 35 differs from the second example in that it does not include a capacitor C3 pn ,C4 pn and a bypass circuit 35L, and a capacitor C1 pn ,C2 pn is omitted.

[0218] As described above, at least a portion of the bypass electric line 35L is interposed between each of the power supply lines 22P, 22N and the ground GND, and a stray capacitance C p ,C n This reduces the stray capacitance C p ,C n are directly connected through a bypass electrical circuit 35L to electrically connect the power supply line 22P and the power supply line 22N.

[0219] The bypass circuit 35L has a stray capacitance C p ,C n The neutral point of the series connection and the capacitor C3 pn ,C4 pn The series connection is electrically connected between the neutral point of the series connection.

[0220] In this example, as in the first and second examples described above, a common mode current may be generated in the diode bridge circuit 22 due to the switching operation of the semiconductor switch SW in the inverter circuit 42. In this case, the common mode current flows through the stray capacitance C p ,C n , and the stray capacitance C between the bypass line 35L and ground GND NT flows through.

[0221] In contrast, in this example, the bypass circuit 35 has a stray capacitance C p ,C n ,C NT The high-frequency common mode current flowing through the bypass circuit 35 can be recovered (i.e., returned) to the inverter circuit 42 through the bypass circuit 35L. Therefore, the power conversion device 1 can suppress radiation noise caused by the switching operation of the semiconductor switch SW in the inverter circuit 42 by the action of the bypass circuit 35.

[0222] For example, the impedance of the bypass circuit 35 is NT This allows the common mode current to flow through the stray capacitance C NT As a result, the common mode current can be effectively recovered to the inverter circuit 42.

[0223] Furthermore, in this example, similar to the first and second examples described above, the diode bridge circuit 22 can be configured using one type of rectifier diode RD with the same structure while suppressing common mode noise originating from the diode bridge circuit 22 as a noise source. This makes it possible to avoid an increase in the variation in performance of the diode bridge circuit 22 and an increase in the effort required to manage the rectifier diode RD in order to suppress the variation in performance.

[0224] [Third example of PIM] Next, a structure of a third example of the PIM 60 according to this embodiment will be described with reference to Fig. 7 and Fig. 8. Specifically, a specific example of the structure of the PIM 60 mounted in the third example (Fig. 6) of the power conversion device 1 described above will be described.

[0225] In the following, the same symbols are used for configurations that are the same as or correspond to the first example (FIG. 4) and second example (FIG. 5) described above, and the explanation will focus on the parts that are different from the first and second examples described above, and explanations of the parts that are the same as or correspond to the first and second examples described above may be omitted.

[0226] Fig. 7 is a top view showing the structure of a third example of PIM 60. Fig. 7 includes Fig. 7A, a top view showing the overall structure of the third example of PIM 60, and Fig. 8B, a top view showing the structure of insulating substrate 60CB2 in the third example of PIM 60. Fig. 8 is a side view showing the structure of the third example of PIM 60.

[0227] In FIG. 7A, the wiring pattern 35L pt2 The portion of the insulating substrate 60CB1 that is not exposed is depicted by a broken line.

[0228] As shown in FIGS. 7 and 8, the PIM 60 according to this example has a wiring pattern 35L corresponding to the bypass electric circuit 35L on the back surface (i.e., the surface facing the negative Z-axis direction) of the insulating substrate 60CB1. pt2 This example differs from the first and second examples described above in that an insulating substrate 60CB2 on which the insulating substrate 60CB2 is provided is laminated.

[0229] The insulating substrate 60CB2 has a wiring pattern 35L on the surface in the positive direction of the Z axis. pt2 The insulating substrate 60CB2 is provided with a base member 60BS attached to the rear surface facing the negative Z-axis direction. The insulating substrate 60CB2 is, for example, a DBC substrate.

[0230] Wiring pattern 35L on insulating substrate 60CB2 pt2 As a result, the insulating substrate 60CB1 is laminated on the front side (positive direction of the Z axis) on which the wiring pattern 35L is provided. pt2 are provided adjacent to each other.

[0231] Wiring pattern 35L pt2 Include wire 35L wr The wiring pattern 35L provided on the mounting surface on the front side (positive direction of the Z axis) of the insulating substrate 60CB1 is pt1 For example, as shown in FIG. 7, when viewed from above on a rectangular insulating substrate 60CB1, the wiring pattern 35L pt2 A part of the overlapping area is cut out, and wiring pattern 35L pt2As a result, the wire 35L can be connected by soldering or the like through the cutout portion of the insulating substrate 60CB1. wr One end of the wiring pattern 35L pt2 Attached to the wire 35L wr The other end is wiring pattern 35L pt1 Can be attached to.

