Input device

Abstract

The present invention provides an input device that allows for the provision of a switch on the side that is independent of the switch on the main surface. [Solution] An input device comprising a substrate having a main surface and at least one side surface substantially perpendicular to the main surface, and a side-side detection electrode portion formed on the side surface for detecting changes in capacitance.

Description

Technical Field

[0001] The present invention relates to an input device.

Background Art

[0002] Input devices that detect the presence or absence of an operation input by a user by detecting a change in capacitance are known (see, for example, Patent Document 1). In the input device described in Patent Document 1, detection electrodes are formed from the main surface of the substrate to the side surface and the opposite main surface in order to detect an operation from the side surface.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the input device described in Patent Document 1, one detection electrode is used to detect operations from both the side surface side and the main surface side. For this reason, there is a problem that an independent switch for detecting only an operation from the side surface side cannot be provided on the side surface side.

[0005] Therefore, one object of the present invention is to provide an input device provided with a switch independent of the switch on the main surface side on the side surface side.

Means for Solving the Problems

[0006] The present invention is, for example, a substrate having a main surface and at least one side surface substantially orthogonal to the main surface, a side surface side detection electrode portion formed on the side surface side for detecting a change in capacitance, and an input device including the same.

Brief Description of the Drawings

[0007] [Figure 1] This figure shows an example of the external appearance of an input device according to the embodiment. [Figure 2] This figure shows an example of the appearance of a substrate according to the embodiment. [Figure 3] Figures A through C are diagrams illustrating the first comparative example. [Figure 4] This is a diagram illustrating the first comparative example. [Figure 5] Figures A through C are diagrams illustrating the second comparative example. [Figure 6] Figures A through C are diagrams illustrating examples of substrate configurations according to the first embodiment. [Figure 7] Figures A to C illustrate an example of the configuration of the side detection electrode section according to the first embodiment. [Figure 8] This is a diagram illustrating the operation of the input device according to the first embodiment. [Figure 9] Figures A to C illustrate an example of the configuration of the side detection electrode section according to the second embodiment. [Figure 10] This is a diagram illustrating the operation of the input device according to the second embodiment. [Figure 11] Figures A to C illustrate an example of the configuration of the side detection electrode section according to the third embodiment. [Figure 12] This is a perspective view of a small substrate according to the fourth embodiment. [Figure 13] Figures A through C are diagrams illustrating examples of substrate configurations according to the fourth embodiment. [Figure 14] A and B are perspective views illustrating the mounting members according to the fifth embodiment. [Figure 15] This figure shows the mounting member according to the fifth embodiment attached to the substrate. [Figure 16] This is a diagram illustrating the operation of the input device according to the fifth embodiment. [Modes for carrying out the invention]

[0008] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The embodiments described below are preferred specific examples of the present invention, and the content of the present invention is not limited to these embodiments. The description will be made in the following order. <First Embodiment> <Second Embodiment> <Third Embodiment> <Fourth Embodiment> <Fifth Embodiment> <Modification Example> Note that the members shown in the claims are not specified as the members of the embodiments. In particular, the dimensions, materials, shapes, relative arrangements thereof, descriptions of directions such as up-down, left-right, etc. of the constituent members described in the embodiments are not intended to limit the scope of the present invention only thereto, but are merely illustrative examples. Note that the sizes and positional relationships of the members shown in each drawing may be exaggerated for clarity of explanation, and in order to prevent the illustration from becoming complicated, only a part of the reference numerals may be illustrated or a part of the illustration may be simplified. Further, in the following description, the same names and reference numerals indicate the same or similar members, and duplicate descriptions will be omitted as appropriate.

[0009] <First Embodiment> [Appearance Example of Input Device] FIG. 1 shows an appearance example of an input device (hereinafter, appropriately referred to as input device 1) according to an embodiment. The input device 1 according to the present embodiment is a capacitive input device. Here, a capacitive input device means a device that detects the presence or absence of an input operation by detecting a change in capacitance. Further, the input device 1 according to the present embodiment is, for example, a remote control device for a toilet that can be attached to a wall or the like. However, the use of the input device 1 is not limited to a remote control device for a toilet. For example, the input device 1 is also applicable to a remote control device for electronic devices such as an air conditioner and a television device.

[0010] The input device 1 has a housing 10. The housing 10 is made of, for example, resin. The housing 10 has, for example, a rectangular parallelepiped shape. Specifically, the housing 10 has a first main surface 10A and a second main surface 10B opposite to the first main surface 10A. In this specification, the main surface means a surface with a relatively larger area (region) than other surfaces. Further, the housing 10 has four side surfaces (the first side surface 11A, the second side surface 11B, the third side surface 11C, and the fourth side surface 11D) connecting the first main surface 10A and the second main surface 10B.

