Liquid immersion cooling module, multi-layer liquid immersion cooling system and method thereof

Abstract

The present invention provides an immersion cooling module, a multi-layer immersion cooling system, and a method thereof, which are convenient for assembly and expansion, allow for independent maintenance of one module without affecting the cooling effect of other modules when cooling equipment with multiple modules, facilitate maintenance and expansion of the cooling space, and improve the circulation efficiency of the coolant. [Solution] The multilayer immersion cooling system of the present invention includes a plurality of immersion cooling modules. Each immersion cooling module includes a main tank and an overflow plate. The main tank has a tank bottom and a partition, and the main tank is divided into a liquid storage tank and a temporary storage tank by the partition. A liquid inlet is provided above the liquid storage tank, and the cooling liquid and the module to be cooled are housed inside the liquid storage tank, and a liquid outlet is provided below the temporary storage tank. The overflow plate is provided inside the main tank, and the height of the overflow plate is lower than the partition. When the cooling liquid exceeds the height of the overflow plate, the cooling liquid overflows from the liquid storage tank and flows into the temporary storage tank, and is discharged from the liquid outlet, thereby achieving a cooling circulation.

Description

Technical Field

[0001] The present invention relates to a cooling system and method for cooling electronic devices, and particularly to a liquid immersion cooling module, a multi-layer liquid immersion cooling system, and a method thereof.

Background Art

[0002] A conventional immersion cooling system is a heat dissipation method in which an electronic device (a cooling target module) is directly immersed in a coolant. Usually, a large cooling tank filled with a coolant at a low temperature is installed. When heat is generated due to the operation of the electronic device, the heat is transferred to the surrounding coolant. Through the convection and agitation of the coolant, the temperature of the coolant becomes uniform, the temperature of the electronic device is lowered, and a cooling effect can be obtained. It is widely used particularly in data centers and high-performance computer devices. Since the immersion cooling system is in direct contact with the heat source, efficient heat dissipation is possible, and since it does not require a conventional large cooling fin or fan system, the entire structure becomes compact. However, it is not easy to maintain a large electronic device in a conventional immersion cooling system. When repair is required, the entire device has to be lifted by a crane, taken out of the cooling tank together with the rack, and waited for the cooling water to drain, and then the internal components and modules have to be replaced or repaired.

[0003] Therefore, in order to solve the problems arising in the above prior art, the present invention proposes a liquid immersion cooling system, a liquid immersion cooling method, and a multi-layer liquid immersion cooling system.

Summary of the Invention

Problems to be Solved by the Invention

[0004] In consideration of the above-mentioned problems, the present invention aims to provide an immersion cooling module, a multi-layer immersion cooling system, and a method thereof that can be used for cooling target modules, including electronic devices, devices, or modules of the same or different types. The present invention is convenient for assembly and expansion, allows for the independent maintenance of one module when cooling equipment of multiple modules without affecting the cooling effect of other modules, is convenient for maintenance and expansion of the cooling space, and can improve the circulation efficiency of the coolant. [Means for solving the problem]

[0005] To achieve the above objectives, the present invention provides an immersion cooling module. The immersion cooling module includes a main tank and an overflow plate. The main tank comprises a tank bottom, a partition, a first side wall and a second side wall, the first and second side walls being connected to the tank bottom, the bottom of the partition being connected to the tank bottom, and the partition being connected to the first side wall. The main tank is divided into a liquid storage tank and a temporary storage tank by the partition, a liquid inlet is provided above the liquid storage tank, the cooling liquid and the module to be cooled are housed inside the liquid storage tank, and a liquid outlet is provided below the temporary storage tank. The overflow plate is provided inside the main tank, the bottom of the overflow plate is connected to the tank bottom, one side of the overflow plate is connected to the partition, and the other side is connected to the second side wall, and the height of the overflow plate is lower than the height of the partition. Coolant is injected into the storage tank through the liquid inlet. When the coolant level rises above the height of the overflow plate, the coolant overflows from the storage tank along the upper edge of the overflow plate and flows into the temporary storage tank, and is finally discharged along the liquid outlet.

[0006] In one embodiment of the present invention, the immersion cooling module further includes a liquid injection tube, the bottom of which is connected to the liquid inlet, thereby transporting the cooling liquid into the storage tank.

