Immersion cooling platform

Abstract

The present invention provides a liquid-cooled computing system and cooling system that utilize pressure and / or steam control. [Solution] A two-phase immersion cooling system is provided for a heat-generating computer component, which vaporizes the dielectric fluid in its liquid phase, condenses the dielectric vapor back into the liquid phase, and is used to cool the computer component. The system operates below atmospheric pressure using a pressure control vessel and a pressure controller. By controlling the pressure under which the system operates, the temperature at which the dielectric fluid vaporizes is affected, thereby achieving increased performance from a given computer component 170. An internal robotic arm 230 and a slot-in type computing component are used to form a self-healing computing system.

Description

Technical Field

[0001] The present invention relates to a computing system that is liquid immersion cooled, i.e., a computing system that utilizes pressure and / or vapor management for liquid immersion cooling.

Summary of the Invention

[0002] Conventional computing and / or server systems utilize air to cool various components. Conventional liquid or water-cooled computers utilize flowing liquid to extract heat from computer components but avoid direct contact between the computer components and the liquid itself. The development of non-conductive and / or dielectric fluids has enabled the use of immersion cooling where computer components and other electronic components can be immersed in a dielectric or non-conductive liquid to directly extract heat from the components to the liquid. Immersion cooling can be used to reduce the total energy required to cool computer components and can also reduce the amount of space and equipment required for adequate cooling. In the embodiments of the disclosure of the present invention described below, the use of a vapor and pressure management system and a power management system can be utilized individually or in combination to form a significantly improved computer system that utilizes liquid immersion cooling. Embodiments of the invention of the present disclosure relate to a pressure control vessel that can be used to house a computing system that is liquid immersion cooled. In one embodiment, the pressure control vessel contains a sufficient amount of a liquid dielectric fluid to substantially immerse the heat-generating computer components and an air-containing gaseous dielectric fluid. Immersion cooling can be used to reduce the total energy required to cool computer components and can also reduce the amount of space and equipment required for adequate cooling.

[0003] In the embodiments of the disclosure of the present invention described below, the use of a vapor and pressure management system and a power management system can be utilized individually or in combination to form a significantly improved computer system that utilizes liquid immersion cooling. can be utilized individually or in combination to form a significantly improved computer system that utilizes liquid immersion cooling.

[0004] Embodiments of the invention of the present disclosure relate to a pressure control vessel that can be used to house a computing system that is liquid immersion cooled. In one embodiment, the pressure control vessel contains a sufficient amount of a liquid dielectric fluid to substantially immerse the heat-generating computer components and an air-containing gaseous dielectric fluid. This also includes dielectric fluids. Embodiments are for cooling a gaseous dielectric fluid and converting it into a liquid dielectric fluid. The condensation system is further equipped. The pressure management system of the disclosed embodiment moves under vacuum. This makes it possible to create a dielectric fluid that vaporizes and enables computing The operating temperature of the system decreases. Embodiments of the disclosure improve the temperature control system described. This enables higher density of computer components and / or higher performance of computers. ru. [Brief explanation of the drawing]

[0005] [Figure 1] Figure 1 shows a schematic diagram of a pressure control vessel according to an exemplary embodiment. [Figure 2] Figure 2 shows a schematic diagram of a pressure control vessel according to an exemplary embodiment. [Figure 3] Figure 3 shows an external view of an exemplary embodiment of the pressure control vessel 110. [Figure 4] Figure 4 illustrates an exemplary embodiment of a superstructure that includes multiple pressure control vessels. [Figure 5] Figure 5 illustrates an exemplary data center embodiment showing multiple pressure control vessels connected to a central power supply. [Figure 6] Figure 6 illustrates an exemplary data center embodiment showing multiple pressure control vessels connected in series with each other. [Figure 7-1] Figure 7A illustrates an exemplary embodiment of a cooled computing system having an internal robotic arm, an airlock, and an external robotic arm. Figure 7B illustrates an exemplary embodiment of a cooled computing system having an internal robotic arm, an airlock, and an external robotic arm. [Figure 7-2]FIG. 7C illustrates an exemplary embodiment of a cooled computing system having an internal robotic arm, an airlock, and an external robotic arm. FIG. 7D illustrates an exemplary embodiment of a cooled computing system having an internal robotic arm, an airlock, and an external robotic arm. [Figure 8A] FIG. 8A shows an exemplary embodiment of a rack system. [Figure 8B] FIG. 8B shows an exemplary embodiment of a rack system. [Figure 8C] FIG. 8C shows an exemplary embodiment of a rack system. [Figure 9A] FIG. 9A shows an exemplary embodiment of a chassis for mounting various components. [Figure 9B] FIG. 9B shows an exemplary embodiment of a chassis for mounting various components. [Figure 9C] FIG. 9C shows an exemplary embodiment of a chassis for mounting various components. [Figure 9D] FIG. 9D shows an exemplary embodiment of a chassis for mounting various components. [Figure 9E] FIG. 9E shows an exemplary embodiment of a chassis for mounting various components. [Figure 9F] FIG. 9F shows an exemplary embodiment of a chassis for mounting various components. [Figure 9G] FIG. 9G shows an exemplary embodiment of a chassis for mounting various components. [Figure 10A] FIG. 10A shows an exemplary embodiment of a pressure control vessel. [Figure 10B] FIG. 10B shows an exemplary embodiment of a pressure control vessel. [Figure 10C] FIG. 10C shows an exemplary embodiment of a pressure control vessel. [Figure 10D] FIG. 10D shows an exemplary embodiment of a pressure control vessel. [Figure 10E] FIG. 10E shows an exemplary embodiment of a pressure control vessel. [Figure 10F]Figure 10F shows an exemplary embodiment of a pressure control vessel. [Figure 11] Figure 11 shows an exemplary cooling and vapor management system for a pressure control vessel. [Figure 12A] Figure 12A shows another embodiment of the vessel. [Figure 12B] Figure 12B shows another embodiment of the vessel. [Figure 12C] Figure 12C shows another embodiment of the vessel. [Figure 12D] Figure 12D shows another embodiment of the vessel. [Figure 12E] Figure 12E shows another embodiment of the vessel. [Figure 13] Figure 13 shows an example of a self - contained vessel. [Figure 14] Figure 14 shows an example of an external housing for a self - contained vessel. [Figure 15A] Figure 15A shows an exemplary magazine located on a platform that can protrude from the vessel. [Figure 15B] Figure 15B shows an exemplary magazine located on a platform that can protrude from the vessel. [Figure 15C] Figure 15C shows an exemplary magazine located on a platform that can protrude from the vessel. [Figure 15D] Figure 15D shows an exemplary magazine located on a platform that can protrude from the vessel. [Figure 16] Figure 16 shows a vapor recovery system according to an exemplary embodiment. <00​​​​​​​​​​​​​It is obvious to those skilled in the art that this can be done without such specific details. Further details regarding such considerations are not available in this disclosure. It is omitted because it is not necessary for the purpose and falls within the scope of the skills of those skilled in the art.

[0007] The devices, components, systems, and subsystems of some of the embodiments of the following disclosures are commercial products. It will be listed by name. This disclosure will not include the fact that such components are developed and / or sold under specific trade names. It can be carried out with a large number of similar components, regardless of whether they are used or not, and the specific product name Features and / or inventive features related to the components are necessary for carrying out the disclosed invention. It is obvious to those skilled in the art that this is not the case.

[0008] Dielectric fluid One form of immersion cooling is thermally conductive but electrically substantially non-conductive or substantially This involves the use of dielectric fluids. Examples of such fluids include 3M (trademark), including Novec 7100. Includes some of the Novec® series fluids designed by ) but the stated The light is not limited to a specific dielectric fluid. Depending on the immersion fluid, typically the cooled computer The components have a boiling point that is desirable for operation. All computers of the disclosed system The elemental components and other embodiments are preferably non-soluble, and if not dielectric. It is made of a material that does not undergo dielectric breakdown in the pressure control vessel when in contact with a fluid. In one embodiment, The boiling points of dielectric fluids at near-atmospheric pressure are approximately below 100°C, below 80°C, and below 60°C. The temperature may be less than approximately 50°C or even lower. In one embodiment, dielectric flow at standard atmospheric pressure. The boiling point of the substance may be above approximately 60°C, above approximately 40°C, above approximately 30°C, or above approximately 20°C. Immersion cooling Certain embodiments of the fluid have a generally low vapor pressure. One embodiment of the immersion cooling fluid These are fluorocarbons and / or fluorinated ketones. Specific embodiments of the dielectric fluid are (CF3)2CFCF2OCH3, C4F9OCH3 or CF3CF2CF2CF It may have the chemical formula 2OCH3 or a similar one. Certain dielectric fluids are hydrof Contains ruoroether and methoxy-nonafluorobutane.

[0009] Other desirable properties of immersion cooling fluids include low toxicity, non-flammability, and / or low surface tension. In this embodiment, the immersion cooling fluid is a composite at the pressure and temperature used for liquid immersion cooling. Connections, wiring, cables, and seals related to computer components and / or computer components. It does not substantially harm the stopper and / or adhesive. A certain dielectric fluid is in the range of about 1.8 to about 8. It has a dielectric constant of and a dielectric strength of approximately 15 megavolts per meter (MV / m). In one embodiment, at least about 5 MV / m, at least about 8 MV / m, and at least about 10 It has a dielectric strength of MV / m or at least about 12 MV / m. In one embodiment, dielectric The fluid has a dielectric strength of up to approximately 3 MV / m, up to approximately 5 MV / m, or up to approximately 8 MV / m. It has. In the embodiments of the disclosure, any liquid that comes into contact with the computer component 170 is particularly Damage to computer components under specific application intervals and conditions It has sufficiently high dielectric strength.

[0010] A certain dielectric fluid has a dielectric strength of at least about 10 W / cm². 2 at least approximately 15 W / cm² 2 , few At most, it's about 18 W / cm². 2 Or at least about 20 W / cm² 2It has a critical heat flux. The electrolytic fluid has a maximum output of approximately 15 W / cm². 2 Up to approximately 10W / cm² 2 Up to approximately 8W / cm² 2 Or a maximum of approximately 5W / cm² 2 It has a critical heat flux.

[0011] Figure 1 shows a schematic diagram of a cooled computing system 110 according to an exemplary embodiment. The disclosed cooled computing system 110 (or computing system (The actual implementation of a system, container, or pressure control vessel, all of which are interchangeable and usable) The method of application involves cooling the computer components 170 by immersing them in a fluid tank. A liquid dielectric fluid 140 can be used to repel the electricity as it passes through the component 170. As a result, component 170 generates heat. As component 170 heats up, the performance of the component changes. The performance will degrade, or the components will be damaged down to the point of failure. Various computers It is advantageous to maintain the composing components at a stable, relatively low temperature. In one embodiment, Computer component 170 operates at temperatures below approximately 80°C, below approximately 70°C, below approximately 65°C, and below approximately 60°C. It can be maintained at or below 55°C. In one embodiment, the computer component 170 It can be maintained at approximately 60°C, approximately 50°C, approximately 40°C, approximately 35°C, or approximately 30°C. As the computer component 170 heats up, the heat flows through the liquid dielectric flow surrounding the component 170. It is transferred to body 140. When a liquid dielectric fluid reaches its boiling point, it transitions from the liquid phase to the gaseous phase. It will be transferred and rise from the liquid tank 142. Component 1 in the dielectric fluid tank 142 70 can be maintained roughly near the boiling point of the specific dielectric fluid 140 being used.

[0012] For a given application, the liquid dielectric fluid reaches its vaporization point at the pressure employed. When heated and turned into a gas, dielectric vapor bubbles rise from the liquid tank 142 into system 110 It rises to the top. Then, the steam is cooled to the condensation point using the condenser 130. Depending on the configuration of system 110, heating and cooling of the dielectric fluid from the liquid phase to the vapor phase and then to the liquid phase. The vent can generate convection as shown in Figure 2.

[0013] In one embodiment, the computer component 170 generates a liquid dielectric flow during the operation of the system. It will be completely immersed within body 140. In other words, computer component 170 The upper part is below the water level of the dielectric liquid 140. Heat is induced from the computer components. By changing the electrolytic fluid from a liquid phase to a gaseous phase, tiny bubbles of the dielectric fluid are incorporated into computer components. It should be clear that they will come into contact. Such components still have the dielectric properties of the liquid phase. It is considered to be completely immersed in the fluid. In one embodiment, the computer configuration Element 170 can be immersed in a liquid-phase dielectric fluid 140. In one exemplary embodiment, this is done Not limited to motherboards, chips, servers, cards, blades, GPUs, or CPUs. Computer components including any part of U and / or any peripheral components If any part is in direct contact with the liquid-phase dielectric fluid 140, the computer components It is considered to be immersed. In certain embodiments, the computer component 170 is Computer component 1 can be at least partially immersed in a liquid-phase dielectric fluid 140. If 70 is not immersed but is sufficiently cooled by dielectric vapor, the computer components It is considered to have been at least partially immersed.

[0014] In some existing immersion cooling systems, the fluid is constantly boiling, so the dielectric fluid It must be added to the fluid tank at all times. If the dielectric fluid is not added to tank 142, the tank The height of the dielectric fluid in 142 is such that the components are exposed to a gaseous atmosphere and not sufficiently cooled. It will drop until it becomes so. This will result in a decrease in the performance or damage of component 170. It is possible.

[0015] In one embodiment, the fluid management system is in a state relating to the dielectric fluid in its liquid state. There may be several operating modes to consider. These modes include (1) when the dielectric fluid is stored (1) Initial filling, which is the process transmitted from the system to the container, and (2) when additional fluid is added to the container. , or continuous leveling which is a process in which excess fluid is removed from the container, (3) fluid is removed from the container (4) The process of extraction is avoided and the fluid is placed in the storage system The process of continuous circulation of particles to ensure the removal of certain fine particles is called operational filtering. It may include 'g'.

[0016] In one embodiment, the first three liquid management challenges are addressed: initial filling, continuous leveling. And withdrawal can be achieved as a whole by the same set of piping, pumps, and valves. A dedicated tank for storing liquid refrigerant is undergoing vapor management treatment after new fluids have been added and the refrigerant has been removed. It can be used for storing excess fluid which is then recondensed. The set of pipes and pumps is During filling and leveling, the refrigerant (or dielectric fluid) is transported from the storage system to the container, and the withdrawal process is performed. It could be used in the story to transport items from a container to a storage system and back.

[0017] In one embodiment, the fourth of the liquid management challenges, namely the operational filter, The filtering can be achieved by a series of skimmers and / or filters. The first step is to filter the container It could be a large-particle filter located at the bottom. The purpose of this filter is to filter out particles that are too large in the subsequent stages. The second objective is to prevent particles that cannot be handled from entering the rest of the system. The stage is a medium particulate filter located inline in the piping system between the first and third stages. This is possible. This second-stage medium-particle filter is used because the first-stage filter is too small. These are fine particles that cannot be removed but are too large to be handled by the third-stage filter. A small barrel-shaped filter can be used for removal. The third stage filter is various It may consist of one or more parallel filters with supports for the filter configuration. One embodiment So, a specific type of filter performs fluid analysis after it has been exposed, and then positions within the container environment. By working together with the set of hardware components, it becomes specialized. By varying the hardware and / or components, the long lifespan and effectiveness of dielectric fluids can be improved. Different types of particulate matter may need to be filtered in order to guarantee the rate. It becomes easier to generate chemical substances.

[0018] Pressure management In general, immersion cooling fluids must be kept free from dust, water, and / or other contaminants. No. The computer component 170 is in direct contact with the immersion cooling fluid 140, so Even small contaminants can cause short circuits or damage to computer components. Furthermore, dielectric materials... Water or water vapor that can contaminate a fluid, as it becomes contaminated, the fluid, and not limited to this, However, it can reduce dielectric properties, including dielectric strength. In addition, computer components may be short-circuited or, even if not, damaged during operation. One way to reduce pollution is to maintain pressure slightly above or above atmospheric pressure. The objective is to operate an immersion cooling system within the enclosure.

[0019] As computer component 170 operates, the initial use of the computer component or Due to the heat generated, some of the dielectric fluid 140 vaporizes and turns into a gas. Immersion cooling system If it is contained within a substantially sealed housing, this vaporization is usually within the housing. To increase atmospheric pressure, pressure relief valves, expansion enclosures and / or other technologies are used. Limiting the increasing pressure and / or at atmospheric pressure or slightly above atmospheric pressure It can be used to maintain pressure within the enclosure. Maintaining the immersion cooling computing system is important to prevent dust, water vapor, or other contaminants from entering. It may help reduce intrusion.

[0020] The current embodiment is a sealed pressure control vessel 110 (or a cooled computing system Using 110), the computing components 170 and immersion cooling equipment, and related The power supply, network connections, wiring connections, etc. are enclosed within the pressure control vessel. In contrast, the pressure control vessel 110 is maintained in at least a slight vacuum, and thereafter Furthermore, to lower the boiling point of dielectric fluid 140 to a temperature below its boiling point at standard atmospheric pressure. It is possible.

[0021] By operating the computing and immersion cooling system under vacuum, the constituent elements Element 170 can be maintained at the lowered low-pressure boiling point of the dielectric fluid 140. This is more Electricity flows through various components 170, enabling greater component performance. It has advantages such as enhanced cooling. By controlling the pressure in the pressure control vessel 110 Therefore, since the boiling point of the dielectric fluid 140 can also be controlled, the same fluid 140 can be used in a wider range of applications. It can be used under the conditions of the surrounding environment. Many embodiments benefit from lower temperatures. However, certain computer components 170 have an ideal range, and temperatures below that range are acceptable. Then the performance will deteriorate. By controlling the pressure in the pressure control vessel 110, The boiling point of the immersion cooling fluid 140 can also be controlled. In certain embodiments, the pressure control system disclosed The system starts up, shuts down, or undergoes other changes. Depending on the conditions, it is used to dynamically control the pressure of the dielectric fluid 140 and, thereby, its boiling point. It's okay.

