Multilayer electronic components

Abstract

This prevents the characteristics from deteriorating due to the structure within the laminate. [Solution] The electronic component (1) includes a ground terminal (115), a conductor layer (661) constituting at least a part of an inductor (L12), a conductor layer (533) constituting a part of a capacitor (C14), a first conductor (11), a second conductor (12), a laminate (50), and a shield conductor (80). The ground terminal (115) is disposed on a first surface (50A) of the laminate (50). The first conductor (11) connects the conductor layer (661) and the ground terminal (115). The second conductor (12) connects the conductor layer (533) and the ground terminal (115), and is not directly connected to the first conductor (11).

Description

[Technical Field]

[0001] The present invention relates to a multilayer electronic component having a shield conductor integrated into the laminate. [Background technology]

[0002] In small mobile communication devices, a common configuration is to provide an antenna that is shared by multiple applications with different systems and operating frequency bands, and to separate the multiple signals transmitted and received by this antenna using a duplexer.

[0003] In general, a duplexer that separates a first signal having a frequency within a first frequency band from a second signal having a frequency within a second frequency band higher than the first frequency band includes a common port, a first signal port, a second signal port, a first filter provided in the first signal path from the common port to the first signal port, and a second filter provided in the second signal path from the common port to the second signal port. The first and second filters include, for example, LC resonators configured using inductors and capacitors.

[0004] Patent Document 1 discloses a filter device including a laminate formed by stacking multiple dielectric layers, a common electrode arranged on a first surface of the laminate, an input terminal, an output terminal, and a ground terminal arranged on a second surface of the laminate, a ground electrode connected to the ground terminal, and a first resonator and a second resonator arranged in a layer between the common electrode and the ground electrode, each including an inductor and a capacitor. The common electrode is connected to the ground electrode by a via. A via constituting an inductor and a capacitor electrode constituting a capacitor are connected to the common electrode.

[0005] It is also known that in a multilayer electronic component such as that disclosed in Patent Document 1, electromagnetic interference that occurs with high-density mounting can be suppressed by providing a shield on the main body of the multilayer electronic component. Patent Document 2 discloses a multilayer electronic component in which an external electrode is provided on the bottom surface of the laminate and a shield electrode is provided on a surface other than the bottom surface of the laminate. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2024-23011 [Patent Document 2] Japanese Patent Application Laid-Open No. 2017-76796 Summary of the Invention [Problem to be solved by the invention]

[0007] In a multilayer electronic component, when an inductor and a capacitor, each connected to ground, are connected to a ground terminal provided on the surface of the laminate, the inductor conductor constituting the inductor and the capacitor conductor layer constituting the capacitor can be connected to the ground terminal via a ground conductor layer provided inside the laminate, as disclosed in Patent Document 1. The capacitor conductor layer can be connected to the ground conductor layer by, for example, a columnar conductor extending in the stacking direction of the multiple dielectric layers.

[0008] However, in the course of research by the inventors of the present application, it was found that the characteristics of the multilayer electronic component may be deteriorated due to the ground conductor layer and the columnar conductors, and that the characteristics are particularly deteriorated when a shield is provided on the main body of the multilayer electronic component.

[0009] The present invention has been made in view of the above problems, and an object of the present invention is to provide a multilayer electronic component having a shielding conductor integrated with the laminate, which is capable of suppressing deterioration of characteristics due to the structure within the laminate. [Means for solving the problem]

[0010] The multilayer electronic component of the present invention includes a first ground terminal, an inductor conductor constituting at least a portion of a first inductor, a capacitor conductor constituting a portion of a first capacitor, a first conductor, a second conductor, a laminate for integrating the first ground terminal, the inductor conductor, the capacitor conductor, the first conductor, and the second conductor, the laminate including a plurality of stacked dielectric layers, and a shield conductor integrated with the laminate. The laminate has a first surface and a second surface located at both ends in the stacking direction of the plurality of dielectric layers, and four side surfaces connecting the first surface and the second surface. A shield conductor is provided on at least one of the four side surfaces. The first ground terminal is located on the first surface. The first conductor connects the inductor conductor and the first ground terminal. The second conductor connects the capacitor conductor and the first ground terminal and is not directly connected to the first conductor. [Effects of the Invention]

[0011] In the multilayer electronic component of the present invention, the first conductor connects the inductor conductor and the first ground terminal, and the second conductor connects the capacitor conductor and the first ground terminal, but is not directly connected to the first conductor. This makes it possible to prevent deterioration of characteristics due to the structure within the laminate. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a circuit diagram showing an example of a circuit configuration of a multilayer electronic component according to an embodiment of the present invention. [Figure 2] 1 is a perspective view showing the appearance of a multilayer electronic component according to an embodiment of the present invention; [Figure 3] 1 is a perspective view showing a laminate of a multilayer electronic component according to an embodiment of the present invention; [Figure 4] FIG. 2 is an explanatory diagram showing pattern-forming surfaces of first to third dielectric layers in a laminate of a multilayer electronic component according to one embodiment of the present invention. [Figure 5]FIG. 2 is an explanatory diagram showing pattern-forming surfaces of fourth to sixth dielectric layers in a laminate of a multilayer electronic component according to one embodiment of the present invention. [Figure 6] FIG. 2 is an explanatory diagram showing pattern-forming surfaces of seventh to ninth dielectric layers in a laminate of a multilayer electronic component according to one embodiment of the present invention. [Figure 7] FIG. 2 is an explanatory diagram showing pattern-forming surfaces of the 10th to 12th dielectric layers in the laminate of the multilayer electronic component according to the embodiment of the present invention. [Figure 8] FIG. 2 is an explanatory diagram showing pattern-forming surfaces of thirteenth to fifteenth dielectric layers in a laminate of a multilayer electronic component according to one embodiment of the present invention. [Figure 9] FIG. 2 is an explanatory diagram showing pattern-forming surfaces of 16th to 18th dielectric layers in a laminate of a multilayer electronic component according to one embodiment of the present invention. [Figure 10] FIG. 2 is an explanatory diagram showing pattern-forming surfaces of the 19th to 22nd dielectric layers in the laminate of the multilayer electronic component according to the embodiment of the present invention. [Figure 11] FIG. 2 is an explanatory diagram showing pattern-forming surfaces of 23rd to 25th dielectric layers in a laminate of a multilayer electronic component according to one embodiment of the present invention. [Figure 12] FIG. 2 is an explanatory diagram showing pattern-forming surfaces of the 26th and 27th dielectric layers in the laminate of the multilayer electronic component according to the embodiment of the present invention. [Figure 13] 1 is a perspective view showing an interior of a laminate of a multilayer electronic component according to an embodiment of the present invention; [Figure 14] 1 is a perspective view showing a part of the interior of a laminate of a multilayer electronic component according to an embodiment of the present invention. [Figure 15] FIG. 10 is a characteristic diagram showing frequency characteristics of isolation of each model obtained by simulation. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First, with reference to FIG. 1, a schematic configuration of a multilayer electronic component (hereinafter simply referred to as electronic component) 1 according to an embodiment of the present invention will be described. FIG. 1 is a circuit diagram showing the circuit configuration of the electronic component 1. FIG. 1 shows a branching filter (diplexer) as an example of the electronic component 1. The electronic component 1 includes a common terminal 2, a first signal terminal 3, a second signal terminal 4, a first circuit 10, and a second circuit 20.

