Conductive structure, cover plate assembly, and battery cell

Abstract

The present invention provides a conductive structure, cover plate assembly, and battery cell that can improve the insufficient current tolerance of composite poles. [Solution] The conductive structure 10 comprises a first metal column and a second metal layer 2. The first metal column has opposing first ends 11 and second ends 12. The second metal layer 2 is bonded to the surface of the first metal column, covering the first end 11 and extending to the second end 12, and the second metal layer 2 is used to connect to a tab. Here, along the axial direction of the first metal column, the distance between the end of the second metal layer 2 and the end face of the second end 12 is H1, the thickness of the first metal column is D2, and the ratio of H1 to D2 is 0 or more and 0.8 or less.

Description

[Technical Field]

[0001] This application claims priority based on the Chinese application No. 202422195863.0 filed on September 6, 2024, and incorporates all the provisions contained herein. This application relates to the technology of batteries, and more specifically to conductive structures, cover plate assemblies, and battery cells. [Background technology]

[0002] Electrode poles are crucial components that connect the inside and outside of a cell (also called a battery cell). Typically, one end of the electrode pole is connected to the external circuitry of the cell, for example, to a busbar on a module, and the other end is connected to the internal circuitry of the cell, for example, to a tab on the electrode assembly via a current collector. Currently, most electrode poles are made of a single metal; for example, the positive electrode pole is made of aluminum and the negative electrode pole is made of copper. However, electrode poles made of a single metal tend to present problems in terms of welding difficulty. Taking the case of a pure copper electrode pole as an example, when laser welding a pure copper electrode pole to a terminal pressing block, the terminal pressing block is generally made of aluminum to reduce cost and cell weight. However, because aluminum and copper have different melting points, laser welding is prone to failure and cracking.

[0003] To reduce the difficulty of welding, composite poles have been developed in related technologies. These composite poles consist of two metal layers, one above the other, made of different materials, which are joined by friction welding or punching. Taking the case of a negative pole as an example, the composite pole includes an aluminum layer and a copper layer. When a composite pole is constructed by laminating two metal layers of different materials, the path of the current flowing through the composite pole becomes longer, increasing the resistance of the composite pole and resulting in insufficient current handling capacity. [Overview of the project]

[0004] Embodiments of the present invention provide a conductive structure, a cover plate assembly, and a battery cell that can improve the problem of insufficient current tolerance capacity of composite poles.

[0005] In a first embodiment, an embodiment of the present application provides a conductive structure comprising a first metal column and a second metal layer, The first metal column has opposite first and second ends, The second metal layer is bonded to the surface of the first metal column, covers the first end and extends to the second end, and is used to connect to a tab. Along the axial direction of the first metal column, the distance between the end of the second metal layer and the end face of the second end is H1, the thickness of the first metal column is D2, and the ratio of H1 to D2 is 0 or more and 0.8 or less.

[0006] In one embodiment, the ratio of H1 to D2 is 0.25 or more and 0.5 or less.

[0007] In one embodiment, H1 is 0 to 3.2 mm and / or D2 is 4 mm to 8 mm.

[0008] In one embodiment, the bonding area between the second metal layer and the first metal column 1 is 20 mm². 2 That's all.

[0009] In one embodiment, the bonding area is 80 mm². 2 That's all.

[0010] In one embodiment, the average thickness of the second metal layer is 3 mm or less.

[0011] In one embodiment, the average thickness of the second metal layer is 0.2 mm or more and 1.5 mm or less.

[0012] In one embodiment, the volume of the second metal layer is smaller than the volume of the first metal column, and the ratio of the volume of the second metal layer to the volume of the first metal column is 0.1 or more and 0.65 or less.

[0013] In one embodiment, on the outer surface of the conductive structure, the ratio of the surface area of the second metal layer to the surface area of the first metal pillar is 0.25 or more.

[0014] In one embodiment, the diameter of the conductive structure is 10 mm or less, and the ratio of the surface area of the second metal layer to the surface area of the first metal pillar is 0.25 or more and 0.6 or less.

[0015] In one embodiment, the diameter of the conductive structure is greater than 10 mm and 30 mm or less, and the ratio of the surface area of the second metal layer to the surface area of the first metal pillar is 0.75 or more and 2 or less.

[0016] In one embodiment, the second metal layer includes a first segment and a second segment, the first segment corresponds to the end face of the first end, and the second segment corresponds to the side surface of the first metal pillar.

[0017] In one embodiment, a boss portion protruding in the radial direction is formed on the first metal pillar, and the second metal layer extends at least to the boss portion.

[0018] In one embodiment, the boss portion is located at the first end, and the second segment covers at least the side surface of the boss portion and the surface of the boss portion close to the second end.

[0019] In one embodiment, the conductive structure is an integrally provided pole column and current collecting member, where the boss portion is the current collecting member, and the current collecting member is used to be directly connected to the tab.

[0020] In one embodiment, the boss portion is far from the first end, the radial dimension of the boss portion is larger than the radial dimension of the first end, the second metal layer further includes a third segment, the third segment corresponds to the surface of the boss portion close to the first end, and the second segment connects the first segment and the third segment.

[0021] In one embodiment, the third segment is formed at the end of the second metal layer, and the third segment is fitted into the boss portion.

[0022] In one embodiment, the boss portion is located at the second end, a part of the boss portion is exposed to the outside of the second metal layer, and the conductive structure is integrally provided pole post and terminal pressing block, where the boss portion is the terminal pressing block.

[0023] In one embodiment, the boss portion is located between the first end and the second end, the radial dimension of the boss portion is further greater than the radial dimension of the second end, the second metal layer further includes a fourth segment, the fourth segment corresponds to the side surface of the boss portion, and the fourth segment is connected to the third segment.

[0024] In one embodiment, the second metal layer further includes a fifth segment, the fifth segment corresponding to a side surface away from the first end of the boss portion, and the fourth segment connecting the fifth segment and the third segment.

[0025] In one embodiment, a portion of the end face of the first end is recessed to form a recess, and the first segment includes a first subsegment, a second subsegment, and a third subsegment that are connected in sequence, the first subsegment being located outside the recess, the second subsegment being located on the side wall of the recess, and the third subsegment being located on the bottom wall of the recess.

[0026] In one embodiment, the first metal column is an aluminum column, the second metal layer is a copper layer, and / or the bonding interface between the second metal layer and the first metal column has a rough microstructure, and / or the conductivity of the second metal in the second metal layer is greater than the conductivity of the first metal in the first metal column.

[0027] In a second embodiment, an embodiment of the present application provides a cover plate assembly, which is a cover plate assembly, Cover plate and The device comprises the aforementioned conductive structure which is provided through the cover plate.

[0028] In one embodiment, the conductive structure is an electrode column, and the cover plate assembly further comprises a flow concentrator, the flow concentrator located on one side of the cover plate and directly connected to the conductive structure.

