Indication device

Abstract

This disclosure relates to a display device. [Solution] The display device according to the present disclosure comprises a display panel including grooves and a circuit board connected to the display panel, wherein the display panel may include a substrate including a first substrate and a second substrate separated from each other by the grooves, a circuit layer disposed on the first substrate and including transistors, a planarization layer disposed on the grooves, a pad portion disposed on the second substrate and connected to the circuit board, a bending wire disposed on the planarization layer, and a connecting wire connected to the bending wire.

Description

Technical Field

[0001] The present invention relates to a display panel and a display device including the same. More specifically, for example, the present invention relates to a display panel including a substrate to which an etching process is applied for optimization of a manufacturing process, and a display device including the same.

Background Art

[0002] A flexible display can vary the screen size by folding or rolling up a flexible panel. The flexible display can be implemented by a rollable display, a foldable display, a bendable display, a slidable display, etc. Such flexible displays are used not only in mobile devices such as smartphones and tablet PCs, but also in TVs, vehicle displays, wearable devices, etc., and their application fields are expanding.

[0003] A flexible display can utilize a flexible panel structure to embody a bezel bended display in which a non-display area is folded in and the bezel area is minimized.

[0004] The description provided in the related art explanation should not be regarded as prior art only for the reason that it is mentioned or related in the related art explanation. The related art explanation can include information explaining one or more aspects of the present invention and does not limit the present invention.

Summary of the Invention

Problems to be Solved by the Invention

[0005] The inventors of this invention have newly discovered that when the bending region of a flexible display bends, stress can concentrate in a portion of the connecting wiring located in that region. Consequently, cracks may occur in the connecting wiring. In this case, the connecting wiring can be made of various metal materials considering conductivity, but there are limitations to the selection of the material for the connecting wiring when considering the possibility of damage to the connecting wiring due to bending.

[0006] Furthermore, the inventors of this application have found that flexible displays can utilize an etching process to simplify the manufacturing process, and that a separate etching prevention layer can be placed for the substrate etching process. However, a separate masking process is required to place the etching prevention layer, and the increased man-hours due to the masking process can reduce the productivity of the display device.

[0007] Therefore, there is a need for a display panel and a display device equipped therewith that can prevent or minimize damage to connected wiring caused by bending, while improving productivity.

[0008] An embodiment of the present invention provides a display panel including a substrate and a display device equipped therewith, to which an etching process is applied for the optimization of the manufacturing process.

[0009] An embodiment of the present invention provides a display panel and a display device equipped therewith, which utilize a portion of the components arranged in the display area as an etching prevention layer to simplify the manufacturing process.

[0010] Embodiments of the present invention provide a display panel and a display device equipped therewith that prevent or reduce the possibility of damage to connected wiring due to bending, through bending wiring arranged in a bending area.

[0011] An embodiment of the present invention provides a display device including a narrow bezel by applying a structurally improved substrate to the pad portion and bending it.

[0012] The problems to be solved by the embodiments of the present invention are not limited to those mentioned above, and further problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0013] An embodiment of the present invention comprises a display panel including grooves and a circuit board connected to the display panel, wherein the display panel includes a substrate including a first substrate and a second substrate separated from each other by the grooves, a circuit layer including transistors disposed on the first substrate, and a planarization layer disposed on the grooves; a pad portion disposed on the second substrate and connected to the circuit board, bending wiring disposed on the planarization layer, and connecting wiring connected to the bending wiring. [Effects of the Invention]

[0014] According to the present invention, process optimization can be achieved through the etching process. For example, multiple grooves corresponding to the grooves of multiple display panels can be formed on a single motherboard through the etching process, thereby simplifying the manufacturing process.

[0015] According to the present invention, by utilizing a portion of the components arranged in the display area as an etching prevention layer, another etching prevention layer that would otherwise be placed in response to the etching process can be eliminated. Consequently, since another masking process for placing the etching prevention layer is not required, the productivity of the display device can be improved.

[0016] According to the present invention, since the glass substrate is processed through an etching process, the rigidity of the substrate can be maintained.

[0017] According to the present invention, when etching a substrate made of glass material, damage to the bending wiring placed in the bending region can be prevented by utilizing a planarization layer of organic material.

[0018] According to the present invention, the bending wiring can be protected through the pattern layer disposed on the bending wiring.

[0019] The effects of the present invention are not limited to the effects mentioned above, and additional effects not mentioned will be clearly understood by those having ordinary knowledge in the technical field to which the technical idea of the present invention belongs from the following description.

[0020] The effects according to the present invention are not limited to the contents exemplified above, and more various effects are included in the present invention.

Brief Description of the Drawings

[0021] [Figure 1] It is a perspective view showing a display device according to an embodiment of the present invention. [Figure 2] It is a plan view showing a display device according to an embodiment of the present invention. [Figure 3] It is a cross-sectional view showing line I-I' of FIG. 2. [Figure 4] It is an enlarged view showing region A of FIG. 3. [Figure 5a] It is a diagram showing the manufacturing process of a display panel according to an embodiment of the present invention. [Figure 5b] It is a diagram showing the manufacturing process of a display panel according to an embodiment of the present invention. [Figure 5c] It is a diagram showing the manufacturing process of a display panel according to an embodiment of the present invention. [Figure 5d] It is a diagram showing the manufacturing process of a display panel according to an embodiment of the present invention. [Figure 6] It is a diagram showing a neutral plane by bending. [Figure 7] It is a diagram showing a coating layer disposed on a display panel according to an embodiment of the present invention. [Figure 8] It is a diagram showing a bent state of a display device according to an embodiment of the present invention. [Figure 9] It is a cross-sectional view showing another embodiment of a display panel according to an embodiment of the present invention. [Figure 10]This is an enlarged view showing area B in Figure 9. [Figure 11] This figure shows a bent display device to which another embodiment of the display panel according to the embodiment of the present invention is applied. [Figure 12] This is a cross-sectional view showing another embodiment of the display panel according to the embodiment of the present invention. [Figure 13] This is an enlarged view showing region C in Figure 12.

[0022] Throughout the drawings and detailed descriptions, unless otherwise specified, reference numerals in the same drawing should be understood to refer to the same elements, features, and structures. The size, length, and thickness of layers, regions, and elements, as well as their depictions, may be exaggerated for clarity, explanation, and convenience. [Modes for carrying out the invention]

[0023] The advantages and features of the present invention, as well as methods for achieving them, will become clearer with reference to the embodiments described below in detail with the accompanying drawings. The present invention is not limited to the embodiments disclosed below, but can be embodied in a variety of different forms, and the embodiments are provided merely to complete the disclosure of the present invention and to fully inform those who are ordinary skill in the art to which the present invention pertains, and the present invention is defined only by the scope of the claims.

[0024] The shapes, sizes, proportions, angles, numbers, etc., disclosed in the drawings illustrating embodiments of the present invention are illustrative only, and the present invention is not limited to what is shown in the drawings. Throughout the specification, the same reference numerals refer to substantially the same components. Furthermore, in describing the present invention, if it is determined that a specific description of related known technology would unnecessarily obscure the gist of the present invention, such detailed description will be omitted.

[0025] When words such as "to have / possess," "to include / encompass," "to have / possess," and "to consist of" are used as referred to herein, other parts may be added unless "only / only" is used. When a component is expressed in the singular, it may be interpreted as plural unless otherwise explicitly stated.

[0026] When interpreting the constituent elements, they shall be interpreted as including a margin of error, even if not explicitly stated otherwise.

[0027] When a positional relationship and interconnectedness between two components is described, such as "on top of," "above," "below," "beside," "connect or couple," or "crossing or intersecting," one or more other components may be interposed between those components unless there is a reference such as "immediately" or "directly."

[0028] When temporal relationships are described using phrases like "after," "following," "next," or "before," unless "immediately" or "directly" is used, the events may not be continuous on the timeline.

[0029] To distinguish between components, prefixes such as "1st," "2nd," "A," "B," "(a)," and "(b)" may be used before the component names, but these ordinal numbers and component names do not restrict their function or structure. These terms are simply used to distinguish one component from another. Therefore, the 1st component described below may be the 2nd component within the technical concept of the present invention.

[0030] The term "at least one" should be understood to include all combinations of one or more of the related listed items. For example, "at least one of item 1, item 2, and item 3" means not only all combinations of items proposed with two or more of item 1, item 2, and item 3, but also combinations of item 1, item 2, and item 3.

[0031] As used herein, the term "device" may refer to a display device comprising a display panel and a driver for driving the display panel. Examples of display devices include light-emitting diodes (LEDs), etc. Examples of such devices include laptop computers, televisions, personal computer monitors, automotive equipment, wearable devices, automotive equipment, and finished products or final products such as sets of electronic devices (or devices) or sets of devices including LEDs, such as mobile electronic devices like smartphones and electronic pads, but the embodiments of the present invention are not limited thereto.

[0032] The dimensions and thicknesses of the components shown in the drawings are provided for illustrative purposes only, and the present invention is not limited to the dimensions and thicknesses of the components shown.

[0033] The following embodiments can be partially or entirely combined or linked with one another, allowing for a variety of technically interconnected and driven configurations. Each embodiment can be implemented independently of the others, or they can be implemented together in a related manner.

[0034] Unless otherwise specified, all terms used herein (including technical and scientific terms) have the same meaning as those generally understood by a person of ordinary skill in the art to which the present invention pertains. Terms that are commonly used, such as dictionary definitions, should be interpreted as having the meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an ideal or overly formal sense unless expressly stated herein.

[0035] Various embodiments of the present invention will be described in detail below with reference to the attached drawings.

[0036] The display devices according to embodiments of the present invention can include display devices in the narrow sense, application products including displays in the narrow sense, or set devices that are end consumer devices.

[0037] The display devices according to the embodiments of the present invention can be realized by liquid crystal display devices (LCDs), plasma display panel devices (PDPs), field emission display devices (FEDs), electroluminescence display devices (ELDs), organic light emitting diodes (OLEDs), quantum dot displays, micro light emitting diode (Micro LED) displays, and the like.

