Sensors and detection devices

Abstract

To provide a sensor capable of improving the light collection efficiency to the light-receiving section. [Solution] According to the embodiment, the sensor comprises a first insulating substrate having a first island portion and a second island portion arranged in a first direction, and a strip portion disposed between the first island portion and the second island portion and connecting the first island portion and the second island portion; a photodiode disposed on the first insulating substrate; a sealing layer that seals the photodiode; and a reflective member disposed above the sealing layer, wherein the reflective member reflects light that has passed through the first insulating substrate and entered the reflective member.

Description

Technical Field

[0001] Embodiments of the present invention relate to sensors and detection devices.

Background Art

[0002] Optical sensors capable of detecting fingerprint patterns and vein patterns are known. Such an optical sensor may be incorporated into a ring-shaped housing to form a ring-shaped detection device. In such a sensor, there is a need for a sensor capable of improving the light condensing efficiency to the light receiving portion.

Summary of the Invention

Problems to be Solved by the Invention

[0003] An object of the present embodiment is to provide a sensor capable of improving the light condensing efficiency to the light receiving portion.

Means for Solving the Problems

[0004] According to one embodiment, the sensor includes a first insulating substrate having a first island portion and a second island portion arranged in a first direction, and a band portion disposed between the first island portion and the second island portion and connecting the first island portion and the second island portion, a photodiode disposed on the first insulating substrate, a sealing layer for sealing the photodiode, and a reflecting member disposed above the sealing layer, and the reflecting member reflects light that has passed through the first insulating substrate and is incident on the reflecting member.

[0005] Also, according to an embodiment, the detection device includes a sensor and a ring-shaped housing, the sensor includes a first insulating substrate having a first island portion and a second island portion arranged in a first direction, and a band portion disposed between the first island portion and the second island portion and connecting the first island portion and the second island portion, a photodiode disposed on the first insulating substrate, a sealing layer for sealing the photodiode, and a reflecting member disposed above the sealing layer, the reflecting member reflects light that has passed through the first insulating substrate and is incident on the reflecting member, and the sensor is disposed inside the housing. [Brief explanation of the drawing]

[0006] [Figure 1] Figure 1 is a schematic diagram showing one configuration example of the detection device of this embodiment, viewed from the side of the housing, with a finger placed inside. [Figure 2] Figure 2 is a schematic cross-sectional view of the detection device along the line II-II in Figure 1. [Figure 3] Figure 3 is a plan view showing one example configuration of the detection device according to this embodiment. [Figure 4] Figure 4 is a schematic cross-sectional view of the detection device along the IV-IV line in Figure 3. [Figure 5] Figure 5 is a cross-sectional view showing one example configuration of the detection device shown in Figure 2. [Figure 6] Figure 6 is a plan view showing another configuration example of the detection device shown in Figure 3. [Figure 7] Figure 7 is a schematic cross-sectional view of the detection device along the line VII-VII in Figure 6. [Modes for carrying out the invention]

[0007] Hereinafter, this embodiment will be described with reference to the drawings. It should be noted that the disclosure is merely an example, and any modifications that a person skilled in the art could easily conceive while maintaining the spirit of the invention are naturally included within the scope of the present invention. Furthermore, the drawings may schematically represent the width, thickness, shape, etc., of each part compared to the actual embodiment in order to clarify the explanation; however, these are merely examples and do not limit the interpretation of the present invention. In addition, in this specification and in each drawing, components that perform the same or similar functions as those described above in previously shown drawings are denoted by the same reference numerals, and redundant detailed explanations may be omitted as appropriate.

[0008] Figure 1 is a schematic diagram showing one configuration example of the detection device 1 of this embodiment with a finger Fg placed inside, as viewed from the side of the housing 200.

[0009] The detection device 1 shown in Figure 1 is a ring-shaped device that can be attached to and detached from the object to be detected, such as the human body. In the example shown in Figure 1, the detection device 1 is attached to a finger Fg of the human body, but it is not limited to this and may be attached to the wrist, foot, or other parts of the human body. The finger Fg includes the thumb, index finger, middle finger, ring finger, and little finger, etc. The detection device 1 can detect information about the biological components of the object to be detected, i.e., biological information, from the finger Fg, etc., to which the detection device 1 is attached.

[0010] Figure 2 is a schematic cross-sectional view of the detection device 1 along the line II-II in Figure 1.

[0011] As shown in Figure 2, the detection device 1 comprises a sensor 100 and a ring-shaped housing 200. In this embodiment, the sensor 100 is an optical sensor that receives light and outputs an electrical signal corresponding to the received light. The detection device 1 further includes a battery (not shown) inside the housing 200. The detection device 1 operates using the power of the battery.