[0029] In one embodiment, the conductive structure is an integrally provided pole post and terminal pressing block, The cover plate assembly further comprises a current collector, the current collector being located on one side of the cover plate and directly connected to the conductive structure, and the terminal pressing block pressing against the other side of the cover plate.

[0030] In one embodiment, the cover plate is The cover plate body and A first insulating member is provided between the conductive structure and the cover plate body, The cover plate body and the current collector member are provided together, and the second insulating member is provided between them. The cover plate assembly further comprises a sealing member provided between the cover plate and the conductive structure.

[0031] In a third embodiment, an embodiment of the present application provides a battery cell, the battery cell is, A housing having an enclosure, An electrode assembly provided within the aforementioned housing cavity and having a tab, The present invention comprises the aforementioned cover plate assembly, wherein the cover plate is connected to the housing and seals the opening of the housing cavity, and the conductive structure is connected to the tab. [Effects of the Invention]

[0032] The conductive structure according to the embodiment of the present application comprises a first metal column and a second metal layer. The second metal layer is bonded to the surface of the first metal column and is configured to extend from the surface of the first end of the first metal column to the second end. This not only effectively increases the bonding area between the second metal layer and the first metal column 1, but also shortens the distance between the end of the second metal layer and the second end of the first metal column, thereby shortening the current path. The combined effect of these two things improves the current tolerance of the conductive structure. [Brief explanation of the drawing]

[0033] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used to describe the embodiments are briefly introduced below. Clearly, the drawings described below represent only a few embodiments of this application. Those skilled in the art can obtain other drawings based on these without any creative effort.

[0034] [Figure 1] This is a front view of the first conductive structure according to an embodiment of the present application. [Figure 2] Figure 1 is a cross-sectional view of the conductive structure. [Figure 3] This is a front view of a second conductive structure according to an embodiment of the present application. [Figure 4] Figure 3 is a cross-sectional view of the conductive structure. [Figure 5] This is a three-dimensional structural diagram of the third conductive structure according to the embodiment of the present application. [Figure 6] Figure 5 is a cross-sectional view of the conductive structure. [Figure 7] This is a cross-sectional view of the fourth conductive structure according to the embodiment of the present application. [Figure 8] This is a cross-sectional view of the fifth conductive structure according to the embodiment of the present application. [Figure 9] This is an exploded view of a cover plate assembly according to an embodiment of the present application. [Figure 10] This is a cross-sectional diagram of a battery cell according to an embodiment of the present application. [Figure 11] This is a cross-sectional structural diagram of the pole column according to Embodiment 1 of the present application. [Modes for carrying out the invention]

[0035] The technical proposal according to embodiments of the present application will be described below clearly and completely with reference to the accompanying drawings of embodiments of the present application. Clearly, the embodiments described are only a selection of embodiments of the present application, not all embodiments. All other embodiments that can be obtained by those skilled in the art without creative work based on embodiments of the present application are included in the scope of protection of the present application.

[0036] It should be understood that the specific embodiments described herein are used solely for the purpose of illustrating and interpreting this application and are not intended to limit it. In this application, unless otherwise stated, directional terms such as “up” and “down” generally refer to the top and bottom in the actual use or operating state of the device, specifically the drawing direction in the drawings, while “inside” and “outside” refer to the contour of the device.

[0037] The terms “first” and “second” are used solely for descriptive purposes and should not be understood as indicating or implying relative importance, or implicitly specifying the number of technical features. Therefore, features limited by “first” or “second” may explicitly or implicitly include one or more of the aforementioned features. In the description herein, unless otherwise specified, “multiple” means two or more.

[0038] In this description, the terms “attachment,” “connection,” and “connection” should be understood broadly unless otherwise explicitly stated or limited. For example, a fixed connection may be a detachable or integral connection. A mechanical connection may be an electrical connection or a communication connection. A direct connection may be an indirect connection via an intermediate medium, or an internal connection or interaction relationship between two elements. A person skilled in the art will understand the specific meaning of the aforementioned terms in this description according to the specific context.

[0039] Furthermore, since the terms “includes,” “equipment,” and other variations thereof are intended in this specification to cover non-exclusive inclusion, it should be noted that a process, method, article, or apparatus that includes a set of elements not only includes those elements but also includes other elements not expressly listed, or elements specific to the process, method, article, or user. Unless otherwise restricted, an element limited by the phrase “includes one…” does not exclude the presence of other identical elements in a process, method, article, or user apparatus that include that element.

[0040] In the description of embodiments of this Application, words such as “exemplary” or “for example” are used to indicate examples, descriptions, or descriptions. Any embodiment or design described as “exemplary” or “for example” in the embodiments of this Application should not be construed as being preferable or advantageous to other embodiments or designs. The use of words such as “exemplary” or “for example” is intended to clearly present relative concepts.

[0041] To facilitate understanding of the solution of this application, spline curves and arrows used by symbols in the drawings are described here. Components indicated by spline curves without arrows are substantial components, that is, components with a physical structure. Components indicated by spline curves with arrows are virtual components, that is, components without a physical structure.

[0042] To address the problem of insufficient current tolerance capacity of composite poles, embodiments of the present invention provide a conductive structure, a cover plate assembly, and a battery cell.

[0043] In a first embodiment, an embodiment of the present invention provides a conductive structure for connecting the internal circuit of a battery cell to the external circuit of the battery cell (simply referred to as the external circuit), thereby enabling communication between the battery cell and the external circuit, allowing the external circuit to supply power to the battery cell (i.e., charging the battery cell), or allowing the battery cell to supply power to the external circuit (i.e., discharging the battery cell). Specifically, the conductive structure can be used to be attached to the cover plate of a battery cell.

[0044] Specifically, refer to Figures 1 to 9. The conductive structure 10 comprises a first metal column 1 and a second metal layer 2, the second metal layer 2 being bonded to the surface of the first metal column 1. The first metal column 1 has opposing ends, which are a first end 11 and a second end 12, respectively. The second metal layer 2 is used to cover the first end 11 and extend to the second end 12, and to connect to a tab. Here, along the axial direction of the first metal column 1, the distance between the end 20 of the second metal layer 2 and the end face of the second end 12 is H1, the thickness of the first metal column 1 is D2, and the ratio of H1 to D2 is 0 or more and 0.8 or less.

[0045] The conductive structure 10 comprises a first metal column 1 and a second metal layer 2. The first metal column 1 has a columnar structure and its material contains a first metal, while the second metal layer 2 has a layered structure and its material contains a second metal. Here, the second metal and the first metal are different metals. Selectively, the conductivity of the second metal is greater than that of the first metal, and as a result, the current preferentially flows through the second metal layer 2, and then through the first metal column 1.

[0046] The bonding of the second metal layer 2 to the surface of the first metal column 1 means that the second metal layer 2 is located on the outer surface of the first metal column 1, and that the second metal layer 2 is bonded to the first metal column 1. Here, bonding means that the second metal layer 2 and the first metal column 1 do not separate simply due to the action of gravity. For example, the second metal layer 2 is physically bonded to the first metal column 1. As an example, the second metal layer 2 and the first metal column 1 may be bonded by cold heading.

