Antenna device and method for manufacturing an antenna device

Abstract

To provide an antenna device and a method for manufacturing an antenna device that improve structural stability. [Solution] According to the embodiment, an antenna device is provided comprising a first structure, a second structure, a signal line, and a third resin member, wherein the first structure comprises a first insulating member, a radiating element, a first conductive layer, and a first resin member, the second structure comprises a second insulating member, a second conductive layer, and a second resin member, and the signal line is provided in either the first region or the third region.

Description

Technical Field

[0001] Embodiments of the present invention relate to an antenna device and a method for manufacturing the antenna device.

Background Art

[0002] In a multilayer substrate type strip line feeding type planar antenna, for each dielectric substrate constituting the multilayer substrate on which the antenna is formed, vias that conduct the metal layers on both sides of the substrate are formed instead of through holes. Then, an adhesive layer is inserted between each dielectric substrate and laminated so that the vias are arranged in the thickness direction of the substrate.

[0003] When the vias are laminated in a hollow state, a part of the resin member constituting the adhesive layer flows into the vias. As a result, the gap between the adjacent and facing vias becomes smaller, and good high-frequency characteristics can be obtained. On the other hand, air bubbles (voids) tend to remain near the step due to the presence or absence of the metal layer of the multilayer substrate, and volume fluctuations of the air bubbles caused by temperature changes occur, easily causing distortion in the structure. Therefore, the structural stability of the antenna device is reduced.

Prior Art Documents

Patent Documents

[0004] [[ID=2s]]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The problem to be solved by the present invention is to provide an antenna device and a method for manufacturing the antenna device with improved structural stability.

Means for Solving the Problems

[0006] According to the embodiment, an antenna device is provided comprising a first structure, a second structure, a signal line, and a third resin member, wherein the first structure comprises a first insulating member, a radiating element, a first conductive layer, and a first resin member, the second structure comprises a second insulating member, a second conductive layer, and a second resin member, and the signal line is provided in either the first region or the third region. [Brief explanation of the drawing]

[0007] [Figure 1] A schematic cross-sectional view showing an example of an antenna device according to the embodiment. [Figure 2] A schematic cross-sectional view showing an example of an antenna device according to the embodiment. [Figure 3] A schematic perspective view showing an example of an antenna device according to the embodiment. [Figure 4] A schematic cross-sectional view showing a modified example of the antenna device according to the embodiment. [Figure 5] A plan view showing an example of an antenna device according to the embodiment. [Figure 6] A cross-sectional view of the antenna device according to the embodiment of Figure 5, cut along line A1-A2. [Figure 7] A schematic cross-sectional view showing the connection structure of a signal circuit in an antenna device according to an embodiment. [Figure 8] A cross-sectional view showing the antenna device after the first step in the antenna device manufacturing method according to the embodiment. [Figure 9] A cross-sectional view showing the antenna device after the second step in the antenna device manufacturing method according to the embodiment. [Figure 10] A cross-sectional view showing the antenna device after the third step in the antenna device manufacturing method according to the embodiment. [Figure 11] A cross-sectional view showing the antenna device after the fourth step in the antenna device manufacturing method according to the embodiment. [Modes for carrying out the invention]

[0008] The embodiments will be described below with reference to the drawings. In the following description, components that perform the same or similar functions will be given the same reference numerals throughout all drawings, and redundant descriptions will be omitted. Furthermore, each figure is a schematic diagram intended to explain the embodiments and facilitate their understanding, and their shape, dimensions, ratios, etc., may differ from those of the actual device. These can be appropriately modified in consideration of the following description and known technology.

[0009] In this specification, expressions such as "approximately the same" or "approximately equal" may be used, but it is not necessary for them to take exactly the same value; a difference that does not affect the original effect is acceptable.

[0010] In this specification, "electrically connected" refers to an ohmic contact that transmits both AC and DC components. Capacitive coupling and electromagnetic coupling refer to transmitting only AC components.

[0011] (First embodiment) In the first embodiment, an antenna device will be described.

[0012] (Example 1) Figures 1, 2, and 3 are schematic cross-sectional views showing an example of an antenna device according to the embodiment. The antenna device 100 comprises a first structure 1, a second structure 2, a third resin member 30, and a signal line 40. The first structure 1 comprises a first insulating member 10, a radiating element 11, a first conductive layer 12, and a first resin member 13. The second structure 2 comprises a second insulating member 20, a second conductive layer 22, and a second resin member 23.

