Dual IC card and method for manufacturing the same

Abstract

The present invention provides a dual IC card and a method for manufacturing the same that can stabilize the electrical connection between conductive wires and connection terminals. [Solution] The dual IC card 100 comprises a plate-shaped card base material 1 having a housing recess 8 formed on a first main surface 1a, an IC module 3 having an IC chip 34 and a substrate 31 having contact-type and contactless communication functions, and an antenna 2 provided on the card base material 1 and having a conductive wire 7. The conductive wire 7 is embedded in the card base material 1 with an exposed surface 7a that is exposed to the bottom surface 21a of the housing recess 8. At least a portion of the IC module 3 is housed in the housing recess 8. The connection terminal 33 is electrically connected to the exposed surface 7a of the conductive wire 7. The conductive wire 7 has a side perpendicular to the bottom surface 21a.

Description

Technical Field

[0001] The present invention relates to a dual IC card and a method for manufacturing the same.

Background Art

[0002] Dual IC cards are used in financial cards such as credit cards and public cards such as my number cards. A dual IC card includes an IC module provided with an IC chip having contact and non-contact communication functions, and an antenna enabling non-contact communication (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the above-described dual IC card, the electrical connection between the conductive wire of the antenna and the connection terminal of the IC module may become unstable.

[0005] One aspect of the present invention aims to provide a dual IC card and a method for manufacturing the same that can stabilize the electrical connection between the conductive wire of the antenna and the connection terminal of the IC module.

Means for Solving the Problems

[0006] A dual IC card according to a first aspect of the present invention comprises a plate-shaped card substrate having a housing recess formed on a first main surface, an IC module having an IC chip having contact-type and contactless communication functions, and a substrate having connection terminals connected to the IC chip, and an antenna provided on the card substrate and having a conductive wire, wherein the conductive wire is embedded in the card substrate with an exposed surface exposed to the bottom surface of the housing recess, at least a portion of the IC module is housed in the housing recess, the connection terminal is electrically connected to the exposed surface of the conductive wire, and the conductive wire has a side surface perpendicular to the bottom surface.

[0007] A second aspect of the present invention is the dual IC card of the first aspect, wherein a plurality of conductive wires are formed side by side on the bottom surface, and adjacent conductive wires are close to each other.

[0008] A third aspect of the present invention is a dual IC card according to the first or second aspect, wherein the conductive wire has a side surface perpendicular to the bottom surface in the portion that is connected to the connection terminal.

[0009] A method for manufacturing a dual IC card according to a fourth aspect of the present invention is a method for manufacturing a dual IC card comprising an IC module having an IC chip having contact-type and contactless communication functions and a substrate having connection terminals connected to the IC chip, comprising: an arrangement step of arranging an antenna having conductive wires on a first main surface of a sheet-like substrate; a cutting step of forming a housing recess by cutting the substrate and exposing an exposed surface which is the cut surface of the conductive wires on the bottom surface of the housing recess; and a connection step of arranging the IC module in the housing recess and electrically connecting the connection terminals and the cut surface, wherein the conductive wires have sides perpendicular to the bottom surface. [Effects of the Invention]

[0010] According to one aspect of the present invention, a dual IC card and a method for manufacturing the same can be provided, which can stabilize the electrical connection between the conductive wires of an antenna and the connection terminals of an IC module. [Brief explanation of the drawing]

[0011] [Figure 1] This is a cross-sectional view of a dual IC card according to the embodiment. [Figure 2] This is a plan view of the antenna of the dual IC card according to the embodiment. [Figure 3] This is a process diagram showing a method for manufacturing a dual IC card according to an embodiment. [Figure 4] This is a process diagram showing a method for manufacturing a dual IC card according to an embodiment. [Figure 5] This is a process diagram showing a method for manufacturing a dual IC card according to an embodiment. [Figure 6] This is a process diagram showing a method for manufacturing a dual IC card according to an embodiment. [Figure 7] This is a process diagram showing a method for manufacturing a dual IC card according to an embodiment. [Figure 8] This is a process diagram showing a method for manufacturing a dual IC card according to an embodiment. [Figure 9] This is a process diagram showing a method for manufacturing a dual IC card according to an embodiment. [Modes for carrying out the invention]

[0012] The dual IC card and its manufacturing method according to the embodiment will be described in detail below with reference to the drawings.

