IC tag

Abstract

The present invention provides an IC tag that can reduce the risk of deterioration in communication functionality even when subjected to external forces such as bending. [Solution] The IC tag comprises a substrate having a first surface and a second surface; an IC chip disposed on the first surface of the substrate; a dipole antenna disposed on the first surface of the substrate for electrically transmitting and receiving information stored in the IC chip; a cover bonded to the first surface of the substrate so as to cover the IC chip and the antenna; a first resin layer laminated on at least a portion of the surface of the cover opposite to the surface bonded to the first surface of the substrate; and a second resin layer laminated on at least a portion of the second surface of the substrate. The first resin layer and the second resin layer have a tensile modulus of 2.0 GPa or less.

Description

Technical Field

[0006] , , ,

[0001] The present invention relates to an IC tag.

Background Art

[0002] In recent years, as one type of IC tag, a configuration in which an antenna for radio communication and an IC chip are mounted on a base sheet made of plastic or paper called an inlay has been proposed. Such an inlay is, for example, sealed with resin and used for item management by attaching it to an item or embedding it in an item.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] IC tags as described above may be used in harsh environments where they are subject to external forces such as bending, which may cause the IC chip to peel off from the antenna and the antenna to break. Thus, when the IC chip peels off from the antenna or the antenna breaks, the communication function may deteriorate and ultimately communication may become impossible.

[0005] ​​​​​​​An IC tag according to a first aspect of the present invention comprises a substrate having a first surface and a second surface; an IC chip disposed on the first surface of the substrate; a dipole antenna disposed on the first surface of the substrate for electrically transmitting and receiving information stored in the IC chip; a cover bonded to the first surface of the substrate so as to cover the IC chip and the antenna; a first resin layer laminated on at least a portion of the surface of the cover opposite to the surface bonded to the first surface of the substrate; and a second resin layer laminated on at least a portion of the second surface of the substrate, wherein the first resin layer and the second resin layer have a tensile modulus of 2.0 GPa or less.

[0007] An IC tag according to a second aspect of the present invention is an IC tag according to a first aspect, wherein the ratio of the tensile modulus of the first resin layer to the tensile modulus of the cover is 0.5 or less.

[0008] An IC tag according to a third aspect of the present invention is an IC tag according to the first or second aspect, wherein the thickness of the first resin layer is greater than the thickness of the cover.

[0009] An IC tag according to the fourth aspect of the present invention is an IC tag according to the third aspect, wherein the ratio of the thickness of the first resin layer to the thickness of the cover is 1.0 or more.

[0010] An IC tag according to the fifth aspect of the present invention is an IC tag according to any one of the first to fourth aspects, wherein the ratio of the tensile modulus of the second resin layer to the tensile modulus of the substrate is 0.5 or less.

[0011] An IC tag according to the sixth aspect of the present invention is an IC tag according to any one of the first to fifth aspects, wherein the thickness of the second resin layer is greater than the thickness of the substrate.

[0012] An IC tag according to the seventh aspect of the present invention is an IC tag according to the sixth aspect, wherein the ratio of the thickness of the second resin layer to the thickness of the substrate is 1.0 or more.

[0013] An IC tag according to the eighth aspect of the present invention is an IC tag according to any one of the first to seventh aspects, wherein the bending load is 2.0 N or less. [Effects of the Invention]

[0014] According to the IC tag of the present invention, even when external forces such as bending are applied, the risk of deterioration in communication function can be reduced. [Brief explanation of the drawing]

[0015] [Figure 1] This is a cross-sectional view of the IC tag according to the embodiment. [Figure 2] This is a plan view of the IC tag shown in Figure 1, with the first resin layer and cover removed. [Figure 3] This is a cross-sectional view of a virtual IC tag. [Figure 4] This table shows the specifications of the IC tags in the examples and comparative examples. [Figure 5] This is a cross-sectional view of the IC tag in Comparative Example 1. [Figure 6] This is a table showing the test results. [Modes for carrying out the invention]

[0016] An IC tag according to one embodiment of the present invention will be described below with reference to the drawings.