[0013] The first insulating member 10 is plate-shaped and has a first surface and a second surface. Here, if the direction from the second structure 2 to the first structure 1 is taken as the first direction D1, in FIG. 1, the first surface is the upper surface of the first insulating member 10 in the first direction D1, and the second surface is the lower surface of the first insulating member 10. The first surface is between the radiation element 11 and the second surface. In other words, in the first insulating member 10, the first surface is the surface on the back side of the second surface. The second surface of the first insulating member 10 has a first region and a second region. The first region and the second region divide the region of the second surface of the first insulating member 10. In other words, the second surface is obtained by adding the first region and the second region together. A conductive material is provided in the first region, and a non-conductive material is provided in the second region.

[0014] The radiation element 11 is provided on the first surface of the first insulating member 10. The radiation element 11 functions as a patch antenna. The shape of the radiation element 11 may be any shape that can receive electromagnetic waves, for example, a quadrilateral. The radiation element 11 is formed, for example, by a conductive material patterned on the first surface of the first insulating member 10.

[0015] The first conductive layer 12 is provided in the first region of the second surface of the first insulating member 10. Taking the distance along the first direction D1 of the first conductive layer 12 as the thickness of the first conductive layer, the thickness of the first conductive layer is, for example, 5 μm or more and 105 μm or less.

[0016] The first resin member 13 is provided in the second region of the second surface of the first insulating member 10. The first resin member 13 is in contact with the first conductive layer 12 and the signal line 40. Taking the distance along the first direction D1 of the first resin member 13 as the thickness of the first resin member, the thickness of the first resin member is, for example, 5 μm or more and 105 μm or less.

[0017] The second insulating member 20 is plate-shaped and has a third surface and a fourth surface. In FIG. 1, the third surface is the upper surface of the second insulating member 20 in the first direction D1, and the fourth surface is the lower surface of the second insulating member 20. The third surface is between the second conductive layer 22 and the second resin member 23 and the fourth surface. In other words, in the second insulating member 20, the third surface is the surface on the back side of the fourth surface. The third surface faces the second surface of the first insulating member 10. The third surface of the second insulating member 20 has a third region and a fourth region. The third region and the fourth region divide the third surface of the second insulating member 20. In other words, adding the third region and the fourth region results in the third surface. A conductive material is provided in the third region, and a non-conductive material is provided in the fourth region.

[0018] The second conductive layer 22 is provided in the third region of the third surface of the second insulating member 20. Assuming the distance along the first direction D1 of the second conductive layer 22 is the thickness of the second conductive layer, the thickness of the second conductive layer is, for example, 5 μm or more and 105 μm or less.

[0019] The second resin member 23 is provided in the fourth region of the third surface of the second insulating member 20. The second resin member 23 is in contact with the second conductive layer 22. Assuming the distance along the first direction D1 of the second resin member 23 is the thickness of the second resin member, the thickness of the second resin member is, for example, 5 μm or more and 105 μm or less.

[0020] The third resin member 30 is provided between the first structure 1 and the second structure 2 and is in contact with both the first structure 1 and the second structure 2. Specifically, it is in contact with the first conductive layer 12, the first resin member 13, the signal line 40, the second conductive layer 22, and the second resin member 23. The third resin member 30 functions as an adhesive layer between the first insulating member 10 and the second insulating member 20. Thereby, the relative positions of the first insulating member 10 and the second insulating member 20 are fixed. The third resin member 30 can include a resin material and a plurality of fillers. By providing the plurality of fillers in the third resin member, the distance between the first insulating member 10 and the second insulating member 2 is more stably controlled. Also, high mechanical strength and thermal stability can be easily obtained.

[0021] The signal line 40 is provided in either the first region on the second surface of the first insulating member 10 or the third region on the third surface of the second insulating member 20. In this embodiment, it will be described as being provided in the first region on the second surface of the first insulating member 10. When a signal is applied to the signal line 40, or when electromagnetic waves are received by the radiating element 11, the signal line 40 is electromagnetically coupled with the radiating element 11 to form a strip line described later. The signal line 40 is formed, for example, from a conductive material patterned on the second surface of the first insulating member 10. If the distance along the first direction D1 of the signal line 40 is the thickness of the signal line, then the thickness of the signal line is, for example, 5 μm or more and 105 μm or less. The planar shape of the signal line is, for example, a rectangle.

