Sensor unit and method for manufacturing the same

Abstract

The present invention provides a sensor unit and a method for manufacturing the same that offer excellent water pressure resistance and weather resistance, and enable easier manufacturing, miniaturization, thinning, cost reduction, simplified manufacturing processes, reduced manufacturing costs, and improved assembly accuracy. [Solution] The solution includes a resin outer case 10 having an annular facing surface 11 facing the object to be applied and a recess 12 opening in the region surrounded by the annular facing surface; a resin inner case 20 having a flat plate portion 21 positioned and fixed inside the recess and sensor housing portions 22, 23, 24 protruding from the flat plate portion on the side opposite to the bottom surface 12b of the recess and opening toward the bottom surface 12b of the recess; sensors 30, 40, 50 positioned in the sensor housing portion; a circuit board 60 fixed to the flat plate portion and electrically connected to the sensors; and a resin sealing material 70 that fills the internal space IS defined by the outer case and the inner case and covers the flat plate portion 21.

Description

[Technical Field]

[0001] The present invention relates to a sensor unit applied to a throttle device of an internal combustion engine mounted in a vehicle, and a method for manufacturing the same. [Background technology]

[0002] Conventional sensor units are known to include a case that defines a contact surface (opposing surface) joined to the throttle body and an outward-opening recess on the opposite side, and a position sensor positioned in the recess of the case (see, for example, Patent Document 1). Other known sensor units include a housing that defines a bonding surface (opposing surface) to be joined to the throttle body and a recess that opens outward on the opposite side of the bonding surface, a temperature sensor and a throttle sensor and a circuit board arranged inside the housing, and a resin sealing material such as epoxy resin filled inside the housing (see, for example, Patent Document 2).

[0003] In these sensor units, the case (housing), when attached to the throttle body, has various sensors arranged in a recess that opens outward on the opposite side from the opposing surface, and is then filled with a resin encapsulant. Therefore, if the resin encapsulant completely fills the recess to form the outer surface of the sensor unit, there is a risk that the resin encapsulant may deteriorate and peel off due to aging or under usage conditions such as high-pressure washing. Alternatively, a configuration in which a cover member is fitted to cover the opening of the case after filling with resin encapsulant is also conceivable, but under the usage conditions described above, there is a risk that gaps may occur at the joint between the case and the cover member, and sealing performance may not be ensured. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2013-26531 [Patent Document 2] Japanese Patent Publication No. 2019-20251 [Overview of the project] [Problems that the invention aims to solve]

[0005] The present invention has been made in view of the above circumstances, and its objective is to provide a sensor unit and a method for manufacturing the same that have excellent water pressure resistance and weather resistance, and that can be manufactured more easily, miniaturized, thinned, cost-effective, have a simpler manufacturing process, reduce manufacturing costs, and improve assembly accuracy. [Means for solving the problem]

[0006] The sensor unit of the present invention comprises a resin outer case having an annular facing surface that faces the object to be applied and a recess that opens into the region surrounded by the annular facing surface; a resin inner case having a flat plate portion that is disposed and fixed inside the recess and a sensor housing portion that protrudes from the flat plate portion on the side opposite to the bottom surface of the recess and opens toward the bottom surface of the recess; a sensor disposed in the sensor housing portion; a circuit board fixed to the flat plate portion to which the sensor is electrically connected; and a resin sealing material that fills the internal space defined by the outer case and the inner case and covers the flat plate portion.

[0007] In the sensor unit described above, the outer case may include a positioning portion for positioning the inner case within a recess and a locking portion for locking the inner case, and the inner case may include a positioned portion that is positioned by the positioning portion and a locked portion that is locked by the locking portion.

[0008] In the sensor unit described above, the outer case may include an external connection terminal integrally molded for connection to a circuit board, a connector that exposes one end of the external connection terminal and surrounds it, and a boss portion through which a screw for fastening to the object to be applied passes, while the inner case may include an opening that exposes the other end of the external connection terminal passed through the connection hole of the circuit board before the resin encapsulant is filled in.

[0009] In the sensor unit described above, the flat portion of the inner case may be configured to include an end face facing the bottom surface of the recess, a base protruding from the end face on which the circuit board is mounted, a positioning projection for positioning the circuit board, and a board locking portion for locking the circuit board.

[0010] In the above-described sensor unit, the sensor may include a temperature sensor, a pressure sensor, and a rotation angle sensor, and the sensor housing may include a first sensor housing for housing the temperature sensor, a second sensor housing for housing the rotation angle sensor, and a third sensor housing for housing the pressure sensor.

[0011] In the above-described sensor unit, the temperature sensor may include a sensor body and lead wires extending from the sensor body and passed through connection holes in the circuit board, and the first sensor housing may include a positioning groove for positioning the free end of the lead wires.

[0012] In the above sensor unit, the temperature sensor may include a sensor body and lead wires extending from the sensor body and passing through connection holes in the circuit board, and the rotation angle sensor may include a Hall IC body and extension terminals extending from the Hall IC body and passing through connection holes in the circuit board, and may also include a first positioning member fixed to a flat plate portion for positioning the lead wires and a second positioning member fixed to a flat plate portion for positioning the extension terminals.

[0013] In the above-described sensor unit, the first sensor housing portion may include a first positioning fitting hole for fitting and positioning a first positioning member, and the second sensor housing portion may include a second positioning fitting hole for fitting and positioning a second positioning member.

[0014] In the above-described sensor unit, the first sensor housing may be formed in the shape of a tapered, bottomed cylinder, the second sensor housing may have an outer contour that is cylindrical, and the third sensor housing may have an outer contour that is a two-stage cylindrical shape with a pressure receiving hole.

[0015] In the above sensor unit, the temperature sensor may adopt a configuration including a sensor body and a lead wire extending from the sensor body and passing through a connection hole of the circuit board, and the rotation angle sensor may be a surface mount type sensor surface-mounted on the circuit board.

[0016] In the sensor unit including the above surface mount type sensor, the first sensor housing portion may be formed in a bottomed cylindrical shape with a tapered tip, the second sensor housing portion may be formed such that its outer contour includes a cylindrical portion on the tip side, and the third sensor housing portion may be formed in a two-stage cylindrical shape having a pressure receiving hole in its outer contour.

[0017] As described above, the manufacturing method of the sensor unit of the present invention is a manufacturing method of a sensor unit including an outer case, an inner case, a sensor, a circuit board, and a resin sealing material, including a step in which an inner case incorporating the sensor and the circuit board is fixed to the outer case by inserting a flat plate portion into a recess, and the resin sealing material is supplied to fill the internal space and cover the flat plate portion and then cured.

[0018] In the above manufacturing method of the sensor unit, before the inner case is fixed to the outer case, the sensor may be electrically connected to the circuit board, and the circuit board may be fixed to the flat plate portion of the inner case while arranging the sensor in the sensor housing portion.

[0019] In the above manufacturing method of the sensor unit, before the inner case is fixed to the outer case, the sensor may be arranged in the sensor housing portion, the circuit board may be fixed to the flat plate portion of the inner case by passing the lead wire or extension terminal of the sensor through the connection hole thereof, and the lead wire or extension terminal of the sensor may be electrically connected to the connection hole of the circuit board.

[0020] In the above manufacturing method of the sensor unit, before the circuit board is fixed to the flat plate portion, the lead wire or extension terminal of the sensor may be positioned by a part of the inner case directly or via the sensor body of the sensor.

[0021] In the method for manufacturing the sensor unit, before the circuit board is fixed to the flat plate portion, the lead wire or the extension terminal of the sensor may be positioned by a positioning member fitted into the inner case.

[0022] In the method for manufacturing the sensor unit, before the circuit board is fixed to the flat plate portion, the lead wire or the extension terminal of the sensor is arranged along the flat plate portion of the inner case and positioned by a first guide plate that guides in the first direction and a second guide plate that is laminated on the first guide plate and guides in a second direction forming a predetermined angle with the first direction. The first guide plate and the second guide plate are removed from the flat plate portion before the inner case is fixed to the outer case. The manufacturing method may be adopted.

[0023] In the method for manufacturing the sensor unit, when the inner case is fixed to the outer case, the other end of the external connection terminal integrally formed on the outer case is passed through the connection hole of the circuit board, and before the resin sealing material is supplied, the other end of the external connection terminal is electrically connected to the connection hole of the circuit board. The manufacturing method may be adopted.

Advantages of the Invention

[0024] According to the sensor unit of the present invention having the above-described configuration, excellent water pressure resistance and weather resistance can be achieved, and facilitation of manufacturing, miniaturization, thinning, and cost reduction can be achieved. Further, according to the method for manufacturing the sensor unit of the present invention, all processes can be performed on a single manufacturing line, and simplification of the manufacturing process, reduction of the manufacturing cost, improvement of the assembling accuracy, etc. can be achieved.

