Temperature control system

Abstract

The load on the temperature control system is reduced compared to conventional technology. [Solution] The temperature control system comprises a booth body having an internal space separated from the external space, The system comprises a temperature control device that adjusts the temperature of the supplied air, a supply unit that supplies the temperature-controlled air to the booth body, and a supply unit that absorbs heat from the intake air and supplies the absorbed air to the temperature control device, or releases heat into the intake air and supplies the released air to the temperature control device.

Description

Technical Field

[0001] The technology of the present disclosure relates to a temperature control system.

Background Art

[0002] In order to assemble electronic components, it is known to provide a booth that forms a local space isolated from the external space inside a factory. In such a booth, the internal space is isolated from the external space by partition members (walls, ceilings, etc.). Further, by introducing temperature-controlled air from a temperature control device into the space inside the booth, the temperature of the space is maintained at a predetermined temperature.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, when the outside air temperature or the air circulated from inside the booth becomes higher than the assumed temperature, and the load for setting the temperature of the space inside the booth to a predetermined temperature exceeds the load in the case of the maximum capacity of the temperature control device, it is necessary to replace the temperature control device with another temperature control device having a capacity larger than the capacity of the temperature control device, and the performance of the temperature control device cannot be fully exhibited. By the way, the temperature control device includes a cooling coil. When the outside air temperature or the air circulated from inside the booth becomes lower than the assumed temperature and the capacity of the temperature control device becomes relatively excessive, the cooling coil freezes and the performance of the temperature control device cannot be fully exhibited.

[0005] An object of the technology of the present disclosure is to provide a temperature control system that can more fully exhibit the performance of a temperature control device than in the prior art.

Means for Solving the Problems

[0006] To achieve the above objective, a temperature control system according to a first aspect of the technology of this disclosure comprises: a booth body having an internal space partitioned from an external space; a temperature control device for adjusting the temperature of supplied air; a supply unit for supplying the temperature-controlled air to the booth body; and a supply unit for absorbing heat from the intake air and supplying the absorbed air to the temperature control device, or radiating heat into the intake air and supplying the radiated air to the temperature control device. [Effects of the Invention]

[0007] A first aspect of the technology of this disclosure is a supply unit that absorbs heat from the intake air and supplies the absorbed air to the temperature control device, or that releases heat into the intake air and supplies the released air to the temperature control device. Therefore, for example, even if the outside temperature is higher than the expected temperature, the supply unit absorbs heat from the intake air and supplies the absorbed air to the temperature control device, so the load on the temperature control device can be reduced compared to the prior art. Also, even if the outside temperature is lower than the expected temperature and the capacity of the temperature control device would otherwise be relatively excessive, the supply unit releases heat into the intake air and supplies the released air to the temperature control device, so the capacity of the temperature control device can be suppressed from becoming relatively excessive. Therefore, the first aspect allows the temperature control device to perform more effectively than the prior art. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a schematic diagram (perspective view) showing an example of a temperature control system according to a first embodiment of the technology of this disclosure. [Figure 2] Figure 2 is a schematic diagram (side view) showing an example of a temperature control system according to the first embodiment of the technology of this disclosure. [Figure 3] Figure 3 is a cross-sectional view showing an example of the configuration of the heat absorption / dissipation device 5n. [Figure 4] Figure 4 is a block diagram of an example of the electrical system of temperature control system 1A. [Figure 5] Figure 5 is a flowchart showing an example of a temperature control program executed by the CPU 62. [Figure 6] Figure 6 is a schematic diagram (side view) showing a temperature control system according to the second embodiment. [Figure 7] Figure 7 is a cross-sectional view showing an example of the configuration of the heat absorption / dissipation supply unit 4BB. [Modes for carrying out the invention]

[0009] Embodiments of the technology of this disclosure will be described below with reference to the drawings.

[0010] [First Embodiment] (composition) The configuration of the temperature control system 1A according to the first embodiment of the technology disclosed herein will be described. Figure 1 is a schematic diagram (perspective view) showing an example of the temperature control system 1A according to the first embodiment of the technology disclosed herein. Figure 2 is a schematic diagram (side view) showing an example of the temperature control system according to the first embodiment of the technology disclosed herein.

