Parts data management method, parts data management program, parts data management device, and parts data management system

Abstract

The present invention provides a parts data management method, a parts data management program, a parts data management device, and a parts data management system that can collect performance data that is highly correlated with operating parameters. [Solution] The component data management method acquires at least component data used by a component mounting device and actual data obtained when components are mounted by the component mounting device using the component data (ST1), processes the actual data based on the production errors that occurred (ST2), and links the acquired component data and the processed actual data and stores them in a database (ST6).

Description

Technical Field

[0001] The present disclosure relates to a component data management method, a component data management program, a component data management device, and a component data management system for managing component data used in a component mounting device for mounting components on a substrate.

Background Art

[0002] A component mounting device for mounting components on a substrate controls the component mounting operation based on a number of operation parameters including operation conditions related to component suction by a nozzle, imaging of components by a camera, and component mounting on the substrate. These operation parameters are set with appropriate values for each component as component data associated with component information including information such as the shape of the component. Patent Document 1 discloses creating achievement information by aggregating performance data when mounting using the component data based on the creation information of the component data in order to generate a learned model that creates component data with high productivity and mounting quality by machine learning.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the prior art including Patent Document 1, the performance data includes suction errors that are not caused by the operation parameters, and using performance data including errors caused by factors unrelated to the operation parameters in machine learning or the like may lead to incorrect judgment of the quality of the component data, and there is room for further improvement.

[0005] Therefore, the purpose of this disclosure is to provide a parts data management method, a parts data management program, a parts data management device, and a parts data management system that can collect performance data that is highly correlated with operating parameters. [Means for solving the problem]

[0006] The component data management method of this disclosure is a component data management method for managing component data in which operating parameters, which are the operating conditions of a component mounting device for mounting the component onto a substrate, are linked to component information of the component, and includes an acquisition step of acquiring at least component data used by the component mounting device and actual data obtained when the component is mounted by the component mounting device using the component data; a data processing step of processing the actual data based on the production errors that occurred; and a storage step of linking the acquired component data and the processed actual data and storing them in a database.

[0007] The parts data management program of this disclosure causes a computer to execute the parts data management method described in any one of claims 1 to 5.

[0008] The component data management device of this disclosure is a component data management device that manages component data in which operating parameters, which are the operating conditions of a component mounting device for mounting the component onto a circuit board, are linked to component information of the component, and comprises: an acquisition unit that acquires at least component data used by the component mounting device and actual data obtained when the component is mounted by the component mounting device using the component data; a data processing unit that processes the actual data based on the production errors that occurred; and a storage processing unit that links the acquired component data and the processed actual data and stores them in a database.

[0009] The component data management system of this disclosure is a component data management system that manages component data in which operating parameters, which are the operating conditions of a component mounting device for mounting the component onto a circuit board, are linked to component information of the component, and comprises: an acquisition unit that acquires at least component data used by the component mounting device and actual data obtained when the component is mounted by the component mounting device using the component data; a data processing unit that processes the actual data based on the production errors that occurred; and a storage processing unit that links the acquired component data and the processed actual data and stores them in a database. [Effects of the Invention]

[0010] According to this disclosure, it is possible to collect performance data that is highly correlated with operating parameters. [Brief explanation of the drawing]

[0011] [Figure 1] A diagram illustrating the configuration of a production system according to one embodiment of the present disclosure. [Figure 2] A block diagram showing the configuration of a production system according to one embodiment of the present disclosure. [Figure 3] A diagram illustrating component data used in a production system according to one embodiment of the present disclosure. [Figure 4] A figure showing an example of error information acquired in a production system according to one embodiment of the present disclosure. [Figure 5] A diagram illustrating the processing of performance data in a production system according to one embodiment of this disclosure. [Figure 6] A diagram showing an example of processed performance data displayed on a display unit in a production system according to one embodiment of the present disclosure. [Figure 7] A flowchart of a component data management method according to one embodiment of the present disclosure. [Modes for carrying out the invention]

[0012] An embodiment of this disclosure will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are illustrative examples for illustrative purposes and can be modified as appropriate according to the specifications of the production system (parts data management system), parts mounting line (production line), parts mounting equipment, production management equipment, and parts data management equipment. In the following, all corresponding elements are denoted by the same reference numerals in all drawings, and redundant explanations are omitted.

[0013] First, let's explain the configuration of Production System 1 with reference to Figure 1. Production System 1 consists of customer factories F1 to F3 and a support center S that supports the customer's production activities. Each factory F1 to F3 is equipped with a component mounting line L1 that produces mounted circuit boards as a production line for producing manufactured goods. The support center S may be located away from factories F1 to F3, or it may be located within factories F1 to F3. Furthermore, the support center S may be set up for each customer, or it may be set up to support multiple customers together. In addition, the functions of the support center S may be configured using cloud computing.

