Electronic components

Abstract

To provide an electronic component that suppresses the degradation of its characteristics. [Solution] Each of the multiple internal electrodes 7 has a main electrode portion 7a facing an adjacent internal electrode 7 in direction D3, and a region 3e on the end face 3e that has a width smaller than the width of the main electrode portion 7a in direction D1 and is located closer to the main surface 3a. a It includes a connecting portion 7b that is exposed to the surface and connects the main electrode portion 7a and the external electrode 5. The first electrode layer E1 is region 3e a The first part, which covers the area 3e of the end face 3e, is connected to the connecting part 7b. a The first electrode layer E1 includes a second portion that covers at least a portion of the area located closer to the main surface 3b. The second electrode layer E2 includes an end-face portion located on the end surface 3e that covers the first portion and exposes the second portion. The third electrode layer E3 covers the second portion of the first electrode layer E1 and the end-face portion of the second electrode layer E2.

Description

[Technical Field]

[0001] One aspect of the present invention relates to an electronic component. [Background technology]

[0002] A known electronic component includes a base body, a plurality of external electrodes arranged on the base body, and a plurality of internal electrodes arranged within the base body. Each of the plurality of external electrodes includes a sintered metal layer and a plating layer. Each of the plurality of internal electrodes is connected to a corresponding external electrode among the plurality of external electrodes. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2003-243249 [Overview of the project] [Problems that the invention aims to solve]

[0004] In configurations where the external electrode includes a plating layer, hydrogen may be generated due to the formation of the plating layer. If the generated hydrogen reaches the internal electrode through the sintered metal layer, the properties of the electronic component may deteriorate. For example, the insulation resistance may decrease.

[0005] One aspect of the present invention aims to provide an electronic component that suppresses the degradation of its characteristics. [Means for solving the problem]

[0006] An electronic component according to one aspect of the present invention includes a base body, a plurality of external electrodes, and a plurality of internal electrodes. The base body has a rectangular parallelepiped shape and includes a first main surface and a second main surface facing each other in a first direction, a pair of end surfaces facing each other in a second direction, and a pair of side surfaces facing each other in a third direction. The plurality of external electrodes are arranged at both ends of the base body in a second direction and include a sintered metal layer, a conductive resin layer, and a plating layer, respectively. The plurality of internal electrodes are arranged inside the base body facing each other in a third direction and are connected to corresponding external electrodes among the plurality of external electrodes. Each of the plurality of internal electrodes includes a main electrode portion facing an adjacent internal electrode in a third direction, and a connecting portion having a width smaller than the width of the main electrode portion in a first direction, exposed in a portion of the end surface located near the first main surface, and connecting the main electrode portion to the corresponding external electrode. The sintered metal layer includes a first portion that covers a portion of the end face and is connected to the joint, and a second portion that covers at least a portion of the end face that is located closer to the second main surface than the portion. The conductive resin layer includes one end face portion located on the end face that covers the first portion and exposes the second portion. The plating layer covers the second portion and the one end face portion.

[0007] In one of the above embodiments, the connection portion of the internal electrode is exposed in a portion of the end face as described above. This portion of the end face is covered by a first portion of the sintered metal layer, and the first portion of the sintered metal layer and the connection portion of the internal electrode are connected to each other. The external electrode includes a conductive resin layer. The conductive resin layer includes one end face portion. The end face portion is located on the end face so as to cover the first portion of the sintered metal layer. The conductive resin layer generally includes a plurality of conductive particles and a resin. The resin included in the end face portion prevents hydrogen from moving from the plating layer toward the first portion of the sintered metal layer. Therefore, hydrogen has difficulty moving toward the first portion of the sintered metal layer and has difficulty reaching the internal electrode. As a result, one embodiment of the above suppresses a deterioration of properties.

[0008] As mentioned above, conductive resin layers generally contain resin. Conductive resin layers have a higher electrical resistance than sintered metal layers that do not contain resin. Electronic components in which the external electrodes contain a conductive resin layer may have increased ESR (Equivalent Series Resistance). The plating layer covers the second portion of the sintered metal layer. The second portion of the sintered metal layer is connected to the plating layer without an intervening conductive resin layer. Therefore, in this embodiment, a current path without a conductive resin layer is formed on the external electrode. As a result, this embodiment suppresses an increase in ESR.

[0009] In one of the above embodiments, the sintered metal layer may completely cover the end face. In a configuration where a sintered metal layer completely covers the end face, the sintered metal layer protects the end face.

[0010] In one of the above embodiments, each of the multiple internal electrodes may have a width smaller than the width of the main electrode portion in the first direction, be exposed to another portion of the end face located closer to the second main face, and include another connection portion that connects the main electrode portion to the corresponding external electrode. The sintered metal layer may include a third portion that covers another portion of the end face and is connected to the other connection portion, and a fourth portion that covers at least a portion of the end face located closer to the first main face than the other portion. The conductive resin layer may include another end face portion located on the end face that covers the third portion and exposes the fourth portion. The plating layer may cover the fourth portion and the other end face portion. In a configuration in which each of the multiple internal electrodes includes the aforementioned additional connection portion, the sintered metal layer includes the aforementioned third portion and fourth portion, the conductive resin layer includes the aforementioned additional end face portion, and the plating layer covers the fourth portion and the additional end face portion, the additional connection portion of the internal electrode is exposed to the aforementioned additional portion of the end face, the aforementioned additional portion of the end face is covered by the third portion of the sintered metal layer, and the third portion of the sintered metal layer and the additional connection portion of the internal electrode are connected to each other. In this configuration, another end face portion is positioned on the end face so as to cover the third portion of the sintered metal layer. The resin contained in the other end face portion prevents hydrogen from moving from the plating layer to the third portion of the sintered metal layer. Therefore, hydrogen has difficulty moving to the third portion of the sintered metal layer and reaching the internal electrodes. As a result, this configuration suppresses the degradation of properties. In this configuration, the plating layer covers the fourth portion of the sintered metal layer. The fourth portion of the sintered metal layer is connected to the plating layer without an intervening conductive resin layer. Therefore, this configuration forms a current path to the external electrode that does not include a conductive resin layer. This configuration suppresses an increase in ESR.

[0011] In one of the above embodiments, the second and fourth parts may be continuous. The end face may be completely covered by the external electrode. In one of the above embodiments, the second and fourth parts may be spaced apart. The end face may be exposed from the external electrode between the second and fourth parts.

[0012] In one of the above embodiments, the conductive resin layer may be continuous with one end face portion and may also include a first main surface portion that covers a part of the first main surface. The main electrode portion may include a first edge on the first main surface that faces in a first direction to the region covered by the first main surface portion, and a second edge on the first main surface that faces in a first direction to the region exposed from the conductive resin layer. The first edge may include an edge region in which the distance from the first main surface in a first direction is greater than the distance between the second edge and the first main surface in the first direction. A conductive resin layer containing metal particles may cause migration to the external electrodes. This migration is thought to occur, for example, through the following events: An electric field acts on metal particles contained in the conductive resin layer, causing them to ionize. The generated metal ions are attracted to the electric field acting on the external electrode and move away from the conductive resin layer. The electric field acting on the metal particles includes, for example, the electric field generated between an external electrode and an internal electrode that are not electrically connected to each other. The metal ions that move away from the conductive resin layer react with electrons supplied from, for example, the internal or external electrode, and deposit as metal on the surface of the substrate. For example, an electric field tends to be generated between the first main surface portion of the conductive resin layer and the internal electrode, which are not electrically connected to each other. This electric field can cause migration, as described above. However, a configuration in which the first edge of the main electrode portion includes the edge region described above reduces the electric field generated between the first main surface portion and the internal electrode, which are not electrically connected to each other. Therefore, this configuration suppresses the occurrence of migration.

[0013] In one of the above embodiments, the first edge may include only the edge region. A configuration in which the first edge includes only the edge region further reduces the electric field generated between the first main surface portion and the internal electrode, which are not electrically connected to each other. Therefore, this configuration further suppresses the occurrence of migration.

[0014] In one embodiment described above, the conductive resin layer may be continuous with one end face portion and may also include a side portion that covers a part of the side. In one embodiment described above, a dummy conductor may be placed inside the substrate, adjacent to the side portion in a third direction, and electrically connected to the side portion. For example, an electric field tends to be generated between the side portions of the conductive resin layer and the internal electrodes, which are not electrically connected to each other. As mentioned above, this electric field can cause migration. However, the configuration including the dummy conductor described above reduces the electric field generated between the side portions and the internal electrodes, which are not electrically connected to each other. Therefore, this configuration suppresses the occurrence of migration.

[0015] In one of the above embodiments, the plane including the first principal surface is used as the reference plane, and the length in the first direction from the reference plane to the edge of the dummy conductor facing the second principal surface may be greater than the length of the side portion in the first direction from the reference plane. A configuration in which the length of the dummy conductor in the first direction from the reference plane to the edge facing the second principal surface is greater than the length of the side portion in the first direction from the reference plane ensures that the electric field between the side portion and the internal electrode, which are not electrically connected to each other, is reduced.