[0012] In the example shown in Figure 2, the housing 200 comprises a first housing 210 and a second housing 220. The first housing 210 has a ring shape and has an outer circumferential surface 210A and an inner circumferential surface 210B. The first housing 210 contacts the object to be detected, for example, a finger Fg, with its inner circumferential surface 210B. The second housing 220 covers the outer circumferential surface 210A of the first housing 210. An air layer exists between the first housing 210 and the second housing 220. The sensor 100 is located inside the housing 200. In the example shown in Figure 2, the sensor 100 is housed in the first housing 210, and the surface of the sensor 100 facing the second housing 220 is in contact with the air layer.

[0013] The first housing 210 is formed from a material such as a light-transmitting synthetic resin or silicon. The second housing 220 is formed from a material such as metal or an opaque synthetic resin.

[0014] Figure 3 is a plan view showing one example configuration of the detection device 1 of this embodiment. In this example, the first direction X, the second direction Y, and the third direction Z are orthogonal to each other, but they may intersect at angles other than 90 degrees. The first direction X and the second direction Y correspond to directions parallel to the main surface of the substrate constituting the sensor 100, and the third direction Z corresponds to the thickness direction of the sensor 100. In this specification, the direction from the first substrate SUB1 toward the second substrate SUB2 is referred to as the "upper side" (or simply "up"), and the direction from the second substrate SUB2 toward the first substrate SUB1 is referred to as the "lower side" (or simply "down"). When referring to the "second member above the first member" and the "second member below the first member," the second member may be in contact with the first member or separated from the first member. Furthermore, it is assumed that there is an observation position for observing the sensor 100 on the tip side of the arrow indicating the third direction Z, and viewing from this observation position toward the XY plane defined by the first direction X and the second direction Y is called a plan view. The first direction X shown in Figure 3 coincides with the inner circumferential direction 200C of the housing 200 shown in Figure 2.

[0015] As shown in Figure 3, the detection device 1 comprises a sensor 100 and a ring-shaped housing 200. The housing 200 also comprises a first housing 210 and a second housing 220. In Figure 3, the first housing 210 is omitted from the illustration.

[0016] The sensor 100 comprises a first substrate SUB1 and a second substrate SUB2. In Figure 3, the first substrate SUB1 and the second substrate SUB2 are shown through the second housing 220.

[0017] The first substrate SUB1 and the second substrate SUB2 are formed in a flat plate shape parallel to the XY plane. The first substrate SUB1 and the second substrate SUB2 may be bent in a third direction Z, for example.

[0018] The first substrate SUB1 has a first island portion I1, a second island portion I2, and a strip portion B that is positioned between the first island portion I1 and the second island portion I2 and connects the first island portion I1 and the second island portion I2.

[0019] In the example shown in FIG. 3, each of the first island portion I1 and the second island portion I2 of the first substrate SUB1 has a substantially rectangular shape. Each of the first island portion I1 and the second island portion I2 of the first substrate SUB1 extends along the second direction Y and has edges E1 and E2 that face each other in the first direction X. Edge E1 of the first island portion I1 faces edge E1 of the second island portion I2 in the first direction X.

[0020] Also, in the example shown in FIG. 3, each of the first island portion I1 and the second island portion I2 of the first substrate SUB1 extends along the first direction X and has edges E3 and E4 that face each other in the second direction Y.

[0021] In the example shown in FIG. 3, the strip portion B of the first substrate SUB1 extends along the first direction X and has edges E5 and E6 that face each other in the second direction Y. Edge E5 faces the light source 60, which will be described later, in the second direction Y.

[0022] The strip portion B of the first substrate SUB1 connects the first island portion I1 and the second island portion I2 of the first substrate SUB1. In the example shown in FIG. 3, one end of the strip portion B is connected to edge E1 of the first island portion I1. Also, the other end of the strip portion B is connected to edge E1 of the second island portion I2. More specifically, the connection portion between one end of the strip portion B and the first island portion I1 is close to the E4 side in the second direction Y. Also, the connection portion between the other end of the strip portion B and the second island portion I2 is close to the E4 side in the second direction Y. In the example shown in FIG. 3, edge E6 is continuously connected to edge E4 of the first island portion I1 and edge E4 of the second island portion I2.

[0023] The second substrate SUB2 has the first island portion I1, the second island portion I2, and a strip portion B disposed between the first island portion I1 and the second island portion I2 and connecting the first island portion I1 and the second island portion I2.

[0024] In the example shown in Figure 3, the first island portion I1 and the second island portion I2 of the second substrate SUB2 each have a substantially rectangular shape. The first island portion I1 and the second island portion I2 of the second substrate SUB2 each have edges E1 and E2 that extend along the second direction Y and face each other in the first direction X. Edge E1 of the first island portion I1 faces edge E1 of the second island portion I2 in the first direction X.