[0022] By operating in a pressure-controlled vessel 110 below atmospheric pressure, the boiling point of the dielectric fluid 140 is lowered. In addition to lowering the temperature, the computer component 170 itself generates heat more efficiently. It may be modified to transmit from and to the dielectric fluid 140. Liquid dielectric fluid 140 The component 170 exposed to the light, for example, by increasing the surface area of ​​the chip, Heat transfer between element 170 and tank 142 of dielectric fluid 140 can be increased by increasing the surface area. The example apparatus for this purpose may be a copper boiler or a copper disk, and it may also be a computer. The tip of the component 170 can be bonded to it. In a particular embodiment, the adhesive used is The choice will be based on its heat transfer capacity and solubility in dielectric cooling fluids. Suitable adhesives exhibit high thermal conductivity and low solubility in the selected dielectric fluid.

[0023] Figure 1 shows a schematic diagram of an exemplary embodiment of the disclosed computing system. The system embodiment includes a pressure control vessel 110 (or a cooled computing system 1) 10) Pressure controller 150, dielectric fluid 140 in at least a certain volume and condensation structure An immersion cooling system including object 130, and a desired computer component 170. The force system may be configured to maintain a desired degree of pressure reduction. The pressure control vessel 110 is , but not limited to, power, data, networking, cooling water and / or communication systems While allowing multiple penetrations into the pressure control vessel 110 for various connections including the system, It may be configured to maintain negative pressure. In one embodiment, an airtight and / or marine-grade seal is provided. Continue using the following. Operate the computing system in the pressure-controlled vessel 110 at below atmospheric pressure. Making this happen requires a series of changes to the system as a whole. This is described below, and some of it will be immediately obvious to those skilled in the art.

[0024] Figure 3 shows the external appearance of an exemplary embodiment of the pressure control vessel 110. In one embodiment, disclosure The pressure control vessel 110 is at least 2 feet high, at least 3 feet high, less Both are 4 feet or at least 5 feet high. In one embodiment, pressure control The container can be up to approximately 3 feet tall, 4 feet tall, or 5 feet tall. That is the case.

[0025] In certain embodiments, the pressure control vessel is at least about 100 cubic feet, at least Approximately 150 cubic feet, at least approximately 200 cubic feet, at least approximately 250 cubic feet , at least approximately 300 cubic feet, at least approximately 350 cubic feet or less It also has an internal volume of approximately 400 cubic feet.

[0026] In one embodiment, the pressure control vessel generates a fluid dielectric flow of approximately 12 inches vertically during operation. It is configured to contain dielectric fluid vapor in a body and vertical direction of approximately 36 inches. Specific implementation In this state, the ratio of gas volume to liquid volume generates convection, and the gas is in a condensation structure that returns vapor back to liquid. It helps to direct dielectric vapor. In one embodiment, the pressure control vessel, during operation, It is configured to contain a volume of liquid dielectric fluid in a ratio of approximately 1:6 to the volume of body dielectric fluid. In other embodiments, the pressure control vessel, during operation, is approximately 1 in relation to the volume of the gaseous dielectric fluid. Includes volume of liquid dielectric fluid in ratios of 3, approximately 1:5, approximately 1:8, approximately 1:10, or approximately 1:15. It is structured in such a way.

[0027] In one exemplary embodiment, the pressure management system may include a pressure controller 150. The force controller 150 can be a vacuum source; for example, the pressure controller 150 is a pressure control A vacuum pump may be connected to the container 110. In one embodiment, a vacuum pump 150 may be located remotely, and the vacuum can be delivered to the pressure control vessel 110 via piping. In a preferred embodiment, the pressure sensor 180 is included in the pressure control vessel 110, and pressure control It is used to adjust and / or maintain the desired negative pressure inside the container 110. In one embodiment, The pressure sensor 180 and / or pressure regulator 190 use the pressure sensor 180 to apply pressure The pressure in the force control container 110 is monitored and the pressure is adjusted using the pressure regulator 190. It may also be connected to a processor.

[0028] One embodiment includes an operator protection mechanism. In one exemplary embodiment, the operator protection The protection mechanism will activate if either the lid or service panel on the pressure control vessel is not in place. This could be a locking mechanism that prevents the stem from moving. In one exemplary embodiment, the operator The data protection mechanism immediately activates if one of the doors or panels of the pressure control vessel is illegally breached. It may include a controller that shuts off the system's power. A life-safe configuration must be provided. In addition, the operator protection mechanism is enhanced for deployments where sensitive data is contained within a container. A security configuration may be provided for operation. Normally, power to the system is not cut off. By ensuring that the device becomes inaccessible during operation, the disk protection mechanism is effective. A high level of assurance can be achieved in the rate-up. Furthermore, in one embodiment, The protection mechanism uses runtime-retained encryption keys to protect data stored on the pressure control vessel. It's okay to be there.

[0029] In certain embodiments, in addition to preventing unsafe access to the pressure control vessel, Sensors may be placed to verify that the system is operating as designed. The essential sensor packages include a temperature sensor for a steam environment, a temperature sensor for a liquid environment, This may include a humidity sensor in a steam space, and / or a pressure sensor in a steam space. These sensor readings are used to confirm that the system is operating safely and correctly. It may be monitored by software and / or human operators. In this embodiment, sensor data is recorded or later analyzed.

[0030] In one embodiment, additional sensors are included within the container or the superstructure (as defined below). Such sensors may be rare. For example, they can detect the leakage of dielectric fluid into the surrounding environment. A thermal imaging camera by FLIR, VESDA, or other form of smoke extraction camera designed for this purpose. This may include detectors and / or refrigerant leak detectors.

[0031] In one embodiment, the container and / or superstructure contains an indicator related to the operating status of the system. A dicate light may be equipped.

[0032] The cooled computing system 110 is also called the pressure controlled system 110. However, a person skilled in the art would say that not all of the cooled computing system 110 is cooled. However, it is recognized that many advantages can be achieved without using a "pressure-controlled system". ru.

[0033] Steam management system Immersion cooling systems can be operated in different ways. Some continuously supply the immersion fluid directly It can operate by cooling in contact with the liquid. Others require the liquid to reach its maximum liquidus temperature. It can operate by boiling it to create a vapor phase. The immersion cooling system that performs this operation is called a two-phase immersion cooling system. The two-phase immersion cooling system is a dielectric The fluid is boiled and / or vaporized, and additional fluid is regularly added to remove the fluid lost to the atmosphere. It is often replaced.

[0034] The embodiments of the disclosure utilize an immersion cooling system contained within a pressure control vessel 110. This has the effect of not losing the dielectric fluid 140 even after being converted into a gaseous form. It has the effect. In a sealed or substantially sealed pressure control vessel 110, the gaseous dielectric fluid is The liquid is condensed and actively used to cool the computing component 170. The dielectric fluid 140 will be added to the tank 142 and returned. The condensation step is, for example, This can be carried out in any appropriate manner by circulating treated water through heat conduction tubes. The structure 130 includes similar equipment that increases the surface area of ​​the heat dissipation fins and / or condenser. This may be the case, and this may allow for greater and / or faster condensation of gaseous dielectric fluids. And it returns to liquid form. In one embodiment, the treated water is at ambient temperature and actively It is not cooled. In other embodiments, the treated water is cooled by vaporization, drying, and / or treatment. The water can be cooled using other known methods in the art for cooling the water.

[0035] In one embodiment, there are two interfaces between the pressure control vessel and the external system. It is possible. The first interface could be a treated water supply interface. This is possible. The cooled treated water is supplied from the equipment to the distribution manifold on the pressure control vessel. It can be a pipe that reaches. The second interface is the treated water return interface. This could be a pipe that returns treated water to equipment that supplies cooled water. The treated water can be returned to the facility after flowing through the pressure control vessel and associated cooling components. The condensing components include, for example, a condenser, condensing coil and / or heat sink in the container, and, for example, a motor. Any powered component including the power supply, pump and / or utility cabinet It may include a coil to block heat from the exhaust. In one embodiment, the superstructure and the external system There may be two interfaces between the two. These interfaces are pressure control interfaces. The two interfaces between the device and the external system may be similar or substantially similar.

[0036] In one embodiment, the position of the condensation structure 130 within the pressure control vessel 110 is such that the vapor phase dielectric It may be configured to optimize the flow of a fluid to increase the rate and / or efficiency of condensation. In one embodiment, the geometric shape of the pressure control vessel 110 itself affects the rate and / or efficiency of condensation. It may be controlled to increase it.

[0037] As shown in Figures 1-3, in one exemplary embodiment, the pressure control vessel is approximately 10 feet in length. It is approximately 4 feet wide and 4 feet high. Tank 142 holds approximately 130 gallons. This can be formed inside the pressure control vessel 110 using ec(trademark) dielectric fluid 140. A layer of liquid dielectric fluid is left approximately 12 inches deep in the immersion cooling tank at the bottom of the pressure control vessel. On the other hand, the majority of the volume of the pressure control vessel is gas. The ceiling of the pressure control vessel has a vertically elongated structure. Lower than the center of the object. The top and / or lid 120 are angled upward and pressure control capacity It gets higher as it approaches the side wall of the vessel 110. The condensation structure 130 is of the pressure control vessel 110. It is elongated vertically on two sides. The condensed structure 130 in this exemplary embodiment is approximately 12 inches wide and high It is approximately 24 inches and extends substantially the entire length of the pressure control vessel 110. Condensation structure 130 This includes a heat sink made of a material with large surface area fins that is cooled using flowing water. Some embodiments may include additional or alternative heat exchangers.

[0038] As shown in Figure 2, the structural arrangement within the pressure control vessel 110 is such that after the dielectric fluid vapor boils As it rises from the liquid tank 142, the convection of the dielectric fluid vapor is directed. The structural arrangement is The convection is directed towards the ceiling of the pressure control vessel, where a large surface area condensation structure 13 The flow is directed towards 0 and recondensed into a liquid form. Then, the dielectric fluid 140 becomes liquid. It flows back into the body tank 142. In this embodiment, the total amount of dielectric fluid 140 is in this sealed housing. It can be held within the sing. By using convection to circulate dielectric fluid vapor, The embodiments of the disclosure can operate even without a mechanical pump for circulating the fluid. This will enable a reduction in the total energy consumption of the disclosed system.

[0039] In certain embodiments, the pressure control vessel must be opened and / or liquid dielectric To enable redundant and robust control of the fluid height, the system startup and / or Using additional tanks and / or storage containers for dielectric fluids that may be used during shutdown That's good too.

[0040] Figure 11 shows an exemplary cooling and steam management system 600 for a pressure control vessel 110. In this exemplary embodiment, the cooling and steam management system 600 controls the condensation of the dielectric fluid 140. It may include a storage section 611 for cooled treated water that passes through a cooling coil 132 to cause shrinkage. After passing through the cooling coil 132, the treated water may proceed to the treated water return storage section 612. The steam management system 600 also includes a steam storage tank 614 and a dielectric fluid storage tank. Tank 615 may be included. Tanks 614 and 615 may be included, for example, in the system as needed. During startup and / or shutdown, a dielectric fluid or vapor can be supplied. Example In one embodiment shown, tanks 614 and 615 are connected via a condensing structure 616. Alternatively, if there is a surplus supply of steam to tank 614, the condensing structure 616 removes the steam. It may be removed and added to the fluid storage tank 615 as a dielectric fluid.

[0041] In one embodiment, during operation, the pressure control vessel is maintained at approximately 3 psi below atmospheric pressure. This lowers the boiling point of dielectric fluids, thereby affecting computer chips and other components. It acts to lower the operating temperature. In one embodiment, the pressure control vessel 110 is exposed to the atmosphere At least approximately 2 psi lower than the pressure, at least approximately 4 psi lower, and at least approximately 6 psi lower. Keep it low, at least about 8 psi lower, or at least about 10 psi lower than atmospheric pressure. It can be done.

[0042] In one embodiment, a component having a certain degree of tolerance to pressure fluctuations is selected. This is necessary. By adjusting the operating pressure of the system, the boiling point of the refrigerant and its It can withstand a wide range of pressures, allowing for control over the approximate operating temperature of the entire system. It is preferable to use components. Considering the nature of operation of a two-phase system, a certain implementation The standard operating conditions for the configuration are a variation of ±4PSIg. System rapid startup. Alternatively, under certain conditions such as during shutdown, a difference of three additional PSIg may be obtained. In one embodiment, these variables are better controlled and more controlled and defined. System-level adjustments may be made to maintain the values ​​within a specified range.

[0043] In certain embodiments, the computer component 170 is at least about 3% higher than atmospheric pressure. Low pressure, pressure at least about 5% lower than atmospheric pressure, pressure at least about 10% lower, less At least approximately 15% lower pressure, at least approximately 20% lower pressure, at least approximately 25% lower pressure, Alternatively, it operates at a pressure at least approximately 30% lower.

[0044] In one embodiment, the pressure control vessel operates at less than approximately 750 torr and approximately 710 torr. Less than rr, less than approximately 650 torr, less than approximately 600 torr, less than approximately 550 torr, approximately 5 Maintain below 00 torr, approximately below 450 torr, approximately below 400 torr, or below that level. In one embodiment, the pressure control vessel is operated to a pressure of over approximately 650 torr and approximately 600 torr. over torr, over about 550 torr, over about 500 torr, over about 450 torr, about 400 It is maintained above torr or approximately above 300 torr.

[0045] One embodiment involves a vapor scrubbing process to control the gaseous atmosphere within a pressure control vessel. and / or utilize an initial purging process. This process involves removing the gaseous atmosphere from the pressure control vessel. Remove a portion of it, and remove undesirable parts of the atmosphere such as air and water vapor. These and Other undesirable parts of the atmosphere can be separated based on the temperature at which the vapor condenses into a liquid. Due to the specialized properties and boiling point of dielectric fluids, numerous naturally occurring pollutants are present in this manner. It can be removed using the law. Removing fluids that are not immediately condensable is a dielectric fluid. It acts to maintain purity. The fluid's condensation point is the dielectric fluid's condensation point at standard atmospheric pressure. If the temperature is more than approximately 20°C below the condensation point, or if the condensation point of the fluid is 10°C at standard atmospheric pressure. If it is less than [a certain value], it is not immediately considered condensable.

[0046] During maintenance, startup and / or shutdown operations, the pressure control vessel is opened and / Alternatively, to reduce the amount of dielectric fluid lost when exposed to atmospheric conditions, nitrogen gas is used. Any inert gas layer may be introduced into the pressure control vessel. As shown in Figure 11, cooling and The steam management system 600 may also include an inert gas tank 613, which is an inert gas By supplying a solvent, the loss of dielectric fluid can be reduced.

[0047] One embodiment of the disclosure is a substantially self-contained server and / or computing system. It may include a stem. In one embodiment, a specialized seal and / or connection is used for pressure control. This can be used to reduce the total number of penetrations into the device 110. In one embodiment, the system To minimize the possibility of leakage while under vacuum, the penetration into the pressure control vessel is minimized. It bundles power, water, vacuum, and networking connections into a series of lines.

[0048] Figure 4 illustrates an exemplary embodiment of a superstructure including multiple pressure control vessels. In this embodiment, two pressure control vessels 110 are pre-installed within a modular superstructure 210. The piping is pre-wired and housed. This allows the embodiment to be pre-fabricated and substantially It becomes possible to deliver the completed, self-contained system. Modular system It is to be connected to other modular embodiments of the computing system of the disclosure. It may be configured as follows. In one embodiment, the modular superstructure 210 is a single power connection It only requires a connection and supplies the necessary voltage to computer components and / or other electronic components. The appropriate electronic devices will be pre-wired.

[0049] Figure 5 shows an exemplary data center configuration illustrating multiple pressure control vessels connected to a central power supply. The configuration is illustrated. Figure 6 is an example data set showing multiple pressure control vessels connected in series. An embodiment of the terminal is shown. In these exemplary embodiments, the pressure control vessel 110 is located above It may or may not be placed within a structure.

[0050] Figures 7A-D show a cooled robot with an internal robot arm, airlock, and external robot arm. An illustrative embodiment of the computing system is shown. In this illustrative embodiment, To remove component 170 and transport the removed component to the airlock 220, pressure control The internal robot arm 230 contained within the container 110 may be used. Component 170 is Using the airlock 220, the pressure, atmosphere, dielectric fluid, and / or pressure control vessel 110 are controlled. Alternatively, it may be removed without substantially hindering or disturbing other conditions. When component 170 is removed from the pressure control vessel 110, the replacement component will replace the airlock 220. It can be introduced into the pressure control vessel 110 using this method. The replacement component is an internal robot. It can be installed by the 230. "Slot-in" blade servers and chassis. By using components that can be installed in the manner of ", this process is greatly simplified. obtain.

[0051] Disturbances to the conditions inside the pressure control vessel are detected by sensors located inside the pressure control vessel, for example, It can be detected by a pressure sensor. The disturbance is outside the standard range of operating conditions under those conditions. This can be indicated by a deviation of at least 10%. A large external difference to the conditions inside the pressure-controlled vessel. Randomness is indicated by a deviation of at least 30% outside the standard range of operating conditions under those conditions. obtain.

[0052] In a particular embodiment, a self-contained diagnostic system analyzes the performance of components within the pressure control vessel 110. The program may be executed if component 170 is not working as desired. The bot arm 230 is used to automatically remove and / or replace its components. In this embodiment, a self-healing, self-contained server and / or computing system A stem may be formed. In certain embodiments, such a self-healing system can be significantly improved. To supply efficient computing power, to ship to remote locations using conventional methods or It is prefabricated and prewired to form a modular unit that can be delivered, It requires only limited setup and / or maintenance.

[0053] In one embodiment, the vapor is cooled and condensed back from a gaseous state to a liquid state. The first steam management challenge was fully achieved within the vessel's closed system through the use of condensing coils. The treated water is piped through a condensation coil inside the container. The shape and geometry of the container itself The shape promotes the flow of steam from the tank region to the coil region, and gravity draws out the recondensed liquid. It acts to return to the tank area.

[0054] In one embodiment, a second steam management task is performed, which involves monitoring and maintaining the internal pressure of the container. The objective is achieved through the use of an integrated pressure sensor and a purge system within the container. In one embodiment, the purging system removes excess vapor from the container and stores it in a liquid storage tank. It is used to condense and return to a liquid state for storage in a refrigerator.

[0055] In one embodiment, non-condensable components of the steam present during system startup are controlled and removed. This third steam management challenge is achieved through the same mechanism as the second challenge. The system, during its initial startup, pressurizes the system and removes any non-condensable gases from the system. It can be used to remove bodily fluids.

