Syntactic foam parts and related methods of manufacture

Abstract

A syntactic lightweight foam made of low density spheres embedded in a resin.SOLUTION: Placing at least one thermally conductive medium layer in the mold. Thereby, at least a portion of the at least one thermally conductive medium layer is spaced apart from the inner surface of the mold. The method also includes loading low density spheres into the mold to surround the at least one layer of thermally conductive medium. The method further includes introducing a resin into the mold. Thereby, the at least one thermally conductive medium layer and the low density spheres are embedded in the resin. The at least one thermally conductive medium layer has a thermal conductivity greater than the thermal conductivity of the low density spheres and the resin. The method includes solidifying the resin after the resin has been introduced into the mold. The method also includes transferring heat through the at least one thermally conductive medium layer as the resin is solidifying.SELECTED DRAWING: Figure 6A

Description

[Technical Field]

[0001] FIELD OF THE DISCLOSURE

[0001] This disclosure relates generally to lightweight foams, and more particularly to syntactic lightweight foams made of low density spheres embedded in a resin. [Background technology]

[0002]

[0002] Lightweight foams are incorporated into components to facilitate their lightweight nature in higher density fluids. Some components that incorporate lightweight foams include, but are not limited to, submarines, ships, oil rigs and their components, offshore platforms, and other marine-based systems. Typical lightweight foams are compression resistant and, in some cases, water resistant, durable, and reliable. Producing lightweight foams with these properties in an efficient, cost-effective, and reliable manufacturing process can be difficult. Summary of the Invention

[0003]

[0003] The subject matter of the present application was developed in response to the current state of the art, and in particular in response to the shortcomings of conventional lightweight foams and conventional methods of making such lightweight foams. These shortcomings have not yet been fully addressed by currently available technology. Accordingly, the subject matter of the present application was developed to provide syntactic foam parts and corresponding methods of making such parts, which overcome at least some of the above-mentioned shortcomings of the prior art.

[0004]

[0004] Below is a non-exhaustive list of several examples of the subject matter disclosed in this specification, which may or may not be claimed.

[0005]

[0005] A method for making a syntactic foam part is disclosed herein. The method includes placing at least one thermally conductive medium layer in a mold, whereby at least a portion of the at least one thermally conductive medium layer is spaced from an inner surface of the mold. The method also includes loading low-density spheres into the mold, whereby the low-density spheres form a lattice arrangement within the mold and surround the at least one thermally conductive medium layer. The method further includes introducing a resin into the mold, whereby the at least one thermally conductive medium layer and the low-density spheres are embedded in the resin. The at least one thermally conductive medium layer has a thermal conductivity greater than the thermal conductivity of the low-density spheres and the thermal conductivity of the resin. The method further includes solidifying the resin after it is introduced into the mold. The method also includes transferring heat through the at least one thermally conductive medium layer as the resin solidifies. The preceding subject matter of this paragraph characterizes Example 1 of the present disclosure.

[0006]

[0006] At least one thermally conductive medium layer is disposed in the mold before the low-density spheres are loaded into the mold. The preceding subject matter of this paragraph characterizes Example 2 of the present disclosure, which also includes subject matter according to Example 1 above.

[0007]

[0007] At least one thermally conductive medium layer is porous. At least some of the low-density spheres pass through the at least one thermally conductive medium layer when the low-density spheres are loaded into the mold. The preceding subject matter of this paragraph characterizes Example 3 of the present disclosure, which also includes subject matter according to Example 2 above.

[0008]

[0008] At least one thermally conductive medium layer is perpendicular to the loading direction of the low-density spheres and the filling direction of the resin. The preceding subject matter of this paragraph characterizes Example 4 of the present disclosure, which also includes subject matter according to Example 3 above.

[0009]

[0009] At least one thermally conductive medium layer is parallel to the loading direction of the low-density spheres and the filling direction of the resin. The preceding subject matter of this paragraph characterizes Example 5 of the present disclosure, which also includes subject matter according to any one of Examples 2 to 4 above.

[0010]

[0010] At least one thermally conductive medium layer is incompletely porous, whereby low-density spheres do not pass through the at least one thermally conductive medium layer when loaded into the mold, and resin passes through the at least one thermally conductive medium layer when introduced into the mold. The preceding subject matter of this paragraph characterizes Example 6 of the present disclosure, which also includes subject matter according to Example 5 above.

[0011]

[0011] At least one thermally conductive medium layer is porous. When the resin is introduced into the mold, at least a portion of the resin passes through the at least one thermally conductive medium layer. The preceding subject matter of this paragraph characterizes Example 7 of the present disclosure, which also includes subject matter according to any one of Examples 1 to 6 above.

[0012]

[0012] Loading the low-density spheres into the mold includes loading a first amount of low-density spheres and loading a second amount of low-density spheres. Placing at least one thermally conductive medium layer in the mold includes, after the first amount of low-density spheres is loaded into the mold, placing at least one thermally conductive medium layer on the first amount of low-density spheres. The second amount of low-density spheres is loaded on the at least one thermally conductive medium layer. The preceding subject matter of this paragraph characterizes Example 8 of the present disclosure, which also includes subject matter according to any one of Examples 1 to 7 above.

[0013]

[0013] At least one thermally conductive medium layer extends across the entire width, height, or length of the mold and is in thermally conductive engagement with the interior surface of the mold at both ends of the at least one thermally conductive medium layer. At least a portion of the heat transferred through the at least one thermally conductive medium layer is transferred directly from the at least one thermally conductive medium layer to the interior surface of the mold via conduction. The preceding subject matter of this paragraph characterizes Example 9 of the present disclosure, which also includes subject matter according to any one of Examples 1 to 8 above.

[0014]

[0014] Placing at least one thermally conductive medium layer in a mold includes placing a plurality of thermally conductive medium layers in the mold at spaced locations within the mold. Low-density spheres are loaded into the mold, whereby the low-density spheres surround the plurality of thermally conductive medium layers. Resin is introduced into the mold, whereby the plurality of thermally conductive medium layers are embedded in the resin. The preceding subject matter of this paragraph characterizes Example 10 of the present disclosure, which also includes subject matter according to any one of Examples 1 to 9 above.

[0015]

[0015] The plurality of thermally conductive medium layers are uniformly spaced within the mold. The preceding subject matter of this paragraph characterizes Example 11 of the present disclosure, which also includes subject matter according to Example 10 above.

[0016]

[0016] The plurality of thermally conductive medium layers are non-uniformly spaced within the mold. The preceding subject matter of this paragraph characterizes Example 12 of the present disclosure, which also includes subject matter according to Examples 10 or 11 above.

[0017] The at least one thermally conductive medium layer has a specific thermal conductivity between 80 Watts per gram per cubic centimeter per meter Kelvin (W / mK / (g / cc)) and 1,400 W / mK / (g / cc), inclusive. The preceding subject matter of this paragraph characterizes Example 13 of the present disclosure, which also includes subject matter according to any one of Examples 1 through 12 above.

[0018]

[0018] The at least one thermally conductive medium layer comprises one of a woven fabric, continuous fiber, chopped fiber, a rod, a tube, a strip, a perforated sheet, or an expanded sheet. The preceding subject matter of this paragraph characterizes Example 14 of the present disclosure, which also includes subject matter according to any one of Examples 1 to 13 above.

[0019]

[0019] Further disclosed herein is a syntactic foam part comprising a resin in a cured state. The syntactic foam part also comprises low-density spheres arranged in a lattice configuration and embedded within the resin. The syntactic foam part further comprises at least one thermally conductive medium layer surrounded by the low-density spheres and embedded within the resin. The at least one thermally conductive medium layer has a thermal conductivity greater than the thermal conductivity of the low-density spheres and the thermal conductivity of the resin. The preceding subject matter of this paragraph characterizes Example 15 of the present disclosure.