[0232] Capacitor C3 pn For example, one electrode is connected to the wiring pattern 42P by soldering or the like. pt1 The other electrode is attached to the wiring pattern 35L pt1 This allows the capacitor C3 pn One electrode is the wiring pattern 42P pt1 and the other electrode is electrically connected to the wiring pattern 35L. pt1 and electrically connected to each other.

[0233] Capacitor C4 pn For example, one electrode is connected to the wiring pattern 35L by soldering or the like. pt1 and the other electrode is attached to the wiring pattern 42N pt1 This allows the capacitor C4 pn One electrode is a wiring pattern 35L pt1 and the other electrode is electrically connected to the wiring pattern 42N pt1 and electrically connected to each other.

[0234] Capacitor C3 pn ,C4 pn is wiring pattern 35L pt1 and the wiring pattern 42P corresponding to the power supply line 42P. pt1 , and the wiring pattern 42N corresponding to the power supply line 42N pt1 Electrically connect between.

[0235] Wiring pattern 35L pt2 2 shows the wiring pattern 22P on the insulating substrate 60CB1 when viewed from above. pt1 ,22N pt1As a result, the wiring pattern 22P is arranged so as to overlap with each of the insulating substrates 60CB2. pt1 ,22N pt1 Each of these and wiring pattern 35L pt2 Therefore, as shown in FIG. 8, the wiring pattern 22P pt1 and wiring pattern 35L pt2 There is a stray capacitance C between p is formed, and the wiring pattern 22N pt1 and wiring pattern 35L pt2 There is a stray capacitance C between n is formed.

[0236] Also, wiring pattern 35L pt2 The wiring pattern 35L faces the base member 60BS with the insulating substrate 60CB2 interposed therebetween. pt2 and the base member 60BS corresponding to the ground GND, there is a stray capacitance C NT is formed.

[0237] Stray capacitance C p ,C n is wiring pattern 35L pt2 and the wiring pattern 22P corresponding to the power supply line 22P is connected in series through the pt1 , and 22N corresponding to the power supply line 22N pt1 Electrically connect between.

[0238] Wiring pattern 35L pt1 ,35L pt2 , and wire 35L wr is the stray capacitance C p ,C n The neutral point of the series connection and the capacitor C3 pn ,C4 pn The wiring pattern 35L is electrically connected between the neutral point of the series-connected body. pt1 ,35L pt2 , and wire 35L wr corresponds to the bypass electrical circuit 35L as a whole.

[0239] In this way, the wiring pattern 22P is formed on the back side of the insulating substrate 60CB1. pt1 ,22N pt1 Wiring pattern 35L overlapping each of the above in top view pt2 By providing p ,C n It is possible to realize a bypass circuit 35 including:

[0240] [Other embodiments] Next, another embodiment will be described.

[0241] The above-described embodiment may be modified or changed as appropriate.

[0242] For example, in the above embodiment, capacitor C1 pn may be replaced by a capacitor group including a plurality of capacitors. In this case, the plurality of capacitors may be replaced by a capacitor group including a power supply line 22P and a capacitor C2 pn may be connected in series or in parallel between them, or a combination of series and parallel connections may be used.

[0243] In the above-described embodiment and modified example, the capacitor C2 pn may be replaced by a capacitor group including multiple capacitors. In this case, the multiple capacitors may include capacitor C1 pn and the power supply line 22N in series or in parallel, or in a combination of series and parallel connections.

[0244] In the above-described embodiment and modified example, the capacitor C3 pn may be replaced by a capacitor group including multiple capacitors. In this case, the multiple capacitors are connected to the power supply line 42P and the capacitor C4 pn may be connected in series or in parallel between them, or a combination of series and parallel connections may be used.

[0245] In the above-described embodiment and modified example, the capacitor C4 pnmay be replaced by a capacitor group including multiple capacitors. In this case, the multiple capacitors may include capacitor C3 pn and the power supply line 42N in series or in parallel, or in a combination of series and parallel connections.

[0246] In the above-described embodiment and its modifications, the power conversion device 1 may drive a load device using single-phase AC supplied from an external power supply. In this case, the diode bridge circuit 22 is replaced with a diode bridge circuit that converts single-phase AC to DC.