[0014] Hereafter, Factory F1 will be referred to as "Factory 1 F1," Factory F2 as "Factory 2 F2," and Factory F3 as "Factory 3 F3." Figure 1 explains the configuration of Factories F1 to F3, using Factory 1 F1 as an example.

[0015] In Figure 1, the first factory F1 is equipped with one component mounting line L1, which consists of a printing device M1, multiple component mounting devices M2 and M3, and an inspection device M4. The component mounting line L1 has the function of printing solder onto the substrate using the printing device M1, sequentially mounting components onto the substrate using the component mounting devices M2 and M3, and inspecting the condition of the components mounted on the substrate with the inspection device M4 to produce mounted substrates. Note that the first factory F1 does not need to have just one component mounting line L1; there may be two or more. Also, the component mounting devices M2 and M3 that make up the component mounting line L1 do not need to be two; there may be one or three or more.

[0016] Each production device within the first factory F1 is connected to an in-plant communication network 2 such as a LAN (Local Area Network), and is connected to a production management device 3 via an internal communication unit 4. The production management device 3 has a function of creating data and parameters necessary for the operation of the production devices provided on the component mounting line L1 and transmitting them to each production device. Further, the production management device 3 has a function of collecting data such as the operation status, work history, and information on events occurring in the production device from each production device. Also, the production management device 3 has a function of creating component data, production data, etc. used in the production devices of the component mounting line L1. Note that the first factory F1 may be configured to include a line management device for managing the production of the mounting substrate for each component mounting line L1 in addition to the production management device 3.

[0017] In FIG. 1, a component data management device 7 is installed in the support center S. External communication units 5 connected to the production management device 3 are arranged in a plurality of factories F1 to F3. Also, an external communication unit 8 connected to the component data management device 7 is arranged in the support center S. The external communication unit 5 and the external communication unit 8 are connected to an off-plant communication network 6 such as the Internet or a mobile communication line. With this configuration, the production management device 3 and the component data management device 7 can exchange information via the off-plant communication network 6.

[0018] The component data management device 7 acquires performance data, component data, etc. of the production devices from the production management devices 3 of each factory F1 to F3 and stores them in a database. Also, the component data management device 7 has a function of generating and transmitting (outputting) component data in response to a request from the production management device 3.

[0019] Note that the production management device 3 and the component data management device 7 are not limited to a configuration in which they directly exchange information via the off-premises communication network 6, and they may exchange information via the cloud. That is, the information transmitted from each device may be stored in the cloud, and the information may be transmitted from the cloud to each device in response to a request. Also, information may be transmitted and received using a communication tool such as e-mail or a data communication line.

[0020] Next, referring to FIG. 1, the component mounting line L1 will be described. The printing device M1 is a production device having a function of performing a solder printing operation of screen-printing solder for component bonding on a substrate. The component mounting devices M2 and M3 are production devices having a function of performing a component mounting operation of mounting components on the substrate after solder printing.

[0021] The component mounting devices M2 and M3 take out the components supplied by the feeder by vacuum suction with the nozzles of the mounting head based on the operation parameters included in the component data set for each component to be mounted on the substrate, image the state of the component held by the nozzle with a component recognition camera, and mount it at the mounting angle designated for the mounting position on the substrate. The component mounting devices M2 and M3 are provided with a plurality of sensors, and work mistakes and operation errors in the component mounting operation, such as the suction operation in which the nozzle sucks the component, the component recognition operation in which the component recognition camera images and recognizes the taken-out component, and the mounting operation in which the nozzle mounts the component on the substrate, are monitored.

[0022] In FIG. 1, the inspection device M4 images the components mounted on the substrate by the component mounting devices M2 and M3 with an inspection camera, and determines the pass / fail of the mounting state such as the mounting position and posture of the components mounted on the substrate, and the pass / fail of the mounted substrate. Based on the mounting state of the components mounted on the substrate, it is determined whether production mistakes such as printing mistakes in the printing device M1 and mounting mistakes in the component mounting devices M2 and M3 have occurred.

[0023] Next, referring to Figure 2, the configuration of the production system 1 (parts data management system) equipped with the parts data management device 7 will be described. Here, among the multiple functions of the parts data management device 7, the configuration of the function that stores the actual data of parts mounting devices M2 and M3 in a database and estimates (creates) good operating parameters for production efficiency and production quality used in parts mounting devices M2 and M3 will be described. Furthermore, the production management devices 3 installed in factories F1 to F3 have a similar configuration, and here, the first factory F1 will be used as an example.

[0024] The production management device 3 installed in Factory F1 is connected to an internal communication unit 4, an external communication unit 5, an input unit 9, and a display unit 10. The input unit 9 is an input device such as a keyboard, touch panel, or mouse, and is used for inputting operation commands and data. The display unit 10 is a display device such as an LCD panel, which displays various data stored in the production management storage unit 11, as well as various information such as operation screens and input screens for operations performed by the input unit 9.