[0020]

[0020] At least one thermally conductive medium layer is porous. At least some of the low-density spheres are sized to be able to pass through the at least one thermally conductive medium layer. The preceding subject matter of this paragraph characterizes Example 16 of the present disclosure, which also includes subject matter according to Example 15 above.

[0021]

[0021] At least one thermally conductive medium layer is porous. The resin, when in a flowable state, can pass through the at least one thermally conductive medium layer. The preceding subject matter of this paragraph characterizes Example 17 of the present disclosure, which also includes subject matter according to Examples 15 or 16 above.

[0022]

[0022] At least one thermally conductive medium layer extends across the entire width, height, or length of the syntactic foam component. The preceding subject matter of this paragraph characterizes Example 18 of the present disclosure, which also includes subject matter according to any one of Examples 15-17 above.

[0023] The syntactic foam component includes a plurality of thermally conductive medium layers spaced apart from one another. The preceding subject matter of this paragraph characterizes Example 19 of the present disclosure, which also includes subject matter according to any one of Examples 15 to 18 above.

[0024]

[0024] The plurality of thermally conductive medium layers are uniformly spaced within the syntactic foam component. The preceding subject matter of this paragraph characterizes Example 20 of the present disclosure, which also includes subject matter according to Example 19 above.

[0025]

[0025] The plurality of thermally conductive medium layers are non-uniformly spaced within the syntactic foam component. The preceding subject matter of this paragraph characterizes Example 21 of the present disclosure, which also includes subject matter according to Examples 19 or 20 above.

[0026] The at least one thermally conductive medium layer has a specific thermal conductivity between 80 Watts per gram per cubic centimeter per meter Kelvin (W / mK / (g / cc)) and 1,400 W / mK / (g / cc), inclusive. The preceding subject matter of this paragraph characterizes Example 22 of the present disclosure, which also includes subject matter according to any one of Examples 15 through 21 above.

[0027]

[0027] At least one thermally conductive medium layer comprises one of a woven fabric, continuous fiber, chopped fiber, rod, tube, strip, perforated sheet, or expanded sheet. The preceding subject matter of this paragraph characterizes Example 23 of the present disclosure, which also includes subject matter according to any one of Examples 15 to 22 above.

[0028] The described features, structures, advantages, and / or characteristics of the presently disclosed subject matter may be combined in any suitable manner in one or more examples and / or embodiments. In the following description, numerous specific details are presented to facilitate a comprehensive understanding of the embodiments of the presently disclosed subject matter. Those skilled in the art will recognize that the presently disclosed subject matter can be practiced without one or more of the specific features, details, components, materials, and / or methods of a particular example or implementation. In other cases, additional features and advantages may be recognized in particular examples and / or implementations, but may not be present in all examples or implementations. Furthermore, in some instances, well-known structures, materials, or steps have not been described or shown in detail so as not to obscure aspects of the presently disclosed subject matter. The features and advantages of the presently disclosed subject matter will become more apparent from the following description and appended claims, or may be learned by practicing the subject matter as described below.

[0029]

[0029] So that the advantages of the present subject matter may be more readily understood, a more detailed description of the subject matter outlined above will be given by reference to specific embodiments illustrated in the accompanying drawings. It will be understood that these drawings, which are not necessarily drawn to scale, depict only certain examples of the subject matter and therefore should not be considered limiting of its scope, and that the subject matter will be described with added specificity and detail using the drawings. [Brief explanation of the drawings]

[0030] [Figure 1]

[0030] FIG. 1 is a schematic perspective view of a mold for making a syntactic foam part according to one or more embodiments of the present disclosure. [Figure 2]

[0031] 2 is a schematic cross-sectional front elevation view of the mold of FIG. 1 taken along line A-A of FIG. 1, in accordance with one or more embodiments of the present disclosure. [Figure 3]

[0032] 2 is a schematic cross-sectional front elevation view taken along line A-A of FIG. 1 showing low-density spheres being loaded into the mold of FIG. 1, according to one or more embodiments of the present disclosure. FIG. [Figure 4]

[0033] 2 is a schematic cross-sectional front elevation view taken along line A-A of FIG. 1 showing more low-density spheres being loaded into the mold of FIG. 1, according to one or more embodiments of the present disclosure. FIG. [Figure 5]

[0034] 2 is a schematic cross-sectional front elevation view taken along line A-A of FIG. 1 showing resin being introduced into the mold of FIG. 1, in accordance with one or more embodiments of the present disclosure. [Figure 6A]

[0035] 2 is a schematic cross-sectional front elevation view of the resin in the mold of FIG. 1 taken along line A-A in FIG. 1, in accordance with one or more embodiments of the present disclosure. [Figure 6B]

[0036] 2 is a schematic cross-sectional front elevation view taken along line A-A of FIG. 1 showing heat being released from the resin in the mold of FIG. 1, in accordance with one or more embodiments of the present disclosure. [Figure 6C]

[0037] FIG. 1 is a perspective view of a syntactic foam component according to one or more embodiments of the present disclosure. [Figure 7]

[0038] 2 is a schematic cross-sectional front elevation view of another mold taken along a line similar to line A-A of FIG. 1, in accordance with one or more embodiments of the present disclosure. [Figure 8]

[0039] FIG. 1 is a schematic perspective view of another mold for making a syntactic foam part according to one or more embodiments of the present disclosure. [Figure 9]

[0040] 9 is a schematic cross-sectional plan view of the mold of FIG. 8 taken along line B-B of FIG. 8, in accordance with one or more embodiments of the present disclosure. [Figure 10]

[0041] 9 is a schematic cross-sectional front elevation view taken along line CC of FIG. 8 showing low-density spheres being loaded into the mold of FIG. 8, in accordance with one or more embodiments of the present disclosure. [Figure 11]

[0042] 9 is a schematic cross-sectional front elevation view taken along line CC of FIG. 8 showing resin being introduced into the mold of FIG. 8, in accordance with one or more embodiments of the present disclosure. [Figure 12]

[0043] 9 is a schematic cross-sectional front elevation view taken along line CC of FIG. 8 of an alternative configuration of the mold of FIG. 8, in accordance with one or more embodiments of the present disclosure. [Figure 13]

[0044] FIG. 1 is a perspective view of a thermally conductive layer made from a perforated sheet used to create and form a portion of a syntactic foam component according to one or more embodiments of the present disclosure. [Figure 14]

[0045] FIG. 1 is a perspective view of a thermally conductive layer made of discontinuous or chopped fibers used to create and form a portion of a syntactic foam component according to one or more embodiments of the present disclosure. [Figure 15]

[0046] FIG. 1 is a perspective view of a thermally conductive layer made of continuous fibers used to create and form a portion of a syntactic foam component according to one or more embodiments of the present disclosure. [Figure 16]

[0047] FIG. 1 is a perspective view of a thermally conductive layer made of a woven fabric used to create and form a portion of a syntactic foam component according to one or more embodiments of the present disclosure. [Figure 17]

[0048] 2 is a schematic cross-sectional front elevation view taken along line A-A of FIG. 1 showing low-density spheres being loaded into an alternative configuration of the mold of FIG. 1, in accordance with one or more embodiments of the present disclosure. FIG. [Figure 18]

[0049] FIG. 2 is a schematic cross-sectional front elevation view taken along line A-A of FIG. 1 showing a thermally conductive medium layer disposed on low-density spheres in an alternative configuration of the mold of FIG. 1, in accordance with one or more embodiments of the present disclosure. [Figure 19]

