Pressure sensor with high pressure seal

Abstract

Components for high pressure sealing of pressure sensors may include joints that require precision machining and welding, causing failure during seating, fitting, and / or welding of the joints.SOLUTION: The pressure sensor comprises a hex bolt assembly comprising a hex port and an inlet coupled to a base of the hex port, a header configured at the base of the hex port, the header comprising (i) a groove in a circumference of said header, (ii) an o-ring in the groove forming a sealed joint between the groove and a sidewall of the hex port, and (iii) a sensor die (a) embedded within a cavity of the header and (b) interfaced with the inlet, and a retainer ring configured within the hex port to retain the header between the retainer ring and the inlet.SELECTED DRAWING: None

Description

[Technical Field]

[0001] Various embodiments of the present disclosure relate to pressure sensors and, more particularly, to designs for high pressure seals in pressure sensors. [Background technology]

[0002] Pressure sensors may be used in high-pressure applications involving measurement of hostile media under harsh environmental conditions. Existing pressure sensor designs may include multiple components connected to achieve a desired high-pressure seal. For example, the components of a conventional high-pressure sensor may include fittings that require precision machining and welding. Furthermore, any imperfections in the seating, mating, and / or welding of the fittings may cause sealing problems.

[0003] Applicant recognizes many technical challenges and difficulties associated with providing high pressure sealing in conventional pressure sensors. Summary of the Invention

[0004] Various embodiments described herein relate to components and devices for measuring the pressure of a medium.

[0005] According to various embodiments of the present disclosure, a pressure sensor is provided. In some embodiments, the pressure sensor includes a hex bolt assembly including a hex port and an inlet coupled to a base of the hex port, a header configured at the base of the hex port, the header including (i) a groove in a circumference of the header and (ii) an O-ring in the groove that forms a sealing joint between the groove and a side wall of the hex port, and a retainer ring configured within the hex port to retain the header between the retainer ring and the inlet.

[0006] In some embodiments, the retaining ring is welded into the hex port. In some embodiments, the header further comprises a sensor die (i) embedded in the cavity of the header and (ii) interfaced with the inlet. In some embodiments, the pressure sensor further comprises one or more electrical contacts and a printed circuit board assembly coupled to the one or more electrical contacts and the sensor die. In some embodiments, the one or more electrical contacts (i) are soldered to the printed circuit board assembly and (ii) are configured to conduct an electrical output generated by the sensor die. In some embodiments, the inlet is configured to receive media from the pressure line and guide it to the hex port. In some embodiments, the hex port comprises a cylindrically shaped internal cavity defined by internal cavity sidewalls within the hex bolt assembly. In some embodiments, the hex port comprises a simple bore internal cavity sidewall. In some embodiments, the retaining ring comprises a tubular shape with a uniform or tapered circumference approximately equal to or less than the circumference of the hex port.

[0007] According to another embodiment, a pressure sensor includes a hex bolt assembly including a hex port and an inlet coupled to a base of the hex port; a header configured at the base of the hex port, the header including (i) a groove in the circumference of the header and (ii) an O-ring in the groove that forms a sealing joint between the groove and a side wall of the hex port; and a circlip configured within the hex port to retain the header between the circlip and the inlet.

[0008] In some embodiments, the hex port comprises a hex port groove. In some embodiments, the hex port groove is spaced from the end of the hex port opposite the inlet at a distance that allows clearance above the header when the header is seated against the base of the hex port. In some embodiments, a circlip is configured within the hex port groove. In some embodiments, the circlip is configured to retain the header within the hex port by pinning the header below the circlip when the circlip is configured within the hex port groove. In some embodiments, the header further comprises a sensor die (i) embedded within the cavity of the header and (ii) interfaced with the inlet. In some embodiments, the inlet is configured to receive media from the pressure line and guide it to the hex port. In some embodiments, the hex port comprises a cylindrically shaped internal cavity defined by internal cavity sidewalls within the hex bolt assembly. In some embodiments, the header further comprises a sensor die (i) embedded within the cavity of the header and (ii) interfaced with the inlet. In some embodiments, the pressure sensor further comprises one or more electrical contacts and a printed circuit board assembly coupled to the one or more electrical contacts and the sensor die, In some embodiments, the one or more electrical contacts (i) are soldered to the printed circuit board assembly and (ii) are configured to conduct an electrical output generated by the sensor die.

