Manufacturing method for light-emitting modules

Abstract

The present invention provides a method for manufacturing a light-emitting module, which is obtained by easily joining a flexible light-emitting device to a support such as a chassis. [Solution] The embodiment is a method for manufacturing a light-emitting module obtained by joining a flexible light-emitting device and a support having a bonding surface, comprising: a light-emitting device placement step of placing the light-emitting device on the curved surface of a holding member which includes a convex curved surface and a first part and a second part having a lower height than the first part on the curved surface; a light-emitting device facing step of facing the light-emitting device and the bonding surface of the support; and a light-emitting device joining step of joining the light-emitting device and the bonding surface of the support with a joining member, from a part of the light-emitting device located on the first part side toward a part of the light-emitting device located toward the second part side.

Description

[Technical Field]

[0001] The embodiment relates to a method for manufacturing a light-emitting module. [Background technology]

[0002] Conventionally, methods for manufacturing light-emitting modules have been disclosed. For example, a manufacturing method is disclosed in which a light-emitting device is bonded to one surface of a heat-dissipating chassis. However, when the light-emitting device is flexible, bonding can be difficult. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2014-060283 [Patent Document 2] Japanese Patent Publication No. 2016-081872 [Overview of the Initiative] [Problems that the invention aims to solve]

[0004] The embodiment aims to provide a method for manufacturing a light-emitting module obtained by easily joining a flexible light-emitting device to a support such as a chassis. [Means for solving the problem]

[0005] The embodiment is a method for manufacturing a light-emitting module obtained by joining a flexible light-emitting device and a support having a bonding surface, comprising: a light-emitting device placement step of placing the light-emitting device on the curved surface of a holding member which includes a convex curved surface and a first part and a second part having a lower height than the first part on the curved surface; a light-emitting device facing step of facing the light-emitting device and the bonding surface of the support; and a light-emitting device joining step of joining the light-emitting device and the bonding surface of the support with a bonding member, from a part of the light-emitting device located on the first part side toward a part of the light-emitting device located toward the second part side. [Effects of the Invention]

[0006] According to the embodiment, a method for manufacturing a light-emitting module can be provided, which involves easily joining a flexible light-emitting device to a support such as a chassis. [Brief explanation of the drawing]

[0007] [Figure 1] This is a process diagram of a method for manufacturing a light-emitting module according to an embodiment. [Figure 2] This is a schematic top view of a light-emitting device mounted on a holding member. [Figure 3] This is a schematic enlarged view of III in Figure 2. [Figure 4] Figure 3 is a schematic cross-sectional view of section IV-IV. [Figure 5] This is a schematic front view of the retaining member. [Figure 6] This is a schematic top view of the retaining member. [Figure 7] This is a schematic bottom view of the support structure. [Figure 8] Figure 7 shows a schematic cross-sectional view of section XIII-XIII. [Figure 9] This is a schematic front view illustrating the process of mounting a light-emitting device in the manufacturing method of a light-emitting module according to an embodiment. [Figure 10] This is a schematic front view illustrating the process opposite the light-emitting device in the manufacturing method of a light-emitting module according to the embodiment. [Figure 11] This is a schematic front view illustrating the light-emitting device joining process in the manufacturing method of a light-emitting module according to the embodiment. [Figure 12] This is a schematic front view illustrating the light-emitting device joining process in the manufacturing method of a light-emitting module according to the embodiment. [Figure 13] This is a schematic cross-sectional view of a holding member used in a method for manufacturing a light-emitting module according to an embodiment. [Figure 14] This is a schematic bottom view of a support structure with a frame. [Figure 15] This is a schematic bottom view of a support having a U-shaped frame. [Figure 16]It is a schematic front view for explaining a light-emitting device facing step performed using a support having a frame. [Figure 17] It is a schematic front view for explaining a light-emitting device bonding step performed using a support having a frame. [Figure 18] It is a schematic front view for explaining a light-emitting device bonding step performed using a support having a frame.

Embodiments for Carrying out the Invention

[0008] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0009] The manufacturing method of the light-emitting module according to the embodiment obtains a light-emitting module by bonding a light-emitting device and a support. The manufacturing method will be described below. FIG. 1 is a process diagram of the manufacturing method of the light-emitting module according to the embodiment. The manufacturing method of the light-emitting module according to the embodiment includes, as shown in FIG. 1, a light-emitting device mounting step S1, a light-emitting device facing step S2, and a light-emitting device bonding step S3. Each step will be described below.

[0010] <Light-Emitting Device Mounting Step> In the light-emitting device mounting step S1, the light-emitting device is placed on the holding member. The light-emitting device and the holding member will be described below.

[0011] (Light-Emitting Device) Figure 2 is a schematic top view of the light-emitting device 10 mounted on the holding member. Figure 2 is a view of the light-emitting device 10 from the light-emitting surface side. The outer shape of the light-emitting device 10, excluding the terminal portion 11 which will be described later, is approximately rectangular. The short side of the light-emitting device 10 is designated as the first direction. The long side of the light-emitting device 10, perpendicular to the short side, is designated as the second direction. The thickness direction of the light-emitting device 10 is designated as the third direction. In Figure 2, the first direction is the same as the X direction, the second direction is the same as the Y direction, and the third direction is the same as the Z direction. The light-emitting device 10 includes a flexible substrate and is flexible. The light-emitting device 10 may also include a flexible thin glass epoxy substrate or the like. Furthermore, as shown in Figure 2, the light-emitting device 10 has a plurality of first light sources 12 arranged in a matrix in the first and second directions.

[0012] A bonding member 40 is positioned on the surface of the light-emitting device 10 opposite to the light-emitting surface. The bonding member 40 is positioned to extend in a first direction, as shown in Figure 2. The bonding member 40 may also be positioned to extend in a second direction. In Figure 2, the area where the bonding member 40 is located is indicated by a dot pattern. The bonding member 40 joins the bonding surface 21a of the light-emitting device 10 and the support 20, which will be described later. Examples of bonding members 40 include double-sided tape and adhesive resin.

[0013] The light-emitting device 10 has a terminal portion 11 that extends to the outside of the light-emitting device 10. The terminal portion 11 includes a flexible substrate and is flexible.