[0011] As shown in Figures 1 and 2, the temperature control system 1A in this embodiment includes a booth body 2 having an internal space S separated from the external space. The temperature control system 1A includes a temperature control device 3 that adjusts the temperature of the supplied air. When temperature-controlled air (hereinafter referred to as "temperature-controlled air") is supplied to the internal space S of the booth body 2, the temperature control device 3 adjusts the temperature of the air supplied to the temperature control device 3 so that the temperature of the internal space S reaches a predetermined temperature. The temperature control system 1A includes a supply unit 32 that supplies the temperature-controlled air supplied by the temperature control device 3 to the booth body 2. The temperature control system 1A includes a heat absorption / discharge supply unit 4AA that takes in air from the external space (i.e., outside air (OA)), absorbs heat from the taken-in outside air, leads the air from which heat has been absorbed to the temperature control device 3, and provides the absorbed heat to a predetermined location. In Figure 2, the dashed arrows indicate the flow of temperature-controlled air.

[0012] The temperature control system 1A is disposed inside the internal space S and includes a temperature sensor 8 that detects the temperature of the internal space S.

[0013] Hereinafter, the case where the temperature control system 1A is disposed, for example, inside a factory (or a building) and the work content performed in the internal space S is the assembly of predetermined electronic components by an assembly device will be described as an example.

[0014] As shown in FIG. 1, the booth main body 2 includes four columns 21a to 21d disposed on the floor surface, a ceiling portion 22, and partition members 23a to 23d. Thereby, an internal space S partitioned from the external space is formed. The size of the internal space S is predetermined.

[0015] As shown in FIG. 2, the booth main body 2 includes a ceiling portion 22 provided with an inlet 24, a space extending in the horizontal direction is formed, and a plurality of introduction holes 24a are formed on the internal space S side. Thereby, the temperature-controlled air supplied from the inlet 24 diffuses horizontally in the space of the ceiling portion 22 and is supplied to the internal space S from each introduction hole 24a. Therefore, the temperature-controlled air is supplied to the entire internal space S.

[0016] A discharge port 25 for discharging the temperature-controlled air in the internal space S to the outside of the booth main body 2 is provided below the partition member 23 (partition member 23c) of the booth main body 2. Therefore, the temperature-controlled air having the temperature of the internal space S set to a predetermined temperature is discharged to the outside of the booth main body 2 through the discharge port 25.

[0017] An entrance / exit 26 allowing entry and exit from the external space to the internal space S is provided in a part of the partition member 23 of the booth main body 2.

[0018] As shown in FIG. 2, the temperature control device 3 includes a housing 35 formed with a supply port 33H and an intake port 34. In the temperature control device 3, air whose heat has been absorbed by the heat absorption and release providing unit 4AA is supplied into the housing 35 through the intake port 34, and a temperature control unit 31 that controls the temperature of the supplied air so that the temperature of the internal space S becomes a predetermined temperature, and a blower fan 33 that blows the temperature-controlled air from the temperature control unit 31 to the supply unit 32 through the supply port 33H. A flow path 35a is formed in the intake port 34, the temperature control unit 31, and the blower fan 33.

[0019] The temperature control unit 31 may be any device that can supply temperature-controlled air. For example, it may have functions related to cooling and heating, dehumidification and humidification. In particular, as the temperature control unit 31 of the present embodiment, there is one that performs temperature control using a refrigerant gas. Specifically, the temperature control unit 31 includes a cooling function configured by a refrigeration circuit including a known compressor, condenser, expansion valve, evaporator, etc.

[0020] Specifically, the supply unit 32 is a supply pipe 32a having one end connected to the supply port 33H of the temperature control device 3 and the other end connected to the introduction port 24 of the booth body 2.

[0021] As shown in FIG. 2, the heat absorption and release providing unit 4AA includes a housing 4A and a heat absorption and release unit 5AA disposed in the housing 4A that does not use a refrigerant. The heat absorption and release unit 5AA is an example of the "supply unit" of the technology of the present disclosure.

[0022] An outside air introduction port 6 and a guide pipe 7 are connected to the housing 4A.

[0023] The heat absorption and release unit 5AA includes an introduction pipe 5a having one end connected to the outside air introduction port 6 and the other end connected to the intake port 34 of the temperature control device 3, and a plurality of heat absorption and release devices 5n provided in the introduction pipe 5a that absorb heat from the outside air introduced into the introduction pipe 5a from the outside air introduction port 6. The air from which heat has been absorbed is supplied to the temperature control device 3 through the introduction pipe 5a and the intake port 34. Each of the plurality of heat absorption and release devices 5n releases the heat absorbed from the outside air. The released heat is provided to a predetermined location through the guide pipe 7.