[0025] In Figure 2, the production management device 3 comprises a production management storage unit 11, a data acquisition unit 17, a display processing unit 18, and a production control unit (not shown). The processing units, such as the data acquisition unit 17, the display processing unit 18, and the production control unit, are implemented by, for example, a memory that stores the control programs executed by each processing unit, and a processor that executes the control programs. The production control unit is, for example, a CPU (Central Processing Unit) and controls the entire production management device 3.

[0026] The production management memory unit 11 is a storage device that stores various types of information, including a production library 12, a parts library 13, performance data 14, event information 15, and inspection information 16. The production management memory unit 11 is implemented using, for example, flash memory or an HDD (Hard Disk Drive).

[0027] In Figure 2, the production library 12 stores production data used for the production of mounted boards by component mounting machines M2 and M3, for each production model name of the mounted board. The production data includes the component name that identifies the component to be mounted on the board, the component code that associates the component with the component data 13a in the component library 13, the mounting position and mounting angle of the component on the board, the component arrangement indicating the position of the feeder that supplies the component in component mounting machines M2 and M3, and the nozzle arrangement indicating the position of the nozzle that picks up the component in the mounting head.

[0028] The parts library 13 stores multiple parts data 13a, each with operating parameters linked to the parts information. The parts data 13a are associated with the production data in the production library 12 by their parts codes. The parts data 13a also contains creation information, including the date and time of creation and information identifying the creator.

[0029] Here, with reference to Figure 3, an example of part data 13a stored in the part library 13 will be described. The part data 13a is associated with the production data of the production library 12 by the "part code" 41 contained in the part data 13a.

[0030] The part data 13a consists of a shape diagram 42, size data 43, part parameters 44, and operation parameters 47. Images, numerical values, and terminology are entered in the blank spaces of each item. Note that the "numerical values" used here are not limited to numerical data, but also include the results of selections of quantitatively and qualitatively expressed options such as yes / no, inexpensive / expensive, high speed / medium speed / low speed, etc. The shape diagram 42, size data 43, and part parameters 44 are part information that identifies the characteristics of the part. The shape diagram 42 illustrates the external shape of the part in question. The size data 43 shows the size information of the part, i.e., external dimensions, number of leads, lead pitch, lead length, lead width, part height, etc., as numerical data.

[0031] In Figure 3, the part parameter 44 is attribute information about the part, and includes basic information 45, which is information about the part itself, and tape information 46, which is information about the carrier tape for supplying the part by the feeder. The basic information 45 shows the polarity of the part, polarity mark, mark position, part type, shape type, and price information. The tape information 46 includes the tape material of the carrier tape, the tape width indicating the width dimension of the carrier tape, the feed interval indicating the tape feed pitch, and color and material information, which is information related to the characteristics when the carrier tape is the target of image recognition.

[0032] The operating parameters 47 are machine parameters that define the operating manner when the component is subjected to component mounting work by component mounting devices M2 and M3. In the example shown here, these include the model 47a indicating the type of component mounting devices M2 and M3, and the nozzle setting 47b indicating the type of nozzle used. Furthermore, the operating parameters 47 include the speed parameter 47c, recognition 47d, gap 47e, suction 47f, mounting 47g, etc.

[0033] In Figure 3, the speed parameter 47c includes the suction speed when the nozzle picks up a component, the mounting speed when the mounting head transfers a component, and the tape feed speed when the feeder feeds the carrier tape. Recognition 47d is a parameter that defines the mode of component recognition and includes the camera type indicating the type of component recognition camera used, the illumination mode indicating the illumination type during imaging, and the recognition speed, which is the movement speed of the nozzle during imaging. The recognition speed can be set from high speed, medium speed, and low speed. Note that the speed parameters may be numerical values ​​(1 to 100%) or selections (high speed, medium speed, low speed, etc.).

[0034] Gap 47e includes the suction gap when the nozzle picks up the component and the mounting gap when the held component is mounted on the substrate. Suction 47f specifies the suction position offset, which indicates the amount of offset when the nozzle picks up the component, and the suction angle. Mounting 47g specifies the pressing load when mounting the component held by the nozzle onto the substrate.

[0035] Thus, the operating parameters 47 include nozzle parameters (nozzle settings 47b) related to the nozzle that picks up the component, suction parameters related to suction when the nozzle picks up the component (suction speed, suction gap, suction 47f), recognition parameters (recognition 47d) for recognizing the shape of the component, and mounting parameters (mounting speed, mounting gap, mounting 47g) for mounting the component. Note that the component parameters 44 and operating parameters 47 shown in the component data 13a of Figure 4 are examples of the relevant items, and various other parameters are set as needed in addition to the items shown here.

