Substrate processing system, substrate processing method, and recording medium

Abstract

To provide a technology that enables composite processing including batch processing and single wafer processing, and single wafer processing to be performed in parallel. [Solution] A substrate processing system according to one aspect of the present disclosure includes an input / output section where cassettes containing multiple substrates are loaded and unloaded, a batch processing section that processes lots containing multiple substrates at once, a single-wafer processing section that processes the substrates one by one, a first interface section that distributes the substrates contained in the cassette between the single-wafer processing section and the batch processing section, and a second interface section that transfers the substrates between the batch processing section and the single-wafer processing section, wherein the first interface section includes a first loading section that loads the substrates before and after processing in the single-wafer processing section, a second loading section that loads the substrates before processing in the batch processing section, and a transport device that transports the substrates contained in the cassette to the first loading section and the second loading section, and the first loading section includes a first area that loads the substrates before processing in the single-wafer processing section, and a second area that loads the substrates after processing in the single-wafer processing section.

Description

[Technical Field]

[0001] The present disclosure relates to a substrate processing system, a substrate processing method, and a recording medium. [Background technology]

[0002] The substrate processing system described in Patent Document 1 includes a batch processing unit and a single wafer processing unit. The batch processing unit holds semiconductor wafers that have been rinsed in water. The semiconductor wafers are chemically processed while multiple wafers are placed on a single holder. The transfer unit picks up the semiconductor wafers one by one from the buffer tank and transfers them to the single wafer processing unit. The single wafer processing unit supports each semiconductor wafer transferred by the transfer unit so that its main surface is horizontal and dries the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-064654 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique that allows single-wafer processing and hybrid processing, which includes batch processing and single-wafer processing, to be performed in parallel. [Means for solving the problem]

[0005] A substrate processing system according to one embodiment of the present disclosure includes an input / output section for loading and unloading cassettes containing multiple substrates, a batch processing section for processing lots containing multiple substrates at once, a single-wafer processing section for processing the substrates one by one, a first interface section for distributing the substrates contained in the cassette between the single-wafer processing section and the batch processing section, and a second interface section for transferring the substrates between the batch processing section and the single-wafer processing section, wherein the first interface section includes a first loading section for loading the substrates before and after processing in the single-wafer processing section, a second loading section for loading the substrates before processing in the batch processing section, and a transport device for transporting the substrates contained in the cassette to the first loading section and the second loading section, and the first loading section includes a first area for loading the substrates before processing in the single-wafer processing section, and a second area for loading the substrates after processing in the single-wafer processing section. [Effects of the Invention]

[0006] According to the present disclosure, combined processing including batch processing and single wafer processing and single wafer processing can be performed in parallel. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a plan view showing a substrate processing system according to an embodiment. [Figure 2] FIG. 2 is a flowchart showing a substrate processing method according to the embodiment. [Figure 3] FIG. 3 is a diagram showing the operation of the combined processing of the substrate processing method according to the embodiment. [Figure 4] FIG. 4 is a diagram showing the operation of single wafer processing in the substrate processing method according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In all the accompanying drawings, the same or corresponding reference numerals are used to designate the same or corresponding members or components, and redundant descriptions will be omitted.

[0009] (Substrate processing system) A substrate processing system according to an embodiment will be described with reference to Fig. 1. As shown in Fig. 1, the substrate processing system 1 includes a loading / unloading unit 2, a first interface unit 3, a batch processing unit 4, a second interface unit 5, a single wafer processing unit 6, and a control device 9.

[0010] The loading / unloading section 2 serves as both a loading section and an unloading section, thereby enabling a reduction in size of the substrate processing system 1. The loading / unloading section 2 includes a load port 21, a stocker 22, a loader 23, and a cassette transport device 24.

[0011] The load port 21 is arranged on the negative side of the X-axis direction of the carry-in / out section 2. Multiple (e.g., four) load ports 21 are arranged along the Y-axis direction. However, there is no particular limit to the number of load ports 21. A cassette C is placed on the load port 21. The cassette C contains multiple (e.g., 25) substrates W and is carried in and out of the load port 21. Inside the cassette C, the substrates W are held horizontally and in the vertical direction at a second pitch P2 (P2 = N × P1) that is N times the first pitch P1. N is a natural number of 2 or more, and is 2 in this embodiment, but may be 3 or more.

[0012] A plurality of stockers 22 (for example, four) are arranged along the Y-axis direction in the center of the X-axis direction of the loading / unloading section 2. A plurality of stockers 22 (for example, two) are arranged adjacent to the first interface section 3 along the Y-axis direction on the positive side of the X-axis direction of the loading / unloading section 2. The stockers 22 may be arranged in multiple tiers in the vertical direction. The stockers 22 temporarily store cassettes C containing substrates W before cleaning processing, cassettes C that have been emptied after the substrates W have been removed, etc. The number of stockers 22 is not particularly limited.

