Analytical apparatus, substrate processing system, analytical method, and computer-readable program

Abstract

To facilitate the identification of the cause of malfunctions. [Solution] The analysis device 8 is a device that analyzes the processing results on a substrate and displays the cause of the defect. The analysis device 8 comprises an information receiving unit 804, a storage unit 801, a defect calculation unit 802, and a display 86. The information receiving unit 804 receives input information. The input information includes processing result information that shows the result of processing on the substrate by the substrate processing device. The storage unit 801 stores defect information. The defect information shows the relationship between the defect type, which indicates the type of defect on the substrate, and the defect cause, which is the cause of the defect. The defect calculation unit 802 identifies the defect type and defect cause corresponding to the processing result information based on the input information and defect information. The display 86 displays the defect cause identified by the defect calculation unit 802 as a candidate defect cause. This makes it easier to identify the cause of the defect.

Description

Technical Field

[0001] The present invention relates to a technique for analyzing the processing result of a substrate and displaying the cause of a defect.

Background Art

[0002] Conventionally, in the manufacturing process of a semiconductor substrate (hereinafter simply referred to as "substrate"), various processes are performed on the substrate. For example, the substrate held by the substrate holding portion in a horizontal state is rotated, and a cleaning liquid is supplied to the surface of the rotating substrate, thereby performing a cleaning process on the substrate.

[0003] In such a cleaning process, in the inspection of the process performance of the processed substrate, etc., defects such as the remaining particles on the substrate may be detected. The cause of the remaining particles may be various, such as when the particles attached to the substrate in the process before the cleaning process could not be removed in the cleaning process, or when some configuration or process of the cleaning apparatus adheres particles to the substrate after the cleaning process. The operator of the cleaning apparatus is required to identify and improve the cause of the remaining particles.

[0004] However, in many cases, the operator does not have the knowledge that the designer of the apparatus has regarding what causes defects such as remaining particles. For this reason, it takes a great deal of time to investigate the cause of the defect, and there is a risk of reducing the production efficiency.

[0005] In Patent Document 1, when there are defects in the wafer processed by the coating and developing processing apparatus, based on the type of the defect, the type of the processing unit that may cause the defect (for example, the lower antireflection film forming unit, the resist coating unit, the upper antireflection film forming unit, the developing processing unit, the heat treatment unit, etc.), and the conveyance path of the wafer across a plurality of processing units, a technique for identifying a single processing unit in which the defect has occurred is proposed.

Prior Art Documents

Patent Document

[0006] [Patent Document 1] Patent No. 5837649 [Overview of the project] [Problems that the invention aims to solve]

[0007] However, while the method described in Patent Document 1 can identify the processing unit where the faulty process occurred (i.e., the location of the fault within the device), it cannot identify the specific processing details that caused the fault (i.e., the specific cause of the fault). For example, if the faulty product is a poorly applied resist due to foreign matter, the resist application unit can be identified as the location of the fault, but it cannot be determined what caused the foreign matter to adhere. Therefore, the operator of the coating and developing apparatus will need to investigate the cause of the fault again, which may reduce production efficiency.

[0008] This invention has been made in view of the above-mentioned problems and aims to facilitate the identification of the cause of a malfunction. [Means for solving the problem]

[0009] One aspect of the present invention is an analysis apparatus for analyzing processing results on a substrate and displaying the cause of a defect, comprising: an information receiving unit that receives input information including processing result information indicating the result of processing on a substrate by a substrate processing apparatus; a storage unit that stores defect information indicating the relationship between a defect type indicating the type of defect on the substrate and a defect cause which is the cause of the defect; a defect calculation unit that identifies the defect type and the defect cause corresponding to the processing result information based on the input information and the defect information; and a display unit that displays the defect cause identified by the defect calculation unit as a candidate defect cause.

[0010] Aspect 2 of the present invention is an analysis apparatus according to aspect 1, wherein the display unit displays the type of defect identified by the defect calculation unit as a candidate for the type of defect.

[0011] A third aspect of the present invention is the analysis apparatus of the second aspect, wherein if there are multiple candidate defects identified by the defect calculation unit, the defect calculation unit calculates the probability that each candidate defect is an actual defect. The display unit also displays the probability of each candidate defect.

[0012] Aspect 4 of the present invention is an analysis apparatus according to Aspect 1 (which may be any one of Aspects 1 to 3), wherein the malfunction information also includes the relationship between the operating state of the substrate processing apparatus and the cause of the malfunction. The input information further includes operating state information indicating the operating state of the substrate processing apparatus during processing of the substrate. If there are multiple candidate malfunction causes identified by the malfunction calculation unit, the malfunction calculation unit calculates the probability that each candidate malfunction cause is the actual cause of the malfunction based on the operating state information and the malfunction information. The display unit also displays the probability of malfunction for each candidate malfunction cause.

[0013] A fifth aspect of the present invention is the analytical apparatus of the fourth aspect, wherein the operating status information includes an identifier of the hand used to transport the substrate.

[0014] Aspect 6 of the present invention is an analysis apparatus according to aspect 1 (which may be any one of aspects 1 to 5), further comprising an information processing unit for processing the processing result information included in the input information. The defect calculation unit identifies the type of defect and the cause of the defect corresponding to the processing result information processed by the information processing unit.

[0015] Aspect 7 of the present invention is an analytical apparatus according to Aspect 1 (which may be any one of Aspects 1 to 5), wherein the processing result information includes the state of particle adhesion on the substrate.

[0016] Aspect 8 of the present invention is a substrate processing system comprising an analytical apparatus described in any one of aspects 1 to 7, and a substrate processing apparatus used for processing a substrate whose processing results are to be analyzed by the analytical apparatus.