Brief Description of the Drawings

[0025] [Figure 1] It shows a throttle device incorporating the sensor unit of the present invention, and is an external perspective view seen obliquely from the upstream side of the intake passage. [Figure 2]This is a perspective view of a throttle device incorporating the sensor unit of the present invention, taken from an oblique angle downstream of the intake passage. [Figure 3] Figure 1 shows the throttle device with the sensor unit removed, viewed from an oblique angle on the upstream side of the intake passage. [Figure 4] Figure 2 shows an exploded perspective view of the throttle device with the sensor unit removed, viewed from an oblique angle on the downstream side of the intake passage. [Figure 5] Figure 1 is a perspective cross-sectional view showing the regions of the temperature sensor, rotation angle sensor, and pressure sensor included in the sensor unit of the throttle device. [Figure 6] This is an external perspective view showing the sensor unit according to the first embodiment. [Figure 7] This is an exploded perspective view of the sensor unit according to the first embodiment. [Figure 8] This is an exploded perspective view showing a circuit board to which an inner case, pressure sensor, temperature sensor, and rotation angle sensor are connected in a sensor unit according to the first embodiment. [Figure 9] This is a plan view of the sensor unit according to the first embodiment, showing the pressure sensor arranged in the sensor housing (third sensor housing), viewed from a direction perpendicular to the end face of a flat plate portion that forms part of the inner case. [Figure 10] This is a perspective view showing the sensor unit according to the first embodiment, in which a temperature sensor, a rotation angle sensor, and a pressure sensor are arranged in their respective sensor housings on an inner case, and a circuit board is fixed to a flat plate portion. [Figure 11] This is an exploded perspective view showing the sensor unit according to the first embodiment, before the inner case, which incorporates the circuit board and the like, is fitted into the recess of the outer case. [Figure 12] This is a perspective view showing the sensor unit according to the first embodiment, in which the inner case, into which the circuit board and the like are incorporated, is fitted into the recess of the outer case. [Figure 13]Figure 12 is a perspective view showing the assembled state after the resin encapsulant has been supplied and cured. [Figure 14] Figure 13 shows a cross-sectional view taken from the plane passing through the temperature sensor in the completed assembly state. [Figure 15] Figure 13 shows a cross-sectional view taken from a plane passing through the rotation angle sensor and pressure sensor in the assembled state. [Figure 16] This is an external perspective view showing the sensor unit according to the second embodiment. [Figure 17] This is an exploded perspective view of the sensor unit according to the second embodiment. [Figure 18] This is an exploded perspective view showing a circuit board to which an inner case, a pressure sensor, a temperature sensor, and a rotation angle sensor are connected in a sensor unit according to the second embodiment. [Figure 19] This is an exploded perspective view showing the sensor unit according to the second embodiment, before the inner case, which incorporates the circuit board and the like, is fitted into the recess of the outer case. [Figure 20] This is a perspective view showing the sensor unit according to the second embodiment, in which the inner case, into which the circuit board and the like are incorporated, is fitted into the recess of the outer case. [Figure 21] Figure 20 shows a perspective view of the assembled state after the resin encapsulant has been supplied and cured. [Figure 22] Figure 20 shows a cross-sectional view taken from a plane passing through the rotation angle sensor and pressure sensor in the completed assembly state. [Figure 23] This is an exploded perspective view of the sensor unit according to the third embodiment. [Figure 24] This is an exploded perspective view showing the inner case, pressure sensor, temperature sensor, and rotation angle sensor in the sensor unit according to the third embodiment. [Figure 25] This is a plan view showing the sensor unit according to the third embodiment, in which the pressure sensor, temperature sensor, and rotation angle sensor are each arranged in the sensor housing portion of the inner case. [Figure 26] Figure 25 shows an exploded perspective view of the sensor unit according to the third embodiment, before the circuit board is incorporated into the inner case. [Figure 27] This is a perspective view of the sensor unit according to the third embodiment, showing the state in which the circuit board is incorporated into the inner case, compared to the state shown in Figure 26. [Figure 28] This is an exploded perspective view of the sensor unit according to the fourth embodiment. [Figure 29] This is an exploded perspective view showing the inner case, pressure sensor, temperature sensor, first positioning member, rotation angle sensor, and second positioning member in the sensor unit according to the fourth embodiment. [Figure 30] This is a perspective view of the sensor unit according to the fourth embodiment, showing the state in which the pressure sensor, temperature sensor, and rotation angle sensor are each arranged in the sensor housing portion of the inner case, as shown in Figure 29. [Figure 31] This is a perspective view of the sensor unit according to the fourth embodiment, showing the state in which the first positioning member and the second positioning member are fitted in, from the state shown in Figure 30. [Figure 32] This is an exploded perspective view of the sensor unit according to the fourth embodiment, showing the state before the circuit board is incorporated into the inner case shown in Figure 31. [Figure 33] This is a perspective view of the sensor unit according to the fourth embodiment, showing the state in which the circuit board is incorporated into the inner case, compared to the state shown in Figure 32. [Figure 34] This is an exploded perspective view of the sensor unit according to the fifth embodiment. [Figure 35] This is a perspective cross-sectional view taken by cutting a plane passing through the pressure sensor in a sensor unit according to the fifth embodiment, where the pressure sensor is integrally molded with the sensor unit. [Figure 36] This is an exploded perspective view showing the first guide plate and the second guide plate used in the sensor unit and its manufacturing method according to the sixth embodiment. [Figure 37]This is a perspective view showing an inner case and a first guide plate in which a temperature sensor, a rotation angle sensor, and a pressure sensor are arranged in their respective sensor housings, in a method for manufacturing a sensor unit according to the sixth embodiment. [Figure 38] Figure 37 shows a perspective view of the state in which the first guide plate is assembled along the flat portion of the inner case. [Figure 39] This is a perspective view showing the state of the first guide plate and inner case as shown in Figure 38, before the second guide plate is incorporated. [Figure 40] Figure 39 is a perspective view showing the second guide plate incorporated into the first guide plate and inner case, as shown in the diagram. [Figure 41] Figure 40 is a perspective view showing the inner case with the first and second guide plates assembled, and the circuit board installed in the case. [Figure 42] This is a perspective view showing the state after the first and second guide plates have been removed from the state shown in Figure 41. [Modes for carrying out the invention]

[0026] Embodiments of the present invention will be described below with reference to the accompanying drawings. The sensor unit of the present invention is intended to be incorporated into the throttle device of an internal combustion engine.

[0027] Here, as shown in Figures 1 to 4, the throttle device is positioned as part of the intake system of an internal combustion engine and comprises a throttle body 1, a rotating shaft 2 centered on axis S, a throttle valve 3 fixed to the rotating shaft 2 and opening and closing the intake passage 1c, a drive unit 4 that drives the throttle valve 3 to open and close, a control valve 5, and a sensor unit U. The sensor unit U is one of the sensor units U1, U2, U3, U4, U5, and U6 according to the first to sixth embodiments described below. Sensor units U1 to U6 include a temperature sensor, a rotation angle sensor, and a pressure sensor as sensors.

[0028] The throttle body 1 is made of a metal material such as aluminum or a resin material and includes an upstream connection part 1a, a downstream connection part 1b, an intake passage 1c, a bypass passage (not shown) adjusted by a control valve 5, a mounting surface 1d for attaching a sensor unit U, a screw hole 1e for screwing in screw b, a through hole 1f, and a detection hole 1g for detecting intake pressure. The rotating shaft 2 is formed from a metal or the like with a circular cross-section and extends in the axial direction S, and is equipped with a detection portion 2a in the region facing the inside of the mounting surface 1d. The detection unit 2a is formed as a bottomed cylindrical portion and is equipped with a permanent magnet (not shown) on its inner circumferential surface, and is formed to non-contactly accommodate a cylindrical region that houses the rotation angle sensor 40 of the sensor unit U.

[0029] As shown in Figures 6 to 15, the sensor unit U1 according to the first embodiment comprises an outer case 10, an inner case 20, a temperature sensor 30, a rotation angle sensor 40, a pressure sensor 50, a circuit board 60, a resin encapsulant 70, and annular sealing members Sr1 and Sr2.

[0030] The outer case 10 is molded from a resin material and, as shown in Figures 7 and 11, includes an annular opposing surface 11, a recess 12, two pins 13 as positioning parts, two locking pieces 14 as locking parts, a receiving part 15, a plurality (in this case, five) of external connection terminals 16, a connector 17, and two boss parts 18 that protrude slightly from the annular opposing surface 11.