[0014] The light-emitting device 10 is, for example, a planar light source device. An example of a planar light source is described below.

[0015] Figure 3 is a schematic enlarged view of section III in Figure 2. Figure 4 is a schematic cross-sectional view taken along line IV-IV in Figure 3. As shown in Figures 3 and 4, the planar light source 10a comprises a light guide member 10b, a light source section 10c, a first reflective member 10d, a light guide hole section 10e, and the like.

[0016] The light guide member 10b is a member that is transparent to the light emitted by the light source unit 10c. The transmittance of the light guide member 10b with respect to the peak wavelength of the light source unit 10c is preferably 60% or more, and more preferably 80% or more. In this specification, transmittance refers to the transmittance with respect to the peak wavelength of the light source unit 10c.

[0017] The light guide member 10b is partitioned by a partition groove 10f. One region partitioned by the partition groove 10f is defined as a light-emitting region. In this embodiment, multiple light guide members 10b partitioned by the partition groove 10f each define a different light-emitting region. One light-emitting region can be used as a driving unit for local dimming. The number of light-emitting regions constituting the planar light source 10a is not particularly limited. For example, the planar light source 10a may have one light-emitting region, or it may have multiple light-emitting regions. Furthermore, by arranging multiple planar light sources 10a, a planar light source device with a larger area can be formed.

[0018] As the material for the light guide member 10b, for example, thermoplastic resins such as acrylic, polycarbonate, cyclic polyolefin, polyethylene terephthalate, or polyester, thermosetting resins such as epoxy or silicone, or glass can be used.

[0019] The thickness of the light guide member 10b is preferably, for example, 150 μm or more and 800 μm or less. The light guide member 10b may be composed of a single layer in the third direction, or it may be composed of a laminate of multiple layers. When the light guide member 10b is composed of a laminate, a light-transmitting adhesive may be placed between each layer. Each layer of the laminate may use a different type of main material. As the adhesive material, for example, thermoplastic resins such as acrylic, polycarbonate, cyclic polyolefin, polyethylene terephthalate, or polyester, or thermosetting resins such as epoxy or silicone can be used.

[0020] As shown in Figure 3, the light source unit 10c is positioned in the center of the light-emitting region partitioned by the partition groove 10f. There may be one or more light source units 10c. The light source unit 10c includes a light-emitting element. The light-emitting element includes a semiconductor laminate. The semiconductor laminate includes, for example, a substrate such as sapphire or gallium nitride, an n-type semiconductor layer and a p-type semiconductor layer placed on the substrate, and a light-emitting layer sandwiched between them. The light-emitting element also includes an n-side electrode electrically connected to the n-type semiconductor layer and a p-side electrode electrically connected to the p-type semiconductor layer. The n-side electrode and the p-side electrode constitute a part of the lower surface of the light-emitting element. Furthermore, the light source unit 10c includes a positive and negative pair of electrodes. The positive and negative pair of electrodes constitute a part of the lower surface of the light source unit 10c. One of the pair of electrodes is electrically connected to the p-side electrode, and the other is electrically connected to the n-side electrode.

[0021] The light source unit 10c may further include a first light-transmitting member 10g (hereinafter also referred to as the light source light-transmitting member). The light source light-transmitting member covers the top and sides of the light-emitting element. The light source light-transmitting member protects the light-emitting element and, depending on the particles added to the light source light-transmitting member, provides functions such as wavelength conversion and light diffusion.

[0022] For example, the light source translucent member may include a translucent resin and further include a phosphor. As the translucent resin, for example, silicone resin or epoxy resin can be used. As the phosphor, a yttrium-aluminum-garnet phosphor (for example, Y3(Al,Ga)5O) can be used. 12 Ce), lutetium-aluminum-garnet phosphors (e.g., Lu3(Al,Ga)5O 12 Ce), terbium aluminum garnet phosphors (e.g., Tb3(Al,Ga)5O 12 :Ce), CCA-based phosphors (e.g., Ca 10 (PO4)6Cl2:Eu), SAE-based phosphors (e.g., Sr4Al 14 O 25 :Eu), chlorosilicate phosphors (e.g., Ca8MgSi4O 16(Cl2:Eu), β-sialon-based phosphors (e.g., (Si,Al)3(O,N)4:Eu) or α-sialon-based phosphors (e.g., Ca(Si,Al) 12 (O,N) 16 :Eu), etc., oxynitride-based phosphors, SLA-based phosphors (e.g., SrLiAl3N4:Eu), CASN-based phosphors (e.g., CaAlSiN3:Eu) or SCASN-based phosphors (e.g., (Sr,Ca)AlSiN3:Eu), etc., nitride-based phosphors, KSF-based phosphors (e.g., K2SiF6:Mn), KSAF-based phosphors (e.g., K2Si 0.99 Al 0.01 F 5.99 :Mn) or MGF-based phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn), etc., fluoride-based phosphors, phosphors having a perovskite structure (e.g., CsPb(F,Cl,Br,I)3), or quantum dot phosphors (e.g., CdSe, InP, AgInS2 or AgInSe2), etc. can be used. As the phosphor added to the light source transmissive member, one type of phosphor may be used, or a plurality of types of phosphors may be used.

[0023] The first reflecting member 10d is a member having reflectivity with respect to the light emitted from the light source unit 10c. The reflectivity of the first reflecting member 10d is preferably, for example, 60% or more, and more preferably 80% or more. In this specification, the reflectivity is the reflectivity with respect to the peak wavelength of the light source unit 10c. The first reflecting member 10d may be composed of a single layer or a laminate of a plurality of layers.

[0024] As shown in FIG. 4, the first reflecting member 10d is disposed above the light source unit 10c (+Z direction). Thereby, it is possible to reduce the overbrightening of the region directly above the light source unit 10c. The first reflecting member 10d is disposed above the transmissive member 10g. In a top view, the outer edge of the first reflecting member 10d is located outside the outer edge of the light source unit 10c. Thereby, it is possible to reduce the overbrightening of the peripheral region directly above the light source unit 10c.

