Computer cooling method

Abstract

Computer semiconductor integrated circuits (such as CPUs) and power supplies (lithium-ion batteries) become hot when used for extended periods, leading to a decrease in processing power and product lifespan. Therefore, it is necessary to suppress the temperature rise. However, conventional methods, such as cooling fans and exhaust vents, rely on heat exchange between the surrounding air (room temperature) and the heat inside the computer, which has the drawback of low cooling efficiency. [Solution] (1) A radiative cooling material (resin) that promotes radiative cooling, which is one of the properties of thermal energy, is attached to the protective cover of the semiconductor integrated circuit or to the surface of the outer casing of the battery. Alternatively, protective covers or the outer casing itself could be manufactured from the material, or, instead of targeting heat-generating components inside the computer, the material could be applied to the surface of the entire computer's outer casing (box) to improve heat dissipation and thus cool it down. (2) Apply to computer cooling a method that uses a refrigerant that has been cooled by circulation involving compression and depressurization of a refrigerant sealed inside a metal tube, as used in air conditioners (cooling) and refrigerators. Coolant pipes are placed inside and around the equipment, and the area around them is cooled, improving the effect of heat conduction and thus achieving cooling. (1)(2) The problem of cooling efficiency is solved by using methods different from conventional methods.

Description

Technical Field

[0001] The present invention relates to an applied technology that utilizes the physical action of thermal energy.

Background Art

[0002] Technology of materials for promoting radiative cooling of thermal energy

[0003] Technology of promoting heat conduction cooling for air conditioners (refrigeration) and refrigerators

Summary of the Invention

Problems to be Solved by the Invention

[0004] Semiconductor integrated circuits (such as CPUs and GPUs) and lithium-ion batteries, which are power sources for controlling computers such as PCs (personal computers) and mainframes, when continuously used for a long time, will reach a high temperature due to Joule heat generated by the current, which may cause a decrease in processing power, malfunctions, and a reduction in product lifespan. Therefore, for heat-generating components and the temperature rise inside the outer frame case of the computer, cooling and exhaust heat measures are taken using cooling fans, heat sinks, exhaust heat fans, exhaust ports, etc. to suppress the temperature rise. Conventional cooling and exhaust heat methods were to cool by blowing room-temperature air and radiate (exhaust heat) into the room-temperature atmosphere. Therefore, there was a problem that the heat conduction efficiency was low, and the cooling function was not sufficient in a state where it was difficult for the temperature of heat-generating components and inside the equipment to drop. A more efficient cooling and exhaust heat method (method of controlling thermal energy) has been demanded.

Means for Solving the Problems

[0005] (1) Technology of materials for promoting radiative cooling A radiative cooling material is a resin having a function of promoting the radiative cooling action, which is one of the thermal actions. Attach a sheet made of this material to the surface of the protective cover of the semiconductor integrated circuit or the outer frame case of the lithium-ion battery, or manufacture the protective cover or outer frame case itself using this material. (The main heat sources in a computer are semiconductor integrated circuits (such as the CPU) and lithium-ion batteries, each of which is fitted with a protective cover or outer casing.) Conventionally, the heat generated from these heat-generating components was blocked by the cover or case, resulting in high temperatures. However, by using radiative cooling-promoting materials, the protective cover and outer case are equipped with radiative cooling functionality, promoting heat dissipation and suppressing temperature rise. Furthermore, instead of targeting the heat-generating components inside the computer, the target is the computer's outer casing (box), and a sheet made of radiative cooling material is attached to the surface of the casing. This allows for greater heat dissipation from the inside of the computer when used in conjunction with the existing cooling fans and exhaust vents on the outer casing (improving the computer's heat dissipation capabilities). (2) Refrigerant circulation heat conduction promotion technology The technology for cooling air conditioners and refrigerators involves placing a refrigerant in sealed metal tubes and using specialized equipment to compress it to a high temperature and depressurize it to a low temperature. The refrigerant then rapidly cools the refrigerant tubes through which it passes, causing the surrounding air to cool down through heat conduction. This cooling technology will be applied to the cooling and heat dissipation methods of computers. Inside a computer, the motherboard is located on the floor, and circuits and electronic components are arranged there, so it is not possible to install refrigerant pipes. On the other hand, the ceiling surface offers open space where it can be placed. The computer is cooled as the depressurized refrigerant passes through the pipes. Alternatively, although the principle is the same, instead of placing the refrigerant pipes inside the computer, they can be placed on the outside of the computer's outer casing (box), and cooled air can be blown in by a cooling fan attached to the case above the semiconductor integrated circuits and battery. In this way, the problem is solved using a method different from conventional approaches.

