Method for adjusting a processing liquid supply unit, pressure loss adjustment unit, and substrate processing apparatus.

Abstract

The present invention provides a method for adjusting a processing liquid supply unit, a pressure loss adjustment unit, and a substrate processing apparatus that can easily reproduce the pressure loss of piping, which differs for each substrate processing plant. [Solution] In the substrate processing apparatus 1, the substrate processing unit 100 and the processing liquid supply unit 200 are connected by a liquid supply pipe 50. A pressure loss adjustment unit 300 is inserted into the liquid supply pipe 50. The pressure loss adjustment unit 300 includes a first pressure gauge 301, a fifth regulator 302, a second pressure gauge 303, a first control unit 304, a first storage unit 305, and a calculation unit 306. The first control unit 304 calculates second information, which is the pressure loss in the liquid supply pipe 50 before and after the fifth regulator 302, from the difference between the values ​​obtained from the first pressure gauge 301 and the second pressure gauge 303. The first control unit 304 controls the opening degree of the fifth regulator 302 so that the first information, which is predetermined information regarding pressure loss, and the second information become equal.

Description

Technical Field

[0004] , , , , ,

[0001] The present invention relates to a substrate processing unit that processes a substrate using a processing liquid, a substrate processing apparatus having a processing liquid supply unit that supplies the processing liquid to the substrate processing unit, a method for adjusting the processing liquid supply unit applicable to the substrate processing apparatus, and a pressure loss adjustment unit. Substrates to be processed include, for example, semiconductor wafers, substrates for liquid crystal display devices, substrates for plasma displays, substrates for FED (Field Emission Display), substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, and the like.

Background Art

[0002] In the manufacturing processes of semiconductors and liquid crystals, a substrate processing apparatus that performs processing on the surface of a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display panel using a processing liquid may be used. For example, in the case of a single-wafer type substrate processing apparatus that processes substrates one by one, the substrate processing apparatus includes a substrate processing unit that processes the substrate and a processing liquid supply unit that supplies the processing liquid to the substrate processing unit via a liquid feed pipe. The substrate processing unit has a plurality of processing chambers for processing the substrate, and each processing chamber includes a processing liquid discharge nozzle for supplying the processing liquid to the surface of the substrate and a supply pipe having one end connected to the processing liquid discharge nozzle and for supplying the processing liquid. The other end of the supply pipe is connected to the liquid feed pipe and further connected to the processing liquid supply unit.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] It is desirable to install the processing liquid supply unit near the substrate processing unit of the substrate processing apparatus. However, due to the layout of the substrate processing plant (hereinafter referred to as the plant), the installation location of the processing liquid supply unit may differ. For example, the substrate processing unit of the substrate processing apparatus may be installed on an upper floor, and the processing liquid supply unit on a lower floor. When the installation location of the processing liquid supply unit differs, the length of the liquid supply piping for supplying the processing liquid from the substrate processing unit of the substrate processing apparatus to the processing liquid supply unit will differ. Furthermore, the length of the liquid supply piping affects the magnitude of the pressure loss applied to the processing liquid. Patent Document 1 discloses a configuration in which the pressure loss in the processing liquid is compensated for by installing the processing liquid supply unit on a lower floor than the substrate processing unit. However, in evaluations conducted before delivering the substrate processing apparatus to the plant, it is difficult to install the processing liquid supply unit in the same location as in the plant, and it is not possible to reproduce the pressure loss in the processing liquid that occurred in the plant. In most cases, the substrate processing unit and the processing liquid supply unit of the substrate processing apparatus are installed at the same height for evaluation.

[0005] Therefore, the object of the present invention is to provide a method for adjusting a processing liquid supply unit, a pressure loss adjustment unit, and a substrate processing device that can easily reproduce pressure loss corresponding to the different conditions of the liquid supply piping in each factory. [Means for solving the problem]

[0006] The invention described in claim 1 is a method for adjusting a processing liquid supply unit that supplies a processing liquid to a substrate processing unit through a liquid supply pipe, in a substrate processing apparatus for processing substrates, comprising the steps of: setting predetermined first information relating to pressure loss; calculating second information which is information relating to the pressure loss of the processing liquid in the liquid supply pipe between the substrate processing unit and the processing liquid supply unit; applying pressure loss to the processing liquid in the liquid supply pipe so that the second information is equal to the first information; setting third information which defines the flow rate and pressure of the processing liquid supplied to the substrate processing unit; and adjusting the flow rate and pressure of the processing liquid supplied to the substrate processing unit so that they are the same as the third information, while the pressure loss is applied to the processing liquid.

[0007] [Effect] In the adjustment method for the processing liquid supply unit described in claim 1, while a predetermined pressure loss is applied to the processing liquid in the liquid supply piping, it becomes possible to adjust the pressure and flow rate of the processing liquid supplied to the main body of the substrate processing apparatus to predetermined values.

[0008] The invention described in claim 2 includes the fact that the first information is determined according to the length of the liquid supply piping between the substrate processing unit and the processing liquid supply unit.

[0009] [Effects] In the method for adjusting the processing liquid supply unit described in claim 2, a predetermined pressure loss is applied to the processing liquid in the liquid supply piping, making it possible to easily reproduce a pressure loss corresponding to the length of the liquid supply piping expected in the factory.

[0010] The invention described in claim 3 includes a step of calculating the second information, in which the pressure loss is calculated based on the pressure of the processing liquid measured in the vicinity of the substrate processing unit and in the vicinity of the processing liquid supply unit within the liquid supply piping.

[0011] [Effect] In the method for adjusting the processing liquid supply unit described in claim 3, the pressure loss can be calculated more accurately.