[0038] Figure 1 is a perspective view showing a display device according to an embodiment of the present invention. Figure 2 is a plan view showing a display panel according to an embodiment of the present invention. Figure 3 is a cross-sectional view showing the line I-I' in Figure 2. Figure 4 is an enlarged view showing area A in Figure 3. Figures 5a to 5d show the manufacturing process of a display panel according to an embodiment of the present invention. For example, Figure 5a shows a mother board MS on which a circuit layer 200, a liquid crystal layer 300, a pad portion PAD, bending wiring BL, and connecting wiring LL are arranged. Figure 5b shows the lower part etching of the mother board MS using a mask. Figure 5c shows a groove G formed on the mother board by the lower part etching. Figure 5d shows a plurality of display panels 10 separated by the cutting process.

[0039] Referring to Figures 1 to 3, the display device according to an embodiment of the present invention may comprise a display panel 10 including grooves G, a circuit board 20 connected to a pad portion PAD of the display panel 10, and a light source unit 30 that irradiates light toward the liquid crystal layer 300 of the display panel 10. The input image can then be visually reproduced on the display panel 10. Here, the light source unit 30 may be a backlight unit.

[0040] The display panel 10 may include a display area DA on which an image is displayed and a non-display area NA on which no image is displayed.

[0041] The non-display area NA may refer to the area outside the display area DA. Multiple types of signal lines may be located in the non-display area NA, and multiple types of drive circuits may be connected to it. At least a portion of the non-display area NA may be foldable so as not to be visible from the front of the display device, or it may be covered by the display device's case or housing (not shown). The non-display area NA is sometimes called the edge area or bezel area.

[0042] The display panel 10 may be a rectangular panel having a width in the X-axis direction, a length in the Y-axis direction, and a thickness in the Z-axis direction. In this case, the width and length of the display panel 10 may be set to various design values ​​depending on the application field of the display device. The X-axis direction may mean the width direction, row direction, or horizontal direction, the Y-axis direction may mean the length direction, column direction, or vertical direction, and the Z-axis direction may mean the up-down direction, vertical direction, or thickness direction. Furthermore, the X-axis direction, Y-axis direction, and Z-axis direction may be perpendicular to each other, but may also mean different directions that are not perpendicular to each other. Accordingly, each of the X-axis direction, Y-axis direction, and Z-axis direction may be described as one of the first, second, or third directions. And the planes extending in the X-axis direction and Y-axis direction may mean horizontal planes.

[0043] The non-display area NA may include a first non-display area NA1, a bending area BA, and a second non-display area NA2. The bending area BA may be located between the first non-display area NA1 and the second non-display area NA2.

[0044] The first non-display area NA1 may be an area that surrounds at least a portion of the display area DA.

[0045] The bending region BA is an area adjacent to at least one of the multiple sides of the first non-display region NA1, and may be a bendable region. The display panel 10 can be easily bent through the bending region BA. For example, the display panel 10 can be easily bent through a groove G located in the bending region BA.

[0046] The second non-display area NA2 is an area adjacent to at least one of the multiple sides of the bending area BA, and a pad portion PAD may be placed in the second non-display area NA2. For example, the bending area BA may be in a flat state and be bent state, and the remaining area of ​​the substrate 100 excluding the bending area BA may be in a flat state. Due to the bending of the bending area BA, the second non-display area NA2 may be positioned overlapping the back surface of the display area DA. Here, the pad portion PAD may be a pad electrode.

[0047] Referring to Figures 3 and 6, the bending region BA is located between the first non-visible region NA1 and the second non-visible region NA2, and various structures such as organic layers, inorganic layers, and wiring placed in the bending region BA can be bent. For example, when the bending region BA is bent, parts of various structures such as organic layers, inorganic layers, and wiring can also be bent together.

[0048] The circuit board 20 may be a flexible printed circuit board and may be connected to the display panel 10 via a pad, but is not limited to this.

[0049] The liquid crystal layer of the display area DA can be driven by signals supplied from one or more circuit boards 20 through the wiring of the display area DA and the connecting wiring LL of the non-display area NA. For example, the wiring of the display area DA, together with multiple connecting wirings LL, may be wiring for transmitting signals output from the circuit board 20 to the liquid crystal layer of the display area DA.

[0050] When only multiple connecting wires LL are placed in a bending region BA, bending of the bending region BA may also cause a portion of the multiple connecting wires LL to bend along with it. This can lead to stress concentration in the bent portion of the connecting wires LL, potentially causing cracks to form in the wiring.

[0051] This allows for consideration of the possibility of damage to the connecting wiring LL due to cracks, etc., when multiple connecting wirings LL are arranged in a bending region BA. For example, the shape and material of the connecting wirings LL can be configured to prevent cracks from occurring in the multiple connecting wirings LL when the bending region BA is bent. For example, to prevent cracks that may occur in the multiple connecting wirings LL when the bending region BA is bent, the connecting wirings LL can be made of a conductive material with excellent flexibility. In addition, multiple connecting wirings LL can be configured in various shapes to accommodate cracks, etc. For example, at least a portion of the multiple connecting wirings LL arranged on the bending region BA may have a shape in which conductive patterns having at least one shape from diamond, rhombus, trapezoidal wave, triangular wave, sawtooth wave, sinusoidal wave, circular, and omega (Ω) shapes are repeatedly arranged.

[0052] The display device according to an embodiment of the present invention can stably connect multiple connecting wires LL and the wiring of the display area DA by utilizing the bending wires BL arranged in the bending area BA.

[0053] Multiple connecting wires LL may extend from multiple pad portions PAD in the second non-display area NA2 toward the bending area BA. The multiple connecting wires LL may, but are not limited to, be electrically connected to the wiring of the display area DA via multiple bending wires BL. For example, considering safety regarding the connection between the multiple connecting wires LL and the wiring of the display area DA, the multiple connecting wires LL may be electrically connected to the wiring of the display area DA, and the bending wires BL may be arranged to overlap with a portion of the connecting wires LL. More specifically, the multiple connecting wires LL may be arranged on the bending wires BL and electrically connected to the wiring of the display area DA, while also being electrically connected to the bending wires BL in at least three areas. For example, the connecting wires LL may be in contact with the bending wires BL in the first non-display area NA1, the bending area BA, and the second non-display area NA2. For example, the connecting wires LL may be arranged overlapping with the bending wires BL in the first non-display area NA1, the bending area BA, and the second non-display area NA2. As a result, even if the connecting wiring LL is damaged by bending of the display panel 10, the signals applied through the connecting wiring LL can be transmitted to the wiring of the display area DA through the bending wiring BL.

[0054] Therefore, by utilizing the double-layered connecting wiring LL and bending wiring BL on the bending region BA, the possibility of defects in the display panel 10 due to bending can be reduced. Here, the connecting wiring LL may be a link line, and the bending wiring BL may be a bending line.

[0055] The light source unit 30 is positioned below the first substrate 110 and can irradiate light toward the upper part of the first substrate 110 (for example, in the Z-axis direction). Here, the light source unit 30 may be a backlight unit.

[0056] The display panel 10 may be manufactured using a flexible plastic material such as polyimide or a thin, flexible glass substrate as its base. For example, considering the etching process, the substrate 100 of the display panel 10 may be formed from a transparent glass material. For example, the display panel 10 may be manufactured using a flexible polymer film as its base. For example, the flexible polymer film may consist of, but is not limited to, any one of polyethylene terephthalate (PET), polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), polyethersulfone (PES), cycloolefin copolymer (COC), triacetyl cellulose (TAC) film, polyvinyl alcohol (PVA) film, polyimide (PI) film, and polystyrene (PS).

[0057] Referring to Figures 1 to 4, the display panel 10 according to an embodiment of the present invention may include a substrate 100 including a first substrate 110 and a second substrate 120 separated from each other by a groove G and arranged adjacent to each other, a circuit layer 200 arranged on the substrate 100, a liquid crystal layer 300 arranged on the circuit layer 200, a pad portion PAD arranged on the second substrate 120 for connection with the circuit board 20, a bending wiring BL arranged on a planarization layer 240 extending from the circuit layer 200 to the top of the groove G, and a connecting wiring LL connecting the pad portion PAD and the bending wiring BL. Here, the circuit layer 200 may include a thin-film transistor 210, a gate insulating layer 220, a first interlayer insulating layer 230, a planarization layer 240, a first electrode 250, a second interlayer insulating layer 260, and a second electrode 270. The thin-film transistor 210 may include a gate electrode 211, an active layer 212, a source electrode 213, and a drain electrode 214. In this case, the planarization layer 240 may be extended through the bending region BA to a portion of the second non-display region NA2 so as to be positioned above the groove G. This allows the planarization layer 240 to act as an etching prevention layer when etching the substrate 100 to form the groove G. The first substrate 110 may be the first region of the substrate 100, and the second substrate 120 may be the second region of the substrate 100. The first and second regions of the substrate 100 may be spaced apart from each other, separated by the groove G, and may be positioned adjacent to each other.

[0058] Furthermore, the display panel 10 according to the embodiment of the present invention may further include a pattern layer 400 arranged on the bending wiring BL.

[0059] Furthermore, the display panel 10 according to an embodiment of the present invention may further include a color filter layer 500 and a black matrix 600 disposed on the liquid crystal layer 300, a sealant 310 surrounding the liquid crystal layer 300, and at least one column 320 disposed between the color filter layer 500 and the circuit layer 200. For example, the color filter layer 500 and the black matrix 600 may be arranged adjacent to each other on the liquid crystal layer 300, but are not limited thereto.

[0060] Furthermore, the display panel 10 according to an embodiment of the present invention may further include a color filter layer 500 and a cover member 700 disposed on the black matrix 600. For example, the cover member 700 may cover and overlap the color filter layer 500 and the black matrix 600. Thus, the cover member 700 can protect the color filter layer 500 and the black matrix 600.

[0061] Furthermore, the display panel 10 according to an embodiment of the present invention may further include a lower polarizing layer DPOL disposed at the bottom of the first substrate 110 and an upper polarizing layer UPOL disposed at the top of the cover member 700. In this case, the lower polarizing layer DPOL and the upper polarizing layer UPOL may be superimposed on the color filter layer 500, but are not limited to this. For example, the lower polarizing layer DPOL and the upper polarizing layer UPOL may be configured to correspond to the color filter layer 500.