[0014] In terms of the circuit configuration, the first circuit 10 is provided between the common terminal 2 and the first signal terminal 3. In terms of the circuit configuration, the second circuit 20 is provided between the common terminal 2 and the second signal terminal 4. In this application, the expression "in terms of the circuit configuration" is used to refer to the arrangement on a circuit diagram, not the arrangement in a physical configuration.

[0015] The first circuit 10 is a filter configured to selectively pass signals having frequencies within a first passband. The second circuit 20 is a filter configured to selectively pass signals having frequencies within a second passband different from the first passband. Each of the first and second circuits 10 and 20 is configured as an LC filter circuit including at least one inductor and at least one capacitor. In this embodiment, both the first and second circuits 10 and 20 are bandpass filters. In addition, in this embodiment, the first passband is a frequency band lower than the second passband.

[0016] A first signal having a frequency within a first passband that is input to the common terminal 2 selectively passes through the first circuit 10 and is output from the first signal terminal 3. A second signal having a frequency within a second passband that is input to the common terminal 2 selectively passes through the second circuit 20 and is output from the second signal terminal 4. In this way, the electronic component 1 separates the first and second signals.

[0017] Next, an example of the circuit configuration of the electronic component 1 will be described with reference to Fig. 1. The electronic component 1 further includes an inductor L10 having one end connected to the common terminal 2.

[0018] The first circuit 10 includes inductors L11, L12, L13, and L14, and capacitors C11, C12, C13, C14, C15, C16, C17, C18, and C19.

[0019] One end of inductor L11 is connected to the other end of inductor L10. One end of capacitor C11 is connected to the other end of inductor L11. One end of capacitor C12 is connected to the other end of capacitor C11. One end of capacitor C13 is connected to one end of capacitor C11. The other end of capacitor C13 is connected to the other end of capacitor C12.

[0020] One end of the capacitor C14 is connected to one end of the capacitor C11. One end of the inductor L12 is connected to the connection point between the capacitors C11 and C12. One end of the capacitor C15 is connected to the other end of the capacitor C12. The other ends of the inductor L12 and the capacitors C14 and C15 are connected to ground.

[0021] One end of inductor L13 is connected to the other end of capacitor C12. One end of inductor L14 is connected to the other end of inductor L13. The other end of inductor L14 is connected to the first signal terminal 3. Capacitor C16 is connected in parallel to inductor L13. Capacitor C17 is connected in parallel to inductor L14.

[0022] The capacitor C18 is connected to the connection point between the inductor L13 and the inductor L14. One end of the capacitor C19 is connected to the other end of the inductor L14. The other ends of the capacitors C18 and C19 are connected to ground.

[0023] The second circuit 20 includes inductors L21, L22, L23, L24, L25, and L26, and capacitors C21, C22, C23, C24, C25, C26, C27, C28, C29, C30, C31, C32, and C33.

[0024] One end of inductor L21 is connected to one end of capacitor C21. One end of inductor L22 is connected to one end of capacitor C22. One end of inductor L23 is connected to one end of capacitor C23. One end of inductor L24 is connected to one end of capacitor C24. One end of inductor L25 is connected to one end of capacitor C25. The other ends of inductors L21 to L25 and capacitors C21 to C25 are connected to ground.

[0025] One end of capacitor C26 is connected to the other end of inductor L10. The other end of capacitor C26, one end of capacitor C27, one end of capacitor C28, and one end of capacitor C31 are connected to one end of inductor L21. The other end of capacitor C27 and one end of capacitor C29 are connected to one end of inductor L22. The other end of capacitor C28, one end of capacitor C30, and one end of capacitor C32 are connected to one end of inductor L23. The other end of capacitor C30 and the other end of capacitor C31 are connected to one end of inductor L24. The other end of capacitor C29, the other end of capacitor C32, and one end of capacitor C33 are connected to one end of inductor L25.

[0026] One end of the inductor L26 is connected to the other end of the capacitor C33, and the other end of the inductor L26 is connected to the second signal terminal 4.

[0027] Next, other configurations of the electronic component 1 will be described with reference to Figures 2 and 3. Figure 2 is a perspective view showing the appearance of the electronic component 1. Figure 3 is a perspective view showing the laminate of the electronic component 1.

[0028] The electronic component 1 includes a laminate 50. The laminate 50 includes a plurality of laminated dielectric layers and a plurality of conductors (a plurality of conductor layers and a plurality of through holes). The common terminal 2, the first signal terminal 3, the second signal terminal 4, the first circuit 10, and the second circuit 20 are integrated into the laminate 50.

[0029] The laminate 50 has a first surface 50A and a second surface 50B located at both ends of the stacking direction T of the multiple dielectric layers, and four side surfaces 50C to 50F connecting the first surface 50A and the second surface 50B. The side surfaces 50C and 50D face in opposite directions from each other, and the side surfaces 50E and 50F also face in opposite directions from each other. The side surfaces 50C to 50F may be perpendicular to the first surface 50A and the second surface 50B.

[0030] Here, the X direction, Y direction, and Z direction are defined as shown in FIGS. 2 and 3. The X direction, Y direction, and Z direction are perpendicular to each other. In this embodiment, a direction parallel to the stacking direction T is defined as the Z direction. The direction opposite to the X direction is defined as the -X direction, the direction opposite to the Y direction is defined as the -Y direction, and the direction opposite to the Z direction is defined as the -Z direction. The expression "when viewed from a predetermined direction (e.g., stacking direction T)" means that the object is viewed from a position away from the predetermined direction or a direction parallel to the predetermined direction.

[0031] As shown in FIG. 3, the first surface 50A is located at the end of the laminate 50 in the -Z direction. The first surface 50A is also the bottom surface of the laminate 50. The second surface 50B is located at the end of the laminate 50 in the Z direction. The second surface 50B is also the top surface of the laminate 50. The side surface 50C is located at the end of the laminate 50 in the -X direction. The side surface 50D is located at the end of the laminate 50 in the X direction. The side surface 50E is located at the end of the laminate 50 in the -Y direction. The side surface 50F is located at the end of the laminate 50 in the Y direction.

[0032] As shown in FIGS. 2 and 3 , the electronic component 1 further includes electrodes 111, 112, and 113 provided on the first surface 50A of the laminate 50. The electrode 111 is located closer to the side surface 50E than to the side surface 50F. The electrodes 112 and 113 are located closer to the side surface 50F than to the side surface 50E. The electrode 112 is located near the corner where the side surface 50D intersects with the side surface 50F, and the electrode 113 is located near the corner where the side surface 50C intersects with the side surface 50F. The electrode 111 corresponds to the common terminal 2, the electrode 112 corresponds to the first signal terminal 3, and the electrode 113 corresponds to the second signal terminal 4. Therefore, the common terminal 2 and the first and second signal terminals 3 and 4 are provided on the first surface 50A of the laminate 50.

[0033] The electronic component 1 further includes ground terminals 114, 115, and 116 provided on the first surface 50A of the laminate 50. The ground terminal 114 is disposed between the electrode 112 and the electrode 113. The ground terminal 115 is disposed between the electrode 111 and the side surface 50D. The ground terminal 116 is disposed between the electrode 111 and the side surface 50C. Each of the ground terminals 114, 115, and 116 is connected to ground.

[0034] The electronic component 1 further includes a shielding conductor 80 made of a conductor and integrated with the laminate 50. The shielding conductor 80 is provided on at least one of the four side surfaces 50C to 50F. In the present embodiment, the shielding conductor 80 includes a first conductor portion 80E provided on the side surface 50E of the laminate 50 and a second conductor portion 80F provided on the side surface 50F of the laminate 50. The first conductor portion 80E covers the entirety or almost the entirety of the side surface 50E. The second conductor portion 80F covers the entirety or almost the entirety of the side surface 50F.