[0013] The loader 23 is adjacent to the first interface section 3 and is arranged on the positive side of the loading / unloading section 2 in the X-axis direction. A cassette C is placed on the loader 23. The loader 23 is provided with a lid opening / closing mechanism (not shown) for opening and closing the lid of the cassette C. A plurality of loaders 23 may be provided. The loaders 23 may be arranged in multiple stages in the vertical direction.

[0014] The cassette transfer device 24 is, for example, an articulated transfer robot, and transfers the cassette C between the load port 21, the stocker 22, and the loader 23.

[0015] The first interface section 3 is disposed on the positive side of the X-axis direction of the load / unload section 2. The first interface section 3 transports substrates W between the load / unload section 2, the batch processing section 4, and the single wafer processing section 6. The first interface section 3 has a substrate transfer device 31, a lot formation section 32, and a first delivery table 33.

[0016] The substrate transfer device 31 transports substrates W between a cassette C placed on the loader 23, a lot formation unit 32, and a first delivery table 33. The substrate transfer device 31 distributes the substrates W contained in the cassette C placed on the loader 23 between the first delivery table 33 for transporting them to the single wafer processing unit 6 and the lot formation unit 32 for transporting them to the batch processing unit 4. The substrate transfer device 31 is composed of a multi-axis (e.g., six-axis) arm robot and has a substrate holding arm 31a at its tip. The substrate holding arm 31a has multiple holding claws (not shown) that can hold multiple substrates W (e.g., 25 substrates W). The substrate holding arm 31a can assume any position and posture in three-dimensional space while holding substrates W with the holding claws.

[0017] The lot forming section 32 is disposed on the positive side of the X-axis direction of the first interface section 3. The lot forming section 32 holds a plurality of substrates W at a first pitch P1 and forms a lot L.

[0018] The first transfer table 33 is adjacent to the single wafer processing unit 6 and is disposed on the positive side of the first interface unit 3 in the Y-axis direction. The first transfer table 33 includes a first area for placing substrates W before they are processed in the single wafer processing unit 6, and a second area for placing substrates W after they have been processed in the single wafer processing unit 6. The first and second areas are disposed side by side in the vertical direction. The second area is preferably located vertically above the first area. In this case, contamination of the processed substrates due to foreign matter falling from the unprocessed substrates can be prevented. In the first area, multiple substrates W are placed at a second pitch P2. The first area is configured to be able to hold a first number of substrates W. The first number is, for example, 25. The first number is, for example, the same number as the number of substrates W accommodated in the cassette C. In the second area, multiple substrates W are placed at a second pitch P2. The second area is configured to be able to hold a second number of substrates W. The second number is greater than the first number, for example, 50 or 100. The second number is, for example, the same as the number of substrates W constituting lot L. Lot L is composed of substrates W in multiple cassettes C. In the first area, the first delivery table 33 receives substrates W from the substrate transfer device 31 and temporarily stores them until they are delivered to the single wafer processing unit 6. In the second area, the first delivery table 33 receives substrates W from the fourth transport device 61 and temporarily stores them until they are delivered to the load / unload unit 2.

[0019] The batch processing unit 4 is disposed on the positive side of the first interface unit 3 in the X-axis direction. That is, the load / unload unit 2, the first interface unit 3, and the batch processing unit 4 are disposed in this order from the negative side of the X-axis direction toward the positive side of the X-axis direction. The batch processing unit 4 processes a lot L including a plurality of substrates W (for example, 50 or 100 substrates) arranged at a first pitch P1 at a time. One lot L is made up of substrates W in, for example, M cassettes C. M is a natural number equal to or greater than 2. M may be the same natural number as N, or may be a natural number different from N. The batch processing unit 4 has a chemical liquid tank 41, a rinse liquid tank 42, a first transport device 43, a processing tool 44, and a drive device 45.

[0020] The chemical liquid tank 41 and the rinse liquid tank 42 are arranged along the X-axis direction. For example, the chemical liquid tank 41 and the rinse liquid tank 42 are lined up in this order from the positive side of the X-axis direction to the negative side of the X-axis direction. The chemical liquid tank 41 and the rinse liquid tank 42 are also collectively referred to as a processing tank. The number of chemical liquid tanks 41 and rinse liquid tanks 42 is not limited to that shown in FIG. 1. For example, although one set of chemical liquid tank 41 and rinse liquid tank 42 is shown in FIG. 1, multiple sets may be provided.

