Indication device

Abstract

To provide an angle adjustment device that can maintain a desired angle. [Solution] An angle that can fix and hold the relative positions of the first part and the second part. It is an angle adjustment device, and in a support that combines the angle adjustment device with parts such as a flat plate, the whole It is held in a shape that is unfolded on a plane, a folded shape, or a shape that maintains a desired angle. It is possible to enable bending in one direction while preventing bending in the opposite direction. Therefore, it is possible to prevent unexpected bending movements of the device having the angle adjustment device. This can prevent damage to the device.

Description

[Technical Field]

[0001] This invention relates to a product, a method, or a method of manufacturing; or to a process, a machine , relating to manufacture or composition of matter. In particular One aspect of the present invention relates to semiconductor devices, light-emitting devices, display devices, electronic devices, lighting devices, and the same. The present invention relates to a driving method or a method for manufacturing the same. In particular, one aspect of the present invention relates to an angle adjustment device, The present invention relates to a support for a flexible component and a display device having said support for the flexible component.

[0002] In this specification, a semiconductor device is defined as a device that can function by utilizing semiconductor properties. This refers to semiconductor devices in general. Transistors, semiconductor circuits, computing devices, memory devices, etc., are examples of semiconductor devices. Furthermore, light-emitting devices, display devices, lighting devices, and electronic devices have semiconductor devices. There are cases where this is the case. [Background technology]

[0003] Mobile phones, smartphones, tablet computers, laptop computers, etc. Electronic devices should be the appropriate size depending on their function, ease of use, design, and portability. It is designed for this purpose. On the other hand, carrying multiple electronic devices with overlapping functions is inconvenient. Therefore, a form that can integrate the functions of multiple electronic devices is desired. For example, Patent Document 1 A tri-fold type light-emitting panel is disclosed. By using this light-emitting panel, It is possible to integrate the functions of multiple electronic devices and create electronic devices with variable size. ru. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2015-130320 [Overview of the Initiative] [Problems that the invention aims to solve]

[0005] A display device in which the display section is foldable has at least one display panel formed on a flexible substrate. A portion of it is fixed to a support, and bending the support is used to perform bending actions. When bending the support in the opposite direction to the intended design, the display panel and the support will be damaged. Because there is a risk of damaging the hinge or other parts, there is a mechanism to prevent it from bending in the reverse direction easily. This is preferable.

[0006] Furthermore, the above-mentioned display devices are used in various transformed forms. For example, they can be unfolded into a flat surface. It is intended for use in the following states: folded, bent, or bent to a desired angle (intermediate state). Therefore, it is preferable that the support can maintain its shape regardless of the conditions.

[0007] Therefore, one aspect of the present invention provides an angle adjustment device for adjusting the relative angle between parts. One of the objectives is to fix the relative angle between parts to a desired angle. One of the objectives is to provide an angle adjustment device that can do the following: or to support a flexible component. One of the objectives is to provide a support device for that purpose. Alternatively, to prevent the reliability of flexible parts from being compromised. One of the objectives is to provide a support device that allows bending motion without any problems. One of the objectives is to provide a novel support for flexible components. Alternatively, to provide a novel light-emitting device. One of the purposes is to provide it.

[0008] Alternatively, one of the objectives is to provide a highly portable, foldable display device. One of its objectives is to provide a foldable display device with excellent visibility. Furthermore, one of the objectives is to provide a foldable display device with power-saving capabilities. One of the objectives is to provide a novel display device.

[0009] Furthermore, the description of these problems does not preclude the existence of other problems. One aspect of the present invention is It is not necessary to solve all of these issues. Furthermore, any issues other than those mentioned above should be detailed. This will become clear from the descriptions in the documents, etc., and it is not possible to extract any issues other than those mentioned above from the descriptions in the specifications, etc. It is possible to release it. [Means for solving the problem]

[0010] One aspect of the present invention is an angle adjustment device capable of maintaining a desired angle, and a support having the angle adjustment device. This relates to a holder or a display device having said holder.

[0011] One aspect of the present invention comprises a first base component, a second base component, a first connecting component, and a second connecting component. A connecting part, a first columnar part, a second columnar part, a third columnar part, a fourth columnar part , and the first base part and the second base part each have a first area and a second area The first connecting part and the second connecting part each have a first opening and cutout. Each has a notch, and the first opening and the notch are the first connecting part and the second They are arranged in the longitudinal direction of each connecting part, and the first opening is connected to the first columnar part. Alternatively, a third columnar component is inserted, and a second or fourth columnar component is inserted into the notch. A is inserted, and the first region of the first base part is the first columnar part, the first connecting part and the The columnar part 4 is connected to the second region of the second base part, and the first of the second base part The region is connected to the first base component via the third columnar component, the second connecting component, and the second columnar component. This is an angle adjustment device connected to the second region.

[0012] The first base part and the second base part have a first face, a second face, a third face, and a fourth face, respectively. It has a first face and a fifth face, the first and second faces are the same shape, and the third and fourth faces The faces are identical in shape, the first face is parallel to the second face, and the first face is opposite to the second face. It is positioned in a way that the third face is adjacent to the first face, and the fourth face is adjacent to the second face. The angle between the third face and the first face is greater than 180° and less than or equal to 270°, and the fourth face The angle formed by the second face is greater than 180° and less than or equal to 270°, and the third face and the fourth face The angle formed is greater than 180° and less than 360°, and the fifth face is the same as the first to fourth faces. Each of the faces is adjacent to the first and second regions, and the fifth region can be provided on the fifth face. Cut.

[0013] The first columnar component is inserted into the first opening of the first connecting component, and the second columnar component is inserted into the second opening of the first connecting component. The third columnar component is inserted into the notch of the connecting component, and the third columnar component is inserted into the first opening of the second connecting component. The fourth columnar part is inserted into the notch of the first connecting part, and the first columnar part The major axes of each of the first to fourth columnar parts can be made parallel.

[0014] The first columnar component is fixed to the first region of the first base component, and the second columnar component is fixed to the first The third columnar component is fixed to the first region of the second base component. The fourth columnar component can be fixed to the second region of the second base component.

[0015] The first and second connecting parts are elastic and allow the shape of the notch to be elastically deformed. It is possible.

[0016] The notch has a third region, a fourth region and a fifth region. The fourth region is the third It is located between the first region and the fifth region, and the fifth region is located between the third region and the first opening. Furthermore, the upper surface shape of the third to fifth regions can be a shape that includes an arc.

[0017] The position of the second columnar component is moved from one of the third or fourth regions of the second connecting component to the other. Switching, the position of the fourth columnar component is moved to either the third or fourth region of the first connecting component. Switching from one side to the other changes the relative angle between the first and second base components. It is possible to obtain it.

[0018] The second columnar component is in the third region of the second connecting component, and the fourth columnar component is in the first connecting component. When in the third region, the first surface of the first base part is aligned with the second surface of the second base part. They can meet.

[0019] The second columnar component is in the third region of the second connecting component, and the fourth columnar component is in the first connecting component. When in the third region, the third face of the first base part is aligned with the fourth face of the second base part. They can meet.

[0020] Furthermore, it has a third connecting part, a fourth connecting part and a fifth columnar part, and the third connecting part The fourth connecting part has a second opening, and the third connecting part is fixed to the first base part. The fourth connecting part is fixed to the second base part and the second opening of the third connecting part And the fifth columnar part is inserted into the second opening of the fourth connecting part, and the fifth columnar part The long axis of the fifth column is parallel to the long axes of the first to fourth columnar parts, respectively. The shaped component can be located near the region where the first base component and the second base component are in contact.

[0021] By providing the above-mentioned angle adjustment device on the hinge portion, a support for flexible parts can be constructed. Furthermore, a display device can be constructed by providing a flexible display panel on the support. Cut.

[0022] The display panel preferably has a light-emitting device. [Effects of the Invention]

[0023] One aspect of the present invention provides an angle adjustment device for adjusting the relative angle between parts. An angle adjustment device that can fix the relative angle between parts to a desired angle. It can provide a support or a support for a flexible component. This is possible. Alternatively, a support device can be used to perform bending operations without compromising the reliability of the flexible component. We can provide it. Or, we can provide a novel support for flexible parts. Alternatively, it is possible to provide a novel light-emitting device.

[0024] Alternatively, a highly portable, foldable display device can be provided. Or, the display It is possible to provide a foldable display device with excellent visibility. Alternatively, it can have a power-saving function. A foldable display device can be provided. Alternatively, a foldable device that is easy to hold can be provided. A display device of the same type can be provided. Or, a novel display device can be provided. ru.

[0025] Furthermore, the description of these effects does not preclude the existence of other effects. The embodiment does not necessarily have to have all of these effects. Furthermore, other effects are... This will become clear from the description in the specification, drawings, claims, etc., and the specification, drawings Furthermore, it is possible to extract other effects from the descriptions in the claims and other documents. [Brief explanation of the drawing]

[0026] [Figure 1] Figure 1 is a diagram illustrating the angle adjustment device. [Figure 2] Figure 2A is a diagram illustrating the basic components. Figure 2B is a diagram illustrating the connecting components. [Figure 3] Figures 3A to 3C illustrate the connecting components. [Figure 4] Figure 4 is a diagram illustrating the angle adjustment device. [Figure 5] Figures 5A to 5D illustrate the angle adjustment device. [Figure 6] Figures 6A and 6B illustrate the angle adjustment device. [Figure 7] Figures 7A to 7D illustrate the angle adjustment device. [Figure 8] Figures 8A and 8B illustrate the angle adjustment device. [Figure 9] Figures 9A to 9C illustrate the angle adjustment device. [Figure 10] Figures 10A and 10B illustrate the angle adjustment device. [Figure 11] Figures 11A to 11C illustrate the support structure. [Figure 12]Figures 12A and 12B illustrate the support structure. [Figure 13] Figures 13A and 13B illustrate the support structure. [Figure 14] Figures 14A and 14B illustrate the display device. [Figure 15] Figures 15A and 15B illustrate the display device. [Figure 16] Figures 16A to 16C illustrate the support structure. [Figure 17] Figures 17A to 17C illustrate the support structure. [Figure 18] Figures 18A and 18B illustrate the display device. [Figure 19] Figures 19A to 19D illustrate the display device. [Figure 20] Figure 20 is a diagram illustrating an example of the display panel configuration. [Figure 21] Figure 21 is a diagram illustrating an example of the display panel configuration. [Figure 22] Figure 22 illustrates an example of the display panel configuration. [Figure 23] Figure 23A is a block diagram of the display panel. Figures 23B and 23C are circuit diagrams of the pixels. [Figure 24] Figures 24A, 24C, and 24D are circuit diagrams of the pixels. Figure 24B is a timing chart illustrating the operation of the pixels. [Figure 25] Figures 25A to 25E illustrate examples of pixel configurations. [Modes for carrying out the invention]

[0027] Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. Without departing from the spirit and scope of the present invention, its form and details may vary. Those skilled in the art will readily understand that modifications are possible. Therefore, the present invention is as follows: The description of the embodiment is not intended to be limited to the details of the invention described below. In this configuration, the same reference numeral is used for identical parts or parts having similar functions across different drawings. The same elements are used in common, and their repeated explanations may be omitted. Basic hatching may be omitted or modified as appropriate between different drawings.

[0028] Furthermore, even if it is shown as a single element in the circuit diagram, there may be functional inconveniences. If not, the element may consist of multiple units. For example, a transistor that acts as a switch. Multiple zistas may be connected in series or parallel. Also, the capacitor may be divided In some cases, the elements may be divided and placed in multiple locations.

[0029] Furthermore, a single conductor may have multiple functions, such as wiring, electrodes, and terminals. In this specification, multiple names may be used for the same element. Even if the elements are shown to be directly connected in the circuit diagram, in reality The elements may be connected via one or more conductors, and in this specification This configuration is also included in the category of direct connection.

[0030] Furthermore, while this specification uses display panels as a representative example of flexible components, other components may also be considered. It may also include solar cells, primary batteries, secondary batteries, antennas, charging coils, speakers, Microphones, cables, lighting, various terminals, various wiring, various sensors, various circuits, and these Examples include any of the following composite devices.

[0031] Furthermore, in this specification, "display device" refers to all devices that have a display function. Electronic devices having a display unit are included in display devices. For example, mobile phones, smartphones This includes displays for smartwatches, tablet computers, television equipment, etc. The electronic device that does this is included in the display device.

[0032] (Embodiment 1) In this embodiment, an angle adjustment device, support, and display device according to one aspect of the present invention are shown in Figure I will explain by referring to the page.

[0033] One aspect of the present invention has a first base part and a second base part, and the relative angle between them is cut An angle adjustment device having a replacement mechanism. Another aspect of the present invention is the angle adjustment It is a support device with an attached mechanism.