[0022] The first insulating member 10 and the second insulating member 20 are, for example, substrates, and are formed from insulators such as resin substrates like PTFE (polytetrafluoroethylene) and epoxy, foamed plastics obtained by foaming resin, and film substrates like liquid crystal polymers. If the first, second, third, and fourth surfaces of the first insulating member 10 and the second insulating member 20 can be processed, the first insulating member 10 and the second insulating member 20 can be made from the same materials as the first resin member 13 and the second resin member 23. Specifically, in addition to the first insulating member 10, a part of the first insulating member 10 may also be formed in the second region, and the first conductive layer 12 may be formed to fill the depressions in the first insulating member 10.

[0023] The first conductive layer 12 and the second conductive layer 22 are conductive materials, and are conductive materials patterned on the second surface of the first insulating member 10 and the third surface of the second insulating member 20. The first conductive layer 12 and the second conductive layer 22 only need to be conductive, for example, copper foil. The first conductive layer 12 and the second conductive layer 22 can be made of the same material, or different materials can be used. The same applies to conductive layers introduced later.

[0024] The first resin member 13 and the second resin member 23 are made of non-conductive materials, such as films or prepregs of thermoplastic or thermosetting resins. The first resin member 13 and the second resin member 23 can be made of the same material or different materials. Considering the manufacturing process, it is desirable that the first resin member 13 and the second resin member 23 are made of the same material. On the other hand, the first resin member 13 and the third resin member 30 are made of different materials, and the second resin member 23 and the third resin member 30 are made of different materials. The first resin member 13, the second resin member 23, and the third resin member 30 can be distinguished by a scanning electron microscope (SEM) or an optical microscope.

[0025] On the second and third surfaces, the arrangement and proportions of the first, second, third, and fourth regions are arbitrary within the operating range of the antenna device 1 and are not dependent on Figure 1 or any other drawings used in the future. Specifically, the first conductive layer 12 and the second conductive layer 22 may or may not face each other via the third resin member 30. Similarly, the first resin member 13 and the second resin member 23 may or may not face each other via the third resin member 30.

[0026] It is desirable that the difference between the thickness of the member in the first region and the thickness of the member in the second region be 1% or less of the combined thickness of the members in the first and second regions. It is also desirable that the difference between the thickness of the member in the third region and the thickness of the member in the fourth region be 1% or less of the combined thickness of the members in the third and fourth regions. In other words, it is desirable that these thickness differences be between 0 μm and 1 μm. To put it another way, it is desirable that the difference between the thickness of the first conductive layer 12 and the thickness of the first resin member 13, the difference between the thickness of the first conductive layer 12 and the thickness of the signal line 40, and the difference between the thickness of the signal line 40 and the thickness of the first resin member 13 be between 0 μm and 1 μm, and that the difference between the thickness of the second conductive layer 22 and the thickness of the second resin member 23 be between 0 μm and 1 μm. Here, when the difference in thickness of each member is between 0 μm and 1 μm, the thickness of each member is said to be approximately equal or approximately the same. As a result, the surfaces of the first conductive layer 12, the signal line 40, and the first resin member 13 that are in contact with the third resin member 30, and the surfaces of the second conductive layer 22 and the second resin member 23 that are in contact with the third resin member 30, become smooth, and the thickness of the third resin member 30 can be reduced.

[0027] The distance along the first direction D1 of the third resin member 30 is defined as the thickness t1 of the third resin member 30. For example, t1 is between 0.05 μm and 20 μm. It is desirable that the third resin member 30 has a uniform thickness, and from the viewpoint of strength, it is desirable that t1 be between 5 μm and 20 μm.

[0028] Furthermore, if t2 is the sum of the thicknesses of the first conductive layer and the second conductive layer, it is desirable that t1 be a value smaller than t2. More preferably, t1 is less than or equal to half of t2. This reduces the distance between the first conductive layer 12 and the second conductive layer 22, allowing for better capacitive coupling.