[0036] For example, these include the suction hold time, which is the time the nozzle is in contact with the component when suctioning the component; the mounting hold time, which is the time the component is in contact with the substrate when mounting the component to the substrate; the number of component recognitions, which is the number of times the recognition camera recognizes the component; suction check ON / OFF, which determines whether to check whether the component has been suctioned; thickness variation tolerance, which sets the tolerance value when measuring the thickness of the component; component suction state detection ON / OFF, which determines whether to detect the suction state of the component; simultaneous component suction / mounting ON / OFF, which determines whether to suction or mount the components simultaneously; automatic component suction position learning ON / OFF, which determines whether to automatically set the suction position of the component; the number of component suction retries, which is the number of times suction is attempted again if suction fails; and the number of recognition retries, which is the number of times recognition is attempted again if recognition fails.

[0037] The operating parameters 47 may be changed even for the same component, depending on the model of the component mounting equipment M2, M3 used to mount the component onto the board, the material of the board, the electrodes on the board, etc., or to improve mounting quality or mounting error rate. When the operating parameters 47 of the component are changed, component data 13a is created (updated) with the changed operating parameters 47 linked to it, without changing the component parameters 44 and other information. At this time, the operating parameters before modification are distinguished from the component code of component data 13a by assigning a new component code 41 to the component code. In this way, the operating parameters 47, which are the operating conditions of the component mounting equipment M2, M3, are linked to the component data 13a.

[0038] In Figure 2, the data acquisition unit 17 collects actual component mounting work data from the production equipment (printing machine M1, component mounting machines M2, M3, inspection machine M4) of the component mounting line L1 installed in the first factory F1. The data acquisition unit 17 collects actual component mounting work data such as actual data 14, event information 15, and inspection information 16, and stores it in the production management storage unit 11 in association with information that identifies the mounted board produced, information that identifies the production equipment that performed the component mounting work, and information that identifies the component data 13a.

[0039] The performance data 14 includes information such as the production start date and time, production end date and time, number of units produced, information identifying the mounting board and the number of components mounted on the board, working time, information on the component data 13a used, and information on the nozzle and feeder used. In other words, the performance data 14 includes information obtained when components are mounted by component mounting devices M2 and M3 using component data 13a. The event information 15 includes information such as the number of work errors, error rate (frequency, spoilage rate), number of operation errors, the time and content of the errors. In other words, the event information 15 includes error information from component mounting devices M2 and M3.

[0040] In Figure 2, the inspection information 16 includes information identifying the mounted circuit board inspected by the inspection device M4, the pass / fail judgment result, and the pass / fail judgment result for the mounting status of the components mounted on the board. In other words, the inspection information 16 includes information related to the inspection results from the inspection device M4 that inspects the circuit board on which components have been mounted by component mounting devices M2 and M3.

[0041] In Figure 2, the parts data management device 7 installed at the support center S has the function of acquiring performance data 14, event information 15, and inspection information 16 from customer factories F1 to F3 and storing them in a database. The parts data management device 7 also has the function of creating parts data 13a used by parts mounting machines M2 and M3 at factories F1 to F3 based on the information stored in the database. An external communication unit 8 and a storage device 20 are connected to the parts data management device 7.

[0042] The storage device 20 stores a database 21 containing information acquired from multiple factories F1 to F3, a trained model 22, and the like. The storage device 20 is implemented, for example, by flash memory or an HDD. The database 21 may also include component data 13a used by multiple factories F1 to F3, and a database prepared in advance by an EDA (Electronic Design Automation) vendor.

[0043] In Figure 2, the parts data management device 7 includes information processing devices such as an acquisition unit 30, a data processing unit 31, a storage processing unit 32, a learning unit 33, an estimation unit 34, and a management control unit (not shown). Each information processing device is implemented using independent hardware assets, as well as a memory to store the control program executed by each information processing device, and a processor to execute the control program. The management control unit controls the entire parts data management device 7. Furthermore, the parts data management device 7 does not need to be composed of a single computer, but may be composed of multiple devices. For example, the storage device 20 and all or part of the information processing devices may be located in the cloud.

[0044] The acquisition unit 30 acquires, via the external communication unit 8, component data 13a used by component mounting devices M2 and M3 from multiple factories F1 to F3, actual data 14 obtained when components are mounted by component mounting devices M2 and M3 using the component data 13a, event information 15 including error information of component mounting devices M2 and M3, and inspection information 16 from inspection device M4 which inspects boards on which components have been mounted by component mounting devices M2 and M3. The acquisition of data by the acquisition unit 30 is performed, for example, once a day at a predetermined time. The acquisition unit 30 also acquires data through the operation of the production management device 3 by managers from factories F1 to F3.