[0025] Furthermore, in the example shown in Figure 3, each of the first island portion I1 and the second island portion I2 of the second substrate SUB2 has edges E3 and E4 that extend along the first direction X and face each other in the second direction Y.

[0026] In the example shown in Figure 3, the strip portion B of the second substrate SUB2 extends along the first direction X and has edges E5 and E6 that face each other in the second direction Y. Edge E5 faces the light source 60, which will be described later, in the second direction Y.

[0027] The strip portion B of the second substrate SUB2 connects the first island portion I1 and the second island portion I2 of the first substrate SUB1. In the example shown in Figure 3, one end of strip portion B is connected to edge E1 of the first island portion I1. The other end of strip portion B is connected to edge E1 of the second island portion I2. More specifically, the connection portion between one end of strip portion B and the first island portion I1 is close to edge E4 in the second direction Y. Similarly, the connection portion between the other end of strip portion B and the second island portion I2 is close to edge E4 in the second direction Y. In the example shown in Figure 3, edge E6 is continuously connected to edge E4 of the first island portion I1 and edge E4 of the second island portion I2.

[0028] The first substrate SUB1 and the second substrate SUB2 are superimposed in a plan view. The edges E1 of the first substrate SUB1 and the second substrate SUB2 are superimposed in a plan view. The edges E3 of the first substrate SUB1 and the second substrate SUB2 are superimposed in a plan view. The edges E4 of the first substrate SUB1 and the second substrate SUB2 are superimposed in a plan view. The edges E5 of the first substrate SUB1 and the second substrate SUB2 are superimposed in a plan view. The edges E6 of the first substrate SUB1 and the second substrate SUB2 are superimposed in a plan view.

[0029] The second island portion I2 of the first substrate SUB1 has an extension portion Ex that extends in the first direction X from the edge E2 of the second substrate SUB2 in a plan view. The extension portion Ex does not overlap with the second substrate SUB2 in a plan view. In other words, the edges E2 of the second island portion I2 of the first substrate SUB1 and the second substrate SUB2 do not overlap in a plan view.

[0030] In other words, in a plan view, the sensor 100 has a first island portion I1, a second island portion I2, and a strip portion B positioned between the first island portion I1 and the second island portion I2, connecting the two island portions I1 and I2, in the region where the first substrate SUB1 and the second substrate SUB2 overlap. In the example shown in Figure 3, each of the first island portion I1 and the second island portion I2 of the sensor 100 has edges E1 and E2 that extend along the second direction Y and face each other in the first direction X. Also, each of the first island portion I1 and the second island portion I2 of the sensor 100 has edges E3 and E4 that extend along the first direction X and face each other in the second direction Y. The strip portion B of the sensor 100 has edges E5 and E6 that extend along the first direction X and face each other in the second direction Y.

[0031] In the example shown in Figure 3, the sensor 100 includes two detection regions AA1 and AA2 and a peripheral region GA in the area where the first substrate SUB1 and the second substrate SUB2 overlap. In a plan view, detection region AA1 overlaps the first island portion I1, and detection region AA2 overlaps the second island portion I2. Peripheral region GA surrounds detection regions AA1 and AA2. In a plan view, peripheral region GA overlaps the band portion B.

[0032] Detection region AA1 is equipped with a first photodiode PD1, and detection region AA2 is equipped with a second photodiode PD2. In the following description, the first photodiode PD1 and the second photodiode PD2 may be collectively referred to as photodiode PD.

[0033] The first photodiode PD1 and the second photodiode PD2 are light-receiving components in the sensor 100. Each of the first photodiode PD1 and the second photodiode PD2 receives light and outputs an electrical signal corresponding to the received light. The first photodiode PD1 and the second photodiode PD2 are, for example, organic photodiodes (OPDs) using organic semiconductors.

[0034] Each of the first photodiode PD1 and the second photodiode PD2 has a semiconductor layer, a first electrode 31, and a second electrode 32. In the example shown in Figure 3, the first photodiode PD1 has an organic semiconductor layer OS, first electrodes 311 and 312, and a second electrode 321. The first electrodes 312 and 311 and the second electrode 321 are arranged in this order in the first direction X.

[0035] The organic semiconductor layer OS of the first photodiode PD1 is superimposed on the detection region AA1 in a plan view. Furthermore, the organic semiconductor layer OS of the first photodiode PD1 is superimposed on the first electrodes 311, 312 and the second electrode 321 in a plan view, and is provided spanning across the first electrodes 311, 312 and the second electrode 321.

[0036] In the example shown in Figure 3, the second photodiode PD2 has an organic semiconductor layer OS, first electrodes 313 and 314, and a second electrode 322. The second electrode 322 and the first electrodes 314 and 313 are arranged in this order in the first direction X.

