Component mounting device and component mounting method

Abstract

The objective is to provide a component mounting apparatus and a component mounting method that can mount components with high precision even when the substrate is subjected to localized deformation. [Solution] When mounting a component at a mounting point P (P1, P, ..., P10) set on a circuit board, a plurality of correction marks HM are selected from a plurality of marks M (M1, M2, ..., M6) provided on the circuit board to correct the coordinate data of the mounting point P according to the positional deviation from the reference position of the circuit board (Step ST4), and the actual position of each of the selected correction marks HM is recognized (Step ST5). Then, the coordinate data of the mounting point is corrected based on the actual position of each of the recognized correction marks HM (Step ST6), and the component is mounted on the circuit board based on the corrected coordinate data of the mounting point P (Step ST7).

Description

Technical Field

[0001] The present disclosure relates to a component mounting device and a component mounting method for mounting components on mounting points set on a substrate.

Background Art

[0002] A component mounting device carries in a substrate sent from the outside by a conveyor, picks up components supplied by a parts feeder with a mounting head, and mounts them on the substrate. At this time, the components are mounted on the mounting points set on the substrate based on their coordinate data. However, if the carried-in substrate is not positioned at the target reference position, the position corresponding to the coordinate data of the mounting points and the actual position do not necessarily match. Therefore, before mounting the components on the mounting points, the component mounting device recognizes the actual positions of a pair of marks provided at opposite corners of the substrate, obtains the difference from the position corresponding to the coordinate data of the actual positions of those marks, and mounts the components on the substrate based on the corrected coordinate data using that difference (for example, Patent Document 1 below).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, as described above, components can be accurately mounted on the mounting points with the coordinate data corrected based on the positions of a pair of marks provided at the corners of the substrate only when the substrate can be treated as a rigid body. When the substrate is accompanied by local deformation, the coordinate data cannot be sufficiently corrected, and as a result, the mounting accuracy of the components may decrease.

[0005] Therefore, the present disclosure aims to provide a component mounting apparatus and a component mounting method that can mount components with high precision even when the substrate is subjected to localized deformation. [Means for solving the problem]

[0006] The component mounting apparatus of this disclosure is a component mounting apparatus for mounting components at mounting points set on a substrate, comprising: a correction mark selection unit that selects a plurality of correction marks from a plurality of marks provided on the substrate to correct the coordinate data of the mounting points in accordance with the positional deviation of the substrate from a reference position; a position recognition unit that recognizes the actual position of each of the plurality of correction marks selected by the correction mark selection unit; a correction unit that corrects the coordinate data of the mounting points based on the actual positions of each of the plurality of correction marks recognized by the position recognition unit; and a mounting head that mounts components on the substrate based on the coordinate data of the mounting points corrected by the correction unit.

[0007] The component mounting method of the present disclosure is a component mounting method for mounting a component at a mounting point set on a substrate, comprising: a correction mark selection step of selecting a plurality of correction marks from a plurality of marks provided on the substrate to correct the coordinate data of the mounting point in accordance with the positional deviation of the substrate from a reference position; a position recognition step of recognizing the actual position of each of the plurality of correction marks selected in the correction mark selection step; a correction step of correcting the coordinate data of the mounting point based on the actual position of each of the plurality of correction marks recognized in the position recognition step; and a component mounting step of mounting a component on the substrate based on the coordinate data of the mounting point corrected in the correction step. [Effects of the Invention]

[0008] The purpose of this disclosure is to provide a component mounting apparatus and a component mounting method that can mount components with high precision even when the substrate is subjected to localized deformation. [Brief explanation of the drawing]