[0024] Since each of the multiple heat absorption and dissipation devices 5n has the same configuration, the configuration of one heat absorption and dissipation device 5n will be described, and the descriptions of the configurations of the other heat absorption and dissipation devices 5n will be omitted. Figure 3 is a cross-sectional view showing an example of the configuration of a heat absorption and dissipation device 5n. As shown in Figure 3, the heat absorption and dissipation device 5n includes an inner heat absorption and dissipation plate 53 positioned in contact with the introduction pipe 5a, and an outer heat absorption and dissipation plate 55 positioned at a distance from the inner heat absorption and dissipation plate 53. The heat absorption and dissipation device 5n includes a thermoelectric element 51 positioned between the inner heat absorption and dissipation plate 53 and the outer heat absorption and dissipation plate 55, in contact with both the inner heat absorption and dissipation plate 53 and the outer heat absorption and dissipation plate 55.

[0025] The thermoelectric element 51 comprises a plurality of lower electrodes 44 and a plurality of upper electrodes 47. The thermoelectric element 51 is a Peltier element, specifically comprising a plurality of p-type semiconductors 51a and a plurality of n-type semiconductors 51b, each made of a material such as bismuth telluride. The plurality of lower electrodes 44 and the plurality of upper electrodes 47 are joined in series via the lower electrodes 44 and the upper electrodes 47. For example, one side of the rightmost p-type semiconductor 51a and one side of the second n-type semiconductor 51b from the right are connected via the lower electrode 44, and the other side of the second n-type semiconductor 51b and the other side of the third p-type semiconductor 51a are connected via the upper electrode 47.

[0026] When a current is passed through the multiple lower electrodes 44 and multiple upper electrodes 47 connected in series in a first direction, one side of each of the p-type semiconductor 51a and n-type semiconductor 51b absorbs heat and the other side dissipates heat. Furthermore, when a current is passed through the multiple lower electrodes 44 and multiple upper electrodes 47 connected in series in a second direction opposite to the first direction, one side of each of the p-type semiconductor 51a and n-type semiconductor 51b dissipates heat and the other side absorbs heat.

[0027] Furthermore, the amount of heat absorption and dissipation can be controlled by controlling the magnitude of the current flowing through the p-type semiconductor 51a and the n-type semiconductor 51b via the multiple lower electrodes 44 and the multiple upper electrodes 47.

[0028] Figure 4 is a block diagram of an example of the electrical system of the temperature control system 1A. As shown in Figure 4, the temperature control system 1A includes a computer 50. The computer 50 includes a CPU 62, ROM 64, RAM 66, and input / output (I / O) ports 68. The CPU 62, ROM 64, RAM 66, and input / output (I / O) ports 68 are configured to communicate with each other via a bus 70. The temperature control program, which will be described later, is stored in the ROM 64.

[0029] The input / output (I / O) port 68 is connected to a blower fan 33, a temperature control unit 31, a temperature sensor 8, a storage device 9, and an input device 58. The input / output (I / O) port 68 is also connected to a magnitude changer 56 that changes the magnitude of the current flowing from the power supply circuit 52 to each heat absorption / dissipation device 5n, and a direction switcher 54 that switches the direction of the current flowing from the power supply circuit 52 to each heat absorption / dissipation device 5n to either a first direction or a second direction. The magnitude changer 56 includes a rectifier, a regulator circuit (or switching element), etc. (not shown). The switcher 54 includes a switching element such as a transistor (not shown).

[0030] (action) The operation of a temperature control system 1A according to a first embodiment of the technology of this disclosure will now be described. Figure 5 is a flowchart showing an example of a temperature control program executed by the CPU 62. When the CPU 62 executes the temperature control program, a temperature control process and a temperature control method are executed. The temperature control program is started when a predetermined start switch (not shown) in the input device 58 is turned on.

[0031] The operator inputs a setting via the input device 58 to switch the direction of the current flowing from the power supply circuit 52 to each heat absorption / dissipation device 5n to a first direction. This allows one side of each of the p-type semiconductor 51a and n-type semiconductor 51b (i.e., the side facing the inner heat absorption / dissipation plate 53) to absorb heat and the other side (i.e., the outer heat absorption / dissipation plate 55) to dissipate heat.