[0062] The substrate 100 may be made of glass, metal, or plastic, but is not limited to these materials. However, for the etching process to simplify the process, a glass substrate with a predetermined strength may be used for the substrate 100.

[0063] The manufacturing process of the display panel according to an embodiment of the present invention will be examined below with reference to Figures 5a to 5d.

[0064] Referring to Figures 5a and 5b, in order to form multiple display panels 10, the components of the display panel 10, such as the circuit layer 200, liquid crystal layer 300, pad portion PAD, bending wiring BL, and connecting wiring LL, can be arranged on a single motherboard MS. Here, the motherboard MS may be made of glass. In this case, using a single motherboard MS, multiple semi-finished panels UP that are separated through a cutting process can be formed. Here, the semi-finished panels UP can represent the state before the display panel 10 is separated, and the semi-finished panels UP can be realized in a form in which the components of the display panel 10 are arranged on the motherboard MS. Then, through an etching process, multiple grooves G can be formed on the lower surface side of the motherboard MS to correspond to the grooves G of the display panel 10. By doing so, process optimization can be realized by forming multiple grooves G on the lower surface side of the motherboard MS through a single etching process. In this case, since the substrate 100 made of glass is processed through the etching process, a decrease in the rigidity of the glass substrate can be suppressed. As a result, the rigidity of the glass substrate can be maintained.

[0065] Referring to Figure 5a, a circuit layer 200, a liquid crystal layer 300, a pad section PAD, bending wiring BL, and connecting wiring LL can be arranged on the upper surface of a single motherboard MS. This allows multiple semi-finished panels UP to be formed using a single motherboard MS.

[0066] Referring to Figures 5b and 5c, multiple grooves G can be formed on the motherboard MS by etching a portion of the underside of the motherboard MS using a patterned mask and an etching solution. The grooves G may, but are not limited to, a tapered shape. Since multiple grooves G are formed on the motherboard MS through a single etching process, the manufacturing process of the display panel 10 can be simplified. Here, nitric acid (H3PO4) or hydrofluoric acid (HF) may be used as the etching solution.

[0067] For example, by using a patterned mask and an etching solution to etch a portion of the lower surface of the motherboard MS, multiple grooves G can be formed on the lower surface side of the motherboard MS so as to correspond to the grooves G of the display panel 10, but this is not limited to this.

[0068] The gate insulating layer 220 and the first interlayer insulating layer 230 of the circuit layer 200 placed on the motherboard MS can be etched by the etching solution. As a result, a portion of the lower surface of the planarization layer 240 may be exposed by the groove G. For example, a portion of the gate insulating layer 220 and a portion of the first interlayer insulating layer 230 of the circuit layer 200 placed on the motherboard MS may be etched by the etching solution, and a portion of the lower surface of the planarization layer 240 may be exposed by the etched gate insulating layer 220 and the first interlayer insulating layer 230. Here, since the planarization layer 240 may be formed of an organic insulating material that has strong corrosion resistance to the etching solution, the planarization layer 240 functions as an etching stop, stopping the etching process when the etching solution reaches the planarization layer 240.

[0069] The etching process can form grooves G up to the planarization layer 240, and the grooves G can remove the gate insulating layer 220 and the first interlayer insulating layer 230 of the circuit layer 200, which are placed on the motherboard MS, together with the motherboard MS. For example, the gate insulating layer 220 and the first interlayer insulating layer 230 of the circuit layer 200 may be placed in the first non-display area NA1 and the second non-display area NA. Here, the grooves G may be placed to correspond to the bending area BA of the display panel 10. Since the gate insulating layer 220 and the first interlayer insulating layer 230 are not placed on the grooves G, crack-like damage does not occur in the gate insulating layer 220 and the first interlayer insulating layer 230 due to stress caused by bending. For example, even if the gate insulating layer 220 and the first interlayer insulating layer 230 are formed of an inorganic insulating material that is vulnerable to bending, the gate insulating layer 220 and the first interlayer insulating layer 230 are not located in the bending region BA, so they are not damaged by the stress caused by bending. Similarly, the second interlayer insulating layer 260, which is also formed of an inorganic insulating material, is not located in the bending region BA, so the second interlayer insulating layer 260 is not damaged by the stress caused by bending.

[0070] Referring to Figure 5d, the multiple display panels 10 can be separated by performing the cutting process along the cutting line CL.

[0071] Grooves G can be formed in the substrate 100 by the etching process, and the substrate 100 can be divided into a first substrate 110 and a second substrate 120 by the grooves G. For example, the grooves G can be placed between the first substrate 110 and the second substrate 120.

[0072] The first substrate 110 may include a display area DA and a first non-display area NA1, and may be formed of a transparent glass material.

[0073] Referring to Figure 10, the first substrate 110 may include a first upper surface 111 that contacts the circuit layer 200, a first lower surface 112 which is the opposite surface of the first upper surface 111, and a first side surface 113 that connects the first upper surface 111 and the first lower surface 112. The first substrate 110 may also include a first upper corner UE1 where the first upper surface 111 and the first side surface 113 meet, and a first lower corner DE1 where the first lower surface 112 and the first side surface 113 meet. Here, the first side surface 113 may be an inclined surface having a predetermined inclination with respect to the first lower surface 112. Since the first side surface 113 is formed by the etching process, a curved surface may be formed at the first lower corner DE1 where the first lower surface 112 and the first side surface 113 meet.

[0074] The second substrate 120 may be placed in the second non-display region NA2 and may be formed of a transparent glass material.

[0075] The second substrate 120 may include a second upper surface 121 that contacts the gate insulating layer 220, a second lower surface 122 which is the opposite surface of the second upper surface 121, and a second side surface 123 that connects the second upper surface 121 and the second lower surface 122. The second substrate 120 may also include a second upper corner UE2 where the second upper surface 121 and the second side surface 123 meet, and a second lower corner DE2 where the second lower surface 122 and the second side surface 123 meet. Here, the second side surface 123 may be an inclined surface having a predetermined inclination with respect to the second lower surface 122. Since the second side surface 123 is formed by the etching process, a curved surface may be formed at the second lower corner DE2 where the second lower surface 122 and the second side surface 123 meet.

[0076] The circuit layer 200 may be placed in the display area DA, and some components of the circuit layer 200 may be placed in the first non-display area NA1, the bending area BA, and the second non-display area NA2. For example, the circuit layer 200 may be placed on the first upper surface 111 of the first substrate 110, and some components of the circuit layer 200 may be extended to the second non-display area NA2 via the first non-display area NA1 and the bending area BA. For example, the gate insulating layer 220 and the first interlayer insulating layer 230 of the circuit layer 200 may be placed in the first non-display area NA1 and the second non-display area NA2. For example, the gate insulating layer 220 and the first interlayer insulating layer 230 of the circuit layer 200 may be removed from the bending area BA, but are not limited to this. The planarization layer 240 may be placed in some areas of the first non-display area NA1, the bending area BA, and the second non-display area NA2. Furthermore, the second interlayer insulating layer 260 may be placed in the first non-display region NA1 and the second non-display region NA2. For example, the second interlayer insulating layer 260 may be removed from the bending region BA, but is not limited to this.

[0077] Referring to Figure 7, the circuit layer 200 may include, but is not limited to, a thin-film transistor 210, a gate insulating layer 220 covering the gate electrode 211 of the thin-film transistor 210, a first interlayer insulating layer 230 covering the active layer 212, source electrode 213, and drain electrode 214 of the thin-film transistor 210, a planarizing layer 240 placed on the first interlayer insulating layer 230, a first electrode 250 placed on the planarizing layer 240, a second interlayer insulating layer 260 placed on the first electrode 250, and a second electrode 270 placed on the second interlayer insulating layer 260. The circuit layer 200 may include more or fewer layers.

[0078] The thin-film transistor 210 may include a gate electrode 211, an active layer 212, a source electrode 213, and a drain electrode 214.

[0079] The gate electrode 211 may be placed on the first upper surface 111 of the first substrate 110.

[0080] The gate electrode 211 may be formed of a conductive material. For example, the gate electrode 211 may be formed of a metallic material. For example, the gate electrode 211 may be a single layer or multiple layer made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0081] The first pad layer PAD2a of the second pad portion PAD2 may be placed on the second upper surface 121 of the second substrate 120.

[0082] The first pad layer PAD2a may be formed of a conductive material. For example, the first pad layer PAD2a may be formed of a metallic material. For example, the gate electrode 211 may be a single layer or multiple layer made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0083] Furthermore, the first pad layer PAD2a may be formed together with the gate electrode 211 by the same masking process used to form the gate electrode 211. For example, the first pad layer PAD2a on the second upper surface 121 of the second substrate 120 may be formed together with the gate electrode 211 on the first upper surface 111 of the first substrate 110 through the same masking process used to form the gate electrode 211.

[0084] The gate insulating layer 220 is placed on the substrate 100 and etched by the etching process, so it can be placed in the display area DA, the first non-display area NA1, and the second non-display area NA2. For example, the gate insulating layer 220 can be placed on the first substrate 110 so as to cover the gate electrode 211. Alternatively, the gate insulating layer 220 can be placed on the second substrate 120 so as to cover the first pad layer PAD2a of the second pad portion PAD2.

[0085] Since the gate insulating layer 220 can be formed from an inorganic insulating material, it can be etched by an etching process. This allows the gate insulating layer 220 to be separated into a gate insulating layer 220 placed on the first substrate 110 and a gate insulating layer 220 placed on the second substrate 120.

[0086] The gate insulating layer 220 may consist of an inorganic insulating material such as silicon oxide (SiOx) and silicon nitride (SiNx). The gate insulating layer 220 may be a single layer or multiple layers made of the inorganic insulating material, but is not limited to this.

[0087] The active layer 212 may be placed on a gate insulating layer 220 which is placed on the first substrate 110. For example, the active layer 212 may be placed so as to cover a portion of the gate insulating layer 220 which is placed on the first substrate 110. The active layer 212 may be superimposed on the first substrate 110. Furthermore, the active layer 212 may be superimposed on the gate electrode 211 in the Z-axis direction.

[0088] The active layer 212 may be formed from amorphous silicon (a-Si), polycrystalline silicon (poly-Si), oxide semiconductor, or organic semiconductor, but is not necessarily limited to these materials.