[0012] The invention described in claim 4 relates to a pressure loss adjustment unit that provides pressure loss to the processing liquid flowing through a liquid supply unit, in a liquid supply piping that connects a processing liquid supply unit that supplies processing liquid to a substrate processing unit that processes substrates, the liquid supply piping comprising: a first pressure gauge located in the vicinity of the processing liquid supply unit in the liquid supply piping and measuring a first pressure which is the pressure of the processing liquid that has been delivered; a second pressure gauge located in the vicinity of the substrate processing unit in the liquid supply piping and measuring a second pressure which is the pressure of the processing liquid that has been delivered from the processing liquid supply unit and taken into the substrate processing unit; and the first The system includes a pressure loss adjustment unit provided between a pressure gauge and a second pressure gauge, which provides the pressure loss to the processing liquid; a first storage unit which stores first information which is a predetermined information relating to a predetermined pressure loss; a calculation unit which calculates second information which is the pressure difference between the vicinity of the processing liquid supply unit and the vicinity of the substrate processing unit based on the difference between the first pressure and the second pressure; and a first control unit, wherein the first control unit reads the first information from the first storage unit, compares the second information with the first information, and controls the pressure loss adjustment unit so that the second information is equal to the first information.

[0013] [Function / Effect] In the pressure loss adjustment unit described in claim 4, a predetermined pressure loss is applied to the processing liquid in the liquid supply piping, making it possible to easily reproduce a desired pressure loss regardless of the length of the liquid supply piping connecting the substrate processing unit and the processing liquid supply unit.

[0014] The invention described in claim 5 includes the fact that the first information is determined according to the length of the liquid supply piping between the substrate processing unit and the processing liquid supply unit.

[0015] [Function / Effect] In the pressure loss adjustment unit described in claim 5, a predetermined pressure loss is applied to the processing fluid in the fluid supply piping, making it possible to easily reproduce a pressure loss corresponding to the length of the fluid supply piping expected in the factory.

[0016] The invention described in claim 6 includes a substrate processing apparatus comprising: a substrate processing unit for processing a substrate with a processing liquid; a processing liquid supply unit for supplying the processing liquid to the substrate processing unit; and a liquid supply pipe connecting the substrate processing unit and the processing liquid supply unit.

[0017] [Effect] In the substrate processing apparatus described in claim 6, while a predetermined pressure loss is applied to the processing liquid in the liquid supply piping, it becomes possible to adjust the pressure and flow rate of the processing liquid supplied to the main body of the substrate processing apparatus to predetermined values.

[0018] The invention described in claim 7 relates to a substrate processing apparatus, wherein the processing liquid supply unit comprises a processing liquid adjustment unit that adjusts the pressure and flow rate of the processing liquid supplied, a second storage unit that stores third information relating to the pressure and flow rate of the processing liquid supplied to the substrate processing unit, and a second control unit, wherein the second control unit reads the third information from the second storage unit by the pressure loss adjustment unit and controls the processing liquid adjustment unit so that the pressure and flow rate of the processing liquid supplied to the substrate processing unit become values ​​determined by the third information while pressure loss is being applied to the processing liquid.

[0019] [Effect] In the substrate processing apparatus described in claim 7, while a predetermined pressure loss is applied to the processing liquid in the liquid supply piping, it becomes possible to adjust the pressure and flow rate of the processing liquid supplied to the main body of the substrate processing apparatus to predetermined values. [Effects of the Invention]

[0020] According to the present invention, it is possible to simply reproduce the pressure loss corresponding to the state of the liquid feed pipe different for each factory without depending on the length of the liquid feed pipe connecting between the substrate processing unit and the processing liquid supply unit.

Brief Description of Drawings

[0021] [Figure 1] It is a schematic diagram of a substrate processing apparatus and a pressure loss adjustment unit according to a first embodiment of the present invention. [Figure 2] It is a schematic diagram showing the internal configuration of the substrate processing unit of FIG. 1. [Figure 3] It is a table showing the relationship between the length of the pipe between the substrate processing unit and the processing liquid supply unit and the pressure loss generated corresponding to the length. [Figure 4] It is a block diagram showing the configuration of the control system of the substrate processing apparatus. [Figure 5] It is a block diagram showing the configuration of the control system of the substrate processing unit. [Figure 6] It is a block diagram showing the configuration of the control system of the processing liquid supply unit. [Figure 7] It is a block diagram showing the configuration of the control system of the pressure loss adjustment unit. [Figure 8] It is a flowchart showing the substrate processing in the substrate processing apparatus of FIG. 1.

Embodiments for Carrying Out the Invention

[0022] Hereinafter, an adjustment method of a processing liquid supply unit, a pressure loss adjustment unit, and a substrate processing apparatus according to an embodiment of the present invention will be described while referring to the drawings.

[0023] Figure 1 is a schematic diagram of a substrate processing apparatus and a pressure loss adjustment unit according to an embodiment of the present invention. As shown in Figure 1, the substrate processing apparatus 1 comprises a substrate processing unit 100, a processing liquid supply unit 200, and a third control unit 400. The substrate processing unit 100 supplies processing liquid to the substrate W and performs processing on the substrate W according to the processing liquid. The processing liquid supply unit 200 supplies processing liquid to the substrate processing unit 100. The third control unit 400 controls, for example, the substrate processing apparatus 1.

[0024] For example, when the substrate processing apparatus 1 is installed at a delivery site such as a factory, the substrate processing unit 100 and the processing liquid supply unit 200 are installed in a first relative positional relationship. In a specific example, in the first relative positional relationship, the substrate processing unit 100 is installed on an upper floor of the factory, and the processing liquid supply unit 200 is installed on a lower floor of the factory. On the other hand, when the substrate processing apparatus 1 is installed at the manufacturer, for example, the substrate processing unit 100 and the processing liquid supply unit 200 are installed in a second relative positional relationship, which is different from the first relative positional relationship. In a specific example, in the second relative positional relationship, the substrate processing unit 100 and the processing liquid supply unit 200 are installed on the same floor (see Figure 1). In this embodiment, the explanation will mainly be given using the case where the substrate processing unit 100 and the processing liquid supply unit 200 are installed on the same floor as an example.

