A lower pressure module capable of multi-point pressurization and multi-point temperature control, and a semiconductor package component inspection device.

Abstract

The present invention provides a semiconductor package component inspection apparatus that applies downward pressure at multiple points to push down the module and generates the effect of multi-point temperature control. [Solution] The controller is suitable for controlling multiple down pressure generation units to drive multiple crimping blocks and apply down pressure to each chip on a semiconductor package component, and the controller is suitable for controlling multiple temperature control units to raise or lower the temperature of multiple chips on a semiconductor package component.

Description

Technical Field

[0005]

[0001] The present invention relates to a downward pressure module and a semiconductor package component inspection apparatus including the same, and more particularly to a semiconductor package component inspection apparatus that applies a downward pressure with multi-point pressurization to push down the module and can generate the effect of multi-point temperature control.

Background Art

[0002] In the conventional inspection technology for semiconductor package components, most of them use a single pressure probe and a single temperature controller. The pressure probe contacts the chip to apply a downward pressure to the chip, and the temperature controller can not only heat or cool the chip, but also the downward pressure further ensures complete electrical contact between the semiconductor package component and the inspection socket.

Summary of the Invention

Problems to be Solved by the Invention

[0003] However, due to the continuous progress of advanced packaging technology, it has now advanced to 2.5D packaging and 3D packaging technology. Currently well-known advanced packaging technologies include Integrated Fan-Out (InFO) and chip-on-wafer-on-substrate (CoWoS) packaging technologies, both of which can be used to package a plurality of chips assembled side by side.

[0004] In other words, on the upper surface of a semiconductor package component using advanced packaging technology, a plurality of chips are included. In addition to the different areas and thicknesses of these chips, the Thermal Design Power (TDP) of each chip may also be different in some cases.

[0005] Therefore, conventional inspection equipment using a single pressure probe and a single temperature controller is no longer suitable for highly packaged semiconductor components, because a single pressure probe may not be able to fully contact all the chips on the semiconductor component, and furthermore, it is impossible to independently control the temperature of each chip.

[0006] However, this defect significantly impacts chips with varying power consumption in their thermal design, potentially leading to thermal crosstalk issues due to uneven temperature distribution across the entire package structure. This can affect the reliability of the semiconductor package structure and the accuracy of testing equipment. [Means for solving the problem]

[0007] In view of the above-mentioned problems, the present invention has the following configuration. One aspect of the present invention is a down pressure module capable of multi-point pressurization and multi-point temperature control, comprising a plurality of crimping blocks, a plurality of down pressure generation units, a plurality of temperature control units, and a controller, wherein the plurality of crimping blocks correspond to a plurality of chips on a semiconductor package component, the plurality of down pressure generation units are connected to the plurality of crimping blocks, the plurality of temperature control units are provided on the plurality of crimping blocks, the controller is electrically connected to the plurality of down pressure generation units and the plurality of temperature control units, the controller is suitable for controlling the plurality of down pressure generation units to drive the plurality of crimping blocks and apply down pressure to the chips on the semiconductor package component, and the controller is suitable for controlling the plurality of temperature control units to raise or lower the temperature of the plurality of chips on the semiconductor package component, thus providing a down pressure module capable of multi-point pressurization and multi-point temperature control.

[0008] Furthermore, in the above embodiment, the system may further include a plurality of force sensing units, each of which is provided on the plurality of crimping blocks and electrically connected to the controller, and the controller may be suitable for controlling the plurality of force sensing units to measure the downward pressure that the plurality of crimping blocks apply to the plurality of chips on the semiconductor package component.

[0009] Furthermore, in the above embodiment, the plurality of force sensing units may comprise a plurality of thin-film pressure sensing sheets, each of which is provided on the contact surface of the plurality of crimping blocks, and the contact surface is used to contact the plurality of chips on the semiconductor package component.

[0010] Furthermore, in the above embodiment, the system may include a plurality of coupling blocks, each of which is provided between the plurality of downward pressure generating units and the crimping block, and each of which is located between the plurality of coupling blocks and the crimping block.

[0011] Furthermore, in the above embodiment, the device may further include a plurality of temperature sensing units, each of which is provided on the plurality of crimping blocks and electrically connected to the controller, and the controller may be suitable for controlling the plurality of temperature sensing units to measure the temperature of each of the plurality of chips on the semiconductor package component.

[0012] Furthermore, in the above embodiment, the system may further include an actuator, which is electrically connected to the controller, and the controller may control the actuator to drive the plurality of crimping blocks and is suitable for pressing the plurality of chips on the semiconductor package component.

[0013] Furthermore, in the above embodiment, the system may further include a lifting frame, a mounting frame, and a plurality of cushioning members, wherein the lifting frame is connected to the actuator, the plurality of down pressure generating units are provided on the mounting frame, and the mounting frame is connected to the lifting frame via the plurality of cushioning members.

[0014] Furthermore, in the above embodiment, a coolant supply unit is further provided, the coolant supply unit being electrically connected to the controller, the plurality of temperature control units each comprising a temperature control fluid channel and a heater, the temperature control fluid channel being connected to the coolant supply unit, the controller being suitable for controlling the coolant supply unit to supply coolant to the temperature control fluid channels of the plurality of temperature control units, and the controller being suitable for controlling the heater to raise the temperature of the plurality of chips on the semiconductor package component.

[0015] Furthermore, in the above embodiment, the system may further include a plurality of monitoring units, each of which is provided on the plurality of crimping blocks and electrically connected to the controller, and the controller may be suitable for controlling the plurality of monitoring units to sense at least one of the posture of the plurality of crimping blocks and the contact condition between the plurality of crimping blocks and the semiconductor package component.

[0016] Another aspect of the present invention relates to a multi-point pressurizing and multi-point temperature control capable down pressure module comprising a plurality of crimping blocks, a plurality of down pressure generating units, a plurality of temperature control units, actuators, and a controller, wherein the plurality of crimping blocks correspond to a plurality of chips on a semiconductor package component, the plurality of down pressure generating units are connected to the plurality of crimping blocks, the plurality of temperature control units are provided on the plurality of crimping blocks, the controller is electrically connected to the plurality of temperature control units and the actuators, the controller is suitable for controlling the actuators to press the plurality of crimping blocks against the plurality of chips on the semiconductor package component, thereby driving the plurality of down pressure generating units to apply a plurality of down pressures to the plurality of chips on the semiconductor package component, and the controller is also suitable for controlling the plurality of temperature control units to raise or lower the temperature of the plurality of chips on the semiconductor package component, thus enabling multi-point pressurizing and multi-point temperature control.

