Adjustment jig

Abstract

To provide an adjusting tool capable of properly adjusting the angle of a water curtain or the angle of an air curtain without depending on the sense of an operator.SOLUTION: The adjustment jig 2 includes curtain inclination parts 6b, 6c, and 6d for confirming an angle of a water curtain C generated from the water curtain nozzle 16 toward the chuck table or an angle of an air curtain generated from the air curtain nozzle 18 toward the chuck table. The adjustment jig 2 is used to confirm whether the angle of the water curtain C is appropriate or the angle of the air curtain is appropriate, and to adjust the water curtain nozzle 16 or the air curtain nozzle 18 when the angle is inappropriate.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to an adjustment jig used in a cutting device that includes at least one of a water curtain nozzle and an air curtain nozzle. [Background technology]

[0002] A wafer with multiple devices such as ICs and LSIs formed on its surface, separated by planned dividing lines, is divided into individual device chips by a cutting machine, and each divided device chip is used in electrical equipment such as mobile phones and personal computers.

[0003] The cutting device includes a chuck table that holds the wafer, a cutting means equipped with a cutting blade that cuts the wafer held on the chuck table, an X-axis feed means that feeds the chuck table in the X-axis direction for processing, a Y-axis feed means that indexes and feeds the cutting means in the Y-axis direction perpendicular to the X-axis direction, a water curtain nozzle that extends in the Y-axis direction and is arranged to straddle the chuck table, and generates a water curtain, and an air curtain nozzle that extends in the Y-axis direction and is arranged to straddle the chuck table, and generates an air curtain, and can easily clean and dry the holding surface of the chuck table or the top surface of a cut wafer held on the chuck table (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-021821 Summary of the Invention [Problem to be solved by the invention]

[0005] The angle of the water curtain sprayed from the water curtain nozzle is adjusted appropriately depending on the type and thickness of the wafer held on the chuck table, the width or depth of the cut groove, and other factors. However, adjusting the angle of the water curtain often relies on the operator's sense. This results in unstable processing quality. The same problem occurs when adjusting the angle of the air curtain nozzle.

[0006] An object of the present invention is to provide an adjustment jig that can properly adjust the angle of a water curtain or an air curtain without relying on the operator's sense. [Means for solving the problem]

[0007] According to the present invention, there is provided the following adjustment jig that solves the above-mentioned problems. "An adjustment jig used in a cutting device comprising a chuck table for holding a wafer, cutting means having a cutting blade for cutting the wafer held on the chuck table, X-axis feed means for processing and feeding the chuck table in an X-axis direction, and Y-axis feed means for indexing and feeding the cutting means in a Y-axis direction perpendicular to the X-axis direction, and including at least one of a water curtain nozzle extending in the Y-axis direction and arranged to straddle the chuck table, for generating a water curtain, and an air curtain nozzle extending in the Y-axis direction and arranged to straddle the chuck table, for generating an air curtain, a curtain tilting unit for checking the angle of a water curtain generated from the water curtain nozzle toward the chuck table or the angle of an air curtain generated from the air curtain nozzle toward the chuck table; An adjustment jig is provided which is used to check whether the angle of the water curtain or the angle of the air curtain is appropriate, and to adjust the water curtain nozzle or the air curtain nozzle if the angle is incorrect.

[0008] Preferably, the cutting means includes an air nozzle for removing water droplets adhering to the cutting blade, and an air nozzle adjustment unit for checking and adjusting the position of the air nozzle. The adjustment jig is preferably made of a resin containing PLA. [Effects of the Invention]