[0247] In the above-described embodiment and its modifications, the power conversion device 1 may drive a single-phase AC load device. In this case, the inverter circuit 42 is replaced with an inverter circuit that converts DC into single-phase AC of a predetermined voltage and frequency and outputs the converted AC.

[0248] In the above-described embodiment and its modifications, the power conversion device 1 may drive a DC load device. In this case, the inverter circuit 42 is replaced with a DC (Direct Current) / DC converter circuit as a switching circuit that converts the DC of the DC link unit 30 into DC of a predetermined voltage and outputs it.

[0249] [Effect] Next, the operation of the power conversion device according to this embodiment will be described.

[0250] In a first aspect of this embodiment, the power conversion device includes a bridge circuit, a switching circuit, a first series-connected body, a second series-connected body, and an electric path. The power conversion device may further include a DC line. The power conversion device is, for example, the above-described power conversion device 1. The power conversion device may also be the above-described PIM 60. The bridge circuit is, for example, the above-described diode bridge circuit 22. The switching circuit is, for example, the above-described inverter circuit 42. The first series-connected body is, for example, the above-described capacitor C1. pn ,C2 pnThe first series connection is a series connection of the above-mentioned stray capacitance C p ,C n The second series connection may be the above-mentioned capacitor C3 pn ,C4 pn The first series-connected body is a series-connected body of the above-mentioned diodes. The electric circuit is the bypass electric circuit 35L described above. The DC line is, for example, the DC line 31 described above. Specifically, the bridge circuit has a plurality of legs connected in parallel, each leg including two diodes, an upper arm and a lower arm, connected in series. The two diodes are, for example, the above-mentioned rectifier diodes RD1 and RD2, rectifier diodes RD3 and RD4, or rectifier diodes RD5 and RD6. The switching circuit is connected to the other end of the DC line and includes a semiconductor switch. The semiconductor switch is, for example, the above-mentioned semiconductor switches SW1 to SW6. The first series-connected body is provided to connect the positive and negative output terminals of the bridge circuit, and two capacitance components are connected in series. The second series-connected body is provided to connect the positive and negative input terminals of the switching circuit, and two capacitance components are connected in series. The electric circuit connects the neutral points of the two capacitance components of the first series-connected body and the second series-connected body. Furthermore, the DC line may include a positive line and a negative line, one end of which is connected to the output of the bridge circuit and the other end of which is connected to the input of the switching circuit. The positive line and the negative line are, for example, the positive line 31P and the negative line 31N described above.

[0251] This allows the power conversion device to recover (i.e., return) the common-mode noise current generated in the bridge circuit due to the switching operation of the semiconductor switches included in the switching circuit to the switching circuit via the bypass electric path, thereby making it possible for the power conversion device to suppress radiation noise caused by, for example, the common-mode noise current generated in the bridge circuit due to the switching operation of the semiconductor switches included in the switching circuit flowing out to the input power supply.

[0252] In a second aspect of this embodiment, based on the first aspect described above, the first series-connected body may be a first capacitor or a first capacitor group consisting of a plurality of capacitors, and a second capacitor or a second capacitor group consisting of a plurality of capacitors, connected in series. The first capacitor may be, for example, the above-described capacitor C1 pn The first capacitor group may be, for example, the capacitor C1 pn The second capacitor is, for example, the above-mentioned capacitor C2 pn The second capacitor group may be, for example, the capacitor C2 pn The second series connection may be a third capacitor or a third capacitor group consisting of a plurality of capacitors, and a fourth capacitor or a fourth capacitor group consisting of a plurality of capacitors, connected in series. The third capacitor may be, for example, the above-mentioned capacitor C3 pn The third capacitor group may be, for example, the capacitor C3 pn The fourth capacitor is, for example, the above-mentioned capacitor C4 pn The fourth capacitor group may be, for example, the capacitor C4 in the above-described modified example. pn These are capacitors that replace the

[0253] As a result, the power conversion device can recover common-mode noise currents generated in the bridge circuit due to the switching operation of the semiconductor switches included in the switching circuit to the switching circuit by using the first capacitor or first capacitor group, the second capacitor or second capacitor group, the third capacitor or third capacitor group, and the fourth capacitor or fourth capacitor group, as well as a bypass circuit.

[0254] In a third aspect of the present embodiment, based on the second aspect described above, the impedance of a circuit portion including the first series-connected body, the second series-connected body, and the electric path may be smaller than the impedance of the stray capacitance of the bridge circuit. The circuit portion including the first series-connected body, the second series-connected body, and the electric path is, for example, the bypass circuit 35 described above.

