A capacitor and a circuit board on which it is mounted.

The capacitor design with a pressure receiving plate and seat plate connection via orthogonal and parallel projections addresses the issue of the sealing body being pushed into the case during molding, ensuring the capacitor element's protection by providing a stable fixing area.

JP2026060189APending Publication Date: 2026-04-08SAN DENSHI INDS
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-09-27
Publication Date
2026-04-08

AI Technical Summary

Technical Problem

The sealing body inside the capacitor case is pushed into the case during molding due to the pressure of the flowing mold resin, potentially damaging the capacitor element.

Method used

A pressure receiving plate is placed on the opening side of the case with projections that extend beyond the case opening, connected to a seat plate via orthogonal and parallel portions, and fixed using adhesive or laser welding, preventing the sealing body from being pushed into the case.

Benefits of technology

Prevents the sealing body from being pushed into the case during mold molding, thus protecting the capacitor element by providing a stable and wide fixing area through the pressure receiving plate and seat plate connection.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates to a capacitor and a capacitor-mounted circuit board on which it is mounted, and aims to prevent the sealing body from being pushed into the case by the flowing molding resin during the molding process. [Solution] A pressure receiving plate 11 is placed on the side of the sealing body 5 facing the opening 2 of the case 3. The outer circumference of the pressure receiving plate 11 is covered by the bent portion 10 of the case 3 when viewed from the opening 2 side of the case 3. The pressure receiving plate 11 is provided with a projection 15 that protrudes toward the seat plate 6, and the pressure receiving plate 11 and the seat plate 6 are joined and integrated via this projection 15. The projection 15 has an orthogonal portion 16 that extends perpendicular to the line connecting the anode connection terminal 7 and the cathode connection terminal 8 between the anode connection terminal 7 and the cathode connection terminal 8, and parallel portions 17 that extend in a direction parallel to the line connecting the anode connection terminal 7 and the cathode connection terminal 8 at both ends of the orthogonal portion 16.
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Description

Technical Field

[0004] ,

[0001] The present invention relates to a capacitor and a capacitor mounting circuit board on which the capacitor is mounted.

Background Art

[0002] In a capacitor mounting circuit board in which a capacitor is mounted together with other components on the surface side of a circuit board, a structure has been proposed in which the surface side of the circuit board is covered with a molding resin to protect the capacitor and other components from heat, shock, etc. (for example, Patent Document 1 below).

[0003] In this prior document, as a problem in the case of covering a capacitor and other components with a molding resin, it is pointed out that the case constituting the capacitor receives the pressure of the molding resin and is deformed.

[0004] That is, the capacitor has a cylindrical case with an opening at one end, a capacitor element housed in this case, a sealing body mounted on the opening side of the capacitor element in the case, and a seat plate arranged in a facing state with respect to the sealing body outside the opening side of the case. In order to prevent the side surface of the case from deforming inward due to the pressure of the flowing molding resin during mold molding, a pressure absorbing member made of silicon is provided on the outer peripheral surface of the case.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] The aforementioned prior literature focuses on the inward deformation of the case sides due to the molding resin, but in reality, the bigger problem is that the sealing body installed on the opening side inside the case is pushed into the case by the pressure of the flowing molding resin during molding, rather than the deformation of the case itself. Specifically, this is as follows:

[0007] The outer periphery of the case has a constricted section that tapers towards the outer periphery of the sealing body. The sealing body is deformed inward at this constricted section of the case, thus ensuring airtightness within the case. For this reason, it is essential that the sealing body be made of an elastic material.

[0008] Therefore, during the above-mentioned molding process, if the pressure of the flowing mold resin is applied to the sealing body exposed to the outside of the case at the case opening, this sealing body may elastically deform and be pushed into the case, potentially damaging the capacitor element.

[0009] Therefore, the present invention aims to prevent the sealing body from being pushed into the case by the flowing mold resin during mold molding. [Means for solving the problem]

[0010] To achieve this objective, the capacitor of the present invention has a pressure receiving plate placed on the opening side of the case of the sealing body, and the anode and cathode connection terminals of the capacitor element are configured to extend outside the opening of the case, passing through the pressure receiving plate, and the outer periphery of the pressure receiving plate on the opening side of the case, beyond the portion through which the anode and cathode connection terminals pass, is covered by the bent portion of the case when viewed from the opening side of the case.

[0011] Furthermore, when viewed from the opening side of the case, the pressure receiving plate is provided with a projection that protrudes toward the seat plate in the portion of the outer circumference covered by the bent portion of the case. The projection has an orthogonal portion extending in a direction perpendicular to the line connecting the anode and cathode connection terminals, and parallel portions extending in a direction parallel to the line connecting the anode and cathode connection terminals at both ends of the orthogonal portion. The pressure receiving plate is connected to the seat plate via at least the parallel portion of the projection.