[0017] Aspect 9 of the present invention is an analysis method for analyzing processing results on a substrate and displaying the cause of a defect, comprising: a) a step of preparing defect information showing the relationship between a defect type indicating the type of defect on the substrate and a defect cause which is the cause of the defect; b) a step of receiving input information including processing result information showing the result of processing on the substrate by a substrate processing apparatus; c) a step of identifying the defect type and the defect cause corresponding to the processing result information based on the input information and the defect information; and d) a step of displaying the defect cause identified in step c) as a defect cause candidate on a display unit.

[0018] Aspect 10 of the present invention is a computer-readable program that analyzes the processing results on a substrate and displays the cause of a defect, wherein when the program is executed on a computer, the following steps are performed: a) preparing defect information that shows the relationship between a defect type indicating the type of defect on the substrate and a defect cause which is the cause of the defect; b) receiving input information including processing result information indicating the result of processing on the substrate by a substrate processing apparatus; c) identifying the defect type and the defect cause corresponding to the processing result information based on the input information and the defect information; and d) displaying the defect cause identified in step c) as a defect cause candidate on a display unit. [Effects of the Invention]

[0019] This invention makes it possible to easily identify the cause of a malfunction. [Brief explanation of the drawing]

[0020] [Figure 1] This is a plan view of a substrate processing system according to one embodiment. [Figure 2] This is a side view of a substrate processing device. [Figure 3] It is a particle map. [Figure 4] It is a diagram showing the configuration of the analyzer. [Figure 5] It is a block diagram showing the functions of the analyzer. [Figure 6A] It is a diagram showing defect information. [Figure 6B] It is a diagram showing defect information. [Figure 6C] It is a diagram showing defect information. [Figure 7] It is a plan view of the substrate. [Figure 8A] It is a particle map. [Figure 8B] It is a particle map. [Figure 8C] It is a particle map. [Figure 8D] It is a particle map. [Figure 9] It is a diagram showing operating state information. [Figure 10] It is a diagram showing the flow of analysis by the analyzer. [Figure 11] It is a diagram showing the screen of the display. [Figure 12] It is a diagram showing the screen of the display. [Figure 13] It is a diagram showing the screen of the display. [Figure 14] It is a diagram showing the screen of the display.

Mode for Carrying Out the Invention

[0021] FIG. 1 is a schematic plan view showing the layout of a substrate processing system 10 according to an embodiment of the present invention. The substrate processing system 10 is a system for processing a semiconductor substrate 9 (hereinafter simply referred to as "substrate 9").

[0022] The substrate processing system 10 comprises an indexer block 101 and a processing block 102 coupled to the indexer block 101. The indexer block 101 and the processing block 102 are also called an indexer cell and a processing cell, respectively. The indexer block 101 is also called an Equipment Front End Module (EFEM) unit, etc.

[0023] The indexer block 101 comprises a carrier holding unit 104, an indexer robot 105, and an IR moving mechanism 106. The carrier holding unit 104 holds multiple carriers 107 capable of accommodating multiple substrates 9. The multiple carriers 107 (e.g., FOUPs) are held in the carrier holding unit 104 in an arrangement in a predetermined carrier arrangement direction. The IR moving mechanism 106 moves the indexer robot 105 in the carrier arrangement direction. The indexer robot 105 performs an unloading operation to unload the substrates 9 from the carriers 107, and an loading operation to load the substrates 9 into the carriers 107 held in the carrier holding unit 104. The substrates 9 are transported in a horizontal position by the indexer robot 105.

[0024] The processing block 102 comprises a plurality of processing units 108 (for example, four or more) for processing the substrate 9, and a central robot 109. The plurality of processing units 108 are arranged to surround the central robot 109 in a plan view. Various processing is performed on the substrate 9 by the plurality of processing units 108. The central robot 109 is equipped with a plurality of hands 109a that are stacked in the vertical direction. Each of the plurality of hands 109a is capable of independently holding the substrate 9 and moving independently. The substrate 9 is transported in a horizontal position by the hands 109a. The central robot 109 performs an loading operation to load the substrate 9 into the processing unit 108, and an unloading operation to unload the substrate 9 from the processing unit 108. Furthermore, the central robot 109 transports the substrate 9 between the plurality of processing units 108. The central robot 109 receives the substrate 9 from the indexer robot 105 and passes the substrate 9 to the indexer robot 105.

[0025] Figure 2 is a side view showing the configuration of the substrate processing apparatus 1. The substrate processing apparatus 1 is one of the multiple processing units 108 shown in Figure 1. In the substrate processing system 10, for example, multiple substrate processing apparatuses 1 having a structure similar to that shown in Figure 2 are provided as multiple processing units 108.

[0026] The substrate processing apparatus 1 is a single-wafer type apparatus that processes substrates 9 one at a time. The substrate processing apparatus 1, for example, supplies a processing liquid to the substrate 9 and performs liquid processing. In this embodiment, the processing liquid is a cleaning liquid, and the liquid processing is a cleaning process for the substrate 9. The substrate processing apparatus 1 comprises a substrate holding section 21, a substrate rotating mechanism 22, a cup section 23, a processing liquid supply section 24, a nozzle moving mechanism 25, and a chamber 11. The substrate holding section 21, the substrate rotating mechanism 22, the cup section 23, the processing liquid supply section 24, and the nozzle moving mechanism 25, etc., are housed in the internal space of the chamber 11. The top of the chamber 11 is provided with an airflow forming section 12 that supplies gas into the internal space to form a downward-flowing airflow (so-called downflow). For example, an FFU (Fan Filter Unit) is used as the airflow forming section 12.