[0045] In Figure 2, the data processing unit 31 analyzes the performance data 14, event information 15, and inspection information 16 acquired by the acquisition unit 30, and processes the performance data 14 based on the production errors that occurred in the component mounting devices M2 and M3. Specifically, the data processing unit 31 processes the performance data 14 to remove production errors within a predetermined time range based on the event information 15. The data processing unit 31 also processes the performance data 14 to remove production errors within a specified number of mounting cycles based on the event information 15. Furthermore, the data processing unit 31 processes the performance data 14 to remove production errors that occurred in the component mounting devices M2 and M3 that mounted components onto the inspected substrates (predetermined substrates) based on the inspection information 16.

[0046] Here, with reference to Figures 4 and 5, we will explain an example of the actual data 14 acquired by the acquisition unit 30 and an example of the processing of the actual data 14 by the data processing unit 31. Figure 4 schematically shows the time transition of the number of errors for the component named "D001" mounted on the mounting board produced on "April 1st". In the component mounting devices M2 and M3, event I1 occurs at "15:00" when the feeder supplying component D001 is changed from feeder N1 to feeder N2. Also, event I2 occurs at "16:00" when the feeder supplying component D001 is changed from feeder N2 to feeder N3.

[0047] In Figure 4, feeder N2 is a feeder that was stored for maintenance, and in event I1, it was mistakenly installed in component mounting machines M2 and M3. Event I2 is the event in which it was discovered that feeder N2 was being used incorrectly and that it was replaced with a normal feeder N3. Therefore, the number of errors during the time when feeder N2 was used in component mounting machines M2 and M3 (from 15:00 to 16:00) is statistically significantly higher compared to the time when feeders N1 and N3 were used (before 15:00 and after 16:00). Thus, the data processing unit 31 determines that the increase in the number of errors is not due to a problem with the operating parameter 47 of the component data 13a, but rather to a problem with feeder N2.

[0048] Then, the data processing unit 31 processes the actual data 14 related to part D001 based on the event information 15 (events I1 and I2) to remove production errors within a predetermined time range (15:00 to 16:00). Alternatively, the data processing unit 31 processes the actual data 14 to remove production errors within a predetermined range of implementations (number of implementations) that occurred between 15:00 and 16:00.

[0049] Figure 5 shows an example of performance data 14 processed by the data processing unit 31. Here, among the performance data 14 for dates 50 "April 1st" and "April 2nd", the number of attachments 52, number of misses 53, and spoilage rate 54 before processing for the component named "D001" mounted on the substrate, and the number of attachments 55, number of misses 56, and spoilage rate 57 after processing. For mounting component D001, component data 13a with component code 41 "CD001A" was used on April 1st, and component data 13a with component code 41 "CD001B" was used on April 2nd.

[0050] On April 1st, the number of times part D001 was picked up (52) was "10,000 times," of which "100 times" (number of misses 53) were pick-up errors, resulting in a spoilage rate 54 (number of misses / number of pick-ups) of "10,000 ppm." On the other hand, as shown in Figure 4, the mounting of part D001 on April 1st included pick-up errors caused by feeder N2. Therefore, the data processing unit 31 subtracts the number of times part D001 supplied from feeder N2 was picked up (1,000 times) from the number of pick-ups 52, calculating the number of pick-ups after processing (55) as "9,000 times." The data processing unit 31 also subtracts the number of pick-up errors that occurred during the time feeder N2 was used (50 times) from the number of misses 53, calculating the number of misses after processing (56) as "50 times." From the number of pick-ups 52 and the number of misses 53 after processing, the spoilage rate 57 after processing is calculated to be "5,556 ppm."

[0051] In Figure 5, the number of times part D001 was picked up on April 2nd was "8,000 times," of which "50 times" (number of misses 53) were missed pickings, resulting in a spoilage rate 54 of "6,250 ppm." No picking errors caused by the feeder or other factors occurred on April 2nd, and the actual data 14 was not processed by the data processing unit 31.

[0052] Judging by the spoilage rate of 54 before processing, when mounting part D001, part data 13a with part code 41 "CD001A" has a spoilage rate of "10,000 ppm", while part data 13a with "CD001B" has a spoilage rate of "6,250 ppm". On the other hand, judging by the spoilage rate of 57 after processing, when mounting part D001, part data 13a with part code 41 "CD001A" has a spoilage rate of "5,556 ppm" after processing, which is considered superior to part data 13a with "CD001B" has a spoilage rate of "6,250 ppm".

[0053] In other words, if the actual data 14 is not processed based on the production errors that have occurred, production errors not caused by the operating parameters 47 of the component data 13a may also be included, which could lead to an incorrect judgment of the quality of the component data 13a. In the form of this disclosure, by processing the actual data 14 based on the production errors that have occurred, it is possible to accurately judge the quality of the component data 13a based on its relationship with the operating parameters 47. Production errors not caused by the operating parameters 47 include the use of a defective feeder N2, improper setting of the carrier tape on the feeder, the use of a defective nozzle, mechanical defects in the component mounting devices M2 and M3, and mounting defects caused by clogging or contamination of the screen mask in the printing device M1.