[0011] In this embodiment, switches are formed on each of the first main surface 10A, the first side surface 11A, and the second side surface 11B. For example, three switches (switch SW1, switch SW2, and switch SW3) are formed on the first main surface 10A. The switch SW1, the switch SW2, and the switch SW3 have, for example, a circular shape. Also, three switches (switch SW4, switch SW5, and switch SW6) are formed on the first side surface 11A. Further, two switches (switch SW7 and switch SW8) are formed on the second side surface 11B. The switch SW4, the switch SW5 ··· and the switch SW8 have, for example, a rectangular shape.

[0012] Each switch is assigned functions such as "flow water", "open and close the toilet seat", etc., and functions for making various settings related to the toilet. Characters or marks indicating these functions may be printed on the housing 10. Although details will be described later, each switch SW is configured as an electrostatic switch. Specifically, when a user touches or approaches a finger to each switch SW, the function assigned to the switch SW is executed. Note that the number, shape, assigned functions, etc. of the switch SW are not limited to the example shown in FIG. 1 and can be changed as appropriate.

[0013] [Appearance example of the substrate] Figure 2 shows an example of the appearance of a substrate (hereinafter appropriately referred to as substrate 20) according to the embodiment. The substrate 20 is, for example, rectangular parallelepiped, and more specifically, has a thin plate shape. The substrate 20 has a first main surface 20A and a second main surface 20B opposite to the first main surface 20A. The substrate 20 has, for example, at least one side surface that is substantially perpendicular to the first main surface 20A. In this embodiment, the substrate 20 has four side surfaces (first side surface 21A, second side surface 21B, third side surface 21C, and fourth side surface 21D) that connect the first main surface 20A and the second main surface 20B and are substantially perpendicular to each main surface. As will be described in detail later, a detection electrode portion for detecting operation input is provided on an appropriate surface of the substrate 20.

[0014] [Explanation of the comparative example] Next, to facilitate understanding of the present invention, comparative examples will be described. Figures 3A to 3C are diagrams illustrating the first comparative example. The first comparative example is an example in which detection electrode sections are not provided on the first side surface 21A or the second side surface 21B, and the substrate is constructed from a single substrate 20. In the following, an example of a detection electrode section that detects operation input to switch SW4 will be described as an example, but the same applies to detection electrode sections that detect operation input to switches SW5 to SW8.

[0015] As shown in Figure 3A, the detection electrode section (hereinafter appropriately referred to as the detection electrode section 23) that detects the operation input to the switch SW4 has, for example, a detection electrode section 23A formed near the end of the first side surface 21A on the first main surface 20A, and a detection electrode section 23B formed near the end of the second main surface 20B on the first side surface 21A. The detection electrode section 23A and the detection electrode section 23B are separated by the first side surface 21A. As shown in Figure 3B, for example, a connection section 23C is connected to the detection electrode section 23A. The connection section 23C extends downward toward the first main surface 20A, and its tip is connected to a detection circuit (not shown) that detects changes in capacitance. Figure 3C is an end view when the substrate according to the comparative example is cut along the cutting line AA-AA in Figure 3B. As shown in Figure 3C, a detection electrode portion 23A is provided near the first side surface 21A of the first main surface 20A, and a detection electrode portion 23B is provided near the first side surface 21A of the second main surface 20B.

[0016] Figure 4 is a diagram illustrating the operation of the input device according to the comparative example. As shown in Figure 4, for example, suppose that when an operation input is made to the side switch SW4 (for example, near the location shown in the end view of Figure 3C), a finger F comes close to the detection electrode 23. When the finger F comes close, a capacitive component is generated between the finger F and the detection electrode 23A or detection electrode 23B. In Figure 4, the capacitive component is schematically shown as a capacitor. This is also the case in Figures 8, 10, and 16. If the change in this capacitive component can be detected, the operation input to switch SW4 can be detected. However, in the first comparative example, because the area of ​​the detection electrode 23A and detection electrode 23B facing the finger F is small, the change in the capacitive component when the finger F comes close is small, making it difficult to detect the change. Therefore, there is a risk that the operation input to switch SW4 cannot be detected. In other words, there is a problem in that operation input to the side cannot be detected independently of operation input to the main surface.

[0017] Figures 5A to 5C illustrate a second comparative example. The second comparative example is an example in which three circuit boards are housed in the housing 10 instead of one. As shown in Figure 5A, circuit board 25A is housed in the housing 10. When viewed from the front, circuit board 25B is positioned above circuit board 25A, and circuit board 25C is positioned to the right of circuit board 25A. Figure 5B is a view of circuit board 25B from above, and Figure 5C is a view of circuit board 25C from the right side.