[0056] In one embodiment, a fourth steam management challenge, which is to control the layering of inert gases, is addressed by a dedicated This can be achieved using a nitrogen overlay supply system. This overlay supplies the refrigerant from the top of the container to the bottom. Maintain this condition and minimize the loss of refrigerant during the period when the container is opened and its components are being repaired. This makes it possible. Dedicated nitrogen storage tanks are supplied through a set of dedicated multilayer pipes inside the container. The piping allows for the addition of an inert layer when the operator wishes to open the system. The gas, along with some other non-condensable substances, is a non-condensable substance that can occur during system startup. It may be removed during the quality removal process. The overall steam management process is controlled by user commands and the system. Managed and monitored through control system software based on condition monitoring. obtain.

[0057] Ballast block In one embodiment of the disclosed system, such as that shown in Figure 1, the pressure control vessel 110 is an induction vessel. A deep tank section 142 and a wide shelf area 112 adjacent to the tank are provided to contain most of the electrolytic fluid 140. May include: circuit boards, cards, chips, blades and / or any other computer configuration. Element 170 is substantially contained within the deep section 142 of the pressure control vessel 110. Wide shelf area 1 12 also includes a liquid dielectric fluid 140 and / or a dielectric that is recondensed from the vapor phase to the liquid phase. Fluid 140 can be collected. In a particular embodiment, dielectric liquid in pressure control vessel 110 The depth can be increased using ballast blocks 160. Ballast blocks 160 , used to occupy unnecessary volume on the shelf, and thereby, if it were not there on shelf 112 The existing dielectric liquid 140 is eliminated, and the liquid is produced without the need to add additional dielectric liquid 140. The water level can be raised. In one embodiment, the ballast block 160 is flow The condensed liquid flows into the deep section of the pressure control vessel without being obstructed by the ballast block 160. Allows the fluid to flow under the ballast block 160 so that it can continue to flow into it. Includes riser legs 161.

[0058] The ballast block 160 is made of any material that does not interfere with the operation of the disclosed immersion cooling system. Ballast blocks can consist of, but are not limited to, metal, rubber, and silicone. It may consist of a material containing and / or polymers. Preferred materials are substantially soluble in a dielectric fluid. It is not possible. The block must be denser than a dielectric fluid, but it does not have to be solid. It is not necessary. In a preferred embodiment, the block is made easier to handle and operate. It has a handle or notch that makes it possible to operate. The embodiment is an interlock type so that the blocks can be stacked on top of each other in a fixed manner. The top and bottom are used. The interlocking top and bottom allow the blocks to slide. Or, if the block deviates from its desired position, there is a risk that it will damage nearby components. To reduce. In one embodiment, the bottom block does not obstruct the fluid flow and has a large volume To occupy space, blocks are fixedly stacked on top of the bottom block, thereby allowing for large-scale additional construction. The water level of the dielectric liquid can rise without requiring the addition of any additional dielectric liquid. To enable this, the interlocking upper section has a recess on the bottom that aligns with the legs and / or risers. Includes the section.

[0059] In one embodiment, the ballast block 160 is connected to the pressure control vessel 110 and / or shelf 11 It is configured to extend along the entire length of 2. In other embodiments, the ballast block 160 is The lock can be of substantially any size that makes it handleable. Such embodiments So, multiple modular ballast blocks can be used to create large or small volumes as desired. It can be configured to eliminate. In one embodiment, one ballast block is approximately 2 feet, approximately 3 feet in length, approximately 4 feet or more in length, approximately 6 inches in width, approximately 8 inches in width Inch, width approximately 12 inches or more, and height approximately 1 inch, height approximately 3 inches, height approximately 6 inches It has external dimensions of approximately 8 inches or more in height.

[0060] superstructure The disclosed computing system consists of various components, all of which are shown in Figure 4. Thus, it can be attached directly or indirectly to the physical superstructure 210. 210 is any required electrical sensor, control, power, fluid control, pressure control and This enables pre-wiring and pre-piping of the communication system. This is faster and simpler. This enables on-site deployment and factory testing before delivery to customers.

[0061] The superstructure 210 is typically made from metal components, equipped with skids, or It may be configured to be handled by a forklift, hoist, or crane. In one embodiment, the superstructure 210 fits inside a standard container to facilitate shipping. It is configured to achieve this. The superstructure 210 and related components total approximately 58,000 liters. It is designed to weigh less than bs and facilitates shipping without requiring special equipment. It may be further divided into smaller components. In one embodiment, the upper structure 210 and The related components are less than approximately 50,000 lbs, less than approximately 40,000 lbs, and approximately 30,000 The weight is less than lbs or less than approximately 20,000 lbs. In one embodiment, the superstructure 2 10 and related components are approximately 5000 lbs or more, approximately 10000 lbs or more, approximately 20000 The weight is greater than lbs or approximately greater than 30,000 lbs. The embodiment of the superstructure 210 is optional. The size and / or shape may be such. Many embodiments include a plurality of pressure control vessels 110, - Barrack 310 and related immersion cooling equipment, as well as power transmission and distribution and network It is large enough to include the equipment necessary to manage the connection.

[0062] The overall design of the superstructure 210 was customized to meet the needs of the existing equipment. To adapt to the specific characteristics of each deployment, including the number of interconnections for electricity and treated water. It can be adjusted.

[0063] The control and management system for all components within the disclosed pressure control vessel is the control of the disclosed It may be included as part of a puteing system. A preferred embodiment of the disclosed system is: Required pumps, valves, regulators, steam management systems, pressure management systems and other related equipment The entire mechanical system necessary to maintain and operate a two-phase liquid immersion cooling environment, including its components. Includes te.

[0064] The superstructure 210 may have an open frame design, or side panels and access doors. It may also include A. This allows for deployment inside existing structures or outside the actual site. This becomes possible. The superstructure 210 may be modified to include a weather-resistant configuration, and in harsh environments. Deployment at the border becomes possible. In one embodiment, the superstructure is a skid / module. A framework is also acceptable.

[0065] Various systems, configurations and / or capabilities, other components of the pressure control vessel and pressure control vessel To support, monitor, and manage any environment contained within or associated with the vessel It may be included in the superstructure 210. In one embodiment, such a system may be other Among the many features, fire detection and / or suppression capabilities, dedicated air conditioning and / or environmental control This may include security configurations such as access control and / or monitoring configurations.

[0066] Power system One embodiment of a superstructure 210 accepts various means of electrical input and connects them to the superstructure Designed to connect to existing power distribution systems built within the structure. Numerous examples of implementation. One configuration involves a 415V input to the main breaker, which then receives an AC415V input. It is distributed to a series of power racks that convert to a DC12V output. In a preferred embodiment, this conversion is It is done in essentially one conversion step, thereby avoiding the loss that would normally occur with such conversions. Efficiency decreases. Conventional computer server locations are typically located near incoming industrial power This converts power from a high AC voltage such as 415V to a reduced AC voltage such as 120V. The conversion results in a loss of energy into heat. Under typical conditions, this is about 6% of energy. This can result in energy loss. And the 120V voltage is due to various computer components. For use, it must be further converted to DC current. This second conversion is energy This represents a second loss of approximately 6% from energy to heat. The industrial voltage of approximately 415V is converted to approximately DC12V. By directly converting to heat, the total loss from energy to heat can be reduced.

[0067] Another example of an embodiment is an AC480V input to a power rack that converts AC480V input to DC48V output. The connection includes an 80V input, and the DC48V output is then connected to the DC48V input, for example, 12 A series of relay power supplies that convert to various DC outputs including 5V, 3.5V, 3.3V and others. It is distributed to the source.

[0068] In one embodiment, there may be a single set of power supplies, or it may operate with different input and output voltages. There may be multiple power supplies. The exact configuration should suit the needs of the specific equipment being installed. The specific design of the power system is adjusted according to the application requirements. to suit the needs of the specific environment in which the disclosed computing system is deployed. It can be adjusted. Customization is possible for both the power input and output to the system. This may include type, capacity, and interface.

[0069] In one embodiment, the rack power distribution system is a modular power supply system and / or modular It may be equipped with a set of modular power systems. One or more modular power systems The specific configuration is as long as it can transmit the desired amount and type of power to the rack, in particular It is not important. Therefore, modular power systems use one, two, or even many distribution lines. They may be configured in parallel, series, or a combination thereof to provide a path to the rack. The specific path may be direct or indirect, and the components involved, the amount of electricity, and This often depends on the type and / or desired configuration. If desired, the route to the rack is... This may involve power distribution to the chassis located within the box. The distributed power is distributed to the configuration and components. It can be transmitted at one or more desired voltages, which may vary accordingly. In some cases, the desired voltage is , for example, may include 12V, 5V and / or 3.5V. In one embodiment, the chassis If adopted, it may employ one or more subsystems. The system allows any desired subsystem that does not interfere with the desired amount and type of power transmitted to the rack. It may include a system. For example, a power-on-package subsystem may be employed. Such packages can receive AC current and DC current, depending on the desired configuration. It can be converted to and / or vice versa. For example, a particularly useful power-on package The cage subsystems are AC208, 240, 380, 400, 415, 480 and / Alternatively, it can receive input power at 600 volts and convert that power directly to DC power, for example, DC 48V. It can be designed to be interchangeable.

[0070] One or more modular power supply systems supply directly or indirectly in any appropriate manner. It can be powered. For example, a modular power supply system can be powered via a main power distribution system within the chassis. It can be directly powered. Depending on the type and amount of power and other components, the chassis can be a set Using an interface such as a spring-loaded pin or other suitable connector interface An electrical continuity may be established between the power distribution route and the chassis itself. The interface connector and the desired server or other computer located on the chassis An established connection between any of the desired power input interfaces in the ting components. In one embodiment, the power-on-package module is odorless to the chassis itself. It may also be used within each chassis to directly convert the voltage to the appropriate level. It can be used for various types of power distribution, but it can be particularly useful, for example, in 48V power distribution. Figure 17 shows an exemplary embodiment of the rack distribution system 950. Rack 310 has AC input 96 at AC interface 311 of rack 310. It can receive 0. The power distribution system 950 generates DC output 320 and DC output 3 20 can be distributed to one or more chassis 400.

[0071] In one embodiment, reliable power is reliably supplied to computer components within a rack. The main concern is to achieve this. To that end, one embodiment uses a specific input voltage Blades capable of supplying the necessary output voltage to the blade and / or component level power supplies. A level power supply or a computer component level power supply is used. In one embodiment, redundancy is provided. To achieve this, each blade includes multiple power supplies.

[0072] In one embodiment, one or more switches may require power. The example switches are An appropriate interface that connects to the rack plane and provides rack-level communication to each blade. It may be a standard data center grade switch having a . One embodiment is one The voltage is distributed, and this forms the interface between the power rail and each of the blades. This can be achieved by power rails and interface systems with connectors, Directly to the source input rail, or between the power supply lead and the rack-level voltage distribution system. Voltage is transmitted through the relay connector that is placed there.

[0073] In one embodiment, there is one or more power rails that distribute the main voltage along the bottom of the rack. This is also acceptable. This rail is often located outside the pressure control vessel and may have one or more main power rails. It is supplied from the flow unit and transmitted to each rack via cables or a busbar system. By using higher voltages at the level, for example 48 volts, the distribution system will be able to The required current transport capacity is reduced, and the flow between the distribution rail and the load interface is made more efficient. Interface is possible.

[0074] In one embodiment, two main power distribution systems located within a superstructure platform Yes. The first main distribution system is the Primary Equipment Power System (PEPS), and the second main distribution system The system is a secondary equipment power system (SEPS). The purpose of PEPS is to provide electrical services. The objective is to provide a component within the container. This system uses copper conductors or busbars. It receives input via the system and processes it into the chassis, computer components and / or other important The main power supply is responsible for supplying the operating current to the load equipment, and transmits high voltage and high current to it. It could be a system. Power enters the upper structure at the specified point, and the master service disconnects. It is transmitted to the power company. All power redundant configurations used in electrical services and systems. The element is located upstream of this point. This input is, for example, AC 415 or 480 volts. This results in a high voltage. The main equipment load is supplied from the breaker panel downstream of the master disconnection breaker. It is powered by an electric power supply or rectifier.

[0075] The purpose of SEPS is to manage infrastructure support systems and components located within the superstructure. To provide electrical services to everything. It is required as part of the secondary equipment infrastructure. Since the components can assume lower input voltages, SEPS is a PEPS master service. Power is supplied by a step-down converter connected to the upstream side of the disconnection breaker via a secondary service disconnection. It is possible.

[0076] This configuration allows SEP to function even if the main power is not transmitted to the remaining system components. The superstructure support and infrastructure system, including all components powered by S, is turned ON. This enables the operation of all management and control systems and steam control systems. The mode may be configured to operate independently of the operation of PEPS.

[0077] In one embodiment, an uninterruptible power supply (UPS) is used as part of a power distribution system or as part of a power distribution system. In addition to the above, it is also included. By including a UPS, in the event of a temporary interruption to the external power supply... This will enable continuous operation of the disclosed computing system.

[0078] The components of the disclosed power distribution system are not limited to, but include, for example, an uninterruptible power supply, DC power systems, AC power systems and / or power control and monitoring systems It may include any commercially available component. Such components include, but are not limited to, for example, , Vertiv products such as Liebert and / or ChlorideUPS products, Du Lithium-based online UPS, line-interactive UPS, standby UPS, lithium This may include ion battery UPSs and combinations thereof. UPS products are single-phase or three-phase. Obtain. Other example power distribution system components include, for example, EmersonNetworkPo wer products, NetSureDC power systems, Vertiv, Liebert, Chl oride and / or NetSure distribution units, as well as, for example, inverters, rectifiers, It may include related components such as transfer switches and combinations thereof. Commercially available monitoring units, controller units and / or software are also available. This may be included in specific embodiments of the shown.

[0079] Pressure control vessel and pressure control system Embodiments of the disclosed system are pressure-sensitive and designed to accommodate a two-phase immersion cooling system. Includes a control vessel. The pressure control vessel 110 is a tank 142 of dielectric cooling fluid 140, gas phase dielectric A condenser 130 having a cooling coil 132 for condensing a fluid into a liquid, and a computer configuration The element 170 is held in place, and power is supplied from the power system to the equipment inside the pressure control vessel 110. Includes physical mechanisms and / or equipment necessary for distributing to the components.

[0080] During operation, the pressure control vessel 110 can be maintained at a slight vacuum. A variety of specialized connections for operating the computing system within the control container 110 It should become clear that further consideration is necessary.

[0081] One embodiment of the system in one disclosure involves passing through panels and cable trays to allow fibers to pass through. In addition to distributing to the 310, it also supports a series of optical fiber media transfer protocols (MTP). This interface enables the connection of a fiber to the pressure control vessel 110. The arrangement reduces the total number of penetrations into the pressure control vessel 110, thereby reducing the possibility of leakage in the vessel. Reduce.

[0082] One embodiment of the pressure control vessel 110 includes sensors to ensure safe operation. The sensor may, but is not limited to, use temperature to ensure and / or automate the operation of the system. Sensors, fluid height sensors, pressure sensors 180, gas partial pressure sensors, position sensors, electric sensors This may include a microphone and / or a camera.

[0083] In one exemplary embodiment, the temperature sensor is located inside the pressure control vessel 110, although this is not limited to the temperature sensor. A sensor for measuring the temperature of the gas phase, and a sensor for measuring the temperature of the liquid phase in a pressure control vessel. Sensors for measuring the temperature of water and / or other processing fluids, and / or It may include sensors for measuring the temperature of other components, including the computer component 170. In one embodiment, a thermocouple, thermistor, and / or a silicon sensor are used in a computer system. It can be used to measure the temperature of the constituent elements. In one embodiment, the system is used to measure the temperature of the constituent elements themselves Information provided by the body, and via APIs, HTTP, or SNMP provided by the device. Generally accepted interfaces for other programs such as JSON. The device temperature is determined based on information obtained or monitored through the use of a communication protocol. It may be determined.

[0084] One embodiment may include various life safety configurations that ensure user safety. These configurations are not limited to, but include automatic electromagnetic locking mechanisms, fail-safe systems, A fire and / or smoke detector and / or suppression system, a ventilation system, and / or may include backup lighting. In certain embodiments, these configurations may be included as part of an integrated platform.

[0085] Certain embodiments include an automatic vapor detection system leak detection system that ensures that any loss of fluid in a pressure control vessel is detected quickly. These systems monitor the pressure within the pressure control vessel 110 to confirm the absence of substantial leaks, and / or may include a gas sensor located outside the pressure control vessel that detects the presence of any dielectric vapor that may have leaked from the

[0086] The specific design, arrangement, and / or layout of embodiments of the disclosed systems may be adjusted based on the conditions under which they are deployed. In certain embodiments, the choices of size, materials, internal systems, component implementation <� and configuration, the interface between the pressure control vessel 110, computer components 170, and the power system may all be adjusted based on the conditions

[0087] Rack system Figures 8A - C show an exemplary embodiment of a rack system 310 (or rack 310). The rack 310 may act as an intermediary between an electrical and communication system installed within the pressure control vessel 110 and computing equipment 170 installed within the rack 310. The computer components 170 may be mounted on the rack 310 to control the spacing, orientation, position, and / or configuration of the computer In one embodiment, each computer component 170 is mounted in the pressure control vessel 110 before It can be installed on chassis 400.

[0088] Rack 310 includes, but is not limited to, frames, brackets, supports, or other structures. Any physical structure, including a manufacturing structure, that may be used to mount the computer component 170. It may be an object. Computer components 170 may be directly or indirectly connected to rack 310. When mounted on rack 310 and held in a substantially fixed position, It is considered to have been done. One embodiment is a dedicated mechanical guide plate as a mounting mechanism, bulk Wiring harness attached to the head fitting, and / or power and signal wiring This may include the use of relay power supplies distributed within the system and a backplane receiver 331.

[0089] The specific design of the rack system 310 is tailored based on the conditions under which the system will be deployed. Obtain. One embodiment of rack 310 may include a dedicated switch. In one embodiment, The drop link interface is connected via fiber infrastructure, and / or downlink The link access interface is the backplane receiver 331 interface or The computer in the rack is connected via any other suitable manner to the computing equipment. It can be connected to the mounting device 170.