[0025] The substrate processing unit 100 and the processing liquid supply unit 200 are connected to each other by a liquid supply pipe 50 for supplying processing liquid from the processing liquid supply unit 200 to the substrate processing unit 100, and a return pipe 51 for supplying processing liquid from the substrate processing unit 100 to the processing liquid supply unit 200. The connection of the liquid supply pipe 50 and the return pipe 51 to the substrate processing unit 100 and the processing liquid supply unit 200 forms a circulation path for the processing liquid to circulate between the substrate processing unit 100 and the processing liquid supply unit 200. A pressure loss adjustment unit 300 is interposed in the liquid supply pipe 50. In this embodiment, the explanation will be given using the stage of manufacturing the substrate processing apparatus 1 before delivering the substrate processing apparatus 1 to the factory as an example. More specifically, the explanation will be given using the case where the processing liquid supply unit 200 is adjusted to operate with predetermined performance at the installation location expected in the factory as an example.

[0026] (1) Configuration of the substrate processing unit Figure 2 is a schematic diagram showing the internal structure of the substrate processing unit 100 shown in Figure 1. The substrate processing unit 100 comprises a plurality of processing units 101. Each processing unit 101 has a side section covering the sides, a top section covering the top, and a bottom section covering the bottom. One side of the side section of each processing unit 101 has a transport opening (not shown) for transporting substrates between the inside and outside of the processing unit 101. The transport opening has an openable and closable shutter (not shown). An FFU (Fan Filter Unit) is provided in the top section of the processing unit 101. The FFU creates a downward flow of clean air inside the processing chamber.

[0027] The processing unit 101 houses a spin chuck 110, a discharge unit 120, and a liquid receiving unit 130. The spin chuck 110 includes a spin base 111, a plurality of chuck pins 112, a spin motor 113, and an opening / closing drive unit 114. The spin base 111 is attached to the upper end of the rotation axis 113a of the spin motor 113. The rotation axis 113a is arranged along the vertical direction. The spin base 111 rotates around the vertical direction by a rotational force around the rotation axis 113a of the spin motor 113. The plurality of chuck pins 112 are arranged at equal intervals around the periphery of the spin base 111. At least one of the plurality of chuck pins 112 is driven by the opening / closing drive unit 114 and can change its state between a holding state, in which it holds the outer peripheral edge of the substrate W, and an open state, in which it does not hold, around an axis perpendicular to the upper surface of the spin base 111. During processing of the substrate W, multiple chuck pins 112 hold the substrate W, and the substrate W is held in a horizontal position on the spin base 111.

[0028] The discharge unit 120 includes a rotary support shaft 121, a rotary drive unit 122, a nozzle arm 123, and a nozzle 124. The rotary support shaft 121 is formed at the bottom of the processing unit 101 so as to extend vertically. The rotary support shaft 121 is connected to the rotary drive unit 122 and configured to be rotatable. The nozzle arm 123 is positioned above the spin chuck 110 and extends horizontally from the upper end of the rotary support shaft 121. A nozzle 124 is attached to the tip of the nozzle arm 123.

[0029] A processing liquid supply unit 200 is connected to the nozzle 124. The processing liquid supply unit 200 supplies processing liquid to the nozzle 124. The rotary drive unit 122 includes one or more pulse motors and rotates the rotary support shaft 121. With the above configuration, when cleaning the upper surface of the substrate W held in the spin chuck 110, the entire upper surface of the substrate W can be cleaned by driving the nozzle 124 in an arc shape via the rotary support shaft 121 and the nozzle arm 123.

[0030] The liquid receiving section 130 includes a cup 131 and a cup drive unit 132. The cup 131 surrounds the spin chuck 110 in a plan view and is provided to be vertically movable. The cup drive unit 132 has, for example, a ball screw mechanism. The cup drive unit 132 moves the cup 131 between a washing position above the spin chuck 110 and a standby position below the spin chuck 110.

[0031] (2) Configuration of the processing liquid supply unit Referring to Figure 1, the processing liquid supply unit 200 will be described. The factory where the processing liquid supply unit 200 is installed is equipped with factory resources necessary for semiconductor manufacturing, such as electricity, processing liquid, gas, and compressed air. In this embodiment, the processing liquid supply unit 200 will be described as an example in which a pure water supply source and a chemical solution supply source, which are factory resources, are connected.

[0032] The processing liquid supply unit 200 includes a processing liquid supply section 201, a tank 204, a circulation section 205, a discharge section 206, a second storage section 207, and a second control section 208. The second control section 208 controls the entire processing liquid supply unit 200.

[0033] The processing liquid supply unit 201 includes a pure water replenishment unit 202 and a chemical solution replenishment unit 203. The pure water replenishment unit 202 includes piping 202a, a first regulator 202b, a first on / off valve 202c, and a first flow meter 202d. Piping 202a has two ends; one end is connected to a pure water supply source, which is the factory's power source for supplying pure water, and the other end is connected to a tank 204. The first flow meter 202d, the first on / off valve 202c, and the first regulator 202b are inserted in this order from upstream to downstream of piping 202a. The first flow meter 202d is, for example, a flow sensor that measures flow rate using ultrasound, measures the flow rate of pure water flowing inside piping 202a, and emits an electrical signal corresponding to the flow rate of pure water. The first regulator 202b is, for example, a pressure regulator. The first regulator 202b is controlled by the second control unit 208 to adjust the flow rate of pure water in the piping 202a. Based on the electrical signal regarding the flow rate of pure water measured by the first flow meter 202d, the second control unit 208 provides feedback control to the first regulator 202b so that the flow rate of pure water flowing through the piping 202a reaches a predetermined flow rate. The first on / off valve 202c adjusts whether or not the processing liquid flows through the piping 202a by having an "open state" where the processing liquid flows and a "closed state" where the processing liquid does not flow.