[0016] In one of the above embodiments, the conductive resin layer may be continuous with one end face portion and may also include a side portion that covers a part of the side. When the side portion and the internal electrodes that are not electrically connected to the side portion are viewed from a third direction, the side portion and the internal electrodes that are not electrically connected to the side portion do not have to overlap each other. As described above, the configuration in which the side portion and the internal electrode that is not electrically connected to the side portion do not overlap reduces the electric field generated between the side portion and the internal electrode that are not electrically connected to each other. Therefore, this configuration suppresses the occurrence of migration. [Effects of the Invention]

[0017] One aspect of the present invention provides an electronic component that suppresses the degradation of its characteristics. [Brief explanation of the drawing]

[0018] [Figure 1] Figure 1 is a perspective view of a multilayer capacitor according to the first embodiment. [Figure 2] Figure 2 shows the cross-sectional configuration of a multilayer capacitor according to the first embodiment. [Figure 3] Figure 3 shows the cross-sectional configuration of a multilayer capacitor according to the first embodiment. [Figure 4] Figure 4 shows the cross-sectional configuration of a multilayer capacitor according to the first embodiment. [Figure 5]Figure 5 shows the configuration of the first electrode layer and the second electrode layer. [Figure 6] Figure 6 shows a cross-sectional configuration of a multilayer capacitor according to one modified example of the first embodiment. [Figure 7] Figure 7 shows the configuration of the first electrode layer and the second electrode layer. [Figure 8] Figure 8 shows the configuration of the first electrode layer and the second electrode layer. [Figure 9] Figure 9 shows a cross-sectional configuration of a multilayer capacitor according to another modified example of the first embodiment. [Figure 10] Figure 10 shows the configuration of the first electrode layer and the second electrode layer. [Figure 11] Figure 11 shows the configuration of the first electrode layer and the second electrode layer. [Figure 12] Figure 12 shows a cross-sectional configuration of a multilayer capacitor according to yet another modification of the first embodiment. [Figure 13] Figure 13 shows a cross-sectional configuration of a multilayer capacitor according to yet another modification of the first embodiment. [Figure 14] Figure 14 shows a cross-sectional configuration of a multilayer capacitor according to yet another modified example of the first embodiment. [Figure 15] Figure 15 shows the configuration of the first electrode layer and the second electrode layer. [Figure 16] Figure 16 is a perspective view of a multilayer capacitor according to the second embodiment. [Figure 17] Figure 17 shows the cross-sectional configuration of a multilayer capacitor according to the second embodiment. [Figure 18] Figure 18 shows the cross-sectional configuration of a multilayer capacitor according to the second embodiment. [Figure 19] Figure 19 shows the configuration of the first electrode layer and the second electrode layer. [Figure 20] Figure 20 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of the second embodiment. [Figure 21] Figure 21 shows the configuration of the second electrode layer. [Modes for carrying out the invention]

[0019] Embodiments of the present invention will be described in detail below with reference to the attached drawings. In this description, the same reference numerals will be used for elements that are the same or have the same function, and redundant explanations will be omitted.

[0020] (First Embodiment) The configuration of the multilayer capacitor C1 according to the first embodiment will be described with reference to Figures 1 to 5. Figure 1 is a perspective view of the multilayer capacitor according to the first embodiment. Figures 2, 3, and 4 are diagrams showing the cross-sectional configuration of the multilayer capacitor according to the first embodiment. Figure 5 is a diagram showing the configuration of the first electrode layer and the second electrode layer. The electronic components include, for example, a multilayer capacitor C1.

[0021] As shown in Figure 1, the multilayer capacitor C1 includes a rectangular parallelepiped base body 3 and a plurality of external electrodes 5. The multilayer capacitor C1 includes, for example, a pair of external electrodes 5. The pair of external electrodes 5 are arranged on the outer surface of the base body 3. The pair of external electrodes 5 are spaced apart from each other. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and edges, or a rectangular parallelepiped shape with rounded corners and edges.

[0022] The base body 3 includes a pair of opposing main surfaces 3a and 3b, a pair of opposing side surfaces 3c, and a pair of opposing end surfaces 3e. The pair of main surfaces 3a and 3b, the pair of side surfaces 3c, and the pair of end surfaces 3e are rectangular in shape. The direction in which the pair of main surfaces 3a and 3b face each other includes direction D1. The direction in which the pair of side surfaces 3c face each other includes direction D3. The direction in which the pair of end surfaces 3e face each other includes direction D2. The main surface 3b is marked with a mark M indicating the orientation of the base body 3. The mark M may be a pattern layer formed on the main surface 3b, or it may be a region on the main surface 3b where at least a part is colored. The multilayer capacitor C1 is solder-mounted to an electronic device. The electronic device includes, for example, a circuit board or electronic components. In the multilayer capacitor C1, the main surface 3a faces the electronic device. The main surface 3a is positioned to constitute the mounting surface. The main surface 3a is the mounting surface. For example, if the main surface 3a includes a first main surface, then the main surface 3b includes a second main surface.

[0023] Direction D1 includes directions perpendicular to each main surface 3a, 3b and is perpendicular to direction D3. Direction D2 includes directions parallel to each main surface 3a, 3b and each side surface 3c and is perpendicular to directions D1 and D3. Direction D3 includes directions perpendicular to each side surface 3c, and direction D2 includes directions perpendicular to each end surface 3e. A pair of side surfaces 3c extend in direction D1 to connect a pair of main surfaces 3a and 3b. The pair of side surfaces 3c also extend in direction D2. A pair of end surfaces 3e extend in direction D1 to connect a pair of main surfaces 3a and 3b. The pair of end surfaces 3e also extend in direction D3.

[0024] For example, the length of base body 3 in direction D2 is greater than the length of base body 3 in direction D1, and also greater than the length of base body 3 in direction D3. Direction D2 includes the longitudinal direction of base body 3. The length of base body 3 in direction D1 and the length of base body 3 in direction D3 may be equal to each other. The length of base body 3 in direction D1 and the length of base body 3 in direction D3 may be different to each other. The length of base body 3 in direction D1 is the height of base body 3. The length of base body 3 in direction D3 is the width of base body 3. The length of base body 3 in direction D2 is the length of base body 3. For example, the height of base body 3 is 0.1 to 3.2 mm, the width of base body 3 is 0.1 to 6.3 mm, and the length of base body 3 is 0.2 to 7.5 mm. For example, the height of base body 3 is 2.5 mm, the width of base body 3 is 2.5 mm, and the length of base body 3 is 3.2 mm.

[0025] The base body 3 includes two ridge portions 3g, two ridge portions 3h, four ridge portions 3i, and four ridge portions 3j. The ridge portion 3g is located between the end face 3e and the main face 3a. The ridge portion 3h is located between the end face 3e and the main face 3b. The ridge portion 3i is located between the end face 3e and each side face 3c. The ridge portion 3j is located between each main face 3a, 3b and each side face 3c. For example, each of the ridge portions 3g, 3h, 3i, 3j is rounded so as to be curved. The base body 3 is subjected to so-called chamfering. The end face 3e and the main face 3a are indirectly adjacent to each other via the ridge portion 3g. The end face 3e and the main face 3a are indirectly adjacent to each other via the ridge portion 3h. The end face 3e and the side face 3c are indirectly adjacent to each other via the ridge portion 3i. Each main face 3a, 3b and each side face 3c are indirectly adjacent to each other via the ridge portion 3j.

[0026] As shown in FIG. 5, the end face 3e includes a plurality of regions 3e a , 3e b , 3e c . The end face 3e includes, for example, three regions 3e a , 3e b , 3e c . The region 3e a is located closer to the main face 3a. The region 3e b is located closer to the main face 3b. The region 3e c is located between the region 3e a and the region 3e b . The regions 3e b , 3e c are located closer to the main face 3b than the region 3e a . The regions 3e a , the region 3e b , and the region 3e c are arranged in the direction D1 in the order of the region 3e a , the region 3e c , the region 3e b . The lengths of each of the regions 3e a , 3e b , 3e c in the direction D1 may be different or the same. The lengths of the regions 3e a , 3e b in the direction D1 may be the same. Each of the regions 3ea ,3e b ,3e c The length in direction D3 may be the same as the length of the end face 3e in direction D3, or it may be less than the length of the end face 3e in direction D3. For example, region 3e a However, if it includes a portion of the end face 3e, then region 3e b This includes another portion of the end face 3e.

[0027] The base body 3 is constructed by stacking multiple dielectric layers in direction D3. The base body 3 includes multiple stacked dielectric layers. In the base body 3, the stacking direction of the multiple dielectric layers coincides with direction D3. Each dielectric layer is composed of, for example, a sintered body of a ceramic green sheet containing a dielectric material. The dielectric material includes dielectric ceramics. Dielectric ceramics include, for example, BaTiO3 systems, Ba(Ti,Zr)O3 systems, or (Ba,Ca)TiO3 systems. In the actual base body 3, each dielectric layer is integrated to such an extent that the boundaries between each dielectric layer are not visible.

[0028] The multilayer capacitor C1 includes a plurality of internal electrodes 7, as shown in Figure 2. Each of the plurality of internal electrodes 7 is connected to a corresponding external electrode 5 from a plurality of external electrodes 5. The internal electrodes 7 are electrically and physically connected to the corresponding external electrodes 5. Each internal electrode 7 is an internal conductor located within the element 3. Each internal electrode 7 is made of a conductive material commonly used as an internal conductor in multilayer electronic components. The conductive material includes, for example, a base metal. The conductive material includes, for example, nickel (Ni) or copper (Cu). The internal electrode 7 is constructed as a sintered body of a conductive paste containing the above conductive material. For example, the internal electrode 7 is made of nickel. In Figure 2, for illustrative purposes, adjacent internal electrodes 7 are intentionally shown offset from each other in directions D1 and D2.

[0029] Multiple internal electrodes 7 are arranged in different positions (layers) in direction D3. Multiple internal electrodes 7 are arranged in the base body 3 so as to be spaced apart and facing each other in direction D3. Adjacent internal electrodes 7 in direction D3 have different polarities. One end of an internal electrode 7 is exposed to the corresponding end face 3e of a pair of end faces 3e. The other end of an internal electrode 7 is located inside the base body 3 and is not exposed to the end face 3e. An internal electrode 7 includes one end that is exposed to the corresponding end face 3e. Multiple internal electrodes 7 include internal electrodes 7 exposed to one end face 3e of a pair of end faces 3e and internal electrodes 7 exposed to the other end face 3e of a pair of end faces 3e. The internal electrodes 7 exposed to one end face 3e and the internal electrodes 7 exposed to the other end face 3e are arranged alternately in direction D3. Multiple internal electrodes 7 are arranged in the base body 3 so as to be aligned in direction D3. The internal electrodes 7 are located in a plane substantially parallel to the pair of side surfaces 3c. The internal electrodes 7 are located in a plane substantially perpendicular to the pair of main surfaces 3a and 3b. The direction in which the internal electrodes 7 face each other is perpendicular to the direction parallel to the pair of side surfaces 3c.

