Inverter devices and rotating machinery

Abstract

It achieves both improved cooling performance and miniaturization. [Solution] The inverter device comprises an inverter housing including a first inverter opening, a second inverter opening, and a partition wall separating a first internal space connected to the first inverter opening from a second internal space connected to the second inverter opening; a circuit module disposed in the first internal space and including a functional element, a substrate connected to the functional element, and a power cable connected to the substrate; and a heat dissipation member disposed in the second internal space and capable of dissipating heat from the functional element. The partition wall includes a through hole connecting the first internal space and the second internal space. The through hole is located in a region opposite to the region where the first and second inverter openings are located, with the functional element in between, in a first direction along the partition wall. The power cable is routed from the first internal space to the second internal space through the through hole.

Description

Technical Field

[0001] The present disclosure relates to an inverter device and a rotating machine.

Background Art

[0002] In recent years, attention has been focused on so-called power semiconductor devices that handle large currents. Power semiconductor devices generate a large amount of heat due to the magnitude of the current they handle. Therefore, discharging the generated heat from the power semiconductor device is an important issue in handling the power semiconductor device. For example, Patent Documents 1 to 4 disclose technologies related to cooling heat sources such as power semiconductor devices.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Summary of the Invention

Problems to be Solved by the Invention

[0004] The power semiconductor device as described above is housed, for example, in the internal space of an inverter housing together with other members such as a substrate and a power cable. The internal space of the inverter housing is partitioned into an inverter space in which the power semiconductor device, the substrate, the power cable, etc. are housed, and a heat dissipation space in which a heat sink for releasing the heat of the power semiconductor device is housed. In this configuration, a cooling fan for sending cooling air to the heat dissipation space may be installed. In this case, by bringing the cooling air into contact with the heat sink, the power semiconductor device can be cooled via the heat sink.

[0005] However, with this configuration, it is difficult to adequately cool other components such as the circuit board and power cables, which can generate significant heat due to the flow of high power. To address this, in addition to the cooling fan that sends cooling air to the heat dissipation space, another cooling fan is sometimes installed to send cooling air to the inverter space. In this case, other components such as the circuit board and power cables, including the power semiconductor elements, can be directly cooled. However, installing multiple cooling fans in this way may increase the overall size of the device.

[0006] This disclosure describes an inverter device and a rotating machine that can achieve both improved cooling performance and miniaturization. [Means for solving the problem]

[0007] An inverter device according to one embodiment of the present disclosure includes an inverter housing including a first inverter opening through which cooling air can flow in or out, a second inverter opening formed at a different position from the first inverter opening and through which cooling air can flow in or out, and a partition wall separating a first internal space connected to the first inverter opening and a second internal space connected to the second inverter opening; a circuit module disposed in the first internal space and including a functional element, a substrate connected to the functional element, and a power cable connected to the substrate; and a heat dissipation member disposed in the second internal space, thermally connected to the functional element via the partition wall, and capable of dissipating heat from the functional element, wherein the partition wall includes a through hole connecting the first internal space and the second internal space, the through hole is located in a region opposite to the region where the first inverter opening and the second inverter opening are located, with the functional element in between, in a first direction along the partition wall, and is capable of transferring cooling air between the first internal space and the second internal space, and the power cable is drawn out from the first internal space to the second internal space through the through hole.

[0008] In the inverter device described above, a partition wall separating the first internal space connected to the first inverter opening and the second internal space connected to the second inverter opening includes a through-hole connecting the first and second internal spaces. The through-hole is located in the region opposite to the region where the first and second inverter openings are positioned, in the first direction along the partition wall, with the functional elements in between. Therefore, cooling air flowing from the first inverter opening into the first internal space is returned through the through-hole and passed to the second internal space, and then flows out from the second inverter opening. Alternatively, cooling air flowing from the second inverter opening into the second internal space is returned through the through-hole and passed to the first internal space, and then flows out from the first inverter opening. In this way, the first internal space, the through-hole, and the second internal space form a cooling air flow path that returns from the first inverter opening through the through-hole to the second inverter opening. When such a return flow path is formed, cooling air can be supplied to both the first and second internal spaces using a single air source. Therefore, in the above inverter device, even without providing multiple air sources to supply cooling air to both the first and second internal spaces, both the circuit module located in the first internal space and the heat dissipation member located in the second internal space can be sufficiently cooled, thus achieving sufficient cooling performance while making the entire device smaller. Furthermore, in the above inverter device, the power cable included in the circuit module is routed from the first internal space to the second internal space through a through-hole. In this case, the power cable, which is one of the heat sources inside the inverter housing, can be effectively cooled by the cooling air, further improving the cooling performance. Thus, the above inverter device makes it possible to achieve both improved cooling performance and miniaturization.

[0009] In some embodiments, the power cable may include a first extending portion extending from the substrate in a first direction, a second extending portion extending in a second direction intersecting the first direction and drawn out from a first internal space to a second internal space through a through-hole, and a bent portion positioned between the first and second extending portions and bending to connect the first and second extending portions. In this case, the power cable can be positioned along a flow path for cooling air, so that the cooling air can more effectively cool the power cable, thereby further improving cooling performance.

[0010] In some embodiments, the inverter housing includes a cable entry port through which a power cable drawn out from a through hole into a second internal space passes, and the cable entry port may be formed in a different location from the second inverter opening. In this case, the power cable can be routed to follow the shortest possible path to the object to which it is connected, thus avoiding the power cable becoming unnecessarily long compared to the case where the power cable is drawn out from the second inverter opening.

[0011] In some embodiments, the second internal space is a space enclosed by a partition wall and a side wall that faces the partition wall with a gap between it and the partition wall in a second direction intersecting the partition wall, and the side wall includes a first side wall portion through which the second inverter opening is opened and a second side wall portion through which the cable insertion port is opened, and the first side wall portion may have a step formed in the direction away from the partition wall relative to the second side wall portion. In this case, a space for cooling air to flow can be secured between the partition wall and the first side wall portion, and a heat dissipation member can be placed in that space, thereby improving cooling performance.

[0012] In some embodiments, the cross-sectional area of ​​the second inverter opening may be larger than the cross-sectional area of ​​the cable entry opening. In this case, sufficient airflow for the cooling air passing through the second inverter opening can be ensured, thereby improving cooling performance.

[0013] A rotating machine according to one embodiment of the present disclosure comprises one of the inverter devices described above and a motor device to which drive power is supplied from the inverter device, wherein the motor device includes a motor electrically connected to a power cable and capable of rotating a shaft by receiving drive power supplied from the power cable, a cooling fan attached to the shaft, and a motor housing housing the motor and the cooling fan, wherein the inside of the motor housing is connected to a second internal space through a second inverter opening, and the cooling fan rotates together with the shaft to cause cooling air to flow into the first inverter opening or the second inverter opening.