[0009] The adjustment jig of the present invention is an adjustment jig for use in a cutting device comprising a chuck table for holding a wafer, cutting means having a cutting blade for cutting the wafer held on the chuck table, X-axis feed means for feeding the chuck table in an X-axis direction for processing, and Y-axis feed means for indexing and feeding the cutting means in a Y-axis direction perpendicular to the X-axis direction, and including at least one of a water curtain nozzle extending in the Y-axis direction and arranged to straddle the chuck table, for generating a water curtain, and an air curtain nozzle extending in the Y-axis direction and arranged to straddle the chuck table, for generating an air curtain; a curtain tilting unit for checking the angle of a water curtain generated from the water curtain nozzle toward the chuck table or the angle of an air curtain generated from the air curtain nozzle toward the chuck table; It is used to check whether the angle of the water curtain or the angle of the air curtain is appropriate, and to adjust the water curtain nozzle or the air curtain nozzle if the angle is incorrect, so that the angle of the water curtain or the angle of the air curtain can be adjusted appropriately without relying on the sense of the operator. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 2 is a perspective view of an adjustment jig according to the present invention. [Figure 2] FIG. 2 is a front view of the adjustment jig shown in FIG. 1 . [Figure 3] FIG. 2 is a perspective view of a cutting device in which the adjustment jig shown in FIG. 1 is used. [Figure 4]4 is a perspective view of the cutting means, the water curtain nozzle, and the air curtain nozzle shown in FIG. 3. [Figure 5] 5 is a schematic diagram showing a state in which the adjustment jig shown in FIG. 1 is positioned below the cutting means shown in FIG. 4. [Figure 6] FIG. 6 is a schematic diagram showing a state in which the position of the air nozzle shown in FIG. 5 is being adjusted. [Figure 7] 5 is a schematic diagram showing a state in which the angle of the water curtain shown in FIG. 4 is being adjusted using the adjustment jig shown in FIG. 1. [Figure 8] Schematic diagram of the water curtain angle adjusted to vertical. DETAILED DESCRIPTION OF THE INVENTION

[0011] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of an adjusting jig according to the present invention will now be described with reference to the drawings.

[0012] (Adjustment jig 2) 1 and 2, the adjustment jig 2 includes a rectangular bottom plate 4, a first side wall 6 extending upward from a first side 4a of the bottom plate 4, and a second side wall 8 extending upward from a second side 4b perpendicular to the first side 4a. The adjustment jig 2 may be made of an appropriate synthetic resin such as PLA (polylactic acid).

[0013] (Bottom plate 4 of adjustment jig 2) The underside of the bottom plate 4 in this embodiment has a first flat portion 4c and a second flat portion 4d that protrudes downward from the first flat portion 4c. That is, a required step exists between the first flat portion 4c and the second flat portion 4d on the underside of the bottom plate 4. This step corresponds to the difference in the appropriate vertical position between the lower end of the spindle housing 24 and the lower end of the air nozzle 34 of the cutting device 10, which will be described later. Therefore, the underside of the bottom plate 4 functions as an air nozzle adjustment portion for checking and adjusting the position of the air nozzle 34 of the cutting device 10, which will be described later.

[0014] (First side wall 6 of adjustment jig 2) The inner surface of the first side wall 6 is provided with a vertical portion 6a that is perpendicular to the upper surface of the bottom plate 4, a first curtain inclined portion 6b that forms an angle of 10 degrees with the vertical portion 6a, a second curtain inclined portion 6c that forms an angle of 30 degrees with the vertical portion 6a, and a third curtain inclined portion 6d that forms an angle of 45 degrees with the vertical portion 6a. In this embodiment, three curtain inclined portions are provided on the inner surface of the first side wall 6, but the number of curtain inclined portions is arbitrary. Also, in this embodiment, the angles formed by the vertical portion 6a and each curtain inclined portion are 10 degrees, 30 degrees, and 45 degrees, but the angles formed by the vertical portion 6a and each curtain inclined portion can also be set arbitrarily.

[0015] The upper end of the first side wall 6 is provided with an arcuate surface 6e corresponding to the cylindrical water curtain nozzle 16 or cylindrical air curtain nozzle 18 of the cutting device 10. The radius of curvature of the arcuate surface 6e is the same as the radius of curvature of the outer circumferential surface of the water curtain nozzle 16 or the air curtain nozzle 18. The arcuate surface 6e is the part that comes into contact with the water curtain nozzle 16 or the air curtain nozzle 18 when checking whether the water curtain angle or the air curtain angle is appropriate. Even when the water curtain angle or the air curtain angle is adjusted vertically, the arcuate surface 6e is configured so as not to impede the spray of cleaning water from the water curtain nozzle 16 or the spray of high-pressure air from the nozzle of the air curtain nozzle 18. Therefore, the angle of the water curtain C or the angle of the air curtain can be adjusted vertically using the adjustment jig 2.