[0030] Each internal electrode 7 includes a main electrode portion 7a and a connecting portion 7b. The main electrode portion 7a and the connecting portion 7b are continuous. The main electrode portion 7a and the connecting portion 7b are integrally formed. The main electrode portion 7a faces an adjacent internal electrode 7 in direction D3 among the multiple internal electrodes 7. The main electrode portion 7a faces the main electrode portion 7a included in an adjacent internal electrode 7 in direction D3. The main electrode portions 7a that are adjacent to each other in direction D3 face each other in direction D3. The multilayer capacitor C1 exhibits capacitance between the main electrode portions 7a that are adjacent to each other in direction D3. The connecting portion 7b connects the main electrode portion 7a to the corresponding external electrode 5. The connecting portion 7b is directly connected to the corresponding external electrode 5. The connecting portion 7b electrically connects the main electrode portion 7a to the corresponding external electrode 5. The connecting portion 7b has one end connected to the main electrode portion 7a and a region 3e included in the corresponding end face 3e of the pair of end faces 3e. a The other end of the connection portion 7b is exposed to region 3e. aIt is exposed only to the region 3e of the end face 3e. The other end of the connecting portion 7b is exposed to the region 3e of the end face 3e. a Other regions, i.e., region 3e b and region 3e c It will not be exposed.

[0031] The connecting portion 7b has a width smaller than the width of the main electrode portion 7a in direction D1. The connecting portion 7b is located closer to the main surface 3a when viewed from direction D3. The distance between the main surface 3a and the connecting portion 7b in direction D1 is smaller than the distance between the main surface 3b and the connecting portion 7b. The distance between the main surface 3b and the connecting portion 7b in direction D1 is larger than the distance between the main surface 3b and the main electrode portion 7a in direction D1. The connecting portion 7b is further from the main surface 3b than the main electrode portion 7a in direction D1. The distance between the main surface 3a and the connecting portion 7b in direction D1 is approximately the same as the distance between the main surface 3a and the main electrode portion 7a in direction D1. The distance between the main surface 3a and the connecting portion 7b in direction D1 may be larger than the distance between the main surface 3a and the main electrode portion 7a in direction D1.

[0032] The external electrodes 5 are positioned at both ends of the base body 3 in direction D1, as shown in Figure 1. Each external electrode 5 is positioned on the corresponding end face 3e side of the base body 3. For example, each external electrode 5 is positioned on a pair of main faces 3a, 3b, a pair of side faces 3c, and one end face 3e. The external electrode 5 includes a plurality of electrode portions 5a, 5b, 5c, 5e, as shown in Figures 2 to 4. Electrode portion 5a is positioned on the main face 3a and on the edge portion 3g. Electrode portion 5b is positioned on the main face 3b and on the edge portion 3g. Each electrode portion 5c is positioned on the side face 3c and on the edge portion 3i. Electrode portion 5e is positioned on the end face 3e. The external electrode 5 also includes electrode portions positioned on the edge portion 3j.

[0033] The external electrode 5 is formed on five surfaces: a pair of main surfaces 3a, 3b, one end surface 3e, and a pair of side surfaces 3c, as well as on edges 3g, 3h, 3i, 3j. Adjacent electrode portions 5a, 5b, 5c, 5e are connected and electrically connected. Electrode portion 5e completely covers one end of a corresponding internal electrode 7 among a plurality of internal electrodes 7. That is, electrode portion 5e completely covers the other end of a connecting portion 7b included in the corresponding internal electrode 7. Electrode portion 5e is directly connected to the corresponding internal electrode 7. The external electrode 5 is electrically connected to the corresponding internal electrode 7. The external electrode 5 includes a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4, as also shown in Figures 2 to 4. The fourth electrode layer E4 includes the outermost layer of the external electrode 5. Each electrode section 5a, 5c, 5e includes a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. The electrode section 5b includes a first electrode layer E1, a third electrode layer E3, and a fourth electrode layer E4.

[0034] The first electrode layer E1 of the electrode portion 5a is positioned on the edge portion 3g. The first electrode layer E1 of the electrode portion 5a is formed to cover the entire edge portion 3g. The first electrode layer E1 of the electrode portion 5a is in contact with the entire edge portion 3g. In the electrode portion 5a, the first electrode layer E1 is in direct contact with the base body 3. The main surface 3a is exposed from the first electrode layer E1. The first electrode layer E1 of the electrode portion 5a is located on the edge portion 3g. In the electrode portion 5a, the first electrode layer E1 may be formed on the main surface 3a. The first electrode layer E1 may be positioned on the main surface 3a. A portion of the main surface 3a near the end surface 3e may be covered by the first electrode layer E1. The second electrode layer E2 of the electrode section 5a is positioned on the first electrode layer E1 and on the main surface 3a. In the electrode section 5a, the second electrode layer E2 is formed to cover the first electrode layer E1 and a part of the main surface 3a. In the electrode section 5a, the second electrode layer E2 is in direct contact with the first electrode layer E1 and the main surface 3a. The second electrode layer E2 of the electrode section 5a is formed to cover the first electrode layer E1 of the electrode section 5a. In the electrode section 5a, the second electrode layer E2 indirectly covers the main surface 3a such that the first electrode layer E1 is located between the second electrode layer E2 and the main surface 3a. The second electrode layer E2 of the electrode section 5a is located on the main surface 3a. Each second electrode layer E2 located on the same main surface 3a has an edge E2a e This includes the edge E2a of one of the second electrode layers E2 on the same main surface 3a. e This is the edge E2a of the other second electrode layer E2. e It is facing the other side. The second electrode layer E2 of the electrode portion 5a includes, for example, a first main surface side portion that covers a part of the main surface 3a. The third and fourth electrode layers E3 and E4 of electrode section 5a are arranged on the second electrode layer E2. In electrode section 5a, the third and fourth electrode layers E3 and E4 cover the second electrode layer E2. In electrode section 5a, the third electrode layer E3 is in contact with the second electrode layer E2. In electrode section 5a, the third electrode layer E3 is in direct contact with the second electrode layer E2. In electrode section 5a, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The third and fourth electrode layers E3 and E4 of electrode section 5a are located on the main surface 3a.

[0035] The first electrode layer E1 of electrode portion 5b is positioned on the edge portion 3h. The first electrode layer E1 of electrode portion 5b is formed to cover the entire edge portion 3h. The first electrode layer E1 of electrode portion 5b is in contact with the entire edge portion 3h. In electrode portion 5b, the first electrode layer E1 is in direct contact with the base body 3. The main surface 3b is exposed from the first electrode layer E1. In electrode portion 5a, the first electrode layer E1 is located on the edge portion 3h. In electrode portion 5b, the first electrode layer E1 may be formed on the main surface 3b. The first electrode layer E1 may be positioned on the main surface 3b. A portion of the main surface 3b near the end surface 3e may be covered by the first electrode layer E1. The third and fourth electrode layers E3 and E4 of electrode section 5b are arranged on the first electrode layer E1. In electrode section 5b, the third and fourth electrode layers E3 and E4 cover the first electrode layer E1. In electrode section 5b, the third electrode layer E3 is in contact with the first electrode layer E1. In electrode section 5b, the third electrode layer E3 is in direct contact with the first electrode layer E1. The third and fourth electrode layers E3 and E4 of electrode section 5b are located on the main surface 3b. Electrode section 5b does not include the second electrode layer E2. The main surface 3b is not covered by the second electrode layer E2.

[0036] The first electrode layer E1 of the electrode portion 5c is positioned on the edge portion 3i. The first electrode layer E1 of the electrode portion 5c is formed to cover the entire edge portion 3i. The first electrode layer E1 of the electrode portion 5c is in contact with the entire edge portion 3i. In the electrode portion 5c, the first electrode layer E1 is in direct contact with the base body 3. The side surface 3c is exposed from the first electrode layer E1. The first electrode layer E1 of the electrode portion 5c is located on the edge portion 3i. In the electrode portion 5c, the first electrode layer E1 may be formed on the side surface 3c. The first electrode layer E1 may be positioned on the side surface 3c. A portion of the side surface 3c near the end surface 3e may be covered by the first electrode layer E1. The second electrode layer E2 of the electrode section 5c is positioned on the first electrode layer E1 and on the side surface 3c. In the electrode section 5c, the second electrode layer E2 is formed to cover a portion of the first electrode layer E1 and a portion of the side surface 3c. In the electrode section 5c, the second electrode layer E2 is in direct contact with the aforementioned portion of the first electrode layer E1 and the aforementioned portion of the side surface 3c. The second electrode layer E2 of the electrode section 5c is formed to cover a aforementioned portion of the first electrode layer E1 of the electrode section 5c. The aforementioned portion of the side surface 3c is, for example, a corner region on the side surface 3c near the main surface 3a and the end surface 3e. In the electrode section 5c, the second electrode layer E2 indirectly covers the aforementioned portion of the side surface 3c such that the first electrode layer E1 is positioned between the second electrode layer E2 and the side surface 3c. The first electrode layer E1 of the electrode section 5c is covered by the second electrode layer E2 in part, and exposed from the second electrode layer E2 in the remaining portion. The second electrode layer E2 of the electrode portion 5c is located on the side surface 3c. Each second electrode layer E2 located on the same side surface 3c has an edge E2c e This includes the edge E2c of one of the second electrode layers E2 on the same side surface 3c. eThis is the edge E2c of the other second electrode layer E2. e It is facing the other side. The second electrode layer E2 of the electrode portion 5c includes, for example, a side portion that covers a part of the side surface 3c. The third and fourth electrode layers E3 and E4 of the electrode section 5c are arranged on the first electrode layer E1 and the second electrode layer E2, respectively. In the electrode section 5c, the third and fourth electrode layers E3 and E4 cover the entire second electrode layer E2 and the entire portion of the first electrode layer E1 that is exposed from the second electrode layer E2. In the electrode section 5c, the third electrode layer E3 is in contact with the entire second electrode layer E2 and the entire portion of the first electrode layer E1 that is exposed from the second electrode layer E2. In the electrode section 5c, the third electrode layer E3 is in direct contact with the first electrode layer E1 and the second electrode layer E2. The third and fourth electrode layers E3 and E4 of the electrode section 5c are located on the side surface 3c.

