Display device

Abstract

To provide a display device which has a display panel on a curved surface and suppresses an increase in volume or weight. Another object is to provide an electronic device that includes a display panel on a curved surface and has a small volume or weight.SOLUTION: A display device comprising: a display panel mounted on a curved surface; and a driver circuit including a circuit element mounted on a plurality of flat surfaces provided on a back side of the curved surface in a staircase pattern along the curved surface.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a display device and an electronic device using the same. The present invention relates to a display device and an electronic device using the same. [Background technology]

[0002] Conventional display panels are flat, so the display panel is mounted on an item (e.g., a display device). The outer shape of the part where the display panel is installed (such as a display device or electronic device) is required to be flat. It was.

[0003] In recent years, flexible display panels have been developed (Patent Document 1). The outer shape of the panel is not limited to a flat surface. Therefore, a flexible display panel is installed. The outer shape of the part of the article where the display panel is provided does not necessarily have to be flat. As a result, the degree of freedom in designing the outer shape of the product on which the flexible display panel is mounted is increased. This means that, for example, designs with high added value can now be applied. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-28761 Summary of the Invention [Problem to be solved by the invention]

[0005] Until now, the outer shape of the display device where the display panel is installed has been required to be flat. As a result, there were restrictions on the design of the external shape of the product. This increases the volume and weight of the display device.

[0006] On the other hand, by using a flexible display panel, it is possible to provide a flat display panel. The volume of the display device was reduced because the external shape was no longer necessary. There is a need to utilize this effectively and efficiently house the drive circuits of the display device and the like.

[0007] One aspect of the present invention has been made in light of this technical background. To provide a display device having a display panel on a curved surface and suppressing an increase in volume or weight. Alternatively, the display panel has a curved surface, and an increase in volume or weight is suppressed. One of the objectives is to provide an electronic device that [Means for solving the problem]

[0008] In order to solve the above-mentioned problems, one aspect of the present invention is a display panel having a curved surface of a base on which a display panel is mounted, It was created with a focus on the structure behind the curved surface. We came up with the idea of ​​a display device having such a configuration.

[0009] The display device according to one embodiment of the present invention includes a display panel mounted on a curved surface and a curved display panel mounted on the rear side of the curved surface. a drive circuit including circuit elements mounted on a plurality of planes arranged in a stepped manner along the .

[0010] That is, one aspect of the present invention is a base body having a curved outer surface and a The display panel and the inner surface of the base have a step that increases in height from the center toward the outer area. a plurality of electronic circuit boards provided on the substrate; and wiring members that electrically connect the electronic circuit boards to each other. The display panel is connected to an electronic circuit board at the side of the base. are.

[0011] Another embodiment of the present invention is a display panel, a driver circuit for driving the display panel, and a display device including: and a plurality of flat surfaces provided in a stepped manner along the curved surface on the back side of the curved surface. and a substrate for supporting the display device, and the driving circuit includes circuit elements mounted on the surface.

[0012] The display device according to one aspect of the present invention includes a display panel mounted on a curved surface and a curved display panel mounted on the back side of the curved surface. and a drive circuit including circuit elements mounted on a plurality of planes arranged in a stepped manner along the plane. This allows for effective use of the volume that is reduced by providing the display panel on a curved surface. As a result, the display panel has a curved surface, and an increase in volume or weight is suppressed. A display device can be provided.

[0013] Furthermore, one aspect of the present invention is a display device comprising a base body having a curved outer surface and a display device attached along the curved surface. The panel and the inner surface of the base are provided with a step that increases in height from the center toward the outer area. and a wiring member that electrically connects the electronic circuit boards to each other. The display panel is connected to an electronic circuit board at the side of the base, and The daughter circuit board includes multiple planarization layers and wiring between the planarization layers.

[0014] Another embodiment of the present invention is a display panel, a driver circuit for driving the display panel, and a display device including: and a plurality of flat surfaces provided in a stepped manner along the curved surface on the back side of the curved surface. The multilayer substrate has a base body that contacts the flat surface, and a multilayer substrate that contacts the flat surface. The multilayer substrate has circuit elements and A planarization layer for planarizing the plurality of planes provided in a stepped pattern and a wiring provided on the planarization layer. The display device includes a display line or a driving circuit.

[0015] The display device according to one embodiment of the present invention includes a planarizing layer that planarizes a stepped surface, and The planarization layer includes wiring or a driving circuit provided on the planarization layer. As a result, the volume that is reduced by providing the display panel on a surface can be effectively utilized. It is possible to provide a display device having a curved surface and suppressing an increase in volume or weight.

[0016] Furthermore, one aspect of the present invention is a display device comprising a base body having a curved outer surface and a display device attached along the curved surface. The panel and the inner surface of the base are provided with a step that increases in height from the center toward the outer area. and a wiring member that electrically connects the electronic circuit boards to each other. The display panel is connected to an electronic circuit board at the side of the base, and The sub-circuit board has a through hole for electrical connection to the display panel.

[0017] Another embodiment of the present invention is a display panel, a driver circuit for driving the display panel, and a display device including: and a plurality of flat surfaces provided in a stepped manner along the curved surface on the back side of the curved surface. and a substrate having a surface, the drive circuit including circuit elements mounted on a plurality of planes, The display device is provided with a through hole that electrically connects the display panel to a drive circuit.

[0018] In the display device according to the aspect of the present invention, the through-holes provided in the base are The driving circuit is electrically connected to the display panel provided on the curved surface. As a result, the volume that is reduced by providing the display panel on a surface can be effectively utilized. It is possible to provide a display device having a curved surface and suppressing an increase in volume or weight.

[0019] Furthermore, one aspect of the present invention is a display device comprising a base body having a curved outer surface and a display device attached along the curved surface. The panel and the inner surface of the base are provided with a step that increases in height from the center toward the outer area. a plurality of electronic circuit boards mounted on the board, wiring members for electrically connecting the electronic circuit boards to each other, and The display panel is a display device having a base and a battery for supplying power to the display panel. The surface portion is connected to an electronic circuit board.

[0020] Another embodiment of the present invention is a display panel, a driver circuit for driving the display panel, and a display device including: and a plurality of flat surfaces provided in a stepped manner along the curved surface on the back side of the curved surface. and a battery for supplying power to the drive circuit, the battery having an outer shape along one of the planes. The display device is provided with:

[0021] The display device according to one aspect of the present invention includes a display panel mounted on a curved surface and a curved display panel mounted on the back side of the curved surface. The battery has an outer shape along a plane with a stepped surface along the surface. By providing the display panel on a curved surface, the reduced volume can be effectively utilized. As a result, it is possible to provide a display device having a curved display panel and suppressing an increase in volume or weight. Cut.

[0022] Furthermore, one aspect of the present invention is the above-mentioned LCD device, wherein the base body includes a touch panel at a position overlapping the display panel. It is a display device.

[0023] In the display device according to one embodiment of the present invention, a touch panel is provided at a position overlapping a display panel mounted on a curved surface. This allows parts that move in an arc around a joint (such as fingers) to move in an arc around a joint. a part of the body or a pointing device held on a part of the body to input information into a display device As a result, the display panel has a curved surface and the volume or weight is not increased. This makes it possible to provide a display device with improved operability.

[0024] Another aspect of the present invention is the display device described above, wherein the base includes a metal film between the curved surface and the plurality of flat surfaces. is.

[0025] The display device according to one aspect of the present invention is configured such that a metal film that functions as a shielding film is included in a base body. This allows the control circuit on the back of the curved surface on which the display panel is mounted to be accessed from the outside of the display device. As a result, the driving circuit can be protected from electrical noise from the outside of the display device. It is possible to provide a display device that is less likely to malfunction due to electrical noise or the like from the external device.

[0026] Furthermore, one aspect of the present invention is a display device including the display panel on an upper surface and a flat portion on a bottom surface. It is a display device that can

[0027] The display device according to one embodiment of the present invention includes a display panel on an upper surface and a flat portion on a bottom surface. As a result, the display device can be placed on a flat surface such as a desk with its bottom facing downwards. This makes it possible to provide a display device in which characters and images displayed on a display panel are easy to read.

[0028] Another embodiment of the present invention is an electronic device including the above display device.

[0029] The electronic device according to one embodiment of the present invention includes a display panel mounted on a curved surface and a curved display panel mounted on the back side of the curved surface. and a drive circuit including circuit elements mounted on a plurality of planes arranged in a stepped manner along the plane. This reduces the volume by providing the display panel on a curved surface. As a result, the display panel can be curved and the volume or weight can be reduced. It is possible to provide an electronic device in which an increase in volume is suppressed.

[0030] In this specification, the EL layer refers to a layer provided between a pair of electrodes of a light-emitting element. Therefore, the light-emitting layer containing an organic compound, which is a light-emitting material sandwiched between the electrodes, is one of the EL layers. This is an aspect.