[0027] The substrate holding section 21 holds the substrate 9 in a horizontal position from below. The substrate holding section 21 is a mechanical chuck that includes, for example, a plurality of chuck pins 211 that directly contact the outer circumference of the substrate 9 to hold the substrate 9. The substrate holding section 21 includes, for example, four chuck pins 211 arranged circumferentially at approximately equal angular intervals (i.e., approximately 90° intervals). The substrate rotation mechanism 22 rotates the substrate 9 held by the substrate holding section 21 by rotating the substrate holding section 21 around the central axis J1. The substrate rotation mechanism 22 is, for example, a motor. In the substrate processing apparatus 1, the substrate holding section 21 and the substrate rotation mechanism 22 constitute a spin chuck that holds and rotates the substrate 9.

[0028] The cup section 23 comprises an annular cup 231 centered on the central axis J1. The cup 231 is arranged around the entire circumference of the substrate 9 and the substrate holder 21, covering the sides of the substrate 9 and the substrate holder 21. The cup 231 is a liquid receiving container that receives liquids such as processing liquid that are scattered outwards from the rotating substrate 9. A drain port (not shown) is provided at the bottom of the cup 231 to discharge the processing liquid received in the cup 231 to the outside of the chamber 11. The cup 231 moves vertically by a lifting mechanism (not shown).

[0029] The cup section 23 may include a plurality of cups 231 stacked radially (hereinafter also simply referred to as "radial direction") around the central axis J1. When the cup section 23 includes a plurality of cups 231, each of the cups 231 can move independently in the vertical direction, and the plurality of cups 231 are switched to be used to receive the processing liquid according to the type of processing liquid splashed from the substrate 9.

[0030] The processing liquid supply unit 24 includes a nozzle 241 positioned above the substrate 9. The nozzle 241 discharges the processing liquid toward the upper surface 91 of the substrate 9. In this embodiment, the processing liquid supplied to the substrate 9 from the nozzle 241 is a cleaning liquid used to clean the substrate 9, as described above. In the processing liquid supply unit 24, for example, multiple types of processing liquids may be switched and discharged from the nozzle 241. Alternatively, the processing liquid supply unit 24 may include multiple nozzles 241, each discharging multiple types of processing liquids.

[0031] The nozzle movement mechanism 25 is a swinging mechanism that swings the nozzle 241 substantially horizontally in the space above the substrate 9. The nozzle movement mechanism 25 comprises an arm 251 and an arm rotation mechanism 252. The arm 251 is a rod-shaped member that extends substantially horizontally. The nozzle 241 is fixed to one end of the arm 251, and the other end is connected to the arm rotation mechanism 252, which is located radially outside the cup portion 23. The arm rotation mechanism 252 rotates the arm 251 substantially horizontally around a rotation axis that extends vertically. The arm rotation mechanism 252 is, for example, a motor.

[0032] The nozzle movement mechanism 25 reciprocates the nozzle 241, which discharges the processing liquid onto the rotating substrate 9, between a first position that is vertically opposite to the center of the upper surface 91 of the substrate 9, and a second position that is radially outward from the first position. Preferably, the second position is vertically opposite to the outer peripheral region of the upper surface 91 of the substrate 9. This ensures that the processing liquid is supplied substantially evenly over substantially the entire upper surface 91 of the substrate 9.

[0033] The substrate processing apparatus 1 further comprises a flow rate sensor 26 and a rotation speed sensor 27. The flow rate sensor 26 measures the flow rate of the processing liquid discharged from the nozzle 241. The flow rate sensor 26 is, for example, an electromagnetic or ultrasonic sensor attached to the nozzle 241. The rotation speed sensor 27 measures the rotation speed of the substrate 9 by the substrate rotation mechanism 22. The rotation speed sensor 27 is, for example, an electromagnetic or optical sensor located near the substrate rotation mechanism 22 or the substrate holding part 21.

[0034] As shown in Figure 1, the substrate processing system 10 further includes an analysis device 8. The analysis device 8 is a device that, when a defect occurs in the substrate 9 processed by the substrate processing device 1, analyzes the processing results of the substrate 9 by the substrate processing device 1 and displays the cause of the defect (hereinafter also referred to as "defect cause"). In other words, the substrate processing device 1 is a device used for processing the substrate 9 whose processing results are to be analyzed by the analysis device 8. In this embodiment, the defect will be described as the adhesion of particles to the upper surface 91 of the substrate 9.

[0035] The substrate 9 processed by the substrate processing apparatus 1 is, for example, transported outside the substrate processing system 10, and the processing result is measured by a measuring device (not shown). In this embodiment, the measuring device measures whether or not particles are present on the upper surface 91 of the substrate 9 after processing by the substrate processing apparatus 1, and if particles are present, the position of the particles on the substrate 9 is obtained.

[0036] Figure 3 is a particle map 61 illustrating the position of particles 93 on the substrate 9 (i.e., the adhesion status of particles 93) acquired by the measuring device. The measurement method in the measuring device is, for example, particle measurement using light scattering or observation by SEM (scanning electron microscope). The position of particles 93 on the substrate 9 shown in the particle map 61 is included in the processing result information indicating the result of processing the substrate 9 by the substrate processing device 1. This processing result information may include various information other than the position of particles 93 on the substrate 9, such as the components of each particle 93 (i.e., the elements that make up each particle 93). This processing result information is sent from the measuring device to the analysis device 8.

[0037] Figure 4 shows the configuration of the analysis device 8. The analysis device 8 has the configuration of a general computer system, including a CPU 81, a GPU 82, a ROM 83, a RAM 84, a fixed disk 85, a display 86, an input unit 87, a reader 88, a communication unit 89, and a bus 80. The CPU 81 performs various calculations. The GPU 82 performs various calculations related to image processing. The ROM 83 stores the basic program. The RAM 84 stores various information. The fixed disk 85 stores information. The display 86 is a display unit that displays various information such as images.