[0014] This rotating machine is equipped with one of the inverter devices described above, and therefore the effects described above can be obtained. Furthermore, in this rotating machine, a cooling fan housed in the motor housing is used as an air source to supply cooling air to the first inverter opening or the second inverter opening. In other words, the air source for cooling the motor inside the motor housing and the air source for cooling the circuit module inside the inverter housing are shared. In this case, the entire device can be made smaller compared to the case where the air source for cooling the motor and the air source for cooling the circuit module are provided separately.

[0015] In some embodiments, the inverter housing is connected to the motor housing in a second direction intersecting a first direction, the shaft extends along the first direction, and the motor housing further includes a first motor opening into which a different cooling airflow from the cooling airflow can enter or exit, and a second motor opening into which another cooling airflow can enter or exit, and when viewed along the second direction, the second inverter opening is located between the first motor opening and the second motor opening in the first direction, and at least a portion of the motor may be located between the first motor opening and the second inverter opening in the first direction. In this case, as the cooling fan rotates, the cooling airflow entering from the first inverter opening flows through the circuit module and heat dissipation member into the motor housing from the second inverter opening. Also, as the cooling fan rotates, another cooling airflow entering from the first motor opening passes through the motor and then merges with the cooling airflow from the inverter housing at the second inverter opening and is discharged to the outside of the motor housing from the second motor opening together with the cooling airflow. Alternatively, as the cooling fan rotates, the cooling air flowing in from the second motor opening splits at the second inverter opening into two streams: one that passes through the motor inside the motor housing, and another that passes through the circuit module and heat dissipation member inside the inverter housing. These streams then flow out from the first motor opening and the first inverter opening. In this configuration, where the cooling air merges or splits at the second inverter opening, the main heat sources inside the inverter housing and the motor housing can be efficiently cooled by the low-temperature cooling air before it exchanges heat with the main heat sources inside the rotating machinery. In this case, for example, the heat sources inside the rotating machinery can be cooled more efficiently than when the cooling air that has exchanged heat with the heat sources inside the inverter housing is used directly to cool the heat sources inside the motor housing. Therefore, the above configuration allows for further improvement in cooling performance. [Effects of the Invention]

[0016] According to some aspects of this disclosure, inverter devices and rotating machines are provided that can achieve both improved cooling performance and miniaturization. [Brief explanation of the drawing]

[0017] [Figure 1] FIG. 1 is a cross-sectional view showing a rotating machine according to an embodiment. [Figure 2] FIG. 2 is a cross-sectional view showing an inverter device included in the rotating machine of FIG. 1. [Figure 3] FIG. 3 is a cross-sectional view showing a rotating machine according to a modified example. [Figure 4] FIG. 4(a) is a cross-sectional view showing a rotating machine according to Comparative Example 1. FIG. 4(b) is a cross-sectional view showing a rotating machine according to Comparative Example 2.

MODE FOR CARRYING OUT THE INVENTION

[0018] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the description of the drawings, the same reference numerals are given to the same elements, and overlapping descriptions are omitted.

[0019] In the present embodiment, as an example of a rotating machine, a centrifugal blower 1 will be described. The centrifugal blower 1 is, for example, an air-cooled electric blower that sucks in air and discharges it at a predetermined pressure. The centrifugal blower 1 includes a motor device 10 that rotates a shaft 2 to which an impeller is attached, and an inverter device 30 that supplies driving power to the motor device 10. The motor device 10 and the inverter device 30 are integrated and electrically connected to each other.

[0020] [Motor device] The motor device 10 includes a motor 11, a cooling fan 13, and a motor housing 15 that houses the motor 11 and the cooling fan 13.

[0021] [Motor] The motor 11 is, for example, a brushless AC motor. The motor 11 includes a rotor 11a fixed to the shaft 2 and a stator 11b surrounding the rotor 11a. The rotor 11a includes one or more magnets. The rotor 11a is rotatable with the shaft 2 around a rotation axis C. The rotation axis C is the axis connecting the centers of rotation of the shaft 2. The stator 11b has multiple coils and an iron core. The stator 11b faces the rotor 11a with a gap between them. The stator 11b rotates the rotor 11a by generating a magnetic field around the shaft 2.

[0022] [Cooling fan] The cooling fan 13 is attached to the first end 2a of the shaft 2 in the axial direction D1 (first direction) along which the rotation axis C extends, and rotates together with the shaft 2 around the rotation axis C. The cooling fan 13 is, for example, a centrifugal fan that draws in air from its center and exhausts it away from the rotation axis C. The second end 2b of the shaft 2, located on the opposite side of the first end 2a, is rotatably supported by a bearing 14. The motor 11 is positioned in the center of the shaft 2 between the cooling fan 13 and the bearing 14. The cooling fan 13 is adjacent to the motor 11 in the axial direction D1 with a gap between them. The bearing 14 is positioned on the opposite side of the motor 11 from the cooling fan 13, and is adjacent to the motor 11 in the axial direction D1 with a gap between them.

[0023] [Motor housing] The motor housing 15 includes a cylindrical side wall 16 extending along the axial direction D1 with respect to the rotation axis C, a first end wall 17 closing the first end of the side wall 16 in the axial direction D1, and a second end wall 18 closing the second end of the side wall 16 in the axial direction D1. The side wall 16, the first end wall 17, and the second end wall 18 form an internal space for housing the motor 11 and the cooling fan 13. The internal space of the motor housing 15 has a motor space V11 in which the motor 11 is housed and a fan space V13 in which the cooling fan 13 is housed.

[0024] The motor space V11 and the fan space V13 are separated within the motor housing 15 by a partition wall 19 extending along a vertical direction D2 (second direction) perpendicular to the axial direction D1, and are adjacent to each other in the axial direction D1, with the partition wall 19 in between. The partition wall 19 includes an insertion hole 19a that connects the motor space V11 and the fan space V13. The shaft 2 is inserted into the insertion hole 19a. The inner diameter of the insertion hole 19a is larger than the shaft 2. With the shaft 2 inserted, the insertion hole 19a allows air to pass between the motor space V11 and the fan space V13. The insertion hole 19a is opposite the cooling fan 13 in the axial direction D1.