[0017] <1. Overview of IC tags> Hereinafter, one embodiment of the IC tag according to the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view of the IC tag 10 according to the present embodiment. FIG. 2 is a plan view of the state where the first resin layer 6 and the cover 4 are removed from the IC tag 10 of FIG. 1. As shown in FIGS. 1 and 2, the IC tag according to the present embodiment includes a rectangular substrate 1 having a first surface 11 (upper surface) and a second surface 12 (lower surface), an IC chip 2 and a dipole antenna 3 disposed on the upper surface of the substrate 1, and a cover 4 formed in a rectangular shape covering the IC chip 2 and the dipole antenna 3. The cover 4 is fixed to the first surface 11 of the substrate 1 by an adhesive 5. Hereinafter, each of these members will be described in detail.

[0018] The material constituting the substrate 1 is not particularly limited. For example, it can be formed of polyester resins such as low-density polyethylene, high-density polyethylene, polypropylene, polyethylene naphthalate, polyamide 6, polyamide 66, polyvinyl chloride, polyethylene terephthalate, or polyimide resins. Further, the thickness of the substrate 1 is not particularly limited, but for example, it is preferably 25 μm or more and 200 μm or less, and more preferably 50 μm or more and 150 μm or less.

[0019] Hereinafter, for convenience of explanation, as shown in FIG. 2, the sides in the longitudinal direction of the substrate 1 will be referred to as the first side 101 and the second side 102, and the sides in the short direction will be referred to as the third side 103 and the fourth side 104. These sides are connected in the order of the first side 101, the third side 103, the second side 102, and the fourth side 104.

[0020] The IC chip 2 is a known one having a memory function and is electrically connected to a dipole antenna 3 formed of a conductor.

[0021] In this embodiment, as an example, a dipole antenna 3 as shown in Figure 2 is used. The dipole antenna 3 comprises an impedance matching section 31 positioned near the center of the longitudinal direction of the base material 1, and a pair of dipole sections 32 extending from the impedance matching section 31 in the longitudinal direction of the base material 1. The impedance matching section 31 is formed in the shape of a rectangular frame having first to fourth sides. More specifically, the first side 311 of the impedance matching section 31 is positioned slightly away from the first side 101 of the base material 1, and the second side 312 is positioned along the second side 102 of the base material 1. That is, the impedance matching section 31 is connected in the order of the first side 311, the third side 313, the second side 312, and the fourth side 314. The IC chip 2 is positioned near the center of the first side 311 of the impedance matching section 31.

[0022] Since the dipole section 32 has a symmetrical shape, only the left side of Figure 2 will be described. The dipole section 32 extends from the first side 311 of the impedance matching section 31 toward the first side 101 of the base material 1, and from there extends along the first side 101 of the base material 1, and further extends along the third side 103 and the second side 102, and this is repeated. The thickness of the dipole antenna 3 is not particularly limited, but for example it can be 5 μm or more and 20 μm or less.

[0023] The materials used to construct the dipole antenna 3 are not particularly limited, but can be made from conductive materials such as silver, copper, or aluminum. When using silver, the dipole antenna 3 can be formed by applying a silver paste containing silver onto the substrate 1 by screen printing. When using copper or aluminum, the dipole antenna 3 can be formed by etching, for example. The IC chip 2 may be fixed to the dipole antenna 3 with a conductive adhesive, for example. Alternatively, the IC chip 2 can be fixed to the dipole antenna 3 using known flip-chip mounting methods for electronic components. The thickness of the IC chip 2 is not particularly limited, but can be between 100 μm and 150 μm.

[0024] With the dipole antenna 3 described above, for example, information stored in the IC chip 2 can be transmitted and received using UHF band radio waves.

[0025] The material constituting the cover 4 is not particularly limited, but it is preferably a material that can be deformed by heat. The material constituting the cover 4 may be, for example, the same material as the base material 1. The thickness of the cover 4 is not particularly limited, but it is preferably 25 μm or more and 250 μm or less, and more preferably 50 μm or more and 150 μm or less.