[0038] The input unit 87 includes a keyboard 87a and a mouse 87b that accept input from the operator. The reader 88 reads information from a computer-readable recording medium 881 such as an optical disk, magnetic disk, magneto-optical disk, or memory card. The display 86, keyboard 87a, mouse 87b, and reader 88 are connected to the bus 80 via an interface I / F. The communication unit 89 sends and receives signals to and from external devices of the analysis device 8. The bus 80 is a signal circuit that connects the CPU 81, GPU 82, ROM 83, RAM 84, fixed disk 85, display 86, input unit 87, reader 88, and communication unit 89.

[0039] In the analysis device 8, program 882 is read in advance from the recording medium 881 via the reader 88 and stored in the fixed disk 85. Program 882 may also be stored in the fixed disk 85 via a network. The CPU 81 and GPU 82 perform calculations using RAM 84 and the fixed disk 85 according to program 882. The CPU 81 and GPU 82 function as the calculation unit in the analysis device 8. Other configurations besides the CPU 81 and GPU 82 that function as the calculation unit may also be employed.

[0040] Figure 5 is a block diagram showing some of the functions of the analysis device 8. The analysis device 8 comprises a storage unit 801, a fault calculation unit 802, an information processing unit 803, and an information receiving unit 804. The storage unit 801 is implemented by RAM 84 and a fixed disk 85, etc. The fault calculation unit 802, the information processing unit 803, and the information receiving unit 804 are implemented by a CPU 81, GPU 82, ROM 83, RAM 84, a fixed disk 85, and their peripheral components.

[0041] The memory unit 801 pre-stores the defect information 51 shown in Figures 6A to 6C. The defect information 51 is information that shows the relationship between the position of the particles on the substrate 9 (i.e., the processing result for the substrate 9), the type of defect on the substrate 9, and the cause of the defect. The defect information 51 includes first defect information 511 and second defect information 512.

[0042] As shown in Figure 6B, the first defect information 511 is information indicating the relationship between the position of the particle on the substrate 9 and the type of defect described above. In the example shown in Figure 6B, the defect types include four types of defect modes: "full surface mode," "peripheral surface mode," "four-point mode," and "two-point mode." The position of the particle also includes four regions: "first region," "second region," "third region," and "fourth region."

[0043] Figure 7 shows the first to fourth regions 911 to 914 described above on the upper surface 91 of the substrate 9. In Figure 7, different parallel diagonal lines are drawn on the first to fourth regions 911 to 914. The fourth region 914 is the central region of the substrate 9. The fourth region 914 is a circular region with a radius equivalent to, for example, 80% of the radius of the substrate 9 and centered on the center C1 of the substrate 9. The first region 911 is the two regions located on the lower side in Figure 7, which are four regions that are spaced circumferentially at approximately equal angular intervals (i.e., approximately 90° intervals) in the outer peripheral region, which is an annular region obtained by excluding the fourth region 914 (i.e., the central region) from the upper surface 91 of the substrate 9. The second region 912 is the two regions other than the first region 911 among the four regions of the outer peripheral region. The third region 913 is the region of the outer peripheral region excluding the first region 911 and the second region 912.

[0044] The full-surface mode, as illustrated in Figure 8A, indicates a state in which particles 93 are distributed over substantially the entire surface of the substrate 9 (i.e., the first region 911, the second region 912, the third region 913, and the fourth region 914). In Figure 8A, the boundaries of the first region 911, the second region 912, the third region 913, and the fourth region 914 are indicated by dashed lines. The same applies to Figures 8B to 8D.

[0045] As illustrated in Figure 8B, the outer periphery mode shows a state in which particles 93 are mainly distributed in the outer periphery region of the substrate 9 (i.e., the first region 911, the second region 912, and the third region 913), and there are almost no particles 93 in the central region of the substrate 9 (i.e., the fourth region 914).

[0046] The 4-point mode, as illustrated in Figure 8C, is a state in which particles 93 are mainly present in four regions (i.e., the first region 911 and the second region 912) arranged at approximately equal angular intervals in the outer peripheral region of the substrate 9, while particles 93 are almost absent in the other regions (i.e., the third region 913 and the fourth region 914).

[0047] The two-point mode, as illustrated in Figure 8D, is a state in which particles 93 are mainly present in the two lower regions (i.e., the first region 911) of the four regions arranged at approximately equal angular intervals in the outer peripheral region of the substrate 9, while particles 93 are almost absent in the other regions (i.e., the second region 912, the third region 913, and the fourth region 914).

[0048] In the first defect information 511 illustrated in Figure 6B, when particles 93 are mainly located in the fourth region 914 on the substrate 9, the probability that the type of defect occurring on the substrate 9 (i.e., the defect type) is full-surface mode is 100%, and the probability that the defect type is outer-peripheral mode, 4-point mode, or 2-point mode is 0%. In other words, when particles 93 are mainly located in the fourth region 914, the defect type is full-surface mode. Note that the probabilities illustrated in Figure 6B may be changed in various ways.

[0049] If particles 93 are mainly located in the third region 913 on the substrate 9, the type of defect occurring on the substrate 9 (i.e., the defect species) is either full-surface mode or periphery mode. The probability that the defect species is full-surface mode is 30%, and the probability that the defect species is periphery mode is 70%. The probability that the defect species is 4-point mode or 2-point mode is 0%.

[0050] If particles 93 are mainly located in the second region 912 on the substrate 9, the type of defect occurring on the substrate 9 is either full-surface mode, outer-periphery mode, or 4-point mode. The probability of the defect being full-surface mode is 10%, the probability of it being outer-periphery mode is 30%, and the probability of it being 4-point mode is 60%. The probability of it being 2-point mode is 0%.

[0051] If particles 93 are mainly located in the first region 911 on the substrate 9, the type of defect occurring on the substrate 9 is either full-surface mode, outer-periphery mode, 4-point mode, or 2-point mode. Furthermore, the probability of the defect being full-surface mode is 5%, the probability of the defect being outer-periphery mode is 10%, the probability of the defect being 4-point mode is 25%, and the probability of the defect being 2-point mode is 60%.

