Three-dimensional structures

Abstract

This invention provides a three-dimensional structure that allows for easy removal of uncured resin remaining in the gaps of a lattice structure, even when manufacturing a three-dimensional resin structure with a lattice structure using a 3D printer. [Solution] The three-dimensional structure 1 is composed of a resin surface layer 2 on which a design surface 2a is formed, and a resin base layer 3 that overlaps with the surface layer 2. The base layer 3 is composed of a plurality of partition walls 4 extending from the surface layer 2 in the thickness direction of the base layer 3, and a plurality of lattice structures 5.

Description

Technical Field

[0001] The present invention relates to a three-dimensional structure.

Background Art

[0002] Conventionally, a three-dimensional structural component having a first base, a lattice structure portion, and a second base has been known (see Patent Document 1). In the three-dimensional structural component of Patent Document 1, the first base and the second base are formed in a plate shape. The lattice structure portion is provided between the first base and the second base.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] When manufacturing a resin three-dimensional structural component having a lattice structure portion by a 3D printer, uncured resin remains in the gaps in the lattice structure portion. Therefore, in this case, it is necessary to remove the uncured resin remaining in the gaps of the lattice structure portion. However, when the lattice structure portion is sandwiched and disposed between the first base and the second base formed in a plate shape as in the three-dimensional structural component of Patent Document 1, it becomes difficult to remove the uncured resin remaining in the gaps of the lattice structure portion, and the productivity of the three-dimensional structural component decreases.

[0005] An object of the present invention is to provide a three-dimensional structure capable of easily removing uncured resin remaining in the gaps of a lattice structure even when manufacturing a resin three-dimensional structure having a lattice structure by a 3D printer.

Means for Solving the Problems

[0006] A three-dimensional structure according to one aspect of the present invention is composed of a resin surface layer and a resin base layer that overlaps the surface layer. The base layer is composed of a plurality of partition walls extending from the surface layer in the thickness direction of the base layer and a plurality of lattice structures connected to the partition walls. [Effects of the Invention]

[0007] According to the present invention, even when manufacturing a three-dimensional resin structure having a lattice structure using a 3D printer, it becomes possible to easily remove uncured resin remaining in the gaps of the lattice structure. [Brief explanation of the drawing]

[0008] [Figure 1] This is a cross-sectional view of a three-dimensional structure according to an embodiment. [Figure 2] Figure 1 is a bottom view of the three-dimensional structure shown. [Figure 3] Figure 1 is a perspective view of a portion of the lattice structure shown. [Figure 4] Figure 3 is a schematic diagram illustrating the structure of the unit cell shown. [Figure 5] This is a bottom view of a three-dimensional structure according to another embodiment. [Modes for carrying out the invention]

[0009] The embodiments will be described below with reference to the drawings.

[0010] <Embodiment> Figure 1 is a cross-sectional view of the three-dimensional structure 1 according to the embodiment. Figure 2 is a bottom view of the three-dimensional structure 1 shown in Figure 1. Figure 3 is a perspective view of a part of the lattice structure 5 shown in Figure 1. Figure 4 is a schematic diagram illustrating the structure of the unit cell 7 shown in Figure 3. In Figure 2, the three-dimensional structure 1 is shown from the EE direction of Figure 1.

[0011] The three-dimensional structure 1 of this embodiment is a resin structural component used, for example, as an interior part of an automobile. The three-dimensional structure 1 is manufactured by a 3D printer. The three-dimensional structure 1 consists of a resin surface layer 2 on which a design surface 2a is formed, and a resin base layer 3 that overlaps with the surface layer 2. The surface layer 2 is formed, for example, in the shape of a flat plate. The surface of the surface layer 2 opposite to the side that overlaps with the base layer 3 is the design surface 2a. The surface layer 2 may also be formed in the shape of a curved plate.

[0012] The base layer 3 is composed of multiple partition walls 4 and multiple lattice structures 5. The partition walls 4 are formed in a rectangular, flat plate shape. As shown in Figure 1, the partition walls 4 extend from the epidermal layer 2 in the thickness direction of the base layer 3. Also, the partition walls 4 rise perpendicularly from the epidermal layer 2 in the thickness direction of the base layer 3. As shown in Figure 2, in the base layer 3, a polygonal annular partition wall 6 is formed by multiple partition walls 4. In this embodiment, a hexagonal annular partition wall 6 is formed by six partition walls 4. In the base layer 3, multiple hexagonal annular partition walls 6 of the same size are arranged so as to be connected to each other. That is, in the base layer 3, one type of annular partition wall 6 is repeatedly arranged multiple times. Also, in the base layer 3, a honeycomb structure is formed by multiple annular partition walls 6. The maximum inner diameter of the annular partition wall 6 is between 100 μm and 10,000 μm.

