Light-emitting device

Abstract

The aim is to miniaturize the light-emitting device. [Solution] An embodiment of the present disclosure of a light-emitting device includes a package having a conductive member including a first conductive part and a second conductive part located side by side in a first direction, and a substrate including a base for holding the conductive member, and at least one electronic component including a light-emitting element, which is disposed on the conductive member and has a first electrode on its upper surface, and a first wire connecting the conductive member and the first electrode, wherein the substrate is located on the base and further has a wall portion that surrounds the at least one electronic component in a top view, the wall portion having a first portion provided integrally with the base and a second portion provided separately from the base and the first portion, and a second portion that covers a first connection portion which is a connection portion between the conductive member and the first wire, and the outer surface of the package includes a first outer surface which is at least partly formed by the outer surface of the base, the outer surface of the second portion, and the outer surface of the conductive member, all located on the same plane.

Description

[Technical Field]

[0001] This disclosure relates to a light-emitting device. [Background technology]

[0002] Patent Document 1 discloses a light-emitting device comprising a substrate, an LED element mounted on the substrate, a dam material arranged around the LED element, and a sealing agent arranged inside the dam material to seal the LED element, wherein the surface of the dam material facing the LED element has a curved convex shape toward the LED element. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Patent No. 7483182 [Overview of the project] [Problems that the invention aims to solve]

[0004] This disclosure aims to miniaturize light-emitting devices. [Means for solving the problem]

[0005] A light-emitting device according to one embodiment of the present disclosure includes a package having a conductive member including a first conductive portion and a second conductive portion located side by side in a first direction, and a substrate including a base portion for holding the conductive member; and at least one electronic component including a light-emitting element, which is disposed on the conductive member and has a first electrode on its upper surface; and a first wire connecting the conductive member and the first electrode, wherein the substrate is located on the base portion and further has a wall portion surrounding the at least one electronic component in a top view, the wall portion having a first portion provided integrally with the base portion, and a second portion provided separately from the base portion and the first portion, the second portion covering a first connection portion which is a connection portion between the conductive member and the first wire, and the outer surface of the package includes a first outer surface which is at least partly formed by the outer surface of the base portion, the outer surface of the second portion, and the outer surface of the conductive member, all located on the same plane. [Effects of the Invention]

[0006] According to one embodiment of the present disclosure, the light-emitting device can be miniaturized. [Brief explanation of the drawing]

[0007] [Figure 1] This is a schematic top view showing a light-emitting device according to an embodiment. [Figure 2] This is a schematic cross-sectional view of the light-emitting device cut along the line II-II in Figure 1. [Figure 3] This is a schematic cross-sectional view of the light-emitting device cut along line III-III in Figure 1. [Figure 4] This is a side view of a light-emitting device according to an embodiment. [Figure 5] This is a schematic top view showing the light-emitting device according to Modification Example 1. [Figure 6] Figure 5 shows a schematic cross-sectional view of the light-emitting device cut along the line VI-VI. [Figure 7] This is a schematic cross-sectional view showing a light-emitting device according to modified example 2. [Figure 8]This is a schematic top view showing the light-emitting device according to Modification 3. [Figure 9] This is a schematic top view showing the light-emitting device according to Modification 4. [Figure 10] This is a schematic top view showing the light-emitting device according to Modification 5. [Figure 11] Figure 10 is a schematic cross-sectional view showing the cross-section of the light-emitting device cut along the line XI-XI. [Figure 12] This is a schematic top view showing the light-emitting device according to the modified example 6. [Modes for carrying out the invention]

[0008] The light-emitting device according to the embodiments of this disclosure will be described in detail below with reference to the drawings. However, the embodiments shown below are illustrative of light-emitting devices that embody the technical concept of the embodiments and are not limited thereto. Furthermore, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are not intended to limit the scope of this disclosure to those described therein, unless otherwise specified, but are merely illustrative examples. Note that the size, positional relationships, etc. of the members shown in each drawing may be exaggerated for clarity of explanation. Also, in the following description, the same name and reference numerals indicate the same or similar members, and detailed explanations will be omitted as appropriate. In some cases, end view diagrams showing only the cross-section may be used as cross-sectional views.

[0009] In the figures shown below, the directions may be indicated by the X-axis, Y-axis, and Z-axis. The X-axis, Y-axis, and Z-axis are directions that are mutually orthogonal. In this specification, the X-axis direction is referred to as "First Direction X". The Y-axis direction is referred to as "Second Direction Y". Also, the Z-axis direction corresponds to the "height direction". In the First Direction X, the direction in which the arrow points is denoted as the +X direction or +X side, and the opposite direction of the +X direction is denoted as the -X direction or -X side. In the Second Direction Y, the direction in which the arrow points is denoted as the +Y direction or +Y side, and the opposite direction of the +Y direction is denoted as the -Y direction or -Y side. In the Z-axis direction, the direction in which the arrow points is denoted as the +Z direction or +Z side, and the opposite direction of the +Z direction is denoted as the -Z direction or -Z side. Also, in the terms of the embodiments, a top view means viewing the object from the +Z direction or +Z side. In this specification, in addition to the parts that can be directly visually recognized from above, for the parts that cannot be directly visually recognized from above, the term "top view" may be used to describe them as if they can be seen through. However, these do not limit the orientation of the light-emitting device during use, and the orientation of the light-emitting device is arbitrary. Also, in the embodiments, the surface of the object when viewed from the +Z direction or +Z side is defined as the "upper surface", and the surface of the object when viewed from the -Z direction or -Z side is defined as the "lower surface". In the embodiments shown below, along the X-axis, Y-axis, and Z-axis includes that the object has an inclination within a range of ±5° with respect to these axes. Also, in the embodiments, orthogonality may include an error within ±5° with respect to 90°. Also, in this specification, "parallel" includes not only the case where two straight lines, sides, surfaces, etc. do not intersect even when extended, but also the case where the angle formed by two straight lines, sides, surfaces, etc. intersects within a range of 10° or less.

[0010] Also, in the present disclosure, unless otherwise specified, with respect to polygons such as rectangles, those with rounded corners, chamfers, corner treatments, etc. applied to the corners of the polygon are also included in the term "polygon". Also, not limited to the corners (i.e., the ends of the sides), shapes with processing applied to the middle part of the sides are likewise included in the term "polygon". That is, shapes with partial processing while leaving the polygon as a base are included in the interpretation of the "polygon" described in the present disclosure.

[0011] The same applies not only to polygons but also to terms representing specific shapes such as trapezoids, circles, and concavities and convexities. The same also applies to terms related to each side forming the shape. That is, even if a side has been processed at a corner or an intermediate portion, the processed portion is included in the interpretation of "side".

[0012] Also, "cover" includes not only the case of direct contact but also the case of indirectly covering, for example, through other members. Also, "arrange" includes not only the case of direct contact but also the case of indirectly arranging, for example, through other members.

[0013] [Embodiment] Referring to FIGS. 1 to 4, an example of the configuration of a light-emitting device 1 according to an embodiment will be described. FIG. 1 is a top view schematically showing the light-emitting device 1 according to the embodiment. FIG. 2 is a cross-sectional view schematically showing a cross-section of the light-emitting device 1 cut along line II-II in FIG. 1. FIG. 3 is a cross-sectional view schematically showing a cross-section of the light-emitting device 1 cut along line III-III in FIG. 1. FIG. 4 is a side view of the light-emitting device 1 according to the embodiment (a side view when the light-emitting device 1 is viewed from the +X side).