[0034] The chemical solution replenishment unit 203 includes piping 203a, a second regulator 203b, a second on / off valve 203c, and a second flow meter 203d. Piping 203a has two ends; one end is connected to a chemical solution supply source, which is a factory power source that supplies the chemical solution, and the other end is connected to a tank 204. The second flow meter 203d, the second on / off valve 203c, and the second regulator 203b are inserted in this order from upstream to downstream of piping 203a. The second flow meter 203d is, for example, a flow sensor that measures the flow rate of the chemical solution flowing inside piping 203a and emits an electrical signal corresponding to the flow rate of the chemical solution. The second regulator 203b is, for example, a pressure regulator. The second regulator 203b is controlled by the second control unit 208 and adjusts the flow rate of the chemical solution in piping 203a. The second control unit 208 provides feedback control to the second regulator 203b based on the electrical signal regarding the flow rate of the chemical solution measured by the second flow meter 203d, so that the flow rate of pure water flowing through the pipe 203a becomes a predetermined flow rate. The second on / off valve 203c adjusts whether or not the treatment liquid flows through the pipe 203a by having an "open state" (as described above) where the treatment liquid flows and a "closed state" where the treatment liquid does not flow. In this embodiment, the chemical solution is, for example, hydrofluoric acid.

[0035] In tank 204, a treatment solution is generated using pure water supplied by the pure water supply unit 202 and chemical solution supplied by the chemical solution supply unit 203. Tank 204 stores the treatment solution.

[0036] The circulation unit 205 includes a circulation pipe 205a, a pump 205b, a heater 205c, a thermometer 205d, a filter 205e, a concentration meter 205f, a third regulator 205g, a third on / off valve 205h, and a fourth on / off valve 205i. The circulation pipe 205a has two ends, one of which is connected to the lower part of the tank 204 and the other end to the upper part of the tank 204. This forms a circulation path in which the processed liquid circulates through the tank 204 and the circulation pipe 205a. The circulation pipe 205a further includes a branch pipe 205j. The fourth on / off valve 205i is interposed in the branch pipe 205j, and one end of the liquid supply pipe 50 is connected to its downstream end.

[0037] The circulation pipe 205a is fitted with a pump 205b, a heater 205c, a thermometer 205d, a filter 205e, a concentration meter 205f, a third regulator 205g, and a third on / off valve 205h. The pump 205b, heater 205c, thermometer 205d, filter 205e, concentration meter 205f, third regulator 205g, and third on / off valve 205h are arranged in this order in the direction of the flow of the processed liquid in the circulation pipe 205a. The pump 205b pumps the processed liquid inside the circulation pipe 205a from upstream to downstream. The heater 205c heats the processed liquid inside the circulation pipe 205a. The thermometer 205d measures the temperature of the processed liquid inside the circulation pipe 205a and emits an electrical signal related to the temperature of the processed liquid flowing through the circulation pipe 205a. The second control unit 208 provides feedback control to the heater 205c based on the electrical signal related to the temperature measured by the thermometer 205d, so that the processing liquid in the circulation pipe 205a reaches a predetermined temperature.

[0038] Filter 205e is, for example, a UPE (Ultra high molecular weight Polyethylene membrane) filter, configured to discharge bubbles in the treatment liquid that permeate through it to the outside. The mesh opening of filter 205e is, for example, 7 nm. The concentration meter 205f measures the concentration of the treatment liquid in the circulation pipe 205a. In this embodiment, the concentration of the treatment liquid is the concentration of the chemical solution that occupies the treatment liquid. The concentration meter 205f emits an electrical signal relating to the concentration of the treatment liquid in the circulation pipe 205a. Based on the electrical signal relating to the concentration of the treatment liquid measured by the concentration meter 205f, the second control unit 208 provides feedback control to the first regulator 202b and the second regulator 203b so that the treatment liquid in the circulation pipe 205a reaches a predetermined concentration.

[0039] The third on / off valve 205h controls whether or not the processing liquid flows in the circulation pipe 205a by switching between an "open state" where the processing liquid flows and a "closed state" where the processing liquid does not flow. The fourth on / off valve 205i controls whether or not the processing liquid flows in the liquid supply pipe 50 by switching between an "open operation" where the processing liquid flows and a "close operation" where the processing liquid does not flow. The second control unit 208 causes the third on / off valve 205h to "open" and the fourth on / off valve 205i to "close," causing the processing liquid to circulate in the circulation section 205. Also, the second control unit 208 causes the third on / off valve 205h to "close" and the fourth on / off valve 205i to "open," supplying the processing liquid to the substrate processing unit 100 via the liquid supply pipe 50. The third regulator 205g is, for example, a pressure regulator. The third regulator 205g is controlled by the second control unit 208 and adjusts the flow rate of the processing liquid in the circulation pipe 205a.

[0040] The discharge section 206 includes a drain pipe 206a, a fifth on / off valve 206b, and a fourth regulator 206c. The drain pipe 206a has two ends, one of which is connected to the bottom of the tank 204. The fifth on / off valve 206b and the fourth regulator 206c are interposed in the drain pipe 206a. The fifth on / off valve 206b adjusts whether or not the processing liquid flows in the drain pipe 206a through an "open operation" (described above) that allows the processing liquid to flow and a "close operation" that prevents the processing liquid from flowing. The fourth regulator 206c is, for example, a pressure regulator. The fourth regulator 206c is controlled by the second control unit 208 and adjusts the flow rate of the processing liquid in the drain pipe 206a. The second storage unit 207 stores the pressure and flow rate of the processing liquid required by the substrate processing unit 100 at the time it is supplied to the substrate processing unit 100.