[0016] (Second side wall 8 of adjustment jig 2) The upper end of the second side wall 8 is aligned with the lower end of the arcuate surface 6 e. Therefore, when the arcuate surface 6 e is brought into contact with the water curtain nozzle 16 or the air curtain nozzle 18 of the cutting device 10, the water curtain nozzle 16 or the air curtain nozzle 18 does not interfere with the second side wall 8.

[0017] (Cutting device 10) FIG. 3 shows an example of a cutting device in which the above-described adjustment jig 2 is used. The cutting device 10 shown in FIG. 3 includes a chuck table 12 that holds a wafer, a cutting means 14 equipped with a cutting blade that cuts the wafer held on the chuck table 12, an X-axis feed means (not shown) that feeds the chuck table 12 in the X-axis direction, and a Y-axis feed means (not shown) that indexes and feeds the cutting means 14 in the Y-axis direction perpendicular to the X-axis direction. The cutting device 10 also includes a water curtain nozzle 16 that extends in the Y-axis direction and straddles the chuck table 12 to generate a water curtain, and an air curtain nozzle 18 that extends in the Y-axis direction and straddles the chuck table 12 to generate an air curtain. The X-axis direction is the direction indicated by the arrow X in FIG. 3, and the Y-axis direction is the direction indicated by the arrow Y in FIG. 3. The XY plane defined by the X-axis and Y-axis directions is substantially horizontal. The Z-axis direction indicated by the arrow Z in FIG. 3 is the up-down direction perpendicular to the X-axis and Y-axis directions.

[0018] (Chuck table 12 of cutting device 10) A circular suction chuck 20 is disposed on the upper end portion of the chuck table 12. The suction chuck 20 is formed from a porous material such as porous ceramics. The suction chuck 20 is connected to a suction means (not shown). In the chuck table 12, the suction means generates a suction force on the upper surface of the suction chuck 20, thereby suction-holding the wafer W placed on the upper surface of the suction chuck 20. The wafer W shown in FIG. 3 is supported on an annular frame F via a dicing tape T, and a plurality of clamps 22 for fixing the annular frame F are disposed at intervals in the circumferential direction around the periphery of the chuck table 12.

[0019] (Cutting means 14 of cutting device 10) As shown in Figure 4, the cutting means 14 comprises a spindle housing 24 that is movable in the Y-axis and Z-axis directions, a spindle 26 that is rotatably supported by the spindle housing 24, an annular cutting blade 28 attached to the tip of the spindle 26, and a blade cover 30 that covers the cutting blade 28.

[0020] As shown in Figures 5 and 6, the blade cover 30 is provided with a pair of cutting water supply nozzles 32 that supply cutting water to the wafer W and the cutting blade 28 during cutting, and an air nozzle 34 that sprays high-pressure air toward the cutting blade 28. The air nozzle 34 is used to improve detection accuracy when optically detecting the bottom end position of the cutting blade 28 using a light-emitting element and a light-receiving element. By spraying high-pressure air from the air nozzle 34 toward the cutting blade 28 and removing water droplets adhering to the cutting blade 28, the bottom end position of the cutting blade 28 can be optically detected with high accuracy. The air nozzle 34 is fixed to the blade cover 30 with screws 36, and the position (height) of the air nozzle 34 in the Z-axis direction can be adjusted by loosening the screws 36.

[0021] (X-axis feed means of cutting device 10) Although not shown, the X-axis feed means has a ball screw connected to the chuck table 12 and extending in the X-axis direction, and a motor that rotates the ball screw. The X-axis feed means converts the rotational motion of the motor into linear motion using the ball screw and transmits it to the chuck table 12, feeding the chuck table 12 in the X-axis direction for processing. The chuck table 12 is rotated around the Z-axis direction by a motor (not shown).

