Semiconductor manufacturing equipment, method for inspecting paste-like adhesives, and method for manufacturing semiconductor devices.

Abstract

The objective is to provide a technology that enables visual inspection at any elapsed time after mass production coating. [Solution] The semiconductor manufacturing apparatus comprises an imaging device for imaging a first paste-like adhesive applied to a coating surface, and a control device for image processing the image data of the first paste-like adhesive captured by the imaging device. The control device is configured to, in a registration operation before mass production, calculate the first shape data from a plurality of reference inspection images of the first paste-like adhesive captured by the imaging device at each time interval after application, and to register the correlation data between the time interval after application and the first shape data through image processing.

Description

Technical Field

[0001] The present disclosure relates to a semiconductor manufacturing apparatus, and is applicable to, for example, a die bonder having a function of applying a paste-like adhesive.

Background Art

[0002] As one step in the manufacturing process of a semiconductor device, a die separated from a wafer is picked up by a semiconductor manufacturing apparatus (for example, a die bonder), and the picked-up die is bonded to a substrate. There may be an appearance inspection to compare an image before mass production and an image by mass production after the application of a resin paste adhesive (hereinafter referred to as a paste-like adhesive) after the same lapse of time, and to check whether the adhesive is applied in a predetermined shape and a predetermined amount at a predetermined position (for example, Japanese Patent Application Laid-Open No. 2021-44466).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technique capable of performing an appearance inspection according to an arbitrary elapsed time after mass production application. Other problems and novel features will become apparent from the description of this specification and the attached drawings.

Means for Solving the Problems

[0005] The outline of a representative one of the present disclosure is briefly described as follows. In other words, the semiconductor manufacturing apparatus comprises an imaging device for imaging a first paste-like adhesive applied to a coating surface, and a control device for image processing the image data of the first paste-like adhesive captured by the imaging device. The control device is configured to, in a registration operation before mass production, calculate the first shape data from a plurality of reference inspection images of the first paste-like adhesive captured by the imaging device at each time interval after application, and to register the correlation data between the time interval after application and the first shape data through image processing. [Effects of the Invention]

[0006] According to this disclosure, it becomes possible to perform visual inspections at any elapsed time after mass production coating. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a schematic top view showing a die bonder in an embodiment. [Figure 2] Figure 2 is a diagram illustrating the schematic configuration as seen from the direction of arrow A in Figure 1. [Figure 3] Figure 3 is a schematic side view showing the preform section shown in Figure 1. [Figure 4] Figure 4 is a block diagram showing the schematic configuration of the die bonder control system shown in Figure 1. [Figure 5] Figure 5 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in Figure 1. [Figure 6] Figure 6(a) shows an image taken immediately after applying a paste-like adhesive to the surface of the substrate, and Figure 6(b) shows an image taken after a predetermined time has elapsed since Figure 6(a). [Figure 7] Figure 7 shows an image of a paste-like adhesive applied to tabs on a substrate in which tabs are arranged in a grid pattern. [Figure 8] Figure 8 is a diagram illustrating the overview of the pre-production registration operation of the embodiment. [Figure 9] Figure 9 is a flowchart illustrating the method for registering correlation data before mass production in the embodiment. [Figure 10] Figure 10 illustrates the correlation between the coating area and the elapsed time after coating, as determined by pre-production images in the embodiment. [Figure 11] Figure 11 is a flowchart illustrating a method for comparative inspection of pre-production and mass-production images in an embodiment. [Figure 12] Figure 12 illustrates a comparison of the coating area in a binarized image taken during mass production and the coating area in a binarized image taken before mass production at the same time interval in the embodiment. [Figure 13] Figure 13 illustrates the shape data in a modified example and shows a binarized image of the applied paste-like adhesive. [Modes for carrying out the invention]

[0008] The embodiments will be described below with reference to the drawings. However, in the following description, the same reference numerals will be used for the same components, and repeated explanations may be omitted. In addition, the drawings may be schematically represented in terms of the width, thickness, shape, etc. of each part, rather than in the actual embodiment, in order to make the explanation clearer, but these are merely examples and do not limit the interpretation of this disclosure.

[0009] The configuration of a die bonder as one embodiment of semiconductor manufacturing equipment will be explained using Figures 1, 2, and 3. Figure 1 is a schematic top view showing the die bonder in the embodiment. Figure 2 is a diagram illustrating the schematic configuration as seen from the direction of arrow A in Figure 1. Figure 3 is a schematic side view showing the preform section shown in Figure 1.

[0010] The die bonder 1 generally includes a wafer supply unit 10, a pickup unit 20, an intermediate stage unit 30, a preform unit 90, a bonding unit 40, a transfer unit 50, a substrate supply unit 60, a substrate unloading unit 70, and a control unit (control device, controller) 80. The Y2 - Y1 direction is the front - rear direction of the die bonder 1, the X2 - X1 direction is the left - right direction, and the Z1 - Z2 direction is the up - down direction. The wafer supply unit 10 is arranged on the front side of the die bonder 1, and the bonding unit 40 is arranged on the rear side.