[0025] The light guide member 10b may include a light guide hole 10e that is recessed in the -Z direction. For example, the depth of the light guide hole 10e is 0.1 times or more and 0.9 times or less the thickness of the light guide member 10b. Furthermore, as shown in Figure 3, the light guide hole 10e extends inclined in a first direction (X direction) and a second direction (Y direction) away from the light source unit 10c from the end of the light guide hole 10e closest to the center of the light source unit 10c. In this way, a portion of the light from the light source unit 10c can be guided in the direction in which the light guide hole 10e extends. This can reduce brightness unevenness of the planar light source 10a.

[0026] The shape and number of light guide holes 10e provided in each of the multiple light guide members 10b of the planar light source 10a may be different or the same. For example, before forming the light guide holes 10e in the light guide members 10b, the brightness unevenness of each light guide member 10b may be checked, and then light guide holes 10e suitable for each light guide member 10 may be formed. Doing so makes it easier to reduce the brightness unevenness of the planar light source 10a. For example, if the brightness unevenness is kept within a desired range before forming the light guide holes 10e in the light guide member 10, it is not necessary to form the light guide holes 10e in the light guide member 10. As a method for checking the brightness unevenness of each light guide member 10b, for example, it can be checked by measuring the brightness with a two-dimensional colorimeter (Konica Minolta CA-2500). As a method for forming the light guide holes 10e in the light guide members 10b, for example, laser processing can be used. As shown in Figure 3, for example, among the four light guide members 10b, the light guide member 10b located on the -X and +Y sides and the light guide member 10b located on the +X and +Y sides may have the same shape and number of light guide holes 10e. Alternatively, the light guide member 10b located on the -X and +Y sides and the light guide member 10b located on the -X and -Y sides may have different numbers of light guide holes 10e. The light guide member 10b located on the +X and -Y sides may not contain any light guide holes 10e.

[0027] The planar light source 10a further comprises a second light-transmitting member 10t. The second light-transmitting member 10t is a member that is light-transmitting to the light emitted by the light source unit 10c. The second light-transmitting member 10t is placed on a second adhesive layer 10m, which will be described later, and is positioned between the light guide member 10b and the first light-transmitting member 10g. The first light-transmitting member 10g covers the side surface of the light source unit 10c.

[0028] As shown in Figure 4, the planar light source 10a further comprises a wiring substrate 10n, a first adhesive layer 10k, a second reflective member 10r, and a second adhesive layer 10m. The wiring substrate 10n has an insulating insulating base material 10p and a conductive wiring layer 10q. The first adhesive layer 10k is located between the wiring substrate 10n and the second reflective member 10r in the third direction, and adheres the wiring substrate 10n and the second reflective member 10r. The second adhesive layer 10m is located between the second reflective member 10r and the light guide member 10b in the third direction, and adheres the second reflective member 10r and the light guide member 10b.

[0029] As shown in Figure 4, the planar light source 10a further comprises a conductive member 10h. The conductive member 10h includes, for example, a resin and metal particles contained in the resin. As the resin of the conductive member 10h, for example, epoxy resin or phenolic resin can be used. As the metal particles, for example, copper or silver particles can be used.

[0030] The conductive member 10h has a connection portion 10i and a wiring portion 10j. The connection portion 10i penetrates the second adhesive layer 10m, the second reflective member 10r, the first adhesive layer 10k, and the insulating substrate 10p in a third direction. The wiring portion 10j is located on the surface of the wiring board 10n where the wiring layer 10q is arranged, and is connected to the connection portion 10i. The connection portion 10i and the wiring portion 10j can be integrally formed from, for example, the same material. A portion of the wiring portion 10j is connected to the wiring layer 10q. The insulating substrate 10p is a flexible substrate.

[0031] One conductive member 10h has a connection portion 10i that is connected to the positive electrode below the light source unit 10c, and the other conductive member 10h has a connection portion 10i that is connected to the negative electrode below the light source unit 10c. The electrodes of the light source unit 10c are electrically connected to the conductive member 10h and the wiring layer 10q.

[0032] (Retaining member) Figure 5 is a schematic front view of the holding member 30. Figure 6 is a schematic top view of the holding member 30. As shown in Figure 5, the holding member 30 has a convex curved surface 33. The curved surface 33 is the mounting surface on which the light-emitting device 10 is placed. As shown in Figure 6, the curved surface 33, which is the mounting surface, is rectangular, such as a rectangle.

[0033] The retaining member 30 includes a first part 31 on the -X direction side of the curved surface 33 and a second part 32 on the +X direction side which is shorter in height than the first part 31. The first part 31 and the second part 32 are positioned side by side in the first direction in the front view and the top view. The first part 31 is located near one end 31a of the curved surface 33, and the second part 32 is located near the other end 31b of the curved surface 33.

[0034] As shown in Figure 5, the curved surface 33 is formed from the end 31a on the first part 31 side to the end 31b on the second part 32 side. The curved surface 33 may also have portions with different curvatures from the end 31a on the first part 31 side to the end 31b on the second part 32 side, but it is preferable to have a constant curvature. By making the curvature of the curved surface 33 constant, the load on the light-emitting device 10 can be reduced when joining the support 20 and the light-emitting device 10. The curved surface 33 in this embodiment has a shape similar to a part of the side surface of a cylinder with the Y direction as its central axis. In addition, the curvature of the curved surface 33 is 0 in a cross-section along the Y direction.

[0035] Furthermore, the retaining member 30 is made of metal or resin, etc.

[0036] (Support) Next, the support body 20 to which the light-emitting device 10 is joined will be described. Figure 7 is a schematic bottom view of the support body 20. Figure 8 is a schematic cross-sectional view taken along line XIII-XIII in Figure 7. As shown in Figures 7 and 8, the support body 20 has a bottom portion 21 and two longitudinal and transverse sides 22 and 23 extending vertically (-Z direction) from the bottom portion 21. As shown in Figure 8, the support body 20 is U-shaped in cross-sectional view. The support body 20 is less flexible than the light-emitting device 10. The bottom portion 21 also has a joining surface 21a to which the light-emitting device 10 is joined. The joining surface 21a is located on the -Z side of the bottom portion 21 in Figure 8. The light-emitting device 10 and the support body 20 are joined by a joining member 40 which is placed on the joining surface 21a.