[0021] The chemical tank 41 stores a chemical in which the lot L is immersed. The chemical is, for example, a phosphoric acid aqueous solution (H3PO4). The phosphoric acid aqueous solution selectively etches and removes the silicon nitride film from the silicon oxide film and the silicon nitride film. The chemical is not limited to a phosphoric acid aqueous solution. For example, DHF (dilute hydrofluoric acid), BHF (a mixture of hydrofluoric acid and ammonium fluoride), dilute sulfuric acid, SPM (a mixture of sulfuric acid, hydrogen peroxide, and water), SC1 (a mixture of ammonia, hydrogen peroxide, and water), SC2 (a mixture of hydrochloric acid, hydrogen peroxide, and water), TMAH (a mixture of tetramethylammonium hydroxide and water), a plating solution, or the like may be used. The chemical may be used for a stripping process or a plating process. The number of chemicals is not particularly limited, and multiple chemicals may be used.

[0022] The rinse liquid tank 42 stores a first rinse liquid in which the lot L is immersed. The first rinse liquid is pure water that removes chemicals from the substrate W, and is, for example, DIW (deionized water).

[0023] The first transfer device 43 has a guide rail 43a and a first transfer arm 43b. The guide rail 43a is disposed on the Y-axis negative side of the processing tank. The guide rail 43a extends horizontally (in the X-axis direction) from the first interface unit 3 to the batch processing unit 4. The first transfer arm 43b moves horizontally (in the X-axis direction) along the guide rail 43a. The first transfer arm 43b may move vertically or may rotate about a vertical axis. The first transfer arm 43b transfers lots L in a batch between the first interface unit 3 and the batch processing unit 4.

[0024] The processing tool 44 receives and holds the lot L from the first transport arm 43b. The processing tool 44 holds the plurality of substrates W at a first pitch P1 in the Y-axis direction, and holds each of the plurality of substrates W vertically.

[0025] The driving device 45 moves the processing tool 44 in the X-axis direction and the Z-axis direction. The processing tool 44 immerses the lot L in the chemical liquid stored in the chemical liquid tank 41, then immerses the lot L in the first rinse liquid stored in the rinse liquid tank 42, and then transfers the lot L to the first transfer device 43.

[0026] Although the number of units including the processing tool 44 and the driving device 45 is one in this embodiment, there may be more than one. In the latter case, one unit immerses the lot L in the chemical liquid stored in the chemical liquid tank 41, and another unit immerses the lot L in the first rinse liquid stored in the rinse liquid tank 42. In this case, the driving device 45 only needs to move the processing tool 44 in the Z-axis direction, and does not need to move the processing tool 44 in the X-axis direction.

[0027] The second interface unit 5 is disposed on the positive side of the batch processing unit 4 in the Y-axis direction. The second interface unit 5 transports substrates W between the batch processing unit 4 and the single wafer processing unit 6. The second interface unit 5 has an immersion tank 51, a second transport device 52, a third transport device 53, and a second delivery table 54.

[0028] The immersion tank 51 is disposed outside the movement range of the first transport arm 43b. For example, the immersion tank 51 is disposed at a position offset toward the positive side of the Y-axis direction relative to the processing tank. The immersion tank 51 stores a second rinse liquid in which the lot L is immersed. The second rinse liquid is, for example, DIW (deionized water). The substrate W is held in the second rinse liquid until it is lifted up from the second rinse liquid by the third transport device 53. Because the substrate W is located below the liquid surface of the second rinse liquid, the surface tension of the second rinse liquid does not act on the substrate W, preventing the concave-convex pattern of the substrate W from collapsing.

[0029] The second transfer device 52 has a Y-axis driving device 52a, a Z-axis driving device 52b, and a second transfer arm 52c.

[0030] The Y-axis drive device 52a is disposed on the positive side of the X-axis direction of the second interface unit 5. The Y-axis drive device 52a extends horizontally (in the Y-axis direction) from the second interface unit 5 to the batch processing unit 4. The Y-axis drive device 52a moves the Z-axis drive device 52b and the second transfer arm 52c in the Y-axis direction. The Y-axis drive device 52a may include a ball screw.

[0031] The Z-axis driving device 52b is movably attached to the Y-axis driving device 52a. The Z-axis driving device 52b moves the second transfer arm 52c in the Z-axis direction. The Z-axis driving device 52b may include a ball screw.