[0013] [Dual IC Card] Figure 1 is a cross-sectional view of the dual IC card 100 according to an embodiment. Figure 2 is a plan view of the antenna 2. In the following description, the vertical positional relationship will be tentatively defined according to Figure 1. The vertical direction in Figure 1 is the thickness direction (height direction) of the card substrate 1. The plan view is a view from the thickness direction of the card substrate 1.

[0014] As shown in Figure 1, the dual IC card 100 comprises a card substrate 1, an antenna 2, and an IC module 3. The card base material 1 is formed in a plate shape. The card base material 1 is formed of a resin or the like. The card base material 1 is, for example, rectangular in a plan view. The card base material 1 includes a main base material 4, a first surface layer 5, and a second surface layer 6.

[0015] The main base material 4 is formed in a plate shape. The main base material 4 is formed of a thermoplastic resin such as, for example, polyvinyl chloride (PVC), glycol-modified polyethylene terephthalate (PETG), or polycarbonate (PC).

[0016] The first surface layer 5 is formed on one surface (the first main surface 4a) of the main base material 4. The second surface layer 6 is formed on the second main surface 4b of the main base material 4, which is opposite to the first main surface 4a. The first surface layer 5 and the second surface layer 6 can be collectively referred to as the surface layers 5, 6. The surface layers 5, 6 are formed transparently. The surface layers 5, 6 are formed of a thermoplastic resin such as, for example, PETG or PC.

[0017] The surface layers 5, 6 have, for example, a display layer (not shown) formed by printing or the like. The display layer can represent, for example, characters, symbols, figures, patterns, colors, or a combination of two or more of these.

[0018] A housing recess 8 is formed on the first main surface 1a (upper surface) of the card base material 1. The housing recess 8 is a recess having a two-stage structure including a first recess 21 and a second recess 22. The first recess 21 is located at a position overlapping at least a part of the antenna 2 in a plan view. In the present embodiment, the first recess 21 is located at a position overlapping the first and second extending portions 7A, 7B in a plan view. The shape of the first recess 21 in a plan view may be, for example, a shape corresponding to the antenna 2. The first recess 21 may be, for example, rectangular.

[0019] The formation of the first recess 21 cuts off a portion of the conductive wire 7 (extended portions 7A, 7B), exposing the metal wire on the cut surface 7a. The cut surface 7a of the conductive wire 7 is an exposed surface that is flush with the bottom surface 21a. The conductive wire 7 (extended portions 7A, 7B) formed in the first recess 21 has a smaller height dimension compared to the other conductive wire 7 (extended portion 7C). The cut surface 7a of the conductive wire 7 becomes a connection portion 23 that connects to the IC module 3. Multiple conductive wires 7 (extended portions 7A, 7B) are formed side by side on the bottom surface 21a. The bottom surface 21a is parallel to the first main surface 1a.

[0020] The second recess 22 is formed on the bottom surface 21a of the first recess 21. In a plan view, the area of ​​the second recess 22 is smaller than that of the first recess 21. In a plan view, the second recess 22 is located inward relative to the periphery of the first recess 21. The bottom surface 22a of the second recess 22 is located lower than the conductive wire 7. For example, in a plan view, the second recess 22 is located in a position that overlaps with a part of the first extension portion 7A.

[0021] Antenna 2 is formed by conductive wires 7. Conductive wires 7 may be, for example, metal wires, or coated wires in which a metal wire is coated with an insulating coating. The metal wires may be made of metals such as copper, copper alloys, aluminum, or aluminum alloys.

[0022] As shown in Figure 2, the antenna 2 has, for example, a conductive wire 7 that is serpentine (meander shape). In this embodiment, the conductive wire 7 has a first extension portion 7A, a second extension portion 7B, and a third extension portion 7C. The first to third extension portions 7A, 7B, and 7C are formed in straight lines parallel to each other. The antenna 2 is shaped like a meander by alternately connecting one end and the other end of adjacent extension portions.

[0023] The first extension portion 7A is the innermost extension portion among the first to third extension portions 7A, 7B, and 7C. The second extension portion 7B is positioned adjacent to the first extension portion 7A. The third extension portion 7C is positioned adjacent to the second extension portion 7B. The first extension portion 7A, the second extension portion 7B, and the third extension portion 7C are aligned in the radial direction (width direction) from the inside to the outside of the antenna 2. Two adjacent extension portions among the first to third extension portions 7A, 7B, and 7C may be touching each other or may be spaced apart.