[0029] Figures 2 and 3 show an example in which the antenna device 1 is provided with the connecting conductive members described later. Figure 2 is an enlarged cross-sectional view of the area where the first connecting conductive member 15 and the second connecting conductive member 25 are provided. Figure 3 is a perspective view when only the second structure 2 is removed from the antenna device 1. On the first surface, the first region is in contact with the third region, and the second region is in contact with the fourth region. Specifically, the first conductive layer 12 is surrounded by the first resin member 13, and the second conductive layer 22 is surrounded by the second resin member 23. This structure improves the structural stability of the antenna device. To explain in more detail, an insulating member with a patterned conductive layer is divided into a region where the conductive layer exists and a region where the conductive layer does not exist, and a recess is created in the region where the conductive layer does not exist due to the step difference with the conductive layer. By filling this recess without gaps with a resin member in advance to eliminate the step difference between the conductive layer and the recess and suppress the formation of voids, an adhesive layer with a t1 smaller than t2 can be used. When resin components contain voids, volume fluctuations of these voids due to temperature changes and other factors can easily cause distortion in the insulating material. By suppressing void formation, it is possible to improve the stability and properties of the structure, such as reliability.

[0030] It is desirable that the first conductive layer 12, the signal line 40, and the second conductive layer 22 are in direct contact with the third resin member 30. In other words, it is desirable that the thickness of the first conductive layer 12, the thickness of the signal line 40, and the thickness of the first resin member 13 are all approximately the same, and that the thickness of the second conductive layer 22 and the thickness of the second resin member 23 are approximately the same. This reduces the distance between the first conductive layer 12 and the second conductive layer 22, allowing for better capacitive coupling. As shown in Figure 4, the first conductive layer 12, the signal line 40, and the second conductive layer 22 do not necessarily have to be in contact with the third resin member 30, and the first conductive layer 12, the signal line 40, and the second conductive layer 22 may be covered by the first resin member 13 or the second resin member 23. In other words, as long as the thicknesses of the first structure 1 and the second structure 2 are uniform, the thickness of the first conductive layer 13, the thickness of the signal line 40, and the thickness of the first resin member 13 may all be different, and the thickness of the second conductive layer and the thickness of the second resin member may also be different.

[0031] (Example 2) In Example 2, the antenna device will be described using Figures 5, 6, and 7. Figure 5 is a plan view showing a modified example of the antenna device according to the embodiment, where the first direction D1 is the direction from the back of the paper to the front of the paper, and Figure 5 shows the antenna device 100 as viewed from above. Figure 6 is a cross-sectional view taken at A1-A2 in Figure 5. Figure 7 is a schematic cross-sectional view showing the connection structure of the signal circuit in the antenna device according to the embodiment, where the first structure 1, the third resin member 30, and the second structure 2 are depicted separated from each other. The antenna device 100 of Example 2 includes, in addition to the antenna device of Example 1, a third conductive layer 14, a first connecting conductive member 15, a fourth conductive layer 24, a second connecting conductive member 25, and a signal circuit 41.

[0032] The third conductive layer 14 is provided on the first surface of the first insulating member 10. The fourth conductive layer 24 is provided on the fourth surface of the second insulating member 20.

[0033] The first connecting conductive member 15 consists of a first cylindrical portion 15c and a first internal space 15i, and penetrates the first structure 1 along the first direction D1. In other words, the first connecting conductive member 15 penetrates the first conductive layer 12, the first insulating member 10, and the third conductive layer 14. The first connecting conductive member 15 electrically connects the first conductive layer 12 and the third conductive layer 14. Specifically, the first connecting conductive member 15 transmits AC and DC components to the first conductive layer 12 and the third conductive layer 14. The second connecting conductive member 25 consists of a second cylindrical portion 25c and a second internal space 25i, and penetrates the second insulating member 20 along the first direction D1. In other words, the second connecting conductive member 25 penetrates the second conductive layer 22, the second insulating member 20, and the fourth conductive layer 24. The second connecting conductive member 25 electrically connects the second conductive layer 22 and the fourth conductive layer 24.

[0034] The first connecting conductive member 15 and the second connecting conductive member 25 are metal vias or through-holes. The first connecting conductive member 15 and the third resin member 30 are in contact, and the second connecting conductive member 25 and the third resin member 30 are in contact. The cross-sectional shape of the first connecting conductive member 15 on its first and second surfaces can be any shape, for example, a substantially annular shape. The cross-sectional shape of the second connecting conductive member 25 on its third and fourth surfaces can be any shape, for example, a substantially annular shape. The diameter of these cross-sections is, for example, about 0.1 mm to 1 mm. At least a portion of the second conductive layer 22 faces the first conductive layer 12 in the first direction D1. This allows the capacitance between the first connecting conductive member 15 and the second connecting conductive member 25 to be increased, thus achieving more efficient capacitive coupling.