[0032] The second transfer arm 52c is movably attached to the Z-axis driver 52b. The second transfer arm 52c receives and holds the lot L from the first transfer arm 43b. The second transfer arm 52c holds multiple substrates W in the Y-axis direction at a first pitch P1, and holds each of the multiple substrates W in the vertical direction. The second transfer arm 52c is moved in the Y-axis direction and the Z-axis direction by the Y-axis driver 52a and the Z-axis driver 52b. The second transfer arm 52c is configured to be movable between multiple positions including a delivery position, an immersion position, and a standby position.

[0033] The transfer position is a position where the first transfer arm 43b and the second transfer arm 52c transfer the lot L. The transfer position is on the negative side in the Y axis direction and the positive side in the Z axis direction.

[0034] The immersion position is a position where the lot L is immersed in the immersion tank 51. The immersion position is a position on the positive side in the Y axis direction and on the negative side in the Z axis direction relative to the delivery position.

[0035] The standby position is a position where the second transport arm 52c waits when the lot L is not being transferred or immersed in the immersion tank 51. The standby position is directly below the transfer position (negative side in the Z axis direction) and does not interfere with the movement of the first transport arm 43b. In this case, the second transport arm 52c can move to the transfer position simply by moving upward (positive side in the Z axis direction), thereby improving throughput. The standby position may be the same position as the immersion position. In this case, particles that may be generated by the operation of the first transport device 43 can be prevented from adhering to the second transport arm 52c. The standby position may be a position directly above the immersion position (positive side in the Z axis direction). In this way, by setting the standby position at a position different from the transfer position, contact between the first transport arm 43b and the second transport arm 52c can be prevented.

[0036] The second transfer device 52 moves the second transfer arm 52c to the immersion position or the standby position while the first transfer device 43 is operating, thereby preventing contact between the first transfer arm 43b and the second transfer arm 52c.

[0037] The third transfer device 53 is a multi-axis (e.g., six-axis) arm robot having a third transfer arm 53a at its tip. The third transfer arm 53a has holding claws (not shown) capable of holding one substrate W. The third transfer arm 53a can assume any position and posture in three-dimensional space while holding the substrate W with the holding claws. The third transfer device 53 transfers the substrate W between the second transfer arm 52c, which is in the immersion position, and the second transfer table 54. At this time, the immersion tank 51 is positioned outside the movement range of the first transfer arm 43b, so the first transfer arm 43b and the third transfer arm 53a do not interfere with each other. This allows one of the first transfer device 43 and the third transfer device 53 to operate independently, regardless of the operating state of the other. Therefore, the first transfer device 43 and the third transfer device 53 can be operated at any timing, thereby shortening the time required to transport the substrate W. As a result, the productivity of the substrate processing system 1 is improved.

[0038] The second delivery stage 54 is adjacent to the single wafer processing unit 6 and is arranged on the negative side of the second interface unit 5 in the X-axis direction. The second delivery stage 54 receives the substrate W from the third transfer device 53 and temporarily stores it until it is transferred to the single wafer processing unit 6. That is, the substrate W taken out of the immersion bath 51 is placed on the second delivery stage 54. It is preferable that the surface of the substrate W placed on the second delivery stage 54 is wet with, for example, the second rinse liquid. In this case, the surface tension of the second rinse liquid does not act on the substrate W, and collapse of the concave-convex pattern of the substrate W can be suppressed. A plurality of substrates W (for example, two) are placed on the second delivery stage 54.

[0039] The single wafer processing unit 6 is disposed on the negative side of the second interface unit 5 in the X-axis direction and on the positive side of the load / unload unit 2, the first interface unit 3, and the batch processing unit 4 in the Y-axis direction. The single wafer processing unit 6 processes substrates W one by one. The single wafer processing unit 6 has a fourth transfer device 61, a liquid processing device 62, and a drying device 63.

[0040] The fourth transfer device 61 has a guide rail 61a and a fourth transfer arm 61b. The guide rail 61a is arranged on the Y-axis negative side of the single wafer processing unit 6. The guide rail 61a extends horizontally (in the X-axis direction) in the single wafer processing unit 6. The fourth transfer arm 61b moves horizontally (in the X-axis direction) and vertically along the guide rail 61a and rotates about a vertical axis. The fourth transfer arm 61b transfers substrates W between the second transfer table 54, the liquid processing device 62, the drying device 63, and the first transfer table 33. The number of fourth transfer arms 61b may be one or more. In the latter case, the fourth transfer device 61 transfers multiple substrates W (for example, five) at a time.

[0041] The liquid processing device 62 is disposed on the positive side of the X-axis direction and the positive side of the Y-axis direction of the single wafer processing device 6. The liquid processing device 62 is a single wafer processing device, and processes substrates W one by one with a processing liquid. The liquid processing device 62 is disposed in multiple stages (for example, three stages) in the vertical direction (Z-axis direction). This allows multiple substrates W to be processed simultaneously with the processing liquid. There may be multiple processing liquids, and for example, pure water such as DIW and a drying liquid having a surface tension lower than that of pure water. The drying liquid may be, for example, alcohol such as IPA (isopropyl alcohol).