[0037] The first electrode layer E1 of the electrode portion 5e is positioned on the end face 3e. The first electrode layer E1 of the electrode portion 5e is formed to completely cover the end face 3e. The first electrode layer E1 of the electrode portion 5e is in contact with the entire end face 3e. In the electrode portion 5e, the first electrode layer E1 is in direct contact with the end face 3e. The second electrode layer E2 of the electrode portion 5e is positioned on the first electrode layer E1. In the electrode portion 5e, the second electrode layer E2 is formed to cover a portion of the first electrode layer E1. In the electrode portion 5e, the second electrode layer E2 is in direct contact with the aforementioned portion of the first electrode layer E1. The second electrode layer E2 of the electrode portion 5e is formed to cover a portion of the aforementioned portion of the first electrode layer E1 of the electrode portion 5e. In the electrode portion 5e, the second electrode layer E2 is positioned in the region 3e of the end face 3e such that the first electrode layer E1 is located between the second electrode layer E2 and the end face 3e. a It indirectly covers the first electrode layer E1 of the electrode portion 5e, in part, it is covered by the second electrode layer E2, and in the remaining part, it is exposed from the second electrode layer E2. The second electrode layer E2 of the electrode portion 5e is, for example, the region 3e of the end face 3e a It includes one end face portion that covers it. The third and fourth electrode layers E3 and E4 of electrode section 5e are arranged on the first electrode layer E1 and the second electrode layer E2, respectively. In electrode section 5e, the third and fourth electrode layers E3 and E4 cover the entire second electrode layer E2 and the entire portion of the first electrode layer E1 that is exposed from the second electrode layer E2. In electrode section 5e, the third electrode layer E3 is in contact with the entire second electrode layer E2 and the entire portion of the first electrode layer E1 that is exposed from the second electrode layer E2. In electrode section 5e, the third electrode layer E3 is in direct contact with the first electrode layer E1 and the second electrode layer E2. The third and fourth electrode layers E3 and E4 of electrode section 5e are located on the end face 3e.

[0038] The first electrode layer E1 is formed by baking a conductive paste applied to the surface of the base body 3. The first electrode layer E1 is formed to cover one end face 3e and the edges 3g, 3h, 3i, 3j. The first electrode layer E1 is formed by sintering the metal components (metal particles) contained in the conductive paste. The first electrode layer E1 is a sintered metal layer. The first electrode layer E1 is a sintered metal layer formed on the base body 3. For example, the first electrode layer E1 is a sintered metal layer made of Cu. The first electrode layer E1 may be a sintered metal layer made of Ni. The first electrode layer E1 contains a base metal. The conductive paste contains, for example, particles made of Cu or Ni, a glass component, an organic binder, and an organic solvent. The first electrode layers E1 contained in each electrode portion 5a, 5b, 5c, 5e are formed integrally and are continuous with each other.

[0039] The second electrode layer E2 is formed by curing a conductive resin applied to the first electrode layer E1. The second electrode layer E2 is formed across the first electrode layer E1 and the base body 3. The first electrode layer E1 is a base metal layer for forming the second electrode layer E2. The second electrode layer E2 is a conductive resin layer covering the first electrode layer E1. The conductive resin includes, for example, a resin, a conductive material, and an organic solvent. The resin includes, for example, a thermosetting resin. The conductive material includes, for example, metal particles. The metal particles include, for example, silver particles or copper particles. For example, the second electrode layer E2 includes a plurality of silver particles. The thermosetting resin includes, for example, a phenolic resin, an acrylic resin, a silicone resin, an epoxy resin, or a polyimide resin. The second electrode layer E2 is in contact with a portion of the edge portion 3j. The second electrode layer E2 included in each electrode portion 5a, 5c, 5e is integrally formed and continuous with respect to each other.

[0040] The third electrode layer E3 is formed on the second electrode layer E2 and on the first electrode layer E1 (the portion exposed from the second electrode layer E2) by a plating method. The third electrode layer E3 may include, for example, a metal plating layer. The third electrode layer E3 may also include a nickel plating layer. The third electrode layer E3 may contain nickel. The third electrode layer E3 may include, for example, a Ni plating layer. The Ni plating layer is formed on the second electrode layer E2 and on the first electrode layer E1. The Ni plating layer has better solder corrosion resistance than the metal contained in the second electrode layer E2. The third electrode layer E3 may be a Sn plating layer, a Cu plating layer, or an Au plating layer. The third electrode layer E3 covers the second electrode layer E2. The third electrode layer E3 included in each electrode portion 5a, 5b, 5c, 5e is formed integrally and is continuous with respect to each other.

[0041] The fourth electrode layer E4 is formed on the third electrode layer E3 by a plating method. The fourth electrode layer E4 includes, for example, a metal plating layer. The fourth electrode layer E4 may also include a solder plating layer. The solder plating layer may include a tin (Sn) plating layer. The solder plating layer is formed on the Ni plating layer. The solder plating layer covers the Ni plating layer. The fourth electrode layer E4 may contain tin. The fourth electrode layer E4 may be a tin-silver alloy (Sn-Ag) plating layer, a tin-bismuth alloy (Sn-Bi) plating layer, or a tin-copper alloy (Sn-Cu) plating layer. The fourth electrode layer E4 covers the third electrode layer E3. The fourth electrode layer E4 included in each electrode portion 5a, 5b, 5c, 5e is formed integrally and is continuous with respect to each other.

[0042] The third electrode layer E3 and the fourth electrode layer E4 constitute the plating layer formed on the second electrode layer E2. That is, the external electrode 5 includes a plating layer, and the plating layer includes the third electrode layer E3 and the fourth electrode layer E4. The plating layer covers the second electrode layer E2. The plating layer may include another plating layer between the second electrode layer E2 and the third electrode layer E3. The plating layer may also include another plating layer between the third electrode layer E3 and the fourth electrode layer E4. The plating layer may be a single layer.

[0043] In the multilayer capacitor C1, the second electrode layer E2 continuously covers only a portion of the main surface 3a, only a portion of the end surface 3e, and only a portion of each of the pair of side surfaces 3c. The second electrode layer E2 includes a portion that is provided to continuously cover only a portion of the main surface 3a, only a portion of the end surface 3e, and only a portion of each of the pair of side surfaces 3c. The above portion of the end surface 3e is region 3e a The second electrode layer E2 covers the entire ridge 3g, only a portion of ridge 3i, and only a portion of ridge 3j. A portion of the first electrode layer E1 is exposed from the second electrode layer E2.

[0044] In the electrode section 5e, the first electrode layer E1, the second electrode layer E2, the third electrode layer E3, and the fourth electrode layer E4 include the following configurations. The first electrode layer E1 is located in the region 3e of the end face 3e. a ,3e b ,3e cThe first electrode layer E1 covers region 3e a The portion covering region 3e b ,3e c Includes a portion covering the first electrode layer E1, for example, region 3e a If the portion covering the area includes the first part, then region 3e b ,3e c The portion covering it includes the second part. The first electrode layer E1 is region 3e a In the portion covering it, it is connected to the internal electrode 7. Region 3e is included in the first electrode layer E1. a The portion covering it is directly connected to connection part 7b. Region 3e a The covering portion is electrically connected to the main electrode portion 7a through the connection portion 7b. The second electrode layer E2 is located in region 3e, which is included in the first electrode layer E1. a The region 3e covers the portion that covers the first electrode layer E1 and is included in the first electrode layer E1. b ,3e c It is positioned on the end face 3e so as to expose the portion that covers it. The third and fourth electrode layers E3 and E4 are included in region 3e of the first electrode layer E1. b ,3e c It covers the part that covers the first electrode and the second electrode layer E2.

[0045] In the multilayer capacitor C1, the connection portion 7b of the internal electrode 7 is in region 3e of the end face 3e. a It is exposed to region 3e. a It is covered with a first electrode layer E1, and the connection portion 7b of the first electrode layer E1 and the internal electrode 7 are connected to each other. The external electrode 5 includes a second electrode layer E2. The second electrode layer E2 is included in the electrode portion 5e. The second electrode layer E2 included in the electrode portion 5e is in region 3e of the first electrode layer E1. a It is located on the end face 3e so as to cover the portion that covers the second electrode layer E2. The second electrode layer E2 includes a plurality of conductive particles and a resin. The resin contained in the second electrode layer E2 of the electrode portion 5e allows hydrogen to escape from the plating layer (e.g., the third electrode layer E3) to the first electrode layer E1, region 3e. a This prevents hydrogen from moving toward the part covering it. Therefore, hydrogen is prevented from moving toward region 3e of the first electrode layer E1. aIt is difficult for the covering portion to move, and difficult to reach the internal electrode 7. As a result, the multilayer capacitor C1 suppresses a decrease in its characteristics. For example, the multilayer capacitor C1 suppresses a decrease in its insulation resistance.