[0012] Furthermore, the projection in the capacitor of the present invention is configured to protrude beyond the opening of the case towards the base plate, and the base plate is provided with a fitting portion into which the projection is fitted, and the projection is fixed to the fitting portion.

[0013] Furthermore, the base plate portion of the capacitor of the present invention is provided with a through hole through which the projection passes, as the fitting portion, and an enlarged diameter portion is provided at the end of the through hole opposite to the pressure receiving plate.

[0014] Furthermore, the capacitor of the present invention has a configuration in which an adhesive is placed in the enlarged portion of the through hole, and the projection is fixed to the base plate with the adhesive.

[0015] Furthermore, the capacitor of the present invention is constructed such that the pressure receiving plate and the base plate are made of synthetic resin, the protrusions are brought into contact with the base plate, and the protrusions are bonded to the base plate with adhesive.

[0016] Furthermore, the capacitor of the present invention is constructed such that the pressure receiving plate and the seat plate are made of synthetic resin, the protrusions are brought into contact with the seat plate, and the protrusions are joined to the seat plate by laser welding.

[0017] Furthermore, the capacitor of the present invention has a recess provided in the portion of the base plate that the projection contacts.

[0018] Furthermore, the capacitor mounting circuit board of the present invention has a configuration in which a capacitor is mounted on the surface of the circuit board, and on the surface of the circuit board, at least the part of the capacitor that is on the circuit board side of the constricted portion of the case, and the base plate are covered with molded resin. [Effects of the Invention]

[0019] As described above, the capacitor of the present invention has a pressure receiving plate placed on the opening side of the case of the sealing body, and the anode connection terminal and cathode connection terminal of the capacitor element are configured to extend outside the opening of the case, passing through the pressure receiving plate, and the outer periphery of the pressure receiving plate on the opening side of the case, beyond the portion through which the anode connection terminal and cathode connection terminal pass, is covered by the bent portion of the case when viewed from the opening side of the case.

[0020] Furthermore, when viewed from the opening side of the case, the pressure receiving plate is provided with a projection that protrudes toward the seat plate in the portion of the outer circumference covered by the bent part of the case. This projection has an orthogonal portion that extends perpendicularly to the line connecting the anode and cathode connection terminals, and parallel portions that extend parallel to the line connecting the anode and cathode connection terminals at both ends of this orthogonal portion. The pressure receiving plate is connected to the seat plate via at least the parallel portion of this projection, thereby preventing the sealing body from being pushed into the case by the flowing mold resin during molding.

[0021] In other words, in this invention, a pressure receiving plate is placed on the opening side of the case of the sealing body, and a projection is provided on this pressure receiving plate that protrudes toward the opposite side from the case, and the pressure receiving plate and the seat plate are connected via this projection.

[0022] At this time, since the base plate is in contact with the opening of the case, the pressure receiving plate is not pushed into the case by the flowing molded resin. As a result, the sealing body is also prevented from being pushed into the case, thus preventing damage to the capacitor element.

[0023] Further, the protruding body has an orthogonal portion extending between the anode connection terminal and the cathode connection terminal so as to be orthogonal to the line connecting these anode connection terminal and cathode connection terminal, and parallel portions extending in a direction parallel to the line connecting the anode connection terminal and the cathode connection terminal on both end sides of this orthogonal portion. At least the parallel portion of the protruding body is configured to connect the pressure receiving plate to the seat plate. Therefore, when performing mold molding, no matter from which direction the flowing mold resin enters, it is possible to suppress the sealing body from being pushed into the case by the flowing mold resin.

Brief Description of the Drawings

[0024] [Figure 1] Perspective view of a capacitor according to an embodiment of the present invention [Figure 2] Exploded perspective view of the capacitor [Figure 3] Front side perspective view of the sealing body and the pressure receiving plate of the capacitor [Figure 4] Back side perspective view of the sealing body and the pressure receiving plate of the capacitor [Figure 5] Front view of the capacitor in a state where the sealing body and the pressure receiving plate are combined [Figure 6] Front view of the capacitor in a state where the sealing body and the pressure receiving plate are attached to the capacitor element [Figure 7] Partial cross-sectional view of the capacitor [Figure 8] Perspective view of the capacitor before attaching the seat plate [Figure 9] Perspective view of the capacitor after attaching the seat plate [Figure 10] Perspective view of a capacitor according to another embodiment of the present invention [Figure 11] Perspective view of the capacitor [Figure 12] Exploded perspective view of the capacitor [Figure 13] Front side perspective view of the sealing body of the capacitor [Figure 14] Back side perspective view of the sealing body of the capacitor [Figure 15]Front side perspective view of the pressure receiving plate of the capacitor. [Figure 16] Rear side perspective view of the pressure receiving plate of the capacitor. [Figure 17] Front view of the capacitor with the sealing body and pressure receiving plate connected. [Figure 18] Front view of the capacitor with the sealing body and pressure receiving plate connected. [Figure 19] Front view of the capacitor element with the sealing body and pressure receiving plate attached. [Figure 20] Cross-sectional view of the capacitor element of the capacitor with the sealing body and pressure receiving plate attached. [Figure 21] Perspective view of the capacitor after the base plate has been installed. [Figure 22] Cross-sectional view of the capacitor after the base plate has been attached. [Figure 23] Rear side perspective view of the capacitor after the base plate has been attached. [Figure 24] Rear view perspective showing the completed state of the capacitor. [Figure 25] Front view showing the completed state of the capacitor. [Figure 26] Cross-sectional view showing the completed state of the capacitor. [Modes for carrying out the invention]