[0017] Furthermore, in the above embodiment, a pressure plate is further provided, the plurality of crimping blocks comprises a first crimping block and a second crimping block, the plurality of down pressure generating units comprises a plurality of first elastic members and a plurality of second elastic members, the plurality of first elastic members are provided between the pressure plate and the first crimping block, the plurality of second elastic members are provided between the pressure plate and the second crimping block, and the controller is suitable for controlling the actuator to drive the pressure plate closer to the first crimping block and the second crimping block, thereby the plurality of first elastic members and the second elastic members may apply the plurality of down pressures via the first crimping block and the second crimping block, respectively.

[0018] Furthermore, in the above embodiment, the first crimping block comprises a central projection, the second crimping block comprises at least one convex frame portion and a central opening, the central projection of the first crimping block is located within the central opening of the second crimping block, and the plurality of temperature control units comprises a temperature control fluid chamber and a temperature control fluid channel, the temperature control fluid chamber is provided within the central projection, and the temperature control fluid channel is provided within the second crimping block.

[0019] Furthermore, in the above embodiment, the pressure plate comprises at least one vertical portion and a bottom plate portion, the at least one vertical portion being connected perpendicularly to the bottom plate portion and having an inclined groove, one end of the inclined groove being adjacent to the bottom plate portion and the other end being away from the bottom plate portion, the actuator comprising a linear displacement generating unit, a horizontal slide block, and a guide rod, the horizontal slide block being connected to the linear displacement generating unit, one end of the guide rod being connected to the horizontal slide block and the other end being located in the inclined groove of at least one vertical portion, the linear displacement generating unit driving the horizontal slide block to generate a horizontal slide, thereby causing the guide rod to slide in the inclined groove, and moving the pressure plate closer to or further away from the first and second crimping blocks.

[0020] Furthermore, in the above embodiment, a pressure plate is further provided, and the plurality of crimping blocks comprises a first crimping block and a second crimping block. The plurality of downward pressure generating units comprises a plurality of first elastic members and a plurality of second elastic members, wherein the plurality of first elastic members are provided between the pressure plate and the first crimping block, and the second elastic members are provided between the first crimping block and the second crimping block, and the controller is suitable for controlling the actuator to drive the pressure plate closer to the first crimping block and the second crimping block, thereby the plurality of first elastic members apply at least one of the plurality of downward pressures via the first crimping block, and in addition, the plurality of first elastic members and the plurality of second elastic members may be driven to apply at least one of the plurality of downward pressures via the second crimping block.

[0021] Another aspect of the present invention is a semiconductor package component inspection apparatus comprising a fixed frame, an inspection socket, a slide frame, a downward pressure module capable of multi-point pressurization and multi-point temperature control, and a slide generating device, wherein the inspection socket is used to house semiconductor package components and is provided on the fixed frame, the slide frame is connected to the fixed frame, the downward pressure module capable of multi-point pressurization and multi-point temperature control is provided on the slide frame, the slide generating device is electrically connected to the controller and assembled on at least one of the fixed frame and the slide frame, the controller is suitable for controlling the slide generating device to drive and slide the slide frame, and the downward pressure module capable of multi-point pressurization and multi-point temperature control is selectably corresponding to or away from the inspection socket.

[0022] Furthermore, in the above embodiment, the inspection socket may include a plurality of positioning plates, the fixed frame may include a bottom plate, the plurality of positioning plates may be provided on the bottom plate, and the plurality of positioning plates and the bottom plate may define a housing space which is used to house the semiconductor package components. [Effects of the Invention]

[0023] As described above, the present invention provides a lower pressure module capable of multi-point pressurization and multi-point temperature control, and a semiconductor package component inspection apparatus including the same. Therefore, a plurality of lower pressures having the same or different sizes can be simultaneously applied to a plurality of chips on a semiconductor package component, and a plurality of the same or different temperature control effects can be generated simultaneously.

[0024] In addition, the lower pressure module capable of multi-point pressurization and multi-point temperature control provided by the present application and the semiconductor package component inspection apparatus including the same can adapt to actual needs, apply a lower pressure to individual chips or regions on the semiconductor package component, the lower pressure can be set to be the same or different, and temperature control is performed independently for the individual chips or regions. For example, it is suitable for different chips (such as SoC and HBM, etc.) or regions on a semiconductor package component of an advanced package adopting 2.5D or 3D, and can provide a pre-burning temperature and a predetermined lower pressure required for each chip or region.

Brief Description of the Drawings

[0025] [Figure 1] It is a system block diagram of a lower pressure module capable of multi-point pressurization and multi-point temperature control in some embodiments of the present invention. [Figure 2A] It is a schematic diagram of a lower pressure module capable of multi-point pressurization and multi-point temperature control in some embodiments of the present invention. [Figure 2B] It is a schematic diagram of a lower pressure module capable of multi-point pressurization and multi-point temperature control in some embodiments of the present invention. [Figure 3A] It is a schematic diagram of a lower pressure module capable of multi-point pressurization and multi-point temperature control in some embodiments of the present invention. [Figure 3B] It is a schematic diagram of a lower pressure module capable of multi-point pressurization and multi-point temperature control in some embodiments of the present invention. [Figure 4A]This is a schematic diagram of a semiconductor package component inspection apparatus in some embodiments of the present invention, in which a lower pressure module capable of multi-point pressurization and multi-point temperature control is arranged at the inspection position. [Figure 4B] This is a schematic diagram of a semiconductor package component inspection apparatus in several embodiments of the present invention, in which a lower pressure module capable of multi-point pressurization and multi-point temperature control is located at the mounting or removal position. [Figure 5] This is a schematic diagram of an inspection socket in a semiconductor package component inspection apparatus in some embodiments of the present invention. [Figure 6] This is a system block diagram of a lower pressure module capable of multi-point pressurization and multi-point temperature control in some embodiments of the present invention. [Figure 7] This is a top view of a lower pressure module capable of multi-point pressurization and multi-point temperature control in a semiconductor package component inspection apparatus according to some embodiments of the present application. [Figure 8] This is a perspective view of a lower pressure module capable of multi-point pressurization and multi-point temperature control in some embodiments of the present invention. [Figure 9A] This is a perspective view of a first crimping block in a lower pressure module capable of multi-point pressurization and multi-point temperature control in some embodiments of the present application. [Figure 9B] This is a perspective view of a second crimping block in a lower pressure module capable of multi-point pressurization and multi-point temperature control in some embodiments of the present invention. [Figure 10] This is a front view of a lower pressure module capable of multi-point pressurization and multi-point temperature control in some embodiments of the present invention. [Figure 11] This is a top view of a first crimping block and a second crimping block in a lower pressure module capable of multi-point pressurization and multi-point temperature control in some embodiments of the present invention. [Figure 12] This is a perspective view of a first crimping block and a second crimping block in a lower pressure module capable of multi-point pressurization and multi-point temperature control in some embodiments of the present invention. [Modes for carrying out the invention]

[0026] For detailed explanation, various embodiments are described below, but these embodiments are for illustrative purposes only and do not limit the technical scope of the present invention. In addition, in embodiments of the present invention, some components may be omitted from the drawings in order to clearly illustrate the technical features of the present invention.