[0032] In step 82, the CPU 62 receives the settings entered by the operator via the input device 58.

[0033] In step 84, the CPU 62 configures the direction switch 54 to switch the direction of the current flowing from the power supply circuit 52 to each thermoelectric element 51 to the first direction.

[0034] In step 86, the CPU 62 operates the blower fan 33, the temperature control unit 31, and the size changer 56. Specifically, the CPU 62 rotates multiple blades (propellers) of the blower fan 33 (not shown) at a predetermined rotational speed and operates the temperature control unit 31 at a predetermined capacity (for example, maximum capacity). When operating the size changer 56, the CPU 62 controls the size changer 56 so that the magnitude of the current flowing from the power supply circuit 52 to each heat absorption / dissipation device 5n in the first direction becomes a predetermined magnitude.

[0035] As a result, outside air OA is drawn in from the outside air inlet 6 into the inlet pipe 5a by the blower fan 33, and heat is absorbed from the outside air via the inner heat absorption / dissipation plate 53 by multiple heat absorption / dissipation devices 5n. The air from which heat has been absorbed is then supplied to the temperature control device 3 via the inlet pipe 5a and the inlet 34.

[0036] The temperature control unit 31 of the temperature control device 3 controls the temperature of the air supplied through the intake port 34 so that the temperature of the internal space S reaches a predetermined temperature. The temperature-controlled air is supplied to the supply unit 32 via the supply port 33H by the blower fan 33. The supply unit 32 (supply pipe 32a) supplies the temperature-controlled air to the inlet 24 of the booth body 2. The temperature-controlled air supplied from the inlet 24 diffuses horizontally within the space of the ceiling 22 and is supplied to the entire internal space S through each inlet hole 24a. The temperature-controlled air, which has brought the temperature of the internal space S to the predetermined temperature, is discharged to the outside of the booth body 2 via the outlet 25.

[0037] Meanwhile, the heat absorbed from the outside air is released into the housing 4A via the outer heat absorption / dissipation plate 55 by each of the multiple heat absorption / dissipation devices 5n, and the released heat is supplied to a predetermined location (not shown) via the guide tube 7.

[0038] In step 88, the CPU 62 determines whether a predetermined time has elapsed since the start of processing in step 86. When this temperature control program starts and processing in step 86 begins, the temperature of the internal space S is higher than the predetermined temperature. However, as the air in the internal space S is gradually replaced with temperature-controlled air, and after the predetermined time has elapsed, the temperature in the internal space S becomes the predetermined temperature.

[0039] If it is determined that a predetermined time has not elapsed since the start of processing in step 86, the CPU 62 repeatedly executes the process in step 88 until it is determined that the predetermined time has elapsed. If it is determined that a predetermined time has elapsed since the start of processing in step 86, it can be determined that the temperature inside the internal space S has reached a predetermined temperature, and the temperature control process proceeds to step 90.

[0040] In step 90, the CPU 62 obtains the temperature inside the internal space S from the temperature sensor 8.

[0041] In step 92, the CPU 62 calculates the load on the temperature control unit 31, which supplies temperature-controlled air so that the temperature of the internal space S reaches a predetermined temperature.

[0042] For example, if the outside temperature rises above the expected temperature and the temperature inside the internal space S increases, the load on the temperature control unit 31 to maintain the internal space S at a predetermined temperature will be greater than the current load on the temperature control unit 31. The increased load is calculated from a predetermined constant stored in the memory device 9 (specifically, the size of the internal space S, the amount of heat generated from the assembly equipment operating in the internal space S for assembling electronic components, and the amount of heat absorbed from the outside air by the entire heat absorption / dissipation unit 5AA) and the temperature of the internal space S detected by the temperature sensor 8.

[0043] In step 94, the CPU 62 determines whether the calculated load is greater than or equal to the maximum load that can be handled by the maximum capacity of the temperature control unit 31.

[0044] If the load is not determined to be equal to or greater than the maximum load of the temperature control unit 31, the temperature control process proceeds to step 100. If the load is determined to be equal to or greater than the maximum load of the temperature control unit 31, the temperature control process proceeds to step 96.

