Photoelectric mixed galvanizing system

Abstract

The present invention provides an optoelectronic mixed-signal device capable of interconnecting multiple wiring boards equipped with integrated circuits with low loss. [Solution] This photoelectric mixed-signal device comprises a first wiring board, a plurality of second wiring boards, each equipped with an integrated circuit, and one or more optical waveguide boards, wherein each of the second wiring boards and the optical waveguide boards is arranged at different positions on the upper surface of the first wiring board in a plan view, and each of the second wiring boards is optically connected to one of the optical waveguide boards.

Description

Technical Field

[0001] The present invention relates to an optoelectronic hybrid device.

Background Art

[0002] In the field of information technology represented by the Internet, optical communication systems, etc., with the increase in communication speed, the use of optical signals instead of electrical signals has been carried out. In such fields, it is necessary to convert optical signals into electrical signals and vice versa, and it is also necessary to interconnect signals between substrates. Therefore, various optical connection structures have been proposed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present invention is to provide an optoelectronic hybrid device capable of interconnecting a plurality of wiring boards on which integrated circuits are mounted with low loss.

Means for Solving the Problems

[0005] The present optoelectronic hybrid device includes a first wiring board, a plurality of second wiring boards each having an integrated circuit, and one or more optical waveguide boards. Each of the second wiring boards and the optical waveguide boards is disposed at a different position on the upper surface of the first wiring board in a plan view, and each of the second wiring boards is optically connected to one of the optical waveguide boards.

Effects of the Invention

[0006] According to the disclosed technology, it is possible to provide an optoelectronic hybrid device capable of interconnecting a plurality of wiring boards on which integrated circuits are mounted with low loss. [Brief explanation of the drawing]

[0007] [Figure 1] This is a perspective view illustrating a photoelectric mixed-signal device according to this embodiment. [Figure 2] This is a cross-sectional view illustrating a photoelectric mixed-signal device according to this embodiment. [Figure 3] This is a perspective view showing an example of connecting two photoelectric mixed-signal devices. [Modes for carrying out the invention]

[0008] The embodiments for carrying out the invention will be described below with reference to the drawings. In each drawing, the same reference numerals are used for identical components, and redundant explanations may be omitted.

[0009] Figure 1 is a perspective view illustrating an optical-electric combined galvanizing apparatus according to this embodiment. Figure 2 is a cross-sectional view illustrating an optical-electric combined galvanizing apparatus according to this embodiment.

[0010] Referring to Figures 1 and 2, the photoelectric mixed-signal device 1 has a first wiring board 10, eight second wiring boards 20, and one optical waveguide board 30. The number of second wiring boards 20 and optical waveguide boards 30 is not limited to the examples in Figures 1 and 2; the photoelectric mixed-signal device 1 may have multiple second wiring boards 20 and one or more optical waveguide boards 30 on the first wiring board 10. A minimum of two second wiring boards 20 is sufficient.

[0011] The first wiring board 10 is, for example, a rectangle in plan view. The first wiring board 10 can be, for example, a square or rectangle with sides of about 200 mm to 400 mm in plan view. The first wiring board 10 is larger in size than the second wiring board 20 and the optical waveguide board 30 in plan view. The first wiring board 10 is, for example, a substrate on which wiring made of copper or the like is formed on a resin substrate such as a glass epoxy substrate. The first wiring board 10 may also be a multilayer wiring board. The first wiring board 10 is, for example, a motherboard.

[0012] Each second wiring board 20 is, for example, rectangular in plan view. Each second wiring board 20 is, for example, a resin substrate such as a glass epoxy substrate on which wiring made of copper or the like is formed. Each second wiring board 20 may be a glass substrate or a ceramic substrate. Each second wiring board 20 may be a multilayer wiring board. Each second wiring board 20 is electrically connected to the first wiring board 10 via bumps or the like.

[0013] Each second wiring board 20 comprises one or more integrated circuits 21. The integrated circuits 21 are, for example, flip-chip mounted on wiring located on the upper surface of the second wiring board 20. Each second wiring board 20 may include, for example, an ASIC (Application Specific Integrated Circuit) or memory as the integrated circuits 21. In the illustrated example, each second wiring board 20 includes, but is not limited to, four ASICs and two memory modules electrically connected to each ASIC.