[0025] The first end wall 17 is positioned opposite the cooling fan 13 in the axial direction D1. The first end wall 17 includes an insertion hole 19a through which the first end 2a of the shaft 2 passes. An impeller (not shown) is attached near the first end of the shaft 2 that extends from the insertion hole 19a to the outside of the motor housing 15. The second end wall 18 is positioned opposite the bearing 14 in the axial direction D1. The second end wall 18 includes an air intake A11 (first motor opening) that takes in outside air as cooling air. The air intake A11 is formed, for example, over the entire length of the second end wall 18. The air intake A11 is provided with a dustproof air filter 18a. The air filter 18a covers, for example, the entire length of the air intake A11. The air filter 18a allows outside air to pass through the air intake A11 while capturing dust. The second end wall 18 may be provided with a retaining part to hold the air filter 18a.

[0026] The side wall 16 includes a side wall portion 16a, a side wall portion 16b (first side wall portion), and a side wall portion 16c (second side wall portion). Side wall portion 16a is the portion of the side wall 16 located between the first end wall 17 and the partition wall 19 in the axial direction D1. Side wall portion 16b is the portion of the side wall 16 located between the partition wall 19 and the bearing 14 in the axial direction D1. Side wall portion 16c is the portion of the side wall 16 located between the bearing 14 and the second end wall 18 in the axial direction D1. Side wall portion 16b, side wall portion 16c, the second end wall 18, and the partition wall 19 form the motor space V11. Side wall portion 16a, the first end wall 17, and the partition wall 19 form the fan space V13.

[0027] The side wall portion 16a protrudes from the side wall portion 16b in a direction away from the axis of rotation C, forming a step relative to the side wall portion 16a. An exhaust port A12 (second motor opening) is formed in the step portion of the side wall portion 16a relative to the side wall portion 16b. The exhaust port A12 discharges the cooling air that flows in from the intake port A11. The exhaust port A12 is provided with an air filter 16d having the same function as the air filter 16d described above. The side wall portion 16b includes an exhaust port A22 (second inverter opening) connected to the inside of the inverter device 30. The side wall portion 16c forms a step that protrudes from the side wall portion 16b in a direction away from the axis of rotation C. The side wall portion 16c includes a cable insertion port 16e through which the power cable 49, described later, can pass.

[0028] The exhaust port A22 is connected in the middle of the flow path of the cooling air G1 between the intake port A11 and the exhaust port A12. When viewed along the vertical direction D2, the exhaust port A22 is located between the intake port A11 and the exhaust port A12 in the axial direction D1. The motor 11 and bearing 14 are located in the flow path of the cooling air G1 between the intake port A11 and the exhaust port A12. More specifically, the motor 11 and bearing 14 are located in the flow path of the cooling air G1 between the exhaust port A22 and the exhaust port A12. When viewed along the vertical direction D2, the motor 11 and bearing 14 are located between the exhaust port A22 and the exhaust port A12 in the axial direction D1. In this embodiment, the entire motor 11 is located between the exhaust port A22 and the exhaust port A12, but only a part of the motor 11 may be located between the exhaust port A22 and the exhaust port A12.

[0029] [Inverter device] The inverter device 30 is aligned vertically D2 with the motor device 10. The inverter device 30 comprises a circuit module 31, a heat dissipation member 33 for cooling the circuit module 31, and an inverter housing 35 that houses the circuit module 31 and the heat dissipation member 33.

[0030] [Circuit Module] The circuit module 31 includes power semiconductor elements 41 (functional elements), a main circuit board 43 (board), a connection board 45, a power cable 47, and a power cable 49. The circuit module 31 may include multiple power semiconductor elements 41.

[0031] The power semiconductor element 41 receives an external electrical signal and performs a desired electrical function. The power semiconductor element 41 is installed on the surface 51a of the partition wall 51 inside the inverter housing 35 and is connected to the back surface 43b of the main circuit board 43 to form an electrical circuit that performs the desired function. The power semiconductor element 41 is in contact with the surface 51a of the partition wall 51. The power semiconductor element 41 is, for example, a transistor or a diode. The power semiconductor element 41 shown in Figure 1 is a so-called MOSFET (Metal Oxide Semiconductor Field Effect Transistor), which combines a field-effect transistor with a metal oxide semiconductor. A MOSFET controls the current flowing between the source and drain by controlling the voltage between the gate and the source. In other words, a MOSFET is a switching element. The power semiconductor element 41 is the main heat source that generates a large amount of heat during the operation of the centrifugal blower 1.

[0032] The main circuit board 43 is, for example, a power board through which a large current flows. The main circuit board 43 is fixed to the surface 51a of the partition wall 51 by bolts or the like, with a gap D2 perpendicular to the surface of the partition wall 51. The back surface 43b of the main circuit board 43 faces the surface 51a of the partition wall 51 perpendicular to the main circuit board 43, with the power semiconductor element 41 in between. Therefore, the power semiconductor element 41 is positioned between the back surface 43b of the main circuit board 43 and the surface 51a of the partition wall 51. The power semiconductor element 41 is, for example, in contact with the surface 51a of the partition wall 51 and away from the back surface 43b of the main circuit board 43. The power semiconductor element 41 may also be in contact with the surface 51a of the partition wall 51 via a heat transfer material such as a heat dissipation sheet. The main circuit board 43 is electrically connected to the power semiconductor element 41 via a connecting wire 42. The connection board 45 is fixed to the inverter housing 35 with a gap D2 perpendicular to the surface 43a of the main circuit board 43. The connection board 45 is electrically connected to the main circuit board 43.

[0033] The power cable 47 is connected to the connection board 45. The power cable 47 is electrically connected to the power semiconductor element 41 via the connection board 45 and the main circuit board 43. The power cable 47 extends axially D1 from the connection board 45 and is led out to the outside of the inverter housing 35 and connected to an external power supply. The power cable 47 supplies power from the external power supply to the power semiconductor element 41 via the connection board 45 and the main circuit board 43. The power cable 49 is connected to the surface 43a of the main circuit board 43. The power cable 49 is electrically connected to the power semiconductor element 41 via the main circuit board 43. The power cable 49 transmits power supplied from the power semiconductor element 41. The power cable 49 extends from the main circuit board 43 and is led out to the outside of the inverter housing 35 and connected to the motor device 10. The power cable 49 supplies power from the power semiconductor element 41 to the motor device 10.

[0034] Thus, the power cable 47, connection board 45, main circuit board 43, and power cable 49 are directly or indirectly connected to the power semiconductor element 41, forming a path for transmitting large amounts of power. For this reason, the power cable 47, connection board 45, main circuit board 43, and power cable 49 are also major heat sources that generate a large amount of heat during the operation of the centrifugal blower 1.