[0031] In this specification, the term "display device" refers to an image display device or a light-emitting device. In addition, connectors such as FPC (Flexible Printed Circuit) are used for display devices. circuit) or TCP (Tape Carrier Package) A module with a printed wiring board at the end of the TCP, or a module with a surface The display element is mounted on the substrate by the COG (Chip On Glass) method. The display device also includes all modules on which a display device (circuit) is directly mounted. [Effects of the Invention]

[0032] According to one aspect of the present invention, a display panel has a curved surface, and an increase in volume or weight is suppressed. Alternatively, a display device having a curved display panel and no increase in volume or weight can be provided. It is possible to provide an electronic device in which the load is suppressed. [Brief explanation of the drawings]

[0033] [Figure 1] 1A and 1B illustrate a structure of a display device having a display panel on a convex curved surface according to an embodiment. [Figure 2] 1A to 1C illustrate a structure of a display device having a display panel on a concave curved surface according to an embodiment. [Figure 3]1A to 1C illustrate a structure of a display device having a display panel on a curved surface according to an embodiment. [Figure 4] 1A to 1C are diagrams illustrating a display device having a display panel on a convex curved surface according to an embodiment. [Figure 5] 1A to 1C are diagrams illustrating a display device having a display panel on a concave curved surface according to an embodiment. [Figure 6] 1A to 1C are diagrams illustrating a display device having a display panel on a convex curved surface according to an embodiment. [Figure 7] 1A to 1C are diagrams illustrating a display device having a display panel on a concave curved surface according to an embodiment. [Figure 8] 1A to 1C illustrate electronic devices according to an embodiment. [Figure 9] 1A to 1C illustrate electronic devices according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0034] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. The present invention is not limited to the above embodiments, and various changes and modifications may be made in the form and details thereof without departing from the spirit and scope of the present invention. It will be readily understood by those skilled in the art that the present invention can be achieved by the following embodiments. It should not be construed as being limited to the contents of the description. The same reference numerals are used in different drawings to denote the same parts or parts having similar functions. A repeated explanation will be omitted.

[0035] (Embodiment 1) In this embodiment, a display device having a display panel on a convex curved surface according to one embodiment of the present invention will be described. This will be explained with reference to FIG.

[0036] FIG. 1A is a top view of a display device 100 according to one embodiment of the present invention, and FIG. 1B is a top view of the display device 100 according to one embodiment of the present invention. 1(A) is a side view of the 00. FIG. 1(C) is a side view of the 00 shown in FIG. 1(A) along the dashed lines A1-A2 and A3-A4. 1(D) is a diagram showing the cross-sectional structure of the display device 100. Figure.

[0037] The display device 100 exemplified and explained in this embodiment is a base 110 having a curved outer surface. The display panel 120 is attached along the curved surface, and the inner surface of the base 110 is A plurality of electronic circuit boards (for example, a first the printed circuit board 111C, the printed circuit board on which the driving circuit 111R is provided, and the second printed circuit board The wiring member (connector 11) electrically connects the electronic circuit boards to each other. 2a and connector 112b). 0 is an electronic circuit board (a printed circuit board on which a drive circuit 111R is provided) on the side surface of the base 110. ) is connected.

[0038] Alternatively, the display device 100 exemplified and explained in this embodiment includes a display panel 120 and a display A driving circuit 111R for driving the panel 120, a curved surface on which the display panel 120 is mounted, and A base 110 having a plurality of flat surfaces provided in a stepped manner along the curved surface on the back side of the curved surface. The driving circuit 111R includes circuit elements mounted on the plane.

[0039] The display device 100 exemplified in this embodiment includes a light-transmitting touch panel 130. The display panel 120 is provided on the display panel 120 (see FIGS. 1A to 1C). By providing a touch panel 130 on the display panel 120, the position of the image to be displayed on the display panel 120 can be adjusted. The mark and the coordinates input from the touch panel 130 can be easily compared.

[0040] The display panel 120 is provided so as to extend along a curved surface that continues from the top surface of the base 110 to the side surface. With this configuration, the image displayed by the display device 100 is It can be observed not only from above but also from the side.

[0041] The base 110 has a terminal portion 115R on the front side of the paper in FIG. 1(B), and the terminal portion 115 L is placed at the back of the paper.

[0042] A plurality of terminals are provided on the terminal portion 115R, and the flexible printed circuit board of the display panel 120 129 is electrically connected.

[0043] A plurality of terminals are provided on the terminal section 115L, and the flexible printed circuit board of the touch panel 130 It is electrically connected to the plate 139.

[0044] On the back side of the curved surface of the base 110, a plurality of flat surfaces are provided in a stepped pattern along the curved surface. For example, the base 110 has three flat surfaces arranged in a stepped manner. 111C, a printed circuit board on which the driving circuit 111R is provided, and a second The flat surface on which the print substrate 111L is provided and the flat surface on which the antenna 114 is provided are provided. See Figure 1(C) and Figure 1(D)).

[0045] The first printed circuit board 111C is connected to the second printed circuit board 111 via a connector 112a. L, and is electrically connected to the drive circuit 111R via the connector 112b. (See Figure 1(D)).

[0046] The display device 100 illustrated in this embodiment includes a display panel 120 mounted on a curved surface, and A drive circuit including circuit elements mounted on multiple flat surfaces arranged in a stepped pattern along the curved surface on the back side of the curved surface. This allows the display panel 120 to be provided on a curved surface, thereby reducing the As a result, the display panel 120 has a curved surface, In addition, it is possible to provide a display device 100 in which an increase in volume or weight is suppressed.

[0047] Hereinafter, each element constituting the display device according to one embodiment of the present invention will be described.

[0048] Display panel The display panel 120 is a flexible printed circuit board to which image data is supplied from the drive circuit 111R. The display unit is connected to the substrate 129 and has a display unit on the curved surface. The display unit has a plurality of pixels, and each pixel is Image data supplied via a flexible printed circuit board is displayed.

[0049] The display panel 120 having a curved display section may be, for example, a flexible display panel. For example, the method may be such that the light source is fixed to the curved surface of a support having a curved surface.

[0050] As a method for attaching a flexible display panel to the curved surface of the base 110, a bonding layer or an adhesive layer may be used. a method of using a transparent housing that covers the curved surface of the base 110, and It may be sandwiched between the housings.

[0051] Each pixel in the display section of the display panel 120 comprises a display element. An electroluminescent element (EL element) is an element in which a layer containing a light-emitting organic compound is sandwiched between two layers. Also known as a liquid crystal display element, an electrophoretic display element, and various other known display elements. can be applied.

[0052] <Drive circuit> The drive circuit 111R drives the display panel 120. For example, the first printed circuit board 111 C generates image data and outputs it to the drive circuit 111R via the connector 112b. The driving circuit 111R transmits image data to a plurality of pixels provided on the display panel 120, The pixels are driven in accordance with image data.

[0053] 《Base》 The base 110 is insulating and has a curved surface on one side, and a step on the back side of the curved surface along the curved surface. The substrate 110 is engineered using, for example, a mold. It can be formed by molding a dry film. The base 110 may be made of a multi-layer substrate.

[0054] <Printed circuit board> A first printed circuit board 111C, a printed circuit board on which a driving circuit 111R is provided, and a second printed circuit board The printed circuit board 111L includes circuit elements and wiring, both of which are a form of electronic circuit board. Examples of circuit elements include LSI chips, capacitance elements, coils, and antennas. It is possible.

[0055] When the display device 100 is used as part of an electronic device, the drive circuit 111R of the display panel , a driving circuit for the touch panel 130, a transmitting / receiving circuit for signal communication with an external information device, etc. Various circuits can be provided on the printed circuit board.

[0056] <Wiring components> The connector 112a connects the first printed circuit board 111C and the second printed circuit board 111L. The connector 112b electrically connects the first printed circuit board 111C and the drive circuit 111R. The connector 112a and the connector 112b are both electronic circuits. It is a wiring member that electrically connects the circuit boards to each other.

[0057] The display device 100 includes a base 110 that includes a display panel 120 and a drive circuit 111R. It has through holes 118 for electrical connection.

[0058] The base 110 has a plurality of through holes that are arranged in a stepped pattern and penetrate from the flat surface to the curved surface. A conductive film is formed on the wall surface of the hole to electrically connect the stepped flat surface and the curved surface. It has been done.

[0059] For example, the through-hole 118 is a hole that penetrates from the plane on which the drive circuit 111R is provided to the curved surface. The conductive film provided in the through-hole 118 is connected to the drive circuit 111R and the terminal portion 115R. The terminals are electrically connected to the base 11 (see FIG. 1(C)). The driving circuit 111R provided on the stepped plane of 0 is for driving the display panel 120. The signal is transmitted via a terminal provided on the curved surface of the base 110 and a flexible printed circuit board 129. , can be output to the display panel 120.

[0060] In addition, a touch panel 130 is provided on the curved surface of the base 110, overlapping the display panel 120. The touch panel 130 is electrically connected to a flexible printed circuit board 139. The flexible printed circuit board 139 is electrically connected to the terminal portion 115L. Therefore, the touch panel 130 transmits the detected signal between the terminal portion 115L and the through-hole (not shown). to a second printed circuit board 111L provided on the stepped plane of the base 110 via a It can be output.

[0061] In the display device 100 exemplified in this embodiment, the through-holes 118 provided in the base 110 are The drive circuit 111R provided on the rear side of the display panel 120 is electrically connected to the curved display panel 120. This effectively utilizes the volume that is reduced by providing the display panel 120 on a curved surface. As a result, the display panel 120 can be curved and the volume or weight can be reduced. It is possible to provide a display device 100 in which an increase in the number of pixels is suppressed.