[0035] A portion of the third resin member 30 is provided between the first connecting conductive member 15 and the second connecting conductive member 25. In this case, the first connecting conductive member 15 can be capacitively coupled with the second connecting conductive member 25. The gap between the opposing conductive layers can be kept to approximately the thickness of the adhesive layer used, that is, approximately the thickness of the third resin member. Therefore, the antenna device 1 according to this embodiment can obtain good high-frequency characteristics. If the thickness t1 of the third resin member 30 is 0.05 μm or more and 20 μm or less, current can be passed between the first connecting conductive member 15 and the second connecting conductive member 25 with higher efficiency.

[0036] The first internal space 15i and the second internal space 25i can be hollow, or they can be filled with conductive material, insulating material, or the like.

[0037] As shown in Figure 7, the signal line 40 is electrically connected to the fourth conductive layer 24 via the signal circuit 41. With this structure, electrical signals such as high-frequency signals are supplied from the signal circuit 41 to the signal line 40 and transmitted to the radiating element 11 via the signal line 40. Then, radio waves corresponding to the electrical signals are emitted from the radiating element 11. The signal line 40 and the radiating element 11 can be electromagnetically coupled, and the antenna device 100 according to this embodiment functions, for example, as a close-coupled fed patch antenna.

[0038] Furthermore, at least a portion of the signal line 40 is provided between the third conductive layer 14 via the first insulating member 10 and the fourth conductive layer 24 via the second insulating member 20. When the antenna device 100 is viewed from the fourth conductive layer 24 in the first direction D1, it is desirable that a portion of the signal line 40 and a portion of the third conductive layer 14 overlap. In this case, the signal line 40, the third conductive layer 14, and the fourth conductive layer 24 function as a strip line 50. A strip line is also called a triplate line. The strip line 50 efficiently radiates radio waves based on the supplied electrical signal. In the antenna device 100 according to this embodiment, the strip line 50 serves as a feed line.

[0039] In a stripline-fed patch antenna, unwanted parallel-plate modes are generated inside the stripline 50 (for example, in the region overlapping with the radiating element 11). These parallel-plate modes propagate between the third conductive layer 14 and the fourth conductive layer 24 contained in the stripline 50. This propagation of parallel-plate modes causes power leakage, reducing antenna efficiency. However, in the antenna device 100 according to this embodiment, the first connecting conductive member 15 and the second connecting conductive member 25 allow current (high-frequency current) to flow between the third conductive layer 14 and the fourth conductive layer 24. This suppresses the parallel-plate modes.

[0040] The third conductive layer 14 and the fourth conductive layer 24 are capacitively coupled via the first connecting conductive member 15 and the second connecting conductive member 25. The third conductive layer 14 and the fourth conductive layer 24 may also be electrically connected via the first connecting conductive member 15 and the second connecting conductive member 25.

[0041] In this embodiment, the distance between the first connecting conductive member 15 and the second connecting conductive member 25 can be shortened uniformly with high precision. As a result, the high-frequency current can flow between the first connecting conductive member 15 and the second connecting conductive member 25 with high efficiency, and the parallel plate mode can be suppressed more effectively. Therefore, power leakage can be suppressed more effectively, and high antenna efficiency can be obtained. According to this embodiment, an antenna device with improved structural stability can be provided.

[0042] (Second embodiment) The second embodiment is a method for manufacturing an antenna device. The method for manufacturing an antenna device according to the embodiment is a method for manufacturing an antenna device comprising a first structure, a second structure, a signal line, and a third resin member, and includes a first step, a second step, a third step, and a fourth step. The first step is a step of preparing the first structure, the second structure, and the signal line. The first structure comprises a first insulating member, a radiating element, and a first conductive layer. The first insulating member includes a first surface and a second surface, the first surface is located between the radiating element and the second surface, the second surface has a first region and a second region, the radiating element is provided on the first surface, and the first conductive layer is provided on the first region. The second structure comprises a second insulating member and a second conductive layer. The second insulating member includes a third surface, the third surface has a third region and a fourth region, and the second conductive layer is provided on the third region. The signal line is provided in either the first region or the third region. The second step involves providing the first resin member in the second region and the second resin member in the fourth region. The third step involves polishing the surfaces of the first conductive layer, the signal line, the first resin member, the second conductive layer, and the second resin member. The fourth step involves providing the third resin member between the second and third surfaces. The manufacturing method of the antenna device according to this embodiment is, for example, the manufacturing method of the antenna device in the first embodiment. Here, the manufacturing method of the antenna device of Example 1 in the first embodiment will be described, and explanations will be omitted where there is overlap in content. From here on, the explanation will be given using Figures 8, 9, 10, and 11.