[0255] This allows the power conversion device to efficiently recover common-mode noise currents generated in the bridge circuit due to the switching operations of the semiconductor switches included in the switching circuit, to the switching circuit via the bypass electrical path.

[0256] In a fourth aspect of this embodiment, based on the second or third aspect described above, the first capacitor or first capacitor group and the second capacitor or second capacitor group may have the same capacitance, and the third capacitor or third capacitor group and the fourth capacitor or fourth capacitor group may have the same capacitance.

[0257] This allows the power conversion device to balance the positive and negative DC lines and suppress common-mode noise currents.

[0258] In addition, in a fifth aspect of this embodiment, based on any one of the second to fourth aspects described above, the power conversion device may include a substrate, a first wiring pattern, a second wiring pattern, a third wiring pattern, a fourth wiring pattern, and a fifth wiring pattern. The substrate is, for example, the insulating substrate 60CB1 shown in FIG. 4 described above. The first wiring pattern is, for example, the wiring pattern 22P shown in FIG. 4 described above. pt1 The second wiring pattern is, for example, the wiring pattern 22N in FIG. pt2 The third wiring pattern is, for example, the wiring pattern 42P in FIG. pt1 The fourth wiring pattern is, for example, the wiring pattern 42N in FIG. pt1The fifth wiring pattern is, for example, the wiring pattern 35L in FIG. pt1 Specifically, the bridge circuit and the switching circuit may be mounted on the substrate. The first wiring pattern may be provided on the substrate and correspond to a positive output portion of the bridge circuit. The second wiring pattern may be provided on the substrate and correspond to a negative output portion of the bridge circuit. The third wiring pattern may be provided on the substrate and correspond to a positive input portion of the switching circuit. The fourth wiring pattern may be provided on the substrate and correspond to a negative input portion of the switching circuit. The fifth wiring pattern may be provided on the substrate and correspond to the electrical path. The first capacitor or the first capacitor group may have a positive terminal connected to the first wiring pattern and a negative terminal connected to the fifth wiring pattern. The second capacitor or the second capacitor group may have a positive terminal connected to the fifth wiring pattern and a negative terminal connected to the second wiring pattern. The third capacitor or the third capacitor group may have a positive terminal connected to the third wiring pattern and a negative terminal connected to the fifth wiring pattern, and the fourth capacitor or the fourth capacitor group may have a positive terminal connected to the fifth wiring pattern and a negative terminal connected to the fourth wiring pattern.

[0259] This allows the power conversion device to realize a structure that allows common-mode noise currents generated in the bridge circuit due to the switching operations of the semiconductor switches included in the switching circuit to be recovered in the switching circuit.