[0037] The joining surface 21a may be a flat surface or a curved surface with curvature. If the joining surface 21a is a flat surface, the light-emitting module can be applied to a flat display, and if the joining surface 21a is a curved surface with curvature, the light-emitting module can be applied to a curved display. Furthermore, when the joining surface 21a is a curved surface with curvature, it is preferable that the curvature of the joining surface 21a is smaller than the curvature of the curved surface 33 of the holding member 30.

[0038] Furthermore, one of the longitudinal sides 22 of the support 20 has a through hole 25 into which the terminal portion 11 of the light-emitting device 10 is inserted. The number of through holes 25 is the same as the number of terminal portions 11. Also, the length of the through holes 25 in the Y direction (the width of the through holes 25) is greater than the length of the terminal portion 11 in the Y direction (the width of the terminal portion 11).

[0039] The support 20 may be, for example, a metal chassis. Preferably, the support 20 contains a metal such as aluminum or a magnesium alloy. Doing so makes it easier to improve the rigidity of the support 20.

[0040] Thus, in the manufacturing method of the light-emitting module according to this embodiment, the light-emitting device 10 is joined to the support 20.

[0041] Figure 9 is a schematic front view illustrating the light-emitting device mounting step S1 in the manufacturing method of a light-emitting module according to the embodiment. In the light-emitting device mounting step S1, as shown in Figure 9, the light-emitting device 10 is placed on the curved surface 33 of the holding member 30.

[0042] In the light-emitting device mounting process S1, the terminal portion 11 is positioned on the first portion 31 side and the light-emitting device 10 is mounted. When mounting the light-emitting device 10 onto the curved surface 33 of the holding member 30, the light-emitting device 10 is positioned using the -Y direction side of the end portion 32a on the second portion 32 side as a reference and then mounted onto the curved surface 33 of the holding member 30. The light-emitting device 10 is mounted on the curved surface 33 of the holding member 30 such that the light-emitting surface of the light-emitting device 10 and the curved surface 33 of the holding member 30 face each other.

[0043] Before the light-emitting device 10 is placed on the curved surface 33 of the holding member 30, the multiple joining members 40 are positioned on the surface opposite to the light-emitting surface of the light-emitting device 10. Furthermore, when positioning the joining members 40 on the light-emitting device 10, it is preferable that, in a top view, the joining member 40 overlaps with the second light source 12a closest to the first part 31 among the multiple first light sources 12 arranged in the first direction. Moreover, when positioning the joining members 40 on the light-emitting device 10, it is preferable, in a top view, that the joining member 40 overlaps with the second light source 12a closest to the end 31a on the first part 31 side among the multiple first light sources 12 arranged in the first direction. This makes it easier to increase the area of ​​the joining member 40 that overlaps with the light-emitting device 10. This makes it easier to improve the bonding strength between the light-emitting device 10 and the support 20. Alternatively, after the light-emitting device 10 is placed on the curved surface 33 of the holding member 30, the multiple joining members 40 may be positioned on the surface opposite to the light-emitting surface of the light-emitting device 10.

[0044] Furthermore, when arranging the joining member 40 on the light-emitting device 10, it is preferable that, in a top view, the joining member 40 overlaps with the third light source 12b that is closest to the second part 32 among the multiple first light sources 12 arranged in the first direction. Also, when arranging the joining member 40 on the light-emitting device 10, it is preferable that, in a top view, the joining member 40 overlaps with the third light source 12b that is closest to the end 32a on the second part 32 side among the multiple first light sources 12. Doing so makes it easier to improve the bonding strength between the light-emitting device 10 and the support 20.

[0045] As shown in Figure 9, in a front view, the length M of the light-emitting device 10 placed on the curved surface 33 of the holding member 30 is preferably 0.95 times or more and 1.05 times or less the length L0 of the curved surface 33. The length L0 of the curved surface 33 is the length of the curve from the end 31a on the first part 31 side to the end 32a on the second part 32 side. This makes it easier to reduce variations in the position of the light-emitting device 10 placed on the curved surface 33 of the holding member 30. Note that the length M of the light-emitting device 10 placed on the curved surface 33 of the holding member 30 does not include the terminal portion 11. Furthermore, in a cross section passing through the first part 31 and the second part 32, the length M of the light-emitting device 10 placed on the curved surface 33 of the holding member 30 is preferably 0.95 times or more and 1.05 times or less the length L0 of the curved surface 33. Note that the cross section passing through the first part 31 and the second part 32 has the same shape as the schematic front view shown in Figure 9. Furthermore, in the cross-section passing through the first part 31 and the second part 32, the length M of the light-emitting device 10 placed on the curved surface 33 of the holding member 30 does not include the terminal portion 11.

[0046] Furthermore, in a top view, the length of the light-emitting device 10 in the longitudinal direction (Y direction) in the second direction is 0.95 times or more and 1.05 times or less the length L0 of the curved surface 33 of the holding member 30 in the second direction. If the length of the light-emitting device 10 in the short direction (X direction) is longer than the length of the curved surface 33, for example, the light-emitting device 10 is positioned using the end 32a on the second part 32 side as a reference and placed on the curved surface 33. In this case, a part of the light-emitting device 10 located on the -X direction side will protrude from the curved surface 33. Also, if the length of the light-emitting device 10 in the longitudinal direction (Y direction) is longer than the length of the curved surface 33, for example, the light-emitting device 10 is positioned using the corner on the +Y direction side as a reference at the end 32a on the second part 32 side and placed on the curved surface 33. In this case, a part of the light-emitting device 10 located on the -Y direction side will protrude from the curved surface 33.

[0047] <Process opposite to the light-emitting device> Figure 10 is a schematic front view illustrating the light-emitting device facing step S2 in the manufacturing method of a light-emitting module according to the embodiment. In the light-emitting device facing step S2, as shown in Figure 10, the light-emitting device 10 and the joining surface 21a of the support 20 are brought into contact. At this time, the height of the support 20 is adjusted, taking into account the thickness of the light-emitting device 10 and the joining member 40, so that the light-emitting device 10 and the support 20 do not come into contact.