[0090] In certain embodiments, the rack system 310 provides the appropriate voltage to the power interface. Housing for one or more relay power supplies that can be distributed to other equipment installed in rack 310 This may include [various types]. The interface that interconnects power from the distribution system to the relay power supply is [various types]. By disconnecting the interfaces between each rack, power, and communication system, Rack 3 is designed to allow for the removal and / or replacement with an alternative rack configuration. It may be included in the 10 designs.

[0091] Figure 8A shows a top view of rack 310. In this exemplary embodiment, rack 310 is Includes AC interface 311 and data interface 312. Rack 310 is This also includes a pair of power supplies, power supply 313 and redundant power supply 314 (or backup power supply). The 310 may also include a rectifier and controller. Redundant power supply 314 (and / or rectifier The equipment and controllers) will be repaired quickly if rack 310 is not properly maintained or if the main power supply is not properly maintained. (Allows the function to continue even when the function is stopped). Rack 310 is converter 315 It may selectively include. Rack 310 receives multiple chassis 400 and chassis 400 It is configured to be held in a substantially fixed position.

[0092] In one embodiment, the entire rack 310 may be immersed in a dielectric fluid. This is an operation This includes immersing the rectifier, power connection, and / or data connection in the dielectric liquid inside. It is possible. To reduce and / or eliminate plastic contamination of dielectric fluids, one embodiment In such embodiments, plastic insulation and / or cable sheathing may be eliminated. So the dielectric fluid covers the cables and / or connections that would otherwise have been exposed. It can act to insulate.

[0093] Figure 8B shows a perspective view of a rack 310 containing multiple chassis 400. The configuration facilitates the hot-swappability of the chassis 400. In this exemplary embodiment, The chassis 310 may include a plurality of AC cables 318 that connect an AC interface 311 to a power supply 313 and / or a redundant power supply 314. The power supply 313 and / or the redundant power supply 314 can generate a DC output 320 that can be transmitted to a backplane receiver 331 via a DC cable 321. The chassis 310 may also include a plurality of data cables 319 that connect a data interface 312 to the backplane receiver 331. The backplane receiver 331 can be used to supply data from a data connection portion on the bottom of the chassis 400 to a data connection portion at the top of the chassis. ... ... ... ... ... ...

[0094] FIG. 8C shows a side view of the chassis 310. In one embodiment, the chassis 310 provides mechanical stability and / or housing for the chassis 400 and its components. Further, the chassis 310 facilitates the routing of power cables and data cables from the top of the chassis 310, where the cables are generally accessible within the enclosure, to the bottom of the chassis 310 where the cables connect to the chassis 400.... ... ... ...

[0095] Chassis and interface system In one exemplary embodiment, the purpose of the disclosed chassis system 400 is to act as a standardized physical relay component between conventional and / or dedicated computing components 170 and the disclosed chassis system 310. In one exemplary embodiment, the purpose of the backplane receiver 331 is to provide a plug-in type interface between the chassis 400 and the chassis 310 to communicate with a power supply in a power system and a network switch in a communication system having various computing components 170 installed within the chassis 400. ... ... ... ... ... The purpose is to enable the distribution of power and signals between the switch and the other device.

[0096] In one embodiment, the pressure control vessel of the present disclosure includes one or more servers, for example, blade servers. It may include at least one rack 310 which may contain a server. Each server is a chassis 400 ( It can be mounted in a server case (also called a case). Figures 9A to G show various components. An exemplary embodiment of a chassis 400 for mounting the 170 is shown. The chassis is pressure control This can facilitate the installation of servers on racks or their removal from the system. In this embodiment, other electronic components of the pressure control vessel can be mounted on the chassis. For example, Computer components such as the motherboard, chip, card, GPU, or CPU Components or hardware can be installed in the chassis. Other examples include power supplies and power inputs. Components such as interfaces or network communication interfaces can be mounted on the chassis. It is Noh.

[0097] In one exemplary embodiment, the chassis is located between the components (e.g., a server) and the pressure control vessel. It can act as a common interface between them. The chassis is the property of the components. Alternatively, it can provide a variety of mount, power, and connectivity configurations that can be customized based on the design. In other words, various configurations of the chassis can be modified based on the design specifications of the components. Thus, the chassis can accommodate almost any model or type of hardware. It is possible. For example, the chassis can be made from specially designed hardware or off-the-shelf hardware. This can promote the use of software.

[0098] The chassis 400 embodiment involves the adaptation of existing commercially available components, and custom-designed components. Allows the use of chassis specialized for specific applications and / or for use in other applications. It may include components designed to do so. Embodiments include standard motherboards and special configuration components. It may include a suitable kit for the element. In certain embodiments, such components may be NVi Gigabyte motherboard with a Dia GPU and / or Intel CPU Includes ultra-compact motherboards.

[0099] Figure 9A shows a chassis 400 for mounting servers on a rack according to an exemplary embodiment. As shown, in this exemplary embodiment, the chassis 400 has a rear wall 410 and two side walls 420 It may be a rectangular box containing the rear wall 410, which facilitates the circulation of fluid within the chassis 400. It may include multiple holes 411 for advancement. The chassis 400 has guide rails 4 on each side wall 420. It may include 21.

[0100] Figure 9B shows several internal components of the chassis 400 according to an exemplary embodiment. In the exemplary embodiment, the rear wall 410 has been removed. Thus, Figure 9B shows the power supply module. Module 431, GPU module 432, CPU module 433 and interface The server 430 including card 434 is shown. In one exemplary embodiment, inside the chassis 400 The components are those used in a blade server, for example, CPU module 4. It may include 33 and a GPU module 432. Furthermore, the components inside the chassis 400 are , other components not conventionally included in the server, such as the power module 431 or It may include an interface card 434. The chassis 400 is a conventional air-cooled device. Since it doesn't require them, the Chassis 400 does not include fans or heatsinks within the chassis. Thus, the chassis is extremely thin for the computing power of the chassis. File.

[0101] Figure 9C shows a schematic diagram of the components within the chassis. In this exemplary embodiment, the server The motherboard 445, multiple power modules 431 and interface card 434, It is mounted on chassis 400. The storage device and / or other peripheral device components are also backpressed. The interface 330 and / or the power module and communication system module Both can be mounted on the Chassis 400.

[0102] For example, the onboard interface is designed so that one piece of hardware is fixed to the chassis. It is attached to or removable from the chassis. On the inner surface of the chassis 400 , components (e.g., motherboard, GPU, CPU, interface card and others) Measures may be taken to enable the related components to be mounted on the chassis. The solution is the mounted interface. The specific arrangement of the chassis system 400 is the chassis This will depend on the equipment and / or components that are mounted in the 400 and / or rack. One embodiment of the chassis 400 is a compatible mounting plate that can be used for mounting equipment. A set of standard mounting plates may be a common or frequently used configuration. It may also be used on elements.

[0103] The power and network interface modules within the chassis system 400 The elements of the design and form are based on the requirements and specifications of the specific components and / or user-specified equipment. It can be adjusted accordingly. For example, the chassis power subsystem can be adjusted to meet the needs of specific components. It can be modified to accommodate this. In other examples, the chassis size is 1 of any size. It can be designed to accommodate one piece of hardware. In yet another example, the chassis is Depending on the network connection card installed in the chassis, different networking options are available. It can be given. Due to these and other configurations of the chassis, the chassis is diverse The components can be accommodated. As a result, the assembly of these components of the pressure control vessel The process of removing and installing components can be simplified and therefore automated. For example, the chassis can be shaken. It may include a server, and the robot will place the chassis against the rack of the pressure control vessel. It can be easily installed or removed. In this way, the robot can break without human intervention. The dosing server can be removed and replaced, thereby minimizing human exposure to dielectric fluid. It is possible.

[0104] In one exemplary embodiment, the chassis has a microphone capable of communicating with the management system of the pressure control vessel. This may include a microcontroller. The microcontroller is located inside or outside the chassis. It can receive sensor data from various sensors. For example, the chassis It may include sensors to detect whether the server is properly positioned within the rack. If it can be connected to a rack, it will be placed appropriately inside the rack. The sensor is It is possible to determine whether the chassis is properly positioned within the rack. In this way, The sensor can transmit data to the microcontroller, and using that data, The microcontroller sends a signal indicating whether the chassis is properly positioned in the rack. It can be supplied to the management system.

[0105] In one embodiment, the microcontroller controls the components mounted within the chassis. It can be coupled to a switch that can turn the power on or off. The microcontroller It can receive power on or off signals from the management system, and responds to the reception of those signals. The microcontroller is a component, for example, a switch that powers the server on or off. A signal can be transmitted to it. In one exemplary embodiment, the microcontroller is operable The microcontroller can receive data from the server and manage this data. It can be relayed to the system. The operational data is an indicator of the server's important performance. Therefore, its performance can be demonstrated. The operational data includes the speed of the computation operation and the computation operation. This may include degradation, power consumption, circuit temperature, and system bandwidth.

[0106] In one exemplary embodiment, the microcontroller controls the electrical and communication equipment of the blade server. It can be monitored, managed, and controlled. For example, current (i.e., amperes) And the display of voltage and other indicators indicates that the system is capable of protecting itself, for example, overcurrent or current It will be monitored to ensure that there are no shortcomings in the countermeasures.

[0107] In one exemplary embodiment, the chassis is designed to allow a robot to grasp and remove it. It may include structures that can be made functional. For example, the chassis may have a front wall, a rear wall The chassis may be in the shape of a rectangular box with side walls. The chassis also includes a top wall and a bottom wall. It may be there. The upper wall of the chassis may have a plate that can be connected to the robot arm. This may include: Using this plate, the robotic arm can perform unloading and other handling operations. The plate can be gripped for operation.

[0108] In one exemplary embodiment, the chassis ensures proper arrangement and insertion of the chassis in the rack. It may include mechanical guide rails and positioning pins to ensure stability. The ru can be positioned on the side wall of the chassis.

[0109] In one exemplary embodiment, the chassis may include various configurations that facilitate fluid flow. Good. For example, the chassis is in the shape of a rectangular box with a front wall, a rear wall and side walls. The chassis may also include the top and bottom walls. In this example, the chassis walls are small. At least one may include fluid flow holes throughout the entire wall. For example, the back wall is , when the chassis is immersed in a liquid tank, it facilitates the flow of fluid into and out of the chassis. It may include multiple holes that can be penetrated.

[0110] In one exemplary embodiment, the chassis is removed from the liquid tank. It may include an opening to ensure that all fluid inside is discharged. For example, the rack It may be located in a liquid tank that cools the computer components held by the rack. To remove the bar, the robot grasps the chassis plate and removes the chassis from the rack. The chassis can be lifted (thereby removing the chassis from the liquid tank). Once removed from the tank, a certain amount of fluid may remain in the chassis. The chassis is pressure controlled. The bottom wall of the chassis ensures that the fluid can be reliably evacuated even if the container is not perfectly horizontal. It may include a notch or drain. The notch or drain is at the corner of the bottom wall. It could exist in the department.

[0111] In one exemplary embodiment, the chassis includes a power interface and / or a communication interface. It may include a face. The interface connects components mounted within the chassis. It can be electrically coupled to the buck and / or pressure control vessel. Power interface and The and / or communication interface may be located on the backplane, for example, within the chassis. The server mounted on the chassis connects to the chassis interface via various wires and cables. It can be connected. When the chassis is placed in a rack, the interface is in the rack (that is (and other interfaces connected to the backplane receiver and / or pressure control vessel) This allows for electrical coupling to the backplane. The electrical coupling between the server and the backplane receiver supplies power to the server. It can connect to a communication network inside or outside the pressure control vessel. The coupling between surfaces can occur automatically during the mechanical insertion of the chassis into the rack. Similarly, by removing the chassis from the rack, the rack and / or pressure control vessel can be removed from the server. It can be separated from it.

[0112] In one embodiment, the backplane interface 330 and the communication system interface By providing standardized interoperability via the interface, the data interface Minimizes the possibility of misconnections and reduces the need for troubleshooting connections. It is possible.

[0113] In certain embodiments, the chassis 400 has a standard power and network interface. Includes a set of components. The network interface is 1G on the device's motherboard. Alternatively, Cat6A or Cat7 compatible for connection to a 10G Ethernet interface. It may be in the form of an RJ45 interface. In such embodiments, the power interface The faceplate is a standard Mole for connecting standard motherboard and / or peripheral components. May include a set of X-style connectors.

[0114] In one exemplary embodiment, the pressure control vessel is for components installed within the system. It may include an internal database for storing information. The internal database may include pressure control capacity It can be a repository of components installed in a container. For example, an internal database is a system The system can store the configuration and model of each server and power supply installed within it. Since its components are replaced or swapped by, for example, a robot, the management system is internal The database can track changes and updates to the information stored there. The pressure control vessel It can also connect to external databases via a network.

[0115] In one exemplary embodiment, each chassis is represented, for example, as a barcode on the chassis. It may be associated with a unique serial number. The components are located within the chassis. In such cases, the specifications of the components (or the configuration and model of the components) are unique serial numbers. It can be associated and stored in an external database. Then the chassis is installed in the pressure control vessel. When this happens, the pressure control vessel searches for its unique serial number in an external database. The components can be referenced by and . For example, the robot arm is on the chassis The system can scan barcodes, and the management system uses barcodes to access external databases. It can be searched within the system. The management system retrieves data from an external database. The information can be used to update the internal database. Similarly, the chassis can control pressure. Once removed from the container, the robotic arm scans the barcode associated with the chassis. The management system can then determine that components mounted on the chassis are no longer part of the system. The internal database can be updated to indicate that it is not present.

[0116] In one exemplary embodiment, the chassis may include an RFID tag. The robotic arm may include a scanner capable of detecting RFID tags by emitting radio frequencies. While the to-arm is handling the chassis, the robot arm scoops the RFID tag. The device is then scanned, and its unique serial number is provided to the management system to update the internal database. It is possible.

[0117] In one exemplary embodiment, the chassis includes an identification plate which may include a user-specific asset identification number. This may include. This asset identification number is stored in association with the components mounted within the chassis. In one embodiment, the identification plate is configured to store an asset identification number. It could be a tip.

[0118] In one exemplary embodiment, the chassis includes a pump that enhances the flow of fluid within the chassis. To maximize heat exchange between the components within the chassis and the liquid tank, the chassis is designed to achieve this. It may include a pump capable of circulating fluid within the chassis and around its components. The pump is located in the chassis The fluid is drawn from various conduits spread around the perimeter and pushed out to the outside of the chassis. They can do one thing or the other.

[0119] In one exemplary embodiment, the chassis is used to dry the chassis and the components mounted thereon. Various conduits may be included around the chassis to allow it to be pulled out of the liquid tank. If this occurs, a predetermined amount of liquid may remain in the chassis or its components. - Induces airflow within or around the components to promote drying of the chassis and components. It may include various conduits that can do so. In one exemplary embodiment, the pressure control vessel is The chassis can be exposed to a gas flow before being delivered to the user. For example, The chassis may include an input pipe for receiving the gas flow and a pressure control vessel. It can supply gas flow through the input pipe.

[0120] Figure 9D shows the bottom wall 415 of the chassis 400 according to an exemplary embodiment. In this configuration, the bottom wall 415 has a power interface 416 and a communication interface 417 This may include the following. Figure 9D also shows the guide rail 421 on the side wall 420 of the chassis 400.

[0121] Figure 9E shows the upper wall 425 of the chassis 400 according to an exemplary embodiment. In this configuration, the upper wall 425 may include a plate 426 and a pair of handles 427. The tow arm can remove the chassis 400 using plate 426.

[0122] Figure 9F shows the side wall 420 of the chassis 400 according to an exemplary embodiment. In this configuration, the side wall 420 may include a guide rail 421. Figure 9F also shows the rear wall 410. The handle 427 and power interface 416 are shown.

[0123] Figure 9G shows an exploded view of the bottom drain hole 450 of the chassis 400 according to an exemplary embodiment. In this exemplary embodiment, the bottom drain hole 450 is located in the bottom wall 415, the side wall 420 and the back It can be placed at the corner of the wall surface 410.

[0124] Figures 10A to 10F show exemplary embodiments of the pressure control vessel 500. In particular, Figure 10A shows the vessel An exemplary embodiment of the equipment 500, for example, a 600KW skid, is shown. The exemplary embodiment is a motor. Includes a Joule-type skid. The container 500 facilitates the movement and transfer of the container 500 to the desired location. It may include multiple forklift tubes 514 that advance. The container 500 is powered and has communication inputs. The treated water from the force 511 and the treated water pipe 512 is received at the smallest penetration point through the container itself. These connections enable the sealed packaging of modular containers in data centers. It may be placed at the top of the container to facilitate this. In one embodiment, the connection is within the data center. To accommodate the vertical load of multiple modular containers, the front and / or sides of the container They may be arranged in a section. In one embodiment, the containers are stacked vertically on top of each other. It may be provided with vertical spacers to facilitate this. The vertical space is between containers Further space may be formed for connection, airflow and / or insulation. Containers can be stacked vertically. This allows for extremely high power densities to be achieved on a square-foot basis. In one embodiment, The container 500 receives input 511 and provides power and network connectivity to the container 500. It may include power and communication boxes configured to distribute power. Vessel 515 is vessel 500 A sealing lid 51 that can facilitate the addition of components to and / or the removal of components from container 500. It may include 5.

[0125] Figure 10B shows another view of the container 500. In one embodiment, without opening the container Stock of replacement components so that components can be replaced using a robotic system inside the container. The robot system may be stored inside container 500. It can be operated in such an embodiment. In such embodiments, if a component is damaged or requires repair, Replacement components are installed in the system, and components that are damaged or removed even if not damaged are removed. However, it can be stored in the cassette until it is full. At that point, it is removed. The cassette containing the components is removed from the container, and a new cassette with new replacement components is installed. A tortoise may be inserted into the container for future use. In one embodiment, the container disclosed is approximately It is 15 feet long, approximately 7 feet wide and approximately 10 feet high. In one embodiment, The system aims to achieve 600KW of computing power in an area of ​​approximately 150 square feet. It supplies power to the building.

[0126] In one embodiment, the container 500 may also include one or more bellows tanks 517. The tank 517 can be used to regulate the pressure inside the container. When the cooling and / or heating system is first activated, the expanded dielectric fluid will be released into the environment. To prevent loss and / or to avoid pressure buildup within the container, the bellows tank is oriented It may be kicked. In one embodiment, the bellows tank 517 contains about twice the amount of liquid dielectric fluid. It may be large enough to hold it inside the container.