[0011] The wafer supply unit 10 includes a wafer cassette lifter 11, a wafer holding stage 12, and a peeling unit 13.

[0012] The wafer cassette lifter 11 moves a wafer cassette (not shown) in which a plurality of wafer rings WR are stored up and down to the wafer transfer height. Alignment of the wafer ring WR supplied from the wafer cassette lifter 11 is performed by a wafer correction chute (not shown). A wafer extractor (not shown) takes out the wafer ring WR from the wafer cassette and supplies it to the wafer holding stage 12, or takes it out from the wafer holding stage 12 and stores it in the wafer cassette.

[0013] A wafer W is adhered (stuck) on a dicing tape DT, and the wafer W is divided into a plurality of dies D. The dicing tape DT is held by the wafer ring WR. The wafer W is, for example, a semiconductor wafer or a glass wafer, and the die D is a semiconductor chip, a glass chip, or a MEMS (Micro Electro Mechanical Systems).

[0014] The wafer holding stage 12 is moved in the X1 - X2 direction and the Y1 - Y2 direction by an XY table and a driving unit (not shown), and moves the die D to be picked up to the position of the peeling unit 13. The wafer holding stage 12 rotates the wafer ring WR in the XY plane by a driving unit (not shown). The peeling unit 13 is moved in the Z1 - Z2 direction by a driving unit (not shown). The peeling unit 13 peels the die D from the dicing tape DT.

[0015] The pickup unit 20 includes a pickup head 21, a Y drive unit 23, and a wafer recognition camera 24. The pickup head 21 is provided with a collet 22 that adsorbs and holds the peeled die D at its tip. The pickup head 21 picks up the die D from the wafer supply unit 10 and places it on the intermediate stage 31. The Y drive unit 23 moves the pickup head 21 in the Y1 - Y2 direction. The pickup unit 20 has drive units (not shown) that move the pickup head 21 up and down, rotate it, and move it in the X1 - X2 direction. The wafer recognition camera 24 grasps the pickup position of the die D picked up from the wafer W and performs a surface inspection of the die D.

[0016] The intermediate stage unit 30 includes an intermediate stage 31 on which the die D is placed and a stage recognition camera 34 for recognizing the die D on the intermediate stage 31. The intermediate stage 31 is provided with suction holes (not shown) that adsorb the placed die D. The placed die D is temporarily held on the intermediate stage 31.

[0017] The preform unit 90 includes a preform head 91, a drive unit 93, a preform camera 94 as an imaging device, and a preform stage 96. The preform head 91 is composed of a syringe 92 having a nozzle. The syringe 92 is filled with a resin paste as an adhesive (hereinafter simply referred to as "paste"), and the paste is discharged from the nozzle. The preform head 91 applies the paste to the substrate S that has been transported to the preform stage 96 by the transport unit 50. The drive unit 93 moves the preform head 91 in the X1 - X2 direction, Y1 - Y2 direction, and Z1 - Z2 direction. The substrate S is, for example, a wiring board, a lead frame formed of a metal thin plate, a glass substrate, or the like.

[0018] The preform camera 94 uses the preform head 91 to identify the surface to which the paste should be applied and to determine the application position. The preform stage 96 rises when applying the paste to the substrate S, supporting the substrate S from below. The preform stage 96 has suction holes (not shown) for vacuum adsorption of the substrate S, and can fix the substrate S in place.

[0019] Furthermore, the preform camera 94 and the control unit 80 constitute the inspection apparatus. A preform stage 96 may also be included in the inspection apparatus.

[0020] The bonding unit 40 includes a bond head 41, a Y drive unit 43, a substrate recognition camera 44, and a bond stage 46. The bond head 41 is provided with a collet 42 that adsorbs and holds the die D at its tip. The Y drive unit 43 moves the bond head 41 in the Y1-Y2 direction. The substrate recognition camera 44 captures position recognition marks (not shown) of the package area P of the substrate S and determines the bond position. Here, the substrate S has multiple product areas (hereinafter referred to as package area P) that will ultimately form a single package. Position recognition marks are provided for each package area P. The bond stage 46 is raised when the die D is placed on the substrate S to support the substrate S from below. The bond stage 46 has a suction hole (not shown) for vacuum adsorption of the substrate S, and can fix the substrate S in place. The bond stage 46 has a heating unit (not shown) for heating the substrate S. The bonding unit 40 has drive units (not shown) that move the bond head 41 up and down, rotate, and move it in the X1-X2 direction and Y1-Y2 direction.

[0021] With this configuration, the bond head 41 corrects its pickup position and orientation based on the image data from the stage recognition camera 34 and picks up the die D from the intermediate stage 31. Then, based on the image data from the substrate recognition camera 44, the bond head 41 bonds (places and adheres) the die D onto the package area P on the substrate S that is being transported, where paste has been applied.

[0022] The transport unit 50 includes transport claws 51 that grasp and transport the substrate S, and a pair of transport lanes (chutes) 52 on which the substrate S moves. The substrate S moves in the X1-X2 direction by driving nuts (not shown) of the transport claws 51, which are provided on the transport lanes 52, with ball screws (not shown) provided along the transport lanes 52. With this configuration, the substrate S moves from the substrate supply unit 60 along the transport lanes 52 to the bonding position, and after bonding, moves to the substrate discharge unit 70 and hands over the substrate S to the substrate discharge unit 70.