[0052] The second defect information 512 is information showing the relationship between the defect type and the defect cause. In the example shown in Figure 6C, the defect types include the full-surface mode, perimeter mode, four-point mode, and two-point mode described above. In Figure 6C, the data elements corresponding to the full-surface mode, perimeter mode, four-point mode, and two-point mode (i.e., a series of data arranged horizontally in the figure) are assigned identification numbers ID1, ID2, ID3, and ID4, respectively. In Figure 6C, each defect type is also shown in text and a schematic diagram.

[0053] In ID1, the causes of malfunction associated with the full-surface mode are "insufficient flow rate" and "insufficient rotation speed." "Insufficient flow rate" means that the flow rate of the processing liquid discharged from the nozzle 241 is less than the flow rate set as the normal operating state (i.e., the standard operating state) of the substrate processing apparatus 1 (hereinafter also referred to as the "standard flow rate"). "Insufficient rotation speed" means that the rotation speed of the substrate 9 is less than the rotation speed set as the normal operating state of the substrate processing apparatus 1 (hereinafter also referred to as the "standard rotation speed"). In the example shown in Figure 6C, the standard flow rate is associated with the malfunction cause "insufficient flow rate," and the standard rotation speed is associated with the malfunction cause "insufficient rotation speed." The full-surface mode is associated with one or more actual particle maps 61 (hereinafter also referred to as "previously registered maps") in which the malfunction type was classified as full-surface mode in past analyses by the analyzer 8.

[0054] In ID2, the malfunction causes associated with the outer perimeter mode are "insufficient flow rate" and "insufficient rotational speed." As described above, the malfunction cause "insufficient flow rate" is associated with a reference flow rate, and the malfunction cause "insufficient rotational speed" is associated with a reference rotational speed. The reference flow rate and reference rotational speed in ID2 may be the same as or different from the reference flow rate and reference rotational speed in ID1. The outer perimeter mode is associated with one or more actual particle maps 61 (i.e., previously registered maps) in which the malfunction type was classified as the outer perimeter mode in past analyses by the analyzer 8.

[0055] In ID3, the cause of the defect associated with the 4-point mode is "chuck". "Chuck" refers to a state in which particles adhere to the substrate 9 due to contact with a contaminated chuck pin 211 (see Figure 2), or a state in which the flow of the processing liquid on the substrate 9 is obstructed by the chuck pin 211, resulting in insufficient cleaning near the chuck pin 211 and the remaining particles. The 4-point mode is associated with one or more actual particle maps 61 (i.e., previously registered maps) in which the defect type was classified as a 4-point mode in past analyses by the analyzer 8.

[0056] In ID4, the cause of the malfunction associated with the two-point mode is "hand". "Hand" indicates a condition in which particles adhere to the substrate 9 due to contact with a contaminated hand 109a during transport of the substrate 9 by the central robot 109. The two-point mode is associated with one or more actual particle maps 61 (i.e., previously registered maps) in which the malfunction type was classified as a two-point mode in past analyses by the analyzer 8.

[0057] In the substrate processing system 10 shown in Figure 1, once the processing of the substrate 9 by the substrate processing apparatus 1 is complete, the processing result of the substrate 9 is measured by the measuring device described above, and operating status information 52 (see Figure 9) indicating the operating status of the substrate processing apparatus 1 during the processing of the substrate 9 is sent from the substrate processing apparatus 1 to the analysis device 8. The operating status information 52 includes various information such as the identifier of the substrate processing apparatus 1 used to process the substrate 9, the identifier of the hand 109a used to load and unload the substrate 9 into and out of the substrate processing apparatus 1, the rotation speed of the substrate 9 during processing obtained by the rotation speed sensor 27, the flow rate of the processing liquid during processing obtained by the flow rate sensor 26, the type of processing liquid, the date and time of processing, temperature, humidity, etc. The operating status included in the operating status information 52 can be changed in various ways.

[0058] Next, the analysis process by the analysis device 8 will be explained with reference to Figure 10. In the analysis device 8, the above-mentioned defect information 51 (see Figure 6A) is first prepared by being stored in the storage unit 801 (see Figure 5) (step S11). Subsequently, the processing result information sent from the above-mentioned measuring device and the operating status information 52 (see Figure 10) sent from the substrate processing device 1 are received as input information by the information receiving unit 804 (step S12) and stored in the storage unit 801. In the following, the analysis process for one substrate 9 will be explained, but in reality, the processing result information and operating status information 52 for multiple substrates 9 are sent to the analysis device 8 together, and each substrate 9 is analyzed in an order selected by the operator of the analysis device 8.

[0059] Next, the defect calculation unit 802 identifies the defect type and defect cause corresponding to the processing result information included in the input information based on the input information and defect information 51 (step S13). Specifically, based on the particle map 61 (see Figure 3) included in the processing result information, it is confirmed which of the first to fourth regions 911 (see Figure 7) on the substrate 9 the particles 93 are mainly attached to. Then, based on the main attachment area of ​​the particles 93 and the first defect information 511 (see Figure 6B) of the defect information 51, one or more defect types corresponding to the attachment area are identified, and the probability of each defect type (hereinafter also referred to as "defect type probability") is obtained.

[0060] The identified defect types are displayed on the screen of the display 86 as defect type candidates, as illustrated in Figure 11. In the example shown in Figure 11, it is determined that the particles 93 of the particle map 61 are mainly attached to the third region 913 (see Figure 7), and both the full-surface mode and the outer-perimeter mode are displayed on the display 86 as defect type candidates. The defect type probability corresponding to each defect type candidate (i.e., the probability that each defect type candidate is the actual defect type) is also displayed on the display 86. Note that if there is only one defect type candidate, the defect type probability does not need to be displayed on the display 86.