[0127] Figure 10C shows a cross-sectional view of container 500. The lower part of container 500 is a computing structure. Rack 310 and / or chassis 400 containing constituent elements may include any dielectric vapor A condenser coil 132 for cooling and condensing is located on the rack. Power is supplied via the power busbar 518. The power may be distributed within the container using this method. This allows the power to be hot-swappable to individual units. It becomes possible to distribute to computing components via the power busbar 518. The container can receive external power through one or a few penetrations. This design simplifies the installation and operation of the container system. In one embodiment, each The power busbar can supply 600 amps to power five racks. In such an embodiment, there may be two sets of busbars, one set on each side of the container. In one embodiment, the busbar does not include a plastic insulator. It may be considered a contaminant of the dielectric fluid and, in some embodiments, is generally avoided. This will happen.

[0128] In one embodiment, the container 500 may contain a desiccant 519. In one embodiment, a dielectric The vapor is removed from the head space of the container 500, and any non-condensable component becomes dielectric flow It may be condensed in a manner that allows it to be removed from the body. Water is a dielectric fluid and Under the same conditions, condensation does not occur. In this way, this system removes water contaminants from the dielectric fluid. It can be used to leave.

[0129] In one embodiment, the container 500 includes a fluid filter 520, a fluid pipe 521 and a fluid port It may also contain pump 522. In one embodiment, the dielectric fluid is a liquid dielectric fluid. It may be added to the container in such a manner that it overflows from the 310 into the reservoir 523. The fluid is filtered using the fluid filter 520 and then pumped by the fluid pump 522 and the fluid pump The distal end of the container can be pumped using Ip521. This system is a new filter Because the pre-ringed dielectric fluid is circulated through the container, the dielectric fluid is used for computing It can be reused to cool the components.

[0130] Figure 10D shows a cross-sectional view of container 500. In this embodiment, the water level of the liquid dielectric fluid is , fluid height higher than the height of rack 310 and / or the computing components located therein It can be maintained at 524. As a result, rack 310 and / or computing configuration The elements will be immersed in a dielectric fluid. Saturated dielectric vapor will be at a fluid height of 524, for example. For example, it can exist up to an intermediate height of 525. In one embodiment, saturated dielectric vapor is at an intermediate height It is maintained up to 525, which can be about half the height of the condenser coil 132. In this state, a head space that can contain low-density dielectric vapor exists above the saturated vapor.

[0131] Communication system The embodiments of the disclosed communication system include the disclosed superstructure 210, pressure control vessel 110 and / or standard rules for equipment located within or associated with computing systems. It is designed to provide connectivity and management interfaces for earphones 1-3.

[0132] In one embodiment, a series of MTP interfaces comprises multiple high-density multimode filters. It provides a function to introduce the IBA connection into the pressure control vessel 110. Then, the fiber connection uses a dedicated breakout cable and a breakout interface. Using a set of patch panels and / or distribution patch panels to rack 310, It can be divided into switch-level connections.

[0133] One embodiment of the disclosed system is a switch installed therein via a short patch panel Each rack 310 has a dedicated fiber patch panel to enable connection to the system. It may include ports on the interface. In other embodiments, a dedicated patch panel The patch panel extending from each switch system to the MTP distribution interface It's okay to have a .

[0134] In one embodiment, the interface between the switch system and the chassis 400 is This may also be via the backplane interface 330 and / or the backplane This may involve the use of connectors or may not involve any other mechanism. In one embodiment, the relay rack-level switch system may be omitted. One embodiment involves pressure control to connect to various computing devices located there. A set of centralized switches inside container 110 can be used.

[0135] The standard interface between the switch system and the chassis 400 is rack 31. This is achieved using a patch panel attached to 0, and the ports on the patch panel are switched Wire to the Backplane System 330 with patch cables that connect to the appropriate ports on the stem. It is possible.

[0136] In one embodiment, the communication system cabinet is located in the MTP of each pressure control vessel 110. A small (6U) rack rail area including patch panels that interconnect to the interface, Furthermore, a centralized network that acts to interconnect the switch systems with each other and / or with the outside world. There is a signal system distribution switch. In such an embodiment, the end user or customer is They set up their own means of maneuvering within the space, and the disclosure computing system and the outside world To provide an external connection there that will serve as a connection between them, or to provide a pressure control vessel 110 or a higher structure Choose either to establish a fiber optic connection between the device 210 and the existing network environment. It is possible.

[0137] Access, communication and / or networking used within an embodiment of a communication system environment The components may be standard equipment or user-specified equipment. Rack 3 The 10 and backplane interface 330 system removes the existing switch. Replace it with some standard switch (such as a 1U switch) and the desired interface. By rewiring to the backplane network interface panel, each It may also include a function to replace the switch system located within the 310.

[0138] In certain embodiments, to directly interface with the backplane system 330 Products designed for this purpose may be used. Such products may utilize specialized, dedicated interconnect networks. via a network interface, via commercially used protocols, or via network Through the specifications for the design of the twerk level interconnection interface, chassis 400 Designed specifically to interconnect patch panel systems and / or switch ports. A direct electrical interface can be used.

[0139] In one embodiment, the connection between each blade or chassis and the switch is made of multiple interfaces - May include a face. One interface is available on a commercially available switch. It can be a standard switch port that can be a standard port. Common interface This utilizes a 1GBA connection with Cat6 or Cat7 stranded-to-copper wire between the switch and the host device. It can be SE-T or 10GBASE-T. Other interfaces are standard switch ports. A patch panel with a standard patch cable running from the front to the front of the patch panel and Hard wiring connection from the back of the patch panel to the signal interface of the signal backplane. It may also be a switch-backplane relay device consisting of any of the following sets. Alternatively, this establishes a connection between a standard switch port and a backplane. Specialized cable and / or standard RJ45 interface from the switch port to the board It can consist of faces. Furthermore, other interfaces can route the signal path through standard switch ports or Interface system signal backing distributed along the printed circuit board (PCB) It can become a lane. One or more signal paths are connected to a signal backplane interface. The PCB may be terminated with a connector. Further interfaces may be sha A signal backplane interface may also be used. This is an interface interface. A connector located on the chassis itself that mates with the stem signal backplane. It may also be a ta. It is an interface system signal backplane and chassis self It serves as an interface between bodies. Another interface is the chassis network. It could be a chassis network interface. This is from the chassis network interface. Patch cables for RJ45 interfaces in chassis-mounted servers It could be a standard patch interface that enables connection.

[0140] Robot system In one embodiment of the system disclosed, hot swap of components within a pressure control vessel 110 This demonstrates a promising method to address the need for precision. It shows how to remotely remove the faulty component 170. The need for replacement functions can be addressed by robots.

[0141] A particular embodiment of the combination of systems disclosed includes an internal robot arm 230 and / or an external robot arm 230. It may include a robotic arm 240. Cryptocurrency applications and / or specific high performance Some embodiments, such as embodiments for computing environments, involve hot swaging of components. This may require high performance. In other hyperscale GPU and CPU environments, this This can be a basic requirement. Embodiments of the robotic system disclosed may not be any other component. This also allows for the replacement of the chassis and / or other computer components without interruption. In one embodiment, a failed card and / or component is automatically and / or programmed It can be exchanged and / or stored by the system. This allows for a short period of time for the embodiments of the disclosed system. This also enables fully remote and autonomous operation for a moderate period of time.

[0142] The mechanism of the internal robot arm 230 is located within the environment of the pressure control vessel 110. Figure 7A As shown in ~D, in the exemplary embodiment, if the card or component is not functioning properly... In conjunction, the removal sequence may be initiated. When the removal sequence is initiated, the internal arm 230 The appropriate computer components 170 and / or associated chassis 400 are mounted in a rack 310. Then remove it and move it to the airlock 220 located inside the pressure control vessel 110, and remove the Signals completion of the sequence. Once this sequence is complete, the inner airlock door will open. When 222 closes, the airlock pressure is equal to the outside air pressure, and the external airlock door 22 Door 4 opens. When the external door 224 opens, the external robot arm 240 moves to chassis 4 Remove 00 from airlock 220 and place it in an empty storage slot.

[0143] In one embodiment, before the airlock 220 is opened to the external environment, the airlock 220 It is purged with nitrogen, other inert gases and / or non-condensable gases. In one embodiment, This has the effect of reducing or eliminating the loss of dielectric vapor when the airlock is opened and closed. In certain embodiments, the airlock is aligned with a one-way valve internally, externally, or both. In an embodiment where a one-way valve is provided both inside and outside the airlock, the airlock By purging, cross-contamination of the internal atmosphere of the pressure control vessel 110 by the external environment is prevented. This also prevents the loss of dielectric vapor.

[0144] When a card or component exchange sequence is initiated, the external robot arm 240 will exchange Remove the replacement components and / or chassis 400 from the storage slot and place the components in the airlock. Place it at 220. Once complete, the outer airlock door 224 will close and the airlock pressure will be The internal pressure of the pressure control vessel 110 is equalized, and the inner door 222 is opened. When released, the internal robotic arm 230 moves the chassis 400 out of the airlock 220. Remove it and insert it into the appropriate rack 310.

[0145] When combined with a remotely accessible management system, the internal and external robotic arms 23 0 and 240 enable remote operation and management of data center environments. This allows for human intervention. This reduces the need for operators to be on standby, and also reduces costs and / or downtime. It is possible. In one embodiment, the external robot arm 240 is mounted on a movable base, As a result, one external robotic arm system is disclosed as part of the computing system. This enables it to operate as multiple embodiments.

[0146] When integrated with custom development workflow management systems and virtualization technologies, the robot of disclosure The system is fully autonomous and self-healing, which can provide the highest level of system reliability. This enables the development of therapeutic data center solutions.

[0147] In one embodiment, a unique human- and / or machine-readable serial number and / or product code are used. Asset tags with a tick code are included in each computer component and / or chassis. In these embodiments, the asset tag may be a unique serial number. The tags include printed barcodes or QR codes, and in the embodiments of the disclosed robotic system This may enable automated part identification. The tag code is detailed in relation to inventory management and automation systems. It may be used in relation to a management software system that provides detailed component information. The adhesive and any related adhesives or other components are preferably made of a material compatible with dielectric fluids. It consists of materials. The tag is preferably readable when the chassis is inserted into the rack. In the pot, it is located on the chassis. In one embodiment, a secondary or additional tag is, Even if located in other areas of the chassis to help identify components and / or inventory management good.

[0148] The embodiments of the disclosed robotic system include the temporary removal and This allows for a process called "reinstallation," which involves replacement. This is useful when it is determined that a hard power cycle of the components is desired. Reinstallation is This is achieved by shutting off all power, temporarily putting it into standby mode, and then reconnecting it.

[0149] In one embodiment, individual cards and / or chassis are connected to a pressure control vessel via an airlock. This makes it possible to remove from the rack. In one embodiment, the robot system is located in the rack. Remove the chassis from that slot, move it to the airlock, and the airlock will open. The completion of this task, which allows the card and / or chassis to be removed, signals the completion of this task. In one embodiment, the components are replaced through the same airlock used during removal. and / or enables the chassis to be placed in a specific rack slot. In this state, the robotic system removes the chassis from the airlock and then loads it into the appropriate lux. Place it in the lot and signal the completion of this task.

[0150] Robots in the internal systems Embodiments of the disclosed system may include a “robot internal” robotic system. In one embodiment, the pressure control vessel is used to house a robotic arm operating within the vessel. It may be expanded. The container is a rack containing computer components that are in operation. They may be arranged to accommodate the movement or transport of the tuner components and / or chassis. It can be seen that pressure-controlled vessels are sometimes also called tanks, pods, and / or vacuum chambers. It should be. Or, a specific component of a pressure control vessel can be called a tank or pod. You should be able to figure something out.

[0151] Figure 10E shows a computing component, for example, a chassis 400 in rack 310. Disclosure having a gantry robot 526 configured to remove, replace and / or install An embodiment of the system is illustrated. In one embodiment, the gantry robot 526 is distributed To remove, replace and / or install DC rectifiers and / or other components of an electrical system. It may be configured as follows. Some embodiments of the computer components and power distribution components of the disclosure are It may be designed to be hot-swappable, and the gantry robot 526 It should be clear that it may include a handle or other configuration to facilitate the handling. In one embodiment, the gantry robot 526 moves in both the x and y directions. It is positioned and can be lowered in the z direction to remove and / or install replacement components. In one embodiment, the gantry robot 526 holds the chassis 400 and / or power supply. It is equipped with a gripping tool, for example, the gripping tool can grip plate 426.

[0152] Figure 10E shows an upper cross-sectional view of an exemplary embodiment of the tank of disclosure. In one embodiment, The 310 array is mounted on the chassis 400 and / or computing board. This is also good. In one embodiment, each chassis 400 utilizes approximately 6KW of power, and each rack 31 0 can contain 10 chassis. This means that 10 such racks 310 can be included. In this embodiment, the container can utilize approximately 600 kW of power for computing. In one embodiment, additional racks 310 and / or magazines 527 of the chassis 400. Furthermore, a DC power rectifier is housed in the container 500 and used as a replacement component and / or A space may be provided for storing components removed from container 500.

[0153] External system robots Figures 12A to E show other embodiments of the container. In particular, Figure 12A shows the chassis 400 and / or a gantry robot outside the tank 710 housing the computing components An embodiment of the container 700 in which 526 exists is shown. In this embodiment, the tank 710 is , smaller, but the external gantry robot 526 is located inside the tank 710 chassis 400 And / or to access the power supply, it needs to be opened more frequently. Also, the exchange The container is located within a modular enclosure such as a storage unit 716 outside the tank 710. It may be stored and / or housed. In one embodiment, the tank 710 has multiple doors 711 It may have, thereby allowing for the removal, installation and / or removal of components or chassis 400. To limit exposure of the interior of the tank 710 when one door 711 is opened for the purpose of replacement. This is possible. In such embodiments, the replacement component does not unnecessarily open the tank. To avoid this, it may be stored outside of tank 710.

[0154] Furthermore, the container 700 includes one or more transformers 712, power distribution panels 713, and treated water pipes 5. 12 and may include an electric chase 714. The container 700 is used to measure the state of various devices inside the container 700. A programmable logic controller (PLC) cabinet that monitors and controls the state This may also include the 715. Transformer 712, distribution panel 713, treated water pipe 512, electrical Even though the chase 714 and PLC cabinet 715 are located outside the tank 710 good.

[0155] Figure 12B shows the container 70 in which the tank 710 can access the external gantry robot 526. A cross-sectional view of part 0 is shown. In this exemplary embodiment, the condenser coil 132, rack 310 and bell Rose 717 is located in tank 710. Figure 12C shows the external gantry robot and multiple A side view of a container 700 having a tank 710 with a number of doors 711 is shown. In this configuration, the tank 710 removes the fluid from the storage area and passes the fluid to the fluid filter 520. Includes a fluid pump for dispensing through the fluid pipe 521. The container 700 is a replacement equipment. It also includes a magazine 718 for storage. In this exemplary embodiment, the magazine 718 is a tank It is located outside of tank 710. In one embodiment, the liquid dielectric fluid in tank 710 Even if spacers and / or ballast blocks 160 are used to reduce the total volume good.

[0156] Figure 12D shows rack 310 according to an exemplary embodiment. In one embodiment, redundant power supplies 314 may be located on the opposite side of rack 310, rather than adjacent to the primary power supply 313. Furthermore, power and / or data cables 318 and 319 are specific requirements for the particular deployment. To adapt, alternative configurations may be used. In this exemplary embodiment, The Cuplein receiver 331 is located at the bottom of rack 310.

[0157] Figure 12E shows an exemplary hinged door that may be used in an alternative embodiment of the tank 710 of the disclosure. 711 is shown. In one embodiment, to reduce or avoid induced current in dielectric vapor Instead of hinged doors, sliding doors may be used. Slowly slide the door. To open it is comparable to swinging open a hinged door to generate a mixed current. All fluctuations in dielectric vapor will be reduced.

[0158] Management System The management system discloses the users and computing systems of the computing system. It is a web interface between the system itself and the system. An embodiment of the management system is: The computing system provides an operational display, and the pressure control vessel 110 and robotic system Various systems, including systems, communication systems, power systems and / or other systems and components. It enables monitoring and management of components. In one exemplary embodiment, the management system is This can be implemented in the PLC cabinet 715 shown in Figure 12A. In other exemplary embodiments, The management system may be implemented in the power and communication box 513 shown in Figure 10A. In the implementation configuration, the power management system is a control device or other suitable device, for example, a computer It can be implemented as a software program on a computer.

[0159] In certain embodiments, data points accessible via a simple network management protocol The set of components monitors key operating parameters via a third-party monitoring system. The management system may be made available to users to enable ringing. Full operation log This may be retained, and the chart may be provided for user updates of operating condition data.

[0160] Regular maintenance of system components is scheduled and maintained via the management system. It is also possible that users may be given regular reminders for scheduled maintenance. The system can recognize this as something being executed within an interface. All data can be retained as part of the operation log information for reviewing historical operations.

[0161] In one embodiment, the operational function is remote to the computing system and related components. API interface to enable remote monitoring and management. It may be made public via [a certain method]. To enable notification to the operator in case of any problems. This may include a complete set of operational monitoring and warning functions.

[0162] Centralized server version or hosted cloud-based management version The management system utilizes multiple pressure control vessel computing systems to benefit customers. It can be used. This is a single unit for managing a group of pressure control vessel computing systems. A program provides the operator with a user-accessible interface.

[0163] In one embodiment, the software-based interface module is Micro Compilation software such as System Center and VMWare VCenter Enables interoperability with the routing platform and third-party management utilities. The API interface provided by the user and management system is disclosed by the robot. Enables complete interoperability with the computing platform and discloses the computing platform This enables completely remote and programmable autonomous operation and management of the system.

[0164] In one embodiment, the control system includes operations such as temperature, pressure, flow rate, and / or power management. This enables adjustment and control of. In one embodiment, the user authentication system has multiple unique Allows users to be authenticated to the system. One embodiment is role-based and / or This includes an element-based authorization system. In such embodiments, the administrator can determine if a user is related Multiple roles can be assigned, and / or specific permissions can be granted to individual users outside of their role assignments. It can be applied to the system.