[0027] Furthermore, the same reference numerals or related numerals, such as those with different last digits, are used throughout the drawings to refer to the same or technically related components. Also, the drawings of the present invention are for illustrative purposes only and are not necessarily drawn to scale, and not all details are shown in the drawings.

[0028] First, the present invention will be described with reference to Figures 1 and 2. Here, Figure 1 is a system block diagram of a lower pressure module capable of multi-point pressurization and multi-point temperature control in some embodiments of the present invention, and Figure 2 is a schematic diagram of a lower pressure module capable of multi-point pressurization and multi-point temperature control in some embodiments of the present invention.

[0029] As shown in Figure 1, the lower pressure module, which is capable of multi-point pressurization and multi-point temperature control, may hereafter be simply referred to as "lower pressure module 1," and mainly comprises multiple crimping blocks 2, multiple lower pressure generation units 3, multiple temperature control units 4, and a controller 5.

[0030] As shown in Figure 5, which will be described later, the crimping block 2 is mainly used to accommodate multiple chips 91 on a semiconductor package component 9. The semiconductor package component 9 shown in Figure 5 employs advanced packaging technology, and multiple chips 91 are arranged on its upper surface, such as a central processing unit (CPU), graphics processing unit (GPU), high-bandwidth memory (HBM), or various other chiplets.

[0031] In other embodiments, the semiconductor package component 9 may be a heterogeneous integration semiconductor package structure or a silicon photonics package component.

[0032] The embodiments of this invention will be described below with reference to Figures 1, 2A, and 5. Furthermore, Figure 2A shows multiple crimping blocks 2 used to correspond to multiple chips 91 on the semiconductor package component 9 in Figure 5. Also, Figure 2A shows three crimping blocks 2, each corresponding to three rows of chips 91 on the semiconductor package component 9 in Figure 5.

[0033] However, the number and position of the crimp blocks 2 should not be limited to three. In other embodiments, the number and position of the crimp blocks 2 may be arranged based on the specifications or characteristics of the chip 91. For example, depending on the size and thermal design power consumption (TDP) of each chip 91, crimp blocks 2 of an appropriate size, in an appropriate number, and in an appropriate position may be arranged.

[0034] Furthermore, Figure 2A shows a plurality of down pressure generating units 3 connected to a plurality of crimping blocks 2. In some embodiments, the number of down pressure generating units 3 is the same as the number of crimping blocks 2. Here, the down pressure generating units 3 are located above the down pressure module 1, and the crimping blocks 2 are located below the down pressure module 1, in a position relative to each of the chips 91 in Figure 5, in order to apply the down pressure generated by the down pressure generating units 3 to each of the chips 91 in Figure 5.

[0035] In other embodiments, the number of each may differ; for example, multiple downward pressure generating units 3 may be arranged for a larger crimping block 2. Also, in some embodiments, the downward pressure generating unit 3 may be a linear actuator such as a linear motor, hydraulic cylinder, or pneumatic cylinder, but is not limited thereto.

[0036] Figure 2A also shows a plurality of temperature control units 4 provided on each of the crimping blocks 2. In some embodiments, each temperature control unit 4 may be a heating unit, a cooling unit, or a component, device, or system comprising both a heating unit and a cooling unit.

[0037] The heating unit may be a heater 24 comprising an electric heating element, a resistive heat source, or other equivalent elements that can be controlled to increase the temperature. In other embodiments, the heating unit may consist of a pipeline or chamber through which a hot fluid flows.

[0038] Furthermore, in the embodiment shown in Figure 2A, the cooling unit can consist of a temperature-controlled fluid channel 233. The temperature-controlled fluid channel 233 is connected to the coolant supply unit 15 shown in Figure 1 (the connection configuration between the temperature-controlled fluid channel 233 and the coolant supply unit 15 is not shown), and it is responsible for supplying coolant to the temperature-controlled fluid channel 233 of the temperature control unit 4.

[0039] In some embodiments, the coolant supply unit 15 may be a Cooling Distribution Unit (CDU) or a Chiller.

[0040] In other embodiments, the cooling unit may be thermoelectric modules or a vapor-compression refrigeration system (VCRS).

[0041] In some embodiments, the cooling unit may also be a condenser and can function, for example, as a circulation channel through which the refrigerant circulates within the crimping block 2. The refrigerant can be liquid nitrogen, ethylene glycol, halogenated hydrocarbons, ammonia, sulfur dioxide, methane, or other cryogenic fluids.

[0042] Furthermore, Figure 1 shows a controller 5 that is electrically connected to the lower pressure generation unit 3 and the temperature control unit 4.

[0043] In some embodiments, the controller 5 may be a Central Processing Unit (CPU), but is not limited thereto, and may be a Microcontroller Unit (MCU), Digital Signal Processor (DSP), Programmable Logic Controller (PLC), Digital Signal Processor (DSP), Application Specific Integrated Circuits (ASIC), Programmable Logic Device (PLD), or other functionally similar devices, or a combination thereof.

[0044] In other embodiments, the controller 5 may implement various operational functions in the form of hardware circuits. Examples include, but are not limited to, workstations, laptops, client terminals, servers, distributed computing systems, handheld devices, or other computing systems or devices. In its most basic configuration, the controller 5 may comprise at least one processor and system memory.

[0045] Here, the controller 5 in Figure 1 is suitable for controlling the downward pressure generation unit 3, which then drives the crimping block 2 to apply small amounts of pressure to each chip 91 on the semiconductor package component 9 in Figure 5.

[0046] In other words, the controller 5 in Figure 1 controls the down pressure generation unit 3 to simultaneously apply multiple down pressures of the same or different magnitudes to multiple chips 91 on the semiconductor package component 9 in Figure 5, and can even accommodate multiple chips 91 at different heights. The down pressure generation units 3 in Figures 1 and 2 can each generate different movement strokes, thereby allowing each crimping block 2 to make complete contact with the upper surface of each chip 91 in Figure 5.

[0047] On the other hand, the controller 5 in Figure 1 is suitable for controlling the temperature control unit 4 to raise or lower the temperature of the chip 91 on the semiconductor package component 9 in Figure 5.

[0048] In other words, in some embodiments, the controller 5 can control the temperature control unit 4 to produce different temperature control effects for each chip 91 based on the thermal design power consumption (TDP) of each chip 91, for example, all chips 91 may be maintained at the same temperature, or each individual chip 91 may be maintained at a different temperature.