[0018] The main surface 26A of the substrate 25A is provided with a detection electrode section 27A for detecting operation input to switch SW1, a detection electrode section 27B for detecting operation input to switch SW2, and a detection electrode section 27C for detecting operation input to switch SW3.

[0019] The main surface (top surface) 26B of the substrate 25B is provided with a detection electrode section 27D for detecting operation input to switch SW4, a detection electrode section 27E for detecting operation input to switch SW5, and a detection electrode section 27F for detecting operation input to switch SW6.

[0020] The main surface 26C of the substrate 25C (the surface viewed from the right side in Figure 5A) is provided with a detection electrode section 27G for detecting operation input to switch SW7 and a detection electrode section 27H for detecting operation input to switch SW8.

[0021] Substrates 25A and 25B are connected by a connecting wire 28A. The changes in the capacitance component detected by detection electrode sections 27D, 27E, and 27F are output via the connecting wire 28A to an IC (Integrated Circuit) or the like provided on substrate 25A.

[0022] Furthermore, substrates 25A and 25C are connected by a connecting line 28B. As a result, changes in the capacitance component detected by detection electrode sections 27G and 27H are output via the connecting line 28B to an IC or the like provided on substrate 25A.

[0023] By providing separate substrates (substrates 25B and 25C in this example) on the side of substrate 25A, the area of ​​the detection electrode section located on the side can be enlarged. However, in the configuration according to the second modified example, three substrates are required, and furthermore, connecting wires are needed to connect each substrate. The cost increases due to the increased number of components, and the process becomes more complex due to the time required to assemble the connecting wires. In addition, since the three substrates need to be housed in the housing 10, there is a risk that the input device will become larger. Based on the above comparative examples, the embodiments will be described in more detail.

[0024] [Substrate according to this embodiment] Figures 6A to 6C illustrate an example of the configuration of the substrate 20 according to this embodiment. Figure 6A is a view of the substrate 20 facing the first main surface 20A. Figure 6B is a view of the substrate 20 facing the first side surface 21A. Figure 6C is a view of the substrate 20 facing the second side surface 21B. The above-described substrate 20 is housed inside the housing 10.

[0025] Three detection electrode sections are formed on the first main surface 20A for detecting operation inputs to switches SW1, SW2, and SW3, respectively. Specifically, detection electrode section 31A for detecting operation input to switch SW1, detection electrode section 31B for detecting operation input to switch SW2, and detection electrode section 31C for detecting operation input to switch SW3 are formed on the first main surface 20A at a distance from each other. Detection electrode sections 31A, 31B, and 31C are positioned relatively close to the center of the first main surface 20A in order to detect changes in the capacitance component independently of the detection electrode sections provided on the sides. Note that in Figure 6, the locations of the detection electrode sections are shown in dark gray. This also applies to Figures 7, 9, 11, and 13.

[0026] Each detection electrode portion is formed by depositing (e.g., plating, or forming a foil) a conductive metal, such as copper, onto the first main surface 20A. Each detection electrode portion has, for example, a circular shape, but may also have other shapes such as a rectangle. Each detection electrode portion provided on the first main surface 20A corresponds to an example of a main surface-side detection electrode portion. A detection electrode portion may also be formed on the second main surface 20B.

[0027] On the side surface of the substrate 20, a side-side detection electrode portion is formed that is different from the main surface detection electrode portion. Here, "different from the main surface detection electrode portion" means that the side-side detection electrode portion is not continuous with the main surface detection electrode portion. In this embodiment, the side-side detection electrode portion is formed on the first side surface 21A and the second side surface 21B, respectively.

[0028] On the first side surface 21A, for example, a detection electrode section 31D for detecting an operation input to switch SW4, a detection electrode section 31E for detecting an operation input to switch SW5, and a detection electrode section 31F for detecting an operation input to switch SW6 are formed at a distance from each other. Each detection electrode section is formed by depositing (e.g., plating, or forming a foil) a conductive metal such as copper onto the first side surface 21A. Each detection electrode section has, for example, a rectangular shape, but may have other shapes such as an ellipse. When there are multiple detection electrodes, the operation of the corresponding switch SW can be detected by forming each detection electrode section at a distance from each other.

[0029] On the second side surface 21B, for example, a detection electrode portion 31G for detecting an operational input to switch SW7 and a detection electrode portion 31H for detecting an operational input to switch SW8 are formed at a distance from each other. Each detection electrode portion is formed by depositing (e.g., plating, or forming a foil) a conductive metal such as copper onto the second side surface 21B. Each detection electrode portion has, for example, a rectangular shape, but may have other shapes such as an ellipse. In addition, detection electrode portions may be formed on sides other than the first side surface 21A and the second side surface 21B. When there are multiple detection electrodes, the operation of the corresponding switch SW can be detected by forming each detection electrode portion at a distance from each other.