[0047] To make it clear, the second metal layer 2 covers the surface of the first end 11 and extends from the surface of the first end 11 to the second end 12. Specifically, the extension of the second metal layer 2 from the first end 11 to the second end 12 means that the end 20 of the second metal layer 2 extends to the second end 12, and the end 20 of the second metal layer 2 may extend to the second end 12, or it may extend to a position between the first end 11 and the second end 12. Selectively, the end 20 of the second metal layer 2 extends to the second end 12, but the second metal layer 2 does not completely cover the second end 12, that is, at least a portion of the second end 12 is exposed to the outside of the second metal layer 2 in order to facilitate direct connection with other parts. Here, the end 20 of the second metal layer 2 refers to the edge portion of the second metal layer 2. In other words, by covering the end face of the first end 11 of the first metal column 1 and at least a portion of the side surface of the first metal column 1 with the second metal layer 2, the bonding area S between the second metal layer 2 and the first metal column 1 is effectively increased, improving the current tolerance of the conductive structure 10.

[0048] The second metal layer 2 is used to connect to the tab, and the second metal layer 2 may be directly connected to the tab or connected to the tab via an intermediate component (e.g., current collector 120). For example, the second metal layer 2 is used to weld to the current collector 120, and the current collector 120 is welded to the tab. Here, the tab refers to the metal conductors that draw the positive and negative electrodes from the battery cell (i.e., the cell). For example, the current collector 120 includes at least one of a current collector disc and a connecting piece.

[0049] When the conductive structure 10 is applied to a battery cell, the first end 11 of the first metal column 1 is directed inward into the battery cell, and the second end 12 is directed outward into the battery cell. The first end 11 of the first metal column 1 is covered with the second metal layer 2, which extends from the first end 11 to the second end 12. In this way, the second metal layer 2 acts as a protective layer, isolating the first end 11 of the first metal column 1 from the electrolyte inside the battery cell and reducing the risk of the first end 11 being corroded by the electrolyte.

[0050] The end portion 20 of the second metal layer 2 extends to the second end portion 12 of the first metal column 1, and it is predicted that the distance between the end portion 20 of the second metal layer 2 and the second end portion 12 of the first metal column 1 will decrease. Referring to Figure 2, the distance between the end portion 20 of the second metal layer 2 and the end face of the second end portion 12 along the axial direction of the first metal column 1 is H1, and the thickness of the first metal column 1 is D2, where the ratio of H1 to D2 is between 0 and 0.8. It can be seen that the closer the end portion 20 of the second metal layer 2 is to the second end portion 12 of the first metal column 1, the smaller H1 becomes and the smaller the ratio of H1 to D2 becomes. The further the end portion 20 of the second metal layer 2 is from the second end portion 12 of the first metal column 1, the larger H1 becomes and the larger the ratio of H1 to D2 becomes. When the conductive structure 10 is used in a battery cell, the first end portion 11 of the first metal column 1 is directed towards the inside of the battery cell, and the second end portion 12 is directed towards the outside of the battery cell. The second end 12 can be used to connect to an external circuit. Shortening the distance between the end 20 of the second metal layer 2 and the second end 12 of the first metal column 1 allows current to flow more quickly through the end 20 of the second metal layer 2 to the second end 12 and further to the external circuit, thus shortening the path of current flowing through the conductive structure 10 and improving the current tolerance capacity of the conductive structure 10. For example, the ratio of H1 to D2 is 0, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, or 0.8.

[0051] The conductive structure 10 according to the embodiment of the present application comprises a first metal column 1 and a second metal layer 2. The second metal layer 2 is bonded to the surface of the first metal column 1 and is configured to extend from the surface of the first end 11 to the second end 12 of the first metal column 1. This not only effectively increases the bonding area between the second metal layer 2 and the first metal column 1, but also shortens the distance between the end 20 of the second metal layer 2 and the second end 12 of the first metal column 1, thereby shortening the current path. The combined effect of these two things improves the current tolerance of the conductive structure 10.

[0052] In some embodiments, H1 is between 0 and 3.2 mm. When the end 20 of the second metal layer 2 extends to the end face of the second end 12, H1 is at its minimum, which is 0. It can be seen that the smaller H1 is, the smaller the surface area of ​​the first metal column 1 exposed to the outside of the second metal layer 2, the smaller the distance between the end 20 of the second metal layer 2 and the second end 12 of the first metal column 1, which contributes to improving the current tolerance of the conductive structure 10. The fact that the end 20 of the second metal layer 2 extends to the end face of the second end 12 does not mean that the end face of the second end 12 is completely covered by the second metal layer 2. It should be noted that the end face of the second end 12 may be left partially exposed to facilitate connection with external circuits. Examples of H1 include 0, 0.1 mm, 0.2 mm, 0.5 mm, 0.8 mm, 1.0 mm, 1.2 mm, 1.5 mm, 1.8 mm, 2.0 mm, 2.2 mm, 2.5 mm, 2.8 mm, 3.0 mm, or 3.2 mm.

[0053] In some embodiments, D2 is between 4 mm and 8 mm. Reducing the thickness D2 of the first metal column 1 is beneficial in reducing the volume and cost of the conductive structure 10. For example, D2 is 4 mm, 5 mm, 6 mm, 7 mm, or 8 mm.

[0054] In some embodiments, the ratio of H1 to D2 is between 0.25 and 0.5. Within this range, the conductive structure 10 has better current tolerance and facilitates connection between the second end 12 of the first metal column 1 and the external circuit. For example, the ratio of H1 to D2 is 0.25, 0.3, 0.35, 0.4, 0.45, or 0.5.

[0055] In some embodiments, the bonding area between the second metal layer 2 and the first metal column 1 is 20 mm². 2 That concludes the explanation. Since the second metal layer 2 is bonded to the surface of the first metal column 1, the surfaces that come into contact with each other between the second metal layer 2 and the first metal column 1 are called bonding surfaces or contact surfaces. The bonding area S between the second metal layer 2 and the first metal column 1 refers to the size of the surface area in contact between the second metal layer 2 and the first metal column 1. Typically, the bonding area S is 20 mm². 2The above is the case. As an example, the bonding area S is 20 mm 2 , 30 mm 2 , 40 mm 2 , 50 mm 2 , 100 mm 2 , 150 mm 2 , 200 mm 2 , 300 mm 2 , 400 mm 2 or 500 mm 2 . By adjusting so that the bonding area S between the second metal layer 2 and the first metal pillar 1 is 20 mm 2 or more, the current-carrying capacity of the conductive structure 10 is ensured.

[0056] Also, by increasing the bonding area S between the second metal layer 2 and the first metal pillar 1, the bonding strength between the second metal layer 2 and the first metal pillar 1 can be enhanced, and the risk of the second metal layer 2 falling off can be reduced.