[0014] Each second wiring board 20 is equipped with a Photonic Integrated Circuit (PIC). The Photonic Integrated Circuit 22 may, for example, be embedded in the second wiring board 20, or it may be flip-chip mounted on wiring arranged on the upper surface of the second wiring board 20. The Photonic Integrated Circuit 22 is, for example, equipped with optical waveguides, light-emitting elements, light-receiving elements, etc., on a substrate such as silicon. The Photonic Integrated Circuit 22 is sometimes referred to as silicon photonics. The Photonic Integrated Circuit 22 has the function of converting between electrical signals and optical signals. The Photonic Integrated Circuit 22 is electrically connected to one or more integrated circuits 21.

[0015] The optical waveguide substrate 30 is, for example, rectangular in plan view. The optical waveguide substrate 30 comprises a substrate and an optical waveguide formed on the substrate. No integrated circuits or optical integrated circuits are mounted on the optical waveguide substrate 30. The optical waveguide may be, for example, embedded in the substrate constituting the optical waveguide substrate 30, or it may be arranged on the upper surface of the substrate. Examples of substrates include silicon, glass, and resin. Examples of optical waveguides include silicon nitride optical waveguides, glass optical waveguides, silicon optical waveguides, and polymer optical waveguides. Among these, the optical waveguide substrate 30 preferably comprises a silicon nitride optical waveguide, which has low optical loss.

[0016] Each second wiring board 20 and optical waveguide board 30 is positioned at different locations on the upper surface of the first wiring board 10 in a plan view. Each second wiring board 20 and optical waveguide board 30 does not overlap with each other in a plan view. Each second wiring board 20 and optical waveguide board 30 is, for example, a rectangle of the same size in a plan view. In this case, each second wiring board 20 and optical waveguide board 30 can be arranged in a matrix on the upper surface of the first wiring board 10 in a plan view. This allows each second wiring board 20 and optical waveguide board 30 to be efficiently arranged on the upper surface of the first wiring board 10, thereby shortening the connection path between each second wiring board 20 and optical waveguide board 30. In the illustrated example, each second wiring board 20 and optical waveguide board 30 is arranged in a 3x3 matrix on the upper surface of the first wiring board 10 in a plan view.

[0017] Each second wiring board 20 is optically connected to the optical waveguide board 30. Specifically, the optical integrated circuit 22 mounted on each second wiring board 20 is electrically connected to the integrated circuit 21 mounted on the same second wiring board 20, and is optically connected to the optical waveguide of the optical waveguide board 30. In other words, the optical integrated circuit 22 converts electrical signals from the integrated circuit 21 into optical signals and sends them to the optical waveguide of the optical waveguide board 30. Also, the optical integrated circuit 22 converts optical signals from the optical waveguide of the optical waveguide board 30 into electrical signals and sends them to the integrated circuit 21.

[0018] In the case where the optoelectronic hybrid device 1 has a plurality of optical waveguide substrates 30, each second wiring substrate 20 is optically connected to any one of the optical waveguide substrates. One second wiring substrate 20 may be optically connected to a plurality of optical waveguide substrates 30.

[0019] The optical waveguide of the optical waveguide substrate 30 and the optical integrated circuit 22 of the second wiring substrate 20 can be optically connected via an optical connection member 40. The optical connection member 40 can include, for example, a grating coupler 41 and a fiber array 42. The optical connection member 40 may include an edge coupler instead of the grating coupler 41, for example. The optical waveguide of the optical waveguide substrate 30 and the optical integrated circuit 22 of the second wiring substrate 20 may be optically connected without passing through the optical connection member 40. Also, a portion where the optical waveguide of the optical waveguide substrate 30 and the optical integrated circuit 22 of the second wiring substrate 20 are optically connected via the optical connection member 40 and a portion where they are optically connected without passing through the optical connection member 40 may coexist. Further, the optical waveguide of the optical waveguide substrate 30 and the optical integrated circuit 22 of the second wiring substrate 20 can be optically connected, for example, by adiabatic coupling. In this case, the fiber array 42 does not need to be used. Thus, there are various methods for optically connecting the optical waveguide of the optical waveguide substrate 30 and the optical integrated circuit 22 of the second wiring substrate 20. Among these, it is preferable to optically connect via an edge coupler with less optical loss.