[0045] If the load exceeds the maximum load of the temperature control unit 31, the temperature control unit 31 cannot supply temperature-controlled air to bring the temperature of the internal space S to a predetermined temperature. However, in this embodiment, in addition to the temperature control unit 31, there are multiple heat absorption and dissipation devices 5n. Therefore, the portion of the temperature that the temperature control unit 31 cannot bring the temperature of the internal space S to a predetermined temperature can be compensated for by the multiple heat absorption and dissipation devices 5n. Specifically, by increasing the amount of heat absorbed by the multiple heat absorption and dissipation devices 5n, the temperature of the air supplied to the temperature control unit 31 is lowered, enabling the temperature control unit 31 to supply temperature-controlled air to bring the temperature of the internal space S to a predetermined temperature. In other words, the load is distributed between the temperature control unit 31 and the multiple heat absorption and dissipation devices 5n. That is, the load on the temperature control unit 31 to bring the temperature of the internal space S to a predetermined temperature is reduced.

[0046] In order to increase the amount of heat absorbed by the multiple heat absorption / dissipation devices 5n, it is necessary to increase the magnitude of the current flowing through the multiple heat absorption / dissipation devices 5n.

[0047] Therefore, in step 96, the CPU 62 calculates the magnitude of the current to flow through the multiple heat absorption and dissipation devices 5n in order to increase the amount of heat absorbed by the multiple heat absorption and dissipation devices 5n, thereby lowering the temperature of the air supplied to the temperature control unit 31, and enabling the temperature control unit 31, operating at a predetermined capacity (for example, maximum capacity), to supply temperature-controlled air to bring the temperature of the internal space S to a predetermined temperature. The CPU 62 calculates the magnitude of the current from the amount of temperature reduction of the air by the multiple heat absorption and dissipation devices 5n and the amount of temperature reduction of the air temperature by the temperature control unit 31, which is operating at the predetermined capacity.

[0048] In step 98, the CPU 62 controls the magnitude converter 56 to supply a calculated current to the multiple heat absorption and dissipation devices 5n. As a result, the temperature of the air absorbed and dissipated by the multiple heat absorption and dissipation devices 5n decreases, and the temperature of the reduced air is further reduced by the temperature control unit 31, which can then supply temperature-controlled air to the internal space S via the supply unit 32 to bring the temperature of the internal space S to a predetermined temperature.

[0049] In step 100, the CPU 62 determines whether the temperature control process has ended by determining whether a predetermined stop switch (not shown) in the input device 58 has been turned on. If it is determined that the temperature control process has not ended, the temperature control process returns to step 90 and executes the above processes (steps 90 to 100). If it is determined that the temperature control process has ended, in step 102, the CPU 62 executes the process of stopping the blower fan 33 and the temperature control unit 31. When the process in step 102 is completed, the execution of this temperature control program ends.

[0050] (effect) As described above, the first embodiment distributes the load required to bring the temperature of the internal space S to a predetermined temperature between the temperature control unit 31 and the multiple heat absorption / dissipation devices 5n, thereby reducing the load on the temperature control unit 31. Therefore, even if the load required to bring the temperature of the internal space S to a predetermined temperature exceeds the maximum capacity load of the temperature control unit 31, this embodiment distributes the load between the temperature control unit 31 and the multiple heat absorption / dissipation devices 5n, preventing the temperature of the internal space S from reaching the predetermined temperature. As described above, the first embodiment allows the performance of the temperature control unit 31 to be fully utilized compared to the prior art.

[0051] Furthermore, in conventional technology, if the load required to bring the temperature of the internal space S to a predetermined temperature exceeds the load at the maximum capacity of the temperature control unit 31, it is necessary to replace the temperature control device with one that has a larger capacity than the temperature control unit 31. However, in this embodiment, the load on the temperature control unit 31 is reduced by distributing the load between the temperature control unit 31 and a plurality of heat absorption and dissipation devices 5n. Therefore, even if the load required to bring the temperature of the internal space S to a predetermined temperature exceeds the load at the maximum capacity of the temperature control unit 31, it is possible to eliminate the need to replace the temperature control device.