[0054] In Figure 2, the storage processing unit 32 performs a storage process that links the component data 13a used by component mounting devices M2 and M3 acquired by the acquisition unit 30, the actual data 14 before processing or processed by the data processing unit 31, and information identifying factories F1 to F3, and stores them in the database 21. If there is actual data 14 processed by the data processing unit 31, the storage processing unit 32 automatically stores the processed actual data 14 in the database 21. In addition, if the managers of factories F1 to F3 compare the actual data 14 before and after processing and instruct which actual data 14 to store, the storage processing unit 32 stores the actual data 14 before or after processing in the database 21 according to the manager's instructions.

[0055] Here, referring to Figures 2 and 6, we will explain the storage process in which the manager of the first factory F1 selects the actual data 14 before and after processing, and the storage processing unit 32 stores the actual data 14 in the database 21 based on the selection result. The display processing unit 18 of the production management device 3 displays a spoilage rate trend display screen 60 on the display unit 10, which includes the actual data 14 before and after processing obtained from the parts data management device 7. The spoilage rate trend display screen 60 shown in Figure 6 includes some of the actual data 14 for which the date 50 shown in Figure 5 is "April 1st".

[0056] In Figure 6, the spoilage rate trend display screen 60 includes a performance data display area 61, a back button 62, a next button 63, a pre-processing save button 64, a post-processing save button 65, and an exit button 66. The performance data display area 61 displays the performance data 14 processed by the data processing unit 31 and the pre-processing performance data 14. In this example, the pre-processing and post-processing performance data 14 for component D001 mounted on the circuit board on April 1st is displayed in graph format. The performance data display area 61 displays the number of mounted components before processing for each hour from 10:00 to 19:00 as a bar graph, the pre-processing spoilage rate as a dotted line graph, and the post-processing spoilage rate as a solid line graph. For example, the data for 15:00 includes the performance data 14 from 15:00 to 16:00.

[0057] The performance data 14 from 15:00 to 16:00 includes performance data 14 where feeder N2 was mistakenly used before maintenance, and the performance data display area 61 displays the spoilage rate 54 before processing and the spoilage rate 57 after processing. The number of mounted items after processing may also be displayed in the performance data display area 61. Furthermore, the spoilage rate trend display screen 60 may display information related to the event information 15 and inspection information 16 that caused the processing of performance data 14. For example, information such as "At 15:00, feeder N1 was replaced with feeder N2 before maintenance (event I1), and at 16:00, feeder N2 was replaced with feeder N3 (event I2)" may be displayed.

[0058] In Figure 6, when the input unit 9 operates (presses) the back button 62, the previously displayed performance data 14 is displayed in the performance data display area 61. When the next button 63 is pressed, the next performance data 14 is displayed in the performance data display area 61. When the pre-processing storage button 64 is pressed, a command is sent from the display processing unit 18 to the parts data management device 7, and the storage processing unit 32 stores the pre-processing performance data 14 displayed in the performance data display area 61 into the database 21. When the post-processing storage button 65 is pressed, a command is sent from the display processing unit 18 to the parts data management device 7, and the storage processing unit 32 stores the post-processing performance data 14 displayed in the performance data display area 61 into the database 21.

[0059] When the exit button 66 is pressed, the display processing unit 18 stops displaying the spoilage rate trend screen 60 on the display unit 10. The administrator looks at the spoilage rate trend screen 60 displayed on the display unit 10 and decides whether to use the pre-processing actual data 14 or the post-processing actual data 14, and presses the pre-processing store button 64 or the post-processing store button 65. As a result, the storage processing unit 32 stores the pre-processing actual data 14 or the post-processing actual data 14 in the database 21 according to the administrator's instructions.

[0060] In Figure 2, the performance data 14 stored in the database 21 is used for activities to improve the production efficiency of mounted circuit boards in factories F1 to F3, as well as for creating new component data 13a and improving existing component data 13a. Furthermore, when creating production data for the next mounted circuit board production, the pre- and post-processing performance data 14 shown in Figure 5 is compared and displayed on the display unit 10 to assist managers in selecting appropriate component data 13a.

[0061] The following describes an example of how to estimate (create) the operating parameters 47 of the part data 13a by machine learning on the actual data 14 stored in the database 21. In this case, since the actual data 14 stored in the database 21 has been removed from which the operating parameters 47 are not relevant, it is possible to generate an appropriate trained model.

