Vibration device

The vibration device addresses the strength issue in ceramic substrates by integrating protrusions and inclined surfaces to maintain mechanical integrity and accommodate vibration elements, enhancing substrate strength and insulation.

JP2026061229APending Publication Date: 2026-04-09SEIKO EPSON CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-09-30
Publication Date
2026-04-09

AI Technical Summary

Technical Problem

Existing vibration devices using ceramic substrates for housing crystal oscillators face a risk of decreased strength due to thinning of parts other than the base, which compromises the overall substrate integrity.

Method used

The vibration device incorporates an integrally formed base substrate with protrusions, thin and thick portions, and a lid body to form an accommodation space, where the thin portions are thinner than the protrusions and the thick portions are connected via inclined surfaces, distributing stress and maintaining mechanical strength.

Benefits of technology

This configuration enhances the mechanical strength of the substrate by preventing the spread of joining materials and reducing the risk of insulation failure, while accommodating a vibration element effectively.

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Abstract

To provide a vibration device having a base substrate with excellent strength. [Solution] The vibration device 1 comprises an integrally formed base substrate 2, a lid 3 joined to the base substrate 2 to form a housing space 4, and a vibration element 30 housed in the housing space 4, wherein the base substrate 2 includes a first protrusion 11 and a second protrusion 12 joined to the vibration element 30, a thin-walled portion 13 provided around the first protrusion 11 and the second protrusion 12 and thinner than the first protrusion 11 and the second protrusion 12, and a thick-walled portion 14 connected to the thin-walled portion 13 and thicker than the thin-walled portion 13.
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Description

Technical Field

[0001] The present invention relates to a vibration device.

Background Art

[0002] For example, Patent Document 1 describes a ceramic substrate for housing a crystal oscillator, which includes a base for mounting the crystal oscillator provided so as to be separated from the frame body, and can suppress the occurrence of insulation failure due to a bonding material for fixing the crystal oscillator.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the vibration device using the ceramic substrate for housing a crystal oscillator described in Patent Document 1, since parts other than the base are thinned, there is a risk that the strength of the entire substrate will decrease.

Means for Solving the Problems

[0005] The vibration device is a vibration device including an integrally formed base substrate, a lid body joined to the base substrate to form an accommodation space, and a vibration element accommodated in the accommodation space, wherein the base substrate includes a first protrusion and a second protrusion joined to the vibration element, a thin portion provided around the first protrusion and the second protrusion and thinner than the first protrusion and the second protrusion, and a thick portion connected to the thin portion and thicker than the thin portion.

Brief Description of the Drawings

[0006] [Figure 1] A plan view showing a schematic structure of a vibration device according to the first embodiment. [Figure 2] Cross-sectional view along line AA in Figure 1. [Figure 3] Enlarged view of section B in Figure 2. [Figure 4] A plan view showing the schematic structure of the vibration device according to the second embodiment. [Figure 5] Cross-sectional view along line AA in Figure 4. [Figure 6] A plan view showing the schematic structure of the vibration device according to the third embodiment. [Figure 7] Cross-sectional view along line AA in Figure 6. [Figure 8] Enlarged view of section B in Figure 7. [Figure 9] A plan view showing the schematic structure of the vibration device according to the fourth embodiment. [Figure 10] Cross-sectional view along line AA in Figure 9. [Figure 11] A plan view showing the schematic structure of the vibration device according to the fifth embodiment. [Figure 12] Cross-sectional view along line AA in Figure 11. [Figure 13] Cross-sectional view along line BB in Figure 11. [Figure 14] Cross-sectional view along line CC in Figure 11. [Modes for carrying out the invention]

[0007] 1. First Embodiment First, the vibration device 1 according to the first embodiment will be described with reference to Figures 1, 2, and 3. In Figure 1, the lid 3 is shown removed for the convenience of explaining the internal structure of the vibration device 1. Also, in Figures 1, 2, and 3, the electrodes provided on the upper surfaces of the first protrusion 11 and the second protrusion 12, and the wiring that electrically connects the electrodes on the first protrusion 11 and the second protrusion 12 to the external terminal 20 provided on the lower surface of the base substrate 2 are omitted from the illustration.

[0008] For the sake of clarity, the following plan and cross-sectional diagrams will show the X, Y, and Z axes as three mutually orthogonal axes. The direction along the X axis will be referred to as the "X direction," the direction along the Y axis as the "Y direction," and the direction along the Z axis as the "Z direction." The tip of the arrow in each axis direction will be referred to as the "positive side," and the base end as the "negative side."

[0009] As shown in Figures 1, 2, and 3, the vibration device 1 according to this embodiment comprises an integrally formed base substrate 2, a lid 3 joined to the base substrate 2 to form a housing space 4, and a vibration element 30 housed in the housing space 4.