[0052] Furthermore, in this embodiment, the heat absorption / discharge unit 5AA includes a plurality of heat absorption / discharge devices 5n that perform heat exchange with the outside air taken in by the introduction pipe 5a. In this way, the heat absorption / discharge unit 5AA can perform not only the function of heat absorption but also the function of heat dissipation. Specifically, firstly, if the temperature of the outside air becomes lower than the expected temperature and the load on the temperature control unit 31 becomes smaller, operating the temperature control unit 31 at the predetermined capacity may cause the inside of the temperature control unit 31 to freeze. However, in this case, by switching the direction of the current to the second direction and dissipating heat from the heat absorption / discharge unit 5AA to the outside air in the introduction pipe 5a, the temperature of the air supplied to the temperature control unit 31 can be increased, preventing the inside of the temperature control unit 31 from freezing. From this point of view as well, the first embodiment can fully demonstrate the performance of the temperature control unit 31 compared to the prior art. Furthermore, since outside air can be taken in, fresh air can be supplied to the interior space S.

[0053] Incidentally, a heat absorption device using a refrigerant can also be used as a device to absorb heat from the outside air in the introduction pipe 5a. If refrigerant leaks from the refrigerant path in a heat absorption device using a refrigerant, it can burn or worsen the environment, so maintenance is burdensome, such as installing a sensor to detect refrigerant leaks. However, in this embodiment, each of the multiple heat absorption and dissipation devices 5n of the heat absorption and dissipation unit 5AA is equipped with a Peltier element thermoelectric element 51. Thus, since this embodiment is equipped with a heat absorption and dissipation unit 5AA that does not use a refrigerant, the maintenance burden can be reduced.

[0054] Furthermore, when a heat absorption device using a refrigerant is applied as a device that absorbs heat from the outside air in the introduction pipe 5a, the direction of refrigerant flow is switched by moving a movable part (spool) in the four-way valve, thereby reversing heat absorption and heat dissipation. Since the switching of the four-way valve is done by moving a movable part in the physical configuration, there is a risk that the movable part will wear out and fail after long-term use. In contrast, in this embodiment, the direction of the current to the Peltier element is controlled solely by electrical control of the switching element in the direction changer 54, so this embodiment does not experience such wear or failure of the physical configuration.

[0055] Furthermore, since the heat absorption / dissipation unit 5AA is located outside the internal space S, it is possible to prevent the temperature of the internal space S from fluctuating due to the heat released by the heat absorption / dissipation unit 5AA. Furthermore, each of the multiple heat absorption and dissipation devices 5n releases heat absorbed from the outside air, and the released heat is provided to a predetermined location via the guide tube 7. Therefore, the heat released from each of the multiple heat absorption and dissipation devices 5n can be collectively provided to the predetermined location.

[0056] [Second Embodiment] (composition) The configuration of the temperature control system 1B according to a second embodiment of the technology of this disclosure will now be described. The configuration of the temperature control system 1B according to the second embodiment is substantially the same as the configuration of the temperature control system 1A according to the first embodiment, so the same parts are denoted by the same reference numerals and their descriptions are omitted, while the different parts will be described.

[0057] Figure 6 is a schematic diagram (side view) showing a temperature control system 1B according to the second embodiment. In the temperature control system 1A according to the first embodiment, the heat absorption / discharge supply unit 4AA takes in outside air OA, absorbs heat from the taken-in outside air, supplies the heat-absorbing air to the temperature control device 3, and provides the absorbed heat to a predetermined location.

[0058] In contrast, the heat absorption and dissipation supply unit 4BB in the second embodiment of the temperature control system 1B, as shown in Figure 6, takes in return air (RA) from the internal space S and outside air, absorbs heat from the taken-in air, supplies the heat-absorbing air to the temperature control device 3, and provides the absorbed heat to a predetermined location. Specifically, the temperature control system 1B includes a first connecting pipe 31B1, one end of which is connected to the outlet 25 of the booth body 2 and the other end of which is connected to the heat absorption and dissipation supply unit 4BB, and a second connecting pipe 31B2, one end of which is connected to the heat absorption and dissipation supply unit 4BB and the other end of which is connected to the intake port 34 of the temperature control device 3.