[0014] As shown in FIGS. 1 to 4, the light-emitting device 1 includes a package 10, at least one electronic component 20, and a first wire 30. Further, the light-emitting device 1 shown in FIGS. 1 to 4 further has a second wire 40 and a light-transmissive member 50. The light-emitting device 1 may further include an electronic component different from the electronic component 20 shown in FIGS. 1 to 4. Here, the electronic component 20 shown in FIGS. 1 to 4 is, for example, a light-emitting element such as an LED (Light Emitting Diode). Also, when the light-emitting device 1 includes a plurality of electronic components 20, at least one of the plurality of electronic components 20 may include a protection element such as a Zener diode. For the sake of convenience of explanation, the electronic component 20 shown in FIGS. 1 to 4 will be described as a light-emitting element below. However, the electronic component 20 is not limited to a light-emitting element.

[0015] <Package 10> Package 10 comprises a base body 11 and a conductive member 15. As shown in Figures 1 to 4, the lower surface of package 10 includes the lower surface of the base body 11 (the lower surface of the base portion 110) and the lower surface of the conductive member 15 (the lower surface of the first conductive portion 151 and the lower surface of the second conductive portion 152). The outer surface of package 10 includes the outer surface of the base body 11 (the outer surface of the base portion 110 and the outer surface of the wall portion 120) and the outer surface of the conductive member 15 (the outer surface of the first conductive portion 151 and the outer surface of the second conductive portion 152).

[0016] In the examples shown in Figures 1 to 4, the outer surface of the package 10 includes four surfaces: the first outer surfaces 10s1 and 10s2, and the second outer surfaces 10s3 and 10s4. In the examples shown in Figures 1 to 4, the package 10 has a rectangular shape when viewed from above. However, the shape of the package 10 when viewed from above is not limited to a rectangle. The shape of the package 10 when viewed from above may be other shapes such as a square. The outer surface of the package 10 constitutes the side surface of the light-emitting device 1. The bottom surface of the package 10 constitutes the bottom surface of the light-emitting device 1.

[0017] As shown in Figure 1, the first outer surface 10s1 is located on the outermost +X side of the package 10 in a top view and extends in the second direction Y. The first outer surface 10s2 is located on the outermost -X side of the package 10 in a top view and extends in the second direction Y. In the example shown in Figure 1, the first outer surfaces 10s1 and 10s2 extend parallel to each other in the second direction Y. For example, if multiple light-emitting devices before individualization are connected in the first direction X, the light-emitting device 1 can be obtained by cutting them using a known method such as dicing and individualizing them. The first outer surfaces 10s1 and 10s2 of the individualized light-emitting device 1 may be outer surfaces corresponding to the cut surfaces during individualization.

[0018] As shown in Figure 1, the second outer surface 10s3 is located on the outermost +Y side of the package 10 in a top view and extends in the first direction X. The first outer surface 10s2 is located on the outermost -Y side of the package 10 in a top view and extends in the first direction X. In the example shown in Figure 1, the second outer surfaces 10s3 and 10s4 extend parallel to each other in the first direction X. For example, if multiple light-emitting devices before individualization are connected in the second direction Y, the light-emitting device 1 can be obtained by cutting them using a known method such as dicing and individualizing them. The second outer surfaces 10s3 and 10s4 of the individualized light-emitting device 1 may be outer surfaces corresponding to the cut surfaces during individualization.

[0019] (Base 11) The base 11 includes a base portion 110 and a wall portion 120 located on the base portion 110. The base portion 110 holds the conductive member 15. The base portion 110 is made of, for example, a resin material. Examples of resin materials include thermosetting resins and thermoplastic resins. Examples of thermosetting resins include epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, silicone-modified epoxy resins, epoxy-modified silicone resins, polyimide resins, modified polyimide resins, and unsaturated polyesters. Examples of thermoplastic resins include polyamides, polyphthalamides (PPA), polycarbonate resins, polyphenylene sulfide (PPS), liquid crystal polymers (LCP), ABS resins, phenolic resins, acrylic resins, and PBT resins. A resin containing at least one of these can be used as the resin material constituting the base portion 110. It is particularly preferable to use a thermosetting resin as the resin material constituting the base portion 110.

[0020] In the example shown in Figures 1 to 4, the base portion 110 includes a first main body portion 111, a second main body portion 112, a connecting portion 113, and exposed portions 114a, 114b, 114c, and 114d. The first main body portion 111, the second main body portion 112, the connecting portion 113, and the exposed portions 114a, 114b, 114c, and 114d may be integrally provided portions of the base portion 110.

[0021] As shown in Figures 1 and 3, the first main body portion 111 is located on the outermost +Y side of the base portion 110 and extends in the first direction X. The first main body portion 111 is also located on the -Z side of the first portion 121a of the wall portion 120. However, the configuration of the first main body portion 111 is not limited to this.

[0022] As shown in Figures 1 and 3, the second main body portion 112 is located on the outermost -Y side of the base portion 110 and extends in the first direction X. The second main body portion 112 is located apart from the first main body portion 111 in the second direction Y and extends parallel to the first main body portion 111. The second main body portion 112 is located on the -Z side of the first portion 121b of the wall portion 120. However, the configuration of the second main body portion 112 is not limited to this.

[0023] In a top view, the connecting portion 113 is located between the first conductive portion 151 and the second conductive portion 152 of the conductive member 15, and connects the first conductive portion 151 and the second conductive portion 152. The connecting portion 113 is in contact with both the first conductive portion 151 and the second conductive portion 152. One end of the connecting portion 113 is continuous with the first main body portion 111. The other end of the connecting portion 113 is continuous with the second main body portion 112.

[0024] The exposed portions 114a, 114b, 114c, and 114d are exposed from the first portions 121a and 121b of the wall portion 120 when viewed from above. In the example shown in Figure 1, the exposed portions 114a and 114b are adjacent to the first portion 121a of the wall portion 120. Hereinafter, the exposed portions 114a and 114b adjacent to the first portion 121a will be referred to as the "first exposed portions 114a and 114b". The exposed portions 114c and 114d are adjacent to the first portion 121b of the wall portion 120. Hereinafter, the exposed portions 114c and 114d adjacent to the first portion 121b will be referred to as the "second exposed portions 114c and 114d".

[0025] As shown in Figure 1, the first exposed portion 114a is continuous with the +X side end of the first main body portion 111 and extends from the first portion 121a side to the -Y side. The first exposed portion 114b is continuous with the -X side end of the first main body portion 111 and extends from the first portion 121a side to the -Y side. The second exposed portion 114c is continuous with the +X side end of the second main body portion 112 and extends from the first portion 121b side to the +Y side. The second exposed portion 114d is continuous with the -X side end of the second main body portion 112 and extends from the first portion 121b side to the +Y side. In a top view, the first exposed portion 114a and the second exposed portion 114c are positioned to sandwich a part (the +X side end) of the second conductive portion 152 of the conductive member 15. The first exposed portion 114b and the second exposed portion 114d are positioned, in a top view, to sandwich a part of the first conductive portion 151 (the -X side end) of the conductive member 15. Here, "end" includes not only the outermost part but also the region near the outermost part.

[0026] As shown in Figure 1, the base 110 may further have protrusions 115a and 115b located between the two first portions 121a and 121b of the wall 120 and on the -Z side of the second portions 122a and 122b of the wall 120. In the examples shown in Figures 1 to 4, the base 110 has two protrusions 115a and 115b. However, the base 110 may have only one of the protrusions 115a and 115b.