[0260] In addition, in a sixth aspect of the present embodiment, based on any one of the second to fourth aspects described above, the power conversion device may include a first substrate, a second substrate, a sixth wiring pattern, a seventh wiring pattern, an eighth wiring pattern, a ninth wiring pattern, a tenth wiring pattern, an eleventh wiring pattern, a first connecting member, a twelfth wiring pattern, a second connecting member, a thirteenth wiring pattern, a third connecting member, a fourteenth wiring pattern, and a fourth connecting member. The first substrate is, for example, the insulating substrate 60CB1 shown in FIG. 5 described above. The second substrate is, for example, the insulating substrate 60PB shown in FIG. 5 described above. The sixth wiring pattern is, for example, the wiring pattern 22P shown in FIG. 5 described above. pt1 The seventh wiring pattern is, for example, the wiring pattern 22N in FIG. pt1 The eighth wiring pattern is, for example, the wiring pattern 42P in FIG. pt1 The ninth wiring pattern is, for example, the wiring pattern 42N in FIG. pt1 The tenth wiring pattern is, for example, the wiring pattern 35L in FIG. pt1 The eleventh wiring pattern is, for example, the wiring pattern 22P in FIG. pt2 The first connection member is, for example, the connection terminal Pd in ​​FIG. 5. The twelfth wiring pattern is, for example, the wiring pattern 22N in FIG. 5. pt2 The second connecting member may be, for example, the connecting member 22N shown in FIG. cr The thirteenth wiring pattern is, for example, the wiring pattern 42P in FIG. pt2 The third connecting member is, for example, the connecting member 42P shown in FIG. cr The fourteenth wiring pattern is, for example, the wiring pattern 42N in FIG. pt2 The fourth connecting member may be, for example, the connecting member 42N shown in FIG. crSpecifically, the bridge circuit and the switching circuit may be mounted on the first substrate. The second substrate may be disposed so as to be spaced apart from the first substrate. The sixth wiring pattern may be provided on the first substrate and correspond to a positive output portion of the bridge circuit. The seventh wiring pattern may be provided on the first substrate and correspond to a negative output portion of the bridge circuit. The eighth wiring pattern may be provided on the first substrate and correspond to a positive input portion of the switching circuit. The ninth wiring pattern may be provided on the first substrate and correspond to a negative input portion of the switching circuit. The tenth wiring pattern may be provided on the second substrate and correspond to the electrical path. The eleventh wiring pattern may be provided on the second substrate. The first connecting member may electrically connect the sixth wiring pattern and the eleventh wiring pattern between the first substrate and the second substrate. The twelfth wiring pattern may be provided on the second substrate. The second connecting member may electrically connect the seventh wiring pattern and the twelfth wiring pattern between the first substrate and the second substrate. The thirteenth wiring pattern may be provided on the second substrate. The third connecting member may electrically connect the eighth wiring pattern and the thirteenth wiring pattern between the first substrate and the second substrate. The fourteenth wiring pattern may be provided on the second substrate. The fourth connecting member may electrically connect the ninth wiring pattern and the fourteenth wiring pattern between the first substrate and the second substrate. The first capacitor or the first capacitor group may have a positive terminal connected to the eleventh wiring pattern and a negative terminal connected to the tenth wiring pattern. Furthermore, the second capacitor or the second capacitor group may have a positive terminal connected to the tenth wiring pattern and a negative terminal connected to the twelfth wiring pattern.The third capacitor or the third capacitor group may have a positive terminal connected to the thirteenth wiring pattern and a negative terminal connected to the tenth wiring pattern. The fourth capacitor or the fourth capacitor group may have a positive terminal connected to the tenth wiring pattern and a negative terminal connected to the fourteenth wiring pattern.

[0261] This allows the power conversion device to realize a structure that allows common-mode noise currents generated in the bridge circuit due to the switching operations of the semiconductor switches included in the switching circuit to be recovered in the switching circuit.

[0262] In a seventh aspect of this embodiment, based on the first aspect described above, at least a portion of the electric circuit may be disposed between each of the positive and negative output portions of the bridge circuit and a conductive portion corresponding to a reference potential. The first series-connected body may have two capacitance components, a first stray capacitance between the positive output portion of the bridge circuit and the electric circuit, and a second stray capacitance between the electric circuit and the negative output portion of the bridge circuit, connected in series via the electric circuit. The first stray capacitance and the second stray capacitance may be, for example, the stray capacitance C p and stray capacitance C n The second series connection may be a fifth capacitor or a fifth capacitor group consisting of a plurality of capacitors, and a sixth capacitor or a sixth capacitor group consisting of a plurality of capacitors, which are connected in series. The fifth capacitor may be, for example, the capacitor C3 in FIG. 6 described above. pn The fifth capacitor group is, for example, a capacitor group that is replaced with a capacitor in the above-mentioned modified example. The sixth capacitor is the capacitor C4 in FIG. pn In the above-described modified example, the sixth capacitor group includes the capacitor C4 pn These are the capacitors that are replaced by

[0263] As a result, by using the first and second stray capacitances, the fifth capacitor or fifth capacitor group and the sixth capacitor or sixth capacitor group, and the bypass circuit, the power conversion device can recover the common-mode noise current generated in the bridge circuit due to the switching operation of the semiconductor switch included in the switching circuit to the switching circuit.