[0007] In one embodiment of the present invention, the immersion cooling module further includes a top cover, which is positioned above the main tank and covers a portion of the liquid storage tank or temporary storage tank, and the top cover is provided with a liquid injection pipe.

[0008] In one embodiment of the present invention, the partition includes a bottom plate, a first side plate, and a second side plate. The bottom plate extends horizontally with respect to the bottom of the tank and is connected to the first side wall and the first side plate. The first side plate extends vertically with respect to the bottom of the tank, one side of the first side plate is connected to the first side wall, and the bottom of the first side plate is connected to the bottom plate. The second side plate is adjacent to the first side plate and extends vertically with respect to the bottom of the tank, one side of the second side plate is connected to the first side plate, and the bottom of the second side plate is connected to the bottom of the tank. The liquid storage tank has a first liquid storage area and a second liquid storage area, the first and second liquid storage areas are connected, the first liquid storage area communicates with the liquid inlet, the first liquid storage area is located above the temporary storage tank and is separated from the first liquid storage area by a partition, the second liquid storage area is close to the overflow plate and the bottom of the second liquid storage area is the bottom of the tank.

[0009] Based on the above objectives, the present invention provides a multi-layer immersion cooling system. The multi-layer immersion cooling system includes a plurality of the aforementioned immersion cooling modules, where each main tank is stacked with its opening facing the same direction, and each storage tank accommodates at least one module to be cooled. Between two vertically adjacent immersion cooling modules, the liquid outlet of the upper immersion cooling module corresponds to the liquid inlet of the lower immersion cooling module, and the cooling liquid is allowed to flow from the upper immersion cooling module to the lower immersion cooling module, thereby ensuring continuous circulation of the cooling liquid.

[0010] In one embodiment of the present invention, the multi-layer immersion cooling system further includes a liquid storage tank and liquid channels. The liquid storage tank is located below a plurality of immersion cooling modules, and the liquid outlets of the lower immersion cooling modules face the liquid storage tank in order to allow the coolant to flow in. The liquid channels are located on the outside of each immersion cooling module, with one end of the liquid channels connected to the liquid storage tank and the other end connected to the liquid inlet of the upper immersion cooling modules.

[0011] In one embodiment of the present invention, the multilayer immersion cooling system further includes a drive unit, which is located outside each immersion cooling module, connected to a liquid flow path, and drives the coolant to achieve circulating flow of the coolant.

[0012] Based on the above-mentioned objectives, the present invention further provides an immersion cooling method. The immersion cooling method includes the steps of providing the multi-layer immersion cooling system described above, installing a plurality of modules to be cooled in a liquid storage tank, and ensuring continuous flow of cooling liquid between two vertically adjacent immersion cooling modules by allowing cooling liquid injected from the liquid inlet of the upper immersion cooling module to flow down from the upper immersion cooling module to the lower immersion cooling module.

[0013] In one embodiment of the present invention, in the upper immersion cooling module, the coolant flows into the storage tank from the liquid inlet, overflows along the overflow plate, and flows down to the liquid outlet of the temporary storage tank. After the coolant flows out from the liquid outlet of the upper immersion cooling module, it flows into the liquid inlet of the lower immersion cooling module, then into the storage tank, overflows along the overflow plate, and flows down to the liquid outlet of the temporary storage tank. This ensures that the modules to be cooled in each layer are immersed in the coolant and that circulating flow of the coolant is achieved. [Effects of the Invention]

[0014] As described above, the immersion cooling module, multilayer immersion cooling system, and method of the present invention are applicable to electronic devices of various sizes, simplifying maintenance procedures when maintaining a single module of an electronic device, thereby reducing maintenance costs, improving the efficiency of maintenance work, and simultaneously improving cooling efficiency. Furthermore, when it is necessary to expand the entire system, the present invention allows for the rapid and simple assembly and expansion of the multilayer immersion cooling system structure, and can be effectively applied to the cooling of electronic devices of various forms and arrangements. [Brief explanation of the drawing]