[0025] (Embodiment 1) As shown in Figures 1 and 2, the capacitor 1 of this embodiment comprises a cylindrical case 3 made of aluminum with an opening 2 at one end, a capacitor element 4 housed inside the case 3, a sealing body 5 made of an elastic material mounted inside the case 3 on the side of the capacitor element 4 towards the opening 2, and a base plate 6 positioned on the outside of the case 3 on the side of the opening 2, facing the sealing body 5.

[0026] The capacitor element 4 has an anode connection terminal 7 that penetrates the sealing body 5 and extends to the base plate 6 outside the opening 2, and a cathode connection terminal 8.

[0027] As shown in Figure 7, the outer circumference of the case 3, which corresponds to the outer circumference of the sealing body 5, is provided with a constricted portion 9 that narrows toward the outer circumference of the sealing body 5, and the end of the case 3 on the opening 2 side is provided with a bent portion 10 that is bent in the inward direction of the case 3.

[0028] The above configuration is similar to that of the conventional example, and the features of this embodiment will be described below.

[0029] In this embodiment, as shown in Figures 3 to 6, a pressure receiving plate 11 is placed on the side of the sealing body 5 facing the opening 2 of the case 3, and the anode connection terminal 7 and cathode connection terminal 8 of the capacitor element 4 pass through the through hole 13 of the sealing body 5 and the through hole 14 of the pressure receiving plate 11, and are configured to extend outside the opening 2 of the case 3, as shown in Figure 8.

[0030] On the side of the pressure receiving plate 11 facing the opening 2 of the case 3, the outer periphery of the portion through which the anode connection terminal 7 and cathode connection terminal 8 pass is covered by the bent portion 10 of the case 3, as seen from the opening 2 side of the case 3, as shown in Figure 7.

[0031] In other words, it prevents the sealing body 5 and the pressure receiving plate 11 from coming out of the case 3.

[0032] Furthermore, when viewed from the opening 2 side of the case 3, the pressure receiving plate 11 is provided with a projection 15 that protrudes toward the seat plate 6 in the portion inward from the outer circumference covered by the bent portion 10 of the case 3.

[0033] As can be seen from Figures 4 and 8, the projection 15 has an orthogonal portion 16 that extends perpendicularly to the line connecting the anode connection terminal 7 and the cathode connection terminal 8 between the anode connection terminal 7 and the cathode connection terminal 8, and parallel portions 17 that extend parallel to the line connecting the anode connection terminal 7 and the cathode connection terminal 8 at both ends of the orthogonal portion 16.

[0034] As shown in Figure 8, the projection 15 of the pressure receiving plate 11 is configured to protrude beyond the opening 2 of the case 3 towards the seat plate 6.

[0035] The seat plate 6 is provided with a through hole 18 as a fitting portion into which the projection 15 is fitted, and the projection 15 is fixed in this through hole 18. The shape of the through hole 18 is similar to that of the projection 15 so that the orthogonal portion 16 and the parallel portion 17 of the projection 15 can be fitted together.

[0036] To further explain the fixing of the projection 15 and the through hole 18, an enlarged diameter portion 19 is provided at the end of the through hole 18 opposite to the pressure receiving plate 11, as shown in Figures 1 and 9. Adhesive (not shown) is placed in the enlarged diameter portion 19, and the projection 15 of the pressure receiving plate 11 is fixed and joined to the seat plate 6 by this adhesive.

[0037] In this embodiment, the pressure receiving plate 11 is connected to the seat plate 6 by the orthogonal portion 16 and the parallel portion 17 of the projection 15, resulting in strong fixing strength between the pressure receiving plate 11 and the seat plate 6.

[0038] Furthermore, the projection 15 protrudes slightly above the bottom of the seat plate 6, so as not to obstruct the flat mounting state of the seat plate 6.

[0039] Furthermore, both the projection 15 and the seat plate 6 are made of synthetic resin, ensuring that the bond and fixation between the projection 15 and the seat plate 6 using adhesive is stable.

[0040] Next, I will explain the manufacturing method.

[0041] First, as shown in Figure 5, the sealing body 5 and the pressure receiving plate 11 are connected.

[0042] Although these sealing bodies 5 and pressure receiving plates 11 do not need to be fixed in place, in order for the anode connection terminal 7 and cathode connection terminal 8 to continuously pass through the through-hole 13 in the sealing body 5 and the through-hole 14 in the pressure receiving plate 11, as shown in Figure 8, these sealing bodies 5 and pressure receiving plates 11 need to be integrated in a fixed position.