[0022] (Y-axis feed means of cutting device 10) Although not shown, the Y-axis feed means has a ball screw connected to the spindle housing 24 of the cutting means 14 and extending in the Y-axis direction, and a motor that rotates this ball screw. The Y-axis feed means converts the rotational motion of the motor into linear motion using the ball screw and transmits it to the spindle housing 24, thereby indexing and feeding the cutting means 14 in the Y-axis direction. The cutting means 14 is fed for cutting in the Z-axis direction by Z-axis feed means, which may be of the ball screw type.

[0023] (Water curtain nozzle 16 of cutting device 10) As shown in Figures 3 and 4, the water curtain nozzle 16 extends in the Y-axis direction above the machining feed path of the chuck table 12 and is disposed so as to straddle the chuck table 12. A number of jetting ports (not shown) are formed at the bottom of the water curtain nozzle 16 at intervals in the Y-axis direction. When cleaning water (e.g., pure water) is supplied to the water curtain nozzle 16 from a cleaning water supply means (not shown), the cleaning water is jetted from the number of jetting ports, generating a water curtain toward the chuck table 12. In addition, as shown in Figure 4, a groove 16a for a tool is formed at the tip of the water curtain nozzle 16, and the direction of the jetting port can be adjusted by fitting a tool into the groove 16a and rotating the water curtain nozzle 16.

[0024] (Air curtain nozzle 18 of cutting device 10) Like the water curtain nozzle 16, the air curtain nozzle 18 extends in the Y-axis direction above the machining feed path of the chuck table 12 and is disposed so as to straddle the chuck table 12. The air curtain nozzle 18 is disposed at a position farther from the cutting means 14 than the water curtain nozzle 16. A number of nozzles (not shown) are formed at the bottom of the air curtain nozzle 18 at intervals in the Y-axis direction. When high-pressure air is supplied to the air curtain nozzle 18 from a high-pressure air supply means (not shown), the high-pressure air is sprayed from the many nozzles, generating an air curtain toward the chuck table 12. A groove 18a for a tool is formed at the tip of the air curtain nozzle 18, and the direction of the nozzle can be adjusted by fitting a tool into the groove 18a and rotating the air curtain nozzle 18.

[0025] As shown in FIG. 3, the cutting device 10 further includes a cassette stage 40 that can be raised and lowered and on which a cassette 38 containing a plurality of wafers W is placed, a loading / unloading means 44 that pulls out the uncut wafer W from the cassette 38 and carries it out to the temporary storage table 42, and also carries the cut wafer W positioned on the temporary storage table 42 into the cassette 38, a first transport means 46 that transports the uncut wafer W that has been carried out from the cassette 38 to the temporary storage table 42 to the chuck table 12, an imaging means 48 that images the wafer W held on the chuck table 12, a cleaning means 50 that cleans the cut wafer W, and a second transport means 52 that transports the cut wafer W from the chuck table 12 to the cleaning means 50.

[0026] When cutting a wafer W using the cutting device 10 as described above, a holding step is first performed in which the wafer W is transported from the cassette 38 to the chuck table 12 and held on the chuck table 12. In the holding step, the uncut wafer W is first transported from the cassette 38 to the temporary placement table 42 by the transport means 44. Next, the wafer W is transported from the temporary placement table 42 to the chuck table 12, which is positioned at the transfer position (the position shown in FIG. 3), by the first transport means 46, and the wafer W is placed on the upper surface of the chuck table 12. Next, a suction force is generated in the suction chuck 20 of the chuck table 12, causing the wafer W to be suction-held on the chuck table 12. In addition, the annular frame F, which supports the wafer W via the dicing tape T, is fixed with multiple clamps 22.

[0027] After the holding step, a cutting step is performed in which the wafer W is cut by the cutting blade 28 of the cutting means 14. In the cutting step, first, the X-axis feed means moves the chuck table 12 directly below the imaging means 48, and the imaging means 48 captures an image of the wafer W. Then, the chuck table 12 is rotated based on the image of the wafer W captured by the imaging means 48 to adjust the orientation of the wafer W and align the predetermined area to be cut in the X-axis direction. Next, the chuck table 12 is moved below the cutting means 14. Next, the cutting blade 28 is rotated at a required rotation speed. Next, the Z-axis feed means lowers the cutting means 14, and the cutting edge of the cutting blade 28 cuts into the wafer W from the top surface to a required depth. At the same time, the chuck table 12 is fed for processing while cutting water is supplied from the pair of cutting water supply nozzles 32. This allows the wafer W to be cut as required. Then, the cutting blade 28 is indexed and fed in the Y-axis direction by the Y-axis feed means, and the cutting process is repeated until all of the predetermined areas to be cut are cut. Also, the chuck table 12 is rotated 90 degrees, and the cutting process and indexing are repeated until all of the predetermined areas that are perpendicular to the predetermined areas that were previously cut are cut.