[0015] [Figure 1] This figure shows one embodiment of the immersion cooling module of the present invention. [Figure 2] This figure shows another embodiment of the immersion cooling module of the present invention. [Figure 3]This figure shows a first embodiment of the multilayer immersion cooling system of the present invention. [Figure 4a] This is a side view showing the flow of the coolant in the first embodiment of a multi-layer immersion cooling system. [Figure 4b] This is a top view showing the flow of the coolant in a first embodiment of a multi-layer immersion cooling system. [Figure 5] This figure shows a second embodiment of the multilayer immersion cooling system of the present invention. [Figure 6] This figure shows a third embodiment of the multilayer immersion cooling system of the present invention. [Figure 7a] This figure shows an example of an application of a multi-layer immersion cooling system. [Figure 7b] This figure shows an example of an application of a multi-layer immersion cooling system. [Figure 8] This is flowchart 1 of the liquid immersion cooling method of the present invention. [Figure 9] This is flowchart 2 of the liquid immersion cooling method of the present invention. [Modes for carrying out the invention]

[0016] Embodiments of the present invention are described below with reference to relevant drawings. In the drawings and specification, the same reference numerals indicate the same or similar components whenever possible. In the drawings, shapes and thicknesses may be shown in enlarged form for simplicity and convenience. Components not shown in the drawings or not described in the specification can be interpreted as being in a form known to those skilled in the art. Those skilled in the art can make various changes and modifications based on the content of the present invention.

[0017] Referring to FIG. 1, the immersion cooling module 1A of the present invention is used to cool the cooling target module 200A. The so-called "cooling target module" can include the same or different types of electronic devices, apparatuses or modules, and for example, there are high power consumption devices such as lithium ion batteries and servers. The immersion cooling module 1A includes a main tank body 10 and an overflow plate 20. The main tank body 10 includes a tank bottom 12, a partition portion 14, a first side wall 16 and a second side wall 18. The first side wall 16 and the second side wall 18 are connected to the tank bottom 12, the bottom of the partition portion 14 is connected to the tank bottom 12, the partition portion 14 is connected to the first side wall 16, and the main tank body 10 is partitioned into a liquid storage tank 10A and a temporary storage tank 10B by the partition portion 14. A liquid injection port 102 is provided above the liquid storage tank 10A, the coolant and the cooling target module 200A are accommodated inside the liquid storage tank 10A, and a liquid discharge port 104 is provided below the temporary storage tank 10B. The overflow plate 20 is provided inside the main tank body 10, the bottom of the overflow plate 20 is connected to the tank bottom 12, one side of the overflow plate 20 is connected to the partition portion 14, the other side is connected to the second side wall 18, and the height of the overflow plate 20 is lower than the height of the partition portion 14. When the coolant is injected into the liquid storage tank 10A from the liquid injection port 102 and the height of the liquid level of the coolant is higher than the height of the overflow plate 20, the coolant overflows from the liquid storage tank 10A along the upper end of the overflow plate 20 and flows into the temporary storage tank 10B, and finally is discharged along the liquid discharge port 104.

[0018] Note that it should be noted that the heights of the main tank body 10 and the overflow plate 20 are both higher than the height of the cooling target module 200A. Therefore, when the coolant in the liquid storage tank 10A is continuously injected into the liquid storage tank 10A, the cooling target module 200A can be completely immersed in the coolant to absorb the heat released by the cooling target module 200A. When the liquid level of the coolant becomes higher than the height of the overflow plate 20, the coolant overflows from the overflow plate 20 and flows downstream to the temporary storage tank 10B. At this time, since the liquid discharge port 104 is provided below the temporary storage tank 10B, the coolant is discharged downward from the liquid discharge port 104, and the coolant can be circulated inside the liquid immersion cooling module 1A, obtaining a better heat dissipation and cooling effect. The liquid immersion cooling module 1A can be used for cooling various electronic devices, apparatuses or modules suitable for liquid immersion cooling. Hereinafter, the point that the liquid immersion cooling module can be added according to the number of cooling target modules and other features that can cope with immediately expanding the entire cooling structure will be described.

[0019] Referring to FIG. 2, the differences between this embodiment and the first embodiment are in the liquid injection pipe 30, the upper cover 40, the partition portion 14, and the liquid storage tank 10A. For clarity of the drawing, the cooling target module 200A and the liquid discharge port 104 are not depicted in FIG. 2, but those with ordinary knowledge can better understand the features of this embodiment from the schematic diagram of FIG. 1.