[0050] 19 is a schematic cross-sectional front elevation view taken along line A-A of FIG. 1 showing low density spheres loaded onto the thermally conductive medium layer of FIG. 18, in accordance with one or more embodiments of the present disclosure. [Figure 20]

[0051] 19 is a schematic cross-sectional front elevation view taken along line A-A of FIG. 1 showing low-density spheres loaded onto a second thermally conductive medium layer disposed on the low-density spheres loaded into the mold of FIG. 19, in accordance with one or more embodiments of the present disclosure. [Figure 21]

[0052] 18 is a schematic cross-sectional front elevation view taken along line A-A of FIG. 1 showing resin being introduced into the mold of FIG. 17, according to one or more embodiments of the present disclosure. [Figure 22]

[0053] FIG. 10 is a schematic perspective view of yet another mold for making a syntactic foam part according to one or more embodiments of the present disclosure. [Figure 23]

[0054] 1 is a schematic flow chart of another method of making a syntactic foam part, according to one or more embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0031]

[0055] When reference is made herein to "one embodiment," "an embodiment," or similar phrases, it means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present disclosure. The phrases "one embodiment," "an embodiment," and similar phrases appearing throughout this specification may, but do not necessarily, all refer to the same embodiment. Similarly, the term "embodiment" means an embodiment having a particular feature, structure, or characteristic described in connection with one or more embodiments of the present disclosure, but the embodiment may be associated with one or more embodiments unless there is a clear correlation suggesting otherwise.

[0032]

[0056] Some conventional methods for making syntactic foam parts involve stacking spheres in a mold and injecting liquid resin into the mold. The liquid resin embeds the spheres. The liquid resin is then solidified (e.g., cured) by heating the resin to a desired solidification temperature. Solidification of the resin occurs through an exothermic reaction initiated by heat applied to the resin. The exothermic reaction causes the resin to release heat, which increases the local temperature of the resin. The heat release also acts to accelerate the exothermic reaction, thus further increasing the local temperature of the resin. Because syntactic foam, particularly syntactic foam spheres, are good insulators, the localized increase and acceleration of the resin temperature can reach dangerously high temperatures in the center of the mold. The significant temperature gradients within the mold caused by such high-temperature spikes can result in damage to the syntactic foam part and / or the mold. This can adversely affect the quality of the syntactic foam part by introducing residual stresses and cracks within the part. Some conventional methods for making syntactic foam parts attempt to mitigate temperature spikes in the mold by slowly heating the resin over an extended period of time, which can be economically costly by limiting production rates, tying up expensive tooling for extended periods of time, and limiting the size of parts that can be produced.

[0033]

[0057] Described herein are several examples of methods for making syntactic foam parts made with low-density spheres embedded in a resin. The methods reduce dangerous temperature spikes as the resin solidifies. The methods incorporate one or more thermally conductive medium layers. The layers form a portion of the syntactic foam part and improve the part's thermal conductivity, helping to distribute heat throughout the part as the resin solidifies. In this manner, by dissipating heat generated by the exothermic reactions associated with resin solidification, and thus reducing the occurrence of temperature spikes, the resin solidifies faster and more reliably within a specified temperature and time cycle, resulting in larger parts that are less susceptible to part damage during manufacturing and post-manufacturing quality issues. Furthermore, the thermally conductive medium layers can be configured and positioned to increase thermal conductivity in specific locations and directions within the part. The thermally conductive medium layers have a relatively high specific thermal conductivity. As a result, adding the thermally conductive medium layer to the part does not significantly increase the overall density of the part. Additionally, the improved thermal conductivity of the syntactic foam part facilitated by the thermally conductive medium layer may be utilized in situ to transfer heat through the part, such as to heat and / or cool adjacent components.

[0034]

[0058] Referring to Figure 23, according to some embodiments, a method 200 of making a syntactic foam part, such as syntactic foam part 142 of Figure 6C, is shown. Referring generally to Figure 23 and particularly to Figures 1 and 2, method 200 includes placing one or more thermally conductive medium layers 150 within a mold 102 (block 210). When placed within the mold 102, at least a portion of each one of the thermally conductive medium layers 150 is spaced from an interior surface 152 of the mold 102.

[0035]

[0059] Further, in some embodiments, such as shown in FIG. 2 , when placed within the mold 102, at least one end or edge of each one of the thermally conductive medium layers 150 is in thermally conductive engagement with the inner surface 152 of the mold. As used herein, thermally conductive engagement refers to any engagement that allows for direct heat transfer from the thermally conductive medium layer 150 to the inner surface 152 via conduction. In some embodiments, as shown in FIG. 2 , the thermally conductive medium layer 150 is in thermally conductive engagement with the inner surface 152 by intimate contact with the inner surface 152 via fasteners, thermally conductive adhesive, thermally conductive paste, 3D printing on the inner surface 152, etc. In certain embodiments, as shown in FIG. 2 , at least two ends or edges of the thermally conductive medium layer 150 are in thermally conductive engagement with the inner surface 152 on either side of the mold 102. Further, in some embodiments, all ends or edges of the thermally conductive medium layer 150 are in thermally conductive engagement with the inner surface 152. Thereby, each one of the thermally conductive medium layers 150 has an area or perimeter that matches the area or perimeter of the internal cavity 112. For example, the internal cavity 112 may have a quadrilateral area and perimeter, and the thermally conductive medium layers 150 may also have a quadrilateral area and perimeter.

[0036]

[0060] 22 , in some embodiments, when the thermally conductive medium layer 150 is placed within the mold 102, at least one end or edge of the thermally conductive medium layer 150 is not in thermally conductive engagement with the inner surface 152. For example, in FIG. 22 , a fixed end 170 of the thermally conductive medium layer 150 may be in thermally conductive engagement with the inner surface 152 of the mold 102C of the tool 100C, while a free end 172 of the thermally conductive medium layer 150 opposite the fixed end 170 is not in thermally conductive engagement with the inner surface 152. Instead, the free end 172 is spaced apart from any inner surface 152 of the mold 102C.

[0037]

[0061] Although not shown, in some embodiments, not all ends or edges of at least one thermally conductive medium layer 150 are in thermally conductive engagement with the inner surface 152. Such embodiments may be useful in environments where the thermally conductive medium layer 150 is incompatible with the environment. Also, in such embodiments, because the thermally conductive medium layer 150 requires less material, the resulting part is lighter (e.g., has less parasitic weight) than a part in which the thermally conductive medium layer 150 extends widely onto the inner surface 152.

[0038]

[0062] In some of the embodiments described and illustrated herein, the thermally conductive medium layers 150 have a sheet-like structure. However, in some embodiments, each one of the thermally conductive medium layers 150 can be an elongated strip, rod, or tube of material. For example, as shown in FIG. 12 , in some embodiments of tool 100B, each thermally conductive medium layer 150 is an elongated strip, rod, or tube having a length significantly greater than its width. Thus, each one of the thermally conductive medium layers 150 in the embodiments of FIG. 12 can extend across the entire length of mold 102B, but only a portion of the width of mold 102B. In one embodiment, each one of the thermally conductive medium layers 150 in the embodiment of FIG. 12 is a strip, rod, or tube made of a thermally conductive material, such as a fiber-reinforced polymer material, a metal material, or a graphite material. In another embodiment, each one of the thermally conductive medium layers 150 in the embodiment of Figure 12 is a strip, rod, or tube made of a foam material coated with a thermally conductive material, such as a fiber reinforced polymer material, a metal material, etc. In yet another alternative embodiment, each one of the thermally conductive medium layers 150 in the embodiment of Figure 12 is a strip, rod, or tube made of a foam having a thermal conductivity greater than that of the low density spheres 120 and resin 138, such as that shown in Figure 5.