[0035] The shield conductor 80 further includes a conductor portion 80B provided on the second surface 50B of the laminate 50, a conductor portion 80C provided on the side surface 50C of the laminate 50, and a conductor portion 80D provided on the side surface 50D of the laminate 50. The conductor portion 80B covers the entire second surface 50B. The conductor portion 80C covers the entire or almost the entire side surface 50C. The conductor portion 80D covers the entire or almost the entire side surface 50D.

[0036] The shield conductor 80 may include multiple laminated metal layers. In this case, the first conductor portion 80E, the second conductor portion 80F, and the conductor portions 80B, 80C, and 80D are preferably continuous. That is, the first and second conductor portions 80E and 80F are preferably connected to the conductor portions 80B, 80C, and 80D, respectively.

[0037] The shielding conductor 80 is electrically connected to the ground terminals 114, 115, and 116. The laminate 50 includes a plurality of conductors that electrically connect the shielding conductor 80 and the ground terminals 114, 115, and 116.

[0038] Next, an example of the plurality of dielectric layers and the plurality of conductors constituting the laminate 50 will be described with reference to Figures 4(a) to 12(b). In this example, the laminate 50 includes 27 laminated dielectric layers. Hereinafter, these 27 dielectric layers will be referred to as the 1st to 27th dielectric layers, in order from the bottom up. The 1st to 27th dielectric layers will be denoted by reference numerals 51 to 77.

[0039] In Figures 4(a) to 12(a), multiple circles represent multiple through holes. Multiple through holes are formed in each of the dielectric layers 51 to 76. The multiple through holes are formed by filling holes for the through holes with conductive paste. Each of the multiple through holes is connected to an electrode, a terminal, a conductive layer, or another through hole. In the following explanation, the connection relationship between each of the multiple through holes and the electrodes, terminals, conductive layers, or other through holes is explained in terms of the connection relationship when the first to 27th dielectric layers 51 to 77 are stacked. Also, in Figures 4(a) to 12(a), multiple specific through holes among the multiple through holes are each assigned a reference symbol.

[0040] 4(a) shows the pattern-formed surface of the first dielectric layer 51. On the pattern-formed surface of the dielectric layer 51, electrodes 111 to 113 and ground terminals 114 to 116 are formed.

[0041] In FIG. 4(a), two through holes denoted by reference numerals 51T6 and 51T7 are connected to a ground terminal 115. In the following description, the through hole denoted by reference numeral 51T6 will be simply referred to as the through hole 51T6. Furthermore, through holes denoted by reference numerals other than the through hole 51T6 will be referred to in the same manner as the through hole 51T6. The two through holes 51T8 shown in FIG. 4(a) are connected to a ground terminal 114. The two through holes 51T9 shown in FIG. 4(a) are connected to a ground terminal 116.

[0042] 4(b) shows the pattern-formed surface of the second dielectric layer 52. Conductor layers 521, 522, 523, 524, and 525 are formed on the pattern-formed surface of the dielectric layer 52. The through-hole 51T6 and the through-hole 52T6 shown in FIG. 4(b) are connected to the conductor layer 524. The through-hole 51T7 and the through-hole 52T7 shown in FIG. 4(b) are connected to the conductor layer 525. The two through-holes 51T8 and the two through-holes 51T9 are connected to the two through-holes 52T8 and the two through-holes 52T9 shown in FIG. 4(b), respectively.

[0043] FIG. 4(c) shows the pattern-formed surface of the third dielectric layer 53. Conductor layers 531, 532, and 533 are formed on the pattern-formed surface of the dielectric layer 53. The through-hole 52T6 is connected to the through-hole 53T6 shown in FIG. 4(c). The through-hole 52T7, the two through-holes 52T8, and the through-holes 53T1b, 53T10, and 53T11 shown in FIG. 4(c) are connected to the conductor layer 533. The two through-holes 52T9 are connected to the two through-holes 53T9 shown in FIG. 4(c).

[0044] FIG. 5(a) shows the pattern-formed surface of the fourth dielectric layer 54. Conductor layers 541, 542, 543, 544, and 545 are formed on the pattern-formed surface of the dielectric layer 54. The through holes 53T1b and 53T11 and the through holes 54T1b and 54T11 shown in FIG. 5(a) are connected to the conductor layer 542. The through hole 53T6 is connected to the through hole 54T6 shown in FIG. 5(a). The two through holes 53T9 are connected to the two through holes 54T9 shown in FIG. 5(a). The through hole 53T10 and the through hole 54T10 shown in FIG. 5(a) are connected to the conductor layer 545.

[0045] FIG. 5(b) shows the pattern-formed surface of the fifth dielectric layer 55. Conductor layers 551, 552, 553, 554, and 555 are formed on the pattern-formed surface of the dielectric layer 55. The two through holes 54T9 are connected to the two through holes 55T9 shown in FIG. 5(b). The through holes 54T1b, 54T6, 54T10, and 54T11 are connected to the through holes 55T1b, 55T6, 55T10, and 55T11 shown in FIG. 5(b), respectively. The through hole 55T5a shown in FIG. 5(b) is connected to the conductor layer 551.

[0046] 5(c) shows the pattern-formed surface of the sixth dielectric layer 56. Conductor layers 561, 562, 563, and 564 are formed on the pattern-formed surface of the dielectric layer 56. The through holes 55T1b, 55T5a, 55T6, and 55T11 are connected to the through holes 56T1b, 56T5a, 56T6, and 56T11 shown in FIG. 5(c), respectively. The two through holes 55T9, the through hole 55T10, and the through hole 56T5b shown in FIG. 5(c) are connected to the conductor layer 561.

[0047] Fig. 6(a) shows the pattern-forming surface of the seventh dielectric layer 57. Conductor layers 571, 572, 573, 574, and 575 are formed on the pattern-forming surface of the dielectric layer 57. The through-holes 56T1b, 56T5a, 56T5b, 56T6, and 56T11 are connected to the through-holes 57T1b, 57T5a, 57T5b, 57T6, and 57T11 shown in Fig. 6(a), respectively. The through-holes 57T2a and 57T4a shown in Fig. 6(a) are connected to the conductor layers 572 and 571, respectively.

[0048] Fig. 6(b) shows the pattern formation surface of the eighth dielectric layer 58. Conductor layers 581, 582, and 583 are formed on the pattern formation surface of the dielectric layer 58. Through holes 57T1b, 57T2a, 57T4a, 57T5a, 57T5b, 57T6, and 57T11 are connected to through holes 58T1b, 58T2a, 58T4a, 58T5a, 58T5b, 58T6, and 58T11 shown in Fig. 6(b), respectively.

[0049] FIG. 6(c) shows the pattern-formed surface of the ninth dielectric layer 59. Conductor layers 591, 592, and 593 are formed on the pattern-formed surface of the dielectric layer 59. Through holes 58T1b, 58T2a, 58T4a, 58T5a, 58T5b, 58T6, and 58T11 are connected to through holes 59T1b, 59T2a, 59T4a, 59T5a, 59T5b, 59T6, and 59T11 shown in FIG. 6(c), respectively. Through hole 59T1a shown in FIG. 6(c) is connected to conductor layer 592.