[0037] The organic semiconductor layer OS of the second photodiode PD2 is superimposed on the detection region AA2 in a plan view. Furthermore, the organic semiconductor layer OS of the second photodiode PD2 is superimposed on the first electrodes 313, 314 and the second electrode 322 in a plan view, and is provided spanning across the first electrodes 313, 314 and the second electrode 322.

[0038] The sensor 100 further includes a reflective member 40. In a plan view, the reflective member 40 is superimposed on the first electrode 31.

[0039] In the example shown in Figure 3, the sensor 100 includes a reflective member 41 superimposed on the first island portion I1 and a reflective member 42 superimposed on the second island portion I2 in a plan view. The reflective member 41 is superimposed on the first electrodes 311 and 312 in a plan view. In the example shown in Figure 3, the reflective member 41 is not superimposed on the peripheral region GA in a plan view, but this is not limited to this, and the reflective member 41 may be superimposed on the peripheral region GA.

[0040] In a plan view, the reflective member 42 is superimposed on the first electrodes 313 and 314. In the example shown in Figure 3, the reflective member 42 is not superimposed on the peripheral region GA in a plan view, but the example is not limited to this, and the reflective member 42 may be superimposed on the peripheral region GA.

[0041] Figure 3 illustrates an example in which the sensor 100 has two reflective members 41 and 42, but it is not limited to this. For example, the sensor 100 may have one reflective member 40, and this one reflective member 40 may be superimposed on the detection regions AA1 and AA2 and the surrounding region GA in a plan view, and also superimposed on the first electrodes 311, 312, 313, and 314.

[0042] The sensor 100 further includes a plurality of terminals 50. The plurality of terminals 50 are provided on the extension Ex of the first substrate SUB1. In the example shown in Figure 3, the plurality of terminals 50 are arranged in the second direction Y. Each of the plurality of terminals 50 is connected to a control circuit (not shown).

[0043] The first electrode 31 is electrically connected to the signal line SL. In the example shown in Figure 3, each of the first electrodes 311, 312, 313, and 314 is connected to the signal line SL via contact holes (CH1, CH2, CH3, CH4) formed in the insulating layer 13, which will be described later.

[0044] The signal line SL connected to the first electrode 311 extends in the second direction Y from the connection point with the first electrode 311 (contact hole CH1), bends in the first direction X, and extends in the first direction X. The signal line SL connected to the first electrode 312 extends in the second direction Y from the connection point with the first electrode 312 (contact hole CH2), bends in the first direction X, and extends in the first direction X. In a plan view, each of the signal lines SL connected to the first electrodes 311 and 312 is superimposed on the band B.

[0045] The signal line SL connected to the first electrode 313 extends in the second direction Y from the connection point with the first electrode 313 (contact hole CH3), bends in the first direction X, and extends in the first direction X. The signal line SL connected to the first electrode 314 extends in the second direction Y from the connection point with the first electrode 314 (contact hole CH4), bends in the first direction X, and extends in the first direction X. Neither of the signal lines SL connected to the first electrodes 313 and 314 overlaps the band B in a plan view.

[0046] The signal line SL is connected to one of the multiple terminals 50. In other words, each of the first electrodes 311, 312, 313, and 314 is connected to the control circuit via the signal line SL and terminal 50.

[0047] The second electrode 32 is electrically connected to the power supply wiring CL. In the example shown in Figure 3, each of the second electrodes 321 and 322 is connected to the power supply wiring CL via contact holes CH5 and CH6 formed in the insulating layer 13, which will be described later.

[0048] The power supply wiring CL connected to the second electrode 321 extends in the second direction Y from the connection point with the second electrode 321 (contact hole CH5), bends in the first direction X, and extends in the first direction X. In a plan view, the power supply wiring CL connected to the second electrode 321 is superimposed on the band B.

[0049] The power supply wiring CL connected to the second electrode 322 extends in the second direction Y from the connection point (contact hole CH6) with the second electrode 322. In a plan view, the power supply wiring CL connected to the second electrode 322 does not overlap the band portion B.

[0050] The power supply wiring CL is connected to one of the multiple terminals 50. In other words, the second electrodes 321, 321 are connected to the control circuit via the power supply wiring CL and terminals 50.

[0051] The signal line SL and power supply wiring CL are superimposed on the surrounding region GA in a plan view. The signal line SL and power supply wiring CL are located on the same layer.

[0052] The control circuit supplies control signals to the first photodiode PD1 and the second photodiode PD2 to control the detection operation. Each of the first photodiode PD1 and the second photodiode PD2 outputs an electrical signal corresponding to the received light as a detection signal to the control circuit. The detection device 1 detects information about the object to be detected based on the detection signal.

[0053] The sensor 100 further includes light sources 60. In the example shown in Figure 3, the sensor 100 includes three light sources 60, namely a first light source 61, a second light source 62, and a third light source 63.