[0062] The display device 100 has a base 110 made of metal provided between a curved surface and a plurality of flat surfaces. The film 117 may be included (see FIG. 1C).

[0063] The display device 100 exemplified in this embodiment has a metal film that functions as a shielding film on the base 110. This allows the control circuit on the back of the curved surface on which the display panel is mounted to be displayed. This allows the display device to be protected from external electrical noise, etc. It is possible to provide a display device that is less likely to malfunction due to electrical noise or the like from outside the display device. .

[0064] The metal film that functions as a shielding film can be made of aluminum, copper, brass, etc. When a conductive film is provided on the wall surface of the through-hole 118, the metal film 117 is The conductive film provided on the wall surface of the through hole 118 and the metal film 117 are not formed around the through hole 118. This is to prevent tangling.

[0065] <Modification> As a modification of the display device of one embodiment of the present invention illustrated in this embodiment, a display panel may be provided on a concave curved surface. The configuration of a display device having a panel will be described with reference to FIG.

[0066] FIG. 2A is a top view of a display device 200 according to one embodiment of the present invention, and FIG. 2B is a top view of a display device 200 according to one embodiment of the present invention. 2(A) is a side view of the 00. FIG. 2(C) is a side view of the 00 shown in FIG. 2(A) along the dashed lines A1-A2 and A3-A4. 2(D) is a diagram showing the cross-sectional structure of the display device 200. Figure.

[0067] The display device 200 shown and described in FIG. 2 has a concave curved surface, which is different from the display device shown and described in FIG. This is different from the display device 100 described below.

[0068] The display device 200 exemplified and explained in this embodiment includes a display panel 220 and a display panel 2 20, and a curved surface on which the display panel 220 is mounted and the back of the curved surface. and a base 210 having a plurality of flat surfaces arranged in a stepped manner along a curved surface on one side. The driving circuit 111R includes circuit elements mounted on a plane.

[0069] The display device 200 exemplified in this embodiment includes a light-transmitting touch panel 230. The display panel 220 is provided on the display panel 220 (see FIGS. 2A to 2C). By providing a touch panel 230 on the display panel 220, the position of the image to be displayed on the display panel 220 can be adjusted. This makes it easier to compare the target with the coordinates input from the touch panel 230.

[0070] On the back side of the curved surface of the base 210, a plurality of flat surfaces are provided in a stepped pattern along the concave curved surface. For example, the base 210 has three flat surfaces. C, the printed circuit board on which the driving circuit 111R is provided, and the second printed circuit board The substrate 111L is provided on a plane, and the antenna 114 is provided on a plane (FIG. 2( C) and Figure 2(D)).

[0071] The first printed circuit board 111C is connected to the second printed circuit board 111 via a connector 112a. L, and is electrically connected to the drive circuit 111R via the connector 112b. (See Figure 2(D)).

[0072] The display device 200 has a base 210 that displays the touch panel 230 on a concave curved surface. Provide for a position that overlaps panel 220.

[0073] The display device 200 exemplified in this embodiment is a display panel mounted on the curved surface of a base 210. A touch panel is provided at the overlapping position, allowing the robot to move in an arc around the joint. Using a part (e.g., a part of the body such as a finger, or a pointing device held on a part of the body), The operation of inputting information into the display device becomes easier. As a result, the display panel has a curved surface, and It is possible to provide a display device in which an increase in volume or weight is suppressed and operability is improved.

[0074] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0075] (Embodiment 2) In this embodiment, a structure of a display device according to one embodiment of the present invention will be described with reference to FIGS. do.

[0076] FIG. 3A shows a display panel having a convex curved surface according to one embodiment of the present invention described in Embodiment 1. 1A and 1B are diagrams showing the cross-sectional structure of the display device 100 taken along dashed lines A1-A2 and A3-A4. do.

[0077] The display device 100 shown in FIG. 3A in this embodiment is a base 1 having a curved outer surface. 10, a display panel 120 attached along the curved surface, and a base 110 attached to the inner surface from the center to the outside. A plurality of electronic circuit boards (e.g., A first printed circuit board 111C, a printed circuit board on which a driving circuit 111R is provided, and a second printed circuit board Printed circuit board 111L) and wiring member (connector) that electrically connects electronic circuit boards The display device has a display panel 112a and a connector 112b. 120 is an electronic circuit board (a printed circuit board on which the drive circuit 111R is provided) on the side surface of the base 110. The electronic circuit board is connected to a substrate, and the electronic circuit board has a plurality of planarization layers and wiring between the planarization layers. .

[0078] Alternatively, the display device 100 illustrated in FIG. 3A in this embodiment includes a display panel 120 and A driving circuit 111R for driving the display panel 120, and a curved surface on which the display panel 120 is mounted. and a base 1 having a plurality of flat surfaces provided in a stepped manner along the curved surface on the back side of the curved surface. The multi-layer substrate 111 is in contact with the flat surface. A planarization layer (e.g., a planarization layer) that flattens the circuit elements 10 and the multiple planes arranged in a stepped pattern. For example, planarization layer 11a, planarization layer 11b, and planarization layer 11c) and a planarization layer provided on the planarization layer. The wiring 12 or the driving circuit 111R is included.

[0079] The display device 100 exemplified in this embodiment is a flattening device that flattens a stepped surface. layers (planarization layer 11a, planarization layer 11b, and planarization layer 11c) and The display panel 120 includes the wiring 12 or the drive circuit 111R. By providing the display on a curved surface, the reduced volume can be effectively utilized. The display device 100 has a curved panel 120 and is suppressed from increasing in volume or weight. can.

[0080] Elements constituting a display device according to one embodiment of the present invention will be described below.

[0081] 《Multilayer board》 The multilayer substrate 111 has a plurality of planarization layers, and the circuit elements 10, the wiring 12, or the driving circuit 11 are Includes functional circuits such as 1R.

[0082] The planarization layer is insulating and has a plurality of planar surfaces provided in a stepped manner and a plurality of planar surfaces provided on the planar surfaces. The planarization layer is a layer that flattens the steps caused by the circuit elements 10 and the like. On the planarization layer, an antenna 114, a circuit element 10 or various functional circuits ( For example, a drive circuit 111R and the like and wiring for electrically connecting these are provided.

[0083] An insulating resin can be used as a material for the planarization layer. For example, imide, acrylic, etc. can be used.

[0084] Furthermore, through holes 18 with a conductive film formed on the wall surface may be formed in the planarizing layer. The through-holes 18 having the film formed on the wall surface electrically connect the wiring 12 provided on different planarization layers. Can be connected.

[0085] As a method for forming a through hole in an insulating resin, in addition to a method using a laser or the like, One method is to apply photolithography to a photosensitive resin. Examples of methods for forming the through-hole on the side surface include plating and electroforming.

[0086] <Modification> As a modification of the display device of one embodiment of the present invention illustrated in this embodiment, a display panel may be provided on a concave curved surface. The structure of a display device having a panel will be described with reference to FIG.

[0087] FIG. 3B shows a display panel having a concave curved surface according to one embodiment of the present invention described in Embodiment 1. 1A and 1B are diagrams showing the cross-sectional structure of the display device 200 taken along dashed lines A1-A2 and A3-A4. do.

[0088] The display device 200 shown in FIG. 3B has a concave curved surface, which is different from the display device 200 shown in FIG. 3A. This is different from the display device 100 shown and described in the accompanying drawings.

[0089] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0090] (Embodiment 3) In this embodiment, a display device having a display panel on a convex curved surface according to one embodiment of the present invention will be described. This will be described with reference to FIG.

[0091] A display device 300 having a display panel on a convex curved surface according to one embodiment of the present invention, as illustrated in FIG. 4(A). A has a housing 160a for housing a battery on its rear surface, which is the same as that described in the first embodiment. This is different from the display device 100.

[0092] The display device 300A described as an example in this embodiment is a base 11 having a curved outer surface. 0, the display panel 120 attached along the curved surface, and the inner surface of the base 110 from the center to the outside A plurality of electronic circuit boards are provided with steps that increase in height toward the area, and the electronic circuit It has wiring members that electrically connect the substrates together and a battery 170 that supplies power to the electronic circuit. The display panel is connected to an electronic circuit board at the side of the base. There are.

[0093] Alternatively, the display device 300A exemplified and explained in this embodiment includes a display panel 120 and a display A driving circuit 111R for driving the display panel 120, a curved surface on which the display panel 120 is mounted, and a base 110 having a plurality of flat surfaces provided in a stepped manner along the curved surface on the back side of the curved surface; and a battery 170 that supplies power to the operating circuit 111R. It has an outline along one plane.

[0094] The display device 300A illustrated in FIG. 4A has a housing 160a, which is curved in a convex shape. The curved surface has a surface and a plurality of flat surfaces provided in a stepped manner along the curved surface on the rear side of the curved surface.

[0095] Between one of the stepped flat surfaces of the housing 160a and the base body 110, a battery 170 and a battery 1 70 control circuit 161L and function circuit 161R are provided.