[0089] The first pad portion PAD1 may be placed on a gate insulating layer 220 which is placed on the second substrate 120. For example, the first pad portion PAD1 may be superimposed on the second substrate 120. The gate insulating layer 220 may be placed between the second substrate 120 and the first pad portion PAD1.

[0090] The first pad portion PAD1 may be formed of a conductive material. For example, the first pad portion PAD1 may be formed of a metallic material. For example, the first pad portion PAD1 may include metals such as aluminum (Al), chromium (Cr), copper (Cu), molybdenum (Mo), titanium (Ti), and tungsten (W).

[0091] The first pad portion PAD1 can be electrically connected to a chip (not shown) placed on the first pad portion PAD1. For example, the first pad portion PAD1 can be electrically connected to a chip (not shown) via a connecting wire LL placed on the first pad portion PAD1. Here, the first pad portion PAD1 is given as an example of being connected to a chip (not shown) via a connecting wire LL, but is not necessarily limited to this. For example, the first pad portion PAD1 can also be directly connected to a chip (not shown) without a connecting wire LL. Here, the chip may include a drive circuit. And the connecting wire LL placed on the first pad portion PAD1 may be a second connecting wire LL2.

[0092] For example, the source electrode 213 and drain electrode 214 of the thin-film transistor 210 may be arranged on the active layer 212.

[0093] Furthermore, the first pad portion PAD1 may be formed together with the source electrode 213 and the drain electrode 214 by the same masking process used to form the source electrode 213 and the drain electrode 214, but is not limited to this.

[0094] The second pad layer PAD2b of the second pad portion PAD2 may be placed on the gate insulating layer 220 which is placed on the second substrate 120. For example, a portion of the second pad layer PAD2b may be placed on the gate insulating layer 220. The second pad layer PAD2b may be electrically connected to the first pad layer PAD2a using contact holes formed in the gate insulating layer 220. Thus, the second pad layer PAD2b of the second pad portion PAD2 may be placed on the first pad layer PAD2a and electrically connected to the first pad layer PAD2a. For example, the second pad layer PAD2b of the second pad portion PAD2 may be placed on the gate insulating layer 220 and a portion of the first pad layer PAD2a exposed by contact holes formed in the gate insulating layer 220.

[0095] The second pad layer PAD2b may be formed from a conductive material. For example, the second pad layer PAD2b may be formed from a metallic material. For example, the second pad layer PAD2b may contain metals such as aluminum (Al), chromium (Cr), copper (Cu), molybdenum (Mo), titanium (Ti), and tungsten (W).

[0096] Furthermore, the second pad layer PAD2b may be formed together with the source electrode 213 and the drain electrode 214 by the same masking process used to form the source electrode 213 and the drain electrode 214, but is not limited to this.

[0097] Furthermore, the second pad layer PAD2b can be electrically connected to the circuit board 20. For example, the second pad layer PAD2b can be connected to the circuit board 20 via a connecting wiring LL placed on the second pad layer PAD2b. Here, the connecting wiring LL placed on the second pad layer PAD2b may be the second connecting wiring LL2.

[0098] The source electrode 213 may be located on the active layer 212. For example, the source electrode 213 may be located on a different layer from the gate electrode 211. The source electrode 213 may be insulated from the gate electrode 211 by the gate insulating layer 220.

[0099] The source electrode 213 may be electrically connected to the source region of the active layer 212, and the source electrode 213 may include a region that overlaps with the source region of the active layer 212. For example, the source electrode 213 may be in direct contact with the source region of the active layer 212.

[0100] The source electrode 213 may contain a conductive material. For example, the source electrode 213 may contain metals such as aluminum (Al), chromium (Cr), copper (Cu), molybdenum (Mo), titanium (Ti), and tungsten (W).

[0101] The drain electrode 214 may be located on the active layer 212. For example, the drain electrode 214 may be located on a different layer from the gate electrode 211. The drain electrode 214 may be insulated from the gate electrode 211 by the gate insulating layer 220. The drain electrode 214 may be located on the same layer as the source electrode 213. The drain electrode 214 may be positioned at a distance from the source electrode 213.

[0102] The drain electrode 214 may be electrically connected to the drain region of the active layer 212, and the drain electrode 214 may include a region that overlaps with the drain region of the active layer 212. For example, the drain electrode 214 may be in direct contact with the drain region of the active layer 212.

[0103] The drain electrode 214 may contain a conductive material. For example, the source electrode 213 may contain metals such as aluminum (Al), chromium (Cr), copper (Cu), molybdenum (Mo), titanium (Ti), and tungsten (W).

[0104] The first interlayer insulating layer 230, which is placed on the substrate 100, is etched by an etching process and can be placed in the display area DA, the first non-display area NA1, and the second non-display area NA2. For example, the first interlayer insulating layer 230 can be placed on the first substrate 110 so as to cover the gate electrode 211, etc. Alternatively, the first interlayer insulating layer 230 can be placed on the second substrate 120 so as to cover the second pad layer PAD2b of the first pad portion PAD1 and the second pad portion PAD2. For example, the first interlayer insulating layer 230 can be placed on the source electrode 213 and the drain electrode 214.

[0105] For example, the first interlayer insulating layer 230 may be placed on the first substrate 110 and cover the active layer 212, the source electrode 213, and the drain electrode 214. Alternatively, the first interlayer insulating layer 230 may be placed on the second substrate 120 and cover the second pad layer PAD2b of the first pad portion PAD1 and the second pad portion PAD2.

[0106] The first interlayer insulating layer 230 may be placed on the active layer 212, the source electrode 213, and the drain electrode 214. In this case, the first interlayer insulating layer 230 may cover the active layer 212, the source electrode 213, and the drain electrode 214 on the first substrate 110. As a result, the first interlayer insulating layer 230 can protect the active layer 212, the source electrode 213, and the drain electrode 214.

[0107] Furthermore, the first interlayer insulating layer 230 may be placed on the first pad portion PAD1 and the second pad layer PAD2b of the second pad portion PAD2. In this case, the first interlayer insulating layer 230 may cover a portion of the first pad portion PAD1 and the second pad layer PAD2b on the second substrate 120. Therefore, the first interlayer insulating layer 230 can protect a portion of the first pad portion PAD1 and the second pad layer PAD2b.

[0108] The first interlayer insulating layer 230 may consist of an inorganic insulating material such as silicon oxide (SiOx) and silicon nitride (SiNx). The first interlayer insulating layer 230 may be a single layer or multiple layers made of the inorganic insulating material, but is not limited to this.

[0109] The planarization layer 240 may be placed on the first interlayer insulating layer 230. In this case, the planarization layer 240 of the circuit layer 200 may be extended through the bending region BA to a portion of the second non-display region NA2 so as to be placed above the groove G. As a result, the planarization layer 240 may be superimposed on the second substrate 120 in the second non-display region NA2. For example, the planarization layer 240 may be superimposed on the first substrate 110 in the first non-display region NA1.

[0110] During etching of the substrate 100 to form grooves G, the planarization layer 240 is formed of an organic insulating material and acts as an etching prevention layer, thereby protecting the bending wiring BL placed on the planarization layer 240 from the etching solution.

[0111] The planarization layer 240 can be placed on the groove G. For example, the planarization layer 240 can extend through the first non-display region NA1 and the bending region BA to a portion of the second non-display region NA2, thereby covering the upper part of the groove G. As a result, the display device according to the embodiment of the present invention does not need to have another etching prevention layer covering the upper part of the groove G, thus improving process productivity.

[0112] The planarization layer 240 may be formed from a transparent organic insulating material. For example, the planarization layer 240 may be formed from one or more of the following substances: polyacrylates resin, epoxy resin, phenolic resin, polyamides resin, polyimides resin, unsaturated polyesters resin, polyphenylenethers resin, polyphenylenesulfides resin, and benzocyclobutene, but is not limited to these. Here, the planarization layer 240 may be a single layer or multiple layers made of organic insulating material.

[0113] Furthermore, since the planarization layer 240 is formed of an organic insulating material that is relatively more flexible than an inorganic insulating material, it can easily accommodate bending of the display panel 10. For example, the planarization layer 240 can be placed in the bending region BA, and since the planarization layer 240 is formed of a highly flexible organic insulating material, it can be easily bent without damage such as cracks.

[0114] The first electrode 250 may be placed on the planarization layer 240. Here, the first electrode 250 may be a common electrode.

[0115] The first electrode 250 may be formed from a transparent conductive material or an opaque conductive material. For example, the first electrode 250 may be ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide) or other conductive material.

[0116] A voltage can be applied to the first electrode 250 and the second electrode 270. This drives the liquid crystal layer 300, allowing an image to be displayed. Here, a voltage can be applied to the second electrode 270 through the drain electrode 214.

[0117] The bending wiring BL may be placed on the planarization layer 240. In this case, the bending wiring BL may be placed in the first non-display area NA1, the bending area BA, and the second non-display area NA2. For example, the bending wiring BL may be placed in part of the first non-display area NA1, the bending area BA, and the second non-display area NA2. For example, the bending wiring BL may be placed on the planarization layer 240 that is placed in the first non-display area NA1, the bending area BA, and the second non-display area NA2.

[0118] The bending wiring BL may be formed to have a predetermined first length L1 in the Y-axis direction. In this case, the bending wiring BL may overlap the groove G in the Z-axis direction, and the first length L1 of the bending wiring BL in the Y-axis direction may be greater than the width W1 of the groove G. Furthermore, the first length L1 of the bending wiring BL in the Y-axis direction may be greater than the width W2 of the pattern layer 400. Here, the width W1 of the groove G may be the first width, and the width W2 of the pattern layer 400 may be the second width.

[0119] Bending wiring BL can be formed from a conductive material. For example, bending wiring BL can be formed from a metallic material. For example, bending wiring BL may be a single layer or multiple layer made of any one of the following or an alloy thereof: ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). For example, bending wiring BL may be formed in a double-layer structure.

[0120] The bending wiring BL comprises at least two layers containing different materials. The bending wiring BL may include a first layer BL1 and a second layer BL2. The materials of the first layer BL1 and the second layer BL2 may be different. This allows the bending wiring BL to easily withstand stress caused by bending. For example, the bending wiring BL may be placed on a flattening layer 240.