[0048] Furthermore, in the light-emitting device facing step S2 before joining the light-emitting device 10 and the support 20, it is preferable to insert the terminal portion 11 of the light-emitting device 10 into the through hole 25 of the support 20 before facing the light-emitting device 10 and the joining surface 21a. By inserting the terminal portion 11 into the through hole before joining the light-emitting device 10 and the support 20, it becomes easier to reduce the likelihood of the light-emitting device 10 and the support 20 separating when the terminal portion 11 is inserted into the through hole. This reduces positional variations between the light-emitting device 10 and the support 20.

[0049] In the light-emitting device facing process S2, an adjustment member 50 is used to adjust the height of the support 20 so that the light-emitting device 10 and the support 20 do not join together. The height of the joining surface 21a is set to be higher than the highest position of the joining member placed on the light-emitting device 10 which is placed on the curved surface 33. It is preferable to face the light-emitting device 10 and the joining surface 21a in this manner. The adjustment member 50 can be, for example, a Z-axis stage. In this way, by using the adjustment member 50, it is possible to reduce the chance of the light-emitting device 10 and the support 20 joining together before the alignment of the support 20 and the light-emitting device 10 is completed. The height of the support 20 can also be adjusted by adsorbing the support 20 from above.

[0050] In the light-emitting device facing process S2, it is preferable to use a spacer 51 to assist in adjusting the height of the support 20. As shown in Figure 10, the spacer 51 has a convex portion 51c and a flat portion 51d. The longitudinal portion 22 and the short portion 23 of the support 20 are placed on the flat portion 51d of the spacer 51, and the spacer 51 assists in adjusting the height of the support 20. In addition, the longitudinal portion 22 and the short portion 23 of the support 20 are brought into contact with the convex portion 51c of the spacer 51 to fix the position of the support 20 in the first and second directions. At this time, as shown in Figure 10, the adjustment member 50 is positioned on the first portion 31 side, the spacer 51 is positioned on the second portion 32 side, and the position of the top surface of the adjustment member 50 is set higher than the position of the flat portion 51d of the spacer 51, so that the light-emitting device 10 and the joining surface 21a face each other. It is preferable to place one spacer 51 (51a, 51b) on the longitudinal side 22 and two spacers 51b on the short side 23 of the support 20. This is because the support 20 is supported at three points by the spacer 51a placed in the first direction and the two spacers 51b placed in the second direction. In addition, the two spacers 51b placed in the second direction can reduce the downward slope of the tip of the support 20 located on the second part 32 side in the -Z direction. The flat portions 51d of the three spacers 51 (51a, 51b) define a single horizontal plane. The joint surface 21a is located in the +Z direction relative to that horizontal plane. It is preferable that the two spacers 51b placed in the second direction be spaced apart from each other. In this way, the height of the support 20 can be adjusted easily and accurately. In addition, the misalignment between the support 20 and the light-emitting device 10 can be reduced.

[0051] <Light-emitting device bonding process> Figure 11 is a schematic front view illustrating the light-emitting device joining process S3 in the manufacturing method of a light-emitting module according to the embodiment, showing how a part of the light-emitting device 10 located on the first part 31 side is joined to the joining surface 21a of the support 20. Figure 12 is a schematic front view illustrating the light-emitting device joining process S3 in the manufacturing method of a light-emitting module according to the embodiment, showing how a part of the light-emitting device 10 located on the second part 32 side is joined to the joining surface 21a of the support 20.

[0052] In the light-emitting device joining process S3, first, at least a portion of the support 20 is lowered in the -Z direction, and the joining surface 21a of the support 20 is joined to a portion of the light-emitting device 10 located on the side of the first portion 31 which is placed on the holding member 30 by the joining member 40. As shown in Figure 11, the end portion 31a of the support 20 on the side of the first portion 31 may be moved downward by lowering the top surface of the adjustment member 50 located on the side of the first portion 31 of the support 20 in the -Z direction, thereby joining a portion of the joining surface 21a between the joining member 40 placed on the light-emitting device 10 and the light-emitting device 10. Furthermore, it is preferable to start the joining of the light-emitting device 10 and the joining surface 21a from a portion of the light-emitting device 10 placed at the highest position on the curved surface 33. The joining of the light-emitting device 10 and the joining surface 21a may also start from a portion of the light-emitting device 10 located in the center of the curved surface 33, or from the side of the second portion 32.

[0053] Furthermore, when lowering at least a portion of the support 20 in the -Z direction, the support 20 may be held in place by adsorption using an adsorption pad or the like.

[0054] Furthermore, when using the spacer 51, the spacer 51 is positioned at a height that allows a portion of the light-emitting device 10 to be joined to the joining surface 21a when at least a portion of the support 20 is lowered in the -Z direction. After joining the joining member 40 placed on the light-emitting device 10 to a portion of the joining surface 21a, the spacer 51 is removed. Alternatively, even without removing the spacer 51, the spacer 51 may be a Z-axis stage or the like with a structure that allows its height to be changed to be lower than the end portion 32a on the second part 32 side, which is the lowest point of the curved surface 33.

[0055] After joining a portion of the light-emitting device 10 to the joining surface 21a of the support 20, as shown in Figure 12, the joining surface 21a of the light-emitting device 10 and the support 20 is joined from the portion of the light-emitting device 10 located on the first portion 31 side toward the portion of the light-emitting device 10 located on the second portion 32 side. At this time, the support 20 is tilted along the curved surface 33 to join the light-emitting device 10 and the joining surface 21a. When joining the light-emitting device 10 and the joining surface 21a, it is preferable to apply pressure from above the support 20 to join the light-emitting device 10 and the joining surface 21a. In this way, the light-emitting device 10 and the joining surface 21a can be firmly joined.

[0056] In Figures 11 and 12, the joining of the light-emitting device 10 and the joining surface 21a was performed from the first part 31 side toward the second part 32 side, but it may also be done in the opposite direction, from the second part 32 side toward the first part 31 side.