[0054] The first light source 61 is positioned between the first island I1 and the second island I2 in a plan view. The second light source 62 is positioned between the first island I1 and the first light source 61 in the first direction X. The third light source 63 is positioned between the second island I2 and the first light source 61 in the first direction X.

[0055] The light source 60 is not superimposed on the first substrate SUB1 and the second substrate SUB2 in a plan view. The light source 60 is provided, for example, on the first housing 210. Although not shown, the sensor 100 may further include a third substrate SUB3 that is superimposed on the first substrate SUB1 and the second substrate SUB2 in a plan view, and the light source 60 may be arranged on the third substrate SUB3.

[0056] Light sources 60 can be, for example, inorganic LEDs (Light Emitting Diodes) or organic ELs (OLEDs). For example, the first light source 61 emits infrared or red light, and the second light source 62 and third light sources 63 emit green light.

[0057] Figure 4 is a schematic cross-sectional view of the detection device 1 along the line IV-IV in Figure 3. In Figure 4, the second housing 220, the first island portion I1, the strip portion B, and the extension portion Ex of the sensor 100 are mainly shown, and other elements are omitted.

[0058] The first substrate SUB1 comprises an insulating substrate 10, a protective layer 11, a buffer layer 12, an insulating layer 13, a first photodiode PD1, a second photodiode PD2, a sealing layer 17, a signal line SL, a power supply wiring CL, and a terminal 50.

[0059] The insulating substrate 10 comprises a main surface (bottom surface) 10A and a main surface (top surface) 10B opposite to the main surface 10A. The protective layer 11 covers the main surface 10B across the first island portion I1, the second island portion I2, and the strip portion B. The buffer layer 12 covers the protective layer 11. The signal line SL and the power supply wiring CL are each located on the buffer layer 12.

[0060] The insulating layer 13 covers the buffer layer 12, the signal line SL, and the power supply wiring CL. In a plan view, the first photodiode PD1 is placed on the insulating layer 13 superimposed on the first island portion I1. Although not shown in the diagram, in a plan view, the second photodiode PD2 is placed on the insulating layer 13 superimposed on the second island portion I2.

[0061] The first photodiode PD1 comprises first electrodes 311 and 312, a second electrode 321, and an organic semiconductor layer OS. In Figure 4, the first electrode 312 is omitted from the illustration. Although not shown, the second photodiode PD2 comprises first electrodes 313 and 314, a second electrode 322, and an organic semiconductor layer OS.

[0062] The first electrodes 311, 312 and the second electrode 321 are arranged on the insulating layer 13. Although not shown, the first electrodes 313, 314 and the second electrode 322 are also arranged on the insulating layer 13. In a plan view, the terminal 50 is arranged on the insulating layer 13 that overlaps the extension portion Ex.

[0063] The first electrode 311 is electrically connected to the signal line SL via a contact hole (CH1) formed in the insulating layer 13. Although not shown in the diagram, each of the first electrodes 312, 313, and 314 is also electrically connected to the signal line SL via contact holes (CH2, CH3, CH4) formed in the insulating layer 13.

[0064] The second electrode 321 is electrically connected to the power supply wiring CL via a contact hole (CH5) formed in the insulating layer 13. Although not shown, the second electrode 322 is also electrically connected to the power supply wiring CL via a contact hole (CH6) formed in the insulating layer 13.

[0065] Terminal 50 is electrically connected to the signal line SL via a contact hole (CH7) formed in the insulating layer 13.

[0066] In a plan view, the organic semiconductor layer OS superimposed on the first island I1 covers the first electrodes 311, 312 and the second electrode 321. Although not shown in the figure, in a plan view, the organic semiconductor layer OS superimposed on the second island I2 covers the first electrodes 313, 314 and the second electrode 322. As shown in Figure 4, the organic semiconductor layer OS has an electron injection layer 14, an active layer 15, and a hole injection layer 16.

[0067] In a plan view, the electron injection layer 14 superimposed on the first island I1 continuously covers the first electrodes 311 and 312. The electron injection layer 14 is in contact with the first electrodes 311 and 312. Although not shown in the figure, in a plan view, the electron injection layer 14 superimposed on the second island I2 continuously covers the first electrodes 313 and 314 and is in contact with them. As shown in Figure 4, a portion of the first electrode 31 may be exposed from the electron injection layer 14.

[0068] The active layer 15 covers the upper surface of the electron injection layer 14 and is in contact with the electron injection layer 14. The hole injection layer 16 continuously covers the upper surface of the active layer 15, the side surface 15A facing the second electrode 32, and the second electrode 32. The hole injection layer 16 is in contact with the active layer 15. The hole injection layer 16 is also in contact with the second electrode 32. As shown in Figure 4, the side surface 15B of the active layer 15 opposite to side surface 15A may be exposed from the hole injection layer 16.