[0027] The protrusion 115a is in contact with the second portion 122a of the wall portion 120. Furthermore, the protrusion 115a is provided integrally with the first exposed portion 114a and the second exposed portion 114c, and is located on the +Z side (above) the first exposed portion 114a and the second exposed portion 114c. In the example shown in Figure 1, the protrusion 115a is located separately from the first portions 121a and 121b. However, the protrusion 115a may be continuous with the +X side ends of the first portions 121a and 121b, respectively.

[0028] The protrusion 115b is in contact with the second portion 122b of the wall portion 120. The protrusion 115b is provided integrally with the first exposed portion 114b and the second exposed portion 114d, and is located on the +Z side (above) of the first exposed portion 114b and the second exposed portion 114d. In the example shown in Figure 1, the protrusion 115b is located separately from the first portions 121a and 121b. However, the protrusion 115b may be continuous with the -X side ends of the first portions 121a and 121b. The other configurations of the protrusion 115b may be approximately the same as those of the protrusion 115a. Therefore, the description of the protrusion 115b will be omitted below.

[0029] In the examples shown in Figures 1 and 4, the protrusion 115a has a first contact portion 115a1 that contacts the first exposed portion 114a and a second contact portion 115a2 that contacts the second exposed portion 114c. The first contact portion 115a1 is located on the +Z side of the first exposed portion 114a and overlaps with the -Y side end of the first exposed portion 114a in a top view. The second contact portion 115a2 is located on the +Z side of the second exposed portion 114c and overlaps with the +Y side end of the second exposed portion 114c in a top view. A part of the conductive member 15 (in Figure 4, the +X side end of the second conductive portion 152) is positioned between the first exposed portion 114a and the second exposed portion 114c. A portion of the protrusion 115a located between the first contact portion 115a1 and the second contact portion 115a2 is located on the +Z side of a portion of the conductive member 15 and is in contact with a portion of the conductive member 15. The protrusion 115a may have only one of the first contact portion 115a1 or the second contact portion 115a2.

[0030] In the example shown in Figure 2, the cross-sectional shape of the protrusion 115a is trapezoidal. Specifically, the protrusion 115a has an upper surface 115u, a lower surface 115t, an outer surface 115s1, and an inner surface 115s2. The upper surface 115u and the inner surface 115s2 of the protrusion 115a are in contact with the second portion 122a. By having the upper surface 115u and the inner surface 115s2 of the protrusion 115a in contact with the second portion 122a, the contact area between the protrusion 115a and the second portion 122a can be increased. This improves the adhesion between the protrusion 115a and the second portion 122a.

[0031] The upper surface 115u of the protrusion 115a may be a plane parallel to the XY plane or a plane inclined with respect to the XY plane. The height of the position on the upper surface 115u of the protrusion 115a closest to the electronic component 20 (the height of the -X side end of the protrusion 115a) is, for example, 0.95 times or more and 1.05 times or less the height of the position furthest from the electronic component 20 (the height of the +X side end of the protrusion 115a). Furthermore, in the cross-sectional view shown in Figure 2, it is preferable that the length of the upper surface 115u of the protrusion 115a in the first direction X is one-third or more of the length of the lower surface 115t of the protrusion 115a in the first direction X. This increases the contact area between the protrusion 115a and the second portion 122a compared to the case where the length of the upper surface 115u of the protrusion 115a in the first direction X is less than one-third of the length of the lower surface 115t of the protrusion 115a in the first direction X. As a result, the adhesion between the protrusion 115a and the second portion 122a can be improved.

[0032] The wall portion 120 surrounds the electronic component 20 in a top view. Specifically, the wall portion 120 has two first portions 121a and 121b and two second portions 122a and 122b. In a top view, the first portions 121a and 121b form two sides extending in a first direction X of the wall portion 120, and the second portions 122a and 122b form two sides extending in a second direction Y of the wall portion 120.

[0033] As shown in Figure 1, the two first parts 121a and 121b are arranged to sandwich the electronic component 20 in the second direction Y. The two second parts 122a and 122b are located between the two first parts 121a and 121b in a top view and are arranged to sandwich the electronic component 20 in the first direction X. However, the wall portion 120 may have only one of the second parts 122a or 122b.

[0034] The first parts 121a and 121b are provided integrally with the base 110. That is, the first parts 121a and 121b are made of the same resin material as the base 110, for example, and are structurally integrated. In the example shown in Figures 1 to 4, the first part 121a is provided integrally with the first main body 111 of the base 110. The first part 121b is provided integrally with the second main body 112 of the base 110.

[0035] The second parts 122a and 122b are provided separately from the base 110 and the first parts 121a and 121b. If the second parts 122a and 122b are provided separately from the base 110 and the first parts 121a and 121b, the materials constituting the second parts 122a and 122b and the materials constituting the base 110 and / or the first parts 121a and 121b may be the same or different.

[0036] It is preferable that the base portion 110 and the second portions 122a and 122b each contain a resin material. This improves the adhesion between the base portion 110 and the second portions 122a and 122b. Similarly, it is preferable that the first portions 121a and 121b and the second portions 122a and 122b each also contain a resin material. This ensures that the base portion 110, the first portions 121a and 121b, and the second portions 122a and 122b are all made of resin material, improving the adhesion between the base portion 110 and the wall portion 120. Furthermore, the first exposed portion 114a and the second exposed portion 114c of the base portion 110 are in contact with the second portion 122a, and the first exposed portion 114b and the second exposed portion 114d are in contact with the second portion 122b. The first exposed portions 114a, 114b and the second exposed portions 114c, 114d may have recesses located on the -Z side of the upper surface of the conductive member 15. This increases the contact area between the base portion 110 and the second portions 122a, 122b, thereby improving adhesion.

[0037] The second portion 122a covers the first connection portion 31, which is the connection between the conductive member 15 (second conductive portion 152 in Figure 1) and the first wire 30. The second portion 122b can also cover the second connection portion 41, which is the connection between the conductive member 15 (first conductive portion 151 in Figure 1) and the second wire 40.

[0038] The second part 122a covers the first connection part 31 after the first wire 30 and the conductive member 15 are connected, and the second part 122b covers the second connection part 41 after the second wire 40 and the conductive member 15 are connected. That is, the second part 122a is not positioned when the first wire 30 and the conductive member 15 are connected, and the second part 122b is not positioned when the second wire 40 and the conductive member 15 are connected. Therefore, according to this embodiment, the first connection part 31 can be provided near the first outer surface 10s1 of the package 10. That is, the first connection part 31 can be provided even if the distance between the side surface of the light-emitting device 1 and the first connection part 31 is short. Also, the second connection part 41 can be provided even if the distance between the side surface of the light-emitting device 1 and the second connection part 41 is short. This makes it possible to shorten the dimensions of the light-emitting device 1 in the first direction X and to miniaturize the light-emitting device 1. The other components of Part 2 122b may be roughly the same as those of Part 2 122a. Therefore, the explanation of Part 2 122b will be omitted below.

[0039] The second portion 122a is in contact with the base 110 and the conductive member 15 (second conductive portion 152). In particular, the second portion 122a can be in contact with the protrusion 115a. When the base 110 has the protrusion 115a, the area of ​​the conductive member 15 exposed from the base 110 in a top view is reduced compared to when the base 110 does not have the protrusion 115a. As a result, the contact area between the base 110 and the second portion 122a increases compared to when the base 110 does not have the protrusion 115a, and the adhesion between the base 110 and the second portion 122a is improved. Furthermore, the protrusion 115a is located on the +Z side of the first exposed portion 114a and the second exposed portion 114c. As a result, the contact area between the base 110 and the second portion 122a is increased, and the adhesion between the base 110 and the second portion 122a can be improved. As a result, the reliability of the light-emitting device 1 can be improved.