[0042] The drying device 63 is disposed adjacent to the liquid processing device 62 on the negative side in the X-axis direction. In this case, the end face of the single wafer processing device 6 on the positive side in the Y-axis direction can be disposed flush or approximately flush with the end face of the second interface unit 5 on the positive side in the Y-axis direction. This results in almost no dead space, thereby reducing the footprint of the substrate processing system 1. In contrast, if the drying device 63 is disposed adjacent to the liquid processing device 62 on the positive side in the Y-axis direction, the end face of the single wafer processing device 6 on the positive side in the Y-axis direction protrudes beyond the end face of the second interface unit 5 on the positive side in the Y-axis direction, which may result in dead space. The drying device 63 is a single wafer processing device and dries each substrate W one by one with a supercritical fluid. The drying devices 63 are disposed in multiple stages (e.g., three stages) in the vertical direction. This allows multiple substrates W to be dried simultaneously.

[0043] Both the liquid processing apparatus 62 and the drying apparatus 63 do not have to be of the single wafer type; the liquid processing apparatus 62 may be of the single wafer type and the drying apparatus 63 of the batch type. The drying apparatus 63 may dry a plurality of substrates W all at once using a supercritical fluid. The number of substrates W processed all at once in the drying apparatus 63 may be equal to or greater than the number of substrates W processed all at once in the liquid processing apparatus 62, but may also be less. Apparatus other than the liquid processing apparatus 62 and the drying apparatus 63 may be arranged in the single wafer processing apparatus 6.

[0044] The control device 9 is, for example, a computer, and includes a CPU (Central Processing Unit) 91 and a recording medium 92 such as a memory. The recording medium 92 stores programs that control various processes executed in the substrate processing system 1. The control device 9 controls the operation of the substrate processing system 1 by causing the CPU 91 to execute the programs stored in the recording medium 92. The control device 9 includes an input interface 93 and an output interface 94. The control device 9 receives signals from the outside via the input interface 93 and transmits signals to the outside via the output interface 94.

[0045] The above program is stored in, for example, a computer-readable recording medium and installed from that recording medium into the recording medium 92 of the control device 9. Examples of computer-readable recording media include hard disks (HDs), flexible disks (FDs), compact disks (CDs), magnet optical disks (MOs), and memory cards. The program may also be downloaded from a server via the Internet and installed into the recording medium 92 of the control device 9.

[0046] The control device 9 is configured to control the substrate transfer device 31 to transport the multiple substrates W stored in the cassette C to either the first delivery table 33 or the lot formation unit 32, based on information associated with the cassette C loaded into the load / unload unit 2. The information may include the substrate type. For example, when the substrate type is a product substrate, the control device 9 controls the substrate transfer device 31 to transport the substrates W stored in the cassette C to the lot formation unit 32. For example, when the substrate type is a dummy substrate, the control device 9 controls the substrate transfer device 31 to transport the substrates W stored in the cassette C to the first delivery table 33.

[0047] The substrate processing system according to the embodiment described above includes a load / unload section 2, a first interface section 3, a batch processing section 4, a second interface section 5, and a single wafer processing section 6. The first interface section 3 is configured to distribute substrates W accommodated in cassettes C in the load / unload section 2 between the single wafer processing section 6 and the batch processing section 4. The substrates W distributed to the single wafer processing section 6 undergo single wafer processing in the single wafer processing section 6. The substrates W allocated to the batch processing section 4 undergo batch processing in the batch processing section 4. The second interface section 5 transports the substrates W that have undergone batch processing to the single wafer processing section 6. The substrates W transported to the single wafer processing section 6 undergo single wafer processing in the single wafer processing section 6. In this way, combined processing including batch processing and single wafer processing, and single wafer processing that does not go through the batch processing section 4 can be performed in parallel on the substrates W accommodated in cassettes C in the load / unload section 2.

[0048] (Operation of the substrate processing system) 2 to 4, the operation of the substrate processing system 1 according to the embodiment, that is, the substrate processing method, will be described. The processing shown in FIG.

[0049] First, a cassette C containing a plurality of substrates W is loaded into the load / unload section 2 and placed on the load port 21. Inside the cassette C, the substrates W are held horizontally and vertically at a second pitch P2 (P2 = N × P1). N is a natural number of 2 or more, and is 2 in this embodiment, but may be 3 or more.