[0034] The angle adjustment device fixes and holds the relative positions of the first base part and the second base part. This is possible. For example, in a support device that combines the angle adjustment device with a flat plate or other component, This includes shapes that are unfolded into a flat surface, folded shapes, or shapes that maintain a desired angle. It can be held in this way.

[0035] Furthermore, the angle adjustment device allows bending in one direction and prevents bending in the opposite direction. This is possible. Therefore, it is possible to prevent unexpected bending movements of the device having the angle adjustment device. This allows for the prevention of damage to the device, etc.

[0036] <Angle adjustment device> Figure 1A is a diagram illustrating an angle adjustment device 100 according to one embodiment of the present invention. Angle adjustment device 10 0 represents the base parts 101a, 101b, connecting parts 102a, 102b, columnar part 103a, It has 103b, 104a, and 104b. The base part 101a is connected to the base part via other parts. It is connected to part 101b. The columnar parts 103a, 103b, 104a, and 104b are Cylindrical or polygonal prism-shaped parts can be used, and in this embodiment, cylindrical parts are used. Let me explain an example.

[0037] Figure 2A is a perspective view illustrating the shapes of base components 101a and 101b. a and 101b can have the same shape, and faces 111, 112, 113, and 101b respectively. It has 14 and 115. Surfaces 111 and 112 can have the same shape. Surfaces 113 and 114 can have the same shape.

[0038] Surfaces 111 and 112 are parallel and opposite each other. Surface 113 is surface 1 It is adjacent to 11. Face 114 is adjacent to face 112. Face 113 is It is inclined at an angle greater than 180° and less than or equal to 270° relative to surface 111. Surface 114 It is inclined at an angle greater than 180° and less than or equal to 270° relative to surface 112. Surface 1 13 is inclined with respect to surface 114 at an angle greater than 180° and less than 360°. Surface 115 is located adjacent to each of surfaces 111 through 114.

[0039] By adjusting the inclination angles of surfaces 113 and 114, the angle adjustment device 100 operates... This allows you to adjust the relative angle between base part 101a and base part 101b. Here, the relative angle is determined by the mechanism of the angle adjustment device, and the base component 101a and the base This refers to the angle that occurs between the same parts when the position of the base component 101b is changed.

[0040] Furthermore, surface 115 has regions 151 and 152. Openings are provided in regions 151 and 152. It may be kicked. In this embodiment, areas 151 and 152 of the base component 101a These are designated as regions 151a and 152a. Also, regions 151 and 152 of the base component 101b are designated as region Let's call them 151b and 152b.

[0041] The base components 101a, 101b and the columnar components 103a, 103b, 104a, 104b are Preferably, it does not deform during operation, and is made of metal, resin, ceramic, or the same. It is preferable to form it with a hard material such as a composite that includes one or more offsets.

[0042] Figure 2B is a top view illustrating the shapes of connecting parts 102a and 102b. Connecting part 102 a and 102b can have the same shape, and are the opening 121 and the notch 122 respectively. It has.

[0043] In the top view, the center of the opening 121 is a straight line parallel to the longitudinal direction of the notch 122. Furthermore, it can be provided on the straight line passing through the center of the notch 122. Connecting part 1 The shapes of 02a and 102b can be made symmetrical with respect to the line in question. Opening 12 A columnar component 103a or a columnar component 103b can be inserted into 1.

[0044] The notch 122 has regions 122a, 122b, and 122c. Region 122a or A columnar component 104a or columnar component 104b can be inserted into region 122b. Regions 122a and 122b are connected, and their respective top surfaces have two arcs. do.

[0045] Here, as shown in Figure 2B, one arc of region 122a has point A, and the other arc has point B It has such that one arc of region 122b has point C, the other arc has point D, and points A and B are Assume that points C and D are opposite each other. In this case, the distance between point A and point B and the distance between point C and point D are opposite each other. The distance L1 between D is approximately the same as the diameter of the cross-section perpendicular to the major axis of the columnar parts 104a and 104b. It is preferable to make it smaller than the diameter. Also, regions 122a and 122b In the flowing region, there is a region where the width of the notch portion 122 in the short axis direction is smaller than L1, resulting in L2. It gets kicked.

[0046] The columnar part 104a or columnar part 104b is held between the two arcs. Therefore, the columnar part 104a or columnar part 104b inserted into the notch 122 is The position can be easily fixed.

[0047] Furthermore, region 122c is provided between the opening 121 and region 122b. Region 122b The region 122c is connected, and the upper surface shape of region 122c has an arc.

[0048] The connecting parts 102a and 102b are made of hard materials such as metal, resin, or a composite thereof. It is preferable that it be formed of an elastic material. Here, the arc of region 122c has The shortest distance between point E and the outer circumference of the connecting part 102a (or 102b), excluding the notch 122. Let the distance be L4. By setting L4 to an appropriate value, the vicinity of region 122c can be used as a pivot point. Then, a part of the connecting component 102a (or 102b) is elastically deformed, and the lengths of L1 and L2 are adjusted. The degree can be changed.

[0049] For example, in the connecting component 102a, as shown in Figure 3A, in the initial state there is a column in region 122b. Assume that the shaped component 104b is in the inserted state. Next, as shown in FIG. 3B, when a force acts on the columnar component 104b to move it in the direction of region 122a, the connecting component 102a elastically deforms with the vicinity of region 122c as a fulcrum, and temporarily L1 changes to L1’ (L1 < L1’). Also , L2 changes to L2’ (L2 < L2’).

[0050] Then, as shown in FIG. 3C, when a force acts on the columnar component 104b to move it in the same direction , when the columnar component 104b enters region 122a, the elastic deformation of the connecting component returns to its original state. Thus , the columnar component 104b is in the state of being inserted into region 122a. If a force acts on the columnar component 1 04b to move it in the reverse direction, it can return from the state shown in FIG. 3C to the state shown in FIG. 3A . Regions 122a and 122b can also be referred to as the stable positions of the columnar component 104b in the notch 122. In this embodiment, an example is shown in which two stable positions, region 122c and region 122b, are provided in the shown notch 122, but the stable regions may be three or more. The degree of the above elastic deformation can be adjusted by the length of L4 shown in FIG. 2B. The longer the length of L4 , the more difficult it is to elastically deform, and the shorter the length of L4, the easier it is to elastically deform. Therefore

[0051] , the length of L4 can be adjusted according to the application. The degree of the above elastic deformation can also be adjusted by adjusting the length of L3, which is the shortest distance between the point F in the region between region 122c and region 122b and the outer periphery of the connecting component 102a (or 102b) excluding the notch 122. Also, the degree of the above elastic deformation

[0052] can be adjusted by adjusting the length of L3, which is the shortest distance between the point F in the region between region 122c and region 122b and the outer periphery of the connecting component 102a (or 102b) excluding the notch 122. Also, the degree of the above elastic deformation can be adjusted by adjusting the length of L3, which is the shortest distance between the point F in the region between region 122c and region 122b and the outer periphery of the connecting component 102a (or The degree can be changed by changing the thickness of the connecting part 102a (or 102b) (length in the depth direction in Figure 2B). You can adjust it.

[0053] Figure 4 is an exploded view of the angle adjustment device 100. In one embodiment of the angle adjustment device 100, the base part The parts are arranged so that surface 111 of part 101a and surface 112 of base part 101b are in contact.

[0054] One of the longitudinal ends of the columnar component 103a is connected to region 151a. One of the longitudinal ends of 4a is connected to region 152a. Also, columnar part 103b One of the longitudinal ends is connected to region 151b. The longitudinal end of columnar component 104b One end of the section is connected to region 152b.

[0055] At this time, each of the columnar parts 103a, 103b and columnar parts 104a, 104b The major axes are parallel and perpendicular to the surfaces 115 of base parts 101a and 101b. Also, each of the columnar parts 103a, 103b and columnar parts 104a, 104b It may be fixed to base part 101a and base part 101b. Alternatively, columnar part 1 Each of 03a, 103b and the columnar parts 104a and 104b can rotate around the center line. It may be left in a state where it can be opened. Alternatively, the columnar parts 103a, 104a and the base part 101a are It may be a single structure. Also, columnar parts 103b, 104b and base part 101 b may be a single structure.

[0056] In the above state, the columnar part 103b is inserted into the opening 121 of the connecting part 102b, and the column The shaped part 104a is inserted into the area 122a of the notch 122 of the connecting part 102b. Furthermore, the columnar part 103a is inserted into the opening 121 of the connecting part 102a, and the columnar part 104b It is inserted into the region 122a of the notch 122 of the connecting part 102a. This results in the shape shown in Figure 1.

[0057] At this time, the connecting part 102b is in a state where it can rotate about the center line of the columnar part 103b as an axis. Furthermore, the connecting part 102a is in a state where it can rotate about the center line of the columnar part 103a as an axis. Let's assume that.

[0058] Here, as shown in Figure 5A, the edge between face 111 and face 113 of the base part 101a is edge H With side H as the central axis, rotational motion is applied to the base parts 101a and 101b, and the base part 10 From the state where surface 111 of 1a and surface 112 of base part 101b are in contact (Figure 5A) to base part 10 To change the state so that surface 113 of 1a and surface 114 of base part 101b are in contact (Figure 5B) Let's consider this. Note that edge H is the edge between face 112 and face 114 of the base part 101b. It's also possible.

[0059] If the same operation as described above is performed with the configuration of one embodiment of the present invention shown in Figure 1, then the results shown in Figures 5C and 5D will be obtained. The connecting part 102b moves so as to rotate around the center line of the columnar part 103b as its axis. The position of the columnar part 104a inserted into the notch 122 is from region 122a to region 122 It changes to b. Also, the connecting part 102a rotates about the center line of the columnar part 103a as its axis. It moves in such a way that the position of the columnar part 104b inserted into the notch 122 is in region 122a It changes from region 122b.

[0060] Furthermore, in order to change from the state in Figure 5C to the state in Figure 5D, or vice versa, It is necessary to apply a force that causes elastic deformation of the connecting parts 102a and 102b. Therefore, the force Unless added, the state in Figure 5C or the state in Figure 5D can be maintained. The change from state to state in Figure 5D, or vice versa, is due to the relationship between base component 101a and base component 1 It can be said that the relative angle between 01b and 01b is being changed. Therefore, one aspect of the present invention It can be used as an angle adjustment device.

[0061] Furthermore, as shown in Figures 6A and 6B, the angle adjustment device according to one embodiment of the present invention includes a connecting component 131a In addition, 131b may be added, and a physical axis of rotation (columnar component 105) may be provided at the position of side H.

[0062] Figure 6A shows the state with the connecting parts 131a and 131b assembled to the base parts 101a and 101b. This is the diagram shown. Figure 6B is an exploded view thereof. Connecting parts 131a, 131b, columnar part 1 By providing 05, the operation of the angle adjustment device 100 can be made smoother, and furthermore, mechanically It can increase strength.

[0063] The base components 101a and 101b have a region corresponding to the position of edge H shown in Figure 5A and its periphery. A notch 106 is provided on the edge into which a columnar component 105 can be inserted. This includes a notched region provided in the base part 101a and a cutout provided in the base part 101b It is divided into notched regions. A cylindrical part can be used for the columnar part 105, and less One end of each piece is inserted into the notch 106. Also, the central axis of the columnar part 105 is shown in Figure 5. It is preferable that it overlaps with side H shown in A.

[0064] The connecting part 131a has openings 141a and 142a, and the opening 141a has a columnar part 104a is inserted. The connecting part 131b also has openings 141b and 142b. A columnar component 104b is inserted into the opening 141b. Also, a part of the connecting component 131a and A portion of the connecting part 131b is positioned to overlap with openings 142a and 142b. A columnar component 105 is inserted into this.

[0065] In Figures 6A and 6B, the connecting part 131b is located inside the base parts 101a and 101b. Since the connecting part 131a is located on the outside, the connecting part 131a has a stable position. A spacer 132 is provided for this purpose. The thickness of the spacer 132 is the same as that of the connecting part 131b. It is preferable that the thickness is the same or greater than the thickness of the connecting part 131b. If, from the 01b side, the connecting part 131b is on the outside and the connecting part 131a is on the inside, A spacer 132 can be provided on the connecting part 131b.

[0066] Here, it is preferable to fix the connecting part 131a to the base part 101a. Alternatively, Even if the connecting part 131a is fixed to the columnar part 104a which is fixed to the base part 101a Good. Furthermore, it is preferable to fix the connecting part 131b to the base part 101b. Or The connecting part 131b is fixed to the columnar part 104b which is fixed to the base part 101b. Alternatively, the base component 101a, the columnar component 104a, and the connecting component 131a may be... It may also be a single structure. Also, the base part 101b, columnar part 104b and connecting part 131b may be a single structure.