[0096] The display device 300A according to the embodiment of the present invention includes a display panel 120 mounted on a curved surface, and The battery 170 has an outer shape along a plane provided in a stepped manner along the curved surface on the back side of the curved surface. This effectively utilizes the volume that is reduced by providing the display panel 120 on a curved surface. As a result, the display panel 120 can be used in a curved configuration without increasing the volume or weight. It is possible to provide a display device in which the increase is suppressed.

[0097] The display device 300A has a display panel on the top surface and a flat portion on the bottom surface. This allows the display device 300A to be placed on a flat surface such as a desk with its bottom facing downwards. As a result, it is possible to provide a display device in which characters and images displayed on the display panel are easy to see.

[0098] The individual elements constituting the display device 300A according to one embodiment of the present invention will be described below.

[0099] "battery" In addition to dry batteries, batteries include secondary batteries (such as Li-ion batteries and nickel-metal hydride batteries). etc. can be used.

[0100] Battery control circuit The control circuit 161L controls the battery 170. For example, the battery 170 supplies power to the display device 3. When a secondary battery is used as the battery 170, the power supply is controlled to supply 00A according to the usage state. In this case, the battery 170 is monitored to prevent overcharging. Charging is performed under optimal conditions according to the information.

[0101] <Variation 1.> The modification of the display device of one embodiment of the present invention illustrated in FIG. 4B is a display device having a housing for accommodating a battery. 160b has a concave curved surface on the rear surface of the display device 300B. This is different from the display device 300A.

[0102] The display device 300B shown in FIG. 4B has a concave curved surface and a curved surface on the back side of the curved surface. The housing 160b has a plurality of flat surfaces arranged in a stepped manner along the axis.

[0103] Between one of the stepped flat surfaces of the housing 160b and the base body 110, a battery 170L and a battery 170C and a battery 170R, a battery control circuit 161L and a function circuit 161R are provided. By providing a plurality of thin batteries, the display panel 120 can be used as the display device 30. By providing it on the curved surface of 0B, the reduced volume can be effectively utilized.

[0104] <Variation 2.> In a modification of the display device of one embodiment of the present invention illustrated in FIG. 4C, the battery 170 is disposed on the base 110. The printed circuit board 161C is mounted on the housing 160c, as shown in FIG. This is different from the display device 300A described in (A).

[0105] The display device 300C illustrated in FIG. 4C has a housing 160c. The housing 160c has a convex The device has a curved surface and a plurality of flat surfaces on the back side of the curved surface that are arranged in a stepped pattern along the curved surface. .

[0106] Between one of the stepped flat surfaces of the housing 160c and the base body 110, a battery 170 and a battery 1 70 control circuit 161L and function circuit 161R are provided.

[0107] <Variation 3.> The modification of the display device of one embodiment of the present invention illustrated in FIG. 5A is similar to the display device described in Embodiment 1. The display device 200 differs from the display device 200 in that it has a housing 260a on the back surface for housing a battery.

[0108] The display device 400A exemplified and explained in this embodiment includes a display panel 220 and a display panel a driving circuit 111R for driving the display panel 220, and a curved surface on which the display panel 220 is mounted and a curved surface A base 210 having a plurality of flat surfaces arranged in a stepped manner along a curved surface on the back side, and a driving circuit 1 11R, and a battery 270 that supplies power to the battery 270. It has an outer shape that conforms to the

[0109] The display device 400A illustrated in FIG. 5A has a housing 260a, which is curved in a convex shape. The curved surface has a surface and a plurality of flat surfaces provided in a stepped manner along the curved surface on the rear side of the curved surface.

[0110] Between one of the stepped flat surfaces of the housing 260a and the base body 210, a battery 270 and a battery 2 70 control circuits 261L and functional circuits 261R are provided.

[0111] <Variation 4.> The modification of the display device of one embodiment of the present invention illustrated in FIG. 5B is a display device having a housing for accommodating a battery. 260b has a concave curved surface on the back surface of the display device 400B and has multiple batteries. , which is different from the display device 400A described in FIG. 5(A).

[0112] The display device 400B shown in FIG. 5B has a concave curved surface and a curved surface on the back side of the curved surface. The housing 260b has a plurality of flat surfaces arranged in a stepped manner along the axis.

[0113] Between one of the stepped flat surfaces of the housing 260b and the base body 210, a battery 270L and A battery 270R, a battery control circuit 261L, and a function circuit 261R are provided. By providing a plurality of display panels 220 on the curved surface of the display device 400B, The volume reduced by this can be effectively utilized.

[0114] <Variation 5.> The modified example of the display device of one embodiment of the present invention illustrated in FIG. 5C includes a battery 270L and a battery 270B. R is provided on the base body 210 side and the battery 270C is provided on the housing 260b side, which is the same as that described in FIG. This is different from the display device 400A.

[0115] The display device 400C illustrated in FIG. 5C has a housing 260c. The housing 260c has a convex The device has a curved surface and a plurality of flat surfaces on the back side of the curved surface that are arranged in a stepped pattern along the curved surface. .

[0116] Between one of the stepped flat surfaces of the housing 260c and the base body 210, a battery 270L and a battery Battery 270R is provided on the base body 210 side, and battery 270C is provided on the housing 260b side.

[0117] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0118] (Fourth embodiment) In this embodiment, a display device having a display panel on a convex curved surface according to one embodiment of the present invention will be described. This will be described with reference to FIG.

[0119] FIG. 6A is a diagram showing a cross-sectional structure of a display device 300D according to one embodiment of the present invention. ) is a perspective view illustrating the overlapping of parts of the configuration of the display device 300D.

[0120] The display device 300D is configured by connecting a curved, light-transmitting spacer 140 to the display panel 120. The difference from the display device 300A described in the third embodiment is that it is provided between the touch panel 130. do.

[0121] The display device 300D exemplified and explained in this embodiment includes a display panel 120 and a display panel a driving circuit 111R for driving the display panel 120, a curved surface on which the display panel 120 is mounted, and A base 110 having a plurality of flat surfaces arranged in a stepped manner along a curved surface on the back side, and a driving circuit 1 The battery 170 supplies power to the 11R. It has an outer shape that conforms to the

[0122] The display device 300D has a housing 160a, which has a convex curved surface and a back surface of the curved surface. The side has a plurality of flat surfaces provided in a stepped manner along the curved surface.

[0123] Between one of the stepped flat surfaces of the housing 160a and the base body 110, a battery 170 and a battery 1 70 control circuit 161L and function circuit 161R are provided.

[0124] In addition, the display device 300D has a transparent spacer 140 that is in contact with the display panel 120. The spacer 140 is provided between the touch panel 130. It may be done.

[0125] The spacer 140 separates the touch panel 130 from the display panel 120. This reduces the influence of the display panel 120 on the touch panel 130, and This has the effect of preventing a decrease in sensitivity.

[0126] The spacer 140 is molded to fit the curved surface of the base 110, and the spacer 140 and the base 110 are then bonded together. The bodies 110 are fitted together, and a flexible display panel 120 is placed between them. , it may be configured to clamp.

[0127] In addition, a ceramic coating layer or a hard coating layer is formed on the surface of the touch panel 130 of the display device 300D. Alternatively, a ceramic coating layer may be formed on the rear surface of the display device 300D. Alternatively, a hard coat layer may be formed.

[0128] Furthermore, a circular polarizer may be provided on the viewer side of the display panel 120 or the touch panel 130. A circular polarizer may be used as the spacer 140. By providing a circular polarizer, The contrast is reduced by the external light reflected by the display panel 120 or the touch panel 130. This can eliminate the problem of deterioration.

[0129] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0130] (Embodiment 5) In this embodiment, a display device having a display panel on a concave curved surface according to one embodiment of the present invention will be described. This will be described with reference to FIG.

[0131] 7A is a perspective view illustrating the configuration of the display device 400D. 10 is a diagram illustrating an example of a cross section of a pixel portion of a display panel applicable to a device 400D. FIG.

[0132] FIG. 7(C) is a perspective view of the configuration of a touch panel applicable to the display device 400D, and FIG. D) is a diagram illustrating the cross-sectional structure.

[0133] The display device 400D has a concave curved surface, a display panel 220, a touch panel 230, The fact that the cover 245 and the circularly polarizing plate 250 are provided in this order is the same as the display device described in the fourth embodiment. This is different from device 300D.

[0134] The display device 400D exemplified and explained in this embodiment includes a display panel 220 and a display panel A curved surface on which 220 is mounted and a plurality of flat surfaces provided in a stepped manner along the curved surface on the back side of the curved surface and a substrate 210 comprising:

[0135] The display device 400D includes a display panel 220, a touch panel 230, a cover 245, and a circular polarizer. The light plates 250 are provided in this order.

[0136] For example, a flexible display panel 22 having a display element having a layer containing a light-emitting organic compound. The thickness of the touch panel 230 formed integrally with the spacer is about 50 μm. The thickness of the cover can be approximately 500 μm, and the thickness of the circular polarizer can be approximately 400 μm. The thickness may be approximately 300 μm.