[0009] [Figure 1] This is a partial perspective view of a component mounting device in Embodiment 1 of the present disclosure. [Figure 2] This is a plan view of a substrate on which components are mounted in a component mounting device according to Embodiment 1 of the present disclosure. [Figure 3] This is a block diagram showing the control system of a component mounting device in Embodiment 1 of the present disclosure. [Figure 4] This figure shows an example of mounting data stored in the memory unit of a component mounting device in Embodiment 1 of this disclosure. [Figure 5] This figure shows an example of mark position data stored in the memory unit of a component mounting device in Embodiment 1 of the present disclosure. [Figure 6] (a)(b)(c)(d) This figure shows the procedure by which the correction mark selection unit of the component mounting device in Embodiment 1 of the present disclosure selects a correction mark. [Figure 7] This figure shows an example of correction mark combination data stored in the memory unit of a component mounting device in Embodiment 1 of the present disclosure. [Figure 8] This figure shows an example of corrected mounting data stored in the memory unit of the component mounting device in Embodiment 1 of this disclosure. [Figure 9] This is a flowchart of the main routine showing the execution procedure of the component mounting operation performed by the component mounting device in Embodiment 1 of this disclosure. [Figure 10] This is a flowchart of a subroutine showing the execution procedure of a component mounting operation performed by a component mounting device in Embodiment 1 of this disclosure. [Figure 11] This figure shows the procedure for selecting three marks that are close in distance from the mounting point as correction marks using the component mounting device in Embodiment 2 of this disclosure. [Figure 12] This figure shows an example of correction mark combination data stored in the memory unit of a component mounting device in Embodiment 2 of the present disclosure. [Figure 13] This is a flowchart of the main routine showing the execution procedure of the component mounting operation performed by the component mounting device in Embodiment 2 of this disclosure.

Embodiments of the Invention

[0010] (Embodiment 1) FIG. 1 shows a component mounting device 10 according to Embodiment 1 of the present disclosure. The component mounting device 10 is a device for mounting components BH on a substrate KB, and includes a base 11, a conveyor 12, a parts feeder 13, a head movement mechanism 14, a mounting head 15, a substrate camera 16, a component camera 17, and a control unit 18 that controls each of these components. For the sake of convenience in explanation, the left-right direction of the component mounting device 10 as viewed from the operator OP is defined as the X direction, the front-rear direction of the component mounting device 10 as viewed from the operator OP is defined as the Y direction, and the up-down direction is defined as the Z direction.

[0011] In FIG. 1, the conveyor 12 is attached to the base 11. The conveyor 12 supports both end portions of the substrate KB in the Y direction from below, conveys them in the X direction, and positions them at a predetermined working position. Each of the plurality of parts feeders 13 is attached to a feeder base 11F installed at an end portion of the base 11 in the Y direction, and continuously supplies the components BH to a component take-out position 13T set at the end portion on the conveyor 12 side as viewed from the operator OP.

[0012] In FIG. 1, the head movement mechanism 14 includes a fixed beam 14a extending in the Y direction and a moving beam 14b extending in the X direction. Both end portions of the fixed beam 14a are fixed to the base 11. One end portion of the moving beam 14b is attached to the fixed beam 14a, and is moved in the direction (Y direction) along the fixed beam 14a by a drive mechanism not shown.

[0013] In FIG. 1, the mounting head 15 is attached to the moving beam 14b, and is moved in the direction (X direction) along the moving beam 14b by a drive mechanism not shown. The mounting head 15 can move freely in the upper space of the base 11 in the direction within the horizontal plane (XY plane) by the movement of the moving beam 14b in the Y direction with respect to the fixed beam 14a and the movement of the mounting head 15 itself in the X direction with respect to the moving beam 14b.

[0014] In FIG. 1, the mounting head 15 includes a plurality of nozzles 15a extending downward. The mounting head 15 generates a vacuum adsorption force at the lower end of each nozzle 15a to adsorb and pick up the component BH supplied by the parts feeder 13 to the component taking-out position 13T on the nozzle 15a.

[0015] In FIG. 1, the substrate camera 16 is provided on the mounting head 15. The substrate camera 16 has its imaging field directed downward and moves integrally with the mounting head 15 to image the local position of the substrate KB from above.

[0016] In FIG. 2, on the upper surface of the substrate KB, together with a plurality of mounting points P (P1, P2, ···, P10) where the component BH is to be mounted, a plurality of marks M (M1, M2, ···, M6) for correcting the coordinate data of each mounting point P are provided. The substrate camera 16 functions as a "mark imaging unit" that images each of the plurality of marks M in a state where the substrate KB is carried in and positioned by the conveyor 12.

[0017] In FIG. 1, the component camera 17 is provided in the region between the conveyor 12 and the parts feeder 13 on the base 11. The component camera 17 has its imaging field directed upward and images the component BH picked up by the mounting head 15 with the nozzle 15a from below.