[0067] Furthermore, the columnar component 105 is fixed to either the connecting component 131a or the connecting component 131b. It is preferable that the columnar part 105 is the base part 1 that constitutes the notch 106. Either the notched area provided in 01a or the notched area provided in the base part 101b It may also be fixed in place. With this configuration, as shown in Figures 7A and 7B The columnar component 105 can be used as an axis to allow the base components 101a and 101b to rotate.

[0068] In the state shown in Figure 7A, the columnar part 105 is the axis of rotation, and the surface 11 of the base part 101a Since the surface 112 of part 1 and the base part 101b are in contact, the rotational movement in the opposite direction is suppressed. It is possible.

[0069] Figures 7C and 7D show the configuration shown in Figures 6A and 6B, with the addition of the aforementioned columnar parts 103a and 10 This shows the configuration with connecting parts 102a and 102b added, and the change in shape due to their operation. This configuration enhances the reliability and strength of the angle adjustment device 100's operation. It is possible.

[0070] Previously, the minimum configuration consisted of a pair of basic components 101a and 101b. As explained above, the total number of basic parts 101a and 101b is 3 or more. This is also possible. Figures 8A and 8B show, as an example, base component 101a and base component 1 This shows a configuration where the total number of 01b is 7. Figures 8A and 8B show the base component 101 Only a and the basic component 101b are shown in the illustration.

[0071] In this embodiment, the operation to change from the state in Figure 8A to the state in Figure 8B is called "folding". The expression "bending" is used. Also, to change from the state in Figure 8B to the state in Figure 8A The term "unfolding" is used to describe the action.

[0072] The inclination angles of surfaces 113 and 114 in base parts 101a and 101b By making adjustments, the gap between base part 101a and base part 101b caused by bending The relative angle can be changed. This angle is the inclination of surface 113 with respect to surface 114. The smaller the value, the smaller it becomes, and the greater the inclination of surface 113 relative to surface 114, the larger it becomes. By adjusting the number of base parts 101a and base parts 101b, the entire angle adjustment device can be adjusted. The maximum angle at which it can be bent can be adjusted.

[0073] In the configurations shown in Figures 8A and 8B, the base components 101a and 101b are arranged alternately. Therefore, cutouts are made between all adjacent base parts 101a and base part 101b. Section 106 is provided.

[0074] Figures 9A and 9B show the configuration of Figures 8A and 8B combined with connecting parts 131a and 131b. These are diagrams illustrating the different states; Figure 9A shows the unfolded state, and Figure 9B shows the folded state.

[0075] Here, the connecting parts 131a and 131b use a configuration different from the one shown in Figure 6B. As shown in Figure 9C, the connecting part 131a has an opening 1 centered on the opening 141a. An opening 143a is provided so as to be symmetrical to 42a. In addition, the connecting part 131b is An opening 143b is provided so as to be symmetrical to opening 142b with respect to opening 141b. It can be done.

[0076] As shown in Figures 9A and 9B, the base component 101a is provided with a connecting component 131a, and the base A connecting part 131b is provided on part 101b. Also, opening 142a and opening 142 b overlaps, and columnar parts 105 are inserted into both. Also, opening 143a and opening 14 3b overlaps, and columnar parts 105 are inserted into both.

[0077] Figures 10A and 10B show the configuration of Figures 9A and 9B combined with connecting parts 102a and 102b. These are diagrams showing the unfolded state, with Figure 10A showing the unfolded state and Figure 10B showing the folded state. Yes, they are.

[0078] In the configurations shown in Figures 10A and 10B, the base components 101a and 101b are arranged alternately. Therefore, all adjacent base parts 101a and base parts 101b have connecting parts. 102a and connecting part 102b are provided.

[0079] This configuration makes it possible to achieve multiple folding shapes and maintain them. However, This can then be effectively used as a hinge for the support device, which will be explained next.

[0080] <Support> Figure 11A is a perspective view illustrating a support 200 equipped with an angle adjustment device 100 according to one embodiment of the present invention. This is a diagram. The support member 200 has two angle adjustment devices 100 (angle adjustment devices 100a, 100a b) It has flat plate sections 161 and 162 and a bent section 165. Figure 11A shows the support 200 This corresponds to the unfolded state.

[0081] The bent portion 165 has a plurality of columnar bodies 166, and one of the longitudinal ends of the columnar bodies 166 is The angle adjustment device 100a is connected to base part 101a or base part 101b. Columnar body The other end of the longitudinal side of 166 is the base part 101a or base of the angle adjustment device 100b It is connected to part 101b. This combination of the bent portion 165 and the angle adjustment device 100 This can be called a hinge. The flat plate portion 161 is connected to one end of the hinge, and the flat plate Part 162 is connected to the other end of the hinge.

[0082] Figure 11B is a perspective view showing a cross-section at the position of line segment A1-A2 shown in Figure 11A. Columnar body 1 66 has a trapezoidal or nearly trapezoidal cross-section perpendicular to its major axis, and as shown in Figure 11C, columnar body 1 66 is the side 167a (the side including one leg of the trapezoid) and the side 167b (the side including the other leg of the trapezoid) (including the side), side 167c (the side including the lower base of the trapezoid), and side 167d (including the upper base of the trapezoid) The curved portion 165 has a plurality of columnar bodies 166, and two adjacent columnar bodies 166 In this case, the side surface 167a of one columnar body 166 and the side surface 167b of the other columnar body 166 are adjacent. It has a compatible configuration.

[0083] Each columnar body 166 has a side surface 167c (the surface including the lower base of the trapezoid) that is continuous and substantial They are connected in such a way that they form a structure. Also, the side surface 167c of the columnar body 166 at one end of the hinge It is connected to the first surface of the flat plate portion 161 so as to be continuous with it. Also, at the other end of the hinge The side surface 167c of the columnar body 166 is connected to the first surface of the flat plate portion 162 so as to be continuous with it. Furthermore, the shape of the side surface 167d (the surface including the upper base of the trapezoid) of each columnar body 166 is different from that of other bodies. It is arbitrary as long as it does not interfere with the columnar body 166 and the flat plate portions 161 and 162. The cross-section perpendicular to the long axis of the columnar body 166 may be triangular or approximately triangular.

[0084] As described above, the flat plate portion 161, the bent portion 165 (the bottom surface of the multiple columnar bodies 166) and the flat plate Section 162 is a continuous plane, and any point A3 on the flat plate section 162 shown in Figure 11B is parallel to it. The distance between any two points A4 on the plate portion 161 remains constant regardless of the state of the bent portion 165. Therefore, when attaching flexible parts to a support, attach them to the plane in question. This is preferable. In one embodiment of the present invention, the unfolded support is as shown in Figures 11A and 11B. Even in this state, the shape can be maintained. Furthermore, the plane in question is formed by multiple columnar parts 105. Designed to be below the plane containing the axis, the plane containing the axes of multiple columnar parts 105 is possible. It is more preferable to bring the flexible component closer to its neutral plane.

[0085] Figure 12A shows the transformation of the support 200 from an unfolded state to a folded state, or This figure shows an example of a transient state (intermediate state) in the reverse of the above. Figure 12B is shown in the same way as Figure 12A. This is a perspective view showing a cross-section at the position of line segment B1-B2.

[0086] Figures 12A and 12B show two adjacent columnar bodies 166, with one columnar body 166 on the side The region where surface 167a and the side surface 167b of the other columnar body 166 are opposite and in contact, and the other adjacent In two matching columnar bodies 166, the side surface 167a of one columnar body 166 and the other columnar body This configuration includes areas where the side surface 167b does not make contact. In one embodiment of the present invention, the support is shown in Figure 1. The shape can be maintained even in transient states as shown in Figure 12B (2A).

[0087] Figure 13A shows the support 200 in a bent state. Figure 13B shows the same as Figure 13A. This is a perspective view showing a cross-section at the point where line segments C1 and C2 meet.

[0088] Figures 13A and 13B show that in all two adjacent columnar bodies 166, one columnar body side This is a configuration in which surface 167a and the side surface 167b of the other columnar body are facing each other and in contact. In the support of this embodiment, even in the bent state shown in Figures 13A and 13B, the shape is It can be held.

[0089] <Display device> The support 200 can be used to support flexible parts. Examples of flexible parts include display panels. By using this method, a flexible display device can be formed.

[0090] Figures 14A and 14B illustrate an example of a foldable display device. The angle adjustment devices 100a and 100b of the component 200 are shown in a simplified manner in Figure 14A. Figure 14B shows the display device in its unfolded state, while Figure 14B shows it in its folded state.

[0091] The display panel 170 is flexible and, for example, is provided on a thin sheet of resin or glass. A display device such as an L display can be used.

[0092] The display panel 170 consists of a flat plate portion 161 and a bent portion 165 (multiple columnar bodies), as shown in Figure 11A, etc. It can be provided along the bottom surface of 166 and the continuous flat surface of the flat plate portion 162. Therefore, as shown in Figure 14B, when folded, the display surface of the display panel is convex. A curved surface is formed.

[0093] Note that in Figures 14A and 14B, the angle adjustment devices 100a and 100b, the flat plate section 161, and the flat plate are shown. Although parts such as section 162 are shown, these may be housed in the casing of the display device.

[0094] Figures 15A and 15B illustrate an example of a tri-foldable display device. The angle adjustment devices 100a, 100b, 100c, and 100d of the device 200 are simplified in the figure. Figure 15A shows the display device in its unfolded state, and Figure 15B shows it in its folded state. It is showing a certain attitude.

[0095] The tri-fold display device is equipped with angle adjustment devices 100c and 100d and a flat plate section 163 on its support. It differs from a folding display device in that it can be used. The flat plate section 163 has an angle adjustment device 100c, 10 It is connected to the flat plate portion 162 via 0d.

[0096] Note that in Figures 15A and 15B, the angle adjustment devices 100a, 100b, 100c, and 100d are shown. The images show flat plate sections 161, 162, and 163, but these are display components. It may be housed in a casing.

[0097] Here, as shown in Figure 15B, the flat plate section 162 and the flat plate section 163 are covered by the display panel. A concave curved surface will be formed on the display surface of the device. Therefore, the angle adjustment device 100c It is preferable to use a different configuration for 100d than for angle adjustment devices 100a and 100b. stomach.

[0098] For example, the angle adjustment devices 100c and 100d use the configurations shown in Figures 16A to 16C. This is possible. Note that the angle adjustment device shown in Figures 16A to 16C is the same as in Figures 15A and 15 The angle adjustment devices 100c and 100d shown in B are in a continuous configuration. Therefore, only one of the symbols is written.

[0099] The angle adjustment device 100c comprises multiple columnar bodies 181 with a rectangular or approximately rectangular cross-section perpendicular to the long axis. There are several. The columnar body 181 has a first side surface (a surface including one side of a roughly rectangular shape) and a second side surface (a roughly rectangular shape). It has a face that includes one side of the shape and the side opposite to it. In a plurality of columnar bodies 181, two adjacent The first side surface of one columnar body 181 and the second side surface of the other columnar body 181 are adjacent to each other. It has such a configuration.

[0100] Each columnar body 181 has a third side surface (a surface containing an edge approximately perpendicular to one side) that forms a continuous surface. They are connected in such a way. Also, the columnar body 181 at one end of the angle adjustment device 100c The side of 3 is connected to the first surface of the flat plate portion 162 so as to be continuous. Also, the angle adjustment device 1 The third side surface of the columnar body 181 at the other end of 00c is continuous with the first surface of the flat plate portion 163. They are connected in such a way. Note that the fourth side of each columnar body 181 (opposite the third side) The shape of the surface (that is to be made) is arbitrary as long as it does not interfere with other columnar bodies and housings.

[0101] As shown in Figure 16A, in two adjacent columnar bodies 181, the number of one columnar body 181 By deforming the side of one and the second side of the other columnar body 181 in a direction that separates them, bending is achieved. This can be achieved. At this time, the third side surfaces of the multiple columnar bodies 181 are at a certain angle. Because they are connected in a continuous manner, a region is formed in which the cross-section is approximately arc-shaped overall. Therefore, A flexible display panel can form a concave curved surface in the area that overlaps with the relevant region. .

[0102] When a transformation (unfolding) is performed from the state shown in Figure 16A, two adjacent parts appear as shown in Figure 16B. In the two columnar bodies 181, the first side of one columnar body 181 and the second side of the other columnar body 181 The side of 2 moves in the direction of approaching, and the radius of curvature of the roughly circular arc described above changes to increase. At that time, the radius of curvature of the curved portion of the display panel also changes to increase.