[0050] FIG. 7(a) shows the pattern-formed surface of the tenth dielectric layer 60. Conductor layers 601, 602, 603, 604, and 605 are formed on the pattern-formed surface of the dielectric layer 60. The through holes 59T1a, 59T2a, 59T4a, and 59T5b are connected to the through holes 60T1a, 60T2a, 60T4a, and 60T5b shown in FIG. 7(a), respectively. The through holes 59T1b and 59T11 and the through holes 60T1b and 60T11 shown in FIG. 7(a) are connected to the conductor layer 602. The through hole 59T5a and the through hole 60T5a shown in FIG. 7(a) are connected to the conductor layer 601. The through hole 59T6 and the through hole 60T6 shown in FIG. 7(a) are connected to the conductor layer 604. The conductor layer 602 is connected to the second conductor portion 80F (see FIG. 2) of the shield conductor 80. The conductor layer 604 is connected to the first conductor portion 80E (see FIG. 2) of the shield conductor 80.

[0051] FIG. 7(b) shows the pattern-formed surface of the eleventh dielectric layer 61. Conductor layers 611, 612, 613, and 614 are formed on the pattern-formed surface of the dielectric layer 61. The through holes 60T1a, 60T2a, 60T4a, 60T5a, and 60T6 are connected to the through holes 61T1a, 61T2a, 61T4a, 61T5a, and 61T6 shown in FIG. 7(b), respectively. The through holes 60T1b and 60T11 and the through hole 61T1b shown in FIG. 7(b) are connected to the conductor layer 613. The through hole 61T3a shown in FIG. 7(b) is connected to the conductor layer 612. The through hole 60T5b and the through holes 61T4b and 61T5b shown in FIG. 7(b) are connected to the conductor layer 614. The conductor layer 614 is connected to the first conductor portion 80E of the shield conductor 80 (see FIG. 2).

[0052] Fig. 7(c) shows the pattern formation surface of the twelfth dielectric layer 62. Conductor layers 621 and 622 are formed on the pattern formation surface of the dielectric layer 62. Through holes 61T1a, 61T1b, 61T2a, 61T3a, 61T4a, 61T4b, 61T5a, 61T5b, and 61T6 are connected to through holes 62T1a, 62T1b, 62T2a, 62T3a, 62T4a, 62T4b, 62T5a, 62T5b, and 62T6 shown in Fig. 7(c), respectively.

[0053] Fig. 8(a) shows the patterned surface of the 13th dielectric layer 63. Through holes 62T1a, 62T1b, 62T2a, 62T3a, 62T4a, 62T4b, 62T5a, 62T5b, and 62T6 are connected to through holes 63T1a, 63T1b, 63T2a, 63T3a, 63T4a, 63T4b, 63T5a, 63T5b, and 63T6 shown in Fig. 8(a), respectively.

[0054] Fig. 8(b) shows the patterned surface of the 14th dielectric layer 64. The through holes 63T1a, 63T1b, 63T2a, 63T3a, 63T4a, 63T4b, 63T5a, 63T5b, and 63T6 are connected to the through holes 64T1a, 64T1b, 64T2a, 64T3a, 64T4a, 64T4b, 64T5a, 64T5b, and 64T6 shown in Fig. 8(b), respectively.

[0055] 8(c) shows the pattern formation surface of the 15th dielectric layer 65. Conductor layers 651 and 652 are formed on the pattern formation surface of the dielectric layer 65. The through holes 64T1a, 64T2a, 64T3a, 64T4a, 64T4b, 64T5a, 64T5b, and 64T6 are connected to the through holes 65T1a, 65T2a, 65T3a, 65T4a, 65T4b, 65T5a, 65T5b, and 65T6 shown in FIG. 8(c), respectively. The through hole 64T1b and the through holes 65T1b and 65T3b shown in FIG. 8(c) are connected to the conductor layer 651.

[0056] 9(a) shows the pattern formation surface of the 16th dielectric layer 66. A conductor layer 661 is formed on the pattern formation surface of the dielectric layer 66. The through holes 65T1a, 65T1b, 65T2a, 65T3a, 65T3b, 65T4a, 65T4b, 65T5a, and 65T5b are connected to the through holes 66T1a, 66T1b, 66T2a, 66T3a, 66T3b, 66T4a, 66T4b, 66T5a, and 66T5b shown in FIG. 9(a), respectively. The through hole 65T6 is connected to the conductor layer 661.

[0057] 9(b) shows the pattern formation surface of the 17th dielectric layer 67. Conductor layers 671 and 672 are formed on the pattern formation surface of the dielectric layer 67. Through holes 66T1a, 66T1b, 66T2a, 66T3a, 66T3b, 66T4a, 66T4b, 66T5a, and 66T5b are connected to through holes 67T1a, 67T1b, 67T2a, 67T3a, 67T3b, 67T4a, 67T4b, 67T5a, and 67T5b shown in FIG. 9(b), respectively.

[0058] 9(c) shows the pattern formation surface of the 18th dielectric layer 68. Conductor layers 681 and 682 are formed on the pattern formation surface of the dielectric layer 68. Through holes 67T1a, 67T1b, 67T2a, 67T3a, 67T3b, 67T4a, 67T4b, 67T5a, and 67T5b are connected to through holes 68T1a, 68T1b, 68T2a, 68T3a, 68T3b, 68T4a, 68T4b, 68T5a, and 68T5b shown in FIG.

[0059] Fig. 10(a) shows the pattern formation surface of the 19th dielectric layer 69. Conductor layers 691 and 692 are formed on the pattern formation surface of the dielectric layer 69. Through holes 68T1a, 68T1b, 68T2a, 68T3a, 68T3b, 68T4a, 68T4b, 68T5a, and 68T5b are connected to through holes 69T1a, 69T1b, 69T2a, 69T3a, 69T3b, 69T4a, 69T4b, 69T5a, and 69T5b shown in Fig. 10(a), respectively.

[0060] 10(b) shows the pattern-formed surfaces of the 20th and 21st dielectric layers 70 and 71. The through holes 69T1a, 69T1b, 69T2a, 69T3a, 69T3b, 69T4a, 69T4b, 69T5a, and 69T5b are respectively connected to through holes 70T1a, 70T1b, 70T2a, 70T3a, 70T3b, 70T4a, 70T4b, 70T5a, and 70T5b formed in the dielectric layer 70. Furthermore, in the dielectric layers 70 and 71, adjacent through holes with the same reference numeral are connected to each other.

[0061] Fig. 10(c) shows the pattern formation surface of the 22nd dielectric layer 72. A conductor layer 721 is formed on the pattern formation surface of the dielectric layer 72. Through holes 70T1a, 70T1b, 70T2a, 70T3a, 70T3b, 70T4a, 70T4b, 70T5a, and 70T5b formed in the dielectric layer 71 are connected to through holes 72T1a, 72T1b, 72T2a, 72T3a, 72T3b, 72T4a, 72T4b, 72T5a, and 72T5b shown in Fig. 10(c), respectively.

[0062] Fig. 11(a) shows the pattern formation surface of the 23rd dielectric layer 73. A conductor layer 731 is formed on the pattern formation surface of the dielectric layer 73. The through holes 72T1a, 72T1b, 72T2a, 72T3a, 72T3b, 72T4a, 72T4b, 72T5a, and 72T5b are connected to the through holes 73T1a, 73T1b, 73T2a, 73T3a, 73T3b, 73T4a, 73T4b, 73T5a, and 73T5b shown in Fig. 11(a), respectively.