[0059] Figure 7 is a cross-sectional view showing an example of the configuration of the heat absorption and dissipation supply unit 4BB. As shown in Figure 7, the heat absorption and dissipation supply unit 4BB comprises a housing 4A to which the intake port 9I and the guide pipe 7 are connected, and a heat absorption and dissipation unit 5BB disposed within the housing 4A. The heat absorption and dissipation unit 5BB comprises an introduction pipe 5b, one end of which is connected to the other end of the first connecting pipe 31B1 and the other end of which is connected to the one end of the second connecting pipe 31B2, an introduction pipe 5c, one end of which is connected to the intake port 9I and the other end of which is connected to the introduction pipe 5b, and a plurality of heat absorption and dissipation devices 5n provided on each of the introduction pipes 5b and 5c. The heat absorption / dissipation unit 5BB is an example of a “supply unit” of the technology of this disclosure.

[0060] (action) The operation of the temperature control system 1B according to a second embodiment of the technology of this disclosure will be described. Since the operation of the temperature control system 1B is substantially the same as that of the temperature control system 1A, only the differences will be described. In the first embodiment of the temperature control system 1A, the temperature-controlled air that has been brought to a predetermined temperature in the internal space S is discharged to the outside of the booth body 2 via the outlet 25. In contrast, in the second embodiment of the temperature control system 1B, the temperature-controlled air from the internal space S is discharged to the introduction pipe 5b of the heat absorption / discharge supply unit 4BB via the first connecting pipe 31B1. The outside air taken in from the intake port 9I is discharged to the introduction pipe 5c, and the outside air discharged to the introduction pipe 5c is discharged to the introduction pipe 5b. The temperature-controlled air and outside air introduced into the introduction pipe 5b are discharged to the temperature control device 3 via the second connecting pipe 31B2 and the intake port 34.

[0061] The temperature-controlled air and outside air introduced into the inlet pipe 5b and the outside air led out into the inlet pipe 5c are heated by each of the multiple heat absorption / dissipation devices 5n, and the heated air is supplied to the temperature control device 3.

[0062] (effect) As described above, in the second embodiment, the temperature-controlled air is led to the introduction pipe 5b of the heat absorption / discharge supply unit 4BB, and the temperature of the temperature-controlled air is lower than the temperature of the outside air. Therefore, the second embodiment can reduce the load distributed between the temperature control unit 31 and the plurality of heat absorption / discharge devices 5n compared to the first embodiment, and can reduce the load on the temperature control unit 31.

[0063] Since the configuration of the temperature control system 1B according to the second embodiment is substantially the same as the configuration of the temperature control system 1A according to the first embodiment, the second embodiment achieves the same effects as the first embodiment.

[0064] [Differentiation] Next, various modifications will be described. Since the configuration of each modification is substantially the same as the configuration of the temperature control system 1A according to the first embodiment, only the differences will be described.

[0065] (First variation) In the first modified example, the intake port 9I and the introduction pipe 5c are omitted in the heat intake / discharge supply unit 4BB of the second embodiment. In this modified example, outside air is not taken in, so low-temperature air (outside air) is not introduced into the temperature control unit 31. Therefore, in this modified example, the load on the temperature control unit 31 can be reduced compared to the temperature control system 1A of the first embodiment or the heat intake / discharge supply unit 4BB of the second embodiment.

[0066] (Second variation) In the second modification, the temperature control system 1A of the first embodiment is further equipped with a heat absorption / discharge supply unit 4BB in which the intake port 9I and the introduction pipe 5c are omitted. Since this modification is equipped with a heat absorption / discharge unit 5AA and a heat absorption / discharge unit 5BB, the load on the temperature control unit 31 can be reduced more than in the temperature control system 1A of the first embodiment.

[0067] (Third variation) In the second modification, an air filter unit such as a ULPA filter is installed in the space of the ceiling section 22 to remove dust and airborne microorganisms from the temperature-controlled air and supply it to the internal space S. This modification can prevent dust and airborne microorganisms from adhering to the assembled electronic components, thereby improving the quality of the electronic components.

[0068] (Fourth variation) The work performed in the internal space S is not limited to electronic components. In the fourth modified example, the work performed in the internal space S may be the operation of a process apparatus or precision machine where extremely high precision in temperature control of the internal space is required, even more so than in the case of assembling electronic components. As described above, even if the load required to bring the temperature of the internal space S to a predetermined temperature exceeds the maximum capacity load of the temperature control unit 31, the load is distributed between the temperature control unit 31 and the multiple heat absorption and dissipation devices 5n, so it is possible to prevent the temperature of the internal space S from falling below the predetermined temperature. Therefore, in the fourth modified example, the process apparatus or precision machine can be operated in a state where the temperature of the internal space is controlled so as not to deviate from the predetermined temperature.