[0031] The annular opposing surface 11 is formed as an annular flat surface perpendicular to the axis S, and faces the mounting surface 1d of the throttle body 1 with a small gap between them. Furthermore, if the boss portion 18 is formed flush with the annular opposing surface 11, the annular opposing surface 11 becomes a joining surface that is in close contact with the mounting surface 1d.

[0032] The recess 12 opens into the region surrounded by the annular opposing surfaces 11, defining the inner wall surface 12a and the bottom surface 12b, and is formed to receive the flat plate portion 21 with a gap between the inner wall surface 12a and the bottom surface 12b and the flat plate portion 21 of the inner case 20. The pin 13 is formed in a cylindrical shape extending in the axial direction S and is fitted into the fitting hole 25 of the inner case 20, which serves as the positioning part. The locking piece 14 is formed in a plate shape extending in the axial direction S, and locks onto the edges 26 and 27 of the inner case 20, which serve as the locking parts, by snap-fit. The receiving portion 15 includes a cylindrical receiving portion 15a that protrudes from the bottom surface 12b in the direction of the axis S to receive the pressure sensor 50, and a receiving portion 15b that is shallower than the bottom surface 12b and formed as a flat surface perpendicular to the axis S to receive a part of the circuit board 60.

[0033] The external connection terminal 16 is formed by bending a long, thin, conductive metal plate and is integrally molded (insert molded) when the outer case 10 is formed. The external connection terminal 16 is surrounded by the connector 17 with one end (not shown) exposed to the outside, and the other end 16b is formed to extend in the axial direction S within the recess 12 and be exposed. The connector 17 provides an electrical connection to the outside and is formed in a cylindrical shape that extends perpendicular to the axis S and opens, surrounding one end (not shown) of the external connection terminal 16. The boss portion 18 is through which the screw b, which fastens to the throttle body 1, passes. As shown in Figure 3, a metal cylindrical collar 18a is integrally molded (insert molded) when the outer case 10 is formed.

[0034] The inner case 20 is molded using a resin material and, as shown in Figures 7 to 12, includes a flat plate portion 21, a first sensor housing portion 22, a second sensor housing portion 23, a third sensor housing portion 24, two fitting holes 25 as positioning portions, two edge portions 26 and 27 as locking portions, and an opening 28.

[0035] As shown in Figures 8 and 9, the flat plate portion 21 includes an outer contour 21a, an end face 21b, four bases 21c, 21d, 21e, and 21f, two positioning protrusions 21g and 21h, and two locking pieces 21i that serve as substrate locking portions.

[0036] The outer contour 21a is formed to be inserted into the recess 12 with a predetermined gap between it and the inner wall surface 12a of the recess 12. The end face 21b is formed as a flat surface perpendicular to the axis S. The base 21c is formed in a cylindrical shape that protrudes from the end face 21b in the direction of the axis S, and supports the circuit board 60 at its end face. The base 21d is formed in a prismatic shape that protrudes from the end face 21b in the direction of the axis S, and supports the circuit board 60 at its end face. The base 21e is formed in an annular shape that protrudes from the end face 21b in the direction of the axis S, and supports the circuit board 60 at its end face. The base 21f is formed as a triangular prism projecting from the end face 21b in the direction of the axis S, and supports the circuit board 60 at its end face.

[0037] The positioning projection 21g is formed in a cylindrical shape that protrudes from the end face 21b in the direction of the axis S, and is fitted into the circular hole 61 of the circuit board 60 to position the circuit board 60 on a plane perpendicular to the axis S. The positioning projection 21h is formed in a cylindrical shape that protrudes from the end face 21b in the direction of the axis S, coaxially with the base 21e, and is fitted into the circular hole 61 of the circuit board 60 to position the circuit board 60 on a plane perpendicular to the axis S. The two locking pieces 21i are formed in a plate shape extending from the end face 21b in the axial direction S, and lock onto the locking edges 68 and 69 of the circuit board 60 by snap-fit.

[0038] As shown in Figure 7, the first sensor housing portion 22 is formed in a tapered, bottomed cylindrical shape that protrudes from the flat plate portion 21 on the side opposite to the bottom surface 12b of the recess 12 of the outer case 10 and opens toward the bottom surface 12b of the recess 12. As shown in Figures 7 to 9, it defines a housing recess 22a with a circular cross-section for housing the temperature sensor 30 and an annular groove 22b for fitting the annular sealing member Sr1. Here, the receiving recess 22a is formed to be slightly larger than the sensor body 31, taking into consideration the ease of inserting the temperature sensor 30.

[0039] As shown in Figure 7, the second sensor housing portion 23 protrudes from the flat plate portion 21 on the side opposite to the bottom surface 12b of the recess 12 of the outer case 10 and opens toward the bottom surface 12b of the recess 12. Its outer contour is formed in a cylindrical shape centered on the axis S, and inside it, as shown in Figures 8 and 9, it defines a housing recess 23a with a rectangular cross-section for housing the rotation angle sensor 40. Here, the housing recess 23a is formed to be slightly larger than the Hall IC body 41, taking into consideration the ease of inserting the rotation angle sensor 40. Furthermore, in the tip-side region of the second sensor housing section 23, an annular yoke forming a magnetic path is integrally molded and embedded around the housing recess 23a.

[0040] As shown in Figure 7, the third sensor housing portion 24 protrudes from the flat plate portion 21 on the side opposite to the bottom surface 12b of the recess 12 of the outer case 10 and opens toward the bottom surface 12b of the recess 12, and its outer contour is formed in a two-stage cylindrical shape, and as shown in Figures 8 and 9, it defines a housing recess 24a for housing the pressure sensor 50 on its inside and a pressure receiving hole 24b that opens toward the outside. The receiving recess 24a includes a cylindrical surface 24a1 that receives the cylindrical portion 51a of the pressure sensor 50, an annular end surface 24a2 that receives the extension piece 51b of the pressure sensor 50, and an inner wall surface 24a3 that positions the outer peripheral wall 51c of the pressure sensor 50. Furthermore, by positioning the pressure sensor 50 in the housing recess 24a, the extension terminal 52 is positioned in the direction of the axis S and in a direction perpendicular to the axis S.

[0041] The fitting hole 25 is a circular hole into which the pin 13 of the outer case 10 is fitted. The edge portion 26 is formed as the inner edge of the opening 26a so as to be locked through the locking piece 14 of the outer case 10. The edge portion 27 is formed as the inner edge portion of the opening 28 so as to be locked through the locking piece 14 of the outer case 10. The opening 28 is a substantially rectangular opening that penetrates the flat plate portion 21, and as shown in Figure 12, it is formed so as to expose the other end 16b of the external connection terminal 16 that is passed through the connection hole 67 of the circuit board 60 before the resin sealing material 70 is filled in.

[0042] The temperature sensor 30 is positioned in the housing recess 22a of the first sensor housing 22, and the temperature of the intake air flowing through the intake passage 1c is detected when the first sensor housing 22 is inserted into the through hole 1f of the throttle body 1. Here, the temperature sensor 30 is a lead-type sensor that includes a temperature-sensing element such as a thermistor, and is composed of a sensor body 31 and two lead wires 32 extending from the sensor body 31. The temperature sensor 30 is then inserted into the housing recess 22a of the first sensor housing 22, and the lead wires 32 are passed through the connection holes 64 of the circuit board 60 to make an electrical connection.

[0043] The rotation angle sensor 40 is positioned in the housing recess 23a of the second sensor housing 23, and the rotation angle of the rotation shaft 2 is detected when the second sensor housing 23 is inserted into the detection portion 2a of the rotation shaft 2. Here, the rotation angle sensor 40 is a non-contact type sensor using, for example, a Hall element, and is composed of a Hall IC body 41 and three extension terminals 42 extending from the Hall IC body 41. The rotation angle sensor 40 is then inserted into the housing recess 23a of the second sensor housing 23, and the extension terminal 42 is passed through the connection hole 65 of the circuit board 60 for electrical connection.

[0044] The pressure sensor 50 is positioned in the housing recess 24a of the third sensor housing 24, and the pressure receiving hole 24b of the third sensor housing 24 is positioned to communicate with the detection hole 1g of the throttle body 1, thereby detecting the pressure of the intake air flowing through the intake passage 1c. Here, the pressure sensor 50 is, for example, a diaphragm type equipped with a semiconductor strain gauge, and consists of a sensor body 51 that houses a pressure receiving part, and three extension terminals 52 extending from the sensor body 51. The sensor body 51 includes a cylindrical part 51a, an extension piece 51b, and an outer peripheral wall 51c. The pressure sensor 50 is then inserted into the housing recess 24a of the third sensor housing 24, and the extension terminal 52 is passed through the connection hole 66 of the circuit board 60 for electrical connection.