[0063] FIG. 11(b) shows the pattern-formed surface of the 24th dielectric layer 74. A conductor layer 741 is formed on the pattern-formed surface of the dielectric layer 74. The through holes 73T1a, 73T1b, 73T2a, 73T3a, 73T3b, 73T4a, and 73T5a are connected to the through holes 74T1a, 74T1b, 74T2a, 74T3a, 74T3b, 74T4a, and 74T5a shown in FIG. 11(b), respectively. The through holes 73T4b and 73T5b and the through holes 74T4b and 74T5b shown in FIG. 11(b) are connected to the conductor layer 741. The conductor layer 741 is connected to the first conductor portion 80E (see FIG. 2) of the shield conductor 80.

[0064] FIG. 11(c) shows the pattern-formed surface of the 25th dielectric layer 75. A conductor layer 751 is formed on the pattern-formed surface of the dielectric layer 75. The through holes 74T1a, 74T2a, 74T3a, 74T4a, 74T4b, 74T5a, and 74T5b are connected to the through holes 75T1a, 75T2a, 75T3a, 75T4a, 75T4b, 75T5a, and 75T5b shown in FIG. 11(c), respectively. The through holes 74T1b and 74T3b and the through holes 75T1b and 75T3b shown in FIG. 11(c) are connected to the conductor layer 751. The conductor layer 751 is connected to the second conductor portion 80F of the shield conductor 80 (see FIG. 2).

[0065] Figure 12(a) shows the pattern formation surface of the 26th dielectric layer 76. Conductor layers 761, 762, 763, 764, and 765 are formed on the pattern formation surface of the dielectric layer 76. The conductor layer 764 is connected to the conductor layer 762. In Figure 12(a), the boundary between the conductor layer 762 and the conductor layer 764 is indicated by a dotted line.

[0066] The conductor layer 761 has a first end and a second end located at both ends of the conductor layer 761 in the longitudinal direction. The conductor layer 762 has a first end and a second end located at both ends of the conductor layer 762 in the longitudinal direction. The conductor layer 763 has a first end and a second end located at both ends of the conductor layer 763 in the longitudinal direction. The conductor layer 764 has a first end and a second end located at both ends of the conductor layer 764 in the longitudinal direction. The conductor layer 765 has a first end and a second end located at both ends of the conductor layer 765 in the longitudinal direction. The first ends of the conductor layers 761 to 765 are located closer to the first conductor portion 80E of the shield conductor 80 than to the second conductor portion 80F of the shield conductor 80 (lower positions in FIG. 12( a)). The second ends of the conductor layers 761-765 are located closer to the second conductor portion 80F of the shield conductor 80 (upper positions in FIG. 12(a)) than to the first conductor portion 80E of the shield conductor 80. The first end of the conductor layer 764 is connected to a portion of the conductor layer 762 near the first end.

[0067] The through hole 75T1a and the through hole 76T1a shown in FIG. 12(a) are connected to a portion of the conductor layer 761 near the first end. The through hole 75T1b and the through hole 76T1b shown in FIG. 12(a) are connected to a portion of the conductor layer 761 near the second end. The through hole 75T2a and the through hole 76T2a shown in FIG. 12(a) are connected to a portion of the conductor layer 762 near the second end. The through hole 75T3a and the through hole 76T3a shown in FIG. 12(a) are connected to a portion of the conductor layer 763 near the first end. The through hole 75T3b and the through hole 76T3b shown in FIG. 12(a) are connected to a portion of the conductor layer 763 near the second end. The through hole 75T4b and the through hole 76T4b shown in FIG. 12(a) are connected to a portion of the conductor layer 764 near the first end. The through hole 75T4a and the through hole 76T4a shown in FIG. 12(a) are connected to a portion near the second end of the conductor layer 764. The through hole 75T5b and the through hole 76T5b shown in FIG. 12(a) are connected to a portion near the first end of the conductor layer 765. The through hole 75T5a and the through hole 76T5a shown in FIG. 12(a) are connected to a portion near the second end of the conductor layer 765.

[0068] Figure 12(b) shows the pattern formation surface of the 27th dielectric layer 77. Conductor layers 771, 772, 773, 774, and 775 are formed on the pattern formation surface of the dielectric layer 77. The conductor layer 774 is connected to the conductor layer 772. In Figure 12(b), the boundary between the conductor layer 772 and the conductor layer 774 is indicated by a dotted line.

[0069] The conductor layer 771 has a first end and a second end located at both ends of the conductor layer 771 in the longitudinal direction. The conductor layer 772 has a first end and a second end located at both ends of the conductor layer 772 in the longitudinal direction. The conductor layer 773 has a first end and a second end located at both ends of the conductor layer 773 in the longitudinal direction. The conductor layer 774 has a first end and a second end located at both ends of the conductor layer 774 in the longitudinal direction. The conductor layer 775 has a first end and a second end located at both ends of the conductor layer 775 in the longitudinal direction. The first ends of the conductor layers 771 to 775 are located closer to the first conductor portion 80E of the shield conductor 80 than to the second conductor portion 80F of the shield conductor 80 (lower positions in FIG. 12(b)). The second ends of the conductor layers 771 to 775 are located closer to the second conductor portion 80F of the shield conductor 80 (upper positions in FIG. 12(b)) than to the first conductor portion 80E of the shield conductor 80. The first end of the conductor layer 774 is connected to a portion of the conductor layer 772 near the first end.

[0070] The through hole 76T1a is connected to a portion of the conductor layer 771 near the first end. The through hole 76T1b is connected to a portion of the conductor layer 771 near the second end. The through hole 76T2a is connected to a portion of the conductor layer 772 near the second end. The through hole 76T3a is connected to a portion of the conductor layer 773 near the first end. The through hole 76T3b is connected to a portion of the conductor layer 773 near the second end. The through hole 76T4b is connected to a portion of the conductor layer 774 near the first end. The through hole 76T4a is connected to a portion of the conductor layer 774 near the second end. The through hole 76T5b is connected to a portion of the conductor layer 775 near the first end. The through hole 76T5a is connected to a portion of the conductor layer 775 near the second end.

[0071] The laminate 50 shown in Figure 3 is formed by stacking the first to 27th dielectric layers 51 to 77 so that the pattern-forming surface of the first dielectric layer 51 becomes the first surface 50A of the laminate 50, and the surface opposite the pattern-forming surface of the 27th dielectric layer 77 becomes the second surface 50B of the laminate 50.

[0072] Fig. 13 shows the inside of the laminate 50, which is formed by stacking the 1st to 27th dielectric layers 51 to 77. As shown in Fig. 13, inside the laminate 50, the multiple conductor layers and multiple through holes shown in Figs. 4(a) to 12(b) are stacked.

[0073] The following describes the correspondence between the components of the circuit of the electronic component 1 shown in Fig. 1 and the components inside the laminate 50 shown in Fig. 4(a) to Fig. 12(b). The conductor layer 652 forms at least a part of the inductor L10.

[0074] Next, the first circuit 10 will be described. The conductor layers 721 and 731 and the through holes connecting these conductor layers form at least a part of the inductor L11. The conductor layers 661, 671, 681, and 691 and the multiple through holes connecting these conductor layers form at least a part of the inductor L12. The conductor layers 672, 682, and 692 and the multiple through holes connecting these conductor layers form at least a part of the inductor L13. The conductor layers 611 and 621 and the through holes connecting these conductor layers form at least a part of the inductor L14.