[0264] In addition, in an eighth aspect of this embodiment, based on the seventh aspect described above, the power conversion device may include a third substrate, a fourth substrate, a fifteenth wiring pattern, a sixteenth wiring pattern, a seventeenth wiring pattern, an eighteenth wiring pattern, a nineteenth wiring pattern, a twentieth wiring pattern, and a fifth connecting member. The third substrate is, for example, the insulating substrate 60CB1 described above in FIG. 7. The fourth substrate is, for example, the insulating substrate 60CB2 described above. The fifteenth wiring pattern is, for example, the wiring pattern 22P described above in FIG. 6. pt1 The sixteenth wiring pattern is, for example, the wiring pattern 22N in FIG. pt1 The seventeenth wiring pattern is, for example, the wiring pattern 42P in FIG. pt1 The 18th wiring pattern is, for example, the wiring pattern 42N in FIG. pt1 The nineteenth wiring pattern is, for example, the wiring pattern 35L in FIG. pt1 The 20th wiring pattern is, for example, the wiring pattern 35L in FIG. pt2 The fifth connecting member is, for example, the wire 35L in FIG. wrSpecifically, the bridge circuit and the switching circuit may be mounted on the third substrate. The fourth substrate may be disposed on the opposite side of the third substrate from the mounting surface of the bridge circuit and the switching circuit. The fifteenth wiring pattern may be provided on the mounting surface of the third substrate and correspond to a positive output portion of the bridge circuit. The sixteenth wiring pattern may be provided on the mounting surface of the third substrate and correspond to a negative output portion of the bridge circuit. The seventeenth wiring pattern may be provided on the mounting surface of the third substrate and correspond to a positive input portion of the switching circuit. The eighteenth wiring pattern may be provided on the mounting surface of the third substrate and correspond to a negative input portion of the switching circuit. The nineteenth wiring pattern may be provided on the mounting surface of the third substrate. The 20th wiring pattern may be provided on a surface of the fourth substrate facing the third substrate and may be arranged to overlap at least a portion of both the 15th wiring pattern and the 16th wiring pattern when the third substrate and the fourth substrate are viewed in a plan view. The fifth connecting member may electrically connect the 19th wiring pattern and the 20th wiring pattern between the third substrate and the fourth substrate. The electrical path may include the 19th wiring pattern, the 20th wiring pattern, and the fifth connecting member. The first stray capacitance may be formed between the 15th wiring pattern and the 20th wiring pattern. The second stray capacitance may be formed between the 16th wiring pattern and the 20th wiring pattern. The fifth capacitor or the fifth capacitor group may have a positive terminal connected to the 17th wiring pattern and a negative terminal connected to the 19th wiring pattern. The sixth capacitor or the sixth capacitor group may have a negative terminal connected to the nineteenth wiring pattern and a negative terminal connected to the eighteenth wiring pattern.

[0265] This allows the power conversion device to realize a structure that allows common-mode noise currents generated in the bridge circuit due to the switching operations of the semiconductor switches included in the switching circuit to be recovered in the switching circuit.

[0266] In addition, in a ninth aspect of this embodiment, based on the seventh or eighth aspect described above, the impedance of a circuit portion including the second series-connected body and the electric path may be smaller than the impedance of a combined capacitance of a third stray capacitance between the electric path and a conductive part corresponding to a reference potential. The third stray capacitance may be, for example, the above-mentioned stray capacitance C NT is.

[0267] This allows the power conversion device to efficiently recover common-mode noise currents generated in the bridge circuit due to the switching operations of the semiconductor switches included in the switching circuit, to the switching circuit via the bypass electrical path.

[0268] Furthermore, in a tenth aspect of this embodiment, assuming any one of the seventh to ninth aspects described above, the capacitances of the fifth capacitor or the fifth capacitor group and the sixth capacitor or the sixth capacitor group may be equal.

[0269] This allows the power conversion device to balance the positive and negative DC lines and suppress common-mode noise currents.

[0270] In addition, in an eleventh aspect of this embodiment, assuming any one of the first to tenth aspects described above, the diode chips included in the bridge circuit may all have the same mounting direction relative to the substrate.

[0271] For example, it is possible to devise a mounting structure for diodes to suppress common-mode noise currents generated in bridge circuits due to the switching operation of semiconductor switches included in switching circuits. However, when considering the mounting structure for diodes, it may become necessary to mount each diode in a different direction on the board. This may require the use of multiple types of diode chips, which may result in increased variation in the performance of the bridge circuit.

[0272] In contrast, the power conversion device of this embodiment can recover common-mode noise current to the switching circuit through the bypass circuit, which allows the use of the same type of diode chips, thereby suppressing variations in the performance of the bridge circuit.

[0273] Although the embodiments have been described in detail above, the present disclosure is not limited to such specific embodiments, and various modifications and variations are possible within the scope of the gist described in the claims. [Explanation of symbols]