[0013] In the base layer 3, lattice structures 5 are placed throughout the entire area where partition walls 4 are not present. The lattice structures 5 are connected to the epidermal layer 2. The lattice structures 5 are also connected to the partition walls 4. Specifically, the lattice structures 5 placed on the inner circumference side of the annular partition wall 6 are connected to the inner surface of the annular partition wall 6. Also, the lattice structures 5 placed on the outside of the annular partition wall 6 are connected to the outer surface of the annular partition wall 6. As shown in Figure 3, the lattice structures 5 are formed by repeatedly arranging multiple unit cell bodies 7 having a three-dimensional lattice-like structure. Specifically, the lattice structures 5 are formed by repeatedly arranging a large number of unit cell bodies 7.

[0014] The unit cell 7 is composed of a plurality of element bodies 8 formed in a rod shape. In this embodiment, the unit cell 7 is composed of eight element bodies 8. The element bodies 8 are formed, for example, in a cylindrical shape. However, the element bodies 8 may be formed in a rod shape other than a cylindrical shape. Furthermore, the unit cell 7 may be composed of seven or fewer element bodies 8, or it may be composed of nine or more element bodies 8.

[0015] As shown in Figure 4, one end of each of the eight element bodies 8 is connected at one point. When the other ends of the element bodies 8 are connected by imaginary lines, a cube is formed with the other ends of the element bodies 8 as vertices. One end of each of the eight element bodies 8 is connected at the center C of this cube. The other end of the element body 8 of the unit cell body 7 is connected to the other end of the element body 8 of the unit cell body 7 adjacent to this unit cell body 7. The maximum outer diameter of the unit cell body 7 is between 50 μm and 1000 μm. The combined thickness t1 of the skin layer 2 and the substrate layer 3 is between 1 mm and 10 mm. That is, the thickness 1 of the three-dimensional structure 1 is between 1 mm and 10 mm. Also, the thickness t2 of the skin layer 2 is 2 mm or less.

[0016] The three-dimensional structure 1 is formed by sequentially layering resin extruded from the inkjet head of a 3D printer in the thickness direction of the three-dimensional structure 1. During the manufacturing of the three-dimensional structure 1, the lattice structure 5 may be supported by support material. Once the surface layer 2 and the base layer 3 are fabricated by the 3D printer, any uncured resin (e.g., support material) remaining in the gaps within the lattice structure 5 is removed by cleaning with a solvent or the like.

[0017] The following describes the effects and benefits of the three-dimensional structure 1.

[0018] (1) The three-dimensional structure 1 is composed of a resin surface layer 2 on which a design surface 2a is formed, and a resin base layer 3 that overlaps with the surface layer 2. The base layer 3 is composed of a plurality of partition walls 4 extending from the surface layer 2 in the thickness direction of the base layer 3, and a plurality of lattice structures 5 formed by repeatedly arranging a plurality of unit cell bodies 7 having a three-dimensional lattice structure and connected to the partition walls 4.

[0019] In this embodiment, since the three-dimensional structure 1 is composed of the base layer 3 formed by the partition wall 4 and the lattice structure 5 and the skin layer 2, after the skin layer 2 and the base layer 3 are shaped by a 3D printer, the uncured resin remaining in the gaps in the lattice structure 5 can be easily removed from the surface of the base layer 3 on the side that does not overlap with the skin layer 2. Further, since the base layer 3 has the partition wall 4, it is possible to ensure the rigidity of the base layer 3. Therefore, even though the uncured resin remaining in the gaps of the lattice structure 5 can be easily removed, the rigidity of the three-dimensional structure 1 can be increased. Further, since the base layer 3 includes the lattice structure 5, the impact resistance of the three-dimensional structure 1 can be increased.

[0020] (2) In the base layer 3, a polygonal ring-shaped annular partition wall 6 is formed by a plurality of partition walls 4, and the lattice structure 5 disposed on the inner peripheral side of the annular partition wall 6 is connected to the inner peripheral surface of the annular partition wall 6. Therefore, it is possible to further increase the rigidity of the base layer 3.

[0021] (3) In the base layer 3, a plurality of the same type of annular partition walls 6 are repeatedly arranged. Therefore, it is possible to further increase the rigidity of the base layer 3.

[0022] (4) The maximum inner diameter of the annular partition wall 6 is 100 μm or more and 10000 μm or less. Since the maximum inner diameter of the annular partition wall 6 is 100 μm or more, it is possible to easily form the lattice structure 5 on the inner peripheral side of the annular partition wall 6. Further, since the maximum inner diameter of the annular partition wall 6 is 10000 μm or less, even though it is possible to easily form the lattice structure 5 on the inner peripheral side of the annular partition wall 6, it is possible to increase the rigidity of the base layer 3 by the annular partition wall 6.