[0057] In some embodiments, the bonding area S between the second metal layer and the first metal pillar 1 is 80 mm 2 or more. By increasing the bonding area S, the current-carrying capacity of the conductive structure 10 can be further enhanced, and the risk of the second metal layer 2 falling off can be reduced. As an example, the bonding area S is 80 mm 2 , 90 mm 2 , 100 mm 2 , 120 mm 2 , 130 mm 2 , 140 mm 2 , 150 mm 2 , 200 mm 2 , 250 mm 2 , 300 mm 2 , 400 mm 2 or 500 mm 2 .

[0058] In some embodiments, the average thickness D1 of the second metal layer 2 is 3 mm or less. By making the second metal layer 2 thinner, the manufacturing cost of the conductive structure 10 can be effectively reduced. In particular, when the first metal column 1 is an aluminum column and the second metal layer 2 is a copper layer, the cost of the conductive structure 10 can be effectively reduced by reducing the use of more expensive copper, and the weight of the conductive structure 10 can also be reduced. For example, the average thickness D1 of the second metal layer 2 is 0.4 mm, 0.5 mm, 0.6 mm, 0.8 mm, 1.0 mm, 1.2 mm, 1.5 mm, 1.8 mm, 2.0 mm, 2.2 mm, 2.5 mm, 2.8 mm, or 3.0 mm.

[0059] In some embodiments, the average thickness D1 of the second metal layer 2 is between 0.2 mm and 1.5 mm. Generally, as the average thickness D1 of the second metal layer 2 decreases, the current tolerance of the conductive structure 10 decreases, but the cost of the conductive structure 10 also decreases. By setting the average thickness D1 of the second metal layer 2 to between 0.2 mm and 1.5 mm, the conductive structure 10 achieves both cost advantages and sufficient current tolerance within this range. For example, the average thickness D1 of the second metal layer 2 is 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, or 1.5 mm.

[0060] In some embodiments, the volume of the second metal layer 2 is smaller than the volume of the first metal column 1. It can be seen that the volume content of the second metal layer 2 in the conductive structure 10 is smaller than the volume content of the first metal column 1. By reducing the content of the second metal layer 2 in the conductive structure 10, the cost of the conductive structure 10 can be reduced.

[0061] In some embodiments, the ratio of the volume of the second metal layer 2 to the volume of the first metal column 1 is between 0.1 and 0.65. In other words, the volume of the first metal column 1 is between 1.54 and 10 times the volume of the second metal layer 2. That is, the volume content of the first metal column 1 in the conductive structure 10 is significantly larger than the volume content of the second metal layer 2. While increasing the bonding area S between the second metal layer 2 and the first metal column 1 ensures that the conductive structure 10 still has sufficient current tolerance, reducing the content of the second metal layer 2 in the conductive structure 10 can reduce the cost of the conductive structure 10, especially when the first metal column 1 is an aluminum column and the second metal layer 2 is a copper layer. For example, the ratio of the volume of the second metal layer 2 to the volume of the first metal column 1 is 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, or 0.65. Typically, the ratio of the volume of the second metal layer 2 to the volume of the first metal column 1 varies depending on the size (e.g., diameter) of the conductive structure 10, and the larger the size of the conductive structure 10, the smaller the ratio of the volume of the second metal layer 2 to the volume of the first metal column 1 becomes.

[0062] In some embodiments, referring to Figure 2, the ratio A of the surface area of ​​the second metal layer 2 to the surface area of ​​the first metal column 1 on the outer surface of the conductive structure 10 is 0.25 or greater. Since the second metal layer 2 is bonded to the surface of the first metal column 1, the surface of the second metal layer 2 that is exposed to the outside becomes the outer surface of the conductive structure 10. If the second metal layer 2 does not completely cover the first metal column 1, the surface of the first metal column 1 that is exposed to the outside also becomes the outer surface of the conductive structure 10. On the outer surface of the conductive structure 10, the surface area of ​​the second metal layer 2 is the area of ​​the surface of the second metal layer 2 that is exposed to the outside, and the surface area of ​​the first metal column 1 is the area of ​​the surface of the first metal column 1 that is exposed to the outside. Increasing the surface area of ​​the second metal layer 2 on the outer surface of the conductive structure 10 corresponds to increasing the surface area of ​​the second metal layer 2 that covers the first metal column 1, that is, increasing the bonding area S between the second metal layer 2 and the first metal column 1, and further improving the current tolerance of the conductive structure 10. As an example, on the outer surface of the conductive structure 10, the ratio A of the surface area of ​​the second metal layer 2 to the surface area of ​​the first metal column 1 is 0.25, 0.5, 0.75, 1, 1.5, 2, 2.5, or 3 or more.

[0063] In some embodiments, the diameter φ of the conductive structure 10 is 10 mm or less, and the ratio A of the surface area of ​​the second metal layer 2 to the surface area of ​​the first metal column 1 is 0.25 or more and 0.6 or less. To facilitate direct connection of the second end 12 to other components, the second end 12 is at least partially exposed to the outside of the second metal layer 2. Generally, the smaller the diameter of the conductive structure 10, the smaller the surface area of ​​the conductive structure 10. When φ ≤ 10 mm, adjusting to 0.25 ≤ A ≤ 0.6 ensures that the second end 12 maintains a sufficient surface area for connection with other components, and that the bonding area S is sufficiently large, thereby ensuring the current tolerance of the conductive structure 10. For example, φ is 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, or 10 mm, and A is 0.25, 0.3, 0.4, 0.5, or 0.6.

[0064] In some embodiments, the diameter φ of the conductive structure 10 is greater than 10 mm and less than or equal to 30 mm, and the ratio of the surface area of ​​the second metal layer 2 to the surface area of ​​the first metal column 1 is greater than or equal to 0.75 and less than or equal to 2. Increasing the diameter of the conductive structure 10 improves the current tolerance, but increases the cost of the conductive structure 10 and places a burden on its volume and mass. When the diameter is 10 mm < φ ≤ 30 mm, the conductive structure 10 can achieve both cost advantages and good current tolerance. In addition, as the diameter of the conductive structure 10 increases, the surface area of ​​the conductive structure 10 also increases, and a portion of the second end 12 remains exposed to the outside of the second metal layer 2, while the remaining area is covered by the second metal layer 2, thereby increasing the bonding area S. When 10 mm < φ ≤ 30 mm, adjusting to 0.75 ≤ A ≤ 2 ensures a sufficiently large bonding area S and further ensures the current tolerance of the conductive structure 10. For example, φ can be 10.1mm, 11mm, 12mm, 14mm, 16mm, 18mm, 20mm, 22mm, 24mm, 26mm, 28mm, or 30mm, and A can be 0.75, 0.8, 0.9, 1.0, 1.2, 1.5, 1.7, 1.85, or 2.

[0065] In some embodiments, the first metal is aluminum, i.e., the first metal column 1 is an aluminum column, and the second metal is copper, i.e., the second metal layer 2 is a copper layer. Since aluminum is cheaper than copper, the cost of the conductive structure 10 can be effectively reduced by constructing the conductive structure 10 from an aluminum column and a copper layer. Exemplarily, the conductive structure 10 is a negative electrode column.