[0030] The detection electrode sections provided on the first side surface 21A and the second side surface 21B correspond to examples of side-side detection electrode sections. The side-side detection electrode section is an electrode for detecting changes in capacitance. Furthermore, the side-side detection electrode section can detect operations from the side of the housing 10 (for example, the first side surface 21A or the second side surface 21B).

[0031] Referring to Figures 7A to 7C, the details of the side-side detection electrode sections provided on the first side surface 21A and the second side surface 21B will be described. In Figures 7A to 7C, the detection electrode section 31D is used as an example of the side-side detection electrode section, but the matters described below also apply to other side-side detection electrode sections such as the detection electrode section 31E.

[0032] Figure 7A is an enlarged view of the area near the detection electrode portion 31D formed on the first side surface 21A, and is a view toward the first side surface 21A. Figure 7B is an enlarged view of the area near the detection electrode portion 31D formed on the first side surface 21A, and is a view toward the first main surface 20A. Figure 7C is an end view when the substrate 20 is cut along the cutting line BB-BB in Figure 7B.

[0033] The detection electrode section 31D further includes a connecting section 32D connected to the detection electrode section 31D. The connecting section 32D is formed by depositing (e.g., plating, or forming a foil) a conductive metal, such as copper, onto the first main surface 20A. As shown in Figure 7B, the connecting section 32D is formed linearly downward (towards the fourth side surface 21D) relative to the first main surface 20A. The tip of the connecting section 32D is connected to a detection circuit (not shown) mounted on the first main surface 20A, for example. The detection circuit is a circuit that detects changes in the capacitive component associated with an operation input made to the switch SW4. As shown in Figure 7C, the detection electrode section 31D is formed over the entire width W1 direction of the first side surface 21A.

[0034] Similar to the detection electrode section 31D, the other side detection electrode sections also have connection parts that connect to the detection circuit.

[0035] [Effect] Referring to Figure 8, the operation of the input device according to the first embodiment will be described. For example, when an operation input is made to switch SW4 (for example, near the location shown in the end view of Figure 7C), the user touches or brings their finger F close to switch SW4 (hereinafter referred to as "touch, etc." as appropriate). As a result, as shown in Figure 8, a capacitive component is generated between the finger F and the detection electrode part 31D corresponding to switch SW4. By detecting the change in this capacitive component, an operation input to switch SW4 can be detected. Similarly, operation inputs to other detection electrode parts can be detected.

[0036] [Effects obtained by this embodiment] According to this embodiment, for example, the following effects can be obtained. For example, by forming detection electrode portions on the first side surface 21A and the second side surface 21B, the area of ​​the detection electrode portion facing the finger F can be made larger compared to the first comparative example described above. This makes it possible to increase the change in capacitance when the finger F comes into contact with the detection electrode portion. This makes it possible to reliably detect operational input to the side surface. Since operational input to the side surface can be reliably detected, a switch independent of the switch provided on the main surface can be provided on the side surface. Since it is not necessary to use multiple circuit boards, the input device 1 can be made smaller and lighter. Furthermore, the manufacturing cost of the input device 1 can be reduced. Furthermore, since only a thin film of conductive metal needs to be deposited on the side surface (for example, by plating or as foil), the degree of freedom in the placement of the detection electrode can be improved. In addition, the degree of freedom in the size, area, and shape of the detection electrode can be increased. For example, the shape of the detection electrode can be adjusted according to the distance and angle with the finger F expected during operation input.

[0037] <Second Embodiment> Next, a second embodiment will be described. Unless otherwise specified, the matters described in the first embodiment are also applicable to the first embodiment. Furthermore, identical or similar components are denoted by the same reference numerals, and redundant explanations are omitted as appropriate.

[0038] In this embodiment, the substrate 20 described in the first embodiment (see Figure 6) can be used. In this embodiment, unlike the first embodiment, the side detection electrode portion is formed such that the area of ​​the end face of the side detection electrode portion is larger than the area of ​​the side (for example, the area of ​​the side that overlaps with the area of ​​the end face of the side detection electrode portion).

[0039] Referring to Figures 9A to 9C, the details of the side-side detection electrode sections provided on the first side surface 21A and the second side surface 21B will be described. In Figures 9A to 9C, the detection electrode section 31D is used as an example of the side-side detection electrode section, but the matters described below also apply to other side-side detection electrode sections such as the detection electrode section 31E.