[0010] The base substrate 2, made of ceramic or the like, and the lid 3, made of metal, ceramic, glass or the like, are joined together via a sealing ring, low-melting-point glass, or other joining member 7.

[0011] The base substrate 2 is provided with a recess 5 that is recessed from the top surface on the side opposite to the lid 3, and the inner bottom surface 6 of the recess 5 is composed of the top surfaces of the thin-walled portion 13, the first protrusion 11 and the second protrusion 12, and the thick-walled portion 14, and an inclined surface 15 that connects the thin-walled portion 13 and the thick-walled portion 14.

[0012] Furthermore, the base substrate 2 is integrally formed and includes a first protrusion 11 and a second protrusion 12 joined to the vibration element 30, a thin-walled portion 13 provided around the first protrusion 11 and the second protrusion 12 and thinner than the first protrusion 11 and the second protrusion 12, a thick-walled portion 14 connected to the thin-walled portion 13 and thicker than the thin-walled portion 13, and an inclined surface 15 connecting the thin-walled portion 13 and the thick-walled portion 14. Specifically, as shown in Figure 3, the thickness T2 of the thin-walled portion 13 is thinner than the thickness T1 of the first protrusion 11 and the second protrusion 12 and the thickness T3 of the thick-walled portion 14. Also, the thin-walled portion 13 and the thick-walled portion 14 are connected via an inclined surface 15 that forms an obtuse angle θ with respect to the thin-walled portion 13. In this embodiment, the thickness T3 of the thick-walled portion 14 is equal to the thickness T1 of the first protrusion 11 and the second protrusion 12.

[0013] The vibration element 30 includes a flat vibration substrate 31, excitation electrodes 32 provided on two surfaces that are in a front-back relationship of the vibration substrate 31, pad electrodes 34, lead electrodes 33 that electrically connect the excitation electrodes 32 and the pad electrodes 34, and side electrodes 35 that electrically connect the lead electrodes provided on the upper surface and the pad electrodes 34 provided on the lower surface. The vibration element 30 has a cantilever structure in which a pad electrode 34 provided at an end on the minus side in the X direction is joined and fixed to the upper surfaces of the first protruding portion 11 and the second protruding portion 12 via a joining member 40.

[0014] Since the vibration element 30 is joined to the upper surfaces of the first protruding portion 11 and the second protruding portion 12, which are thicker than the thin portion 13, via a conductive joining member 40 such as a conductive adhesive, it is possible to prevent the joining member 40 from spreading toward the excitation electrode 32 side. Further, since only the peripheries of the first protruding portion 11 and the second protruding portion 12 to which the vibration element 30 is joined are constituted by the thin portion 13 that is thinner than the first protruding portion 11 and the second protruding portion 12, the inner bottom surface 6 excluding the thin portion 13 can be thickened, and a reduction in the mechanical strength of the base substrate 2 can be reduced.

[0015] Note that, as the vibration element 30, for example, a crystal oscillator, other piezoelectric oscillators, MEMS (Micro Electro Mechanical Systems) oscillators, or the like can be used. As the material of the vibration substrate 31, piezoelectric materials such as quartz, piezoelectric ceramics such as lead zirconate titanate, or silicon semiconductor materials or the like can be used.

[0016] In the vibration device 1 of the present embodiment, since only the peripheries of the first protruding portion 11 and the second protruding portion 12 to which the vibration element 30 is joined are constituted by the thin portion 13 that is thinner than the first protruding portion 11, the second protruding portion 12, and the thick portion 14, the entire inner bottom surface 6 excluding the thin portion 13 can be thickened, and a reduction in the mechanical strength of the base substrate 2 can be reduced.

[0017] 2. Second Embodiment Next, the vibration device 1a according to the second embodiment will be described with reference to FIGS. 4 and 5. Note that FIG. 4 illustrates a state in which the lid body 3 is removed for convenience of explanation.

[0018] The vibration device 1a of this embodiment is the same as the vibration device 1 of the first embodiment, except that the structure of the base substrate 2a is different from that of the vibration device 1 of the first embodiment. The explanation will focus on the differences from the first embodiment described above, and similar matters will be omitted.

[0019] As shown in Figures 4 and 5, the vibration device 1a comprises a base substrate 2a, a lid 3 which is joined to the base substrate 2a to form a housing space 4, and a vibration element 30 which is housed in the housing space 4.