[0049] In embodiments such as a burn-in test, the controller 5 controls the heater 24 to heat and maintain all the chips 91 on the semiconductor package component 9 to a specific burn-in temperature.

[0050] The explanation will continue with reference to Figure 2A. In some embodiments, each crimping block 2 includes a force sensing unit 6 and a temperature sensing unit 7.

[0051] The force sensing unit 6 and the temperature sensing unit 7 are electrically connected to the controller 5 in Figure 1. The force sensing unit 6 can be controlled to measure the pressure applied by each crimping block 2 to the chip 91 on the semiconductor package component 9 in Figure 5. This allows the downward pressure generation unit 3 to apply sufficient downward pressure (downward force) to the chip 91.

[0052] Furthermore, the temperature sensing unit 7 can be controlled to measure the temperature of each chip 91 on the semiconductor package component 9, and the temperature control unit 4 is used to adjust the temperature of each chip 91, thereby maintaining each chip 91 at a predetermined temperature.

[0053] In some embodiments, the temperature value detected by the temperature sensing unit 7 is transmitted to the controller 5. If the detected temperature value is abnormal, the controller 5 can control the temperature control unit 4 to raise or lower the temperature of the crimping block 2 and further heat or cool the chip 91 on the semiconductor package component 9 by adjusting, for example, the temperature and flow rate of the refrigerant or the power applied to the heater 24.

[0054] If the temperature abnormality persists, controller 5 will immediately send a warning message and stop the inspection process.

[0055] Furthermore, in the embodiment shown in Figure 2A, a coupling block 25 is positioned between each downward pressure generating unit 3 and each crimping block 2, and the force sensing unit 6 can be positioned between the coupling block 25 and the crimping block 2.

[0056] The force sensing unit 6 is, for example, a load cell, a capacitive pressure sensor, a piezoresistive pressure sensor, or any other type of pressure sensor, but is not limited to these.

[0057] This will be explained with reference to Figure 2B. Here, Figure 2B is a schematic diagram of a lower pressure module capable of multi-point pressurization and multi-point temperature control in some embodiments of the present invention.

[0058] In the embodiment shown in Figure 2B, a thin-film pressure-sensing sheet 61 is provided on the contact surface 21 of the crimping block 2, and the contact surface 21 is used to contact the surface of the chip 91 on the semiconductor package component 9 shown in Figure 5.

[0059] More specifically, the thin-film pressure-sensing sheet 61 may be placed between the lower surface of the compression block 2 and the thermal interface material (TIM) 41.

[0060] In another embodiment, as described with reference to Figure 1, monitoring units 20 such as tilt sensors and proximity sensors can be further placed on each crimping block 2. The monitoring units 20 can be used together with the force sensing unit 6 to send sensing signals back to the controller 5, thereby monitoring contact between each crimping block 2 and the surface of the chip 91.

[0061] To further explain, a tilt sensor can be used to monitor the orientation of the crimping block 2 before and after contact with the semiconductor package component 9, and to determine whether tilting is occurring. A proximity sensor can be used to monitor whether there is complete contact between the crimping block 2 and the semiconductor package component 9.

[0062] If the sensing signals detected by the monitoring unit 20 and the force sensing unit 6 are abnormal, for example, if the downward pressure is too high or the contact between the crimping block 2 and the semiconductor package component 9 is abnormal, the controller 5 can send a control signal, and the multiple downward pressure generating units 3 will stop the downward pressure to prevent damage to the chip 91 on the semiconductor package component 9.

[0063] Furthermore, if the sensing signals detected by the monitoring unit 20 and the force sensing unit 6 are abnormal, but the horizontal position and downward pressure of the crimping block 2 do not exceed a set maximum threshold, the controller 5 can send a control signal to a specific downward pressure generating unit 3, which adjusts the appropriate downward pressure to the crimping block 2 and performs an inspection to ensure that each crimping block 2 is in full contact with the chip 91 on the semiconductor package component 9.

[0064] The explanation will be given with reference to Figure 3A. Here, Figure 3A is a schematic diagram of a lower pressure module capable of multi-point pressurization and multi-point temperature control in some embodiments of the present invention.

[0065] The difference between the embodiment shown in Figure 3A and the embodiment shown in Figure 2A is that the downward pressure module 1 further comprises an actuator 8, a lifting frame 16, a mounting frame 17, and a plurality of cushioning members 18.

[0066] In this embodiment, the actuator 8 is located above the downward pressure generation unit 3. The lifting frame 16 is a plate-like body extending horizontally and is connected to the actuator 8 via a mounting fixture (not indicated by a reference numeral). The mounting frame 17 is a plate-like body extending horizontally and is located below the lifting frame 16, on the opposite side, via the downward pressure generation unit 3.

[0067] Furthermore, the downward pressure generating unit 3 is positioned to contact the mounting frame 17. The mounting frame 17 is connected to the lifting frame 16 so as to be able to move up and down relative to it, and a buffer member 18 is provided between the lifting frame 16 and the mounting frame 17.

[0068] With these configurations, the actuator 8 provides vertical displacement to the crimping block 2 via the lifting frame 16 and the mounting frame 17, and after the crimping block 2 is brought closer to or directly pressed against the chip 91 on the semiconductor package component 9, the downward pressure generating unit 3 can apply downward pressure to the chip 91.

[0069] However, the cushioning effect of the cushioning member 18 prevents damage to the semiconductor package component 9 caused by the impact that the crimping block 2 inflicts on the chip 91 when the crimping block 2 is driven by the actuator 8.

[0070] In some embodiments, the actuator 8 can be considered a master actuator, which can achieve a wide range of lifting and lowering movements. The downward pressure generating unit 3 can be considered a slave actuator that can provide fine lifting and lowering movements to apply downward pressure.

[0071] Next, we will explain with reference to Figure 3B. Here, Figure 3B is a schematic diagram of a lower pressure module capable of multi-point pressurization and multi-point temperature control in some embodiments of the present invention.

[0072] Similarly, the difference between the embodiment shown in Figure 3B and the embodiment shown in Figure 2B is as follows: This embodiment further includes an actuator 8, a lifting frame 16, a mounting frame 17, and a plurality of cushioning members 18. The operating principles and functions of these components are as described in the previous paragraph.

[0073] Furthermore, in some embodiments, the actuator 8 may be a linear actuator, such as a linear motor, hydraulic cylinder, or pneumatic cylinder. The actuator 8 may also be composed of a composite mechanism; for example, the motor may be combined with a transmission element such as a ball screw or gears and a rack.