[0061] Once a candidate for the type of malfunction is identified from the first malfunction information 511, the malfunction cause corresponding to that candidate is identified based on the identified candidate for the type of malfunction and the second malfunction information 512 (see Figure 6C). The identified malfunction cause is displayed on the screen of the display 86 as a candidate for the malfunction cause, as illustrated in Figure 11 (step S14). In the example shown in Figure 11, "insufficient flow rate" and "insufficient rotational speed" are displayed on the display 86 as candidate malfunction causes corresponding to the full-surface mode. The same applies to the outer perimeter mode. In the example shown in Figure 11, the reference operating conditions (i.e., reference flow rate and reference rotational speed) corresponding to "insufficient flow rate" and "insufficient rotational speed" are also displayed on the display 86.

[0062] The display 86 displays the operating status of the substrate processing apparatus 1 corresponding to the candidate cause of the malfunction, extracted from the operating status information 52. In the example shown in Figure 11, the flow rate and rotation speed included in the operating status information 52 are displayed on the display 86 as operating statuses corresponding to "insufficient flow rate" and "insufficient rotation speed," respectively. If 4-point mode and 2-point mode are identified as malfunction types, "chuck" and "hand" are displayed on the display 86 as candidate causes of the malfunction corresponding to 4-point mode and 2-point mode, respectively. The identifier of the substrate processing apparatus 1 and the identifier of the hand 109a included in the operating status information 52 are then displayed on the display 86 as operating status information 52 corresponding to "chuck" and "hand," respectively.

[0063] In the analysis device 8, if there are multiple candidate causes of a single type of malfunction, the probability that any of these candidate causes is the actual cause of the malfunction (hereinafter also referred to as the "malfunction cause probability") is calculated by the malfunction calculation unit 802 based on the operating state information 52 and malfunction information 51 described above, and displayed on the display 86. The malfunction calculation unit 802, for example, assigns the malfunction probability of a single type of malfunction to the multiple candidate causes of the malfunction based on the degree of deviation between the reference operating state and the actual operating state (i.e., the relationship between the malfunction cause and the operating state).

[0064] In the example shown in Figure 11, the 30% failure probability corresponding to the full-circuit mode is allocated as follows: 24% to "insufficient flow rate" with a relatively large deviation, and 6% to "insufficient rotational speed" with a relatively small deviation. Similarly, the 70% failure probability corresponding to the outer-circuit mode is allocated as follows: 56% to "insufficient flow rate" with a relatively large deviation, and 14% to "insufficient rotational speed" with a relatively small deviation.

[0065] As shown in Figure 11, the analyzer 8 displays candidate causes of malfunctions along with their probability of occurrence by inputting processing result information and operating status information 52 as input information. Therefore, it is possible to easily identify the cause of malfunctions that occur during processing of the substrate 9. In the example shown in Figure 11, "insufficient flow rate," which is a candidate cause of malfunction in the full-surface mode, and "insufficient flow rate," which is a candidate cause of malfunction in the outer-periphery mode, are displayed separately, but they may be displayed together as a single item. The same applies to "insufficient rotation speed," which is a candidate cause of malfunction.

[0066] Furthermore, the probability of a malfunction does not necessarily have to be determined based on the degree of deviation between the standard operating state and the actual operating state, and may be determined by various methods. For example, in the second malfunction information 512 shown in Figure 6C, the probability of each malfunction candidate may be determined based on the number of particle maps 61 included in the registered map corresponding to each malfunction.

[0067] In the above description, in step S13, the particle map 61 included in the processing result information is used as is (i.e., without processing) to identify the type of defect and the cause of the defect, but this is not limited to the above. In step S13, for example, the processing result information may be processed by the information processing unit 803 (see Figure 5), and then the type of defect and the cause of the defect corresponding to the processed processing result information may be identified by the defect calculation unit 802.

[0068] Specifically, for example, the operator processes the processing result information by selecting some of the particles 93 on the particle map 61 on the display 86 using a mouse 87b or the like. In Figure 12, the selected particles 93 are shown as black circles. In the processed result information after processing, only the selected particles 93 (black circles) are treated as being attached to the substrate 9, while the unselected particles 93 (white circles) are treated as not being attached to the substrate 9.

[0069] In the example shown in Figure 12, the post-processing result information indicates that the particles 93 are mainly attached to the first region 911 (see Figure 7), and the full-surface mode, outer-perimeter mode, 4-point mode, and 2-point mode are displayed on the display 86 as candidate defect types. The probability of each defect type, the candidate cause of the defect, and the probability of the cause of the defect corresponding to each candidate defect type are also displayed on the display 86. This allows the operator to analyze the cause of the defect based only on the particles 93 they are interested in (i.e., only the parts that are important in the processing result information).

[0070] Alternatively, as shown in Figure 13, the operator may click the toggle button 53 located in the upper right corner of the processing result information window with a mouse 87b or the like, to switch the area on the right side of the display 86 to the periodic table. Then, by selecting a specific element (for example, Fe) in the periodic table with the mouse 87b or the like, only the particles 93 containing the selected element are selected in the particle map 61 of the processing result information, and the processing result information is processed. In Figure 13, the selected element is highlighted, and the selected particles 93 are indicated by black circles. In the processed result information after processing, only the selected particles 93 (black circles) are treated as being attached to the substrate 9, and the unselected particles 93 (white circles) are treated as not being attached to the substrate 9.

[0071] In the example shown in Figure 13, the processing result information after processing indicates that the particles 93 are mainly attached to the fourth region 914 (see Figure 7). When the operator clicks the toggle button 53 with a mouse 87b or the like, the full-surface mode is displayed on the display 86 as a candidate for the defect type, as shown in Figure 14. The probability of the defect type, the candidate for the defect cause, and the probability of the defect cause corresponding to the full-surface mode are also displayed on the display 86. This allows the operator to analyze the cause of the defect based only on the particles 93 that they are interested in (i.e., only the parts that are considered important in the processing result information).