[0020] The base substrate 2a includes a first protrusion 11 and a second protrusion 12 joined to the vibration element 30, a thin-walled portion 13 provided around the first protrusion 11 and the second protrusion 12 and thinner than the first protrusion 11 and the second protrusion 12, a thick-walled portion 14a connected to the thin-walled portion 13 and thicker than the thin-walled portion 13, and an inclined surface 15a connecting the thin-walled portion 13 and the thick-walled portion 14a. In this embodiment, the thickness T3 of the thick-walled portion 14a is thinner than the thickness T1 of the first protrusion 11 and the second protrusion 12. That is, the relationship T1 > T3 > T2 holds. Furthermore, the thin-walled portion 13 and the thick-walled portion 14a are connected via an inclined surface 15a that forms an obtuse angle with respect to the thin-walled portion 13.

[0021] By adopting this configuration, the same effects as in the first embodiment can be obtained.

[0022] 3. Third Embodiment Next, the vibration device 1b according to the third embodiment will be described with reference to Figures 6, 7, and 8. Note that Figure 6 shows the device with the cover 3 removed for the sake of explanation.

[0023] The vibration device 1b of this embodiment is the same as the vibration device 1 of the first embodiment, except that the structure of the base substrate 2b is different from that of the vibration device 1 of the first embodiment. The explanation will focus on the differences from the first embodiment described above, and similar matters will be omitted.

[0024] As shown in Figures 6, 7, and 8, the vibration device 1b comprises a base substrate 2b, a lid 3 joined to the base substrate 2b to form a housing space 4, and a vibration element 30 housed in the housing space 4.

[0025] The base substrate 2b includes a first protrusion 11 and a second protrusion 12 that are joined to the vibration element 30, a thin-walled portion 13 that is thinner than the first protrusion 11 and the second protrusion 12 and is provided around the first protrusion 11 and the second protrusion 12, and a thick-walled portion 14 that is connected to the thin-walled portion 13 and is thicker than the thin-walled portion 13. The first protrusion 11 and the second protrusion 12 and the thin-walled portion 13 are connected via a curved surface 11b, and the thin-walled portion 13 and the thick-walled portion 14 are connected via a curved surface 15b.

[0026] This configuration allows for the distribution of stress applied to the connection between the first protrusion 11 and the second protrusion 12 and the thin-walled portion 13, and to the connection between the thin-walled portion 13 and the thick-walled portion 14, thereby further reducing the decrease in the mechanical strength of the base substrate 2b.

[0027] 4. Fourth Embodiment Next, the vibration device 1c according to the fourth embodiment will be described with reference to Figures 9 and 10. Note that Figure 9 shows the device with the cover 3 removed for convenience of explanation.

[0028] The vibration device 1c of this embodiment is the same as the vibration device 1 of the first embodiment, except that the structure of the base substrate 2c is different from that of the vibration device 1 of the first embodiment. The explanation will focus on the differences from the first embodiment described above, and similar matters will be omitted.

[0029] As shown in Figures 9 and 10, the vibration device 1c comprises a base substrate 2c, a lid 3 joined to the base substrate 2c to form a housing space 4, and a vibration element 30 housed in the housing space 4.

[0030] The base substrate 2c includes a first protrusion 11 and a second protrusion 12 that are joined to the vibration element 30, a thin-walled portion 13 that is thinner than the first protrusion 11 and the second protrusion 12 and is provided around the first protrusion 11 and the second protrusion 12, and a thick-walled portion 14c that is connected to the thin-walled portion 13 and is thicker than the thin-walled portion 13.

[0031] The thickened portion 14c includes a first thickened portion 141c and a second thickened portion 142c, which, in a plan view, is provided between the thinned portion 13 and the first thickened portion 141c and has a thickness T4 that is thicker than the thickness T2 of the thinned portion 13 and thinner than the thickness T3 of the first thickened portion 141c. The thinned portion 13 and the second thickened portion 142c are connected via an inclined surface 15c that forms an obtuse angle with respect to the thinned portion 13, and the second thickened portion 142c and the first thickened portion 141c are connected via an inclined surface 151c that forms an obtuse angle with respect to the second thickened portion 142c.

[0032] The vibrating element 30 includes one end 36 joined to the first protrusion 11 and the second protrusion 12, a central part 37 on which the excitation electrode 32 is provided, and another end 38 on the opposite side of the central part 37 from the one end 36 in the X direction, and the first thickened part 141c overlaps with the other end 38 in a plan view, but does not overlap with the excitation electrode 32.

[0033] With this configuration, when an impact is applied in the Z direction, the excitation electrode 32 of the vibrating element 30 does not come into contact with the first thickened portion 141c, and only the other end 38 comes into contact with the first thickened portion 141c, acting as a stopper, and the same effect as in the first embodiment can be obtained.