[0040] Figure 9A is an enlarged view of the area near the detection electrode portion 31D formed at a predetermined location on the first side surface 21A, and is a view toward the first side surface 21A. Figure 9B is an enlarged view of the area near the detection electrode portion 31D formed at a predetermined location on the first side surface 21A, and is a view toward the first main surface 20A. Figure 9C is an end view of the substrate 20 when it is cut along the cutting line CC-CC in Figure 9B.

[0041] The detection electrode portion 31D is formed continuously not only on the first side surface 21A, but also from near the end of the first main surface 20A on the side surface 21A side (near the side edge) to the first side surface 21A, and then to near the end of the second main surface 20B on the opposite side on the side surface 21A side. With this configuration, as shown in Figure 9A, when viewed toward the first side surface 21A, the width W2 of the detection electrode portion 31D is larger than the width W1 of the first side surface 21A. As a result, the area of ​​the end face of the detection electrode portion 31D is larger than the area of ​​the first side surface 21A (the area of ​​the first side surface 21A that overlaps with the area of ​​the end face of the detection electrode portion 31D). As shown in Figure 9C, when the detection electrode portion 31D is viewed from the end face when the substrate 20 is cut along the cutting line CC-CC, the detection electrode portion 31D has a shape that is an inverted concave shape.

[0042] The detection electrode section 31D further includes a connecting section 32D connected to the detection electrode section 31D. The connecting section 32D is formed by depositing (e.g., plating, or forming a foil) a conductive metal, such as copper, onto the first main surface 20A. As shown in Figure 9B, the connecting section 32D is formed linearly downward (towards the fourth side surface 21D) relative to the first main surface 20A. The connecting section 32D is connected, for example, to a portion of the detection electrode section 31D that protrudes slightly toward the first main surface 20A. The tip of the connecting section 32D is connected to, for example, a detection circuit (not shown) mounted on the first main surface 20A. The detection circuit is a circuit that detects changes in the capacitive component associated with an operation input made to the detection electrode section 31D.

[0043] Referring to Figure 10, the operation of the input device according to the second embodiment will be described. For example, when performing an operation input to switch SW4 (for example, near the location shown in the end view of Figure 9C), the user touches switch SW4 with their finger F. As a result, a capacitive component is generated between the finger F and the detection electrode 31D, as shown in Figure 10. By detecting the change in this capacitive component, the operation input to switch SW4 can be detected. Similarly, operation inputs to other detection electrode parts can be detected.

[0044] [Effects obtained by this embodiment] According to this embodiment, for example, the following effects can be obtained. For example, by forming detection electrode portions on the first side surface 21A and the second side surface 21B, the area of ​​the detection electrode portion facing the finger F can be made larger compared to the first comparative example described above. Furthermore, the area of ​​the end face of the side detection electrode portion is configured to be larger than the area of ​​the side surface (the area of ​​the side surface that overlaps with the area of ​​the end face of the side detection electrode portion). As a result, when the finger F is brought into contact with the electrode, the area of ​​the side detection electrode portion facing the finger F can be made larger. Therefore, as schematically shown in Figure 10 with two capacitors, the change in the capacitance component (for example, the increase in the capacitance component) when the finger F is brought into contact with the electrode can be made larger than in the first embodiment. As a result, operation input to the side surface can be detected more reliably.

[0045] <Third Embodiment> Next, a third embodiment will be described. Unless otherwise specified, the matters described in the first and second embodiments are also applicable to the third embodiment. Furthermore, identical or similar components are denoted by the same reference numerals, and redundant explanations are omitted where appropriate.

[0046] In the first and second embodiments, a self-capacitive electrostatic switch was described, but the electrostatic switch may also be a mutual-capacitive switch. In the case of a mutual-capacitive switch, the side detection electrode section includes a pair of detection electrodes (transmitting electrode and receiving electrode).

[0047] The side detection electrode portion according to this embodiment will now be described. Figures 11A to 11C are enlarged views of the side detection electrode portion according to this embodiment, for example, the vicinity of the detection electrode portion 31D according to this embodiment. Figure 11A is a view of the detection electrode portion 31D according to this embodiment as seen toward the first side surface 21A. Figure 11B is a view of the detection electrode portion 31D according to this embodiment as seen toward the first main surface 20A. Figure 11C is a view of the detection electrode portion 31D according to this embodiment as seen toward the second main surface 20B. Note that Figure 11C is an inverted version of Figures 11A and 11B.