[0020] The bottom of the liquid injection pipe 30 is connected to a liquid inlet 102 for transporting the coolant 100 into the storage tank. The top cover 40 is positioned above the main tank body 10 and is used to cover a portion of the storage tank 10A or the temporary storage tank 10B. The liquid injection pipe 30 is provided on the top cover 40, and the top cover 40 does not need to completely seal the main tank body 10, but it also prevents the coolant 100 from leaking out. This allows the top cover 40 to firmly install the liquid injection pipe 30, making it easy to adjust the height of the liquid injection pipe 30 when multiple immersion cooling modules 1B are installed and stacked, and also making it convenient to connect to other components. If the immersion cooling module 1B is not sealed, the structure of the overflow plate 20 and the liquid outlet 104 of the temporary storage tank 10B allows the coolant 100 to be effectively guided and discharged, preventing the coolant 100 from overflowing outside the storage tank 10A. As shown in Figure 2, the direction of the arrows indicates the direction of flow of the coolant 100 as it overflows and flows down along the overflow plate 20, and the wave pattern represents the coolant 100. When the liquid level of the coolant 100 rises above the height of the overflow plate 20, the coolant 100 overflows from the overflow plate 20 and flows into the temporary storage tank 10B, and is discharged downward from the liquid outlet 104, thereby allowing the coolant inside the immersion cooling module 1B to circulate smoothly.

[0021] The partition section 14 includes a bottom plate 140, a first side plate 141, and a second side plate 142. The bottom plate 140 extends horizontally with respect to the tank bottom 12 and is connected to the first side wall 16 and the first side plate 141. The first side plate 141 extends vertically with respect to the tank bottom 12, one side of the first side plate 141 is connected to the first side wall 16, and the bottom of the first side plate 141 is connected to the bottom plate 140. The second side plate 142 is adjacent to the first side plate 141 and extends vertically with respect to the tank bottom 12, one side of the second side plate 142 is connected to the first side plate 141, and the bottom of the second side plate 142 is connected to the tank bottom 12.

[0022] The liquid storage tank 10A can be divided into two regions, a first liquid storage region 10A' and a second liquid storage region 10A'', and the first liquid storage region 10A' and the second liquid storage region 10A'' are connected. The first liquid storage region 10A' communicates with the liquid inlet 102, and the first liquid storage region 10A' is located above the temporary storage tank 10B. The bottom plate 140 of the partition 14 separates the first liquid storage region 10A' from the temporary storage tank 10B, and when coolant is injected, it flows into the first liquid storage region before the temporary storage tank 10B. The second liquid storage region 10A'' is close to the overflow plate 20, and the bottom of the second liquid storage region 10A'' becomes the tank bottom 12. Normally, the second fluid reservoir 10A'' is used to position the module 200A to be cooled, and the first fluid reservoir 10A' is used to receive the injected coolant, but if necessary, the first fluid reservoir 10A' can be modified to be used to position the module 200A to be cooled.

[0023] Referring to Figure 3, the multi-layer immersion cooling system 1 includes a plurality of immersion cooling modules, which may be immersion cooling modules 1A or 1B of the embodiments described above. For ease of understanding, in Figure 3, the immersion cooling modules are illustrated by reference numerals 1A and 1A', where 1A represents the upper layer immersion cooling module and 1A' represents the lower layer immersion cooling module, and immersion cooling modules 1A and 1A' are actually identical in structure. The openings of the main tank bodies 10 of immersion cooling modules 1A and 1A' are stacked facing the same direction Z, and each storage tank 10A houses a cooling module (indicated as 200A and 200B in the figure). Between the two vertically adjacent immersion cooling modules 1A and 1A', the liquid outlet 104 of the upper immersion cooling module 1A is connected to the liquid inlet 102 of the lower immersion cooling module 1A', allowing the cooling liquid to flow from the upper immersion cooling module 1A to the lower immersion cooling module 1A', thus ensuring continuous circulation of the cooling liquid.

[0024] In Figure 3, the liquid inlet 102 and liquid outlet 104 are shown with different shapes and sizes to identify their locations. However, in actual implementation, to facilitate the flow of coolant, the liquid inlet 102 and liquid outlet 104 can be designed to be similar in size and dimensions, or their openings can be designed to fit together, as needed.