[0103] If further deformation is performed from the state shown in Figure 16B, the flat plate portion 162 will be as shown in Figure 16C. The first surface, the third side of each columnar body 181, and the first surface of the flat plate portion 163 are flat. They are arranged in a continuous pattern. At this time, the curved parts of the display panel also change to flat, and the whole becomes flat. It will be in the unfolded state. By performing the transformation actions in the reverse order of the above, it can be folded.

[0104] Furthermore, since the cross-section of the columnar body 181 is rectangular, when it is unfolded flat, two adjacent bodies In the columnar body 181, the first side surface of one columnar body 181 and the second side surface of the other columnar body 181 The sides will be in contact. Therefore, the angle adjustment device 100c will be in the opposite direction to the display panel. It does not cause bending, and a mechanism to suppress reverse bending may not be necessary. Spacers may be provided to maintain the gap between the housings when bending.

[0105] Figures 17A to 17C illustrate another example of the angle adjustment devices 100c and 100d. The angle adjustment device 100d will be described below, but the angle adjustment device 100c is also the same. It is structured as follows.

[0106] The angle adjustment device 100d has gear 186a and gear 186b. Gear 186a is a flat plate It is fixed to part 162. Gear 186b is fixed to the flat plate part 163. Inside gear 186a The central axis preferably overlaps with the first surface of the flat plate portion 162. Also, the central axis of the gear 186b It is preferable that this overlaps with the first surface of the flat plate portion 163.

[0107] As shown in Figure 17A, when the gear is folded, the gear 186a and teeth are in a specific position. Assume that the gear 186b is meshed. At this time, the central axis of the gear 186a is the flat plate portion 16 Since the central axis of gear 186b is on the first surface of the flat plate portion 161, the flat plate portion 1 A gap is created between 62 and the flat plate portion 163 (between the opposing display surfaces of the display panel). Therefore, the flexible display panel has a concave shape with a radius of curvature of approximately 1 / 2 of the gap. It can form curved surfaces.

[0108] When a deformation (unfolding) operation is performed from the state shown in Figure 17A, the flat plate portion 162 and the flat plate portion 163 are The angle adjustment device 100d synchronizes with the meshing of gears 186a and 186b. It moves to open as a pivot point (see Figure 17B). At this time, the curved part of the display panel It changes in such a way that the radius of curvature increases.

[0109] When further deformation is performed from the state shown in Figure 17B, the flat plate portion 162 becomes as shown in Figure 17C. The surface of part 1 and the first surface of the flat plate portion 163 are aligned so that they are flat. At this time, the display panel However, the curved parts become flat, and the whole thing unfolds into a flat state. The reverse order of the above. By performing a deformation action, it can be folded.

[0110] Furthermore, a mechanism may be provided to maintain the meshing of gears 186a and 186b. Furthermore, when unfolded flat, the side surface of the flat plate portion 162 and the side surface of the flat plate portion 163 come into contact. Therefore, the angle adjustment device 100d does not cause the display panel to bend in the opposite direction. Since there is no such thing, a mechanism to suppress reverse bending may not be necessary. Note that when bending, the flat part A spacer may be provided to maintain the gap between 162 and the flat plate portion 163. Alternatively, A mechanism for maintaining the cap may be provided on gears 186a and 186b.

[0111] <Application Examples> FIG. 18 is a diagram showing an example of applying the flexible display device shown in this embodiment as an information terminal such as a smartphone. Elements common to the display device described above are labeled with the same reference numerals. The display device 250 shown in FIG. 18A includes a display panel 170, audio input / output units 235a and 235b, cameras 236a and 236b, a sensor 237, and a sensor 220. The audio input / output units 235a and 235b can function as a microphone and a speaker, respectively, when one of them is functioning as a microphone. Therefore, when using the telephone function, for example, conversations can be carried out without inconvenience regardless of which direction the device is held. The microphone function and the speaker function can be switched by a sensor 220 that detects the tilt. Similarly, either one of the cameras 236a and 236b can be prioritized to function by the sensor 220. The input / output units 235a and 235b may have both a device that functions as a microphone and a device that functions as a speaker, or may have a single device that has both functions. Also, both of the input / output units 235a and 235b can function as microphones to record stereo sound. Further, both of the input / output units 235a and 235b can function as speakers to reproduce stereo sound. Further, both of the cameras 236a and 236b can be made to function to capture a 3D image.

[0112] The sensor 237 is a light sensor and can adjust the display brightness so as to be easily visible according to the ambient illuminance. When using the telephone function, for example, conversations can be carried out without inconvenience regardless of which direction the device is held. The microphone function and the speaker function can be switched by a sensor 220 that detects the tilt. Similarly, either one of the cameras 236a and 236b can be prioritized to function by the sensor 220. When using the telephone function, for example, conversations can be carried out without inconvenience regardless of which direction the device is held. The microphone function and the speaker function can be switched by a sensor 220 that detects the tilt. Similarly, either one of the cameras 236a and 236b can be prioritized to function by the sensor 220. The sensor 237 is a light sensor and can adjust the display brightness so as to be easily visible according to the ambient illuminance. When using the telephone function, for example, conversations can be carried out without inconvenience regardless of which direction the device is held. The microphone function and the speaker function can be switched by a sensor 220 that detects the tilt. Similarly, either one of the cameras 236a and 236b can be prioritized to function by the sensor 220.

[0113] The input / output units 235a and 235b may have both a device that functions as a microphone and a device that functions as a speaker, or may have a single device that has both functions. The input / output units 235a and 235b may have both a device that functions as a microphone and a device that functions as a speaker, or may have a single device that has both functions. The input / output units 235a and 235b may have both a device that functions as a microphone and a device that functions as a speaker, or may have a single device that has both functions.

[0114] Also, both of the input / output units 235a and 235b can function as microphones to record stereo sound. Further, both of the input / output units 235a and 235b can function as speakers to reproduce stereo sound. Also, both of the input / output units 235a and 235b can function as microphones to record stereo sound. Further, both of the input / output units 235a and 235b can function as speakers to reproduce stereo sound. Also, both of the input / output units 235a and 235b can function as microphones to record stereo sound. Further, both of the input / output units 235a and 235b can function as speakers to reproduce stereo sound.

[0115] Further, both of the cameras 236a and 236b can be made to function to capture a 3D image. The sensor 237 is a light sensor and can adjust the display brightness so as to be easily visible according to the ambient illuminance. The sensor 237 is a light sensor and can adjust the display brightness so as to be easily visible according to the ambient illuminance.

[0116] Furthermore, as shown in Figure 18B, the front of the display panel 170 of the display device 250 is different from the front of the display panel 170. A display panel 171 may be provided on the opposite rear side. The display panel 171 is a display panel In addition to being able to display the same images as Nel 170, it can also display simple information, pictures, patterns, and photographs. It can also be used as a display or lighting. The display panel 171 has In addition to being able to use display panels with optical or liquid crystal devices, it also has low power consumption. Electronic paper or similar technologies may be used. The display panel 171 uses a rigid substrate as a support. A display panel can also be used.

[0117] Furthermore, as shown in Figure 19A, a display panel 171 is provided on the flat plate portion 16 Even if a display panel 172 is provided on part 2 and a display panel 173 is provided on the flat plate part 163, Good. Display panels 172 and 173 should use display panels equivalent to display panel 171. It is possible.

[0118] Alternatively, as shown in Figure 19B, a flexible display panel 17 is located on the rear surface of the display device 250. 5 may be provided. In this case, the display panel 175 can be bent and therefore provided on the front. It can be provided across the flat plate sections 161 to 163, similar to the display panel 170.

[0119] Furthermore, as shown in Figure 19C, a solar cell 240 may be provided on the rear surface of the display device 250. The electricity generated by the solar cell 240 can be used to charge the battery in the display device 250. Additionally, power can be supplied to an external source via the external interface 245.

[0120] In addition, FIG. 19C shows an example of a solar cell having a rigid support. The solar cell and as, for example, a silicon solar cell having crystalline silicon as a photoelectric conversion layer, or a solar cell such as a tandem-structured solar cell formed by a silicon solar cell and a perovskite solar cell can be used. Yes.

[0121] Alternatively, as shown in FIG. 19D, a solar cell having a flexible substrate as a support may be used. The solar cell may be, for example, a thin-film solar cell such as an amorphous silicon solar cell, a CIGS (Cu-In-Ga- Se) type solar cell, an organic solar cell, or a perovskite solar cell. 141 or the like can be used. The solar cell having a flexible substrate as a support can be provided across the flat plate portions 161 to 163 in the same manner as the display panel 1

[0122] (Embodiment 2) In this embodiment, a configuration example of a display panel applicable to a display device according to an aspect of the present invention will be described.

[0123] <Configuration Example> FIG. 20 shows a top view of a display panel 700. The display panel 700 is applied with a flexible support substrate 745 and can be used as a flexible display. The display panel 700 has a pixel portion 702 provided on a flexible support substrate 745. A source driver circuit portion �04, a pair of gate driver circuit portions 7 06, wirings 710, etc. are provided on the support substrate 745. A plurality of display devices are provided in the pixel portion 702.

[0124] Also, a part of the support substrate 745 has an FPC 716 (FPC: Flexible print An FPC terminal section 708 is provided to which the ed circuit is connected. FPC71 6, via the FPC terminal section 708 and wiring 710, connects the pixel section 702 and the source drive Various signals are supplied to the IBA circuit section 704 and the gate driver circuit section 706, respectively. It can be done.

[0125] A pair of gate driver circuit sections 706 are provided on both sides of the pixel section 702. Oh, the gate driver circuit section 706 and the source driver circuit section 704 are semiconductors The IC chip may be formed separately on a substrate or the like and packaged. The chip is mounted on the support substrate 745 using COF (Chip On Film) technology, etc. It is possible.

[0126] The pixel section 702, the source driver circuit section 704, and the gate driver circuit section 706 have It is preferable to apply an OS transistor to the transistor.

[0127] A light-emitting device or the like can be used as the display device provided in the pixel section 702. Examples of optical devices include LEDs (Light Emitting Diodes) and OLEDs. (Organic LED), QLED (Quantum-dot LED), Semiconductor LED Examples include self-illuminating light-emitting devices such as LEDs. Also, as display devices, transmissive type Liquid crystal devices such as reflective liquid crystal devices and semi-transmissive liquid crystal devices It can also be used. Furthermore, shutter-type or optical interference-type MEMS (Micro Electro-Mechanical Systems) devices, microcapsules Methods include electrophoresis, electrowetting, or electronic powder fluid (registered trademark) method. Display devices that incorporate formulas or other methods can also be used.

[0128] Furthermore, in Figure 20, the portion of the support substrate 745 on which the FPC terminal portion 708 is provided protrudes. An example of a shape is shown. A portion of the support substrate 745, including the FPC terminal portion 708, is shown in Figure 2. In region P1, it can be folded back to the other side. This involves folding back a portion of the support substrate 745. Then, with the FPC 716 placed on top of the back of the pixel section 702, the display panel 700 is powered It can be implemented in sub-devices, etc., and contributes to space saving and miniaturization of electronic devices, etc. .

[0129] Furthermore, the IC717 is mounted on the FPC716, which is connected to the display panel 700. IC717 functions, for example, as a source driver circuit. In this case, the display panel... The source driver circuit section 704 in 700 includes a protection circuit, a buffer circuit, and a demultiplier. The configuration may include at least one such circuit, such as a weed circuit.

[0130] <Example of cross-sectional configuration> In the following, we will use Figures 21 and 22 to describe a configuration using organic EL as the display device. Let me explain. Figures 21 and 22 show the display panel 700 shown in Figure 20, respectively. This is a schematic cross-sectional view of the area indicated by the dashed line ST.

[0131] First, let's explain the common parts of the display panels shown in Figures 21 and 22.

[0132] Figures 21 and 22 show the pixel section 702, the gate driver circuit section 706, and the FPC terminal. The image shows a cross-section including part 708. The pixel part 702 includes transistor 750 and It has a transistor 790. The gate driver circuit section 706 has a transistor 752.

[0133] Transistors 750 and 752 have an acid in the semiconductor layer where the channel is formed. This is a transistor that uses a synthetic semiconductor. However, it is not limited to this; the semiconductor layer can also be silicon (Amorphous silicon, polycrystalline silicon, or single-crystal silicon), organic semiconductors A Rangista can also be applied.

[0134] The transistor used in this embodiment is made of highly purified oxide semiconductor material with suppressed oxygen vacancy formation. It has a conductive film. The transistor can significantly reduce the off-current. Therefore, Pixels to which such transistors are applied can increase the retention time of electrical signals such as image signals, and image The writing interval for signals, etc., can also be set to be longer. Therefore, the frequency of refresh operations can be reduced. Therefore, power consumption can be reduced.