[0045] As shown in Figures 7, 8, and 11, the circuit board 60 is formed to have a smaller contour than the flat plate portion 21 of the inner case 20, and has printed wiring (not shown) and a plurality of electronic components (not shown) mounted on it, and includes two circular holes 61 through which positioning protrusions 21g and 21h pass, two openings 62 and 63, two connection holes 64, three connection holes 65, three connection holes 66, five connection holes 67, and two locking edges 68 and 69 into which the locking piece 21i is locked.

[0046] The opening 62 is formed to allow the locking piece 21i to pass through, and defines the locking edge portion 68 in its inner edge region. The opening 63 is formed to allow the locking piece 14 of the outer case 10 to pass through. The connection hole 64 is a through-hole, and is the area through which the lead wires 32 of the temperature sensor 30 are passed and electrically connected. The connection hole 65 is a through-hole, and is the area through which the extension terminal 42 of the rotation angle sensor 40 is passed and electrically connected. The connection hole 66 is a through-hole, and is the area through which the extension terminal 52 of the pressure sensor 50 is passed and electrically connected. The connection hole 67 is a through-hole, and is the area through which the other end 16b of the external connection terminal 16, which is integrally molded with the outer case 10, passes and is electrically connected.

[0047] The resin encapsulant 70 is a thermosetting resin such as epoxy resin, and as shown in Figures 14 and 15, it is supplied and cured so as to fill the internal space IS defined by the outer case 10 and the inner case 20 and cover the flat plate portion 21 that is inserted into and fixed in the recess 12. Furthermore, the resin encapsulant 70 fills the gap area (internal space IS) around where the sensors (temperature sensor 30, rotation angle sensor 40, pressure sensor 50) and circuit board 60 are located, and also embeds the flat plate portion 21, thereby improving the sealing performance.

[0048] Next, a method for manufacturing the sensor unit U1 according to the first embodiment will be described. An outer case 10 with an external connection terminal 16 and cylindrical collar 18a integrally molded, an inner case 20, a temperature sensor 30, a rotation angle sensor 40, a pressure sensor 50, a circuit board 60, and annular sealing members Sr1 and Sr2 are prepared in advance.

[0049] First, as shown in Figure 8, the temperature sensor 30 and the rotation angle sensor 40 are electrically connected to the circuit board 60. Specifically, the lead wires 32 of the temperature sensor 30 are passed through the connection holes 64 and soldered, and the extension terminals 42 of the rotation angle sensor 40 are passed through the connection holes 65 and soldered. Also, as shown in Figure 9, the pressure sensor 50 is placed in the third sensor housing section 24 of the inner case 20.

[0050] Next, as shown in Figure 10, the circuit board 60 is fixed to the flat plate portion 21 of the inner case 20 via a locking piece 21i, with the extension terminal 52 of the pressure sensor 50 passing through the connection hole 66, and the temperature sensor 30 being placed in the first sensor housing portion 22 and the rotation angle sensor 40 being placed in the second sensor housing portion 23. Next, the extension terminal 52 of the pressure sensor 50 is electrically connected to the connection hole 66 of the circuit board 60 by soldering.

[0051] Next, as shown in Figures 11 and 12, the inner case 20 is fixed to the outer case 10 via the locking piece 14 by inserting the flat plate portion 21 into the recess 12, thereby passing the other end 16b of the external connection terminal 16 through the connection hole 67. Next, in the state shown in Figure 12, the other end 16b of the external connection terminal 16 is electrically connected to the connection hole 67 of the circuit board 60 by soldering.

[0052] Subsequently, the resin encapsulant 70 is supplied to fill the internal space IS defined by the outer case 10 and the inner case 20, as shown in Figures 13 to 15, and to cover the flat plate portion 21, and then hardened. Finally, as shown in Figure 6, the annular sealing member Sr1 is fitted onto the outer circumference (annular groove 22b) of the first sensor housing 22, and the annular sealing member Sr2 is fitted onto the outer circumference of the third sensor housing 24. With this, the manufacturing of the sensor unit U1 by assembly is completed.

[0053] According to the sensor unit U1 of the first embodiment having the above configuration, it is possible to achieve excellent water pressure resistance and weather resistance, as well as ease of manufacturing, miniaturization, thinning, and cost reduction. Furthermore, the manufacturing method described above allows all processes to be carried out on a single production line, thereby simplifying the manufacturing process and reducing manufacturing costs.

[0054] Figures 16 to 22 show the sensor unit U2 according to the second embodiment, and components identical to those in the sensor unit U1 according to the first embodiment are denoted by the same reference numerals and their descriptions are omitted. As shown in Figures 16 and 17, the sensor unit U2 according to the second embodiment comprises an outer case 10, an inner case 120, a temperature sensor 30, a rotation angle sensor 140, a pressure sensor 50, a circuit board 160, a resin encapsulant 70, and annular sealing members Sr1 and Sr2.

[0055] The inner case 120 is molded using a resin material and includes a flat plate portion 21, a first sensor housing portion 22, a second sensor housing portion 123, a third sensor housing portion 24, two fitting holes 25 as positioning portions, two edge portions 26, 27 as locking portions, and an opening 28.

[0056] As shown in Figures 17 and 18, the second sensor housing portion 123 protrudes from the flat plate portion 21 on the side opposite to the bottom surface 12b of the recess 12 of the outer case 10 and opens toward the bottom surface 12b of the recess 12. Inside, it defines a rectangular housing recess 123a for housing the rotation angle sensor 140, and outside it is formed to have a cylindrical portion 123b centered on the axis S.

[0057] The rotation angle sensor 140 is a surface-mount type sensor and is positioned in the housing recess 123a of the second sensor housing 123. The rotation angle of the rotation shaft 2 is detected when the detected part (not shown) of the rotation shaft 2 is inserted into the cylindrical part 123b of the second sensor housing 123. The detected part of the rotation shaft 2 is inserted non-contact into the inside of the cylindrical part 123b, instead of the detected part 2a which forms a bottomed cylindrical part, and is formed to form a disc shape facing the rotation angle sensor 140 in the axial direction S.

[0058] The circuit board 160 is formed to have a smaller contour than the flat portion 21 of the inner case 120, and has printed wiring (not shown) and a plurality of electronic components (not shown) mounted on it, and includes two circular holes 61 through which positioning protrusions 21g, 21h pass, two openings 62, 63, two connection holes 64, eight pads 165, three connection holes 66, five connection holes 67, and two locking edges 68, 69 into which locking pieces 21i are locked. The pad 165 is the area where the terminal 142 of the rotation angle sensor 140 is in contact and electrically connected.

[0059] The manufacturing method for the sensor unit U2 according to the second embodiment is the same as the manufacturing method for the sensor unit U1 according to the first embodiment, as shown in Figures 18 to 22, except that the inner case 20 is changed to an inner case 120, the rotation angle sensor 40 is changed to a rotation angle sensor 140, and the circuit board 60 is changed to a circuit board 160. According to the sensor unit U2 of the second embodiment having the above configuration, it is possible to achieve excellent water pressure resistance and weather resistance, as well as ease of manufacturing, miniaturization, thinning, and cost reduction. Furthermore, according to the manufacturing method of the sensor unit U2 as per the second embodiment, all processes can be carried out on a single manufacturing line, thereby achieving simplification of the manufacturing process and reduction of manufacturing costs.

[0060] Figures 23 to 27 show the sensor unit U3 and its manufacturing method according to the third embodiment. Components identical to those in the sensor unit U1 according to the first embodiment are denoted by the same reference numerals and their descriptions are omitted. As shown in Figure 23, the sensor unit U3 according to the third embodiment includes an outer case 10, an inner case 220, a temperature sensor 130, a rotation angle sensor 40, a pressure sensor 50, a circuit board 260, a resin encapsulant 70 (not shown in Figure 23), and annular sealing members Sr1 and Sr2 (not shown in Figure 23).

[0061] The temperature sensor 130 is positioned in the housing recess 22a of the first sensor housing 222, and the temperature of the intake air flowing through the intake passage 1c is detected when the first sensor housing 222 is inserted into the through hole 1f of the throttle body 1. Here, the temperature sensor 130 is a lead-type sensor including a temperature-sensing element such as a thermistor, and is composed of a sensor body 31 and two lead wires 132 that extend from the sensor body 31 and are formed by bending the free end.

[0062] The inner case 220 is molded using a resin material and includes a flat plate portion 21, a first sensor housing portion 222, a second sensor housing portion 23, a third sensor housing portion 24, two fitting holes 25 as positioning portions, two edge portions 26, 27 as locking portions, and an opening 28. As shown in Figures 24 to 26, the first sensor housing section 222 includes a housing recess 22a, an annular groove 22b, and two positioning grooves 222c. The positioning groove 222c is formed in the opening region of the receiving recess 22a and is designed to receive and position the free end of the lead wire 132. In other words, the temperature sensor 130 is inserted into the housing recess 22a of the first sensor housing 222, and the free end of the lead wire 132 is positioned in the positioning groove 222c, and then passed through the connection hole 64 of the circuit board 60 for electrical connection.