[0043] Figure 8 is a cross-sectional view showing the antenna device after the first step in the antenna device manufacturing method according to the embodiment. In the first step, a radiating element 11 is formed on the first surface of the first insulating member 10 of the first structure 1, and a first conductive layer 12 is formed in the first region of the second surface. In the second insulating member 20 of the second structure 2, a second conductive layer 22 is formed in the third region of the third surface. The signal line 40 may be formed in either the first region of the first insulating member 10 or the third region of the second insulating member 20. These members can be formed, for example, by patterning.

[0044] When manufacturing the antenna device 1 according to Example 2, in the first step, a third conductive layer 14 is further formed on the first surface of the first insulating member 10, and a fourth conductive layer 24 is further formed on the fourth surface of the second insulating member 20. The first connecting conductive member 15 is formed by penetrating a part of the first structure 1 along the first direction D1. In other words, the first connecting conductive member 15 is formed by penetrating the first conductive layer 12, the first insulating member 10, and the third conductive layer 14. The second connecting conductive member 25 is formed by penetrating a part of the second structure 2 along the second direction D1. In other words, the second connecting conductive member 25 is formed by penetrating the second conductive layer 22, the second insulating member 20, and the fourth conductive layer 24. The first connecting conductive member 15 and the second connecting conductive member 25 have, for example, copper foil on their surfaces and are pre-penetrated through the first structure 1 and the second structure 2 before forming the radiating element 11, the first conductive layer 12, the second conductive layer 22, the signal line 40, the third conductive layer 14, and the fourth conductive layer 24. When forming the radiating element 11, the first conductive layer 12, the second conductive layer 22, the signal line 40, the third conductive layer 14, and the fourth conductive layer 24, the surfaces of the first connecting conductive member 15 and the second connecting conductive member 25 are masked to prevent the copper foil of the first connecting conductive member 15 and the second connecting conductive member 25 from being removed.

[0045] Figure 9 is a cross-sectional view showing the antenna device after the second step in the antenna device manufacturing method according to the embodiment. In the second step, the first resin member 13 is formed in the second region of the second surface of the first insulating member 10, and the second resin member 23 is formed in the fourth region of the third surface of the second insulating member 20. It is desirable that the second and fourth regions are filled without gaps by the first resin member 13 and the second resin member 23, respectively. The surfaces of the first conductive layer 12, the signal line 40, and the second conductive layer 22 may be covered by the first resin member 13 and the second resin member 23. The first resin member 13 and the second resin member 23 can be formed, for example, by applying varnish or solder resist, but they may be formed by other methods. If there are depressions or holes in the first structure 1 or the second structure 2 in a direction perpendicular to the first direction D1, they can be filled with the first resin member 13 or the second resin member 23 in the second step. This reduces the number of steps required when hole filling is necessary. When manufacturing the antenna device 1 in Example 2, in the second step, it is possible to prevent the first resin member 13 and the second resin member 23 from flowing into the first connecting conductive member 15 and the second connecting conductive member 25. Alternatively, the insides of the first connecting conductive member 15 and the second connecting conductive member 25 may be filled with resin or a conductive layer before the second step, and then the first resin member 13 and the second resin member 23 may be applied.

[0046] Figure 10 is a cross-sectional view showing the antenna device after the third step in the antenna device manufacturing method according to the embodiment. In the third step, the surfaces of the first conductive layer 12, signal line 40, first resin member 13, second conductive layer 22, and second resin member 23 are polished. Polishing is, for example, smoothing, which means minimizing irregularities within each member and steps between each member. It is desirable that the difference in thickness of each member be between 0 μm and 1 μm. In the third step, it is desirable to perform smoothing until the surfaces of the first conductive layer 12, signal line 40, and second conductive layer 22 are exposed, and the thickness of the first conductive layer 12, signal line 40, and second conductive layer 22 may be reduced by polishing. At this time, the thickness of the first conductive layer 12, signal line 40, and second conductive layer 22 is, for example, between 5 μm and 105 μm. It is desirable that the thicknesses of the first conductive layer 12, signal line 40, and first resin member 13 are approximately the same. Furthermore, it is desirable that the thickness of the second conductive layer 22 and the second resin member 23 be approximately the same. This makes the surfaces of the first conductive layer 12, the signal line 40, and the first resin member 13 that contact the third resin member 30, as well as the surfaces of the second conductive layer 22 and the second resin member 23 that contact the third resin member 30, smooth, thereby reducing the thickness of the third resin member 30. Polishing, blasting, etc., can be used in the third step, but other processing methods may be used to perform the smoothing.