[0025] Please refer to Figures 4a and 4b for a further explanation of the circulation direction of the coolant. Figure 4a is a side view showing the flow of coolant in a multi-layer immersion cooling system, and Figure 4b is a top view showing the flow of coolant in the same embodiment. The direction of the arrows in the figures indicates the direction of coolant flow, and the gray area represents the coolant. As shown in Figures 4a and 4b, the coolant is injected from the liquid inlet 102 of the upper immersion cooling module 1A and flows down from the upper immersion cooling module 1A to the lower immersion cooling module 1A', thus ensuring continuous coolant flow. The coolant flows from the liquid inlet 102 into the storage tank 10A, and when the coolant level rises above the height of the overflow plate 20, the coolant overflows from the storage tank 10A along the upper end of the overflow plate 20 and flows into the temporary storage tank 10B, and is finally discharged along the liquid outlet 104.

[0026] Both sides of the overflow plate 20 are connected to the partition 14 and the second side wall 18, and since the height of the overflow plate 20 is lower than the height of the partition 14 and the second side wall 18, even if the coolant overflows from the storage tank 10A to the temporary storage tank 10B, it will not spill out to the outside of the storage tank 10A, and the surrounding environment of the multi-layer immersion cooling system 1 can be kept orderly.

[0027] Referring to Figure 5, the multi-layer immersion cooling system 1' further includes a liquid injection pipe 30, a top cover (e.g., top cover 40 in Figure 2), a liquid storage tank 50, and a liquid flow path 60. The liquid injection pipe 30 is located between two vertically adjacent immersion cooling modules 1A and 1A', with its upper end connected to the liquid outlet 104 of the upper immersion cooling module 1A, and its lower end connected to the liquid inlet 102, used to transport the coolant into the storage tank 10A. Referring to Figures 2 and 5 together, a plurality of top covers 40 are positioned above each main tank body 10, and the top covers 40 are used to cover at least a portion of the storage tank 10A or the temporary storage tank 10B, with the liquid injection pipe 30 provided on each top cover 40.

[0028] As shown in Figure 5, the liquid storage tank 50 is located below the immersion cooling module 1A', and the liquid outlet 104 of the lower immersion cooling module 1A' faces the liquid storage tank 50 in order to allow the coolant to flow in. The liquid flow path 60 is located outside the immersion cooling modules 1A and 1A', with one end of the liquid flow path 60 connected to the liquid storage tank 50 and the other end connected to the liquid inlet 102 of the upper immersion cooling module 1A. The liquid flow path 60 is used to guide the coolant from bottom to top after it has flowed out of the liquid storage tank 50 and into the upper immersion cooling module 1A. Therefore, in this embodiment, the coolant in the immersion cooling modules 1A and 1A' can be reliably continuously circulated without a drive device (i.e., a pump), and each immersion cooling module can hold the same amount of coolant without continuous injection of coolant from the outside.

[0029] Referring to Figure 6, the difference between the multilayer immersion cooling system 1” of this embodiment and the multilayer immersion cooling system of Figure 5 lies in the drive unit 70. The multilayer immersion cooling system 1” of this embodiment includes a drive unit 70 located outside the immersion cooling modules 1A and 1A', which is connected to the liquid flow path 60 and used to achieve circulating flow of the coolant by driving the coolant.

[0030] In the above-described embodiment of the multilayer immersion cooling system, the coolant's temperature is reduced by natural heat dissipation during its circulating flow. When the high-temperature coolant comes into contact with relatively low-temperature surfaces within the immersion cooling module, thermal energy is transferred from the coolant to these surfaces, resulting in a reduction in the coolant's temperature. During the coolant's flow, convection and radiation between the coolant and the surrounding gas (e.g., air) also dissipate heat, increasing the heat exchange process.

[0031] Depending on the application, a multi-layer immersion cooling system may include cooling devices other than those described above, which may be located at the bottom or side of the liquid tank and may include, but are not limited to, coolers, heat exchangers / heat exchange plates, chillers, etc.

[0032] The following is a description of the diagrams illustrating an application example of the multilayer immersion cooling system 1". Please refer to Figures 7a and 7b. As shown in Figure 7a, a cooler 80 is attached to the bottom or outside of the multilayer immersion cooling system 1. The cooler 80 outputs cold air 800, which is directed towards the liquid storage tank 50. The temperature of the cooling liquid in the liquid storage tank 50 can be adjusted using an existing air cooling method. The cooled cooling liquid flows along the liquid flow path 60 into each immersion cooling module (immersion cooling modules 1A and 1A' in the diagram), and then changes the temperature inside each immersion cooling module 1A and 1A' one by one. As a result, the modules to be cooled within each layer of the immersion cooling modules can obtain a cooling effect.