[0028] After the cutting process, a cleaning process is performed to clean the wafer W. In the cleaning process, first, cleaning water is sprayed from the water curtain nozzle 16 to generate a water curtain, and air is sprayed from the air curtain nozzle 18 to generate an air curtain. Next, the X-axis feed means moves the chuck table 12 from below the cutting means 14 to the transfer position. As a result, the chuck table 12 holding the wafer W passes through the water curtain, and the top surface of the wafer W is simply cleaned by the cleaning water in the water curtain. Furthermore, the chuck table 12 holding the wafer W passes through the water curtain and then the air curtain. As a result, the cleaning water is simply removed from the top surface of the wafer W by the air in the air curtain. Then, when the chuck table 12 arrives at the transfer position, the second transport means 52 transports the wafer W to the cleaning means 50, where the wafer W is precisely cleaned by spinner cleaning. After the spinner cleaning, moisture is removed from the wafer W by the cleaning means 50. When the state of the dividing grooves is detected by the detection means 48 during cutting of the wafer W, a water curtain and an air curtain are also used on the surface of the wafer W.

[0029] After the cleaning step is performed, a carry-in step is performed in which the wafer W is carried into the cassette 38. In the carry-in step, first, the wafer W is carried from the cleaning means 50 to the temporary placement table 42 by the first transfer means 46. Then, the wafer W positioned on the temporary placement table 42 is carried into the cassette 38 by the carry-in / out means 44.

[0030] Next, a method for checking whether the angle of the water curtain C generated from the water curtain nozzle 16 toward the chuck table 12 is appropriate will be described with reference to FIGS.

[0031] To check whether the angle of the water curtain C is appropriate, the arcuate surface 6e of the first side wall 6 of the adjustment jig 2 is brought into contact with the water curtain nozzle 16, and the angle of the first side wall 6 is adjusted so that the vertical portion 6a is vertical. Next, as shown in FIG. 7 , cleaning water is sprayed from the nozzle of the water curtain nozzle 16 to generate the water curtain C. The angle of the generated water curtain C is then visually compared with the vertical portion 6a and the first to third curtain inclined portions 6b, 6c, and 6d of the adjustment jig 2 to check whether the angle of the generated water curtain C is appropriate. If the angle of the water curtain C is incorrect, a tool is used to rotate the water curtain nozzle 16 and adjust the position of the nozzle of the water curtain nozzle 16. This allows the angle of the water curtain C to be adjusted to the appropriate angle.

[0032] To check whether the air curtain angle is appropriate, first, mist is generated around the air curtain nozzle 18. To generate the mist, cleaning water can be sprayed from the water curtain nozzle 16, or cutting water can be sprayed from the cutting water supply nozzle 32 of the cutting means 14. Then, using the same method as the method for checking whether the angle of the water curtain C is appropriate, the angle of the air curtain is visually confirmed. Specifically, the arcuate surface 6e is brought into contact with the air curtain nozzle 18, and the angle of the first side wall 6 is adjusted so that the vertical portion 6a is vertical. Next, high-pressure air is sprayed from the nozzle of the air curtain nozzle 18 to generate an air curtain. The angle of the generated air curtain is then visually compared with the vertical portion 6a and the first to third curtain inclined portions 6b, 6c, and 6d of the adjustment jig 2 to confirm whether the angle of the generated air curtain is appropriate. Generally, it is difficult to visually observe an air curtain, but the air curtain can be visualized by generating mist around air curtain nozzle 18, so the angle of the air curtain can be confirmed visually. If the angle of the air curtain is incorrect, a tool can be used to rotate air curtain nozzle 18 and adjust the position of the nozzle of air curtain nozzle 18. This allows the angle of the air curtain to be adjusted to the correct angle.