[0035] [Heat dissipation component] The heat dissipation member 33 releases the heat generated by the power semiconductor element 41. The heat dissipation member 33 is, for example, a heat sink having multiple fins. The heat dissipation member 33 may be any other member having a heat dissipation function. The heat dissipation member 33 is installed on the back surface 51b of the partition wall 51 inside the inverter housing 35. The heat dissipation member 33 is in contact with the back surface 51b of the partition wall 51. The heat dissipation member 33 may be in contact with the back surface 51b of the partition wall 51 via a heat transfer member such as a heat dissipation sheet. The heat dissipation member 33 is positioned opposite the power semiconductor element 41 in the vertical direction D2, with the partition wall 51 in between. In other words, the heat dissipation member 33 is positioned overlapping the power semiconductor element 41 in the vertical direction D2. The heat dissipation member 33 is thermally connected to the power semiconductor element 41 via the partition wall 51.

[0036] [Inverter enclosure] The inverter housing 35 is adjacent to the motor housing 15 in the vertical direction D2 and is connected to the motor housing 15 in the vertical direction D2. The inverter housing 35 includes a top wall 36 located on the opposite side of the motor device 10 from the side wall 16 in the vertical direction D2, a first end wall 37 located at the first end of the top wall 36 in the axial direction D1, and a second end wall 38 located at the second end of the top wall 36 in the axial direction D1. Furthermore, the inverter housing 35 shares the side wall 16 of the motor housing 15. The side wall 16 functions as the bottom wall of the inverter housing 35. The side wall 16, together with the top wall 36, the first end wall 37, and the second end wall 38, constitute the inverter housing 35.

[0037] The side wall 16, top wall 36, first end wall 37, and second end wall 38 form an internal space for housing the circuit module 31 and the heat dissipation member 33. The internal space of the inverter housing 35 has an inverter space V31 (first internal space) for housing the circuit module 31 and a heat dissipation space V33 (second internal space) for housing the heat dissipation member 33. The inverter space V31 and the heat dissipation space V33 are separated by a partition wall 51 that extends along the axial direction D1 inside the motor housing 15, and are adjacent to each other in the vertical direction D2 with the partition wall 51 in between. The partition wall 51 is located between the side wall 16 and the top wall 36. The partition wall 51 includes a back surface 51b that faces the side wall 16 in the vertical direction D2, and a front surface 51a that faces the opposite side of the side wall 16. Furthermore, the partition wall 51 includes a through hole A23 that penetrates vertically in the vertical direction D2 from the front surface 51a to the back surface 51b. The through-hole A23 connects the inverter space V31 and the heat dissipation space V33.

[0038] The first end wall 37 includes a first end wall portion 37a and a second end wall portion 37b. The first end wall portion 37a is the portion of the first end wall 37 located between the top wall 36 and the partition wall 51 in the vertical direction D2. The second end wall portion 37b is the portion of the first end wall 37 located between the partition wall 51 and the side wall 16 in the vertical direction D2. The second end wall portion 37b forms a step that is recessed toward the second end wall 38 side in the axial direction D1 relative to the first end wall portion 37a. The second end wall portion 37b extends vertically D2 from the first end wall portion 37a and is connected to the side wall portion 16b of the side wall 16. The second end wall portion 37b faces the exhaust port A12 of the motor housing 15 in the axial direction D1 with a gap between them. The second end wall 38 extends vertically D2 from the top wall 36 and is connected to the side wall portion 16c of the side wall 16.

[0039] The top wall 36, the first end wall 37a, the second end wall 38, and the partition wall 51 form an inverter space V31. The side wall 16, the second end wall 37b, the second end wall 38, and the partition wall 51 form a heat dissipation space V33. Power cable 47 is positioned closer to the first end wall 37 than to the second end wall 38 in the axial direction D1, and power cable 49 is positioned closer to the second end wall 38 than to the first end wall 37 in the axial direction D1. Power semiconductor element 41 is positioned in the central part between the first end wall 37 and the second end wall 38 in the axial direction D1.

[0040] The first end wall portion 37a includes an air intake port A21 (first inverter opening) that takes in outside air as cooling air G2. The air intake port A21 is formed, for example, in a part of the first end wall portion 37a. The air intake port A21 is provided with a dustproof air filter 37c. The air filter 37c covers, for example, at least a part of the air intake port A21. The air filter 37c has the same function as the air filter 18b described above. A power cable 47 is drawn out from the air intake port A21. Therefore, the air filter 37c covers the part of the air intake port A21 other than the part through which the power cable 47 passes. The power cable 47 drawn out from the air intake port A21 to the outside of the inverter housing 35 is connected to an external power source. The side wall portion 16b of the side wall 16 includes an exhaust port A22, as described above. The exhaust port A22 discharges the cooling air G2 that has been drawn in from the air intake port A21. The exhaust port A22 is formed, for example, at a position adjacent to the second end wall portion 37b in the axial direction D1.

[0041] As shown in Figure 2, the through-hole A23 connecting the inverter space V31 and the heat dissipation space V33 is located in region R2, opposite to region R1 where the intake port A21 and exhaust port A22 are located, with reference to the position P of the power semiconductor element 41 in the axial direction D1. The position P of the power semiconductor element 41 is, for example, the position of the center of the power semiconductor element 41 in the axial direction D1. Region R1 is the region of the inverter housing 35 from the first end wall 37 to position P in the axial direction D1. Region R2 is the region of the inverter housing 35 from the second end wall 38 to position P in the axial direction D1. The through-hole A23 is formed, for example, in region R2 at a position away from the main circuit board 43 in the axial direction D1. In one example, the through-hole A23 is formed at a position adjacent to the second end wall 38. When viewed along the vertical direction D2, the through-hole A23 is located between the main circuit board 43 and the second end wall 38 in the axial direction D1.

[0042] The through-hole A23 is, for example, a circular hole that penetrates the partition wall 51 in the vertical direction D2. A power cable 49 extending from the main circuit board 43 is inserted into the through-hole A23. The inner diameter of the through-hole A23 is larger than the outer diameter of the power cable 49. In other words, the cross-sectional area of ​​the through-hole A23 is larger than the cross-sectional area of ​​the power cable 49. With the power cable 49 inserted, the through-hole A23 allows air (cooling air G2) to pass between the inverter space V31 and the heat dissipation space V33. The cross-sectional area of ​​the through-hole A23 refers to the area of ​​the through-hole A23 in a plane perpendicular to the vertical direction D2 from which the through-hole A23 extends. The cross-sectional area of ​​the power cable 49 refers to the area of ​​the power cable 49 in a plane perpendicular to the vertical direction D2.