[0023] The substrate supply unit 60 takes the substrates S that have been stored in a transport jig (not shown) and supplied to the transport unit 50. The substrate discharge unit 70 stores the substrates S that have been transported by the transport unit 50 into a transport jig (not shown).

[0024] The control system of die bonder 1 will be explained using Figure 4. Figure 4 is a block diagram showing the schematic configuration of the die bonder control system shown in Figure 1.

[0025] The control system 8 comprises a control unit 80, a drive unit 86, a signal unit 87, and an optical system 88. The control unit 80 is broadly composed of a control / arithmetic unit 81 mainly consisting of a CPU (Central Processing Unit), a storage device 82, an input / output device 83, a bus line 84, and a power supply unit 85. The storage device 82 has a main memory 82a and an auxiliary storage device 82b. The main memory 82a is composed of RAM (Random Access Memory) that stores processing programs and the like. The auxiliary storage device 82b is composed of an HDD (Hard Disk Drive) or SSD (Solid State Drive) that stores control data and image data necessary for control.

[0026] The input / output device 83 includes a monitor 83a that displays the device status and information of the die bonder 1, a pointing device such as a touch panel 83b for inputting operator instructions and a mouse 83c for operating the monitor 83a, and an image acquisition device 83d for acquiring image data from the optical system 88. The input / output device 83 further includes a motor control device 83e and an I / O signal control device 83f. The motor control device 83e controls the drive units 86, such as the XY table (not shown) of the wafer supply unit 10 and the XYZ drive axes of the bond head table (not shown) of the bonding unit 40. The I / O signal control device 83f acquires signals from the signal unit 87 and controls the signal unit 87. The signal unit 87 includes various sensors, switches and potentiometers for controlling the brightness of lighting devices, etc. The control / arithmetic unit 81 acquires necessary data via the bus line 84, performs calculations, and controls the pickup head 21, etc., and sends information to the monitor 83a, etc.

[0027] The control and calculation unit 81 stores image data captured by the optical system 88 in the storage device 82 via the image acquisition device 83d. The optical system 88 includes a wafer recognition camera 24, a stage recognition camera 34, a substrate recognition camera 44, a preform camera 94, and an illumination device. The cameras used in the optical system 88 quantify light intensity and color. Based on the stored image data, the control and calculation unit 81 uses programmed software to recognize the positions of the die D and substrate S, inspect the paste application pattern, and inspect the surfaces of the die D and substrate S. Based on the calculated positions of the die D and substrate S, the control and calculation unit 81 uses software to move the drive unit 86 via the motor control device 83e. Through this process, the control and calculation unit 81 recognizes the positions of the die D on the wafer holder 12 and the intermediate stage 31, and the positions of the substrate S on the preform stage 96 and the bond stage 46, and uses the drive units of the wafer supply unit 10, the pickup unit 20, and the bonding unit 40 to bond the die D onto the package area P of the substrate S.

[0028] A part of the semiconductor device manufacturing process using die bonder 1 (method of manufacturing a semiconductor device) will be explained with reference to Figure 5. Figure 5 is a flowchart of the method of manufacturing a semiconductor device using die bonder shown in Figure 1. In the following explanation, the operation of each part constituting die bonder 1 is controlled by control unit 80.

[0029] (Wafer loading process: Process S1) A wafer cassette containing wafer rings WR is loaded into the wafer cassette lifter 11. The wafer rings WR are then supplied (transported) from the loaded wafer cassette to the wafer holder 12.

[0030] (Substrate loading process: Process S2) A transport jig (not shown) containing the substrate S is fed into the substrate supply unit 60. In the substrate supply unit 60, the substrate S stored in the transport jig (not shown) is removed from the transport jig (not shown). It is then supplied (carried in) to the preform unit 90 via the transport unit 50.

[0031] (Pickup process: Process S3) After step S1, the wafer holder 12 is moved so that the desired die D can be picked up from the dicing tape DT. The die D is imaged by the wafer recognition camera 24, and image data is acquired through imaging. By processing the image data, the amount of displacement (in the X, Y, and θ directions) of the die D on the wafer holder 12 from the die position reference point of the die bonder 1 is calculated, and positioning is performed. The die position reference point is a predetermined position on the wafer holder 12 that is held as the initial setting of the device. Surface inspection of the die D is performed by processing the image data.

[0032] The die D is peeled off from the dicing tape DT by the peeling unit 13 and the pickup head 21. The die D, peeled off from the dicing tape DT, is attracted and held by a collet 22 provided on the pickup head 21, and is transported to and placed on the intermediate stage 31.

[0033] The die D on the intermediate stage 31 is imaged by the stage recognition camera 34, and image data is acquired through imaging. By processing the image data, the amount of displacement (in the X, Y, and θ directions) of the die D on the intermediate stage 31 from the die position reference point of the die bonder 1 is calculated, and positioning is performed. The die position reference point is a predetermined position on the intermediate stage 31 that is held in advance as the initial setting of the device. Surface inspection of the die D is performed by processing the image data.