[0018] The control unit 18 is composed of an arithmetic device such as a CPU (Central Processing Unit). As shown in FIG. 3, the control unit 18 controls the operations of the conveyor 12, the plurality of parts feeders 13, the head movement mechanism 14, and the mounting head 15. Specifically, the control unit 18 controls the conveyor 12 to convey and position the substrate KB, controls each parts feeder 13 to supply the component BH to the component taking-out position 13T. Also, the control unit 18 controls the head movement mechanism 14 to move the mounting head 15 and controls the mounting head 15 to adsorb (pick up) the component BH on each nozzle 15a.

[0019] The control unit 18 also controls the imaging operations of the substrate camera 16 and the component camera 17, respectively. The image data obtained by the imaging operation of the substrate camera 16 (image data of each of the multiple marks M) and the image data obtained by the imaging operation of the component camera 17 (image data of component BH) are transmitted to the control unit 18. The control unit 18 performs image recognition based on the obtained image data and makes the necessary decisions.

[0020] In Figure 3, the control unit 18 includes a storage unit 21, a correction mark selection unit 22, a position recognition unit 23, a correction unit 24, and a component mounting control unit 25. The storage unit 21 stores various data, including an operation program PG that operates each unit to perform the task of mounting component BH onto the circuit board KB (component mounting operation), as well as production data SD.

[0021] In Figure 3, the production data SD includes mounting data DP and mark position data DM. The mounting data DP consists of mounting point coordinate data (Xt, Yt), which is the coordinate data of each of the multiple mounting points P set on the substrate KB (coordinate data based on the coordinate axes set on the component mounting device 10), attitude data (Θt)), which is the attitude data of the component BH at each mounting point P (angle data taken counterclockwise from the X axis), and "feeder number" data, which is the identification number of the parts feeder 13 that supplies the component BH. Here, the attitude data (Θt) is represented by the angle from the X axis in Figure 2 (counterclockwise direction is positive). The mark position data DM consists of mark coordinate data (Xs, Ys)), which is the coordinate data of each of the multiple marks M attached to the substrate KB, as shown in Figure 5.

[0022] If the substrate KB, which has been transported by the conveyor 12, is accurately positioned at the target reference position, the actual position of each mounting point P will coincide with the position corresponding to the mounting point coordinate data (Xt, Yt) shown in the mounting data DP. However, if the substrate KB is positioned at a position shifted from the reference position, the actual position of each mounting point P will not coincide with the position corresponding to the mounting point coordinate data (Xt, Yt). Therefore, if the substrate KB is accurately positioned at the reference position, the component BH can be accurately mounted at the mounting point P by mounting it on the substrate KB based on the mounting point coordinate data (Xt, Yt). However, if the substrate KB is positioned at a position shifted from the reference position, the component BH cannot be accurately mounted at the mounting point P unless it is mounted based on coordinate data corrected according to the positional shift of the substrate KB from the reference position (referred to as "corrected mounting point coordinate data (Xh, Yh)").

[0023] Regarding the orientation of component BH, if the substrate KB is accurately positioned at the reference position, mounting component BH on the substrate KB based on the orientation data (Θt) shown in the mounting data DP will result in an accurate orientation for component BH. However, if the substrate KB is positioned with a rotational displacement from the reference orientation, component BH cannot be mounted in an accurate orientation unless it is mounted based on an orientation corrected according to the rotational displacement of the substrate KB (referred to as "corrected orientation data (Θh)").

[0024] The correction mark selection unit 22 of the control unit 18 selects several (in this case, three) correction marks HM from among several marks M provided on the substrate KB to correct the mounting point coordinate data (Xt, Yt) of each of the multiple mounting points P (P1, P2, ..., P10) set on the substrate KB. Specifically, the correction mark selection unit 22 first accesses the mark position data DM to obtain the mark coordinate data (Xs, Ys) of each of the multiple marks M (M1, M2, ..., M6) shown in Figure 5, and also accesses the mounting data DP to obtain the mounting point coordinate data (Xt, Yt) and attitude data (Θt) of each of the multiple mounting points P shown in Figure 4. Then, for each of the multiple mounting points P, it selects three marks M corresponding to the three vertices of the triangle that encloses each mounting point P, and sets these three selected marks M as correction marks HM (i.e., selects the correction marks HM).