[0043] To this end, in this embodiment, as shown in Figure 4, a groove 20 is provided on the side of the sealing body 5 that faces the pressure receiving plate 11, and a projection 21 that penetrates the groove 20 is provided on the side of the pressure receiving plate 11 that faces the sealing body 5 and corresponds to the groove 20.

[0044] Then, the fitting of these grooves 20 and projections 21 integrates the sealing body 5 and the pressure receiving plate 11 in their fixed positions.

[0045] Furthermore, as shown in Figure 4, the groove 20 of the sealing body 5 is rectangular in shape, extending between the left and right through holes 13 in a direction perpendicular to the line connecting these two through holes 13.

[0046] Furthermore, to match the shape of this groove 20, the projection 21 of the pressure receiving plate 11 was also made rectangular, as shown in Figure 3.

[0047] However, both the long-side and short-side dimensions of the projection 21 of the pressure receiving plate 11 are shorter than the long-side and short-side dimensions of the corresponding groove 20 of the sealing body 5.

[0048] Furthermore, the height dimension of the projection 21 of the pressure receiving plate 11 is smaller than the depth dimension of the groove 20 of the sealing body 5.

[0049] In the configuration described above, the groove 20 of the sealing body 5, which is made of an elastic material, has a portion that is narrower in the width direction (short side direction). When the projection 21 of the pressure receiving plate 11 is used to push and widen this portion while fitting the two together, they can maintain a single unit state as shown in Figure 5, which improves convenience during production.

[0050] Let's continue the explanation regarding the pressure receiving plate 11 and the sealing body 5.

[0051] Both the pressure receiving plate 11 and the sealing body 5 are disc-shaped, but the outer diameter of the pressure receiving plate 11 is smaller than that of the sealing body 5. On the side of the case 3 facing the opening 2, the outer circumference of the pressure receiving plate 11 beyond the through-hole 14 through which the anode connection terminal 7 and cathode connection terminal 8 pass is covered by the bent portion 10 of the case 3 when viewed from the opening 2 side of the case 3. In other words, the pressure receiving plate 11 and the sealing body 5 are structured in such a way that movement outside the opening 2 is prevented by the bent portion 10.

[0052] Furthermore, the outer circumference of the pressure receiving plate 11 is larger than the inner circumference of the constricted portion 9 of the case 3, which prevents the pressure receiving plate 11 from moving towards the capacitor element 4 while pressing against the sealing body 5.

[0053] Next, the integrated pressure receiving plate 11 and sealing body 5, as shown in Figure 5, are integrated with the capacitor element 4 as shown in Figure 6.

[0054] In other words, the anode connection terminal 7 and cathode connection terminal 8 of the capacitor element 4 are passed through the through-hole 13 of the sealing body 5 and the through-hole 14 of the pressure receiving plate 11, resulting in the state shown in Figure 6.

[0055] Next, the capacitor element 4 in this state is inserted into the case 3 through its opening 2, and then the end of the case 3 on the opening 2 side is bent inward to form the bent portion 10, as shown in Figures 7 and 8.

[0056] At this time, the projection 15 of the pressure receiving plate 11 protrudes outward (towards the seat plate 6) from the end of the case 3 on the opening 2 side (in this case, the bent portion 10), as shown in Figure 8.

[0057] Next, in this state, attach the seat plate 6 to the opening 2 side of case 3 as shown in Figure 9.

[0058] In other words, the anode connection terminal 7 and cathode connection terminal 8 of the capacitor element 4 pass through the through hole 14 of the base plate 6 on the opposite side from the case 3, and the projection 15 of the pressure receiving plate 11 is fitted into the through hole 18 of the base plate 6.

[0059] Next, adhesive (not shown) is placed in the enlarged diameter portion 19 provided at the end of the through hole 18 opposite to the pressure receiving plate 11, and the projection 15 of the pressure receiving plate 11 is fixed and joined to the seat plate 6 with this adhesive.

[0060] Alternatively, instead of using adhesive, ultrasonic heat welding may be employed. For example, the projection 15 is passed through the through-hole 18 of the seat plate 6, and an ultrasonic horn (not shown) is brought into contact with the tip of the projection 15, and the ultrasonic horn is vibrated. This causes the projection 15 to melt, and the projection 15 of the pressure receiving plate 11 and the seat plate 6 can be heat-welded together.

[0061] In this embodiment, the pressure receiving plate 11 is connected to the seat plate 6 by the orthogonal portion 16 and the parallel portion 17 of the projection 15, resulting in strong fixing strength between the pressure receiving plate 11 and the seat plate 6.

[0062] Furthermore, in this state, the opening 2 of case 3 (in this case, the bent portion 10) is in contact with the surface of the seat plate 6 on the case 3 side.