[0048] As shown in Figure 11A, the detection electrode section 31D includes, for example, a transmitting electrode 33A and a receiving electrode 33B. The transmitting electrode 33A and the receiving electrode 33B are formed linearly by depositing (e.g., plating, or forming a foil) a conductive metal, such as copper, onto the first main surface 20A. As shown in Figures 11A to 11C, the transmitting electrode 33A is formed continuously not only on the first side surface 21A, but also from near the end of the first side surface 21A on the first main surface 20A to the first side surface 21A, and from near the end of the first side surface 21A on the second main surface 20B. As shown in Figures 11A to 11C, the receiving electrode 33B is formed continuously not only on the first side surface 21A, but also from near the end of the first side surface 21A on the first main surface 20A to the first side surface 21A, and from the lower side (upper side in Figure 11C) of the second main surface 20B.

[0049] With this configuration, as shown in Figure 11A, when the first side surface 21A is viewed from above, the widths W3 of the transmitting electrode 33A and the receiving electrode 33B are larger than the width W1 of the first side surface 21A. As a result, the area of ​​the end face of the side detection electrode portion, including the transmitting electrode 33A and the receiving electrode 33B, is larger than the side area (the side area that overlaps with the area of ​​the end face of the side detection electrode portion).

[0050] The tip of the receiving electrode 33B is connected to a detection circuit (not shown) mounted on, for example, the second main surface 20B. The detection circuit is a circuit that detects changes in the capacitance component associated with an operation input made to the detection electrode section 31D.

[0051] When an operation input is made to switch SW4, a finger F makes contact with the detection electrode 31D. This contact causes a change (for example, a decrease) in the capacitance component between the transmitting electrode 33A and the receiving electrode 33B. By detecting this change in capacitance component, an operation input to switch SW4 is detected.

[0052] Thus, the side detection electrode section may include a transmitting electrode and a receiving electrode.

[0053] <Fourth Embodiment> Next, a fourth embodiment will be described. Unless otherwise specified, the matters described in the first to third embodiments are also applicable to the fourth embodiment. Furthermore, identical or similar components are denoted by the same reference numerals, and redundant explanations are omitted where appropriate.

[0054] In this embodiment, a smaller substrate (hereinafter appropriately referred to as small substrate 40) is used, which is smaller in size than the substrate 20. Figure 12 is a perspective view of the small substrate 40 according to this embodiment. The small substrate 40 is, for example, rectangular parallelepiped, and more specifically, has a thin plate shape. The small substrate 40 has a first main surface 40A and a second main surface 40B opposite to the first main surface 40A. The small substrate 40 has, for example, at least one side surface that is substantially perpendicular to the first main surface 40A. In this embodiment, the small substrate 40 has four side surfaces (first side surface 41A, second side surface 41B, third side surface 41C, and fourth side surface 41D) that connect the first main surface 40A and the fourth main surface 40B and are substantially perpendicular to each main surface.

[0055] Figures 13A to 13C are diagrams illustrating a substrate 20 according to a fourth embodiment. Figure 13A is a view of the substrate 20 facing the first main surface 20A. Figure 13B is a view of the substrate 20 facing the first side surface 21A. Figure 13C is a view of the substrate 20 facing the second side surface 21B.

[0056] In this embodiment, a small substrate 40 is attached to the edge of the first main surface 20A near the first side surface 21A. The small substrate 40 is attached by an appropriate method such as adhesive, screw fastening, or soldering. Specifically, the small substrate 40 is attached to the first main surface 20A such that the first side surface 21A of the substrate 20 and the first side surface 41A of the small substrate 40 are substantially on the same plane. In this embodiment, the first side surface 41A functions as a flat surface. Of course, other sides of the small substrate 40 may also function as flat surfaces.

[0057] The small circuit boards 40 are mounted at locations corresponding to the switch SW. As shown in Figures 13A to 13C, in this embodiment, three small circuit boards 40 are mounted near the first side surface 21A of the first main surface 20A. The three small circuit boards 40 are mounted spaced apart along the lateral direction. In addition, two small circuit boards 40 are mounted near the second side surface 21B of the first main surface 20A. The two small circuit boards 40 are mounted spaced apart along the vertical direction.

[0058] With this configuration, a region of the first side surface 41A of the small substrate 40 and a predetermined region of the first side surface 21A adjacent to the first side surface 41A are formed. As shown in Figures 13A and 13C, a conductive metal such as copper is deposited (for example, plated or foil) on these two regions to form a side-side detection electrode portion such as the detection electrode portion 31D. Note that the metal may be deposited after the small substrate 40 is attached to the substrate 20, or the metal may be deposited on both the small substrate 40 and the substrate 20, and then the small substrate 40 may be attached to the substrate 20.