[0025] When the correction mark selection unit 22 selects the three correction marks HM as described above, if there are multiple combinations of the three marks M (i.e., multiple triangles that enclose the mounting point P), it extracts the triangle in which the longest side of the three sides of each of those multiple triangles is the shortest, and selects the three marks M corresponding to the three vertices of that extracted triangle as the correction marks HM.

[0026] For example, as shown in Figures 6(a), (b), (c), and (d), the triangles that enclose P4, one of the mounting points P, include triangle TR1 (Figure 6(a)) with three marks M1, M2, and M5 as vertices, triangle TR2 (Figure 6(b)) with three marks M1, M2, and M3 as vertices, triangle TR3 (Figure 6(c)) with three marks M1, M2, and M6 as vertices, and triangle TR4 (Figure 6(d)) with three marks M1, M2, and M4 as vertices. In this case, the correction mark selection unit 22 compares the lengths of the longest sides L1, L2, L3, and L4 of the four triangles TR1, TR2, TR3, and TR4 (referred to as LG1, LG2, LG3, and LG4 respectively), and selects the three marks M (M1, M2, M5) corresponding to the three vertices of triangle TR1 (Figure 6(a)), which has the longest side length, as the correction marks HM.

[0027] The correction mark selection unit 22 selects three correction marks HM for each of the multiple mounting points P (P1, P2, ..., P10) in accordance with the above procedure. Then, it generates correction mark combination data KD from the data of the three correction marks HM for each of the multiple mounting points P obtained in this way, and stores it in the correction mark storage area RM (Figure 3) of the storage unit 21. Figure 7 shows an example of the correction mark combination data KD stored in the correction mark storage area RM.

[0028] In this embodiment 1, the correction mark selection unit 22 selects each of the three marks M corresponding to the three vertices of the triangle enclosing the mounting point P as a correction mark HM. If there are multiple combinations of three marks M corresponding to the three vertices of the triangle enclosing the mounting point P, the unit selects each of the three marks M corresponding to the three vertices of the triangle with the shortest longest side as a correction mark HM.

[0029] The position recognition unit 23 of the control unit 18 recognizes the position (actual position) of each of the three correction marks HM for each mounting point P selected by the correction mark selection unit 22 as described above. Specifically, the position recognition unit 23 first moves the substrate camera 16 above the substrate KB by operating the head movement mechanism 14, and causes the substrate camera 16 to image each of the multiple correction marks HM selected for any of the mounting points P by the correction mark selection unit 22. Then, based on the image data of the correction marks HM obtained in this way, the position recognition unit 23 recognizes the position of those correction marks HM. Note that the position recognition unit 23 may recognize the position of all of the multiple marks M (M1, M2, ..., M6), not just the correction marks HM selected by the correction mark selection unit 22.

[0030] The correction unit 24 of the control unit 18 corrects the mounting point coordinate data (Xt, Yt), which is the coordinate data for each mounting point P (P1, P2, ..., P10), based on the actual position of each of the multiple (in this case, three) correction marks HM recognized by the position recognition unit 23, and also corrects the attitude data (Θt), which is the attitude data of the component BH corresponding to each mounting point P (P1, P2, ..., P10). The correction unit 24 combines the corrected mounting point coordinate data (Xh, Yh) and corrected attitude data (Θh) obtained by this correction for all of the multiple mounting points P to generate corrected mounting data DH (Figure 8), and stores it in the corrected mounting data storage area RP (Figure 3) of the storage unit 21. Note that "ΔX", "ΔY", and "ΔΘ" shown in Figure 8 represent minute quantities in the X direction, Y direction, and rotation direction, respectively, whose values ​​are not specified.

[0031] The X and Y components of the corrected mounting point coordinate data (Xh, Yh) shown in the corrected mounting data DH in Figure 8 are obtained by adding the X and Y components of the positional displacement of the substrate KB from the reference position to the X and Y components of the mounting point coordinate data (Xt, Yt), which is the coordinate data of the mounting point P before correction. In addition, the corrected attitude data (Θh) shown in the corrected mounting data DH is obtained by adding the displacement of the substrate KB in the rotational direction to the attitude data (Θt) before correction.