[0121] The bending wiring BL may, but is not limited to, include at least one of the first layer BL1 and the second layer BL2 as the same metal layer as the first electrode 250.

[0122] Furthermore, the first layer BL1 and the second layer BL2 of the bending wiring BL may be made of a different material than the first electrode 250.

[0123] The first layer BL1 may be placed on the planarization layer 240. The first layer BL1 may be formed of transparent ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide). For example, the first layer BL1 may contain the same material as the first electrode 250 and may be formed together with the first electrode 250 through the same masking process used to form the first electrode 250, but is not limited to this.

[0124] The second layer BL2 may be placed on the first layer BL1. With respect to the Y-axis direction, the second layer BL2 may have the same length as the first layer BL1. For example, the first layer BL1 and the second layer BL2 may be formed to have a predetermined first length L1 in the Y-axis direction.

[0125] The second layer BL2 may be formed from a different material than the first layer BL1. For example, the second layer BL2 may consist of one of the following, or an alloy thereof: molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). For example, the second layer BL2 may contain copper (Cu).

[0126] Furthermore, the bending wiring BL may contain materials different from those of the connecting wiring LL. For example, the connecting wiring LL may be made of ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide), and the second layer BL2 of the bending wiring BL may be made of copper, so the bending wiring BL may contain materials different from those of the connecting wiring LL.

[0127] Therefore, the display device according to the embodiment of the present invention can easily withstand bending stress because it connects the first connecting wiring LL1 and the second connecting wiring LL2 via bending wiring BL. Furthermore, since bending wiring BL comprises at least two layers containing different materials, it can withstand bending stress even more effectively.

[0128] The second interlayer insulating layer 260 may be placed on the first electrode 250 and the bending wiring BL. For example, the second interlayer insulating layer 260 may be placed on the flattening layer 240 so as to cover the first electrode 250 and the bending wiring BL. In this case, the second interlayer insulating layer 260 may be placed in the display area DA, the first non-display area NA1, and the second non-display area NA2. For example, the second interlayer insulating layer 260 may be placed in the bending area BA. Then, with reference to the Z-axis direction, in the first non-display area NA1, the second interlayer insulating layer 260 may be placed between the bending wiring BL and the first connecting wiring LL1.

[0129] Furthermore, in the second non-display area NA2, the second interlayer insulating layer 260 may be placed between the bending wiring BL and the second connecting wiring LL2.

[0130] The second interlayer insulating layer 260 may consist of an inorganic insulating material such as silicon oxide (SiOx) and silicon nitride (SiNx). The second interlayer insulating layer 260 may be a single layer or multiple layers made of the inorganic insulating material, but is not limited to this.

[0131] The second electrode 270 may be placed on the second interlayer insulating layer 260. The second electrode 270 may be electrically connected to the drain electrode 214 through contact holes formed in the planarization layer 240 and the second interlayer insulating layer 260. Here, the second electrode 270 may be a pixel electrode. For example, the second electrode 270 may be placed on the second interlayer insulating layer 260 of the display area DA.

[0132] The second electrode 270 may be formed from a transparent conductive material or an opaque conductive material. For example, the second electrode 270 may be ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide) or other conductive material.

[0133] The connecting wiring LL may be arranged on the second interlayer insulating layer 260. For example, multiple connecting wirings LL may be arranged on the second interlayer insulating layer 260 to transmit signals applied from the circuit board 20 to the wiring of the display area DA. In this case, multiple connecting wirings LL may be connected to the first pad portion PAD1 and the second pad portion PAD2 through contact holes formed in the first interlayer insulating layer 230, the planarization layer 240 and the second interlayer insulating layer 260, or in the first and second interlayer insulating layers 230 and 260. For example, the connecting wiring LL may be arranged on the second interlayer insulating layer 260 of the first non-display area NA1 and the second non-display area NA2.

[0134] The connecting wiring LL may be formed from a transparent conductive material or an opaque conductive material. For example, the second electrode 270 may be ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide) or made from another conductive material.

[0135] The connecting wiring LL may be formed together with the second electrode 270 by the same masking process used to form the second electrode 270, but is not limited to this.

[0136] The connecting wiring LL may include a first connecting wiring LL1 and a second connecting wiring LL2, which are arranged to be spaced apart from each other. The first connecting wiring LL1 and the second connecting wiring LL2 may be electrically connected via a bending wiring BL. For example, a pattern layer 400 may be placed between the first connecting wiring LL1 and the second connecting wiring LL2 with respect to the Y-axis direction. For example, the pattern layer 400 may be placed on the bending wiring BL between the first connecting wiring LL1 and the second connecting wiring LL2. For example, the connecting wiring LL, which includes the first connecting wiring LL1 and the second connecting wiring LL2, may not be placed in the bending region BA. In this case, the bending wiring BL placed below the pattern layer 400 may be electrically connected to the first connecting wiring LL1 through a first contact hole CH1 and to the second connecting wiring LL2 through a second contact hole CH2. As a result, the first connecting wiring LL1 may contact one side of the bending wiring BL, and the second connecting wiring LL2 may contact the other side of the bending wiring BL. Here, the first contact hole CH1 may be located in the first non-display area NA1. The first contact hole CH1 may be formed to penetrate the second interlayer insulating layer 260 located between the bending wiring BL and the first connecting wiring LL1. The second contact hole CH2 may be located in the second non-display area NA2. The second contact hole CH2 may be formed to penetrate the second interlayer insulating layer 260 located between the bending wiring BL and the second connecting wiring LL2.

[0137] The first connecting wiring LL1 may be placed in the first non-display area NA1. For example, the first connecting wiring LL1 may be placed on the second interlayer insulating layer 260 of the first non-display area NA1. The first connecting wiring LL1 may then be electrically connected to the bending wiring BL in the first non-display area NA1 through the first contact hole CH1.

[0138] The second connecting wiring LL2 may be located in the second non-display area NA2. For example, the second connecting wiring LL2 may be located on the second interlayer insulating layer 260 of the second non-display area NA2. The second connecting wiring LL2 may then be electrically connected to the bending wiring BL in the second non-display area NA2 through the second contact hole CH2.

[0139] In such a case, the bending wiring BL placed beneath the pattern layer 400 can be electrically connected to the first connecting wiring LL1 of the first non-display area NA1 through the first contact hole CH1, and can be electrically connected to the second connecting wiring LL2 of the second non-display area NA2 through the second contact hole CH2.

[0140] The liquid crystal layer 300 may be arranged on the second interlayer insulating layer 260, the second electrode 270, and the first connecting wiring LL1, and may include an alignment film (not shown) for easily guiding the arrangement of liquid crystals. For example, the liquid crystal layer 300 may be arranged on the second interlayer insulating layer 260, the second electrode 270, and the first connecting wiring LL1 in the display area DA and the first non-display area NA1, but is not limited thereto.

[0141] The sealant 310 may surround the liquid crystal layer 300. For example, the sealant 310 may be arranged along the periphery of the liquid crystal layer 300.

[0142] Referring to Figure 3, the sealant 310 may be placed on the second interlayer insulating layer 260. For example, with respect to the Z-axis direction, the sealant 310 may be placed between the second interlayer insulating layer 260 and the black matrix 600. The sealant 310 may, but is not limited to, contact with the second interlayer insulating layer 260. For example, the sealant 310 may also be in contact with the connecting wiring LL placed on the second interlayer insulating layer 260. In this case, the sealant 310 may overlap with the bending wiring BL in the Z-axis direction.

[0143] The sealant 310 may be a photocurable or thermosetting epoxy resin. The sealant 310 can form a gap for liquid crystal injection between the second interlayer insulating layer 260 and the black matrix 600. The sealant 310 can then play a role in preventing leakage of the liquid crystal injected into the gap.

[0144] Referring to Figure 3, at least one column 320 may be positioned on the second interlayer insulating layer 260. For example, with respect to the Z-axis direction, the column 320 may be positioned between the second interlayer insulating layer 260 and the color filter layer 500. This allows the column 320 to maintain a gap for liquid crystal injection.

[0145] For example, the sealant 310 may be placed between the second interlayer insulating layer 260 and the black matrix 600 in the first non-display area NA1, with reference to the Z-axis direction. For example, the column 320 may be placed between the second interlayer insulating layer 260 and the color filter layer 500 in the display area DA.

[0146] Column 320 may include, but is not limited to, a first column section 321 and a second column section 322.

[0147] The first column portion 321 may be placed on the second interlayer insulating layer 260. The first column portion 321 may be in contact with the second interlayer insulating layer 260.

[0148] The first column portion 321 may be formed of an organic insulating material and may be formed together with the pattern layer 400 by the same masking process used to form the pattern layer 400, but is not limited to this.

[0149] The second column portion 322 may be positioned on the first column portion 321 and may overlap with the first column portion 321. The second column portion 322 may be positioned between the first column portion 321 and the color filter layer 500. The second column portion 322 may be in contact with the color filter layer 500.

[0150] The second column portion 322 may be formed of an organic insulating material.

[0151] The pattern layer 400 may be placed on the bending wiring BL. This allows the pattern layer 400 to protect the bending wiring BL from physical and / or chemical impacts. For example, the pattern layer 400 can prevent moisture, impurities, etc., from penetrating the bending wiring BL. For example, the pattern layer 400 may be aligned with the bending wiring BL in the bending region BA.

[0152] The pattern layer 400 may be placed in the bending region BA, and when the bending region BA is bent, the pattern layer 400 may also be bent together with it. Furthermore, the pattern layer 400 may overlap with the groove G.

[0153] The pattern layer 400 may be formed from an organic insulating material to withstand stress caused by bending. For example, the pattern layer 400 may be formed from an organic substance including polyester polymers, acrylic polymers, etc.

[0154] Referring to Figures 1 to 4, the pattern layer 400 may be provided as a structure having a predetermined width W2 and height H, and may be arranged along the X-axis. For example, the pattern layer 400 may be formed in the shape of a bar including a trapezoidal cross-section, but is not limited thereto.

[0155] The pattern layer 400 may be formed to have a predetermined width W2, and the width W2 of the pattern layer 400 may be the same as the width W1 of the groove G, but is not necessarily limited to this. For example, the width W2 of the pattern layer 400 may be greater than the width W1 of the groove G. Furthermore, the width W2 of the pattern layer 400 may be less than the first length L1 of the bending wiring BL.