[0039]

[0063] In the illustrated embodiments, each one of the thermally conductive medium layers 150 is a continuous layer or extends continuously from one end to the other, although in some embodiments, at least one of the thermally conductive medium layers 150 extends discontinuously from one end to the other. For example, the thermally conductive medium layer 150 may include a plurality of spaced apart segments that are adjacent to each other but do not touch each other.

[0040]

[0064] According to various embodiments, multiple thermally conductive medium layers 150 are disposed within the mold 102. In some embodiments, as shown in FIGS. 2-6A , the thermally conductive medium layers 150 are uniformly spaced within the mold 102. For example, the distance D1 between adjacent ones of the thermally conductive medium layers 150 may be the same. Alternatively, in certain embodiments, as shown in FIG. 7 , the thermally conductive medium layers 150 are non-uniformly spaced within the mold 102. For example, the distance D1 between adjacent two of the thermally conductive medium layers 150 may be different (e.g., larger) than the distance D2 between another adjacent two of the thermally conductive medium layers 150. In certain embodiments, some of the thermally conductive medium layers 150 may be positioned closer together in locations within the mold 102 that are more sensitive to temperature spikes than in other locations within the mold 102 (where the thermally conductive medium layers 150 may be spaced further apart).

[0041]

[0065] According to some embodiments, each one of the thermally conductive medium layers 150 is planar or lies in the same plane. In such embodiments, the thermally conductive medium layers 150 have a sheet-like or plate-like appearance with a thickness that is substantially less than their width or length. Thus, in certain embodiments, such as that shown in FIG. 2, the thermally conductive medium layers 150 may be parallel to one another. However, in other embodiments, one or more of the thermally conductive medium layers 150 may be non-planar or curved.

[0042]

[0066] Referring generally to FIG. 23 and particularly to FIGS. 3 and 4 , the method 200 further includes loading low-density spheres 120 into the mold 102 (block 220). In some embodiments, the mold 102 includes a selectively openable lid that selectively covers an opening in the mold 102 through which the low-density spheres 120 can be loaded into the mold 102. The low-density spheres 120 are loaded such that they form a lattice arrangement 130 within the mold 102 (see, for example, FIG. 5 ). In the lattice arrangement 130, each one of the low-density spheres 120 contacts each one of at least two other low-density spheres 120 at a single contact point. The low-density spheres 120 can, in some embodiments, be arranged to form at least a bimodal or trimodal distribution of spheres. Additionally, in the grid arrangement 130, gaps are defined between a corresponding one of the low-density spheres 120 and at least two other ones of the low-density spheres 120. Because the figures show the low-density spheres 120 in two-dimensional space, each gap is shown as being defined by only three of the low-density spheres 120. However, it is recognized that the grid arrangement 130, when considered in three-dimensional space, may have low-density spheres 120 entering and / or exiting the page. Thus, in three-dimensional space, each gap may be further defined by one or two additional low-density spheres 120. According to some embodiments, using spheres of a single size, all or a portion of the grid arrangement 130 is packed with low-density spheres 120 at most 74% packed, e.g., at most 69% packed in one embodiment, and at most 50% packed in another embodiment. A gap is defined herein as the space between one of the low-density spheres 120 and at least one of the following: (1) the second low-density spheres 120; and (2) the inner periphery of the mold 102.

[0043]

[0067] As used herein, a lattice arrangement is a three-dimensional arrangement of objects (e.g., sparse spheres). A three-dimensional arrangement of objects does not need to be a perfectly repeating geometric arrangement to be considered a lattice arrangement. Rather, a lattice arrangement can be any grouping, bed, tightly packed, or loosely packed assortment of objects, whether it is a perfectly repeating, substantially repeating, or non-repeating geometric arrangement of the objects.

[0044]

[0068] The internal cavity 112 of the mold 102 defines the overall size and shape of the syntactic foam part 142, an example of which is shown in FIG. 6C . The syntactic foam part 142, and therefore the internal cavity 112 of the mold, can have any of a variety of shapes and sizes, including, without limitation, a standard shape (e.g., a rectangular-based prism, a cuboid, a cube, a pyramid, a cone, etc.) or a complex shape. Furthermore, in certain embodiments, the size and shape of the internal cavity 112 are configured to form a lattice arrangement 130 (see, e.g., FIG. 5 ) when the low-density spheres 120 are loaded into the mold 102. Thus, the size and shape of the internal cavity 112 can depend on the size of the low-density spheres 120, or vice versa. Note that the low-density spheres 120 and the mold 102 are not necessarily drawn to scale. For example, in the depicted representation, the size of the low-density spheres 120 is abnormally large relative to the size of the mold 102 to more clearly illustrate and explain the present invention. In reality, the size of the low-density spheres 120 will be significantly smaller relative to the size of the mold 102 than depicted. In some embodiments, the maximum diameter D of the low-density spheres 120 is between 5 microns and 153 millimeters (mm), inclusive, such as between 20 microns and 10,000 microns, inclusive, in one embodiment, between 25 microns and 5,000 microns, inclusive, in another embodiment, such as between 250 microns and 35,000 microns, inclusive, in another embodiment, and between 500 microns and 1,000 microns, inclusive, in yet another embodiment.

[0045]

[0069] According to some embodiments, each or at least one of the low-density spheres 120 is a hollow sphere. A hollow sphere has a hollow interior space defined by the inner surface of a sidewall that also defines the exterior surface of the low-density sphere 120. A hollow sphere has a thin-walled structure. In other words, the thickness of the sidewall of the hollow sphere is less than the diameter of the hollow sphere. In some embodiments, the ratio of thickness to diameter is between 0.001 and 0.1, inclusive, for example, between 0.01 and 0.1, inclusive, in one embodiment, and between 0.02 and 0.08, inclusive, in another embodiment. The hollow sphere may be made of any of a variety of materials, including, but not limited to, glass, ceramic, polymer, or metal.

[0046]

[0070] In alternative embodiments, each or at least one of the low-density spheres 120 is a solid foam sphere. In such embodiments, the solid foam sphere does not have a single hollow space, such as a hollow sphere. Rather, the solid foam sphere is made of a solid piece of foam having multiple hollow spaces in the form of multiple open or closed cells. In some embodiments, the foam of the solid foam sphere is one or more of polystyrene foam, expanded polystyrene (EPS) foam, expanded polypropylene (EPP) foam, polyethylene foam, polyurethane foam, and / or any of a variety of other types of foam.

[0047]

[0071] As used herein, in certain embodiments, low density spheres 120 have a density of 0.005 g / cm3, inclusive. 3 and 0.6 g / cm 3 For example, in one embodiment, 0.05 g / cm 3 and 0.4 g / cm 3 and in another embodiment, 0.1 g / cm 3 and 0.3 g / cm 3 and in yet another embodiment, 0.02 g / cm 3 and 0.15 g / cm 3 and in a further embodiment, 0.015 g / cm 3 and 0.03 g / cm 3A hollow or solid sphere having a density between .

[0048]

[0072] Although not shown, in some embodiments, at block 220, the low-density spheres 120 may be pre-coated with a uniform coating before being loaded into the mold 102. The uniform coating may have a constant (i.e., non-varying) thickness throughout the sphere. In effect, when pre-coated, the uniform coating defines the exterior surface of the low-density spheres 120. The uniform coating may be made of any of a variety of materials, including, but not limited to, preceramic materials, resin matrix composites, nanoscale materials, glass, water glass, colloidal silica nanoparticles, polymers, ceramics, etc. In some cases, such as when the low-density spheres 120 are solid foam spheres, the uniform coating may provide strength and / or enhanced thermal stability to the underlying spheres.