[0059] By attaching the small substrate 40, for example, the area of ​​the end face of the detection electrode portion 31D can be made larger than the area of ​​the first side surface 21A (specifically, the area of ​​the first side surface 21A adjacent to the first side surface 41A). This allows the area of ​​the side detection electrode portion facing the finger F to be made larger when a finger F is brought into contact with the switch SW4 to provide an operational input. As a result, the change in the capacitive component when a finger F is brought into contact can be made larger. Therefore, operational input to the side can be detected more reliably.

[0060] In this embodiment, an example of attaching the small substrate 40 to the substrate 20 has been described, but the substrate to which this embodiment applies may be one in which the small substrate 40 and the substrate 20 are integrated. For example, the substrate according to this embodiment may be manufactured by removing unnecessary parts from a substrate with a relatively large thickness. In this case, the manufacturing process of the substrate can be simplified and costs can be reduced by pre-depositing a conductive metal film on the side surface before removing the unnecessary parts. The small substrate 40 and the substrate 20 may be cut from the same substrate or from different substrates. The thicknesses of the small substrate 40 and the substrate 20 may be the same or different. In this embodiment, an example has been described in which the small substrate 40 is attached only to the first main surface 20A of the substrate 20, but the embodiment is not limited to this. The small substrate 40 may be attached to both the first main surface 20A and the second main surface 20B, or it may be attached only to the second main surface 20B.

[0061] <Fifth Embodiment> Next, a fifth embodiment will be described. Unless otherwise specified, the matters described in the first to fourth embodiments are also applicable to the fifth embodiment. Furthermore, identical or similar components are denoted by the same reference numerals, and redundant explanations are omitted where appropriate.

[0062] This embodiment is an example of expanding the side area using a mounting member that can be attached to the substrate 20.

[0063] Figures 14A and 14B are perspective views illustrating a mounting member (hereinafter appropriately referred to as mounting member 50) according to this embodiment. The mounting member 50 is made of a conductive metal such as copper. The end face of the mounting member 50 has, for example, a roughly Ω shape. The mounting member 50 has a space 51 on its inside that communicates with the external space. The space 51 includes a first space 51B that leads to an open end 51A, and a second space 51C that widens inward from the first space 51B. The width of the open end 51A and the first space 51B is slightly larger than the width of the side surface of the substrate 20. The tip of the second space 51C is the bottom surface 52. The mounting member 50 has a flat portion 53, which is a roughly flat surface, on the opposite side (outside) of the bottom surface 52.

[0064] The mounting members 50 are attached, for example, to locations inside the housing 10 (not shown in Figures 15 and 16) corresponding to the switches SW. For example, the flat portion 53 is fitted into the housing 10. Specifically, mounting members 50 are attached at intervals near the locations where switches SW4, SW5, and SW6 are provided. Also, mounting members 50 are attached at intervals near the locations where switches SW7 and SW8 are provided. In this embodiment, a total of five mounting members 50 are attached inside the housing 10. The circuit board 20 is mounted on these mounting members 50.

[0065] Next, an example of how to attach the mounting members 50 will be described. When housing the circuit board 20 inside the housing 10, the ends of the circuit board 20 are attached to each mounting member 50 provided on the inside of the housing 10. For example, the first side surface 21A is inserted from the open end 51A, and the circuit board 20 is slid toward the space 51 of the mounting member 50. This inserts the circuit board 20 into the second space 51C via the first space 51B. The attachment of the circuit board 20 to the mounting member 50 is completed when the first side surface 21A of the circuit board 20 comes into contact with the bottom surface 52 and the sliding of the mounting member 50 is restricted. Alternatively, the mounting members 50 may be attached to the circuit board 20 beforehand, and then the mounting members 50 and the circuit board 20 may be placed in the housing 10. Or, the circuit board 20 may be placed in the housing 10 first, and then the mounting members 50 may be attached to the circuit board 20.

[0066] Figure 15 is an end view showing the mounting member 50 attached to the substrate 20. When the substrate 20 is attached to the mounting member 50, the first side surface 21A abuts against the bottom surface 52. Also, the inner surface of the first space 51B abuts against the first main surface 20A and the second main surface 20B. This allows the substrate 20 to be stably attached to the mounting member 50. Furthermore, the substrate 20 can be stably supported within the housing 10. Note that it is sufficient that the mounting member 50 is stably supported, and the bottom surface 52 of the mounting member 50 does not necessarily have to be in contact with the first side surface 21A.

[0067] Although not shown in the diagram, when the circuit board 20 is attached to the mounting member 50, an appropriate part of the mounting member 50 is connected to a wiring pattern that leads to the detection circuit. The detection circuit is a circuit that detects changes in the capacitive component associated with the operation input made to each mounting member 50.

[0068] When the substrate 20 is attached to the mounting member 50, a flat portion 53 is located outside the first side surface 21A, which is larger than the area of ​​the first side surface 21A (the area of ​​the first side surface 21A where the mounting member 50 is attached).