[0063] The circuit board 260 is formed to have a smaller contour than the flat portion 21 of the inner case 220, and has printed wiring (not shown) and a number of electronic components (not shown) mounted on it, and includes two circular holes 61, two openings 62, 63, two connection holes 264, three connection holes 65, three connection holes 66, five connection holes 67, and two locking edges 68, 69. The two connection holes 264 are spaced further apart than the two connection holes 64 to accommodate the distance between the free ends of the two lead wires 132.

[0064] Next, a method for manufacturing the sensor unit U3 according to the third embodiment will be described. The outer case 10, inner case 220, temperature sensor 130, rotation angle sensor 40, pressure sensor 50, circuit board 260, and annular sealing members Sr1 and Sr2 are prepared in advance.

[0065] First, as shown in Figures 24 and 25, the temperature sensor 130, the rotation angle sensor 40, and the pressure sensor 50 are arranged in the first sensor housing 222, the second sensor housing 23, and the third sensor housing 24, respectively, and the lead wire 132 of the temperature sensor 130 is positioned by the positioning groove 222c. Next, as shown in Figures 26 and 27, the circuit board 260 is fixed to the flat plate portion 21 of the inner case 220 via locking pieces 21i, through its connection holes 264, 65, and 66, through the lead wires 132 of the temperature sensor 130, the extension terminals 42 of the rotation angle sensor 40, and the extension terminals 52 of the pressure sensor 50.

[0066] Next, the lead wires 132 of the temperature sensor 130 are soldered to the connection holes 264, the extension terminals 42 of the rotation angle sensor 40 are soldered to the connection holes 65, and the extension terminals 52 of the pressure sensor 50 are soldered to the connection holes 66, thereby electrically connecting them. Next, similar to the first embodiment, the inner case 220 is fixed to the outer case 10 via the locking piece 14 by inserting the flat plate portion 21 into the recess 12, thereby passing the other end 16b of the external connection terminal 16 through the connection hole 67. Next, the other end 16b of the external connection terminal 16 is electrically connected to the connection hole 67 of the circuit board 260 by soldering.

[0067] Subsequently, the resin encapsulant 70 is supplied to fill the internal space IS defined by the outer case 10 and the inner case 220, and to cover the flat plate portion 21, and then hardened. Finally, the annular sealing member Sr1 is fitted onto the outer circumference (annular groove 22b) of the first sensor housing 222, and the annular sealing member Sr2 is fitted onto the outer circumference of the third sensor housing 24. With this, the manufacturing of the sensor unit U3 by assembly is completed.

[0068] According to the sensor unit U3 of the third embodiment having the above configuration, it is possible to achieve excellent water pressure resistance and weather resistance, as well as ease of manufacturing, miniaturization, thinning, and cost reduction. Furthermore, according to the manufacturing method of the sensor unit U3 of the third embodiment, all processes can be carried out on a single manufacturing line, achieving simplification of the manufacturing process, reduction of manufacturing costs, and in particular, the lead wire 132 can be smoothly inserted into the connection hole 264.

[0069] Figures 28 to 33 show the sensor unit U4 and its manufacturing method according to the fourth embodiment. Components identical to those in the sensor unit U1 according to the first embodiment are denoted by the same reference numerals and their descriptions are omitted. As shown in Figure 28, the sensor unit U4 according to the fourth embodiment includes an outer case 10, an inner case 320, a temperature sensor 30, a rotation angle sensor 40, a pressure sensor 50, a circuit board 60, a resin encapsulant 70 (not shown in Figure 28), a first positioning member 80, a second positioning member 90, and annular sealing members Sr1 and Sr2 (not shown in Figure 28).

[0070] The first positioning member 80 is formed in a disc shape from a non-conductive material (e.g., resin material) and has two circular holes 81 through which the lead wires 32 pass, two through holes 82 through which the resin sealing material 70 to be filled passes, and two notches 83. The second positioning member 90 is formed in a disc shape from a non-conductive material (e.g., resin material) and has three circular holes 91 through which the extension terminal 42 passes, two through holes 92 for passing the resin sealing material 70 to be filled, and two notches 93.

[0071] The inner case 320 is molded using a resin material and includes a flat plate portion 21, a first sensor housing portion 322, a second sensor housing portion 323, a third sensor housing portion 24, two fitting holes 25 as positioning portions, two edge portions 26, 27 as locking portions, and an opening 28.

[0072] As shown in Figures 29 to 32, the first sensor housing section 322 is formed in a tapered, bottomed cylindrical shape and includes a housing recess 22a, an annular groove 22b, and a first positioning fitting hole 322c. The first positioning fitting hole 322c has an annular end face 322c1 and two positioning protrusions 322c2 in the opening region of the receiving recess 22a which forms part of the flat plate portion 21. The annular end face 322c1 is the region into which the first positioning member 80 is joined, and the positioning projection 322c2 is the region into which the notch 83 of the first positioning member 80 is fitted.

[0073] As shown in Figures 29 to 32, the second sensor housing 323 has an outer contour formed in a cylindrical shape centered on the axis S, and is equipped with a housing recess 23a and a second positioning fitting hole 323c on its inside. The second positioning fitting hole 323c has an annular end face 323c1 and two positioning protrusions 323c2 in the opening region of the receiving recess 23a which forms part of the flat plate portion 21. The annular end face 323c1 is the region into which the second positioning member 90 is joined, and the positioning projection 323c2 is the region into which the notch 93 of the second positioning member 90 is fitted. Furthermore, in the tip-side region of the second sensor housing section 323, an annular yoke forming a magnetic path is integrally molded and embedded around the housing recess 23a.

[0074] Next, a method for manufacturing the sensor unit U4 according to the fourth embodiment will be described. The outer case 10, inner case 320, temperature sensor 30, rotation angle sensor 40, pressure sensor 50, circuit board 60, first positioning member 80, second positioning member 90, and annular sealing members Sr1 and Sr2 are prepared in advance.

[0075] First, as shown in Figure 30, the temperature sensor 30, the rotation angle sensor 40, and the pressure sensor 50 are arranged in the first sensor housing 322, the second sensor housing 323, and the third sensor housing 24, respectively. Next, as shown in Figure 31, the first positioning member 80 is fitted into the first positioning fitting hole 322c to position the lead wire 32 of the temperature sensor 30, and the second positioning member 90 is fitted into the second positioning fitting hole 323c to position the extension terminal 42 of the rotation angle sensor 40.

[0076] Next, as shown in Figures 32 and 33, the circuit board 60 is fixed to the flat plate portion 21 of the inner case 320 via locking pieces 21i, with the lead wires 32 of the temperature sensor 30, the extension terminals 42 of the rotation angle sensor 40, and the extension terminals 52 of the pressure sensor 50 passing through its connection holes 64, 65, and 66. Next, the lead wires 32 of the temperature sensor 30 are soldered to the connection holes 64, the extension terminals 42 of the rotation angle sensor 40 are soldered to the connection holes 65, and the extension terminals 52 of the pressure sensor 50 are soldered to the connection holes 66, thereby electrically connecting them. Next, similar to the first embodiment, the inner case 320 is fixed to the outer case 10 via the locking piece 14 by inserting the flat plate portion 21 into the recess 12, thereby passing the other end 16b of the external connection terminal 16 through the connection hole 67. Next, the other end 16b of the external connection terminal 16 is electrically connected to the connection hole 67 of the circuit board 60 by soldering.

[0077] Subsequently, the resin encapsulant 70 is supplied to fill the internal space IS defined by the outer case 10 and the inner case 320, and to cover the flat plate portion 21, and then hardened. Finally, the annular sealing member Sr1 is fitted onto the outer circumference (annular groove 22b) of the first sensor housing 322, and the annular sealing member Sr2 is fitted onto the outer circumference of the third sensor housing 24. With the above steps completed, the manufacturing process by assembling the sensor unit U4 is finished.

[0078] According to the sensor unit U4 of the fourth embodiment having the above configuration, it is possible to achieve excellent water pressure resistance and weather resistance, as well as ease of manufacturing, miniaturization, thinning, and cost reduction. Furthermore, according to the manufacturing method of the sensor unit U4 according to the fourth embodiment, all processes can be carried out on a single manufacturing line, achieving simplification of the manufacturing process, reduction of manufacturing costs, and in particular, the lead wires 32 and extension terminals 42 can be smoothly inserted into the connection holes 64 and 65, respectively.