[0040] The second part 122a of the light-emitting device 1 according to the embodiment is light-reflective. When the second part 122a is light-reflective, it may include, for example, light-reflective particles. Examples of light-reflective particles include inorganic particles such as titanium dioxide, zinc oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, magnesium silicate, barium titanate, barium sulfate, aluminum hydroxide, aluminum oxide, zirconium oxide, silicon oxide, and boron nitride. One of these can be used alone, or two or more can be used in combination. The second part 122a may also be light-transmitting. When the second part 122a is light-transmitting, the light emitted by the electronic component (light-emitting element) 20 can be extracted not only from the top surface of the light-emitting device 1, but also from the side surface of the light-emitting device 1 (the first outer surface 10s1 of the package 10). Herein, in this specification, "translucency" refers to the property of having a transmittance of at least 60%, preferably 80%, or more for light emitted by the electronic component (light-emitting element) 20. Furthermore, the second parts 122a and 122b may optionally contain phosphors, light scattering agents, colorants, etc.

[0041] The phosphor converts at least a part of the wavelength of the light emitted by the electronic component (light-emitting element) 20 and emits light of the converted wavelength. As the phosphor, for example, yttrium aluminum garnet-based phosphors (for example, (Y,Gd)3(Al,Ga)5O 12 :Ce, hereinafter referred to as "YAG phosphor"), lutetium aluminum garnet-based phosphors (for example, Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet-based phosphors (for example, Tb3(Al,Ga)5O 12 :Ce), CCA-based phosphors (for example, Ca 10 (PO4)6Cl2:Eu), SAE-based phosphors (for example, Sr4Al 14 O 25 :Eu), chlorosilicate-based phosphors (for example, Ca8MgSi4O 16 Cl2:Eu), silicate-based phosphors (for example, (Ba,Sr,Ca,Mg)2SiO4:Eu), β-sialon-based phosphors (for example, (Si,Al)3(O,N)4:Eu) or α-sialon-based phosphors (for example, Ca(Si,Al) 12 (O,N) 16 :Eu) and other oxynitride-based phosphors, LSN-based phosphors (for example, (La,Y)3Si6N 11 :Ce), BSESN-based phosphors (for example, (Ba,Sr)2Si5N8:Eu), SLA-based phosphors (for example, SrLiAl3N4:Eu), CASN-based phosphors (for example, CaAlSiN3:Eu) or SCASN-based phosphors (for example, (Sr,Ca)AlSiN3:Eu) and other nitride-based phosphors, KSF-based phosphors (for example, K2SiF6:Mn), KSAF-based phosphors (for example, K2(Si 1-x Al x )F 6-x:Mn where x satisfies 0 < x < 1), or fluoride-based phosphors such as MGF-based phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn), quantum dots having a perovskite structure (e.g., (Cs,FA,MA)(Pb,Sn)(F,Cl,Br,I)3 where FA and MA represent formamidinium and methylammonium, respectively), II-VI group quantum dots (e.g., CdSe), III-V group quantum dots (e.g., InP), or quantum dots having a chalcopyrite structure (e.g., (Ag,Cu)(In,Ga)(S,Se)2) can be used.

[0042] As the light scattering agent, for example, particles such as titanium oxide, silicon oxide, aluminum oxide, zinc oxide, magnesium oxide, zirconium oxide, yttrium oxide, calcium fluoride, magnesium fluoride, niobium pentoxide, barium titanate, tantalum pentoxide, barium sulfate, or glass can be used.

[0043] As shown in FIG. 1, when the electronic component 20 is disposed on the first conductive portion 151, the second portion 122a may be in contact with the connecting portion 113. By the second portion 122a being in contact with the connecting portion 113, the contact area between the second portion 122a and the base portion 110 can be increased. Thereby, the adhesion between the second portion 122a and the base portion 110 can be improved.

[0044] As shown in FIG. 4, the outer surface 122s1 of the second portion 122a is located on the same plane as the outer surface 110s1 of the base portion 110 and the outer surface 15s1 of the conductive member 15 on the first outer surface 10s1 of the package 10. That is, at least a part of the first outer surface 10s1 of the package 10 is constituted by the outer surface 122s1 of the second portion 122a, the outer surface 110s1 of the base portion 110, and the outer surface 15s1 of the conductive member 15 that are located on the same plane. Thereby, the second portion 122a covering the first connection portion 31 can be disposed at the outermost part on the +X side of the light emitting device 1. [[ID=!4]]

[0045] Furthermore, at least a portion of the first outer surface 10s1 of the package 10 is composed of the outer surfaces 121s1 of the first portions 121a and 121b and the outer surface 115s1 of the protrusion 115a. Specifically, the outer surfaces 121s1 of the first portions 121a and 121b, the outer surface 115s1 of the protrusion 115a, the outer surface 122s1 of the second portion 122a, and the outer surface 15s1 of the conductive member 15 are arranged on the same plane of the first outer surface 10s1 of the package 10. For example, when the first outer surface 10s1 of the package 10 is formed by cutting by a known method such as dicing, the second portion 122a is cut in a state in contact with the first portions 121a and 121b and the protrusion 115a on the first outer surface 10s1 of the package 10 corresponding to the cut surface. As a result, compared to the case where the second portion 122a is cut without contacting the protrusion 115a on the first outer surface 10s1, the area in contact with the base body 11 of the second portion 122a is increased when it is cut. As a result, the adhesion between the second portion 122a and the base body 11 is improved, and the delamination of the second portion 122a and the conductive member 15 during cutting can be reduced. Furthermore, it is preferable that the hardness of the first portions 121a, 121b and the hardness of the protrusion 115a are higher than the hardness of the second portion 122a. As a result, the outer surfaces 121s1 of the first portions 121a, 121b and the outer surface 115s1 of the protrusion 115a, which have relatively higher hardness, can be placed on the first outer surface 10s1 of the package 10. As a result, the strength of the first outer surface 10s1 of the package 10 is improved. Here, "hardness" refers to the mechanical property of a material that can be measured, for example, by a durometer hardness test or a Rockwell hardness test.

[0046] (Conductive member 15) The conductive member 15 includes a first conductive portion 151 and a second conductive portion 152. The conductive member 15 may further include one or more conductive portions different from the first conductive portion 151 and the second conductive portion 152. As shown in Figure 1, the first conductive portion 151 and the second conductive portion 152 are located side by side in the first direction X. The first conductive portion 151 and the second conductive portion 152 are located apart and connected via a connecting portion 113 of the base portion 110.

[0047] As shown in Figure 4, a portion of the conductive member 15 (a portion of the second conductive portion 152 in Figure 4) contacts a portion of the protrusion 115a located between the first contact portion 115a1 and the second contact portion 115a2 (a portion of the protrusion 115a). This improves the adhesion between the protrusion 115a and the conductive member 15. As a result, the reliability of the light-emitting device 1 can be improved. Furthermore, if the protrusion 115a has only one of the first contact portion 115a1 or the second contact portion 115a2, a portion of the conductive member 15 contacts a portion of the protrusion 115a that is continuous with either the first contact portion 115a1 or the second contact portion 115a2. In this case as well, the adhesion between the protrusion 115a and the conductive member 15 can be improved. As a result, the reliability of the light-emitting device 1 can be improved.