[0043] The power cable 49 includes a first extension 49a connected to the main circuit board 43, a second extension 49b passing through the through hole A23, and a bent portion 49c positioned between the first extension 49a and the second extension 49b. The first extension 49a extends axially D1 from the main circuit board 43 toward the second end wall 38. The second extension 49b extends vertically D2 at a position axially D1 away from the main circuit board 43 toward the second end wall 38. The bent portion 49c connects the first extension 49a and the second extension 49b while bending.

[0044] The power cable 49, which is drawn out from the through-hole A23 into the heat dissipation space V33, is drawn out to the outside of the inverter housing 35 through a cable entry port 16e formed in the side wall portion 16c. The cable entry port 16e is located in region R2 opposite to region R1 where the exhaust port A22 is located, with the position P of the power semiconductor element 41 in between. The cable entry port 16e is formed, for example, in a position opposite the through-hole A23 in the vertical direction D2. In other words, the cable entry port 16e is arranged to overlap the through-hole A23 in the vertical direction D2. When the cable entry port 16e overlaps the through-hole A23 in the vertical direction D2, it means that when viewed along the vertical direction D2, at least a part of the cable entry port 16e overlaps with at least a part of the through-hole A23.

[0045] The cable entry port 16e is, for example, a circular hole through which a power cable 49 can pass. The cross-sectional area of ​​the cable entry port 16e is the same as the cross-sectional area of ​​the power cable 49. The cross-sectional area of ​​the cable entry port 16e is smaller than the cross-sectional area of ​​the through-hole A23 through which the power cable 49 and the cooling air G2 pass. Also, the cross-sectional area of ​​the cable entry port 16e is smaller than, for example, the cross-sectional area of ​​the exhaust port A22. As described above, the side wall portion 16c where the cable entry port 16e is formed has a step that protrudes toward the partition wall 51 relative to the side wall portion 16b where the exhaust port A22 is formed. In other words, the side wall portion 16b has a step that is recessed toward the partition wall 51 relative to the side wall portion 16c. Therefore, the width W1 in the vertical direction D2 between the side wall portion 16b and the back surface 51b of the partition wall 51 is larger than the width W2 in the vertical direction D2 between the side wall portion 16c and the back surface 51b of the partition wall 51.

[0046] The power cable 49 extending vertically D2 from the through hole A23 continues vertically D2 and passes through the cable insertion opening 16e. After passing through the cable insertion opening 16e, the power cable 49 is drawn out into the motor space V11 of the motor housing 15 and connected to the stator 11b (see Figure 1). For example, after passing through the cable insertion opening 16e, the power cable 49 is drawn out between the bearing 14 and the air intake A21 in the motor space V11, and then passes between the bearing 14 and the side wall portion 16b to connect to the stator 11b. In this way, the power semiconductor element 41 is electrically connected to the motor 11 via the main circuit board 43 and the power cable 49. The motor 11 receives power transmitted by the power cable 49 and rotates the shaft 2 around the rotation axis C.

[0047] [Operation] Next, the operation of the centrifugal blower 1 will be explained with reference to Figure 1.

[0048] When power is supplied from the power semiconductor element 41 to the stator 11b via the power cable 49, a rotating magnetic field is generated between the stator 11b and the rotor 11a, causing the shaft 2 to rotate. As the impeller rotates with the rotation of the shaft 2, the main flow is drawn into the impeller housing that contains the impeller. When the centrifugal blower 1 is used for suction, air is drawn in from a predetermined object to be suctioned. When the centrifugal blower 1 is used for blowing, the main flow drawn into the impeller housing is blown to a predetermined object to be blown through the diffuser and scroll.

[0049] During operation of the centrifugal blower 1, the cooling fan 13 rotates together with the shaft 2. When the cooling fan 13 rotates, the motor housing 15 and the inverter housing 35 are drawn in through the exhaust port A12. As a result, the motor housing 15 and the inverter housing 35 become negatively pressurized, so outside air is drawn into the motor housing 15 as cooling air G1 through the intake port A11, and outside air is drawn into the inverter housing 35 as cooling air G2 through the intake port A21.

[0050] Cooling air G2, drawn in from the intake port A21 into the inverter space V31 of the inverter housing 35, comes into contact with the power cable 47, the main circuit board 43, the connection board 45, the power semiconductor element 41, and the power cable 49. This cools the circuit module 31. Subsequently, the cooling air G2 flows through the through hole A23 into the heat dissipation space V33. As a result, the power cable 49 is also cooled by the cooling air G2 in the through hole A23. The cooling air G2 that flows into the heat dissipation space V33 comes into contact with the heat dissipation member 33. As a result, the power semiconductor element 41 is further cooled via the heat dissipation member 33. The cooling air G2 that has passed through the heat dissipation member 33 is drawn into the motor housing 15 from the exhaust port A22.

[0051] The inverter space V31 is a space that extends along the axial direction D1 from the intake port A21 to the through-hole A23. The inverter space V31 functions as a first cooling passage that passes the cooling air G2 drawn in from the intake port A21 through to the through-hole A23. The through-hole A23 is a space that extends along the vertical direction D2 between the inverter space V31 and the heat dissipation space V33. The through-hole A23 functions as a second cooling passage that transfers the cooling air G2 flowing through the inverter space V31 to the heat dissipation space V33. The heat dissipation space V33 is a space that extends along the axial direction D1 from the through-hole A23 to the exhaust port A22. The through-hole A23 functions as a third cooling passage that discharges the cooling air G2 that has passed through the through-hole A23 from the exhaust port A22. The inverter space V31, the through-hole A23, and the heat dissipation space V33 form a passage that returns from the intake port A21, through the through-hole A23, to the exhaust port A22.

[0052] Cooling air G1, drawn in from the intake port A11 into the motor space V11 of the motor housing 15, comes into contact with the power cable 49, the bearing 14, and the motor 11. This cools the power cable 49, the bearing 14, and the motor 11. After passing through the bearing 14, the cooling air G1 flows between the stator 11b and the rotor 11a and reaches the exhaust port A22, which is connected to the inside of the inverter housing 35. At the exhaust port A22, the cooling air G1 merges with the cooling air G2 discharged from the inverter housing 35. The merged cooling air G3 flows towards the shaft 2 to which the cooling fan 13 is attached, and flows through the insertion hole 19a formed in the partition wall 19 into the fan space V13. The cooling air G3 that has flowed into the fan space V13 is directed away from the axis of rotation C by the cooling fan 13 and is discharged to the outside of the motor housing 15 through the exhaust port A12.