[0049]

[0073] In some embodiments, when the low-density spheres 120 are introduced into the internal cavity 112 of the mold 104, they occupy at least 50% of the total volume of the internal cavity 112. In some embodiments, the low-density spheres 120 occupy more than 50% and less than 99% of the total volume of the internal cavity 112.

[0050]

[0074] 3 and 4, all of the low-density spheres 120 loaded into the mold 102 at block 220 have the same size. However, in other embodiments, the low-density spheres loaded into the mold 102 at block 220 may have different sizes and may be loaded into the mold 102 at different times corresponding to their sizes. The sizes of the differently shaped low-density spheres may be selected taking into account the size of the mold 102, thereby causing the differently shaped low-density spheres to form a lattice arrangement, as described above.

[0051]

[0075] After or before the low-density spheres 120 are loaded into the mold 102, a thermally conductive medium layer 150 is placed within the mold 102 at block 210. Referring to FIGS. 2-4 , an embodiment is shown in which the thermally conductive medium layer 150 is placed within the mold 102 before the low-density spheres 120 are loaded into the mold 102. In other words, in such an embodiment, the thermally conductive medium layer 150 is in place (e.g., fixed) within the mold 102 when the low-density spheres 120 are loaded into the mold 102 at block 220. As the low-density spheres 120 are loaded into the mold 102, the low-density spheres 120 pass through the thermally conductive medium layer 150 in place within the mold 102 and begin to form a bed of spheres within the internal cavity 112 at the bottom of the mold 102. As more low-density spheres 120 are loaded into the mold 102, the height of the sphere bed increases until the interior cavity 112 is filled with the low-density spheres 120 and the low-density spheres 120 surround the thermally conductive medium layer 150 (see, for example, FIG. 5 ). In the embodiment of FIGS. 2-4 , the thermally conductive medium layer 150 is porous and has sufficient coarse porosity to allow the low-density spheres 120 to pass through as the spheres are loaded into the mold 102. In other words, the thermally conductive medium layer 150 has at least some voids that are larger than each one of the low-density spheres 120. In this embodiment, the thermally conductive medium layer 150 may be angled (e.g., perpendicular) relative to the loading direction of the low-density spheres 120 so that the low-density spheres 120 can pass through the thermally conductive medium layer 150. In the illustrated embodiment, the loading of the low-density spheres 120 is assisted by gravity. Thereby, the loading direction of the low density spheres 120 is substantially vertical or from top to bottom.

[0052]

[0076] 8-10 , another embodiment is shown in which a thermally conductive medium layer 150 is placed in the mold 102 before the low-density spheres 120 are loaded into the mold 102. However, unlike the embodiment of FIGS. 2-4 , when the low-density spheres 120 are loaded into the mold 102 in block 220 (see, for example, FIG. 10 ), the low-density spheres 120 do not pass through the thermally conductive medium layer 150 before forming a bed of spheres within the internal cavity 112 at the bottom of the mold 102. In other words, in the embodiment of FIGS. 8-10 , the thermally conductive medium layer 150 of the mold 102B of the tool 100B does not have sufficient coarse porosity to allow the low-density spheres 120 to pass through. Instead, the thermally conductive medium layer 150 may act as a barrier that prevents the low-density spheres 120 from passing through. Because the thermally conductive medium layers 150 are non-porous with respect to the low-density spheres 120, the thermally conductive medium layers 150 in the embodiment of Figures 8-10 are oriented differently than the embodiment of Figures 2-4. For example, the thermally conductive medium layers 150 in mold 102B may be substantially parallel to each other and parallel to the loading direction of the low-density spheres 120, such that the low-density spheres 120 are loaded and stacked vertically between adjacent ones of the thermally conductive medium layers 150, as shown in Figures 10 and 11.

[0053]

[0077] In contrast to the previous embodiments, FIGS. 17-20 illustrate an embodiment in which the thermally conductive medium layer 150 is placed in the mold 102 after the low-density spheres 120 are loaded into the mold 102. In other words, in such an embodiment, the thermally conductive medium layer 150 is not in place in the mold 102 when the low-density spheres 120 are first loaded into the mold 102. Instead, as shown in FIG. 17 , a first quantity of low-density spheres 120 is loaded into the mold 102 before any one of the thermally conductive medium layers 150 is placed in the mold 102. As shown in FIG. 18 , after the first quantity of low-density spheres 120 has been loaded, a first one of the thermally conductive medium layers 150 is placed in the mold 102 over the first quantity of low-density spheres 120. 19, a second quantity of low-density spheres 120 is then loaded into the mold 102 onto the first of the thermally conductive medium layers 150. Thereafter, as shown in FIG. 20, a second of the thermally conductive medium layers 150 is placed into the mold 102 onto the second quantity of low-density spheres 120, and a third quantity of low-density spheres 120 is loaded into the mold 102 onto the second of the thermally conductive medium layers 150. This process can be repeated until a desired number of thermally conductive medium layers 150 and layers of low-density spheres 120 have been placed and loaded into the mold 102. In the embodiments of FIGS. 17-20, the thermally conductive medium layer 150 is placed onto a pre-loaded quantity of low-density spheres 120, so in some embodiments, the thermally conductive medium layer 150 need not be porous to the low-density spheres 120. However, in other embodiments of the examples of FIGS. 17-20, the thermally conductive medium layer 150 may be porous to the low density spheres 120.

[0054]

[0078] 23 generally and FIGS. 5, 11, and 21 in particular, after the mold 102 is filled with the low-density spheres 120 and the thermally conductive medium layer 150 according to blocks 210 and 220, the method 200 further includes introducing a resin 138 into the mold 102 (block 230). The one or more thermally conductive medium layers 150 and the low-density spheres 120 within the mold 102 are thereby embedded within the resin 138. In some embodiments, the thermally conductive medium layer 150 is porous with respect to the resin 138. The resin 138 thereby passes through the thermally conductive medium layer 150 as the resin 138 is introduced into the mold 102 and fills the mold 102. In other words, the thermally conductive medium layer 150 has sufficient coarse porosity to allow the resin 138 to pass through as it is introduced into the mold 102 when the resin 138 is in a flowable state (e.g., fluid or liquid). 5 and 21 , resin 138 is introduced into the internal cavity 112 of the mold 102 through the resin inlet 108 of the tool 100 and passes through the thermally conductive medium layer 150 as it fills the internal cavity 112. The resin inlet 108 is operable to introduce the resin 138 from a resin source into the internal cavity 112. In the illustrated embodiment, the resin inlet 108 is located at the bottom of the mold 102. This allows the resin 138 to fill the internal cavity 112 from the bottom to the top and pass through the thermally conductive medium layer 150 in generally the same direction. Once the resin 138 fills the internal cavity 112, any excess resin 138 may be expelled from the internal cavity 112 through the resin outlet 110 of the tool 100. When the internal cavity 112 is filled with the resin 138, the thermally conductive medium layer 150 and the low-density spheres 120 become embedded within the resin 138. In other embodiments, resin 118 may be introduced into mold 102 through a primary resin inlet located at the top of mold 102 and passively gravity-fed through mold 102 in a generally top-to-bottom direction, thereby causing the top section of the mold to fill before any lower sections of the mold. In some embodiments, resin 138 is pumped (i.e., actively pushed) into mold 102 through the primary resin inlet via a pump (not shown) in addition to being actively pulled through a vacuum port.