[0032] The component mounting control unit 25, located in the control unit 18, operates the head movement mechanism 14 and the mounting head 15 to pick up the component BH supplied by the parts feeder 13 with the nozzle 15a. After moving the mounting head 15 so that the component BH passes above the component camera 17 to allow the component camera 17 to recognize the component BH, the mounting head 15 is moved above the substrate KB and the component BH is mounted on the corrected mounting point coordinate data (Xh, Yh), which is the corrected coordinate data of the mounting point P. When mounting the component BH on the mounting point P, the component mounting control unit 25 rotates the nozzle 15a so that the orientation of the component BH becomes the corrected orientation data (Θh).

[0033] Here, the corrected mounting point coordinate data (Xh, Yh) and corrected orientation data (Θh) are obtained by correcting the mounting point coordinate data (Xt, Yt) and orientation data (Θt) to account for the positional deviation of the substrate KB from the reference position after it has been transported and positioned by the conveyor 12. Therefore, if each component BH is mounted on the substrate KB at the position of its corrected mounting point coordinate data (Xh, Yh) and in the orientation of the corrected orientation data (Θh), the component BH will be mounted accurately at the mounting point P in the correct orientation. Although the rotational deviation may differ for each mounting point P due to the deformation of the substrate KB, it is possible to calculate the overall rotational deviation of the substrate KB from the positions of the two furthest marks M on the substrate KB (for example, M1 and M4), and correct the orientation data (Θt) using that overall rotational deviation of the substrate KB as the rotational deviation of each mounting point P.

[0034] As described above, the component mounting device 10 in Embodiment 1 is configured to include a correction mark selection unit 22 that selects a plurality of correction marks HM from a plurality of marks M provided on the substrate KB to correct the mounting point coordinate data (Xt, Yt), which is the coordinate data of the mounting point P, according to the positional deviation of the substrate KB from a reference position; a position recognition unit 23 that recognizes the actual position of each of the plurality of correction marks HM selected by the correction mark selection unit 22; a correction unit 24 that corrects the mounting point coordinate data (Xt, Yt) based on the actual position of each of the plurality of correction marks HM recognized by the position recognition unit 23; and a mounting head 15 that mounts the component BH on the substrate KB based on the corrected mounting point coordinate data (Xh, Yh), which is the mounting point coordinate data (Xt, Yt) corrected by the correction unit 24.

[0035] Next, the execution procedure (component mounting method) for the component mounting work per board KB performed by the component mounting device 10 in Embodiment 1 will be explained according to the flowcharts (the flowchart of the main routine shown in Figure 9 and the flowchart of the subroutine shown in Figure 10).

[0036] When the component mounting device 10 performs component mounting work, the control unit 18 first operates the conveyor 12 to bring in the substrate KB sent from the upstream side and position the substrate KB at a predetermined work position (step ST1 in Figure 9). Once the substrate KB is positioned at the work position, the control unit 18 accesses the mark position data DM of the production data SD (Figure 5) to obtain mark coordinate data (Xs, Ys) for each of the six marks M (M1, M2, ..., M6) (step ST2).

[0037] After acquiring mark coordinate data (Xs, Ys) for each of the six marks M, the control unit 18 accesses the mounting data DP of the production data SD to acquire mounting data DP for each of the multiple mounting points P (P1, P2, ..., P10) (step ST3). Then, after acquiring the mounting data DP for each of the multiple mounting points P, the correction mark selection unit 22 selects three correction marks HM from the six marks M (M1, M2, ..., M6) to correct the mounting point coordinate data (Xt, Yt), which is the coordinate data of each mounting point P for each of the multiple mounting points P (P1, P2, ..., P10). Specifically, as described above, the three marks M corresponding to the three vertices of the triangle that encloses the mounting point P are selected as correction marks HM (step ST4).

[0038] The combination of three correction marks HM for each of the multiple mounting points P (P1, P2, ..., P10) selected by the correction mark selection unit 22 is stored in the correction mark storage area RM of the storage unit 21 as the correction mark combination data KD (Figure 7). If there are multiple triangles that enclose the mounting points P, and therefore multiple combinations of three marks M, the correction mark selection unit 22 selects the three marks M corresponding to the three vertices of the triangle with the shortest longest side as the correction marks HM, as described above.

[0039] As described above, once the correction mark selection unit 22 has selected three correction marks HM for each of the multiple mounting points P(P1, P2, ..., P10), the position recognition unit 23 recognizes the actual position of each of the six marks M by having the substrate camera 16 capture an image of each of the six marks M (step ST5).