[0047] Figure 11 is a cross-sectional view showing the antenna device after the fourth step in the antenna device manufacturing method according to the embodiment. In the fourth step, the third resin member 30 is inserted between the second surface of the first structure 1 and the third surface of the second structure 2, and temperature and pressure are applied to the first insulating member 10 and the second insulating member 20 so that they move closer together. At this time, at least the first conductive layer 12, the signal line 40, the first resin member 13, the second conductive layer 22, and the second resin member 23 are in contact with the third resin member 30. The thickness of the third resin member 30 is preferably thinner than the thickness of each of the first conductive layer 12, the signal line 40, the first resin member 13, the second conductive layer 22, and the second resin member 23, for example, 0.05 μm or more and 20 μm or less. The third resin member 30 is preferably of uniform thickness, and from the viewpoint of strength, the thickness of the third resin member 30 is preferably 5 μm or more and 20 μm or less. In this embodiment, a method for manufacturing an antenna device is provided that can achieve both good high-frequency characteristics and improved structural stability.

[0048] While several embodiments of the present invention have been described, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments can be carried out in a variety of other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents.

[0049] The invention of the embodiment is described below.

[0050] <1> An antenna device comprising a first structure, a second structure, a signal line, and a third resin member, The first structure comprises a first insulating member, a radiating element, a first conductive layer, and a first resin member. The first insulating member includes a first surface and a second surface, the first surface is located between the radiating element and the second surface, and the second surface has a first region and a second region. A radiating element is provided on the first surface, a first conductive layer is provided in the first region, and a first resin member is provided in the second region. The aforementioned second structure comprises a second insulating member, a second conductive layer, and a second resin member. The second insulating member includes a third surface facing the second surface via the third resin member, and the third surface has a third region and a fourth region. A second conductive layer is provided in the third region, and a second resin member is provided in the fourth region. The signal line is provided in either the first region or the third region. The first conductive layer is surrounded by the first resin member, and the second conductive layer is surrounded by the second resin member. Antenna device.

[0051] <2> The difference between the thickness of the first conductive layer and the thickness of the first resin member is 0 μm or more and 1 μm or less. The difference between the thickness of the second conductive layer and the thickness of the second resin member is 0 μm or more and 1 μm or less. <1> The antenna device described above.

[0052] <3> The thickness of the third resin member is less than the sum of the thickness of the first conductive layer and the thickness of the second conductive layer. <1> or <2> The antenna device described above.

[0053] <4> The second insulating member further includes a fourth surface, the first surface having a third conductive layer and the fourth surface having a fourth conductive layer, the fourth surface being located between the fourth conductive layer and the third surface, A first connecting conductive member that electrically connects the first conductive layer and the third conductive layer, A second connecting conductive member electrically connects the second conductive layer and the fourth conductive layer, Furthermore, <1> from <3> An antenna device as described in any one of the items.

[0054] <5> The first connecting conductive member penetrates the first conductive layer, the first insulating member, and the third conductive layer in a first direction from the second structure to the first structure. The second connecting conductive member penetrates the second conductive layer, the second insulating member, and the fourth conductive layer in the first direction. <4> The antenna device described above.

[0055] <6> The signal circuit further comprises the signal line and the fourth conductive layer, which are electrically connected to each other. <4> or <5> The antenna device described above.

[0056] <7> At least a portion of the signal line is provided between the third conductive layer and the fourth conductive layer. <4> from <6> An antenna device as described in any one of the items.

[0057] <8> The first connecting conductive member is filled with the first resin member or the second resin member. The first resin member or the second resin member is filled inside the second connecting conductive member. <4> The antenna device described above.