[0274] 1 Power conversion device 10 Input terminal 10E Ground terminal 10R, 10S, 10T input terminals 20 Converter Module 21 Input terminal 21R, 21S, 21T input terminals 22 Diode bridge circuit 22N power wire 22N cr Connection parts 22N pt1 Wiring pattern 22N pt2 Wiring pattern 22N wr1 ,22N wr2 ,22N wr3 ,22N wr4 Wire 22P power wire 22Ppt1 Wiring pattern 22P pt2 Wiring pattern 22R power line 22R pt Wiring pattern 22R wr Wire 22S power line 22S pt Wiring pattern 22S wr Wire 22T power line 22T pt Wiring pattern 22T wr Wire 23 Output terminal 23N, 23P output terminals 30 DC link section 31 DC line 31N negative line 31N1, 31N2 negative line 31P positive line 31P1, 31P2 positive line 32 Smoothing circuit 35 Bypass circuit 35L bypass circuit 35L pt1 Wiring pattern 35L pt2 Wiring pattern 35L wr Wire 40 Inverter Module 41 Input terminal 41N, 41P input terminal 42 Inverter circuit 42N power wire 42N cr Connection parts 42N pt1 Wiring pattern 42N pt2 Wiring pattern 42N wr1 ,42N wr2 ,42N wr3 ,42N wr4 ,42N wr5 ,42N wr6 Wire 42P power wire 42 pages cr Connection parts 42 pages pt1 Wiring pattern 42 pages pt2 Wiring pattern 42U power line 42U pt1 ,42U pt2 Wiring pattern 42U wr1 ,42U wr2 ,42U wr3 Wire 42V power line 42V pt1 ,42V pt2 Wiring pattern 42V wr1 ,42V wr2 ,42V wr3 Wire 42W power line 42W pt1 ,42W pt2 Wiring pattern 42W wr1 ,42W wr2 ,42W wr3 Wire 43 Output terminal 43U, 43V, 43W output terminal 50 output terminal 50E Ground terminal 50U, 50V, 50W output terminal 60 PIM 60BS base material 60CB1 Insulating substrate 60CB2 insulating substrate 60PB insulating substrate 61 Input terminal 61R, 61S, 61T input terminals 62 Output terminal 62U, 62V, 62W output terminal 63 Connection terminal 63N, 63P connection terminal C1 pn ,C2 pn capacitor C3 pn ,C4 pncapacitor C n Stray capacitance C NT Stray capacitance C p Stray capacitance FD1~FD6 Freewheeling diodes GND Ground Nd,Ni connection terminal Pd,Pi connection terminal RD1~RD6 rectifier diodes SW1~SW6 semiconductor switches

Claims

1. a bridge circuit in which a plurality of legs, each including two diodes of an upper arm and a lower arm connected in series, are connected in parallel; a switching circuit including a semiconductor switch; a first series-connected body provided to connect the positive and negative output portions of the bridge circuit, the first series-connected body including two capacitance components connected in series; a second series-connected body provided to connect the positive and negative input portions of the switching circuit together, the second series-connected body including two capacitance components connected in series; an electric path connecting the neutral points of the two capacitance components of the first series-connected body and the second series-connected body, Power conversion device.

2. the first series-connected body is a first capacitor group consisting of a first capacitor or a plurality of capacitors, and a second capacitor or a second capacitor group consisting of a plurality of capacitors, connected in series; the second series-connected body is a third capacitor or a third capacitor group consisting of a plurality of capacitors, and a fourth capacitor or a fourth capacitor group consisting of a plurality of capacitors, connected in series; The power conversion device according to claim 1 .

3. an impedance of a circuit portion including the first series-connected body, the second series-connected body, and the electric path is smaller than an impedance of a stray capacitance of the bridge circuit; The power conversion device according to claim 2 .

4. a substrate on which the bridge circuit and the switching circuit are mounted; a first wiring pattern provided on the substrate and corresponding to a positive output portion of the bridge circuit; a second wiring pattern provided on the substrate and corresponding to a negative output portion of the bridge circuit; a third wiring pattern provided on the substrate and corresponding to a positive input portion of the switching circuit; a fourth wiring pattern provided on the substrate and corresponding to a negative input portion of the switching circuit; a fifth wiring pattern provided on the substrate and corresponding to the electrical path; a positive terminal of the first capacitor or the first capacitor group is connected to the first wiring pattern and a negative terminal of the first capacitor or the first capacitor group is connected to the fifth wiring pattern; a positive terminal of the second capacitor or the second capacitor group is connected to the fifth wiring pattern and a negative terminal of the second capacitor or the second capacitor group is connected to the second wiring pattern; the third capacitor or the third capacitor group has a positive terminal connected to the third wiring pattern and a negative terminal connected to the fifth wiring pattern; The fourth capacitor or the fourth capacitor group has a positive terminal connected to the fifth wiring pattern and a negative terminal connected to the fourth wiring pattern. The power conversion device according to claim 2 or 3.