[0066] In some embodiments, the bonding interface between the second metal layer 2 and the first metal column 1 has a non-slip microstructure. Here, this refers to a microscopic interlocking of the surfaces of the second metal layer 2 and the first metal column 1. Selectively, the conductive structure 10 is a cold-formed product. For example, the first metal column 1 is an aluminum column, the second metal layer 2 is a copper layer, and the conductive structure 10 is obtained by forming a copper-aluminum composite plate by cold forming. Because the metal is ductile, during cold forming, the pressure causes the first metal in the first metal column 1 and the second metal in the second metal layer 2 to deform and penetrate each other, thereby forming the bonding interface between the first metal column 1 and the second metal layer 2 into a microscopically non-slip, wavy surface, and increasing the bonding area between the first metal column 1 and the second metal layer 2.

[0067] Referring to Figures 2, 6 to 8, in some embodiments, the second metal layer 2 includes a first segment 21 and a second segment 22, where the first segment 21 corresponds to the end face 11 of the first end and the second segment 22 corresponds to the side surface of the first metal column 1. Here, the first segment 21 and the second segment 22 refer to two different parts of the second metal layer 2. To make it clear, the end face of the first end 11 of the first metal column 1 is covered by the first segment 21, and at least a portion of the side surface of the first metal column 1 is covered by the second segment 22, thereby effectively increasing the bonding area S between the second metal layer 2 and the first metal column 1 and improving the current tolerance of the conductive structure 10 by shortening the distance between the end of the second metal layer 2 and the second end 12 of the first metal column 1. Furthermore, the second metal layer 2 is configured to include at least two segments, where the first segment 21 and the second segment 22 cover the first end 11, thereby protecting the first end 11 and reducing the risk of corrosion by the electrolyte. Here, the end 20 of the second metal layer 2 may or may not be located within the second segment 22. If the end 20 of the second metal layer 2 is not located within the second segment 22, it means that the second metal layer 2 further includes other segments, i.e., other parts. Selectively, the number of segments in the second metal layer 2 is 5 or less, since a larger number of segments increases the difficulty and cost of manufacturing.

[0068] In some embodiments, referring to Figures 1 and 8, a boss portion 13 projecting radially is formed on the first metal column 1, and the second metal layer 2 extends at least to the boss portion 13. Specifically, a portion of the first metal column 1 projects outward along substantially the radial direction of the first metal column 1 to form the boss portion 13. For example, the deviation of the angle between the boss portion 13 and the radial direction of the first metal column 1 is within ±15°. The second metal layer 2 extends at least to the boss portion 13. The end portion 20 of the second metal layer 2 may extend to the boss portion 13 or may extend beyond the boss portion 13. That is, the boss portion 13 may be completely or partially covered by the second metal layer 2. If the end portion 20 of the second metal layer 2 extends to the boss portion 13, the end portion 20 of the second metal layer 2 may be fitted into the boss portion 13 or may be located only on the surface of the boss portion 13. By causing the first metal column 1 to protrude radially to form a boss portion 13, the surface area of ​​the outer surface of the first metal column 1 can be increased by the boss portion 13. Furthermore, by partially or completely covering the boss portion 13 with the second metal layer 2, the bonding area between the second metal layer 2 and the first metal column 1 is increased, thereby improving the current tolerance of the conductive structure 10.

[0069] When the conductive structure 10 is applied to a battery cell, the boss portion 13 can be aligned with other components (e.g., a cover plate 110) as a stopper structure, and the second metal layer 2 extends to the boss portion 13, so that the second metal layer 2 can be sandwiched between the boss portion 13 and the component that aligns with the boss portion 13, thereby preventing the second metal layer 2 from separating from the first metal column 1.

[0070] In some embodiments, referring to Figures 3 and 4, the boss portion 13 is located at the first end 11, and the second segment 22 covers at least the side surface of the boss portion 13 and the surface on the side of the boss portion 13 closer to the second end 12, i.e., the boss portion 13 is completely covered by the second metal layer 2. For example, referring to Figure 3, the conductive structure 10 takes on a generally inverted T-shape. When assembling the conductive structure 10 to the cover plate 110, the smaller end of the conductive structure 10 may be passed from bottom to top through the mounting hole 114 of the cover plate 110 until the boss portion 13 abuts against the cover plate 110, and the second metal layer 2 on the upper surface of the boss portion 13 is sandwiched between the boss portion 13 and the cover plate 110 to prevent the second metal layer 2 from falling off.

[0071] In some embodiments, referring to Figures 3 and 4, the conductive structure 10 is an integrated pole column-current collector structure, that is, the conductive structure 10 is an integrally provided pole column 101 and current collector 120, where the boss portion 13 is the current collector 120, and the current collector 120 is used to connect directly to the tab. By providing the pole column 101 and the current collector 120 integrally, the assembly process of the pole column 101 and the current collector 120 can be omitted, thereby reducing the production cost of the battery cell. Furthermore, since the second metal layer 2 extends to the boss portion 13, that is, since the second metal layer 2 extends to the current collector 120, there is no need to increase the volume of the pole column 101, and by simply doubling the current collector 120, the bonding area of ​​the second metal layer 2 can be greatly increased, improving the current tolerance of the conductive structure 10, reducing the risk of the second metal layer 2 falling off, and without adding volume or weight. The current collector 120 described above is also a component of the battery cell, and is usually located inside the battery cell. That is, when an integrated pole-current collector structure is attached to the battery cell, for example to the battery cell's cover plate 110, the boss portion 13 is located inside the battery cell. The current collector 120 is also used to connect to the tabs of the electrode assembly.

[0072] In some embodiments, referring to Figures 1, 2 and 5 through 8, the boss portion 13 is separated from the first end 11, and the radial dimension of the boss portion 13 is greater than the radial dimension of the first end 11. The boss portion 13 may be located at the second end 12, or it may be located between the second end 12 and the first end 12. For example, referring to Figure 1, when the boss portion 13 is located at the second end 12, the conductive structure 10 takes on a generally upright T-shape. When assembling the conductive structure 10 to the cover plate 110, the smaller end of the conductive structure 10 may be passed from top to bottom through the mounting hole of the cover plate 110 until the boss portion 13 abuts against the cover plate 110, and the second metal layer 2 on the lower surface of the boss portion 13 is sandwiched between the boss portion 13 and the cover plate 110 to prevent the second metal layer 2 from falling off.

[0073] Selectively referring to Figures 2, 6 through 8, the second metal layer 2 further includes a third segment 23. The third segment 23 corresponds to the surface of the boss portion 13 closer to the first end 11, and the second segment 22 connects the first segment 21 and the third segment 23. Here, the third segment 23 refers to a portion of the second metal layer 2 that is distinct from the first segment 21 and the second segment 22. Here, the end 20 of the second metal layer 2 may or may not be located within the third segment 23. If the end 20 of the second metal layer 2 is not located within the third segment 23, it means that the second metal layer 2 further includes other segments, i.e., other portions.