[0053] The motor space V11 is a space that extends along the axial direction D1 from the intake port A11 to the partition wall 19. The motor space V11 functions as a fourth cooling passage that directs the cooling air G1 drawn in from the intake port A11 to the exhaust port A22. Furthermore, the motor space V11 functions as a fifth cooling passage that merges the cooling air G1 drawn in from the intake port A11 with the cooling air G2 from the inverter housing 35 at the exhaust port A22 and directs it through the cooling fan 13. The fan space V13 functions as a sixth cooling passage that discharges the cooling air G3 that has passed through the cooling fan 13 from the exhaust port A12.

[0054] During operation of the centrifugal blower 1, the motor 11 and bearings 14 also generate heat as heat sources, but the motor 11 and bearings 14 are cooled by the cooling air G1 flowing through the motor space V11. Also, as described above, in the inverter device 30, the power semiconductor element 41, power cable 47, connection board 45, main circuit board 43, and power cable 49 are heat sources, but these are cooled by the cooling air G2. Furthermore, the power semiconductor element 41 is further cooled by the cooling air G2 via the heat dissipation member 33. Therefore, in this embodiment, all of the heat sources described above are cooled directly or indirectly.

[0055] <Effects> The effects obtained by the inverter device 30 and centrifugal blower 1 described above will be explained along with the problems of the comparative example.

[0056] The inverter device 130 shown in Figure 4(a) comprises a circuit module 131 including a power semiconductor element 141, a substrate 143, a power cable 147, and a power cable 149; a heat dissipation member 133 thermally connected to the power semiconductor element 141; and an inverter housing 135 housing the circuit module 131 and the heat dissipation member 133. The internal space of the inverter housing 135 is divided into an inverter space V131 housing the circuit module 131 and a heat dissipation space V133 housing the heat dissipation member 133. The inverter housing 135 includes an intake port A121 connected to the heat dissipation space V133 and an exhaust port A122 on the opposite side of the intake port A121 that also connects to the heat dissipation space V133. A cooling fan 113 is installed in the intake port A121 to send cooling air G101 to the heat dissipation space V133. In this case, the cooling air G101 comes into contact with the heat dissipation member 133, thereby cooling the power semiconductor element 141 via the heat dissipation member 133. However, in the inverter device 130, it is difficult to adequately cool other components such as the substrate 143 and power cables 147, 149, which can generate a large amount of heat in response to the heat generated by the power semiconductor element 141.

[0057] The inverter device 230 shown in Figure 4(b) includes an inverter housing 235 in place of the inverter housing 135 of the inverter device 130. The inverter housing 235 includes an intake port A121 and an exhaust port A122, as well as an intake port A221 connected to the inverter space V131, and an exhaust port S222 connected to the inverter space V131 on the opposite side of the intake port A221. Furthermore, a cooling fan 213 is installed at the intake port A221 to send cooling air G201 into the inverter space V131. In other words, in the inverter device 230, in addition to the cooling fan 113 that sends cooling air G101 into the heat dissipation space V133, another cooling fan 213 is installed to send cooling air G201 into the inverter space V131. In this case, the power semiconductor element 141, as well as other components such as the substrate 143 and power cables 147, 149, can be directly cooled. However, installing multiple cooling fans 113, 213 in this manner may increase the overall size of the device.

[0058] In contrast, in the inverter device 30 according to this embodiment, the partition wall 51 separating the inverter space V31 connected to the intake port A21 and the heat dissipation space V33 connected to the exhaust port A22 includes a through hole A23 connecting the inverter space V31 and the heat dissipation space V33. The through hole A23 is located in region R2 opposite to region R1 where the intake port A21 and exhaust port A22 are located, with the power semiconductor element 41 in the axial direction D1 in between. Therefore, the cooling air G2 that flows from the intake port A21 into the inverter space V31 is returned through the through hole A23 and passed to the heat dissipation space V33, and flows out from the exhaust port A22. In this way, the inverter space V31, the through hole A23, and the heat dissipation space V33 form a flow path for the cooling air G2 that returns from the intake port A21 through the through hole A23 to the exhaust port A22. When such a loop channel is formed, a single air source can be used to send cooling air G2 to both the inverter space V31 and the heat dissipation space V33. Therefore, in the inverter device 30, even without providing multiple cooling fans to send cooling air G2 to both the inverter space V31 and the heat dissipation space V33, both the circuit module 31 located in the inverter space V31 and the heat dissipation member 33 located in the heat dissipation space V33 can be sufficiently cooled, thus enabling sufficient cooling performance while making the entire device smaller. Furthermore, in the inverter device 30, the power cable 49 included in the circuit module 31 is drawn out from the inverter space V31 to the heat dissipation space V33 through the through hole A23. In this case, the power cable 49, which is one of the heat sources, can be effectively cooled, further improving the cooling performance. Thus, according to the inverter device 30 of this embodiment, it is possible to achieve both improved cooling performance and miniaturization.

[0059] As in this embodiment, the power cable 49 may include a first extension portion 49a extending from the main circuit board 43 along the axial direction D1, a second extension portion 49b extending along the vertical direction D2 intersecting the axial direction D1, passing through the through hole A23 and being drawn out from the inverter space V31 to the heat dissipation space V33, and a bent portion 49c positioned between the first extension portion 49a and the second extension portion 49b and bending to connect the first extension portion 49a and the second extension portion 49b. In this case, the power cable 49 can be positioned along the flow path of the cooling air G2, so that the power cable 49 can be cooled more effectively by the cooling air G2. This further improves the cooling performance.

[0060] As in this embodiment, the inverter housing 35 includes a cable inlet 16e through which the power cable 49, which is drawn out from the through-hole A23 into the heat dissipation space V33, passes. The cable inlet 16e may be formed in a different location from the exhaust port A22. In this case, the power cable 49 can be routed to follow the shortest possible path to the object to which it is connected, thus avoiding the power cable 49 becoming unnecessarily long compared to the case where the power cable 49 is drawn out from the exhaust port A22.

[0061] As in this embodiment, the side wall 16 includes a side wall portion 16b through which the exhaust port A22 opens and a side wall portion 16c through which the cable insertion port 16e opens. The side wall portion 16b may have a step formed in the direction away from the partition wall 51 relative to the side wall portion 16c. In this case, a flow space for the cooling air G2 can be secured between the partition wall 51 and the side wall portion 16b, and the heat dissipation member 33 can be placed in that space, thereby improving cooling performance.

[0062] As in this embodiment, the cross-sectional area of ​​the exhaust port A22 may be larger than the cross-sectional area of ​​the cable inlet 16e. In this case, the flow rate of the cooling air G2 flowing through the exhaust port A22 can be sufficiently ensured, thereby improving cooling performance.