[0165] One embodiment describes video input from a camera that may be located inside the container and / or a superstructure. To provide the user with the function to record and acquire video, video management is included. In one embodiment, a camera In such an embodiment, the system can acquire visible data that can be analyzed by the processor. The processor then processes the container, robot and / or higher structure according to the acquired visual data. Computer vision technology may be used to control the operation of the system.

[0166] In one embodiment, the control system and software are provided by the disclosed computing platform The operation and state of the entire system, individual subsystems, and / or components of the platform. It can be configured to generate reports related to this.

[0167] Example of a merger system It should be understood that the disclosure systems may be used individually or in combination. Numerous embodiments of merged computing systems that can be adapted to various use cases be.

[0168] One exemplary embodiment is the Crypto series, which is a dedicated computing system. Hardware, guide plates and wiring harnesses designed for that hardware A modified architecture of a rack 310, a communication system 360, and 1MW This is an ultra-high-density embodiment of the disclosed technology utilizing a pressure control vessel 110 and a power distribution system. A typical user of this embodiment uses customized computing components. Those who wish to perform cryptocurrency mining or other ultra-high power density processing, The computer hopes to develop a full two-phase liquid immersion cooling system, including its own hardware. They are a manufacturer of coating components.

[0169] Another exemplary embodiment is a series of GPUs, which are high-density GPUs of the technology of this disclosure. This is an example of supercomputing. This example demonstrates ultrafast GPU communication. Gigabyte motherboards utilize Nvidia NVLink technology to enhance the GPU. A custom-made chassis 400 designed to include the board and an NVidia GPU. This technology utilizes Rack 310 and Backplane Interface 330. Typical users include those involved in graphic rendering, particle simulation, and general research activities. General-purpose parallel processing that can utilize GPU-based computing and memory capabilities. Includes applications.

[0170] Another exemplary embodiment is a series of CPUs. This is a high-density CPU of the technology of the disclosure. This is an example of PU computing. This example uses a high-end Supermicro o-based motherboard, Intel Xeon CPU, high-speed network interface It utilizes semiconductor memory devices for the face, high-speed memory, and local storage. Typical users of the technology are those using it for their own internal applications or for third-party customer use. Data centers that utilize high-performance computing for purposes such as providing services to other organizations. This includes enterprises and cloud / VPS hosting providers and service providers.

[0171] Further exemplary embodiments include the Edge series, which is designed for remote / field deployment. or specifically set up within or in conjunction with conventional business and data center environments. This is a scaled-down version of the computing system described in the disclosure. The embodiment is This technology is specialized for safe, weather-resistant environments with complete remote monitoring and management capabilities. The target users of this technique include network operators and other organizations with distributed field infrastructure. The field deployment and distributed technology operators, as well as minimal changes to existing facilities or structures. Furthermore, they will become operators of existing facilities who wish to further enhance their computing capabilities. This system incorporates various extensions into its external structure, including electricity, water, and networking. This can simplify the connection to the system for utility services, including connectivity.

[0172] Self-contained implementation One embodiment of the disclosure does not require an external water source. Such an embodiment does not require an external water source. A closed-loop chiller for cooling water or other fluids that can be circulated through a condenser, as shown above. It is possible. By using a closed-loop chiller instead of an external cooling water supply source, it can be practically self-sufficient. This enables various configurations of the binding type.

[0173] Figure 13 shows an exemplary self-contained container 750. The exemplary embodiment in Figure 13 is a pod or This is a skid tower for cooling the water or other liquid used in the condenser within the immersion tank 710. A mounted closed-loop chiller 719 is used. By using a closed-loop chiller, external... This eliminates the need for a cooling water supply source, and in order to be fully operational, an external power supply and a net are required. This will be a self-contained data center solution that only requires network connectivity. Container 7 50 includes bellows 717, door 711, gantry robot 526, power distribution panel 713, This may also include the PLC cabinet 715 and magazine 718.

[0174] In one embodiment, the closed-loop chiller 719 is located outside the modular pressure control vessel. It may be a skid-mounted closed-loop chiller enclosed within a ring. In such an embodiment, Heat is transferred from the computer components to the dielectric liquid in tank 710. This converts dielectric liquids into dielectric vapors, as described here. Dielectric vapors are stored in tanks. It rises within 710, is cooled by the condenser, and thereby converts the dielectric vapor into dielectric liquid. It returns to the body. Then, the heat transferred from the dielectric vapor to the condenser is transferred from the condenser to the refrigerant within the condenser. Alternatively, it is transmitted to the condensing fluid and then to the closed-loop chiller 719. In one embodiment, Chiller 719 is a vapor compressor, compressor, evaporator, heat exchanger, or refrigerant or condensed fluid. Remove heat from the refrigerant or condensing fluid using other closed-loop methods for cooling. The heat from the fluid is ultimately dissipated through air cooling. In one embodiment, this is self This will be a self-contained, modular, air-cooled, two-phase immersion computing system. (In the field of immersion cooling) Since the opposite has generally been taught regarding air cooling, especially for self-contained devices, The air cooling of this self-contained embodiment is remarkable.

[0175] One embodiment of the disclosure may be provided as a form element with a space-saving installation range. Exemplary implementation The configuration is a single unit containing 10 blades or servers immersed in a dielectric liquid as described above. It is equipped with a rack. In one embodiment, each server can draw approximately 6 kW of power. Therefore, it provides approximately 60kW of computer power in a small installation area.

[0176] The exemplary embodiment shown in Figure 13 is approximately 4 feet 2 inches deep and 8 feet 8.5 inches wide. It is included within a range of inches and a height of approximately 8 feet 8 inches. This exemplary embodiment is approximately Equipped with 60kW of computer power and other operating components and systems, it covers approximately 36.3 square meters. It is included in the area of ​​one foot. The operating components of the container are not limited to this, but the computer Tank or pod including dielectric fluid, condenser, power supply and data connection for data components It should be clear that this may include: sensors, control equipment, power cabinets, etc. Rose 717, vacuum systems, fluid filters, purge systems and / or other components It may be provided. One self-contained embodiment may include an external housing. In one embodiment, The outer housing encloses the container, provides structural support, and is skid-mountable. It may be ventilated, weather-resistant and / or water-resistant, and / or decorative. In the configuration, the outer housing of the self-contained container consists of a heat sink coil, fan grate, and heat transfer device. The components may include air-cooling components to facilitate the use of the closed-loop chiller.

[0177] In one embodiment, a self-contained computing system per square foot At least approximately 1.5 kW, at least approximately 1.6 kW per square foot, per square foot At least approximately 1.65 kW per square foot, at least approximately 1.8 kW per square foot At least approximately 2.0 kW per tee, or at least approximately 3.0 kW per square foot. It supplies computing power to a self-contained computing system. The system delivers a maximum of approximately 1.5 kW per square foot, and a maximum of... Approximately 1.6kW, with a maximum of approximately 1.65kW per square foot, with a maximum of approximately 1.8kW, up to approximately 2.0kW per square foot, or up to approximately It supplies 3.0kW of computing power. The height of the self-contained system is adjustable. This allows for the supply of more or less computing power within a given installation range. It should become clear that this will enable the use of power.

[0178] The dimensions, components, arrangement and configuration of the exemplary embodiments of the disclosure are diverse in their form elements. It can be seen that it may be modified, added to, and / or deleted to generate such potential embodiments. It should be.

[0179] In one embodiment, a self-contained computing system is, for example, a blade server. B, remove, replace and / or install the power supply or other components, for example, chassis 400. It may be equipped with a robotic system such as a gantry robot 526 configured in such a way. Self-contained The system type is either an "internal robot" or an "external robot" It can be provided. In embodiments with a smaller installation range, a smaller magazine 7 of the replacement components. 18 may be used. In one embodiment, the magazine 718 of the replacement components is shown in Figure 13. It may be attached to the outside of the tank 710. In one embodiment, the tank 710, The computer components, power supply, replacement magazine 718 and gantry robot 526 are The gantry robot 526 removes and replaces components while moving in virtually only one direction. They can be arranged so that they can be installed. When the various components are arranged in a substantially linear fashion, The gantry robot 526 removes and replaces the desired component without moving in the second direction. And / or it becomes possible to move along a single axis for installation. Gantry robot 526 In addition to moving in a single linear direction, it may also be possible to raise and lower its components. It should be possible.

[0180] By utilizing small elements such as those shown in the embodiment in Figure 13, a self-contained 2PL can be created. The IC system can be easily transported. This includes a closed-loop chiller 719. Therefore, a two-phase immersion cooling system cannot have access to a practical source of the water to be cooled. It can be used in remote conditions. Furthermore, it does not require external cooling water. In one embodiment, only two external connections, one power supply, and one data connection are required. A self-contained computing system is formed.

[0181] In one embodiment, the computing system is located in an external housing as shown in Figure 14. It may be included within the g. In one embodiment, it is schematically identified in Figure 13 and / or here The components disclosed may be included within the outer housing. In one embodiment, the outer housing The volume of the cooling system depends on the expected cooling requirements, the configuration of the closed-loop chiller, and / or the self-contained type. It can be adapted based on the environment in which the computing system is expected to be deployed.

[0182] The disclosed self-contained, self-healing, and small form element embodiments are large computing Used as a standalone solution that provides capabilities in virtually any location or environment. It is possible. In some applications, multiple small computing systems interact with each other. They may be located nearby and / or linked together to form a cluster. In one embodiment, The outer housing allows access to only one or two sides of the outer housing for maintenance and It is positioned to allow for the performance and / or service work to be carried out. The number of individual self-contained computing systems decreased among the self-contained systems. Alternatively, it becomes possible to place them at the minimum distance.

[0183] In one exemplary embodiment, four classes of exemplary self-contained computing systems are presented. The system has a self-contained computer with approximately 240kW of power in an installation area of ​​approximately 140 square feet. They can be strategically positioned to enable power. In one embodiment, these units They may be in a state of power and / or data communication with each other, thereby forming a single external power connection. This also enables the operation of a multi-unit cluster with only a single data connection. In this configuration, the data center comprises multiple small computing systems or such systems. This can be established using multiple clusters of computing systems.

[0184] Certain embodiments of disclosure and / or computing systems disclosed herein are modern It can be used in data centers and / or weather-controlled environments, but the disclosure is self-contained. Some embodiments of the pewting system are suitable for remote locations and / or harsh environmental conditions. It may be deployed. In one embodiment, the outer housing is weather-resistant, water-resistant, and and / or otherwise designed to withstand prolonged exposure to harsh environments. One embodiment of the disclosure provides access to large amounts of computing resources in remote or hard-to-reach locations. This enables rapid deployment. One self-contained embodiment provides access to power and data connections. It can be arranged to be operational in virtually any location where it can be operated. In terms of form, an uninterruptible power supply and / or generator provides a more reliable or constant power supply. It may be operablely connected to a computing system to grant access.

[0185] A self-contained embodiment of a certain disclosure is designed to be loadable. Some embodiments may be designed to be low-profile. Specific embodiments may be approximately 5 feet 5 inches high and deep It may be 5 feet 6 inches and 9 feet wide. This is a 42 square foot installation area. This translates to approximately 60kW of computer power in the enclosure. Such a unit is the same 42 square meters. Stacked vertically to supply 120kW of computer power within a foot installation area. It may also be used.

[0186] The embodiments of the disclosed computing system are loaded, and multiple loads are adjacent to each other. They can be arranged in this way. This eliminates the need for pathway space between individual computing systems. This reduces power consumption, enabling a higher overall power density within the data center.

[0187] One embodiment completes by accessing only one aspect of a self-contained computing system. It can be designed to be fully operational and maintainable. Such embodiments may be This is advantageous because it facilitates the placement of self-contained systems in very close proximity to one another. Furthermore, in one self-contained embodiment, the entire immersion tank is located on only one side of the device. They can be removed and / or replaced while accessing. In certain embodiments, the tanks are individually modular It may be a rule-type and / or skid-equipped type.

[0188] In one embodiment, a self-contained computing system has an even smaller installation area. They may be arranged vertically for use. Embodiments of the vertical design of the disclosed system It provides approximately 60kW of computing power within an installation area of ​​approximately 22.9 square feet. It can be supplied. Similar to other embodiments of the disclosure, several vertically oriented self-contained containers The puteing systems can be arranged in close proximity to each other. Also, in several other embodiments... As described above, some vertically oriented self-contained computing systems are... It can be operated and maintained with access to only one side. In one embodiment, the entire tank is outside It can be removed from the housing and replaced. This arrangement allows for multiple blade servers and / or enables the rapid replacement of other computing components.

[0189] Mobile Implementation A self-contained computing system that does not require an external source of cooling water, Novel computing applications become possible. In one embodiment, a generator is By using this method, power is supplied to the system, and the system is connected to an external and / or fixed power source. Eliminates the need for continuation. In one embodiment, the system relies on wireless data communication. That's fine.

[0190] In certain self-contained embodiments that do not rely on a fixed power supply or wired data communication, fully mobile A virtual computing system can be realized. Embodiments of disclosure can be implemented in almost any environment A self-contained in-vehicle computer that can be used to supply large amounts of computing power. Includes a mounting system. In one embodiment, a truck-mounted wireless computing system The system is driven within the wireless communication range of an existing or temporary network, and is essentially set up It can supply large amounts of computing power without top-up or installation time.

[0191] Embodiment of natural water In one embodiment, the computing system is used for boats, ships, oil drilling equipment, and floating It is used on a platform or on other containers or structures located in close proximity to a body of water. They may be arranged in such a way. In such embodiments, dielectric vapor as described herein The condenser used to convert the fluid back into a dielectric fluid can be cooled using water from a water source. In one exemplary embodiment, the modular computing system includes a water intake and a water outlet. and may include a pump or impeller. The pump and / or impeller separates water from the condenser. It can be passed through and then returned to the water body. In one embodiment, a condenser, piping and other components are used. Designed to protect computing system components from sources of contamination in water. It may include filters and / or processing components. In some embodiments, it may include a condenser and other components. The elements are arranged to withstand prolonged contact with brackish water or saltwater, such as seawater.

[0192] Horizontal magazine swap In one embodiment, the magazine of replacement components is located outside the tank, and the computing system It may be housed inside the outer housing of the stem. For example, chassis, server, blade and Replacement components such as and / or power components are removed from the magazine and the components inside the tank It can be used to replace components. The magazine is used to replace components from the magazine. To enable this, it is configured to protrude from the outer housing of the computing system. It may be on a platform that has been designated as such.

[0193] In one non-specific example, if the blade server in the tank does not function properly, the robot... The system removes the non-functional components from the tank and places those non-functional components into the magazine. It can be used to move it to the storage slot. Then the robotic arm moves it from the magazine to the machine Remove the functioning blade server and install it in the location where the non-functioning server was previously installed. This allows for the replacement of a non-functioning server with a new, working server.

[0194] As time passes, the magazine is used to ensure the robotic system can continue operating for an extended period. , accumulating non-working components that can be replaced with new working components. One embodiment So, even if the magazine is on a platform that can protrude from the outside of the outer housing Often, this allows the operator to access the magazine. In one embodiment So, the platform allows components to slide in or out of the magazine. To enable this, the magazine is configured to rotate from a nearly vertical position to a nearly horizontal position. ru.

[0195] In one embodiment, a cart with adjustable height allows a human operator to access the components. It does not require lifting or supporting the weight of the components while removing or replacing them. It can be used to move, load, and / or receive components. It rotates to a nearly horizontal position. A magazine configured in such a way allows for the loading of functional components into the magazine and non-functional components. It should become clear that this can also facilitate the removal of elements.

[0196] Figures 15A-D show the platform 820 which can extend outside the container. An example of a magazine 810 is shown. In Figure 15A, the magazine 810 has a rotating member 821 and a support It can be connected to a platform including a support member 822 and a rail 823. In one embodiment The support member 822 is located in the magazine 810 and is stored inside the magazine. Rail 82 that allows movement while supporting the weight of the misaligned server or other components It can be connected to 3. In the exemplary embodiment shown in Figure 15A, platform 820 is in an extended position. It is located there.

[0197] As shown in Figure 15B, during normal operation, the support member 822 is connected to the computing system It can be reduced relative to the outer housing. Magazine 810 is on rail 823 during normal operation. It can be stored on top. In one embodiment, the weight of the magazine 810 is supported on the rail 823. Regardless of the position of member 822, it is supported by the support member 822 and the rail 823.

[0198] In one embodiment, a computer such as a server used in the disclosed embodiment is used. The components may be denser and / or heavier than conventional computer components. In one embodiment, due to the increased cooling capacity of the disclosed embodiment, the weight of the blade server at least about 50 lbs, at least about 60 lbs, at least about 70 lbs s, at least about 80 lbs, at least about 90 lbs, or at least about 1 It can be around 00 lbs. In one embodiment, the weight of the blade server is up to about 50 Approximately lbs, up to about 60 lbs, up to about 70 lbs, up to about 80 lbs However, it can reach a maximum of approximately 90 lbs or even 100 lbs. (See Figure 15B) Thus, the magazine 810 can hold multiple chassis 400 or blade servers. Each blade server can weigh approximately 73 lbs. A magazine can hold three of these. When the eel server is loaded, the total weight of the magazine 810 and the server is approximately 395 lbs. It is possible.

[0199] In one embodiment, the server used is a blade server mounted on a chassis. The server and / or chassis are used for server installation and in computing systems. It may include a backplane system to facilitate removal. In one embodiment, the server is It may be an immersion server that does not include a fan or other air cooling device. In one embodiment, individual servers The board can be configured to have 16 GPUs and draw approximately 6KW of power. In one embodiment, the server is a 1.5U server. The server in one disclosure is a 1 octave immersion server. It could be a nit (OIU) server. Such a server would be 1.5U tall and liquid immersion cooled. It is configured for use in a computing system. In one embodiment, a single tank in the computing system is , 10 10IU servers are running, and all 10 servers are running at virtually full power. It can be configured to provide approximately 60 kW of power when this is the case. In one embodiment, the computer The tanking system may comprise one or two such tanks. In this configuration, the computing system has multiple tanks, for example, 10 such tanks. It may be equipped with a tank.

[0200] In one embodiment, as shown in Figure 15A, the magazine is connected to the computing system When removed, the support member moves from its storage position along the rail, and the computer The outer housing of the mounting system is cantilevered.