[0063] Finally, as shown in Figure 1, the anode connection terminal 7 and cathode connection terminal 8 are placed on the underside of the base plate 6 and bent to the left and right to complete the assembly.

[0064] Then, this capacitor 1 will be mounted (soldered) onto a circuit board (not shown).

[0065] When a circuit board with a capacitor 1 mounted on its surface along with other components is referred to as a capacitor-mounted circuit board, and the surface of the circuit board is covered with a molding resin for the capacitor 1 and other components, the capacitor-mounted circuit board is placed inside a mold and the molding resin is injected under pressure.

[0066] Conventionally, during mold molding, there was a risk that the sealing body 5 would be pushed into the case 3 by the molding resin flowing inside the mold, but in this embodiment, this can be suppressed.

[0067] In other words, in this embodiment, a pressure receiving plate 11 is placed on the side of the sealing body 5 that faces the opening 2 of the case 3, and a projection 15 is provided on the pressure receiving plate 11 that protrudes toward the opposite side from the case 3, and the pressure receiving plate 11 and the seat plate 6 are connected via this projection 15.

[0068] At this time, since the seat plate 6 is in contact with the opening 2 of the case 3, the pressure receiving plate 11 is not pushed into the case 3 by the flowing mold resin. As a result, the sealing body 5 is also prevented from being pushed into the case 3, thus preventing damage to the capacitor element 4.

[0069] Furthermore, the projection 15 has an orthogonal portion 16 that extends perpendicularly to the line connecting the anode connection terminal 7 and the cathode connection terminal 8, and parallel portions 17 that extend parallel to the line connecting the anode connection terminal 7 and the cathode connection terminal 8 at both ends of the orthogonal portion 16. The pressure receiving plate 11 is connected to the seat plate 6 via the orthogonal portion 16 and the parallel portion 17 of the projection 15. As a result, during molding, regardless of the direction from which the flowing mold resin enters the case 3, it is possible to prevent the sealing body 5 from being pushed into the case 3 by the flowing mold resin. In other words, rather than fixing only the center point of the pressure receiving plate 11 to the base plate 6, connecting the pressure receiving plate 11 to the base plate 6 via the orthogonal portion 16 and the parallel portion 17 of the projection 15 results in a wider fixing area between the pressure receiving plate 11 and the base plate 6, and the fixing is more spread out overall. Therefore, during mold molding, regardless of the direction from which the flowing mold resin enters the case 3, it is possible to suppress the sealing body 5 from being pushed into the case 3 by the flowing mold resin.

[0070] (Embodiment 2) Figures 10 to 26 show other embodiments of the present invention, in which only the pressure receiving plate 11 and seat plate 6 of the above embodiment are changed. Therefore, the same reference numerals are used for parts that are the same as in the above embodiment.

[0071] As shown in Figures 10 to 13, the capacitor 22 of this embodiment comprises a cylindrical case 3 made of aluminum with an opening 2 at one end, a capacitor element 4 housed inside the case 3, a sealing body 5 made of an elastic material mounted inside the case 3 on the side of the capacitor element 4 towards the opening 2, and a base plate 23 positioned on the outside of the case 3 on the side of the opening 2, facing the sealing body 5.

[0072] The capacitor element 4 has an anode connection terminal 7 that penetrates the sealing body 5 and extends to the base plate 6 outside the opening 2, and a cathode connection terminal 8.

[0073] As shown in Figure 22, the outer circumference of the case 3, which corresponds to the outer circumference of the sealing body 5, is provided with a constricted portion 9 that narrows toward the outer circumference of the sealing body 5, and the end of the case 3 on the opening 2 side is provided with a bent portion 10 that is bent toward the inner circumference of the case 3.

[0074] The above configuration is similar to that of the conventional example, and the features of this embodiment will be described below.

[0075] In this embodiment, as shown in Figures 12 to 18, a pressure receiving plate 24 is placed on the side of the sealing body 5 facing the opening 2 of the case 3, and the anode connection terminal 7 and cathode connection terminal 8 of the capacitor element 4 extend outside the opening 2 of the case 3 by passing through the through hole 13 of the sealing body 5 and the through hole 25 of the pressure receiving plate 24, as shown in Figures 19 and 20.

[0076] On the side of the pressure receiving plate 24 facing the opening 2 of the case 3, the outer periphery of the portion through which the anode connection terminal 7 and cathode connection terminal 8 pass is covered by the bent portion 10 of the case 3, as seen from the opening 2 side of the case 3, as shown in Figures 21 and 22.

[0077] In other words, the sealing body 5 and the pressure receiving plate 24 are prevented from coming out of the case 3.

[0078] Furthermore, when viewed from the opening 2 side of the case 3, the pressure receiving plate 24 is provided with a projection 26 that protrudes toward the seat plate 6 in the portion inward from the outer circumference covered by the bent portion 10 of the case 3.