[0069] The sealing layer 17 is arranged across the first island portion I1, the second island portion I2, and the band portion B. The sealing layer 17 covers the insulating layer 13, the hole injection layer 16, the side surface 15B of the active layer 15, and the first electrode 31 exposed from the active layer 15. By forming the sealing layer 17, the photodiode PD is well sealed, thereby suppressing the intrusion of moisture from the top side.

[0070] The sealing layer 17 is not present in the extension portion Ex. In other words, in the extension portion Ex, the insulating layer 13, the contact hole CH7, and the terminal 50 are exposed from the sealing layer 17.

[0071] The second substrate SUB2 comprises an insulating substrate 20, a protective layer 21, a buffer layer 22, and reflective members 41 and 42. The insulating substrate 20 comprises a main surface (bottom surface) 20A and a main surface (top surface) 20B opposite to the main surface 20A. The protective layer 21 covers the main surface 20A. The buffer layer 22 covers the protective layer 21. The protective layer 21 is bonded to the first substrate SUB1, for example, by a sealing layer 17. This bonds the first substrate SUB1 and the second substrate SUB2.

[0072] The reflective member 41 is provided on the main surface 20B. In a plan view, the reflective member 41 is superimposed on the first electrodes 311 and 312. Although not shown, the reflective member 42 is also provided on the main surface 20B and, in a plan view, is superimposed on the first electrodes 313 and 314.

[0073] The sensor 100 of this embodiment, shown in Figures 3 and 4, is housed in the first housing 210, as shown in Figure 2, and is therefore positioned inside the ring-shaped housing 200. The main surface 10A of the insulating substrate 10 faces the inner circumferential surface 210B of the first housing 210, and the main surface 10B of the insulating substrate 10 faces the second housing 220. The sensor 100 is curved along the outer circumferential surface 210A of the first housing 210.

[0074] As shown in Figure 4, the reflective members 41 and 42 are positioned between the insulating substrate 10 and the second housing 220, and between the insulating substrate 20 and the second housing 220.

[0075] As shown in Figure 4, an air layer exists between the sensor 100 and the second housing 220. The surface of the reflective member 40 facing the second housing 220 is in contact with the air layer.

[0076] The insulating substrates 10 and 20 are insulating substrates and are flexible. The insulating substrates 10 and 20 are formed of, for example, a film-like resin. The protective layers 11 and 21 are formed of an inorganic insulating material, for example, a SiOx film. The buffer layers 12 and 22 are formed of an organic material. The insulating layer 13 may be an inorganic insulating film or an organic insulating film. The insulating layer 13 may be a single layer or a multilayer film. The signal line SL and power supply wiring CL are formed of, for example, metal wiring.

[0077] The first electrode 31 and the second electrode 32 are formed from a light-transmitting conductive material such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide).

[0078] The electron injection layer 14 is formed of a material having electron injection properties. A material commonly used as an electron injection layer can be used as the electron injection layer 14. The hole injection layer 16 is formed of a material having hole injection properties. A material commonly used as a hole injection layer can be used as the hole injection layer 16.

[0079] The active layer 15 is made of a material whose properties (e.g., voltage-current characteristics and resistance) change depending on the light it is irradiated with. For example, the active layer 15 has a bulk heterostructure in which a p-type organic semiconductor and an n-type organic semiconductor, an n-type fullerene derivative (PCBM), are mixed. In addition, as the active layer 15, for example, low molecular weight organic materials such as C60 (fullerene), PCBM (phenyl C61-butyric acid methyl ester), CuPc (copper phthalocyanine), F16CuPc (fluorinated copper phthalocyanine), rubrene (5,6,11,12-tetraphenyltetracene), and PDI (derivative of perylene) can be used.

[0080] The active layer 15 can be formed by vapor deposition (Dry Process) using these low-molecular-weight organic materials. In this case, the active layer 15 may be, for example, a laminated film of CuPc and F16CuPc, or a laminated film of rubrene and C60. The active layer 15 can also be formed by coating (Wet Process). In this case, the active layer 15 uses a material that combines the low-molecular-weight organic material and the polymeric organic material described above. As the polymeric organic material, for example, P3HT (poly(3-hexylthiophene)), F8BT (F8-alt-benzothiadiazole), etc. can be used. The active layer 15 can be a film in which P3HT and PCBM are mixed, or a film in which F8BT and PDI are mixed.

[0081] The sealing layer 17 is a sealing adhesive layer formed of an inorganic film such as a silicon nitride film or an aluminum oxide film, or a resin film such as acrylic. The sealing layer 17 is not limited to a single layer, but may be a laminated film of two or more layers combining the above-mentioned inorganic film and resin film.