[0074] The following explanation will be given with reference to Figures 4A, 4B, and 5. Here, Figure 4A is a schematic diagram of a semiconductor package component inspection apparatus 10 in some embodiments of the present invention, in which a lower pressure module 1 capable of multi-point pressurization and multi-point temperature control is located at the inspection position, and Figure 4B is a schematic diagram of a semiconductor package component inspection apparatus 10 in some embodiments of the present application, in which a lower pressure module 1 capable of multi-point pressurization and multi-point temperature control is located at the mounting or removal position. Furthermore, Figure 5 is a schematic diagram of an inspection socket 11 in a semiconductor package component inspection apparatus 10 in some embodiments of the present application.

[0075] In the embodiments shown in Figures 4A and 4B, a semiconductor package component inspection apparatus 10 is provided, which mainly comprises a fixed frame 12, an inspection socket 11, a sliding frame 13, and a downward pressure module 1.

[0076] The fixed frame 12 can be fixed to the machine's work area. In some embodiments, the fixed frame 12 may be a substantially U-shaped structural component comprising a substantially rectangular bottom plate 121 and two side plates 122 extending vertically and in a front-to-back direction perpendicular to the vertical direction from both ends in the width direction that do not obstruct the insertion of the inspection socket 11.

[0077] Referring to Figure 5, the inspection socket 11 can be positioned on the base plate 121. In some embodiments, the inspection socket 11 consists of four positioning plates 111 that extend from the four sides of a substantially rectangular semiconductor package component 9 to connect to the base plate 121, and the positioning plates 111 and the base plate 121 define a housing space for housing the semiconductor package component 9.

[0078] The housing space is also equipped with several probes (not shown). These probes are primarily used to electrically contact the contacts on the underside of the semiconductor package component 9 in order to facilitate the transmission of power and signals.

[0079] Furthermore, Figures 4A and 4B also show a slide frame 13 that is slidable along the front-rear direction, which is perpendicular to the width direction and horizontal direction described above. The slide frame 13 is connected to the fixed frame 12 using guide rails (not indicated) and guide grooves (not indicated), and the pressurizing module 1 can be placed on the slide frame 13. Here, the guide rails extend along the front-rear direction. The guide grooves are formed along the side of the guide rails along the front-rear direction. Furthermore, as is clear from Figure 4B, an adjustment rod (not indicated) extending in the front-rear direction is attached to the lower side of the slide frame 13 in the vertical direction, and the other end of this adjustment rod, away from the slide frame, is inserted into a slide generating device 14, which will be described later. The slide frame as a whole is formed in a substantially H shape and is positioned to cover the substantially U-shaped fixed frame 12 described above from above.

[0080] In other words, the slide frame 13 is slidable relative to the fixed frame 12, and the pressurizing module 1 can also move along the bottom plate 121 of the fixed frame 12 in the front-to-back direction together with the slide frame 13.

[0081] Furthermore, in the embodiments shown in Figures 4A and 4B, a slide generating device 14 is arranged on the outer side in the width direction of each of the two side plates 122 of the fixed frame 12, which is electrically connected to the controller 5 and also connected to the slide frame 13.

[0082] In other embodiments, the slide generating device 14 may be placed on the slide frame 13 and connected to the fixed frame 12. In some embodiments, the slide generating device 14 may be a linear actuator such as a linear motor, hydraulic cylinder, or pneumatic cylinder.

[0083] In other words, the controller 5 controls the slide generating device 14 to drive the slide frame 13 to slide in the front-rear direction, and can selectively position the lower pressure module 1 to correspond to the inspection socket 11 or move it away from the inspection socket 11.

[0084] Here, the lower pressure module 1 shown in Figure 4A corresponds to the inspection socket 11. That is, the lower pressure module 1 is located at the inspection position directly above the inspection socket 11.

[0085] At this time, by pushing down the downward pressure module 1, downward pressure can be applied to the semiconductor package component 9 on the inspection socket 11 to control its temperature. On the other hand, as can be seen in Figure 4B, where the adjustment rod described above is extended and the slide frame 13 is pulled towards the front in the front-rear direction, the downward pressure module 1 is far away from the inspection socket 11 and is positioned for mounting or removal.

[0086] At this time, the upper part of the inspection socket 11 is not blocked by the downward pressure module 1, and an inspection-completed semiconductor package component 9 can be removed or an inspection-to-be-completed semiconductor package component 9 can be placed using an attachment or removal device (not shown).

[0087] Next, we will explain with reference to Figures 6, 7, and 8. Here, Figure 6 is a system block diagram of a lower pressure module 1 capable of multi-point pressurization and multi-point temperature control in some embodiments of the present application. Figure 7 is a top view of the lower pressure module 1 capable of multi-point pressurization and multi-point temperature control in a semiconductor package component inspection apparatus 10 in some embodiments of the present application. Figure 8 is a perspective view of the lower pressure module 1 capable of multi-point pressurization and multi-point temperature control in some embodiments of the present application.

[0088] In the embodiment shown in Figure 6, the pressurizing module 1 mainly comprises two crimping blocks 2, a plurality of down pressure generating units 3, two temperature control units 4, a controller 5, two force sensing units 6, two temperature sensing units 7, two monitoring units 20, and an actuator 8.

[0089] These crimping blocks 2 shown in Figure 6 each correspond to multiple chips 91 on the semiconductor package component 9 in Figure 5. The following explanation will refer to Figures 5 and 6 simultaneously.

[0090] The downward pressure generation unit 3 is connected to these crimping blocks 2. The temperature control unit 4, temperature sensing unit 7, monitoring unit 20, and force sensing unit 6 are each provided on the crimping block 2.

[0091] The controller 5 is electrically connected to the temperature control unit 4, the force sensing unit 6, the temperature sensing unit 7, the monitoring unit 20, and the actuator 8.

[0092] In some embodiments, the controller 5 is suitable for controlling the actuator 8 to drive the crimping block 2 to press each chip 91 on the semiconductor package component 9, thereby driving the down pressure generating unit 3 to apply each of the multiple down pressures to the chip 91 on the semiconductor package component 9.

[0093] The configuration and functions of the temperature control unit 4, force sensing unit 6, monitoring unit 20, and temperature sensing unit 7 are the same as in the embodiment described above, so their explanation will be omitted.

[0094] In the embodiment shown in Figure 8, the lower pressure module 1 further comprises a pressure plate 81. The crimping block 2 comprises a first crimping block 22 and a second crimping block 23.

[0095] Here, the pressure plate 81 described above comprises a pair of vertical sections 811 and a bottom plate section 812. Each vertical section is formed in a roughly rectangular parallelepiped shape that extends in the vertical and front-to-back directions, but will be described in more detail later. The bottom plate section 812 is formed to extend in the horizontal direction, and in the embodiment shown in Figure 8, a pair of vertical sections are provided on the bottom plate section 812 with a gap between them, but will be described in more detail later.