[0026] The adhesive 5 can be formed from a material primarily composed of, for example, an acrylic thermosetting resin, an ester thermosetting resin, an epoxy thermosetting resin, or a polyimide thermosetting resin. A thermoplastic adhesive can also be used for the adhesive 5.

[0027] The IC tag 10 may be used in harsh environments where it is subjected to external forces such as bending. In a typical example, the IC tag 10 is attached to clothing. Therefore, when clothing to which the IC tag 10 is attached is washed in a washing machine, the IC tag 10 is subjected to a large external force in the bending direction. In this embodiment, the IC tag 10 further includes a first resin layer 6 and a second resin layer 7 to suppress the detachment of the IC chip 2 from the dipole antenna 3 and the disconnection of the dipole antenna 3 (hereinafter, this may be collectively referred to as "deterioration of the communication function of the IC tag 10") even when subjected to a large external force in the bending direction.

[0028] The first resin layer 6 suppresses excessive plastic deformation of the cover 4 even when subjected to a large external force in the bending direction. The first resin layer 6 is laminated on at least a portion of the surface of the cover 4 opposite to the surface that is joined to the first surface 11 of the base material 1. In this embodiment, the first resin layer 6 is laminated on almost the entire surface of the cover 4 opposite to the surface that is joined to the first surface 11 of the base material 1.

[0029] The material constituting the first resin layer 6 is not particularly limited as long as its tensile modulus is 2.0 GPa or less. The material constituting the first resin layer 6 may be an adhesive, a bonding sheet containing the adhesive, or a coating material. The adhesive is, for example, an epoxy adhesive. The coating material is an elastomer such as rubber. The rubber is not particularly limited and examples include nitrile rubber, chloroprene rubber, chlorosulfonated polyethylene, polybutadiene rubber, natural rubber, ethylene propylene rubber (EPM), ethylene propylene diene rubber (EPDM), hydrogenated nitrile rubber (H-NBR), millable urethane, acrylic rubber, silicone rubber, fluororubber, carboxylated nitrile rubber, etc. These rubbers may be used individually or in mixtures of two or more. These rubbers may also be used in mixtures with at least one of the adhesive and the bonding sheet. The tensile modulus of the first resin layer 6 is measured according to IPC-TM-650 "Reliability testing of electronic components and printed circuit boards" or JIS K7127 1999 "Plastics - Test methods for tensile properties - Part 3: Test conditions for films and sheets".

[0030] From the viewpoint of suppressing large plastic deformation of the cover 4, the tensile modulus of the first resin layer 6 is preferably 1.0 GPa or less, and more preferably 0.5 GPa or less.

[0031] From the viewpoint of suppressing large plastic deformation of the cover 4, the ratio of the tensile modulus of the first resin layer 6 to the tensile modulus of the cover 4 is preferably 0.5 or less, more preferably 0.25 or less, and even more preferably 0.125 or less.

[0032] The thickness of the first resin layer 6 is not particularly limited. From the viewpoint of suppressing large plastic deformation of the cover 4, the thickness of the first resin layer 6 is preferably 25 μm or more, more preferably 50 μm or more, and even more preferably 100 μm or more. From the viewpoint of improving the flexibility of the IC tag 10, the thickness of the first resin layer 6 is preferably 300 μm or less, more preferably 250 μm or less, and even more preferably 200 μm or less. The preferred ranges for the thickness of the first resin layer 6 are 25 μm or more and 300 μm or less, 25 μm or more and 250 μm, 25 μm or more and 200 μm, 50 μm or more and 300 μm or less, 50 μm or more and 250 μm, 50 μm or more and 200 μm, 100 μm or more and 300 μm or less, or 100 μm or more and 250 μm, or 100 μm or more and 200 μm or less.

[0033] From the viewpoint of suppressing significant plastic deformation of the cover 4, it is preferable that the thickness of the first resin layer 6 is greater than the thickness of the cover 4.