[0020] When the optoelectronic hybrid device 1 has one optical waveguide substrate 30, each second wiring substrate 20 is preferably arranged radially around the optical waveguide substrate 30 in a plan view. With such an arrangement, it becomes possible to shorten the connection path between each second wiring substrate 20 and the optical waveguide substrate 30, and they can be interconnected with low loss.

[0021] FIG. 3 is a perspective view showing an example of connecting optoelectronic hybrid devices to each other. As shown in FIGS. 1 and 3, in the optoelectronic hybrid device 1, the optical waveguide substrate 30 has an input / output portion 35 for optically connecting the optoelectronic hybrid device 1 to the outside. The input / output portion 35 can include, for example, a grating coupler 36 and a fiber array 37. An edge coupler may be used instead of the grating coupler 36. The edge coupler is preferable in that it has less optical loss than the grating coupler. As shown in FIG. 3, the input / output portion 35 may be used for connecting the optoelectronic hybrid devices 1 to each other, or for connecting the optoelectronic hybrid device 1 to another substrate.

[0022] Thus, in the optoelectronic hybrid device 1, one or more optical waveguide substrates 30 are provided for the purpose of relaying the second wiring substrate 20, and each second wiring substrate 20 is optically connected to one of the optical waveguide substrates 30. For example, if the optical waveguide substrates 30 are not provided and the second wiring substrates 20 are optically connected to each other, it is difficult to make the connection because the fibers become long or the fibers cross each other, and it is also difficult to realize a low-loss optical connection. On the other hand, by relaying the optical signals from each second wiring substrate 20 once with the optical waveguide substrate 30, the optical connection between the second wiring substrates 20 becomes easy and the fibers do not cross each other in a complicated manner, so that the second wiring substrates 20 can be interconnected with low loss.

[0023] Although the preferred embodiments have been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope described in the claims.

Explanation of Reference Numerals

[0024] 1 Optoelectronic hybrid device 10 First wiring substrate 20 Second wiring substrate 21 Integrated circuit 22 Optical integrated circuit 30 Optical waveguide substrate 35 Input / output portion 36, 41 Grating coupler 37,42 Fiber Array 40 Optical connection member

Claims

1. First wiring board and Multiple second wiring boards, each equipped with an integrated circuit, It comprises one or more optical waveguide substrates, Each of the second wiring boards and the optical waveguide board is arranged in a plan view at different positions on the upper surface of the first wiring board. Each of the aforementioned second wiring boards is optically connected to one of the aforementioned optical waveguide boards in an optoelectronic mixed-signal device.

2. Each of the Series 2 wiring boards is equipped with an optical integrated circuit, The aforementioned optical integrated circuit has a function of mutually converting electrical signals and optical signals. The optical integrated circuit is electrically connected to the integrated circuit and optically connected to an optical waveguide of any of the optical waveguide substrates, as described in claim 1.

3. The optical waveguide of the optical waveguide substrate and the optical integrated circuit are optically connected via an edge coupler, as described in claim 2.

4. The photoelectric mixed-loading apparatus according to any one of claims 1 to 3, wherein the optical waveguide substrate comprises a silicon nitride optical waveguide.

5. The optical waveguide substrate has an input / output section for optical connection with the outside, as described in any one of claims 1 to 3.

6. Each of the aforementioned second wiring boards and optical waveguide boards is a rectangle of the same size in a plan view. The photoelectric mixed-loading apparatus according to any one of claims 1 to 3, wherein the first wiring board is arranged in a matrix on its upper surface in a plan view.

7. The photoelectric mixed-signal apparatus according to any one of claims 1 to 3, wherein each of the second wiring boards is arranged radially with respect to the optical waveguide board in a plan view.

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