[0096] The lower surface of the first crimping block 22 corresponds to a roughly rectangular, larger chip 91 (see Figure 5) located in the center of the semiconductor package component 9. The lower surface of the second crimping block 23 is positioned on both sides of the semiconductor package component 9 along the long side of the large chip 91, sandwiching the large chip. In the embodiment shown in Figure 5, three roughly square chips 91 are arranged at equal intervals on each side, and since there are these on both sides, a total of six square chips 91 are provided.

[0097] The downward pressure generating unit 3 comprises a plurality of first elastic members 31 and a plurality of second elastic members 32. The first elastic members 31 are interposed between the bottom plate portion 812 of the pressure plate 81 and the first crimping block 22. The second elastic members 32 are interposed between the bottom plate portion 812 of the pressure plate 81 and the second crimping block 23.

[0098] The first crimping block 22 and the second crimping block 23 are each formed in a roughly rectangular, thick block shape.

[0099] The multiple first elastic members 31 and the multiple second elastic members 32 may be compression springs, and may have different allowable compression amounts.

[0100] In some embodiments, the first elastic member 31 may be placed at the four corners of the first crimping block 22, and similarly, the second elastic member 32 may be placed at the four corners of the second crimping block 23.

[0101] Here, when the actuator 8 is controlled and driven to move the pressure plate 81 closer to the first crimping block 22 and the second crimping block 23, the first elastic member 31 and the second elastic member 32 move, thereby applying different or the same downward pressure to the plurality of chips 91 on the semiconductor package component 9 via the first crimping block 22 and the second crimping block 23, respectively.

[0102] Furthermore, referring again to Figure 5, the inspection socket 11 shown in Figure 5 consists of four positioning plates 111. These positioning plates 111 coincide with the first crimping block 22 and the second crimping block 23, particularly in the vertical direction.

[0103] In other words, when the lower pressure module 1 in Figure 8 is pressurized, the positioning plates 111 each limit the depth of pressurization between the first crimping block 22 and the second crimping block 23, thereby preventing damage to the tip 91 from excessive pressurization.

[0104] In other words, since the area from the bottom plate 121 to the semiconductor package component 9 on which the chip 91 is mounted is connected by four thin, plate-shaped positioning plates 111, the positioning plates 111 can bend to a certain extent due to their characteristics, thereby releasing excessive pressure.

[0105] Next, we will explain with reference to Figures 9A and 9B. Here, Figure 9A is a perspective view of the first crimping block 22 in the lower pressure module 1 capable of multi-point pressurization and multi-point temperature control in some embodiments of the present application, and Figure 9B is a perspective view of the second crimping block 23 in the lower pressure module 1 capable of multi-point pressurization and multi-point temperature control in some embodiments of the present application.

[0106] In some embodiments, the first crimping block 22 includes a central projection 221, which is used to contact a larger central chip 91 on the semiconductor package component 9 (see Figure 5).

[0107] Here, the first crimping block 22 illustrated in Figure 9A has a roughly T-shape in cross-section, and the central projection 221 protrudes downward from the center of a roughly rectangular parallelepiped plate whose longitudinal direction extends horizontally.

[0108] As shown in Figure 9B, the second crimping block 23 comprises two convex frame portions 231 and a central opening 232. The two convex frame portions 231 are each provided on two opposing sides via the central opening 232. The two convex frame portions 231 are used to contact the chips 91 arranged in two rows on the semiconductor package component 9 side (see also Figure 5).

[0109] Furthermore, the central projection 221 of the first crimping block 22 is located in the central opening 232 of the second crimping block 23, and the two fit together with a certain degree of play. In other words, the first crimping block 22 and the second crimping block 23 can operate independently without interfering with each other.

[0110] In some embodiments, multiple cushioning springs 33 can be placed between the first and second crimping blocks 22 and 23 (see Figure 8), which are used to prevent them from colliding with each other and also to return them to their original positions and maintain a certain distance between them.

[0111] In the embodiments shown in Figures 9A and 9B, for example, the temperature control unit 4 shown in Figure 6 comprises a temperature control fluid chamber 222 and a temperature control fluid channel 233.

[0112] The temperature-controlled fluid chamber 222 is provided within the central projection 221 of the first crimping block 22, and the temperature-controlled fluid channel 233 is provided in the second crimping block 23.

[0113] Therefore, by supplying high-temperature or low-temperature controlled fluid to the temperature-controlled fluid chamber 222 and the temperature-controlled fluid channel 233, respectively, the first crimping block 22 and the second crimping block 23 can raise or lower the temperature of the chip 91 on the semiconductor package component 9.

[0114] In some embodiments, a Cooling Distribution Unit (CDU) or chiller can be used to supply a low-temperature fluid to the temperature-controlled fluid chamber 222 and the temperature-controlled fluid channel 233.

[0115] The following explanation will be given with reference to Figures 7 and 8. In the embodiments shown in these figures, as described above, the pressure plate 81 comprises two vertical portions 811 and a bottom plate portion 812.

[0116] The vertical sections 811 are connected perpendicularly to the base plate section 812, and each vertical section 811 has an inclined groove 813 formed therein. However, in Figure 8, the inclined groove 813 is not shown for the vertical section 811 depicted on the right side due to the angle.

[0117] The inclined groove 813 is inclined such that its rear side in the front-rear direction is positioned on the upper side and its front side in the front-rear direction is positioned on the lower side. In this way, one end of the inclined groove 813 located on the front side is adjacent to the bottom plate portion 812, and the other end is separated from the bottom plate portion 812.

[0118] Furthermore, as shown in Figure 7, the actuator 8 in Figure 6 comprises a linear displacement generation unit 82, a horizontal slide block 83, and a guide rod 84. The horizontal slide block 83 is connected to the linear displacement generation unit 82, one end of the guide rod 84 is connected to the horizontal slide block 83, and the other end is located in the inclined groove 813 of the vertical section 811.

[0119] Note that Figure 7 partially omits the upper part of the vertical section 811 shown in Figure 8, so that the roller of the guide rod 84 is visible.

[0120] Therefore, when the linear displacement generating unit 82 drives the horizontal slide block 83 to generate horizontal sliding, the guide rod 84 can be moved in conjunction with it to slide within the inclined groove 813, thereby allowing the pressure plate 81 to move closer to or further away from the first and second crimping blocks 22 and 23.

[0121] In other words, the above mechanism design allows the horizontal driving action of the linear displacement generation unit 82 to be converted into the upward movement of the pressure plate 81, making the entire mechanical component more compact, and significantly reducing the length, especially in the vertical direction.

[0122] Next, we will explain with reference to Figure 10. Here, Figure 10 is a front view of a lower pressure module 1 capable of multi-point pressurization and multi-point temperature control in some embodiments of the present invention.