[0058] <9> A method for manufacturing an antenna device comprising a first structure, a second structure, a signal line, and a third resin member, The first structure comprises a first insulating member, a radiating element, and a first conductive layer, wherein the first insulating member includes a first surface and a second surface, the first surface is located between the radiating element and the second surface, the second surface has a first region and a second region, the radiating element is provided on the first surface, and the first conductive layer is provided on the first region, The second structure comprises a second insulating member and a second conductive layer, wherein the second insulating member includes a third surface, the third surface has a third region and a fourth region, and the third region is provided with the second conductive layer, The signal line is provided in either the first region or the third region, The first step is to prepare, A second step involves providing a first resin member in the second region and a second resin member in the fourth region, A third step of polishing the surface of the first conductive layer, the signal line, the first resin member, the second conductive layer, and the second resin member, A fourth step involves providing the third resin member between the second surface and the third surface, A method for manufacturing an antenna device, including the method described above. [Explanation of Symbols]

[0059] 1 1st structure 2 Second structure 10 First insulating member 11 Radiation element 12 First conductive layer 13. First resin component 14 Third conductive layer 15 First connecting conductive member 15c First cylindrical part 15i 1st interior space 20 Second insulating member 22 Second conductive layer 23 Second resin component 24. Fourth conductive layer 25 Second connecting conductive member 25c Second cylindrical part 25i 2nd interior space 30 Third resin component 40 signal lines 41 Signal circuit 50 strip tracks 100 Antenna equipment D1 1st direction

Claims

1. An antenna device comprising a first structure, a second structure, a signal line, and a third resin member, The first structure comprises a first insulating member, a radiating element, a first conductive layer, and a first resin member. The first insulating member includes a first surface and a second surface, the first surface is located between the radiating element and the second surface, and the second surface has a first region and a second region. The first surface is provided with the radiating element, the first region is provided with the first conductive layer, and the second region is provided with the first resin member. The second structure comprises a second insulating member, a second conductive layer, and a second resin member. The second insulating member includes a third surface facing the second surface via the third resin member, and the third surface has a third region and a fourth region. A second conductive layer is provided in the third region, and a second resin member is provided in the fourth region. The signal line is provided in either the first region or the third region. The first conductive layer is surrounded by the first resin member, and the second conductive layer is surrounded by the second resin member. Antenna device.

2. The difference between the thickness of the first conductive layer and the thickness of the first resin member is 0 μm or more and 1 μm or less. The difference between the thickness of the second conductive layer and the thickness of the second resin member is 0 μm or more and 1 μm or less. The antenna device according to claim 1.

3. The thickness of the third resin member is less than the sum of the thickness of the first conductive layer and the thickness of the second conductive layer. The antenna device according to claim 1 or claim 2.

4. The second insulating member further includes a fourth surface, the first surface having a third conductive layer, and the fourth surface having a fourth conductive layer, the fourth surface being located between the fourth conductive layer and the third surface. A first connecting conductive member that electrically connects the first conductive layer and the third conductive layer, A second connecting conductive member electrically connects the second conductive layer and the fourth conductive layer, Furthermore, The antenna device according to claim 1.

5. The first connecting conductive member penetrates the first conductive layer, the first insulating member, and the third conductive layer in a first direction from the second structure to the first structure. The second connecting conductive member penetrates the second conductive layer, the second insulating member, and the fourth conductive layer in the first direction. The antenna device according to claim 4.

6. The signal circuit further comprises the signal line and the fourth conductive layer, which are electrically connected to each other. The antenna device according to claim 4.

7. At least a portion of the signal line is provided between the third conductive layer and the fourth conductive layer. The antenna device according to claim 4.

8. The first connecting conductive member is filled with the first resin member or the second resin member. The first resin member or the second resin member is filled inside the second connecting conductive member. The antenna device according to claim 4.

9. A method for manufacturing an antenna device comprising a first structure, a second structure, a signal line, and a third resin member, The first structure comprises a first insulating member, a radiating element, and a first conductive layer, wherein the first insulating member includes a first surface and a second surface, the first surface is located between the radiating element and the second surface, the second surface has a first region and a second region, the radiating element is provided on the first surface, and the first conductive layer is provided on the first region, The second structure comprises a second insulating member and a second conductive layer, wherein the second insulating member includes a third surface, the third surface has a third region and a fourth region, and the third region is provided with the second conductive layer. The signal line is provided in either the first region or the third region, The first step is to prepare, A second step involves providing a first resin member in the second region and a second resin member in the fourth region, A third step of polishing the surface of the first conductive layer, the signal line, the first resin member, the second conductive layer, and the second resin member, A fourth step involves providing the third resin member between the second surface and the third surface, A method for manufacturing an antenna device, including the method described above.

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