[0057] Figure 13 is a schematic cross-sectional view of a holding member 30 used in a method for manufacturing a light-emitting module according to an embodiment. Preferably, the first distance L1 from the first part 31 to the second part 32 in the first direction is longer than the second distance L2 from the first part 31 to the second part 32 in the third direction (Z direction) which is perpendicular to the first direction (X direction) in a cross-section passing through the first part 31 and the second part 32. Also, preferably, the first distance L1 is 2 times or more and 10 times or less of the second distance L2. By making the first distance L1 2 times or more of the second distance L2, the curvature of the curved surface 33 of the holding member 30 becomes smaller than if it were less than 2 times, making it easier to align the light-emitting device 10 and the support 20. Furthermore, by making the first distance L1 10 times or less of the second distance L2, when joining the light-emitting device 10 and the joining surface 21a of the support 20 from the first part 31 side to the second part 32 side, the joining can be easily performed, thereby reducing the amount of air that gets mixed between the joining member 40 placed on the light-emitting device 10 and the joining surface 21a.

[0058] The third distance L3 from the end 31a on the first part 31 side to the end 32a on the second part 32 side in the first direction is preferably longer than the fourth distance L4 from the end 31a on the first part 31 side to the end 32a on the second part 32 side in the third direction perpendicular to the first direction in a cross-section passing through the first part 31 and the second part 32. Furthermore, the third distance L3 is preferably between 2 and 10 times the fourth distance L4.

[0059] Figure 14 is a schematic bottom view of a support 20 having a frame 70. The support 20 may have a frame 70 as shown in Figure 14. The frame 70 is removable from the support 20. The frame 70 is made of metal or the like.

[0060] Furthermore, the frame 70 may have a mechanism that allows the relative position of the joint surface 21a of the support body 20 and the curved surface 33 of the holding member 30 in a third direction to be arbitrarily changed. For example, the relative position can be arbitrarily changed by providing a cylinder or the like on the frame 70 and raising and lowering the support body 20 in a third direction while maintaining the horizontal position of the joint surface 21a of the support body 20. The frame 70 is provided with a clearance that does not interfere with the holding member 30 and has the function of moving in a third direction relative to the holding member 30. In this way, the frame 70 has a mechanism that adjusts the position of the support body 20 and the light-emitting device 10 in a top view, so that the support body 20 and the light-emitting device 10 can be aligned. Furthermore, the support body 20 and / or the holding member 30 may have a mechanism that recognizes the relative position of the support body 20 and the holding member 30 using a camera or the like and corrects the first direction, second direction, third direction and / or rotation angle.

[0061] Figure 15 is a schematic bottom view of the support 20 having a U-shaped frame 71. When lowering the support 20 in the -Z direction opposite to the third direction, if there is a risk that the terminal portion 11 will interfere with the holding member 30, the U-shaped frame 71 may be formed by cutting out a part of the frame 71 on the first portion 31 side, as shown in Figure 15.

[0062] Next, the process of facing the light-emitting device S2 and joining the light-emitting device S3 when a support 20 having a frame 70 is used will be explained. Note that the process of placing the light-emitting device S1 here is as described above. Figure 16 is a schematic front view illustrating the process of facing the light-emitting device S2 when a support 20 having a frame 70 is used. In the process of facing the light-emitting device S2, the light-emitting device 10 and the joining surface 21a of the support 20 are faced. At this time, the positions of the support 20 and the light-emitting device 10 are aligned. This is done at a distance such that the joining members 40 placed on the support 20 and the light-emitting device 10 do not come into contact. In addition, the terminals may be inserted into the through holes 25 in the process of placing the light-emitting device S1. Otherwise, it is the same as the process of facing the light-emitting device S2 described above.

[0063] Figure 17 is a schematic front view illustrating the light-emitting device joining process S3 performed using a support 20 having a frame 70, showing how a part of the light-emitting device 10 located on the first part 31 side is joined to the joining surface 21a of the support 20. Figure 18 is a schematic front view illustrating the light-emitting device joining process S3 performed using a support 20 having a frame 70, showing how a part of the light-emitting device 10 located on the second part 32 side is joined to the joining surface 21a of the support 20. As shown in Figure 17, the support 20 having a frame 70 is moved in the -Z direction to bring the support 20 into contact with a part of the light-emitting device 10 placed on the curved surface 33, and that part is joined. When the support 20 and a part of the light-emitting device 10 are joined, it is preferable to apply a load in the -Z direction. For example, it is preferable to apply the load using a pressure roller 80.

[0064] Then, as shown in Figure 18, the support 20 is tilted along the curved surface 33 from the first part 31 side toward the second part 32 side to join the light-emitting device 10 and the joining surface 21a. At this time, for example, the joining surface 21a of the light-emitting device 10 and the support 20 is joined while moving the position where the load is applied by the pressure roller 80.

[0065] After the bonding of the light-emitting device 10 and the support 20 at the bonding surface 21a is completed, the frame 70 is removed from the support 20. The rest of the process is the same as the light-emitting device bonding process S3 described above.

[0066] Based on the above, according to the embodiment, it is possible to provide a method for manufacturing a light-emitting module by easily joining a flexible light-emitting device 10 to a support 20 such as a chassis.

[0067] Furthermore, in the light-emitting device mounting step S1, the terminal portion 11 is positioned on the first portion 31 side and the light-emitting device 10 is mounted. In the light-emitting device facing step S2, the terminal portion 11 is inserted into the through hole 25, and the light-emitting device 10 and the bonding surface 21a are brought into contact. This makes it easier to reduce the likelihood of the light-emitting device 10 and the support 20 separating when the terminal portion 11 is inserted into the through hole 25. In addition, variations in the position of the light-emitting device 10 and the support 20 can be reduced.

[0068] Furthermore, in the cross-section passing through the first part 31 and the second part, the length of the light-emitting device 10 placed on the curved surface 33 of the holding member 30 is set to be 0.95 times or more and 1.05 times or less the length of the curved surface 33, thereby making it easier to reduce variations in the position of the light-emitting device 10 placed on the curved surface 33 of the holding member 30.