[0034] 5. Fifth Embodiment Next, the vibration device 1d according to the fifth embodiment will be described with reference to Figures 11, 12, 13, and 14. Note that Figure 11 shows the device with the cover 3 removed for the sake of explanation.

[0035] The vibration device 1d of this embodiment is the same as the vibration device 1 of the first embodiment, except that the structure of the base substrate 2d is different from that of the vibration device 1 of the first embodiment. The explanation will focus on the differences from the first embodiment described above, and similar matters will be omitted.

[0036] As shown in Figures 11, 12, 13, and 14, the vibration device 1d comprises a base substrate 2d, a lid 3 joined to the base substrate 2d to form a housing space 4, and a vibration element 30 housed in the housing space 4.

[0037] The base substrate 2d includes a first protrusion 11 and a second protrusion 12 joined to the vibrating element 30, a thin-walled portion 13 provided around the first protrusion 11 and the second protrusion 12 and thinner than the first protrusion 11 and the second protrusion 12, and a thick-walled portion 14d connected to the thin-walled portion 13 and thicker than the thin-walled portion 13. The thick-walled portion 14d includes a recessed portion 16 that is recessed from the upper surface on the side opposite to the vibrating element 30, and a peripheral portion 17 provided around the recessed portion 16, the thickness T3 of the peripheral portion 17 being thicker than the thickness T5 of the recessed portion 16.

[0038] The vibrating element 30 includes one end 36 that is joined to the first protrusion 11 and the second protrusion 12, a central part 37 on which the excitation electrode 32 is provided, and another end 38 that is on the opposite side of the central part 37 from the one end 36 in the X direction, and the recessed part 16 of the thickened part 14d is positioned to overlap with the excitation electrode 32 in a plan view.

[0039] With this configuration, when an impact is applied in the Z direction, the excitation electrode 32 of the vibrating element 30 does not come into contact with the thickened portion 14d, and only the other end 38 of the vibrating element 30 comes into contact with the peripheral portion 17 of the thickened portion 14d, acting as a stopper, and the same effect as in the first embodiment can be obtained. [Explanation of Symbols]

[0040] 1, 1a, 1b, 1c, 1d... Vibration device, 2... Base substrate, 3... Cover, 4... Housing space, 5... Recess, 6... Inner bottom surface, 7... Joining member, 11... First protrusion, 12... Second protrusion, 13... Thin-walled section, 14... Thick-walled section, 15... Inclined surface, 16... Recessed section, 17... Peripheral section, 20... External terminal, 30... Vibration element, 31... Vibration substrate, 32... Excitation electrode, 33... Lead electrode, 34... Pad electrode, 35... Side electrode, 36... One end, 37... Center section, 38... Other end, 40... Joining member, T1, T2, T3, T4, T5... Thickness, θ... Angle.

Claims

1. A vibration device comprising an integrally formed base substrate, a lid joined to the base substrate to form a housing space, and a vibration element housed in the housing space, The base substrate is The first protrusion and the second protrusion are joined to the vibrating element, A thin-walled portion is provided around the first and second protrusions, and is thinner than the first and second protrusions. It includes a thicker portion connected to the thin portion, which is thicker than the thin portion. Vibration device.

2. The thin-walled portion and the thick-walled portion are connected via an inclined surface that forms an obtuse angle with respect to the thin-walled portion. The vibration device according to claim 1.

3. The thickness of the thickened portion is equal to the thickness of the first and second protrusions. The vibration device according to claim 1.

4. The thickened portion is thinner than the first and second protrusions. The vibration device according to claim 1.

5. The first protrusion and the second protrusion and the thin-walled portion are connected via a curved surface. The thin-walled portion and the thick-walled portion are connected via a curved surface. The vibration device according to claim 1.

6. The aforementioned thickened portion comprises a first thickened portion and In a plan view, it includes a second thickened portion provided between the thinned portion and the first thickened portion, which is thicker than the thinned portion and thinner than the first thickened portion, The vibration device according to claim 1.

7. The vibrating element includes one end that is joined to the first protrusion and the second protrusion, a central part on which an excitation electrode is provided, and the other end. The first thickened portion, in a plan view, overlaps with the other end and does not overlap with the excitation electrode. The vibration device according to claim 6.

8. The vibrating element includes one end that is joined to the first protrusion and the second protrusion, a central part on which an excitation electrode is provided, and the other end. The aforementioned thickened portion, in a plan view, has a recessed portion that overlaps with the excitation electrode, A peripheral portion provided around the recessed portion and thicker than the recessed portion, The vibration device according to claim 1.

Citation Information

Patent Citations

  • Ceramic substrate for housing crystal oscillator and crystal oscillator implementation package using the same

    JP2016058955A