[0024] The width W of the conductive wire 7 (extended portions 7A, 7B, 7C) can be, for example, 0.05 mm to 0.3 mm. The pitch P of the multiple conductive wires 7 can be, for example, 0.2 mm to 0.5 mm.

[0025] It is desirable that adjacent conductive wires 7 (extended portions 7A, 7B, 7C) be in close proximity to each other. For example, the distance D between two adjacent conductive wires 7 can be, for example, 0.3 mm or less. The distance D between adjacent conductive wires 7 can be, for example, three times the width W or less. When adjacent conductive wires 7 are in close proximity to each other, inclination of the conductive wires 7 (inclination around the axis of the conductive wire 7) becomes less likely.

[0026] The spacing D between two adjacent conductive wires 7 can be, for example, 0.05 mm or more. The spacing D between adjacent conductive wires 7 can be, for example, 0.5 times the width W or more.

[0027] As shown in Figure 1, one and the other side surfaces 7b of the conductive wire 7 of the antenna 2 are perpendicular to the bottom surface 21a of the housing recess 8. A side surface 7b can be considered perpendicular to the bottom surface 21a if it is within a range of 90°±20° (preferably 90°±10°) relative to the bottom surface 21a. It is desirable that both side surfaces 7b of the conductive wire 7, at least the portion connected to the connection terminal 33, are perpendicular to the bottom surface 21a of the housing recess 8. The side surfaces 7b are formed flat. The portion connected to the connection terminal 33 is the portion that overlaps with the connection terminal 33 in a plan view.

[0028] The conductive wire 7 has sides 7b on one and the other that intersect with the bottom surface 21a of the housing recess 8. At least the side 7b of the length portion of the conductive wire 7 that is connected to the connection terminal 33 (see Figure 2) intersects with the bottom surface 21a of the housing recess 8.

[0029] The cross-sectional shape of the conductive wire 7 (the shape of the cross-section perpendicular to the length direction) is preferably such that two sides 7b are parallel to each other (a pair of opposite sides are parallel to each other). In particular, the cross-sectional shape of the conductive wire 7 is preferably a parallelogram (a pair of opposite sides are parallel to each other). If the inclination angle of one opposite side to the other is within the range of 0°±10, these opposite sides can be considered parallel to each other.

[0030] If the cross-sectional shape of the conductive wire 7 (the shape of the cross-section perpendicular to the length direction) is a parallelogram, it is desirable to arrange adjacent conductive wires 7 such that their side surfaces 7b are parallel to each other. For example, if the opposite side surfaces 7b of adjacent conductive wires 7 (extended portions 7A, 7B) are parallel to each other, inclination of the conductive wire 7 (inclination around the axis of the conductive wire 7) becomes less likely. Therefore, the side surfaces 7b tend to be perpendicular to the bottom surface 21a of the housing recess 8.

[0031] The cross-sectional shape of the conductive wire 7 (the shape of the cross-section perpendicular to the length direction) is, for example, rectangular. The cross-sectional shape of at least the portion of the conductive wire 7 that is connected to the connection terminal 33 is rectangular. This cross-section has two side surfaces 7b perpendicular to the first main surface 4a, an upper surface (cut surface 7a) parallel to the first main surface 4a, and a lower surface parallel to the first main surface 4a.

[0032] The IC module 3 is located inside a housing recess 8 formed in the card substrate 1. The IC module 3 has both contact-type and contactless communication functions. The IC module 3 comprises a substrate 31 and an IC chip section 32.

[0033] A connection terminal 33 is formed on the opposing surface 31a of the substrate 31. The connection terminal 33 is electrically connected to the antenna 2. The substrate 31 is an insulating substrate made of, for example, resin, fiber-reinforced resin, etc. The opposing surface 31a (bottom surface) of the substrate 31 is formed flat. At least a portion of the connection terminal 33 is formed on the portion of the opposing surface 31a that faces the bottom surface 21a. The thickness of the substrate 31 is preferably equal to the depth of the first recess 21.