[0201] As shown in Figures 15C-D, the magazine is either pulled out or not pulled out. It can slide along the wall and be cantilevered outside the computing system. In the installation configuration, as shown in Figures 15C-D, the magazine removal tool removes the entire magazine and the magazine It may be used to remove components contained within the din. In such embodiments, The magazine removal tool lifts the magazine from the support member in order to transport it. It can be used to slide along rails.

[0202] In one embodiment, when the magazine is moved outside the computing system, The rat form allows the magazine to rotate to a nearly horizontal position. And inside the magazine The server included can slide out of the magazine.

[0203] Figures 15A-D illustrate an exemplary embodiment for removing the server from the magazine. The following shows a series of steps. In the exemplary embodiment, the magazine is located behind the access door, in a linear guide It can be attached to a rail system. As shown in Figures 15C-D, the magazine is pulled It can be extracted and can be cantilevered outside the computing system. The magazine is manually It may be pulled out, or used with a powered or automated system for computing It may be moved outside the stem. As shown in Figure 15D, the magazine is included in the magazine. The server and / or other components can be rotated by approximately 90 degrees so that they are facing a nearly horizontal position. When in a nearly horizontal position, the server and / or other components slide out of the magazine. , on a cart or other tool configured to accept servers and / or other components It can slide. As shown in Figure 15C, the scissor lift cart can be used for servers or It may be adjusted to an appropriate height to accommodate other components. Height adjustable by a rotating surface. The server can be mounted without requiring a human operator to support its weight. It may be used to enable transfer from the gin onto a cart. (See Figure 15D) As such, when the server is slid onto a cart having a grinding surface or a rotating surface, the server or other The components will be transported to another location where they will be replaced or repaired. You should see that it can be loaded into the magazine using essentially the same steps in reverse order. be.

[0204] In one alternative embodiment, the magazine is supported on a rotatable and extendable arm without rails. It may be held. In such embodiments, the magazine, during normal operation, is a computing system It can be stored in a nearly vertical position within the outer housing of the stem. Components in the magazine are replaced. If it is determined that it should be removed, the magazine will use an extendable arm to move outwards. It can be extended to the outside. When the magazine is extended beyond the outer housing, the magazine is To enable components stored in the magazine to be removed horizontally from the magazine. It can be rotated from a nearly vertical position to a nearly horizontal position.

[0205] Bellows In some embodiments, bellows and / or a steam collection system may be used. Before the embodiment is first activated, dielectric fluid, computer components such as servers and Other system components may be in thermal equilibrium. When the computing system is activated... Computer components such as servers begin to generate heat that can be dissipated into a dielectric fluid. This process transitions a portion of the dielectric fluid from a liquid state to a vapor state. As the body temperature rises, more of the dielectric fluid can transition to a vapor state. Closed system In this case, an increase in the volume of dielectric vapor leads to an increase in pressure within the system. In one embodiment, the tank containing the dielectric fluid is connected to the recovery system for fluid and / or vapor circulation. It can become that state.

[0206] Figure 16 shows a steam recovery system 900 according to an exemplary embodiment. Recovery system 900 It is connected to tank 710 containing dielectric vapor. Dielectric vapor is piped from tank 710. The steam will flow through to one or more bellows 905. The Tem 900 includes an expandable / contractable bellows 905 configured to receive dielectric vapor, This reduces or eliminates any increased pressure in tank 710. The system cools down. When the dielectric vapor portion condenses into a dielectric liquid, the bellows in tank 710 It can be folded or contracted to substantially maintain pressure equilibrium.

[0207] In one embodiment, the steam recovery system 900 allows air to be introduced into the steam recovery system. The valve 912 is configured as follows. In such an embodiment, dielectric vapor is directed to the atmosphere. It can be mixed with the atmosphere. By mixing dielectric vapor with the atmosphere, the temperature of the dielectric vapor decreases. Obtained. In one embodiment, the mixed air / vapor is directed through the carbon bed 911. It may be done. The carbon medium in the carbon bed 911 is a system in which the atmosphere passes through the carbon medium. From 900, for example, dielectric vapors can be ventilated via the outlet valve 913. It can be configured to attract attention. In such an embodiment, heated dielectric vapor They can be cooled and collected by a carbon medium.

[0208] After operating for a sufficient amount of time, the embodiment of the computing system is... The cutting components reach a stable thermal state based on the power capacity used. If less or less computing power is used, more or less The dielectric fluid can be transitioned into dielectric vapor. As a result, the bellows 905 can convert the dielectric fluid It can expand and / or contract in response to the heat dissipated.

[0209] In one embodiment, the bellows 905 may comprise one or more pouches. It may have a metal foil and polymer laminated structure. The bellows pouch is used for steam recovery system piping. They can be connected in series or in parallel to each other. In one embodiment, an expanded bellows pouch The total volume can be at least about 15% of the liquid fluid volume of the tank. In one embodiment, The total volume of the expanded bellows pouch is at least about 20% of the liquid fluid volume of the tank. It may be at least 23%, or at least 25%, or even more. In this state, the total volume of the expanded bellows pouch is approximately 40% of the liquid fluid volume of the tank. It may be up to approximately 30%, or up to approximately 25%, or less.

[0210] In one embodiment, once the computing system has substantially reached thermal stability, steam The air recovery system 900 is closed to the cooling atmosphere, and the air is discharged from the system. The valve that enables this may be closed. In one embodiment, the carbon bed is the valve It can be configured to open only to the tank and bellows using a certain method. A detachable heater, configured to circulate heat through a carbon medium, raises the temperature of the carbon medium. It can be operated in such a way. As the temperature of the carbon medium rises, previously collected by the carbon medium Any dielectric fluid that is drawn away from the carbon will be returned to the tank, and that As mentioned earlier, it can condense and return to being a dielectric fluid.

[0211] In one embodiment, when the computing system is powered in a state below the previous stable state, In combination, the portion of the dielectric fluid in vapor state may decrease, and in some embodiments, the bellows It can be contracted to regulate the decrease in dielectric vapor. In one embodiment, air is introduced into the bellows. The valve that allows air to enter is opened to introduce air into the bellows and further reduce the pressure difference. In one embodiment, nitrogen, rather than air, reduces the pressure difference and also reduces the atmosphere It may also be used to avoid the introduction of potential contamination.

[0212] In one embodiment, the bellows and / or steam recovery system is completely or substantially passive It may be. In one embodiment, the bellows and / or steam recovery system is computer Sensors from temperature, pressure, and / or power sensors placed throughout the lighting system Power supply and / or automation may be performed based on survey data.

[0213] In one embodiment, a computing system having a steam recovery system is provided. Even if the system is not closed, there will be no emissions. In one embodiment, the atmosphere or Nitrogen is introduced into the system without releasing any or very much of the dielectric fluid into the ambient atmosphere. It can then be discharged from the system.

[0214] Exemplary Embodiments Embodiments of disclosure relate to the density of computer components and / or computing power. Allows for an increase. Two-phase liquid-immersion cooled computer component 1 inside pressure control vessel 110 In one embodiment comprising 70, the components are less than about 1 inch, less than about 0.7 inches or They can be separated from each other by less than approximately 0.5 inches. In one embodiment, the individual components are Over approximately 0.3 inches, over approximately 0.5 inches, over approximately 0.7 inches, over approximately 1 inch, or approximately 1.5 inches They can be separated by more than an inch.

[0215] One embodiment of the disclosure demonstrates improved power efficiency (P) compared to conventional data centers. UE) enables. By using the embodiments of the disclosure, computer component 170 This enables a reduction in energy consumption for cooling, thereby reducing the overall energy consumption of the data center. Energy consumption decreases, and the PUE approaches 1.0. In one embodiment, a two-phase liquid Regarding a data center that includes computer components to be immersed and cooled within a pressure control vessel 110 Data centers are less than approximately 1.15, less than approximately 1.10, less than approximately 1.08, or less than approximately 1.05. It has a PUE. In one embodiment, a two-phase immersion-cooled computer component is pressure controlled. Regarding the data center provided within container 110, the data center is approximately 1.05 and approximately 1.06 It has a PUE greater than approximately 1.08 or greater than approximately 1.10.

[0216] In one embodiment, a heat-condensable dielectric fluid is used in a two-phase immersion cooling system. It is provided so that the computer components operate below atmospheric pressure, and it is a dielectric fluid. This lowers the vaporization temperature, thereby lowering the temperature of the dielectric fluid's liquid phase compared to standard atmospheric pressure. It is maintained by the computer components, which generate heat as they operate. Heat is transferred to the dielectric liquid in contact with the computer components, causing the dielectric liquid to vaporize into a gas. Gaseous dielectric fluids can be condensed using a condenser. (At ambient temperature or cooled during processing) Water is passed through a condenser. When a gaseous dielectric fluid is cooled by a condenser, it condenses. It returns to the liquid phase, descends, and returns to the tank of liquid dielectric fluid.

[0217] One embodiment of the disclosure relates to a high-density data center. Conventional data centers are approximately 1 Approximately 1 megawatt (MW) of computing power distributed over 0,000 square feet Includes power. High-end data centers are distributed across approximately 6,000 square feet. It may include 1 MW of computing power. Embodiments of the disclosure are two-phase immersion cooled Regarding a data center that includes a computer component 170 inside a pressure control container 110, The center is approximately 3000 square feet, approximately 1500 square feet, and approximately 1000 square feet. The system consists of approximately 1 MW of power distributed over an area of ​​approximately 800 square feet or approximately 600 square feet. It utilizes computing power. In one embodiment, the disclosed computing system Multiple pressure control vessels, including one containing a pressure control element, are arranged in a row and can be powered by a central power supply. In the embodiments, multiple embodiments of the disclosed computing system are connected in series with one another. It may be continued.

[0218] An embodiment of the disclosure includes a computer component 17 that is immersed and cooled within a pressure control vessel 110. It is equipped with 0, thereby the components are immersed in the dielectric liquid 140 by a pressure control vessel. This is done to block air pollution. One embodiment of the disclosure provides minimal air filtration and / or relating to a data center operating with cleaning requirements. In one embodiment, the data center is Without a HEPA filter or equivalent, a MERV11 filter or equivalent It operates without any components, or without a MERV8 filter or its equivalent.

[0219] An embodiment of the disclosure includes a computer component 17 that is immersed and cooled within a pressure control vessel 110. It is equipped with 0, so that the components are not cooled by gaseous air. Embodiments of disclosure This data shows that it operates without a cooling fan and / or other similar devices for circulating air. Includes the center.

[0220] The embodiments of the disclosure relate to an environmentally friendly data center. In one embodiment, the data center The system includes computer components 170 that are immersed and cooled within a pressure control vessel 110. The process consumes little to no water. In one embodiment, the condensation structure 130 is cooled Conversely, a closed-circuit drying and cooling tower is used to condense dielectric fluid vapor into dielectric fluid liquid. This reduces the temperature of the water circulating through the disclosed condensation structure 130. The system operates as a closed loop without the need to add or remove large amounts of water, and the drying cooling tower uses evaporative cooling. It does not rely on the flow of water for cooling or other operations. One embodiment of a data center is one day Less than approximately 10,000 gallons of water per day, less than approximately 1,000 gallons of water per day, approximately Less than 100 gallons of water, less than approximately 10 gallons of water per day, 0 gallons of water per day Use and / or discharge. One data center embodiment uses more than approximately 100 gallons per day. Water, more than 1,000 gallons of water per day, more than 10,000 gallons of water per day To spit out / discharge.

[0221] Embodiments of disclosure include a pressure control operably connected to a pressure controller and / or vacuum source. A pressure-controlled container having an interior and an exterior, configured to contain an atmosphere inside. A container, a predetermined volume of thermally conductive, condensable dielectric fluid, and computer components are mounted within it. A rack for which, when computer components are mounted on the rack, a predetermined volume of heat conduction A rack positioned to be at least partially immersed in a dielectric fluid, and a condensed structure The system comprises a predetermined volume of thermally conductive dielectric fluid, a rack, computer components, and a condensed structure. The object relates to a computing system contained within a pressure control vessel. One embodiment is a pressure control vessel having an internal structure, and a pressure controller that reduces the internal pressure to below atmospheric pressure. Configured to be operablely connected, allowing a predetermined volume of thermally conductive material to condense in the liquid and gas phases. A pressure control vessel configured to contain a dielectric fluid capable of handling pressure, and one or more computer components. The element is at least partially immersed in a predetermined volume of a thermally conductive, condensable dielectric fluid liquid phase. One or more computer components arranged to obtain a gas-phase dielectric fluid and a liquid-phase dielectric fluid This relates to a cooling system that includes a condenser for condensing into the body.

[0222] In one embodiment, the pressure control vessel is mounted within a superstructure, and the blade server is a computer. The cutting system is configured to be swappable without interruption, and the pressure control vessel is electrically powered The pressure control vessel is operably connected to the power source, water supply source and network connection, and has an open top. It has a lid configured to seal the mouth and opening, and the lid controls the pressure of rising steam. It is configured to direct the pressure from the middle of the container to the side of the pressure control vessel, and the pressure control vessel is approximately 1 Having an internal volume between 00 cubic feet and approximately 300 cubic feet, and / or pressure control vessel This includes liquid dielectric fluids in ratios between approximately 1:3 and 1:8 relative to gaseous dielectric fluids. The embodiment includes a ballast block, a blade server and a blade server chassis, and a robot The arm and airlock, the airlock significantly disturbs the atmosphere inside the pressure control vessel. A robot configured to allow access to the interior of a pressure control vessel without requiring assistance. Arm and airlock, and / or purge system having a predetermined volume of thermally conductive dielectric It further includes a purge system configured to remove contaminants from the fluid. In this state, the purge system removes a portion of the atmosphere from the pressure control vessel and removes the atmosphere. It is configured to condense one of the dielectric fluids and discard any remaining vapor. In this application, the purge system condenses at least a portion of the gaseous dielectric fluid, thus preventing gaseous contamination. It is designed to dispose of items.

[0223] One embodiment relates to a method for cooling computer components, the method being a housing A step of providing a housing, wherein the housing is a thermally conductive, condensable dielectric fluid and a heat-generating It includes computer components, and the housing is configured to withstand at least a small vacuum. The steps include the steps of operating computer components, and the computer The steps to operate the components generate heat, and the computer components come into contact with a dielectric fluid. The steps include, and, the step of generating a vacuum inside the housing, The pressure is at least less than about 1 atmosphere, and the step comprises. In one embodiment, How A step of maintaining a vacuum in the sing while the computer components are operating The pressure inside the housing is less than approximately 1 atmosphere, and the computer components are... The steps include using the heat generated to vaporize the dielectric fluid from a liquid state to a gaseous state, and condensation. The process involves using a container to condense the dielectric fluid from a gaseous state to a liquid state, and then directly from the dielectric fluid to The further step is to remove a liquid that cannot be condensed. In one embodiment, and And / or replacing a part of a computer component while the system is running. In certain embodiments The step of removing the non-condensable fluid isolates a portion of the gaseous atmosphere from inside the housing. The steps include: a step of condensing one of the dielectric fluids from a gaseous atmosphere, and the condensed The steps involve returning the dielectric fluid to the housing and discarding any remaining portion of the gaseous atmosphere. It comprises a step and / or the housing is configured to generate convection.

[0224] In one embodiment, computer components in contact with a thermally conductive dielectric fluid are subjected to atmospheric pressure. The present invention relates to a method for cooling computer components that have a step of operating at full capacity. The method involves two steps: vaporizing the dielectric fluid and condensing the dielectric fluid at a pressure below atmospheric pressure. To further enhance the features.

[0225] One embodiment relates to a method for cooling computer components, the method being thermally conductive The steps include supplying a condensable dielectric fluid in liquid and gas phases, and supplying a thermally conductive condensable dielectric fluid. In the presence of a dielectric fluid, in at least partially contact with a condensable dielectric fluid with thermal conductivity in the liquid phase The method includes the step of operating computer components at a pressure below atmospheric pressure. The method of operation involves at least one part of the heat generated by operating the computer components. A step of vaporizing a dielectric fluid from the liquid phase to the gas phase using a portion, and at least A step of condensing a portion from the gas phase to the liquid phase, and a step of a dielectric fluid that cannot be immediately condensed. The steps of removing at least a portion of and / or the computer component operating The further step includes replacing at least one computer component during that time. El.

[0226] One embodiment relates to a method for cooling computer components, the method being a computer The process includes a step of operating the data components at a pressure below atmospheric pressure, at least 1 psi, and the computer The constituent elements are in at least partial contact with a thermally conductive dielectric fluid, and the boiling point of the dielectric fluid The temperature is less than approximately 80°C. In one embodiment, the computer components do not exceed approximately 80°C. The method further includes a step of condensing a dielectric fluid under certain conditions.

[0227] Various embodiments of the disclosure may include some or all of the components, even if not described herein. It should be understood that certain components and their characteristics may be included in each specific implementation. It can be adjusted based on the characteristics of the state. Modifications include higher or lower densities of power, cooling and The use of network connectivity systems, pressure management systems, steam management systems, and specialized This may include the selection of equipment and components.

[0228] From the above description, a person skilled in the art can easily identify the essential features of this disclosure and their gist. and any modifications to adapt this disclosure to various uses and conditions without departing from the scope It can be deformed. The embodiments described above are for illustrative purposes only and the present disclosure It should not be interpreted as a limitation of scope.