[0048] Each of the first conductive part 151 and the second conductive part 152 is electrically connected to an external power source. Examples of materials constituting each of the first conductive part 151 and the second conductive part 152 include metals such as copper, aluminum, silver, and gold, or alloys thereof. Each of the first conductive part 151 and the second conductive part 152 may have a single-layer structure composed of these metals or alloys, or it may have a laminated structure (e.g., clad material). Each of the first conductive part 151 and the second conductive part 152 is preferably a metal plate containing 90% or more copper as its main component. Furthermore, each of the first conductive part 151 and the second conductive part 152 may also contain trace elements such as silicon or phosphorus.

[0049] <Electronic component 20> The electronic component 20 is placed on the conductive member 15. The electronic component 20 has a first electrode 21 on its upper surface. The electronic component 20 may also have a second electrode 22 having a different polarity from the first electrode 21. However, the second electrode 22 may be placed on the lower surface of the electronic component 20 and joined to the conductive member 15 directly or via a bonding member. In the example shown in Figure 1, the electronic component 20 is placed on the first conductive part 151. However, the electronic component 20 may be placed on the second conductive part 152. Furthermore, the electronic component 20 may be placed across the first conductive part 151 and the second conductive part 152. Furthermore, the electronic component 20 may be placed on a conductive part different from the first conductive part 151 and the second conductive part 152.

[0050] The electronic component 20 further comprises a semiconductor structure 23. If the electronic component 20 is a light-emitting element, the semiconductor structure 23 comprises a first semiconductor layer, a light-emitting layer, and a second semiconductor layer. The first semiconductor layer, the light-emitting layer, and the second semiconductor layer are configured as a laminate. The semiconductor structure 23 may also include an element substrate that supports the laminate. The element substrate is made of an insulating material such as sapphire, spinel, or glass.

[0051] The first semiconductor layer and the second semiconductor layer have different conductivity types. For example, if the first semiconductor layer is an n-type semiconductor layer, the second semiconductor layer is a p-type semiconductor layer. If the first semiconductor layer is a p-type semiconductor layer, the second semiconductor layer is an n-type semiconductor layer. One of the first and second semiconductor layers is electrically connected to the first electrode 21. The other of the first and second semiconductor layers is electrically connected to the second electrode 22. The light-emitting layer may have a single quantum well (SQW) structure or a multi-quantum well (MQW) structure including multiple well layers.

[0052] The first semiconductor layer, the light-emitting layer, and the second semiconductor layer may each be semiconductor layers made of a nitride semiconductor. Nitride semiconductors include In x Al y Ga 1-x-yThe semiconductor comprises all compositions in which the composition ratios x and y are varied within their respective ranges in the chemical formula N (0 ≤ x, 0 ≤ y, x + y ≤ 1). The emission peak wavelength of the light-emitting layer can be appropriately selected depending on the purpose. The light-emitting layer is configured to emit, for example, visible light or ultraviolet light.

[0053] When a structure comprising a first semiconductor layer, an emissive layer, and a second semiconductor layer is considered as a single laminate, the semiconductor structure 23 may comprise multiple laminates. In this case, for example, the multiple laminates may be stacked sequentially in the Z-axis direction. The multiple emissive layers comprising each of the multiple laminates may include well layers with different emission peak wavelengths, or they may include well layers with the same emission peak wavelength.

[0054] The combination of emission peak wavelengths of multiple laminates can be selected as appropriate. For example, if the semiconductor structure 23 comprises two laminates, possible combinations of light emitted by the light-emitting layers of each laminate include blue light and blue light, green light and green light, red light and red light, ultraviolet light and ultraviolet light, ultraviolet light and blue light, blue light and green light, blue light and red light, or green light and red light. For example, if the semiconductor structure 23 comprises three laminates, possible combinations of light emitted by the light-emitting layers of each laminate include blue light, green light, and red light.

[0055] <First wire 30> The first wire 30 connects the conductive member 15 and the first electrode 21 of the electronic component 20. The material of the first wire 30 can be a conductive wire made of a metal such as gold, silver, copper, platinum, or aluminum, or an alloy containing at least one of these metals. In particular, it is preferable to use a wire containing gold, which has excellent thermal resistance. The diameter of the wire can be, for example, 10 μm or more and 30 μm or less. The first wire 30 is joined to the conductive member 15 and the first electrode 21, respectively, by a joining method such as wire bonding. A first connection portion 31, which is the connection point between the first wire 30 and the conductive member 15, is provided on the conductive member 15. In the example shown in Figure 1, the first wire 30 connects the second conductive portion 152 and the first electrode 21. Therefore, the first connection portion 31 is located on the second conductive portion 152.

[0056] The first connection portion 31 of the first wire 30 is covered by the second portion 122a of the wall portion 120. As shown in Figure 1, the first connection portion 31 is located between the electronic component 20 and the protrusion 115a in a top view. This eliminates the need to provide a region for the first connection portion 31 to be located outside the protrusion 115a in the first direction X in a top view. Therefore, the light-emitting device 1 can be miniaturized.

[0057] <Second wire 40> The second wire 40 connects the conductive member 15 and the second electrode 22 of the electronic component 20. The same material as the first wire 30 can be used for the second wire 40. The second wire 40 is joined to the conductive member 15 and the second electrode 22, respectively, by a joining method such as wire bonding. A second connection portion 41, which is the connection portion between the second wire 40 and the conductive member 15, is provided on the conductive member 15. In the example shown in Figure 1, the second wire 40 connects the first conductive portion 151 and the second electrode 22. Therefore, the second connection portion 41 is located on the first conductive portion 151.

[0058] The second connection portion 41 of the second wire 40 is covered by the second portion 122b of the wall portion 120. As shown in Figure 1, the second connection portion 41 is located between the electronic component 20 and the protrusion 115b in a top view. This eliminates the need to provide a region for the second connection portion 41 to be located outside the protrusion 115b in the first direction X in a top view. Therefore, the light-emitting device 1 can be miniaturized.

[0059] <Translucent member 50> The light-transmitting member 50 is positioned inside the wall portion 120 when viewed from above. The light-transmitting member 50 also covers the electronic component 20. If the light-emitting device 1 includes other electronic components different from the electronic component 20, the light-transmitting member 50 may or may not cover the other electronic components.

[0060] The light-transmitting member 50 is preferably light-transmitting, capable of transmitting light from the electronic component (light-emitting element) 20, and also possessing light resistance that prevents degradation by such light. Specific materials include insulating resin compositions having light-transmitting properties that allow light from the electronic component (light-emitting element) 20 to pass through, such as silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, urea resin, and acrylic resin. Furthermore, silicone resin, epoxy resin, urea resin, fluororesin, and hybrid resins containing at least one of these resins can also be used. Moreover, the light-transmitting member 50 is not limited to these organic materials; inorganic materials such as glass and silica sol can also be used. In addition to such materials, phosphors, light-scattering agents, colorants, etc., can be included as desired. The light-transmitting member 50 may contain the same phosphors as those contained in the second parts 122a and 122b.

[0061] <Other components> In the light-emitting device 1, if a silver-containing metal layer is formed on the outermost surface of the conductive member 15, it is preferable to provide a protective film such as silicon oxide on the surface of the silver-containing metal layer. The protective film can cover, for example, the base 110, the conductive member 15, the electronic component 20, the first wire 30, and the second wire 40. This reduces discoloration of the silver-containing metal layer due to sulfur components in the atmosphere. The protective film can be formed by a vacuum process such as sputtering, for example, but other known methods may also be used. In this specification, the protective film located on the base 110 is included in the base 110. Also, the protective film located on the conductive member 15 is included in the conductive member 15.