[0135] Furthermore, the transistor used in this embodiment can obtain a relatively high field-effect mobility. , high-speed operation is possible. For example, a transistor capable of such high-speed operation can be used in a display panel. By using it in the pixel section, the switching transistor and the drive circuit used in the drive circuit are used. A transistor can be formed on the same substrate. That is, by using a silicon wafer, A configuration that does not apply a pre-formed drive circuit is also possible, thereby reducing the number of components in the display device. This is possible. Furthermore, by using transistors capable of high-speed driving in the pixel section, We can provide high-quality images.

[0136] Capacitor 790 is made from the same film as the first gate electrode of transistor 750. A lower electrode formed by processing a metal oxide film identical to the semiconductor layer, and an upper electrode formed by processing the same metal oxide film as the semiconductor layer. The upper electrode is similar to the source and drain regions of transistor 750. The resistance has been reduced. Also, between the lower electrode and the upper electrode, the number of transistor 750 A portion of the insulating film, which functions as a gate insulating layer, is provided. That is, capacitor 79 0 has a multilayer structure in which an insulating film, which functions as a dielectric film, is sandwiched between a pair of electrodes. Furthermore, the upper electrode has the same film as the source and drain electrodes of transistor 750. Wiring obtained by processing is connected.

[0137] Furthermore, on transistor 750, transistor 752, and capacitor 790, An insulating layer 770 that functions as a protective film is provided.

[0138] The transistor 750 in the pixel section 702 and the transistor in the gate driver circuit section 706 Transistors with different structures may be used instead of the 752 transistor. For example, either one of them A top-gate transistor is applied to one side, and a bottom-gate transistor is applied to the other side. The above configuration is also acceptable. Furthermore, the source driver circuit section 704 also has a gate driver. This is the same as the IBA circuit section 706.

[0139] The FPC terminal section 708 includes wiring 760, part of which functions as a connecting electrode, and an anisotropic conductive film 780. , and FPC716. Wiring 760 is connected to FPC71 via an anisotropic conductive film 780. It is electrically connected to the terminals of 6. Here, wiring 760 is connected to transistor 750, etc. The source and drain electrodes are formed from the same conductive film.

[0140] Next, we will explain the display panel 700 shown in Figure 21.

[0141] The display panel 700 shown in Figure 21 has a support substrate 745 and a support substrate 740. The substrate 745 and the support substrate 740 can be, for example, a glass substrate or a plastic substrate. A substrate with flexibility such as the above can be used.

[0142] Transistors 750, 752, capacitor 790, etc. are placed on the insulating layer 744. The support substrate 745 and the insulating layer 744 are bonded together by an adhesive layer 742. .

[0143] The display panel 700 also includes a light-emitting device 782, a colored layer 736, a light-shielding layer 738, and the like. .

[0144] The light-emitting device 782 has a conductive layer 772, an EL layer 786, and a conductive layer 788. The electrode layer 772 is electrically connected to the source electrode or drain electrode of the transistor 750. The conductive layer 772 is provided on the insulating layer 770 and functions as a pixel electrode. An insulating layer 730 is provided to cover the end of the conductive layer 772, and the insulating layer 730 and the conductive layer 772 An EL layer 786 and a conductive layer 788 are laminated on top of it.

[0145] The conductive layer 772 can be made of a material that is reflective to visible light. For example, Materials containing aluminum, silver, etc. can be used. In addition, the conductive layer 788 is made of visible light A translucent material can be used for this purpose. For example, indium, zinc, tin, etc. It is preferable to use an oxide material containing [the specified element]. Therefore, the light-emitting device 782 is positioned opposite the surface to be formed. This is a top-emission type light-emitting device that emits light toward the side (support substrate 740 side).

[0146] The EL layer 786 contains organic compounds or inorganic compounds such as quantum dots. 6 contains a light-emitting material that emits blue light when an electric current flows through it.

[0147] Examples of luminescent materials include fluorescent materials, phosphorescent materials, and thermally activated delayed fluorescence (thermally ac activated delayed fluorescence (TADF) materials, mineralization Compounds (such as quantum dot materials) can be used. The materials used include colloidal quantum dot materials, alloy-type quantum dot materials, and core-shell type quantum dot materials. Examples include sub-dot materials and core-type quantum dot materials.

[0148] The light-shielding layer 738 and the colored layer 736 are provided on one side of the insulating layer 746. 36 is positioned to overlap with the light-emitting device 782. Also, the light-shielding layer 738 is positioned to cover the image. In the element 702, it is provided in an area that does not overlap with the light-emitting device 782. Layer 738 may also be provided on top of the gate driver circuit section 706, etc.

[0149] The support substrate 740 is bonded to the other side of the insulating layer 746 by an adhesive layer 747. Furthermore, the support substrate 740 and the support substrate 745 are bonded together by a sealing layer 732. .

[0150] Here, the EL layer 786 of the light-emitting device 782 is defined as a light-emitting material that exhibits white light emission. The material is applied. The white light emitted by the light-emitting device 782 is due to the colored layer 736. It is colored and emitted to the outside. The EL layer 786 is provided across pixels exhibiting different colors. The pixel section 702 transmits either red (R), green (G), or blue (B). By arranging pixels with a colored layer 736 in a matrix, the display panel 700 is configured as follows: It can display in full color.

[0151] Furthermore, a conductive film having transparency and reflectivity may be used as the conductive layer 788. This enables the realization of a microcavity structure between conductive layer 772 and conductive layer 788. Furthermore, it is possible to configure it to intensify and emit light of a specific wavelength. Also, in this case, the conductive layer 7 An optical adjustment layer is placed between 72 and the conductive layer 788 to adjust the optical distance, and the optical adjustment By varying the thickness of the layer between pixels of different colors, the light emitted from each pixel... A configuration that enhances color purity is also acceptable.

[0152] Furthermore, the EL layer 786 is formed in an island-like pattern for each pixel or in a striped pattern for each row of pixels, i.e., color-coded. When formed by this method, the configuration does not include a colored layer 736 or the optical adjustment layer described above. That is also acceptable.

[0153] Here, insulating layer 744 and insulating layer 746 each function as a barrier film with low moisture permeability. It is preferable to use an inorganic insulating film. Between such insulating layer 744 and insulating layer 746 By having the light-emitting device 782 and transistor 750 etc. sandwiched together, This suppresses degradation and enables the creation of highly reliable display panels.

[0154] The display panel 700A shown in Figure 22 is located between the adhesive layer 742 and the insulating layer 744 shown in Figure 21. A resin layer 743 is provided. In addition, a protective layer 749 is provided instead of the support substrate 740. do.

[0155] The resin layer 743 is a layer containing an organic resin such as polyimide or acrylic. Insulating layer 74 4 contains an inorganic insulating film such as silicon oxide, silicon oxide nitride, or silicon nitride. Resin layer 7 43 and the support substrate 745 are bonded together by an adhesive layer 742. The resin layer 743 is It is preferable that the substrate is thinner than the support substrate 745.

[0156] The protective layer 749 is bonded to the sealing layer 732. The protective layer 749 is made of glass substrate A plate or resin film can be used. Also, as the protective layer 749, a polarizing plate ( Optical components such as circular polarizers, scattering plates, input devices such as touch sensor panels, or A configuration in which two or more of these are stacked may also be applied.

[0157] Furthermore, the EL layer 786 of the light-emitting device 782 is on the insulating layer 730 and the conductive layer 772. They are arranged in an island-like configuration. The EL layer 786 is designed so that each sub-pixel emits a different color. This makes it possible to achieve color display without using the colored layer 736.

[0158] Furthermore, a protective layer 741 is provided covering the light-emitting device 782. The protective layer 741 is The protective layer 741 has the function of preventing impurities such as water from diffusing into the optical device 782. From the conductive layer 788 side, the insulating layer 741a, insulating layer 741b, and insulating layer 741c are in this order. It has a laminated structure made up of layers. In this case, insulating layer 741a and insulating layer 741c are An inorganic insulating film with high barrier properties against impurities such as water is used for the insulating layer 741b, and a planarized film is used for the insulating layer 741b. It is preferable to use organic insulating films that function in this way. Also, the protective layer 741 is a gate It is preferable that the driver circuit section 706 also extends to the driver circuit section.

[0159] Furthermore, inside the sealing layer 732, transistors 750 and 752 It is preferable that the organic insulating film covering the above is formed in an island-like manner. In other words, the organic insulating film The end of the part is located inside the sealing layer 732, or in a region that overlaps with the end of the sealing layer 732. Preferably, in Figure 22, the insulating layer 770, insulating layer 730, and insulating layer 741b are island-shaped. This shows an example of how it is processed. For example, in the part that overlaps with the sealing layer 732, the insulating layer 741 c and the insulating layer 741a are provided in contact. In this way, transistor 750 and Furthermore, the surface of the organic insulating film covering transistor 752 is not exposed beyond the sealing layer 732. By configuring it this way, the transistor 750 and the transistor can be accessed from the outside via the organic insulating film. This effectively prevents water or hydrogen from diffusing into the STA752. This suppresses fluctuations in the electrical characteristics of the inverter, enabling the realization of an extremely reliable display device.

[0160] Furthermore, in Figure 22, in the bendable region P1, the support substrate 745 and the adhesive layer 742 In addition, there are parts where an inorganic insulating film such as the insulating layer 744 is not provided. Also, in region P1 Therefore, to prevent the wiring 760 from being exposed, an insulating layer 770 containing organic material is applied to the wiring 760. It has a structure that covers the area. The inorganic insulating film is provided as little as possible in the foldable region P1. Furthermore, the structure consists of only a conductive layer containing a metal or alloy and a layer containing an organic material. This prevents cracks from forming when the substrate is bent. Also, the support substrate 74 in region P1 By omitting the 5, a portion of the display panel 700A can be bent with an extremely small radius of curvature. It is possible.

[0161] Furthermore, in Figure 22, a conductive layer 761 is provided on the protective layer 741. 1 can be used as wiring or an electrode.

[0162] Furthermore, the conductive layer 761 is used when a touch sensor is installed on top of the display panel 700A. An electrostatic discharge (ESD) is used to prevent electrical noise generated when driving pixels from being transmitted to the touch sensor. It can function as a shielding film. At this time, a predetermined constant potential is applied to the conductive layer 761. It should be configured in a way that allows it to function.

[0163] Alternatively, the conductive layer 761 can be used, for example, as an electrode for a touch sensor. This allows the display panel 700A to function as a touch panel. For example, conductive Layer 761 can be used as an electrode or wiring for a capacitive touch sensor. At this time, the conductive layer 761 is connected to the wiring or electrodes to which the detection circuit is connected, or the sensor signal is It can be used as input wiring or electrodes. Thus, the light-emitting device 782 By integrating a touch sensor into the surface, the number of parts can be reduced, lowering the manufacturing costs of electronic devices and other components. It can be reduced.

[0164] The conductive layer 761 is preferably provided in a portion that does not overlap with the light-emitting device 782. For example, the conductive layer 761 can be provided in a position that overlaps with the insulating layer 730. As the electrode layer 761, there is no need to use a transparent conductive film with relatively low conductivity, and high conductivity gold is used. Because materials such as metals or alloys can be used, the sensitivity of the sensor can be increased.

[0165] Furthermore, the touch sensor method that can be constructed using the conductive layer 761 is: Not limited to quantitative methods, but also include resistive film methods, surface acoustic wave methods, infrared methods, optical methods, pressure-sensitive methods, etc. Various methods can be used. Alternatively, two or more of these methods can be used in combination. .

[0166] <Components> The following describes the components, such as transistors, that can be applied to display devices.

[0167] [Transistor] A transistor consists of a conductive layer that functions as a gate electrode, a semiconductor layer, and a source electrode. A conductive layer that can perform certain functions, a conductive layer that functions as a drain electrode, and an insulating layer that functions as a gate insulating layer. It has a marginal layer.

[0168] Furthermore, the structure of the transistors in the display device according to one aspect of the present invention is not particularly limited. For example... For example, it could be a planar transistor or a staggered transistor. It may also be an inverse staggered transistor. Furthermore, a top-gate or bottom-gate type may be used. Any of the following transistor structures may be used. Alternatively, gate electrodes may be provided above and below the channel. It's okay if it's done that way.

[0169] The crystallinity of semiconductor materials used in transistors is not particularly limited; amorphous semiconductors, monocrystalline semiconductors, etc. Crystalline semiconductors, or semiconductors having crystalline properties other than single crystals (microcrystalline semiconductors, polycrystalline semiconductors, Either a single-crystal semiconductor or a semiconductor having a crystalline region in part may be used. Using a semiconductor with crystalline properties is preferable because it can suppress the degradation of transistor characteristics.

[0170] The following describes transistors that use metal oxide films as the semiconductor layer in which channels are formed. I will explain.