[0040] Once the position recognition unit 23 recognizes the actual position of each of the six marks M (M1, M2, ..., M6), the correction unit 24 corrects the mounting data DP for each of the multiple mounting points P (P1, P2, ..., P10), i.e., the mounting point coordinate data (Xt, Yt) and attitude data (Θt), based on the actual positions of each of the six marks M (M1, M2, ..., M6) recognized by the position recognition unit 23, to create corrected mounting data DH (step ST6). The created corrected mounting data DH is stored in the corrected mounting data storage area RP of the storage unit 21.

[0041] Once the correction unit 24 generates corrected mounting data DH for each of the multiple mounting points P(P1, P2, ..., P10) as described above, the component mounting control unit 25 mounts component BH on the substrate KB based on the corrected mounting data DH (step ST7).

[0042] When the component mounting control unit 25 mounts component BH onto the substrate KB based on the corrected mounting data DH, it proceeds to the subroutine shown in Figure 10. In the subroutine, first, the mounting head 15 is moved above the parts feeder 13 indicated in the mounting data DP (or corrected mounting data DH) (step ST11 shown in the subroutine of Figure 10). Then, the component BH supplied by the parts feeder 13 is picked up by the nozzle 15a of the mounting head 15 (step ST12).

[0043] After the nozzle 15a picks up the component BH, the component mounting control unit 25 moves the mounting head 15 so that the component BH is positioned above the component camera 17 (step ST13). Once the component camera 17 images and recognizes the component BH (step ST14), the component BH is moved above the position corresponding to the corrected mounting point coordinate data (Xh, Yh) shown in the corrected mounting data DH (step ST15). Then, the component BH is rotated based on the corrected attitude data (Θh) shown in the corrected mounting data DH (step ST16), and the component BH is mounted at the position corresponding to the corrected mounting point coordinate data (Xh, Yh) (step ST17).

[0044] In the subroutine shown in Figure 10, steps ST11 to ST17 are looped through for multiple mounting points P(P1, P2, ..., P10). Once this loop is complete, all of the multiple mounting points P(P1, P2, ..., P10) on the circuit board KB will have the component BH mounted on them.

[0045] Once all of the multiple mounting points P on the circuit board KB have been loaded with components BH, the control unit 18 exits the subroutine and returns to the main routine shown in Figure 9. Upon returning to the main routine, the control unit 18 activates the conveyor 12 to transport the circuit board KB downstream (step ST8). This completes the component loading process for each circuit board KB.

[0046] As described above, the component mounting method in Embodiment 1 includes a correction mark selection step (step ST4) in which a plurality of correction marks HM are selected from a plurality of marks M (M1, M2, ..., M6) provided on the substrate KB to correct the mounting point coordinate data (Xt, Yt), which is the coordinate data of the mounting point P (P1, P2, ..., P10), according to the positional deviation of the substrate KB from a reference position, a position recognition step (step ST5) in which the actual position of each of the plurality of correction marks HM selected in the correction mark selection step is recognized, a correction step (step ST6) in which the mounting point coordinate data (Xt, Yt) is corrected based on the actual position of each of the plurality of correction marks HM recognized in the position recognition step is corrected, and a component mounting step (step ST7) in which the component BH is mounted on the substrate KB based on the corrected mounting point coordinate data (Xh, Yh), which is the mounting point coordinate data (Xt, Yt) corrected in the correction step is corrected.

[0047] In the component mounting device 10 (component mounting method) of Embodiment 1, multiple correction marks HM are selected from multiple marks M (M1, M2, ..., M6) provided on the substrate KB to correct the mounting point coordinate data (Xt, Yt), which is the position data of the mounting point P. The actual position of each of the selected correction marks HM is recognized, and the mounting point coordinate data (Xt, Yt) is corrected based on the actual position of each of the recognized correction marks HM. Therefore, instead of using a fixed mark (a pair of marks provided at the corner of the substrate) regardless of the position of the mounting point P, as in the conventional method, the mounting point coordinate data (Xt, Yt) can be corrected based on multiple correction marks HM selected from multiple marks M that can be selected according to the mounting point P. Therefore, by selecting the correction marks HM appropriately (for example, selecting three marks corresponding to the three vertices of the triangle enclosing the mounting point P as the correction marks HM), it becomes possible to mount component BH with high precision even when the substrate KB is undergoing local deformation.