[0079] Figures 34 and 35 show the sensor unit U5 according to the fifth embodiment. Components identical to those in the sensor unit U4 according to the fourth embodiment are denoted by the same reference numerals and their descriptions are omitted. As shown in Figure 34, the sensor unit U5 according to the fifth embodiment includes an outer case 10, an inner case 420, a temperature sensor 30, a rotation angle sensor 40, a pressure sensor 150, a circuit board 60, a resin encapsulant 70 (not shown in Figure 34), a first positioning member 80, a second positioning member 90, and annular sealing members Sr1 and Sr2 (not shown in Figure 34).

[0080] The pressure sensor 150 is, for example, a diaphragm type equipped with a semiconductor strain gauge, and as shown in Figure 35, it consists of a sensor body 151 that has a pressure receiving section built in and a pressure receiving hole 151a, and three extension terminals 152 that extend from the sensor body 151. The pressure sensor 150 is integrally molded (insert molded) into the third sensor housing 424 of the inner case 420.

[0081] The inner case 420 is molded using a resin material and includes a flat plate portion 21, a first sensor housing portion 322, a second sensor housing portion 323, a third sensor housing portion 424, two fitting holes 25, two edges 26, 27, and an opening 28. As shown in Figure 35, the third sensor housing 424 has an outer contour formed in a two-stage cylindrical shape, and the sensor body 151 of the pressure sensor 150 is embedded inside it, while the three extension terminals 152 are positioned to protrude from the end face 21b in the axial direction S.

[0082] The manufacturing method for the sensor unit U5 according to the fifth embodiment is the same as the manufacturing method for the sensor unit U4 according to the fourth embodiment, except that the inner case 320 is changed to an inner case 420, the pressure sensor 50 is changed to a pressure sensor 150, and the pressure sensor 150 is integrally molded with the inner case 420 in the third sensor housing 424. According to the sensor unit U5 of the fifth embodiment having the above configuration, it is possible to achieve excellent water pressure resistance and weather resistance, as well as ease of manufacturing, miniaturization, thinning, and cost reduction. Furthermore, according to the manufacturing method of the sensor unit U5 of the fifth embodiment, all processes can be carried out on a single manufacturing line, achieving simplification of the manufacturing process and reduction of manufacturing costs. In particular, the lead wires 32 and extension terminals 42 and 152 can be smoothly inserted into the connection holes 64, 65, and 66, respectively.

[0083] Figures 36 to 42 show the sensor unit U6 and its manufacturing method according to the sixth embodiment. Components identical to those in the sensor unit U1 according to the first embodiment are denoted by the same reference numerals and their descriptions are omitted. As shown in Figure 36, the sensor unit U6 according to the sixth embodiment includes an outer case 10, an inner case 520, a temperature sensor 30, a rotation angle sensor 40, a pressure sensor 50, a circuit board 60, a resin encapsulant 70 (not shown in Figure 36), and annular sealing members Sr1 and Sr2 (not shown in Figure 36). In addition, a first guide plate J1 and a second guide plate J2 are used in the manufacturing process of the sensor unit U6.

[0084] The inner case 520 is molded using a resin material and, as shown in Figures 36 and 37, includes a flat plate portion 21, a first sensor housing portion 22, a second sensor housing portion 23, a third sensor housing portion 24, two fitting holes 25 as positioning portions, two edge portions 26 and 27 as locking portions, and an opening 28. The flat plate portion 21 includes an outer contour 21a, an end face 21b, four bases 21c, 21d, 21e, 21f, two positioning protrusions 21g, 21h, two locking pieces 21i as substrate locking parts, and two guide portions 521j. The two guide portions 521j guide the first guide plate J1 so that it can move freely in the first direction L1, and are formed in a cylindrical shape with a height less than or equal to the thickness of the first guide plate J1.

[0085] As shown in FIGS. 37 and 38, the first guide plate J1 is formed in a substantially rectangular flat plate shape and is arranged to be reciprocally movable in the first direction L1 along the end face 21b of the flat plate portion 21. It has a guide slit J that slidably receives two guide portions 521j in the first direction L1 and receives the locking piece 21i 10 and two guide slits J that receive and guide two lead wires 32 in the first direction L1 and restrict movement in the second direction 11 and three guide slits J that receive and guide three extension terminals 42 in the first direction L1 and restrict movement in the second direction 12 and a relief slit J for escaping the positioning projection 21g 13 and a relief slit J for escaping the pedestal 21f 14 and guide portions J on both sides for guiding the second guide plate J2 in the second direction 15 It is provided with.

[0086] As shown in FIGS. 39 and 40, the second guide plate J2 is formed in a substantially rectangular flat plate shape and is laminated on the first guide plate J1 and arranged to be reciprocally movable in the second direction L2. It has a guided side wall J that is slidably guided by the guide portion J of the first guide plate J1 15 and a guide slit J that receives and guides two lead wires 32 in the second direction L2, restricts movement in the first direction, and receives the positioning projection 21g 20 and a guide slit J that receives and guides three extension terminals 42 in the second direction L2 and restricts movement in the first direction 21 and a relief slit J for escaping the locking piece 21i 22 / / This comment is just for showing the position in the original text, not part of the translation and a relief slit J for escaping the pedestal 2*** / / There seems to be a typo in the original text, assuming it should be 21f 23 and a relief slit J for escaping the pedestal 21f 24 It is provided with.

[0087] Here, the thickness dimensions of the first guide plate J1 and the second guide plate J2 in the stacked state are set to be the same as or less than the height dimensions of the pedestals 21c, 21d, 21e, 21f. Also, the angle of the second direction L2 with respect to the first direction L1 is set to a right angle (90 degrees), but a configuration forming a predetermined angle other than a right angle may also be used.

[0088] Next, a method for manufacturing the sensor unit U6 according to the sixth embodiment will be described. The following components are prepared in advance: outer case 10, inner case 520, temperature sensor 30, rotation angle sensor 40, pressure sensor 50, circuit board 60, annular sealing members Sr1 and Sr2, first guide plate J1, and second guide plate J2.

[0089] First, as shown in Figure 37, the temperature sensor 30, the rotation angle sensor 40, and the pressure sensor 50 are arranged in the first sensor housing 22, the second sensor housing 23, and the third sensor housing 24, respectively. Next, as shown in Figure 38, the first guide plate J1 is advanced in the first direction so as to be aligned with the end face 21b of the flat plate portion 21, positioning the lead wire 32 so as not to move in the second direction L2, and also positioning the extension terminal 42 so as not to move in the second direction L2. Next, as shown in Figures 39 and 40, the second guide plate J2 is advanced in the second direction while being stacked on the first guide plate J1, so that the lead wire 32 does not move in the first direction L1, and the extension terminal 42 does not move in the first direction L1.

[0090] Next, as shown in Figure 41, the circuit board 60 is fixed to the flat plate portion 21 of the inner case 520 via locking pieces 21i, through its connection holes 64, 65, and 66, through the lead wires 32 of the temperature sensor 30, the extension terminals 42 of the rotation angle sensor 40, and the extension terminals 52 of the pressure sensor 50. Next, the lead wires 32 of the temperature sensor 30 are soldered to the connection holes 64, the extension terminals 42 of the rotation angle sensor 40 are soldered to the connection holes 65, and the extension terminals 52 of the pressure sensor 50 are soldered to the connection holes 66, thereby electrically connecting them.

[0091] Next, as shown in Figure 42, the first guide plate J1 and the second guide plate J2 are removed from the flat plate portion 21. Next, similar to the first embodiment, the inner case 520 is inserted into the recess 12 by inserting the flat plate portion 21, thereby passing the other end 16b of the external connection terminal 16 through the connection hole 67, and fixing it to the outer case 10 by the locking piece 14. Next, the other end 16b of the external connection terminal 16 is electrically connected to the connection hole 67 of the circuit board 60 by soldering.

[0092] Subsequently, the resin encapsulant 70 is supplied to fill the internal space IS defined by the outer case 10 and the inner case 520, and to cover the flat plate portion 21, and then hardened. Finally, the annular sealing member Sr1 is fitted onto the outer circumference (annular groove 22b) of the first sensor housing 22, and the annular sealing member Sr2 is fitted onto the outer circumference of the third sensor housing 24. With this, the manufacturing of the sensor unit U6 by assembly is completed.

[0093] According to the sensor unit U6 of the sixth embodiment having the above configuration, it is possible to achieve excellent water pressure resistance and weather resistance, as well as ease of manufacturing, miniaturization, thinning, and cost reduction. Furthermore, according to the manufacturing method of the sensor unit U6 according to the sixth embodiment, all processes can be carried out on a single manufacturing line, achieving simplification of the manufacturing process, reduction of manufacturing costs, and in particular, the lead wires 32 and extension terminals 42 can be smoothly inserted into the connection holes 64 and 65, respectively.