[0009] The foregoing illustrative summary, as well as other illustrative objects and / or advantages of the present disclosure, and the manner in which they are accomplished, are further described in the following detailed description and its accompanying drawings. [Brief explanation of the drawings]

[0010] The description of illustrative embodiments may be read in conjunction with the accompanying figures. Unless otherwise noted, it will be understood that for simplicity and clarity of illustration, elements illustrated in the figures have not necessarily been drawn to scale. For example, unless otherwise noted, the dimensions of some of the elements may be exaggerated relative to other elements. Embodiments incorporating the teachings of the present disclosure are shown and described in connection with the figures presented herein. [Figure 1A] FIG. 1 is a perspective view of an exemplary pressure sensor. [Figure 1B] FIG. 1 is an exploded cross-sectional view of an exemplary pressure sensor. [Figure 1C] 1 illustrates a cross-sectional view of an exemplary pressure sensor. [Figure 1D] 1 illustrates a cross-sectional view of an exemplary pressure sensor. [Figure 2A] FIG. 1 is a perspective view of an exemplary pressure sensor according to some embodiments of the present disclosure. [Figure 2B] FIG. 1 is an exploded cross-sectional view of an exemplary pressure sensor according to some embodiments of the present disclosure. [Figure 2C] 1 is a cross-sectional view of an exemplary pressure sensor according to some embodiments of the present disclosure. [Figure 3A] FIG. 1 is a perspective view of an exemplary pressure sensor according to some embodiments of the present disclosure. [Figure 3B] FIG. 1 is an exploded cross-sectional view of an exemplary pressure sensor according to some embodiments of the present disclosure. [Figure 3C] 1 is a cross-sectional view of an exemplary pressure sensor according to some embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0011] Certain embodiments of the present disclosure will now be described more fully below with reference to the accompanying drawings, in which some, but not all, embodiments of the present disclosure are shown. Indeed, these disclosures may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements. Like numbers refer to like elements throughout.

[0012] As used herein, terms such as "front," "rear," "top," etc. are used for descriptive purposes to describe the relative location of certain components or portions of components in the examples provided below. Additionally, as will be apparent to those skilled in the art in view of this disclosure, the terms "substantially" and "approximately" indicate that the referenced component or associated description is accurate to within applicable engineering tolerances.

[0013] As used herein, the term "comprising" means including, but not limited to, and should be interpreted in the manner typically used in patent contexts. The use of broader terms such as "comprises," "includes," and "having" should be understood to support narrower terms such as "consisting of," "consisting essentially of," and "comprised substantially of."

[0014] The phrases "in one embodiment," "according to one embodiment," and the like generally mean that the particular feature, structure, or characteristic that follows the phrase may be included in at least one embodiment of the present disclosure, and may be included in more than one embodiment of the present disclosure (importantly, such phrases do not necessarily refer to the same embodiment).

[0015] The words "example" or "exemplary" are used herein to mean "serving as an example, instance, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments.

[0016] When the specification states that a component or feature "may include," "can include," "could include," "should include," "will include," "preferably include," "potentially include," "optionally include," "e.g., include," "often include," or "might include" (or other such language), or that a characteristic "may have," "can have," "could have," "should have," "will have," "preferably have," "potentially have," "optionally have," "e.g., have," "often have," or "might have" (or other such language), that particular component or feature need not be included or have that characteristic. Such a component or feature may be optionally included in or excluded from some embodiments.

[0017] As noted above, there are many technical challenges and difficulties associated with providing a high pressure seal in a pressure sensor.