[0033] As shown in Figure 7b, a heat exchange plate 90 is attached to the bottom or outside of the multi-layer immersion cooling system 1'', and both ends of the heat exchange plate 90 are connected to a chiller 94 via piping 92. When the coolant from the lower layer immersion cooling module 1A' flows into the liquid storage tank 50, the heat energy of the coolant in the liquid storage tank 50 is transferred to the chiller 94 via the heat exchange plate 90, and the chiller 94 can lower the temperature of the coolant in the liquid storage tank 50. In this way, the cooled coolant flows out of the liquid storage tank 50 and flows back into each immersion cooling module (immersion cooling modules 1A, 1A' in the figure) along the liquid flow path 60, thus achieving the effect of lowering the temperature of the modules to be cooled in each layer of the immersion cooling module.

[0034] When describing the structure of the multilayer liquid immersion cooling system of the present invention, the concept of the liquid immersion cooling method of the system was also explained. To make it clearer, the flowcharts in Figures 8 and 9 are used to provide further explanation below.

[0035] The liquid immersion cooling method, including steps S1 to S3, is described below. Please refer to Figure 8 first.

[0036] Step S1: A multi-layer immersion cooling system is provided. This multi-layer immersion cooling system includes multiple immersion cooling modules, and its structure is the same as that of the previously described immersion cooling module and multi-layer immersion cooling system, so it will not be described again here.

[0037] Step S2: Install multiple modules to be cooled in each liquid storage tank.

[0038] Step S3: Between two adjacent immersion cooling modules, coolant is injected from the liquid inlet of the upper immersion cooling module, and the coolant is allowed to flow down from the upper immersion cooling module to the lower immersion cooling module, thereby ensuring continuous flow of coolant.

[0039] Next, please refer to Figure 9. Step S3 of the immersion cooling method described above further includes steps S31 to S34.

[0040] Step S31: In the upper immersion cooling module, the cooling liquid flows into the storage tank from the liquid inlet, overflows along the overflow plate, and flows down to the liquid outlet of the temporary storage tank.

[0041] Step S32: After the coolant flows out from the liquid outlet of the upper immersion cooling module, it flows into the liquid inlet of the lower immersion cooling module, then into the storage tank, overflows along the overflow plate, and flows down to the liquid outlet of the temporary storage tank.

[0042] Step S33: The coolant flows into the liquid storage tank along the liquid outlet of the lower immersion cooling module, and when the coolant in the liquid storage tank reaches the liquid storage level, it flows along the liquid flow path to the liquid inlet of the upper immersion cooling module.

[0043] Step S34: The coolant is driven by the drive device to flow to the liquid inlet of the upper immersion cooling module, thereby achieving circulating flow of the coolant.

[0044] In steps S31 and S32, when the coolant level in each immersion cooling module exceeds the height of the overflow plate, the coolant overflows from the storage tank along the upper end of the overflow plate and flows into the temporary storage tank, and is finally discharged along the liquid outlet.

[0045] Although the above-described embodiment uses a two-layer immersion cooling module as an example, the invention is not limited thereto, and a person with ordinary skill in the art can easily modify the specification and drawings of the present invention to configure any multi-layer immersion cooling module.

[0046] Based on the above, the immersion cooling module, multilayer immersion cooling system, and method of the present invention have the following effects.

[0047] 1. The present invention can be widely applied to the cooling of the same or different types of electronic devices, equipment, or modules, is easy to assemble and expand, and allows users to freely increase the number of modules as needed without being limited to existing configurations.

[0048] 2. The present invention can improve maintenance efficiency and reduce costs. When a single module requires repair, the present invention simplifies the maintenance process, enabling reduced maintenance costs and improved work efficiency. Furthermore, when expanding the entire system, it is possible to expand the structure of the multi-layer immersion cooling system through quick and easy assembly.

[0049] 3. High cooling circulation efficiency: The design of the present invention can rapidly circulate the coolant while minimizing the power of the pump required for circulation, thereby further enhancing cooling performance.