[0069] Furthermore, in the light-emitting device facing step S2, by using the adjustment member 50 to position the light-emitting device 10 higher than the highest position of the light-emitting device 10, and bringing the light-emitting device 10 and the joining surface 21a facing each other, it is possible to reduce the chance of the light-emitting device 10 and the support 20 joining before the alignment of the support 20 and the light-emitting device 10 is completed.

[0070] In the light-emitting device facing process S2, the adjustment member 50 is positioned on the first part 31 side, the spacer 51 is positioned on the second part 32 side, and the position of the top surface of the adjustment member 50 is set higher than the position of the top surface of the spacer 51, so that the light-emitting device 10 and the joining surface 21a face each other, thereby allowing for easy and accurate height adjustment of the support 20. This reduces misalignment between the support 20 and the light-emitting device 10 in the light-emitting module.

[0071] In the light-emitting device joining process S3, the adjustment member 50 moves the end portion 31a of the support 20 on the first portion 31 side downward, thereby joining the joining member 40 with a portion of the joining surface 21a, which further reduces the misalignment between the support 20 and the light-emitting device 10 in the light-emitting module.

[0072] By removing the spacer 51 after joining the joining member 40 to a part of the joining surface 21a, the misalignment between the support 20 and the light-emitting device 10 in the light-emitting module can be further reduced.

[0073] In the light-emitting device joining process S3, the support is tilted along the curved surface 33 from a part of the light-emitting device 10 located on the first part 31 side toward a part of the light-emitting device 10 located on the second part side, thereby joining the light-emitting device 10 and the joining surface 21a, making it easier to join the light-emitting device 10 and the support 20.

[0074] In the light-emitting device bonding process S3, pressure is applied from above the support 20 to bond the light-emitting device 10 and the bonding surface 21a, thereby achieving a stronger bond between the light-emitting device 10 and the support 20.

[0075] By making the first distance L1 longer than the second distance L2, it is possible to reduce the amount of air that gets mixed in between the joining member 40 placed on the light-emitting device 10 and the joining surface 21a of the support 20 when joining the light-emitting device 10 and the joining surface 21a of the support 20.

[0076] By setting the first distance L1 to be between twice and ten times the second distance L2, the amount of air mixed between the joining member 40 placed on the light-emitting device 10 and the joining surface 21a can be further reduced.

[0077] The joining member 40 is made easier to join the light-emitting device 10 and the support 20 by overlapping the second light source 12a, which is closest to the first part 31 among the multiple first light sources 12 arranged in the first direction.

[0078] The third light source 12b, which is closest to the second part 32 among the multiple first light sources 12 arranged in the first direction, and the joining member 40 overlap, making it easier to join the light-emitting device 10 and the support 20.

[0079] The joining member 40 can be placed on the light-emitting device 10 before the light-emitting device mounting step S1, thereby easily joining the light-emitting device 10 to the support 20.

[0080] The embodiments and their modifications described above are examples that embody the present invention, and the present invention is not limited to these embodiments and modifications. For example, the present invention also includes the addition, deletion, or modification of some components or processes in the embodiments and modifications described above. Furthermore, the embodiments and modifications described above can be implemented in combination with each other.

[0081] The present invention includes the following embodiments. (Note 1) A method for manufacturing a light-emitting module obtained by joining a flexible light-emitting device and a support having a bonding surface, A process of placing the light-emitting device on the curved surface of a holding member which includes a convex curved surface and a first part and a second part that is lower in height than the first part, A process of facing the light-emitting device and the bonding surface of the support toward each other, A light-emitting device bonding process in which the bonding surface of the light-emitting device and the support is bonded by a bonding member from a part of the light-emitting device located on the first part side toward a part of the light-emitting device located on the second part side, A method for manufacturing a light-emitting module equipped with [a specific feature / feature]. (Note 2) The light-emitting device has a terminal portion that extends to the outside of the light-emitting device, The support has a through hole into which it is inserted into the terminal portion. In the process of mounting the light-emitting device, the terminal portion is positioned on the first portion side and the light-emitting device is mounted. The method for manufacturing a light-emitting module according to Appendix 1, wherein in the step of facing the light-emitting device, the terminal portion is inserted into the through hole and the light-emitting device and the joining surface are faced each other. (Note 3) A method for manufacturing a light-emitting module according to Appendix 1 or 2, wherein, in a cross-section passing through the first and second parts, the length of the light-emitting device placed on the curved surface of the holding member is 0.95 times or more and 1.05 times or less the length of the curved surface. (Note 4) A method for manufacturing a light-emitting module according to any one of the appendices 1 to 3, wherein in the step of facing the light-emitting device, an adjustment member that can adjust the height of the support is used to adjust the height of the joining surface so that the height of the joining surface is higher than the highest position of the light-emitting device placed on the curved surface, so that the light-emitting device and the support are not joined, and the light-emitting device and the joining surface are faced. (Note 5) The method for manufacturing a light-emitting module according to Appendix 4, wherein in the process of facing the light-emitting device, the adjustment member is positioned on the first part side, the spacer on which the support is placed is positioned on the second part side, and the position of the top surface of the adjustment member is higher than the position of the top surface of the spacer, thereby facing the light-emitting device and the joining surface. (Note 6) The method for manufacturing a light-emitting module according to Appendix 5, wherein in the light-emitting device joining step, the end of the support on the first part side is moved downward by the adjustment member to join the joining member and a part of the joining surface. (Note 7) A method for manufacturing a light-emitting module according to Appendix 6, wherein the spacer is removed after joining the joining member and a part of the joining surface. (Note 8) A method for manufacturing a light-emitting module according to any one of the appendices 1 to 7, wherein in the light-emitting device joining step, the support is tilted along the curved surface from a part of the light-emitting device located on the first part side toward a part of the light-emitting device located on the second part side, thereby joining the light-emitting device and the joining surface. (Note 9) A method for manufacturing a light-emitting module according to any one of the appendices 1 to 8, wherein in the light-emitting device bonding step, pressure is applied from above the support to bond the light-emitting device and the bonding surface. (Note 10) In a front view, the first part and the second part are positioned side by side in the first direction. A method for manufacturing a light-emitting module according to any one of the appendices 1 to 9, wherein the first distance from the first part to the second part in the first direction is longer than the second distance from the first part to the second part in a third direction perpendicular to the first direction in a cross-section passing through the first part and the second part. (Note 11) The method for manufacturing a light-emitting module according to Appendix 10, wherein the first distance is more than twice and less than or equal to 10 times the second distance. (Note 12) In a top view, the first part and the second part are positioned side by side in the first direction. The light-emitting device has a plurality of first light sources arranged in the first direction, The joining member extends in the first direction, A method for manufacturing a light-emitting module according to any one of the appendices 1 to 11, wherein, in a top view, the second light source closest to the first part among the plurality of first light sources and the joining member overlap. (Note 13) A method for manufacturing a light-emitting module as described in Appendix 11, wherein, in a top view, the third light source closest to the second part among the plurality of first light sources and the joining member overlap. (Note 14) The method for manufacturing a light-emitting module according to any one of the appendices 1 to 13, wherein the joining member is placed in the light-emitting device before the light-emitting device mounting step. [Explanation of Symbols]