[0082] The reflective member 40 is a film capable of reflecting light incident on it. The reflective member 40 reflects, for example, at least one of infrared light, red light, and green light. As the reflective member 40, a reflective sheet such as Enhanced Specular Reflector (ESR) Film (manufactured by 3M) can be used. Alternatively, as the reflective member 40, a resin film such as PET having a metal layer formed of a highly reflective metal material such as aluminum, silver, and titanium on the surface facing the photodiode PD can be used. The metal layer can be formed, for example, by depositing a metal material onto the surface of the resin film.

[0083] Figure 5 is a cross-sectional view showing one example configuration of the detection device 1 shown in Figure 2. In Figure 5, the detection device 1 mainly shows the second housing 220 and the sensor 100, while other elements are omitted. Also in Figure 5, an example is shown in which a finger Fg is placed inside the detection device 1 as the object to be detected. The light emitted from the light source 60 will be explained with reference to Figure 5.

[0084] The light source 60 emits light L1 towards the object to be detected, such as a finger Fg, which is housed inside the detection device 1. The light L1 emitted from the light source 60 is either reflected from the surface or inside of the finger Fg, or it passes through the finger Fg. Figure 5 shows an example where the light L1 is reflected from the surface of the finger Fg. The light L1 that is reflected from or passed through the finger Fg passes through the insulating substrate 10 and is incident on at least one of the first photodiode PD1 and the second photodiode PD2. As a result, the voltage-current characteristics and resistance value of the active layer 15 change, and a current flows between the first electrode 31 and the second electrode 32 via the electron injection layer 14, the active layer 15, and the hole injection layer 16. The sensor 100 can detect information about the biological material of the object to be detected by detecting the current flowing between the first electrode 31 and the second electrode 32.

[0085] Information about living organisms includes, for example, fingerprints, pulse waves of fingers and palms, pulse rate, vascular images, and blood oxygen saturation. Different information about living organisms can be detected depending on the type of light L1 emitted from the light source 60. For example, if the light L1 emitted from the light source 60 is green light, the pulse rate of the subject can be detected. Also, if the light L1 emitted from the light source 60 is infrared light or red light, blood oxygen saturation can be detected. For example, if the first light source 61 shown in Figure 3 emits infrared or red light, and the second light source 62 and third light source 63 emit green light, then to detect the pulse rate of the subject, at least one of the second light source 62 and the third light source 63 needs to be lit, and to detect blood oxygen saturation, only the first light source 61 needs to be lit.

[0086] A portion of the light L1 incident on the photodiode PD passes through the photodiode PD and the second substrate SUB2, reaches the main surface 20B, and is incident on the reflecting member 40. In this embodiment, the sensor 100 can reflect the light L1 that reaches the main surface 20B back towards the photodiode PD using the reflecting member 40. This prevents light leakage between the sensor 100 and the housing 200. Therefore, compared to the case where the reflecting member 40 is not provided, the light collection efficiency of the light L1 to the photodiode PD, which is the light-receiving part of the sensor 100, can be improved. Thus, according to this embodiment, a sensor 100 capable of improving the light collection efficiency to the light-receiving part can be provided.

[0087] Next, other configuration examples of this embodiment will be described.

[0088] Figure 6 is a plan view showing another configuration example of the detection device 1 shown in Figure 3. The configuration example shown in Figure 6 differs from the configuration example shown in Figure 3 in that the sensor 100 is further provided with a reflective member 40 on the side surface of the sensor 100.

[0089] In the example shown in Figure 3, the sensor 100 further includes a reflective member 43 along the edge E3 of the first island portion I1 and a reflective member 44 along the edge E3 of the second island portion I2. The sensor 100 also further includes reflective members 45 along the edges E4 of the first island portion I1 and the second island portion I2, as well as the edge E6 of the strip portion.

[0090] Figure 7 is a schematic cross-sectional view of the detection device 1 along the line VII-VII in Figure 6. In Figure 7, the sensor 100 and the second housing 220 are mainly shown, and other elements are omitted. As shown in Figure 7, the reflective member 43 is positioned on the side surface along the edge E3 of the first island portion I1. Although not shown, the reflective member 44 is positioned on the side surface along the edge E3 of the second island portion I2. The reflective members 45 are continuously positioned on the side surfaces along the edges E4 of the first island portion I1 and the second island portion I2, and along the edge E6 of the strip portion B.

[0091] In the example shown in Figure 7, the reflective members 43, 44, and 45 are arranged across the sides of the first substrate SUB1 and the second substrate SUB2, but are not limited to this arrangement. For example, the reflective members 43, 44, and 45 may be provided only on at least a portion of the sides of the first substrate SUB1 and the second substrate SUB2.