[0075] The conductor layers 563 and 573 and the dielectric layer 56 between these conductor layers constitute at least a portion of the capacitor C11. The conductor layers 573 and 583 and the dielectric layer 57 between these conductor layers constitute at least a portion of the capacitor C12. The conductor layers 583 and 593 and the dielectric layer 58 between these conductor layers constitute at least a portion of the capacitor C13. The conductor layers 533 and 544 and the dielectric layer 53 between these conductor layers constitute at least a portion of the capacitor C14.

[0076] The conductor layers 543 and 553 and the dielectric layer 54 between these conductor layers constitute at least a portion of the capacitor C15. The conductor layers 532 and 543 and the dielectric layer 53 between these conductor layers constitute at least a portion of the capacitor C16. The conductor layers 523 and 532 and the dielectric layer 52 between these conductor layers constitute at least a portion of the capacitor C17. The conductor layers 532 and 533 constitute at least a portion of the capacitor C18. The conductor layers 553 and 562 and the dielectric layer 55 between these conductor layers constitute at least a portion of the capacitor C19.

[0077] Next, the components of the second circuit 20 will be described. Conductor layers 592, 761, and 771 and through holes 53T1b, 54T1b, 55T1b, 56T1b, 57T1b, 58T1b, 59T1a, 59T1b, 60T1a, 60T1b, 61T1a, 61T1b, 62T1a, 62T1b, 63T1a, 63T1b, 64T1a, 64T1b, 65T1a, 65T1b, 6 6T1a, 66T1b, 67T1a, 67T1b, 68T1a, 68T1b, 69T1a, 69T1b, 70T1a, 70T1b, 72T1a, 72T1b, 73T1a, 73T1b, 74T1a, 74T1b, 75T1a, 75T1b, 76T1a, and 76T1b form at least a part of inductor L21.

[0078] The conductor layers 762 and 772 and the through holes 57T2a, 58T2a, 59T2a, 60T2a, 61T4b, 61T2a, 62T4b, 62T2a, 63T4b, 63T2a, 64T4b, 64T2a, 65T4b, 65T2a, 66T4b, 66T2a, 67T4b, 67T2a, 68T4b, 68T2a, 69T4b, 69T2a, 70T4b, 70T2a, 72T4b, 72T2a, 73T4b, 73T2a, 74T4b, 74T2a, 75T4b, 75T2a, 76T4b, and 76T2a form at least a part of the inductor L22.

[0079] Conductor layers 763 and 773 and through holes 61T3a, 62T3a, 63T3a, 64T3a, 65T3a, 65T3b, 66T3a, 66T3b, 67T3a, 67T3b, 68T3a, 68T3b, 69T3a, 69T3b, 70T3a, 70T3b, 72T3a, 72T3b, 73T3a, 73T3b, 74T3a, 74T3b, 75T3a, 75T3b, 76T3a, and 76T3b form at least a part of inductor L23.

[0080] Conductor layers 764 and 774 and through holes 57T4a, 58T4a, 59T4a, 60T4a, 61T4a, 61T4b, 62T4a, 62T4b, 63T4a, 63T4b, 64T4a, 64T4b, 65T4a, 65T4b, 66T4a, 66T4b, 67T4a, 67T4b, 68T4a, 68T4b, 69T4a, 69T4b, 70T4a, 70T4b, 72T4a, 72T4b, 73T4a, 73T4b, 74T4a, 74T4b, 75T4a, 75T4b, 76T4a, and 76T4b form at least a part of inductor L24.

[0081] Conductor layers 765 and 775, and through holes 55T5a, 56T5a, 56T5b, 57T5a, 57T5b, 58T5a, 58T5b, 59T5a, 59T5b, 60T5a, 60T5b, 61T5a, 61T5b, 62T5a, 62T5b, 63T5a, 63T5b, 64T5a, 64T5b, 65T5a, 65T5b, 66T5a, 66T5b, 67T5a, 67T5b, 68T5a, 68T5b, 69T5a, 69T5b, 70T5a, 70T5b, 72T5a, 72T5b, 73T5a, 73T5b, 74T5a, 74T5b, 75T5a, 75T5b, 76T5a, and 76T5b form at least a part of inductor L25.

[0082] The conductor layer 522 forms at least a part of the inductor L26.

[0083] The conductor layers 561 and 564 constitute at least a part of the capacitor C21. The conductor layers 533 and 552 and the dielectric layers 53 and 54 between these conductor layers constitute at least a part of the capacitor C22. The conductor layers 561 and 575 and the dielectric layer 56 between these conductor layers constitute at least a part of the capacitor C23. The conductor layers 561 and 571 and the dielectric layer 56 between these conductor layers constitute at least a part of the capacitor C24. The conductor layers 551 and 561 and the dielectric layer 55 between these conductor layers constitute at least a part of the capacitor C25.

[0084] Conductor layers 555, 564, 574, and 582 and the dielectric layers 55, 56, and 57 between these conductor layers constitute at least a portion of capacitor C26. Conductor layers 572 and 582 and the dielectric layer 57 between these conductor layers constitute at least a portion of capacitor C27. Conductor layers 575 and 582 and the dielectric layer 57 between these conductor layers constitute at least a portion of capacitor C28. Conductor layers 541 and 552 and the dielectric layer 54 between these conductor layers constitute at least a portion of capacitor C29.

[0085] The conductor layers 571 and 581 and the dielectric layer 57 between these conductor layers constitute at least a part of the capacitor C30. The conductor layers 571 and 582 and the dielectric layer 57 between these conductor layers constitute at least a part of the capacitor C31. The conductor layers 581 and 591 and the dielectric layer 58 between these conductor layers constitute at least a part of the capacitor C32. The conductor layers 531 and 541 and the dielectric layer 53 between these conductor layers constitute at least a part of the capacitor C33.

[0086] Next, structural features of the electronic component 1 according to this embodiment will be described. First, features relating to the inductor L12 and capacitor C14 of the first circuit 10 will be described with reference to Fig. 1, Fig. 4(a) to Fig. 10(a), and Fig. 14. Fig. 14 is a perspective view showing a part of the interior of the electronic component 1. Fig. 14 shows a part of the first circuit 10 and a ground terminal 115.

[0087] The inductor L12 corresponds to the "first inductor" of the present invention. The capacitor C14 corresponds to the "first capacitor" of the present invention. The ground terminal 115 corresponds to the "first ground terminal" of the present invention. Both the inductor L12 and the capacitor C14 are connected to the ground terminal 115.

[0088] Here, the conductor connecting inductor L12 and ground terminal 115 is referred to as first conductor 11, and the conductor connecting capacitor C14 and ground terminal 115 is referred to as second conductor 12. First conductor 11 includes through hole 51T6, conductor layer 524, and through holes 52T6, 53T6, 54T6, 55T6, 56T6, 57T6, 58T6, 59T6, 60T6, 61T6, 62T6, 63T6, 64T6, and 65T6. Through hole 65T6 is connected to conductor layer 661 that constitutes inductor L12. Conductor layer 661 corresponds to the "inductor conductor" of this invention.

[0089] The second conductor 12 includes a through hole 51T7, a conductor layer 525, and a through hole 52T7. The through hole 52T7 is connected to a conductor layer 533 that constitutes the capacitor C14. The conductor layer 533 corresponds to the "capacitor conductor" of this invention.

[0090] The second conductor 12 is connected to the first conductor 11 via the ground terminal 115, but is not directly connected to the first conductor 11. Therefore, the inductor L12 and the capacitor C14 do not join together along the path from the inductor L12 or the capacitor C14 to the ground terminal 115, but are connected separately to the same ground terminal 115.