[0046] The plating layers (for example, the third and fourth electrode layers E3 and E4) are formed by a plating method, as described above. In the plating method, for example, the base body 3 on which the first and second electrode layers E1 and E2 are located is immersed in a plating solution. In this case, the plating solution may penetrate into the base body 3. The plating solution penetrates into the base body 3, for example, from the exposed end of the internal electrode 7 or from the interface between the exposed end and the base body 3. Electronic components into which the plating solution has penetrated the base body 3 may experience degradation of their properties. In contrast, in the multilayer capacitor C1, the second electrode layer E2 included in the electrode portion 5e is in region 3e of the first electrode layer E1. a It is positioned on the end face 3e so as to cover the portion that covers the electrode. Therefore, the second electrode layer E2 is positioned on the penetration path of the plating solution to the exposed end of the internal electrode 7, i.e., to the other end of the connection portion 7b. The second electrode layer E2 inhibits the penetration of the plating solution into the substrate 3. As a result, the multilayer capacitor C1 suppresses the deterioration of its characteristics.

[0047] The second electrode layer E2 contains resin. The second electrode layer E2 has a higher electrical resistance than the first electrode layer E1, which does not contain resin. A multilayer capacitor C1 in which the external electrode 5 includes the second electrode layer E2 may have increased ESR. The plating layer is region 3e of the first electrode layer E1. b ,3e c It covers the part that covers the first electrode layer E1, region 3e b ,3e c The portion covering the electrode is connected to the plating layer without going through the second electrode layer E2. Therefore, the multilayer capacitor C1 forms a current path to the external electrode 5 that does not involve the second electrode layer E2. As a result, the multilayer capacitor C1 suppresses an increase in ESR.

[0048] When a multilayer capacitor C1 is soldered to an electronic device, external forces acting on the capacitor C1 from the electronic device may act on the element 3 through the external electrodes 5. These external forces are transmitted to the external electrodes 5 through the solder fillets formed during soldering. The electronic device includes, for example, a circuit board or electronic components. In the multilayer capacitor C1, the external electrode 5 includes the second electrode layer E2. Therefore, external forces are less likely to act from the external electrode 5 to the element 3. As a result, the multilayer capacitor C1 suppresses the occurrence of cracks in the element 3.

[0049] In the multilayer capacitor C1, a mark M indicating the directionality of the element 3 may be attached to the main surface 3b. In a configuration where the first electrode layer E1 completely covers the end face 3e, region 3e a The location of is difficult to recognize. In a configuration where mark M is attached to the main surface 3b, the surface opposite the surface to which mark M is attached is identified as the main surface 3a. Therefore, the region 3e located closer to the main surface 3a. a The position of the mark can be easily identified. As a result, in the configuration in which the mark M is attached to the main surface 3b, the second electrode layer E2 can be formed in an appropriate position when forming the second electrode layer E2.

[0050] In the multilayer capacitor C1, the first electrode layer E1 may completely cover the end face 3e. In a multilayer capacitor C1 where the first electrode layer E1 completely covers the end face 3e, the first electrode layer E1 protects the end face.

[0051] Next, the configuration of a multilayer capacitor C11 according to one modified example of the first embodiment will be described with reference to Figures 6 to 8. Figure 6 is a diagram showing the cross-sectional configuration of the multilayer capacitor according to this modified example. Figures 7 and 8 are diagrams showing the configuration of the first electrode layer and the second electrode layer. The multilayer capacitor C11 is generally similar to or identical to the multilayer capacitor C1 described above, but differs from the multilayer capacitor C11 in the configuration of its internal electrodes 7. The differences between the multilayer capacitor C11 and the multilayer capacitor C1 will be explained below. In Figure 6, for illustrative purposes, adjacent internal electrodes 7 are intentionally shown offset from each other in directions D1 and D2.

[0052] The internal electrode 7 included in the multilayer capacitor C11 includes a main electrode portion 7a having the following configuration. As shown in Figure 6, the main electrode portion 7a has a shape in which the corner on the other end side, closer to the main surface 3a, is notched. The main electrode portion 7a includes edges 7e1 and 7e2 that face the main surface 3a. Edge 7e1 is located on the other end side of the internal electrode 7. Edge 7e1 faces the region of the main surface 3a covered by the second electrode layer E2 in direction D1. Edge 7e2 faces the region of the main surface 3a exposed from the second electrode layer E2 in direction D1. Edge 7e1 includes an edge region in which the distance from the main surface 3a in direction D1 is greater than the distance from edge 7e2 to the main surface 3a in direction D1. Edge 7e1 may include only the edge region in which the distance from the main surface 3a in direction D1 is greater than the distance from edge 7e2 to the main surface 3a in direction D1. In this case, the distance between edge 7e1 and the main surface 3a in direction D1 is greater than the distance between edge 7e2 and the main surface 3a in direction D1. For example, if edge 7e1 includes the first edge, then edge 7e2 includes the second edge. The main electrode portion 7a includes an electrode portion including edge 7e1 and an electrode portion including edge 7e2. The electrode portion including edge 7e1 includes the other end of the internal electrode 7. The electrode portion including edge 7e2 is located between the electrode portion including edge 7e1 and the connecting portion 7b in direction D2. As shown in Figure 7, when viewing the internal electrode 7 and the second electrode layer E2, which are not electrically connected to each other, from direction D1, the electrode portion including edge 7e1 overlaps with the second electrode layer E2, while the electrode portion including edge 7e2 does not overlap with the second electrode layer E2. The main electrode portion 7a is measured from the reference plane, which includes the end face 3e facing the other end of the internal electrode 7, to the electrode portion including edge 7e2, and the distance from the reference plane to the reference plane to the edge E2a of the second electrode layer E2. e It's greater than the distance to [the destination]. As shown in Figure 8, when the second electrode layer E2 included in the electrode section 5c and the internal electrodes 7 among the multiple internal electrodes 7 that are not electrically connected to the second electrode layer E2 included in the electrode section 5c are viewed from direction D3, the second electrode layer E2 included in the electrode section 5c and the internal electrodes 7 that are not electrically connected to the second electrode layer E2 included in the electrode section 5c do not overlap each other.

[0053] The second electrode layer E2 may be included in the electrode portion 5e and the electrode portion 5a. The second electrode layer E2 included in the electrode portion 5e may be continuous with the second electrode layer E2 included in the electrode portion 5a. The main electrode portion 7a may include the edges 7e1 and 7e2 described above. Edge 7e1 may include an edge region in which the distance from the main surface 3a in direction D1 is greater than the distance from edge 7e2 to the main surface 3a in direction D1. The configuration of the second electrode layer E2, which includes multiple metal particles in the conductive particles, may cause migration to the external electrode 5. Migration is thought to occur, for example, due to the following events: An electric field acts on the metal particles contained in the second electrode layer E2, causing them to ionize. The generated metal ions are attracted to the electric field acting on the external electrode 5 and move away from the second electrode layer E2. The electric field acting on the metal particles includes, for example, the electric field generated between the external electrode 5 and the internal electrode 7, which are not electrically connected to each other. The metal ions moving away from the second electrode layer E2 react with electrons supplied from, for example, the internal electrode 7 or the external electrode 5, and are deposited as metal on the surface of the substrate 3. For example, an electric field tends to be generated between the second electrode layer E2 and the internal electrode 7, which are not electrically connected to each other, as contained in the electrode portion 5a. As described above, this electric field can cause migration. However, a configuration in which the edge 7e1 of the main electrode portion 7a includes an edge region where the distance from the main surface 3a in direction D1 is greater than the distance from the edge 7e2 to the main surface 3a in direction D1 reduces the electric field generated between the second electrode layer E2 and the internal electrode 7, which are not electrically connected to each other, as contained in the electrode portion 5a. Therefore, this configuration suppresses the occurrence of migration.

[0054] The edge 7e1 may include only the edge region described above. The configuration in which the edge 7e1 includes only the aforementioned edge region further reduces the electric field generated between the second electrode layer E2 and the internal electrode 7, which are not electrically connected to each other and are included in the electrode portion 5a. Therefore, this configuration further suppresses the occurrence of migration.

[0055] The distance between edge 7e1 and the main surface 3a in direction D1 does not have to be greater than the distance between edge 7e2 and the main surface 3a in direction D1 over the entire edge 7e1. For example, the distance between edge 7e1 and the main surface 3a in direction D1 may be greater than the distance between edge 7e2 and the main surface 3a in direction D1 over only a portion of edge 7e1. Even if the distance between edge 7e1 and the main surface 3a in direction D1 is greater than the distance between edge 7e2 and the main surface 3a in direction D1 over only a portion of edge 7e1, the electric field generated between the second electrode layer E2 included in the electrode portion 5a and the internal electrode 7 can be reduced.

[0056] The second electrode layer E2 may be included in both the electrode section 5e and the electrode section 5c. When the second electrode layer E2 included in the electrode section 5c and the internal electrode 7 that is not electrically connected to the second electrode layer E2 included in the electrode section 5c are viewed from direction D3, the second electrode layer E2 included in the electrode section 5c and the internal electrode 7 that is not electrically connected to the second electrode layer E2 included in the electrode section 5c do not have to overlap each other. For example, an electric field tends to be generated between the second electrode layer E2 and the internal electrode 7, which are not electrically connected to each other and are included in the electrode section 5c. As mentioned above, this electric field can cause migration. However, when viewed from direction D3, a configuration in which the second electrode layer E2 included in the electrode section 5c and the internal electrode 7, which is not electrically connected to the second electrode layer E2 included in the electrode section 5c, do not overlap each other reduces the electric field generated between the second electrode layer E2 and the internal electrode 7, which are not electrically connected to each other and are included in the electrode section 5c. Therefore, this configuration suppresses the occurrence of migration.

[0057] Next, the configuration of a multilayer capacitor C12 according to another modification of the first embodiment will be described with reference to Figures 9 to 11. Figure 9 is a diagram showing the cross-sectional configuration of the multilayer capacitor according to this modification. Figures 10 and 11 are diagrams showing the configuration of the first electrode layer and the second electrode layer. The multilayer capacitor C12 is generally similar to or the same as the multilayer capacitor C11, but differs from the multilayer capacitor C11 in that it contains multiple conductors 11. The differences between the multilayer capacitor C12 and the multilayer capacitor C11 will be explained below. In Figure 9, for illustrative purposes, adjacent internal electrodes 7 are intentionally shown offset from each other in directions D1 and D2, and adjacent internal electrodes 7 and conductors 11 are intentionally shown offset from each other in directions D1 and D2.