[0062] In Figure 2, the learning unit 33 uses multiple part data 13a (part parameters 44, operation parameters 47) and performance data 14 stored in the database 21 as training data to generate a trained model 22 that estimates operation parameters 47 with high production efficiency and implementation quality, using a learning algorithm such as machine learning. The generated trained model 22 is stored in the memory device 20. Possible learning algorithms include neural networks (including deep learning using multi-layer neural networks), genetic programming, decision trees, Bayesian networks, and support vector machines (SVMs).

[0063] The estimation unit 34 estimates (calculates) the operating parameters 47 based on the generated trained model 22 and the part information (shape diagram 42, size data 43, part parameters 44) of the parts transmitted from the production management devices 3 of factories F1 to F3, and creates part data 13a. The estimation unit 34 transmits the created part data 13a to the production management devices 3 of the requesting factories F1 to F3 via the external communication unit 8.

[0064] Thus, in the parts data management system (production system 1) equipped with a parts data management device 7, parts data 13a is created at the support center S by estimating operating parameters 47 using machine learning or other methods based on requests from factories F1 to F3.

[0065] Next, following the flow in Figure 7, we will explain a component data management method (data management program) for managing component data 13a, which links component information (shape diagram 42, size data 43, component parameters 44) of a component with operating parameters 47, which are the operating conditions of component mounting devices M2 and M3 for mounting components onto a circuit board. First, the acquisition unit 30 acquires component data 13a used by component mounting devices M2 and M3, actual data 14 obtained when components are mounted by component mounting devices M2 and M3 using component data 13a, event information 15 including error information of component mounting devices M2 and M3, and inspection information 16 from inspection device M4 that inspects the circuit board on which components have been mounted by component mounting devices M2 and M3 (ST1: acquisition process).

[0066] Next, the data processing unit 31 processes the actual data 14 based on the production errors that occurred (ST2: data processing step). For example, in the data processing step (ST2), the actual data 14 is processed to remove production errors within a predetermined time range based on the acquired event information 15. Also in the data processing step (ST2), the actual data 14 is processed to remove production errors within a predetermined number of mounting cycles based on the acquired event information 15. Furthermore, in the data processing step (ST2), the actual data 14 is processed to remove production errors for a predetermined substrate based on the acquired inspection information 16.

[0067] In Figure 7, the display processing unit 18 then displays the spoilage rate trend display screen 60 (Figure 6), which displays the processed actual data 14, on the display unit 10 (ST3: display process). When the pre-processing storage button 64 is operated on the spoilage rate trend display screen 60 (No in ST4), the storage processing unit 32 links the acquired part data 13a with the pre-processing actual data 14 and stores it in the database 21 (ST5: pre-processing data storage process).

[0068] When the post-processing storage button 65 is pressed on the spoilage rate trend display screen 60 (Yes in ST4), the storage processing unit 32 links the acquired part data 13a with the processed actual data 14 and stores it in the database 21 (ST6: post-processing data storage process). This makes it possible to exclude actual data 14 that has little correlation with the operation parameters 47 and collect actual data 14 that has a high correlation with the operation parameters 47.

[0069] As explained above, this disclosure discloses the following technical concepts.

[0070] (Technology 1) A component data management method for managing component data 13a, which associates component information (shape diagram 42, size data 43, component parameters 44) with operating parameters 47, which are the operating conditions for component mounting devices M2 and M3 for mounting components onto a circuit board, An acquisition step (ST1) to acquire at least component data 13a used by component mounting devices M2 and M3, and actual data 14 obtained when components are mounted by component mounting devices M2 and M3 using component data 13a, Based on the production errors that occurred, a data processing process (ST2) is performed to process the actual data 14, A parts data management method, which includes a storage step (ST6) of linking acquired parts data 13a with processed performance data 14 and storing them in a database 21.

[0071] This makes it possible to collect performance data 14 that are highly correlated with the operating parameters 47.

[0072] (Technology 2) In the acquisition process (ST1), event information 15 including error information from component mounting devices M2 and M3 is further acquired. The parts data management method described in Technology 1, wherein in the data processing step (ST2), the actual data 14 is processed based on event information 15 to eliminate production errors within a predetermined time range.

[0073] This makes it possible to exclude performance data 14 that have little correlation with the operating parameters 47 from the performance data 14 stored in the database 21.

[0074] (Technology 3) In the acquisition process (ST1), event information 15 including error information from component mounting devices M2 and M3 is further acquired. A component data management method according to Technology 1 or 2, wherein in the data processing step (ST2), the actual data 14 is processed based on event information 15 to eliminate production errors within a predetermined range of mounting cycles.

[0075] This makes it possible to exclude performance data 14 that have little correlation with the operating parameters 47 from the performance data 14 stored in the database 21.

[0076] (Technology 4) A parts data management method according to any one of the technologies 1 to 3, further comprising a display step (ST3) for displaying processed performance data 14.

[0077] This allows the administrator to review the processed performance data 14 before it is stored in the database 21.