5. a first substrate on which the bridge circuit and the switching circuit are mounted; a second substrate disposed so as to be spaced apart from the first substrate; a sixth wiring pattern provided on the first substrate and corresponding to a positive output portion of the bridge circuit; a seventh wiring pattern provided on the first substrate and corresponding to a negative output portion of the bridge circuit; an eighth wiring pattern provided on the first substrate and corresponding to a positive input portion of the switching circuit; a ninth wiring pattern provided on the first substrate and corresponding to a negative input portion of the switching circuit; a tenth wiring pattern provided on the second substrate and corresponding to the electrical path; an eleventh wiring pattern provided on the second substrate; a first connecting member that electrically connects the sixth wiring pattern and the eleventh wiring pattern between the first substrate and the second substrate; a twelfth wiring pattern provided on the second substrate; a second connection member that electrically connects the seventh wiring pattern and the twelfth wiring pattern between the first substrate and the second substrate; a thirteenth wiring pattern provided on the second substrate; a third connection member that electrically connects the eighth wiring pattern and the thirteenth wiring pattern between the first substrate and the second substrate; a fourteenth wiring pattern provided on the second substrate; a fourth connection member that electrically connects the ninth wiring pattern and the fourteenth wiring pattern between the first substrate and the second substrate, a positive terminal of the first capacitor or the first capacitor group is connected to the eleventh wiring pattern and a negative terminal of the first capacitor or the first capacitor group is connected to the tenth wiring pattern; the second capacitor or the second capacitor group has a positive terminal connected to the tenth wiring pattern and a negative terminal connected to the twelfth wiring pattern; the third capacitor or the third capacitor group has a positive terminal connected to the thirteenth wiring pattern and a negative terminal connected to the tenth wiring pattern; The fourth capacitor or the fourth capacitor group has a positive terminal connected to the tenth wiring pattern and a negative terminal connected to the fourteenth wiring pattern. The power conversion device according to claim 2 or 3.

6. at least a portion of the electric path is disposed between each of the positive and negative output portions of the bridge circuit and a conductive portion corresponding to a reference potential; the first series-connected body is configured such that a first stray capacitance between the positive output part of the bridge circuit and the electric circuit and a second stray capacitance between the electric circuit and the negative output part of the bridge circuit are connected in series via the electric circuit; the second series-connected body includes a fifth capacitor or a fifth capacitor group including a plurality of capacitors, and a sixth capacitor or a sixth capacitor group including a plurality of capacitors, connected in series; The power conversion device according to claim 1 .

7. a third substrate on which the bridge circuit and the switching circuit are mounted; a fourth substrate disposed on the opposite side of the third substrate from the mounting surface on which the bridge circuit and the switching circuit are mounted; a fifteenth wiring pattern provided on the mounting surface of the third substrate and corresponding to a positive output portion of the bridge circuit; a sixteenth wiring pattern provided on the mounting surface of the third substrate and corresponding to a negative output portion of the bridge circuit; a seventeenth wiring pattern provided on the mounting surface of the third substrate and corresponding to a positive input portion of the switching circuit; an eighteenth wiring pattern provided on the mounting surface of the third substrate and corresponding to a negative input portion of the switching circuit; a nineteenth wiring pattern provided on the mounting surface of the third substrate; a twentieth wiring pattern provided on one surface of the fourth substrate facing the third substrate, and arranged so as to overlap at least a portion of both the fifteenth wiring pattern and the sixteenth wiring pattern when the third substrate and the fourth substrate are seen in a plan view; a fifth connection member that electrically connects the nineteenth wiring pattern and the twentieth wiring pattern between the third substrate and the fourth substrate, the electrical path includes the nineteenth wiring pattern, the twentieth wiring pattern, and the fifth connecting member, the first stray capacitance is formed between the fifteenth wiring pattern and the twentieth wiring pattern, the second stray capacitance is formed between the sixteenth wiring pattern and the twentieth wiring pattern, The fifth capacitor or the fifth capacitor group has a positive terminal connected to the seventeenth wiring pattern and a negative terminal connected to the nineteenth wiring pattern, The sixth capacitor or the sixth capacitor group has a negative terminal connected to the nineteenth wiring pattern and a negative terminal connected to the eighteenth wiring pattern. The power conversion device according to claim 6.

8. an impedance of a circuit portion including the second series connection and the electric path is smaller than an impedance of a combined capacitance of a third stray capacitance between the electric path and a conductive portion corresponding to a reference potential; The power conversion device according to claim 6 or 7.

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