[0058] In this modified example, as shown in Figures 9 and 10, the multilayer capacitor C12 includes a plurality of conductors 11. The plurality of conductors 11 are arranged within the element 3. Each conductor 11 is made of a conductive material commonly used as an internal conductor in multilayer electronic components. The conductive material includes, for example, a base metal. The conductive material includes, for example, nickel (Ni) or copper (Cu). The conductor 11 is constructed as a sintered body of a conductive paste containing the above conductive material. For example, the conductor 11 is made of nickel. The conductor 11 is adjacent to the side surface 3c in direction D3. The conductor 11 is located between the side surface 3c and the outermost internal electrode 7 among the multiple internal electrodes 7, which is located in direction D3. The conductor 11 is adjacent to the second electrode layer E2 included in the electrode section 5c in direction D3. When the second electrode layer E2 included in the electrode section 5c and the conductor 11, which is not electrically connected to the second electrode layer E2 included in the electrode section 5c, are viewed from direction D3, the second electrode layer E2 included in the electrode section 5c and the conductor 11, which is not electrically connected to the second electrode layer E2 included in the electrode section 5c, overlap each other.

[0059] The conductor 11 includes one end exposed to a corresponding end face 3e of a pair of end faces 3e, and the other end located within the element 3 and not exposed to the end face 3e. The conductor 11 includes a main body portion 11a and a connecting portion 11b. The main body portion 11a and the connecting portion 11b are continuous. The main body portion 11a and the connecting portion 11b are integrally formed. The leading element portion 11a faces the main electrode portion 7a included in the internal electrode 7, which is adjacent to the conductor 11 in direction D3. The connecting portion 11b is located on one end side of the conductor 11. The connecting portion 11b is connected to the corresponding external electrode 5 among the multiple external electrodes 5. The connecting portion 11b connects the main body portion 11a and the corresponding external electrode 5. The connecting portion 11b is located in the region 3e included in the corresponding end face 3e. a It includes one end that is exposed to the region 3e. As shown in Figure 11, one end of the connection portion 11b is in region 3e. a It is exposed only to the region 3e of the end face 3e. One end of the connecting portion 11b is exposed to the region 3e of the end face 3e. a Other regions, i.e., region 3e b and region 3e c It is not exposed. One end of the connection portion 11b is completely covered by the electrode portion 5e included in the corresponding external electrode 5. The conductor 11 is directly connected to the corresponding external electrode 5. The conductor 11 is electrically connected to the corresponding external electrode 5.

[0060] If adjacent internal electrodes 7 and conductors 11 in direction D3 are electrically connected to each other, the multilayer capacitor C12 does not need to exhibit capacitance between adjacent internal electrodes 7 and conductors 11 in direction D3. The conductors 11 include dummy conductors that do not contribute to the formation of capacitance. If adjacent internal electrodes 7 and conductors 11 in direction D3 are not electrically connected to each other, the multilayer capacitor C12 may exhibit capacitance between adjacent internal electrodes 7 and conductors 11 in direction D3.

[0061] The connecting portion 11b has a width smaller than the width of the main body portion 11a in direction D1. The connecting portion 11b is located closer to the main surface 3a when viewed from direction D3. In direction D1, the distance between the main surface 3a and the connecting portion 11b is smaller than the distance between the main surface 3b and the connecting portion 11b. In direction D1, the distance between the main surface 3b and the connecting portion 11b is larger than the distance between the main surface 3b and the main body portion 11a in direction D1. In direction D1, the connecting portion 11b is further from the main surface 3b than the main body portion 11a. In direction D1, the distance between the main surface 3a and the connecting portion 11b is approximately the same as the distance between the main surface 3a and the other end portion of the conductor 11 in direction D1. With the plane containing the main surface 3a as the reference plane SP, the length L1 in the direction D1 from the reference plane SP to the edge of the conductor 11 facing the main surface 3b is greater than the length L2 of the second electrode layer E2 included in the electrode portion 5c in the direction D1 from the reference plane SP. The edge of the conductor 11 facing the main surface 3b includes, for example, the edge of the main body portion 11a facing the main surface 3b. The length L1 may be approximately the same as the length L3 in the direction D1 from the reference plane SP to the edge of the internal electrode 7 facing the main surface 3b. The edge of the internal electrode 7 facing the main surface 3b includes, for example, the edge of the main electrode portion 7a facing the main surface 3b.

[0062] The multilayer capacitor C12 is located within the base body 3 and may include a conductor 11 that is adjacent to the second electrode layer E2 included in the electrode portion 5c in direction D3 and is electrically connected to the second electrode layer E2 included in the electrode portion 5c. The configuration including the conductor 11 reduces the electric field generated between the second electrode layer E2 and the internal electrode 7, which are not electrically connected to each other and are included in the electrode portion 5c. Therefore, this configuration suppresses the occurrence of migration. Length L1 may be greater than length L2. A configuration in which length L1 is greater than length L2 ensures that the electric field generated between the second electrode layer E2 and the internal electrode 7, which are contained in the electrode portion 5c and are not electrically connected to each other, is reduced.

[0063] Next, with reference to Figures 12 to 15, the configuration of a multilayer capacitor according to several further modifications of the first embodiment will be described. Figures 12, 13, and 14 are diagrams showing the cross-sectional configuration of the multilayer capacitor according to this modification. Figure 15 is a diagram showing the configuration of the first electrode layer and the second electrode layer. The multilayer capacitor shown in Figure 12 is generally similar to or the same as multilayer capacitor C1, but differs from multilayer capacitor C1 in the configuration of the external electrodes 5. The multilayer capacitor shown in Figure 13 is generally similar to or the same as multilayer capacitor C11, but differs from multilayer capacitor C11 in the configuration of the external electrodes 5. The multilayer capacitor shown in Figure 14 is generally similar to or the same as multilayer capacitor C12, but differs from multilayer capacitor C12 in the configuration of the external electrodes 5. In Figures 12 to 14, for illustrative purposes, adjacent internal electrodes 7 are intentionally offset from each other in directions D1 and D2.

[0064] As shown in Figures 12 to 14, the external electrode 5 does not necessarily include an electrode portion 5b. The external electrode 5 may include only electrode portions 5a, 5c, and 5e. In a configuration where the external electrode 5 does not include an electrode portion 5b, the external electrode 5 continuously covers only a portion of the main surface 3a, only a portion of the end surface 3e, and only a portion of each of the pair of side surfaces 3c. The main surface 3b is entirely exposed from the external electrode 5. On the side surfaces 3c, only the corner regions near the main surface 3a and the end surface 3e are covered by the external electrode 5. As shown in Figure 15, the region 3e of the end surface 3e b It is entirely exposed from the external electrode 5. In electrode section 5e, the first electrode layer E1 is in region 3e a It completely covers region 3e. b It is exposed from the first electrode layer E1. In the electrode portion 5e, the first electrode layer E1 is in region 3e c In region 3e a At least the surrounding area is covered. The first electrode layer E1 is region 3e c It may be completely covered. The first electrode layer E1 is region 3e a The portion covering region 3e cIncluding the portion covering region 3e b It does not include the part that covers it.

[0065] (Second embodiment) The configuration of the multilayer capacitor C13 according to the second embodiment will be described with reference to Figures 16 to 19. Figure 16 is a perspective view of the multilayer capacitor according to the second embodiment. Figures 17 and 18 are diagrams showing the cross-sectional configuration of the multilayer capacitor according to the second embodiment. Figure 19 is a diagram showing the configuration of the first electrode layer and the second electrode layer. Multilayer capacitor C13 is generally similar to or identical to multilayer capacitor C1, but differs from multilayer capacitor C1 in the configuration of its external electrodes 5 and internal electrodes 7. The following will mainly explain the differences between multilayer capacitor C13 and multilayer capacitor C1. In Figure 16, for illustrative purposes, adjacent internal electrodes 7 are intentionally shown offset from each other in directions D1 and D2.

[0066] As shown in Figures 16 to 19, the multilayer capacitor C13, like the multilayer capacitor C1, includes a rectangular parallelepiped body 3, a pair of external electrodes 5, and a plurality of internal electrodes 7. In the multilayer capacitor C13, either the main surface 3a or the main surface 3b faces the electronic device. The main surface 3a or the main surface 3b is arranged to constitute the mounting surface. The main surface 3a or the main surface 3b is the mounting surface. For example, if the main surface 3a includes the first main surface, then the main surface 3b includes the second main surface.

[0067] Each internal electrode 7 includes a main electrode portion 7a, a connecting portion 7b, and a connecting portion 7c. The main electrode portion 7a, the connecting portion 7b, and the connecting portion 7c are continuous. The main electrode portion 7a, the connecting portion 7b, and the connecting portion 7c are integrally formed. The connecting portion 7c connects the main electrode portion 7a to the corresponding external electrode 5. The connecting portion 7c is directly connected to the corresponding external electrode 5. The connecting portion 7c electrically connects the main electrode portion 7a to the corresponding external electrode 5. The connecting portion 7c has one end connected to the main electrode portion 7a and a region 3e included in the corresponding end face 3e of the pair of end faces 3e. b The other end of the connection portion 7c is exposed to region 3e.b is only exposed. The other end of the connection portion 7c is in the end face 3e, in the region 3e b other than the region, that is, the region 3e a and the region 3e c is not exposed. The internal electrode 7 is not exposed in the region 3e c is not exposed.