[0094] As described above, the sensor unit U1 (U2~U6) of the present invention includes a resin outer case 10 having an annular facing surface 11 facing the object to be applied and a recess 12 opening in the region surrounded by the annular facing surface 11; a resin inner case 20 (120, 220, 320, 420, 520) having a flat plate portion 21 disposed and fixed inside the recess 12 and a sensor housing portion that protrudes from the flat plate portion 21 on the opposite side of the bottom surface 12b of the recess 12 and opens toward the bottom surface 12b of the recess 12; a sensor (temperature sensor 30, 130, rotation angle sensor 40, 140, pressure sensor 50, 150) disposed in the sensor housing portion; a circuit board 60 (160, 260) fixed to the flat plate portion 21 and to which the sensor is electrically connected; and a resin sealing material 70 that fills the internal space IS defined by the outer case and the inner case and covers the flat plate portion 21. According to this design, the resin encapsulant 70 is filled into the recessed area 12 surrounded by the annular opposing surface 11 facing the object to be applied, thus preventing exposure to the external atmosphere and improving water pressure resistance and weather resistance. Furthermore, since the flat plate portion 21 of the inner case incorporating the sensor and circuit board is inserted into the recessed area 12 and fixed, and then sealed with the resin encapsulant 70, the sealing performance is enhanced, and a thinner and smaller design can be achieved.

[0095] Furthermore, since the outer case 10 includes a positioning portion (pin 13) for positioning the inner case 20 within the recess 12, and the inner case 20 includes a positioned portion (fitting hole 25) that is positioned by the positioning portion, the positioning of both can be performed with high precision.

[0096] Furthermore, since the outer case 10 includes a locking portion (locking piece 14) that locks onto the inner case 20, and the inner case 20 includes a lockable portion (edge ​​portion 26, 27) that is locked onto the locking portion, the two can be fixed together with a simple structure.

[0097] Furthermore, the outer case 10 includes an external connection terminal 16 integrally molded for connection to the circuit board 60, a connector 17 that exposes one end of the external connection terminal 16 and surrounds it, and a boss portion 18 through which a screw b for fastening to the object to be applied passes. The inner case 20 includes an opening 28 that exposes the other end 16b of the external connection terminal 16 that passes through the connection hole 67 of the circuit board 60, before the resin encapsulant 70 is filled. According to this, even if the circuit board 60 is placed in the internal space IS surrounded by the flat plate portion 21 and the bottom surface 12b of the recess 12, the other end 16b can be easily soldered to the connection hole 67 through the opening 28 to make an electrical connection.

[0098] Furthermore, the flat plate portion 21 of the inner case 20 includes an end face 21b facing the bottom surface 12b of the recess 12, bases 21c, 21d, 21e, and 21f protruding from the end face 21b on which the circuit board 60 is placed, positioning protrusions 21g and 21h for positioning the circuit board 60, and a board locking portion (locking piece 21i) for locking the circuit board 60. According to this, the circuit board 60 can be firmly fixed to the flat plate portion 21 with a simple structure by placing the circuit board 60 on the base and locking it with the board locking portion (locking piece 21i). Furthermore, by placing the circuit board 60 on the bases 21c, 21d, 21e, and 21f and forming a gap between it and the end face 21b of the flat plate portion 21, the resin sealing material 70 can be smoothly filled to every corner of the internal space IS.

[0099] The sensor also includes a temperature sensor 30, a rotation angle sensor 40, and a pressure sensor 50. The sensor housing includes a first sensor housing 22 for housing the temperature sensor 30, a second sensor housing 23 for housing the rotation angle sensor 40, and a third sensor housing 24 for housing the pressure sensor 50. According to this, multiple sensors can be individually housed while preventing interference with each other, and can be firmly fixed by the resin encapsulant 70 that is filled in.

[0100] Furthermore, the temperature sensor 130 includes a sensor body 31 and a lead wire 132 extending from the sensor body 31 and passing through a connection hole 264 of the circuit board 260, and the first sensor housing 222 includes a positioning groove 222c for positioning the free end of the lead wire 132. According to this, even though the lead wire 132 is long and easily deformed, it is positioned by the positioning groove 222c, so the lead wire 132 can be easily inserted into the connection hole 264 of the circuit board 260, and the subsequent soldering work can be carried out smoothly.

[0101] Furthermore, the temperature sensor 30 includes a sensor body 31 and lead wires 32 extending from the sensor body 31 and passing through connection holes 64 of the circuit board 60, and the rotation angle sensor 40 includes a Hall IC body 41 and an extension terminal 42 extending from the Hall IC body 41 and passing through connection holes 65 of the circuit board 60, and includes a first positioning member 80 fixed to the flat plate portion 21 for positioning the lead wires 32 and a second positioning member 90 fixed to the flat plate portion 21 for positioning the extension terminal 42. According to this configuration, the lead wire 32 is positioned by the first positioning member 80 and the extension terminal 42 is positioned by the second positioning member 90, so the lead wire 32 and the extension terminal 42 can be easily inserted into the connection holes 64 and 65 of the circuit board 60, and the subsequent soldering work can be carried out smoothly.

[0102] Furthermore, the first sensor housing 322 includes a first positioning fitting hole 322c for fitting and positioning the first positioning member 80, and the second sensor housing 323 includes a second positioning fitting hole 323c for fitting and positioning the second positioning member 90. According to this, the lead wire 32 and extension terminal 42 can be easily positioned simply by fitting the first positioning member 80 into the first positioning fitting hole 322c and the second positioning member 90 into the second positioning fitting hole 323c.

[0103] Furthermore, the first sensor housing 22 is formed in a tapered, bottomed cylindrical shape, the second sensor housing 23 has a cylindrical outer contour, and the third sensor housing 24 has an outer contour that is either a two-stage cylindrical shape with a pressure receiving hole 24b, or, in the case of the rotation angle sensor 140 being a surface-mount type sensor, has an outer contour that includes a cylindrical portion 123b at the tip. Thus, each sensor can be configured according to its detection purpose, enabling high-precision detection of the intake air state and the rotation angle of the rotation axis 2.

[0104] Furthermore, by arranging annular sealing members Sr1 and Sr2 on the outer circumference of the first sensor housing 22 and the third sensor housing 24, the sealing performance between them and the mounting surface 1d of the object to be applied can be further enhanced.

[0105] Furthermore, in the manufacturing method of the sensor unit of the present invention, the inner case 20, into which the sensor and circuit board are incorporated, is fixed to the outer case 10 by inserting the flat plate portion 21 into the recess 12, and the resin sealing material 70 is supplied so as to fill the internal space IS defined by the outer case 10 and the inner case 20 and cover the flat plate portion 21, and then hardened. According to this, sensor units can be manufactured while achieving simplification of the manufacturing process, reduction of manufacturing costs, and improvement of assembly accuracy.

[0106] Furthermore, before the circuit board 60 is fixed to the flat plate portion 21, the sensor's lead wires 32 or extension terminals 52 are positioned in a part of the inner case 20 (positioning groove 222c, housing recess 23a) either directly or via the sensor body 51 of the sensor. This allows the lead wires 32 or extension terminals 52 to be easily passed through the connection holes 64 and 66, enabling smooth soldering work afterward.

[0107] Furthermore, before the circuit board 60 is fixed to the flat plate portion 21, the sensor's lead wires 32 or extension terminals 42 are positioned by positioning members fitted into the inner case. More specifically, the sensor includes a temperature sensor 30 and a rotation angle sensor 40, and the lead wires 32 of the temperature sensor 30 are positioned by a first positioning member 80 fitted into the inner case 320, and the extension terminals 42 of the rotation angle sensor 40 are positioned by a second positioning member 90 fitted into the inner case 320. This allows the lead wires 32 or extension terminals 42 to be easily passed through the connection holes 64 and 65, enabling smooth soldering work afterward.

[0108] Furthermore, before the circuit board 60 is fixed to the flat plate portion 21, the sensor lead wires 32 or extension terminals 42 are positioned by a first guide plate J1 which is arranged along the flat plate portion 21 of the inner case 520 and guides in a first direction L1, and a second guide plate J2 which is stacked on the first guide plate J1 and guides in a second direction L2 which forms a predetermined angle with the first direction L1. The first guide plate J1 and the second guide plate J2 are removed from the flat plate portion 21 before the inner case 520 is fixed to the outer case 10, thereby automating tasks such as inserting the lead wires 32 and extension terminals 42 into connection holes 64 and 65 and soldering, and improving productivity.

[0109] In the above embodiment, a configuration was shown that included temperature sensors 30, 130, rotation angle sensors 40, 140, and pressure sensors 50, 150 as sensors. However, the invention is not limited to this configuration, and the present invention's configuration and manufacturing method may be adopted in a configuration that includes any one of these sensors.