[0055]

[0079] According to the embodiment of FIG. 11 , in one configuration, the thermally conductive medium layer 150 is porous with respect to the resin 138, as shown. The resin 138 is allowed to pass through the thermally conductive medium layer 150 in a generally lateral or side-to-side direction as the resin 138 fills the internal cavity 112. However, in an alternative configuration, the thermally conductive medium layer 150 is not porous with respect to the resin 138. In such a configuration, the resin 138 is introduced at multiple locations between the thermally conductive medium layers 150, allowing the resin 138 to fill the spaces between the thermally conductive medium layers 150 without passing through the thermally conductive medium layers 150. In other embodiments in which the thermally conductive medium layer 150 is not porous with respect to the resin 138, the thermally conductive medium layer 150 may be configured as a strip, rod, or tube, as described above in connection with FIG. 12 . This causes the resin 138 to flow around (rather than through) the thermally conductive medium layer 150 as the resin 138 fills the mold.

[0056]

[0080] As mentioned above, in some embodiments, at least one of the thermally conductive medium layers 150 is porous to both the resin 138 and the low-density spheres 120. Referring to FIG. 13 , in certain embodiments, the thermally conductive medium layer 150 is a mesh sheet 150A having a mesh 182 defining apertures 180 sized to allow the low-density spheres 120 to pass through. In one embodiment, the mesh sheet 150A is a perforated metal sheet or foil, which, in some embodiments, may be formed via a stamping process. For example, the apertures 180 may be stamped into a solid sheet of metal to form the mesh 182. In alternative embodiments, the metal sheet 150A is an expanded metal foil formed by punching slits in a solid sheet of metal and expanding the slits into the openings by pulling or expanding the foil.

[0057]

[0081] As described above, in some embodiments, at least one of the thermally conductive medium layers 150 is porous with respect to the resin 138 but not with respect to the low-density spheres 120. Referring to FIG. 14 , in certain embodiments, the thermally conductive medium layer 150 is a chopped fiber sheet 150B made of a porous sheet of chopped fibers 151. The chopped fibers 151 can be uniformly distributed along the chopped fiber sheet 150B in various embodiments, or in other embodiments, can be non-uniformly distributed along the chopped fiber sheet 150B to provide directional thermal conductivity. Alternatively, as shown in FIG. 15 , in some embodiments, the thermally conductive medium layer 150 is a continuous fiber sheet 150C made of a porous sheet of continuous fibers 153 (e.g., fibers, yarns, tows, etc.). The continuous fibers 153 are arranged parallel to one another and extend across the entire length or width of the thermally conductive medium layer 150.

[0058]

[0082] In certain embodiments where the thermally conductive medium layer 150 is made of chopped or continuous fibers, the sheet may be fully interlocked, but may have holes intentionally formed in the sheet, or the sheet may contain enough resin to bond the fibers together but not enough resin to prevent the resin 138 from passing through the sheet.

[0059]

[0083] According to other embodiments in which the thermally conductive medium layer 150 is porous to the resin 138 but not to the low-density spheres 120, and referring to Figure 16, the thermally conductive medium layer 150 is a fabric sheet 150D. The fabric sheet 150D may be a sheet of nonwoven fabric, woven fabric, felt, or the like.

[0060]

[0084] 1-5 , each one of the resin inlets 108 and resin outlets 110 may include a valve selectively operable to regulate the flow of resin 138 into and out of the internal cavity 112, respectively. In the illustrated embodiment, the resin inlet 108 is located at the bottom of the mold 102, and the resin outlet 110 is located at the top of the mold 102. However, in other embodiments, the resin inlet 108 and the resin outlet 110 may be located at other respective locations on the mold 102. Alternatively, the tool 100 may include multiple resin inlets 108 and / or resin outlets 110 located at various locations around the mold 102. In some embodiments, the resin 138 may be pumped (i.e., actively pushed) into the mold 102 through the resin inlet 108 via a pump (not shown). In one embodiment, the resin 138 may also be actively drawn via negative pressure introduced at the top of the mold 102, such as via a negative pressure device (e.g., a vacuum device).

[0061]

[0085] Resin 138 can be any of a variety of resins that help embed and immobilize low-density spheres 120 and thermally conductive medium layer 150. According to some embodiments, resin 138 is one or more of a pure resin material (e.g., epoxy resin), a preceramic resin (e.g., silane preceramic resin), a resin matrix composite (i.e., a reinforcing material embedded within a matrix material), a high modulus polymer (e.g., a highly cross-linked rigid-chain polymer, a nanoparticle-loaded polymer, a colloidal silica nanoparticle-loaded resin), etc. The reinforcing material of a resin matrix composite can be any of a variety of materials, such as fumed silica, nanoparticles, crushed carbon fiber, etc. According to some embodiments, resin 138 includes a density-reducing component, such as smaller low-density spheres (e.g., hollow spheres, such as hollow glass, ceramic, or polymer spheres), which helps reduce the density of resin 138 without compromising the strength of resin 138.

[0062]

[0086] Referring generally to FIG. 23 , after the mold 102 is filled with the resin 138, the method 200 further includes solidifying the resin 138 (block 240) and transferring heat through at least one thermally conductive medium layer 150 (block 250) as part of a solidification process (e.g., a curing process) of the resin 138. In certain embodiments, the resin 138 solidifies at room temperature without the application of external heat. However, in other embodiments, as shown in FIG. 6A , the tool 100 includes one or more heaters 160 configured to generate heat 162 and direct the heat 162 into the mold 102. The heater 160 can be any of various types of heaters known in the art, such as an infrared heater, an electric heater, a curing bath heater, a heat blanket, or the like. Alternatively, the heater 160 can be an autoclave or oven, in which the mold 102 can be placed, heated, and optionally pressurized. Regardless of the type of heater, when external heat is needed in block 240 of method 200, heat is transferred into mold 102 (whether in a single cycle or over the course of multiple cycles) to cause resin 138 to reach a solidification temperature (e.g., a curing temperature) associated with solidification (e.g., hardening) of resin 138. In some situations, heat transfer from outside mold 102 to deeper locations (e.g., the center) within mold 102 can be difficult, resulting in uneven heating of resin 138, which can create residual stresses in the final part. However, as shown in FIG. 6A , a thermally conductive medium layer 150 having a greater thermal conductivity than resin 138 helps distribute heat 162 toward deeper locations within mold 102, thus promoting more uniform distribution of heat throughout mold 102, more uniform solidification of resin 138, and reduced residual stresses in the final part. Thus, in certain embodiments, transferring heat through at least one thermally conductive medium layer 150 in block 250 includes transferring heat in a direction toward the center of the mold 102, as indicated by the directional arrows in FIG. 6A.

[0063]

[0087] In some embodiments, without limitation, the solidification temperature of resin 138 is between 21° C. (i.e., room temperature) and 232° C., inclusive, such as between 21° C. and 180° C., inclusive, in one particular embodiment, between 21° C. and 125° C., inclusive, in another particular embodiment, and between 21° C. and 65° C., inclusive, in yet another particular embodiment. Resin 138 is held at the solidification temperature for a predetermined period of time (and / or resin 138 may undergo multiple identical or different cure cycles associated with particular temperatures and ramp rates) to effect solidification of resin 138.