[0068] The connection portion 7c has a width smaller than the width of the main electrode portion 7a in the direction D1. The connection portion 7c is located closer to the main surface 3b when viewed from the direction D3. The distance between the main surface 3b and the connection portion 7c in the direction D1 is smaller than the distance between the main surface 3a and the connection portion 7c. The distance between the main surface 3a and the connection portion 7c in the direction D1 is larger than the distance between the main surface 3a and the main electrode portion 7a in the direction D1. The connection portion 7c is farther from the main surface 3a than the main electrode portion 7a in the direction D1. The distance between the main surface 3b and the connection portion 7c in the direction D1 is substantially the same as the distance between the main surface 3b and the main electrode portion 7a in the direction D1. The distance between the main surface 3b and the connection portion 7c in the direction D1 may be larger than the distance between the main surface 3b and the main electrode portion 7a in the direction D1.

[0069] The electrode portion 5b includes a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. The second electrode layer E2 of the electrode portion 5b is disposed on the first electrode layer E1 and on the main surface 3b. In the electrode portion 5b, the second electrode layer E2 is formed so as to cover a part of the first electrode layer E1 and the main surface 3b. In the electrode portion 5b, the second electrode layer E2 is in direct contact with the first electrode layer E1 and the main surface 3b. The second electrode layer E2 of the electrode portion 5b is formed so as to cover the first electrode layer E1 of the electrode portion 5b. In the electrode portion 5b, the second electrode layer E2 indirectly covers the main surface 3b such that the first electrode layer E1 is located between the second electrode layer E2 and the main surface 3b. The second electrode layer E2 of the electrode portion 5b is located on the main surface 3b. Each second electrode layer E2 located on the same main surface 3b includes an edge E2b e including. On the same main surface 3b, the edge E2b of one second electrode layer E2 e is opposed to the edge E2b of the other second electrode layer E2 e is opposed. The second electrode layer E2 of the electrode portion 5b includes, for example, a second main surface side portion covering a part of the main surface 3b. The third and fourth electrode layers E3 and E4 of electrode section 5b are arranged on the second electrode layer E2. In electrode section 5b, the third and fourth electrode layers E3 and E4 cover the second electrode layer E2. In electrode section 5b, the third electrode layer E3 is in contact with the second electrode layer E2. In electrode section 5b, the third electrode layer E3 is in direct contact with the second electrode layer E2. In electrode section 5b, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The third and fourth electrode layers E3 and E4 of electrode section 5b are located on the main surface 3b.

[0070] The second electrode layer E2 of the electrode portion 5c is formed to cover another portion of the first electrode layer E1 and another portion of the side surface 3c. In the electrode portion 5c, the second electrode layer E2 is in direct contact with the aforementioned other portion of the first electrode layer E1 and the aforementioned other portion of the side surface 3c. The second electrode layer E2 of the electrode portion 5c is formed to cover the aforementioned other portion of the first electrode layer E1 of the electrode portion 5c. The aforementioned other portion of the side surface 3c is, for example, a corner region on the side surface 3c near the main surface 3b and the end surface 3e. In the electrode portion 5c, the second electrode layer E2 indirectly covers the aforementioned other portion of the side surface 3c such that the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3c. The first electrode layer E1 of the electrode portion 5c is covered by the second electrode layer E2 in the aforementioned portion and the aforementioned other portion, and is exposed from the second electrode layer E2 in the remaining portion excluding the aforementioned portion and the aforementioned other portion.

[0071] The second electrode layer E2 of the electrode portion 5e is formed to cover another part of the first electrode layer E1. In the electrode portion 5e, the second electrode layer E2 is in direct contact with the aforementioned other part of the first electrode layer E1. The second electrode layer E2 of the electrode portion 5e is formed to cover the aforementioned other part of the first electrode layer E1 of the electrode portion 5e. In the electrode portion 5e, the second electrode layer E2 is positioned between the second electrode layer E2 and the end face 3e in the region 3e of the end face 3e. b It indirectly covers the first electrode layer E1 of the electrode portion 5e. The first electrode layer E1 of the electrode portion 5e is covered by the second electrode layer E2 in part and another part, and is exposed from the second electrode layer E2 in the remaining part excluding the part and another part. The second electrode layer E2 of the electrode portion 5e is, for example, the region 3e of the end face 3e b Includes another end face portion that covers it.

[0072] In the multilayer capacitor C13, the second electrode layer E2 continuously covers only a portion of the main surface 3a, only a portion of the end surface 3e, and only a portion of each of the pair of side surfaces 3c, while continuously covering only a portion of the main surface 3b, only another portion of the end surface 3e, and only another portion of each of the pair of side surfaces 3c. The second electrode layer E2 includes a first portion provided to continuously cover only a portion of the main surface 3a, only a portion of the end surface 3e, and only a portion of each of the pair of side surfaces 3c, and a second portion provided to continuously cover only a portion of the main surface 3b, only another portion of the end surface 3e, and only another portion of each of the pair of side surfaces 3c. The above portion of the end surface 3e is region 3e b The second electrode layer E2 covers the entire ridge 3g, only a portion of ridge 3i, and only a portion of ridge 3j, as well as the entire ridge 3h, only another portion of ridge 3i, and only another portion of ridge 3j.

[0073] In the electrode section 5e, the first electrode layer E1, the second electrode layer E2, the third electrode layer E3, and the fourth electrode layer E4 include the following configurations. The first electrode layer E1 is located in the region 3e of the end face 3e. a ,3e b ,3e c The first electrode layer E1 covers region 3e a The portion covering region 3e b The portion covering region 3e c The portion covering and including. Region 3e c The area covering region 3e a It is closer to the main surface 3b than the part covering it. Region 3e c The area covering region 3e b It is closer to the main surface 3a than the part covering it. In the first electrode layer E1, for example, region 3e a If the portion covering the area includes the first part, then region 3e b The portion covering it includes the third part, region 3e c The covering portion includes the second and fourth parts. In the multilayer capacitor C13, region 3e c The second and fourth parts, which are included in the covering portion, are continuous. The first electrode layer E1 is region 3e a The portion covering region 3eb The portion covering it is connected to the internal electrode 7. Region 3e is included in the first electrode layer E1. b The portion covering it is directly connected to connection part 7c. Region 3e b The covering portion is electrically connected to the main electrode portion 7a through the connection portion 7c. The second electrode layer E2 is located in region 3e, which is included in the first electrode layer E1. a The portion covering region 3e b The region 3e covers the portion that covers the first electrode layer E1 and is included in the first electrode layer E1. c It is positioned on the end face 3e so as to expose the portion that covers it. The third and fourth electrode layers E3 and E4 are included in region 3e of the first electrode layer E1. c It covers the part that covers the first electrode and the second electrode layer E2.

[0074] In the multilayer capacitor C13, the connection portion 7c of the internal electrode 7 is in region 3e of the end face 3e. b It is exposed to region 3e. b It is covered with a first electrode layer E1, and the first electrode layer E1 and the connection portion 7c of the internal electrode 7 are connected to each other. The external electrode 5 includes a second electrode layer E2. The second electrode layer E2 is included in the electrode portion 5e. The second electrode layer E2 included in the electrode portion 5e is in region 3e of the first electrode layer E1. b It is located on the end face 3e so as to cover the portion that covers the electrode portion 5e. The resin contained in the second electrode layer E2 of the electrode portion 5e allows hydrogen to travel from the plating layer (for example, the third electrode layer E3) to the first electrode layer E1, region 3e b This prevents hydrogen from moving toward the part covering it. Therefore, hydrogen is prevented from moving toward region 3e of the first electrode layer E1. b It is difficult for the covering portion to move and difficult to reach the internal electrode 7. As a result, the multilayer capacitor C13 suppresses a decrease in its characteristics. For example, the multilayer capacitor C13 suppresses a decrease in its insulation resistance.

[0075] In the multilayer capacitor C13, the second electrode layer E2 included in the electrode portion 5e is in region 3e of the first electrode layer E1. bIt is positioned on the end face 3e so as to cover the portion that covers the electrode. Therefore, the second electrode layer E2 is positioned on the penetration path of the plating solution to the exposed end of the internal electrode 7, i.e., to the other end of the connection portion 7c. The second electrode layer E2 inhibits the penetration of the plating solution into the substrate 3. As a result, the multilayer capacitor C13 suppresses the deterioration of its characteristics.

[0076] The plating layer is region 3e of the first electrode layer E1. c It covers the part that covers the first electrode layer E1, region 3e c The portion covering the electrode is connected to the plating layer without going through the second electrode layer E2. Therefore, the multilayer capacitor C13 forms a current path to the external electrode 5 that does not involve the second electrode layer E2. As a result, the multilayer capacitor C13 suppresses an increase in ESR.

[0077] The multilayer capacitor C13 can be mounted in electronic equipment with either its main surface 3a as the mounting surface or its main surface 3b as the mounting surface. Therefore, the multilayer capacitor C13 does not have a specific orientation when mounting, improving the ease of mounting.

[0078] Next, the configuration of the multilayer capacitor C14 according to one modification of the second embodiment will be described with reference to Figures 20 and 21. Figure 20 is a diagram showing the cross-sectional configuration of the multilayer capacitor according to this modification. Figure 21 is a diagram showing the configuration of the second electrode layer. The multilayer capacitor C14 is generally similar to or the same as the multilayer capacitor C13, but the multilayer capacitor C14 differs from the multilayer capacitor C13 in terms of the configuration of the external electrodes 5. The differences between the multilayer capacitor C14 and the multilayer capacitor C13 will be mainly described below. In Figure 20, for illustrative purposes, adjacent internal electrodes 7 are intentionally shown offset from each other in directions D1 and D2.