[0050] 4. Convenient Maintenance and Expansion: Particularly suitable for multi-module cooling systems, maintenance and replacement of a single module can be performed without affecting the operation or cooling effect of other modules, making it convenient for maintenance and expansion of cooling space, and improving the circulation efficiency of the coolant.

[0051] The above description merely illustrates preferred embodiments of the present invention and does not limit the scope of the invention. Therefore, any simple substitutions and equivalent modifications made based on the claims and specification of the present invention are all included within the scope of the claims of the present invention. [Explanation of Symbols]

[0052] 1, 1', 1” Multilayer Immersion Cooling System 1A, 1B, 1A' Immersion Cooling Module 10 Main tank body 12 Tank bottom 14 Partition section 140 Bottom plate 141 1st side plate 142 Second side plate 16. First side wall 18. Second side wall 10A liquid storage tank 10A' 1st storage area 10A” 2nd storage area 10B Temporary Storage Tank 102 Liquid inlet 104 Liquid outlet 20 Overflow plate 100 Coolant 200A, 200B Cooling Modules 30 Liquid injection tube 40 Top lid 50 Stock tank 60 Liquid flow path 70 Drive unit 80 Cooler 800 cold air 90 Heat exchange plate 92 Piping 94 Chiller Steps S1-S3, S31-S34 Z direction

Claims

1. Including the main tank and overflow plate, The main tank body comprises a tank bottom, a partition, a first side wall and a second side wall, the first side wall and the second side wall are connected to the tank bottom, the bottom of the partition is connected to the tank bottom, the partition is connected to the first side wall, the main tank body is divided into a liquid storage tank and a temporary storage tank by the partition, a liquid inlet is provided above the liquid storage tank, the cooling liquid and the module to be cooled are housed inside the liquid storage tank, and a liquid outlet is provided below the temporary storage tank. The overflow plate is provided inside the main tank body, the bottom of the overflow plate is connected to the bottom of the tank, one side of the overflow plate is connected to the partition, the other side is connected to the second side wall, and the height of the overflow plate is lower than the height of the partition. A liquid immersion cooling module in which a coolant is injected into the storage tank from the liquid inlet, and when the level of the coolant rises above the height of the overflow plate, the coolant overflows from the storage tank along the upper end of the overflow plate and flows into the temporary storage tank, and is finally discharged along the liquid outlet.

2. The immersion cooling module according to claim 1, further comprising a liquid injection tube, wherein the bottom of the liquid injection tube is connected to the liquid inlet to transport the cooling liquid into the liquid storage tank.

3. The liquid immersion cooling module according to claim 2, further comprising a top cover positioned above the main tank body, wherein the top cover covers a portion of the liquid storage tank or the temporary storage tank, and the top cover is provided with the liquid injection pipe.

4. The partition portion includes a bottom plate, a first side plate and a second side plate, the bottom plate extends horizontally with respect to the bottom of the tank and is connected to the first side wall and the first side plate, the first side plate extends vertically with respect to the bottom of the tank, one side of the first side plate is connected to the first side wall, the bottom of the first side plate is connected to the bottom plate, the second side plate is adjacent to the first side plate and extends vertically with respect to the bottom of the tank, one side of the second side plate is connected to the first side plate, and the bottom of the second side plate is connected to the bottom of the tank, as described in claim 1.

5. The liquid storage tank has a first liquid storage area and a second liquid storage area, the first liquid storage area and the second liquid storage area are connected, the first liquid storage area communicates with the liquid inlet, the first liquid storage area is located above the temporary storage tank, the first liquid storage area and the temporary storage tank are separated by the partition, the second liquid storage area is close to the overflow plate, and the bottom of the second liquid storage area is the bottom of the tank, as described in claim 1.

6. The invention comprises a plurality of immersion cooling modules as described in claim 1, wherein each of the main tanks is stacked with its opening facing the same direction, and each of the liquid storage tanks houses one cooling target module. A multi-layer immersion cooling system in which, between two vertically adjacent immersion cooling modules, the liquid outlet of the upper immersion cooling module is connected to the liquid inlet of the lower immersion cooling module, and the cooling liquid is allowed to flow down from the upper immersion cooling module to the lower immersion cooling module, thereby allowing the cooling liquid to circulate continuously.