[0156] The pattern layer 400 may be formed to have a predetermined height H. The height H of the pattern layer 400 can be adjusted. Thus, the display panel 10 according to an embodiment of the present invention can adjust the height H of the pattern layer 400 to minimize the stress applied to the bending wiring BL.

[0157] Figure 6 shows the neutral plane after bending.

[0158] Referring to Figure 6, the neutral plane can be defined as the plane where the stress state during bending is zero, and the magnitude of tensile or compressive stress is determined in proportion to the distance from the neutral plane. With respect to the Z direction, the neutral plane can be located midway between the plane on which tensile stress acts and the plane on which compressive stress acts. Here, the plane on which compressive stress acts can be defined as the plane located near the center of curvature, and the plane on which tensile stress acts can be defined as the plane opposite the plane on which compressive stress acts. For example, the plane on which tensile stress is applied can be defined as the plane far from the center of curvature.

[0159] In addition, configurations placed in areas subjected to tensile stress are more prone to cracking than configurations placed in areas subjected to compressive stress. For example, the bending wiring BL placed in the bending area BA of the display panel 10 may be placed in an area subjected to tensile stress, so the bending of the bending area BA makes it relatively more likely that cracks will occur in the bending wiring BL. As a result, during bending, the area subjected to tensile stress is more vulnerable to cracking than the area subjected to compressive stress, so the neutral plane can be moved closer to the bending wiring BL to minimize the stress applied to the bending wiring BL.

[0160] Therefore, when the pattern layer 400 is placed on the bending wiring BL (see Figure 3), the display device according to the embodiment of the present invention can adjust the height H of the pattern layer 400, with the thickness from the pattern layer 400 to the bending wiring BL determined, to position the neutral plane on the bending wiring BL or move it close to the bending wiring BL. As a result, the display panel 10 can use the pattern layer 400 to reduce the stress acting on the bending wiring BL when the display panel 10 is bent.

[0161] The color filter layer 500 may be placed on the liquid crystal layer 300. In this case, the color filter layer 500 may be placed in the display area DA. The black matrix 600 may be placed in the first non-display area NA1. The color filter layer 500 may also be formed on the same layer as the black matrix 600. For example, the color filter layer 500 and the black matrix 600 may be placed adjacent to each other.

[0162] The color filter layer 500 may, but is not limited to, include red, green, and blue color filters. For example, the color filter layer 500 may include acrylic resin and pigments. The color filter layer 500 can then be divided into red, green, and blue depending on the type of pigment that embodies the color.

[0163] The black matrix 600 may be placed in the first non-display area NA1 and may be placed on the liquid crystal layer 300 and sealant 310.

[0164] Furthermore, the black matrix 600 may have a closed-loop shape surrounding the display area DA. This allows the black matrix 600 to prevent light leakage. In this case, the black matrix 600 can be superimposed on the color filter layer 500 in the X-axis and Y-axis directions.

[0165] The cover member 700 may be placed on the color filter layer 500 and the black matrix 600. For example, the cover member 700 may be placed so as to overlap the color filter layer 500 and the black matrix 600, covering them. In this way, the cover member 700 can protect the color filter layer 500 and the black matrix 600.

[0166] The ends of the cover member 700 may, but are not limited to, protrude further than the black matrix 600 in the Y-axis direction. For example, the ends of the cover member 700 may be positioned to overlap with the ends of the black matrix 600 in the Z-axis direction.

[0167] The cover member 700 may, but is not limited to, be made of transparent plastic, glass, or tempered glass.

[0168] The upper polarizing layer UPOL may be placed on the cover member 700. Furthermore, the upper polarizing layer UPOL may be superimposed on the color filter layer 500 and placed in the display area DA. For example, the upper polarizing layer UPOL may be placed on a portion of the cover member 700 in the display area DA.

[0169] The lower polarizing layer DPOL may be positioned below the first substrate 110. For example, the lower polarizing layer DPOL may be attached to the bottom of the first substrate 110 via an adhesive member. For example, the lower polarizing layer DPOL may be superimposed on the color filter layer 500 and positioned in the display area DA.

[0170] Figure 7 shows the coating layer to be placed on the display panel according to an embodiment of the present invention.

[0171] Referring to Figure 7, the display panel 10 according to an embodiment of the present invention may further include a coating layer 800 disposed in the groove G.

[0172] The coating layer 800 may be positioned below the planarization layer 240 so as to overlap a portion of the bending wiring BL. Here, the lower surface 810 of the coating layer 800 may, but is not limited to, be formed recessed toward the planarization layer 240. For example, the lower surface 810 of the coating layer 800 may be substantially flat.

[0173] The coating layer 800 may be formed from an organic substance including, but is not limited to, polyester polymers and acrylic polymers.

[0174] The coating layer 800 may be formed to have a predetermined thickness T, taking into consideration the position of the neutral plane.

[0175] In the display device according to an embodiment of the present invention, the thickness T of the coating layer 800 can be adjusted while the thickness from the planarization layer 240 to the bending wiring BL, or from the planarization layer 240 to the pattern layer 400, is determined. This allows the neutral plane to be positioned at the bending wiring BL or moved close to the bending wiring BL. Therefore, the display panel 10 can use the coating layer 800 to reduce the stress acting on the bending wiring BL when the display panel 10 is bent.

[0176] Figure 8 shows the bent state of a display device according to an embodiment of the present invention.

[0177] Referring to Figure 8, the display panel 10 of the display device according to an embodiment of the present invention can be bent. For example, by bending the bending region BA, the display panel 10 can be bent so that the first substrate 110 and the second substrate 120 face each other. In this case, the bending region BA can be bent to have a predetermined radius of curvature.

[0178] In the bending region BA of the display panel 10 according to the embodiment of the present invention, the gate insulating layer 220, the first interlayer insulating layer 230, and the second interlayer insulating layer 260, all made of inorganic insulating material, are not placed therein. Therefore, damage to the gate insulating layer 220, the first interlayer insulating layer 230, and the second interlayer insulating layer 260 due to bending can be prevented in advance.

[0179] As the bending region BA is bent, the light source unit 30 can be positioned between the first substrate 110 and the second substrate 120. Here, the light source unit 30 can irradiate light toward the first substrate 110. Therefore, the light source unit 30 can be superimposed on the first substrate 110 in the Z-axis direction. Furthermore, the light source unit 30 can be superimposed on the second substrate 120 in the Z-axis direction.

[0180] The light source unit 30 may include a backlight unit 31 and a case 32 that encloses the light source module.

[0181] The backlight unit 31 can irradiate light toward the first substrate 110. While an LED (Light Emitting Diode) may be used as the light source for the backlight unit 31, it is not necessarily limited to this.

[0182] The case 32 is positioned to enclose the backlight unit 31 and protect it. The case 32 may include an aperture OP so that light from the backlight unit 31 is directed toward the first substrate 110. For example, the surface of the case 32 facing the first substrate 110 may, but is not limited to, include an aperture OP so that light is emitted from the backlight unit 31 toward the first substrate 110.

[0183] The aperture OP may be positioned toward the first substrate 110. A lower polarizing layer DPOL may be positioned in the aperture OP.

[0184] Figure 9 is a cross-sectional view showing another embodiment of the display panel according to the embodiment of the present invention. Figure 10 is an enlarged view showing area B in Figure 9. Figure 11 is a diagram showing the bent state of a display device to which another embodiment of the display panel according to the embodiment of the present invention is applied. The display panel 10a shown in Figures 9 to 11 may be a display panel according to the second embodiment. The display panel 10 shown in Figures 3, 7 and 8 may be a display panel according to the first embodiment.

[0185] Referring to Figures 3, 7 to 11, when comparing the display panel 10 according to the first embodiment with the display panel 10a according to the second embodiment, the display panel 10 according to the first embodiment (for example, Figures 7, 8, and other figures) utilizes two first connecting wires LL1 and second connecting wires LL2 that are spaced apart from each other with a pattern layer 400 in between. However, the display panel 10a according to the second embodiment (for example, Figures 9 to 11, and other figures) utilizes one connecting wire LL, so that the connecting wire LL can overlap with the bending wire BL in the bending region BA. For example, the connecting wire LL of the display panel 10a according to the second embodiment, which extends from the first non-display region NA1 through the bending region BA to the second non-display region NA2, can be placed on the bending wire BL in the bending region BA. As a result, the connecting wire LL can come into contact with the bending wire BL in the bending region BA. In this case, the display panel 10a according to the second embodiment can be applied to the display device according to the embodiment of the present invention in place of the display panel 10 according to the first embodiment.

[0186] Referring to Figures 3, 7 through 11, and describing the display panel 10a according to the second embodiment, substantially identical components in the display panel 10 according to the first embodiment and the display panel 10a according to the second embodiment can be represented by the same reference numerals, so a detailed explanation of these components will be omitted. A detailed description given for one or more elements in the figures may also apply to elements in other figures that use the same reference numerals.

[0187] Referring to Figures 9 to 11, an embodiment of the present invention may comprise a display panel 10a including grooves G, a circuit board 20 connected to a pad portion PAD of the display panel 10a, and a light source unit 30 that irradiates light toward the liquid crystal layer 300 of the display panel 10a.

[0188] A display panel 10a according to an embodiment of the present invention may include a substrate 100 comprising a first substrate 110 and a second substrate 120 arranged adjacent to each other and separated by a groove G, a circuit layer 200 disposed on the substrate 100, a liquid crystal layer 300 disposed on the circuit layer 200, a pad portion PAD disposed on the second substrate 120 for connection with the circuit board 20, a bending wiring BL disposed on a planarization layer 240 extending from the circuit layer 200 to the upper part of the groove G, and a connecting wiring LL connecting the pad portion PAD and the bending wiring BL. Here, the circuit layer 200 may include a thin-film transistor 210, a gate insulating layer 220, a first interlayer insulating layer 230, a planarization layer 240, a first electrode 250, a second interlayer insulating layer 260, and a second electrode 270. The thin-film transistor 210 may include a gate electrode 211, an active layer 212, a source electrode 213, and a drain electrode 214. In this case, the planarization layer 240 may be extended through the bending region BA to a portion of the second non-display region NA2 so as to be positioned above the groove G. This allows the planarization layer 240 to act as an etching prevention layer when etching the substrate 100 to form the groove G. The first substrate 110 may be the first region of the substrate 100, and the second substrate 120 may be the second region of the substrate 100. The first region and the second region of the substrate 100 may be arranged adjacent to each other but separated by the groove G.