[0041] (3) Configuration of the pressure loss adjustment unit Referring to Figure 1, the configuration of the pressure loss adjustment unit 300 will be described. The pressure loss adjustment unit 300 includes a first pressure gauge 301, a fifth regulator 302, a second pressure gauge 303, a first control unit 304, a first storage unit 305, and a calculation unit 306. The first control unit 304 controls the entire pressure loss adjustment unit 300. The first pressure gauge 301, the fifth regulator 302, and the second pressure gauge 303 are interposed in the liquid supply piping 50. The second pressure gauge 303, the fifth regulator 302, and the first pressure gauge 301 are arranged in this order from upstream to downstream as the processing liquid flows through the liquid supply piping 50. In the first embodiment, the first pressure gauge 301 is located in the liquid supply piping 50 near the substrate processing unit 100, and the second pressure gauge 303 is located in the liquid supply piping 50 near the processing liquid supply unit 200.

[0042] The vicinity of the substrate processing unit 100 refers to the length of the liquid supply piping 50 from the first pressure gauge 301 to the substrate processing unit 100 at which pressure loss due to the liquid supply piping 50 can be ignored. For example, the vicinity of the substrate processing unit 100 means that the length from the first pressure gauge 301 to the substrate processing unit 100 is 10m or less. The vicinity of the processing liquid supply unit 200 refers to the length of the liquid supply piping 50 from the inlet of the processing liquid supply unit 200 to the second pressure gauge 303 at which pressure loss due to the liquid supply piping 50 can be ignored. For example, the vicinity of the processing liquid supply unit 200 means that the length from the processing liquid supply unit 200 to the second pressure gauge 303 is 30m or less.

[0043] The first pressure gauge 301 measures the first pressure, which is the pressure of the processing liquid near the substrate processing unit 100 within the liquid supply piping 50. The second pressure gauge 303 measures the second pressure, which is the pressure of the processing liquid near the processing liquid supply unit 200 within the liquid supply piping 50. The first pressure gauge 301 and the second pressure gauge 303 emit electrical signals corresponding to the first and second pressures of the processing liquid.

[0044] The first storage unit 305 stores predetermined correspondence information regarding pressure loss. As shown in Figure 3, the correspondence information records the relationship between the length of the liquid supply piping 50 between the substrate processing unit 100 and the processing liquid supply unit 200 and the pressure loss that occurs in accordance with that length. The correspondence information may also record the relationship between the difference in installation height between the substrate processing unit 100 and the processing liquid supply unit 200 and the pressure loss that occurs in accordance with that difference in installation height. In addition to the correspondence between each value and the pressure loss value, the relational expression between each value and the pressure loss value may also be recorded.

[0045] Incidentally, the length of the liquid supply pipe 50 in the first relative positional relationship, and the difference in installation height between the substrate processing unit 100 and the processing liquid supply unit 200 are known. Therefore, based on the installation information, which includes at least one of the length of the liquid supply pipe 50 and the difference in installation height, and the correspondence relationship information, the first information, which is the pressure loss of the liquid supply pipe 50 in the first relative positional relationship, can be determined.

[0046] Furthermore, the calculation unit 306 calculates the pressure loss in the liquid supply piping 50 between the first pressure gauge 301 and the second pressure gauge 303 based on the electrical signals related to pressure emitted from the first pressure gauge 301 and the second pressure gauge 303. More specifically, it calculates second information, which is the pressure loss in the liquid supply piping 50 before and after the fifth regulator 302, from the difference between the first pressure and the second pressure. The fifth regulator 302 is, for example, a pressure regulator. As will be described later, the fifth regulator 302 is controlled by the first control unit 304 based on the first and second information to adjust the flow rate of the processed liquid in the liquid supply piping 50.

[0047] (4) Configuration of the control unit of the substrate processing apparatus 1 Figure 4 shows an example of the configuration of the third control unit 400. The configuration of the third control unit 400 will be described with reference to Figure 4. The third control unit 400 includes a CPU 401, RAM 402, ROM 403, storage device 404, input / output interface 405, and bus 406. The CPU 401, RAM 402, ROM 403, storage device 404, and input / output interface 405 are connected to the bus 406.

[0048] RAM 402 is used as the working area for CPU 401. ROM 403 stores the system program. Storage device 404 includes a storage medium such as a hard disk or semiconductor memory and stores the program. The program includes, for example, processing conditions set during the processing of the circuit board W.

[0049] The processing conditions include, at a minimum, the rotation speed of the substrate W in the spin chuck 110, the concentration of the processing solution, the temperature of the processing solution, the input pressure which is the pressure immediately before the processing solution is supplied to the substrate processing unit 100, and the input flow rate which is the flow rate immediately before the processing solution is supplied to the substrate processing unit 100, all of which are necessary for performing the predetermined processing. The values ​​entered in the processing conditions are predetermined values. Here, "immediately before" refers to the time when the processing solution has passed through one end of the liquid supply piping 50 that is connected to the substrate processing unit 100. The input pressure and input flow rate correspond to the third information described later.

[0050] Furthermore, a memory 407 containing a program is detachably attached to the storage device 404. The CPU 401 inputs the program stored in the storage device 404 and the program stored in the memory 407 into the RAM 402 and executes them. The input / output interface 405 is a communication interface that connects the CPU 401 to external devices. The input / output interface 405 also communicates with various parts of the board processing device 1, enabling the transmission and reception of data.

[0051] The CPU 401 executes a substrate processing program, thereby controlling the operation of each part of the substrate processing apparatus 1. Figure 5 is a block diagram showing an example of the functional configuration of the third control unit 400. The third control unit 400 controls the spin motor 113, the opening / closing drive unit 114, the rotation drive unit 122, the processing liquid supply unit 200, and the cup drive unit 132.