[0137] <Display panel> The display panel 220 has a display section in the area enclosed by the dashed line in the figure (see FIG. 7(A)). The display section is provided with a plurality of pixels 228 arranged in a matrix. The display element applicable to the pixel 228 is a light-emitting organic EL element between a pair of electrodes. Electroluminescent elements (also called EL elements) in which layers containing compounds are sandwiched, liquid crystal Examples of such display elements include electrophoretic display elements and various other known display elements.

[0138] The display panel 220 is also provided with a flexible printed circuit board 229. The flexible printed circuit board 229 is electrically connected to a drive circuit (not shown) and A signal for driving the display unit 220 is supplied to the display unit.

[0139] An example of the configuration of a pixel 228 applicable to an active matrix display panel is shown in FIG. 7(B). The pixel 228 includes a transistor 227 and a source electrode or The EL element 223 electrically connected to the drain electrode and the color filter overlapping the EL element 223 are The filter 225a is provided.

[0140] "substrate" The display panel 220 is made up of a first substrate 221 disposed on the base 210 side and a second substrate 222 disposed on the viewer side. The pixel 228 is formed between the first substrate 221 and the second substrate 222. Both the first substrate 221 and the second substrate 222 are flexible. The display panel 220 is also flexible.

[0141] The thermal expansion coefficient of the first substrate 221 and the thermal expansion coefficient of the second substrate 222 are approximately the same value. By matching the thermal expansion coefficient, a flexible display panel can be produced. This prevents the problem of 220 curling.

[0142] When an EL element is used as the display element, the first substrate 221 and the second substrate 222 are A substrate with excellent gas barrier properties is used. A substrate with improved barrier properties may also be used.

[0143] Transistor The transistor 227 includes a semiconductor layer. Known semiconductors such as silicon, low-temperature polysilicon, and oxide semiconductors can be used.

[0144] The transistor 227 may also be provided with a back gate electrode. The pole may be used to control the threshold of transistor 227 .

[0145] EL element The EL element 223 has a first electrode 223a, a second electrode 223c, and a first electrode 223a. A layer 223b containing a light-emitting organic compound is provided between the second electrodes 223c.

[0146] The color of the light emitted by the EL element 223 is determined by the material used in the layer 223b containing the luminescent organic compound. The EL element 223 exemplified in this embodiment exhibits white color. It emits light.

[0147] Color Filter The color filter 225a converts the white light emitted by the EL element into light of a desired color. A color filter 225a is placed over the EL element 223 that exhibits white light. The beam configuration is called a light emitting module 225 .

[0148] The first electrode 223a of the EL element has an edge covered with the partition wall 224 and overlaps with the opening of the partition wall 224. become.

[0149] The spacer 226 is provided on the partition wall 224, and the EL element 223 and the color filter 225 Adjust the spacing of a.

[0150] 《Sealing structure》 The display element is made up of a first substrate 221 and a second substrate 222 bonded together with a sealing material (not shown). 22, and is sealed.

[0151] In addition, a light-transmitting adhesive is used to bond the light-emitting element 223 and the color filter 225a. It may also be glued.

[0152] As the sealing material, a material with low moisture permeability is preferable. When an EL element is used as the display element, Preferably, an inorganic material such as low-melting-point glass is used as the sealing material.

[0153] <<Display Panel Manufacturing Method>> An example of a method for manufacturing the display panel 220 will be described.

[0154] In the first step, a release layer is provided on a substrate for the manufacturing process, and a highly gas-barrier film is formed on the release layer. The substrate for the manufacturing process does not need to be flexible, but it is necessary to have heat resistance and a sufficient size. A substrate with excellent chemical stability (for example, a glass substrate) is preferred.

[0155] As the release layer, a metal layer such as tungsten can be used in addition to a polyimide layer. The layer to be peeled off in contact with the peeling layer is silicon oxide, silicon nitride with high gas barrier properties, etc. Two substrates for the manufacturing process having this structure are prepared.

[0156] In the second step, a pixel circuit is formed on the substrate for the first manufacturing process by stacking the film with high gas barrier properties. Then, a display element connected to the pixel circuit is fabricated.

[0157] In the third step, a color filter is applied to a highly gas-barrier film on a substrate for other manufacturing processes. The order of the second and third steps does not matter.

[0158] In the fourth step, the first manufacturing process substrate and the second manufacturing process substrate are bonded to each other. The side with the optical element and the side with the color filter are placed facing each other using an adhesive. and glue them together.

[0159] In the fifth step, the first manufacturing process substrate is peeled off from the peeled layer, and the peeled layer that appears on the surface is A flexible substrate is attached to the layer. Then, the substrate for another manufacturing process is peeled off from the peeled layer, and the surface is A flexible substrate is attached to the peeled layer that appears on the surface. An adhesive is used for the attachment. Alternatively, a circularly polarizing plate may be attached to the layer to be peeled off from the substrate for other manufacturing steps. By directly laminating a circular polarizer to the peelable layer, the number of parts required can be reduced when using a circular polarizer. It is possible.

[0160] Through the above steps, a flexible display panel 220 can be manufactured.

[0161] <Touch panel> The touch panel 230 has a touch sensor unit in the area surrounded by the dashed line in the figure (FIG. 7(A) ) The display unit is equipped with touch sensors arranged in a matrix.

[0162] The touch panel 230 is also provided with a flexible printed circuit board 239. The switch panel 230 transmits the detected signal via a flexible printed circuit board 239. The signal is output to a signal processing circuit or the like that is not connected to the

[0163] The configuration of the touch sensor provided in the area 235 of the touch panel 230 is shown in FIG. 7(C). The touch sensor shown in the example is a projected capacitive touch sensor. It has a pole 231 and an electrode 232.

[0164] The electrode 231 is an electrode in which the vertices of rectangular conductive films arranged in a line are connected by wiring 233. The electrode 232 is a rectangular conductive film that is arranged in a line in a direction intersecting the electrode 231, and the vertices of the conductive film are mutually perpendicular. The electrodes 231 and 232 are arranged to cross each other, so that the The quadrilateral conductive film of the electrode 231 and the quadrilateral conductive film of the electrode 232 are arranged in a staggered pattern. An insulating film is formed in the area where the line 233 overlaps the electrode 232, and the electrode 231 and the electrode 232 are It prevents short circuits.

[0165] The electrodes 231 and 232 are arranged so that the area of ​​the intersection between them is as small as possible. This reduces the area of ​​the region where no electrodes are provided. This can reduce display unevenness caused by differences in transmittance due to the difference in transmittance.

[0166] Reducing the thickness of the touch panel 230 is preferable because it reduces the weight and increases the transmittance.

[0167] One example of a method for manufacturing a thin touch panel is a manufacturing process that has excellent dimensional stability and heat resistance. A touch sensor is fabricated on a substrate (for example, a glass substrate) and the fabricated touch sensor is One method is to transfer the substrate from which it was made to another light and thin base material.

[0168] Specifically, a peelable layer is provided on a glass substrate, and a peelable layer including a touch sensor is laminated on top of the peelable layer. The release layer may be made of polyimide or a metal layer such as tungsten. A film of silicon oxide or the like is formed on the metal layer as a layer to be peeled off, and a touch panel is then formed on top of that. A lightweight film is attached to the top surface of the fabricated touch sensor. When the film to which the peelable layer is adhered is peeled from the interface between the peelable layer and the peelable layer, a lightweight and thick film is obtained. This allows for the creation of thin touch panels.

[0169] <Display panel with touch sensor> The display panel 220 may be provided with a touch sensor. The display panel 220 can also function as the touch panel 230, reducing the weight of the display device. can be further reduced.

[0170] The display panel 220 can be provided with various touch sensors. For example, capacitive elements These elements can be used as touch sensors. By arranging them in a trix shape, it is possible to detect the coordinates of the part of the body that is in contact with a finger or other object.

[0171] The touch sensor is provided on the first substrate 221 or the second substrate 222 of the display panel 220. Alternatively, the structure provided on the first substrate 221 and the structure provided on the second substrate 222 may be , constitutes a touch sensor.

[0172] An example of a touch sensor provided on the first substrate 221 is a photoelectric conversion element. The photoelectric conversion element can optically detect a finger or other object that touches the surface of the second substrate.

[0173] The touch sensor provided on the second substrate 222 may be a photoelectric conversion element or a capacitance element. The touch sensor is provided on the side of the second substrate facing the first substrate. The capacitance element has a pair of electrodes, one of which is The change in potential of the electrode caused by a finger or the like coming into contact with the second substrate is detected.

[0174] The structure is composed of a structure provided on a first substrate 221 and a structure provided on a second substrate 222. An example of the touch sensor is a capacitive element. The electrode connected to the second substrate 222 and the electrode provided on the second substrate 222 constitute a capacitor element. The change in capacitance caused by the touching finger bringing the second substrate closer to the first substrate is detected. do.

[0175] When the display panel 220 is an active matrix type, the first substrate 221 or The transistors are provided in a matrix on the second substrate 222. The transistor sensor may be provided on the second substrate 222 so as to overlap the first substrate side. The process is simplified by providing the touch sensor and the controller on the same surface of the same substrate. It is possible.

[0176] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0177] (Embodiment 6) It is preferably used in a region where a channel of the transistor exemplified in the above embodiment is formed. An example of a semiconductor that can achieve this will be described below.