[0123] The main differences between the embodiment shown in Figure 10 and the embodiment shown in Figure 8 are as follows: In the embodiment shown in Figure 10, the first elastic member 31 is interposed between the pressure plate 81 and the first crimping block 22, and the second elastic member 32 is interposed between the first crimping block 22 and the second crimping block 23.

[0124] Of these, when the controller 5 controls the actuator 8 to drive the pressure plate 81 closer to the first crimping block 22 and the second crimping block 23, the first elastic member 31 is driven to apply downward pressure to the chip 91 on the semiconductor package component 9 via the first crimping block 22.

[0125] Simultaneously, the plurality of first elastic members 31 and the plurality of second elastic members 32 can be driven to apply downward pressure to other chips 91 on the semiconductor package component 9 via the second crimping block 23.

[0126] To explain further, the first crimping block 22 is affected only by the compressive elastic force of the first elastic member 31, while the second crimping block 23 is affected by the compressive elastic force of the second elastic member 32 in addition to the first elastic member 31. Thus, the first crimping block 22 and the second crimping block 23 each generate two downward pressures of different magnitudes.

[0127] The explanation will be given with reference to Figure 11. Here, Figure 11 is a top view of the first crimping block 22 and the second crimping block 23 in a lower pressure module 1 capable of multi-point pressurization and multi-point temperature control in some embodiments of the present application.

[0128] As shown in Figure 11, the first crimping block 22 includes two vertically extending fluid flow ports 223, both connected to the temperature-controlled fluid chamber 222 so as to be spaced apart from each other on the underside of the first crimping block 22, which is formed in a substantially T shape (see Figure 9A).

[0129] Furthermore, the second crimping block 23 includes two vertically extending fluid channel openings 234, both of which are connected to an annularly formed temperature-controlled fluid channel 233 within the second crimping block 23 (see Figure 9B). The two fluid channel openings 234 are also positioned opposite each other via a central opening 232.

[0130] In fact, the two fluid inlets 223 and the two fluid channel inlets 234 each have an inlet and an outlet, and the multiple inlets allow the temperature-controlled fluid to flow into the temperature-controlled fluid chamber 222 (see Figure 9A) and the temperature-controlled fluid channel 233 (see Figure 9B), while the multiple outlets are used to discharge the temperature-controlled fluid.

[0131] Furthermore, as shown in the figure, the two fluid flow ports 223 and the two fluid channel ports 234 are each located within the leak-prevention grooves 26.

[0132] According to this, if fluid leakage occurs in the fluid flow port 223 and the fluid channel port 234, the leak prevention groove 26 can accumulate the leaked liquid, preventing the leaked liquid from flowing directly to the semiconductor package component 9 or other electronic components, thereby avoiding a short circuit.

[0133] In another embodiment, the liquid leak detector 261 is placed in the leak prevention groove 26 to immediately detect liquid leaks, report them immediately, and take appropriate action.

[0134] The explanation will be given with reference to Figure 12. Here, Figure 12 is a perspective view of the first crimping block 22 and the second crimping block 23 in a lower pressure module 1 capable of multi-point pressurization and multi-point temperature control in some embodiments of the present application.

[0135] In the embodiment shown in Figure 12, each liquid leak detector 261 may be equipped with a cover 262 to prevent the leaked liquid from splashing or overflowing, but the other configurations are the same as in the embodiment shown in Figure 11, so a description will be omitted.

[0136] Although embodiments of the present invention have been described above, these embodiments are not intended to limit the present invention, and those skilled in the art may modify or change them without departing from the spirit and scope of the invention, but the technical scope of the present invention is defined by the claims. [Explanation of Symbols]

[0137] 1. Down pressure module capable of multi-point pressurization and multi-point temperature control. 2 Crimping block 3. Downward pressure generation unit 4. Temperature control unit 5. Controller 6. Force sensing unit 7. Temperature sensing unit 8 Actuators 9 Semiconductor packaging components 10 Semiconductor package component inspection equipment 11 Inspection Socket 12 Fixed Frame 13 Slide Frame 14 Slide Generator 15 Coolant supply unit 16 Lifting Frame 17 Mounting frame 18. Cushioning material 20 monitoring units 21 Contact surfaces 22 First crimping block 23. Second crimping block 24 Heater 25 Coupling Block 26 Leak-proof groove 31 First elastic member 32 Second elastic member 33. Buffer spring 41 Thermal interface materials 61 Thin-film pressure-sensing sheet 81 Pressure plate 82 Linear Displacement Generation Unit 83 Horizontal sliding block 84 Guide Rod 91 chips 111 Positioning plate 121 Bottom plate 122 Side panel 221 Central protrusion 222 Temperature-controlled fluid chamber 223 Fluid flow port 231 Convex frame section 232 Central opening 233 Temperature-controlled fluid channels 234 Fluid channel opening 261 Liquid leak detector 262 Cover 811 Vertical section 812 Bottom plate part 813 Slanted groove

Claims

1. A lower pressure module capable of multi-point pressurization and multi-point temperature control, comprising multiple crimping blocks, multiple lower pressure generation units, multiple temperature control units, and a controller, The aforementioned multiple crimping blocks each correspond to multiple chips on a semiconductor package component, The plurality of downward pressure generating units are each connected to the plurality of crimping blocks, The plurality of temperature control units are provided on each of the plurality of crimping blocks, The controller is electrically connected to the plurality of lower pressure generating units and the plurality of temperature control units. A multi-point pressurization and multi-point temperature control capable down pressure module, characterized in that the controller is suitable for controlling the plurality of down pressure generation units to drive the plurality of crimping blocks to apply down pressure to each of the chips on the semiconductor package component, and is suitable for controlling the plurality of temperature control units to raise or lower the temperature of the plurality of chips on the semiconductor package component.

2. It is further equipped with multiple force sensing units, The plurality of force sensing units are provided on each of the plurality of crimping blocks and are electrically connected to the controller. The downward pressure module capable of multi-point pressurization and multi-point temperature control according to claim 1, characterized in that the controller is suitable for controlling the plurality of force sensing units to measure the downward pressure applied by the plurality of crimping blocks to the plurality of chips on the semiconductor package component.

3. The aforementioned force sensing units are equipped with a plurality of thin-film pressure sensing sheets, The plurality of thin-film pressure-sensing sheets are each provided on the contact surface of the plurality of crimping blocks, The downward pressure module capable of multi-point pressurization and multi-point temperature control according to claim 2, characterized in that the contact surface is used to contact the plurality of chips on the semiconductor package component.

4. Equipped with multiple coupling blocks, The plurality of coupling blocks are each provided between the plurality of lower pressure generating units and the crimping block, The downward pressure module capable of multi-point pressurization and multi-point temperature control according to claim 2, characterized in that the plurality of force sensing units are each located between the plurality of coupling blocks and the crimping block.