[0050] Next, the cassette transport device 24 transports the cassette C from the load port 21 to the loader 23 (arrow F1 in FIG. 3, arrow G1 in FIG. 4). When the cassette C is transported to the loader 23, the lid of the cassette C is opened by the lid opening / closing mechanism.

[0051] Next, the control device 9 controls each part of the substrate processing system 1 so as to perform the process shown in Fig. 2. The control device 9 controls each part of the substrate processing system 1 so as to perform the process shown in Fig. 2 every time a cassette C is placed on the loader 23.

[0052] First, when a cassette C is transported to the loader 23, the control device 9 determines whether to perform combined processing or single-substrate processing on the multiple substrates W contained in the cassette C based on the information associated with the cassette C (S101 in Figure 2).

[0053] 2, if it is determined that composite processing is to be performed, the control device 9 controls each part of the substrate processing system 1 to transport the substrates W stored in the cassette C to the batch processing unit 4 (S102 in FIG. 2). Specifically, the substrate transfer device 31 receives the substrates W stored in the cassette C and transports them to the lot formation unit 32 (arrow F2 in FIG. 3). Next, the lot formation unit 32 holds multiple substrates W at a first pitch P1 (P1 = P2 / N) to form a lot L. One lot L is made up of, for example, M substrates W stored in cassettes C. Since the pitch of the substrates W narrows from the second pitch P2 to the first pitch P1, the number of substrates W to be processed at one time can be increased. Next, the first transport device 43 receives the lot L from the lot formation unit 32 and transports it to the processing tool 44 (arrow F3 in FIG. 3).

[0054] Next, the processing tool 44 descends from above the chemical liquid tank 41, immerses the lot L in the chemical liquid, and performs chemical processing (S103 in FIG. 2). Thereafter, the processing tool 44 rises to lift the lot L out of the chemical liquid, and then moves horizontally (to the negative side in the X-axis direction) toward above the rinse liquid tank 42 (arrow F4 in FIG. 3).

[0055] Next, the processing tool 44 descends from above the rinse liquid tank 42, immerses the lot L in the first rinse liquid, and performs rinse liquid processing (S103 in FIG. 2). Thereafter, the processing tool 44 ascends to lift the lot L out of the first rinse liquid. Next, the first transfer device 43 receives the lot L from the processing tool 44 and transfers it to the second transfer device 52.

[0056] Next, the second transfer arm 52c of the second transfer device 52 moves horizontally (positive side in the Y-axis direction) and descends from above the immersion tank 51 to immerse the lot L in the second rinse liquid (S104 in FIG. 2, arrow F5 in FIG. 3). The multiple substrates W in the lot L are held in the second rinse liquid until they are lifted up from the second rinse liquid by the third transfer device 53. Because the substrates W are present below the liquid surface of the second rinse liquid, the surface tension of the second rinse liquid does not act on the substrates W, preventing the concave-convex pattern of the substrates W from collapsing.

[0057] Next, the third transfer device 53 transfers the substrates W of the lot L held by the second transfer arm 52c in the second rinse liquid to the second transfer table 54 (arrow F6 in FIG. 3). The third transfer device 53 transfers the substrates W one by one to the second transfer table 54.

[0058] Next, the fourth transfer device 61 receives the substrate W from the second delivery table 54 and transfers it to the liquid treatment device 62 (arrow F7 in FIG. 3).

[0059] Next, the liquid processing device 62 processes the substrates W one by one with a liquid (S105 in FIG. 2). There may be multiple liquids, for example, pure water such as DIW and a drying liquid having a lower surface tension than pure water. The drying liquid may be, for example, alcohol such as IPA. The liquid processing device 62 supplies the pure water and the drying liquid in this order onto the upper surface of the substrate W to form a liquid film of the drying liquid.

[0060] Next, the fourth transfer device 61 receives the substrate W from the liquid treatment device 62 and holds the substrate W horizontally with the film of drying liquid facing upward. The fourth transfer device 61 transfers the substrate W from the liquid treatment device 62 to the drying device 63 (arrow F8 in FIG. 3).

[0061] Next, the drying device 63 dries the substrates W one by one with a supercritical fluid (S105 in FIG. 2). The drying liquid can be replaced with the supercritical fluid, and collapse of the uneven pattern on the substrate W due to the surface tension of the drying liquid can be suppressed. Since the supercritical fluid requires a pressure-resistant container, single-wafer processing is performed rather than batch processing in order to make the pressure-resistant container smaller.