[0052] The third control unit 400 controls the opening / closing drive unit 114. By operating the opening / closing drive unit 114, the third control unit 400 changes the state of the multiple chuck pins 112 from an open state, where they are separated from the substrate W, to a holding state, where they hold the substrate W. As a result, the substrate W that has been brought into the processing unit 101 is held by the spin chuck 110. Furthermore, the third control unit 400 changes the state of the multiple chuck pins 112 from a holding state, where they hold the substrate W, to an open state, where they do not hold the substrate W, making the substrate W ready to be transported from the processing unit 101. In addition, the third control unit 400 controls the spin motor 113. The third control unit 400 controls the spin motor 113 based on processing conditions stored in the memory device 404. As a result, when processing the substrate W, the substrate W held by the spin chuck 110 rotates at a preset speed.

[0053] The third control unit 400 controls the cup drive unit 132. As a result, when processing the substrate W, the cup 131 shown in Figure 2 moves between a cleaning position above the spin chuck 110 and a standby position below the spin chuck 110. The third control unit 400 also controls the processing liquid supply unit 200 by sending commands to the second control unit of the processing liquid supply unit 200. As a result, when processing the substrate W, a predetermined amount of processing liquid is discharged from the nozzle 124 shown in Figure 2 onto the substrate W based on the processing conditions recorded in the storage device 404.

[0054] The third control unit 400 controls the rotary drive unit 122. By controlling the rotary drive unit 122, the third control unit 400 rotates the nozzle arm 123 based on the processing conditions recorded in the storage device 404.

[0055] (5) Configuration of the control unit of the processing liquid supply unit 200 Figure 6 is a block diagram showing an example of the functional configuration of the second control unit 208. As shown in Figure 6, the second control unit 208 controls the first regulator 202b, the first on / off valve 202c, the first flow meter 202d, the second regulator 203b, the second on / off valve 203c, the second flow meter 203d, the pump 205b, the heater 205c, the thermometer 205d, the concentration meter 205f, the third regulator 205g, the third on / off valve 205h, the fourth on / off valve 205i, the fifth on / off valve 206b, the fourth regulator 206c, and the second storage unit 207.

[0056] The second control unit 208 reads an electrical signal emitted from the concentration meter 205f when adjusting the concentration of the processing liquid. The second control unit 208 controls the first regulator 202b based on the processing conditions stored in the memory device 404 and the electrical signal read from the concentration meter 205f. Specifically, the second control unit 208 compares the concentration of the processing liquid in the circulation piping 205a with a predetermined concentration of the processing liquid stored in the memory device 404, and feedback controls the opening degree of the first regulator 202b based on an electrical signal indicating the flow rate of pure water emitted from the first flow meter 202d so that the flow rate of pure water is the amount required for the processing liquid of the predetermined concentration.

[0057] When adjusting the concentration of the processing liquid, the second control unit 208 reads the electrical signal emitted from the concentration meter 205f. Based on the processing conditions stored in the memory device 404 and the electrical signal read from the concentration meter 205f, the second control unit 208 controls the second regulator 203b. Specifically, the second control unit 208 compares the concentration of the processing liquid in the circulation piping 205a with a predetermined concentration of processing liquid stored in the memory device 404, and feedback controls the opening degree of the second regulator 203b based on the flow rate of the chemical solution measured by the second flow meter 203d so that the flow rate of the chemical solution required for the predetermined concentration of processing liquid. As a result, processing liquid adjusted to the predetermined concentration is created and stored in the tank 204.

[0058] The second control unit 208 reads an electrical signal related to the pressure of the processing liquid from the second storage unit 207 and controls the pump 205b. For example, the second control unit 208 reads third information and controls the pump 205b. The third information is set by the second control unit 208 communicating with the third control unit 400 to read the "input pressure," which is the pressure immediately before the processing liquid is supplied to the substrate processing unit 100, and the "input flow rate," which is the flow rate immediately before the processing liquid is supplied to the substrate processing unit 100, from the storage device 404. The second control unit 208 controls the heater 205c based on the processing conditions stored in the storage device 404 and the temperature of the processing liquid measured by the thermometer 205d. Specifically, it compares the temperature of the processing liquid in the circulation piping 205a measured by the thermometer 205d with a predetermined temperature of the processing liquid read from the storage device 404, and uses the thermometer 205d to feedback control the heater 205c so that the temperature reaches the predetermined temperature. As a result, the processing solution, adjusted to a predetermined temperature, is supplied to the substrate processing unit 100.

[0059] The second control unit 208 controls the third regulator 205g, the third on / off valve 205h, and the fourth on / off valve 205i. When supplying processing liquid to the substrate processing unit 100, the second control unit 208 controls the third on / off valve 205h to be in the "closed state" and the fourth on / off valve 205i to be in the "open state". When circulating the processing liquid in the circulation unit 205 and the tank 204, the second control unit 208 controls the third on / off valve 205h to be in the "open operation" and the fourth on / off valve 205i to be in the "close operation". The second control unit 208 also reads electrical signals related to the flow rate of the processing liquid from the second storage unit 207 and controls the opening degree of the third regulator 205g. For example, the second control unit 208 reads third information and controls the opening degree of the third regulator 205g.

[0060] The second control unit 208 controls the fifth on / off valve 206b and the fourth regulator 206c. When discharging the processed liquid from the tank 204, it controls the fifth on / off valve to be in the "open" position. It also controls the opening degree of the fourth regulator 206c to adjust the flow rate of the processed liquid discharged from the tank 204.

[0061] (6) Configuration of the control unit of the pressure loss adjustment unit 300 Figure 7 is a block diagram showing an example of the functional configuration of the pressure loss adjustment unit 300 of the first control unit 304. The first control unit 304 controls the first pressure gauge 301, the fifth regulator 302, the second pressure gauge 303, the first storage unit 305, and the calculation unit 306. The first control unit 304 reads out electrical signals emitted from the first pressure gauge 301 and the second pressure gauge 303. The first control unit 304 controls the calculation unit 306. The calculation unit 306 calculates second information, which is the pressure loss between the first pressure gauge 301 and the second pressure gauge 303, from the electrical signals related to pressure obtained from the first pressure gauge 301 and the second pressure gauge 303. The first control unit 304 controls the first storage unit 305 and reads out an electrical signal corresponding to the predetermined first information related to pressure loss. The first control unit 304 compares the first information with the second information and feedback-controls the opening degree of the fifth regulator 302 so that the second information becomes the same value as the first information.