[0091] At least a portion of the second conductor 12 is adjacent to, and spaced apart from, the first conductor 11 in a direction perpendicular to the stacking direction T. That is, no other conductors are interposed between, at least a portion of the second conductor 12 and the first conductor 11. In the present embodiment, the through hole 51T7, the conductor layer 525, and the through hole 52T7 of the second conductor 12 are adjacent to, and spaced apart from, the through hole 51T6, the conductor layer 524, and the through hole 52T6 of the first conductor 11 in the above-mentioned direction, respectively. No other conductors are interposed between the through hole 51T7 and the through hole 51T6, between the conductor layer 525 and the conductor layer 524, and between the through hole 52T7 and the through hole 52T6.

[0092] Here, a columnar structure formed by one or more through holes is called a columnar conductor. When a columnar conductor is formed by multiple through holes, the multiple through holes are connected in series. The columnar conductors extend in a direction parallel to the stacking direction T. The first conductor 11 includes a first columnar conductor formed by a through hole 51T6. The second conductor 12 includes a second columnar conductor formed by a through hole 51T7. Each of the first columnar conductor (through hole 51T6) and the second columnar conductor (through hole 51T7) is directly connected to the ground terminal 115.

[0093] The first conductor 11 further includes third columnar conductors formed by through holes 52T6, 53T6, 54T6, 55T6, 56T6, 57T6, 58T6, 59T6, 60T6, 61T6, 62T6, 63T6, 64T6, and 65T6.

[0094] The third columnar conductor of the first conductor 11 is connected to the first conductor portion 80E of the shield conductor 80 via the conductor layer 604. The conductor layer 604 is a feature that corresponds to the "first conductor layer" of this invention.

[0095] Next, features related to the second circuit 20 will be described with reference to Fig. 1 and Figs. 4(a) to 12(b). Inductors L21 and L23 of the second circuit 20 are connected to ground terminals 114 and 115, respectively. Inductors L22, L24, and L25 are connected to ground terminal 116, respectively. Each of inductors L22, L24, and L25 corresponds to a "second inductor" in the present invention. Ground terminal 116 corresponds to a "second ground terminal" in the present invention.

[0096] Inductor L22 is connected to ground terminal 116 via through holes 51T9, 52T9, 53T9, 54T9, 55T9, conductor layer 561, through holes 56T5b, 57T5b, 58T5b, 59T5b, 60T5b, conductor layer 614, through holes 61T4b, 62T4b, 63T4b, 64T4b, 65T4b, 66T4b, 67T4b, 68T4b, 69T4b, 70T4b, 72T4b, 73T4b, 74T4b, 75T4b and conductor layer 764.

[0097] The inductor L24 is connected to the ground terminal 116 via through holes 51T9, 52T9, 53T9, 54T9, and 55T9, a conductor layer 561, through holes 56T5b, 57T5b, 58T5b, 59T5b, and 60T5b, and a conductor layer 614.

[0098] The inductor L25 is connected to the ground terminal 116 via through holes 51T9, 52T9, 53T9, 54T9, and 55T9 and a conductor layer 561.

[0099] Each of the inductors L22, L24, and L25 is connected to the second conductor portion 80F of the shield conductor 80 via the conductor layers 614 and 741. The conductor layers 614 and 741 correspond to the "second conductor layer" of this invention.

[0100] Next, the operation and effect of electronic component 1 according to this embodiment will be described. Electronic component 1 according to this embodiment includes shield conductor 80 including conductor portions 80B-80F covering the surface of laminate 50. Shield conductor 80 is connected to ground terminals 114-116 via conductor layers 602, 614, and 741 in laminate 50 and multiple conductors connected to conductor layers 602, 614, and 741. In this way, shield conductor 80 is connected to ground.

[0101] The shield conductor 80 prevents electromagnetic waves generated by multiple components in the laminate 50 of the electronic component 1 from leaking outside the electronic component 1, and also prevents electromagnetic waves generated by other electronic components mounted near the electronic component 1 from entering the laminate 50 of the electronic component 1. Therefore, the shield conductor 80 can prevent electromagnetic interference from occurring between multiple electronic components as the mounting density increases. This effect includes the effect of preventing electromagnetic waves generated by multiple components in the laminate 50 of the electronic component 1 from adversely affecting other electronic components, and the effect of preventing electromagnetic waves generated by other electronic components from adversely affecting the electronic component 1.

[0102] The laminate 50 includes multiple specific components, each connected to ground. A portion of the connecting conductor for connecting the shield conductor 80 to the ground terminals 114-116 and a portion of the connecting conductor for connecting the multiple specific components to the ground terminals 114-116 are shared. This may result in unintended power transmission between the multiple specific components via the connecting conductor and the shield conductor 80. Unintended power transmission may cause the characteristics of the electronic component 1 to deviate from desired characteristics. In this embodiment, the electronic component 1 is a branching filter (diplexer) including a first circuit 10 and a second circuit 20. Unintended power transmission between the multiple specific components may result in a deterioration in isolation characteristics between the first signal terminal 3 connected to the first circuit 10 and the second signal terminal 4 connected to the second circuit 20.

[0103] In the first circuit 10, unintended power propagation may occur via the inductor L12 connected to ground and the conductor connected to the inductor L12. In particular, in this embodiment, the third columnar conductor of the first conductor 11, which connects the inductor L12 to the ground terminal 115, is connected to the first conductor portion 80E of the shield conductor 80 via the conductor layer 604. Therefore, unintended power propagation may occur via the shield conductor 80. Furthermore, if unintended power propagates to a component that is physically or circuitly close to the inductor L12, specifically, the capacitor C14, the characteristics of the first circuit 10 may deviate from the desired characteristics.

[0104] In contrast, in the present embodiment, second conductor 12 connecting capacitor C14 to ground terminal 115 connects conductor layer 533, which is a capacitor conductor, to ground terminal 115, but is not directly connected to first conductor 11 connecting inductor L14 to ground terminal 115. Ground terminal 115 is directly connected to the ground electrode of the substrate on which electronic component 1 is mounted, and therefore has the function of suppressing power propagation (backflow) toward electronic component 1. Therefore, according to the present embodiment, it is possible to suppress unintended power propagation to capacitor C14 compared to when first conductor 11 and second conductor 12 are partly common to each other, i.e., when second conductor 12 is connected to first conductor 11 midway along the path from capacitor C14 to ground terminal 115.

[0105] In order to prevent unintended power propagation to capacitor C14, it is possible to add a ground terminal and connect inductor L12 and capacitor C14 to separate ground terminals. However, adding a ground terminal would increase the dimensions of the laminate 50. In contrast, in this embodiment, both inductor L12 and capacitor C14 are connected to ground terminal 115. As a result, this embodiment can prevent unintended power propagation to capacitor C14 while reducing the dimensions of the laminate 50.

[0106] Furthermore, in this embodiment, each of the inductors L22, L24, and L25 of the second circuit 20 is connected to the second conductor portion 80F of the shield conductor 80 via the conductor layers 614 and 741. This raises the risk of unintended power transmission from the second circuit 20 to the first circuit 10 via the shield conductor 80. In contrast, in this embodiment, by connecting the capacitor C14 to the ground terminal 115 as described above, it is possible to prevent unintended power transmission from the second circuit 20 to the capacitor C14. As a result, this embodiment can prevent deterioration of the isolation characteristics between the first signal terminal 3 to which the first circuit 10 is connected and the second signal terminal 4 to which the second circuit 20 is connected.