[0064]

[0088] As described above, the solidification of the resin 138 is the result of an exothermic reaction, which generates additional heat. If left unattended or unmitigated, the heat generated by the exothermic reaction can lead to a dangerous temperature spike (i.e., thermal runaway). Therefore, in certain embodiments, in block 250, transferring heat through at least one thermally conductive medium layer 150 includes transferring heat in a direction toward the inner surface 152 of the mold 102 and away from the center of the mold 102, as indicated by the directional arrows in FIG. 6B . In particular, transferring heat 164 through the thermally conductive medium layer 150 includes transferring heat toward (and ultimately away from) the inner surface 152 of the mold 102 when the resin 138 solidifies and an excessive exothermic reaction occurs, causing the temperature of the center of the mold 102 to be hotter than portions closer to the inner surface 152. The heat 164 transferred toward the inner surface 152 of the mold 102 includes at least a portion of the heat generated via the exothermic reaction.

[0065]

[0089] Transferring heat toward the inner surface 152 results in cooling the temperature in the more central areas within the mold where thermal runaway is more likely, thus reducing and mitigating the likelihood of a thermal runaway event and helping to promote a more uniform temperature distribution throughout the mold 102, more uniform solidification of the resin 138, and reduced residual stress in the final part. Therefore, locating a portion of the thermally conductive medium layer 150 away from the inner surface 152 helps the thermally conductive medium layer 150 collect heat in the more central areas within the internal cavity 112 and transfer at least a portion of that heat from the center toward the inner surface 152. In this manner, thermal spikes in the central area within the internal cavity 112 are mitigated by the thermally conductive medium layer 150, resulting in more uniform solidification of the resin 138. Ultimately, heat 164 is transferred (e.g., via conduction) from the thermally conductive medium layer 150 to the walls of the mold 102. From the walls of the mold 102, all or a portion of the heat 164 is dissipated or released into the environment via passive or forced heat transfer techniques such as heat exchangers.

[0066]

[0090] After the resin 138 solidifies in block 240, the solidified resin and the thermally conductive medium layer 150 form a syntactic foam component 142, an example of which is shown in FIG. 6B. In some embodiments, the syntactic foam component 142 includes multiple layers of low-density spheres 120 infused with the resin 138 and multiple layers of the thermally conductive medium 150. The syntactic foam component 142 can be combined with other, different or similar, syntactic foam components to form more complex structures.

[0067]

[0091] As discussed above, in some embodiments, the thermally conductive medium layer 150 is configured to enhance the thermal conductivity of the syntactic foam component 142. Thus, the thermally conductive medium layer 150 has a thermal conductivity that is greater than the thermal conductivity of the syntactic foam of the syntactic foam component 142 (which is based on various factors, including the thermal conductivity of the low-density spheres 120 and the thermal conductivity of the resin 138). In some embodiments, the ratio of the thermal conductivity of the thermally conductive medium layer 150 to the thermal conductivity of the syntactic foam of the syntactic foam component 142 is, for example, between 150 and 40,000, inclusive, such as between 500 and 6,500, inclusive in one embodiment, and between 850 and 4,500, inclusive in another embodiment. According to various embodiments, the relatively high thermal conductivity and relatively low density of the thermally conductive medium layer 150 results in a specific thermal conductivity of the thermally conductive medium layer 150 between 40 W / mK / (g / cc) and 1,600 W / mK / (g / cc) (watts per meter Kelvin per gram per cubic centimeter), inclusive, such as between 80 W / mK / (g / cc) and 1,400 W / mK / (g / cc), inclusive, in one embodiment, and between 90 W / mK / (g / cc) and 500 W / mK / (g / cc), in another embodiment.

[0068]

[0092] According to some embodiments, each one of the thermally conductive medium layers 150 is made of silver (and silver alloys), copper (and copper alloys), aluminum (and aluminum alloys (e.g., aluminum 1050)), carbon compounds (e.g., silicon carbide, boron carbide, graphite, etc.), silicon, magnesium, aluminum nitride, and / or carbon fibers (e.g., PAN-based carbon fibers (e.g., M55J carbon fibers), pitch-based carbon fibers, carbon nanofibers, etc.). In some embodiments, each one of the thermally conductive medium layers 150 can have a thickness between 25 micrometers and 75 micrometers inclusive.

[0069]

[0093] In the above description, certain terms may be used, such as "up," "down," "upper," "lower," "horizontal," "vertical," "left," "right," "over," "under," etc. These terms are used where appropriate to provide some clarity to the description when referring to interrelationships. However, these terms are not intended to imply absolute relationships, positions, and / or orientations. For example, with respect to an object, the "upper" surface may become the "lower" surface simply by turning the object upside down. It is still the same object. Furthermore, the words "including," "comprising," "having," and variations thereof mean "including, but not limited to" (unless expressly stated otherwise). Listed items do not imply that any or all of the items are mutually exclusive and / or inclusive, unless expressly stated otherwise. Terms such as "a," "an," and "the" also refer to "one or more," unless expressly stated otherwise. Additionally, the term "plurality" may be defined as "at least two." Furthermore, unless expressly stated otherwise, as made clear herein, a plurality of a particular feature does not necessarily refer to every particular feature of a particular set or class.

[0070]

[0094] While in some embodiments, the terms "about" or "substantially" are defined to mean within + / - 5% of a given value, in further embodiments, any disclosure of "about" can be further narrowed and claimed to mean within + / - 4% of a given value, within + / - 3% of a given value, within + / - 2% of a given value, within + / - 1% of a given value, or the exact given value. Furthermore, when at least two values ​​of a variable are disclosed, such disclosure is specifically intended to include a range between the two values, whether or not disclosed in terms of separate embodiments or examples thereof, and is specifically intended to include a range up to and including at least the lower of the two values ​​and / or a range up to and including the higher of the two values. Furthermore, when at least three values ​​of a variable are disclosed, such disclosure is specifically intended to include ranges between any two of the values, whether or not they are disclosed with respect to separate embodiments or examples, and is specifically intended to include ranges up to and including at least value A and / or value B, where A can be any of the disclosed values ​​other than the maximum disclosed value, and B can be any of the disclosed values ​​other than the minimum disclosed value.

[0071]

[0095] Furthermore, in this specification, an instance where one element is "coupled" to another element may include direct and indirect coupling. A direct coupling may be defined as one element being connected to another element and being in some contact with the other element. An indirect coupling may be defined as a coupling between two elements that are not in direct contact with each other but have one or more additional elements between the coupled elements. Furthermore, in this specification, fixing one element to another element may include direct fixing and indirect fixing. In addition, in this specification, "adjacent" does not necessarily mean contact. For example, one element may be adjacent to another element without touching it.

[0072]

[0096] As used herein, the phrase "at least one of" used in conjunction with enumerated items means that various combinations of one or more of the enumerated items may be used, and that only one of each enumerated item may be required. An item may be a specific object, article, or category. In other words, "at least one of" means that any combination or number of items from the list may be used, but not all of the enumerated items may be required. For example, "at least one of item A, item B, and item C" may mean, for example, "item A," "item A and item B," "item B," "item A, item B, and item C," or "item B and item C." In some cases, "at least one of item A, item B, and item C" may mean, by way of example and not limitation, "two item A, one item B, and ten item C," "four item B, and seven item C," or other suitable combinations.

[0073]

[0097] Unless otherwise indicated, the terms "first," "second," etc. are used herein merely as designators and are not intended to impose any sequential, positional, or hierarchical requirements on the items they refer to. Furthermore, a reference to, e.g., a "second" item does not require or exclude the presence of, e.g., a "first" or lower numbered item and / or, e.g., a "third" or higher numbered item.