[0034] From the viewpoint of suppressing large plastic deformation of the cover 4, the ratio of the thickness of the first resin layer 6 to the thickness of the cover 4 is preferably 1.0 or more, more preferably 1.5 or more, and even more preferably 2.0 or more.

[0035] The second resin layer 7 suppresses excessive plastic deformation of the base material 1 even when subjected to a large external force in the bending direction. The second resin layer 7 is laminated on at least a portion of the second surface 12 of the base material 1. In this embodiment, the second resin layer 7 is laminated on almost the entire second surface 12 of the base material 1.

[0036] The material constituting the second resin layer 7 is not particularly limited as long as its tensile modulus is 2.0 GPa or less. The material constituting the second resin layer 7 may be an adhesive, a bonding sheet containing the adhesive, or a coating material. The adhesive is, for example, an epoxy adhesive. The coating material is an elastomer such as rubber. The rubber is not particularly limited and examples include nitrile rubber, chloroprene rubber, chlorosulfonated polyethylene, polybutadiene rubber, natural rubber, ethylene propylene rubber (EPM), ethylene propylene diene rubber (EPDM), hydrogenated nitrile rubber (H-NBR), millable urethane, acrylic rubber, silicone rubber, fluororubber, carboxylated nitrile rubber, etc. These rubbers may be used individually or in mixtures of two or more. These rubbers may also be mixed with at least one of the adhesive and the bonding sheet. The tensile modulus of the second resin layer 7 is measured by the same method as for the first resin layer 6.

[0037] From the viewpoint of suppressing large plastic deformation of the base material 1, the tensile modulus of the second resin layer 7 is preferably 1.0 GPa or less, and more preferably 0.5 GPa or less.

[0038] The thickness of the second resin layer 7 is not particularly limited. From the viewpoint of suppressing large plastic deformation of the substrate 1, the thickness of the second resin layer 7 is preferably 25 μm or more, more preferably 50 μm or more, and even more preferably 100 μm or more. From the viewpoint of improving the flexibility of the IC tag 10, the thickness of the second resin layer 7 is preferably 300 μm or less, more preferably 250 μm or less, and even more preferably 200 μm or less. The preferred ranges for the thickness of the second resin layer 7 are 25 μm or more and 300 μm or less, 25 μm or more and 250 μm, 25 μm or more and 200 μm, 50 μm or more and 300 μm or less, 50 μm or more and 250 μm, 50 μm or more and 200 μm, 100 μm or more and 300 μm or less, or 100 μm or more and 250 μm, or 100 μm or more and 200 μm or less.

[0039] From the viewpoint of suppressing large plastic deformation of the base material 1, it is preferable that the thickness of the second resin layer 7 is greater than the thickness of the base material 1.

[0040] From the viewpoint of suppressing large plastic deformation of the base material 1, the ratio of the thickness of the second resin layer 7 to the thickness of the base material 1 is preferably 1.0 or more, more preferably 1.5 or more, and even more preferably 2.0 or more.

[0041] From the viewpoint of suppressing large plastic deformation of the base material 1, the ratio of the tensile modulus of the second resin layer 7 to the tensile modulus of the base material 1 is preferably 0.5 or less, more preferably 0.25 or less, and even more preferably 0.125 or less.

[0042] From the viewpoint of enhancing the flexibility of the IC tag 10, the bending load of the IC tag 10 is preferably 2.0 N or less, more preferably 1.5 N or less, and even more preferably 1.0 N or less. When the bending load of the IC tag 10 is 2.0 N or less, the clothing to which the IC tag 10 is attached is less likely to be damaged when washed in a washing machine.

[0043] The bending load of the IC tag 10 is measured using a bending load measuring device (IMADA Force Gauge ZTS-200N). To measure the bending load of the IC tag 10, a jig is placed between a pair of support bases, with a distance of 16 mm between the two support bases. Next, the IC tag 10 is positioned so as to straddle the pair of support bases. Then, the portion of the IC tag 10 between the two support bases is pressed down at a speed of 10 mm / min using the attachment of the bending load measuring device, and the load when the attachment has been lowered by 5 mm is taken as the bending load of the IC tag 10.