[0178] Oxide semiconductors have a large energy gap of 3.0 eV or more, making it possible to use oxide semiconductors appropriately. The oxide semiconductor film obtained by processing under these conditions and sufficiently reducing the carrier density was applied. In a transistor, the leakage current between the source and drain in the off state (off current) is , can be made extremely low compared to conventional silicon-based transistors.

[0179] When an oxide semiconductor film is used in a transistor, the thickness of the oxide semiconductor film is 2 nm to 40 nm. It is preferable to set it to nm or less.

[0180] The applicable oxide semiconductors are at least indium (In) or zinc (Zn) It is preferable that the oxide semiconductor contains In and Zn. As a stabilizer to reduce the variation in the electrical characteristics of the transistors used, In addition to gallium (Ga), tin (Sn), hafnium (Hf), and zirconium (Zr) , titanium (Ti), scandium (Sc), yttrium (Y), lanthanides (e.g. , cerium (Ce), neodymium (Nd), gadolinium (Gd), or It is preferable that one or more types are contained.

[0181] For example, oxide semiconductors include indium oxide, tin oxide, zinc oxide, and In-Zn oxide. substances, Sn-Zn oxides, Al-Zn oxides, Zn-Mg oxides, Sn-Mg oxides In-Mg oxides, In-Ga oxides, In-Ga-Zn oxides (IGZO and (also written as In-Al-Zn oxide, In-Sn-Zn oxide, Sn-Ga-Z n-based oxides, Al-Ga-Zn-based oxides, Sn-Al-Zn-based oxides, In-Hf-Zn In-Zr-Zn oxide, In-Ti-Zn oxide, In-Sc-Zn oxide Oxide, In-Y-Zn oxide, In-La-Zn oxide, In-Ce-Zn oxide In-Pr-Zn oxides, In-Nd-Zn oxides, In-Sm-Zn oxides , In-Eu-Zn oxide, In-Gd-Zn oxide, In-Tb-Zn oxide, In-Dy-Zn oxide, In-Ho-Zn oxide, In-Er-Zn oxide, I n-Tm-Zn oxide, In-Yb-Zn oxide, In-Lu-Zn ​​oxide, In -Sn-Ga-Zn oxide, In-Hf-Ga-Zn oxide, In-Al-Ga-Z n-based oxides, In-Sn-Al-Zn-based oxides, In-Sn-Hf-Zn-based oxides, In -Hf-Al-Zn oxides can be used.

[0182] Here, the In-Ga-Zn oxide is an oxide having In, Ga, and Zn as its main components. The ratio of In, Ga, and Zn is not important. Metal elements may also be included.

[0183] In addition, as an oxide semiconductor, InMO3(ZnO) m (m>0 and m is not an integer) It is also possible to use a material represented by the formula: where M is selected from Ga, Fe, Mn, and Co. Indicates one or more metal elements, or the above-mentioned stabilizer elements In addition, as an oxide semiconductor, In2SnO5(ZnO) n (n>0 and n is an integer) Materials expressed as follows may also be used.

[0184] For example, In:Ga:Zn=1:1:1, In:Ga:Zn=3:1:2, or In In-Ga-Zn oxides with an atomic ratio of Ga:Zn=2:1:3 and oxides with similar compositions It is a good idea to use compounds.

[0185] When a large amount of hydrogen is contained in the oxide semiconductor film, the hydrogen is bonded to the oxide semiconductor. Some of these become donors, generating electrons as carriers. Therefore, after the formation of the oxide semiconductor film, the threshold voltage of the In the step of forming the oxide semiconductor film, dehydration treatment (dehydrogenation treatment) is performed to remove hydrogen or moisture from the oxide semiconductor film. By removing impurities to the maximum extent possible, the product is highly purified and dehydrated (dehydrogenated). In order to compensate for the increased oxygen vacancies, a treatment for adding oxygen to the oxide semiconductor film is preferably performed. stomach..

[0186] In this specification and the like, supplying oxygen to an oxide semiconductor film is referred to as oxygen-adding treatment. In some cases, or when the amount of oxygen contained in the oxide semiconductor film is higher than the stoichiometric composition, This is sometimes referred to as hyperoxia treatment.

[0187] In this way, hydrogen or moisture is removed from the oxide semiconductor film by dehydration treatment (dehydrogenation treatment). By adding oxygen to the silicon dioxide, the oxygen vacancies are compensated for, resulting in i-type (intrinsic) or An oxide semiconductor film that is close to i-type and is substantially i-type (intrinsic) can be obtained. The term "substantially intrinsic" means that there are very few carriers derived from donors in the oxide semiconductor film ( (close to zero), and the carrier density is 1×10 17 / cm 3 Below, 1×10 16 / cm 3 below, 1×10 15 / cm 3 Below, 1×10 14 / cm 3 Below, 1×10 13 / cm 3 Below is This means that...

[0188] In addition, a transistor including an i-type or substantially i-type oxide semiconductor film as described above can be For example, a transistor using an oxide semiconductor film can be The drain current when the device is off is 1×10 at room temperature (approximately 25°C). -18 A or below, good Preferably 1 x 10 -21 A or less, more preferably 1 × 10 -24 A or below, or 85℃ 1 x 10 -15 A or less, preferably 1×10 -18 A or less, more preferably 1 x 1 0 -21 A or less. Note that the off state of a transistor is an n-channel In the case of a transistor, this refers to a state in which the gate voltage is sufficiently smaller than the threshold voltage. If the gate voltage is 1V or more, 2V or more, or 3V or more less than the threshold voltage, The transistor is turned off.

[0189] Oxide semiconductor films are roughly classified into non-single-crystal oxide semiconductor films and single-crystal oxide semiconductor films. The single-crystal oxide semiconductor film is called CAAC-OS (C Axis Aligned Crystal Polycrystalline oxide semiconductor film The CAAC-OS film is a film having a c-axis direction, a microcrystalline oxide semiconductor film, an amorphous oxide semiconductor film, or the like. This is one of oxide semiconductor films having a plurality of oriented crystal parts.

[0190] Preferably, the oxide semiconductor film is a CAAC-OS (C Axis Aligned Cr The film is a crystalline oxide semiconductor.

[0191] The CAAC-OS film was observed under a transmission electron microscope (TEM). When observed under a crystalline microscope, clear boundaries between the crystals, i.e., crystal boundaries, are clearly visible. It is not possible to confirm the grain boundary. It can be said that the AC-OS film is less susceptible to the decrease in electron mobility caused by grain boundaries.

[0192] The CAAC-OS film was observed by TEM from a direction roughly parallel to the sample surface (cross-sectional TEM observation). ) It can be confirmed that the metal atoms are arranged in layers in the crystalline part. Each layer has a surface on which the CAAC-OS film is formed (also referred to as a surface on which the CAAC-OS film is formed) or an uneven surface on which the CAAC-OS film is formed. The shape reflects this and is aligned parallel to the surface on which the CAAC-OS film is formed or the top surface.

[0193] On the other hand, the CAAC-OS film was observed by TEM from a direction approximately perpendicular to the sample surface (planar TEM). When observed, it was found that the metal atoms were arranged in triangular or hexagonal shapes in the crystals. However, there is no regularity in the arrangement of metal atoms between different crystal parts. stomach.

[0194] When electron diffraction was performed on the CAAC-OS film, spots (bright spots) indicating orientation were observed. It is observed.

[0195] Cross-sectional and planar TEM observations revealed that the crystals in the CAAC-OS film had an orientation. It turns out that there are.

[0196] Most of the crystals in the CAAC-OS film are cubes with sides of less than 100 nm. Therefore, the crystal part included in the CAAC-OS film has a side length of 10n This also includes cases where the size fits within a cube of less than 100 mm, less than 5 nm, or less than 3 nm. In addition, multiple crystals in the CAAC-OS film are connected to form a single large crystal region. For example, in a planar TEM image, 2 Over 5μm 2 or more than 1000μm 2 Crystal regions with more than this size may be observed.

[0197] X-ray diffraction (XRD) was performed on the CAAC-OS film. For example, a CAAC-OS film with InGaZnO4 crystals was found by structural analysis using the device. In the out-of-plane analysis, a peak was observed at a diffraction angle (2θ) of approximately 31°. This peak is attributed to the (009) plane of the InGaZnO4 crystal. This indicates that the crystals of the CAAC-OS film have a c-axis orientation, and the c-axis is approximately aligned on the surface on which the film is formed or on the upper surface. It can be seen that it is oriented in a substantially vertical direction.

[0198] On the other hand, in-pl X-rays are incident on the CAAC-OS film from a direction approximately perpendicular to the c-axis. In the analysis by the ane method, a peak may appear at 2θ around 56°. This is attributed to the (110) plane of the InGaZnO4 crystal. In the case of a semiconductor film, 2θ is fixed at around 56°, and the normal vector of the sample surface is set as the axis (φ axis). When the sample is rotated and analyzed (φ scan), the crystal plane equivalent to the (110) plane is In contrast, in the case of the CAAC-OS film, 2θ is set to 5 Even when the φ is fixed at around 6° and scanned, no clear peak appears.