[0062] As described above, since the substrate processing apparatus 1 includes a pressure loss adjustment unit 300, it is possible to easily reproduce the pressure loss corresponding to the different conditions of the liquid supply piping in each factory.

[0063] (7) Operation of the pressure loss adjustment unit 300 and the substrate processing device 1 Figure 8 is a flowchart illustrating the operation of the pressure loss adjustment unit 300 and the substrate processing apparatus 1. When adjusting the processing liquid supply unit 200, the substrate processing unit 100 and the processing liquid supply unit 200 are arranged in a second relative positional relationship (for example, on the same floor), and the pressure loss adjustment unit 300 is inserted into the liquid supply piping 50 connecting the substrate processing unit 100 and the processing liquid supply unit 200. Here, we assume a first relative positional relationship in which the substrate processing unit 100 is installed on the first floor and the processing liquid supply unit 200 is installed on the third basement floor (pipe length is 10m), and we will explain using the case where the processing liquid supply unit 200 is adjusted during the manufacturing stage of the substrate processing apparatus 1 as an example. As shown in Figure 3, when the length of the piping connecting the substrate processing unit 100 and the processing liquid supply unit 200 is 10m, a pressure loss of 100kPa is achieved.

[0064] In step S1, the first control unit 304 of the pressure loss adjustment unit 300 reads first information from the first storage unit 305. This allows the first control unit 304 to obtain predetermined information regarding pressure loss. In other words, the first control unit 304 sets the first information. More specifically, 100 kPa is set as the first information in the first control unit 304. As a concrete example of operation, a worker inputs installation information, such as the length of the piping in the first relative positional relationship, into the input / output interface 405. The input / output interface 405 outputs this installation information to the first control unit 304, and the first control unit 304 sets the first information based on this installation information and the correspondence information in Figure 3. Since the installation information is predetermined, it can be said that the first information is also predetermined.

[0065] In step S2, the second control unit 208 starts supplying processing liquid to the substrate processing unit 100. At this time, the processing liquid is supplied to the substrate processing unit via the liquid supply piping 50.

[0066] In step S3, the first control unit 304 controls the calculation unit 306 to calculate the second information. More specifically, the second information is calculated by calculating the difference in pressure of the processed liquid at each position in the liquid supply piping 50 obtained from the first pressure gauge 301 and the second pressure gauge 303. For example, if 210 kPa is measured at the first pressure gauge 301 and 250 kPa at the second pressure gauge 303, the difference of 40 kPa, which is the difference between 210 kPa at the first pressure gauge 301 and 250 kPa at the second pressure gauge 303, is calculated as the second information.

[0067] In step S4, the first control unit 304 controls the fifth regulator 302 to add a pressure loss to the processing fluid in the liquid supply piping 50. The first control unit 304 refers to the first information and adds the same pressure loss to the processing fluid as indicated by the first information. The first control unit 304 adds the pressure loss calculated from the difference between the first information and the second information by adjusting the opening of the fifth regulator 302. According to this embodiment, the first control unit 304 adjusts the opening of the fifth regulator 302 so that 100 kPa, set as the first information, is added to the processing fluid. More specifically, the first control unit 304 adjusts the opening of the fifth regulator 302 so that an additional 60 kPa, which is the difference between 100 kPa from the first information and 40 kPa from the second information, is added to the processing fluid.

[0068] In step S5, the first control unit 304 issues a command to the second control unit 208. The second control unit 208 controls the second storage unit 207 and reads out the third information stored in the second storage unit 207. In other words, the second control unit 208 sets the third information. For example, the third information may be set to a value of 300 kPa for pressure and a value of 2 L / min for flow rate.

[0069] In step S6, the second control unit 208 controls the pump 205b and the third regulator 205g of the processing liquid supply unit 200. More specifically, the second control unit 208 adjusts the pressure and flow rate of the processing liquid to approximate the values ​​specified in the third information. For example, the second control unit 208 controls the pump 205b and the third regulator 205g so that when the processing liquid is input to the substrate processing unit 100, the pressure is 300 kPa and the flow rate is 2 L / min. If the pressure and flow rate of the processing liquid cannot be adjusted to match the values ​​specified in the third information, an error message may be displayed using an error message display unit or the like.

[0070] As described above, in this embodiment, first information regarding the pressure loss when the substrate processing apparatus 1 is positioned in a first relative positional relationship is set (step S1), second information regarding the pressure loss when the substrate processing apparatus 1 is positioned in a second relative positional relationship is measured (calculated) (step S3), and the pressure loss adjustment unit 300 applies a pressure loss to the processing liquid based on the first and second information so that the pressure loss in the second relative positional relationship matches the first information (step S4). As a result, the same pressure loss as in the first relative positional relationship can be achieved in the substrate processing apparatus 1 positioned in the second relative positional relationship. In other words, an environment equivalent to that of the substrate processing apparatus 1 positioned in the first relative positional relationship can be realized in the second relative positional relationship. For this reason, performance tests of the substrate processing apparatus 1 positioned in the first relative positional relationship can be performed using the substrate processing apparatus 1 positioned in the second relative positional relationship.