[0044] <2. Features> Figure 3 is a cross-sectional view of a hypothetical IC tag 10X (hereinafter referred to as "IC tag 10X") that does not have the first resin layer 6 and the second resin layer 7. The IC tag 10X comprises a rectangular base material 1X having a first surface 11X and a second surface 12X, an IC chip 2X and a dipole antenna 3X placed on the upper surface of the base material 1X, and a rectangular cover 4X that covers the IC chip 2X and the dipole antenna 3X. The cover 4X is fixed to the first surface 11X of the base material 1X by adhesive 5X. The IC tag 10X has the same configuration as the IC tag 10 of this embodiment, except that it does not have the first resin layer 6 and the second resin layer 7.

[0045] The IC tag 10X is highly flexible because no arbitrary materials are laminated on the outside of the cover 4 or on the second surface 12X of the base material 1. Therefore, if an external force is applied to the IC tag 10X that causes it to bend near the center XA in the longitudinal direction, as indicated by the arrow in Figure 3, the cover 4X will undergo significant plastic deformation in the stretching direction.

[0046] When the external force is removed, the IC tag 10X attempts to return to its original shape. The adhesive 5X returns to its original length, but the stretched portion of the cover 4X does not, causing wrinkles to form in the cover 4X. Repeated bending and unbending of the IC tag 10X causes the wrinkles in the cover 4X to become larger. If large wrinkles form in the area of ​​the cover 4X that covers the IC chip 2X, a gap is formed on the IC chip 2X, making it easier for the IC chip 2X to detach from the dipole antenna 3X.

[0047] In this embodiment, the IC tag 10 has a cover 4 with a first resin layer 6 having a tensile modulus of elasticity of 2 GPa or less laminated on it. The cover 4 is prevented from undergoing large plastic deformation in the stretching direction by the first resin layer 6, thus suppressing the formation of wrinkles in the cover 4. As a result, the delamination of the IC chip 2 from the dipole antenna 3 is suppressed.

[0048] Furthermore, when the IC tag 10X is bent back, a force acts on the cover 4X in a direction that causes it to peel away from the adhesive 5X. As a result, the cover 4X may peel away from the adhesive 5X. If the IC tag 10X is bent while the cover 4X is peeled away from the adhesive 5X, stress will concentrate at the boundary between the part of the cover 4X that is bonded to the base material 1X by the adhesive 5X and the peeled part, which may cause the dipole antenna 3X to break.

[0049] In this embodiment, the first resin layer 6 prevents the cover 4 from undergoing significant plastic deformation in the stretching direction of the IC tag 10. Therefore, when the IC tag 10 is bent back, the force acting on the cover 4 in the direction of peeling from the adhesive 5 is weak. Because the cover 4 is less likely to peel from the adhesive 5, the risk of the dipole antenna 3 breaking is suppressed.

[0050] When the IC tag 10X is bent back, a force acts on the base material 1X in a direction that causes it to detach from the dipole antenna 3X, which can cause the base material 1X to detach from the dipole antenna 3X. If the IC tag 10X is bent while the base material 1X is detached from the dipole antenna 3X, stress will concentrate at the boundary between the part of the base material 1X that is joined to the dipole antenna 3X and the detached part, which may cause the dipole antenna 3X to break.

[0051] In this embodiment, the IC tag 10 has a second resin layer 7 with a tensile modulus of elasticity of 2 GPa or less laminated on the second surface 12 of the base material 1. In this embodiment, the second resin layer 7 prevents the base material 1 from undergoing large plastic deformation in the shrinking direction, so the force acting on the base material 1 when the IC tag 10 is bent back is weak in the direction of delamination from the dipole antenna 3. Therefore, the base material 1 is less likely to delaminate from the dipole antenna 3, and thus the breakage of the dipole antenna 3 is suppressed.