[0107] Next, the effects of this embodiment will be described with reference to the results of a simulation. In the simulation, a model of an example and a model of a comparative example were used. The model of the example is a model of the electronic component 1 according to this embodiment.

[0108] The comparative example model is a model of a comparative example electronic component. In the comparative example electronic component, conductor layer 533, which is a capacitor conductor, is connected to through holes 52T6 and 53T6 of first conductor 11. Therefore, in the comparative example electronic component, a portion of the connecting conductor connecting inductor L12 to ground terminal 115 and a portion of the connecting conductor connecting capacitor C14 to ground terminal 115 are shared. The other configurations of the comparative example electronic component are the same as those of electronic component 1 according to the present embodiment.

[0109] In the simulation, the frequency characteristics of the isolation between the first signal terminal 3 and the second signal terminal 4 were obtained for each of the model of the example and the model of the comparative example.

[0110] The definition of isolation between the first signal terminal 3 and the second signal terminal 4 is as follows: When a high-frequency signal with power P1 is input to the first signal terminal 3, the power of the signal output from the second signal terminal 4 is defined as P2. Isolation I is defined by the following equation (1).

[0111] I=-10log(P2 / P1) …(1)

[0112] Fig. 15 is a characteristic diagram showing the frequency characteristics of isolation for each model. In Fig. 15, the horizontal axis represents frequency and the vertical axis represents isolation. In Fig. 15, the curve labeled 81 represents the frequency characteristics of isolation for the model of the example. The curve labeled 82 represents the frequency characteristics of isolation for the model of the comparative example.

[0113] 15, it can be seen that the isolation of the model of the example is greater than that of the model of the comparative example in a frequency range including a frequency range greater than 5000 MHz and less than 7500 MHz. As can be seen from this result, according to this embodiment, it is possible to increase the isolation between the first signal terminal 3 and the second signal terminal 4 compared to the comparative example.

[0114] The present invention is not limited to the above-described embodiment, and various modifications are possible. The present invention is not limited to the electronic component having the circuit configuration shown in Fig. 1, but can be applied to electronic components having various circuit configurations as long as they satisfy the requirements of the claims.

[0115] As described above, the multilayer electronic component of the present invention includes a first ground terminal, an inductor conductor constituting at least a portion of a first inductor, a capacitor conductor constituting a portion of a first capacitor, a first conductor, a second conductor, a laminate for integrating the first ground terminal, the inductor conductor, the capacitor conductor, the first conductor, and the second conductor, the laminate including a plurality of stacked dielectric layers, and a shield conductor integrated with the laminate. The laminate has a first surface and a second surface located at both ends in the stacking direction of the plurality of dielectric layers, and four side surfaces connecting the first surface and the second surface. A shield conductor is provided on at least one of the four side surfaces. The first ground terminal is located on the first surface, and the first conductor connects the inductor conductor and the first ground terminal. The second conductor connects the capacitor conductor and the first ground terminal and is not directly connected to the first conductor.

[0116] The multilayer electronic component of the present invention may further include a first conductor layer connecting the shield conductor and the first conductor.

[0117] In the multilayer electronic component of the present invention, the first conductor may include a first columnar conductor extending in a direction parallel to the stacking direction, and the first columnar conductor may be directly connected to the first ground terminal.

[0118] In the multilayer electronic component of the present invention, the second conductor may include a second columnar conductor extending in a direction parallel to the stacking direction, and the second columnar conductor may be directly connected to the first ground terminal.

[0119] In the multilayer electronic component of the present invention, at least a portion of the second conductor may be adjacent to and spaced from the first conductor in a direction perpendicular to the stacking direction.

[0120] The multilayer electronic component of the present invention may further include a common terminal, a first signal terminal, a second signal terminal, a first circuit arranged between the common terminal and the first signal terminal in a circuit configuration, and a second circuit arranged between the common terminal and the second signal terminal in a circuit configuration. The first circuit may include a first inductor and a first capacitor and be configured to pass signals having frequencies within a first pass band. The second circuit may be configured to pass signals having frequencies within a second pass band different from the first pass band.

[0121] In the multilayer electronic component of the present invention, the first pass band may be a frequency band lower than the second pass band.

[0122] In the multilayer electronic component of the present invention, the second circuit may include a second inductor and a second capacitor.

[0123] The multilayer electronic component of the present invention may further include a second ground terminal disposed on the first surface at a position different from the first ground terminal, and the second inductor may be connected to the second ground terminal.

[0124] The multilayer electronic component of the present invention may further include a second conductor layer that connects the shield conductor and the second inductor. [Explanation of symbols]

[0125] 1... multilayer electronic component, 2... common terminal, 3... first signal terminal, 4... second signal terminal, 10... first circuit, 11... first conductor, 12... second conductor, 20... second circuit, 50... laminate, 50A... first surface, 50B... second surface, 50C to 50F... side surface, 80... shield conductor, 80B to 80D... conductor portion, 80E... first conductor portion, 80F... second conductor portion, 111 to 116... electrodes, C11 to C19, C21 to C33... capacitors, L10 to L14, L21 to L26... inductors.

Claims

1. a first ground terminal; an inductor conductor that forms at least a part of a first inductor; a capacitor conductor that forms a part of a first capacitor; a first conductor; a second conductor; and a laminate for integrating the first ground terminal, the inductor conductor, the capacitor conductor, the first conductor, and the second conductor, the laminate including a plurality of laminated dielectric layers; a shield conductor integrated with the laminate; the laminate has a first surface and a second surface located at both ends in a stacking direction of the plurality of dielectric layers, and four side surfaces connecting the first surface and the second surface; the shield conductor is provided on at least one of the four side surfaces; the first ground terminal is disposed on the first surface; the first conductor connects the inductor conductor and the first ground terminal; The multilayer electronic component is characterized in that the second conductor connects the capacitor conductor and the first ground terminal, and is not directly connected to the first conductor.

2. 2. The multilayer electronic component according to claim 1, further comprising a first conductor layer connecting said shield conductor and said first conductor.

3. the first conductor includes a first columnar conductor extending in a direction parallel to the stacking direction, 2. The multilayer electronic component according to claim 1, wherein the first columnar conductor is directly connected to the first ground terminal.

4. the second conductor includes a second columnar conductor extending in a direction parallel to the stacking direction, 2. The multilayer electronic component according to claim 1, wherein the second columnar conductor is directly connected to the first ground terminal.

5. 2. The multilayer electronic component according to claim 1, wherein at least a portion of the second conductor is adjacent to and spaced apart from the first conductor in a direction perpendicular to the stacking direction.

6. Furthermore, a common terminal; a first signal terminal; a second signal terminal; a first circuit provided between the common terminal and the first signal terminal in a circuit configuration; a second circuit provided between the common terminal and the second signal terminal in terms of circuit configuration; the first circuit includes the first inductor and the first capacitor and is configured to pass signals having frequencies within a first passband; 2. The multilayer electronic component according to claim 1, wherein the second circuit is configured to pass signals having frequencies within a second pass band different from the first pass band.

7. 7. The multilayer electronic component according to claim 6, wherein the first pass band is a frequency band lower than the second pass band.

8. 7. The multilayer electronic component according to claim 6, wherein the second circuit includes a second inductor and a second capacitor.

9. a second ground terminal disposed on the first surface and at a position different from the first ground terminal; 9. The multilayer electronic component according to claim 8, wherein the second inductor is connected to the second ground terminal.

10. 9. The multilayer electronic component according to claim 8, further comprising a second conductor layer connecting the shield conductor and the second inductor.

Images