[0189] Furthermore, the display panel 10a according to an embodiment of the present invention may further include a pattern layer 400 disposed on a bending wiring BL, a color filter layer 500 and a black matrix 600 disposed on a liquid crystal layer 300, a sealant 310 surrounding the liquid crystal layer 300, at least one column 320 disposed between the color filter layer 500 and the circuit layer 200, a cover member 700 disposed on the color filter layer 500 and the black matrix 600, a lower polarizing layer DPOL disposed below the first substrate 110, and an upper polarizing layer UPOL disposed above the cover member 700. In this case, the lower polarizing layer DPOL and the upper polarizing layer UPOL may be superimposed on the color filter layer 500, but are not limited thereto. For example, the lower polarizing layer DPOL and the upper polarizing layer UPOL may be configured to correspond to the color filter layer 500. In addition, the cover member 700 can protect the color filter layer 500 and the black matrix 600.

[0190] Furthermore, the display panel 10a according to the embodiment of the present invention may further include a coating layer 800 disposed in the groove G.

[0191] The connecting wiring LL may be located in the first non-display area NA1, the bending area BA, and the second non-display area NA2. For example, the connecting wiring LL may extend from the first non-display area NA1 to the second non-display area NA2. For example, the connecting wiring LL may be located so as to extend from the first non-display area NA1 to the second non-display area NA2, passing through the bending area BA.

[0192] The connecting wiring LL may be positioned in the bending region BA so as to be in contact with the bending wiring BL. A pattern layer 400 may then be positioned on the connecting wiring LL. This allows the connecting wiring LL to protect the bending wiring BL. For example, in the display panel 10a according to an embodiment of the present invention, a portion of the connecting wiring LL can be positioned between the bending wiring BL and the pattern layer 400 to protect the bending wiring BL. For example, the bending wiring BL may contain copper (Cu). When copper (Cu) is exposed to air, it can oxidize. This can increase the resistance of the bending wiring BL when the copper (Cu)-containing bending wiring BL oxidizes.

[0193] Therefore, the display panel 10a according to the embodiment of the present invention can prevent oxidation of the copper (Cu)-containing bending wiring BL by utilizing the pattern layer 400. However, by further arranging a portion of the connecting wiring LL between the bending wiring BL and the pattern layer 400, oxidation of the bending wiring BL can be prevented more effectively. This prevents an increase in the resistance of the bending wiring BL due to oxidation.

[0194] The connecting wiring LL may come into contact with the bending wiring BL in the first non-display area NA1, the bending area BA, and the second non-display area NA2. For example, the connecting wiring LL may come into contact with the bending wiring BL in a part of the first non-display area NA1, the bending area BA, and a part of the second non-display area NA2, but is not limited to this. As a result, the connecting wiring LL of the display panel 10a according to the embodiment of the present invention can be stably connected to the bending wiring BL. For example, even if a part of the connecting wiring LL or one of the bending wiring BLs located in the bending area BA is damaged due to bending of the display panel 10a, the signal applied through the connecting wiring LL can be transmitted to the wiring of the display area DA through the undamaged connecting wiring LL or bending wiring BL. For example, if a portion of the connecting wiring LL is damaged in the bending area BA of the display panel 10a, the signal applied through the pad PAD may travel in the following order: connecting wiring LL of the second non-display area NA2, second contact hole CH2, bending wiring BL, first contact hole CH1, connecting wiring LL of the first non-display area NA1, and then be transmitted to the wiring of the display area DA.

[0195] Referring to Figures 9 and 10, the connecting wiring LL may be placed on the second interlayer insulation layer 260. The connecting wiring LL may then be electrically connected to the bending wiring BL through the first contact hole CH1, the second contact hole CH2, and the third contact hole CH3.

[0196] The first contact hole CH1 may be located in the first non-display area NA1, and the connecting wiring LL may be electrically connected to the bending wiring BL through the first contact hole CH1.

[0197] The second contact hole CH2 may be located in the second non-display area NA2, and the connecting wiring LL may be electrically connected to the bending wiring BL through the second contact hole CH2.

[0198] The third contact hole CH3 may be located in the bending region BA, and the connecting wiring LL may be electrically connected to the bending wiring BL through the third contact hole CH3. In this case, a portion of the connecting wiring LL that contacts the bending wiring BL through the third contact hole CH3 may be formed to have a predetermined second length L2 in the Y-axis direction. The second length L2 may be smaller than the first length L1 of the bending wiring BL. For example, considering the location of the sealant 310 and the contact holes CH1, CH2, CH3 formed in the second interlayer insulating layer 260, the second length L2 may be smaller than the first length L1 of the bending wiring BL.

[0199] Therefore, the display panel 10a according to the embodiment of the present invention is electrically connected to the bending wiring BL through the first contact hole CH1, the second contact hole CH2, and the third contact hole CH3, thereby enabling stable transmission of signals applied through the connecting wiring LL to the wiring of the display area DA.

[0200] Referring to Figure 11, the display panel 10a of the display device according to an embodiment of the present invention can be bent. In the bending region BA, the display panel 10a according to an embodiment of the present invention can have a structure that is robust against bending because a portion of the connecting wiring LL is arranged to overlap and support the bending wiring BL.

[0201] Figure 12 is a cross-sectional view showing another embodiment of the display panel according to the embodiment of the present invention. Figure 13 is an enlarged view showing area C in Figure 12. The display panel 10b shown in Figures 12 to 13 may be a display panel according to a third embodiment.

[0202] Referring to Figures 3, 7 through 13, and comparing the display panel 10 according to the first embodiment (Figures 7, 8, etc.) with the display panel 10b according to the third embodiment, the display panel 10b according to the third embodiment (Figures 12, 13, etc.) may further include another third connecting wiring LL3 superimposed on the bending wiring BL. In this case, the third connecting wiring LL3 may be positioned on the bending wiring BL in the bending region BA. The display panel 10b according to the third embodiment may be applied to the display device according to the embodiment of the present invention in place of the display panel 10 according to the first embodiment. Detailed descriptions given for one or more elements in the figures may also apply to other elements in the figures using the same reference numerals.

[0203] Referring to Figures 3, 7 to 11, and 12 to 13, when describing the display panel 10b according to the third embodiment, substantially identical components in the display panel 10 according to the first embodiment and the display panel 10b according to the third embodiment can be represented by the same reference numerals, so a detailed explanation of them will be omitted.

[0204] Referring to Figures 12 to 14, an embodiment of the present invention may comprise a display panel 10b including grooves G, a circuit board 20 connected to a pad portion PAD of the display panel 10b, and a light source unit 30 that irradiates light toward the liquid crystal layer 300 of the display panel 10b.

[0205] The connecting wiring LL of the display panel 10b may include a first connecting wiring LL1 located in the first non-display area NA1, a second connecting wiring LL2 located in the second non-display area NA2, and a third connecting wiring LL3 located in the bending area BA.

[0206] The third connecting wiring LL3 may be placed between the first connecting wiring LL1 and the second connecting wiring LL2. For example, the first connecting wiring LL1, the second connecting wiring LL2, and the third connecting wiring LL3 may be connected by a bending wiring BL. The third connecting wiring LL3 may also be separated from the first connecting wiring LL1 and the second connecting wiring LL2, respectively. For example, the first connecting wiring LL1, the second connecting wiring LL2, and the third connecting wiring LL3 may be placed on the second interlayer insulating layer 260 so as to be separated from each other. In this case, the first connecting wiring LL1 may be electrically connected to the bending wiring BL through the first contact hole CH1. The second connecting wiring LL2 may also be electrically connected to the bending wiring BL through the second contact hole CH2.

[0207] The third connecting wire LL3 may be positioned overlapping with the bending wire BL in the bending region BA. For example, the third connecting wire LL3 may be positioned on the bending wire BL in the bending region BA. For example, the third connecting wire LL3 may be positioned in contact with the bending wire BL in the bending region BA. For example, the third connecting wire LL3 may be electrically connected to the bending wire BL through the third contact hole CH3.

[0208] Therefore, in the embodiment of the present invention, the display panel 10b can have a robust structure against bending because the third connecting wiring LL3 is arranged to overlap and support the bending wiring BL in the bending region BA. Furthermore, since the third connecting wiring LL3 is arranged on the bending wiring BL, oxidation of the bending wiring BL, which contains copper (Cu), can be prevented.

[0209] A display device according to one or more embodiments of the present invention can be described as follows.

[0210] A display device according to one or more embodiments of the present invention comprises a display panel including grooves and a circuit board connected to the display panel, wherein the display panel may include a substrate including a first substrate and a second substrate separated from each other by the grooves, a circuit layer disposed on the first substrate and including transistors, a liquid crystal layer disposed on the circuit layer, a planarization layer disposed on a first region and the grooves, a pad portion disposed on the second substrate and connected to the circuit board, a bending wire disposed on the planarization layer, and a connecting wire connecting the bending wire and the pad portion.

[0211] A display panel according to one or more embodiments of the present invention includes a substrate comprising a first substrate and a second substrate separated from each other by grooves, a circuit layer disposed on the first substrate and including transistors, a planarization layer disposed on the first substrate and the grooves, a pad portion disposed on the second substrate, bending wiring disposed on the planarization layer, and connecting wiring connected to the bending wiring.

[0212] According to one or more embodiments of the present invention, the bending wiring may include a material different from that of the connecting wiring.

[0213] According to one or more embodiments of the present invention, the bending wiring comprises a first layer and a second layer, wherein the material of the first layer and the material of the second layer may be different.

[0214] According to one or more embodiments of the present invention, the planarization layer disposed on the groove may be extended to overlap with the second substrate.

[0215] According to one or more embodiments of the present invention, the display panel further includes a pattern layer disposed on the bending wiring, wherein the pattern layer may be made of an organic insulating material.