[0072] In the analysis device 8, by clicking one of the four modes indicating candidate defect types with a mouse 87b or the like on the display 86 shown in Figure 12, multiple particle maps 61 (see Figure 6C), which are pre-registered maps corresponding to that mode, may be displayed on the display 86. This allows the operator to easily compare the particle map 61 of the processing result information with the multiple particle maps 61 of the pre-registered maps corresponding to the mode mentioned above. As a result, the operator can easily determine which of the candidate defect types presented by the analysis device 8 corresponds to the particle map 61 of the processing result information.

[0073] In the analysis device 8, the defect information 51 shown in Figures 6A to 6C may be updated as needed. For example, if the particle map 61 of the processing result information is classified as a full-circumference mode, and the particle map 61 has different characteristics from multiple particle maps 61 of the previously registered maps of the full-surface mode, the particle map 61 of the processing result information is added to the previously registered maps of the full-surface mode in the second defect information 512 (see Figure 6C). In this case, the probability of each defect type related to the full-surface mode in the first defect information 511 (see Figure 6B) may also be changed as appropriate.

[0074] Furthermore, if the particle map 61 of the processing result information is difficult to classify into any of the defect types included in the defect information 51, a new defect type corresponding to the particle map 61 is added to the first defect information 511 and the second defect information 512. In this case, the particle map 61 is registered in the already registered map of the newly added defect type. The defect type probability for each defect type in the first defect information 511 is also changed as appropriate.

[0075] As described above, the analysis device 8 is a device that analyzes the processing results on the substrate 9 and displays the cause of the defect. The analysis device 8 comprises an information receiving unit 804, a storage unit 801, a defect calculation unit 802, and a display unit (i.e., a display 86). The information receiving unit 804 receives input information. The input information includes processing result information that shows the result of processing on the substrate 9 by the substrate processing device 1. The storage unit 801 stores defect information 51. The defect information 51 shows the relationship between the defect type, which indicates the type of defect on the substrate 9, and the defect cause, which is the cause of the defect. The defect calculation unit 802 identifies the defect type and defect cause corresponding to the processing result information based on the input information and the defect information 51. The display 86 displays the defect cause identified by the defect calculation unit 802 as a candidate defect cause. This allows the operator to easily obtain a candidate defect cause from the processing results of the substrate 9. As a result, the identification of the defect cause can be made easier.

[0076] As described above, it is also preferable that the display 86 displays the defect types identified by the defect calculation unit 802 as defect type candidates. This allows the operator to easily identify the defect types that are most likely to be classified as the processing result of the substrate 9.

[0077] As described above, if there are multiple candidate defects identified by the defect calculation unit 802, it is preferable for the defect calculation unit 802 to determine the probability that each candidate defect is an actual defect. It is also preferable for the display 86 to display the probability of each candidate defect. This makes it even easier for the operator to understand which defect is most likely to be classified as the processing result of the substrate 9.

[0078] In the example described above, the defect information 51 also includes the relationship between the operating state of the substrate processing apparatus 1 and the cause of the defect. The input information further includes operating state information 52 that indicates the operating state of the substrate processing apparatus 1 during processing of the substrate 9. In the analysis apparatus 8, if there are multiple candidate defects identified by the defect calculation unit 802, it is preferable for the defect calculation unit 802 to determine the probability that each candidate defect is the actual cause of the defect based on the operating state information 52 and the defect information 51. It is also preferable for the display 86 to display the probability of each candidate defect. This makes it even easier to identify the cause of the defect.

[0079] As described above, it is also preferable that the operating status information 52 includes an identifier for the hand 109a used to transport the substrate 9. This makes it easy to identify the cause of malfunctions caused by dirt on the hand 109a, etc.

[0080] As described above, it is preferable that the analysis device 8 further includes an information processing unit 803 that processes the processing result information contained in the input information. Furthermore, it is preferable that the malfunction calculation unit 802 identifies the malfunction type and malfunction cause corresponding to the processing result information processed by the information processing unit 803. This makes it possible to identify the malfunction cause based on the part of the processing result information that the operator considers important.

[0081] As described above, it is preferable that the processing result information includes the adhesion status of particles 93 on the substrate 9. This makes it easy to identify the cause of the defect that causes the adhesion of particles 93.

[0082] As described above, the substrate processing system 10 comprises the analysis device 8 described above and a substrate processing device 1 used for processing the substrate 9 whose processing results are to be analyzed by the analysis device 8. This makes it possible to easily identify the cause of defects in the processing results of the substrate 9 in the substrate processing system 10 that processes the substrate 9.

[0083] The analysis method described above includes the steps of: preparing defect information 51 that shows the relationship between a defect type indicating the type of defect on the substrate 9 and the defect cause which is the cause of the defect (step S11); receiving input information including processing result information indicating the result of processing the substrate 9 by the substrate processing apparatus 1 (step S12); identifying the defect type and defect cause corresponding to the processing result information based on the input information and the defect information 51 (step S13); and displaying the defect cause identified in step S13 as a candidate defect cause on the display unit (i.e., display 86) (step S14). This makes it possible to easily identify the defect cause as described above.

[0084] As described above, when program 882 is executed on the computer, the following steps are performed: (step S11) prepare defect information 51 that shows the relationship between the type of defect on the circuit board 9 and the cause of the defect; (step S12) receive input information including processing result information that shows the result of processing the circuit board 9 by the circuit board processing device 1; (step S13) identify the defect type and cause of the defect corresponding to the processing result information based on the input information and the defect information 51; and (step S14) display the cause of the defect identified in step S13 as a candidate cause of the defect on the display unit (i.e., display 86). As a result, as described above, the identification of the cause of the defect can be made easier.

[0085] Various modifications are possible to the aforementioned analytical apparatus 8, substrate processing system 10, analytical method, and program 882.