[0092] Depending on the angle of incidence of the light L1 emitted from the light source 60 onto the finger Fg, light leakage may occur from the side of the sensor 100, reducing the light collection efficiency to the photodiode PD. The sensor 100 shown in Figures 6 and 7 can reflect the light L1 that reaches the side of the sensor 100 back into the sensor 100 by a reflective member 40 provided on the side of the sensor 100. This prevents light leakage from the side of the sensor 100. Therefore, compared to the case where the reflective member 40 is not provided on the side of the sensor 100, the light collection efficiency of the light L1 to the photodiode PD, which is the light receiving part of the sensor 100, can be improved. Thus, the configuration example shown in Figures 6 and 7 can further improve the light collection efficiency to the light receiving part. Furthermore, the same effects as the configuration example shown in Figure 3 can be obtained in this configuration example as well.

[0093] As described above, this embodiment provides a sensor that can improve the light collection efficiency to the light receiving section.

[0094] Within the scope of the spirit of the present invention, a person skilled in the art can conceive of various modifications, and such modifications are also understood to fall within the scope of the present invention. For example, modifications to the above-described embodiments in which a person skilled in the art has appropriately added, deleted, or modified components, or added, omitted, or modified processes, are also included within the scope of the present invention, as long as they retain the gist of the present invention.

[0095] Furthermore, any other effects and advantages brought about by the embodiments described above that are obvious from the description herein or that can be appropriately conceived by those skilled in the art are naturally considered to be brought about by the present invention. [Explanation of Symbols]

[0096] 1. Detection device 100 sensors 10,20 Insulating substrate 11,21 Protective layer 12,22 Buffer Layers 13 Insulating layer 14 Electron injection layer 15 Active layer 16 Hole injection layer 17. Sealing layer 31 1st electrode 32 2nd electrode Reflective material 40, 41, 42, 43, 44, 45 50 terminals 60 light source OS Organic Semiconductor Layer PD, PD1, PD2 photodiodes AA1, AA2 detection area GA related fields SL signal line CL power supply wiring 200 cabinets

Claims

1. A first insulating substrate having first island portions and second island portions arranged in a first direction, and a strip portion disposed between the first island portion and the second island portion and connecting the first island portion and the second island portion, A photodiode positioned above the first insulating substrate, A sealing layer that seals the photodiode, The system comprises a reflective member positioned above the sealing layer, The reflective member is a sensor that reflects light that has passed through the first insulating substrate and entered the reflective member.

2. The sensor according to claim 1, wherein the reflective member reflects at least one of infrared light, red light, and green light.

3. The sensor according to claim 1, wherein the reflective member is a reflective sheet or a resin film having a metal layer on the surface facing the photodiode.

4. The sensor according to claim 3, wherein the metal layer is made of aluminum.

5. The aforementioned photodiode is A first electrode positioned above the first insulating substrate, The sensor according to claim 1, comprising a semiconductor layer disposed on the first electrode.

6. The sensor according to claim 5, wherein the reflective member is superimposed on the first electrode in a plan view.

7. The semiconductor layer comprises an electron injection layer in contact with the first electrode, The active layer in contact with the electron injection layer, The sensor according to claim 5, comprising a hole injection layer in contact with the active layer.

8. Furthermore, the sensor according to claim 7, comprising a second electrode in contact with the hole injection layer.

9. Furthermore, the sensor according to claim 8, comprising an insulating layer disposed on the first insulating substrate.

10. The sensor according to claim 9, wherein the first electrode and the second electrode are arranged on the insulating layer.

11. Furthermore, the sensor according to claim 1 is further provided with a reflective member on its side.

12. Furthermore, in a plan view, a first light source is positioned between the first island portion and the second island portion, In the first direction, a second light source is disposed between the first island portion and the first light source, The sensor according to claim 1, further comprising a third light source disposed between the second island portion and the first light source in the first direction.

13. The sensor according to claim 12, wherein the first light source emits infrared light or red light.

14. The sensor according to claim 12, wherein the second light source and the third light source emit green light.

15. Sensors and, It comprises a ring-shaped housing, The aforementioned sensor is A first insulating substrate having first island portions and second island portions arranged in a first direction, and a strip portion disposed between the first island portion and the second island portion and connecting the first island portion and the second island portion, A photodiode positioned above the first insulating substrate, A sealing layer that seals the photodiode, The system comprises a reflective member positioned above the sealing layer, The reflective member reflects light that has passed through the first insulating substrate and entered the reflective member. The sensor is a detection device located inside the housing.

16. Furthermore, in a plan view, a first light source is positioned between the first island portion and the second island portion, In the first direction, a second light source is disposed between the first island portion and the first light source, The detection device according to claim 15, further comprising a third light source disposed between the second island portion and the first light source in the first direction.

17. The housing comprises a ring-shaped first housing and a second housing that covers the outer circumferential surface of the first housing. The detection device according to claim 15, wherein the sensor is housed in the first housing.

18. The detection device according to claim 17, wherein the reflective member is disposed between the first insulating substrate and the second housing.

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