[0074] By further configuring the second metal layer 2 to include a third segment 23, and the third segment 23 to extend to the surface of the boss portion 13, the bonding area between the second metal layer 2 and the first metal column 1 can be further increased, improving the current tolerance of the conductive structure 10 and reducing the risk of the second metal layer 2 falling off.

[0075] In some embodiments, as shown in Figure 2, the third segment 23 is formed as the end portion 20 of the second metal layer 2 and fitted into the boss portion 13. By configuring the second metal layer 2 to include only three segments, the manufacturing difficulty of the conductive structure 10 can be reduced. Furthermore, the fitting of the third segment 23, which serves as the end portion 20 of the second metal layer 2, into the boss portion 13 increases the bonding area between the second metal layer 2 and the first metal column 1, thereby improving the current tolerance of the conductive structure 10 and the bonding strength between the second metal layer 2 and the first metal column 1, resulting in a cost-effective conductive structure 10.

[0076] In some embodiments, as shown in Figures 1, 2 and 5, 6, the boss portion 13 is located at the second end portion 12 and is partially exposed to the outside of the second metal layer 2. The boss portion 13 is located at the second end portion 12 and is usually located on the outside of the cover plate 110 when the conductive structure 10 is assembled with the cover plate 110. Partially exposing the boss portion 13 to the outside of the second metal layer 2 makes it easier for the boss portion 13 to be directly connected to other components (such as busbars of the module).

[0077] Selectively, referring to Figure 2, the conductive structure 10 is an integrated pole post-terminal pressing block structure, that is, the conductive structure 10 is an integrally provided pole post 101 and terminal pressing block 102, where the boss portion 13 is the terminal pressing block 102. By integrally providing the pole post 101 and the terminal pressing block 102, the assembly process of the pole post 101 and the terminal pressing block 102 can be omitted, and the production cost of the battery cell can be reduced. Furthermore, since the second metal layer 2 extends to the boss portion 13, that is, since the second metal layer 2 extends to the terminal pressing block 102, there is no need to increase the volume of the pole post 101, and by simply doubling the terminal pressing blocks 102, the bonding area of ​​the second metal layer 2 can be greatly increased, improving the current tolerance capacity of the conductive structure 10, reducing the risk of the second metal layer 2 falling off, and without imposing a burden on volume and weight. When an integrated pole-terminal pressing block structure is attached to a battery cell, for example, to the battery cell's cover plate 110, the boss portion 13 is located outside the battery cell as a terminal pressing block 102, and can be pressed against the cover plate 110 to achieve fixation.

[0078] In some embodiments, referring to Figures 7 and 8, the boss portion 13 is located between the first end 11 and the second end, and the radial dimension of the boss portion 13 is greater than the radial dimension of the second end. For example, referring to Figures 7 and 8, when the boss portion 13 is located between the first end 11 and the second end 12, and the radial dimension (e.g., diameter) of the boss portion 13 is greater than both the radial dimension of the first end 11 and the radial dimension of the second end 12, the conductive structure 10 generally takes on a "medium" shape. In this shape of conductive structure 10, if the boss portion 13 functions as a stopper structure, the second metal layer 2 can be more stably fixed by sandwiching the boss portion 13 from both sides. To prevent the conductive structure 10 from becoming too tall, the boss portion 13 is selectively made thin, and the second end 12 is used for electrical connections with other components.

[0079] Selectively, referring to Figure 7, the second metal layer 2 further includes a fourth segment 24. The fourth segment 24 corresponds to the side surface of the boss portion 13 and is connected to the third segment 23. By providing the fourth segment 24, the bonding area between the second metal layer 2 and the first metal column 1 can be further increased. Here, the side surface of the boss portion 13 may be completely or partially covered by the fourth segment 24.

[0080] Selectively, referring to Figure 8, the second metal layer 2 further includes a fifth segment 25. The fifth segment 25 corresponds to the surface of the boss portion 13 away from the first end 11. The fourth segment 24 connects the fifth segment 25 and the third segment 23. By providing the fifth segment 25, the bonding area between the second metal layer 2 and the first metal column 1 can be further increased. Selectively, the end 20 of the second metal layer 2 is located within the fifth segment 25.

[0081] In some embodiments, referring to Figures 6 to 8, a portion of the end face of the first end 11 is recessed to form a recess 11b, and the first segment 21 includes a first subsegment 211, a second subsegment 212, and a third subsegment 213 that are connected in sequence, with the first subsegment 211 located outside the recess 11b, the second subsegment 212 located on the side wall of the recess 11b, and the third subsegment 213 located on the bottom wall of the recess 11b. Here, recess means recessed into the interior of the first metal column 1. In other words, a recess 11b is formed on the end face of the first end 11, and the second metal layer 2 also has a second subsegment 212 and a third subsegment 213 that are in close contact with the inner wall surface of the recess 11b, matching the surface of the first end 11. By providing a recess 11b on the end face of the first end 11 and bringing the second metal layer 2 into close contact with the inner wall surface of the recess 11b, the bonding area between the second metal layer 2 and the first metal column 1 is increased, improving the current tolerance of the conductive structure 10.

[0082] In a second aspect, embodiments of the present invention further provide a cover plate assembly, which, together with the housing of a battery cell, forms a sealed cavity, the cavity for housing the electrode assembly of the battery cell.

[0083] Specifically, referring to Figure 9, the cover plate assembly 100 comprises a cover plate 110 and the aforementioned conductive structure 10 connected to the cover plate 110. Specifically, the conductive structure 10 is provided through the cover plate 110.

[0084] More specifically, along the thickness direction of the cover plate 110, the cover plate 110 has a first surface and a second surface facing away from each other. Referring to Figure 9, with the cover plate assembly 100 attached to the housing 1100 of the battery cell 1000, the first surface is the surface away from the housing 1100, and the second surface is the surface closer to the housing 1100. Along the thickness direction of the cover plate 110, mounting holes 114 are provided through the cover plate 110, and the conductive structure 10 is provided through the cover plate 110 via the mounting holes 114.

[0085] In some embodiments, referring to Figure 9, the conductive structure 10 comprises integrally provided pole posts 101 and terminal pressing blocks 102, and the boss portion 100 of the cover plate assembly 100 further comprises a current collector 120. The current collector 120 is a conductive member for connecting to the tabs 1210 of the electrode assembly 1200 in the battery cell 1000. The current collector 120 is located on one side of the cover plate 110, specifically the side away from the terminal pressing blocks 102 of the cover plate 110, i.e., the current collector 120 is located on the second surface of the cover plate 110. The terminal pressing blocks 102 press against the other side of the cover plate 110, i.e., the first surface. The current collector 120 is directly connected to the conductive structure 10, for example by welding. Specifically, the current collector 120 is welded to the second metal layer 2 of the conductive structure 10. Selectively, the material of the current collector 120 is the same as the material of the second metal layer 2; that is, the material of the current collector 120 is the second metal. In this way, the difficulty of welding the current collector 120 and the second metal layer 2 can be reduced, and the reliability of the welding can be improved.