[0034] The pickup head 21, which has transported die D to the intermediate stage 31, is returned to the wafer supply unit 10. Following the procedure described above, the next die D is peeled off from the dicing tape DT, and thereafter, die D is peeled off one by one from the dicing tape DT following the same procedure.

[0035] (Preform process: Process S4) After step S2, the substrate S is transported to the preform stage 96 by the transport unit 50. The surface of the substrate S before coating is imaged by the preform camera 94, and the coating surface is confirmed based on the image data acquired by the image, and the position where the paste should be applied is determined. If there are no problems with the surface to be coated, the position where the paste will be applied on the substrate S supported by the preform stage 96 is confirmed and positioned.

[0036] The applied paste is imaged by the preform camera 94. Based on the image acquired by the imaging, it is confirmed whether the paste has been applied accurately, and an inspection (visual inspection) of the applied paste is performed. In other words, the visual inspection confirms whether the applied paste has been applied to the predetermined location on the substrate S in a predetermined shape and in a predetermined amount. The inspection contents include, for example, the presence or absence of paste, the application area, and the application shape (excess or insufficient, overflow).

[0037] (Bonding process: Process S5) If there are no problems with the coating, the substrate S is transported to the bond stage 46 by the transport unit 50. The substrate S placed on the bond stage 46 is imaged by the substrate recognition camera 44, and image data is acquired through imaging. By processing the image data, the amount of displacement of the substrate S from the substrate position reference point of the die bonder 1 (in the X, Y, and θ directions) is calculated. The substrate position reference point is a predetermined position of the bonding unit 40, which is held as the initial setting of the device.

[0038] In step S3, the suction position of the bond head 41 is corrected based on the amount of displacement of the die D on the intermediate stage 31 calculated, and the die D is picked up by the collet 42. The die D is bonded to a predetermined location on the substrate S supported by the bond stage 46 by the bond head 41, which has picked up the die D from the intermediate stage 31. The die D bonded to the substrate S is imaged by the substrate recognition camera 44, and an inspection is performed based on the image data acquired by the image to determine whether the die D has been bonded to the desired position.

[0039] The bond head 41, having bonded die D to substrate S, is returned to the intermediate stage 31. Following the procedure described above, the next die D is picked up from the intermediate stage 31 and bonded to substrate S. This process is repeated until die D is bonded to all package areas P on substrate S.

[0040] (Substrate unloading process: Process S6) The transport unit 50 transports the substrate S, to which the die D has been bonded, from the bonding unit 40 to the substrate unloading unit 70. In the substrate unloading unit 70, the substrate S is removed and stored in a transport jig (not shown), and the substrate S is unloaded. The transport jig (not shown) containing the substrate S is unloaded from the die bonder 1.

[0041] As described above, die D is mounted on substrate S and discharged from die bonder 1. Subsequently, for example, the transport jig containing substrate S with die D mounted on it is transported to the wire bonding process, where the electrodes of die D are electrically connected to the electrodes of substrate S via Au wire or the like. Then, substrate S is transported to the molding process, where die D and Au wire are sealed with molding resin (not shown) to complete the semiconductor package.

[0042] The problems that arise when paste-type adhesive is applied to a substrate will be explained using Figure 6. Figure 6(a) shows an image taken immediately after paste-type adhesive was applied to the surface of the substrate, and Figure 6(b) shows an image taken after a predetermined time has elapsed since Figure 6(a).

[0043] When a paste-like adhesive PA is applied to the tab TB, which serves as the die mounting area of ​​the substrate SA, the paste-like adhesive PA spreads over time, changing its application shape. As the application shape changes, the application area as viewed from above also changes. The lower the viscosity of the paste-like adhesive PA, the more easily the application shape changes, as shown in Figure 6(b). However, despite this change in application shape over time, the time elapsed to calculate the application area of ​​the paste-like adhesive PA is not constant, and the area calculated at an arbitrary timing has been used as the application area.

[0044] When visual inspection is performed immediately after application of paste-type adhesive PA, the inspection should be completed before the paste-type adhesive PA spreads. However, if re-inspection or inspection after a predetermined time has elapsed is necessary for any reason, changes in the paste-type adhesive PA must be taken into consideration.

[0045] Here, we will explain, using Figure 7, the case where inspection is required after a predetermined time has elapsed since the application of the paste-type adhesive. Figure 7 shows an image of paste-type adhesive applied to tabs on a substrate in which tabs are arranged in a grid pattern.

[0046] The substrate SA, in which the tabs TB (coating surfaces) are arranged in a grid, is sequentially coated with paste-type adhesive starting from the upper right tab TB and moving downwards. After applying paste-type adhesive PAS to the lower right tab TB, paste-type adhesive PAR is applied sequentially starting from the top of the second row from the right and moving downwards. This process is then repeated for the third and fourth rows. As a result, the paste-type adhesive PAS applied to the top tab TB of the first row has the longest elapsed time after application, while the paste-type adhesive PAE applied to the bottom tab TB of the fourth row has the shortest elapsed time after application.