Claims

1. To control computers such as PCs and mainframes, the built-in electronic components, such as semiconductor integrated circuits (CPUs, GPUs, etc.) and lithium-ion batteries that provide power, can become overheated due to Joule heating (heat generated by electric current) if used for extended periods. This can lead to decreased processing power (unstable operation of the device), malfunctions, and a reduced product lifespan. Therefore, cooling and heat dissipation measures using cooling fans, heat sinks, exhaust fans, and exhaust vents are necessary to counteract the temperature rise of heat-generating components and the inside of the device. Heat-generating components (such as CPUs and GPUs) are precision parts and are protected by plastic covers to prevent scratches and dirt. Furthermore, lithium-ion batteries have an outer casing. A sheet made of radiative cooling material is attached to the surface (top and sides) of this protective cover or outer case. (Radiative cooling materials are resins that have the function of promoting radiative cooling, which is one of the thermal processes. Radiative cooling is the phenomenon in which heat is released into the air, causing the temperature of the heat source to decrease.) By attaching this radiative cooling material sheet to the protective cover of a semiconductor integrated circuit or the outer casing of a lithium-ion battery, the heat generated inside the cover or casing escapes to the outside rather than remaining inside, compared to when the sheet is not attached. This is because the radiative cooling material applied to the surface promotes the dissipation of the heat generated. This method involves attaching a sheet made of radiative cooling material to the surface of the cover or case of a heat-generating component, thereby accelerating the radiative cooling phenomenon, cooling the component, and dissipating heat from inside the cover or case. A method to improve cooling and heat dissipation functions by adding radiative cooling capabilities to covers and cases.

2. A method that is fundamentally the same as the method described in claim 1 (radiative cooling promotion effect), but improves the cooling efficiency of heat-generating components by manufacturing the resin cover or case itself from a radiative cooling material instead of attaching a sheet made of radiative cooling material to the surface of the protective cover or outer case of the heat-generating component. A method that improves the heat dissipation efficiency of the heat inside the cover or case. A method to improve the cooling and heat dissipation functions of computers by manufacturing resin protective covers for semiconductor integrated circuits and resin outer cases for lithium-ion batteries using radiative cooling materials, thereby giving the covers and cases a radiative cooling-promoting function.

3. The method is fundamentally the same as the method described in claim 1 (radiative cooling promotion effect), but instead of attaching a sheet made of radiative cooling material to the protective cover of heat-generating components or the surface of the outer frame case, the method involves attaching a sheet made of radiative cooling material to the surface (top and sides) of the outer frame case (box) of a mainframe, gaming PC, etc., thereby promoting the heat dissipation effect from within the computer outer frame case and improving the cooling effect of heat-generating components. Conventional methods for dissipating heat from inside a computer case include cooling fans and exhaust vents. However, this method involves attaching a sheet made of radiant cooling material to the surface (top and sides) of the case to promote radiant cooling, which dissipates internal heat to the outside, thereby improving the cooling function of heat-generating components and the heat dissipation function of the computer.

4. Semiconductor integrated circuits (CPU, GPU, etc.) within the electronic components used to control computers such as PCs and mainframes become overheated due to Joule heating (heat generated by electric current) when used for extended periods. This can lead to decreased processing power (unstable operation of the device), malfunctions, and a reduced product lifespan. Therefore, cooling and heat dissipation measures using cooling fans, heat sinks, exhaust fans, and exhaust vents are necessary to counteract the temperature rise of heat-generating components and the inside of the device. The mechanism for cooling air conditioners and refrigerators involves sealing a refrigerant inside a sealed metal tube and circulating it through the tube while repeatedly compressing and decompressing it using a special device. When a depressurized refrigerant passes through a pipe, the air surrounding that pipe is cooled. (The mechanism works by transferring heat from the surrounding area of ​​the refrigerant pipe to the cooled refrigerant pipe, thereby cooling the surrounding area.) Using the same method, coolant pipes are routed inside the computer and placed near heat-generating components such as semiconductor integrated circuits and lithium-ion batteries. The computer contains only refrigerant pipes; devices for compressing and depressurizing the refrigerant are installed outside the computer. This method involves placing refrigerant pipes in a location that does not come into contact with the motherboard (circuits, electronic components) inside the computer, and passing the cooled refrigerant through them to cool and dissipate heat from heat-generating components and the inside of the computer.

5. The method described in claim 4 is in principle the same as the method described in claim 4 (passing a depressurized refrigerant through a metal tube to cool the surrounding air), but the refrigerant tube is placed outside the computer instead of inside. Then, the air cooled on the outside of the computer's outer casing (box) is blown into the interior by a cooling fan attached to the casing. Conventionally, cooling fans mounted on the outer casing are often positioned directly above the semiconductor integrated circuit, blowing in outside air (at room temperature). However, this method improves both cooling and heat dissipation by arranging refrigerant pipes around the outer circumference of the casing, which then blows cooled air into the circuit. (The methods described in claims 4 and 5 involve arranging refrigerant pipes inside and outside the computer to enhance cooling and heat dissipation. However, because an external power supply, compressor, and depressurizer are required to circulate the refrigerant, this method is not suitable for mobile devices such as PCs or smartphones, but rather for stationary computers in data centers, etc.)

6. Apparatus and equipment using the method according to claim 1, claim 2, claim 3, claim 4, and claim 5.

7. Services and businesses using the apparatus and equipment described in claim 6.