[0034] The IC chip portion 32 is provided on the opposing surface 31a of the substrate 31. The IC chip portion 32 protrudes downward from the opposing surface 31a of the substrate 31. The IC chip portion 32 has an IC chip 34 and a sealing portion 35 that covers the IC chip 34.

[0035] The IC chip 34 has both a contact interface and a non-contact interface. The IC chip 34 is electrically connected to the connection terminal 33, for example, by bonding wires 36. The sealing portion 35 is formed of resin or the like. The IC chip portion 32 is smaller than the substrate 31 in a plan view. The IC chip portion 32 is formed, for example, in the portion including the center of the opposing surface 31a.

[0036] The IC module 3 is placed in the housing recess 8. The substrate 31 is housed in the first recess 21. It is desirable that the upper surface 31b of the substrate 31 be flush with the first main surface 1a (upper surface) of the card base material 1. The IC chip portion 32 is housed in the second recess 22.

[0037] The opposing surface 31a of the substrate 31 faces the bottom surface 21a of the first recess 21. The opposing surface 31a is bonded to the bottom surface 21a by an adhesive layer 37. The adhesive layer 37 is formed from, for example, ACP (Anisotropic Conductive Paste) or ACF (Anisotropic Conductive Film). The adhesive layer 37 is made conductive by conductive particles, such as metal particles.

[0038] The connection terminal 33 formed on the substrate 31 is electrically connected to the cut surface 7a (connection portion 23) of the conductive wire 7 via the adhesive layer 37.

[0039] [Manufacturing method for dual IC cards] A method for manufacturing a dual IC card 100 according to an embodiment will be described with reference to Figures 3 to 9.

[0040] (1st process: placement process) As shown in Figure 3, a sheet-like substrate 10 is prepared. One side of the substrate 10 (the top surface in Figure 3) is the first main surface 10a. The other side of the substrate 10 (the bottom surface in Figure 3) is the second main surface 10b. The substrate 10 is formed of, for example, a resin. The substrate 10 is formed of a thermoplastic resin such as polyvinyl chloride (PVC), glycol-modified polyethylene terephthalate (PETG), or polycarbonate (PC).

[0041] The antenna 2 is placed on the first main surface 10a of the base material 10. The conductive wire 7 may be partially embedded in the base material 10. In this embodiment, the portion of the conductive wire 7 including the lowest part is located in a recess 10c formed in the first main surface 10a of the base material 10. The upper part of the conductive wire 7 protrudes upward from the first main surface 10a. To embed a portion of the conductive wire 7 in the base material 10, for example, the conductive wire 7 is pressed against the base material 10 that has been softened by heating. Two or more of the first to third extending portions 7A, 7B, and 7C may be at different heights relative to the base material 10. The conductive wire 7 does not have to be embedded in the base material 10.

[0042] (Second step: Formation of auxiliary substrate and surface layer) As shown in Figure 4, a sheet-like first auxiliary substrate 11 is placed on the first main surface 10a of the base material 10. A sheet-like second auxiliary substrate 12 is placed on the second main surface 10b of the base material 10. The first auxiliary substrate 11 and the second auxiliary substrate 12 can be collectively referred to as auxiliary substrates 11 and 12. The formation of the auxiliary substrates 11 and 12 makes it difficult for the antenna 2 to fall off the base material 10.

[0043] The auxiliary substrates 11 and 12 are formed from thermoplastic resins such as PVC, PETG, or PC. The auxiliary substrates 11 and 12 are heat-fused to the substrate 10, for example. If the auxiliary substrates 11 and 12 are formed from the same material as the substrate 10, they will be easier to heat-fuse to the substrate 10. The auxiliary substrates 11 and 12 may also be bonded to the substrate 10 by an adhesive layer. The adhesive layer can be formed by known coating methods, such as roll coating or gravure coating.

[0044] As shown in Figure 5, the base material 10 and auxiliary base materials 11, 12 are integrated by heating and pressing them. For example, the base material 10 and auxiliary base materials 11, 12 can be integrated by heating and pressing them in the thickness direction using a pressing member having a flat pressing surface. This forms a composite base material 13 in which the base material 10 and auxiliary base materials 11, 12 are integrated.