[0079] As can be seen from Figure 16 and the like, the projection 26 has an orthogonal portion 27 that extends perpendicularly to the line connecting the anode connection terminal 7 and the cathode connection terminal 8 between the anode connection terminal 7 and the cathode connection terminal 8, and parallel portions 28 that extend parallel to the line connecting the anode connection terminal 7 and the cathode connection terminal 8 at both ends of the orthogonal portion 27.

[0080] The projection 26 of the pressure receiving plate 24 is configured to protrude beyond the opening 2 of the case 3 towards the seat plate 23.

[0081] The surface of the seat plate 23 facing the case 3 is flat, but as shown in Figure 22, the opening 2 of the case 3 abuts against the outer circumference, and the seat plate 23 supports the case 3. Furthermore, on the inner circumference of the surface of the seat plate 23 facing the case 3, a recess 23a is provided, as shown in Figure 22, into which the projections 26 (orthogonal portion 27, parallel portion 28) of the pressure receiving plate 24 fit.

[0082] The shape of the recess 23a is similar to that of the projection 26, and the flat surface (bottom surface) of the recess 23a and the flat surface (bottom surface) of the projection 26 are in contact with each other. By irradiating the projection 26 of the projection 26 with a laser from the opposite side of the pressure receiving plate 24 of the seat plate 23 towards the orthogonal portion 27 and the parallel portion 28 of the projection 26, the projection 26 of the pressure receiving plate 24 is fixed and joined to the recess 23a of the seat plate 23.

[0083] To this end, the pressure receiving plate 24 is made of a laser light absorbing material, and the seat plate 23 is made of a laser light transmitting material.

[0084] In other words, in this embodiment, the surface of the projection 26 of the pressure receiving plate 24 on the seat plate 23 side and the surface of the recess 23a of the seat plate 23 on the pressure receiving plate 24 side are brought into flat contact, and then the seat plate 23 and the pressure receiving plate 24 are welded together at the flat contact portion by laser irradiation from the seat plate 23 side.

[0085] The seat plate 23 and the pressure receiving plate 24 can be formed from PPS (polyphenylene sulfide) resin, PPA (polyphthalamide) resin, LCP (liquid crystal polymer) resin, or the like.

[0086] If the seat plate 23 is formed from a laser light-transmitting material, it should be made transparent.

[0087] Furthermore, if the pressure receiving plate 24 is formed from a laser light absorbing material, it will be made black.

[0088] When heat-welding the pressure receiving plate 24 and the seat plate 23 by irradiating them with laser light, it is preferable to make the pressure receiving plate 24 and the seat plate 23 from LCP (liquid crystal polymer) resin from the viewpoint of heat resistance.

[0089] For example, the seat plate 23 is formed from E6008 as an LCP (liquid crystal polymer) resin.

[0090] Furthermore, the pressure receiving plate 24 is formed from E6008B, which is an LCP (liquid crystal polymer) resin.

[0091] In this embodiment, the pressure receiving plate 24 is connected to the seat plate 23 by the orthogonal portion 27 and the parallel portion 28 of the projection 26, resulting in strong fixing strength between the pressure receiving plate 24 and the seat plate 23.

[0092] Next, I will explain the manufacturing method.

[0093] First, as shown in Figures 17 and 18, the sealing body 5 and the pressure receiving plate 24 are connected.

[0094] While these sealing bodies 5 and pressure receiving plates 24 do not need to be fixed in place, in order for the anode connection terminal 7 and cathode connection terminal 8 to continuously pass through the through-hole 13 in the sealing body 5 and the through-hole 25 in the pressure receiving plate 24, as shown in Figures 19 and 20, these sealing bodies 5 and pressure receiving plates 24 need to be integrated in a fixed position.

[0095] To this end, in this embodiment, as shown in Figure 14, a groove 20 is provided on the pressure receiving plate 24 side of the sealing body 5, and a projection 29 that penetrates the groove 20 is provided on the sealing body 5 side of the pressure receiving plate 24 corresponding to the groove 20.

[0096] Then, the fitting of these grooves 20 and projections 29 integrates the sealing body 5 and the pressure receiving plate 24 into a fixed position.

[0097] Furthermore, as shown in Figure 14, the groove 20 of the sealing body 5 is rectangular in shape, extending between the left and right through holes 13 in a direction perpendicular to the line connecting these two through holes 13.

[0098] Furthermore, to match the shape of this groove 20, the projection 29 of the pressure receiving plate 24 was also made rectangular, as shown in Figure 15.

[0099] The long-side and short-side dimensions of the projections 29 of the pressure receiving plate 24 are shorter than the long-side and short-side dimensions of the corresponding grooves 20 of the sealing body 5.

[0100] Furthermore, the height dimension of the projection 29 of the pressure receiving plate 24 is smaller than the depth dimension of the groove 20 of the sealing body 5.