[0062] The light-emitting device 1 may further include a lens placed on the package 10. The light-emitting device 1 may also further include, for example, a light-reflective resin placed in a recess provided on the upper surface of the lens. The light-reflective resin reflects light emitted from the electronic component (light-emitting element) 20 and transmitted through the lens in different directions. A resin material containing light-reflective particles may be used as the light-reflective resin. The light-reflective particles may be similar to those that may be included in the second parts 122a and 122b.

[0063] [Example 1] Next, an example of the configuration of the light-emitting device 1A according to the modified embodiment 1 will be described with reference to Figures 5 and 6. Figure 6 is a schematic cross-sectional view showing the light-emitting device 1A according to the modified embodiment 1. In the modified embodiment 1, the same reference numerals are used for components similar to those in the embodiment, and their descriptions are omitted as appropriate.

[0064] In the light-emitting device 1A according to Modification 1, the second parts 122a and 122b are translucent, and the protrusions 115a and 115b are light-reflecting. That is, the light emitted by the electronic component (light-emitting element) 20 is emitted not only from the top surface of the light-emitting device 1A, but also from the side surfaces of the light-emitting device 1A.

[0065] As shown in Figure 5, it is preferable that the length W1 of the protrusions 115a and 115b in the second direction Y is shorter than the length W2 of the second portion 122a and 122b in the second direction Y. By making the length W1 of the protrusions 115a and 115b in the second direction Y shorter than the length W2 of the second portion 122a and 122b in the second direction Y, the obstruction of light emitted by the electronic component (light-emitting element) 20 by the protrusions 115a and 115b can be reduced. This improves the light extraction efficiency of the light-emitting device 1.

[0066] Furthermore, as shown in Figure 6, the maximum height H1 of the protrusions 115a and 115b from the lower surface of the base 110 (the lower surface of the connecting portion 113 in Figure 6) is smaller than the maximum height H2 of the electronic component 20 from the lower surface of the base 110. In the example shown in Figure 6, the position of the upper surface 115u of the protrusions 115a and 115b in the Z-axis direction is lower than the position of the upper surface of the electronic component 20 in the Z-axis direction. Because the maximum height H1 of the protrusions 115a and 115b is smaller than the maximum height H2 of the electronic component 20, for example, the obstruction of light emitted by the electronic component (light-emitting element) 20 by the protrusions 115a and 115b can be reduced. This improves the light extraction efficiency of the light-emitting device 1A. Furthermore, even if the second parts 122a and 122b have either light-transmitting or light-reflecting properties, the first connection part 31 can be provided even if the distance between the side surface of the light-emitting device 1A and the first connection part 31 is short, similar to the light-emitting device 1 according to the embodiment. This makes it possible to miniaturize the light-emitting device 1A.

[0067] [Differentiation 2] Next, with reference to Figure 7, an example of the configuration of the light-emitting device 1B according to the modified embodiment 2 will be described. Figure 7 is a schematic cross-sectional view showing the light-emitting device 1B according to the modified embodiment 2. In the modified embodiment 2, the same reference numerals are used for components similar to those in the embodiment and modified embodiment 1, and their descriptions are omitted as appropriate.

[0068] In the light-emitting device 1B according to the modified example 2, the second parts 122a and 122b are light-reflecting. Also, as shown in Figure 7, the maximum height H3 of the translucent member 50B from the lower surface of the base 110 (the lower surface of the connecting part 113 in Figure 7) is greater than the maximum height of the wall part 120 from the lower surface of the base 110. In the example shown in Figure 7, the position of the upper surface of the translucent member 50B in the Z-axis direction is higher than the position of the top of the wall part 120 (second parts 122a and 122b) in the Z-axis direction. Since the maximum height H3 of the translucent member 50B is greater than the maximum height of the wall part 120, the light emitted by the electronic component (light-emitting element) 20 can also be emitted from the region between the upper surface of the translucent member 50B, which corresponds to the upper part of the side surface of the light-emitting device 1B, and the top of the wall part 120. This makes it possible to broaden the irradiation range of the light from the light-emitting device 1B. Furthermore, even if the second parts 122a and 122b have either light-transmitting or light-reflecting properties, the first connection part 31 can be provided even if the distance between the side surface of the light-emitting device 1B and the first connection part 31 is short, similar to the light-emitting device 1 according to the embodiment. This makes it possible to miniaturize the light-emitting device 1B.

[0069] [Difference 3] Next, with reference to Figure 8, an example of the configuration of the light-emitting device 1C according to the modified embodiment 3 will be described. Figure 8 is a schematic top view showing the light-emitting device 1C according to the modified embodiment 3. In the modified embodiment 3, the same reference numerals are used for components that are the same as those in the embodiment and modified embodiments 1 to 2, and their descriptions are omitted as appropriate.

[0070] In the light-emitting device 1 according to the embodiment, the first electrode 21 and the second electrode 22 of the electronic component 20 are arranged side by side in the first direction X. In contrast, in the light-emitting device 1C according to the modified example 3, the first electrode 21 and the second electrode 22 of the electronic component 20 are arranged side by side in the second direction Y. Alternatively, the first electrode 21 and the second electrode 22 of the electronic component 20 may be arranged side by side in directions different from the first direction X and the second direction Y.

[0071] In the light-emitting device 1C according to the modified example 3, the second parts 122a and 122b are translucent, and the protrusions 115a and 115b are light-reflecting. That is, the light emitted by the electronic component (light-emitting element) 20 is emitted not only from the top surface of the light-emitting device 1A, but also from the side surface of the light-emitting device 1A.

[0072] As shown in Figure 8, the protrusion 115c of the modified example 3 is composed of, for example, a first region 115c1 and a second region 115c2 aligned in the second direction Y. The first region 115c1 of the protrusion 115c is in contact with the first exposed portion 114a (114b). The second region 115c2 of the protrusion 115c is in contact with the second exposed portion 114c (114d). That is, a part of the second portion 122a (122b) (the -Z side end) is located between the first region 115c1 and the second region 115c2 of the protrusion 115c. This reduces the obstruction of light emitted by, for example, the electronic component (light-emitting element) 20 by the protrusion 115c. As a result, the light extraction efficiency of the light-emitting device 1C can be improved. Furthermore, even if the second parts 122a and 122b have either light-transmitting or light-reflecting properties, the first connection part 31 can be provided even if the distance between the side surface of the light-emitting device 1C and the first connection part 31 is short, similar to the light-emitting device 1 according to the embodiment. This makes it possible to miniaturize the light-emitting device.

[0073] [Differentiation Example 4] Next, with reference to Figure 9, an example of the configuration of the light-emitting device 1D according to the modified embodiment 4 will be described. Figure 9 is a schematic top view showing the light-emitting device 1D according to the modified embodiment 4. In the modified embodiment 4, the same reference numerals are used for components similar to those in the embodiment and modified embodiments 1 to 3, and their descriptions are omitted as appropriate.

[0074] As shown in Figure 9, the protrusion 115d of the modified example 4 has one first extension 115d1 and two second extensions 115d2. The first extension 115d1 is located between the first exposed portion 114a (114b) and the second exposed portion 114c (114d) in a top view and extends in the second direction Y. Each of the two second extensions 115d2 extends in the first direction X. Furthermore, each of the two second extensions 115d2 is continuous with both ends of the first extension 115d1 in the second direction Y.

[0075] The second portions 122a and 122b of the wall portion 120 come into contact with the protrusion 115d, which has two or more regions extending in different directions, thereby increasing the contact area between the second portions 122a and 122b and the protrusion 115d. This improves the adhesion between the second portions 122a and 122b and the protrusion 115d. Furthermore, the two second extending portions 115d2 are positioned to sandwich the first connection portion 31 of the first wire 30, and one first extending portion 115d1 is positioned to overlap the first connection portion 31 of the first wire 30 in a first direction. This protects the first connection portion 31 from external forces. Similarly, the two second extending portions 115d2 are positioned to sandwich the second connection portion 41 of the second wire 40, and one first extending portion 115d1 is positioned to overlap the second connection portion 41 of the second wire 40 in a first direction. This protects the second connection part 41 from external forces. As a result, the reliability of the light-emitting device 1D can be improved.