[0033] In the adjusting jig 2 of this embodiment, even when the angle of the water curtain C or the angle of the air curtain is adjusted to be vertical, the arcuate surface 6e of the adjusting jig 2 does not interfere with the spraying of cleaning water from the nozzle of the water curtain nozzle 16, and does not interfere with the spraying of high-pressure air from the nozzle of the air curtain nozzle 18. In other words, when the arcuate surface 6e is brought into contact with the water curtain nozzle 16 or the air curtain nozzle 18 and the angle of the first side wall 6 is adjusted so that the vertical portion 6a is vertical, the arcuate surface 6e does not block the nozzle positioned directly below the water curtain nozzle 16 or the air curtain nozzle 18. Therefore, the angle of the water curtain C or the angle of the air curtain can be adjusted to be vertical using the adjusting jig 2.

[0034] Furthermore, the adjustment jig 2 of this embodiment can also be used to check whether the Z-axis position (height) of the air nozzle 34 is appropriate. When checking the Z-axis position of the air nozzle 34, as shown in FIG. 5 , the first and second flat portions 4c and 4d are faced upward, and the first flat portion 4c is positioned below the spindle housing 24, and the second flat portion 4d is positioned below the air nozzle 34. Next, as shown in FIG. 6 , the first flat portion 4c is brought into contact with the lower end of the spindle housing 24, and the second flat portion 4d is brought into contact with the lower end of the air nozzle 34. This makes it possible to check whether the Z-axis position of the air nozzle 34 is appropriate. As described above, the difference in level between the first and second flat portions 4c and 4d corresponds to the difference in the appropriate Z-axis position between the lower end of the spindle housing 24 of the cutting device 10 and the lower end of the air nozzle 34. If the position of the air nozzle 34 in the Z-axis direction is incorrect, loosen the screw 36 and adjust the position of the air nozzle 34 in the Z-axis direction to the correct position.

[0035] As described above, the adjusting jig 2 of this embodiment makes it possible to properly adjust the angle of the water curtain C or the angle of the air curtain without relying on the sense of the operator. Therefore, a water curtain or air curtain can be generated according to the type, thickness, rigidity, etc. of the wafer W, thereby stabilizing the processing quality of the wafer W. [Explanation of symbols]

[0036] 2: Adjustment jig 4: Bottom plate 4a: First side 4b: Second side 4c: First flat area 4d: Second flat section 6: First side wall 6a: Vertical part 6b: First curtain slope 6c: Second curtain slope 6d: Third curtain slope 6e: Arc surface 8: Second side wall 10:Cutting equipment 12: Chuck table 14:Cutting means 16: Water curtain nozzle 18: Air curtain nozzle 28: Cutting blade 34: Air nozzle

Claims

1. An adjustment jig for use in a cutting device comprising: a chuck table for holding a wafer; cutting means having a cutting blade for cutting the wafer held on the chuck table; X-axis feed means for feeding the chuck table in an X-axis direction for processing; and Y-axis feed means for indexing and feeding the cutting means in a Y-axis direction perpendicular to the X-axis direction, and including at least one of a water curtain nozzle extending in the Y-axis direction and arranged to straddle the chuck table, for generating a water curtain, and an air curtain nozzle extending in the Y-axis direction and arranged to straddle the chuck table, for generating an air curtain, a curtain tilting unit for checking the angle of a water curtain generated from the water curtain nozzle toward the chuck table or the angle of an air curtain generated from the air curtain nozzle toward the chuck table; An adjustment jig used to check whether the angle of the water curtain or the angle of the air curtain is appropriate, and to adjust the water curtain nozzle or the air curtain nozzle if the angle is incorrect.

2. The cutting means includes an air nozzle for removing water droplets adhering to the cutting blade, 2. The adjustment jig according to claim 1, further comprising an air nozzle adjustment section for checking and adjusting the position of the air nozzle.

3. 2. The adjustment jig according to claim 1, wherein the adjustment jig is made of a resin containing PLA.

Images