[0074]

[0098] As used herein, a system, device, structure, article, element, component, or hardware that is "configured to" perform a specified function does not mean that it is, in fact, capable of performing the specified function without any modification and is merely likely to perform the specified function after further modification. In other words, a system, device, structure, article, element, component, or hardware that is "configured to" perform a specified function is specifically selected, created, implemented, utilized, programmed, and / or designed for the purpose of performing the specified function. As used herein, the phrase "configured to" means that there are characteristics of the system, device, structure, article, element, component, or hardware that enable the system, device, structure, article, element, component, or hardware to perform a particular function without further modification. In this disclosure, a system, apparatus, structure, article, element, component, or hardware described as being "configured to" perform a particular function may additionally or alternatively be described as being "adapted to" and / or "operative to" perform that function.

[0075]

[0099] The schematic flow diagrams included herein are generally defined as logical flow diagrams. As such, the depicted order and labeled steps represent one embodiment of the presented method. Other steps and methods may be conceived that are equivalent in function, logic, or effect to one or more steps, or portions thereof, of the depicted method. Furthermore, it is understood that the format and symbols employed are provided to illustrate the logical steps of the method and do not limit the scope of the method. While various types of arrows and lines may be used in the flow diagrams, it is understood that these do not limit the scope of the corresponding method. In fact, some arrows or other connectors may be used only to indicate the logical flow of the method. For example, arrows may indicate an indefinite amount of waiting or monitoring time between listed steps of the depicted method. Furthermore, the order in which a particular method is performed may or may not strictly follow the order of the corresponding steps depicted.

[0076]

[0100] The subject matter herein may be embodied in other specific forms without departing from its spirit and essential characteristics. The above-described embodiments are to be construed in all respects as merely illustrative and not restrictive. All changes that come within the meaning and range of equivalency of the claims are to be embraced therein.

Claims

1. A method (200) of making a syntactic foam component (142), comprising: disposing at least one thermally conductive medium layer (150) within a mold (102), wherein at least a portion of said at least one thermally conductive medium layer (150) is spaced from an inner surface (152) of said mold (102); loading low-density spheres (120) into the mold (102), the low-density spheres (120) forming a lattice arrangement (130) within the mold (102) and surrounding the at least one thermally conductive medium layer (150); introducing a resin (138) into the mold (120), wherein the at least one thermally conductive medium layer (150) and the low-density spheres (120) are embedded in the resin (138), and the at least one thermally conductive medium layer (150) has a thermal conductivity greater than a thermal conductivity of the low-density spheres (120) and a thermal conductivity of the resin (138); allowing the resin (138) to solidify after it is introduced into the mold (120); and The method (200) includes transferring heat through the at least one thermally conductive medium layer (150) as the resin (138) solidifies.

2. 2. The method of claim 1, wherein the at least one thermally conductive medium layer is disposed in the mold before the low-density spheres are loaded into the mold.

3. the at least one thermally conductive medium layer (150) is porous; 3. The method (200) of claim 2, wherein at least some of the low-density spheres (120) pass through the at least one thermally conductive medium layer (150) as the low-density spheres (120) are loaded into the mold (102).

4. The method (200) of claim 3, wherein the at least one thermally conductive medium layer (150) is perpendicular to a loading direction of the low-density spheres (120) and a packing direction of the resin (138).

5. The method (200) of claim 2, wherein the at least one thermally conductive medium layer (150) is parallel to a loading direction of the low-density spheres (120) and a packing direction of the resin (138).

6. the low density spheres (120) do not pass through the at least one thermally conductive medium layer (150) when loaded into the mold (102); the resin (138) passes through the at least one thermally conductive medium layer (150) when introduced into the mold (102); The method of claim 5 , wherein the at least one thermally conductive medium layer (150) is incompletely porous.

7. the at least one thermally conductive medium layer (150) is porous; 10. The method of claim 1, wherein at least a portion of the resin passes through the at least one thermally conductive medium layer as the resin is introduced into the mold.

8. loading the low density spheres (102) into the mold (102) includes loading a first amount of the low density spheres (120) and loading a second amount of the low density spheres (120); disposing the at least one thermally conductive medium layer (150) in the mold (102) includes disposing the at least one thermally conductive medium layer (150) on the first quantity of the low-density spheres (120) after the first quantity of the low-density spheres (120) is loaded into the mold (102); The method (200) of claim 1, wherein the second amount of the low density spheres (120) is loaded onto the at least one thermally conductive medium layer (150).

9. the at least one thermally conductive medium layer (150) extends across the entire width, height, or length of the mold (102) and is in thermally conductive engagement with the inner surface (152) of the mold (102) at both ends of the at least one thermally conductive medium layer (150); 10. The method of claim 1, wherein at least a portion of the heat transferred through the at least one thermally conductive medium layer is transferred directly from the at least one thermally conductive medium layer to the inner surface of the mold via conduction.

10. disposing the at least one thermally conductive medium layer (150) within the mold (102) includes disposing a plurality of thermally conductive medium layers (150) within the mold (102) at spaced apart locations within the mold (102); The low-density spheres (120) are loaded into the mold (102) so as to surround the plurality of thermally conductive medium layers (150); 2. The method of claim 1, wherein the resin is introduced into the mold such that the plurality of thermally conductive medium layers are embedded within the resin.

11. The method (200) of claim 10, wherein the plurality of thermally conductive medium layers (150) are uniformly spaced within the mold (102).

12. The method (200) of claim 10, wherein the plurality of thermally conductive medium layers (150) are non-uniformly spaced within the mold (102).

13. 10. The method of claim 1, wherein the at least one thermally conductive medium layer has a specific thermal conductivity between 80 watts per gram per meter Kelvin per cubic centimeter (W / mK / (g / cc)) and 1,400 W / mK / (g / cc), inclusive.

14. 10. The method of claim 1, wherein the at least one thermally conductive medium layer comprises one of a woven fabric, continuous fiber, chopped fiber, a rod, a tube, a strip, a perforated sheet, or an expanded sheet.

15. A syntactic foam component (142), a resin (138) in a cured state; low density spheres (120) arranged in a lattice arrangement (130) and embedded within said resin (138); and at least one layer of thermally conductive medium (150) surrounded by said low density spheres (120) and embedded within said resin (138); The at least one thermally conductive medium layer (150) has a thermal conductivity greater than the thermal conductivity of the low-density spheres (120) and the thermal conductivity of the resin (138).

16. the at least one thermally conductive medium layer (150) is porous; 16. The syntactic foam component (142) of claim 15, wherein at least some of the low density spheres (120) are sized to be able to pass through the at least one thermally conductive medium layer (150).

17. the at least one thermally conductive medium layer (150) is porous; The syntactic foam component (142) of claim 15, wherein the resin (138), when in a flowable state, is capable of passing through the at least one thermally conductive medium layer (150).

18. 16. The syntactic foam component (142) of claim 15, wherein the at least one thermally conductive medium layer (150) extends across the entire width, height, or length of the syntactic foam component (142).

19. The syntactic foam component (142) of claim 15, wherein the syntactic foam component (142) comprises a plurality of thermally conductive medium layers (150) spaced apart from one another.

20. 20. The syntactic foam component (142) of claim 19, wherein the plurality of thermally conductive medium layers (150) are uniformly spaced within the syntactic foam component (142).

21. 20. The syntactic foam component (142) of claim 19, wherein the plurality of thermally conductive medium layers (150) are non-uniformly spaced within the syntactic foam component (142).

22. 16. The syntactic foam component of claim 15, wherein the at least one thermally conductive medium layer has a specific thermal conductivity of between 80 watts per gram per meter Kelvin per cubic centimeter (W / mK / (g / cc)) and 1,400 W / mK / (g / cc), inclusive.

23. 16. The syntactic foam component (142) of claim 15, wherein the at least one thermally conductive medium layer (150) comprises one of a woven fabric, continuous fiber, chopped fiber, rod, tube, strip, perforated sheet, or expanded sheet.

Images