[0052] <3. Variant> The above embodiments are illustrative of possible forms of the IC tag according to the present invention and are not intended to limit its form. The IC tag according to the present invention may take forms different from those illustrated in the embodiments. For example, a form in which some of the configurations of the embodiments are replaced, modified, or omitted, or a form in which new configurations are added to the embodiments. Several examples of modifications of the embodiments are shown below. Note that the following modifications can be combined with each other to the extent that they are not technically contradictory.

[0053] <3-1. First variation> The shape of the dipole antenna 3 in this embodiment is just one example and can be changed to various shapes. Furthermore, the position of the IC chip 2 on the dipole antenna 3 is not particularly limited. Moreover, various types of dipole antennas can be used; in addition to the dipole antenna 3 used in this embodiment, a patch antenna may also be used. In other words, the shape of the dipole antenna 3 is not particularly limited, and various forms are possible.

[0054] <3-2. Second variation> The shape of the IC tag 10, that is, the shape of the base material 1, cover 4, first resin layer 6, and second resin layer 7, is not particularly limited and can be made into various shapes such as rectangular, circular, polygonal, etc., in addition to the elongated shape described above, depending on the application. Furthermore, the base material 1 and cover 4 do not necessarily have to be the same shape, and it is sufficient that the IC chip 2 and dipole antenna 3 are placed between the base material 1 and cover 4.

[0055] <4. Examples> The inventors of the present invention manufactured IC tags of Examples 1 and 2 and Comparative Examples 1 to 4, and conducted tests to confirm their durability and flexibility. For the sake of explanation, in the following description, elements constituting the IC tags of Examples 1 and 2 and Comparative Examples 1 to 4 that are the same as those in the embodiments will be denoted by the same reference numerals as in the embodiments.

[0056] Figure 4 is a table showing the specifications of the IC tags for Examples 1 and 2, and Comparative Examples 1 to 4. The IC tags in Examples 1 and 2 are IC tags of the embodiment. The materials constituting the base material 1 and cover 4 of the IC tags in Examples 1 and 2 are polyethylene terephthalate. The tensile modulus of polyethylene terephthalate is 3.9 GPa. The material constituting the adhesive 5 of the IC tags in Examples 1 and 2 is an epoxy thermosetting resin. The materials constituting the first resin layer 6 and second resin layer 7 of the IC tags in Examples 1 and 2 are bonding sheets containing epoxy adhesive. The modulus of the bonding sheet is 0.3 GPa.

[0057] Figure 5 is a cross-sectional view of the IC tag of Comparative Example 1. The IC tag of Comparative Example 1 comprises a rectangular base material 1Y having a first surface 11Y and a second surface 12Y, an IC chip 2Y and a dipole antenna 3Y disposed on the upper surface of the base material 1Y, and a rectangular cover 4Y that covers the IC chip 2Y and the dipole antenna 3Y. The cover 4Y is fixed to the first surface 11Y of the base material 1Y by adhesive 5Y. In the IC tag of Comparative Example 1, a laminate material 6Y is laminated onto the cover 4Y. The laminate material 6Y is bonded to the cover 4Y by adhesive 8Y. In the IC tag of Comparative Example 1, a laminate material 7Y is laminated onto the second surface 12Y of the base material 1Y. The laminate material 7Y is bonded to the base material 1Y by adhesive 9Y.

[0058] The materials constituting the base material 1Y and cover 4Y of the IC tag in Comparative Example 1 are polyethylene terephthalate. The tensile modulus of the polyethylene terephthalate constituting the base material 1Y and cover 4Y is 3.9 GPa. The material constituting the adhesive 5Y of the IC tag in Comparative Example 1 is an epoxy thermosetting resin. The materials constituting the laminate material 6Y and laminate material 7Y of the IC tag in Comparative Example 1 are polyethylene terephthalate. The tensile modulus of the polyethylene terephthalate constituting the laminate materials 6Y and 7Y is 3.9 GPa. The materials constituting the adhesive materials 8Y and 9Y of the IC tag in Comparative Example 1 are acrylic adhesive tape (No. 5000NS manufactured by Nitto Denko Corporation).