[0101] In the configuration described above, the groove 20 of the sealing body 5, which is made of an elastic material, has a portion that is narrower in the width direction (short side direction). When the projection 29 of the pressure receiving plate 24 is used to push and expand this portion while fitting the two together, the two can maintain an integrated state as shown in Figures 17 and 18, thereby improving convenience during production.

[0102] Let's continue the explanation regarding the pressure receiving plate 24 and the sealing body 5.

[0103] Both the pressure receiving plate 24 and the sealing body 5 are disc-shaped, but the outer diameter of the pressure receiving plate 24 is smaller than that of the sealing body 5. On the side of the case 3 facing the opening 2, the outer circumference of the pressure receiving plate 24, beyond the through-hole 25 through which the anode connection terminal 7 and cathode connection terminal 8 pass, is covered by the bent portion 10 of the case 3 when viewed from the opening 2 side of the case 3. In other words, the pressure receiving plate 24 and the sealing body 5 are structured in such a way that movement outside the opening 2 is prevented by the bent portion 10.

[0104] Furthermore, the outer circumference of the pressure receiving plate 24 is larger than the inner circumference of the constricted portion 9 of the case 3, which prevents the pressure receiving plate 11 from moving towards the capacitor element 4 while pressing against the sealing body 5.

[0105] Next, the integrated pressure receiving plate 24 and sealing body 5, as shown in Figures 17 and 18, are integrated with the capacitor element 4 as shown in Figures 19 and 20.

[0106] In other words, the anode connection terminal 7 and cathode connection terminal 8 of the capacitor element 4 are passed through the through-hole 13 of the sealing body 5 and the through-hole 25 of the pressure receiving plate 24, resulting in the state shown in Figures 19 and 20.

[0107] Next, the capacitor element 4 in this state is inserted into the case 3 through its opening 2, and then the end of the case 3 on the opening 2 side is bent inward as shown in Figure 22 to form the bent portion 10.

[0108] At this time, the projection 26 of the pressure receiving plate 24 protrudes outward (towards the seat plate 23) from the end of the case 3 on the opening 2 side (in this case, the bent portion 10), as shown in Figure 22.

[0109] Next, in this state, attach the seat plate 23 to the opening 2 side of case 3 as shown in Figures 21 and 22.

[0110] In other words, the anode connection terminal 7 and cathode connection terminal 8 of the capacitor element 4 pass through the through hole 30 of the base plate 23 on the opposite side from the case 3, and the projection 26 of the pressure receiving plate 24 is fitted into the recess 23a of the base plate 23.

[0111] Next, by irradiating the projection 26 of the pressure receiving plate 24 with a laser from the opposite side of the seat plate 23 from the pressure receiving plate 24, the projection 26 of the pressure receiving plate 24 is fixed and connected to the recess 23a of the seat plate 23.

[0112] In order to bring the opening 2 side of case 3 into contact with the base plate 23, a small gap must be provided between the projection 26 and the recess 23a of the base plate 23, and the opening side of case 3 must first be brought into contact with the base plate 23. In order to laser weld the projection 26 and the recess 23a of the base plate 23 in that state, it is necessary to press and deform the side of the recess 23a of the base plate 23 opposite to the capacitor element 4 toward the projection 26. Alternatively, the recess 23a can be softened (slightly melted) by laser irradiation, and the displaced portion of this molten part can be brought into contact with the projection 26 and integrated with the projection 26.

[0113] In this embodiment, the pressure receiving plate 24 is joined to the seat plate 23 by laser welding using the orthogonal portion 27 and the parallel portion 28 of the projection 26, resulting in strong fixing strength between the pressure receiving plate 24 and the seat plate 23.

[0114] Furthermore, in this state, the opening 2 of case 3 (in this case, the bent portion 10) is in contact with the surface of the seat plate 23 on the case 3 side.

[0115] Finally, as shown in Figures 25 and 26, the anode connection terminal 7 and cathode connection terminal 8 are folded to the left and right on the underside of the base plate 23 to complete the assembly.

[0116] Then, this capacitor 22 will be mounted (soldered) onto a circuit board (not shown).

[0117] When a circuit board with a capacitor 22 mounted on its surface along with other components is referred to as a capacitor-mounted circuit board, and the surface of the circuit board is covered with the capacitor 22 and other component molding resin, the capacitor-mounted circuit board is placed in a mold and the molding resin is injected under pressure.

[0118] Conventionally, during mold molding, there was a risk that the sealing body 5 would be pushed into the case 3 by the molding resin flowing inside the mold, but in this embodiment, this can be suppressed.

[0119] In other words, in this embodiment, a pressure receiving plate 24 is placed on the side of the sealing body 5 facing the opening 2 of the case 3, and a projection 26 is provided on this pressure receiving plate 241 that protrudes toward the opposite side from the case 3, and the pressure receiving plate 24 and the seat plate 23 are connected via this projection 26.

[0120] At this time, since the seat plate 23 is in contact with the opening 2 of the case 3, the pressure receiving plate 24 is not pushed into the case 3 by the flowing mold resin. As a result, the sealing body 5 is also prevented from being pushed into the case 3, thus preventing damage to the capacitor element 4.