[0047] As shown in Figure 7, when the appearance of the paste-like adhesive applied to all tabs TB in all four rows is inspected after coating all four rows, that is, after coating all tabs TB with paste-like adhesive PAE, the spread of the paste-like adhesive PA differs from tab TB to tab TB. Normally, the appearance of the paste-like adhesive is inspected row by row, so the spread of the paste-like adhesive PAS on the first tab TB coated in a row and the paste-like adhesive PAE on the last tab TB coated in that row will differ from tab to tab.

[0048] When applying the adhesive to multiple tabs (TB) in one or more rows and then performing a full tab inspection, the time between application and inspection differs for each tab, resulting in different spreads of the paste-like adhesive (PA) for each tab. Consequently, the inspection results vary depending on the position of the tab (TB), i.e., the time the inspection started.

[0049] Next, regarding the outline of an embodiment that solves the above problems, the method for acquiring correlation data calculated based on an image (hereinafter referred to as the reference inspection image) of the first paste-like adhesive PB applied to the first substrate SB, which is performed in the registration operation before mass production in this embodiment, will be explained using Figures 8 and 9. Figure 8 is a diagram illustrating the outline of the registration operation before mass production in this embodiment. Figure 9 is a flowchart illustrating the method for registering correlation data before mass production in this embodiment.

[0050] The die bonder 1 is equipped with an imaging device that images the first paste-like adhesive PB applied to the first substrate SB, and a control unit 80 that processes the image data of the first paste-like adhesive PB captured by the imaging device. The control unit 80 calculates the shape data of the first paste-like adhesive PB (hereinafter referred to as the first shape data), for example, the application area, from multiple reference inspection images taken at intervals after application, and records it as log data in the control unit 80. Then, a correlation relationship is established between the time elapsed after application and the application area, which is the shape data, and the correlation data is registered as a registration operation before mass production. The application area can be determined, for example, by the number of pixels.

[0051] Here, the method for registering correlation data in the embodiment will be explained using Figures 8 and 9.

[0052] (First substrate transport process: Process S41) Similar to the substrate loading process (process S2) described above, the first substrate SB for acquiring the reference inspection image is loaded into the transport section 50 of the die bonder 1. The first substrate SB is then transported to the preform section 90.

[0053] (First paste-like adhesive application process: Process S42) As described above, the preform camera 94 of the preform unit 90 images the surface of the first substrate SB before application, and the position where the first paste-like adhesive PB should be applied is determined. If there are no problems with the surface to be coated, the first paste-like adhesive PB is applied to the first substrate SB supported by the preform stage 96, and the first paste-like adhesive PB is imaged by the preform camera 94.

[0054] (Time measurement start process: process S43) The measurement of elapsed time begins simultaneously with the application. At this time, in order to clarify the time after application when acquiring the reference inspection image described later, the control unit 80 also activates a timestamp.

[0055] (Reference inspection image acquisition, timestamp acquisition process: process S44) A reference inspection image RII of the first paste-like adhesive PB is acquired using the preform camera 94. At the same time, the time t1 of acquisition is also recorded as a timestamp.

[0056] (Image processing step: Step S45) The acquired reference inspection image RII is then subjected to a binarization process, for example, by the control unit 80. This results in the acquisition of a binarized image BI.

[0057] (First coating area acquisition step: Step S46) The first shape data is calculated from the acquired binarized image BI and registered in the storage device 82. The first shape data is, for example, the application area of ​​the first paste-like adhesive PB, and this area is represented by the number of pixels. The application area of ​​the first paste-like adhesive PB is also called the first application area.

[0058] After the completion of process S46, the process returns to process S44 after a set time has elapsed, and a reference inspection image RII of the first paste-like adhesive PB at time t2 after the new time has elapsed is obtained. This process is repeated until the spread of the first paste-like adhesive PB is almost gone (for example, until time t3), and the elapsed time and the first applied area CB are obtained. As a result, as shown in Figure 8, the first applied area CB is determined via the binarized image BI as B1 at time t1, B2 at time t2, and B3 at time t3.

[0059] (Correlation establishment process: Process S47) Here, we will explain the correlation between the first coating area CB, obtained from the pre-production reference inspection image RII in the above-described embodiment, and the elapsed time after coating. Figure 10 is a diagram illustrating the correlation between the coating area, obtained from the pre-production image in the embodiment, and the elapsed time after coating. After the first coating area CB is acquired for each elapsed time, the control and calculation device 81 of the control unit 80 calculates the characteristics of the elapsed time and the first coating area CB, i.e., the correlation, as shown in Figure 10, and registers it as correlation data in the storage device 82 of the control unit 80. Here, since Figure 10 shows an approximation curve, even at a time different from the reference image acquisition timing, for example, 3.5 seconds after coating, the 41 pixels of the first coating area CB can be recorded as reference data with a baseline. On the other hand, after a certain elapsed time, in this case 8 seconds or more, the first coating area CB does not change, that is, the spread of the first paste-like adhesive PB has stopped. In other words, after 8 seconds or more, the first coating area CB is constant with no spread of the first paste-like adhesive PB, so it is not necessary to acquire a reference inspection image. On the other hand, for less than 8 seconds, this approximation curve can be used as correlation data.