[0229] Immersion cooling treatment 1. A method, Computer components are at least partially immersed in a thermally conductive, condensable dielectric fluid. This is a step, The aforementioned computer component includes a backplane for receiving power from the rack. It is mounted on a chassis, The aforementioned computer component, when the computer component is operating, It is configured to dissipate heat into the fluid. Steps and The steps include: using a condenser to condense the dielectric fluid in the gas phase into the dielectric fluid in the liquid phase; The rack is equipped with a pressure controller that lowers or raises the internal pressure of the tank. The method described is located inside the tank. 2. The tank has at least 300W of power distributed across each square foot of space. A method of Embodiment 1 having computing power density of computing power. 3. Further comprising the step of removing the chassis from the rack using a robot, The robot is located inside the tank, according to the method of Embodiment 1. 4. The robot further comprises the step of transporting the chassis to the airlock. The airlock does not significantly disturb the pressure inside the tank. A method of embodiment 3, configured to allow access to a part. 5. The step of opening the inner door of the airlock, The steps include placing the chassis in the airlock, The steps include closing the inner door of the airlock, The steps include making the pressure of the airlock equal to atmospheric pressure, The steps include opening the outer door of the aforementioned airlock and A method of embodiment 4 further comprising: 6. The robot further comprises the step of storing the chassis in a magazine. The method of Embodiment 3. 7. The magazine is located on a platform including a support member, a rotating member, and a rail. The method of Embodiment 6. 8. The robot is configured to remove, replace, or install the chassis. - The method of Embodiment 3, which is a robot. 9. The gantry robot is configured to move horizontally and descend vertically. Method of application form 8. 10. The robot is configured to remove, replace, or install components of the power distribution system. The method of Embodiment 9. 11. Embodiment 10 The robot includes a gripping tool for gripping the chassis. The method. 12. The method of Embodiment 1, wherein the tank is mounted within a superstructure containing multiple tanks. . 13. The method of Embodiment 1, further comprising the step of removing contaminants from the dielectric fluid. 14. The method of Embodiment 1, further comprising the step of removing gaseous contaminants. 15. Further comprising the steps of supplying power, network connection, and processing fluid to the tank. The method of Embodiment 1. 16. The method of Embodiment 1, wherein the tank comprises an opening at the top and a removable lid. 17. The tanks have internal volumes between approximately 100 cubic feet and approximately 300 cubic feet. The method of Embodiment 1. 18. The method of Embodiment 1, wherein the chassis does not include a heatsink and a fan. 19. The chassis contains blade servers, processors, power supplies, or interface cards. The method of Embodiment 1, including the method of Embodiment 1. 20. The backplane is connected to a 1G or 10G Ethernet interface. The interface is a Cat6A or Cat7 compatible RJ45 interface. The method of Embodiment 19, which is electrically connected to the code.

[0230] Container design and configuration for immersion cooling 1. A device, A tank configured to hold a thermally conductive, condensable dielectric fluid, A pressure controller for lowering or raising the internal pressure of the tank, A rack at least partially immersed in the dielectric fluid, A condenser for condensing the dielectric fluid in the gas phase, A robot configured to move the chassis within the rack A device equipped with the following features. 2. The device includes a modular skid equipped with multiple forklift tubes. Apparatus of Embodiment 1. 3. The tank has at least 300W of power distributed across each square foot of space. The apparatus of Embodiment 1, having computing power density of computing power. 4. The apparatus of Embodiment 1, wherein the external part of the apparatus includes a power input unit and a communication input unit. 5. The power input unit and the communication input unit are electrically connected to the box. The box uses multiple wires to connect the power input unit and the communication input unit to the rack. The apparatus of Embodiment 4, which distributes to [the specified location]. 6. The rack is configured to distribute power and communication signals to the chassis. Apparatus of Embodiment 5, including a plane receiver. 7. The chassis is, The power and communication signals are received from the backplane receiver of the rack. The power and communication signals are distributed to the computer components within the chassis. Apparatus of Embodiment 6, including a backplane configured as such. 8. The apparatus of Embodiment 5, wherein the plurality of wires do not contain plastic insulators. 9. The rack is the apparatus of Embodiment 5, including a transformer. 10. The apparatus of Embodiment 1, wherein the apparatus is loadable. 11. The apparatus of Embodiment 1, further comprising a magazine for storing replacement components. 12. The robot removes the chassis from the rack and places the chassis in the magazine The apparatus of embodiment 11, configured to be placed in [location]. 13. The magazine is positioned on a platform including a rotating member, a support member and a rail. The apparatus of embodiment 12. 14. The platform is configured to guide the magazine outside the device. The apparatus of embodiment 13. 15. The apparatus includes a desiccant configured to remove water vapor contaminants from the apparatus. Apparatus of Embodiment 1. 16. Charge area and, Pump and Filters and The pump further comprises the following before transporting the dielectric fluid to the tank portion of the tank: The dielectric fluid is removed from the reservoir region and the dielectric fluid is passed through the filter. The apparatus of Embodiment 1 has been constructed. 17. The dielectric fluid has a boiling point in the range of 20°C to 100°C, according to the apparatus of Embodiment 1. . 18. The dielectric fluid is (CF3)2CFCF2OCH3, C4F9OCH3 or Chemical substances of the formula CF3CF2CF2CF2OCH3, hydrofluoroethers, or me Apparatus of Embodiment 1, comprising toxic-nonafluorobutane. 19. The device will not operate if either the lid or door of the device is not secured. The apparatus of Embodiment 1 further includes a lock to prevent further damage. 20. If there is unauthorized access to the lid or door, the device will be shut off. The apparatus of embodiment 19 further comprises a controller configured in the manner described above.

[0231] Robots and automation for immersion cooling 1. A device, A tank configured to hold a thermally conductive, condensable dielectric fluid, A pressure controller for lowering or raising the internal pressure of the tank, A computer component at least partially immersed in the dielectric fluid, A condenser for condensing the dielectric fluid in the gas phase, A robot configured to retrieve the aforementioned computer components A device equipped with the following features. 2. The apparatus of Embodiment 1, further comprising an airlock. 3. The airlock is the apparatus of Embodiment 2, which includes an inner door and an outer door. 4. The airlock shall permeate the dielectric fluid in the gas phase before the outer door is opened. The apparatus of Embodiment 3, configured to receive an inert gas. 5. The robot is the apparatus of Embodiment 3, located outside the tank. 6. The robot is the apparatus of Embodiment 3, located inside the tank. 7. The robot removes the computer components from the rack and the computer components The apparatus of Embodiment 6, configured to transport the constituent elements to the airlock. 8. The robot further, Open the inner door of the airlock, The aforementioned computer components are placed in the airlock, Close the inner door of the airlock, The pressure of the aforementioned airlock is made equal to atmospheric pressure. Open the outer door of the airlock. The apparatus of Embodiment 7, configured as described above. 9. The apparatus of embodiment 8, further comprising a second robot located outside the tank. 10. The second robot, when the outer door is opened, the computer components The apparatus of embodiment 9, configured to remove from the airlock. 11. The second robot places the computer components into the storage slot. The apparatus of embodiment 9, configured as follows. 12. The airlock equalizes the pressure inside the airlock after the outer door is closed. The apparatus of embodiment 9, configured as follows. 13. The device is configured to receive commands from a server located outside the device. Apparatus of Embodiment 1. 14. The computer component is located within a chassis that displays an asset tag, Device of state 1. 15. The robot scans the asset tag and puts the asset tag into a management system. The apparatus of embodiment 14, configured to relay to a device. 16. The robot is configured to remove, replace, or install the computer components. The apparatus of Embodiment 1 is a gantry robot. 17. Embodiments in which the gantry robot is configured to move horizontally and vertically. 8 devices. 18. The robot is configured to remove, replace, or install components of the power distribution system. The apparatus of Embodiment 1. 19. The component of the power distribution system is a transformer or a power supply, according to Embodiment 18. Place. 20. The robot includes a gripping tool for grasping the computer components, Apparatus of Embodiment 1.

[0232] Ballast block for immersion cooling 1. A device, It is a tank, Tank portion for holding thermally conductive, condensable dielectric fluid and computer components. and, A shelf section configured to hold at least one ballast block and A tank equipped with, A pressure controller for lowering or raising the internal pressure of the tank, A condenser for condensing the dielectric fluid in the gas phase, A robot configured to retrieve the aforementioned computer components A device equipped with the following features. 2. The bottom point of the tank portion is lower than the height of the shelf portion, according to Embodiment 1. Place. 3. The tank portion is at least partially immersed in the dielectric fluid, the computer components are at least partially immersed in the dielectric fluid. The apparatus of Embodiment 1, configured for dipping. 4. The computer components include a blade server, processor, power supply, or transformer. The apparatus of Embodiment 3. 5. The height of the dielectric fluid is sufficient to cover at least a portion of the shelf portion. The apparatus of Embodiment 1. 6. The apparatus of Embodiment 1, wherein the shelf portion is located next to the condenser. 7. The shelf portion is configured to receive the condensed dielectric fluid from the condenser. Apparatus of configuration 6. 8. The ballast block removes the dielectric fluid from the shelf to the area above the tank portion. The apparatus of Embodiment 1, configured to occupy the volume of the tank on the shelf in such a manner. 9. The ballast block is such that the dielectric fluid flows beneath the ballast block. The apparatus of Embodiment 1, including multiple riser feet to enable the following. 10. The ballast block is a device of Embodiment 1 that is not soluble in the dielectric fluid. Place. 11. The ballast block is made of metal, rubber, silicone or polymer, Device of state 1. 12. The apparatus of Embodiment 1 wherein the ballast block is denser than the dielectric fluid. . 13. The ballast block has a handle for removing or replacing the ballast block. The apparatus of Embodiment 1, having a notch or a plate. 14. The robot uses the handle, the notch, or the plate to ballast A device of embodiment 13 configured to lift a to block. 15. The ballast block is subjected to other ballast from the upper or lower side of the ballast block. The apparatus of Embodiment 1, configured to interlock with a block. 16. The interlock prevents the other ballast block from sliding. Apparatus of Embodiment 15. 17. The other ballast block is located above or below the ballast block. The apparatus of embodiment 15, configured to be present. 18. The ballast block is provided with a recess on the upper side of the ballast block, Furthermore, the riser feet of the other ballast block are in the recess of the ballast block The apparatus of embodiment 15, configured to be locked into one position. 19. The ballast block is arranged so as to extend at least 40% of the total length of the shelf portion. The apparatus of Embodiment 1 has been constructed. 20. The ballast blocks are approximately 2 feet long, 8 inches wide, and 1 inch high. The apparatus of Embodiment 1, having external dimensions.

[0233] Server cases for immersion cooling 1. A device, A tank configured to hold a thermally conductive, condensable dielectric fluid, A pressure controller for lowering or raising the internal pressure of the tank, A chassis at least partially immersed in the dielectric fluid, A condenser for condensing the dielectric fluid in the gas phase, A robot configured to remove the chassis A device equipped with the following features. 2. The apparatus of Embodiment 1, wherein the chassis does not require a heat sink and a fan. 3. The chassis is the apparatus of Embodiment 1, including a blade server. 4. The chassis includes a processor, power supply, or interface card, according to Embodiment 1. The device. 5. The interface card connects to a 1G or 10G Ethernet interface. Embodiment 4 is a Cat6A or Cat7 compatible RJ45 interface for connection. The device. 6. The apparatus of Embodiment 1, wherein the chassis is removably mounted on a rack. 7. The chassis has a slot-in interface between the chassis and the rack. Apparatus of Embodiment 6, including the backplane provided. 8. The backplane distributes the power and signals received from the rack within the chassis. The apparatus of embodiment 7, configured to distribute the information. 9. The backplane transmits power and data to the blade server via cable. The apparatus of embodiment 8, configured in such a way. 10. The chassis is a roughly rectangular box having a rear wall and two side walls, and the rear The face wall has a plurality of holes that facilitate the circulation of the dielectric fluid within the chassis, in an embodiment Device 1. 11. The chassis is provided with guide rails on each of the two side walls, according to Embodiment 10. Device. 12. The chassis has mounting interfaces for holding computer components. The apparatus of Embodiment 1, which is equipped with the above. 13. The chassis is equipped with a plane, and the robot uses the plate to operate the shear The apparatus of Embodiment 1, configured to lift the object. 14. The chassis is the apparatus of Embodiment 1, including a microcontroller. 15. The microcontroller, From the sensors mounted on the chassis, it is determined that the chassis is properly positioned in the rack. It receives sensor data indicating whether it is, The aforementioned sensor data is transmitted to the management system. The apparatus of embodiment 14, configured as described above. 16. The microcontroller, Receive power signals from the management system, The power signal is transmitted to a switch configured to interrupt the power within the chassis. do The apparatus of embodiment 14, configured as described above. 17. The microcontroller, The system receives operational data from computer components mounted within the chassis. The aforementioned operation data is transmitted to the management system. The apparatus of embodiment 14, configured as described above. 18. The microcontroller controls the electrical and communication equipment of the blade server. The apparatus of embodiment 14, configured as follows. 19. The chassis is the apparatus of Embodiment 1, which is equipped with an RFID tag. 20. The robot scans the RFID tag and transmits a signal to the management system. The apparatus of embodiment 19, configured as described above.

[0234] Steam control for immersion cooling using bellows 1. A device, It is configured to hold a thermally conductive, condensable dielectric fluid and computer components. The tank and, A pressure controller for lowering or raising the internal pressure of the tank, A vapor control system for condensing the dielectric fluid in the gas phase, A robot configured to retrieve the aforementioned computer components A device equipped with the following features. 2. The steam management system is the apparatus of Embodiment 1, which includes a condensation structure in the tank. 3. The condensation structure includes a heat-conducting tube, a coil, and a heat dissipation fin, as in Embodiment 2. Device. 4. The condensing structure is such that the coolant passes through the condensing structure, and the coolant supply source The apparatus of embodiment 2, configured to be coupled to the following. 5. The apparatus is configured to cool the coolant using evaporative cooling or a dry cooling tower. The apparatus of Embodiment 2. 6. The steam management system is the apparatus of Embodiment 2, including an intake pipe and a discharge pipe. 7. The intake pipe receives the coolant from the cooled coolant supply source, and the coolant is condensed. The apparatus of embodiment 6, configured to guide a structure. 8. The discharge pipe receives the coolant from the condensing structure, and the coolant is cooled by the cold The apparatus of embodiment 6, configured to return the waste liquid to the source. 9. The steam management system includes a storage unit for storing the dielectric fluid. Apparatus of form 1. 10. The steam management system provides the dielectric fluid from the storage unit to the tank. The apparatus of embodiment 9, configured to face in a specific direction. 11. The steam management system includes a steam storage unit for storing the dielectric fluid steam. The apparatus of Embodiment 1, including the apparatus. 12. The apparatus of Embodiment 11, wherein the steam storage unit is a bellows. 13. The bellows expand or contract to maintain the internal pressure of the tank. The apparatus of embodiment 12, as configured. 14. The apparatus of Embodiment 12, wherein the bellows comprises one or more pouches. 15. The steam storage unit enables the introduction of air into the steam management system. The apparatus of embodiment 11, comprising a valve for lowering the temperature of the vapor of the dielectric fluid. 16. The steam storage unit has a carbon bed that separates the dielectric fluid steam from the air. The apparatus of embodiment 15, which is operably connected to the device. 17. The carbon bed is heated to raise the temperature of the carbon bed. The apparatus of embodiment 16, comprising a detachable heater configured to raise. 18. The steam management system is the apparatus of Embodiment 1, comprising a filter. 19. The filter is configured to remove air and water vapor, according to Embodiment 17. Place. 20. The steam management system is, Equipped with an inert gas storage unit, During startup or shutdown, inert gas is released from the inert gas storage unit into the tank. The apparatus of Embodiment 1, configured to introduce an active gas.

Claims

1. A cooling system for computing components, A pressure control vessel, wherein the pressure control reduces the internal pressure of the pressure control vessel to below atmospheric pressure. Equipped with a condensable dielectric fluid with thermal conductivity, configured to hold a thermally conductive dielectric fluid in liquid and gas phases. Pressure control vessel and One or more computer components, wherein the one or more computer components are the liquid The phase is at least partially immersed in a predetermined volume of a thermally conductive, condensable dielectric fluid. The one or more computer components that are arranged and are processors or network cards Original, A condenser for condensing a gaseous dielectric fluid into a liquid dielectric fluid, The cooling system comprising the above.

2. The cooling system according to claim 1, wherein the pressure control vessel is mounted within a superstructure. 。

3. The cooling system according to claim 1, further comprising a backplane system.

4. The one or more computer components described above operate without large disturbances to the internal pressure of the pressure control vessel. The cooling system according to claim 1, which is swappable.

5. The robot arm and airlock are further provided, and the airlock is located inside the pressure control vessel. This allows access to the inside of the pressure control vessel without significantly disturbing the pressure. The cooling system according to claim 1, configured as described above.

6. The system further comprises a purge system, wherein the purge system comprises a predetermined volume of thermally conductive dielectric material. The cooling system according to claim 1, configured to remove contaminants from a fluid.

7. The purging system condenses at least a portion of the gaseous dielectric fluid and gaseous contaminants. The cooling system according to claim 6, configured to dispose of waste.

8. The pressure control vessel is operably connected to a power source, a water supply source and a network connection. The cooling system according to claim 1.

9. The pressure control vessel comprises an opening at the top and a removable lid, as described in claim 1. Rejection system.

10. One or more of the lids direct the gaseous, heat-conductive dielectric fluid toward the side of the pressure control vessel. The cooling system according to claim 9, configured to direct the cooling direction.

11. The pressure control vessel has an internal volume between approximately 100 cubic feet and approximately 300 cubic feet. The cooling system according to claim 1.

12. The pressure control vessel has a ratio between approximately 1:3 and approximately 1:8 with respect to the volume of the gaseous dielectric fluid. The cooling system according to claim 1, comprising a volume of a liquid dielectric fluid.

13. The cooling system according to claim 1, further comprising a ballast block.

14. A cooling system for computing components, A pressure control vessel, A pressure controller that reduces the internal pressure of the pressure control vessel to below atmospheric pressure, A predetermined volume of a thermally conductive, condensable dielectric fluid in the liquid and gas phases A pressure control vessel equipped with, A condenser for condensing a gaseous dielectric fluid into a liquid dielectric fluid, A structure housing the aforementioned pressure control vessel, A power distribution system that converts AC power to DC power, and the thermal conductivity of a predetermined volume of the liquid phase The power distribution system is at least partially immersed in a dielectric fluid, An uninterruptible power supply unit operably connected to the aforementioned power distribution system and The cooling system comprising the above.

15. The aforementioned power distribution system converts AC power exceeding 400 volts to DC power of less than 50 volts. The system according to claim 14.

16. The aforementioned power distribution system converts approximately 415 volts of AC power to approximately 48 volts of DC power. The system according to claim 14.

17. The aforementioned power distribution system converts approximately 415 volts of AC power to approximately 3.5 volts of DC power. The system according to claim 14.

18. The system according to claim 14, further comprising a graphics processor unit.

19. Configured to be operably connected to the power distribution system, and controlling the operation of the pressure control vessel The system according to claim 14, further comprising a processor configured to control.

20. The processor is at least partially contained within a predetermined volume of a thermally conductive dielectric fluid in the liquid phase. The system according to claim 19, which is immersed in the

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