[0110] In the above embodiments, inner cases 20, 120, 220, 320, 420, and 520 were shown, in which the flat plate portion 21 is snap-fitted and fixed to the recess 12 of the outer case 10. However, the embodiments are not limited to this, and an embodiment in which a part of the outer wall of the flat plate portion is fitted into a part of the inner wall surface of the recess and fixed may also be adopted.

[0111] In the above embodiment, the throttle body 1 of a throttle device was shown as the target object, but it is not limited to this, and may also be applied to the intake pipe that constitutes the intake system of an internal combustion engine, or other target objects.

[0112] As described above, the sensor unit and its manufacturing method of the present invention offer excellent water pressure resistance and weather resistance, facilitate manufacturing, miniaturize, thin, and reduce costs. Furthermore, all processes can be carried out on a single manufacturing line, simplifying the manufacturing process, reducing manufacturing costs, and improving assembly accuracy. Therefore, it is applicable not only to internal combustion engines mounted on motorcycles and the like, but also to internal combustion engines mounted on automobiles or other vehicles. [Explanation of symbols]

[0113] 1. Throttle body (applicable object) 1d Mounting surface 1f through hole 1g detection hole 2 rotation axes 2a Detected part b Screw U1 Sensor Unit 10 Outer Cases 11 Ring-shaped opposing surface 12 recesses 12b Bottom 13 Pins (positioning part) 14. Locking piece (locking part) 15 Receiving part 16 External connection terminals 16b Other end 17 Connectors 18 Boss Section 20 Inner Cases IS interior space 21 Flat plate part 21b End face 21c, 21d, 21e, 21f Pedestal 21g, 21h Positioning protrusion 21i Locking piece (substrate locking part) 22 First sensor housing 22b Ring groove Sr1 annular sealing member 23 Second sensor housing 24 Third sensor housing 24a Recessed area (part of the inner case) 24b Pressure receiving hole Sr2 annular sealing member 25 Fitting hole (positioning part) 26,27 Edge (locked part) 28 Opening 30 Temperature Sensors 31 Sensor body 32 Lead wires 40 Rotation Angle Sensor 41 Hole IC Body 42 Extension terminals 50 Pressure Sensors 51 Sensor body 52 Extension terminals 60 Circuit boards 61 Round hole 64, 65, 66, 67 connection holes 68,69 Locked edge 70 Resin encapsulant U2 Sensor Unit 120 Inner Case 123 Second sensor housing 123b Cylindrical section 140 Rotation Angle Sensor (Surface Mount Sensor) 160 Circuit Boards 165 pads U3 Sensor Unit 130 Temperature Sensor 132 Lead wires 220 Inner Case 222 First Sensor Housing 222c Positioning groove (part of the inner case) 260 Circuit Boards 264 connection holes U4 Sensor Unit 80 First positioning member 90 Second positioning member 320 Inner Case 322 First sensor housing 322c First positioning fitting hole 323 Second sensor housing 323c Second positioning fitting hole U5 Sensor Unit 150 Pressure Sensor 151 Sensor body 151a Pressure receiving hole 152 Extension terminals 420 Inner Case 424 Third sensor housing U6 Sensor Unit 520 Inner Case J1 First Guide Plate L1 1st direction J2 Second Guide Plate L2 2nd direction

Claims

1. A resin outer case having an annular opposing surface facing the object to be applied and a recess opening in the region surrounded by the annular opposing surface, A resin inner case having a flat plate portion positioned and fixed inside the recess and a sensor housing portion that protrudes from the flat plate portion on the side opposite to the bottom surface of the recess and opens toward the bottom surface of the recess, The sensor arranged in the aforementioned sensor housing section, A circuit board fixed to the flat plate portion and electrically connected to the sensor, A resin sealing material that fills the internal space defined by the outer case and the inner case and covers the flat plate portion, A sensor unit, including the sensor unit.

2. The outer case includes a positioning portion for positioning the inner case within the recess and a locking portion for locking the inner case. The inner case includes a positioning portion that is positioned in the positioning portion and a locking portion that is locked to the locking portion. The sensor unit according to feature 1.

3. The outer case includes an external connection terminal integrally molded for connection to the circuit board, a connector that exposes one end of the external connection terminal and surrounds it, and a boss portion through which a screw for fastening to the object to be applied passes. The inner case includes an opening that exposes the other end of the external connection terminal passed through the connection hole of the circuit board, in the state before the resin sealing material is filled in. The sensor unit according to feature 1.

4. The flat portion of the inner case includes an end face facing the bottom surface of the recess, a base protruding from the end face on which the circuit board is placed, a positioning projection for positioning the circuit board, and a board locking portion for locking the circuit board. The sensor unit according to claim 3, characterized in that it is as described above.

5. The aforementioned sensor includes a temperature sensor, a pressure sensor, and a rotation angle sensor. The sensor housing includes a first sensor housing for housing the temperature sensor, a second sensor housing for housing the rotation angle sensor, and a third sensor housing for housing the pressure sensor. The sensor unit according to claim 3, characterized in that it is as described above.

6. The temperature sensor includes a sensor body and lead wires extending from the sensor body and passing through connection holes in the circuit board. The first sensor housing includes a positioning groove for positioning the free end of the lead wire. The sensor unit according to feature 5.

7. The temperature sensor includes a sensor body and lead wires extending from the sensor body and passing through connection holes in the circuit board. The rotation angle sensor includes a Hall IC body and an extension terminal that extends from the Hall IC body and is passed through a connection hole in the circuit board. The device includes a first positioning member fixed to the flat plate portion for positioning the lead wire, and a second positioning member fixed to the flat plate portion for positioning the extension terminal. The sensor unit according to feature 5.

8. The first sensor housing includes a first positioning fitting hole for fitting and positioning the first positioning member, The second sensor housing includes a second positioning fitting hole for fitting and positioning the second positioning member. The sensor unit according to feature 7.

9. The first sensor housing is formed in the shape of a tapered, bottomed cylinder, The second sensor housing has an outer contour formed in a cylindrical shape. The third sensor housing is formed in a two-stage cylindrical shape with an outer contour having a pressure receiving hole. The sensor unit according to any one of features 5 to 8.

10. The temperature sensor includes a sensor body and lead wires extending from the sensor body and passing through connection holes in the circuit board. The rotation angle sensor is a surface-mount type sensor mounted on the circuit board. The sensor unit according to feature 5.

11. The first sensor housing is formed in the shape of a tapered, bottomed cylinder, The second sensor housing is formed such that its outer contour includes a cylindrical portion at its tip. The third sensor housing is formed in a two-stage cylindrical shape with an outer contour having a pressure receiving hole. The sensor unit according to claim 10.

12. A method for manufacturing a sensor unit according to claim 1, The inner case, in which the sensor and the circuit board are incorporated, is fixed to the outer case by inserting the flat plate portion into the recess. The resin sealing material is supplied so as to fill the internal space and cover the flat plate portion, and then hardened. A method for manufacturing a sensor unit characterized by the above.

13. Before the inner case is fixed to the outer case, The sensor is electrically connected to the circuit board. The circuit board is fixed to the flat plate portion of the inner case while the sensor is placed in the sensor housing portion. A method for manufacturing a sensor unit according to claim 12.

14. Before the inner case is fixed to the outer case, The aforementioned sensor is placed in the sensor housing section. The circuit board is fixed to the flat plate portion of the inner case by passing the lead wires or extension terminals of the sensor through its connection holes. The lead wires or extension terminals of the sensor are electrically connected to the connection holes of the circuit board. A method for manufacturing a sensor unit according to claim 12.

15. Before the circuit board is fixed to the flat plate portion, The lead wires or extension terminals of the sensor are positioned in a part of the inner case, either directly or via the sensor body of the sensor. A method for manufacturing a sensor unit according to claim 14.

16. Before the circuit board is fixed to the flat plate portion, The lead wires or extension terminals of the sensor are positioned by a positioning member fitted into the inner case. A method for manufacturing a sensor unit according to claim 14.

17. Before the circuit board is fixed to the flat plate portion, The lead wires or extension terminals of the sensor are positioned by a first guide plate, which is arranged along the flat portion of the inner case and guides in a first direction, and a second guide plate, which is stacked on the first guide plate and guides in a second direction at a predetermined angle with respect to the first direction. The first guide plate and the second guide plate are removed from the flat plate portion before the inner case is fixed to the outer case. A method for manufacturing a sensor unit according to claim 14.

18. When the inner case is fixed to the outer case, the other end of the external connection terminal, which is integrally molded with the outer case, is passed through the connection hole of the circuit board. Before the aforementioned resin encapsulant is supplied, The other end of the external connection terminal is electrically connected to the connection hole of the circuit board. A method for manufacturing a sensor unit according to any one of 12 to 17, characterized by the features described herein.

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