[0078] (Technology 5) In the acquisition process (ST1), inspection information 16 is further acquired from the inspection device M4, which inspects the circuit board on which components have been mounted by component mounting devices M2 and M3. A component data management method according to any one of the technologies 1 to 4, wherein in the data processing step (ST2), the actual data 14 is processed based on the inspection information 16 to eliminate production errors of a predetermined substrate.

[0079] This makes it possible to exclude performance data 14 that have little correlation with the operating parameters 47 from the performance data 14 stored in the database 21.

[0080] (Technology 6) A parts data management program that causes a computer to execute one of the parts data management methods described in any of Techniques 1 through 5.

[0081] This makes it possible to collect performance data 14 that are highly correlated with the operating parameters 47.

[0082] (Technology 7) A component data management device 7 manages component data 13a, which is formed by linking component information (shape diagram 42, size data 43, component parameters 44) of a component with operating parameters 47 that are the operating conditions for component mounting devices M2 and M3 for mounting a component onto a circuit board. An acquisition unit 30 that acquires at least component data 13a used by component mounting devices M2 and M3, and actual data 14 obtained when components are mounted by component mounting devices M2 and M3 using the component data 13a, Based on the production errors that occurred, a data processing unit 31 processes the performance data 14, A parts data management device 7 includes a storage processing unit 32 that links acquired parts data 13a with processed performance data 14 and stores them in a database 21.

[0083] This makes it possible to collect performance data 14 that are highly correlated with the operating parameters 47.

[0084] (Technology 8) A component data management system (production system 1) that manages component data 13a, which links component information (shape diagram 42, size data 43, component parameters 44) of a component with operating parameters 47 that are the operating conditions for component mounting devices M2 and M3 for mounting a component onto a circuit board, An acquisition unit 30 that acquires at least component data 13a used by component mounting devices M2 and M3, and actual data 14 obtained when components are mounted by component mounting devices M2 and M3 using the component data 13a, Based on the production errors that occurred, a data processing unit 31 processes the performance data 14, A parts data management system (production system 1) comprises a storage processing unit 32 that links acquired parts data 13a with processed performance data 14 and stores them in a database 21.

[0085] This makes it possible to collect performance data 14 that are highly correlated with the operating parameters 47. [Industrial applicability]

[0086] The component data management method, component data management device, component data management program, and component data management system disclosed herein have the effect of being able to collect performance data that is highly correlated with operating parameters, and are useful in the field of mounting components onto circuit boards. [Explanation of Symbols]

[0087] 1. Production System (Parts Data Management System) 7. Parts Data Management Device M2, M3 component mounting equipment M4 Inspection Equipment

Claims

1. A component data management method for managing component data, which associates component information of a component with operating parameters that are the operating conditions of a component mounting device for mounting the component onto a circuit board, An acquisition step of acquiring at least component data used by the component mounting device and actual data obtained when the component is mounted by the component mounting device using the component data, A data processing process is performed to process the aforementioned performance data based on the production errors that occurred, A method for managing parts data, comprising a storage step of linking the acquired parts data with the processed performance data and storing them in a database.

2. In the acquisition step described above, event information including error information of the component mounting device is further acquired, The parts data management method according to claim 1, wherein in the data processing step, the actual data is processed based on the event information to remove the production errors within a predetermined time range.

3. In the acquisition step described above, event information including error information of the component mounting device is further acquired, The component data management method according to claim 1, wherein in the data processing step, the actual data is processed based on the event information to exclude the production errors within a predetermined range of implementation cycles.

4. The parts data management method according to claim 1, further comprising a display step of displaying the processed performance data.

5. In the acquisition step, inspection information is further acquired from an inspection device that inspects the substrate on which the components are mounted by the component mounting device. The component data management method according to claim 1, wherein in the data processing step, the actual data is processed based on the inspection information to eliminate the production errors of a predetermined substrate.

6. A parts data management program for causing a computer to execute the parts data management method described in any one of claims 1 to 5.

7. A component data management device that manages component data by linking the component information of a component with operating parameters, which are the operating conditions of a component mounting device for mounting the component onto a circuit board, An acquisition unit that acquires at least component data used by the component mounting device and actual data obtained when the component is mounted by the component mounting device using the component data, Based on the production errors that occurred, a data processing unit processes the aforementioned performance data, A parts data management device comprising a storage processing unit that links the acquired parts data with the processed performance data and stores them in a database.

8. A component data management system that manages component data by linking the component information of a component with operating parameters, which are the operating conditions of a component mounting device for mounting the component onto a circuit board, An acquisition unit that acquires at least component data used by the component mounting device and actual data obtained when the component is mounted by the component mounting device using the component data, Based on the production errors that occurred, a data processing unit processes the aforementioned performance data, A parts data management system comprising a storage processing unit that links the acquired parts data with the processed performance data and stores them in a database.

Images