[0199] From the above, it is concluded that the a-axis and b-axis orientations are inconsistent between different crystal regions in the CAAC-OS film. Although it is regular, it has a c-axis orientation, and the c-axis is parallel to the normal vector of the surface to be formed or the upper surface. Therefore, the layered arrangement confirmed by the cross-sectional TEM observation mentioned above is consistent with the above. Each layer of aligned metal atoms is a plane parallel to the ab plane of the crystal.

[0200] The crystalline part is formed when the CAAC-OS film is formed or when a crystallization process such as a heat treatment is performed. As described above, the c-axis of the crystal is aligned with the surface on which the CAAC-OS film is formed or the surface on which the CAAC-OS film is formed. The orientation of the CAAC-OS film is parallel to the normal vector of the top surface. When the shape is changed by etching, the c-axis of the crystal is aligned with the surface on which the CAAC-OS film is formed. Or it may not be parallel to the normal vector of the upper surface.

[0201] Furthermore, the distribution of c-axis oriented crystal parts in the CAAC-OS film does not need to be uniform. For example, the crystalline part of the CAAC-OS film is formed by crystal growth from the vicinity of the top surface of the CAAC-OS film. When the crystal is formed by this method, the region near the top surface has a larger amount of c-axis oriented crystals than the region near the surface on which the crystal is formed. In addition, when impurities are added to the CAAC-OS film, the proportion of impurities may increase. The region where the ZnO was added was transformed, and regions with different proportions of c-axis oriented crystals were formed. This may also occur.

[0202] In addition, the out-of-plane method of CAAC-OS film with InGaZnO4 crystals In the analysis by , in addition to the peak at 2θ around 31°, a peak also appeared at 2θ around 36°. The peak at 2θ around 36° is due to the presence of c-axis orientation in part of the CAAC-OS film. The CAAC-OS film contains crystals that do not have a 2θ of around 31°. It is preferable that the peak is exhibited at 2θ of around 36° and that the peak is not exhibited at 2θ of around 36°.

[0203] The CAAC-OS film is an oxide semiconductor film with a low concentration of impurities. These are elements other than the main components of the oxide semiconductor film, such as silicon and transition metal elements. The elements that bond to oxygen more strongly than the metal elements that constitute the oxide semiconductor film, such as fluorine, are oxidized. By removing oxygen from the oxide semiconductor film, the atomic arrangement of the oxide semiconductor film is disrupted, reducing its crystallinity. In addition, heavy metals such as iron and nickel, argon, and carbon dioxide have an atomic radius (or molecular radius) is large, and when it is contained inside the oxide semiconductor film, The impurities contained in the oxide semiconductor film are likely to disturb the atomic arrangement and cause a decrease in crystallinity. Objects can act as carrier traps or carrier sources.

[0204] The CAAC-OS film is an oxide semiconductor film with a low density of defect states. Oxygen vacancies in the semiconductor film can become carrier traps or trap hydrogen, It can be a source of carrier generation.

[0205] Low impurity concentration and low defect level density (low oxygen vacancies) are called high purity intrinsic or The term "substantially highly purified intrinsic" refers to a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor film. Since there are fewer carrier generation sources, the carrier density can be reduced. A transistor using an oxide semiconductor film has electrical characteristics such as a negative threshold voltage ( It is also called marion.) It is rare for it to become high purity genuine or substantially high purity genuine. The oxide semiconductor film has few carrier traps. A transistor using such a material has little fluctuation in electrical characteristics and is highly reliable. Note that it takes a long time for charges trapped in the carrier traps in the oxide semiconductor film to be released. The time between the charges is long and the charge may behave as if it is a fixed charge. However, a transistor using an oxide semiconductor film with a high density of defect states has unstable electrical characteristics. There are cases where this happens.

[0206] In addition, transistors using CAAC-OS films show improved electrical characteristics when irradiated with visible light or ultraviolet light. The fluctuation is small.

[0207] In addition, the following conditions are preferably applied to form the CAAC-OS film.

[0208] By increasing the substrate temperature during film formation, migration of plate-shaped sputtering particles that reach the substrate is prevented. Sputtering occurs, and the flat surface of the sputtered particle adheres to the substrate. The sputtering particles are positively charged, so they repel each other and are attached to the substrate. Therefore, sputtering particles do not overlap unevenly, resulting in a CA with uniform thickness. Specifically, the substrate temperature is set to 100°C or higher and 740°C or higher. Preferably, the film is formed at a temperature of 200°C or higher and 500°C or lower.

[0209] In addition, by reducing the amount of impurities mixed in during film formation, it is possible to prevent the crystal state from being destroyed by impurities. For example, the concentration of impurities (hydrogen, water, carbon dioxide, nitrogen, etc.) present in the film formation chamber can be controlled. In addition, the impurity concentration in the deposition gas can be reduced. A deposition gas having a dew point of -80°C or less, preferably -100°C or less, is used.

[0210] In addition, increasing the oxygen ratio in the deposition gas and optimizing the power reduces plasma damage during deposition. The oxygen ratio in the deposition gas is preferably 30% by volume or more, and more preferably 100% by volume or more. The product is %.

[0211] After the CAAC-OS film is formed, heat treatment may be performed. The temperature is set to 740°C or higher, preferably 200°C or higher and 500°C or lower. The heating time is from 1 minute to 24 hours, preferably from 6 minutes to 4 hours. The heat treatment may be carried out in an active atmosphere or an oxidizing atmosphere. Preferably, the heat treatment is carried out in an inert atmosphere. After that, heat treatment is performed in an oxidizing atmosphere. The impurity concentration of the S film can be reduced in a short time. In this case, oxygen vacancies may be generated in the CAAC-OS film in an oxidizing atmosphere. The heat treatment can reduce the oxygen vacancies. The crystallinity of the AAC-OS film can be further improved. The reaction may be carried out under reduced pressure of 100 Pa or less, 10 Pa or less, or 1 Pa or less. can reduce the impurity concentration of the CAAC-OS film in a shorter time.

[0212] As an example of a sputtering target, an In-Ga-Zn-O compound target is The following are the results:

[0213] InO X powder, GaO Y Powder and ZnO Z The powders are mixed in a specified number of moles and then pressurized. By heat treatment at a temperature between 1000℃ and 1500℃, polycrystalline In-Ga -Zn-O compound target, where X, Y, and Z are any positive numbers. , the predetermined molar ratio is, for example, InO X powder, GaO Y Powder and ZnO Z Powder, 1 :1:1, 1:1:2, 1:3:2, 2:1:3, 2:2:1, 3:1:1, 3:1:2 , 3:1:4, 4:2:3, 8:4:3, or values ​​close to these. The type of powder and the molar ratio of the powder to be mixed depend on the sputtering target to be prepared. This can be changed as appropriate depending on the kit.

[0214] Alternatively, the CAAC-OS film may be formed by the following method.

[0215] First, a first oxide semiconductor film is formed to a thickness of 1 nm or more and less than 10 nm. The semiconductor film is formed by sputtering. Specifically, the substrate temperature is set to 100°C or higher for 5 00℃ or less, preferably 150℃ or more and 450℃ or less, and the oxygen ratio in the deposition gas is 30 The film is formed at a volume percentage of at least 100%, preferably 100%.

[0216] Next, heat treatment is performed to convert the first oxide semiconductor film into a first CAAC-OS film with high crystallinity. The temperature of the heat treatment is 350°C or higher and 740°C or lower, preferably 450°C or higher and 650°C or lower. The heat treatment time is 1 minute to 24 hours, preferably 6 minutes to 4 hours. The heat treatment may be carried out in an inert atmosphere or an oxidizing atmosphere. Or, after heat treatment in an inert atmosphere, heat treatment is performed in an oxidizing atmosphere. By the heat treatment in air, the impurity concentration of the first oxide semiconductor film can be reduced in a short time. On the other hand, oxygen vacancies are generated in the first oxide semiconductor film by heat treatment in an inert atmosphere. In this case, the oxygen deficiency can be reduced by heat treatment in an oxidizing atmosphere. Heat treatment can be carried out at a pressure of 1000 Pa or less, 100 Pa or less, 10 Pa or less, or The treatment may be performed under reduced pressure of 1 Pa or less. Under reduced pressure, the impurity concentration of the first oxide semiconductor film can be reduced to It can be reduced in an even shorter time.

[0217] The first oxide semiconductor film has a thickness of 1 nm or more and less than 10 nm. Compared with nanometers or larger, it can be easily crystallized by heat treatment.

[0218] Next, a second oxide semiconductor film having the same composition as the first oxide semiconductor film is formed to a thickness of 10 nm or more and 50 nm or more. The second oxide semiconductor film is deposited to a thickness of 100 nm or less by sputtering. Specifically, the substrate temperature is set to 100°C or higher and 500°C or lower, preferably 150°C or higher and 450°C or lower. The oxygen ratio in the deposition gas is set to 30% by volume or more, preferably 100% by volume. do.