[0018] FIG. 1A is a perspective view of an exemplary pressure sensor 100. As shown in FIG. 1A, the pressure sensor 100 includes a hex bolt assembly 120, a plurality of electrical contacts 124, and a retainer ring 106. The plurality of electrical contacts 124 may be coupled to sensor electronics housed within the hex bolt assembly 120. The retainer ring 106 may include a ring attached to the electrical contact (e.g., electrical contacts 124) end of the hex bolt assembly 120 and configured to retain the sensor electronics and other pressure sensor components within the hex bolt assembly 120. The hex bolt assembly 120 includes a hex portion 130 and threads 132. The hex portion 130 allows a tool to apply torque to the hex bolt assembly 120 so that the threads 132 can be fastened or unfastened to a system to be measured.

[0019] 1B is an exploded cross-sectional view of the exemplary pressure sensor 100. The hex bolt assembly 120 further includes a hex port 102 and an inlet 118. The hex port 102 may include a cylindrically shaped internal cavity defined by internal cavity sidewalls within the hex bolt assembly 120. The inlet 118 may be configured to receive a medium (e.g., a fluid) from a pressure line and guide it to the hex port 102. The pressure sensor 100 further includes a header 104. The header 104 includes (i) a sensor die 108 embedded within a chamber of the header 104, (ii) a fill fluid within the chamber, and (iii) a diaphragm 136 providing an interface between the sensor die 108, the fill fluid, and the inlet 118. The printed circuit board assembly (PCBA) 134 may include circuitry coupled to the electrical contacts 124 and the sensor die 108.

[0020] 1C and 1D show cross-sectional views of an exemplary pressure sensor 100. A header 104 is configured within a hex port 102 of a hex bolt assembly 120. The header 104 is configured within the hex port 102, and a sensor die 108 (i) is seated with the header 104 at the base of the hex port 102 and (ii) faces the inlet 118. Thus, media received at the inlet 118 can be measured by the sensor die 108.

[0021] The pressure sensor 100 further includes a retainer ring 106 partially seated within the internal cavity of the hex port 202 and above the header 204. The retainer ring 106 includes a plurality of external notched edges that complement and fit within gaps or grooves formed between a portion of the hex port 102 (or the internal cavity wall of the hex bolt assembly 120) and a portion of the exterior wall of the header 104. Thus, a plurality of contact points are formed between the retainer ring 106, the header 104, and the hex bolt assembly 120, which includes a first joint 110 and a second joint 112. The first joint 110 includes an intersection of a collar edge of the hex bolt assembly 120 and a flange edge of the retainer ring 106. The second fitting 112 comprises an intersection of (i) a notch including a portion of the hex port 102, (ii) a collar of the retaining ring 106, and (iii) an outcrop of the header 104. The first fitting 110 and the second fitting 112 may be further welded to provide a leak-proof seal. In some embodiments, the first fitting 110 may comprise a weld joining the intersection of a collar edge of the hex bolt assembly 120 and a flange edge of the retaining ring 106. In some embodiments, the second fitting 112 may comprise a weld joining the intersection of (i) a notch including a portion of the hex port 102, and (ii) an outcrop of the header 104. An O-ring 114 is configured within an internal groove of the retaining ring 106 to provide an additional sealing joint 116.

[0022] 1D , despite welding, a weld leak path 140 may be formed at the first fitting 110 and the second fitting 112. Furthermore, the header 104 may include a groove 122 that is not utilized within the pressure sensor 100 and does not serve any particular purpose. Thus, the pressure sensor 100 has several disadvantages, including (i) the need for precision welding at the first fitting 110 and the second fitting 112, (ii) unused machining of the header 104 to create the groove 122, (iii) the need for precision machining of the hex port 102 or hex bolt assembly 120 and the retainer ring 106 to create the first fitting 110 and the second fitting 112, and (iv) high product costs, quality issues, and manufacturing lead times resulting from the disadvantages caused by disadvantages (i)-(iii).