[0171] The semiconductor material used in the transistor preferably has an energy gap of 2 eV or more. A metal oxide with a voltage of 2.5 eV or higher, more preferably 3 eV or higher, can be used. Typical examples include indium-containing oxide semiconductors, such as CAAC-O, which will be discussed later. S or CAC-OS can be used. CAAC-OS is an atom that makes up the crystal. It is stable and suitable for transistors and other applications where reliability is important. In addition, CAC-OS is high Because it exhibits mobility characteristics, it is suitable for transistors and other devices that require high-speed operation.

[0172] OS transistors have a large energy gap in the semiconductor layer, so several yA / μm (channels It can exhibit extremely low off-current characteristics (current value per 1 μm of width). OS transistors are designed to address impact ionization, avalanche breakdown, and short-channel effects. It has characteristics different from Si transistors, such as not producing defects, and forms highly reliable circuits. This is possible. Furthermore, the electrical properties caused by the crystalline inhomogeneity, which is a problem in Si transistors, can be reduced. OS transistors are also less prone to variations in characteristics.

[0173] The semiconductor layer is made of, for example, indium, zinc, and M (where M is aluminum, titanium, or gallium). Germanium, yttrium, zirconium, lanthanum, cerium, tin, neodymium In-M-Zn oxide containing one or more metals selected from hafnium, etc. The film can be represented as such. In-M-Zn oxides are, for example, sputtering The G method, ALD (Atomic layer deposition) method, or MOCVD (Metal organic chemical vapor deposition) method, etc. can be used for formation. D (Metal organic chemical vapor deposition n) method, etc.

[0174] When forming an In-M-Zn-based oxide by sputtering method, the atomic ratio of metal elements in the sputtering target preferably satisfies In ≥ M and Zn ≥ M. As such atomic ratios of metal elements in the sputtering target, In:M:Zn = 1:1:1, In :M:Zn = 1:1:1.2, In:M:Zn = 3:1:2, In:M:Zn = 4:2: 3, In:M:Zn = 4:2:4.1, In:M:Zn = 5:1:6, In:M:Zn = 5:1:7, In:M:Zn = 5:1:8, etc. are preferable. Note that the atomic ratio of the semiconductor layer to be formed includes fluctuations of minus 40% of the atomic ratio of the metal elements contained in the above sputtering target respectively. As the semiconductor layer, a metal oxide film with a low carrier density is used. For example, the carrier density of the semiconductor layer is 1×10 / cm or less, preferably 1×10

[0175] / cm or less, more preferably 1×10 17 / cm 3 or less, still more preferably 1×10 15 / cm 3 or less, even more preferably 1×10 / cm 13 or less, yet more preferably 1×10 3 / cm 11 or less, still yet more preferably 1×10 3 / cm or less, and most preferably less than 1×10 10 / cm 3 and metal oxides of 1×10 -9 / cm 3 or more can be used. Such metal oxides are high-purity intrinsic or substantially high-purity intrinsic ​These are called metal oxides. These oxide semiconductors have a low defect level density and possess stable metal properties. It can be said to be an oxide.

[0176] Furthermore, this is not limited to the semiconductor characteristics and electrical characteristics (field effect) of the transistor as needed. An oxide semiconductor with an appropriate composition should be used depending on the fruit mobility, threshold voltage, etc. To obtain the required semiconductor characteristics of the transistor, the carrier density of the semiconductor layer and the impurity concentration... The degree, defect density, atomic ratio of metal elements to oxygen, interatomic distance, density, etc., should be appropriate. It is preferable.

[0177] In the metal oxide that constitutes the semiconductor layer, silicon or carbon, which is one of the Group 14 elements. When present, oxygen vacancies increase in the semiconductor layer, causing it to become n-type. The concentration of silicon or carbon in the body layer (concentration obtained by secondary ion mass spectrometry) , 2×10 18 atoms / cm 3 The following is preferably 2 × 10 17 atoms / cm 3 Below It will be below.

[0178] Furthermore, alkali metals and alkaline earth metals generate carriers when they combine with metal oxides. This can sometimes lead to an increase in the transistor's off-current. Alkali metals or alkaline earth metals obtained by secondary ion mass spectrometry in the layer The concentration is 1 × 10 18 atoms / cm 3 The following is preferably 2 × 10 16 ate / c m 3 Do the following:

[0179] Furthermore, if nitrogen is present in the metal oxide that makes up the semiconductor layer, electrons, which are carriers, are produced. As a result, the carrier density increases, making it easier to convert to n-type. This is a result of nitrogen-containing metal oxides. Transistors using this technology tend to exhibit normally-on characteristics. Therefore, two semiconductor layers The nitrogen concentration obtained by secondary ion mass spectrometry is 5 × 10⁻⁶ 18 atoms / cm 3 Below It is preferable to do so.

[0180] Furthermore, if hydrogen is present in the oxide semiconductor that makes up the semiconductor layer, the acid will bond with the metal atom. Because it reacts with elements to form water, it can sometimes form oxygen vacancies in oxide semiconductors. If the channel formation region in the conductor contains oxygen vacancies, the transistor will be normally-on This can be a characteristic. Furthermore, a defect where hydrogen is present in the oxygen deficiency can function as a donor, Sometimes, electrons, which are carriers, are generated. Also, some of the hydrogen combines with metal atoms. It can combine with other elements to generate electrons, which act as carriers. Therefore, it contains a large amount of hydrogen. Transistors using oxide semiconductors tend to exhibit normally-on characteristics.

[0181] Defects where hydrogen fills an oxygen vacancy can function as donors for oxide semiconductors. However, Therefore, it is difficult to quantitatively evaluate the defect. In oxide semiconductors, In some cases, the evaluation is based on the carrier concentration rather than the acid concentration. Therefore, in this specification, etc., acid As a parameter for the ionized semiconductor, we assume a state where no electric field is applied, rather than the donor concentration. In some cases, a carrier concentration may be used. In other words, the "carrier concentration" described in this specification, etc., is This can sometimes be rephrased as "donor concentration."

[0182] Therefore, it is preferable that the hydrogen content in the oxide semiconductor be reduced as much as possible. Specifically, In oxide semiconductors, secondary ion mass spectrometry (SIMS) is used. The hydrogen concentration obtained by mass spectrometry is 1 × 10⁻⁶ 20 a toms / cm 3 Less than 1 × 10 19 atoms / cm 3 Less than, more preferably is 5 x 10 18 atoms / cm 3 Less than 1 × 10 18 ate / c m 3 It shall be less than. Oxide semiconductors in which impurities such as hydrogen have been sufficiently reduced are used in transistors. By using it in the channel formation region, stable electrical properties can be imparted.

[0183] Furthermore, oxide semiconductors (metal oxides) include single-crystal oxide semiconductors and other non-single-crystal oxides. They can be divided into monocrystalline semiconductors and non-single-crystal oxide semiconductors. Examples of non-single-crystal oxide semiconductors include CAAC-OS( C-Axis Aligned Crystalline Oxide Semicon ductor), polycrystalline oxide semiconductor, nc-OS (nanocrystalline Oxide semiconductor, pseudo-amorphous oxide semiconductor (a-like OS: amorphous-like oxide semiconductor), These include amorphous oxide semiconductors. In non-single crystal structures, amorphous structures have the most defect levels. Despite its high density, CAAC-OS has the lowest defect level density.

[0184] Amorphous oxide semiconductor films, for example, have a disordered atomic arrangement and do not contain crystalline components. Alternatively, an amorphous oxide film may have a completely amorphous structure and no crystalline parts. stomach.

[0185] Furthermore, the semiconductor layer consists of regions with an amorphous structure, regions with a microcrystalline structure, regions with a polycrystalline structure, and CAAC. - A mixed film having two or more regions from among the OS region and the single-crystal structure region. The film may have a monolayer structure or a multilayer structure, for example, containing two or more of the regions described above. It may have a structure.

[0186] Furthermore, the semiconductor layer of the transistor disclosed in one aspect of the present invention includes CAC-OS(Clo ud-Aligned Composite oxide semiconductor ) may also be used.

[0187] Furthermore, the semiconductor layer of the transistor disclosed in one aspect of the present invention is the non-single-crystal oxide described above. Semiconductors or CAC-OS can be suitably used. Also, non-single-crystal oxide semiconductors and In this regard, nc-OS or CAAC-OS can be suitably used.

[0188] In one aspect of the present invention, it is preferable to use CAC-OS as the semiconductor layer of the transistor. It seems that using CAC-OS gives transistors high electrical characteristics or high reliability. It can be granted.

[0189] Furthermore, the semiconductor layer is divided into CAAC-OS region, polycrystalline oxide semiconductor region, and nc-OS region. Two or more of the following regions: pseudo-amorphous oxide semiconductor region and amorphous oxide semiconductor region. It may be a mixed film containing any two or more of the regions described above. It may have a single-layer structure or a layered structure that includes the region.

[0190] <Configuration of CAC-OS> Hereinafter, the configuration of CAC (Cl oud-Aligned Composite)-OS that can be used for the transistor disclosed in one aspect of the present invention will be described.

[0191] CAC-OS is, for example, a material in which the elements constituting the metal oxide are unevenly distributed in a size of 0.5 nm or more and 10 nm or less , preferably 1 nm or more and 2 nm or less, or in the vicinity of that size. In the following, in the metal oxide, one or more metal elements are unevenly distributed , and the region having the metal element is in a mixed state in a size of 0.5 nm or more and 10 nm or less, preferably 1 nm or more 2 nm or less, or in the vicinity of that size, and is also referred to as a mosaic state or a patch state.

[0192] The metal oxide preferably contains at least indium. Particularly preferably contains indium and zinc. In addition to these, one or more selected from aluminum, gallium, yttrium , lithium, copper, vanadium, beryllium, boron, silicon, titanium, iron, nickel, germanium , zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum , tungsten, or magnesium may be included. [[ID=3 forty]]

[0193] For example, in In-Ga-Zn oxide, CAC-OS (among CAC-OS, In-G a-Zn oxide may be particularly referred to as CAC-IGZO.) is indium oxide (hereinafter, InO X1 (X1 is a real number greater than 0).), or indium zinc oxide (hereinafter, In X2 Zn Y2 ​O Z2 (X2, Y2, and Z2 are real numbers greater than 0) Let's assume that...) and gallium oxide (hereinafter referred to as GaO X3 (Let X3 be a real number greater than 0) . ), or gallium zinc oxide (hereinafter referred to as Ga X4 Zn Y4 O Z4 (X4, Y4, and Let Z4 be a real number greater than 0. The material separates into parts such as ), resulting in a mosaic pattern. and a mosaic-like InO X1 , or In X2 Zn Y2 O Z2 However, it was uniformly distributed in the membrane. This configuration (hereinafter also referred to as cloud-based) is as follows.

[0194] In other words, CAC-OS is GaO X3 The region in which is the main component, and In X2 Zn Y2 O Z2 , or InO X1 A composite metal oxide having a composition in which a region is the main component and a region is mixed. Yes. In this specification, for example, the atomic ratio of In to element M in the first region is The first region is greater than the atomic ratio of In to element M in the second region. Assume that the concentration of In is higher compared to the other region.

[0195] Note that IGZO is a common name and refers to a single compound composed of In, Ga, Zn, and O. There are combinations. A typical example is InGaO3(ZnO). m1 (m1 is a natural number), or In ( 1+x0) Ga (1-x0) O3(ZnO) m0 (-1≦x0≦1, m0 is any number) Examples of crystalline compounds include those that are produced.

[0196] The above crystalline compounds have a single-crystal structure, a polycrystalline structure, or a CAAC structure. A CAAC structure is one in which multiple IGZO nanocrystals have c-axis orientation and in the ab-plane. This is a crystal structure in which the elements are linked without orientation.

[0197] On the other hand, CAC-OS relates to the material composition of metal oxides. CAC-OS is In, Ga In a material composition containing Zn and O, it was observed that Ga was the main component in part of the nanoparticles. The region is observed to be mo This refers to a configuration in which elements are randomly dispersed in a zigzag pattern. Therefore, in CAC-OS, Crystal structure is a secondary factor.

[0198] Furthermore, CAC-OS does not include a layered structure of two or more films with different compositions. For example, a structure consisting of two layers, one with In as the main component and the other with Ga as the main component, is included. do not have.

[0199] Note that GaO X3 The region in which is the main component, and In X2 Zn Y2 O Z2 , or InO X1 but In some cases, a clear boundary may not be observable between the principal component region and the surrounding area.

[0200] Note that aluminum, yttrium, copper, vanadium, and beryllium can be used instead of gallium. Boron, silicon, titanium, iron, nickel, germanium, zirconium, molybdenum Lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, or magnesium If one or more species selected from Cium, etc., are included, CAC-OS will be partially The region is observed to be in the form of nanoparticles mainly composed of the metal element, and a part of it is mainly composed of In. The regions observed in the nanoparticle form are randomly dispersed in a mosaic-like manner. say.