[0063] The centrifugal blower 1 according to this embodiment comprises an inverter device 30 and a motor device 10 to which driving power is supplied from the inverter device 30. The motor device 10 includes a motor 11 electrically connected to a power cable 49 and capable of rotating a shaft 2 by receiving driving power supplied from the power cable 49, a cooling fan 13 attached to the shaft 2, and a motor housing 15 housing the motor 11 and the cooling fan 13. The inside of the motor housing 15 is connected to a heat dissipation space V33 through an exhaust port A22, and the cooling fan 13 rotates together with the shaft 2, causing cooling air G2 to flow into the intake port A21 through the exhaust port A22. In the centrifugal blower 1, the cooling fan 13 housed in the motor housing 15 is used as an air source to bring cooling air G2 into the intake port A21. In other words, the air source for cooling the motor 11 and bearing 14 inside the motor housing 15 and the air source for cooling the circuit module 31 and heat dissipation member 33 inside the inverter housing 35 are shared. In this case, the entire device can be made smaller compared to the case where a separate air source is provided for cooling the motor 11 and bearing 14, and a separate air source is provided for cooling the circuit module 31 and heat dissipation member 33.

[0064] As in this embodiment, the inverter housing 35 is connected to the motor housing 15 in a vertical direction D2, the shaft 2 extends along the axial direction D1, and the motor housing 15 includes an intake port A11 into which a different cooling air G1, distinct from the cooling air G2, flows in, and an exhaust port A12 into which the cooling air G1 flows out. When viewed along the vertical direction D2, the exhaust port A22 is located between the intake port A11 and the exhaust port A12 in the axial direction D1, and at least a portion of the motor 11 may be located between the intake port A11 and the exhaust port A12 in the axial direction D1. In this case, as the cooling fan 13 rotates, the cooling air G2 flowing in from the intake port A21 flows through the circuit module 31 and the heat dissipation member 33 and into the motor housing 15 from the exhaust port A22. Furthermore, as the cooling fan 13 rotates, the cooling air G1 flowing in from the intake port A11 passes through the motor 11 and then merges with the cooling air G2 from the inverter housing 35 at the exhaust port A22, and together with the cooling air G2, is discharged to the outside of the motor housing 15 from the exhaust port A12. In this configuration, where the cooling air G1 and G2 merge at the exhaust port A22, the main heat sources inside the inverter housing 35 and the main heat sources inside the motor housing 15 can be efficiently cooled by the low-temperature cooling air G1 and G2 before they exchange heat with the heat sources inside the centrifugal blower 1. In this case, for example, the heat sources inside the centrifugal blower 1 can be cooled more efficiently than when the cooling air that has exchanged heat with the heat sources inside the inverter housing is used directly to cool the heat sources inside the motor housing. Therefore, the above configuration allows for further improvement in cooling performance.

[0065] This disclosure can be implemented in various forms, including the embodiments described above, with various modifications and improvements based on the knowledge of those skilled in the art. Modifications of the embodiments can be constructed by utilizing the technical matters described in the embodiments described above.

[0066] <Variation> For example, the flow direction of the cooling air G1, G2, and G3 flowing inside the centrifugal blower 1A shown in Figure 3 may be opposite to the flow direction of the cooling air G1, G2, and G3 flowing inside the centrifugal blower 1 according to the embodiment described above. In the centrifugal blower 1A, the motor housing 15A of the motor device 10A includes an intake port A32 (second motor opening) for drawing in the cooling air G3, instead of the exhaust port A12 of the motor housing 15 described above. The motor housing 15A includes an exhaust port A31 (first motor opening) for discharging the cooling air G1, instead of the intake port A11 of the motor housing 15 described above. The inverter housing 35A of the inverter device 30A includes an intake port A42 (second inverter opening) for drawing in the cooling air G2, instead of the exhaust port A22 of the inverter housing 35 described above. The inverter housing 35A includes an exhaust port A41 (first inverter opening) for discharging cooling air G1, replacing the intake port A21 of the inverter housing 35 described above. The cooling fan 13A, located inside the motor housing 15A, is configured, for example, to draw in air from its outer periphery and exhaust it to the center.

[0067] In the centrifugal blower 1A, as the cooling fan 13A rotates, the cooling air G3 flowing in from the intake port A32 branches at the intake port A42 into cooling air G1 that passes through the motor 11 and bearing 14 inside the motor housing 15A, and cooling air G2 that passes through the circuit module 31 and heat dissipation member 33 inside the inverter housing 35. The respective cooling airs G1 and G2 are then discharged from the exhaust ports A41 and A31. Even with this configuration where the cooling airs G1 and G2 branch at the exhaust port A22, the main heat sources inside the inverter housing 35 and the main heat sources inside the motor housing 15 can be efficiently cooled by the low-temperature cooling air G1 and G2 before heat exchange with the heat sources inside the centrifugal blower 1A, similar to the embodiment described above. This allows for further improvement of cooling performance.

[0068] In the embodiments described above, a centrifugal blower was described as an example of the “rotating machine” of the Disclosure, but the “rotating machine” of the Disclosure may also be a centrifugal compressor, or an axial-flow type blower or compressor. In the embodiments described above, a centrifugal fan was described as an example of the “cooling fan” of the Disclosure, but the “cooling fan” may also be other types of fans, such as an axial-flow fan. In the embodiments described above, a power semiconductor element was exemplified as an example of the “functional element” of the Disclosure, but the “functional element” of the Disclosure may also be a diode, a resistor, or a capacitor, etc. The “heat dissipation member” of the Disclosure may be a member other than a heat sink, as long as it can dissipate the heat of the “functional element.” The “circuit module” of the Disclosure may further include elements other than the “functional element,” the “substrate,” and the “power cable.”

[0069] <Note> This disclosure includes [1] an inverter housing including a first inverter opening into which cooling air can flow in or out, a second inverter opening formed at a different position from the first inverter opening and into which the cooling air can flow in or out, and a partition wall separating a first internal space connected to the first inverter opening and a second internal space connected to the second inverter opening, A circuit module is arranged in the first internal space and includes a functional element, a substrate connected to the functional element, and a power cable connected to the substrate. A heat dissipation member is disposed in the second internal space, thermally connected to the functional element via the partition wall, and capable of releasing heat from the functional element. Equipped with, The partition wall includes a through hole connecting the first internal space and the second internal space. The through-hole is located in a region opposite to the region where the first inverter opening and the second inverter opening are located, in a first direction along the partition wall, with the functional element in between, and is capable of transferring the cooling air between the first internal space and the second internal space. The power cable is drawn out from the first internal space to the second internal space through the through-hole in the inverter device.