[0079] The external electrode 5 is divided into two parts: one located closer to the main surface 3a and the other closer to the main surface 3b. The parts closer to the main surface 3a and the parts closer to the main surface 3b are spaced apart in direction D1. The base body 3 is exposed from the external electrode 5 between the parts closer to the main surface 3a and the parts closer to the main surface 3b. area 3e c The area covering region 3e a The portion that covers the area and the portion that is continuous with the area 3e b It is divided into two parts: a part that is continuous with the part that covers it, and a part that is continuous with the area. Region 3e a The portion that covers the area and the portion that is continuous with the area 3e b The portion that covers the region is separated from the portion that is continuous with it in direction D1. The end face 3e is region 3e a The portion that covers the area and the portion that is continuous with the area 3e b The portion that covers the external electrode 5 is exposed between the continuous portion and the end face 3e. The end face 3e includes the region exposed from the external electrode 5.

[0080] In this specification, when an element is described as being placed on another element, that element may be placed directly on the other element or indirectly on it. If an element is placed indirectly on another element, an intervening element exists between the two elements. If an element is placed directly on another element, no intervening element exists between the two elements. In this specification, when an element is described as being located on another element, that element may be located directly on the other element or indirectly on the other element. If an element is located indirectly on another element, an intervening element exists between the two elements. If an element is located directly on another element, no intervening element exists between the two elements. In this specification, when an element is described as covering another element, that element may directly cover the other element or indirectly cover it. If an element indirectly covers another element, an intervening element exists between the two elements. If an element directly covers another element, no intervening element exists between the two elements.

[0081] While embodiments of the present invention have been described above, the present invention is not necessarily limited to the embodiments described above, and various modifications are possible without departing from the spirit of the invention.

[0082] In each of the multilayer capacitors C13 and C14, the main electrode portion 7a may have a shape in which the corners on the other end side, closer to the main surface 3a and closer to the main surface 3b, are notched. In this case, each of the multilayer capacitors C13 and C14 suppresses migration, just like the multilayer capacitor C11. Each multilayer capacitor C13 and C14 may contain multiple conductors 11. In this case, each multilayer capacitor C13 and C14, like the multilayer capacitor C12, suppresses migration.

[0083] In the embodiments and modifications described above, multilayer capacitors were used as examples of electronic components, but the applicable electronic components are not limited to multilayer capacitors. Applicable electronic components include, for example, multilayer electronic components such as multilayer inductors, multilayer varistors, multilayer piezoelectric actuators, multilayer thermistors, multilayer solid-state battery components, or multilayer composite components, or electronic components other than multilayer electronic components.

[0084] As can be seen from the above-described embodiments and modifications, this specification includes the following embodiments. (Note 1) A base body having a rectangular parallelepiped shape, comprising a first principal face and a second principal face facing each other in the first direction, a pair of end faces facing each other in the second direction, and a pair of side faces facing each other in the third direction, Multiple external electrodes are arranged at both ends of the base body in the second direction, and each electrode includes a sintered metal layer, a conductive resin layer, and a plating layer, respectively. Multiple internal electrodes are arranged within the body facing each other in the third direction and connected to a corresponding external electrode among the multiple external electrodes, Each of the aforementioned plurality of internal electrodes is Among the plurality of internal electrodes, the main electrode portion facing the adjacent internal electrode in the third direction, In the first direction, it includes a connecting portion having a width smaller than the width of the main electrode portion, exposed in a portion of the end face located near the first main surface, and connecting the main electrode portion and the corresponding external electrode, The sintered metal layer is The first portion covers the aforementioned portion of the end face and is connected to the connecting portion, The end face includes a second portion that covers at least a portion of the area located closer to the second main surface than the portion of the area, The conductive resin layer includes one end face portion located on the end face so as to cover the first portion and expose the second portion, The aforementioned plating layer covers the second portion and the first end face portion of the electronic component. (Note 2) The sintered metal layer covers the entire end face of the electronic component as described in Appendix 1. (Note 3) Each of the plurality of internal electrodes has a width smaller than the width of the main electrode portion in the first direction, is exposed to another portion of the end face located closer to the second main surface, and includes another connecting portion that connects the main electrode portion and the corresponding external electrode. The sintered metal layer is A third portion that covers another part of the end face and is connected to the other connecting portion, A fourth portion of the end face, which covers at least a portion of the area located closer to the first main surface than the other portion of the area, The conductive resin layer includes another end face portion located on the end face so as to cover the third portion and expose the fourth portion, The aforementioned plating layer further covers the fourth portion and the other end face portion, as described in Appendix 1 of the electronic component. (Note 4) The second part and the fourth part are continuous, The end face is entirely covered by the external electrode, as described in Appendix 3. (Note 5) The second part and the fourth part are separated, The end face is an electronic component as described in Appendix 3, exposed from the external electrode between the second portion and the fourth portion. (Note 6) The conductive resin layer is continuous with the one end face portion and includes a first main surface portion that covers a part of the first main surface. The main electrode portion includes a first edge of the first main surface that faces in the first direction the region covered by the first main surface side portion, and a second edge of the first main surface that faces in the first direction the region exposed from the conductive resin layer. The electronic component according to any one of the appendices 1 to 5, wherein the first edge includes an edge region in which the distance from the first main surface in the first direction is greater than the distance from the second edge to the first main surface in the first direction. (Note 7) The aforementioned first edge is an electronic component as described in Appendix 6, which includes only the edge region. (Note 8) The conductive resin layer is continuous with the one end face portion and includes a side portion that covers a part of the side surface. The electronic component according to any one of the appendices 1 to 7, further comprising a dummy conductor disposed within the substrate, adjacent to the side portion in the third direction, and electrically connected to the side portion. (Note 9) The electronic component as described in Appendix 8, wherein the plane including the first principal surface is used as a reference plane, and the length in the first direction from the reference plane to the edge of the dummy conductor facing the second principal surface is greater than the length of the side portion from the reference plane in the first direction. (Note 10) The conductive resin layer is continuous with the one end face portion and includes a side portion that covers a part of the side surface. An electronic component as described in any one of the appendices 1 to 9, wherein when the side portion and the internal electrodes among the plurality of internal electrodes that are not electrically connected to the side portion are viewed from the third direction, the side portion and the internal electrodes that are not electrically connected to the side portion do not overlap each other. [Explanation of Symbols]

[0085] 3...Body, 3a, 3b...Main surface, 3c...Side surface, 3e...End surface, 3e a ,3e b ,3e c ...end face region, 5...external electrode, 5a, 5b, 5c, 5e...electrode portion, 7...internal electrode, 7a...main electrode portion, 7b, 7c...connection portion, 7e1, 7e2...edge included in the main electrode portion, 11...conductor, C1, C11, C12, C13, C14...multilayer capacitor, D1, D2, D3...direction, E1...first electrode layer, E2...second electrode layer, E3...third electrode layer, SP...reference plane.

Claims

1. A base body having a rectangular parallelepiped shape, comprising a first principal face and a second principal face facing each other in the first direction, a pair of end faces facing each other in the second direction, and a pair of side faces facing each other in the third direction, Multiple external electrodes are arranged at both ends of the base body in the second direction, and each electrode includes a sintered metal layer, a conductive resin layer, and a plating layer, respectively. Multiple internal electrodes are arranged within the body facing each other in the third direction and connected to a corresponding external electrode among the multiple external electrodes, Each of the aforementioned plurality of internal electrodes is Among the plurality of internal electrodes, the main electrode portion facing the adjacent internal electrode in the third direction, In the first direction, it includes a connecting portion having a width smaller than the width of the main electrode portion, exposed in a portion of the end face located near the first main surface, and connecting the main electrode portion and the corresponding external electrode, The sintered metal layer is The first portion covers the aforementioned portion of the end face and is connected to the connecting portion, The end face includes a second portion that covers at least a portion of the area located closer to the second main surface than the portion of the area, The conductive resin layer includes one end face portion located on the end face so as to cover the first portion and expose the second portion, The aforementioned plating layer covers the second portion and the first end face portion of the electronic component.

2. The sintered metal layer covers the entire end face, as described in claim 1.

3. Each of the plurality of internal electrodes has a width smaller than the width of the main electrode portion in the first direction, is exposed to another portion of the end face located closer to the second main surface, and includes another connecting portion that connects the main electrode portion and the corresponding external electrode. The sintered metal layer is A third portion that covers another part of the end face and is connected to the other connecting portion, A fourth portion of the end face, which covers at least a portion of the area located closer to the first main surface than the other portion of the area, The conductive resin layer includes another end face portion located on the end face so as to cover the third portion and expose the fourth portion, The electronic component according to claim 1, wherein the plating layer further covers the fourth portion and the other end face portion.

4. The second part and the fourth part are continuous, The end face is entirely covered by the external electrode, as described in claim 3.

5. The second part and the fourth part are separated, The end face is exposed from the external electrode between the second portion and the fourth portion, as described in claim 3.

6. The conductive resin layer is continuous with the one end face portion and includes a first main surface portion that covers a part of the first main surface. The main electrode portion includes a first edge of the first main surface that faces in the first direction the region covered by the first main surface side portion, and a second edge of the first main surface that faces in the first direction the region exposed from the conductive resin layer. The electronic component according to claim 1, wherein the first edge includes an edge region in which the distance from the first main surface in the first direction is greater than the distance from the second edge to the first main surface in the first direction.

7. The electronic component according to claim 6, wherein the first edge includes only the edge region.

8. The conductive resin layer is continuous with the one end face portion and includes a side portion that covers a part of the side surface. The electronic component according to claim 1, further comprising a dummy conductor disposed within the substrate, adjacent to the side portion in the third direction, and electrically connected to the side portion.

9. The electronic component according to claim 8, wherein, with the surface including the first principal surface as the reference surface, the length in the first direction from the reference surface to the edge of the dummy conductor facing the second principal surface is greater than the length of the side portion from the reference surface in the first direction.

10. The conductive resin layer is continuous with the one end face portion and includes a side portion that covers a part of the side surface. The electronic component according to claim 1, wherein when the side portion and the internal electrodes among the plurality of internal electrodes that are not electrically connected to the side portion are viewed from the third direction, the side portion and the internal electrodes that are not electrically connected to the side portion do not overlap each other.

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