[0069] Next, the operation of the mounting member 50 will be explained with reference to Figure 16. In this embodiment, at least a portion of the mounting member 50 functions as a side detection electrode. As shown in Figure 16, when a finger F is brought into contact with the switch SW corresponding to the mounting member 50, a change in the capacitance component (for example, an increase in the capacitance component) occurs. By detecting this change in the capacitance component with the detection circuit described above, it is possible to detect an operation input to the switch SW corresponding to the location where the mounting member 50 is attached.

[0070] The mounting member may have a different shape. The mounting position and number of mounting members 50 can also be changed as appropriate according to the position and number of switches SW. In addition, the mounting member 50 may be made of resin instead of conductive metal. In this case, a conductive metal film may be formed on, for example, the flat portion 53 of the mounting member 50 (e.g., plated, foil). The entire outer surface of the mounting member 50 may also be coated with metal. From the viewpoint of making it easier to detect changes in capacitance components, it is preferable that the area of ​​the flat portion 53 is larger than the area of ​​the first side surface 21A (the area of ​​the first side surface 21A at the location where the mounting member 50 is attached), but they may be the same. Furthermore, not limited to the flat portion 53, the area of ​​the mounting member 50 or the electrode portion provided on the mounting member 50 may be larger than the area of ​​the first side surface 21A (the area of ​​the first side surface 21A at the location where the mounting member 50 is attached), or it may be the same as the area of ​​the first side surface 21A (the area of ​​the first side surface 21A at the location where the mounting member 50 is attached).

[0071] <Variation> Although embodiments of the present invention have been specifically described above, the present invention is not limited to the embodiments described above, and various modifications based on the technical concept of the present invention are possible.

[0072] In the embodiments described above, an example was given in which the detection electrode portion is provided on the main surface, but the detection electrode portion may not be provided on the main surface. The shape of the substrate may be polygonal, circular, or elliptical. The arrangement position and number of the detection electrode portions are not limited to the example in the embodiments described above and can be changed as appropriate. In addition, in the embodiments described above, an example was given in which all switches provided in the input device are capacitive switches, but the input device may be equipped with switches that are not capacitive (for example, mechanical switches such as push buttons).

[0073] The configurations, methods, processes, shapes, materials, and numerical values ​​of the embodiments and modified examples described above can be combined or substituted with each other, as long as they do not depart from the spirit of the present invention. It is also possible to divide one thing into two or more, and to combine two or more things into one. Furthermore, it is possible to omit parts of the invention. Moreover, the effects described herein should not be interpreted as limiting the scope of the present invention. [Explanation of Symbols]

[0074] 1. Input device 10... cabinet 20... circuit board 20A...First main surface 20B...2nd main surface 21A...1st side 21B...Second side 21C...Third side 21D...4th side 31A~31H...Detection electrode section 40... circuit board 41A...1st side 41B...Second side 41C...Third side 41D...4th side 50... Mounting parts 53...Flat area

Claims

1. A substrate having a main surface and at least one side surface substantially perpendicular to the main surface, A side-side detection electrode portion formed on the side surface for detecting changes in capacitance, An input device equipped with the following features.

2. Having a main surface side detection electrode portion formed on the main surface, The side-side detection electrode portion is a different detection electrode from the main-side detection electrode portion. The input device according to claim 1.

3. The side detection electrode portion is formed such that the area of ​​the end face of the side detection electrode portion is larger than the area of ​​the side surface. The input device according to claim 1.

4. The side detection electrode portion has a shape in which an electrode portion formed at a predetermined location on the side and an electrode portion formed near the side end of the main surface are continuously formed. The input device according to claim 3.

5. The side detection electrode section includes a transmitting electrode and a receiving electrode. The input device according to claim 3.

6. The main surface has another substrate provided near the side surface, The aforementioned other substrate has a flat portion that is substantially flush with the side surface, The side detection electrode portion is formed in a predetermined region of the side and in the planar portion adjacent to the predetermined region. The input device according to claim 3.

7. The substrate has a conductive mounting member attached to its side surface, At least a portion of the mounting member functions as the side detection electrode portion. The input device according to claim 1.

8. Multiple side-side detection electrode portions are formed on the aforementioned side surface at intervals from each other. The input device according to claim 1.

9. The main surface detection electrode portion and the side surface detection electrode portion are made of a conductive metal film. An input device according to any one of claims 1 to 8.

10. Having a casing, The aforementioned circuit board is housed in the aforementioned housing, The side detection electrode section is capable of detecting operation from the side of the housing. An input device according to any one of claims 1 to 8.

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