7. The multilayer immersion cooling system according to claim 6, further comprising a liquid injection pipe provided between two vertically adjacent immersion cooling modules, wherein the upper end of the liquid injection pipe is connected to the liquid outlet of the upper immersion cooling module, and the lower end of the liquid injection pipe is connected to the liquid inlet, for transporting the cooling liquid into a storage tank.

8. The multilayer immersion cooling system according to claim 7, further comprising a plurality of top covers disposed above each of the main tank bodies, wherein the plurality of top covers cover a portion of the liquid storage tank or the temporary storage tank, and each of the top covers is provided with the liquid injection pipe.

9. The multilayer immersion cooling system according to claim 6, wherein each partition includes a bottom plate, a first side plate, and a second side plate, the bottom plate extends horizontally with respect to the bottom of the tank and is connected to the first side wall and the first side plate, the first side plate extends vertically with respect to the bottom of the tank, one side of the first side plate is connected to the first side wall, the bottom of the first side plate is connected to the bottom plate, the second side plate is adjacent to the first side plate and extends vertically with respect to the bottom of the tank, one side of the second side plate is connected to the first side plate, and the bottom of the second side plate is connected to the bottom of the tank.

10. The multilayer immersion cooling system according to claim 6, wherein each of the liquid storage tanks has a first liquid storage area and a second liquid storage area, the first liquid storage area and the second liquid storage area are connected, the first liquid storage area communicates with the liquid inlet, the first liquid storage area is located above the temporary storage tank, the first liquid storage area and the temporary storage tank are separated by the partition, the second liquid storage area is close to the overflow plate, and the bottom of the second liquid storage area is the bottom of the tank.

11. The system further includes a liquid storage tank and a liquid channel, The liquid storage tank is located below a plurality of the immersion cooling modules, and the liquid outlets of the lower immersion cooling modules face the liquid storage tank in order to allow the cooling liquid to flow in. The multilayer immersion cooling system according to claim 6, wherein the liquid flow path is located outside each of the immersion cooling modules, one end of the liquid flow path is connected to the liquid storage tank, and the other end is connected to the liquid inlet of the upper immersion cooling module.

12. The multilayer immersion cooling system according to claim 11, further comprising a drive device provided on the outside of each of the immersion cooling modules, the drive device being connected to the liquid flow path and driving the cooling liquid to achieve circulating flow of the cooling liquid.

13. A step of providing a multilayer immersion cooling system according to any one of claims 6 to 12, The steps include: installing multiple modules to be cooled in each of the liquid storage tanks of the multi-layer immersion cooling system; Between two vertically adjacent liquid immersion cooling modules, coolant is injected from the liquid inlet of the upper liquid immersion cooling module, and the coolant flows down from the upper liquid immersion cooling module to the lower liquid immersion cooling module, thereby ensuring continuous flow of the coolant. A liquid immersion cooling method, including the above.

14. In the upper layer of the immersion cooling module, the cooling liquid flows from the liquid inlet into the storage tank, overflows along the overflow plate, and flows down to the liquid outlet of the temporary storage tank. The cooling liquid flows out from the liquid outlet of the upper immersion cooling module, then flows into the liquid inlet of the lower immersion cooling module, then into the storage tank, overflows along the overflow plate, and flows down to the liquid outlet of the temporary storage tank, thereby immersing the modules to be cooled in each layer in the cooling liquid and achieving circulating flow of the cooling liquid. The immersion cooling method according to claim 13, further comprising:

15. The immersion cooling method according to claim 13, further comprising the step in which, in each of the immersion cooling modules, when the height of the coolant level exceeds the height of the overflow plate, the coolant overflows from the storage tank along the upper end of the overflow plate and flows into the temporary storage tank, and is finally discharged along the liquid outlet.

16. The immersion cooling method according to claim 13, further comprising the step that the coolant flows into a liquid storage tank along the liquid outlet of the lower immersion cooling module, and when the coolant in the liquid storage tank reaches the liquid storage level, it flows along the liquid flow path to the liquid inlet of the upper immersion cooling module.

17. The liquid immersion cooling method according to claim 16, further comprising the step of driving the coolant with a drive device to flow it to the liquid inlet of the upper liquid immersion cooling module, thereby achieving circulating flow of the coolant.

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