[0023] (5) The maximum outer diameter of the unit cell 7 is 50 μm or more and 1000 μm or less. Because the maximum outer diameter of the unit cell 7 is 50 μm or more, it becomes possible to easily form the lattice structure 5. Also, because the maximum outer diameter of the unit cell 7 is 1000 μm or less, it becomes possible to make the lattice structure 5 function on the inner circumference side of the annular partition wall 6.

[0024] (6) The combined thickness t1 of the epidermal layer 2 and the base layer 3 is 1 mm or more and 10 mm or less. Since the combined thickness t1 of the epidermal layer 2 and the base layer 3 is 1 mm or more, it is possible to perform the function of the three-dimensional structure 1. Also, since the combined thickness t1 of the epidermal layer 2 and the base layer 3 is 10 mm or less, it is possible to easily form the resin three-dimensional structure 1.

[0025] (7) The thickness t2 of the surface layer 2 is 2 mm or less. Therefore, it is possible to suppress the excessive increase in the rigidity of the three-dimensional structure 1.

[0026] <Variation> Figure 5 is a bottom view of the three-dimensional structure 1 according to another embodiment. In Figure 5, components similar to those in the above-described embodiment are denoted by the same reference numerals.

[0027] As shown in Figure 5, the base layer 3 may, for example, have multiple partition walls 9 and multiple partition walls 10 instead of multiple partition walls 4. The partition walls 9 and 10 extend from the epidermal layer 2 in the thickness direction of the base layer 3, similar to the partition walls 4. The partition walls 9 are formed in an annular shape. The partition walls 10 are formed in a rectangular plate shape. The partition walls 10 connect two adjacent partition walls 9. In this modified example, an annular partition wall 11 is formed by one partition wall 9. Also, an octagonal annular partition wall 12 is formed by parts of four partition walls 9 and four partition walls 10. That is, the base layer 3 contains a mixture of annular partition walls 11 and polygonal annular partition walls 12. In the base layer 3, the two types of annular partition walls 11 and 12 are repeatedly arranged in multiple rows. The lattice structure 5, positioned on the inner circumference side of the annular partition walls 11 and 12, is connected to the inner surface of the annular partition walls 11 and 12.

[0028] Furthermore, the partition wall 9 may be formed in an elliptic ring shape. That is, the annular partition wall 11 may be formed in an elliptic ring shape. Also, in the base layer 3, polygonal annular partition walls such as triangular or quadrilateral annular partition walls may be formed. In addition, in the base layer 3, polygonal annular partition walls and elliptic annular partition walls may be mixed, circular annular partition walls and elliptic annular partition walls may be mixed, and polygonal annular partition walls, circular annular partition walls and elliptic annular partition walls may be mixed. Furthermore, annular partition walls may not be formed in the base layer 3.

[0029] The embodiments and modifications described above are merely illustrative examples provided to facilitate understanding of the invention. The technical scope of the invention is not limited to the specific technical matters disclosed in the embodiments, etc., but also includes various modifications, changes, and alternative technologies that can be easily derived therefrom. [Explanation of symbols]

[0030] 1 Three-dimensional structure 2 Epidermal layer 2a Design surface 3. Substratum 4, 9, 10 Bulkhead 5 Lattice Structures 6, 11, 12 Annular partition 7 Unit lattice

Claims

1. It consists of a resin surface layer on which a design surface is formed, and a resin base layer that overlaps with the surface layer. The substrate layer is a three-dimensional structure comprising a plurality of partition walls extending from the epidermal layer in the thickness direction of the substrate layer, and a plurality of lattice structures formed by repeatedly arranging a plurality of unit cell bodies having a three-dimensional lattice structure, and connected to the partition walls.

2. In the substrate layer, one or more of the partitions form a polygonal, circular, or elliptical annular partition. The three-dimensional structure according to claim 1, wherein the lattice structure arranged on the inner circumference side of the annular partition wall is connected to the inner surface of the annular partition wall.

3. The three-dimensional structure according to claim 2, wherein in the base layer, one or more types of annular partitions are repeatedly arranged in multiple rows.

4. The three-dimensional structure according to claim 2 or 3, wherein the maximum inner diameter of the annular partition wall is 100 μm or more and 10,000 μm or less.

5. The three-dimensional structure according to claim 4, wherein the size of the largest outer portion of the unit cell is 50 μm or more and 1000 μm or less.

6. The three-dimensional structure according to any one of claims 1 to 3, wherein the combined thickness of the epidermal layer and the substrate layer is 1 mm or more and 10 mm or less.

7. The three-dimensional structure according to any one of claims 1 to 3, wherein the thickness of the surface layer is 2 mm or less.

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