[0219] Next, heat treatment is performed to form a second oxide semiconductor film by solid-phase growth from the first CAAC-OS film. The heat treatment temperature was 350°C. The temperature is set to 450°C or higher and 740°C or lower, preferably 450°C or higher and 650°C or lower. The heating time is from 1 minute to 24 hours, preferably from 6 minutes to 4 hours. The heat treatment may be carried out in an active atmosphere or an oxidizing atmosphere. Preferably, the heat treatment is carried out in an inert atmosphere. After that, heat treatment is performed in an oxidizing atmosphere. The impurity concentration of the semiconductor film can be reduced in a short time. Oxygen vacancies may be generated in the second oxide semiconductor film by the treatment. The oxygen deficiency can be reduced by heat treatment in a 10 atmosphere. The pressure may be reduced to 00 Pa or less, 100 Pa or less, 10 Pa or less, or 1 Pa or less. Under reduced pressure, the impurity concentration of the second oxide semiconductor film can be reduced in a shorter time. do.

[0220] In this manner, a CAAC-OS film having a total thickness of 10 nm or more can be formed. can.

[0221] The oxide semiconductor film may have a structure in which a plurality of oxide semiconductor films are stacked.

[0222] For example, the oxide semiconductor film is formed by dividing the oxide semiconductor film (for convenience, referred to as a first layer) and the gate insulating film. Between them, there is a layer consisting of the elements that make up the first layer, and the electron affinity is 0.2 eV or more smaller than that of the first layer. In this case, when an electric field is applied from the gate electrode, a charge is generated in the first layer. The first layer is a channel, and the second layer is a channel. Since the values ​​of the first and second layers are the same, almost no interfacial scattering occurs at the interface between the first and second layers. Therefore, by providing a second layer between the first layer and the gate insulating film, the transistor The field effect mobility can be increased.

[0223] Furthermore, the gate insulating film may be a silicon oxide film, a silicon oxynitride film, a silicon nitride oxide film, or When a silicon nitride film is used, silicon contained in the gate insulating film is transferred to the oxide semiconductor film. When silicon is contained in the oxide semiconductor film, the crystallinity of the oxide semiconductor film may be deteriorated. Therefore, the first layer where the channel is formed is In order to reduce the silicon concentration, it is preferable to provide a second layer between the first layer and the gate insulating film. For the same reason, the second layer is made up of elements that make up the first layer and has an electron affinity of 0. It is preferable to provide a third layer that is at least 0.2 eV smaller, and to sandwich the first layer between the second and third layers.

[0224] By adopting such a structure, the diffusion of impurities such as silicon into the region where the channel is formed is prevented. This reduces or even prevents diffusion, resulting in a highly reliable transistor. Cut.

[0225] Note that in order for the oxide semiconductor film to be a CAAC-OS film, Silicon concentration 2.5×10 21 / cm 3 Preferably, the oxide semiconductor film contains The silicon concentration is 1.4 x 10 21 / cm 3 less than 4 x 10 19 / cm 3 less than 2.0 × 10 18 / cm 3The oxide semiconductor film The silicon concentration in 21 / cm 3 If this is the case, the transistor There is a risk of a decrease in mobility due to the magnetic field effect, and the 19 / cm 3 If this is the case, the oxide semiconductor This is because there is a risk that the oxide semiconductor film may become amorphous at the interface with the film in contact with the semiconductor film. In addition, the silicon concentration in the oxide semiconductor film is set to 2.0×10 18 / cm 3 Less than As a result, the reliability of the transistor is further improved and the DOS (de It is expected that the silicon dioxide in the oxide semiconductor film will be reduced. The concentration of ions was measured by secondary ion mass spectrometry (SIMS). It can be measured by spectrometry.

[0226] This embodiment may be implemented in appropriate combination with other embodiment modes described in this specification. can be done.

[0227] (Embodiment 7) In this embodiment, a display panel mounted on a curved surface and a display device mounted on the curved surface, which are one embodiment of the present invention, will be described. A drive circuit including circuit elements mounted on multiple flat surfaces arranged in a stepped pattern along the curved surface on the back side An example of an electronic device including a display device having the above will be described with reference to FIG.

[0228] The electronic devices shown in FIGS. 8A to 8C are examples of portable information terminals.

[0229] The mobile information terminal 1010 shown in FIG. 8A includes a display device 101 incorporated in a housing 1011. In addition to 2A, there are an operation button 1013, a speaker 1014, a microphone 1015, and other components not shown. Stereo headphone jack, memory card slot, camera, USB connector, etc. It is equipped with external connection ports, etc.

[0230] Here, the display device 1012A is the display device of one embodiment of the present invention described in the above embodiment. The display device 1012A shown in FIG. 8(A) is a device having a convex curved surface. 1 is an example having a display panel mounted on a display panel.

[0231] The mobile information terminal 1020 shown in FIG. 8B has the same configuration as the mobile information terminal 1010. A display device having a display panel mounted on a curved surface that fits the side of the housing 1011 8C is an example of a portable information terminal 1030. A display device having a similar configuration to that of the terminal 1010 and having a display panel mounted on a concavely curved surface. This is an example in which the display device 1012B and the display device 1012C are provided. In this case, the display device of one embodiment of the present invention described in the above embodiment can be applied.

[0232] An electronic device according to one embodiment of the present invention includes a display panel having a curved surface on its top surface and a flat portion on its bottom surface. This allows you to place the electronic device face down on a flat surface such as a desk. As a result, it is possible to provide an electronic device in which characters and images displayed on a display panel are easy to read. This can be done.

[0233] The portable information terminals shown in FIGS. 8A to 8C are, for example, telephones, electronic books, personal computers, etc. The display device has the functions of one or more of a game machine and a game computer. The sensor may be provided with a switch sensor.

[0234] 9(A) to 9(D) show a portable information terminal 300E. 9(B) is a perspective view illustrating the external shape of the information device terminal 300E. 9(C) is a top view of the portable information device terminal 300E of FIG. 9(D) is a cross-sectional view taken along the cutting line Z1-Z2 of the portable information terminal 300E. FIG.

[0235] The portable information device terminal 300E is selected from, for example, a telephone, a notebook, an information viewing device, etc. It has one or more functions. Specifically, it can be used as a smartphone. .

[0236] The portable information terminal 300E includes a housing 160a and a housing 160b that fits into the housing 160a. 0b, the space surrounded by the housing 160a and the housing 160b, the base 110, the housing 160a and the base 110, a display panel 120 and a printed circuit board 161C that drives the display panel 120 (See FIG. 9(C)).

[0237] The display panel 120 is provided along multiple surfaces of the housing 160a. The display panel 120 having the above structure is disposed along the inside of the housing 160a. The portable information device terminal 300E can display text and image information on multiple surfaces. For example, three operation buttons can be displayed on one side (see FIG. 9(A)). The information shown in the dashed rectangle can be displayed on another surface (see Figure 9(B)).

[0238] The portable information device terminal 300E can display text and image information on multiple surfaces. This allows the user to store the portable information terminal 300E in, for example, a breast pocket of his / her clothes. The display can be confirmed in this state (see FIG. 9(D)).

[0239] Specifically, the telephone number or name of the caller of the incoming call is displayed on the display panel 120. The user can see the display from above the portable information device terminal 300E. The user can check the display panel 120 without taking the electronic device terminal 300E out of his / her pocket. This allows you to, for example, accept calls if they are urgent and reject calls if they are not. It can be denied.

[0240] The portable information device terminal 300E includes a vibration sensor and a vibration sensor that detects the vibration. It is equipped with a storage device that stores a program that switches to a mode that rejects incoming calls based on vibration. This allows the user to easily wear the portable information terminal 300E over their clothes. By tapping the phone and vibrating it, you can put it into a mode where it will reject incoming calls.

[0241] This embodiment may be implemented in appropriate combination with other embodiment modes described in this specification. can be done. [Explanation of symbols]

[0242] 10 Circuit Elements 11a Planarization layer 11b Planarization layer 11c Planarization layer 12 Wiring 18 Through holes 100 display device 110 Base 111 Multilayer board 111C Printed Circuit Board 111L Printed Circuit Board 111R drive circuit 112a connector 112b connector 114 Antenna 115L terminal section 115R terminal section 117 Metal Film 118 Through Hole 120 Display Panel 129 Flexible Printed Circuit Board 130 Touch Panel 139 Flexible Printed Circuit Board 140 spacer 160a housing 160b case 160c housing 161C Printed Circuit Board 161L Control circuit 161R Functional Circuit 170 Batteries 170C battery 170L battery 170R battery 200 Display device 210 Base 220 Display Panel 226 Spacer 229 Flexible Printed Circuit Board 233 Wiring 230 Touch Panel 239 Flexible Printed Circuit Board 260a housing 260b housing 260c chassis 261L Control circuit 261R Functional Circuit 270 batteries 270C battery 270L battery 270R battery 300A display device 300B display device 300C display unit 300D display device 400A display device 400B display device 400D display device 400C display device 1010 Mobile Information Terminal 1011 Case 1012A Display device 1012B Display device 1012C Display device 1013 Operation button 1014 Speaker 1015 Mike 1020 Mobile Information Terminal 1030 Mobile Information Terminal

Claims

[Claim 1] a base body having an outer surface molded into a curved surface; a display panel attached along the curved surface; a plurality of electronic circuit boards provided on the inner surface of the base body with steps that increase in height from a central portion toward an outer region; a wiring member that electrically connects the electronic circuit boards to each other, The display device, wherein the display panel is connected to the electronic circuit board at a side portion of the base.

Images