[0060] As described above, the control unit 80 logs the data as an approximate curve, making it possible to determine the first coating area CB at any elapsed time. For example, the area can be calculated even during periods when the first coating area CB is not acquired using a reference inspection image, such as the 3.5 seconds mentioned above. Of course, the acquisition time and interval of the reference inspection image can be set arbitrarily.

[0061] Next, the inspection method for images acquired during mass production in the embodiment (hereinafter referred to as inspection images) will be explained using Figures 11 and 12. Figure 11 is a flowchart illustrating the method for comparing images before mass production and images during mass production in the embodiment. Figure 12 is a diagram illustrating a comparison of the coating area using a binarized image during mass production and the coating area using a binarized image before mass production at the same elapsed time in the embodiment.

[0062] (Second substrate transport process: Process S51) During mass production, the second substrate SC is fed into the transport section 50 of the die bonder 1. The second substrate SC is then transported to the preform section 90.

[0063] (Second paste-like adhesive application process: Process S52) The preform camera 94 in the preform section 90 captures an image of the surface of the second substrate SC before application, and the location where the second paste-like adhesive PC should be applied is determined. If there are no problems with the surface to be coated, the second paste-like adhesive PC is applied to the tab TB of the second substrate SC, which is supported by the preform stage 96.

[0064] (Process to start time measurement simultaneously with application: Process S53) Simultaneously with the application to each tab TB, the measurement of elapsed time begins. At this time, in order to clearly indicate the elapsed time after application, the control unit 80 also operates a timestamp, similar to when acquiring the reference inspection image described above.

[0065] Steps S52 and S53 are repeated until the second paste-like adhesive PC is applied to all tabs TB of the second substrate SC, and the elapsed time after application is measured.

[0066] (Inspection image acquisition and timestamp acquisition process: Process S54) The timing of visual inspection in mass production varies depending on the position of the tab TB on the second substrate SC. Using the preform camera 94, an inspection image of the second paste-like adhesive PC is acquired for each tab TB and recorded in the storage device 82 of the control unit 80. At the same time, the time of imaging is also recorded as a timestamp. This allows the elapsed time of visual inspection timing for all tabs TB during mass production to be measured, and inspection image INIs are acquired.

[0067] (Image processing step: Step S55) The acquired inspection image INI is subjected to the binarization process described above by the control unit 80. This results in the acquisition of a binarized image BI.

[0068] (Second coating area acquisition step: Step S56) Shape data (hereinafter referred to as second shape data) is calculated from the acquired binarized image BI through image processing and recorded in the storage device 82 of the control unit 80. The second shape data is, for example, the coating area (CC) represented by the number of pixels of the second paste-like adhesive PC. The coating area of ​​the second paste-like adhesive PC is also called the second coating area.

[0069] (Comparative inspection process: Process S57) The control unit 80 performs a comparative inspection (visual inspection) of the second coating area CC and the first coating area CB at the same elapsed time after coating, which is registered in the control unit 80. More specifically, the control unit 80 compares and determines the second coating area CC at the elapsed time (time t2) when the second coating area CC was acquired (here, the second coating area CC is C2) with the first coating area CB (B2) at the same elapsed time (time t2) from when the second paste-like adhesive PC was applied until the second paste-like adhesive PC was photographed, which is extracted from the correlation between the first coating area CB and the elapsed time after coating shown in Figure 10. For example, in mass production, if the second coating area CC is calculated 3 seconds after coating using the flow shown in Figure 11, the calculated second coating area CC is compared with the 38 pixels of the first coating area CB at 3 seconds after application of the first paste-like adhesive PB.

[0070] Since the change in the first coating area CB over time is recorded in the storage device 82 of the control unit 80, it is possible to perform comparative inspections on at least two locations on the second substrate SC, namely the first tab TB applied and the last tab TB applied, during mass production.

[0071] (Judgment process: Process S58) Using the results of the comparison in process S57, the control unit 80 determines whether the second coating area CC during mass production is within the normal range, that is, whether the coating amount is appropriate. Of course, a threshold can also be set to account for errors due to the paste position and order of the second substrate SC.

[0072] If within the normal range, proceed to the bonding process in step S5. If it deviates from the range, stop the operation of die bonder 1 and inspect and adjust the preform section 90, the second paste-like adhesive PC, or both.

[0073] Alternatively, the determination may be made by comparing the area ratio, i.e., the area of ​​the second paste-like adhesive PC / the area of ​​the first paste-like adhesive PB.

[0074] If the time for acquiring inspection images during mass production is fixed, the application status of the second paste-like adhesive PC can be easily determined as the second application area CC by comparing it with reference inspection image data from the corresponding time. However, due to equipment trouble, re-inspection, or other circumstances, inspection images during mass production may be acquired at elapsed times other than the fixed time. In this case as well, as described above, the first application area CB corresponding to the elapsed time after application of the second paste-like adhesive PC can be determined from the graph of the approximation curve between the first application area CB and elapsed time shown in Figure 10, and it becomes possible to compare and inspect it with the second application area CC.