5. It is further equipped with multiple temperature sensing units, The plurality of temperature sensing units are provided on each of the plurality of crimping blocks and are electrically connected to the controller. The downward pressure module capable of multi-point pressurization and multi-point temperature control according to claim 1, characterized in that the controller is suitable for controlling the plurality of temperature sensing units to measure the temperature of each of the plurality of chips on the semiconductor package component.

6. Equipped with an actuator, The actuator is electrically connected to the controller, The downward pressure module capable of multi-point pressurization and multi-point temperature control according to claim 1, characterized in that the controller is suitable for controlling the actuator to drive the plurality of crimping blocks and pressing each of the plurality of chips on the semiconductor package component.

7. It further comprises a lifting frame, a mounting frame, and multiple cushioning members. The lifting frame is connected to the actuator, The plurality of downward pressure generating units are provided on the mounting frame, The downward pressure module capable of multi-point pressurization and multi-point temperature control according to claim 6, characterized in that the mounting frame is connected to the lifting frame via the plurality of cushioning members.

8. It is further equipped with a coolant supply unit, The coolant supply unit is electrically connected to the controller, Each of the aforementioned temperature control units comprises a temperature control fluid channel and a heater, The temperature-controlled fluid channel is connected to the coolant supply unit. The controller is suitable for controlling the coolant supply unit to provide coolant to the temperature control fluid channels of the plurality of temperature control units. The downward pressure module capable of multi-point pressurization and multi-point temperature control according to claim 1, characterized in that the controller is also suitable for controlling the heater to raise the temperature of the plurality of chips on the semiconductor package component.

9. It is further equipped with multiple monitoring units, The plurality of monitoring units are provided on each of the plurality of crimping blocks and are electrically connected to the controller. The lower pressure module capable of multi-point pressurization and multi-point temperature control according to claim 1, characterized in that the controller is suitable for controlling the plurality of monitoring units to sense at least one of the posture of the plurality of crimping blocks and the contact condition between the plurality of crimping blocks and the semiconductor package component.

10. A lower pressure module capable of multi-point pressurization and multi-point temperature control, comprising multiple crimping blocks, multiple lower pressure generation units, multiple temperature control units, actuators, and a controller, The aforementioned multiple crimping blocks each correspond to multiple chips on a semiconductor package component, The plurality of downward pressure generating units are connected to the plurality of crimping blocks, The plurality of temperature control units are provided on each of the plurality of crimping blocks, The controller is electrically connected to the plurality of temperature control units and the actuator. The controller is suitable for controlling the actuator to press the plurality of crimping blocks against the plurality of chips on the semiconductor package component, thereby driving the plurality of down pressure generating units to apply a plurality of down pressures to the plurality of chips on the semiconductor package component. The aforementioned controller is also suitable for controlling the plurality of temperature control units to raise or lower the temperature of the plurality of chips on the semiconductor package component, characterized in that it is a down pressure module capable of multi-point pressurization and multi-point temperature control.

11. It is further equipped with a pressure plate, The plurality of crimping blocks comprises a first crimping block and a second crimping block, The aforementioned plurality of downward pressure generating units comprises a plurality of first elastic members and a plurality of second elastic members, The plurality of first elastic members are provided between the pressure plate and the first compression block. The plurality of second elastic members are provided between the pressure plate and the second compression block. The controller is suitable for controlling the actuator to drive the pressure plate closer to the first and second crimping blocks, thereby the plurality of first and second elastic members apply the plurality of downward pressures via the first and second crimping blocks, respectively, as described in 10, a downward pressure module capable of multi-point pressurization and multi-point temperature control.

12. The first crimping block is provided with a central projection, The second crimping block comprises at least one convex frame portion and a central opening, The central projection of the first crimping block is located within the central opening of the second crimping block. The aforementioned plurality of temperature control units include a temperature control fluid chamber and a temperature control fluid channel, The temperature-controlled fluid chamber is provided within the central projection, The downward pressure module capable of multi-point pressurization and multi-point temperature control according to claim 11, characterized in that the temperature control fluid channel is provided within the second crimping block.

13. The pressure plate comprises at least one vertical portion and a bottom plate portion, The at least one vertical portion is connected perpendicularly to the bottom plate portion and is provided with an inclined groove, One end of the inclined groove is adjacent to the bottom plate, and the other end is separated from the bottom plate. The actuator comprises a linear displacement generating unit, a horizontal slide block, and a guide rod. The horizontal slide block is connected to the linear displacement generating unit, One end of the guide rod is connected to the horizontal slide block, and the other end is located in the inclined groove of at least one vertical section. The linear displacement generating unit drives the horizontal slide block to generate a horizontal slide, thereby causing the guide rod to slide within the inclined groove, and moving the pressure plate closer to or further away from the first and second crimping blocks, as described in 11, which enables multi-point pressurization and multi-point temperature control.

14. It is further equipped with a pressure plate, The plurality of crimping blocks comprises a first crimping block and a second crimping block, The aforementioned plurality of downward pressure generating units comprises a plurality of first elastic members and a plurality of second elastic members, The plurality of first elastic members are provided between the pressure plate and the first compression block. The second elastic member is provided between the first crimping block and the second crimping block, The controller is suitable for controlling the actuator to drive the pressure plate closer to the first and second crimping blocks. As a result, the plurality of first elastic members apply at least one of the plurality of downward pressures via the first crimping block, and in addition, this drives the plurality of first elastic members and the plurality of second elastic members to apply at least one of the plurality of downward pressures via the second crimping block, characterized in that a downward pressure module capable of multi-point pressurization and multi-point temperature control according to claim 10.

15. A semiconductor package component inspection apparatus comprising a fixed frame, an inspection socket, a slide frame, a lower pressure module capable of multi-point pressurization and multi-point temperature control as described in any one of claims 1 to 14, and a slide generating device, The inspection socket is used to house semiconductor package components and is mounted on the fixed frame. The slide frame is connected to the fixed frame, The lower pressure module capable of multi-point pressurization and multi-point temperature control according to any one of claims 1 to 14 is provided on the slide frame, The slide generating device is electrically connected to the controller and assembled to at least one of the fixed frame and the slide frame. The controller is suitable for controlling the slide generating device to drive and slide the slide frame. A semiconductor package component inspection apparatus characterized in that the lower pressure module, which is capable of multi-point pressurization and multi-point temperature control, is selectably corresponding to or away from the inspection socket.

16. The inspection socket comprises a plurality of positioning plates, The aforementioned fixed frame includes a bottom plate, The semiconductor package component inspection apparatus according to claim 15, characterized in that the plurality of positioning plates are provided on the bottom plate, and the plurality of positioning plates and the bottom plate define a storage space, which is used to house the semiconductor package component.

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