[0045] As shown in Figure 6, a third auxiliary substrate 14 is laminated onto the first main surface 13a (top surface) of the composite substrate 13. A fourth auxiliary substrate 15 is laminated onto the second main surface 13b (bottom surface) of the composite substrate 13. The third auxiliary substrate 14 and the fourth auxiliary substrate 15 can be collectively referred to as auxiliary substrates 14 and 15. The auxiliary substrates 14 and 15 are provided, for example, for adjusting the thickness of the dual IC card 100.

[0046] The auxiliary substrates 14 and 15 are formed from thermoplastic resins such as PVC, PETG, or PC. The auxiliary substrates 14 and 15 are heat-fused to the composite substrate 13, for example. If the auxiliary substrates 14 and 15 are formed from the same material as the composite substrate 13, they will be easier to heat-fuse to the composite substrate 13. The auxiliary substrates 14 and 15 may also be bonded to the composite substrate 13 by an adhesive layer. The adhesive layer can be formed by known coating methods, such as roll coating or gravure coating.

[0047] A first surface layer 5 is formed on the first main surface 14a (upper surface) of the third auxiliary substrate 14. A second surface layer 6 is formed on the second main surface 15b (lower surface) of the fourth auxiliary substrate 15. The surface layers 5 and 6 are heat-fused to the auxiliary substrates 14 and 15, respectively, for example. If the surface layers 5 and 6 are formed from the same material as the auxiliary substrates 14 and 15, they will be easier to heat-fuse to the auxiliary substrates 14 and 15. The surface layers 5 and 6 may also be bonded to the auxiliary substrates 14 and 15 by an adhesive layer. The adhesive layer can be formed by known coating methods, such as the roll coating method or the gravure coating method.

[0048] As shown in Figure 7, the composite substrate 13, auxiliary substrates 14, 15, and surface layers 5, 6 are integrated by heating and pressing them together. For example, the composite substrate 13, auxiliary substrates 14, 15, and surface layers 5, 6 can be integrated by heating and pressing them in the thickness direction using a pressing member having a flat pressing surface. As a result, the composite substrate 13 and auxiliary substrates 14, 15 are integrated to form the main substrate 4. The thickness of the main substrate 4 is preferably twice or more the diameter (vertical dimension) of the conductive wire 7.

[0049] The surface layers 5 and 6 are integrated with the main substrate 4. The main substrate 4 and the surface layers 5 and 6 are integrated to form the card substrate 1.

[0050] (3rd process: cutting process) As shown in Figure 8, a recessed area 8 is formed on the first main surface 1a (top surface) of the card substrate 1 by cutting. The cutting process may be, for example, milling. By forming the first recessed area 21, a portion of the conductive wire 7 (extended portions 7A, 7B) is cut away, and the metal wire of the cut surface 7a is exposed. The cut surface 7a of the conductive wire 7 is an exposed surface that is flush with the bottom surface 21a. The cut surface 7a of the conductive wire 7 becomes a connection portion 23 that is connected to the IC module 3.

[0051] (Step 4: Connection Step) As shown in Figures 9 and 1, the IC module 3 is placed in the housing recess 8. The substrate 31 is housed in the first recess 21. It is desirable that the upper surface 31b of the substrate 31 be flush with the first main surface 1a (upper surface) of the card base material 1. The IC chip portion 32 is housed in the second recess 22.

[0052] The opposing surface 31a of the substrate 31 faces the bottom surface 21a of the first recess 21. The opposing surface 31a is bonded to the bottom surface 21a by the adhesive layer 37. The connection terminal 33 formed on the substrate 31 is electrically connected to the cut surface 7a (connection portion 23) of the conductive wire 7 via the adhesive layer 37.

[0053] [Effects of the dual IC card according to this embodiment] In the dual IC card 100 according to this embodiment, the conductive wire 7 has a side surface 7b perpendicular to the bottom surface 21a of the housing recess 8. Therefore, the area of ​​the cut surface 7a (exposed surface) of the conductive wire 7 does not easily fluctuate with the height of the bottom surface 21a (depth of cutting). Thus, variations in the area of ​​the cut surface 7a of the conductive wire 7 can be reduced. As a result, the electrical connection between the conductive wire 7 and the connection terminal 33 can be stabilized.

[0054] Multiple conductive wires 7 (extended portions 7A, 7B) are formed side by side on the bottom surface 21a. When adjacent conductive wires 7 are formed close to each other, inclination of the conductive wires 7 (inclination around the axis of the conductive wires 7) is less likely to occur. Therefore, the side surface 7b tends to be perpendicular to the bottom surface 21a of the housing recess 8.