[0075] Since this graph is recorded as an approximation curve in the memory device 82 of the control unit 80, it is possible to obtain an approximate value of the second coating area CC at any time other than the elapsed seconds used when acquiring the reference inspection image, i.e., any arbitrary time such as the 3.5 seconds mentioned above.

[0076] Furthermore, in cases where multiple paste points exist, as shown in Figure 7 above, the elapsed time after coating will inevitably differ significantly between the first tab TB and the last tab TB. In this case, if a correlation between the first coated area CB and the elapsed time can be obtained using a reference inspection image as shown in Figure 10, it becomes possible to easily determine the coating status for multiple tabs TB at any elapsed time during the coating operation for each tab TB in mass production. In addition, even in processes where there is a considerable amount of time between coating and inspection during mass production, the coating result can be determined by the correlation using the reference inspection image.

[0077] The control unit 80 displays the actual reference inspection image, the mass production inspection image, and the correlation data for the same elapsed time on the monitor 83a, allowing the operator to directly check them. By displaying these results on the monitor 83a, it becomes possible to detect abnormalities in the die bonder 1, the preform section 90, or the second paste-like adhesive PC at an early stage.

[0078] According to this embodiment, one or more of the following effects can be obtained.

[0079] Since images and data of the first coating area CB are obtained in advance using reference inspection images, and the correlation between the first coating area CB and elapsed time is obtained, it becomes possible to determine the coating inspection of the second paste-like adhesive PC during mass production without stopping the operation of the die bonder 1, that is, while maintaining the equipment operating rate.

[0080] Since the correlation between the first coating area CB and elapsed time in the reference inspection image is obtained, as described above, in the inspection image during mass production, coating determination on the second substrate SC becomes possible at only two locations: the first tab TB and the last tab TB, leading to an improvement in equipment utilization rate.

[0081] Since the correlation between the first application area CB and the elapsed time in the reference inspection image is obtained, even if there are multiple paste points within the tab TB, the inspection area can be set for each paste point, and the risk of misjudgment can be reduced even when there is a large difference in the application time between the first and last paste points.

[0082] This method is effective not only for low-viscosity paste-type adhesives, but also for paste-type adhesives of other viscosity types. In other words, this method is effective for all paste-type adhesives.

[0083] <Variation> The following are some examples of typical modifications of the embodiments. In the following descriptions of modifications, the same reference numerals as in the embodiments described above may be used for parts having the same configuration and function as those described in the embodiments described above. Furthermore, the descriptions of such parts may be appropriately referenced from the embodiments described above, to the extent that they do not contradict the technical standards. In addition, some of the embodiments described above, and all or some of the modifications, may be applied in combination as appropriate, to the extent that they do not contradict the technical standards.

[0084] In the modified example, following a flow similar to that shown in Figures 9 and 11 of the present configuration, the shape data obtained in steps S46 and S56 includes the coating width and length instead of the coating area. Figure 13 illustrates the shape data in the modified example and shows a binarized image of the applied paste-like adhesive.

[0085] Similar to the embodiment, the coating widths WB1 and WB2 of the binarized image BI_B for each elapsed time before mass production of the first paste-like adhesive PB3 are calculated and recorded in the storage device 82 of the control unit 80. Meanwhile, after coating, the control unit 80 calculates the coating widths WC1 and WC2 of the binarized image BI_C for the second paste-like adhesive PC3 during mass production. Then, the coating widths at the same position at the same elapsed time are compared and a comparative inspection is performed to determine if the shape change after coating is normal.

[0086] Alternatively, the rate of change of each coating width, WC1 / WB1 and WC2 / WB2, may be determined and compared. Furthermore, it is possible to compare shapes other than coating width; for example, the length LB or angle θB of the first shape data and the length LC or angle θC of the second shape data may be compared, as shown in Figure 13.

[0087] In this way, comparative inspection may be performed using the coating width, length, etc. as a basis, with the binarized image data obtained by image processing a reference inspection image as the first shape data and the binarized image data obtained by image processing an inspection image as the second shape data. Furthermore, as shown in Figure 10 of the embodiment, it is also possible to obtain correlation data between the coating width, length, etc. of the first shape data obtained by image processing a reference inspection image and the time elapsed after coating. Therefore, even if the time elapsed after coating during mass production becomes arbitrary, as in the embodiment, comparative inspection can be performed using the second shape data and the first shape data.

[0088] Furthermore, in the modified form obtained by comparing this shape data, the control unit 80 displays the actual reference inspection image, the mass production inspection image, and the correlation data for the same elapsed time on the monitor 83a, allowing the operator to directly confirm them.

[0089] Furthermore, since applying paste-like adhesive to a substrate and calculating the first shape data would waste at least one tab, another method is to use a test application stage for the paste-like adhesive, which is made of a material that is transparent in visible light, such as glass. The control unit applies the paste onto the test application stage using a syringe. An imaging device is provided below the test application stage, and the application position and area of ​​the paste are confirmed by taking a picture from the back side (below) of the test application stage. In the pre-production registration operation on this test application stage, multiple reference inspection images taken at each elapsed time after application of the paste-like adhesive can be calculated as first shape data by image processing, and correlation data between the elapsed time after application and the first shape data can be registered.