[0086] In some embodiments, referring to Figure 9, the conductive structure 10 is a pole column 101, and the cover plate assembly 100 further comprises a current collector 120. The current collector 120 is located on one side of the cover plate 110, for example, on a second surface of the cover plate 110. The current collector 120 is directly connected to the conductive structure 10, for example, by welding.

[0087] In some embodiments, the current collector 120 includes at least one of a current collector disc and a connecting piece.

[0088] In some embodiments, the current collector 120 comprises a current collector body (not shown) and a connecting piece (not shown) connected to the current collector body. Here, the current collector body is for connection to a tab 1210 of the electrode assembly, and the connecting piece is welded to the second metal layer.

[0089] In some embodiments, referring to Figure 9, the cover plate 110 comprises a cover plate body 111, a first insulating member 112, and a second insulating member 113. Here, the first insulating member 112 and the second insulating member 113 are arranged on opposite sides of the cover plate body 111, respectively. The first insulating member 112 is provided between the conductive structure 10 and the cover plate body 111, and the second insulating member 113 is provided between the cover plate body 111 and the current collector 120. Selectively, if the first metal column 1 of the conductive structure 10 has a boss portion 13, the first insulating member 112 is provided between the boss portion 13 and the cover body 111. The cover plate 110 is provided with mounting holes 114 that penetrate the cover plate body 111, the first insulating member 112, and the second insulating member 113. For example, the cover plate body 111 is an untreated aluminum plate, and both the first insulating member 112 and the second insulating member 113 are plastic members.

[0090] In some embodiments, referring to Figure 9, the cover plate assembly 100 further comprises a sealing member 130. The sealing member 130 is provided between the cover plate 110 and the conductive structure 10 and prevents electrolyte leakage from the gap between the conductive structure 10 and the mounting hole. For example, the sealing member 130 is located between the cover plate body 111 and the second insulating member 113.

[0091] In some embodiments, the assembly process for the cover plate assembly 100 includes aligning the holes and stacking the second insulating member 113, the sealing member 130, the cover plate body 111, and the first insulating member 112 sequentially from bottom to top; passing the conductive structure 10 through the mounting holes 114 from top to bottom and bringing the larger end (e.g., boss portion 13) of the conductive structure 10 into contact with the first insulating member 112; attaching the current collector member 120 to the side of the second insulating member 113 away from the sealing member 130; and welding the current collector member 120 to, for example, the second metal layer 2 of the conductive structure 10 by laser welding.

[0092] In some embodiments, referring to Figure 9, the cover plate assembly 100 further comprises an explosion-proof valve 140, which is provided on the cover plate 110.

[0093] In some embodiments, referring to Figure 9, the cover plate 110 is further provided with an injection hole 115 and a sealing structure (not shown) for sealing the injection hole.

[0094] In a third aspect, with reference to Figure 10, an embodiment of the present invention further provides a battery cell 1000. The battery cell 1000, also called a cell, is a basic unit that realizes the interconversion of chemical energy and electrical energy.

[0095] Specifically, the battery cell 1000 comprises a housing 1100, an electrode assembly 1200, and the aforementioned cover plate assembly 100. Specifically, the housing 1100 has a housing cavity 1110. The electrode assembly 1200 is placed inside the housing cavity 1110, and the cover plate assembly 100 is connected to the housing 1100 and seals the housing cavity 1110. The electrode assembly 1200 includes a tab 1210, to which the conductive structure 10 is connected.

[0096] Specifically, the electrode assembly 1200 further comprises an electrode sheet and a separator. Tab 1210 is connected to the electrode sheet, which includes a positive electrode sheet and a negative electrode sheet, and the separator is located between the positive electrode sheet and the negative electrode sheet. To understand this, tab 1210 further includes a positive electrode tab and a negative electrode tab, where the positive electrode tab is connected to the positive electrode sheet and the negative electrode tab is connected to the negative electrode sheet.

[0097] Furthermore, the battery cell 1000 is further equipped with an electrolyte, which is located within the housing cavity 1110, and the electrode assembly 1200 is immersed in the electrolyte.

[0098] The following will describe the details with reference to specific embodiments.

[0099] Example 1

[0100] We provide pole posts, and the manufacturing process for these pole posts is as follows:

[0101] S1. Using a punch press, a copper-aluminum composite sheet (where the copper layer accounts for 21% of the total thickness) is punched out into cylindrical blanks (12.8 mm in diameter) according to the desired dimensions.

[0102] S2. By setting the blank in a forming jig and forming it, the uniformity of the blank dimensions is improved, and a small amount of copper material adhering to the top surface of the aluminum layer is removed.

[0103] S3. Cylindrical blanks are placed in a sorting tray, blanks that meet the requirements (i.e., the copper and aluminum surfaces are facing the same direction) are sorted and loaded into the first cold heading die.

[0104] S4. The blank is set in the first cold forging die, and cold forging is performed to press the aluminum layer onto the copper layer, thereby obtaining a mushroom-shaped semi-finished product.

[0105] S5, the mushroom-shaped semi-finished product is fed into the second cold forging die using gripping claws, where it undergoes cold forging again, and the copper layer is spread outwards by pressing the aluminum layer on top.

[0106] S6. Excess material is removed from the semi-finished product to obtain the finished product, i.e., the pole column.

[0107] Figure 11 shows a cross-sectional structure of the pole column created in Example 1, where the first metal column 1 is an aluminum column and the second metal layer 2 is a copper layer. Resistance experiments were conducted at different parts of the pole column. The specific experimental procedure is as follows: Ten pole columns were randomly selected as samples from all the finished products made in Example 1, and the experiment was conducted. Referring to Figure 11, in Experimental Plan 1, the resistance value between point a (located at the top of the copper layer) and point b (center of the end face of the aluminum column) was measured using a multimeter. In Experimental Plan 2, the resistance value between point a and point c (edge ​​of the end face of the aluminum column) was measured using a multimeter. The results obtained from the two experimental plans are recorded in Table 1.

[0108] [Table 1]

[0109] As can be seen from Table 1, averaging the resistance test results of 10 samples, the average resistance value at point a-b was 0.0133 mΩ, and the average resistance value at point a-c was 0.0106 mΩ. In the pole column, the copper layer covers one side of the aluminum column, and since copper has better conductivity than aluminum, the current preferentially flows through the copper layer. Furthermore, the end of the copper layer is fitted into the aluminum column, and the distance from the copper layer to point b is greater than the distance from the copper layer to point c. Therefore, the average resistance value at point a-b is greater than the average resistance value at point a-c. Thus, by having the end of the copper layer extend to the side of the aluminum column (specifically the bottom surface of the boss), at least a part of the current path can be shortened, improving the current tolerance capacity of the pole column.