[0055] As shown in Figure 2, the electrical connection between the conductive wire 7 and the connection terminal 33 can be stabilized if at least the side surface 7b of the length portion of the conductive wire 7 that is connected to the connection terminal 33 is perpendicular to the bottom surface 21a of the housing recess 8.

[0056] According to the manufacturing method of the dual IC card 100 of this embodiment, since the conductive wire 7 has a side surface 7b perpendicular to the bottom surface 21a of the housing recess 8, the area of ​​the cut surface 7a of the conductive wire 7 does not easily fluctuate with the height of the bottom surface 21a. Therefore, it is possible to manufacture a dual IC card 100 that can reduce the variation in the area of ​​the cut surface 7a of the conductive wire 7. Thus, the electrical connection between the conductive wire 7 and the connection terminal 33 can be stabilized.

[0057] As shown in Figure 4, if the first auxiliary substrate 11 is formed on the first main surface 10a of the substrate 10 prior to the cutting process, the antenna 2 becomes less likely to fall off the substrate 10.

[0058] Although embodiments of the present invention have been described above, the configurations and combinations thereof in the embodiments are merely examples, and additions, omissions, substitutions, and other modifications to the configurations are possible without departing from the spirit of the present invention.

[0059] In the dual IC card 100 shown in Figure 1, the conductive wire 7 has a rectangular cross-section with two side surfaces 7b perpendicular to the bottom surface 21a and an upper and lower surface parallel to the bottom surface 21a. However, the conductive wire is not limited to a rectangular cross-section. The conductive wire can have any shape in which its side surfaces are perpendicular to the bottom surface. For example, the conductive wire may have side surfaces 7b perpendicular to the bottom surface 21a, and one or both of its upper and lower surfaces may be inclined relative to the bottom surface 21a.

[0060] In the dual IC card 100 shown in Figure 1, multiple conductive wires 7 are formed in a row on the bottom surface 21a of the housing recess 8, but the number of conductive wires formed on the bottom surface of the housing recess may be one. In other words, the number of conductive wires formed on the bottom surface of the housing recess may be one or more.

[0061] After the first step (see Figure 2) and prior to the second step (see Figure 3), the conductive wire 7 may be pressed toward the base material 10 using a pressing member having a flat pressing surface. This allows the height positions of the conductive wire 7 (extended portions 7A, 7B, 7C) to be aligned. [Explanation of Symbols]

[0062] 1…Card substrate, 2…Antenna, 3…IC module, 7…Conductive wire, 7a…Cut surface (exposed surface), 7b…Side, 8…Recessed area, 31…Circuit board, 33…Connection terminals, 34…IC chip, 100…Dual IC card

Claims

1. A plate-shaped card base material having a receiving recess formed on its first main surface, An IC module having an IC chip with contact and non-contact communication functions, and a substrate having connection terminals connected to the IC chip, The card substrate is provided with an antenna having a conductive wire, The conductive wire is embedded in the card substrate having an exposed surface that is exposed to the bottom surface of the housing recess. At least a portion of the IC module is housed in the housing recess, The aforementioned connection terminal is electrically connected to the exposed surface of the conductive wire. The conductive wire has a side surface perpendicular to the bottom surface, Dual IC card.

2. Multiple conductive wires are formed in a row on the bottom surface. The adjacent conductive wires are in close proximity to each other. The dual IC card according to claim 1.

3. The conductive wire has a side surface perpendicular to the bottom surface at the portion connected to the connection terminal. The dual IC card according to claim 1.

4. A method for manufacturing a dual IC card comprising an IC module having an IC chip having contact-type and contactless communication functions and a substrate having connection terminals connected to the IC chip, A placement step involves arranging an antenna having conductive wires on the first main surface of a sheet-like substrate, A cutting process is performed to form a recessed area by cutting the substrate, and to expose the exposed surface, which is the cut surface of the conductive wire, on the bottom surface of the recessed area. A connection step involves placing the IC module in the housing recess and electrically connecting the connection terminals to the cut surface, It has, The conductive wire has a side surface perpendicular to the bottom surface, A method for manufacturing a dual IC card.

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