[0121] Furthermore, the projection 26 has an orthogonal portion 27 that extends perpendicularly to the line connecting the anode connection terminal 7 and the cathode connection terminal 8, and parallel portions 28 that extend parallel to the line connecting the anode connection terminal 7 and the cathode connection terminal 8 at both ends of the orthogonal portion 27. The pressure receiving plate 24 is connected to the seat plate 23 via the orthogonal portion 27 and the parallel portion 28 of the projection 26. As a result, during molding, regardless of the direction from which the flowing mold resin enters the case 3, it is possible to prevent the sealing body 5 from being pushed into the case 3 by the flowing mold resin. In other words, rather than fixing only the center point of the pressure receiving plate 24 to the base plate 23, connecting the pressure receiving plate 24 to the base plate 23 via the orthogonal portion 27 and parallel portion 28 of the projection 26 results in a wider fixing area between the pressure receiving plate 24 and the base plate 23, and the fixing is more spread out overall. Therefore, during mold molding, regardless of the direction from which the flowing mold resin enters the case 3, it is possible to suppress the sealing body 5 from being pushed into the case 3 by the flowing mold resin. [Explanation of Symbols]

[0122] 1 Capacitor 2 openings 3 cases 4 Capacitor elements 5 Sealing body 6 Seat board 7. Anode connection terminal 8 Cathode connection terminal 9. Aperture section 10 Bend section 11 Pressure receiving plate 13 Through hole 14 Through holes 15 Protrusion 16. Orthogonal section 17 Parallel section 18 Through holes 19 Expanded diameter part 20 grooves 21 Protrusion 22 Capacitors 23 Seat board 23a Recess 24 Pressure receiving plate 25 Through holes 26 Protrusion 27 Orthogonal section 28 Parallel section 29 Protrusion 30 Through holes

Claims

1. The device comprises a cylindrical case with an opening at one end, a capacitor element housed within the case, a sealing body made of an elastic material mounted on the side of the case closer to the opening than the capacitor element, and a base plate positioned opposite the sealing body on the outside of the case on the opening side. The capacitor element has an anode connection terminal and a cathode connection terminal that penetrate the sealing body and extend to the base plate outside the opening. The outer periphery of the case, corresponding to the outer periphery of the sealing body, is provided with a constricted portion that narrows toward the outer periphery of the sealing body. In a capacitor in which a bent portion is provided at the end of the case on the opening side, the case is bent in the circumferential direction, A pressure receiving plate is placed on the opening-side surface of the sealing body. The anode connection terminal and the cathode connection terminal are configured to extend from inside the case to outside the opening, passing through the pressure receiving plate. On the side of the case facing the opening, the outer periphery of the pressure receiving plate, beyond the portion through which the anode and cathode connection terminals pass, is covered by the bent portion when viewed from the opening side. When the pressure receiving plate is viewed from the opening side, a projection is provided in the portion of the pressure receiving plate that is inward from the portion covered by the bent portion, projecting toward the seat plate side. The aforementioned protrusions are Between the anode connection terminal and the cathode connection terminal, there is an orthogonal portion extending in a direction perpendicular to the line connecting the anode connection terminal and the cathode connection terminal, At both ends of this orthogonal section, there are parallel sections extending in a direction parallel to the aforementioned line, It has, A capacitor in which the pressure receiving plate is coupled to the seat plate via at least the parallel portion of the orthogonal portion and the parallel portion.

2. The capacitor according to claim 1, wherein the projection is configured to protrude beyond the opening towards the seat plate, the seat plate is provided with a fitting portion into which the projection is fitted, and the projection is fixed to the fitting portion.

3. The capacitor according to claim 2, wherein the base plate is provided with a through hole through which the projection passes as the fitting portion, and an enlarged diameter portion is provided at the end of the through hole opposite to the pressure receiving plate.

4. The capacitor according to claim 3, wherein an adhesive is placed in the enlarged diameter portion and the projection is fixed to the base plate by the adhesive.

5. The capacitor according to claim 1, wherein the pressure receiving plate and the seat plate are made of synthetic resin, the projection is brought into contact with the seat plate, and the projection is bonded to the seat plate with the adhesive.

6. The capacitor according to claim 1, wherein the pressure receiving plate and the seat plate are made of synthetic resin, the projection is brought into contact with the seat plate, and the projection is joined to the seat plate by laser welding.

7. The capacitor according to claim 6, wherein a recess is provided in the portion of the base plate that the projection contacts.

8. A capacitor mounting circuit board having a capacitor according to any one of claims 1 to 7 mounted on the surface of a circuit board, wherein on the surface of the circuit board, at least the part of the capacitor closer to the circuit board than the constricted portion of the main case, and the base plate, are covered with molded resin.

Citation Information

Patent Citations

  • Resin molding and method of manufacturing the same

    JP2015002258A