[0076] [Difference 5] Next, an example of the configuration of the light-emitting device 1E according to the modified embodiment 5 will be described with reference to Figures 10 and 11. Figure 10 is a schematic top view showing the light-emitting device 1E according to the modified embodiment 5. Figure 11 is a schematic cross-sectional view showing the cross-section of the light-emitting device 1E cut along the line XI-XI in Figure 10. In the modified embodiment 5, the same reference numerals are used for components similar to those in the embodiment and modified embodiments 1 to 4, and their descriptions are omitted as appropriate.

[0077] As shown in Figure 10, the wall portion 120E of the modified example 5 has one second portion 122a. In addition to the first portions 121a and 121b, the wall portion 120E also has a first portion 121c which is provided integrally with the base portion 110 and the first portions 121a and 121b. The first portion 121c is positioned where the second portion 122b of the embodiment was located. That is, the first portion 121c is located on the outermost -X side of the wall portion 120E.

[0078] In the example shown in Figure 10, the inner surface 122u of the second portion 122a is a concave curved surface when viewed from above. Because the inner surface 122u of the second portion 122a is a concave curved surface, the area of ​​the second portion 122a that contacts the first portions 121a and 121b can be increased. This increases the contact area between the first portions 121a and 121b and the second portion 122a. As a result, the adhesion between the first portions 121a and 121b and the second portion 122a can be improved, thereby improving the reliability of the light-emitting device 1. In the light-emitting device 1E according to modified embodiment 5, the length of the second portion 122a in the first direction X is maximized at the portion in contact with the first portions 121a and 121b. This increases the contact area between the first portions 121a and 121b and the second portion 122a. As a result, the adhesion between the first parts 121a, 121b and the second part 122a can be improved, thereby improving the reliability of the light-emitting device 1. The length of the second part 122a in the first direction X may be maximized at the part in contact with the first part 121a, or it may be maximized at the part in contact with the first part 121b.

[0079] Furthermore, because the inner surface 122u of the second portion 122a is a concave curved surface, it is possible to reduce the change in the distance between the inner surface 122u and the electronic component (light-emitting element) 20 depending on the position of the inner surface 122u in the second direction Y. This reduces the change in the optical path length between the electronic component (light-emitting element) 20 and the inner surface 122u depending on the position of the inner surface 122u in the second direction Y. As a result, for example, if the light-transmitting member 50 has a phosphor, it is possible to reduce the change in the amount of light converted by the phosphor contained in the light-transmitting member 50 between the electronic component (light-emitting element) 20 and the inner surface 122u.

[0080] The upper surface 115u of the convex portion 115a may further have a convex portion and / or a concave portion. This improves the adhesion between the second portion 122a and the convex portion 115a. As shown in Figure 11, the upper surface 115ue of the convex portion 115e of the light-emitting device 1E according to Modified Example 1 is a concave curved surface that is recessed on the -Z side. The fact that the upper surface 115ue of the convex portion 115e is a concave curved surface that is recessed on the -Z side increases the contact area between the second portion 122a and the convex portion 115e. This improves the adhesion between the second portion 122a and the convex portion 115e. As a result, the reliability of the light-emitting device 1E can be improved.

[0081] [Modification 6] Next, with reference to Figure 12, an example of the configuration of the light-emitting device 1F according to the modified embodiment 6 will be described. Figure 12 is a schematic top view showing the light-emitting device 1F according to the modified embodiment 6. In the modified embodiment 6, the same reference numerals are used for components similar to those in the embodiment and modified embodiments 1 to 5, and their descriptions are omitted as appropriate.

[0082] The conductive member 15 of Modified Example 6 further includes a third conductive part 153 in addition to the first conductive part 151 and the second conductive part 152. Furthermore, the light-emitting device 1F of Modified Example 6 comprises a plurality of electronic components 20F. In the example shown in Figure 12, the light-emitting device 1F comprises five electronic components 20F. All five electronic components 20F may be light-emitting elements. The light-emitting elements may emit light of different colors from each other.

[0083] In modified example 6, five electronic components 20F are connected in series. The five electronic components 20F are located on the first conductive portion 151. The first wire 30 connects the first electrode 21 of electronic component 20F1 to the second conductive portion 152. The first connection portion 31 is located on the second conductive portion 152. The second wire 40 connects the second electrode 22 of electronic component 20F2 to the third conductive portion 153. The second connection portion 41 is located on the third conductive portion 153.

[0084] The second portion 122f of the wall portion 120F covers the first connection portion 31 and the second connection portion 41. By covering the first connection portion 31 and the second connection portion 41 with the second portion 122f, the distance between the first connection portion 31 and the side of the light-emitting device 1F and the distance between the second connection portion 41 and the side of the light-emitting device 1F can be shortened. This makes it possible to match or bring close the position of the geometric center of gravity of the multiple electronic components 20 in a top view to the position of the geometric center of gravity of the light-emitting device 1F in a top view. As a result, the light-emitting centers of the multiple electronic components (light-emitting elements) 20 can match or bring close to the position of the geometric center of gravity of the light-emitting device 1F in a top view. Therefore, the light extraction efficiency of the light-emitting device 1F can be improved. Furthermore, if the light-emitting device 1F includes a lens positioned above the multiple electronic components 20F, matching or bringing close the light-emitting centers of the multiple electronic components (light-emitting elements) 20 to the position of the geometric center of gravity of the light-emitting device 1F in a top view simplifies the design of the lens. In this specification, "emission center" refers to the center of one light-emitting element when viewed from above, if the light-emitting device includes one light-emitting element. If the light-emitting device includes multiple light-emitting elements, it refers to the average of the position coordinates indicating the center of each light-emitting element when viewed from above. Furthermore, "center of light-emitting element" means the geometric centroid of the light-emitting element when viewed from above.

[0085] Although preferred embodiments have been described in detail above, the invention is not limited to the embodiments described above, and various modifications and substitutions can be made to the embodiments described above without departing from the scope of the claims. For example, the second parts 122a, 122b, and 122f in the embodiments and modified examples 1 to 6 may consist of a plurality of layers stacked in the Z-axis direction. In this case, of the plurality of layers, for example, the lower layer may be light-reflective and the upper layer may be light-transmitting. Also, the second parts 122a, 122b, and 122f in the embodiments and modified examples 1 to 6 may be in contact with electronic components 20 and 20F.