[0059] The IC tags of Comparative Examples 2-4 are IC tags relating to the hypothetical IC tag 10X shown in Figure 3. The materials constituting the base material 1X and cover 4X of the IC tags of Comparative Examples 2-4 are polyethylene terephthalate. The tensile modulus of polyethylene terephthalate is 3.9 GPa. The material constituting the adhesive 5X of the IC tags of Comparative Examples 2-4 is an epoxy thermosetting resin.

[0060] In the test, IC tags from Examples 1 and 2, and Comparative Examples 2-4 were attached to cotton T-shirts using name labels (manufactured by NLC Co., Ltd.), and the T-shirts with the attached IC tags were washed and dried in a washer-dryer. The capacity of the washer-dryer used in the test was 20 kg, the washing time was 40 minutes, and the drying time was 120 minutes. The drying temperature was 90°C. In the test, 30 T-shirts each with IC tags from Examples 1 and 2 and Comparative Examples 2-4 were prepared, and all T-shirts were washed and dried 100 times. After that, the reading distance was measured for each IC tag, and IC tags with a reading distance retention rate of 50% or more were judged as not having a malfunction, while IC tags with a reading distance retention rate of less than 50% were judged to have a malfunction. In addition, the bending load was measured for the IC tags from Examples 1 and 2 and Comparative Examples 2-4 using the method described in the embodiment.

[0061] Figure 6 is a table showing the test results. The IC tags in Examples 1 and 2 were confirmed not to have experienced any malfunctions. Therefore, it was confirmed that the IC tags in Examples 1 and 2 are less likely to experience a decrease in communication function even when subjected to external forces such as bending. Furthermore, it was confirmed that the IC tags in Examples 1 and 2 have a bending load of 2.0 N or less, meaning they are highly flexible. Therefore, it was confirmed that the IC tags in Examples 1 and 2 are less likely to damage clothing during washing, even when attached to clothing.

[0062] Although no malfunction occurred in the IC tag of Comparative Example 1, it was confirmed that it exhibited a high bending load. Therefore, it was confirmed that the IC tag of Comparative Example 1 is highly likely to damage clothing during washing or other processes when attached to clothing.

[0063] It was confirmed that the IC tags in Comparative Examples 2-4 were malfunctioning. This is thought to be because the IC tags in Comparative Examples 2-4 lacked the first resin layer 6 and the second resin layer 7, resulting in lower durability. [Explanation of Symbols]

[0064] 1: Base material 2: IC chip 3: Dipole antenna 4: Cover 6: 1st resin layer 7: Second resin layer 11: 1st page 12:Second side

Claims

1. A substrate having a first surface and a second surface, An IC chip disposed on the first surface of the substrate, A dipole antenna is disposed on the first surface of the substrate and electrically transmits and receives information stored in the IC chip, A cover is bonded to the first surface of the substrate so as to cover the IC chip and the dipole antenna, A first resin layer is laminated on at least a portion of the surface of the cover opposite to the surface of the substrate that is joined to the first surface, The substrate comprises a second resin layer laminated on at least a portion of the second surface, The first resin layer and the second resin layer have a tensile modulus of 2.0 GPa or less. IC tag.

2. The ratio of the tensile modulus of the first resin layer to the tensile modulus of the cover is 0.5 or less. The IC tag according to claim 1.

3. The thickness of the first resin layer is greater than the thickness of the cover. The IC tag according to claim 1 or 2.

4. The ratio of the thickness of the first resin layer to the thickness of the cover is 1.0 or greater. The IC tag according to claim 1 or 2.

5. The ratio of the tensile modulus of the second resin layer to the tensile modulus of the substrate is 0.5 or less. The IC tag according to claim 1 or 2.

6. The thickness of the second resin layer is greater than the thickness of the substrate. The IC tag according to claim 1 or 2.

7. The ratio of the thickness of the second resin layer to the thickness of the substrate is 1.0 or greater. The IC tag according to claim 1 or 2.

8. The bending load is 2.0 N or less. The IC tag according to claim 1 or 2.

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