[0023] Various exemplary embodiments of the present disclosure overcome the aforementioned technical challenges and difficulties in pressure sensors and provide various technical advances and improvements. According to various embodiments of the present disclosure, pressure sensor components and pressure sensor component configurations in exemplary pressure sensors having improved high-pressure sealing are disclosed. In some embodiments, a pressure sensor assembly includes a hex port and a header seated within the hex port. The hex port may include (i) a groove seated with an O-ring, and (ii) a simple machined port interfaced with the header, secured within the hex port via (a) a retaining ring welded to the hex port or (b) a circlip configured within the groove in the hex port.

[0024] 2A is a perspective view of an exemplary pressure sensor 200 according to some embodiments of the present disclosure. The pressure sensor 200 includes a hex bolt assembly 220, a plurality of electrical contacts 224, and a retainer ring 206. The plurality of electrical contacts 224 may be coupled to sensor electronics housed within the hex bolt assembly 220. The retainer ring 206 may include a ring inserted into an opening in the electrical contact (e.g., electrical contact 224) end of the hex bolt assembly 220 and configured to retain the sensor electronics and other pressure sensor components within the hex bolt assembly 220. The hex bolt assembly 220 includes a hex portion 230 and threads 232. The hex portion 230 allows a tool to apply torque to the hex bolt assembly 220 so that the threads 232 can be fastened or unfastened to the system being measured.

[0025] 2B is an exploded cross-sectional view of an exemplary pressure sensor 200 according to some embodiments of the present disclosure. The hex bolt assembly 220 further comprises a hex port 202 and an inlet 218. The hex port 202 may comprise a cylindrically shaped internal cavity defined by internal cavity sidewalls within the hex bolt assembly 220. The inlet 218 is coupled to a base of the hex port 202. The inlet 218 may be configured to receive a medium (e.g., a fluid) from a pressure line (e.g., which may be coupled to the inlet 218) and guide it to the hex port 202. The pressure sensor 200 further comprises a header 204. The header 204 comprises (i) a sensor die 208 embedded within a chamber of the header 204, (ii) a fill fluid (e.g., silicon oil or transformer oil) within the chamber, and (iii) a diaphragm 236 providing an interface between the sensor die 208, the fill fluid, and the inlet 218. The PCBA 234 may include circuitry coupled to the electrical contacts 224 and the sensor die 208. In some embodiments, the electrical contacts 224 are soldered to the PCBA 234 and are configured to conduct an electrical output generated by the sensor die 208 that represents the pressure sensed by the sensor die 208.

[0026] The sensor die 208 may comprise one or more elements configured to convert mechanical movement, stress, and / or deflection of the sensor die 208 into an electrical signal. In some embodiments, the sensor die 208 comprises a piezoresistive material, which includes any material that exhibits a change in electrical resistance in response to a mechanical force or pressure applied to the material. For example, when a force or pressure is applied to the sensor die 208, the resistance between wire bonds connected by the piezoresistive material may change in a time-varying manner based on the applied force. A signal representative of the magnitude of the force applied to the sensor die 208 may be generated by the sensor die 208 and transmitted by the electrical contacts 224 based on the change in resistance.

[0027] 1A-1D , the hex port 202 does not include the cutouts provided in the hex port 102 for mating with the collar of the retainer ring 106 or for welding at the second fitting 112.

[0028] 2C is a cross-sectional view of an exemplary pressure sensor 200 according to some embodiments of the present disclosure. The hex port 202 includes a circumference appropriately sized to receive the header 204 and the retaining ring 206. As shown in FIG. 2C, the header 204 is seated at the base of the hex port 202. The header 204 is configured within the hex port 202, and the sensor die 208 (i) is seated with the header 204 at the base of the hex port 202 and (ii) interfaces with the inlet 218 of the hex bolt assembly. Thus, media received at the inlet 218 can be measured by the sensor die 208.