[0216] According to one or more embodiments of the present invention, the width of the pattern layer may be smaller than the length of the bending wiring with respect to the Y-axis direction.

[0217] According to one or more embodiments of the present invention, the pattern layer can be superimposed on the groove in the Z-axis direction.

[0218] According to one or more embodiments of the present invention, the display panel may further include a coating layer disposed in the groove.

[0219] According to one or more embodiments of the present invention, the display panel may further include a color filter layer disposed on the liquid crystal layer, a black matrix, and a sealant surrounding the liquid crystal layer.

[0220] According to one or more embodiments of the present invention, the sealant can be superimposed on the bent wiring in the Z-axis direction.

[0221] According to one or more embodiments of the present invention, the display panel may further include a cover member disposed on the color filter layer and the black matrix.

[0222] According to one or more embodiments of the present invention, the display panel may further include a light source superimposed on the first substrate.

[0223] According to one or more embodiments of the present invention, the connecting wiring may include a first connecting wiring that contacts one side of the bending wiring and a second connecting wiring that contacts the other side of the bending wiring.

[0224] According to one or more embodiments of the present invention, the display panel may include a pattern layer arranged between a first connecting wire and a second connecting wire, and the first connecting wire and the second connecting wire may be connected through a bending wire.

[0225] According to one or more embodiments of the present invention, the display panel further includes a second interlayer insulating layer disposed between the bending wiring and the first connecting wiring and between the bending wiring and the second connecting wiring, wherein the first connecting wiring is in contact with the bending wiring through a first contact hole in the second interlayer insulating layer, and the second connecting wiring is in contact with the bending wiring through a second contact hole in the second interlayer insulating layer.

[0226] According to one or more embodiments of the present invention, a portion of the connecting wiring is arranged on the bending wiring.

[0227] According to one or more embodiments of the present invention, the display panel further includes a pattern layer disposed on the connecting wiring, wherein the pattern layer may overlap the groove in the Z-axis direction.

[0228] According to one or more embodiments of the present invention, the display panel may further include a second interlayer insulating layer disposed between the bending wiring and the connecting wiring, the connecting wiring being able to contact the bending wiring through first contact holes, second contact holes, and third contact holes of the second interlayer insulating layer.

[0229] According to one or more embodiments of the present invention, the connecting wiring includes a first connecting wiring, a second connecting wiring, and a third connecting wiring, which are arranged to be spaced apart from each other, and the third connecting wiring may overlap with the bending wiring.

[0230] According to one or more embodiments of the present invention, the third connecting wiring can be separated from the first connecting wiring and the second connecting wiring, respectively.

[0231] According to one or more embodiments of the present invention, the display panel further includes a second interlayer insulating layer disposed between the bending wiring and the first connecting wiring and between the bending wiring and the second connecting wiring, wherein the first connecting wiring is in contact with the bending wiring through a first contact hole in the second interlayer insulating layer, and the second connecting wiring is in contact with the bending wiring through a second contact hole in the second interlayer insulating layer.

[0232] According to one or more embodiments of the present invention, the third connecting wiring may be arranged to contact the bending wiring.

[0233] According to one or more embodiments of the present invention, the first side surface of the first substrate and the second side surface of the second substrate may be inclined surfaces having a predetermined angle.

[0234] According to one or more embodiments of the present invention, the display panel further includes a first electrode disposed on the planarization layer, and the bending wiring includes a first layer and a second layer, wherein at least one of the first layer and the second layer may include the same metal layer as the first electrode.

[0235] According to one or more embodiments of the present invention, the planarization layer may include an organic material.

[0236] According to one or more embodiments of the present invention, the display panel may include a substrate comprising a first substrate and a second substrate separated from each other by grooves, a circuit layer disposed on the first substrate and including transistors, a planarization layer extending from the circuit layer and disposed on the grooves, a pad portion disposed on the second substrate, a bending wire disposed on the planarization layer, and a connecting wire connecting the pad portion and the bending wire.

[0237] According to one or more exemplary embodiments of the present disclosure, insulating or dielectric layers directly disposed on the electrodes of a transistor may be disposed on a first substrate and a second substrate without being placed on grooves, such that the insulating or dielectric layers are not present in the bending region. For example, the insulating or dielectric layers may include a gate insulating layer, a first interlayer dielectric layer, and a second interlayer dielectric layer.

[0238] According to one or more exemplary embodiments of the present disclosure, the inorganic layers of the circuit layer may be arranged on a substrate excluding grooves such that the inorganic layers are not present in the bending region. For example, the inorganic layers may include a gate insulating layer, a first interlayer insulating layer, and a second interlayer insulating layer.

[0239] According to one or more exemplary embodiments of the present disclosure, the metal layer of the circuit layer may be disposed on the first substrate without being placed on grooves, or on the first substrate and the second substrate without being placed on grooves. For example, the metal layer of the circuit layer may include some or all of the gate electrode, source electrode, drain electrode, first electrode, and second electrode.

[0240] According to one or more exemplary embodiments of the present disclosure, the bending wiring may be separate from the connecting wiring.

[0241] Therefore, since the contents of the specification, which describe the problem the invention aims to solve, the means for solving the problem, and the effects of the invention, do not specify the essential features of the claims, the scope of rights of the claims is not limited by the matters described in the specification.

[0242] Although embodiments of the present invention have been described in more detail above with reference to the attached drawings, the present invention is not necessarily limited to such embodiments and can be implemented in various modified forms without departing from the technical concept of the present invention. Therefore, the embodiments disclosed herein are for illustrative purposes only, not to limit the technical concept of the present invention, and the scope of the technical concept of the present invention is not limited by such embodiments. Accordingly, the embodiments described above should be understood to be illustrative and non-limiting in all respects. The scope of protection of the present invention should be interpreted by the claims, and all technical concepts within an equivalent scope should be interpreted as being included in the scope of the rights of the present invention. [Explanation of Symbols]

[0243] 10, 10a: Display panel 100: Circuit board 110: First board 120: Second board 200:Circuit layer 240: Flattening layer 300: Liquid crystal layer 400: Pattern layer 500: Color filter layer 600: Black Matrix 700: Cover component 800: Coating layer BL: Bending Wiring G:Groove LL: Connection wiring PAD: Pad part

Claims

1. Equipped with a display panel, The aforementioned display panel is grooves and A substrate including a first region and a second region separated from each other by the groove, A circuit layer including a transistor is placed on the first region, The first region and the flattening layer disposed on the groove, A pad portion is placed on the second region, Bending wiring arranged on the flattening layer, A display device including a connecting wire connected to the aforementioned bending wire.

2. The display device according to claim 1, wherein the bending wiring includes a material different from the material of the connecting wiring.

3. The aforementioned bending wiring includes a first layer and a second layer, The display device according to claim 1, wherein the material of the first layer and the material of the second layer are different.

4. The display device according to claim 1, wherein the flattening layer disposed on the groove is extended so as to overlap with the second region.

5. The system further comprises a pattern layer arranged on the aforementioned bending wiring, The display device according to claim 1, wherein the pattern layer is made of an organic insulating material.

6. The display device according to claim 5, wherein the width of the pattern layer is smaller than the length of the bending wiring.

7. The display device according to claim 5, wherein the pattern layer is superimposed on the groove.

8. The display device according to claim 1, further comprising a coating layer disposed in the groove.

9. The display device according to claim 1, wherein the connecting wiring includes a first connecting wiring that contacts one side of the bending wiring and a second connecting wiring that contacts the other side of the bending wiring.

10. The system further comprises a pattern layer disposed between the first connecting wiring and the second connecting wiring, The display device according to claim 9, wherein the first connecting wiring and the second connecting wiring are connected through the bending wiring.

11. The system further comprises a second interlayer insulating layer disposed between the bending wiring and the first connecting wiring, and between the bending wiring and the second connecting wiring. The first connecting wiring contacts the bending wiring through the first contact hole of the second interlayer insulating layer. The display device according to claim 9, wherein the second connecting wiring is in contact with the bending wiring through the second contact hole of the second interlayer insulating layer.

12. The display device according to claim 1, wherein a portion of the connecting wiring is arranged on the bending wiring.

13. The system further comprises a pattern layer arranged on the aforementioned connecting wiring, The display device according to claim 12, wherein the pattern layer is superimposed on the groove.

14. The system further comprises a second interlayer insulating layer disposed between the bending wiring and the connecting wiring, The display device according to claim 12, wherein the connecting wiring is in contact with the bending wiring through the first contact hole, the second contact hole, and the third contact hole of the second interlayer insulating layer.

15. The aforementioned connecting wiring includes a first connecting wiring, a second connecting wiring, and a third connecting wiring, which are arranged to be spaced apart from each other. The display device according to claim 1, wherein the third connecting wiring is superimposed on the bending wiring.

16. The display device according to claim 15, wherein the third connecting wiring is separated from the first connecting wiring and the second connecting wiring, respectively.

17. The system further comprises a second interlayer insulating layer disposed between the bending wiring and the first connecting wiring, and between the bending wiring and the second connecting wiring. The first connecting wiring contacts the bending wiring through the first contact hole of the second interlayer insulating layer. The display device according to claim 15, wherein the second connecting wiring is in contact with the bending wiring through the second contact hole of the second interlayer insulating layer.

18. The display device according to claim 17, wherein the third connecting wiring is arranged to contact the bending wiring.

19. The display device according to claim 1, wherein the first side surface of the first region and the second side surface of the second region are inclined surfaces having a predetermined angle.

20. The first electrode is further disposed on the planarization layer, The aforementioned bending wiring includes a first layer and a second layer, The display device according to claim 1, wherein at least one of the first layer and the second layer includes the same metal layer as the first electrode.

21. The display device according to claim 1, wherein the planarization layer includes an organic material.

22. The display panel further comprises a circuit board connected to the aforementioned display panel, The display device according to claim 1, wherein the pad portion is connected to the circuit board.

23. A substrate including a first substrate and a second substrate separated from each other by grooves, Displaced on the first substrate, a circuit layer including a transistor, The first substrate and the planarizing layer disposed on the groove, A pad portion is placed on the second substrate, Bending wiring arranged on the flattening layer, A display panel including connecting wiring connected to the aforementioned bending wiring.

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