[0069] (Fifth variation) In the first embodiment, the temperature control unit 31 adjusts the temperature, but the technology of this disclosure is not limited thereto, and in the fifth modification, humidity may also be adjusted. This modification can prevent electrical contact failures due to corrosion and can improve the reliability of the assembled electronic components.

[0070] (Sixth variation) In the first embodiment, a single supply pipe 32a is provided as the supply unit 32, but the technology of this disclosure is not limited thereto, and in the sixth modification, multiple supply pipes are provided as the supply unit 32. The sixth modification allows for a more even supply of temperature-controlled air to the space of the ceiling 22, and can better prevent temperature unevenness in the internal space S.

[0071] (Other variations) The heat absorption and dissipation unit 5AA is equipped with Peltier elements as thermoelectric elements 51 in the multiple heat absorption and dissipation devices 5n, but the technology of this disclosure is not limited thereto. For example, the heat absorption device may be provided which passes the introduction pipe 5a through a chilled water coil, or the heat absorption and dissipation device may be equipped with a temperature control unit that uses a refrigerant and has a smaller capacity than the temperature control unit 31. In the former case, since chilled water has a high specific heat, it can absorb a lot of heat from the air and has high cooling efficiency. In the latter case, the cooling efficiency is higher than that of a Peltier element and power consumption can be reduced.

[0072] [Note] Based on the above disclosures, the following addendum is proposed. (Note 1) The booth body has an interior space separated from the external space, A temperature control device that adjusts the temperature of the supplied air, A supply unit that supplies the temperature-controlled air to the booth body, A supply unit that absorbs heat from the intake air and supplies the absorbed air to the temperature control device, or that releases heat into the intake air and supplies the released air to the temperature control device, A temperature control system equipped with the following features. In the temperature control system described in Appendix 1, a guide unit may be further provided to guide the heat absorbed from the air to a predetermined location.

[0073] (Note 2) The supply unit is a heat absorption / dissipation unit capable of absorbing heat from the air and releasing heat into the air.

[0074] (Note 3) The aforementioned supply unit is a supply unit that does not use a refrigerant. The temperature control system described in Appendix 1 or Appendix 2.

[0075] (Note 4) The supply unit includes a Peltier element. A temperature control system as described in any one of the items in Appendix 1 to Appendix 3.

[0076] (Note 5) The supply unit takes in air from the external space. A temperature control system as described in any one of the appendices 1 to 4.

[0077] (Note 6) The supply unit takes in air from the internal space. A temperature control system as described in any one of the appendices 1 to 5.

[0078] (Note 7) The temperature control device and the supply unit are located outside the booth body. A temperature control system as described in any one of the appendices 1 to 6.

[0079] (Note 8) A temperature control system according to any one of the appendices 1 to 7, further comprising a control unit that controls the temperature control device and the supply unit so as to distribute the load required to bring the temperature of the internal space to a predetermined temperature. [Explanation of Symbols]

[0080] 1A Temperature Control System S interior space 2 ブース body 3 Temperature control device 32 Supply Department 4AA Heat Absorption and Release Supply Section 5AA endothermic thermometer 5a Infusion tube 5n heat absorption and release device 53 Inner heat absorption and release plate 55 External heat absorption and release plates 51 thermoelectric elements 44 Lower electrode 47 Upper electrode

Claims

1. The booth body has an interior space separated from the external space, A temperature control device that adjusts the temperature of the supplied air, A supply unit that supplies the temperature-controlled air to the booth body, A supply unit that absorbs heat from the intake air and supplies the absorbed air to the temperature control device, or that releases heat into the intake air and supplies the released air to the temperature control device, A temperature control system equipped with the following features.

2. The supply unit is a heat absorption and dissipation unit capable of absorbing heat from the intake air and supplying the heated air to the temperature control device, and also releasing heat into the intake air and supplying the heated air to the temperature control device. The temperature control system according to claim 1.

3. The aforementioned supply unit is a unit that does not use a refrigerant. The temperature control system according to claim 1.

4. The supply unit includes a Peltier element. The temperature control system according to claim 1.

5. The supply unit takes in air from the external space. The temperature control system according to claim 1.

6. The supply unit takes in air from the internal space. The temperature control system according to claim 1.

Images