[0071] In the above-described embodiment, the example given was one in which the substrate processing apparatus 1 is adjusted to operate with predetermined performance during the manufacturing stage before being delivered to the substrate processing plant. However, the present invention is not limited to the above-described embodiment. For example, the present invention may be applied when the arrangement of the substrate processing unit 100 and the processing liquid supply unit 200 is changed after the substrate processing apparatus 1 has been delivered to the plant. In that case, before changing the arrangement of the substrate processing unit 100 and the processing liquid supply unit 200, the length of the liquid supply piping 50 between the substrate processing unit 100 and the processing liquid supply unit 200 after the change is estimated, and the pressure loss corresponding to the estimate is calculated. By adding the calculated pressure loss using the pressure loss adjustment unit 300, it becomes possible to check whether the processing liquid supply unit 200 can operate with predetermined performance before changing the arrangement of the substrate processing unit 100 and the processing liquid supply unit 200. The pressure loss adjustment unit 300 may be removed after the adjustment of the processing liquid supply unit 200 has been completed.

[0072] Furthermore, in the example above, the first piece of information regarding pressure loss is the pressure loss itself, and the second piece of information regarding pressure loss is the pressure loss itself, but this is not necessarily the case. For example, the first and second pieces of information may be head.

[0073] (8) Correspondence between each component of the claim and each part of the embodiment The liquid supply piping 50 is an example of the "liquid supply piping" described in the claims of the present invention, the first pressure gauge 301 is an example of the "first pressure gauge" described in the claims of the present invention, the second pressure gauge 303 is an example of the "second pressure gauge" described in the claims of the present invention, the fifth regulator 302 is an example of the "pressure loss adjustment unit" described in the claims of the present invention, the first storage unit 305 is an example of the "first storage unit" described in the claims of the present invention, the calculation unit 306 is an example of the "calculation unit" described in the claims of the present invention, the first control unit 304 is an example of the "first control unit" described in the claims of the present invention, the second storage unit 207 is an example of the "second storage unit" described in the claims of the present invention, the second control unit 208 is an example of the "second control unit" described in the claims of the present invention, and the pump 205b and the third regulator 205g are examples of the "processing liquid adjustment unit" described in the claims of the present invention. [Explanation of Symbols]

[0074] 50…Liquid supply piping, 100…Substrate processing unit, 200…Processing liquid supply unit, 205c…Pump, 205h…Third regulator, 207…Second memory unit, 208…Second control unit, 301…First pressure gauge, 302…Fifth regulator, 303…Second pressure gauge, 304…First control unit, 305…First memory unit, 306…Calculation unit

Claims

1. A method for adjusting a processing liquid supply unit, which supplies processing liquid to a substrate processing unit through a liquid supply pipe, among substrate processing apparatuses that process substrates, A step of setting predetermined first information regarding pressure loss, A step of calculating second information which is information relating to the pressure loss of the processing liquid in the liquid supply piping between the substrate processing unit and the processing liquid supply unit, A step of applying a pressure loss to the processing liquid in the liquid supply piping so that the second information becomes equal to the first information, The steps include setting third information that defines the flow rate and pressure of the processing liquid supplied to the substrate processing unit, A method for adjusting a processing liquid supply unit, comprising the step of adjusting the flow rate and pressure of the processing liquid supplied to the substrate processing unit to be the same as the third information, while the pressure loss is applied to the processing liquid.

2. A method for adjusting the processing liquid supply unit according to claim 1, The first information is a method for adjusting the processing liquid supply unit, which is determined according to the length of the liquid supply piping between the substrate processing unit and the processing liquid supply unit.

3. A method for adjusting the processing liquid supply unit according to claim 1 or claim 2, A method for adjusting a processing liquid supply unit, wherein the step of calculating the second information is to calculate the pressure loss based on the pressure of the processing liquid measured in the vicinity of the substrate processing unit and in the vicinity of the processing liquid supply unit within the liquid supply piping.

4. In a liquid supply piping that connects a liquid supply unit that supplies processing liquid to a substrate processing unit that processes substrates, a pressure loss adjustment unit that imparts pressure loss to the processing liquid flowing through the liquid supply piping, A first pressure gauge is located near the processing liquid supply unit within the aforementioned liquid supply piping and measures the first pressure, which is the pressure of the processing liquid that has been delivered. A second pressure gauge is located in the vicinity of the substrate processing unit within the liquid supply piping and measures the second pressure, which is the pressure of the processing liquid that is supplied from the processing liquid supply unit and taken into the substrate processing unit. A pressure loss adjustment unit is provided between the first pressure gauge and the second pressure gauge, which provides the pressure loss to the processing liquid, A first storage unit that stores first information, which is information relating to a predetermined pressure loss, A calculation unit calculates second information, which is the pressure difference between the vicinity of the processing liquid supply unit and the vicinity of the substrate processing unit, based on the difference between the first pressure and the second pressure. A first control unit is provided, The first control unit reads the first information from the first storage unit, compares the second information with the first information, and controls the pressure loss adjustment unit so that the second information becomes equal to the first information; this is a pressure loss adjustment unit.

5. A pressure loss adjustment unit according to claim 4, The first information is a pressure loss adjustment unit, which is determined according to the length of the liquid supply piping between the substrate processing unit and the processing liquid supply unit.

6. A pressure loss adjustment unit according to claim 4 or 5, The substrate processing unit processes the substrate using a processing solution, A processing liquid supply unit that supplies the processing liquid to the substrate processing unit, A substrate processing apparatus comprising the substrate processing unit and a liquid supply piping connecting the processing liquid supply unit.

7. A substrate processing apparatus according to claim 6, The aforementioned processing liquid supply unit is A processing liquid adjustment unit that adjusts the pressure and flow rate of the processing liquid supplied to the processing liquid, A second storage unit stores third information relating to the pressure and flow rate of the processing liquid supplied to the substrate processing unit, A second control unit is provided, A substrate processing apparatus comprising: a second control unit, which reads the third information from the second storage unit, and controls the processing liquid adjustment unit so that the pressure and flow rate of the processing liquid supplied to the substrate processing unit become values ​​determined by the third information, while the pressure loss adjustment unit imparts a pressure loss to the processing liquid.

Images