[0201] CAC-OS is formed, for example, by sputtering under conditions where the substrate is not intentionally heated. It is possible. Also, when forming CAC-OS by sputtering, the deposition gas and Then, selected from inert gases (typically argon), oxygen gas, and nitrogen gas. You may use one or more of them. Also, the oxygen in relation to the total flow rate of the deposition gas during film formation. A lower gas flow rate ratio is preferable; for example, a flow rate ratio of oxygen gas of 0% or more and less than 30% is preferable. Alternatively, it is preferable to have a value of 0% or more and 10% or less.

[0202] CAC-OS is a type of X-ray diffraction (XRD) measurement method. When measured using the θ / 2θ scan method, which is the only Out-of-plane method, It is characterized by the absence of a clear peak. In other words, from X-ray diffraction measurements, It can be seen that no orientation is observed in the ab-plane direction or the c-axis direction of the region.

[0203] Furthermore, CAC-OS uses an electron beam with a probe diameter of 1 nm (also called a nanobeam electron beam). In the electron diffraction pattern obtained by irradiation, a ring-shaped region with high brightness and Multiple bright spots are observed within the ring-shaped region. Therefore, from the electron diffraction pattern, C The crystal structure of AC-OS is non-oriented in both the planar and cross-sectional directions. It can be seen that it has a nano-crystal structure.

[0204] For example, in CAC-OS in In-Ga-Zn oxide, energy-dispersive X-rays Spectroscopy (EDX: Energy Dispersive X-ray spectroscopy) GaO X3 The region in which is the main component and In X2 Zn Y2 O Z2 , or InO X1 Regions where it is the main component are unevenly distributed and mixed. It can be confirmed that it has the following structure.

[0205] CAC-OS has a different structure from IGZO compounds in which metal elements are uniformly distributed, It has different properties from ZO compounds. In other words, CAC-OS is GaO X3 These are the main components. In a certain area, X2 Zn Y2 O Z2 , or InO X1 The region in which is the main component, and It exhibits phase separation, and has a mosaic-like structure in which regions composed of each element are the main components.

[0206] Here, In X2 Zn Y2 O Z2 , or InO X1 The region in which is the main component is GaO X3 Compared to regions where these are the main components, this region has high conductivity. In other words, In X2 Zn Y 20 Z2 , or InO X1 As carriers flow through the region where the main component is metal, Conductivity as an oxide is exhibited. Therefore, In X2 Zn Y2 O Z2 , or InO X1Regions where [substance] is the main component are distributed in a cloud-like manner within the metal oxide, enabling a high field effect mobility (μ) to be achieved.

[0207] On the other hand, regions where GaO X3 etc. are the main component are regions with higher insulation compared to regions where In X2 Zn Y2 O Z2 or InO X 1 is the main component. That is, when regions where GaO X3 etc. are the main component are distributed in the metal oxide, leakage current can be suppressed and good switching operation can be achieved.

[0208] Therefore, when CAC-OS is used in a semiconductor device, the insulation X3 caused by GaO and the conductivity caused by In X2 Zn Y2 O Z2 or InO X1 act complementarily, enabling a high on-current (I ) and a high field effect mobility (μ) to be realized. on

[0209] In addition, a semiconductor device using CAC-OS has high reliability. Therefore, CAC-OS is optimal for various semiconductor devices including displays.

[0210] Also, a transistor having CAC-OS in the semiconductor layer has a high field effect mobility and high driving ability. Therefore, by using this transistor in a driving circuit, typically a scanning line driving circuit that generates a gate signal, a display device with a narrow border width (also referred to as a narrow border) can be provided. Also, by using this transistor in a signal line driving circuit of a display device (particularly, a signal line driving By using it in a demultiplexer connected to the output terminal of the shift register of the circuit. This makes it possible to provide a display device with a small number of wires connected to it.

[0211] Furthermore, transistors with CAC-OS in the semiconductor layer use low-temperature polysilicon transistors Unlike ZISTA, it does not require a laser crystallization process. Therefore, it is suitable for use with large-area substrates. Even with equipment, it is possible to reduce manufacturing costs. Furthermore, ultra-high-definition ("4K resolution", "4K2K", "4K"), Super Hi-Vision ("8K resolution") High resolution such as "8K4K" and "8K" are used in large display devices, and half By using transistors with CAC-OS in the conductor layer in the drive circuit and display unit, short It is preferable because it allows for time-based writing and reduces display errors.

[0212] Alternatively, silicon may be used as the semiconductor in which the transistor channel is formed. Amorphous silicon may be used as the silicon, but crystalline silicon is particularly preferred. Preferably, microcrystalline silicon, polycrystalline silicon, monocrystalline silicon, etc. are used. It is preferable that... In particular, polycrystalline silicon can be formed at a lower temperature than single-crystal silicon. Furthermore, it possesses higher field-effect mobility and greater reliability compared to amorphous silicon.

[0213] <Conductive layer> In addition to the gate, source, and drain of a transistor, various wirings that make up a display device and Materials that can be used for conductive layers such as electrodes include aluminum, titanium, and chromium. Nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, or tan Examples include metals such as gusten, or alloys in which it is the main component. A film containing the material can be used as a single layer or as a multilayer structure. For example, a film containing silicon. A single-layer structure of aluminum film, a double-layer structure in which an aluminum film is laminated on a titanium film, tungsten A two-layer structure with an aluminum film laminated on a stainless steel film, copper-magnesium-aluminum alloy. Two-layer structure with a copper film laminated on a film, two-layer structure with a copper film laminated on a titanium film, tungsten film A two-layer structure with a copper film laminated on top, a titanium film or titanium nitride film, and an aluminum layer on top of that. A three-layer structure is formed by laminating a um or copper film, and then forming a titanium film or titanium nitride film on top of it. The structure consists of a molybdenum film or molybdenum nitride film, with an aluminum film or copper film layered on top of it. A three-layer structure in which a film is stacked and then a molybdenum film or molybdenum nitride film is formed on top of it, etc. There are also oxides such as indium oxide, tin oxide, or zinc oxide. Using copper containing manganese is preferable because it improves the controllability of the shape through etching.

[0214] <Insulating layer> Examples of insulating materials that can be used for each insulating layer include resins such as acrylic and epoxy. In addition to lipids and resins containing siloxane bonds, silicon oxide, silicon oxide nitride, silicon oxide nitride Inorganic insulating materials such as condensate, silicon nitride, and aluminum oxide can also be used.

[0215] Furthermore, it is preferable that the light-emitting device is provided between a pair of insulating films with low water permeability. This prevents impurities such as water from entering the light-emitting device, thus improving the reliability of the device. The decline can be suppressed.

[0216] Examples of low-permeability insulating films include films containing nitrogen and silicon such as silicon nitride films and silicon oxynitride films, films containing nitrogen and aluminum such as aluminum nitride films, and the like. Further, silicon oxide films, silicon oxynitride films, aluminum oxide films, etc. may also be used. For example, the water vapor transmission rate of a low-permeability insulating film is 1×10 [g / (m

[0217] ·day)] or less, preferably 1×10 -5 [g / (m 2 ·day)] or less, more preferably 1×10 [g / (m -6 ·day)] or less, still more preferably 1×10 2 [g / (m -7 ·day)] or less, and even more preferably 1×10 2 [g / (m -8 ·day)] or less. 2 ·da y)] or less.

[0218] The above is the description of the components.

[0219] The configuration examples illustrated in this embodiment, and the corresponding drawings, etc. can be implemented in appropriate combination with at least a part of other configuration examples, or drawings, etc.

[0220] This embodiment can be implemented in appropriate combination with at least a part of other embodiments described in this specification.

[0221] (Embodiment 3) [[ID=​​​​​​​​​

[0223] The pixel section 502 consists of multiple pixels arranged in an X row and Y column (where X and Y are independent natural numbers greater than or equal to 2). It has multiple pixel circuits 501 that drive the display device.

[0224] The drive circuit section 504 outputs a scanning signal to the gate lines GL_1 to GL_X. Source driver 504a, which supplies data signals to data lines DL_1 to DL_Y. It has a drive circuit such as 4b. The gate driver 504a has at least a shift register The configuration should include such features. Furthermore, the source driver 504b can, for example, handle multiple analog switches. It is constructed using components such as 'C'. Furthermore, it uses shift registers and other components to create the source driver 504b. It may be configured as follows:

[0225] The terminal section 507 inputs power, control signals, and image signals, etc., from an external circuit to the display device. This refers to the part that is equipped with terminals for that purpose.

[0226] The protection circuit 506, when a potential outside a certain range is applied to the wiring to which it is connected, This is a circuit that creates a conductive state between a wire and another wire. The protection circuit 506 shown in Figure 23A is, for example, , gate wire GL, which is the wiring between gate driver 504a and pixel circuit 501, or saw Connect to various wires such as the data line DL, which is the wiring between the driver 504b and the pixel circuit 501. In Figure 23A, the protection circuit 506 and the pixel circuit 501 are distinguished. Route 506 is marked with hatching.

[0227] Furthermore, the gate driver 504a and the source driver 504b are the same as the pixel unit 502, respectively. They may be provided on the same substrate, or the gate driver circuit or source driver circuit may be separate. A substrate formed during the process (for example, a drive circuit board formed from a single-crystal semiconductor or polycrystalline semiconductor) ) to COF, TCP (Tape Carrier Package), COG (Chip It may also be configured to be mounted on a circuit board using methods such as On Glass.

[0228] Furthermore, the multiple pixel circuits 501 shown in Figure 23A can be configured, for example, as shown in Figures 23B and 23C. It can be done this way.

[0229] The pixel circuit 501 shown in Figure 23B includes a liquid crystal device 570, a transistor 550, and a capacitor. It has a passitor 560 and a pixel circuit 501. The pixel circuit 501 also has a data line DL_n and a gate line GL _m, potential supply line VL, etc. are connected.

[0230] The potential of one of the pair of electrodes of the liquid crystal device 570 is set appropriately according to the specifications of the pixel circuit 501. The orientation state of the liquid crystal device 570 is set by the data being written to it. Oh, one of the pairs of electrodes of the liquid crystal device 570 that each of the multiple pixel circuits 501 has A common potential may be applied. Also, the liquid crystal device of the pixel circuit 501 in each row. A different potential may be applied to one of the pair of electrodes in 570.

[0231] Furthermore, the pixel circuit 501 shown in Figure 23C consists of transistors 552 and 554 and capacitor 5 It has 62 and a light-emitting device 572. The pixel circuit 501 also has a data line DL_n The gate line GL_m, potential supply line VL_a, and potential supply line VL_b are connected. ru.

[0232] Furthermore, a high power supply potential VDD is supplied to one of the potential supply lines VL_a and VL_b. On the other hand, a low power supply potential VSS is applied to the gate of transistor 554. The current flowing through the light-emitting device 572 is controlled according to the potential, thereby controlling the light-emitting device The brightness of the light emitted from Vice 572 is controlled.

[0233] The configuration examples illustrated in this embodiment, and the corresponding drawings, etc., are at least a part of them. This can be implemented by combining it with other configuration examples or drawings as appropriate.

[0234] This embodiment can be appropriately combined with other embodiments described herein, at least in part. They can be implemented together.

[0235] (Embodiment 4) The following describes a pixel circuit equipped with memory for correcting the gradation displayed in a pixel, and a pixel circuit equipped with this memory. This section describes the display device.

[0236] <Circuit Configuration> Figure 24A shows the circuit diagram of the pixel circuit 400. The pixel circuit 400 consists of transistor M1, It has a transistor M2, a capacitor C1, and a circuit 401. The pixel circuit 400 also has wiring S1, wiring S2, wiring G1, and wiring G2 are connected.

[0237] Transistor M1 has its gate connected to wiring G1, and one of its sources or drains connected to wiring S1. The other end is connected to one electrode of capacitance C1. Transistor M2 has a gate that is wired G2, one of the source and drain is connected to wiring S2, and the other electrode is connected to capacitance C1, and Connect each to circuit 401.

[0238] Circuit 401 is a circuit that includes at least one display device. The display device can be various... Various devices can be used, but typically organic EL devices or LED devices are used. Light-emitting devices such as liquid crystal devices, or MEMS (Microelectronic Systems). Mechanical Systems (Mechanical Systems) devices and the like can be applied.

[0239] The node connecting transistor M1 and capacitor C1 is node N1, and transistor M2 and the circuit... Let node N2 be the node that connects to 401.