[0086] The aspects of this disclosure are, for example, as follows: <Item 1> A package having a conductive member including a first conductive portion and a second conductive portion located side by side in a first direction, and a substrate including a base portion for holding the conductive member, An electronic component including a light-emitting element, wherein the electronic component is disposed on the conductive member and has a first electrode on its upper surface, A first wire connecting the conductive member and the first electrode, Equipped with, The substrate is located on the base and further has a wall portion that surrounds the at least one electronic component when viewed from above. The aforementioned wall portion is A first portion provided integrally with the base, A second portion provided separately from the base and the first portion, the second portion covering the first connection portion which is the connection portion between the conductive member and the first wire, It has, The outer surface of the package includes a first outer surface, which is at least partially formed by the outer surface of the base, the outer surface of the second portion, and the outer surface of the conductive member, all of which are located on the same plane. Light-emitting device. <Item 2> The at least one electronic component is located on the first conductive portion, The first connection portion is located on the second conductive portion, The light-emitting device described in item 1 above. <Item 3> Further comprising a second wire connecting the first conductive portion and a second electrode located on the upper surface of the at least one electronic component, The second portion covers the second connection portion, which is the connection portion between the first conductive portion and the second wire. The light-emitting device described in item 2 above. <Item 4> The base portion is located between the first conductive portion and the second conductive portion in a top view and has a connecting portion that connects the first conductive portion and the second conductive portion. The second portion is in contact with the connecting portion, A light-emitting device according to any one of the above items <1> to <3>. <Clause 5> The base portion has an exposed portion that is exposed from the first portion when viewed from above, The base portion is provided integrally with the exposed portion and has a protrusion located above the exposed portion. The second portion is in contact with the convex portion, A light-emitting device according to any one of the above items <1> to <4>. <Item 6> At least a portion of the first outer surface is formed by the outer surface of the first portion and the outer surface of the protrusion. The light-emitting device described in item 5 above. <Clause 7> The first connecting portion covered by the second portion is located, in a top view, between the at least one electronic component and the protrusion. The light-emitting device described in item 6 above. <Clause 8> The hardness of the first portion and the hardness of the protrusion are higher than the hardness of the second portion. The aforementioned protrusion is continuous with the first portion, A light-emitting device according to any one of items 5 to 7 above. <Item 9> The second part is translucent, The aforementioned protrusion has light reflectivity, A light-emitting device according to any one of items 5 to 8 above. <Item 10> The maximum height of the protrusion from the lower surface of the base is less than the maximum height of the base from the lower surface of the at least one electronic component. The light-emitting device described in item 9 above. <Item 11> The wall portion has two first portions arranged to sandwich the at least one electronic component in a second direction perpendicular to the first direction, Each of the second portion and the protrusion is located between the two first portions. The length of the protrusion in the second direction is shorter than the length of the second portion in the second direction. The light-emitting device described in item 10 above. <Clause 12> The wall portion has two first portions arranged to sandwich the at least one electronic component in a second direction perpendicular to the first direction, The exposed portion includes a first exposed portion adjacent to one of the two first portions, and a second exposed portion adjacent to the other of the two first portions. The protrusion has a first contact portion that contacts the first exposed portion and a second contact portion that contacts the second exposed portion. A portion of the conductive member contacts a portion of the protrusion located between the first contact portion and the second contact portion. A light-emitting device according to any one of items 5 to 11 above. <Item 13> A translucent member is provided which is positioned inside the wall portion in a top view and covers the at least one electronic component, The maximum height from the lower surface of the base in the light-transmitting member is greater than the maximum height from the lower surface of the base in the wall portion. A light-emitting device according to any one of the above items <1> to <12>. <Item 14> The inner surface of the second part is a curved surface that is concave when viewed from above. A light-emitting device according to any one of the above items <1> to <13>. <Clause 15> Each of the base and the second portion comprises a resin material, The second portion is in contact with the base, A light-emitting device according to any one of the above items <1> to <14>. [Explanation of Symbols]

[0087] 1, 1A, 1B, 1C, 1D, 1E, 1F Light-emitting device 10 packages 10s1,10s2 1st outer surface 10s3,10s4 2nd outer surface 11 Base 110 Base 113 Connecting part 114a,114b 1st exposed part 114c,114d 2nd exposed part 115a, 115b, 115c, 115d, 115e Convex part 115a1 1st contact part 115a2 2nd contact part 120,120E,120F Wall section 121a,121b,121c Part 1 122a,122b,122f 2nd part 122u inner side 15 Conductive members 151 First conductive part 152 Second conductive part 20, 20F, 20F1, 20F2 Electronic Components 21 1st electrode 22 2nd electrode 23 Semiconductor Structures 30 First wire 31. First connection section 40. Second wire 41 Second connection section 50,50B Translucent member

Claims

1. A package comprising a conductive member including a first conductive portion and a second conductive portion positioned side by side in a first direction, and a substrate including a base portion for holding the conductive member, An electronic component comprising a light-emitting element, wherein the electronic component is disposed on the conductive member and has a first electrode on its upper surface, A first wire connecting the conductive member and the first electrode, Equipped with, The substrate is located on the base and further has a wall portion that surrounds the at least one electronic component when viewed from above, The aforementioned wall portion is A first portion provided integrally with the base, A second portion provided separately from the base and the first portion, the second portion covering the first connection portion which is the connection portion between the conductive member and the first wire, It has, The outer surface of the package includes a first outer surface, which is at least partially formed by the outer surface of the base, the outer surface of the second portion, and the outer surface of the conductive member, all of which are located on the same plane. Light-emitting device.

2. The at least one electronic component is located on the first conductive portion, The first connection portion is located on the second conductive portion, The light-emitting device according to claim 1.

3. The device further comprises a second wire connecting the first conductive portion and a second electrode located on the upper surface of the at least one electronic component, The second portion covers the second connection portion, which is the connection portion between the first conductive portion and the second wire. The light-emitting device according to claim 2.

4. The base portion is located between the first conductive portion and the second conductive portion in a top view and has a connecting portion that connects the first conductive portion and the second conductive portion. The second portion is in contact with the connecting portion, A light-emitting device according to any one of claims 1 to 3.

5. The base portion has an exposed portion that is exposed from the first portion when viewed from above, The base portion is provided integrally with the exposed portion and has a protrusion located above the exposed portion. The second portion is in contact with the convex portion, A light-emitting device according to any one of claims 1 to 3.

6. At least a portion of the first outer surface is formed by the outer surface of the first portion and the outer surface of the protrusion. The light-emitting device according to claim 5.

7. The first connecting portion, which is covered by the second portion, is located between the at least one electronic component and the protrusion in a top view. The light-emitting device according to claim 6.

8. The hardness of the first portion and the hardness of the protrusion are higher than the hardness of the second portion. The aforementioned protrusion is continuous with the first portion, The light-emitting device according to claim 5.

9. The second part is translucent, The aforementioned protrusion has light reflectivity, The light-emitting device according to claim 5.

10. The maximum height of the protrusion from the lower surface of the base is smaller than the maximum height of the base from the lower surface of the at least one electronic component. The light-emitting device according to claim 9.

11. The wall portion has two first portions arranged to sandwich the at least one electronic component in a second direction perpendicular to the first direction, Each of the second portion and the protrusion is located between the two first portions, The length of the protrusion in the second direction is shorter than the length of the second portion in the second direction. The light-emitting device according to claim 10.

12. The wall portion has two first portions arranged to sandwich the at least one electronic component in a second direction perpendicular to the first direction, The exposed portion has a first exposed portion adjacent to one of the two first portions, and a second exposed portion adjacent to the other of the two first portions. The protrusion has a first contact portion that contacts the first exposed portion and a second contact portion that contacts the second exposed portion. A portion of the conductive member contacts a portion of the protrusion located between the first contact portion and the second contact portion. The light-emitting device according to claim 5.

13. In a top view, it is provided with a translucent member that is positioned inside the wall and covers at least one electronic component, The maximum height from the lower surface of the base in the light-transmitting member is greater than the maximum height from the lower surface of the base in the wall portion. A light-emitting device according to any one of claims 1 to 3.

14. The inner surface of the second part is a curved surface that is concave when viewed from above. A light-emitting device according to any one of claims 1 to 3.

15. Each of the base and the second portion includes a resin material. The second portion is in contact with the base, A light-emitting device according to any one of claims 1 to 3.

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