[0082] 10 Light-emitting device, 10a Planar light source, 10b Light guide member, 10c Light source section, 10d First reflective member, 10e Light guide hole section, 10f Partition groove, 10g First light-transmitting member, 10h Conductive member, 10i Connection section, 10j Wiring section, 10k First adhesive layer, 10m Second adhesive layer, 10n Wiring substrate, 10p Insulating substrate, 10q Wiring layer, 10r Second reflective member, 10t Second light-transmitting member, 11 Terminal section, 12 First light source, 12a Second light source, 12b Third light source, 20 Support, 21 Bottom, 21a Joint surface, 22 Long side, 23 Short side, 25 Through hole, 30 Retaining member, 31 First part, 31a End (on the first part side), 32 Second part, 32a End (on the second part side), 33 Curved surface, 40 Joining members, 50 Adjustment member, 51 Spacer, 51a Spacer (arranged in the first direction), 51b Spacer (arranged in the first direction), 51c Convex portion (of the spacer), 51d Flat portion (of the spacer), Slots 70 and 71, 80 pressure rollers, L0 is the length of the surface, L1 is the first distance, L2 is the second distance, L3 is the third distance, L4 is the fourth distance. M The length of the (short side) of the light-emitting device, S1 Light-emitting device mounting process, S2 Light-emitting device facing process, S3 Light-emitting device bonding process

Claims

1. A method for manufacturing a light-emitting module obtained by joining a flexible light-emitting device and a support having a bonding surface, A process of placing the light-emitting device on the curved surface of a holding member which includes a convex curved surface and a first part and a second part that is lower in height than the first part, A process of facing the light-emitting device and the bonding surface of the support toward each other, A light-emitting device joining process in which the joining surfaces of the light-emitting device and the support are joined by a joining member, from a part of the light-emitting device located on the first part side toward a part of the light-emitting device located on the second part side, A method for manufacturing a light-emitting module equipped with [a specific feature / equipment].

2. The light-emitting device has a terminal portion that extends to the outside of the light-emitting device, The support has a through hole into which it is inserted into the terminal portion. In the process of mounting the light-emitting device, the terminal portion is positioned on the first portion side and the light-emitting device is mounted. The method for manufacturing a light-emitting module according to claim 1, wherein in the step of facing the light-emitting device, the terminal portion is inserted into the through hole and the light-emitting device and the joining surface are facing each other.

3. A method for manufacturing a light-emitting module according to claim 1 or 2, wherein in a cross section passing through the first and second parts, the length of the light-emitting device placed on the curved surface of the holding member is 0.95 times or more and 1.05 times or less the length of the curved surface.

4. In the step of facing the light-emitting device, the manufacturing method for a light-emitting module according to claim 1 or 2, wherein an adjustment member capable of adjusting the height of the support is used to adjust the height of the joining surface so that the height of the joining surface is higher than the highest position of the light-emitting device placed on the curved surface, so that the light-emitting device and the support are not joined, and the light-emitting device and the joining surface are faced.

5. The method for manufacturing a light-emitting module according to claim 4, wherein in the process of facing the light-emitting device, the adjustment member is positioned on the first part side, the spacer on which the support is placed is positioned on the second part side, and the position of the top surface of the adjustment member is higher than the position of the top surface of the spacer, thereby facing the light-emitting device and the joining surface.

6. The method for manufacturing a light-emitting module according to claim 5, wherein in the light-emitting device joining step, the end of the support on the first part side is moved downward by the adjustment member to join the joining member and a part of the joining surface.

7. A method for manufacturing a light-emitting module according to claim 6, wherein the spacer is removed after the joining member and a part of the joining surface are joined together.

8. A method for manufacturing a light-emitting module according to claim 1 or 2, wherein in the light-emitting device joining step, the support is tilted along the curved surface from a part of the light-emitting device located on the first part side toward a part of the light-emitting device located on the second part side, thereby joining the light-emitting device and the joining surface.

9. The method for manufacturing a light-emitting module according to claim 1 or 2, wherein in the light-emitting device joining step, pressure is applied from above the support to join the light-emitting device and the joining surface.

10. In a front view, the first part and the second part are positioned side by side in the first direction. A method for manufacturing a light-emitting module according to claim 1 or 2, wherein the first distance from the first part to the second part in the first direction is longer than the second distance from the first part to the second part in the second direction perpendicular to the first direction in a cross-section passing through the first part and the second part.

11. The method for manufacturing a light-emitting module according to claim 10, wherein the first distance is two times or more and ten times or less the second distance.

12. In a top view, the first part and the second part are positioned side by side in the first direction. The light-emitting device has a plurality of first light sources arranged in the first direction, The joining member extends in the first direction, A method for manufacturing a light-emitting module according to claim 1 or 2, wherein, in a top view, the second light source closest to the first part among the plurality of first light sources and the joining member overlap.

13. A method for manufacturing a light-emitting module according to claim 12, wherein, in a top view, the third light source closest to the second part among the plurality of first light sources and the joining member overlap.

14. The method for manufacturing a light-emitting module according to claim 1 or 2, wherein the joining member is placed on the light-emitting device before the light-emitting device mounting step.

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