[0086] For example, the display mode on display 86 is not limited to the above example and can be changed in various ways. For example, on display 86, processing result information, candidate defect types, defect type probability, standard operating state, operating state, and defect cause probability do not necessarily need to be displayed.

[0087] The candidate defects and their probabilities corresponding to the processing results described above may be obtained by various methods other than those described above. For example, multiple trained models corresponding to multiple defect types may be created by machine learning using a previously registered map as training data, and the measurement results from the above-mentioned measuring device on the substrate 9 may be input to each trained model to obtain the candidate defects and their probabilities corresponding to the measurement results. In addition, publicly available datasets published on the web may be used as the training data.

[0088] The processing performed on the substrate 9 by the substrate processing apparatus 1 is not necessarily limited to cleaning, but may be liquid processing other than cleaning, or processing other than liquid processing. Furthermore, the processing results of the substrate 9 included in the processing result information (i.e., the measurement results of the processed substrate 9 by the above measuring device) are not limited to the particle map 61, but may be changed in various ways according to the content of the processing performed on the substrate 9. For example, if etching is performed on the substrate 9 in the substrate processing apparatus 1, the processing result information may be an etching map showing the distribution of etching amount on the substrate 9. Alternatively, feature quantities extracted from measurement results such as the particle map 61 or etching map by deep learning may be used as processing result information.

[0089] The input information received by the information receiving unit 804 does not necessarily need to include the operating status information 52, as long as it includes processing result information.

[0090] The substrate processing apparatus 1 may be used to process glass substrates used in flat panel displays such as liquid crystal displays or organic electroluminescence (EL) displays, or glass substrates used in other displays, in addition to semiconductor substrates. Furthermore, the substrate processing apparatus 1 may be used to process substrates for optical discs, magnetic discs, magneto-optical discs, photomasks, ceramic substrates, and solar cell substrates.

[0091] The analysis device 8 does not necessarily have to be installed in the substrate processing system 10 together with the substrate processing device 1, and may be used as a device independent of the substrate processing device 1.

[0092] The configurations in the above embodiments and each modified example may be combined as appropriate, as long as they do not contradict each other. [Explanation of Symbols]

[0093] 1. Substrate processing apparatus 8 Analyzer 9 circuit boards 10. Substrate Processing System 51. Bug Information 52 Operating Status Information 93 Particles 109a Hand 801 Storage section 802 Malfunction Calculation Unit 803 Information processing department 804 Information Reception Department 882 Program S11~S14 Step

Claims

1. An analytical device that analyzes the processing results on a circuit board and displays the cause of the defect, An information receiving unit that receives input information including processing result information indicating the result of processing on a substrate by a substrate processing device, A storage unit that stores defect information showing the relationship between the type of defect on the circuit board and the cause of the defect, A defect calculation unit that identifies the defect type and the defect cause corresponding to the processing result information based on the input information and the defect information, A display unit that displays the cause of the malfunction identified by the malfunction calculation unit as a candidate cause of the malfunction, An analytical device equipped with the following features.

2. The analytical apparatus according to claim 1, The display unit is an analysis device that displays the type of defect identified by the defect calculation unit as a candidate for the type of defect.

3. The analytical apparatus according to claim 2, If there are multiple candidate defects identified by the defect calculation unit, the defect calculation unit determines the probability that each candidate defect is an actual defect. The display unit also displays the probability of each of the candidate defects, and is an analytical device.

4. The analytical apparatus according to claim 1, The aforementioned malfunction information also includes the relationship between the operating status of the substrate processing device and the cause of the malfunction. The input information further includes operating status information indicating the operating status of the substrate processing apparatus during the processing of the substrate, If there are multiple candidate causes of the malfunction identified by the malfunction calculation unit, the malfunction calculation unit determines the probability that each candidate cause of the malfunction is the actual cause of the malfunction, based on the operating status information and the malfunction information. The display unit is an analysis device that also displays the probability of each of the candidate causes of the malfunction.

5. The analytical apparatus according to claim 4, The operating status information includes an identifier for the hand used to transport the substrate, in the analysis device.

6. The analytical apparatus according to claim 1, The system further comprises an information processing unit that processes the processing result information included in the input information, The malfunction calculation unit is an analysis device that identifies the malfunction type and the malfunction cause corresponding to the processing result information processed by the information processing unit.

7. The analytical apparatus according to claim 1, The processing result information includes the state of particle adhesion on the substrate, as analyzed by an analytical apparatus.

8. A substrate processing system, An analytical apparatus according to any one of claims 1 to 7, A substrate processing apparatus used for processing substrates whose processing results are to be analyzed by the aforementioned analytical apparatus, A substrate processing system comprising the above.

9. An analysis method that analyzes the processing results on a circuit board and displays the cause of the defect, a) A step of preparing defect information that shows the relationship between the type of defect on the substrate and the cause of the defect, b) A step of receiving input information including processing result information indicating the result of processing on a substrate by a substrate processing apparatus, c) A step of identifying the type of defect and the cause of the defect corresponding to the processing result information based on the input information and the defect information, d) A step of displaying the cause of the malfunction identified in step c) above as a candidate cause of the malfunction on the display unit, An analytical method that includes the following features.

10. A computer-readable program that analyzes the processing results on a circuit board and displays the cause of the malfunction, When the aforementioned program is executed on a computer, a) A step of preparing defect information that shows the relationship between the type of defect on the substrate and the cause of the defect, b) A step of receiving input information including processing result information indicating the result of processing on a substrate by a substrate processing apparatus, c) A step of identifying the type of defect and the cause of the defect corresponding to the processing result information based on the input information and the defect information, d) A step of displaying the cause of the malfunction identified in step c) above as a candidate cause of the malfunction on the display unit, A computer-readable program that performs [some action].

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