[0029] The retainer ring 206 may be configured to retain the header 204 within the hex port 202 by positioning the retainer ring 206 within the hex port 202 on the header 204 and capping the hex port 202 by welding the retainer ring 206 into the hex port 202 with a weld joint 210. In some exemplary embodiments, as shown in FIG. 2C , the retainer ring 206 is configured at the electrical contact (e.g., electrical contact 224) end of the hex port 202 opposite the inlet 218 such that the header 204 is retained between the retainer ring 206 and the inlet 218. The retainer ring 206 comprises a tubular shape having a uniform or tapered circumference approximately equal to and / or smaller than the circumference of the hex port 202. Compared to the retainer ring 106, the retainer ring 206 does not include a flange edge that the retainer ring 106 includes to mate with a collar edge of the hex bolt assembly 120.

[0030] 1A-1D . However, as disclosed above, the header 104 includes a groove 122 that is not utilized in the pressure sensor 100. According to various embodiments of the present disclosure, the header 204 includes a groove 216 within a central portion of the circumference of the header 204. An O-ring 212 is disposed within the groove 216 to create a sealing joint 214 between the groove 216 and the sidewall of the hex port 202. In some embodiments, a retainer ring 206 may be welded within the hex port 202 at a weld joint 214 to provide an additional seal with the hex port 202 that prevents leakage from the header 204 through the sealing joint 210.

[0031] Thus, pressure sensor 200 provides several advantages, including (i) unnecessarily complex designs of hex port 202 and retaining ring 206, which may reduce machining costs and / or complexity, and (ii) reduction and / or elimination of welded joints, which may reduce weld leak paths or failures caused by weld defects.

[0032] 3A is a perspective view of an exemplary pressure sensor 300 according to some embodiments of the present disclosure. The pressure sensor 300 includes a hex bolt assembly 320, a plurality of electrical contacts 324, and a circlip 306. The plurality of electrical contacts 324 may be coupled to sensor electronics housed within the hex bolt assembly 320. The circlip 306 may be configured to retain the sensor electronics and other sensor components within the hex bolt assembly 320. The hex bolt assembly 320 includes a hex portion 330 and threads 332. The hex portion 330 allows a tool to apply torque to the hex bolt assembly 320 so that the threads 332 can be fastened or unfastened to the system being measured.

[0033] 3B is an exploded cross-sectional view of an exemplary pressure sensor 300 according to some embodiments of the present disclosure. The hex bolt assembly 320 further comprises a hex port 302 and an inlet 318. The hex port 302 may comprise a cylindrically shaped internal cavity defined by internal cavity sidewalls within the hex bolt assembly 320. The inlet 318 is coupled to a base of the hex port 302. The inlet 318 may be configured to receive a medium (e.g., a fluid) from a pressure line (e.g., which may be coupled to the inlet 318) and guide it to the hex port 302. The pressure sensor 300 further comprises a header 304. The header 304 comprises (i) a sensor die 308 embedded within a chamber of the header 304, (ii) a fill fluid (e.g., silicon oil or transformer oil) within the chamber, and (iii) a diaphragm 336 providing an interface between the sensor die 308, the fill fluid, and the inlet 318. The PCBA 334 may include circuitry coupled to the electrical contacts 324 and the sensor die 308. In some embodiments, the electrical contacts 324 are soldered to the PCBA 334 and are configured to conduct an electrical output generated by the sensor die 308 that represents the pressure sensed by the sensor die 308.

[0034] The sensor die 308 may comprise one or more elements configured to convert mechanical movement, stress, and / or deflection of the sensor die 308 into an electrical signal. In some embodiments, the sensor die 308 comprises a piezoresistive material, which includes any material that exhibits a change in electrical resistance in response to a mechanical force or pressure applied to the material. For example, when a force or pressure is applied to the sensor die 308, the resistance between wire bonds connected by the piezoresistive material may change in a time-varying manner based on the applied force. A signal representative of the magnitude of the force applied to the sensor die 308 may be generated by the sensor die 308 and transmitted by the electrical contacts 324 based on the change in resistance.