[0070] This disclosure includes [2] "The power cable is, A first extending portion extending from the substrate along the first direction, A second extending portion extends along a second direction intersecting the first direction, passes through the through hole, and is drawn out from the first internal space to the second internal space, It includes a bent portion that is positioned between the first extended portion and the second extended portion and bends to connect the first extended portion and the second extended portion, The inverter device described in [1].

[0071] This disclosure includes [3] "the inverter housing includes a cable entry port through which the power cable drawn out from the through hole into the second internal space passes," The cable insertion opening is formed in a different position from the second inverter opening. The inverter device described in [1] or [2].

[0072] This disclosure includes [4] "the second internal space is a space enclosed by the partition wall and a side wall that faces the partition wall with a gap between it and the partition wall in a second direction intersecting the partition wall, The aforementioned side wall is The first side wall portion through which the second inverter opening is opened, The second side wall portion includes the cable insertion opening, The first side wall portion has a step that is recessed in the direction away from the partition wall relative to the second side wall portion. The inverter device described in [3].

[0073] This disclosure states that [5] "the area of ​​the second inverter opening is larger than the area of ​​the cable entry opening." [4] The inverter device described therein.

[0074] This disclosure includes [6] "an inverter device described in any of [1] to [5], A motor device to which drive power is supplied from the inverter device, Equipped with, The motor device is A motor electrically connected to the power cable and capable of rotating the shaft by receiving the drive power supplied from the power cable, A cooling fan attached to the aforementioned shaft, The motor housing includes the motor and the cooling fan, The inside of the motor housing is connected to the second internal space through the second inverter opening. The cooling fan rotates together with the shaft to direct the cooling air into the first inverter opening or the second inverter opening. It is a rotating machine.

[0075] This disclosure includes [7] "the inverter housing is connected to the motor housing in a second direction intersecting the first direction, and the shaft extends along the first direction, The motor housing is A first motor opening into which a different cooling airflow from the aforementioned cooling airflow can flow in or out, The invention further includes a second motor opening through which the aforementioned cooling air can flow in or out, When viewed along the second direction, the second inverter opening is positioned between the first motor opening and the second motor opening in the first direction, and at least a portion of the motor is positioned between the first motor opening and the second inverter opening in the first direction. [6] The rotating machinery described therein. [Explanation of Symbols]

[0076] 1. Centrifugal blower (rotating machine) 2 shafts 10,10A motor device 11 Motor 13. Cooling fan (air source) 13A Cooling Fan 15,15A motor housing 16 side wall 16b Side wall part (first side wall part) 16c Side wall part (second side wall part) 16e cable entry port 30 Inverter device 31 Circuit Modules 33 Heat dissipation components 35,35A Inverter Enclosure 41 Power semiconductor devices (functional devices) 43 Main circuit board (board) 47,49 Power Cables 49a First extension part 49b Second extension part 49c Bend part 51 Bulkhead 143 circuit boards A11 Air intake (first motor opening) A12 Exhaust port (second motor opening) A21 Air intake (first inverter opening) A22 Exhaust port (second inverter opening) A23 through hole A31 Exhaust port (first motor opening) A32 Air intake (second motor opening) A41 Exhaust port (first inverter opening) A42 Air intake (second inverter opening) D1 Axial direction (first direction) D2 Vertical direction (second direction) G1,G2,G3 Cooling air R1,R2 area V31 Inverter space (first internal space) V33 Heat dissipation space (second internal space)

Claims

1. An inverter housing including a first inverter opening through which cooling air can flow in or out, a second inverter opening formed at a different location from the first inverter opening and through which the cooling air can flow in or out, and a partition wall separating a first internal space connected to the first inverter opening and a second internal space connected to the second inverter opening, A circuit module is arranged in the first internal space and includes a functional element, a substrate connected to the functional element, and a power cable connected to the substrate. A heat dissipation member is disposed in the second internal space, thermally connected to the functional element via the partition wall, and capable of releasing heat from the functional element. Equipped with, The partition wall includes a through hole connecting the first internal space and the second internal space. The through-hole is located in a region opposite to the region where the first inverter opening and the second inverter opening are located, in a first direction along the partition wall, with the functional element in between, and is capable of transferring the cooling air between the first internal space and the second internal space. The power cable is drawn out from the first internal space to the second internal space through the through hole in the inverter device.

2. The aforementioned power cable is A first extending portion extending from the substrate along the first direction, A second extending portion extends along a second direction intersecting the first direction, passes through the through hole, and is drawn out from the first internal space to the second internal space, It includes a bent portion that is positioned between the first extended portion and the second extended portion and bends to connect the first extended portion and the second extended portion, The inverter device according to claim 1.

3. The inverter housing includes a cable entry port through which the power cable, which is drawn out from the through hole into the second internal space, passes. The cable insertion opening is formed in a different position from the second inverter opening. The inverter device according to claim 1 or 2.

4. The aforementioned second internal space is a space enclosed by the partition wall and a side wall that faces the partition wall with a gap between it and the partition wall in a second direction intersecting the partition wall. The aforementioned side wall is The first side wall portion through which the second inverter opening is opened, The second side wall portion includes the cable insertion opening, The first side wall portion has a step that is recessed in the direction away from the partition wall relative to the second side wall portion. The inverter device according to claim 3.

5. The cross-sectional area of ​​the second inverter opening is larger than the cross-sectional area of ​​the cable entry opening. The inverter device according to claim 4.

6. An inverter device according to claim 1 or 2, A motor device to which drive power is supplied from the inverter device, Equipped with, The motor device is A motor electrically connected to the power cable and capable of rotating the shaft by receiving the drive power supplied from the power cable, A cooling fan attached to the aforementioned shaft, The motor housing includes the motor and the cooling fan, The inside of the motor housing is connected to the second internal space through the second inverter opening. The cooling fan rotates together with the shaft to direct the cooling air into the first inverter opening or the second inverter opening. Rotating machinery.

7. The inverter housing is connected to the motor housing in a second direction intersecting the first direction, and the shaft extends along the first direction. The motor housing is A first motor opening into which a different cooling airflow from the aforementioned cooling airflow can flow in or out, The invention further includes a second motor opening through which the aforementioned cooling air can flow in or out, When viewed along the second direction, the second inverter opening is positioned between the first motor opening and the second motor opening in the first direction, and at least a portion of the motor is positioned between the first motor opening and the second inverter opening in the first direction. The rotating machine according to claim 6.

Images