[0110] The display panel and display device according to the embodiments of the present application have been described in detail above. While this specification has used specific examples to illustrate the principles and embodiments of the present application, the above-described embodiments are intended solely as reference for understanding the methods and core ideas of the present application. Furthermore, while those skilled in the art may modify the embodiments and scope of application according to the ideas of the present application, in summary, the contents of this specification should not be understood as limitations on the present application. [Explanation of symbols]

[0111] 10 Conductive structure 101 Pole Pillar 102 Terminal pressing block 1 1st metal pillar 11 1st end 11b recess 12 2nd end 13 Boss Section 2 Second metal layer 20 End 21. Segment 1 211 First Subsegment 212 Second Segment 213 Third Subsegment 22. Segment 2 23 Third Segment 24. Segment 4 25. Fifth Segment 100 Cover Plate Assembly 110 Cover Plate 111 Cover plate body 112 First insulator 113 Second insulator 114 mounting holes 115 Liquid injection hole 120 Flow collection member 130 Sealing member 140 Explosion-proof valve 1000 battery cells 1100 cabinets 1110 Capacity Cavity 1200 Electrode Assembly 1210 tabs

Claims

1. A conductive structure comprising a first metal column and a second metal layer, The first metal column has opposing first and second ends, The conductive structure is characterized in that the second metal layer is bonded to the surface of the first metal column, covers the first end and extends to the second end, and the second metal layer is used to connect to a tab, wherein the distance between the end of the second metal layer and the end face of the second end along the axial direction of the first metal column is H1, the thickness of the first metal column is D2, and the ratio of H1 to D2 is 0 or more and 0.8 or less.

2. The conductive structure according to claim 1, characterized in that the ratio of H1 to D2 is 0.25 or more and 0.5 or less.

3. The conductive structure according to claim 1, characterized in that H1 is 0 to 3.2 mm and / or D2 is 4 mm to 8 mm.

4. The bonding area between the second metal layer and the first metal column 1 is 20 mm². ２ The conductive structure according to claim 1, as described above.

5. The aforementioned bonding area is 80 mm². ２ The conductive structure according to feature 4.

6. The conductive structure according to claim 1, characterized in that the average thickness of the second metal layer is 3 mm or less.

7. The conductive structure according to claim 6, characterized in that the average thickness of the second metal layer is 0.2 mm or more and 1.5 mm or less.

8. The conductive structure according to claim 1, characterized in that the volume of the second metal layer is smaller than the volume of the first metal column, and the ratio of the volume of the second metal layer to the volume of the first metal column is 0.1 or more and 0.65 or less.

9. The conductive structure according to claim 1, characterized in that, on the outer surface of the conductive structure, the ratio of the surface area of ​​the second metal layer to the surface area of ​​the first metal column is 0.25 or more.

10. The conductive structure according to claim 9, characterized in that the diameter of the conductive structure is 10 mm or less, and the ratio of the surface area of ​​the second metal layer to the surface area of ​​the first metal column is 0.25 or more and 0.6 or less, or the diameter of the conductive structure is greater than 10 mm and 30 mm or less, and the ratio of the surface area of ​​the second metal layer to the surface area of ​​the first metal column is 0.75 or more and 2 or less.

11. The conductive structure according to any one of claims 1 to 10, wherein the second metal layer further comprises a first segment and a second segment, the first segment corresponding to the end face of the first end, and the second segment corresponding to the side surface of the first metal column.

12. The conductive structure according to claim 11, characterized in that the first metal column has a boss portion that protrudes radially, and the second metal layer extends at least to the boss portion.

13. The conductive structure according to claim 12, characterized in that the boss portion is located at the first end, and the second segment covers at least the side surface of the boss portion and the surface of the boss portion closer to the second end.

14. The conductive structure according to claim 13, wherein the conductive structure comprises an integrally provided pole column and a flow-collecting member, the boss portion is the flow-collecting member, and the flow-collecting member is used to connect directly to the tab.

15. The conductive structure according to claim 12, characterized in that the boss portion is far from the first end, the radial dimension of the boss portion is greater than the radial dimension of the first end, the second metal layer further includes a third segment, the third segment corresponds to the surface of the boss portion on the side closer to the first end, and the second segment connects the first segment and the third segment.

16. The conductive structure according to claim 15, characterized in that the third segment forms the end of the second metal layer, and the third segment is fitted into the boss portion.

17. The conductive structure according to claim 15, characterized in that the boss portion is located at the second end, a part of the boss portion is exposed to the outside of the second metal layer, the conductive structure is integrally provided with pole posts and terminal pressing blocks, and the boss portion is the terminal pressing block.

18. The conductive structure according to claim 15, characterized in that the boss portion is located between the first end and the second end, the radial dimension of the boss portion is further greater than the radial dimension of the second end, the second metal layer further includes a fourth segment, the fourth segment corresponds to the side surface of the boss portion, and the fourth segment is connected to the third segment.

19. The conductive structure according to claim 18, wherein the second metal layer further includes a fifth segment, the fifth segment corresponding to a side surface of the boss portion away from the first end, and the fourth segment connects the fifth segment and the third segment.

20. The conductive structure according to claim 11, characterized in that a local part of the end face of the first end is recessed to form a recess, and the first segment includes a first subsegment, a second subsegment, and a third subsegment that are connected in order, the first subsegment being located outside the recess, the second subsegment being located on the side wall of the recess, and the third subsegment being located on the bottom wall of the recess.

21. The conductive structure according to any one of claims 1 to 10, characterized in that the first metal column is an aluminum column, the second metal layer is a copper layer, and / or the bonding interface between the second metal layer and the first metal column has an uneven microstructure, and / or the conductivity of the second metal in the second metal layer is greater than the conductivity of the first metal in the first metal column.

22. A cover plate assembly, Cover plate and A cover plate assembly characterized by comprising a conductive structure according to any one of claims 1 to 10 that is penetrated through the cover plate.

23. The cover plate assembly according to claim 22, wherein the conductive structure is a pole column, the cover plate assembly further comprises a current collector, the current collector is located on one side of the cover plate and directly connected to the conductive structure, or the conductive structure is an integrally provided pole column and terminal pressing block, the cover plate assembly further comprises a current collector, the current collector is located on one side of the cover plate and directly connected to the conductive structure, and the terminal pressing block presses against the other side of the cover plate.

24. The aforementioned cover plate is The cover plate body and A first insulating member is provided between the conductive structure and the cover plate body, The system comprises a second insulating member provided between the cover plate body and the current collector, and / or The cover plate assembly according to claim 23, further comprising a sealing member provided between the cover plate and the conductive structure.

25. It is a battery cell, A housing having an enclosure, An electrode assembly provided within the aforementioned housing cavity and having a tab, A battery cell comprising a cover plate assembly according to claim 22, wherein the cover plate assembly is connected to the housing and seals the opening of the housing cavity, and the conductive structure is connected to the tab.

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