[0035] The hex port 302 also does not include the notch that the hex port 102 (of the pressure sensor 100 of FIGS. 1A-1D ) includes for mating with the collar of the retainer ring 106 or for welding at the second joint 112. The hex port 302 further includes a hex port groove 310. The hex port groove 310 is located within the hex port 302 a specific distance from the end of the hex port 302 opposite the inlet 318 to allow clearance above the header 304 when the header 304 is seated against the base of the hex port 302. The circlip 306 may include a retaining ring that is inserted into the hex port 302 through an opening in the electrical contact (e.g., electrical contact 324) end of the hex bolt assembly 320 and configured (e.g., snap-fit) within the hex port groove 310. Circlip 306 may be configured to retain header 304 within hex port 302 by pinning header 304 below circlip 306 while positioned within hex port groove 310. In some exemplary embodiments, circlip 306 is configured within hex port groove 310 such that header 304 is retained between circlip 306 and inlet 318. Thus, circlip 306 replaces the need for welding a retainer ring and / or the need for welding a fitting.

[0036] 3C is a cross-sectional view of an exemplary pressure sensor 300 according to some embodiments of the present disclosure. The hex port 302 may have a circumference appropriately sized to receive the header 304. As shown in FIG. 3C, the header 304 is seated at the base of the hex port 302. The sensor die 308 is embedded within a cavity in the header 304, which may be filled with a fill fluid (e.g., silicon oil or transformer oil). The header 304 is configured within the hex port 302, and the sensor die 308 (i) is seated with the header 304 at the base of the hex port 302 and (ii) is interfaced with the inlet 318. Thus, a medium received at the inlet 318 may be measured by the sensor die 308.

[0037] The header 304 includes a header groove 316 in the center of the circumference of the header 304. An O-ring 312 is disposed in the header groove 316 to create a sealed joint 314 between the header groove 316 and the sidewall of the hex port 302.

[0038] Pressure sensor 300 offers several advantages, including (i) replacing unnecessarily complex designs of hex port 302 and retainer rings with circlip 306, which may reduce machining costs and / or complexity, and (ii) elimination of welded joints, which eliminates weld leak paths or failures caused by weld defects.

[0039] It is to be understood that the present disclosure is not limited to the particular embodiments disclosed and that modifications and other embodiments are intended to be included within the scope of the appended claims. Although specific terms are employed herein, unless otherwise indicated, they are used in a generic and descriptive sense only and not for purposes of limitation.

Claims

1. A pressure sensor, a hex bolt assembly including a hex port and an inlet coupled to a base of the hex port; a header configured at the base of the hexagonal port, the header comprising: (i) a groove within the circumference of the header; (ii) an O-ring within the groove that forms a sealing joint between the groove and a sidewall of the hexagonal port; and (iii) a sensor die (a) mounted within a cavity of the header and (b) interfaced with the inlet; a retainer ring configured within the hex port to retain the header between the retainer ring and the inlet.

2. A pressure sensor, a hex bolt assembly including a hex port, the hex port including a hex port groove, and an inlet coupled to a base of the hex port; a header configured at the base of the hexagonal port, the header comprising: (i) a groove within the circumference of the header; (ii) an O-ring within the groove that forms a sealing joint between the groove and a sidewall of the hexagonal port; and (iii) a sensor die (a) mounted within a cavity of the header and (b) interfaced with the inlet; a circlip configured within the hex port groove to retain the header between the circlip and the inlet.

3. 3. The pressure sensor of claim 2, wherein (i) the hex port groove is spaced from an end of the hex port opposite the inlet at a distance that allows clearance above the header when the header is seated against the base of the hex port, and (ii) the circlip is configured to retain the header within the hex port by pinning the header below the circlip when the circlip is configured within the hex port groove.

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