[0048] (Embodiment 2) Next, Embodiment 2 of the present disclosure will be described. The configuration of the component mounting device 10 in Embodiment 2 is the same as the configuration of the component mounting device 10 in Embodiment 1, but in Embodiment 2, the correction mark selection unit 22 selects each of the multiple marks M that are close in distance from the mounting point P as a correction mark HM. For example, for P2, which is one of the multiple mounting points P in Embodiment 1, as shown in Figure 11, three marks M (M1, M2, M5) that are close in distance from P2 are selected as correction marks HM. Figure 12 shows the correction mark combination data KD when selected in this way.

[0049] In Embodiment 2, the flowchart showing the procedure for mounting components on one board KB differs from the flowchart shown in Figure 9 above in only a portion of the processing. In Embodiment 2, in step ST4a of the main routine flowchart in Figure 13, the correction mark selection unit 22 performs the correction mark selection process (correction mark selection step). Note that the other processing, including subroutines, is the same as in Embodiment 1.

[0050] In Embodiment 2, as in Embodiment 1, the component mounting device 10 (component mounting method) selects a plurality of correction marks HM from a plurality of marks M (M1, M2, ..., M6) provided on the substrate KB to correct the mounting point coordinate data (Xt, Yt), which is the coordinate data of the mounting point P (step ST4a). After recognizing the actual position of each of the selected correction marks HM (step ST5), the mounting point coordinate data (Xt, Yt) is corrected based on the actual position of each of the recognized correction marks HM (step ST6). Therefore, even if the substrate KB is subject to local deformation, the component BH can be mounted with high precision.

[0051] The embodiments of this disclosure are described above, and include the following technologies (component mounting devices and component mounting methods).

[0052] (Item 1) A component mounting device (component mounting device 10) for mounting a component (component BH) at a mounting point (mounting point P) set on a substrate (substrate KB), comprising: a correction mark selection unit (correction mark selection unit 22) for selecting a plurality of correction marks (correction mark HM) from a plurality of marks (mark M) provided on the substrate to correct the coordinate data of the mounting point (mounting point coordinate data (Xt, Yt)) according to the positional deviation of the substrate from a reference position; a position recognition unit (position recognition unit 23) for recognizing the actual position of each of the plurality of correction marks selected by the correction mark selection unit; a correction unit (correction unit 24) for correcting the coordinate data of the mounting point based on the actual position of each of the plurality of correction marks recognized by the position recognition unit; and a mounting head (mounting head 15) for mounting a component on the substrate based on the coordinate data of the mounting point (corrected mounting point coordinate data (Xh, Yh)) corrected by the correction unit.

[0053] As mentioned above, in the component mounting device of item 1, multiple correction marks for correcting the coordinate data of the mounting point are selected from multiple marks provided on the substrate, the actual position of each of the selected correction marks is recognized, and the coordinate data of the mounting point is corrected based on the actual position of each of the recognized correction marks. Since the coordinate data of the mounting point can be corrected based on multiple correction marks selected from among multiple marks that can be selected according to the mounting point, by selecting the correction marks appropriately, components can be mounted with high precision even when the substrate is deformed locally.

[0054] (Item 2) The component mounting device according to item 1, comprising a mark imaging unit (substrate camera 16) that images each of the multiple correction marks, and the position recognition unit that recognizes the actual position of each of the multiple correction marks based on the images of each of the multiple correction marks captured by the mark imaging unit.

[0055] (Item 3) The component mounting device according to item 1, wherein the correction mark selection unit selects each of the three marks corresponding to the three vertices of the triangle enclosing the mounting point as the correction marks.

[0056] (Item 4) The component mounting device according to item 3, wherein, if there are multiple combinations of three marks corresponding to the three vertices of a triangle containing the mounting point, the correction mark selection unit selects each of the three marks corresponding to the three vertices of the triangle with the shortest longest side as the correction mark.

[0057] (Item 5) The component mounting device according to item 1, wherein the correction mark selection unit selects each of the multiple marks that are close in distance from the mounting point as the correction mark.