[0090] Although the present disclosure has been described in detail based on embodiments and modifications, it goes without saying that the present disclosure is not limited to the above embodiments and can be modified in various ways.

[0091] In this embodiment, an intermediate stage section 30 is provided between the pickup section 20 and the bonding section 40. The die D picked up from the pickup section 20 by the pickup head 21 is placed on the intermediate stage 31, and the die D is picked up again from the intermediate stage 31 by the bond head 41 and bonded to the transported substrate S. However, the bond head 41 may be used to bond the die D picked up by the pickup section 20 to the substrate S.

[0092] Furthermore, although the embodiment includes one pickup head 21 and one bond head 41, there may be two or more of each. Also, although the embodiment includes an intermediate stage 31, the intermediate stage 31 may be omitted.

[0093] Furthermore, although a semiconductor manufacturing apparatus was described in the embodiment, it can also be applied to mounting apparatus for mounting electronic components onto printed circuit boards. [Explanation of Symbols]

[0094] 1. Die bonder (semiconductor manufacturing equipment) 80. Control Unit (Control Device) 94. Preform camera (imaging device)

Claims

1. An imaging device for imaging the first paste-like adhesive applied to the coating surface, The system comprises a control device for image processing the image data of the first paste-like adhesive captured by the imaging device, The control device is During the registration process before mass production, A semiconductor manufacturing apparatus configured to calculate a plurality of reference inspection images of the first paste-like adhesive captured by the imaging device at each time interval after application as first shape data by image processing, and to register correlation data between the time interval after application and the first shape data.

2. In the semiconductor manufacturing apparatus according to claim 1, The control device is During mass production, The inspection image of the second paste-like adhesive applied to the second substrate, captured by the imaging device, is calculated as second shape data through image processing. A semiconductor manufacturing apparatus configured to perform visual inspection based on a comparison between the second shape data and the first shape data, which represents the same elapsed time as the time from when the second paste-like adhesive is applied until the second paste-like adhesive is imaged.

3. In the semiconductor manufacturing apparatus according to claim 2, The control device is A semiconductor manufacturing apparatus configured to measure the elapsed time after application of the second paste-like adhesive to all tabs on the second substrate to which the second paste-like adhesive has been applied.

4. In the semiconductor manufacturing apparatus according to claim 2, The control device is A semiconductor manufacturing apparatus configured to perform the visual inspection using the correlation data, which is an approximation curve.

5. In the semiconductor manufacturing apparatus according to claim 2, The control device is A semiconductor manufacturing apparatus configured such that the first shape data and the second shape data are calculated using the first coating area and the second coating area, respectively, which are represented by the number of pixels.

6. A method for inspecting a paste-like adhesive using an inspection apparatus comprising: an imaging device for imaging a first paste-like adhesive applied to a coating surface; and a control device for image processing the image data of the first paste-like adhesive captured by the imaging device, wherein, in a registration operation before mass production, the control device calculates a plurality of reference inspection images of the first paste-like adhesive captured by the imaging device at each time interval after application as first shape data by image processing, and registers correlation data between the time interval after application and the first shape data, wherein the control device is configured to perform the inspection, During mass production, A step of calculating second shape data by image processing the inspection image of the second paste-like adhesive applied to the second substrate captured by the imaging device, A step of performing an appearance inspection based on a comparison of the second shape data and the first shape data obtained at the same time after application, A method for testing paste-like adhesives containing [specific components / materials].

7. In the method for inspecting a paste-like adhesive according to claim 6, A method for inspecting a paste-like adhesive, in which the first shape data and the second shape data are the first and second coating areas, respectively, represented by the number of pixels.

8. In the method for inspecting a semiconductor device according to claim 7, The aforementioned visual inspection is a method for inspecting a paste-like adhesive, which is performed by comparing the first coating area and the second coating area obtained from the correlation data.

9. A semiconductor device manufacturing apparatus comprising an imaging device for imaging a first paste-like adhesive applied to a coating surface, and a control device for image processing the image data of the first paste-like adhesive captured by the imaging device, wherein the control device is configured to, in a registration operation before mass production, calculate a plurality of reference inspection images of the first paste-like adhesive captured by the imaging device at each time interval after application as first shape data by image processing, and register correlation data between the time interval after application and the first shape data, wherein the apparatus is configured to manufacture a semiconductor device, During mass production, A step of calculating second shape data by image processing the inspection image of the second paste-like adhesive applied to the second substrate captured by the imaging device, A step of performing an appearance inspection based on a comparison of the second shape data and the first shape data obtained at the same time after application, A method for manufacturing a semiconductor device containing [a specific component].

10. In the method for manufacturing a semiconductor device according to claim 9, A method for manufacturing a semiconductor device, wherein the first shape data and the second shape data are the first and second coating areas, respectively, represented by the number of pixels.

11. In the method for manufacturing a semiconductor device according to claim 10, The method for manufacturing a semiconductor device, wherein the visual inspection is performed by comparing the first coating area and the second coating area obtained from the correlation data.

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