[0062] In this embodiment, the drying apparatus 63 is of a single-wafer type, but as described above, it may be of a batch type. The batch-type drying apparatus 63 dries multiple substrates W on which a liquid film has been formed all at once with a supercritical fluid. While the single-wafer type drying apparatus 63 has one transport arm for holding the substrates W, the batch-type drying apparatus 63 has multiple transport arms.

[0063] Furthermore, although the drying apparatus 63 of this embodiment dries the substrate W with a supercritical fluid, the drying method is not particularly limited. Any drying method that can prevent the concavo-convex pattern of the substrate W from collapsing may be used, for example, spin drying, scan drying, or water-repellent drying. In spin drying, the substrate W is rotated and the liquid film is shaken off from the substrate W by centrifugal force. In scan drying, the substrate W is rotated while the supply position of the drying liquid is moved from the center of the substrate W toward the periphery of the substrate W, and the liquid film is shaken off from the substrate W by centrifugal force. In scan drying, the supply position of a drying gas such as N2 gas may also be moved from the center of the substrate W toward the periphery of the substrate W to follow the supply position of the drying liquid.

[0064] Next, the fourth transfer device 61 receives the substrate W from the drying device 63 and transfers it to the first delivery table 33 (arrow F9 in FIG. 3).

[0065] Next, the substrate transfer device 31 receives the substrate W from the first delivery table 33 and stores it in the cassette C placed on the loader 23 (S106 in FIG. 2, arrow F10 in FIG. 3).

[0066] Next, the cassette transport device 24 transports the cassette C from the loader 23 to the load port 21 (arrow F11 in FIG. 3). The cassette C transported to the load port 21 is transported from the loader / unloader 2 with multiple substrates W stored therein. The cassette transport device 24 may transport the cassette C from the loader 23 to the stocker 22 and temporarily store it in the stocker 22.

[0067] 2, if it is determined that single wafer processing is to be performed, the control device 9 controls each part of the substrate processing system 1 to transport the substrate W accommodated in the cassette C to the single wafer processing unit 6 (S107 in FIG. 2). Specifically, the substrate transfer device 31 receives the substrate W accommodated in the cassette C and transports it to the first delivery table 33 (arrow G2 in FIG. 4). Next, the fourth transport device 61 receives the substrate W from the first delivery table 33 and transports it to the liquid processing device 62 (arrow G3 in FIG. 4).

[0068] Next, similarly to S105 in FIG. 2, the liquid processing device 62 processes the substrates W one by one with a liquid, and then the drying device 63 dries the substrates W one by one with a supercritical fluid (S108 in FIG. 2, arrow G4 in FIG. 4).

[0069] Next, the fourth transfer device 61 receives the substrate W from the drying device 63 and transfers it to the first delivery table 33 (arrow G5 in FIG. 4).

[0070] Next, the substrate transfer device 31 receives the substrate W from the first delivery table 33 and stores it in the cassette C placed on the loader 23 (S109 in FIG. 2, arrow G6 in FIG. 4).

[0071] Next, the cassette transport device 24 transports the cassette C from the loader 23 to the load port 21 (arrow G7 in FIG. 4). The cassette C transported to the load port 21 is transported from the loader / unloader 2 with multiple substrates W stored therein. The cassette transport device 24 may transport the cassette C from the loader 23 to the stocker 22 and temporarily store it in the stocker 22.

[0072] In the substrate processing method according to the embodiment described above, when a first cassette that is the target of composite processing is transported to the loader 23, the first interface unit 3 distributes the substrates W contained in the first cassette to the batch processing unit 4.

[0073] The substrates W allocated to the batch processing section 4 undergo batch processing in the batch processing section 4. The second interface section 5 transports the substrates W that have undergone batch processing to the single wafer processing section 6. The substrates W transported to the single wafer processing section 6 undergo single wafer processing in the single wafer processing section 6. The transported substrates W undergo batch processing in the batch processing section 4. In this way, the substrates W allocated to the batch processing section 4 undergo combined processing including batch processing and single wafer processing, and are then returned to the cassette C in the loader 23.

[0074] When the second cassette, which is the target of single-wafer processing, is transported to the loader 23 while the composite processing is being performed on the substrates W removed from the first cassette, the first interface unit 3 distributes the substrates W contained in the second cassette to the single-wafer processing unit 6. The substrates W distributed to the single-wafer processing unit 6 are subjected to single-wafer processing in the single-wafer processing unit 6.

[0075] As described above, according to the substrate processing method of this embodiment, combined processing including batch processing and single wafer processing, and single wafer processing that does not go through the batch processing unit 4 can be performed in parallel.