[0240] The pixel circuit 400 maintains the potential of node N1 by turning off transistor M1. This is possible. Also, by turning off transistor M2, the potential of node N2 can be changed. It can hold. Also, with transistor M2 in the off state, the transistor By writing a predetermined potential to node N1 via terminal M1, capacitive coupling via capacitor C1 occurs. Therefore, the potential of node N2 can be changed in accordance with the potential displacement of node N1.

[0241] Here, in one or both of transistors M1 and M2, Embodiment 2 As illustrated earlier, a transistor using an oxide semiconductor can be applied. The extremely low off-current maintains the potential of nodes N1 and N2 for extended periods. This is possible. However, if the period for which the potential of each node is maintained is short (specifically, the frame When the frequency is 30Hz or higher, a transistor using a semiconductor such as silicon is used. You may also use "ta".

[0242] <Example of driving method> Next, an example of how the pixel circuit 400 operates will be explained using Figure 24B. Figure 24B is This is a timing chart related to the operation of the pixel circuit 400. For simplicity of explanation, this chart is presented here. Therefore, various resistors such as wiring resistance, parasitic capacitance of transistors or wiring, and transistors The effects of the threshold voltage of the zista are not considered.

[0243] In the operation shown in Figure 24B, one frame period is divided into period T1 and period T2. Period T1 is Period T2 is the period during which the potential is written to node N2, and period T2 is the period during which the potential is written to node N1. be.

[0244] During period T1, a potential is applied to both wire G1 and wire G2 to turn on the transistor. Furthermore, the wiring S1 has a fixed potential V ref The first data is supplied to wiring S2. Potential V w To supply.

[0245] Node N1 receives a potential V from wiring S1 via transistor M1. ref It is given. Furthermore, node N2 receives the first data potential V from wiring S2 via transistor M2. w gave Therefore, the capacitance C1 has a potential difference V w -V ref This state is maintained.

[0246] Next, during period T2, a potential is applied to wiring G1 to turn on transistor M1, and wiring G2 is supplied with a potential that turns off transistor M2. Also, the second data is supplied to wiring S1. Potential V data A predetermined constant potential is applied to the wiring S2, or a floating It may also be considered in a "g" state.

[0247] Node N1 receives a second data potential V from wiring S1 via transistor M1. data is given At this time, the second data potential V is obtained through capacitive coupling by capacitance C1. data in response The potential of node N2 changes by a potential of dV. That is, circuit 401 has the first data current. Place V w The input will be the sum of the potential dV and the current potential. Note that in Figure 24B, the potential dV is Although shown as a positive value, it can also be a negative value. That is, the second data potential V data The potential is V ref It can be lower.

[0248] Here, the potential dV is roughly determined by the capacitance value of capacitor C1 and the capacitance value of circuit 401. If the capacitance value of capacitor C1 is sufficiently larger than the capacitance value of circuit 401, the potential dV is the second day. Potential V data The potential will be close to that.

[0249] Thus, the pixel circuit 400 combines two types of data signals to include a display device. Since it can generate the potential supplied to circuit 401, grayscale correction can be performed within the pixel circuit 400. This makes it possible to do so.

[0250] Furthermore, the pixel circuit 400 generates a potential that exceeds the maximum potential that can be supplied to wiring S1 and wiring S2. It also becomes possible to achieve this. For example, when using a light-emitting device, high dynamic range It can display HDR (high-definition) images, etc. Also, when using a liquid crystal device, over-the-top images are possible. - Enables drive-driven operation, etc.

[0251] <Examples of application> [Examples using liquid crystal devices] The pixel circuit 400LC shown in Figure 24C has circuit 401LC. Circuit 401LC is liquid It has a crystal device LC and a capacitance C2.

[0252] In a liquid crystal device (LC), one electrode is at node N2 and capacitance C2, and the other electrode is at node N2 and capacitance C2. The poles have a potential of V. com2 Connect to the wiring provided. The other electrode of capacitance C2 is at potential V com Connect to the wiring that is given as 1.

[0253] Capacity C2 functions as the retention capacity. Note that capacity C2 can be omitted if it is not needed. ru.

[0254] The 400LC pixel circuit can supply a high voltage to the liquid crystal device LC, for example Overdrive enables high-speed display, and suitable liquid crystal materials with high drive voltage are used. It can be used for purposes such as supplying a correction signal to wiring S1 or wiring S2. The gradation can also be corrected according to the operating temperature or the degradation state of the liquid crystal device (LC).

[0255] [Examples using light-emitting devices] The pixel circuit 400EL shown in Figure 24D has circuit 401EL. Circuit 401EL is It has an optical device EL, a transistor M3, and a capacitor C2.

[0256] Transistor M3 has its gate connected to one electrode of node N2 and capacitance C2, and its source and One end of the drain is connected to a wire to which a potential VH is applied, and the other end is connected to one electrode of the light-emitting device EL. They are connected to each other. The other electrode of capacitance C2 has a potential of V com The wiring and connection provided The other electrode of the light-emitting device EL is at potential V. L Connect to the provided wiring.

[0257] Transistor M3 has the function of controlling the current supplied to the light-emitting device EL. Capacitor C 2 functions as the retention capacity. Capacity C2 can be omitted if it is not needed.

[0258] In this example, the anode side of the light-emitting device EL is connected to transistor M3. However, transistor M3 may be connected to the cathode side. In that case, the potential V H and electric potential V L The value can be changed as needed.

[0259] The 400EL pixel circuit uses a high potential applied to the gate of transistor M3 to generate light. Because it can supply a large current to EL displays, it can enable features such as HDR display. Yes, it is possible. Also, by supplying a correction signal to wiring S1 or wiring S2, transistor M3 It can also be used to correct variations in the electrical characteristics of light-emitting devices (ELs).

[0260] Note that the circuits are not limited to those illustrated in Figures 24C and 24D, and may also include transistors and capacitors. A configuration with the addition of this element is also acceptable.

[0261] This embodiment can be appropriately combined with other embodiments described herein, at least in part. They can be implemented together.

[0262] (Embodiment 5) The following describes an example of the pixel configuration of a display panel according to one embodiment of the present invention.

[0263] Figures 25A to 25E show examples of the configuration of pixel 300.

[0264] Pixel 300 has multiple pixels 301. Each of the multiple pixels 301 is a sub-pixel. It functions as follows: A single pixel 300 is composed of multiple pixels 301, each exhibiting a different color. This allows the display unit to show full color.

[0265] The pixel 300 shown in Figures 25A and 25B each has three subpixels. The color combination exhibited by pixel 301, which is located in the indicated pixel 300, is red (R), green (G), and This is blue (B). The color combination exhibited by pixel 301, which is part of pixel 300, as shown in Figure 25B. The colors are cyan (C), magenta (M), and yellow (Y).

[0266] Each of the pixels 300 shown in Figures 25C to 25E has four subpixels. Figure 25C The color combination exhibited by pixel 301, which is part of pixel 300 shown, is red (R), green (G), The colors are blue (B) and white (W). By using sub-pixels that exhibit white light, the brightness of the display area is increased. The color combination exhibited by pixel 301 of pixel 300 shown in Figure 25D is These are red (R), green (G), blue (B), and yellow (Y). Pixel 300, shown in Figure 25E, has the following properties: The color combination exhibited by pixel 301 is cyan (C), magenta (M), yellow (Y), and white. (W)

[0267] By increasing the number of subpixels that function as one pixel, red, green, blue, cyan, magenta, and By appropriately combining sub-pixels that exhibit colors such as yellow, the reproduction of midtones can be improved. This allows for improved display quality.

[0268] Furthermore, a display device according to one aspect of the present invention can reproduce various color gamut standards. For example, PAL (Phase Alternating Line) used in television broadcasting. Standards and NTSC (National Television System Com) (Mittee) standard, personal computers, digital cameras, printers and other electronic devices The sRGB (standard RGB) standard is widely used in display devices and Adobe RGB standard, HDTV (High Definition Television) ITU-R BT.709 (Intern ational Telecommunication Union Radiocom munication Sector Broadcasting Service(T DCI-P3(D), a standard used in digital cinema projection (DCI-P3(D) 709). igital Cinema Initiatives P3) standard, UHDTV (Ul tra High Definition Television, Super High Vision ITU-R BT.2020 (REC.2020 (Recomm) is used in (also known as n) It can reproduce color gamuts such as those specified in the 2020 edition.

[0269] Furthermore, arranging 300 pixels in a 1920 x 1080 matrix results in what is known as Full HD. The resolution of Vision (also called "2K resolution," "2K1K," or "2K") A multi-color display device can be realized. Also, for example, 300 pixels can be 38 When arranged in a 40x2160 matrix, it becomes what is known as ultra-high definition ("4K resolution"). Full-color display capability at a resolution of "4K2K" or "4K" (also known as "4K2K" or "4K"). A display device can be realized. Also, for example, 300 pixels can be used to create a 7680 x 4320 display. When arranged in a trix pattern, it becomes what is known as Super Hi-Vision ("8K resolution", "8K4K" It enables the creation of a display device capable of full-color display at a resolution of 8K (also known as "8K"). This is possible. By increasing the number of pixels by 300, full-color displays can be displayed at 16K or 32K resolution. It is also possible to realize a display device capable of showing this information.

[0270] This embodiment can be appropriately combined with other embodiments described herein, at least in part. They can be implemented together. [Explanation of symbols]

[0271] 100: Angle adjustment device, 100a: Angle adjustment device, 100b: Angle adjustment device, 100c: Angle adjustment device, 100d: Angle adjustment device, 101a: Base part, 101b: Base part, 1 02a: Connecting part, 102b: Connecting part, 103a: Columnar part, 103b: Columnar part, 1 04a: Columnar part, 104b: Columnar part, 105: Columnar part, 111: Surface, 112: Surface, 113: Surface, 114: Surface, 115: Surface, 121: Opening, 122: Section, 122a: Area, 122b: Area, 122c: Area, 131a: Connecting part, 131b: Connecting part, 132: Spacer, 141: thin-film solar cell, 141a: aperture, 141b: aperture, 142a: open mouth, 142b: opening, 143a: opening, 143b: opening, 151: area, 151 a: area, 151b: area, 152: area, 152a: area, 152b: area, 161: Flat plate part, 162: Flat plate part, 163: Flat plate part, 165: Bent part, 166: Column body, 167a :side, 167b:side, 167c:side, 167d:side, 170:display panel, 17 1: Display panel, 172: Display panel, 173: Display panel, 175: Display panel, 18 1: Columnar body, 186a: Gear, 186b: Gear, 200: Support, 220: Sensor, 23 5a: Input / Output Unit, 235b: Input / Output Unit, 236a: Camera, 236b: Camera R, 237: Sensor, 240: Solar cell, 245: External interface, 250: Display Device, 300: pixel, 301: pixel, 400: pixel circuit, 400EL: pixel circuit, 400 LC: Pixel circuit, 401: Circuit, 401EL: Circuit, 401LC: Circuit, 501: Pixel circuit Path, 502: Pixel section, 504: Drive circuit section, 504a: Gate driver, 504b: Saw Driver, 506: Protection circuit, 507: Terminal section, 550: Transistor, 552: Transistor Transistor, 554: Transistor, 560: Capacitor, 562: Capacitor, 570: Liquid crystal device, 572: Light-emitting device, 700: Display panel, 700A: Display panel, 7 02: Pixel section, 704: Source driver circuit section, 706: Gate driver circuit section, 708 :FPC terminal section, 710:wiring, 716:FPC, 717:IC, 730:insulating layer, 73 2: Sealing layer, 736: Colored layer, 738: Light shielding layer, 740: Support substrate, 741: Protective layer, 7 41a: insulating layer, 741b: insulating layer, 741c: insulating layer, 742: adhesive layer, 743: resin Layers, 744: insulating layer, 745: support substrate, 746: insulating layer, 747: adhesive layer, 749: support Protective layer, 750: transistor, 752: transistor, 760: wiring, 761: conductive layer, 770: insulating layer, 772: conductive layer, 780: anisotropic conductive film, 782: light-emitting device, 78 6: EL layer, 788: conductive layer, 790: capacitor

Claims

[Claim 1] It has an angle adjustment device, a support having a flat plate, and a flexible display panel. The angle adjustment device is, It comprises a first base component, a second base component, a first connecting component, a second connecting component, and first to fourth columnar components. The first base component and the second base component each have a first region and a second region, The first connecting part and the second connecting part each have a first opening of the same shape and a notch of the same shape, The first opening and the notch are provided side by side in the longitudinal direction of the first connecting part and the second connecting part, respectively. The first columnar component or the third columnar component is inserted into the first opening. The second columnar component or the fourth columnar component is inserted into the notch. The first region of the first base component is connected to the second region of the second base component via the first columnar component, the first connecting component, and the fourth columnar component. A display device in which the first region of the second base component is connected to the second region of the first base component via the third columnar component, the second connecting component, and the second columnar component.

Images