[0058] (Item 6) A component mounting method for mounting a component (component BH) at a mounting point (mounting point P) set on a substrate (substrate KB), comprising: a correction mark selection step of selecting a plurality of correction marks (correction marks HM) from a plurality of marks provided on the substrate to correct the coordinate data of the mounting point (mounting point coordinate data (Xt, Yt)) according to the positional deviation of the substrate from a reference position; a position recognition step of recognizing the actual position of each of the plurality of correction marks selected in the correction mark selection step; a correction step of correcting the coordinate data of the mounting point based on the actual position of each of the plurality of correction marks recognized in the position recognition step; and a component mounting step of mounting the component on the substrate based on the coordinate data of the mounting point corrected in the correction step (corrected mounting point coordinate data (Xh, Yh)).

[0059] According to the component mounting method in item 6, similar to the component mounting device in item 1, by appropriately selecting the correction mark HM, component BH can be mounted with high precision even when the substrate KB is subject to localized deformation.

[0060] While embodiments of the present disclosure have been described above, the technology of the present disclosure is not limited to those described above, and various modifications are possible. For example, in the above-described embodiment, the correction mark selection unit 22 was configured to select three correction marks HM from three marks M, but this is just one example, and the correction mark selection unit 22 can be configured to select multiple correction marks HM from multiple marks M provided on the substrate KB. Therefore, as long as the number of marks M on the substrate KB is greater than the number (however multiple) selected as correction marks HM, the number of marks M and the number of correction marks HM are not limited. Also, in the above-described embodiment, it was assumed that there were multiple mounting points P on the substrate KB where the component BH is mounted, but there are not multiple mounting points P, and there may be only one. [Industrial applicability]

[0061] The present invention provides a component mounting apparatus and a component mounting method that can mount components with high precision even when the substrate is subject to localized deformation. [Explanation of Symbols]

[0062] 10. Component mounting device 12 Conveyor 13 Parts Feeder 15 Mounted Heads 16. Circuit board camera (mark imaging unit) 17 parts camera 18 Control Unit 21 Memory section 22 Correction Mark Selection Section 23 Location recognition part 24 Correction section 25 Component Mounting Control Unit DP-equipped data DM mark position data DH Corrected Data KD Correction Mark Combination Data RM Correction Mark Storage Area RP Corrected Mounted Data Storage Area P loading point M mark HM Correction Mark BH parts KB board

Claims

1. A component mounting device that mounts components at mounting points set on a circuit board, A correction mark selection unit selects from among a plurality of marks provided on the substrate to correct the coordinate data of the mounting point in accordance with the positional deviation of the substrate from a reference position, A position recognition unit recognizes the actual position of each of the multiple correction marks selected by the correction mark selection unit, A correction unit corrects the coordinate data of the mounting point based on the actual position of each of the multiple correction marks recognized by the position recognition unit, A mounting head that mounts components onto the substrate based on the coordinate data of the mounting point corrected by the correction unit, A component mounting device equipped with the following features.

2. The component mounting device according to claim 1, further comprising a mark imaging unit that images each of the multiple correction marks, and the position recognition unit that recognizes the actual position of each of the multiple correction marks based on the images of each of the multiple correction marks captured by the mark imaging unit.

3. The component mounting device according to claim 1, wherein the correction mark selection unit selects each of the three marks corresponding to the three vertices of a triangle enclosing the mounting point as the correction marks.

4. The component mounting device according to claim 3, wherein, if there are multiple combinations of three marks corresponding to the three vertices of a triangle containing the mounting point, the correction mark selection unit selects each of the three marks corresponding to the three vertices of the triangle with the shortest longest side as the correction mark.

5. The component mounting device according to claim 1, wherein the correction mark selection unit selects each of the multiple marks that are close in distance from the mounting point as the correction mark.

6. A component mounting method for mounting components at designated mounting points on a circuit board, A correction mark selection step involves selecting from a plurality of marks provided on the substrate a plurality of correction marks for correcting the coordinate data of the mounting point in accordance with the positional deviation of the substrate from a reference position. A position recognition step that recognizes the actual position of each of the multiple correction marks selected in the correction mark selection step, A correction step is performed to correct the coordinate data of the mounting point based on the actual position of each of the multiple correction marks recognized in the position recognition step, A component mounting step in which a component is mounted on the substrate based on the coordinate data of the mounting point corrected in the correction step, A method for mounting components with fasteners.

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