[0076] The first cassette to be subjected to the combined processing is, for example, a cassette containing product substrates. The second cassette to be subjected to the single-wafer processing is, for example, a cassette containing dummy substrates. In this case, the combined processing on the product substrates and dummy processing using dummy substrates in the single-wafer processing unit 6 can be performed in parallel. Dummy processing can be performed, for example, by passing a large number of dummy substrates through a drying unit 63 to increase the cleanliness of the drying unit 63 after parts replacement or the like is performed on at least one of the drying units 63 arranged in multiple stages. Unlike product substrates, dummy substrates do not require batch processing (e.g., chemical processing). By transporting the dummy substrates to the single-wafer processing unit 6 without passing through the batch processing unit 4, unnecessary transport can be eliminated and the time required for dummy processing can be shortened. The first cassette may contain first product substrates to be subjected to the combined processing, and the second cassette may contain second product substrates to be subjected to only single-wafer processing.

[0077] The second cassette that is the target of single-wafer processing may be a cassette that stores product substrates. In this case, combined processing on the product substrates and single-wafer processing on the product substrates can be performed in parallel. The first cassette that is the target of combined processing may be a cassette that stores dummy substrates. In this way, the types of substrates stored in the first and second cassettes are not limited. Similarly, combined processing and single-wafer processing can be performed in parallel for three or more cassettes C.

[0078] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive, and the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0079] 1. Substrate Processing System 2 Loading and unloading area 3. First Interface Section 31 Substrate transfer device 32 Lot Formation Department 33 First Delivery Platform 4 Batch Processing Unit 5 Second interface section 6 Single wafer processing section C Cassette L Lot W substrate

Claims

1. a loading / unloading section into which a cassette containing a plurality of substrates is loaded and unloaded; a batch processing unit that processes a lot including a plurality of the substrates at once; a single-substrate processing section for processing the substrates one by one; a first interface unit that distributes the substrates accommodated in the cassette between the single substrate processing unit and the batch processing unit; a second interface unit that transfers the substrate between the batch processing unit and the single wafer processing unit; and The first interface unit a first mounting part on which the substrate is mounted before or after being processed in the single wafer processing part; a second mounting part on which the substrate is mounted before being processed in the batch processing part; a transport device that transports the substrates accommodated in the cassette to the first and second mounting parts; Including, The first placement section is a first area for placing the substrate before processing in the single wafer processing section; a second area for placing the substrate after processing in the single wafer processing section; Including, Substrate processing system.

2. the first interface unit is disposed adjacent to the single wafer processing unit and the batch processing unit, the first mounting unit is disposed adjacent to the single wafer processing unit; The substrate processing system of claim 1 .

3. the first area is capable of mounting a first number of the substrates; the second area is capable of mounting a second number of the substrates; The second number is greater than the first number. The substrate processing system according to claim 1 or 2.

4. The second region is provided vertically above the first region. The substrate processing system according to claim 1 .

5. A control device is provided. the control device is configured to control the transport device to transport the plurality of substrates accommodated in the cassette to either the first mounting part or the second mounting part, based on information associated with the cassette to be loaded into the loading / unloading part. The substrate processing system according to claim 1 .

6. A substrate processing method in a substrate processing system having a loading / unloading section into which a cassette containing a plurality of substrates is loaded and unloaded, a batch processing section that processes a lot including the plurality of substrates at once, a single wafer processing section that processes the substrates one by one, and a first interface section that distributes the substrates contained in the cassette between the single wafer processing section and the batch processing section, The first interface unit a first mounting part on which the substrate is mounted before or after being processed in the single wafer processing part; a second mounting part on which the substrate is mounted before being processed in the batch processing part; a transport device that transports the substrates accommodated in the cassette to the first and second mounting parts; Including, The first placement section is a first area for placing the substrate before processing in the single wafer processing section; a second area for placing the substrate after processing in the single wafer processing section; Including, (a) transporting the substrates accommodated in the cassette to the single wafer processing section without passing through the batch processing section, and returning the substrates to the cassette after processing the substrates in the single wafer processing section; (b) transporting the lot containing the plurality of substrates accommodated in the cassette to the batch processing unit and processing the lot collectively in the batch processing unit; (c) transporting the lot processed in the batch processing unit from the batch processing unit to the single wafer processing unit, and returning the substrate to the cassette after processing the substrate in the single wafer processing unit; having Substrate processing method.

7. the first interface unit is disposed adjacent to the single wafer processing unit and the batch processing unit, the first mounting unit is disposed adjacent to the single wafer processing unit; The substrate processing method according to claim 6 .

8. (a) and (b) and (c) are carried out in parallel; The substrate processing method according to claim 6 or 7.

9. 9. A computer-readable recording medium storing a program for causing a computer to execute the substrate processing method according to claim 6.

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